JP2020064119A - Cell for repairment, micro led display, and method for manufacturing cell for repairment - Google Patents

Abstract

To provide a cell for repairment which enables repairment of a defect in a micro LED display by omitting complicated steps and shortening a tact time.SOLUTION: A cell for repairment 21a used as a replacement of a defective cell comprises: a micro LED 3 including a light emission surface 32 which emits light having a specific spectrum of ultraviolet to blue wavelength band, has electrodes 31a and 31b for light emission on one of surfaces opposite to each other and emits light to the other surface; a plate-like flattening film 4 having a surrounding wall 41 located at a predetermined position in order to hold the micro LED 3 by bonding it to the peripheral side surface thereof, and holding one or more micro LEDs 3 by exhibiting a bonding function by ultraviolet irradiation or heating; and a fluorescent layer 11 provided on the flattening film and obtained by filling a region surrounded with a shading wall 12 with fluorescent material excited by the light emitted from the micro LED 3 according to the number of micro LEDs 3 and wavelength-converted into fluorescence of a corresponding color.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a repair cell used as a substitute for a defective cell in which a defect has occurred in a micro LED (Light Emitting Diode) display in which a plurality of cells for realizing full-color display are arranged in a matrix, and can be repaired particularly efficiently. The present invention relates to a repair cell, a micro LED display in which a defective cell in which a defect has occurred among the plurality of cells is replaced by the repair cell, and a method for manufacturing the repair cell.

  2. Description of the Related Art Conventionally, a display in which a micrometer (μm) size micro LED is used as a pixel has been disclosed (see, for example, Patent Document 1). In the manufacturing process of a display using micro LEDs as pixels, full color display is realized by using micro LEDs that emit light of the three primary colors of light, red (R), green (G), and blue (B), respectively. In the case of a micro LED display, defects or bright spot defects due to non-lighting of the micro LED may occur. In the case of a micro LED display that realizes full-color display by using an LED that emits light in the ultraviolet to near-ultraviolet band as a light source and using a fluorescent material as a color conversion layer, not only defects of the micro LED but also fluorescent material Defects such as color mixing and color loss after filling may occur.

  When such a defect occurs, it is desirable to repair the cell at the defective portion (defective cell). Usually, when repairing a defect of a cell, after removing the defective part by laser processing, etc., the circuit pattern is restored and the cell is further restored. Therefore, at the defective part, remounting including mounting of a new LED chip is performed. It is necessary to perform the process of.

Japanese Patent Publication No. 2016-512347

  However, the remounting process requires complicated processes such as exposure, development, drying, and curing at the defective portion, which may cause new defects.

  Therefore, the present invention addresses such a problem, omits complicated steps, shortens the tact time, and repair cells capable of repairing defective cells of a micro LED display, and defects have occurred. An object of the present invention is to provide a micro LED display in which a defective cell is replaced with a repair cell, and a method for manufacturing the repair cell.

  In order to achieve the above object, the repair cell according to the present invention (the invention according to claim 1 of the present application) has a defect in a micro LED display in which a plurality of cells for realizing full color display are arranged in a matrix. Repair cell used as an alternative to the defective cell, which emits any one of the three primary colors of light: red (R), green (G), and blue (B), and one of the opposite surfaces. A micro LED having an electrode for emitting light on the other side and a light emitting surface for emitting emitted light formed on the other surface, and a micro LED formed in a flat plate shape, to be adhered to and held on the peripheral side surface of the micro LED. A flat surface having a surrounding wall of the above and having a number of the micro LEDs corresponding to the above-mentioned red (R), green (G), and blue (B) emission patterns by exhibiting an adhesive function by ultraviolet irradiation or heating. And a chemical film It is intended.

  In order to achieve the above object, the repair cell according to the present invention (the invention according to claim 4 of the present application) has a defect in a micro LED display in which a plurality of cells for realizing full-color display are arranged in a matrix. A repair cell used as a substitute for the defective cell, which emits light having a specific spectrum in the ultraviolet to blue wavelength band, and has an electrode for light emission on one surface of the opposite surface. , A micro LED having a light emitting surface for emitting the emitted light on the other surface, and a predetermined position of an enclosing wall formed in a flat plate shape and adhered to and holding the peripheral side surface of the micro LED. And a flattening film for holding one or a plurality of the micro LEDs by exhibiting an adhesive function by ultraviolet irradiation or heating, and the microphone provided on the flattening film. A fluorescent light emitting layer in which a region surrounded by a light shielding wall is filled with a fluorescent material that is excited by light emitted from the micro LED according to the number of LEDs to convert the wavelength into fluorescent light of a predetermined corresponding color. And ,.

  In order to achieve the above object, a micro LED display according to the present invention (the invention according to claim 7 of the present application) is a micro LED display in which a plurality of cells for realizing full color display are arranged in a matrix. The defective cell in which a defect has occurred is replaced with the repair cell according to any one of claims 1 to 3.

  In order to achieve the above object, a micro LED display according to the present invention (an invention according to claim 8 of the present application) is a micro LED display in which a plurality of cells for realizing full color display are arranged in a matrix, A defective cell in which a defect has occurred is replaced with the repair cell according to any one of claims 4 to 6.

  In order to achieve the above object, a method for manufacturing a repair cell according to the present invention (an invention according to claim 9 of the present application) is a micro LED display in which a plurality of cells for realizing full color display are arranged in a matrix. A method of manufacturing a repair cell used as an alternative to a defective cell in which a defect has occurred, which emits any one of the three primary colors of light, red (R), green (G), and blue (B), and faces each other. In order to hold the micro LED, which has a light emitting electrode on one surface thereof and a light emitting surface for emitting the emitted light on the other surface, adhered to the peripheral side surface of the micro LED. A flat plate having a surrounding wall and holding the number of the micro LEDs according to the emission patterns of the red (R), green (G), and blue (B) by exhibiting an adhesive function by irradiation with ultraviolet rays or heating. Flattened film Including the step of integrally formed.

  In order to achieve the above object, a method of manufacturing a repair cell according to the present invention (an invention according to claim 10 of the present application) is a micro LED display in which a plurality of cells for realizing full color display are arranged in a matrix. A method of manufacturing a repair cell used as a substitute for a defective cell in which a defect has occurred, which emits light having a specific spectrum in the ultraviolet to blue wavelength band, and emits light on one of the opposite surfaces. A micro LED having a light emitting surface for emitting emitted light on the other surface of the micro LED, and an enclosing wall for adhering and holding the peripheral side surface of the micro LED at a predetermined position And a step of integrally forming a flat plate-shaped flattening film for holding one or a plurality of the micro LEDs by exhibiting an adhesive function by irradiation with ultraviolet rays or heating. Fluorescence emission in which a region surrounded by a light-shielding wall is filled with a fluorescent material that is excited by the light emitted from the micro LED according to the number of the black LEDs and converts the wavelength into fluorescence of a predetermined corresponding color. A step of forming a layer and a step of adhering the fluorescent light emitting layer on the flattening film are included.

  According to the repair cell of the present invention, even when a defect occurs among a plurality of cells, since repair is performed using the repair cell of the present invention that is manufactured in advance, the repair cell is complicated. The steps can be omitted, the tact time can be shortened, and the defective portion of the micro LED display can be repaired.

