JP2020053568A - Light-emitting device and manufacturing method thereof - Google Patents

Abstract

To provide a light-emitting device with a wide light distribution that can be made thinner and a manufacturing method thereof.SOLUTION: A light-emitting device 100 includes: electrode forming surfaces 11 and 21 including a pair of positive and negative electrode terminals 13 and 23; a first light emitting element 10 and a second light emitting element 20 having light emitting surfaces 12 and 22 opposite to the electrode forming surfaces 11 and 21; a translucent covering portion 40 that covers each periphery of the first light emitting element 10 and the second light emitting element 20; a bonding layer 30 that bonds the electrode terminals 13 and 23 in a state where the electrode forming surfaces 11 and 21 face each other; and an external connection terminal 50 electrically connected to the electrode terminals 13, 23 and the light translucent covering portion 40 that covers each periphery of the first light-emitting element 10 and the second light-emitting element 20 bonded via the bonding layer 30, and exposed to the outside from the covering portion 40.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a light emitting device and a method for manufacturing the same.

  A light emitting device using a semiconductor light emitting element such as a light emitting diode or a semiconductor laser is used for applications such as lighting and illumination. Such a semiconductor light emitting device has advantages such as a long life, easy downsizing, and high impact resistance as compared with a conventional incandescent lamp using tungsten as a filament.

  A light emitting device using a semiconductor light emitting element is generally highly directional, and is suitable for use in illuminating a specific part such as a spotlight.On the other hand, the light distribution range is narrower than that of a conventional incandescent lamp. Illuminating a wide area was not easy. Therefore, there has been a demand for a light-emitting device having a wide light distribution while using a semiconductor light-emitting element.

  As such a light emitting device, for example, a light emitting device disclosed in Patent Document 1 has been proposed. As shown in FIG. 10, the light emitting device includes lead frames 111 and 112 spaced apart from each other, an LED die 114 connected to the upper surfaces of the lead frames 111 and 112, and an LED die 115 connected to the lower surface. And a covering member 101 for covering them.

  However, in this configuration, metal lead frames 111 and 112 are indispensable for providing the LED dies vertically, and the thickness of the lead frames 111 and 112 has a problem that the light emitting device becomes thick. There is also a problem that the metal lead frames 111 and 112 become shadows and a part of the light from the LED dies 114 and 115 is absorbed.

International Publication WO2013-115379 JP-T-2012-527076 JP-T-2015-507371A JP-A-1-231380

  An object of the present invention is to provide a light emitting device with a wide light distribution that can be reduced in thickness and a method for manufacturing the same.

  According to the light emitting device of one embodiment of the present invention, an electrode forming surface including a pair of positive and negative electrode terminals, a first light emitting element having a light emitting surface opposite to the electrode forming surface, and a second light emitting element A light-transmitting covering portion that covers the periphery of the first light-emitting element and the second light-emitting element, and a bonding layer that bonds each electrode terminal in a state where the electrode forming surfaces face each other; A light-transmitting covering portion that covers the periphery of the first light-emitting element and the second light-emitting element that are joined through an external connection terminal that is electrically connected to the electrode terminal and exposed to the outside from the covering portion Can be provided.

  According to the method for manufacturing a light emitting device according to another aspect, a first light emitting element having a first light emitting surface having a pair of positive and negative electrode terminals and a first light emitting surface opposite to the electrode forming surface. A first member including a light-transmitting first covering portion that covers the periphery of the first light-emitting element in a state where the first electrode forming surface is exposed, and a second member including a pair of positive and negative electrode terminals. An electrode forming surface, a second light emitting element having a second light emitting surface opposite to the electrode forming surface, and covering the periphery of the second light emitting element with the second electrode forming surface exposed. And a second member including a light-transmitting second covering portion, and a step of preparing the first member and the second member, respectively, and at least a part of each electrode terminal And joining them in a state where they are directly connected.

  According to the above configuration, the first light emitting element and the second light emitting element can be arranged vertically while eliminating the need for a mounting substrate for holding the light emitting element. A light emitting device with a wide light distribution can be realized.

