JP2021148868A - Repair tape and manufacturing apparatus and manufacturing method of the repair tape - Google Patents

Abstract

To provide a repair tape capable of easily repairing a color conversion chip.SOLUTION: A repair tape 1 is used for repairing a specific component built into micro-LED displays. The repair tape includes: an elongated light-transmissive tape base material 2 which can be wound up in a roll shape; and a color conversion chip 3 that is arranged according to a predetermined arrangement on one surface of the tape base material 2 and emits light being excited by light from a UV-LED as the specific component.SELECTED DRAWING: Figure 1

Description

In the present invention, a color conversion layer comprises a micro LED (Light Emitting Diode) that emits UV (Ultra Violet) and an RGB phosphor composed of red (R), green (G), and blue (B), which are the three primary colors of light. In the manufacturing stage of a UV-excited micro LED display that realizes full-color display in combination with a color conversion chip used as a As a component, the present invention relates to a repair tape for easily repairing a defect in a color conversion chip, an apparatus for manufacturing the repair tape, and a manufacturing method for the repair tape.

Conventionally, in the manufacturing process of an LED display, when manufacturing an LED substrate by using a transfer technique, a repair method has been proposed in which an LED is selectively retransferred to a defective portion (an unmounted portion of the LED). For example, see Patent Document 1). Specifically, this repair method includes a step of arranging a plurality of LEDs side by side on a transfer substrate made of a resin film in which a plurality of LEDs are arranged in a matrix, and an LED on the transfer substrate is arranged on the LED substrate. A step of transferring to the LED board, a step of detecting an unmounted portion of the LED on the LED substrate, and a repair step of selectively retransferring the LED from the transfer substrate to the detected unmounted portion of the LED substrate. (See, for example, Patent Document 1).

JP-A-2009-94181

However, the repair method described in Patent Document 1 has a problem that when the LED is a minute element such as a micro LED, the contact area of the LED with respect to the LED substrate is narrowed and the contact with the LED substrate becomes unstable. there were.

Further, the repair method described in Patent Document 1 does not envision a repair method for a component having a size of μm such as a color conversion chip incorporated in the manufacturing stage of a micro LED display.

Therefore, an object of the present invention is to provide a repair tape, a manufacturing apparatus thereof, and a manufacturing method for dealing with such a problem and making it possible to easily repair the color conversion chip.

In order to achieve the above object, the repair tape according to the first invention is a repair tape used for repairing a specific component incorporated in a micro LED display, and is an elongated light transmission that can be wound into a roll. A sex tape base material and a color conversion chip which is arranged on one surface of the tape base material according to a predetermined arrangement and is excited by light from a UV-LED to emit light as the specific component are provided. It is a thing.

In order to achieve the above object, the repair tape manufacturing apparatus according to the second invention is a repair tape manufacturing apparatus used for repairing a specific component incorporated in a micro LED display, and can be wound into a roll. A delivery mechanism that sequentially conveys a slender, light-transmitting tape base material to a laser processing position, and a plurality of the above-mentioned specific parts arranged on one surface of a light-transmitting substrate, and light from a UV-LED. A laser device that emits pulsed laser light at the timing of sequentially transferring the color conversion chip having an RGB phosphor that is excited by and emits light to the tape substrate by laser lift-off, and the color of the pulsed laser light to be transferred At the laser processing position, the optical system that forms an image on the interface between the conversion chip and the substrate is aligned so that the substrate and the tape substrate face each other, and the color conversion chip to be transferred and the tape substrate are aligned. By the laser lift-off, the color conversion chip to be transferred is peeled off from the substrate, and the color conversion chip to be transferred is transferred to the tape substrate, and the color conversion chip is transferred. It is provided with a winding mechanism for winding the tape base material, a sending mechanism, a laser device, a transfer mechanism, and a control unit for controlling the winding mechanism.

In order to achieve the above object, the repair tape manufacturing method according to the third invention is a repair tape manufacturing method used for repairing a specific part in the manufacturing stage of a micro LED display, and is wound in a roll shape. A process of sequentially transporting an elongated light-transmitting tape base material that can be taken to a laser processing position, and a plurality of the above-mentioned specific parts arranged on one surface of a light-transmitting substrate, from a UV-LED. In order to transfer a color conversion chip having an RGB phosphor that is excited by light and emits light to the tape base material at the laser processing position, a step of aligning the substrate and the tape base material so as to face each other and transfer. The color conversion chip to be transferred is peeled off from the substrate by the step of bonding the target color conversion chip and the tape base material and the laser lift-off, and the color conversion chip to be transferred is transferred to the tape base material. The step of winding the tape base material to which the color conversion chip is transferred is executed, and the process of winding the tape base material from the step of sequentially transporting the tape base material to the laser processing position is performed. By repeating the process, the color conversion chip is arranged on one surface of the tape base material according to a predetermined arrangement.

According to the repair tape according to the first invention, it is possible to provide the repair tape having the above configuration. As a result, even if a defect occurs in the color conversion chip, which is a specific component incorporated in the micro LED display, the repair tape according to the first invention manufactured in advance can be used to, for example, color. The color conversion chip can be easily repaired by transferring the replacement color conversion chip to the defective portion of the conversion chip.

Further, according to the repair tape manufacturing apparatus according to the second invention, it is possible to provide an apparatus for easily manufacturing the repair tape according to the first invention by the above configuration.

Further, according to the method for manufacturing a repair tape according to the third invention, the repair tape according to the first invention can be easily manufactured by the above steps.

It is a schematic diagram which shows one Embodiment of the repair tape by 1st invention. It is an enlarged plan view of the color conversion chip shown in FIG. It is an enlarged view of the main part of the repair tape shown in FIG. FIG. 3 is an enlarged cross-sectional view of the color conversion chip shown in FIG. It is a flow chart which shows the manufacture of a color conversion chip. It is a process drawing (1) explaining the manufacturing of a color conversion chip. It is a process drawing (2) explaining the manufacturing of a color conversion chip. It is a process drawing (3) explaining the manufacturing of a color conversion chip. It is a block diagram of the manufacturing apparatus of the repair tape according to 2nd invention. It is a detailed schematic diagram of the main part of the repair tape manufacturing apparatus shown in FIG. It is explanatory drawing which shows the positional relationship between a stage and a tape base material. It is a block diagram which shows an example of the hardware composition of the control part shown in FIG. It is a flow chart which shows the manufacturing method of the repair tape by 3rd invention. It is a process drawing (1) explaining the manufacturing method of the repair tape by 3rd invention. It is a process drawing (2) explaining the manufacturing method of the repair tape by 3rd invention. It is a process drawing (3) explaining the manufacturing method of the repair tape by 3rd invention. It is a schematic diagram explaining the repair means which transfers a color conversion chip on a display panel. It is a top view which shows the other embodiment of the repair tape by 1st invention. It is an enlarged view of the main part of the repair tape shown in FIG. It is an enlarged cross-sectional view of the color conversion chip shown in FIG. It is explanatory drawing which shows the other embodiment of the manufacturing method of the repair tape according to 3rd invention. It is a top view of the repair tape. It is a top view of the repair tape newly formed by cutting the repair tape shown in FIG. 22 into a plurality of pieces.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
FIG. 1 is a schematic view showing an embodiment of a repair tape according to the first invention. (A) is a plan view, and (b) is a cross-sectional view taken along the line AA shown in (a).