  Further, according to the micro LED display of the present invention, since the defective cell is replaced by the repair cell according to the present invention, a complicated micro process is omitted, and a tact time is shortened to provide a repaired micro LED display. You can

  Furthermore, according to the repair cell manufacturing method of the present invention, it is possible to provide a repair cell capable of repairing a defective portion of a micro LED display by omitting complicated steps and shortening the tact time.

It is a figure which shows typically the structural example of the micro LED display which concerns on 1st Embodiment. It is explanatory drawing of the repair cell which concerns on 1st Embodiment. It is explanatory drawing of the repair cell which concerns on 1st Embodiment. It is a flowchart which shows the process of the manufacturing method of the repair cell which concerns on 1st Embodiment. It is a flowchart which shows the formation process of an LED element. FIG. 6 is a process diagram illustrating a process of forming an LED element. FIG. 6 is a process diagram illustrating a process of forming an LED element. It is a principal part enlarged view of LED. It is a principal part enlarged view of LED after laser lift-off. It is a flowchart which shows the formation process of a fluorescent light emitting layer. It is a flowchart explaining the formation process of a fluorescence emission layer. It is a flowchart explaining the formation process of a fluorescence emission layer. It is a flowchart explaining the formation process of a fluorescence emission layer. It is a flow chart which shows a pasting process. It is a flowchart explaining a pasting process. It is a flowchart explaining a pasting process. It is a flowchart explaining a pasting process. It is a flowchart explaining a pasting process. It is an explanatory view of transfer to a film. It is an explanatory view of transfer to a film. It is a block diagram of the repair cell transferred to the film. It is a flow chart which shows a lighting inspection process. It is a process drawing explaining a lighting inspection process. It is a process drawing explaining a lighting inspection process. It is a block diagram of an inspection board. It is a figure explaining the lighting inspection by the board | substrate for an inspection. It is a figure which shows the modification of the repair cell which concerns on 1st Embodiment. It is a top view which shows typically an example of the micro LED display which concerns on 2nd Embodiment. It is explanatory drawing of the repair cell which concerns on 2nd Embodiment. It is a figure explaining transfer to the film of the repair cell which concerns on 2nd Embodiment. It is a figure explaining transfer to the film of the repair cell which concerns on 2nd Embodiment. It is a figure which shows the modification of the repair cell which concerns on 2nd Embodiment.

[First Embodiment]
Hereinafter, a first embodiment for carrying out a method for manufacturing a repair cell, a micro LED display, and a repair cell according to the present invention will be described in detail with reference to the accompanying drawings.
[Micro LED display]
FIG. 1 is a diagram schematically showing a configuration example of the micro LED display according to the first embodiment. FIG. 1A is a plan view of the micro LED display according to the first embodiment. The micro LED display 100 includes an array substrate 1 and a cell array 2. The micro LED display 100 realizes full-color display by emitting light from the micro LED 3 (hereinafter, simply referred to as “LED3”). The micro LED display 100 employs, for example, a passive matrix system.

  Specifically, the micro LED display 100 includes an array substrate 1 including a wiring substrate 6 that drives a plurality of LEDs 3 that emit light having a specific spectrum in the ultraviolet to blue wavelength band. Note that, in FIG. 1A, the wiring of the wiring board 6 is omitted for easy viewing of the arrangement of the LED 3 and the fluorescent light emitting layer 11 having the fluorescent material layers 11R, 11G, and 11B described later.

  Further, the micro LED display 100 is excited on the array substrate 1 by the LEDs 3 and light (excitation light) emitted from the LEDs 3 according to the number of the LEDs 3, and wavelength conversion into fluorescence of a predetermined corresponding color. A cell array 2 is provided in which cells 21 each including a fluorescent light emitting layer 11 in which a region surrounded by a light shielding wall is filled with a fluorescent material are arranged in a matrix. Here, the predetermined corresponding color is any one of the three primary colors of light: red (R), green (G), and blue (B). As a result, in the micro LED display 100, a plurality of cells 21 for realizing full color display are arranged in a matrix. In FIG. 1A, in order to make the explanation easy to understand, the cell array 2 is arranged in 4 rows and 5 columns.

  Note that a general micro LED display can be applied to a flat display or a flexible display. When the micro LED display 100 is applied to, for example, a flat display, illustration of a protective glass as another component is omitted in FIG. 1.

  The array substrate 1 defines the array position of the cells 21 and supplies a video signal from an electric circuit (not shown) to each LED 3 which is a constituent element of the plurality of cells 21 via the wiring substrate 6, and each LED 3 is individually provided. It can be turned on and turned on and turned off and turned off.

  The wiring board 6 is, for example, a flexible printed circuit board (FPC), and is a film-like board including an insulating base film (for example, polyimide) and a wiring layer on which an electric circuit is formed. is there. FIG. 1B is a diagram illustrating the wiring board 6 in the region R1 indicated by the broken line in FIG. However, in FIG. 1B, in order to make the layout of the wiring easy to understand, the fluorescent light emitting layer 11 and the flattening film 4 described later are omitted. The LEDs 3 are arranged on the wiring board 6 in a region surrounded by the intersections of the vertical wirings 6a and the horizontal wirings 6b. A partition wall 12 is provided so as to surround the LED 3. In addition, a repair cell, which will be described later, is provided on the wiring board 6 at the end of the lead-out wiring 6c that is electrically connected to the LED electrodes 31a and 31b (see FIG. 2C) of the LED 3 with the LEDs 3 interposed therebetween. An alignment mark 6d for repair, which serves as a mark for mounting 21a, is provided.

  The cell array 2 has cells 21 arranged in a matrix, which are configured by bonding the LEDs 3 and the fluorescent light emitting layer 11 together. The fluorescent light emitting layer 11 has a fluorescent material layer 11R filled with a red fluorescent dye, a fluorescent material layer 11G filled with a green fluorescent dye, and a fluorescent material layer 11B filled with a blue fluorescent dye. These fluorescent dyes are examples of RGB phosphors.

  In the first embodiment, for example, a method of realizing full-color display by combining an LED that emits light of a short wavelength and an RGB phosphor is used. Therefore, the LED 3 emits light having the above spectrum and is manufactured using gallium nitride (GaN) as a main material. Specifically, the LED 3 is an ultraviolet light emitting diode (UV-LED), and even if the LED emits near-ultraviolet light having a wavelength of, for example, 200 nm to 380 nm, it emits blue light having a wavelength of, for example, 380 nm to 500 nm. It may be an LED. Near-ultraviolet light having a wavelength of, for example, 200 nm to 380 nm and blue light having a wavelength of, for example, 380 nm to 500 nm correspond to an example of light having a specific spectrum. The LED 3 can be targeted to a size of, for example, 30 μm in length, 90 μm in width, and 10 to 30 μm in height.

[Repair cell]
2 and 3 are explanatory diagrams of the repair cell according to the first embodiment. 2A is a plan view of the repair cell, and FIG. 2B is a sectional view taken along the line AA of FIG. 2A. (C) is a front view of the LED 3. In order to make the description easier to understand, in the present embodiment, as an example, in the manufacturing process of the micro LED display 100 shown in FIG. 1, the cell 21 surrounded by the region R2 was found to be a defective cell, and for repair, A case where the cell 21a is replaced as a replacement part will be described. The repair cell 21a is composed of the same parts as the cell 21 determined to have no defect in the manufacturing process of the micro LED display 100.