FIG. 2 is a plan view illustrating the light emitting device according to the first embodiment of the present invention. FIG. 2 is a vertical sectional view taken along line II-II of the light emitting device of FIG. 1. FIG. 3 is a horizontal sectional view of the light emitting device of FIG. 2 taken along the line III-III. FIG. 2 is a plan view showing a state where the light emitting device of FIG. 1 is mounted on a mounting substrate. FIG. 5 is a vertical sectional view of the light emitting device of FIG. 4. It is a vertical sectional view showing the light emitting device concerning Embodiment 2 of the present invention. It is a vertical sectional view showing the light emitting device concerning Embodiment 3 of the present invention. FIG. 4 is a vertical sectional view illustrating a manufacturing process of the light emitting device according to the first embodiment of the present invention. FIG. 4 is a vertical sectional view illustrating a manufacturing process of the light emitting device according to the first embodiment of the present invention. It is a sectional view showing the conventional light emitting device.

  According to the light emitting device according to one embodiment of the present invention, the bonding layer includes a conductive conductive layer that physically connects the opposing electrode terminals of the first light emitting element and the second light emitting element, The external connection terminal can be connected to the conductive layer. According to the above configuration, it is possible to directly connect the electrode terminals to each other with the conductive layer adhered and fixed without the interposition of the mounting board.

  Further, a part of the external connection terminal may be exposed from each electrode terminal in a different direction on the surface of the covering portion.

  Further, a part of the external connection terminal may be exposed from each electrode terminal in the same direction on the surface of the covering portion.

  Still further, the external connection terminal may be a member for soldering and mounting to an external electric bonding component.

  Furthermore, the covering portion may be formed in a circular shape in a sectional view when viewed from the direction of the light emitting surface.

  Furthermore, the covering portion may be formed in a dome shape.

  Furthermore, the first light emitting element and the second light emitting element may be joined so as to overlap each other.

  Furthermore, a plurality of the first light-emitting elements are arranged in the same plane, and the plurality of second light-emitting elements are respectively in the same plane in a state of facing the respective electrode forming surfaces of the plurality of first light-emitting elements. It may be arranged.

  Furthermore, a plurality of the first light emitting elements are arranged in a planar shape so as to be adjacent to each other at substantially the same interval as the size of the first light emitting elements, and one or more of the second light emitting elements are arranged in the plurality of first light emitting elements. In a state facing each electrode forming surface of the light emitting element, and the electrode terminal thereof, between the adjacent first light emitting elements, so as to be respectively joined to adjacent electrode terminals of the adjacent first light emitting element. They can also be placed.

  Furthermore, according to the method for manufacturing a light emitting device according to another embodiment of the present invention, the step of preparing the first member and the second member includes the first light emitting element and the second light emitting element, The first heat-resistant sheet, and the step of mounting on one surface of the second heat-resistant sheet, the first light-emitting element on the first heat-resistant sheet, and the second light-emitting element on the second heat-resistant sheet, respectively, to cover Potting the resin to form a dome shape and curing, peeling the first heat-resistant sheet and the second heat-resistant sheet, sputtering Ni / Au on the back side, and patterning by laser irradiation Forming the first member and the second member, for each of the first light emitting element and the second light emitting element, applying a conductive material to the electrode portion, obtained. Said In posture one light emitting element and the second light-emitting element in back-to-back, can be a step of bonding the state in which the respective electrode terminals are connected directly at least in part. This makes it possible to arrange the first light emitting element and the second light emitting element vertically, respectively, without the need for a mounting substrate for holding the light emitting element. A light emitting device having a wide viewing angle can be realized.

  Furthermore, according to the method for manufacturing a light emitting device according to another embodiment, further, a light emitting element assembly in which the first light emitting element and the second light emitting element are joined back to back is electrically connected to the electrode terminal. The method may further include a step of soldering and mounting the external connection terminals exposed from a part of the covering portion to the electric connection component.