The repair tape 1 is used for repairing a specific component incorporated in the manufacturing stage of the micro LED display, and includes a tape base material 2, a plurality of color conversion chips 3, and a protective tape 4 (FIG. 6). 1 (a), (b)). However, FIG. 1A illustrates a state in which the repair tape 1 is partially cut out. Further, for convenience of explanation, the protective tape 4 is not shown. In FIG. 1B, the color conversion chip 3 is provided between the tape base material 2 and the protective tape 4, but the color conversion chip is relative to the thickness of the tape base material 2 (for example, about 0.7 mm). The thickness of 3 is, for example, about several tens of μm, and in reality, the protective tape 4 is also attached to the tape base material 2.

The tape base material 2 has an elongated shape that can be wound into a roll shape and has a light transmissive property that transmits UV light, and one end face of a plurality of color conversion chips 3 is fixed to the tape base material 2. To support. The tape base material 2 is, for example, an ultraviolet curable adhesive tape (also referred to as “ultraviolet release tape”) whose adhesive strength is reduced by irradiation with ultraviolet rays. Specifically, in this ultraviolet curable adhesive tape, when fixing the color conversion chip 3, the color conversion chip 3 is sufficiently fixed, and the adhesive is cured by irradiating with ultraviolet light. Adhesive strength can be reduced and peeling can be facilitated. The tape base material 2 is not limited to the ultraviolet curable adhesive tape, and may be a resin film having an adhesive coated on its surface, or may be various adhesive tapes. However, it is preferable to use an ultraviolet curable adhesive tape.

FIG. 2 is an enlarged plan view of the color conversion chip 3 shown in FIG. However, for convenience of explanation, the illustration of the light-transmitting protective film 34 described with reference to FIG. 4 is omitted. The color conversion chip 3 is excited by light from an ultraviolet light emitting diode (hereinafter, simply referred to as “UV-LED”) (hereinafter, simply referred to as “UV-LED”), which is not shown, and wavelength-converts to fluorescence of a predetermined corresponding color to realize full-color display. Is. Specifically, the color conversion chip 3 has an RGB phosphor that is provided on the chip of the UV-LED and is excited by the light emitted by the UV-LED to emit light. Color conversion layers (also referred to as "fluorescent light emitting layers") 3R, 3G, 3B in which green (G) and blue (B) phosphors are filled in concave regions divided by color by a wall 30 for preventing color mixing. have. In the present embodiment, the color conversion chip 3 is a specific component incorporated in the manufacturing stage of the UV excitation type micro LED display.

As the UV-LED, for example, one that emits light having a peak wavelength corresponding to any of 355, 360, 365, 370, 375, 385, 395, 400, and 405 nm is known. In the present embodiment, in consideration of the conversion efficiency of the RGB phosphor, a UV-LED that emits light having a peak wavelength of 385 nm may be selected as an example.

FIG. 3 is an enlarged view of a main part of the repair tape 1 shown in FIG. 1, and specifically, is an enlarged cross-sectional view of a region surrounded by R1 shown in FIG. 1 (b). The tape base material 2 has a base member 21 and an adhesive layer 22 laminated on one surface of the base member 21, and the color conversion chip 3 has one end surface via the adhesive layer 22. It is attached to the tape base material 2.

The base member 21 is made of an ultraviolet-transparent resin as an ultraviolet-curable adhesive tape. The pressure-sensitive adhesive layer 22 is an ultraviolet-curable pressure-sensitive adhesive laminated on one surface of the base member 21.

In the repair tape 1, the color conversion chips 3 are arranged on the tape base material 2 in an independent state in units of 1 pixel based on the arrangement pitch P as a predetermined arrangement. The distance interval of the array pitch P is defined so that the color conversion chip 3 can be efficiently repaired. Therefore, with such a structure, the color conversion chip 3 can be efficiently repaired by using the repair tape 1. Details will be described later with reference to FIG.

Further, in FIG. 3, the protective tape 4 has an elongated shape that can be wound into a roll shape to protect the color conversion chip 3, and the color conversion chip 3 is sandwiched between the protective tape 4 and the tape base material 2. It is provided on the opposite side. The protective tape 4 is easily peeled off from the plurality of color conversion chips 3 and the tape base material 2 by an adhesive applied to the surface. The protective tape 4 is peeled off before the color conversion chip 3 is repaired.

FIG. 4 is an enlarged cross-sectional view of the color conversion chip 3 shown in FIG. Specifically, the color conversion chip 3 has a peeling layer 32 for laser lift-off in the front view of FIG. 4, a wall 30 for preventing color mixing on the peeling layer 32, and a concave shape partitioned on the wall 30. It has color conversion layers 3R, 3G, and 3B in the region of. The wall 30 for preventing color mixing is composed of a light-shielding wall 31 and an opening wall 33. The light-shielding wall 31 reflects light from the UV-LED to block light, and has a partition wall 31a and a metal film 31b. The light-shielding wall 31 is a partition wall 31a coated with a metal film 31b.

The opening wall 33 is laminated so as to be connected to one end surface of the light-shielding wall 31, and contains a black color material that absorbs light from a UV-LED. By providing the opening wall 33, color unevenness due to reflection by metal is suppressed, and the larger the area of the black portion displayed on the screen of the micro LED display, the more black when the light is turned off, and the screen. Has the effect of improving the contrast of. A protective film 34 that seals and protects these color conversion layers 3R, 3G, and 3B is laminated on the wall 30 for preventing color mixing and the upper layers of the color conversion layers 3R, 3G, and 3B.

Next, the repair tape manufacturing apparatus according to the second invention, which is used for manufacturing the repair tape configured as described above, will be described. However, this manufacturing apparatus needs to use a light-transmitting transfer substrate 5 having a color conversion chip 3 arranged in a predetermined arrangement pattern on one surface (surface) (FIG. 8 (c)). )reference). Therefore, in order to make the explanation easy to understand, the manufacture of the color conversion chip 3 arranged on the substrate 5 will be described in advance. The predetermined arrangement pattern is preferably, for example, a matrix-like arrangement of m rows and n columns. Here, the total number of color conversion chips 3 to be transferred is determined according to, for example, a combination of set natural numbers (m, n).

FIG. 5 is a flow chart showing a process of manufacturing the color conversion chip 3. 6 to 8 are process diagrams (1) to (3) for explaining the process of manufacturing the color conversion chip 3.

First, in the preparation of the substrate (step S1), the substrate 5 is installed on a mounting table of a coating device (not shown) such as a spinner (spin coater). FIG. 6A illustrates the substrate 5 installed on the mounting table. The coating device is not limited to the spinner, and may be a slit coating type coating device. Since the color conversion chip 3 is transferred to the tape base material 2 by laser lift-off in the process of manufacturing the repair tape 1, the substrate 5 is a substrate having optical characteristics that the pulsed laser light passes through the substrate 5. Therefore, it is desirable that the substrate 5 has a transmittance of 90% or more with respect to the laser beam. The substrate 5 is a hard substrate capable of transmitting ultraviolet light such as quartz glass. Further, the wavelength of the laser light is determined in consideration of the absorption wavelength of the polyimide resin that absorbs the laser light in the next film formation of polyimide (step S2). This is because the polyimide resin needs to absorb the laser beam to cause the phenomenon of laser ablation.

In the film formation of polyimide (step S2), a process of forming a film by uniformly coating the polyimide 6 dissolved in a solvent on the substrate 5 with a predetermined film thickness is performed using the coating device. Subsequently, in step S2, the formed polyimide 6 is heat-dried to remove the solvent.

