JP2020068279A - Circuit board structure - Google Patents

Abstract

To provide a circuit board structure capable of easily positioning a metal plate on a substrate.SOLUTION: A metal plate 22 includes a first connecting portion 61 soldered to a first conductive member 51, a second connecting portion 62 soldered to a second conductive member 52, and an intermediate portion 63 extending from the first connecting portion 61 to the second connecting portion 62. A conductor pattern includes conductor pattern portions 31 to 38 that are exposed on a substrate 21 through openings 41 to 48 of a resist 40 at positions separated from the first conductive member 51 and the second conductive member 52, and in which a part of the intermediate portion 63 is soldered.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a circuit board structure.

  In the insulated power converter disclosed in Patent Document 1, a part of the pattern on the primary side of the transformer and the secondary side of the transformer with the lower voltage is formed of a metal plate, and the other part of the pattern is formed of metal. It is composed of a metal foil having a smaller cross-sectional area than the plate, and the metal plate is mounted on the pattern of the board by soldering. The primary winding is mounted on the board with solder, the secondary winding is mounted on the board with solder, and the metal plate that constitutes the winding is mounted around the through hole in which the transformer core is inserted. .

JP, 2017-79545, A

  By the way, since the positioning is difficult in mounting the metal plate, the mounting shifts. Positioning can be done with a through-hole or an insertion mechanism into the through-hole so as not to shift, but the cost of the metal plate increases, and the board space increases.

  It is an object of the present invention to provide a circuit board assembly that can easily position a metal plate on a board.

  A circuit board structure for solving the above problems includes a circuit board having a conductor pattern and a resist, and a metal plate soldered to the first conductive portion and the second conductive portion of the substrate. In the structure, the metal plate includes a first connecting portion soldered to the first conductive portion, a second connecting portion soldered to the second conductive portion, and the first connecting portion to the second connecting portion. An intermediate portion extending to a connection portion, wherein the conductor pattern is exposed on the substrate through an opening of the resist at a position separated from the first conductive portion and the second conductive portion, and the intermediate portion The gist is that a part of the portion has a conductor pattern portion to be soldered.

  According to this, the conductor pattern portion is exposed through the opening of the resist, and at the time of soldering, a part of the intermediate portion of the metal plate is easily aligned with the substrate by the self-alignment effect using the conductor pattern portion. Can be positioned.

  Further, in the circuit board structure, the first connection portion is formed at one end of the metal plate, and the first conductive portion projects from a first overlapping portion overlapping the first connection portion and one end of the metal plate. A second overlapping portion having a first protruding portion, the conductor pattern portion overlapping the intermediate portion, and a second protruding portion protruding from the intermediate portion in a direction opposite to a protruding direction of the first protruding portion. It is good to have and.

  Further, in the circuit board structure, the second connecting portion is formed at the other end of the metal plate, and the second conductive portion is formed from a third overlapping portion overlapping the second connecting portion and the other end of the metal plate. A fourth projecting portion having a third projecting portion projecting, and the conductor pattern portion projecting from the intermediate portion in a direction opposite to a projecting direction of the third projecting portion; And a protruding portion.

  Further, in the circuit board structure, the conductor pattern portion has a first conductor pattern portion and a second conductor pattern portion provided at a position separated from the first conductor pattern portion, and the first conductor pattern portion is provided. The part may have the second overlapping part and the second protruding part, and the second conductor pattern part may have the fourth overlapping part and the fourth protruding part.

  Further, in the circuit board structure, the width of the conductor pattern portion may be wider than the width of the metal plate.

  According to the present invention, the metal plate can be easily positioned on the substrate.

(A) is a plan view of the circuit board assembly in the embodiment, (b) is a sectional view taken along line AA of (a), and (c) is a sectional view taken along line BB of (a). The partial top view of a circuit board structure. 2A is a sectional view taken along the line AA of FIG. 2, and FIG. 2B is a sectional view taken along the line BB of FIG. Sectional drawing in the CC line | wire of FIG. The partial top view of a circuit board structure. Sectional drawing in the AA line of FIG. (A), (b), (c) is a partial cross section figure of a circuit board structural body for demonstrating a manufacturing process. (A), (b) is a partial cross section figure of a circuit board structural body for demonstrating a manufacturing process.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the drawings, the horizontal plane is defined by the orthogonal X and Y directions, and the vertical direction is defined by the Z direction.