  Hereinafter, embodiments will be described in detail with reference to the drawings. In the following description, terms indicating specific directions and positions (for example, “above”, “below”, and other terms including those terms) will be used as necessary. This is for the purpose of facilitating the understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of those terms. In addition, the same reference numeral in a plurality of drawings indicates the same or equivalent part or member. In this specification, the term “provided” is used to include both components provided as separate members and components configured as an integral member.

Further, the embodiments described below exemplify a light emitting device for embodying the technical idea of the present invention, and do not limit the present invention to the following. In addition, dimensions, materials, shapes, relative arrangements, and the like of the components described below are not intended to limit the scope of the present invention thereto, unless otherwise specified, and are exemplified. Intended. Further, what is described in one embodiment or example can be applied to other embodiments or examples. In addition, the size, positional relationship, and the like of the members illustrated in the drawings are exaggerated in some cases in order to make the description clear.
[Embodiment 1]

  The light emitting device according to the first embodiment will be described with reference to FIGS. In these drawings, FIG. 1 is a plan view showing the light emitting device 100 according to the first embodiment of the present invention, FIG. 2 is a vertical sectional view taken along line II-II of the light emitting device 100 of FIG. 1, and FIG. FIG. 4 is a plan view showing a state in which the light emitting device 100 of FIG. 1 is mounted on a mounting board, and FIG. 5 is a vertical sectional view of the light emitting device 100 of FIG. ing. The light emitting device 100 shown in these figures includes a first light emitting element 10, a second light emitting element 20, and a bonding layer 30 for bonding the electrode terminals 13 and 23 of the first light emitting element 10 and the second light emitting element 20. , A light-transmitting covering portion 40 covering the periphery of the first light emitting element 10 and the second light emitting element 20, and an external connection terminal 50 exposed to the outside from the covering portion 40.

  The first light emitting element 10 has a first electrode forming surface 11 having a pair of positive and negative first electrode terminals 13, and a first light emitting surface 12 opposite to the first electrode forming surface 11. The second light emitting element 20 also has a second electrode forming surface 21 having a pair of positive and negative second electrode terminals 23, and a second light emitting surface 22 opposite to the second electrode forming surface 21. Preferably, the first light emitting element 10 and the second light emitting element 20 use the same type of light emitting element. Then, one of the first light emitting element 10 and the second light emitting element 20 is turned over as shown in FIG. 2 and the like, and the first light emitting element 10 and the second light emitting element 20 are joined so that the first electrode forming surface 11 and the second electrode forming surface 21 face each other. . That is, as shown in FIGS. 1 and 3, the first light emitting element 10 and the second light emitting element 20 are joined so as to overlap each other in a plan view. Thereby, the light emitting element assembly 1 in which the first light emitting element 10 and the second light emitting element 20 are joined together has the first light emitting surface 12 exposed on one surface and the second light emitting surface 22 exposed on the other surface. In addition, it is possible to output light with high light emission intensity on both sides, and wide light distribution is realized.

  In this example, the first light emitting element 10 and the second light emitting element 20 are connected in parallel by connecting p electrodes and n electrodes. In the example of FIG. 2, the upper surface side of the light emitting element assembly is the first light emitting element 10 and the lower surface side is the second light emitting element 20, but it is needless to say that these may be interchanged.

  Each of the light-emitting elements 10 and 20 has, for example, a light-transmitting substrate such as sapphire and a semiconductor multilayer structure stacked on the light-transmitting substrate. The semiconductor laminated structure includes a light emitting layer, an n-type semiconductor layer and a p-type semiconductor layer sandwiching the light emitting layer, and an n-side electrode and a p-side electrode are electrically connected to the n-type semiconductor layer and the p-type semiconductor layer, respectively. You. The light-emitting elements 10 and 20 are disposed, for example, outward so that the light-emitting surfaces 12 and 22 provided with a light-transmitting substrate are opposite to each other, and a pair of electrode terminals are provided on the electrode forming surfaces 11 and 21 opposite to the light-emitting surfaces 12 and 22. 13 and 23.

