JP2020053631A - Heat dissipation structure and radiator mounting method - Google Patents

Abstract

To further improve heat radiation efficiency of heat of an electronic component while preventing the electronic component from falling off from a substrate or damaging the electronic component.SOLUTION: A hear radiation structure 10 includes a radiator 16 provided on a substrate 12 and connected to an electronic component 14 mounted on the substrate 12 so as to be able to transfer heat, and a pressing tool 24 provided on the substrate 12 to intersect with a longitudinal direction of the radiator 16 and pressing the radiator 16 toward the substrate 12. The pressing tool 24 has, at each end thereof, an elastic supporting portion 26 that is elastically deformable in a height direction and supports the substrate 12, and the heat radiation structure 10 includes a pair of fixtures 34 that is configured to be separated from the pressing tool 24 in the longitudinal direction and adjust an amount of elastic deformation in the height direction of the elastic supporting portion 26, and fix the pressing tool 24 to the substrate 12.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a heat dissipation structure for dissipating heat of an electronic component mounted on a board, and a method of attaching a heatsink for dissipating heat of an electronic component to a board.

  In recent years, various developments have been made to enhance the heat radiation efficiency (heat radiation) of electronic components mounted on a substrate (see Patent Document 1). The configuration of the heat dissipation structure according to the prior art will be briefly described as follows.

  A radiator that radiates heat of the electronic component is provided on the substrate, and the radiator is connected to the electronic component so that heat can be transmitted. Further, the substrate is provided with an H-shaped pressing member (a heat sink fixing device in Patent Document 1) for pressing the radiator toward the substrate (electronic component side) in plan view. A leaf spring portion (pressing portion in Patent Literature 1) that can be elastically deformed in the height direction is formed at the center of the pressing tool. Further, the heat dissipation structure includes a plurality of fixing tools (fastening members such as bolts in Patent Document 1) for fixing the pressing tool to the substrate by fastening screws.

JP 2013-138160 A

  By the way, the electronic component, the radiator, and the pressing tool each have a dimensional tolerance, and in order to sufficiently secure the heat radiation efficiency of heat of the electronic component, expansion and contraction for absorbing the variation in the dimensional tolerance of the electronic component, etc. It is necessary to interpose a thermally conductive sheet between the electronic component and the radiator.

  However, the degree of expansion and contraction of the thermal conductive sheet also varies, and the thermal conductive sheet cannot sufficiently absorb variations in dimensional tolerances of electronic components and the like, and when the radiator is mounted on the substrate, the substrate warps. Sometimes. As a result, there is a possibility that the electronic component may fall off the substrate or the electronic component may be damaged.

  In addition, the heat conductive sheet is thickened in order to sufficiently secure the amount of expansion and contraction in the thickness direction of the heat conductive sheet, and the thick heat conductive sheet increases the thermal resistance between the electronic component and the radiator. As a result, it is difficult to further improve the heat radiation efficiency of heat of the electronic component.

  Therefore, the present invention can solve the above-mentioned problems, and can reduce the thermal resistance between the electronic component and the radiator while preventing warpage of the substrate when attaching the radiator to the substrate. It is an object to provide a heat radiating structure and a heat radiator mounting method.

  The heat dissipation structure according to the first embodiment of the present invention is provided on a substrate, connected to an electronic component mounted on the substrate so as to be able to transfer heat, and a radiator that dissipates heat of the electronic component; The heat radiator is provided so as to intersect with the first direction, and has an elastic support portion that is elastically deformable in a height direction and supports the substrate on each end side. A pressing tool that presses against the component side) and a pressing tool that is separated in a second direction of the pressing tool that intersects the first direction of the radiator, and configured to be capable of adjusting an amount of elastic deformation in a height direction of the elastic support portion, A pair of fixing tools for fixing the pressing tool to the substrate.

  The radiator mounting method according to the second embodiment of the present invention includes disposing the radiator on the board so that the radiator is connected to an electronic component mounted on the board so that heat can be transferred, and The radiator is disposed on the substrate so as to intersect the first direction. Each of the elastic support portions is supported by the elastic support portions provided on each end side of the pressing tool, and the radiator is pressed toward the substrate side (the electronic component side) by the press tool. The pressing tool is fixed to the substrate while adjusting the amount of elastic deformation in the height direction.