  Specifically, the repair cell 21 a is used as a substitute for the cell 21 of the micro LED display 100, and includes the LED 3, the flattening film 4, and the fluorescent light emitting layer 11. As shown in FIG. 2C, the LED 3 has a compound semiconductor 30 including a plurality of layers such as a peeling layer for laser lift-off and a light emitting layer. The LED 3 has LED electrodes 31a and 31b for light emission at predetermined positions on the upper surface (on one surface) of the compound semiconductor 30, and from the light source (light emitting layer) on the lower surface (the other surface) of the compound semiconductor 30. The light emitting surface 32 that emits the light is formed.

  In the present embodiment, the light emitting surface 32 is formed on the release layer side. In the laser lift-off, a laser beam is focused and irradiated on an interface region (for example, a peeling layer) where peeling is desired to decompose a substance in the interface region, and for example, for the LED 3 on the sapphire substrate, the sapphire. The substrate can be peeled off. When laser lift-off is performed by a device (not shown) for performing laser lift-off, a fourth harmonic (266 nm) picosecond laser is used as the laser light L, for example, a solid-state UV (Ultra Violet) laser. It is preferable.

  The flattening film 4 is formed in a flat plate shape, an enclosing wall for adhering to and holding the peripheral side surface of the LED 3 is provided at a predetermined position, and exhibits an adhering function by ultraviolet irradiation or heating. By exhibiting the adhesive function, the LED 3 is held as shown in FIG. Note that the LED 3 and the flattening film 4 that are integrally formed are referred to as an LED element 5 in the present embodiment for convenience of description. In the present embodiment, an ultraviolet curable transparent photosensitive adhesive is used for forming the flattening film 4. In this case, the flattening film 4 is formed by irradiating the photosensitive adhesive with ultraviolet rays having a wavelength at which the photosensitive adhesive is cured by an ultraviolet irradiation device (not shown).

  The fluorescent light emitting layer 11 is a layer in which red, green, and blue fluorescent dyes (an example of a fluorescent material) perform wavelength conversion into red (R), green (G), and blue (B) fluorescence for realizing full-color display. Is. Specifically, the fluorescent dye of each of the fluorescent material layers 11R, 11G, and 11B transitions to an excited state by the light (excitation light) emitted from the LED 3, and then returns to the ground state by each fluorescent material. It emits fluorescence corresponding to the wavelength-converted visible spectrum of red (R), green (G), and blue (B). These fluorescent material layers 11R, 11G, and 11B are partitioned by partition walls 12 having a metal film 15 on the surface.

  FIG. 3 shows a more detailed configuration of the repair cell 21a, and the fluorescent light emitting layer 11 corresponding to each color of RGB is provided on the LED element 5 via an adhesive. Specifically, the fluorescent material layer 11R of the fluorescent light emitting layer 11 is formed by mixing a fluorescent dye 14a having a large particle size of several tens of microns and a fluorescent dye 14b having a small particle size of several tens of nanometers in a resist film. , Dispersed. The fluorescent material layer 11R may be composed of only the fluorescent dye 14a having a large particle size, but in this case, the filling rate of the fluorescent dye 14a is reduced, and the leaked light of the excitation light to the display surface side is reduced. Will increase.

  On the other hand, when the fluorescent material layer 11R is composed of only the fluorescent dye 14b having a small particle diameter, there is a problem that stability such as light resistance is deteriorated. Therefore, in the present embodiment, it is preferable that the fluorescent material layer 11R is composed of a mixture in which the fluorescent dye 14a having a large particle diameter is mixed more than the fluorescent dye 14b having a small particle diameter.

  Further, the fluorescent material layer 11G is, as in the fluorescent material layer 11R, a mixture of a fluorescent dye 14c having a large particle diameter and a fluorescent dye 14d having a small particle diameter, which are dispersed. Further, the fluorescent material layer 11B is, as in the fluorescent material layer 11R, a mixture and dispersion of a fluorescent dye 14e having a large particle diameter and a fluorescent dye 14f having a small particle diameter. As a result, it is possible to suppress the leakage of the excitation light to the display surface side and improve the light emission efficiency.

  The mixing ratio of fluorescent dyes having different particle diameters is 50 to 90 Vol% for fluorescent dyes having a large particle diameter and 10 to 50 Vol% for fluorescent dyes having a small particle diameter in terms of volume ratio. It is desirable that the total amount of the fluorescent dye and the fluorescent dye having a small particle size be 100 Vol%.

  The partition wall 12 is an example of a light shielding wall and separates the fluorescent material layers 11R, 11G, and 11B from each other. The partition wall 12 is formed of, for example, a transparent photosensitive resin. In the present embodiment, for example, in order to increase the filling rate of the fluorescent dye 14a having a large particle size in the fluorescent material layer 11R, the partition wall 12 has a high aspect ratio that allows an aspect ratio of height to width of 3 or more. Is preferred. The same applies to the fluorescent material layers 11G and 11B. An example of such a high aspect material is SU-83000 photoresist manufactured by Nippon Kayaku Co., Ltd.

  As shown in FIG. 3, a metal film 15 is provided on the surface of the partition wall 12. The metal film 15 is for preventing the excitation light and the fluorescent light FL emitted from the light emitting surface 32 from passing through the partition 12 and being mixed with the adjacent fluorescent light FL of another color. The fluorescent light FL emits light when each fluorescent dye in each of the fluorescent material layers 11R, 11G, and 11B is excited by the excitation light. The metal film 15 is formed with a thickness that can sufficiently block the excitation light and the fluorescence FL. In this case, the metal film 15 is preferably a thin film such as aluminum or aluminum alloy that easily reflects excitation light.

  The fluorescent light emitting layer 11 can reflect the excitation light traveling toward the partition wall 12 by the metal film 15 such as aluminum, and can be used for the light emission of each of the fluorescent material layers 11R, 11G and 11B. Therefore, the luminous efficiency of each of the fluorescent material layers 11R, 11G, and 11B is improved. However, the thin film deposited on the surface of the partition wall 12 is not limited to the metal film 15 that reflects the excitation light and the fluorescence FL, and may be one that absorbs the excitation light and the fluorescence FL.

[Manufacturing method of repair cell]
Next, a method of manufacturing the repair cell thus configured will be described.
FIG. 4 is a flowchart showing steps of the method for manufacturing the repair cell according to the first embodiment. The repair cell manufacturing method is roughly divided into formation of an LED element (step S1) in which a micro LED and a flattening film are integrally formed, formation of a fluorescent light emitting layer (step S2), and LED element and fluorescence. Bonding with the light emitting layer (step S3) is performed. Each step further includes a plurality of steps, and the details of each step will be specifically described below.

(LED element forming process)
FIG. 5 is a flowchart showing a process of forming an LED element. 6 and 7 are process drawings for explaining the process of forming the LED element. The step of forming the LED element is an example of the step of integrally forming the LED 3 and the flattening film 4.

  In the process of forming the LED element, first, by using the plurality of LEDs 3 arranged in a matrix on one surface of the sapphire substrate 7 shown in FIG. 6A, the LEDs shown in FIGS. The element 5 is formed. In the present embodiment, a method of realizing full color display by combining the above-described LED 3 and RGB phosphor is adopted. In the present embodiment, the wavelength conversion is performed by the fluorescent material so that each of the fluorescent material layers 11R, 11G, and 11B can emit fluorescence corresponding to red (R), green (G), and blue (B). The flattening film 4 that holds three LEDs 3 as one pixel unit is formed by combining the red (R), green (G), and blue (B) fluorescence units. Specifically, in the present embodiment, a case will be described in which four LED elements 5 are formed using the flattening film 4.