  There is no particular limitation on the vertical, horizontal and height dimensions of the light emitting elements 10 and 20, but preferably, a semiconductor light emitting element having vertical and horizontal dimensions of 1000 μm or less in plan view is used, and more preferably vertical and horizontal dimensions are used. A light-emitting element having a size of 500 μm or less, more preferably a vertical and horizontal size of 200 μm or less, is used.

  As the light emitting elements 10 and 20, known semiconductor light emitting elements can be used. In the present embodiment, flip-chip type light emitting diodes are exemplified as the light emitting elements 10 and 20. The light emitting elements 10 and 20 emit, for example, blue light. As the light emitting elements 10 and 20, an element that emits light other than blue light can be used. Further, light emitting elements that emit light of different colors may be used as the plurality of light emitting elements 10 and 20. Further, a wavelength conversion member that converts light emitted from the light emitting elements 10 and 20 can be combined.

As the light emitting elements 10 and 20, an element that emits light of an arbitrary wavelength can be selected. For example, as an element that emits blue and green light, a light emitting element using a nitride semiconductor (In _x Al _Y Ga _{1 -XYN} , 0 ≦ X, 0 ≦ Y, X + Y ≦ 1) or GaP is used. be able to. Further, as the element that emits red light, a light-emitting element containing a semiconductor such as GaAlAs or AlInGaP can be used. Further, a semiconductor light emitting device made of a material other than these may be used. Various emission wavelengths can be selected depending on the material of the semiconductor layer and the degree of mixed crystal thereof. The composition, emission color, size, number, and the like of the light-emitting elements to be used may be appropriately selected depending on the purpose.

  Further, a wavelength conversion member may be arranged on or around the light emitting surface of the light emitting element. The wavelength conversion member is a member that receives light emitted from the light emitting element and converts the light into light of a different wavelength. For example, by including a phosphor that emits yellow light when excited by blue light emitted from a light emitting element, a light emitting device that emits white light by mixing blue light and yellow light can be realized. Further, the wavelength conversion member may be included in the covering portion.

  The wavelength conversion member is obtained by adding a phosphor as a wavelength conversion material to a base material. As a material of the base material, for example, a translucent material such as an epoxy resin, a silicone resin, a resin obtained by mixing them, or glass can be used.

Examples of the wavelength conversion material contained in the wavelength conversion member include yttrium aluminum garnet activated by cerium, lutetium aluminum garnet activated by cerium, and nitrogen-containing calcium aluminosilicate activated by europium and / or chromium (calcium). Can be partially replaced by strontium), sialon activated by europium, silicate activated by europium, strontium aluminate activated by europium, β-sialon phosphor, nitride-based phosphor, fluorinated by manganese Potassium silicate, a sulfide-based phosphor, a quantum dot phosphor, a fluoride-based phosphor such as a KSF-based phosphor, and the like. In particular, a plurality of types of wavelength conversion members are used in one wavelength conversion member, and more preferably, the wavelength conversion member is a fluorinated phosphor such as a β-sialon phosphor that emits green light and a KSF-based phosphor that emits red light. By including the phosphor based on the compound, the color reproduction range of the light emitting module can be expanded. In this case, the light emitting elements 10 and 20 are nitride semiconductors (In _X Al _Y Ga _{1 -XYN} , 0 ≦ X, 0 ≦ Y) capable of emitting light of a short wavelength capable of efficiently exciting the wavelength conversion member. , X + Y ≦ 1). Also, for example, when the light emitting elements 10 and 20 that emit blue light are used, a KSF-based phosphor (red phosphor) is added to the wavelength conversion member by 60 weight so that red light can be obtained. %, Preferably 90% by weight or more. In other words, the wavelength conversion member that emits light of a specific color may be included in the wavelength conversion member to emit light of a specific color. Further, the wavelength conversion material may be a quantum dot. The wavelength conversion material may be arranged in any manner in the wavelength conversion member. For example, they may be substantially uniformly distributed, or may be partially distributed. Further, a plurality of layers each containing the wavelength conversion member may be provided in a stacked manner.
(Joining layer 30)