  According to the present invention, it is possible to further improve the heat radiation efficiency of the electronic component while preventing the electronic component from dropping off the substrate or damaging the electronic component.

FIG. 1 is a plan view of the heat dissipation structure according to the first embodiment of the present invention. FIG. 2 is a front view of the heat dissipation structure according to the first embodiment of the present invention. FIG. 3A is a view corresponding to FIG. 3B and shows a state before the pressing tool is fixed to the substrate. FIG. 3B is a cross-sectional view along the line III-III in FIG. FIG. 4A is an end view along the line IV-IV in FIG. FIG. 4B is a view corresponding to FIG. 4A and shows a state in which a radiator body is provided on the surface of the substrate so as to overlap a plurality of electronic components. FIG. 5 is a plan view of a heat dissipation structure according to the second embodiment of the present invention. FIG. 6 is a front view of the heat dissipation structure according to the second embodiment of the present invention. FIG. 7A is a view corresponding to FIG. 7B and shows a state before the pressing tool is fixed to the substrate. FIG. 7B is a sectional view taken along line VII-VII in FIG.

  A first embodiment and a second embodiment of the present invention will be described with reference to FIGS. 1 to 7A and 7B. In the specification and the claims of the present application, the “height direction” refers to the height direction of the heat dissipation structure, and is synonymous with the thickness direction of the substrate. In the drawings, “AD” indicates the longitudinal direction (first direction) of the radiator, “BD” indicates the longitudinal direction (second direction) of the pressing tool, and “CD” indicates the height direction.

(1st Embodiment)
As shown in FIGS. 1 and 2, a heat dissipation structure 10 according to the first embodiment of the present invention is a structure for dissipating heat of an electronic component 14 mounted on a substrate 12. The specific configuration of the heat radiation structure 10 is as follows.

  As shown in FIG. 1, FIG. 2, FIG. 3 (b), and FIG. 4 (a), the substrate 12 is provided with a radiator (heat sink) 16 for radiating heat of the electronic component 14. Reference numeral 16 is connected to the electronic component 14 so that heat can be transmitted. The radiator 16 is made of a metal having excellent thermal conductivity such as aluminum or an aluminum alloy. The radiator 16 includes a radiator body 18 provided on the substrate 12 so as to overlap the electronic component 14, and a plurality of radiators 16 standing on the surface of the radiator body 18 at intervals in the longitudinal direction of the radiator 16. Radiation fins 20. Further, a pair of radiator positioning holes 12 h are formed in the substrate 12 so as to be spaced apart from each other in the longitudinal direction of the radiator 16. On each end side of the back surface of the radiator main body 18, a positioning pin 22 that engages with the radiator positioning hole 12h is formed. In other words, each end of the radiator 16 is positioned with respect to the substrate 12. Note that an insulating thin heat conductive sheet or heat conductive grease (not shown) may be interposed between the back surface of the radiator body 18 and the front surface of the electronic component 14.

  As shown in FIGS. 1 to 4A, a pressing tool 24 for pressing the radiator 16 toward the substrate 12 (toward the electronic component 14) is orthogonal to the longitudinal direction of the radiator 16 (at right angles). Crossing). The pressing tool 24 is formed by bending a plate-like metal. The central part of the pressing tool 24 is configured so as to sandwich the central part of the radiator body 18 in cooperation with the electronic component 14. Although the longitudinal direction of the pressing tool 24 is orthogonal to the longitudinal direction of the radiator 16, it does not have to be orthogonal as long as it intersects the longitudinal direction of the radiator 16.

  At each end of the pressing tool 24, a leaf spring portion 26 is formed as an elastic supporting portion for supporting the surface of the substrate 12. Each leaf spring portion 26 is in a state before fixing the pressing tool 24 to the substrate 12 and is elastically deformable in the height direction while being elastically deformed in the longitudinal direction of the radiator 16. The pair of leaf spring portions 26 are arranged symmetrically with respect to the center line CL in the longitudinal direction of the pressing tool 24. Further, in order to sufficiently secure the amount of elastic deformation in the height direction of each leaf spring portion 26, a mountain-shaped convex portion is provided between the central portion of the pressing tool 24 and each leaf spring portion 26 (each end). 28 are formed. The pair of convex portions 28 are arranged symmetrically with respect to the longitudinal center line CL of the pressing tool 24.