  6A is an enlarged plan view of a part of the sapphire substrate 7 on which the LEDs 3 are arranged, and FIG. 6B is a sectional view taken along line AA of FIG. 6A. The cross-sectional views of FIGS. 6D and 6F also show the cross-sectional view taken along the line AA of FIG. 6A. In FIG. 6A, the light emitting surface 32 of the LED 3 shown in FIG. 2C is in contact with the sapphire substrate 7.

  In the application of the flattening film (step S11), for example, a resin of a transparent photosensitive adhesive is applied as the flattening film 4 by using a micro dispenser (not shown) controlled automatically. In this case, all the LEDs 3 are covered with the flattening film 4, as shown in FIGS. In the present embodiment, since the resin of the photosensitive adhesive is applied so as to have a uniform height, the flattened flattening film 4 is formed. The advantage of being flat is that, for example, the thickness of the flattening film 4 shown in FIG. 2B and the height of the LED 3 including the LED electrodes 31a and 31b shown in FIG. In the lighting inspection described later or when the cell 21 or the repair cell 21a is mounted on the wiring board 6, there is an effect of preventing contact failure of the LED electrodes 31a and 31b of the LED 3.

  In the exposure of the flattening film (step S12), since the LED electrodes 31a and 31b are covered with the flattening film 4, for example, the LED electrodes 31a and 31b are exposed by a photolithography technique using a photomask (not shown). Expose. 6E and 6F show a state in which the LED electrodes 31a and 31b are exposed (see FIG. 8).

  FIG. 8 is an enlarged view of a main part of the LED. 8A is an enlarged plan view of a region R3 indicated by a broken line in FIG. 6E, and FIG. 8B is a cross-sectional view taken along line BB of FIG. 8A. As shown in FIGS. 8A and 8B, only the flattening film 4 in the region covering the LED 3 is removed by exposure, and the LED electrodes 31a and 31b are exposed. 8C is a view for explaining the surrounding wall 41 of the flattening film 4, and shows a region surrounding the peripheral side surface 30a of the LED 3 shown in FIG. 8A.

  In the bonding (step S13), the first temporary substrate 8 temporarily used for laser lift-off is bonded to the flattening film 4, and then pressure is applied. As the first temporary substrate 8, a substrate such as quartz glass that allows transmission of ultraviolet UV (ultraviolet light) is used. Since the first temporary substrate 8 is later peeled off by the laser lift-off, the laser light L can also be transmitted. FIG. 7A is a plan view showing a state after bonding and pressing, and FIG. 7B is a front view. As shown in FIG. 7B, the flattening film 4 develops an adhesive function by irradiating the flattening film 4 with ultraviolet rays UV after bonding and pressurizing, and when the flattening film 4 is hardened, the peripheral side surface of the LED 3 is cured. 30a and the surrounding wall 41 of the flattening film 4 are bonded to each other so that they are integrally formed and the LED element 5 is formed.

  In the laser lift-off (step S14), laser light L is irradiated from the sapphire substrate 7 side to peel off the sapphire substrate 7. 7C and 7D are diagrams for explaining the laser lift-off. In step S14, the laser lift-off is executed by irradiating the irradiation region 71 with the laser light L. However, the focus position of the laser light L is in the boundary region between the sapphire substrate 7 and the planarization film 4.

  In the transfer to the first temporary substrate (step S15), the LED element 5 is transferred to the first temporary substrate 8 by peeling off the sapphire substrate 7. 7E and 7F schematically show a state in which the LED element 5 is transferred to the first temporary substrate 8 by peeling the sapphire substrate 7.

  FIG. 9 is an enlarged view of a main part of the LED after the laser lift-off. 9A is an enlarged plan view of a region R4 shown by a broken line in FIG. 7E, and FIG. 9B is a cross-sectional view taken along line CC of FIG. 9A. Focusing on the LED 3, the LED electrodes 31 a and 31 b provided on the surface of the LED 3 held by the flattening film 4 on the opposite side of the light emitting surface 32 are in contact with the first temporary substrate 8. In this case, the height of the flattening film 4 shown in FIG. 8B is different from the height of the flattening film 4 shown in FIG. 9B because the flattening film 4 is pressed and bonded. Is.

(Formation of fluorescent light emitting layer)
FIG. 10 is a flowchart showing the steps of forming the fluorescent light emitting layer. 11 to 13 are process diagrams illustrating the process of forming the fluorescent light emitting layer. The step of forming the fluorescent light emitting layer includes formation of partition walls (step S21), formation of a reflective film (step S22), laser processing of the reflective film (step S23), and filling of a fluorescent material (step S24).

  First, in the formation of the partition (step S21), the partition 12 is formed on the second temporary substrate 9 which is temporarily used for laser lift-off. FIG. 11A is a plan view showing a state in which the partition walls 12 are provided on the second temporary substrate 9, and FIG. 11B is a front view. Here, like the first temporary substrate 8, the second temporary substrate 9 is a transparent substrate made of quartz glass or the like, and ultraviolet rays are transmitted therethrough. Further, the second temporary substrate 9 is peeled off by the laser lift-off, so that the laser light L is also transmitted. In step S21, for example, a transparent photosensitive resin for the partition 12 is applied on the second temporary substrate 9, exposed using a photomask, and developed to form each of the fluorescent material layers 11R, 11G, and 11B. The opening 12a is provided corresponding to the formation position.

  Then, in step S21, the transparent partition 12 having an aspect ratio of height to width of 3 or more is formed with a height of about 20 μm per minute. In this case, the photosensitive resin used is preferably a high aspect material such as SU-83000 manufactured by Nippon Kayaku Co., Ltd., for example.

  Next, in the formation of the reflection film (step S22), a film formation technique such as sputtering is applied from the side of the partition wall 12 formed on the second temporary substrate 9 to form the metal film 15 such as aluminum or aluminum alloy. A film is formed to have a predetermined thickness. In step S22, the metal film 15 may be formed to have a predetermined thickness by plating. 11C is a plan view showing a state after the metal film 15 is formed on the second temporary substrate 9, and FIG. 11D is a front view.

  Subsequently, in the laser processing of the reflective film (step S23), the metal film 15 covering the upper portion of the opening surrounded by the partition wall 12 is irradiated with the laser light L1 of visible light or ultraviolet light suitable for the laser processing of the reflective film. , The metal film 15 in the region excluding the side surface in the opening is removed. As a result, the metal film 15 deposited on the bottom of the opening that is in contact with the second temporary substrate 9 is also removed. 11E is a plan view showing a state where the metal film 15 is formed on the partition wall 12 after the laser processing, and FIG. 11F is a front view of FIG. 11E, showing the laser beam L1. The state of irradiation is shown.

  FIG. 12 is an explanatory diagram of laser processing of the reflective film. FIG. 12A is an enlarged plan view of the partition wall 12 of FIG. 11E, and FIG. 12B is a sectional view taken along the line DD of FIG. 12A. As shown in FIG. 12, the metal film 15 is formed only on the partition wall 12 by laser processing.