  The bonding layer 30 bonds the electrode terminals 13 and 23 in a state where the electrode forming surfaces 11 and 21 face each other. Further, the bonding layer 30 may include a conductive layer that physically connects the opposing electrode terminals 13 and 23 of the first light emitting element 10 and the second light emitting element 20 to each other. As such a conductive layer, an Ag paste, a conductive adhesive, or the like can be suitably used. It is not necessary that all the bonding layers 30 have conductivity, and some of the bonding layers may have no conductivity. For example, in the case where a plurality of light emitting elements are connected, light emitting elements whose electrical connection is maintained by parallel connection can be bonded using a bonding layer having no conductivity.

The external connection terminal 50 is connected to this conductive layer. Thereby, it is possible to electrically connect the electrode terminals 13 and 23 directly to each other with the conductive layer adhered and fixed without the interposition of the mounting board. In addition, since no mounting substrate or conductive lead is interposed on the bonding surface, it is advantageous in reducing the height of the light emitting device.
(Coating part 40)

  The covering section 40 covers the periphery of the light-emitting element assembly 1 joined via the joining layer 30. The covering part 40 preferably covers the periphery of the first light emitting element 10 and the second light emitting element 20 respectively. However, in a state where the first light emitting element 10 and the second light emitting element 20 are joined, the periphery thereof may be integrally covered with the covering portion 40. The covering portion 40 is formed of a member having a light-transmitting property. For example, a light-transmitting thermosetting resin material such as a silicone resin or an epoxy resin can be used.

  Further, the shape of the covering portion 40 is formed in a circular shape in a sectional view when viewed from the direction of the light emitting surface. The covering portion 40 is preferably formed in a spherical shape or a dome shape. The dome-shaped covering portion functions as an optical member such as a lens. However, in the present invention, the shape of the covering portion is not limited to this, and may be any shape such as a shell shape, a cylindrical shape, a semi-cylindrical shape, and the like.

  The external connection terminal 50 is a terminal for supplying driving power for driving the light emitting device 100. The external connection terminal 50 is electrically connected to the electrode terminals 13 and 23 of the first light emitting element 10 and the second light emitting element 20. In the example of FIG. 2, the first light emitting element 10 and the second light emitting element 20 are connected in parallel, and the first electrode terminal 13 on the positive electrode side, the second electrode terminal 23, the first electrode terminal 13 on the negative electrode side, External connection terminals 50 are connected to the two electrode terminals 23, respectively. The pair of external connection terminals 50 serve as a positive terminal and a negative terminal of the light emitting device 100, respectively. In addition, the external connection terminal 50 can be used as a member for mounting by soldering to the external electric bonding component 60.

  Further, a part of the external connection terminal 50 is exposed from each of the electrode terminals 13 and 23 in a different direction on the covering portion 40. In the example of FIG. 1 and the like, the external connection terminals 50 extend from the left and right sides of the covering portion 40. In this example, the external connection terminal 50 is provided at a position of approximately the diameter of the spherical covering portion 40.

In the above example, the example in which the external connection terminal 50 is exposed on the surface of the covering portion 40 has been described. The exposed external connection terminal 50 may have a substantially same planar shape as the covering portion 40, may be slightly protruded, or may be slightly recessed from the surface of the covering portion. Alternatively, the external connection terminal may be made to protrude in a bar shape from the covering portion. Further, the external connection terminals 50 are not limited to the configuration extending in the direction away from each other, and may be configured to be exposed in the same direction. Also in this case, the exposed external connection terminals may be projected from the surface of the covering portion. In such a configuration, for example, by pulling out a pair of external connection terminals 50 from the covering portion 40 in parallel, like a pair of leads protruding from a bullet-shaped LED, it is easy to wire. This is advantageous.
(Electrical bonding parts 60)