  As shown in FIG. 1A, FIG. 1B, and FIG. 1C, the circuit board structure 10 includes a metal base member 20, a substrate 21, and a metal that constitutes a coil having the number of turns “1”. The board 22 and the EI type core 23 are provided. The substrate 21 is fixed to the metal base member 20. On the upper surface of the substrate 21, a metal plate 22 that constitutes a coil having the number of turns “1” is mounted. The metal plate 22 is a copper flat plate. Through holes 21a, 21b, 21c are formed in the substrate 21 side by side.

  The EI type core 23 includes an E type core 24 and an I type core 25. The I-shaped core 25 is inserted into the recess 20 a that opens on the upper surface of the metal base member 20. The substrate 21 is located between the E-shaped core 24 and the I-shaped core 25. The three legs 24 a, 24 b, 24 c of the E-shaped core 24 penetrate the through holes 21 a, 21 b, 21 c of the substrate 21 and are in contact with the I-shaped core 25.

  As shown in FIG. 2, FIG. 3A, and FIG. 3B, the substrate 21 includes an insulating substrate 26, a conductor pattern formed on the surface of the insulating substrate 26, and a resist 40 covering the surface of the insulating substrate 26. Have.

  The metal plate 22 is formed in a coil shape having a number of turns of "1". One end of the metal plate 22 is soldered to the first conductive member 51 for forming a circuit on the substrate 21. The other end of the metal plate 22 is soldered to the second conductive member 52 for forming a circuit on the substrate 21. That is, the metal plate 22 is soldered to the first conductive member 51 as the first conductive portion and the second conductive member 52 as the second conductive portion of the substrate 21.

  As shown in FIGS. 5 and 6, the conductive members 51 and 52 are made of a metal member such as copper. Each of the conductive members 51 and 52 has a plate portion 53 and a column portion 54 extending upward from the central portion of the upper surface of the plate portion 53. The column portion 54 is inserted into the through hole 21d formed in the substrate 21. The metal plate 22 is soldered to the upper surface of the pillar portion 54.

  As shown in FIG. 2, the metal plate 22 includes a first connecting portion 61, a second connecting portion 62, and an intermediate portion 63. The first connecting portion 61 is formed on one end of the metal plate 22 and is soldered to the first conductive member 51 for forming a circuit. The second connecting portion 62 is formed on the other end of the metal plate 22 and is soldered to the second conductive member 52 for forming a circuit. The intermediate portion 63 extends from the first connecting portion 61 to the second connecting portion 62.

  The intermediate portion 63 of the metal plate 22 is soldered to the heat dissipation conductive member 55 on the substrate 21. As shown in FIGS. 1A and 1B, the conductive member 55 is made of a metal member such as copper. The conductive member 55 includes a plate portion 53 and a column portion 54 that extends upward from the central portion of the upper surface of the plate portion 53. The pillar portion 54 is inserted into the through hole formed in the substrate 21. The metal plate 22 is soldered to the upper surface of the pillar portion 54. The plate portion 53 of the conductive member 55 is thermally connected to the metal base member 20 via the insulating heat dissipation sheet 80. The heat Q generated in the metal plate 22 is released to the metal base member 20 via the conductive member 55. That is, the heat Q generated by the metal plate 22 is radiated by the metal base member 20 via the conductive member 55.

  As shown in FIG. 2, FIG. 3A, and FIG. 3B, the conductor pattern includes conductor pattern portions 31, 32, 33, 34, 35, 36, 37, 38 for alignment. The conductor pattern portions 31 to 38 are formed at positions separated from the first conductive member 51 and the second conductive member 52.

  The conductor pattern portion 31 and the conductor pattern portion 32 are formed so as to be separated from each other in a portion of the intermediate portion 63 of the metal plate 22 that extends in the Y direction. The conductor pattern portion 31 and the conductor pattern portion 32 are wider than the width of the portion of the intermediate portion 63 of the metal plate 22 that extends in the Y direction. The conductor pattern portion 33 is formed on a portion of the intermediate portion 63 of the metal plate 22 that extends in the X direction. The conductor pattern portion 33 is wider than the width of the portion of the intermediate portion 63 of the metal plate 22 that extends in the X direction. The conductor pattern portion 34 and the conductor pattern portion 35 are formed so as to be separated from each other in a portion of the intermediate portion 63 of the metal plate 22 extending in the Y direction. The conductor pattern portion 34 and the conductor pattern portion 35 are wider than the width of the portion of the intermediate portion 63 of the metal plate 22 that extends in the Y direction. The conductor pattern portion 36 is formed in a portion of the intermediate portion 63 of the metal plate 22 that extends in the X direction. The conductor pattern portion 36 is wider than the width of the portion extending in the X direction in the intermediate portion 63 of the metal plate 22.