FIG. 6B illustrates a thin film (polyimide resin) of polyimide 6 laminated on the substrate 5. As the polyimide 6, a solvent-soluble type (for example, H230 / H310 manufactured by Mitsubishi Gas Chemical Company) is used. The film thickness of the polyimide 6 is not particularly limited, but is preferably in the range of 1 to 10 μm as a predetermined film thickness.

In the film formation (step S3) of the black matrix (hereinafter referred to as “BM”), a process of forming a BM material on the polyimide 6 is performed. Specifically, in step S3, the BM material is uniformly coated on the polyimide 6 with a predetermined film thickness by using the above-mentioned coating apparatus to form a film of BM7.

FIG. 6C illustrates a thin film of BM7 laminated on polyimide6. The BM material is, for example, a resist material for a black matrix containing a black color material. However, the value of the optical density (OD: Optical Density) is selected so as to be equal to or higher than a predetermined reference value (for example, 3.0) in order to reduce color unevenness and improve contrast. The film thickness of BM7 is preferably about 0.5 to 1.5 μm as a predetermined film thickness.

In the formation of the rib structure (step S4), the base of the light-shielding wall 31 (see FIG. 7A) for filling the red (R), green (G), and blue (B) phosphors by the so-called rib structure. A process for forming a partition wall (rib) 31a as a material is performed.

FIG. 6D illustrates a state in which the partition wall 31a is formed on the BM7. In order to form the plurality of partition walls 31a, in step S4, first, a process of uniformly applying a transparent photosensitive resin onto the BM7 is performed. The photosensitive resin used here is a high-aspect material capable of having an aspect ratio of height to width of about 3 or more. As the photosensitive resin, for example, a resin such as SU-8 3000 manufactured by Nippon Kayaku Co., Ltd. or TMMR manufactured by Tokyo Ohka Kogyo Co., Ltd. is suitable.

Subsequently, in step S4, a transparent photosensitive resin is exposed and developed using a photomask to form a partition wall 31a by a photolithography technique (see FIG. 6D). Specifically, in step S4, the outer shape of the color conversion chip 3 of each unit is shaped by exposure and development by a photolithography technique, and the concave region surrounded by the partition wall 31a made of transparent resin 3 is formed. Two concave accommodating portions 31c are formed. In this case, it is preferable that the arrangement pitch of the three concave accommodating portions 31c is determined in consideration of, for example, the arrangement pitch of the micro LEDs in units of 1 pixel of the micro LED display.

In the surface processing (step S5) by forming a metal film, the partition wall 31a is coated with the metal film 31b (see FIG. 7A). Specifically, in step S5, in order to form a film on the entire surface of the structure (BM7, partition 31a) provided on the surface of the substrate 5 including the side surface of the partition 31a, for example, a sputtering film forming technique is applied. A process of forming a metal film 31b such as aluminum or an aluminum alloy is performed.

FIG. 7A illustrates a light-shielding wall 31 formed by forming a metal film 31b on the partition wall 31a. The film forming method is not limited to sputtering, and any general metal film forming method that can be used, such as plating, may be used. The metal type used is preferably a material having a high absorption rate or a high reflectance for light in the region of ultraviolet light (380 nm) to visible light (780 nm).

In the laser ablation processing (step S6), as laser light pulses, by a straightforward laser beam L _1, which is collimated to within 2 degrees is irradiated on one surface of the substrate 5 to process the laser ablation (Figure 7 (b)). By this treatment, the metal film 31b on the bottom surface surrounded by the partition wall 31a, the metal film 31b on the upper surface of the partition wall 31a, and the laser-irradiated BM7 region are removed while leaving the metal film 31b on the side surface of the partition wall 31a. On the other hand, the region of the BM7 that has not been laser ablated is formed as the opening wall 33. Therefore, in the present embodiment, the opening wall 33 can be formed without patterning the BM7.

FIG. 7B illustrates a color mixing prevention wall 30 having a light-shielding wall 31 and an opening wall 33 formed in step S6. Here, as the wavelength of the laser beam of the pulse, the wavelength at which the laser ablation processing is efficiently performed with respect to the metal film 31b and BM7 is selected. Further, in step S6, lasers having several wavelengths may be irradiated stepwise or mixed. Specifically, when a laser having a wavelength of 250 to 400 nm is used, ablation processing is performed efficiently. The pulsed laser beam irradiation may be performed on the machined surface at once, or may be performed by scanning or stepping by moving the axis.

In the formation of the color conversion layer (step S7), the patterning process of the fluorescent resist is performed (see FIG. 7C). Specifically, in step S7, the three concave housing portions 31c, which are concave regions partitioned by color by the color mixing prevention wall 30, are filled with red, green, and blue fluorescent resists, respectively. In step S7, red, green, and blue fluorescent resists are selected in order, the selected fluorescent resist is applied to the surface side of the substrate 5, and then exposure and development using a photomask are executed for each color. Then, the color conversion layers 3R, 3G, and 3B of the corresponding colors are formed in the three concave accommodating portions 31c surrounded by the wall 30. The red, green, and blue fluorescent resists each contain a fluorescent dye (pigment or dye) of the corresponding color.

FIG. 7C illustrates a state in which the color conversion layers 3R, 3G, and 3B are formed. The process of this step S7 will be described in more detail. In step S7, for example, after applying a red fluorescent resist to the surface side of the substrate 5, preheating is performed by a photolithography technique, and mask exposure, development, and heating are performed. The color conversion layer 3R is first formed in one of the concave accommodating portions 31c by performing the patterning process. Therefore, the red fluorescent resist is removed from the region other than the concave accommodating portion 31c filled with the color conversion layer 3R.

Subsequently, in step S7, after applying a blue fluorescent resist to the surface side of the substrate 5, a patterning process is performed by a photolithography technique in the same manner as the process performed on the red fluorescent resist to form a concave shape. A color conversion layer 3B is formed in one of the accommodating portions 31c.

Further, in step S7, after applying a green fluorescent resist to the surface side of the substrate 5, a patterning process is performed by a photolithography technique in the same manner as the process performed on the red and blue fluorescent resists. A color conversion layer 3G is formed in one of the concave housing portions 31c. The fluorescent resist is not particularly limited, but is preferably a mixture of a fluorescent dye having a large particle size and a fluorescent dye having a small particle size.

Alternatively, in step S7, as another method, for example, fluorescent resists corresponding to each color are filled in the concave housing portion 31c by inkjet, and then these fluorescent resists are dried to form the color conversion layers 3R, 3G, 3B. May be good.

In the formation of the protective film of the fluorescent resist (step S8), in order to seal and protect the color conversion layers 3R, 3G, and 3B, a process of laminating and forming the protective film 34 is performed (see FIG. 8A). .. Specifically, in step S8, a protective film 34 is formed by exposing and developing a photosensitive resin having excellent adhesion by using a photomask by a photolithography technique.

FIG. 8A illustrates a state in which a protective film 34 for sealing and protecting the color conversion layers 3R, 3G, and 3B surrounded by the wall 30 for preventing color mixing is formed by the step S8. As the photosensitive resin having excellent adhesion, for example, the photosensitive insulating / adhesive "VPA series" manufactured by Nittetsu Chemical & Materials Co., Ltd. is preferable. When the adhesion of the fluorescent resist is high and the formation of the protective film 34 is unnecessary, the process of step S8 may be skipped.