The light emitting device 100 can be mounted on the electric bonding component 60 as shown in the sectional view of FIG. 5 and the plan view of FIG. The electrical bonding component 60 functions as a mounting board for mounting the light emitting element or an external connection board. The electrical connection component 60 is formed of, for example, a ceramic substrate, an aluminum substrate, a glass epoxy substrate, a flexible substrate, or the like. Further, a wiring pattern or the like is provided on the electric bonding component 60 as necessary. The mounting of the light emitting device 100 on the electrical connection component 60 is performed by connecting the external connection terminal 50 exposed on a part of the covering portion 40 to a wiring pattern of the electrical connection component 60, or the like. In addition, the electric bonding component 60 is not limited to a form in which the light emitting device is covered or mounted, and may be, for example, a component that forms an interface that can be connected to an external device. For example, a connector for electrical connection or the like can also be used as one mode of the electrical connection component.
[Embodiment 2]

  In the above example, the example in which the light emitting device 100 is configured using the two light emitting elements of the first light emitting element 10 and the second light emitting element 20 has been described, but the present invention limits the number of light emitting elements to two. However, the number can be any number of three or more. When three or more light-emitting elements are used, the first light-emitting element 10 and the second light-emitting element 20 are overlapped with each other so as to overlap with each other, and alternately so as to straddle two light-emitting elements. Either or both of the overlapping modes can be used.

Here, as the light emitting device 200 according to the second embodiment, a plurality of the first light emitting elements 10 are arranged on the same plane, and the same number of the second light emitting elements 20 as the first light emitting elements 10 FIG. 6 shows an example in which the electrodes are arranged on the same plane so as to face the electrode forming surfaces 11 and 21 of FIG. By thus increasing the number of light-emitting elements, a high-output light-emitting device with higher luminance can be obtained. Further, while the opposing first light emitting element 10 and second light emitting element 20 are connected in parallel, these light emitting element joined bodies 1 can be connected in series, and provisionally constitute each light emitting element joined body 1. Even if any one of the first light emitting element 10 and the second light emitting element 20 is broken, an advantage is obtained in that the electrical connection is maintained and the light emitting device can be continuously used.
[Embodiment 3]

  A light emitting device 300 according to the third embodiment is shown in a cross-sectional view of FIG. In the light emitting device 300 shown in this figure, the interval between the adjacent first light emitting elements 10 is equal to the distance between the second electrode terminals 23 of the second light emitting elements 20 while the plurality of first light emitting elements 10 are arranged on the same plane. Align with the interval. Then, the second light emitting element 20 connects each first electrode terminal 13 of the adjacent first light emitting element 10 to the pair of second light emitting elements 20 so as to straddle the adjacent first light emitting elements 10. Connect to electrode terminal 23. According to this connection method, the first light emitting surface 12 and the second light emitting element 20 can be alternately connected in series, and a higher output can be obtained as compared with the parallel connection.

In each of the second and third embodiments, the light emitting device is not limited to the configuration in which the light emitting elements are arranged in a one-dimensional linear shape in plan view of the light emitting device, and the light emitting elements may be arranged in a two-dimensional planar shape. Furthermore, when the light-emitting elements are arranged two-dimensionally, the first light-emitting element 10 and the second light-emitting element 20 are overlapped with each other as in Embodiment 2, and the first light-emitting element 10 as in Embodiment 3 is used. You may combine with the example which arrange | positions the 2nd light emitting element 20 by turns. For example, the connection of the third embodiment is performed between adjacent rows while the light emitting elements are arranged in a matrix and the connection of the second embodiment is performed in units of rows. Alternatively, the second embodiment and the third embodiment may be repeatedly arranged for each row.
[Method of manufacturing light emitting element]

  Next, a method for manufacturing the light emitting device will be described with reference to FIGS. First, as shown in FIG. 8, the first member 2 in which the first light emitting element 10 is covered with the dome-shaped first covering portion 41 is prepared. The first member 2 covers the periphery of the first light-emitting element 10 with a light-transmitting first covering portion 41 in a state where the first electrode forming surface 11 of the first light-emitting element 10 is exposed. Similarly, the second member 3 in which the second light emitting element 20 is covered with the dome-shaped second covering portion 42 is prepared. The second member 3 also covers the periphery of the second light emitting element 20 with the light-transmitting second covering portion 42 with the second electrode forming surface 21 of the second light emitting element 20 exposed.

