JP2020047649A5 - - Google Patents
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- JP2020047649A5 JP2020047649A5 JP2018172974A JP2018172974A JP2020047649A5 JP 2020047649 A5 JP2020047649 A5 JP 2020047649A5 JP 2018172974 A JP2018172974 A JP 2018172974A JP 2018172974 A JP2018172974 A JP 2018172974A JP 2020047649 A5 JP2020047649 A5 JP 2020047649A5
- Authority
- JP
- Japan
- Prior art keywords
- mold
- composition
- substrate
- molding apparatus
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018172974A JP7191606B2 (ja) | 2018-09-14 | 2018-09-14 | 型を用いて基板上の組成物を成形する成形装置、成形方法、及び、物品製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018172974A JP7191606B2 (ja) | 2018-09-14 | 2018-09-14 | 型を用いて基板上の組成物を成形する成形装置、成形方法、及び、物品製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020047649A JP2020047649A (ja) | 2020-03-26 |
| JP2020047649A5 true JP2020047649A5 (https=) | 2021-09-24 |
| JP7191606B2 JP7191606B2 (ja) | 2022-12-19 |
Family
ID=69901759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018172974A Active JP7191606B2 (ja) | 2018-09-14 | 2018-09-14 | 型を用いて基板上の組成物を成形する成形装置、成形方法、及び、物品製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7191606B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11034057B2 (en) * | 2019-08-15 | 2021-06-15 | Canon Kabushiki Kaisha | Planarization process, apparatus and method of manufacturing an article |
| JP7532234B2 (ja) * | 2020-12-10 | 2024-08-13 | キヤノン株式会社 | 平坦化装置、平坦化方法及び物品の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3957166B2 (ja) | 2002-05-09 | 2007-08-15 | Ｔｄｋ株式会社 | スタンパ剥離方法および装置、ならびに多層記録媒体 |
| TW200504928A (en) * | 2003-06-20 | 2005-02-01 | Matsushita Electric Industrial Co Ltd | Manufacturing method of semiconductor device |
| JP5782784B2 (ja) | 2011-03-31 | 2015-09-24 | 大日本印刷株式会社 | インプリント方法およびそれを実施するためのインプリント装置 |
| JP6012944B2 (ja) | 2011-09-22 | 2016-10-25 | オリンパス株式会社 | 光学素子の製造方法および表面加工装置 |
| JP6447613B2 (ja) | 2016-11-01 | 2019-01-09 | 本田技研工業株式会社 | 乗員保護装置 |
-
2018
- 2018-09-14 JP JP2018172974A patent/JP7191606B2/ja active Active
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