The conductor pattern portion 31 and the conductor pattern portion 35 are located on the same X axis. The conductor pattern portion 32 and the conductor pattern portion 34 are located on the same X axis.
The conductive member 51 is located at one end of the portion of the metal plate 22 extending in the X direction, and the conductor pattern portion 37 is formed at a corner of the portion of the metal plate 22 extending in the X direction. The conductor pattern portion 37 extends outside the metal plate 22 in the X direction.

  The conductive member 52 is located at the other end of the portion of the metal plate 22 extending in the X direction, and the conductor pattern portion 38 is formed at the corner of the portion of the metal plate 22 extending in the X direction. The conductor pattern portion 38 extends outside the metal plate 22 in the X direction.

  As shown in FIGS. 5 and 6, conductor pattern portions 39 a and 39 b are formed on the lower surface of the substrate 21. The plate portion 53 of the conductive member 51 is joined (soldered) to the conductor pattern portion 39a by the solder 75a. The plate portion 53 of the conductive member 52 is joined (soldered) to the conductor pattern portion 39b by the solder 75b. Therefore, the conductor pattern portion 39 a is connected to one end of the metal plate (coil) 22 on the upper surface of the substrate 21 via the conductive member 51 on the lower surface of the substrate 21, and the metal plate (coil) 22 is formed on the upper surface of the substrate 21. The other end is connected to the conductor pattern portion 39b on the lower surface of the substrate 21 via the conductive member 52. In this way, a circuit through the metal plate (coil) 22 is formed. Each of the conductor pattern portions 39a and 39b is connected to a wiring pattern (not shown) made of a copper plate arranged on the lower surface of the substrate 21 by soldering.

  As shown in FIGS. 2 and 4, the conductor pattern portions 31, 32, 33, 34, 35, 36, 37, 38 for alignment are electrically connected to the conductive members 51, 52 for circuit formation. Instead, it is exposed on the substrate 21 through the openings 41, 42, 43, 44, 45, 46, 47, 48 of the resist 40. The openings 41, 42 are wider than the width of the portion of the intermediate portion 63 of the metal plate 22 extending in the Y direction. The opening 43 is wider than the width of the portion of the intermediate portion 63 of the metal plate 22 that extends in the X direction. The openings 44 and 45 are wider than the width of the portion of the intermediate portion 63 of the metal plate 22 that extends in the Y direction. The opening 46 is wider than the width of the portion of the intermediate portion 63 of the metal plate 22 that extends in the X direction. The opening 47 extends outside the metal plate 22 in the X direction at the corner of the intermediate portion 63 of the metal plate 22. The opening 48 extends outside the metal plate 22 in the X direction at the corner of the intermediate portion 63 of the metal plate 22.

  As shown in FIG. 4, a part of the intermediate portion 63 of the metal plate 22 is joined to the conductor pattern portions 31, 32, 33, 34, 35, 36, 37, 38 for alignment with solder 70. .

  As shown in FIGS. 5 and 6, the first connection portion 61 is formed at one end of the metal plate 22, and the first conductive member 51 as the first conductive portion has a first overlapping portion 51 a that overlaps the first connection portion 61. , A first protruding portion 51b protruding from one end of the metal plate 22. The conductor pattern portion 37 has a second overlapping portion 37a that overlaps with the intermediate portion 63, and a second protruding portion 37b that protrudes from the intermediate portion 63 in a direction opposite to the protruding direction of the first protruding portion 51b.

  As shown in FIGS. 5 and 6, the second connection portion 62 is formed at the other end of the metal plate 22, and the second conductive member 52 as the second conductive portion overlaps with the second connection portion 62 at the third overlapping portion 52 a. And a third protruding portion 52b protruding from the other end of the metal plate 22. As shown in FIG. 2, the conductor pattern portion 38 includes a fourth overlapping portion 38a overlapping the intermediate portion 63, and a fourth protruding portion 38b protruding from the intermediate portion 63 in a direction opposite to the protruding direction of the third protruding portion 52b. Have and.

  As shown in FIG. 2, the conductor pattern portion has a first conductor pattern portion 37 and a second conductor pattern portion 38 provided at a position separated from the first conductor pattern portion 37. The first conductor pattern portion 37 has a second overlapping portion 37a and a second protruding portion 37b. The second conductor pattern portion 38 has a fourth overlapping portion 38a and a fourth protruding portion 38b.