In melting the polyimide at an unnecessary portion (step S9), in order to form the color conversion chip 3 shown in FIG. 8 (c), the end face of the wall 30 for preventing color mixing and the color conversion layer 3R surrounded by the wall 30 are formed. , 3G, 3B are subjected to a process of removing the polyimide 6 that is not in contact with the end faces (see FIG. 8B).

In FIG. 8B, in step S9, the substrate 5 containing the color conversion layers 3R, 3G, 3B and the like is immersed in the solvent 6a using the solvent 6a for dissolving the polyimide, and the polyimide 6 at an unnecessary portion is immersed in the solvent 6a. The state of dissolving and removing is schematically shown. By this treatment, the undissolved polyimide 6 becomes the release layer 32 for laser lift-off. Here, the protective film 34 formed in the formation of the photosensitive resin and the protective film of the fluorescent resist (step S8) used in the formation of the rib structure (step S4) has resistance to the solvent 6a. , Does not dissolve. As the solvent 6a, for example, γ-butyrolactone is preferable when the above-mentioned H230 / H310 manufactured by Mitsubishi Gas Chemical Company, Inc. is used in step S2.

By the above steps, the color conversion chip 3 can be manufactured on the substrate 5. FIG. 8C illustrates a color conversion chip 3 formed on the substrate 5 according to a predetermined arrangement pattern. Next, the configuration of the repair tape manufacturing apparatus using the substrate 5 will be described.

FIG. 9 is a block configuration diagram of a repair tape manufacturing apparatus according to the second invention. FIG. 10 is a detailed schematic view of a main part of the repair tape manufacturing apparatus shown in FIG. The repair tape manufacturing apparatus manufactures the repair tape according to the first invention. Specifically, as shown in FIG. 10, the repair tape manufacturing apparatus performs color conversion of a plurality of color conversion chips 3 formed on one surface (surface) of the transfer substrate 5 by laser lift-off. The chip 3 is transferred to the tape base material 2 to manufacture the repair tape 1. The laser lift-off is a process of irradiating a pulsed laser beam from the other surface (back surface) of the substrate 5 to peel off each color conversion chip 3 from the substrate 5.

The repair tape manufacturing apparatus shown in FIG. 9 includes a laser apparatus 10, a uniform optical system 11, a mirror 12, a mask 13, an optical system 14, a delivery mechanism 15, a transfer mechanism 16, and a winding mechanism 17. And a control unit 18.

The laser device 10 emits a laser beam of pulses generated by laser oscillation, and includes a laser head 101 and a laser power supply control unit 102. Specifically, the laser apparatus 10 transfers the color conversion chips 3 arranged on one surface of the substrate 5 in order to the tape substrate 2 by laser lift-off, so that the laser beam of pulses is transferred at the timing of transfer. Is to inject. The laser device 10 emits laser light using, for example, a YAG (Yttrium Aluminum Garnet) laser having a wavelength of 355 nm (third harmonic). Here, at the time of laser lift-off, the laser irradiation surface is the release layer 32 (see FIG. 4) in which the polyimide resin is uniformly formed, so that the wavelength of the laser used is high in the light absorption rate of the polyimide resin. It is good to choose the wavelength. Therefore, in the present embodiment, the wavelength of 355 nm is selected.

The laser head 101 is, for example, a lamp-excited YAG laser device. The laser power supply control unit 102 controls a laser power supply (not shown), receives a control signal from the control unit 18, sets a laser output value, and supplies electric power to the laser head 101. The laser device 10 has a configuration in which a _{pulsed laser beam can be emitted as a laser beam L 2} from the laser head 101 by receiving a trigger signal from a pulse generator (not shown).

The uniform optical system 11 mainly has a uniform intensity distribution of laser light, and includes, for example, an optical element such as a beam magnifying lens 111, a homogenizer lens 112, and a condenser lens 113. The beam magnifying lens 111 magnifies the beam of the laser beam. The homogenizer lens 112 is an optical element that controls the beam profile of the laser beam, and converts a beam profile having a Gaussian distribution having a high intensity at the center of the beam into a beam profile having a uniform light intensity distribution. The condenser lens 113 shapes the cross section of the beam into a rectangular shape so that, for example, the laser beam transmitted through the homogenizer lens 112 can irradiate a predetermined region of the substrate 5 (see FIG. 10).

The laser beam transmitted through the condenser lens 113 changes the optical path by the mirror 12 and is incident on the mask 13. The mask 13 is a slit that shapes the laser beam into a predetermined shape. Then, the laser beam that has passed through the translucent region of the mask 13 is guided to the irradiation region of the substrate 5 via the optical system 14.

The optical system 14 focuses the laser beam transmitted through the mask 13 on the processed surface of the substrate 5 and collects the laser light, and includes a lens barrel 141 and an objective lens 142.

The lens barrel 141 guides the laser beam transmitted through the mask 13 to the objective lens 142. The objective lens 142 is arranged so that the optical axis of the laser light is perpendicular to the laser processing position, and the beam cross-sectional area of the laser light is transferred to the release layer 32 of the color conversion chip 3 to be transferred by a preset magnification. It is adjusted so that it matches the outer size of.

As shown in FIG. 10, the delivery mechanism 15 sequentially conveys the elongated light-transmitting tape base material 2 that can be wound into a roll to the laser processing position of the transfer mechanism 16. Specifically, the delivery mechanism 15 conveys the tape base material 2 continuously or intermittently in a fixed direction by, for example, a roll-to-roll method, and the first delivery roller 151, the release roller 152a, and the like. It includes 152b, a first tension roller 153, and a first take-up roller 154. The delivery mechanism 15 is provided with a plurality of support rollers (not shown) for preventing the tape base material 2 during transportation from being displaced, meandering, falling off, or the like.

The first delivery roller 151 is provided on the front side of the tape base material 2 in the transport direction (hereinafter, simply referred to as “conveyance direction”) D, and rotates to feed out the wound tape base material 2. be. The protective tape 2a is attached to the tape base material 2 on the adhesive surface to which the color conversion chip 3 is attached. This is to prevent the inclusion of deposits such as dust.

The peeling rollers 152a and 152b peel the protective tape 2a from the tape base material 2 transported along the transport direction D. At this time, the protective tape 2a is mechanically peeled from the tape base material 2 by the rotational action of the peeling rollers 152a and 152b. The first take-up roller 154 winds the peeled protective tape 2a via the first tension roller 153. The first tension roller 153 prevents the peeled protective tape 2a from loosening. When the tip of the protective tape 2a is wound around the release roller 152b, a mechanism (not shown) is provided so that the tip of the protective tape 2a is wound around the first tension roller 153 and the first winding roller 154 (not shown). It is provided.

As shown in FIG. 10, the transfer mechanism 16 aligns the substrate 5 and the tape base material 2 so as to face each other at the laser processing position where the laser lift-off is performed, and brings the color conversion chip 3 to be transferred and the tape base material 2 together. The color conversion chip 3 to be transferred is peeled off from the substrate 5 by bonding and laser lift-off, and the color conversion chip 3 to be transferred is transferred to the tape base material 2.