  A pressing tool positioning hole 18h is formed in the center of the surface of the radiator body 18. At the center of the back surface of the pressing tool 24, a positioning pin 30 is formed to engage with the pressing tool positioning hole 18h. In other words, the center of the pressing tool 24 is positioned with respect to the radiator body 18. Further, guide elongated holes 12v extending in the longitudinal direction of the pressing tool 24 are formed on both sides of the substrate 12 in the longitudinal direction of the pressing tool 24 with the electronic component 14 therebetween. On each end side of the back surface of the pressing tool 24, a slide pin 32 that is guided in the longitudinal direction of the pressing tool 24 in the corresponding guide elongated hole 12v is formed. In other words, each end of the pressing tool 24 is in a state before fixing the pressing tool 24 to the substrate 12, and is supported movably in the longitudinal direction of the pressing tool 24 with respect to the substrate 12. .

  As shown in FIGS. 1 to 3A and 3B, the heat dissipation structure 10 includes a pair of fixing members 34 for fixing the pressing member 24 to the substrate 12 by fastening screws. The pair of fixtures 34 are spaced apart in the longitudinal direction of the pressing tool 24 with the electronic component 14 therebetween, and are symmetrically arranged with respect to the center line CL of the pressing tool 24 in the longitudinal direction. Each fixture 34 is configured so that the amount of elastic deformation in the height direction of each leaf spring portion 26 can be adjusted by fastening a screw. As the fixture 34, a fixing bolt 36 and a nut 38 screwed to the fixing bolt 36 are used. Each projection 28 is formed with an insertion slot 28f through which the fixing bolt 36 is inserted, and the insertion slot 28f extends in the longitudinal direction of the pressing tool 24. An insertion hole 12f through which the fixing bolt 36 is inserted is formed at a position on the substrate 12 that matches the insertion long hole 28f. Note that instead of using the fixing bolt 36 and the nut 38 as the fixing tool 34, a set screw (not shown) may be used. In this case, a screw hole (not shown) for screwing into a set screw is formed at a position on the substrate 12 that matches the insertion long hole 28f.

  Subsequently, a radiator mounting method according to the first embodiment of the present invention will be described. The radiator mounting method according to the first embodiment of the present invention is a method for mounting a radiator 16 that radiates heat of an electronic component 14 mounted on a substrate 12 to the substrate 12.

  First, the radiator 16 is prepared, and each positioning pin 22 is engaged with the corresponding radiator positioning hole 12 h of the substrate 12. Thus, the radiator 16 is arranged on the surface of the substrate 12 so that the radiator 16 is connected to the electronic component 14 so as to be able to transfer heat.

  Next, the pressing tool 24 is prepared, the positioning pin 30 is engaged with the pressing tool positioning hole 18h of the radiator body 18, and each slide pin 32 is inserted into the corresponding guide elongated hole 12v of the substrate 12. Thereby, the pressing tool 24 is disposed on the substrate 12 at right angles to the longitudinal direction of the radiator 16 so that the radiator body 18 is sandwiched by the cooperation of the central part of the pressing tool 24 and the electronic component 14 ( FIG. 3A).

  Further, the fixing bolts 36 are tightened while the board 12 is supported by the leaf spring portions 26 and the center of the radiator body 18 is pressed toward the board 12 (the electronic component 14) by the center of the pressing tool 24. Thus, the pressing tool 24 is fixed to the substrate 12 while adjusting the amount of elastic deformation of each leaf spring portion 26 in the height direction by each fixing tool 34 (see FIG. 3B). As a result, the radiator 16 can be attached to the substrate 12 by the pressing tool 24 and the pair of fixing tools 34.

  Next, the operation and effect of the first embodiment of the present invention will be described.