As shown in FIG. 4, the width W1 of the conductor pattern portions 31 to 38 for alignment is wider than the width W2 of the metal plate 22 formed in the coil shape having the number of turns “1”.
In FIG. 7C, there is a gap of, for example, about 0.2 mm between the inner ends of the resist openings 41 to 48 and the outer end of the metal plate 22, and a fillet of the solder 70 is formed in this gap. ing.

Next, the operation will be described.
In the manufacturing process, as shown in FIG. 7A, the solder paste 70a is applied to the openings 41, 42, 43, 44, 45, 46, 47, 48 of the resist 40.

As shown in FIG. 7B, the metal plate 22 is placed on the solder paste 70 a arranged in the openings 41, 42, 43, 44, 45, 46, 47, 48 of the resist 40.
Then, the metal plate 22 is soldered by heating in a reflow furnace as shown in FIG. 7 (c). In FIG. 7C, there is a gap of, for example, about 0.2 mm between the inner ends of the resist openings 41 to 48 and the outer end of the metal plate 22, and a fillet of the solder 70 is formed in this gap. .

  Here, as shown in FIG. 8A, it is assumed that the position is displaced when the metal plate 22 is placed on the solder paste 70a. That is, in FIG. 7B, the centers of the resist openings 41 to 48 and the center of the metal plate 22 coincide with each other, but in FIG. 8A, the centers of the resist openings 41 to 48 and the center of the metal plate 22. It is out of alignment. Specifically, in FIG. 8A, the center of the metal plate 22 is displaced leftward with respect to the centers of the resist openings 41 to 48.

  However, due to the subsequent heating in the reflow furnace, the metal plate 22 does not jump out of the resist openings 41 to 48 due to the surface tension (self-alignment) of the molten solder, as shown in FIG. 8B. The position is determined, the metal plate 22 moves to the optimum position, and is soldered.

  In the related art, since it is difficult to position the metal plate 22 when mounting it, the mounting is misaligned, so that the metal plate 22 can be positioned by an insertion mechanism into a through hole or a through hole so that the metal plate 22 does not shift. Invites expansion.

  In the present embodiment, the conductor pattern portions 31, 32, 33, 34, 35, 36, 37, 38 for alignment provided on the substrate 21 have openings 41, 42, 43, 44, 45, 46 of the resist 40. , 47, 48 are exposed. Therefore, at the time of soldering, a part of the intermediate portion 63 of the metal plate 22 formed in the coil shape having the number of turns “1” is positioned in the conductive pattern portions 31, 32, 33, 34, 35, 36 for positioning, By the self-alignment effect using 37 and 38, the metal plate 22 formed in the coil shape having the number of turns “1” can be easily positioned on the substrate 21.

  That is, as shown in FIG. 2, at the time of soldering, due to surface tension, forces F1a and F1b, forces F2a and F2b, forces F3a and F3b, forces F4a and F4b, are separated from each other with respect to the metal plate 22. Forces F5a and F5b, forces F6a and F6b, forces F7a and F7b, and forces F8a and F8b act. The force F1a and the force F1b are opposite forces acting in the directions away from each other in the X direction. The force F2a and the force F2b are opposite forces acting in the directions away from each other in the X direction. The force F3a and the force F3b are opposite forces acting in a direction away from each other in the Y direction. The force F4a and the force F4b are opposite forces acting in the directions away from each other in the X direction. The force F5a and the force F5b are opposite forces acting in the directions away from each other in the X direction. The force F6a and the force F6b are opposite forces acting in the directions away from each other in the Y direction. Therefore, the force acts from both sides of the metal plate 22 in the X direction and the force acts from both sides of the metal plate 22 in the Y direction, so that the intermediate portion 63 of the metal plate 22 is positioned in the X direction and the Y direction.

  The force F7a is a force that acts in the X direction when the conductive member 51 and the metal plate 22 are soldered simultaneously with the soldering of the conductor pattern portions 31 to 38. The force F7a and the force F7b are opposite forces acting in the directions away from each other in the X direction. Therefore, the conductor pattern portion 37 for alignment is provided in the corner portion corresponding to the conductive member 51 at one end of the metal plate 22, and the conductor pattern portion 37 for alignment is soldered to the conductor pattern portion 37 for alignment, so that in the X direction. Positioned.