The transfer mechanism 16 includes a stage 161, a pressure member 162, and an elevating mechanism 163. The stage 161 is, for example, a holder-type XY stage that supports the substrate 5 on which the color conversion chip 3 is arranged around the stage 161 and positions the color conversion chip 3 to be transferred by moving in a horizontal plane. The pressurizing member 162 is a member that pressurizes the tape base material 2 from the base member 21 side. The elevating mechanism 163 raises the pressurizing member 162 at the time of transfer, and attaches the color conversion chip 3 to be transferred and the tape base material 2. The elevating mechanism 163 lowers the pressurizing member 162 after the color conversion chip 3 is transferred.

Further, the transfer mechanism 16 includes an imaging means (not shown) such as an observation camera for positioning the color conversion chip 3 located directly below the laser beam. The control unit 18 can receive image data obtained by an observation camera using an optical means such as a half mirror and perform image analysis. Further, the observation camera can also take an image of the tape base material 2 that moves to a position directly under the laser beam via the light transmitting substrate 5. By receiving the data of this image and analyzing the image, the control unit 18 can detect, for example, the tip end portion of the tape base material 2 that is being conveyed.

FIG. 11 is an explanatory diagram showing the positional relationship between the stage 161 and the tape base material 2. The stage 161 includes a substrate holder 161a and a stage mechanism 161b. Here, the stage mechanism 161b includes a stage control unit (not shown), and the stage control unit moves and positions the substrate 5 supported by the substrate holder 161a based on a control signal from the control unit 18. Is. As the stage mechanism 161b, known moving means and positioning means can be applied.

The substrate holder 161a is configured to support the substrate 5 in which the color conversion chips 3 are arranged in a matrix on one surface in order to easily enable laser lift-off. The stage mechanism 161b can move the substrate holder 161a in a horizontal plane according to an instruction from the control unit 18 (see FIG. 9).

As shown in FIG. 10, the winding mechanism 17 winds the tape base material 2 (repair tape 1) on which the color conversion chip 3 is transferred. Specifically, the take-up mechanism 17 conveys the repair tape 1 continuously or intermittently in a fixed direction by, for example, a roll-to-roll method, and the second delivery roller 171 and the second A tension roller 172, a crimping roller 173a, 173b, and a second take-up roller 174 are provided. Similar to the delivery mechanism 15, the winding mechanism 17 is provided with a plurality of support rollers (not shown) for preventing the repair tape 1 during transportation from being displaced, meandering, falling off, or the like. There is.

The second delivery roller 171 has a rotation mechanism and sends out the protective tape 4 that protects the repair tape 1 in order to prevent the inclusion of deposits such as dust. The second tension roller 172 guides the protective tape 4 to the crimping roller 173a without loosening it. The crimping rollers 173a and 173b are used to crimp the protective tape 4 to the adhesive layer 22 (see FIG. 3) of the tape base material 2 to which the color conversion chip 3 is attached. By this crimping, the color conversion chip 3 is protected by the protective tape 4. The second take-up roller 174 winds up the repair tape 1 to which the protective tape 4 is crimped.

The transporting means of the sending mechanism 15 and the winding mechanism 17 is not limited to the roll-to-roll system, and for example, a conveyor-type transport path may be provided. In the case of the conveyor type, the tape base material 2 fed from the first delivery roller 151 conveys on the transport path, and after the color conversion chip 3 is transferred to the tape base material 2, the repair tape 1 moves on the transport path. It may be carried.

FIG. 12 is a block diagram showing an example of the hardware configuration of the control unit 18 shown in FIG. The control unit 18 is a computer for control, and includes a processor 18a, a storage 18b, a memory 18c, an input device 18d, a communication interface 18e, a display device 18f, and a bus 18g. The processor 18a, the storage 18b, the memory 18c, the input device 18d, the communication interface 18e, and the display device 18f are connected to each other via the bus 18g. The control unit 18 is connected by a communication line in order to transmit, for example, a control signal indicating an instruction of the operation content to the transmission mechanism 15, the laser device 10, the transfer mechanism 16, and the winding mechanism 17.

The processor 18a executes the control of the control unit 18. Further, the storage 18b is, for example, a storage device such as an HDD (Hard Disk Drive) or a flash memory, and stores programs and various data.

The memory 18c is a storage device such as a RAM (Random Access Memory), and for example, a program executed by the processor 18a is loaded. The input device 18d is, for example, a keyboard type or touch panel type input device. The communication interface 18e includes, for example, a communication interface for performing data communication. The display device 18f is, for example, a liquid crystal monitor, and displays an operation menu screen and an output result in response to an instruction from the processor 18a.

Further, the control unit 18 realizes various functions by cooperating with the program and the hardware such as the processor 18a, the storage 18b, and the memory 18c. This program includes a control program for realizing the production of the repair tape according to the first invention.

Specifically, this control program will be described with reference to FIG. 10, in which a step of sequentially transporting an elongated light-transmitting tape base material 2 that can be wound into a roll to a laser processing position and a specific step. In order to transfer the color conversion chip 3 as a component to the tape base material 2 at the laser processing position, a step of aligning the substrate 5 and the tape base material 2 so as to face each other, and the color conversion chip 3 and the tape base to be transferred. A step of bonding the material 2 and a step of peeling the color conversion chip 3 to be transferred from the substrate 5 by laser lift-off and transferring the color conversion chip 3 to be transferred to the tape base material 2 and a color conversion chip. The steps of winding up the tape base material 2 (repair tape 1) to which 3 has been transferred are executed, and the steps of sequentially transporting the tape base material 2 to the laser processing position and winding up the tape base material 2 are performed. By repeating the process, the process of arranging the color conversion chips on one surface of the tape base material 2 according to a predetermined arrangement is executed under the control of the control unit 18.

That is, the control unit 18 controls the laser device 10, the delivery mechanism 15, the transfer mechanism 16, and the winding mechanism 17 in an integrated manner according to this control program (see FIG. 9). That is, the laser device 10, the sending mechanism 15, the transfer mechanism 16, and the winding mechanism 17 operate according to the instruction from the control unit 18.

Next, the operation of the repair tape manufacturing apparatus configured as described above and the repair tape manufacturing method will be described.

FIG. 13 is a flow chart showing a method for manufacturing a repair tape according to the third invention. However, the flow chart shown in FIG. 13 pays particular attention to the transfer process of the color conversion chip 3. 14 to 16 are process diagrams (1) to (3) for explaining the method for manufacturing the repair tape according to the third invention. First, after the power of the repair tape manufacturing apparatus shown in FIG. 9 is turned on and the state shifts to the ready state where laser irradiation is possible, the control unit 18 starts the operation of the repair tape manufacturing method via the input device 18d. Accepts the indicated instruction input. Then, the control unit 18 instructs the transmission mechanism 15 to start the operation based on the control program for executing the repair tape manufacturing method. Then, the first delivery roller 151 of the delivery mechanism 15 sends out the wound tape base material 2 by rotating, and conveys the tape base material 2 along the transfer direction D.

Subsequently, when the tape base material 2 passes through the release rollers 152a and 152b, the protective tape 2a on the adhesive surface of the pressure-sensitive adhesive layer 22 is peeled off by the action of the release rollers 152a and 152b. The peeled protective tape 2a is wound by the first take-up roller 154 via the first tension roller 153 as the tape base material 2 is conveyed.

Next, when the control unit 18 detects that the tip end portion of the tape base material 2 is conveyed to a position directly below the laser beam (laser processing position) via the observation camera, the control unit 18 processes the flow chart shown in FIG. Start.