  Next, in the filling of the fluorescent material (step S24), as the fluorescent material of RGB, the red fluorescent pigment is filled in the fluorescent material layer 11R, the green fluorescent pigment is filled in the fluorescent material layer 11G, and the blue fluorescent pigment is filled. The fluorescent material layer 11B is filled. FIG. 11G is a plan view showing a state after the RGB fluorescent materials are filled, and FIG. 11H is a front view thereof.

  13A is an enlarged view of the fluorescent light emitting layer 11 shown in FIGS. 11G and 11H, and FIG. 13B is a sectional view taken along line EE of FIG. 13A. As an example, as shown in FIG. 3, a resist containing a red fluorescent dye 14 is applied to the opening corresponding to red by inkjet, for example. The opening is a region surrounded by the partition wall 12 as described above.

  Specifically, in step S24, the red fluorescent material layer 11R is formed by curing the resist containing the red fluorescent dye by ultraviolet irradiation. In step S24, after coating the second temporary substrate 9 with a resist containing a red fluorescent dye, exposure is performed using a photomask and development is performed, and red openings are formed in openings corresponding to red. The fluorescent material layer 11R may be formed. In this case, the resist is obtained by mixing and dispersing the fluorescent dye 14a having a large particle size and the fluorescent dye 14b having a small particle size.

  Similarly, in step S24, a resist containing a green fluorescent dye is applied to the opening corresponding to green by, for example, an inkjet, and then cured by ultraviolet irradiation to form a green fluorescent material layer 11G. In step S24, the method of forming the red fluorescent material layer 11R in the opening corresponding to red may be similarly applied to form the green fluorescent material layer 11G in the opening corresponding to green. .

  Similarly, in step S24, a blue fluorescent material layer 11B is formed by applying a resist containing a blue fluorescent dye to the opening corresponding to blue by, for example, an inkjet method, and then curing the resist by ultraviolet irradiation. In step S24, the method of forming the red fluorescent material layer 11R in the opening corresponding to red may be similarly applied to form the blue fluorescent material layer 11B in the opening corresponding to blue. .

(Lamination of LED element and fluorescent light emitting layer)
Subsequently, in the present embodiment, in order to manufacture the repair cell 21a, a process of bonding the LED element 5 and the fluorescent light emitting layer 11 is performed. This is an example of a step of bonding the fluorescent light emitting layer 11 on the flattening film 4. Here, the bonding (step S3) includes processing (steps S38 and S39) from application of the adhesive to the LED element (step S31) to transfer of all the repair cells 21a to the film.

  FIG. 14 is a flowchart showing the bonding process. 15 to 18 are process diagrams illustrating the bonding process. FIG. 15A is a plan view of the LED element 5 bonded on the first temporary substrate 8, and FIG. 15B is a sectional view taken along line FF of FIG. 15A. FIG. 15A illustrates the LED element 5 formed in the formation of the LED element shown in FIG. 4 (step S1). However, the LED element 5 is bonded onto the first temporary substrate 8 at this stage.

  Then, in the application of the adhesive to the LED element (step S31), the adhesive 51 is applied on the flattening film 4 of the LED element 5. FIG. 15C is a plan view of the first temporary substrate 8 including the LED element 5, and FIG. 15D is a front view thereof. The adhesive 51 is, for example, a resin of a transparent photosensitive adhesive that exhibits an adhesive function by irradiation of ultraviolet rays, like the flattening film 4. The adhesive 51 is not applied to the entire surface in order to avoid applying the adhesive 51 to the light emitting surface 32 of the LED 3 shown in FIG.

  In the bonding with the fluorescent light emitting layer (step S32), the fluorescent light emitting layer 11 is made to be the upper layer of the light emitting surface 32 of the LED 3 of the LED element 5, and the LED element 5 on the first temporary substrate 8 and the Second, the fluorescent light emitting layer 11 on the temporary substrate 9 is attached. FIG. 15E shows the LED element 5 on the first temporary substrate 8 shown in FIG. 15C and the fluorescent light emitting layer 11 on the second temporary substrate 9 shown in FIGS. 11G and 11H. FIG. 15 (f) is a front view showing a state in which the LED element 5 and the fluorescent light emitting layer 11 are adhered to each other by ultraviolet irradiation after the two are bonded together.

  Here, in the present embodiment, the lighting inspection (step S33) may be executed. FIG. 15G illustrates a state in which the LED element 5 is in contact with the inspection substrate 10, and details will be described later with reference to FIGS. 22 to 26.

  In the laser lift-off on the fluorescent light emitting layer side (step S34), laser light L is applied to the second temporary substrate 9 side to perform laser lift-off. 16A and 16B schematically show the process of laser lift-off. In step S34, the laser lift-off is executed by irradiating the irradiation area 91 with the laser light L.

  In the peeling of the second temporary substrate (step S35), the second temporary substrate 9 is peeled off by laser lift-off. As a result, the repair cell 21a bonded to the first temporary substrate 8 is manufactured. FIG. 17A shows a plan view of the first temporary substrate 8 including the repair cell 21a after the second temporary substrate 9 is peeled off, and FIG. 17B shows a front view thereof.

  Next, in the bonding to the film (step S36), the repair cells 21a adhered on the first temporary substrate 8 are transferred to the film F in order, so the repair cells 21a are bonded to the film F. . The film F has, for example, an adhesive or an adhesive, and is a supporting film for fixing and holding the repair cell 21a. 18A is a plan view showing a state in which the repair cell 21a adhered to the first temporary substrate 8 is attached to the film F, and FIG. 18B is a front view.

  Subsequently, in the laser lift-off from the first temporary substrate 8 side (step S37), the laser light L is irradiated from the first temporary substrate 8 side, and the repair cell 21a is moved to the first temporary substrate by laser lift-off. Remove from 8. 18C and 18D schematically show the process of laser lift-off, and in step S37, the laser light L is applied to the irradiation region 81 to perform the laser lift-off.

  In the transfer to the film (step S38), the repair cell 21a is transferred to the film side. Hereinafter, in step S39, it is determined whether all repair cells 21a have been transferred to the film. Then, when all the repair cells 21a have not been transferred to the film F (No in step S39), the processing of steps S36 to S38 (hereinafter, simply referred to as "transfer processing to film") is repeated. 18E and 18F show a state in which one repair cell 21a is transferred to the film F by laser lift-off.

  19 and 20 are explanatory views of transfer to a film. More specifically, FIG. 19A shows a plan view of the film F, and alignment marks M1 to M4 for transferring the repair cell 21a are previously attached to one film surface. . Here, in the transfer process to the film, the first temporary substrate 8 is controlled by, for example, a robot arm (not shown) by automatic control, and the repair cell 21a bonded to the first temporary substrate 8 is aligned with the alignment mark. It is positioned and attached to M1 (see FIG. 19B). After that, in the transfer process to the film, laser light L (not shown) is irradiated to the bonding surface between the repair cell 21a positioned on the alignment mark M1 and attached to the film F and the first temporary substrate 8. Then, the repair cell 21a is peeled from the first temporary substrate 8 by laser lift-off, and transferred to the film F (see FIG. 19C). The width of the film is a value selected from the range of 5 to 15 mm, for example.