  Similarly, the force F8a is a force that acts in the X direction when the conductive member 52 and the metal plate 22 are soldered simultaneously with the soldering of the conductor pattern portions 31 to 38. The force F8a and the force F8b are opposite forces acting in the directions away from each other in the X direction. Therefore, the corner of the other end of the metal plate 22 corresponding to the conductive member 52 is provided with the conductor pattern portion 38 for alignment, and the conductor pattern portion 38 for alignment is soldered to the X direction. Is positioned at.

  Specifically, as shown in FIGS. 5 and 6, the first conductive member 51 has a first overlapping portion 51a and a first protruding portion 51b, and the conductor pattern portion 37 has a second overlapping portion 37a and a second protruding portion. 37b. As a result, as shown in FIGS. 3B and 6, when the fillet 90 is formed on one end of the metal plate 22, the fillet 91 formed on the second projecting portion 37b balances the fillet 90 to improve the positioning accuracy. Improvement is achieved.

  In addition to this, an opening portion 48 (conductor pattern 38) is provided so that a fillet is formed on the opposite side of the fillet formed on one end of the metal plate 22 in order to balance the fillet. That is, as shown in FIGS. 5 and 6, the second conductive member 52 has a third overlapping portion 52a and a third protruding portion 52b, and as shown in FIG. 3B, the conductor pattern portion 38 is It has a fourth overlapping portion 38a and a fourth protruding portion 38b. Therefore, as shown in FIG. 3B, when the fillet 92 is formed on the other end of the metal plate 22, the positioning accuracy is improved by balancing by the fillet 93 formed on the fourth protruding portion 38b. Planned. As a result, the positioning accuracy can be further improved by performing the same treatment on both ends of the metal plate 22.

  As described above, when the metal plate 22 forming the coil having the number of turns “1” is surface-mounted on the substrate 21, the accuracy of the soldering position can be improved. By using the positioning conductor patterns (31 to 38) separately from the electrically conductive portions (51, 52), the mounting position accuracy is improved by the self-alignment effect. Further, since the mounting is completed on one surface (upper surface) of the substrate 21, space efficiency is good. Further, the metal plate 22 may be a flat plate, and the copper plate can be simplified without bending or the like.

According to the above embodiment, the following effects can be obtained.
(1) As a configuration of the circuit board structure 10, a substrate 21 having conductor patterns (31, 32, 33, 34, 35, 36, 37, 38) and a resist 40, and a first conductive portion of the substrate 21 are provided. The first conductive member 51 and the metal plate 22 soldered to the second conductive member 52 as the second conductive portion are provided. The metal plate 22 has a first connecting portion 61 soldered to a first conductive member 51 as a first conductive portion, and a second connecting portion 62 soldered to a second conductive member 52 as a second conductive portion. , An intermediate portion 63 extending from the first connecting portion 61 to the second connecting portion 62. The conductor pattern is exposed on the substrate 21 through the openings 41 to 48 of the resist 40 at a position separated from the first conductive member 51 serving as the first conductive portion and the second conductive member 52 serving as the second conductive portion. Part of the portion 63 has conductor pattern portions 31 to 38 to be soldered.

  Therefore, the conductor pattern portions 31 to 38 are exposed through the openings 41 to 48 of the resist 40. When soldering, the number of turns is "1" due to the self-alignment effect of a part of the intermediate portion 63 of the metal plate 22 formed in the coil shape having the number of turns of "1" by using the conductor pattern portions 31 to 38. The metal plate 22 formed in the coil shape can be easily positioned on the substrate 21.

  (2) As shown in FIGS. 5 and 6, the first connecting portion 61 is formed at one end of the metal plate 22, and the first conductive member 51 as the first conductive portion overlaps with the first connecting portion 61 in the first superposition. It has a part 51 a and a first protruding part 51 b protruding from one end of the metal plate 22. The conductor pattern portion 37 has a second overlapping portion 37a that overlaps with the intermediate portion 63, and a second protruding portion 37b that protrudes from the intermediate portion 63 in a direction opposite to the protruding direction of the first protruding portion 51b. Therefore, as shown in FIGS. 3B and 6, when the fillet 90 is formed on one end of the metal plate 22, the fillet 91 formed on the second projecting portion 37b is balanced to improve the positioning accuracy. To do.