  Here, an example of the step of preparing the first member 2 will be described with reference to FIG. First, the first light emitting element 10 is mounted on one surface of the first heat resistant sheet 16. Then, a resin material is formed into a dome shape by potting so as to cover the first light-emitting element 10 on the first heat-resistant sheet 16, and is cured. Epoxy resin, silicone resin and the like can be used as the resin material. Thus, a hemispherical first covering portion 41 as shown in FIG. 8 is formed. Further, the first heat-resistant sheet 16 is peeled off, a metal layer is formed on the back surface by sputtering, and patterning by laser irradiation is performed to form an electrode portion. The electrode portions constitute the electrode terminals 13 and 23. The electrode layer is composed of, for example, a metal layer of Ni / Au. The metal layer includes a Ni layer and an Au layer, and a Ni layer 500 # and an Au layer 500 # are formed in this order on the entire electrode forming surface including the surface of the first electrode terminal 13 by, for example, sputtering. Here, in consideration of patterning by laser beam irradiation, the metal layer is preferably formed to a thickness of 1 μm or less, preferably 1000 ° or less.

  The same procedure as the above-described step of preparing the first member 2 can be used for the step of preparing the second member 3.

  Then, the first member 2 and the second member 3 are joined with their respective electrode terminals 13 and 23 at least partially directly connected in a back-to-back posture. An example of a process of joining the first member 2 and the second member 3 will be described. First, for each of the first light emitting element 10 and the second light emitting element 20, a conductive material is applied to the electrode portion as shown in FIG. Ag paste or the like can be used as the conductive material. The conductive material cures to form a conductive layer. Then, in a posture in which the obtained first light emitting element 10 and second light emitting element 20 are back-to-back, the electrode terminals 13 and 23 are joined with a conductive material in a state where at least a part thereof is directly connected. At the time of joining, it is preferable to fill the gap by applying a filler such as resin so that a gap corresponding to the thickness of the electrode material does not occur. That is, in the light emitting device 100 in FIG. 2, the space 17 formed between the electrode terminals 13 and 23 on the electrode forming surfaces 11 and 21 of the first light emitting element 10 and the second light emitting element 20 is not limited to a gap, Can also be filled with the filler.

  Further, the light emitting device 100 is mounted on the electric bonding component 60 as necessary. For example, as shown in the cross-sectional view of FIG. 5 and the plan view of FIG. The exposed external connection terminals 50 are soldered and mounted on the electric bonding parts 60. The external connection terminal 50 is electrically connected to the electrode terminals 13 and 23 in advance.

  This makes it possible to arrange the first light emitting element 10 and the second light emitting element 20 vertically, respectively, without the need for a mounting substrate for holding the light emitting element. A light-emitting device with a wide viewing angle can be realized.

  The light emitting device according to the present embodiment can be used, for example, as a lighting fixture or the like.

100, 200, 300 Light emitting device 1 Light emitting element assembly 2 First member 3 Second member 10 First light emitting element 11 First electrode forming surface 12 First light emitting surface 13 First electrode terminal 16 ... first heat-resistant sheet 17 ... space 20 ... second light emitting element 21 ... second electrode forming surface 22 ... second light emitting surface 23 ... second electrode terminal 30 ... bonding layer 40 ... covering portion 41 ... first covering portion 42 ... first. Two coating parts 50 ... External connection terminals 60 ... Electrical bonding parts 101 ... Coating members 111 and 112 ... Lead frames 114 and 115 ... LED dies

Claims (13)