  Subsequently, in the transfer process to the film, the repair cell 21a of the first temporary substrate 8 is positioned and attached to the alignment mark M2 (see FIG. 19D). Then, in the transfer process to the film, the repair cell 21a is peeled off from the first temporary substrate 8 by laser lift-off, and transferred to the film F (see FIG. 20A). Thereafter, when the transfer process to the film is executed by the same process, as shown in FIGS. 20B to 20D, the repair cell 21a is finally positioned at the alignment marks M1 to M4. It is positioned and attached to the film F. The interval between the alignment marks M1 to M4 is a value selected from the range of 0.5 to 1.0 mm, for example.

  FIG. 21 is a configuration diagram of a repair cell transferred to a film. 21A is an enlarged plan view of a region R5 indicated by a broken line in FIG. 20D, and FIG. 21B is a sectional view taken along line GG of FIG. 21A. When the repair cell 21a is transferred to the film F, the upper surface of the fluorescent light emitting layer 11 of the repair cell 21a is bonded to the film F. In addition, in this embodiment, in order to simplify the description, the case where the four repair cells 21a are transferred to the film F has been described as an example. However, the present invention is not limited to this. For example, the film F is a tape of a winding type. The repair cell 21a may be in the form of a sheet or a large number of repair cells 21a may be transferred.

(Lighting inspection)
Next, details of the lighting inspection (step S33) will be described.
FIG. 22 is a flowchart showing the lighting inspection process. 23 and 24 are process diagrams illustrating the lighting inspection process. Here, the lighting inspection (step S33) includes processing from laser lift-off of the first temporary substrate (step S41) to reattachment of the first temporary substrate (step S45).

  In the lighting inspection (step S33), it is inspected whether or not the LED 3 of the repair cell 21a is normally turned on after the above-mentioned bonding with the fluorescent light emitting layer (step S32). FIG. 23A is a plan view showing a state in which the LED element 5 on the first temporary substrate 8 and the fluorescent light emitting layer 11 on the second temporary substrate 9 are bonded together after the step S32. (B) is the front view.

  In the laser lift-off of the first temporary substrate (step S41), the laser light L is emitted from the first temporary substrate 8 side to perform the laser lift-off. 23C and 23D are diagrams schematically showing laser lift-off.

  In the peeling of the first temporary substrate (step S42), the first temporary substrate 8 is peeled off by laser lift-off. FIG. 23 (e) is a plan view showing a state where the first temporary substrate 8 is peeled off, and FIG. 23 (f) is a front view. As a result, the LED electrode surface is exposed.

  In the contact with the inspection substrate (step S43), the LED electrodes 31a and 31b are positioned so as to be aligned with the electrode 10a of the inspection substrate 10, and pressure is applied to bring them into contact with each other. FIG. 24A is a front view showing a contact state with the inspection substrate 10. Then, in step S43, a current is passed between the anode and the cathode of the inspection substrate 10 to perform the lighting inspection of the LED 3.

  FIG. 25 is a configuration diagram of the inspection board. 25A is a plan view of the inspection substrate 10 and FIG. 25B is a sectional view taken along line HH of FIG. 25A. FIG. 26 is a diagram for explaining the lighting inspection by the inspection board, and is a partially enlarged view of the front view (FIG. 24A) showing the contact state with the inspection board 10. The inspection substrate 10 includes an anode pattern 10b and a cathode pattern 10c, and is composed of projecting electrodes 10a (photospacer electrodes) connected to the LED electrodes 31a and 31b.

  In the lighting confirmation (step S44), regarding the presence or absence of lighting of the LED 3, an image 10e is acquired by an observation electronic camera (not shown) via the filter 10d. FIG. 24B is a diagram schematically showing the lighting confirmation process (step S44). In step S44, for example, the LEDs 3 are simultaneously turned on for each line. Observation with an electronic camera through a filter that transmits only the R (red) wavelength is performed to determine non-lighting, color mixture (R emits light other than the R cell), color loss (low brightness of R), and the like. Check G (green) and B (blue) by changing the filters.

  In the re-bonding of the first temporary substrate (step S45), the adhesive 51 is applied to the bonding region of the flattening film 4, and the first temporary substrate 8 is bonded and cured. FIG. 24C is a front view showing a state in which the first temporary substrate 8 is reattached. As a result, as shown in FIG. 15F, the state returns to the state after the bonding with the fluorescent light emitting layer (step S32). Then, in the bonding of the LED element and the fluorescent light emitting layer (step S3), the laser lift-off on the fluorescent light emitting layer side (step S34) can be continued. The defective cells found in the lighting inspection are not transferred in the transfer to the film (step S38).

  As described above, according to the repair cell 21a according to the first embodiment, the flattening film 4 holding the LED 3 which is the ultraviolet light emitting diode (UV-LED), and the fluorescent light emission provided on the flattening film 4 are provided. And a layer 11. Conventionally, when a defective cell is found in the manufacturing stage of a micro LED display that realizes full-color display by using an ultraviolet light emitting diode light emitting source and a fluorescent material as a color conversion layer, laser processing of the defective portion is performed as described above. In order to restore the circuit pattern and further restore the cell after the removal, it is necessary to carry out a remounting process including mounting a new LED chip at the defective portion. On the other hand, since the repair cell 21a manufactured in advance may be replaced, the above-mentioned remounting step can be omitted. As a result, the tact time can be shortened by that amount, and the defective portion found in the manufacturing stage of the micro LED display can be repaired. Further, since the above-mentioned remounting process is unnecessary, it is possible to avoid the occurrence of new defects.

  Further, according to the micro LED display 100 according to the first embodiment, the defective cell is replaced by the repair cell 21a, so that the repaired micro LED display can be provided by shortening the tact time.

  Furthermore, the repair cell manufacturing method according to the first embodiment can manufacture the repair cell 21a.

Next, a modified example of the repair cell according to the first embodiment will be described.
FIG. 27 is a diagram showing a modification of the repair cell according to the first embodiment. 27A is a plan view of repair cells 21b, 21c, and 21d of the modification, and FIG. 27B is a sectional view taken along line I-I of FIG. 27A. (C) is a front view of micro LED3a (henceforth "LED3a"). In the repair cells 21b, 21c, and 21d, as compared with the repair cell 21a, the flattening film 4a has a surrounding wall 41a, exhibits an adhesive function by ultraviolet irradiation or heating, and is wavelength-converted by a fluorescent material. The difference is that one micro LED is held as one pixel for each unit of red (R), green (G), and blue (B) fluorescence. Here, the LED element 5a is formed by integrally forming the LED 3a and the flattening film 4a.

  Further, as shown in FIG. 27A, the fluorescent light emitting layer 11a of the repair cell 21b includes a fluorescent material layer 11R having a red fluorescent dye, and the fluorescent light emitting layer 11b of the repair cell 21c has a green fluorescent dye. The repairing cell 21d includes a fluorescent material layer 11G, and the fluorescent light emitting layer 11c of the repair cell 21d includes a fluorescent material layer 11B having a blue fluorescent dye. The partition 12 surrounds each of the fluorescent material layers 11R, 11G, and 11B, and a metal film 15 is provided on the surface of the partition 12.

  The LED 3a has the same configuration as the LED 3, has LED electrodes 31c and 31d for light emission at predetermined positions on the upper surface (on one surface) of the compound semiconductor 30b, and lower surface (the other surface) of the compound semiconductor 30b. ) Is formed with a light emitting surface 32a that emits light from the light source (light emitting layer).