  As described above, on each end side of the pressing tool 24, the leaf spring portion 26 is formed as an elastic support portion for supporting the surface of the substrate 12. Further, in the radiator mounting method according to the first embodiment of the present invention, with the board 12 supported by the leaf spring portions 26, the fixing bolts 36 are tightened to fix the pressing tool 24 to the board 12. doing. Therefore, it is possible to sufficiently prevent the board 12 from warping when the radiator 16 is attached to the board 12.

  As described above, each leaf spring portion 26 is in a state before the pressing tool 24 is fixed to the substrate 12 and is elastically deformable in the height direction while being elastically deformed in the longitudinal direction of the radiator 16. . Each fixture 34 is configured so that the amount of elastic deformation in the height direction of each leaf spring portion 26 can be adjusted by fastening a screw. Further, in the radiator mounting method according to the first embodiment of the present invention, the pressing tool 24 is moved relative to the substrate 12 while adjusting the amount of elastic deformation in the height direction of each leaf spring portion 26 by each fixing tool 34. It is fixed. Thereby, the variation in the dimensional tolerance of the electronic component 14 and the like is absorbed without using a thick elastic thermal conductive sheet for absorbing the variation in the dimensional tolerance of the electronic component 14, the radiator 16, and the pressing tool 24. be able to. As shown in FIG. 4B, even when the radiator 16 is mounted on the substrate 12 so as to overlap the plurality of electronic components 14, a thin heat conductor for absorbing a variation in dimensional tolerance of the plurality of electronic components 14. It is only necessary to use the sheet 40. Therefore, the thermal resistance between the electronic component 14 and the radiator 16 can be sufficiently reduced.

  Therefore, according to the first embodiment of the present invention, it is possible to further improve the heat radiation efficiency of the electronic component 14 while preventing the electronic component 14 from falling off the substrate 12 or damaging the electronic component 14. it can.

(2nd Embodiment)
As shown in FIGS. 5 and 6, the heat dissipation structure 42 according to the second embodiment of the present invention is a structure for dissipating heat of the electronic component 14 mounted on the board 12. The heat dissipating structure 42 has the same configuration as the heat dissipating structure 10 (see FIGS. 1 and 2), and only the differences between the heat dissipating structure 42 and the like of the heat dissipating structure 42 will be described. Note that, among the plurality of components in the heat dissipation structure 42, those corresponding to the components in the heat dissipation structure 10 are denoted by the same reference numerals in the drawings.

  As shown in FIGS. 5 to 7A and 7B, a pressing member 44 for pressing the radiator 16 toward the substrate 12 (the electronic component 14) is provided on the substrate 12 with respect to the longitudinal direction of the radiator 16. They are provided orthogonally. The pressing member 44 has a plate-shaped pressing member body 46 provided on the substrate 12 at right angles to the longitudinal direction of the radiator 16. The central portion of the pressing tool body 46 is configured so as to sandwich the central portion of the radiator body 18 in cooperation with the electronic component 14. In addition, although the longitudinal direction of the pressing tool 44 (the pressing tool body 46) is orthogonal to the longitudinal direction of the radiator 16, it does not need to be orthogonal if it intersects the longitudinal direction of the radiator 16. Good.

  At the center of the back surface of the pressing body 46, a positioning pin 48 is formed to engage with the pressing positioning hole 18h of the radiator body 18. In other words, the center of the pressing tool body 46 is positioned with respect to the radiator body 18. Guide holes 12g are formed on both sides of the substrate 12 in the longitudinal direction of the pressing body 46 with the electronic component 14 therebetween. On each end side of the back surface of the pressing tool body 46, a slide pin 50 that is guided in the height direction by the corresponding guide hole 12g is formed. In other words, each end of the pressing tool main body 46 is in a state before the pressing tool 44 is fixed to the substrate 12, and is supported movably in the height direction with respect to the substrate 12. Further, the pressing tool 44 has a coil spring 52 provided between the back surface of the pressing tool main body 46 of each slide pin 50 and the surface of the substrate 12 and serving as an elastic supporting portion for supporting the surface of the substrate 12. Each coil spring 52 as an elastic support portion is in a state before the pressing tool 44 is fixed to the substrate 12 and is elastically deformable in the height direction.