An electrode forming surface including a pair of positive and negative electrode terminals,
A first light emitting element having a light emitting surface opposite to the electrode forming surface, and a second light emitting element,
Around the first light emitting element and the second light emitting element, a translucent covering portion that respectively covers,
In a state where the electrode forming surfaces face each other, a bonding layer for bonding each electrode terminal,
A light-transmitting covering portion that covers the periphery of the first light-emitting element and the second light-emitting element joined via the joining layer,
An external connection terminal electrically connected to the electrode terminal and exposed to the outside from the covering portion;
A light emitting device comprising: The light emitting device according to claim 1,
The bonding layer includes a conductive conductive layer that physically bonds the opposing electrode terminals of the first light emitting element and the second light emitting element,
A light emitting device in which the external connection terminal is connected to the conductive layer. The light emitting device according to claim 1, wherein:
A light emitting device in which a part of the external connection terminal is exposed from each electrode terminal in a different direction on the surface of the covering portion. The light emitting device according to claim 1, wherein:
A light emitting device in which a part of the external connection terminal is exposed from each electrode terminal in the same direction on the surface of the covering portion. The light emitting device according to claim 1, wherein:
A light emitting device, wherein the external connection terminal is a member for mounting by soldering to an external electric bonding component. The light emitting device according to claim 1, wherein:
A light emitting device in which the covering portion is formed in a circular shape in cross section as viewed from the direction of the light emitting surface. The light emitting device according to claim 1, wherein:
A light emitting device in which the covering portion is formed in a dome shape. The light emitting device according to claim 1, wherein:
A light emitting device in which the first light emitting element and the second light emitting element are joined so as to overlap each other. It is a light emitting device according to any one of claims 1 to 8,
A plurality of the first light emitting elements are arranged on the same plane,
A light emitting device in which a plurality of the second light emitting elements are arranged on the same plane in a state of facing the respective electrode forming surfaces of the plurality of first light emitting elements. It is a light emitting device according to any one of claims 1 to 8,
The plurality of first light-emitting elements are arranged in a planar shape so as to be adjacent to each other at substantially the same interval as the size of the first light-emitting elements,
One or more of the second light-emitting elements are opposed to the respective electrode forming surfaces of the plurality of first light-emitting elements, and the electrode terminals thereof are disposed between the adjacent first light-emitting elements, and the adjacent first light-emitting elements are arranged in the first area. A light-emitting device in which light-emitting elements are arranged so as to be joined to adjacent electrode terminals. A first electrode forming surface including a pair of positive and negative electrode terminals,
A first light emitting element having a first light emitting surface opposite to the electrode forming surface,
In a state where the first electrode formation surface is exposed, a light-transmitting first coating portion that covers the periphery of the first light-emitting element,
A first member comprising:
A second electrode forming surface including a pair of positive and negative electrode terminals,
A second light emitting element having a second light emitting surface opposite to the electrode forming surface,
In a state where the second electrode forming surface is exposed, a light-transmitting second covering portion that covers the periphery of the second light-emitting element,
A second member comprising:
Preparing each of the
The first member and the second member, respectively, in a back-to-back posture, a step of joining each electrode terminal at least partially directly connected state,
A method for manufacturing a light emitting device comprising: It is a manufacturing method of the light emitting device of Claim 11, Comprising:
The step of preparing the first member and the second member,
The first light-emitting element, and the second light-emitting element, respectively, the first heat-resistant sheet, the step of mounting on one surface of the second heat-resistant sheet,
The first light-emitting element on the first heat-resistant sheet, and the second light-emitting element on the second heat-resistant sheet, forming a dome shape by potting a resin so as to cover, respectively, and curing.
Peeling the first heat-resistant sheet and the second heat-resistant sheet, sputtering Ni / Au on the back surface side, and patterning by laser irradiation to form an electrode portion;
Including
The step of bonding the first member and the second member includes applying a conductive material to the electrode portion for each of the first light emitting element and the second light emitting element, and obtaining the first light emitting element and the second light emitting element. A method for manufacturing a light-emitting device, which comprises a step of joining each electrode terminal in a state where the light-emitting elements are back-to-back and at least partially directly connected to each other. The method for manufacturing a light emitting device according to claim 12, further comprising:
From the light-emitting element assembly in which the first light-emitting element and the second light-emitting element are joined back-to-back, an external connection terminal that is electrically connected to the electrode terminal and is exposed from a part of the covering portion, A method for manufacturing a light emitting device, comprising a step of soldering and mounting on a light emitting device.

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