In the alignment (step S10), the substrate 5 and the tape substrate 2 are opposed to each other to align the positions. Specifically, in step S10, first, the tape base material 2 is moved by a predetermined distance, and then the color conversion chip 3 is transferred to the tape base material 2, so that the delivery of the delivery mechanism 15 is temporarily stopped (). (See FIG. 10). Then, the substrate 5 is moved as needed by the stage mechanism 161b of the stage 161 shown in FIG. 11, and this time, the color conversion chip 3 for transfer transferred by laser lift-off is positioned at the laser processing position. In this case, the optical axis OA of the laser beam passes through the color conversion chip 3 for transfer thereof. FIG. 14A shows a state in which the substrate 5 and the tape substrate 2 are opposed to each other and aligned.

In the bonding (step S11), a process of bonding the color conversion chip 3 to be transferred and the tape base material 2 is performed. Specifically, the elevating mechanism 163 of the transfer mechanism 16 shown in FIG. 10 raises the pressurizing member 162. As a result, the tape base material 2 is pushed up by the pressure member 162 and comes into contact with the color conversion chip 3 of the substrate 5 installed on the stage 161. Then, the color conversion chip 3 and the adhesive layer 22 of the tape base material 2 are bonded together. FIG. 14B shows a state in which a plurality of color conversion chips 3 including the color conversion chip 3 for transfer and the pressure-sensitive adhesive layer 22 are bonded together. The control unit 18 determines that it is the timing to transfer the color conversion chip 3 at the position directly below the laser beam (laser processing position) to the tape base material 2 by laser lift-off in this bonded state.

In the transfer by laser lift-off (step S12), the color conversion chip 3 to be transferred is peeled from the substrate 5 by the laser lift-off, and the color conversion chip 3 is transferred to the tape base material 2. In this case, in step S12, a process of irradiating the interface between the color conversion chip 3 to be transferred and the substrate 5 from the back surface of the substrate 5 with laser light is performed.

Specifically, the control unit 18 shown in FIG. 9 transmits a control signal instructing the laser device 10 to execute the laser lift-off at the stage when it is determined that the transfer timing has been reached. As a result, the laser device 10 emits a pulsed laser beam (laser beam L ₂ ). The laser beam of the emitted pulse passes through the uniform optical system 11, so that the energy distribution in the cross section of the laser beam is made uniform. The uniformed laser beam changes the optical path by the mirror 12 and passes through the slit of the mask 13.

The laser beam that has passed through the slit of the mask 13 passes through the lens barrel 141 and the objective lens 142, and is focused on the release layer 32 corresponding to the interface between the color conversion chip 3 to be transferred and the substrate 5.

FIG. 15A shows a state in which the laser beam L2 is irradiated to the release layer 32 of the color conversion chip 3 to be transferred. By this laser irradiation, the release layer 32 is laser ablated, and the color conversion chip 3 to be transferred is separated from the substrate 5. Here, since the release layer 32 shown in FIG. 4 absorbs the laser light, regarding the absorption of the laser light, the fluorescent resist of the black matrix opening wall 33 and the color conversion layers 3R, 3G, 3B under the release layer 32. It does not depend on the light absorption rate of. This enables stable and uniform laser lift-off.

If the release layer 32 is not provided, the fluorescent resists of the color conversion layers 3R, 3G, and 3B and the opening wall 33 will coexist at the processing interface to be irradiated with the laser at the time of laser lift-off. In this case, since the opening wall 33 has a higher light absorption rate than the fluorescent resist, it is laser ablated (decomposed) with a laser energy lower than the laser energy of the laser light applied to the fluorescent resist, so that it is lifted off. Yield becomes worse. Therefore, in the present embodiment, it is possible to avoid the phenomenon that the yield of lift-off is deteriorated by providing the release layer 32.

When the color conversion chip 3 is transferred to the tape base material 2, the pressurizing member 162 is lowered by the elevating mechanism 163 of the transfer mechanism 16 and returns to the original position. As the pressure member 162 descends, the tape base material 2 also descends. At this time, the adhesive strength of the color conversion chip 3 is greater than the adhesive strength of the color conversion chip 3 that is adhered to the substrate 5, so that the color conversion chip 3 other than the transfer target is used. , It will be peeled off from the tape base material 2. FIG. 15B illustrates a state in which the color conversion chip 3 is transferred to the tape base material 2.

Subsequently, it is determined whether or not all the color conversion chips 3 have been transferred (step S13). When all the predetermined number of color conversion chips 3 are not transferred to the tape base material 2 (step S13: No), although not shown in the flow chart of FIG. 13, the control unit 18 is a transmission mechanism. By issuing an instruction to 15, the delivery mechanism 15 steps the tape base material 2 according to a predetermined arrangement pitch P (see FIG. 3). FIG. 16A illustrates a state in which the delivery mechanism 15 steps the tape base material 2 in order to transfer the next color conversion chip 3.

Then, the process returns to the process of alignment (step S10), and the process from the alignment (step S10) to the transfer by laser lift-off (step S12) is repeated. 16 (b) and 16 (c) illustrate the transfer process of the next color conversion chip 3 by laser lift-off.

Further, although not shown in the flow chart of FIG. 13, the control unit 18 issues an instruction to the winding mechanism 17 shown in FIG. 10, so that the winding mechanism 17 is a tape base material on which the color conversion chip 3 is transferred. The process of winding 2 is performed. In this case, the winding mechanism 17 moves the tape base material 2 when the tip of the tape base material 2 (repair tape 1) to which the color conversion chip 3 is transferred reaches the positions of the crimping rollers 173a and 173b. Along with this, the protective tape 4 is pressed against the pressure-sensitive adhesive layer 22 of the tape base material 2 to which the color conversion chip 3 is attached. As a result, the repair tape 1 to which the protective tape 4 is attached is formed. Further, when the tip of the repair tape 1 reaches the second take-up roller 174, the second take-up roller 174 winds the repair tape 1 in a roll shape in response to the movement of the repair tape 1. Perform the process of taking.

On the other hand, when all the predetermined number of color conversion chips 3 are transferred to the tape base material 2 (step S13: No), the process of the flow chart of FIG. 13 is completed, and the control unit 18 is shown in FIG. By issuing an instruction to the sending mechanism 15 shown, the sending mechanism 15 causes all the color conversion chips 3 transferred to the tape base material 2 to be wound by the second take-up roller 174 as the repair tape 1. The tape base material 2 having a predetermined length is sent out. Then, the production of the repair tape is finished.

From the above, according to the method for manufacturing the repair tape according to the third invention, the repair tape according to the first invention can be easily manufactured.

In the above embodiment, the transfer mechanism 16 uses the XY stage as the stage 161 to position the color conversion chip 3 to be transferred at the laser processing position by moving in the horizontal plane, and the color conversion by the pressurizing member 162. The chip 3 and the tape base material 2 are bonded together. With this configuration, the color conversion chip 3 and the tape base material 2 can be reliably bonded to each other. The repair tape manufacturing apparatus according to the second invention is not limited to this, and may have the following configurations.

That is, the transfer mechanism 16 uses the XYZ stage as the stage 161 to position the color conversion chip 3 to be transferred at the laser processing position by moving in the horizontal plane, and moves with the color conversion chip 3 in the height direction. The tape base material 2 may be bonded to the tape base material 2. With this configuration, the color conversion chip 3 and the tape base material 2 can be reliably bonded to each other without using the pressure member 162.