  Here, in the micro LED display 100 shown in FIG. 1, it is assumed that the repair cells 21b, 21c, and 21d are replaced with cells having the same configuration. If the repair cells 21b, 21c, and 21d for each pixel unit of red (R), green (G), and blue (B) that are wavelength-converted by the respective fluorescent material layers 11R, 11G, and 11B are adopted, defects will occur. At the location, defective cells can be replaced in units of each pixel (subpixel) of red (R), green (G), and blue (B).

[Second Embodiment]
Next, a second embodiment for carrying out the repair cell, the micro LED display, and the method for manufacturing the repair cell according to the present invention will be described in detail.

[Micro LED display]
In the second embodiment, the LEDs 3 and 3a which are the ultraviolet light emitting diodes (UV-LEDs) as in the first embodiment are not used, but the three primary colors of light are red (R), green (G), and blue ( A visible light emitting diode (LED) that emits any color of B) is used.

  FIG. 28 is a plan view schematically showing an example of the micro LED display according to the second embodiment. A micro LED display 100a shown in FIG. 28 is a micro LED display in which a plurality of cells for realizing full color display are arranged in a matrix, and a cell 21e including micro LEDs 3b, 3c, 3d arranged in a matrix. And an array substrate 1a including a wiring substrate 6e for driving the respective micro LEDs 3b, 3c, 3d.

  In the present embodiment, as an example, in the manufacturing process of the micro LED display 100a shown in FIG. 28, the cell 21e surrounded by the region R6 was found to be a defective cell, and the repair cell 21f was replaced as a replacement part. The case will be described. The repair cell 21f is composed of the same parts as the cell 21e which is determined to have no defect in the manufacturing process of the micro LED display 100a.

  The micro LED 3b (hereinafter, simply referred to as “LED3b”) is a diode that emits red (R) color, and the micro LED 3c (hereinafter, simply referred to as “LED 3c”) is a diode that emits green (G) color, The LED 3d (hereinafter, simply referred to as "LED3d") is a diode that emits blue (B) color. Although the wiring of the wiring board 6e is not shown in FIG. 28, the wiring board 6e may have the same configuration as that of the wiring board 6 shown in FIG. 1B. In the cell 21e and the repair cell 21f, the flattening film 4b (see FIG. 29) holds a number of LEDs 3b, 3c, and 3d corresponding to the emission patterns of red (R), green (G), and blue (B). Specifically, the flattening film 4b holds three LEDs 3b, 3c, and 3d as one pixel by combining units of light emission of red (R), green (G), and blue (B). As a result, the micro LED display 100a does not require the fluorescent light emitting layer 11 shown in FIG.

  Like the micro LED display 100, the micro LED display 100a can be applied to a flat display or a flexible display. When the micro LED display 100a is applied to, for example, a flat display, in FIG. 28, for example, protective glass is omitted as another component.

[Repair cell]
FIG. 29 is an explanatory diagram of a repair cell according to the second embodiment. 29A is a plan view seen from the LED electrode side of the repair cell 21f, FIG. 29B is a sectional view taken along line JJ of FIG. 29A, and FIG. 29C is a light emitting surface 32a. It is a top view of repair cell 21f seen from the side. Here, the repair cell 21f of the second embodiment is used as a substitute for the defective cell of the micro LED display 100a, and is formed in a flat plate shape with the LEDs 3b, 3c, 3d, as shown in FIG. An enclosing wall 41b for adhering and holding the peripheral side surfaces of the LEDs 3b, 3c, 3d is provided, and a flattening film 4b that exhibits an adhering function by ultraviolet irradiation or heating is provided. The LED 3b has LED electrodes 31e and 31f for light emission on one of the opposite surfaces, and a light emitting surface 32b for emitting the emitted light on the other surface. The LED 3c has LED electrodes 31e and 31f and a light emitting surface 32c, like the LED 3b. Further, the LED 3d has LED electrodes 31e and 31f and a light emitting surface 32d, like the LED 3b.

  The flattening film 4b holds the number of LEDs 3b, 3c, and 3d according to the light emission patterns of red (R), green (G), and blue (B) by exhibiting an adhesive function. Specifically, the flattening film 4b holds, for example, three LEDs 3b, 3c, and 3d as one pixel by combining units of light emission of red (R), green (G), and blue (B). In this embodiment, the flattening film 4b and the LEDs 3b, 3c, and 3d integrally formed are referred to as an LED element 5b. However, since the fluorescent light emitting layer 11 is unnecessary, the LED element 5b itself is for repairing. It becomes the cell 21f.

[Manufacturing method of repair cell]
In the method for manufacturing the repair cell according to the second embodiment, the LEDs 3b, 3c and 3d and the flattened flat film 4b that holds them are integrally formed. Therefore, the manufacturing method of the repair cell according to the second embodiment relates to the first embodiment only by changing the LED to be used from the ultraviolet light emitting diode (UV-LED) to the visible light emitting diode (LED). This is the same as the formation of the LED element (step S21). Therefore, the description is omitted.

Next, transfer of the repair cell to the film according to the second embodiment will be described.
30 and 31 are diagrams for explaining the transfer of the repair cell according to the second embodiment onto the film. FIG. 30A is a plan view of the repair cell 21f bonded to the first temporary substrate 8, and FIG. 30B is a front view. 30C and 30D show a state in which the film F is attached to the repair cell 21f. 30E and 30F show a state where the first temporary substrate 8 is irradiated with the laser light L and the laser is lifted off. 30G and 30H show a state in which the first temporary substrate 8 is peeled off. The transfer of the film F of the repair cell 21f is the same as the method described with reference to FIGS.

  31A is a plan view showing a state in which the repair cell 21f is transferred to the film F, and FIG. 31B is a sectional view taken along line KK of FIG. 31A. When the repair cell 21f is transferred to the film F, the LED electrodes 31e and 31f are on the front side, and the light emitting surface of the repair cell 21f is attached to the film F.

  As described above, the repair cell 21f according to the second embodiment has the structure including the LEDs 3b, 3c, and 3d, which are visible light emitting diodes (LEDs), and the flattening film 4b that holds them. In the second embodiment as well, the repair cell 21f manufactured in advance can be used as a substitute for the defective cell, so that the above-mentioned re-mounting step can be omitted as in the first embodiment. As a result, according to the repair cell 21f according to the second embodiment, the tact time can be shortened by that much, and the defective portion found in the manufacturing stage of the micro LED display can be repaired. Further, since the above-mentioned remounting process is unnecessary, it is possible to avoid the occurrence of new defects.

  Further, according to the micro LED display 100a according to the second embodiment, since the defective cell is replaced with the repair cell 21f, it is possible to provide a repaired micro LED display by shortening the tact time.

  Furthermore, the repair cell manufacturing method according to the first embodiment can manufacture the repair cell 21f.

  Next, a modification of the repair cell according to the second embodiment will be described. The repair cell of this modified example is a repair cell used as a substitute for a defective cell of a micro LED display, and is formed in a flat plate shape with the micro LED, and is surrounded by a peripheral side surface of the micro LED for adhesion and holding. A flattening film that has a wall and holds a number of micro LEDs corresponding to the emission patterns of red (R), green (G), and blue (B) by exhibiting an adhesive function by ultraviolet irradiation or heating; Equipped with. Specifically, the planarizing film holds the micro LED as one pixel for each unit of light emission of red (R), green (G), and blue (B). The repair cell of this modification has, for example, a configuration in which the repair cell 21f according to the second embodiment shown in FIG. 29 is divided into three for each pixel unit.