  The heat radiation structure 42 includes a pair of fixing members 54 for fixing the pressing member 44 to the substrate 12 by fastening screws. The pair of fixing members 54 are spaced apart from each other in the longitudinal direction of the pressing member 44 with the electronic component 14 therebetween, and are symmetrically arranged with respect to the longitudinal center line CL of the pressing member 44. Each fixture 54 is configured so that the amount of elastic deformation of each coil spring 52 in the height direction can be adjusted by fastening a screw. As the fixture 54, a fixing bolt 56 and a nut 58 screwed to the fixing bolt 56 are used. Insertion holes 46v for inserting fixing bolts 56 are formed on both sides in the longitudinal direction of the presser 44 with the electronic component 14 therebetween in the presser main body 46. An insertion hole 12v through which the fixing bolt 56 is inserted is formed at a position on the substrate 12 that matches the insertion hole 46v. Note that instead of using the fixing bolt 56 and the nut 58 as the fixing tool 54, a set screw (not shown) may be used. In this case, a screw hole (not shown) for screwing into a set screw is formed at a position on the substrate 12 that matches the insertion hole 46v.

  Subsequently, a radiator mounting method according to the second embodiment of the present invention will be described.

  First, the radiator 16 is prepared, and each positioning pin 22 is engaged with the corresponding radiator positioning hole 12 h of the substrate 12. Thus, the radiator 16 is arranged on the surface of the substrate 12 so that the radiator 16 is connected to the electronic component 14 so as to be able to transfer heat.

  Next, the pressing tool 44 (the pressing tool body 46 and the pair of coil springs 52) is prepared, and each slide pin 50 is inserted into the corresponding guide hole 12g of the substrate 12. Thereby, the pressing tool 44 (pressing tool main body 46) is attached to the substrate 12 with respect to the longitudinal direction of the radiator 16 so that the radiator main body 18 is sandwiched by the cooperation of the central part of the pressing tool main body 46 and the electronic component 14. And placed orthogonally.

  Further, in a state where the substrate 12 is supported by the respective coil springs 52 and the central portion of the radiator body 18 is pressed toward the substrate 12 by the central portion of the pressing member body 46, the positioning pins 48 are inserted into the positioning holes for the pressing member of the radiator body 18. 18h and each fixing bolt 56 is tightened. Thus, the pressing member 44 is fixed to the substrate 12 while adjusting the amount of elastic deformation of each coil spring 52 in the height direction by each fixing member 54. As a result, the radiator 16 can be attached to the substrate 12 by the pressing tool 44 and the pair of fixing tools 54.

  Subsequently, the operation and effect of the second embodiment of the present invention will be described.

  A coil spring 52 is provided between the rear surface of the pressing tool main body 46 and the surface of the substrate 12 in each slide pin 50 as an elastic supporting portion for supporting the surface of the substrate 12. Further, in the radiator mounting method according to the second embodiment of the present invention, while the substrate 12 is supported by the coil springs 52, the fixing bolts 56 are tightened to fix the pressing tool 44 to the substrate 12. I have. Therefore, it is possible to sufficiently prevent the board 12 from warping when the radiator 16 is attached to the board 12.

  As described above, each coil spring 52 is in a state before the pressing tool 44 is fixed to the substrate 12 and is elastically deformable in the height direction. Each fixture 54 is configured so that the amount of elastic deformation of each coil spring 52 in the height direction can be adjusted by fastening a screw. Further, in the radiator mounting method according to the second embodiment of the present invention, the pressing tool 44 is fixed to the substrate 12 while adjusting the amount of elastic deformation of each coil spring 52 in the height direction by each fixing tool 54. ing. Thereby, the variation in the dimensional tolerance of the electronic component 14 and the like is absorbed without using a thick elastic thermal conductive sheet for absorbing the variation in the dimensional tolerance of the electronic component 14, the radiator 16, and the pressing tool 44. be able to.

  Therefore, according to the second embodiment of the present invention, the same effects as those of the above-described first embodiment of the present invention can be obtained.