  (3) As shown in FIGS. 5 and 6, the second connecting portion 62 is formed at the other end of the metal plate 22, and the second conductive member 52 as the second conductive portion overlaps with the second connecting portion 62. The overlapping portion 52a and the third protruding portion 52b protruding from the other end of the metal plate 22 are included. As shown in FIG. 3B, the conductor pattern portion 38 has a fourth overlapping portion 38a that overlaps the intermediate portion 63 and a fourth protruding portion 52a that protrudes from the intermediate portion 63 in a direction opposite to the protruding direction of the third protruding portion 52b. And a protruding portion 38b. Therefore, as shown in FIG. 3B, when the fillet 92 is formed on the other end of the metal plate 22, the fillet 93 formed on the fourth protruding portion 38b balances and the positioning accuracy is improved. In this way, the positioning accuracy is further improved by performing the same treatment on both ends of the metal plate 22.

  (4) As shown in FIG. 2, the conductor pattern portion has a first conductor pattern portion 37 and a second conductor pattern portion 38 provided at a position separated from the first conductor pattern portion 37. The first conductor pattern portion 37 has a second overlapping portion 37a and a second protruding portion 37b, and the second conductor pattern portion 38 has a fourth overlapping portion 38a and a fourth protruding portion 38b. Therefore, it is easier to balance and the positioning accuracy is improved by separately providing the conductor pattern portions.

(5) The width W1 of the conductor pattern portions 31 to 38 is wider than the width W2 of the metal plate 22. Therefore, the self-alignment effect can be further exerted.
The embodiment is not limited to the above, and may be embodied as follows, for example.

  The conductive portion for forming the circuit was the metal member (51, 52) penetrating the substrate 21, but the present invention is not limited to this. For example, the conductive portion for forming a circuit may be a conductor pattern formed on the substrate 21.

  The metal plate 22 is a coil, but is not limited to this. For example, it may be a primary winding or a secondary winding of a transformer. Alternatively, the metal plate may be wiring.

  DESCRIPTION OF SYMBOLS 10 ... Circuit board structure, 21 ... Board, 22 ... Metal plate, 32, 33, 34, 35, 36, 37, 38 ... Conductor pattern part, 37a ... 2nd overlapping part, 37b ... 2nd protruding part, 38a ... Fourth overlapping portion, 38b ... Fourth protruding portion, 40 ... Resist, 41, 42, 43, 44, 45, 46, 47, 48 ... Opening portion, 51 ... First conductive member, 51a ... First overlapping portion, 51b ... first protruding portion, 52 ... second conductive member, 52a ... third overlapping portion, 52b ... third protruding portion, 61 ... first connecting portion, 62 ... second connecting portion, 63 ... intermediate portion, W1 ... width, W2 ... width.

Claims (5)

A substrate having a conductor pattern and a resist,
A metal plate soldered to the first conductive portion and the second conductive portion of the substrate;
In a circuit board structure provided with,
The metal plate is
A first connection portion soldered to the first conductive portion;
A second connection portion soldered to the second conductive portion;
An intermediate portion extending from the first connecting portion to the second connecting portion;
Equipped with
The conductor pattern is a conductor pattern portion exposed on the substrate through the opening of the resist at a position separated from the first conductive portion and the second conductive portion, and a part of the intermediate portion is soldered. A circuit board structure characterized by having. The first connecting portion is formed at one end of the metal plate,
The first conductive portion has a first overlapping portion overlapping the first connecting portion, and a first protruding portion protruding from one end of the metal plate,
The conductor pattern portion has a second overlapping portion that overlaps with the intermediate portion, and a second protruding portion that protrudes from the intermediate portion in a direction opposite to a protruding direction of the first protruding portion. Item 2. A circuit board structure according to item 1. The second connecting portion is formed on the other end of the metal plate,
The second conductive portion has a third overlapping portion overlapping the second connecting portion, and a third protruding portion protruding from the other end of the metal plate,
The conductor pattern portion has a fourth overlapping portion that overlaps the intermediate portion, and a fourth protruding portion that protrudes from the intermediate portion in a direction opposite to a protruding direction of the third protruding portion. Item 3. The circuit board structure according to item 2. The conductor pattern portion has a first conductor pattern portion and a second conductor pattern portion provided at a position separated from the first conductor pattern portion,
The first conductor pattern portion has the second overlapping portion and the second protruding portion,
The circuit board structure according to claim 3, wherein the second conductor pattern portion has the fourth overlapping portion and the fourth protruding portion.   The circuit board assembly according to claim 1, wherein a width of the conductor pattern portion is wider than a width of the metal plate.