Next, a mode of use of the repair tape according to the first invention will be described. In the manufacturing stage of the UV excitation type micro LED display, it is preferable to manufacture a display panel in which, for example, color conversion chips are arranged in a matrix according to the arrangement pattern of the micro LED chips. In this case, after a process of transferring a predetermined color conversion chip is performed on the display panel, an unmounted portion of the color conversion chip or a defective color conversion chip may be found. The defective color conversion chip is removed by laser irradiation in advance, for example. As a result, the part where the defective color conversion chip is removed also becomes the part where the color conversion chip is not mounted. For example, the micro LED chips may already be arranged in a matrix on the display panel, and the color conversion chips may be mechanically and electrically connected on the micro LED chips.

Then, as described below, the color of the non-defective product is used by the repair means for transferring the color conversion chip for transfer used for restoration to the unmounted portion of the display panel, using the repair tape according to the first invention. A conversion chip can be mounted.

FIG. 17 is a schematic diagram illustrating a repair means for transferring the color conversion chip 3 onto the display panel 41. (A) exemplifies the state before transfer of the color conversion chip 3, (b) exemplifies the state during transfer, and (c) exemplifies the state after transfer. In FIG. 17A, a hot plate 43 is placed on the XY stage 42, and a display panel 41 in which the color conversion chips 3 are arranged in a matrix is placed on the hot plate 43. The repair means employs a transport mechanism for step-moving the repair tape 1 in a roll-to-roll system having a delivery roller 44 and a take-up roller 45.

Further, the repair means includes a pressure head 46 that pushes down the repair tape 1 and presses the color conversion chip 3 for transfer against the unmounted portion 48 of the display panel 41. The pressure head 46 is made of transparent glass such as quartz glass in order to transmit ultraviolet light UV. In particular, the side where the pressure head 46 comes into contact with the repair tape 1 is formed so as to have an arc at least in the moving direction of the repair tape 1. Then, by a moving mechanism (not shown), the objective lens 47 moves up and down along the optical axis. The objective lens 47 irradiates the transfer position with ultraviolet light UV emitted from a UV light source (not shown).

In FIG. 17A, the XY stage 42 is controlled by the transfer means to be translated in the two-dimensional direction, and the unmounted portion 48 of the color conversion chip 3 on the display panel 41 is positioned in the field of view of the objective lens 47. ..

In FIG. 17B, the pressurizing head 46 is lowered, and the color conversion chip 3 for transfer is pressed against the transfer position which is the unmounted portion 48. Then, the color conversion chip 3 pressed against the transfer position is irradiated with ultraviolet light UV by the transfer means. In this case, since the repair tape 1 is an ultraviolet curable adhesive tape as described above, the adhesive is cured by irradiating with ultraviolet light UV, so that the adhesive strength is lowered and the adhesive is easily peeled off. Can be done.

On the other hand, for example, a heat-curable adhesive is previously applied to the unmounted portion 48 of the color conversion chip 3 on the display panel 41, and the hot plate 43 is heated to heat-cure the adhesive. As a result, the color conversion chip 3 is adhesively fixed on the display panel 41.

As the transfer means, an ultraviolet curable adhesive may be used. In this case, the hot plate 43 becomes unnecessary. When this ultraviolet curable adhesive is previously applied to the unmounted portion 48 of the color conversion chip 3 on the display panel 41, the adhesive is ultraviolet cured by irradiating with ultraviolet light UV. As a result, the color conversion chip 3 is adhesively fixed on the display panel 41.

In FIG. 17C, the pressure of the pressurizing head is released as the pressurizing head 46 is raised by the transfer means, so that the repair tape 1 also returns to its original position while being in contact with the pressurizing head 46. Return.

From the above, if the repair tape 1 is used to transfer a good replacement color conversion chip 3 to the unmounted portion 48, which is a defective portion of the color conversion chip 3, for example, the defective portion of the color conversion chip 3 can be removed. Can be easily repaired. Here, as shown in FIG. 17B, the arrangement pitch of the color conversion chips 3 in the repair tape 1 is the transfer target when the color conversion chip 3 to be transferred is pressed against the transfer position by the transfer means. The arrangement pitch is calculated and determined in advance so that the color conversion chips 3 other than the above do not come into contact with the display panel 41. This arrangement pitch corresponds to, for example, the arrangement pitch P shown in FIG.

In other words, in the repair tape 1, the color conversion chips 3 are arranged on one surface of the tape base material 2 according to a predetermined arrangement pitch P, and the arrangement pitch P is the color conversion chips 3 to be transferred. It is characterized in that the color conversion chip 3 other than the transfer target is defined so as not to come into contact with other parts at the time of replacement. As a result, the color conversion chip 3 can be smoothly repaired.

In the above embodiment, the color conversion chip 3 is used as a replacement color conversion chip, and as shown in FIG. 4, the three color conversion layers 3R, 3G, and 3B are used as cells in units of 1 pixel. The invention is not limited to this, and cells in which the color conversion layers 3R, 3G, and 3B are individually set in 1 pixel units may be adopted.

FIG. 18 is a plan view showing another embodiment of the repair tape according to the first invention. As shown in FIG. 18, the repair tape 1a is a repair tape used for repairing a specific component incorporated in a micro LED display, and is an elongated light-transmitting tape base material 2 that can be wound into a roll. And a color conversion chip 3a which is arranged on one surface of the tape base material 2 according to a predetermined arrangement and is excited by light from a UV-LED to emit light as the specific component. be. For convenience of explanation, the protective tape 4 is not shown.

FIG. 19 is an enlarged view of a main part of the repair tape 1a shown in FIG. Specifically, it is an enlarged cross-sectional view of the BB line of the region surrounded by R2 shown in FIG. The tape base material 2 has a base member 21 and an adhesive layer 22 laminated on one surface of the base member 21, and the color conversion chip 3a is partitioned by a wall 30 for preventing color mixing. A color conversion layer (for example, red (R)) in which one of red (R), green (G), and blue (B) phosphors is selected and filled as an RGB phosphor in the concave region. The color conversion layer 3R) is provided, and one end face of the color conversion chip 3a is attached to the tape base material 2 via the pressure-sensitive adhesive layer 22. Further, a protective tape 4 is provided on the side opposite to the tape base material 2 with the color conversion chip 3a interposed therebetween.

FIG. 20 is an enlarged cross-sectional view of the color conversion chip 3a shown in FIG. Similar to the color conversion chip 3a shown in FIG. 4, the color conversion chip 3a shown in FIG. 20 has a peeling layer 32 in the front view of FIG. 19, and a wall 30 for preventing color mixing and a wall 30 thereof on the peeling layer 32. The color conversion layer 3R is provided in the concave region partitioned on the wall 30. The wall 30 for preventing color mixing is composed of a light-shielding wall 31 and an opening wall 33. The light-shielding wall 31 has a partition wall 31a and a metal film 31b.

Although not shown, the color conversion chip 3a having the color conversion layer 3G and the color conversion chip 3a having the color conversion layer 3B are not limited to the color conversion layer 3R, and are placed on one surface of the tape base material 2. They may be arranged according to a predetermined arrangement. Such a repair tape 1a is suitable for repairing the color conversion layers 3R, 3G, and 3B individually.

Further, in the above embodiment, the color conversion chip 3 is transferred in units of one, but the present invention is not limited to this, and the color conversion chips 3 may be transferred in units of a plurality of units.

FIG. 21 is an explanatory diagram showing another embodiment of the method for manufacturing a repair tape according to the third invention. In another embodiment (hereinafter referred to as “variation example”), in order to transfer the color conversion chip 3 in units of a plurality of units, the mask 13 shown in FIG. 9 is replaced with a mask 13a having a plurality of openings, and FIG. 11 shows. The substrate 5a supported by the substrate holder 161a of the stage 161 shown is used. In order to make the explanation easy to understand, the mask 13a is drawn superimposed on the substrate 5a. In the modified example, the tape base material 20 having a width wider than that of the tape base material 2 is used, and the color conversion chips 3 are transferred to the tape base material 20 in units of a plurality by one laser lift-off. Further, in the modified example, under the control of the stage mechanism 161b, the color conversion chips 3 are sequentially transferred to the tape base material 20 in units of a plurality of units to form the repair tape 1b.

FIG. 22 is a plan view of the repair tape 1b. The repair tape 1b is obtained by transferring four color conversion chips 3 to the tape base material 20 at a time. Here, in FIG. 22, since cutting is performed at predetermined intervals, cutting may be performed in the longitudinal direction along a virtually drawn cut line 2d.

In the modified example, the take-up mechanism 17 cuts the repair tape 1b between the crimping rollers 173a and 173b and the second take-up roller 174 in the longitudinal direction along the cut line 2d (illustrated). Omitted) is further provided. Then, the tape cutting device cuts the conveyed repair tape 1b in the longitudinal direction along the cut line 2d.

FIG. 23 is a plan view of the repair tapes 1c to 1f newly formed by cutting the repair tape 1b shown in FIG. 22 into a plurality of pieces. The second take-up roller 174 of the take-up mechanism 17 individually winds the newly formed repair tapes 1c to 1f. In this way, in the modified example, a plurality of color conversion chips 3 are transferred to the tape base material 20 at one time, and the repair tape 1b formed is further divided into the number of color conversion chips 3 that cross the longitudinal direction. Correspondingly, it is cut in the longitudinal direction along the cut line 2d to form a plurality of repair tapes 1c to 1f.

Therefore, in the modification, the step of sequentially transporting the tape base material 20 to the laser processing position and the process of transferring the color conversion chip 3 to the tape base material 20 at the laser processing position are performed with the substrate 5a. A step of aligning the tape base materials 20 so as to face each other, a step of bonding the plurality of color conversion chips 3 to be transferred and the tape base material 20, and a plurality of color conversions of the transfer target by laser lift-off. A step of peeling the chip 3 from the substrate 5a and transferring the plurality of color conversion chips 3 to be transferred to the tape base material 20, and a tape base material (repair tape 1b) to which the color conversion chip 3 is transferred. ), In order to form a tape base material on which the color conversion chips 3 are transferred in one row, a step of cutting the repair tape 1b in the longitudinal direction at predetermined intervals and a step of newly forming by cutting. From the step of winding each tape base material (repair tapes 1c to 1f) to which the color conversion chip 3 is transferred, and the step of sequentially transporting the tape base material 20 to the laser processing position. It is characterized in that a plurality of repair tapes 1c to 1f are manufactured by repeating the process of winding the tape base material (repair tapes 1c to 1f). Thereby, in the above-mentioned modified example, the repair tape according to the first invention can be manufactured in units of a plurality of pieces at a time.

The present embodiment is schematically shown to the extent that the present invention can be understood and implemented, and the present invention is not limited thereto. The present invention may be modified and modified in various ways as long as it does not deviate from the scope of the technical idea shown in the claims.

1,1a, 1b, 1c, 1d, 1e, 1f ... Repair tape 2,20 ... Tape base material 3,3a ... Color conversion chip 5,5a ... Substrate 10 ... Laser device 14 ... Optical system 15 ... Transmission mechanism 16 ... Transfer mechanism 17 ... Winding mechanism 18 ... Control unit 21 ... Base member 22 ... Adhesive layer 30 ... Wall 161 ... Stage (XY stage, XYZ stage)
162 ... Pressurizing member 3R, 3G, 3B ... Color conversion layer

Claims (6)

A repair tape used to repair specific parts incorporated in micro LED displays.
An elongated light-transmitting tape base material that can be wound into a roll,
A color conversion chip that is arranged on one surface of the tape substrate according to a predetermined arrangement, and as the specific component, is excited by light from a UV-LED and emits light.
A repair tape that is characterized by being equipped with. The tape base material has a base member and an adhesive layer laminated on one surface of the base member.
The color conversion chip is a color conversion in which red (R), green (G), and blue (B) phosphors are filled as RGB phosphors in a concave region divided by color by a color mixing prevention wall. Has layers and
The repair tape according to claim 1, wherein one end face of the color conversion chip is attached to the tape base material via the pressure-sensitive adhesive layer. A repair tape manufacturing device used to repair specific parts incorporated in micro LED displays.
A delivery mechanism that sequentially conveys an elongated light-transmitting tape substrate that can be wound into a roll to a laser processing position, and
As the specific component, a plurality of color conversion chips arranged on one surface of a light-transmitting substrate and excited by light from a UV-LED to emit light are sequentially transferred to the tape substrate by laser lift-off. A laser device that emits pulsed laser light with
An optical system that forms an image of the pulsed laser beam on the interface between the color conversion chip to be transferred and the substrate.
At the laser processing position, the substrate and the tape base material are opposed to each other and aligned, the color conversion chip to be transferred and the tape base material are bonded to each other, and the color conversion chip to be transferred is subjected to the laser lift-off. Is peeled off from the substrate, and the color conversion chip to be transferred is transferred to the tape substrate, and a transfer mechanism.
A winding mechanism for winding the tape base material on which the color conversion chip is transferred, and a winding mechanism.
A control unit that controls the delivery mechanism, the laser device, the transfer mechanism, and the winding mechanism.
A repair tape manufacturing device characterized by being equipped with. The transfer mechanism uses an XY stage to position the color conversion chip to be transferred at the laser processing position by moving in a horizontal plane, and a pressure member is used to move the color conversion chip to be transferred and the tape base material. The repair tape manufacturing apparatus according to claim 3, wherein the repair tapes are bonded together. The transfer mechanism uses an XYZ stage to position the color conversion chip to be transferred to the laser processing position by moving in a horizontal plane, and the color conversion chip to be transferred and the tape group by moving in the height direction. The repair tape manufacturing apparatus according to claim 3, wherein the material is bonded to the material. A method for manufacturing repair tapes used for repairing specific parts in the manufacturing stage of micro LED displays.
A process of sequentially transporting an elongated light-transmitting tape substrate that can be wound into a roll to a laser processing position, and
To transfer a plurality of color conversion chips, which are arranged on one surface of a light-transmitting substrate as the specific component and are excited by light from a UV-LED to emit light, to the tape substrate at the laser processing position. In addition, the step of aligning the substrate with the tape substrate facing each other and
The process of bonding the color conversion chip to be transferred and the tape base material,
A step of peeling the color conversion chip to be transferred from the substrate by laser lift-off and transferring the color conversion chip to be transferred to the tape substrate.
The process of winding up the tape base material to which the color conversion chip is transferred, and
And
By repeating the process of sequentially transporting the tape base material to the laser processing position and winding the tape base material, the color conversion chip follows a predetermined arrangement on one surface of the tape base material. Place,
A method for manufacturing a repair tape, which is characterized in that.

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