  The present invention is not limited to the description of the above-described embodiment, but can be implemented in various other modes by making appropriate changes. The scope of rights included in the present invention is not limited to the above-described embodiment.

REFERENCE SIGNS LIST 10 heat dissipation structure 12 substrate 12 f insertion hole 12 h heatsink positioning hole 12 v guide elongated hole 14 electronic component 16 heatsink 18 heatsink body 18 h pressing tool positioning hole 20 heatsink fin 22 positioning pin 24 pressing tool 26 leaf spring portion (elastic support portion) )
28 convex part 28h insertion long hole 30 positioning pin 32 slide pin 34 fixing tool 36 fixing bolt 38 nut 40 heat conduction sheet 42 heat dissipation structure 44 pressing tool 46 pressing tool main body 46v insertion hole 48 positioning pin 50 slide pin 52 coil spring (elastic support section) )
54 Fixture 56 Fixing bolt 58 Nut

Claims (10)

A radiator provided on the substrate, connected to the electronic component mounted on the substrate so as to be able to transfer heat, and radiating heat of the electronic component,
The substrate is provided so as to intersect with the first direction of the radiator, and has an elastic support portion that is elastically deformable in a height direction and supports the substrate on each end side, and the radiator is provided on the substrate. A pressing tool for pressing to the side,
The pressing device is separated from the radiator in a second direction intersecting the first direction, and the amount of elastic deformation in the height direction of the elastic supporting portion is adjustable, and the pressing device is fixed to the substrate. A heat dissipating structure comprising: a pair of fixing members.   The heat dissipation structure according to claim 1, wherein the elastic support portion is a leaf spring portion formed at each end of the pressing tool.   The center of the pressing tool is positioned with respect to the radiator, and each end of the pressing tool is in a state before fixing the pressing tool to the board, and The heat dissipating structure according to claim 2, wherein the pressing tool is supported so as to be movable in a second direction.   A positioning hole is formed in the radiator, and a positioning pin that engages with the positioning hole is formed at a central portion of the pressing tool, and both sides of the pressing tool in the second direction between the electronic components on the substrate. A guide elongated hole extending in the second direction of the pressing tool is formed, and a slide pin guided in the second direction of the pressing tool is formed in the guide elongated hole on each end side of the pressing tool. The heat dissipation structure according to claim 2, wherein the heat dissipation structure is provided. The pressing tool,
A pressing tool body provided on the substrate so as to intersect the first direction of the radiator;
The heat dissipation structure according to claim 1, further comprising: a coil spring as the elastic support portion provided on each end side of the pressing tool main body.   The central part of the pressing tool main body is positioned with respect to the radiator, and each end of the pressing tool main body is in a state before fixing the pressing tool to the substrate, and is positioned with respect to the substrate. The heat dissipation structure according to claim 5, wherein the heat dissipation structure is supported so as to be movable in a height direction.   A positioning hole is formed in the radiator, a positioning pin that engages with the positioning hole is formed at a central portion of the pressing tool main body, and guides are provided on both sides of the positioning hole in the second direction of the pressing tool on the substrate. 7. The heat dissipation structure according to claim 6, wherein holes are respectively formed, and a slide pin guided in a height direction by the guide holes is formed on each end side of the pressing tool main body.   The one pair of said elastic support parts and a pair of said fixing tools are each arrange | positioned symmetrically with reference to the center line of the said 2nd direction of the said press tool, The any one of Claim 1 to 7 characterized by the above-mentioned. 2. The heat dissipation structure according to claim 1.   Each fixing tool is configured to fix the pressing tool to the substrate by fastening a screw, and to be capable of adjusting the amount of elastic deformation in the height direction of the elastic support portion by fastening the screw. The heat dissipation structure according to any one of claims 1 to 8. Arranging the radiator on the board so that the radiator is connected to the electronic components mounted on the board so as to be able to conduct heat,
A pressing tool is disposed on the substrate so as to intersect the first direction of the radiator,
The amount of elastic deformation in the height direction of each elastic support portion in a state where the substrate is supported by the elastic support portions provided on each end side of the presser and the radiator is pressed toward the substrate by the presser. Fixing the pressing tool to the substrate while adjusting the temperature.

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