  FIG. 32 is a diagram showing a modified example of the repair cell according to the second embodiment. 32A is a plan view of the repair cells 21g, 21h, and 21i viewed from the LED electrode side, and FIG. 32B is a sectional view taken along line LL of FIG. 32A. [Fig. 4] is a plan view of each repair cell 21g, 21h, 21i viewed from the light emitting surface side.

  The repair cell 21g includes a red (R) color LED 3b and a flat plate-shaped flattening film 4c that exhibits an adhesive function by irradiation with ultraviolet rays, and is integrally formed similarly to the repair cell 21a of the first embodiment. As a result, the flattening film 4c holds the LED 3b by the surrounding wall 41c. The repair cell 21h includes a green (G) LED 3c and a flattening film 4c, and is integrally formed so that the flattening film 4c holds the LED 3c by the surrounding wall 41c. The repair cell 21i is provided with a blue (G) LED 3d and a flat plate-shaped flattening film 4c, and is integrally formed by irradiation with ultraviolet rays, so that the flattening film 4c holds the LED 3d by the surrounding wall 41c. is there. Here, it is assumed that the micro LED display 100a shown in FIG. 28 is replaced with a cell having the same configuration as the repair cells 21g, 21h, and 21i.

  As described above, in the modification example of the repair cell according to the second embodiment, when the repair cells 21g, 21h, and 21i for each pixel unit of red (R), green (G), and blue (B) are adopted, the defective portion is defective. In, the defective cells can be replaced in units of each pixel (subpixel) of red (R), green (G), and blue (B).

  In the above-described embodiment, an ultraviolet curable transparent photosensitive adhesive that exhibits an adhesive function is applied to the planarizing films 4, 4a, 4b, 4c and the adhesive 51, but the present invention is not limited to this, and A heat-curable transparent heat-sensitive adhesive exhibiting a function may be applied to the flattening films 4, 4a, 4b, 4c and the adhesive 51. In this case, in the above embodiment, the ultraviolet irradiation may be replaced with the heat treatment. In this case, a heating device (not shown) may be used to perform heat treatment at a temperature at which the heat-sensitive adhesive is cured.

3, 3a, 3b, 3c, 3d ... Micro LED
4, 4a, 4b, 4c ... Planarization film 11, 11a, 11b, 11c ... Fluorescent light emitting layer 12 ... Partition (light shielding wall)
21, 21e ... Cell 21a, 21b, 21c, 21d, 21f, 21g, 21h, 21i ... Repair cell 31a, 31b, 31c, 31d, 31e, 31f ... LED electrode 32, 32a, 32b, 32c, 32d ... Light emission Surface 41, 41a, 41b, 41c ... Enclosing wall 100, 100a ... Micro LED display

Claims (10)

A repair cell used as a substitute for a defective cell in which a defect has occurred in a micro LED display in which a plurality of cells for realizing full-color display are arranged in a matrix,
It emits any of the three primary colors of light, red (R), green (G), and blue (B), and has an electrode for light emission on one of the opposite surfaces and the other surface. A micro LED having a light emitting surface for emitting emitted light;
The red (R), green (G), which is formed in a flat plate shape, has an enclosing wall for adhering and holding the peripheral side surface of the micro LED, and develops an adhering function by ultraviolet irradiation or heating, A flattening film for holding a number of the micro LEDs corresponding to a blue (B) emission pattern,
A repair cell, which is characterized by having.   The repair film according to claim 1, wherein the flattening film holds the micro LED as one pixel for each unit of light emission of the red (R), green (G), and blue (B). cell.   The repair according to claim 1, wherein the flattening film holds the micro LED as one pixel by combining the units of light emission of the red (R), green (G), and blue (B). Cell. A repair cell used as a substitute for a defective cell in which a defect has occurred in a micro LED display in which a plurality of cells for realizing full-color display are arranged in a matrix,
A light emitting surface that emits light having a specific spectrum in the ultraviolet to blue wavelength band, has an electrode for light emission on one of the opposite surfaces, and emits the emitted light on the other surface. A micro LED formed with
The micro LED is formed in a flat plate shape and has an enclosing wall for adhering and holding the peripheral side surface of the micro LED at a predetermined position, and the micro LED is 1 or A planarizing film that holds a plurality of
A fluorescent material that is provided on the flattening film and that is excited by the light emitted from the micro LEDs according to the number of the micro LEDs to convert the wavelength into fluorescence of a predetermined corresponding color is shielded around the periphery. A fluorescent light emitting layer filled in a region surrounded by,
A repair cell, which is characterized by having. The corresponding color of the fluorescent light whose wavelength is converted by the fluorescent material is any one of the three primary colors of light, red (R), green (G), and blue (B),
The flattening film holds the micro LED as one pixel for each unit of the red (R), green (G), and blue (B) fluorescence wavelength-converted by the fluorescent material. The repair cell according to claim 4. The corresponding color of the fluorescent light whose wavelength is converted by the fluorescent material is any one of the three primary colors of light, red (R), green (G), and blue (B),
The flattening film holds the micro LED as one pixel unit by combining the red (R), green (G), and blue (B) fluorescent units whose wavelengths are converted by the fluorescent material. The repair cell according to claim 4. A micro LED display in which a plurality of cells for realizing full color display are arranged in a matrix,
A micro LED display, wherein a defective cell in which a defect has occurred is replaced with the repair cell according to any one of claims 1 to 3. A micro LED display in which a plurality of cells for realizing full color display are arranged in a matrix,
A micro LED display, wherein a defective cell in which a defect has occurred is replaced by the repair cell according to any one of claims 4 to 6. A method of manufacturing a repair cell, which is used as a substitute for a defective cell in which a defect has occurred in a micro LED display in which a plurality of cells for realizing full-color display are arranged in a matrix,
It emits any of the three primary colors of light, red (R), green (G), and blue (B), and has an electrode for light emission on one of the opposite surfaces and the other surface. In the micro LED on which the light emitting surface for emitting the emitted light is formed, has a surrounding wall for adhering and holding the peripheral side surface of the micro LED, and by exerting an adhesive function by ultraviolet irradiation or heating, A repair cell comprising a step of integrally forming a flat plate-shaped planarizing film holding the number of the micro LEDs corresponding to the red (R), green (G) and blue (B) emission patterns. Manufacturing method. A method of manufacturing a repair cell, which is used as a substitute for a defective cell in which a defect has occurred in a micro LED display in which a plurality of cells for realizing full-color display are arranged in a matrix,
A light emitting surface that emits light having a specific spectrum in the ultraviolet to blue wavelength band, has an electrode for light emission on one of the opposite surfaces, and emits the emitted light on the other surface. Has a surrounding wall for adhering and holding the peripheral side surface of the micro LED at a predetermined position, and the micro LED is developed by exhibiting an adhering function by ultraviolet irradiation or heating. A step of integrally forming a flat plate-shaped flattening film for holding one or a plurality of layers,
Fluorescent light that is excited by light emitted from the microLEDs according to the number of the microLEDs and is filled with a fluorescent material that converts the wavelength into fluorescent light of a predetermined corresponding color in a region surrounded by a light shielding wall. A step of forming a light emitting layer,
Bonding the fluorescent light emitting layer on the flattening film,
A method of manufacturing a repair cell, comprising: