JP2020040019A - Ultrasonic water jet device - Google Patents

Ultrasonic water jet device Download PDF

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JP2020040019A
JP2020040019A JP2018169601A JP2018169601A JP2020040019A JP 2020040019 A JP2020040019 A JP 2020040019A JP 2018169601 A JP2018169601 A JP 2018169601A JP 2018169601 A JP2018169601 A JP 2018169601A JP 2020040019 A JP2020040019 A JP 2020040019A
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water
ultrasonic
ultrasonic vibration
cylindrical portion
grinding
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JP7222635B2 (en
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邱 暁明
Toshiaki Oka
暁明 邱
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Disco Corp
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Disco Abrasive Systems Ltd
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  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Special Spraying Apparatus (AREA)
  • Apparatuses For Generation Of Mechanical Vibrations (AREA)

Abstract

To provide an ultrasonic washing nozzle, which allows ultrasonic vibration with large amplitude to be propagated to washing water.SOLUTION: An ultrasonic water jet device 2, which is a device for jetting water to which ultrasonic vibration is propagated, comprises: a tubular water storage part 20 that temporarily stores water supplied from a water supply source 22; a jetting port 21 through which water is jetted from one end side of the water storage part 20; and an ultrasonic oscillation part 23, arranged at the other end side of the water storage part 20 to oppose to the jetting port 21, which propagates ultrasonic vibration to water in the water storage part 20. The ultrasonic oscillation part 23 comprises: a first columnar part 25; a second columnar part 26 with a diameter larger than a diameter of the first columnar part 25, connected to the first columnar part 25, sharing a center shaft with the first columnar part; and an ultrasonic vibration plate 29 arranged at a free end side of the second columnar part 26. The water storage part 20 is made to store the first columnar part 25, and a side wall 200 forming the water storage part 20 is connected to a part at which ultrasonic vibration becomes zero in a longitudinal direction of the ultrasonic oscillation part 23.SELECTED DRAWING: Figure 2

Description

本発明は、超音波振動を伝播させた水を噴射する超音波水噴射装置に関する。   TECHNICAL FIELD The present invention relates to an ultrasonic water jetting device that jets water propagated by ultrasonic vibration.

被洗浄物の汚れをとる超音波洗浄ノズル(例えば、特許文献1参照)は、洗浄水を一時的に溜める水溜部と、水溜部から水を噴出する噴出口と、噴出口に対向して水溜部に配置した超音波振動板とを備えており、超音波振動板から発振した超音波振動を水溜部内の洗浄水に伝播させ、噴出口から噴出させた洗浄水の超音波振動により被洗浄物の汚れに衝撃を与えることで、被洗浄物から汚れを除去している。   An ultrasonic cleaning nozzle that removes dirt from an object to be cleaned (for example, see Patent Literature 1) includes a water reservoir for temporarily storing cleaning water, a jet port for jetting water from the water pool, and a water pool facing the jet port. The ultrasonic vibration oscillated from the ultrasonic vibration plate is transmitted to the cleaning water in the water reservoir, and the object to be cleaned is generated by the ultrasonic vibration of the cleaning water ejected from the ejection port. By applying an impact to the dirt, the dirt is removed from the object to be cleaned.

特開2004−082038号公報JP-A-2004-082038

このような超音波洗浄ノズルを用いる洗浄は、2流体洗浄ノズルや高圧洗浄ノズルでは取ることができない細かい汚れを除去する目的で使用されるため、1MHzの超高周波を洗浄水に伝播させる事が多い。
一方、超音波振動板から発せられる超音波振動の振幅を小さく設定すると、研削加工で発生する研削屑のような大きな汚れを除去する事ができない。そのため、大きな汚れを除去させるために周波数を下げた超音波振動を超音波振動板からダイレクトに洗浄水に伝播させるが、超音波振動が伝播しないため、研削屑のような大きな汚れを除去する事ができないという問題がある。
Since the cleaning using such an ultrasonic cleaning nozzle is used for the purpose of removing fine dirt that cannot be removed with a two-fluid cleaning nozzle or a high-pressure cleaning nozzle, an ultra-high frequency of 1 MHz is often transmitted to the cleaning water. .
On the other hand, if the amplitude of the ultrasonic vibration generated from the ultrasonic vibration plate is set to be small, it is not possible to remove large dirt such as grinding dust generated by grinding. For this reason, ultrasonic vibration with a reduced frequency is transmitted directly from the ultrasonic vibration plate to the cleaning water to remove large dirt, but since ultrasonic vibration does not propagate, it is necessary to remove large dirt such as grinding dust. There is a problem that can not be.

よって、超音波洗浄ノズルにおいては、大きな振幅の超音波振動を洗浄水に伝播できるようにするという課題がある。   Therefore, in the ultrasonic cleaning nozzle, there is a problem that ultrasonic vibration having a large amplitude can be transmitted to the cleaning water.

上記課題を解決するための本発明は、超音波振動を伝播させた水を噴射する超音波水噴射装置であって、水供給源から供給される水を一時的に溜める筒状の水溜部と、該水溜部の一方の端側から水を噴射する噴射口と、該噴射口に対向して該水溜部の他方の端側に配設され該水溜部内の水に超音波振動を伝播させる超音波発振部と、を備え、該超音波発振部は、第1の円柱部と、該第1の円柱部と中心軸を同じくして連結され該第1の円柱部の直径より大きい直径の第2の円柱部と、該第2の円柱部の自由端側に配設される超音波振動板と、を備え、該水溜部に該第1の円柱部を収容させ、該超音波水噴射装置を形成する側壁を該超音波発振部の長手方向において超音波振動がゼロになる部分に接続させた超音波水噴射装置である。   The present invention for solving the above-mentioned problem is an ultrasonic water jetting device for jetting water in which ultrasonic vibrations are propagated, and a cylindrical water reservoir for temporarily storing water supplied from a water supply source. An outlet for injecting water from one end side of the water reservoir, and an ultrasonic wave disposed at the other end of the water reservoir opposed to the water outlet for transmitting ultrasonic vibrations to the water in the water reservoir. An ultrasonic wave oscillating unit, wherein the ultrasonic wave oscillating unit is connected to a first columnar portion and having the same central axis as the first columnar portion, and has a diameter larger than the diameter of the first columnar portion. And an ultrasonic vibrating plate disposed on a free end side of the second cylindrical portion, wherein the first cylindrical portion is accommodated in the water reservoir, and the ultrasonic water jet device is provided. Is an ultrasonic water spraying device in which the side wall forming the above is connected to a portion where ultrasonic vibration becomes zero in the longitudinal direction of the ultrasonic oscillation section.

本発明に係る超音波水噴射装置においては、16kHzから80kHzの高周波電力を前記超音波振動板に供給すると好ましい。   In the ultrasonic water jet apparatus according to the present invention, it is preferable that high-frequency power of 16 kHz to 80 kHz is supplied to the ultrasonic diaphragm.

本発明に係る超音波水噴射装置は、水供給源から供給される水を一時的に溜める筒状の水溜部と、水溜部の一方の端側から水を噴射する噴射口と、噴射口に対向して水溜部の他方の端側に配設され水溜部内の水に超音波振動を伝播させる超音波発振部と、を備え、超音波発振部は、第1の円柱部と、第1の円柱部と中心軸を同じくして連結され第1の円柱部の直径より大きい直径の第2の円柱部と、第2の円柱部の自由端側に配設される超音波振動板と、を備え、水溜部に第1の円柱部を収容させ、超音波水噴射装置を形成する側壁を超音波発振部の長手方向において超音波振動がゼロになる部分に接続させているため、大きな振幅の超音波振動を効率よく水に伝播させることができる。また、大きな振幅の超音波振動を伝播させた水を被洗浄物に噴射し、従来の超音波ノズルでは除去できなかった研削屑のような大きなゴミを除去すること可能となる。   The ultrasonic water injection device according to the present invention is a cylindrical water storage portion for temporarily storing water supplied from a water supply source, an injection hole that injects water from one end side of the water storage portion, and an injection hole. An ultrasonic oscillating section disposed opposite to the other end of the water basin to transmit ultrasonic vibration to water in the water basin, the ultrasonic oscillating section comprising: a first columnar section; A second columnar portion connected to the columnar portion in the same central axis and having a diameter larger than the diameter of the first columnar portion; and an ultrasonic diaphragm disposed on a free end side of the second columnar portion. Since the first cylindrical portion is housed in the water reservoir and the side wall forming the ultrasonic water jet device is connected to a portion where the ultrasonic vibration becomes zero in the longitudinal direction of the ultrasonic oscillator, a large amplitude Ultrasonic vibration can be efficiently transmitted to water. In addition, it is possible to spray water to which the ultrasonic vibration having a large amplitude is propagated onto the object to be cleaned, thereby removing large dust such as grinding dust that cannot be removed by the conventional ultrasonic nozzle.

本発明に係る超音波水噴射装置が配設された研削装置の一例を示す斜視図である。It is a perspective view showing an example of a grinding device in which the ultrasonic water injection device concerning the present invention was arranged. 超音波水噴射装置の一例を示す断面図である。It is sectional drawing which shows an example of an ultrasonic water injection device. 水溜部の別例を示す断面図である。It is sectional drawing which shows another example of a water reservoir part. 胴体部を備えない超音波水噴射装置の一例を示す断面図である。It is sectional drawing which shows an example of the ultrasonic water injection device which does not have a body part. 超音波水噴射装置の別例を示す断面図である。It is sectional drawing which shows another example of an ultrasonic water injection device. 超音波水噴射装置で洗浄水を研削砥石の研削面に噴射しながら被加工物の研削を行っている状態を説明する断面図である。FIG. 4 is a cross-sectional view illustrating a state in which the workpiece is being ground while the cleaning water is being sprayed onto the grinding surface of the grinding wheel by the ultrasonic water spray device.

図1に示す研削装置1は、保持手段3上に保持された被加工物Wを研削手段7によって研削する装置である。研削装置1のベース10上の前方(−Y方向側)は、保持手段3に対して被加工物Wの着脱が行われる領域であり、ベース10上の後方(+Y方向側)は、研削手段7によって保持手段3上に保持された被加工物Wの研削が行われる領域である。   The grinding device 1 shown in FIG. 1 is a device for grinding a workpiece W held on a holding means 3 by a grinding means 7. The front (−Y direction side) on the base 10 of the grinding device 1 is a region where the workpiece W is attached to and detached from the holding unit 3, and the rear (+ Y direction side) on the base 10 is the grinding unit. 7 is a region where the workpiece W held on the holding means 3 by the grinding is performed.

保持手段3は、円形板状のポーラス部材等からなり被加工物Wを吸着する吸着部30と、吸着部30を支持する枠体31とを備える。吸着部30は、真空発生装置等の図示しない吸引源に連通し、吸引源が吸引することで生み出された吸引力が、吸着部30の露出面である保持面30aに伝達されることで、保持手段3は保持面30a上で被加工物Wを吸引保持できる。また、保持手段3は、カバー39により周囲を囲繞されており、Z軸方向の軸心周りに回転可能となっている。   The holding means 3 is composed of a circular plate-shaped porous member or the like, and includes a suction unit 30 that suctions the workpiece W, and a frame 31 that supports the suction unit 30. The suction unit 30 communicates with a suction source (not shown) such as a vacuum generator, and the suction force generated by the suction by the suction source is transmitted to the holding surface 30a that is the exposed surface of the suction unit 30. The holding means 3 can suction-hold the workpiece W on the holding surface 30a. Further, the holding means 3 is surrounded by a cover 39 and is rotatable around the axis in the Z-axis direction.

保持手段3、カバー39、及びカバー39に連結された蛇腹カバー39aの下方(ベース10内部)には、保持手段3をY軸方向に移動させるモータ及びボールネジ等からなる図示しないY軸方向移動手段が配設されており、保持手段3は該Y軸方向移動手段によってY軸方向に往復移動可能となっている。   Below the holding means 3, the cover 39, and the bellows cover 39a connected to the cover 39 (inside the base 10), a motor for moving the holding means 3 in the Y-axis direction and a Y-axis moving means (not shown) including a ball screw and the like. Is provided, and the holding means 3 is reciprocally movable in the Y-axis direction by the Y-axis direction moving means.

研削領域には、コラム11が立設されており、コラム11の前面には研削手段7を保持手段3に対して離間又は接近するZ軸方向(鉛直方向)に研削送りする研削送り手段5が配設されている。研削送り手段5は、鉛直方向の軸心を有するボールネジ50と、ボールネジ50と平行に配設された一対のガイドレール51と、ボールネジ50の上端に連結しボールネジ50を回動させるモータ52と、内部のナットがボールネジ50に螺合し側部がガイドレール51に摺接する昇降板53とを備えており、モータ52がボールネジ50を回動させると、これに伴い昇降板53がガイドレール51にガイドされてZ軸方向に往復移動し、昇降板53に固定された研削手段7がZ軸方向に研削送りされる。   In the grinding area, a column 11 is provided upright. On the front surface of the column 11, there is provided a grinding feeding means 5 for grinding and feeding the grinding means 7 in the Z-axis direction (vertical direction) which is separated or approaches the holding means 3. It is arranged. The grinding feed means 5 includes a ball screw 50 having a vertical axis, a pair of guide rails 51 arranged in parallel with the ball screw 50, a motor 52 connected to the upper end of the ball screw 50 to rotate the ball screw 50, An internal nut is screwed into the ball screw 50, and a side portion is provided with an elevating plate 53 slidingly contacting the guide rail 51. When the motor 52 rotates the ball screw 50, the elevating plate 53 is attached to the guide rail 51 accordingly. It is guided and reciprocates in the Z-axis direction, and the grinding means 7 fixed to the elevating plate 53 is ground and fed in the Z-axis direction.

保持手段3に保持された被加工物Wを研削加工する研削手段7は、軸方向がZ軸方向である回転軸70と、回転軸70を回転可能に支持するハウジング71と、回転軸70を回転駆動するモータ72と、回転軸70の下端に接続された円環状のマウント73と、マウント73の下面に着脱可能に装着された研削ホイール74と、ハウジング71を支持し研削送り手段5の昇降板53にその側面が固定されたホルダ75とを備える。   The grinding means 7 for grinding the workpiece W held by the holding means 3 includes a rotating shaft 70 whose axial direction is the Z-axis direction, a housing 71 rotatably supporting the rotating shaft 70, and a rotating shaft 70. A motor 72 that rotates, an annular mount 73 connected to the lower end of a rotating shaft 70, a grinding wheel 74 that is detachably mounted on the lower surface of the mount 73, and a housing 71 that supports the housing 71 and raises and lowers the grinding feed unit 5. A holder 75 having a side surface fixed to the plate 53 is provided.

研削ホイール74は、ホイール基台741と、ホイール基台741の底面に環状に配置された略直方体形状の複数の研削砥石740とを備える。研削砥石740は、例えば、レジンボンドやメタルボンド等でダイヤモンド砥粒等が固着されて成形されている。   The grinding wheel 74 includes a wheel base 741 and a plurality of substantially rectangular parallelepiped grinding wheels 740 arranged annularly on the bottom surface of the wheel base 741. The grinding wheel 740 is formed, for example, by bonding diamond abrasive grains or the like with a resin bond, a metal bond, or the like.

研削位置まで降下した状態の研削ホイール74に隣接する位置には、本発明に係る超音波水噴射装置2が配設されている。
図2に示す超音波振動を伝播させた水を噴射する超音波水噴射装置2は、例えば、水供給源22から供給される水を一時的に溜める筒状の水溜部20と、水溜部20の一方の端側(図2においては、+Z方向側)から水を噴射する噴射口21と、噴射口21に対向して水溜部20の他方の端側(図2においては、−Z方向側)に配設され水溜部20内の水に超音波振動を伝播させる超音波発振部23と、を少なくとも備えている。
An ultrasonic water injection device 2 according to the present invention is disposed at a position adjacent to the grinding wheel 74 that has been lowered to the grinding position.
The ultrasonic water jetting device 2 for jetting water propagated by ultrasonic vibration shown in FIG. 2 includes, for example, a cylindrical water reservoir 20 for temporarily storing water supplied from a water supply source 22 and a water reservoir 20. An injection port 21 for injecting water from one end side (+ Z direction side in FIG. 2), and the other end side of the water reservoir 20 opposed to the injection port 21 (−Z direction side in FIG. 2). And an ultrasonic oscillator 23 for transmitting ultrasonic vibrations to water in the water reservoir 20.

筒状の水溜部20は、例えば、SUS等からなり、例えば一方の端側の噴射口21に向けて徐々に縮径している。水溜部20の側壁200には水供給口200aが貫通形成されており、水供給口200aには開閉バルブ221を介して水供給源22が連通している。
なお、図3に示すように、水溜部20は噴射口21に向けて縮径していない形状であってもよい。
The cylindrical water reservoir 20 is made of, for example, SUS or the like, and gradually decreases in diameter, for example, toward the injection port 21 on one end side. A water supply port 200 a is formed through the side wall 200 of the water reservoir 20, and the water supply source 22 communicates with the water supply port 200 a via an on-off valve 221.
In addition, as shown in FIG. 3, the water reservoir 20 may have a shape that is not reduced in diameter toward the injection port 21.

超音波水噴射装置2は、水溜部20に一体的に連結し水溜部20よりも大径の筒状の胴体部24を備えている。胴体部24の自由端側(−Z方向側)には、超音波発振部23が進入する進入口240が形成されている。   The ultrasonic water injection device 2 includes a cylindrical body 24 integrally connected to the water reservoir 20 and having a diameter larger than that of the water reservoir 20. An entrance 240 into which the ultrasonic oscillator 23 enters is formed on the free end side (−Z direction side) of the body portion 24.

本実施形態における超音波発振部23は、例えば、所定の金属(例えば、チタン合金又はアルミ合金等)で構成される第1の円柱部25と、第1の円柱部25とZ軸方向に延在する中心軸を同じくして連結され第1の円柱部25の直径より大きい直径の第2の円柱部26と、第2の円柱部26の自由端側(−Z方向端側)に配設される超音波振動板29と、を備えている。   The ultrasonic oscillator 23 in the present embodiment includes, for example, a first columnar portion 25 made of a predetermined metal (for example, a titanium alloy or an aluminum alloy), and the first columnar portion 25 extending in the Z-axis direction. A second cylindrical portion 26 having the same central axis and connected to each other and having a diameter larger than the diameter of the first cylindrical portion 25, and disposed on the free end side (-Z direction end side) of the second cylindrical portion 26; And an ultrasonic vibration plate 29 to be used.

円柱形状の棒状体である第1の円柱部25は、水溜部20に非接触で収容されており、第2の円柱部26にその根元250が一体的に連結されている。第1の円柱部25の根元250の外周面は末広がりのR状の傾斜となるように形成されている。   The first cylindrical portion 25, which is a cylindrical rod-shaped body, is accommodated in the water reservoir 20 in a non-contact manner, and the base 250 is integrally connected to the second cylindrical portion 26. The outer peripheral surface of the base 250 of the first cylindrical portion 25 is formed so as to have an R-shaped slope that widens toward the end.

所定の金属で形成された第2の円柱部26は、その直径が、例えば第1の円柱部25の直径及び水溜部20の内径よりも大きく設定されており、胴体部24の天板241に円環板状のゴム板263を介して接触している。天板241に固定接着されたゴム板263は、シール部材としての役割を果たし、水供給口200aから水溜部20内に供給された水が胴体部24側に入り込むことを防ぐ。また、ゴム板263は、超音波発振部23全体の伸縮と共に伸縮して、胴体部24が超音波振動の増幅の妨げにならないようにしている。   The diameter of the second cylindrical portion 26 formed of a predetermined metal is set to be larger than, for example, the diameter of the first cylindrical portion 25 and the inner diameter of the water reservoir 20. They are in contact via a ring-shaped rubber plate 263. The rubber plate 263 fixed and bonded to the top plate 241 serves as a sealing member, and prevents water supplied from the water supply port 200a into the water reservoir 20 from entering the body 24 side. Further, the rubber plate 263 expands and contracts together with expansion and contraction of the entire ultrasonic oscillation unit 23 so that the body 24 does not hinder amplification of ultrasonic vibration.

本実施形態においては、超音波発振部23は、第1の円柱部25及び第2の円柱部26に加えて、さらに、第3の円柱部27及び第4の円柱部28を備えている。
所定の金属で構成され円柱形状の棒状体である第3の円柱部27は、例えば、第1の円柱部25と略同径の直径を備えており、その一端面(図2における+Z方向端面)が第2の円柱部26の自由端面26aに連結ネジ277によって連結されている。第3の円柱部27の他端側の根元270(図2における−Z方向端側)は、例えば、超音波振動板29の直径と略同径になるようにフランジ状に拡径されている。そして、第3の円柱部27の他端側には、第3の円柱部27よりも大径の金属製の連結板274が所定のろう付け部材等で接着固定されている。第3の円柱部27は、超音波振動板29から伝達されてきた超音波振動の振幅(振動の大きさ)を増減させて調整するブースターの役割を果たす。
In the present embodiment, the ultrasonic oscillator 23 further includes a third column 27 and a fourth column 28 in addition to the first column 25 and the second column 26.
The third columnar portion 27, which is a columnar rod-shaped body made of a predetermined metal, has, for example, a diameter substantially the same as that of the first columnar portion 25, and has one end face (the end face in the + Z direction in FIG. 2). ) Is connected to the free end surface 26 a of the second cylindrical portion 26 by a connecting screw 277. The root 270 (the end in the −Z direction in FIG. 2) at the other end of the third columnar portion 27 is, for example, expanded in a flange shape so as to have substantially the same diameter as the diameter of the ultrasonic vibration plate 29. . A metal connecting plate 274 having a diameter larger than that of the third cylindrical portion 27 is bonded and fixed to the other end of the third cylindrical portion 27 with a predetermined brazing member or the like. The third cylindrical portion 27 plays a role of a booster that increases and decreases the amplitude (magnitude of vibration) of the ultrasonic vibration transmitted from the ultrasonic vibration plate 29 to adjust.

連結板274には、超音波振動板29が接着固定されている。超音波振動板29は、電圧が印加されることで伸縮する板状の第1の圧電素子291及び第2の圧電素子292が重ねて接合されたものである。第1の圧電素子291及び第2の圧電素子292は、例えば、セラミックスの一種であるピエゾ素子である。また、第1の圧電素子291と第2の圧電素子292とには、それぞれ図示しない電極が取り付けられ、該電極及び配線293を介して交流電圧を印加して高周波電力を超音波振動板29に供給する電源295が接続されている。電源295によって所定の周波数で電圧の印加のオンとオフとを繰り返すことによって、第1の圧電素子291と第2の圧電素子292とにZ軸方向における伸縮運動を発生させることができる。そして、該伸縮運動が機械的な超音波振動となる。   The ultrasonic vibration plate 29 is bonded and fixed to the connection plate 274. The ultrasonic vibration plate 29 has a plate-shaped first piezoelectric element 291 and a second piezoelectric element 292 that expand and contract when a voltage is applied, and are joined together. The first piezoelectric element 291 and the second piezoelectric element 292 are, for example, piezo elements that are a kind of ceramics. An electrode (not shown) is attached to each of the first piezoelectric element 291 and the second piezoelectric element 292, and an AC voltage is applied to the first piezoelectric element 291 and the second piezoelectric element 292 to apply high-frequency power to the ultrasonic vibration plate 29 through the electrode and the wiring 293. The power supply 295 to be supplied is connected. By repeatedly turning on and off the application of the voltage at a predetermined frequency by the power supply 295, the first piezoelectric element 291 and the second piezoelectric element 292 can be caused to expand and contract in the Z-axis direction. Then, the expansion and contraction movement becomes mechanical ultrasonic vibration.

超音波振動板29上には、第4の円柱部28が配設されており、第4の円柱部28は、第3の円柱部27と螺合する固定ボルト283によって、超音波振動板29上に固定される。そして超音波振動板29は、第4の円柱部28と第3の円柱部27とによりZ軸方向両側からしっかりと挟まれた状態となっている。   A fourth cylindrical portion 28 is provided on the ultrasonic vibration plate 29, and the fourth cylindrical portion 28 is fixed to the ultrasonic vibration plate 29 by a fixing bolt 283 screwed with the third cylindrical portion 27. Fixed on top. The ultrasonic vibration plate 29 is firmly sandwiched between the fourth cylindrical portion 28 and the third cylindrical portion 27 from both sides in the Z-axis direction.

胴体部24の底板242の下面側には、環状のゴム板275が接着固定されており、超音波発振部23が水溜部20と胴体部24とに挿入された状態において、超音波発振部23の連結板274が該ゴム板275に当接する。連結板274の外周側の領域にはネジ穴274aが周方向に均等に複数形成されている。そして、図示しない固定ネジがネジ穴274aに挿入され、ゴム板275及び胴体部24の底板242の図示しないネジ孔に螺合することで、超音波発振部23が胴体部24に固定された状態になる。
なお、図2に示すように、第3の円柱部27の根元270の外周面は、胴体部24に直に接触していない状態となっている。
なお、超音波水噴射装置2は、図4に示すように、胴体部24、連結板274、及びゴム板275を備えない構成でもよい。この場合においては、超音波発振部23は、ゴム板263を介して水溜部20の下端面に接着固定されている。
An annular rubber plate 275 is adhered and fixed to the lower surface side of the bottom plate 242 of the body portion 24. When the ultrasonic oscillation portion 23 is inserted into the water reservoir 20 and the body portion 24, the ultrasonic oscillation portion 23 Is in contact with the rubber plate 275. A plurality of screw holes 274a are formed uniformly in the circumferential direction in an outer peripheral region of the connection plate 274. Then, a fixing screw (not shown) is inserted into the screw hole 274 a and screwed into a screw hole (not shown) of the rubber plate 275 and the bottom plate 242 of the body 24, so that the ultrasonic oscillation unit 23 is fixed to the body 24. become.
In addition, as shown in FIG. 2, the outer peripheral surface of the root 270 of the third columnar portion 27 is not in direct contact with the body portion 24.
In addition, as shown in FIG. 4, the ultrasonic water injection device 2 may be configured not to include the body 24, the connecting plate 274, and the rubber plate 275. In this case, the ultrasonic oscillator 23 is bonded and fixed to the lower end surface of the water reservoir 20 via the rubber plate 263.

超音波発振部23においては、Z軸方向の振幅が0になるノード点と呼ばれる波長の節の部分が存在する。そして、超音波水噴射装置2は、水溜部20及び胴体部24の長手方向長さや内径、並びに、超音波発振部23を構成する第1の円柱部25、第2の円柱部26、及び第3の円柱部27の長手方向長さや直径を所定の大きさに設定することで、水溜部20に第1の円柱部25を収容させ、水溜部20を形成する側壁200を超音波発振部23の長手方向(Z軸方向)において超音波振動がゼロになる部分に接続させている。また、本実施形態においては、胴体部24の側壁を超音波発振部23の長手方向(Z軸方向)において超音波振動がゼロになる部分に接続させている。
なお、図4に示す胴体部24を備えない超音波水噴射装置2においても同様に、水溜部20に第1の円柱部25を収容させ、水溜部20を形成する側壁200を超音波発振部23の長手方向(Z軸方向)において超音波振動がゼロになる部分に接続させている。
In the ultrasonic oscillation unit 23, there is a node portion of a wavelength called a node point where the amplitude in the Z-axis direction becomes zero. Then, the ultrasonic water spraying device 2 includes the first cylindrical portion 25, the second cylindrical portion 26, and the first cylindrical portion 25, which constitute the ultrasonic oscillating portion 23, and the longitudinal lengths and inner diameters of the water reservoir 20 and the body 24. By setting the length and diameter of the cylindrical portion 27 in the longitudinal direction to a predetermined size, the first cylindrical portion 25 is housed in the water reservoir 20, and the side wall 200 forming the water reservoir 20 is connected to the ultrasonic oscillator 23. Is connected to a portion where the ultrasonic vibration becomes zero in the longitudinal direction (Z-axis direction). In the present embodiment, the side wall of the body 24 is connected to a portion where the ultrasonic vibration becomes zero in the longitudinal direction (Z-axis direction) of the ultrasonic oscillator 23.
In the ultrasonic water jetting device 2 without the body portion 24 shown in FIG. 4, similarly, the first cylindrical portion 25 is housed in the water reservoir 20, and the side wall 200 forming the water reservoir 20 is formed by the ultrasonic oscillator. 23 is connected to a portion where the ultrasonic vibration becomes zero in the longitudinal direction (Z-axis direction).

例えば、図2に示す超音波水噴射装置2の第1の円柱部25の長さ:第2の円柱部26の長さ:第3の円柱部27の長さ:第3の円柱部27の根元270の長さ=56.5:57.1:59.0:9.0である。
また、第1の円柱部25の直径:第2の円柱部26の直径:第3の円柱部27の直径:第3の円柱部27の根元270の直径:第4の円柱部28の直径=25:45:25:42:42である。
なお、上記各円柱部の長さの比や各円柱部の直径の比は、一例であってこれに限定されるものではなく、例えば、第1の円柱部25の根元250の外周面の末広がりのR状の傾斜の角度等によっても変化する。
For example, the length of the first cylindrical portion 25 of the ultrasonic water injection device 2 shown in FIG. 2: the length of the second cylindrical portion 26: the length of the third cylindrical portion 27: the length of the third cylindrical portion 27 The length of the root 270 = 56.5: 57.1: 59.0: 9.0.
Also, the diameter of the first cylindrical portion 25: the diameter of the second cylindrical portion 26: the diameter of the third cylindrical portion 27: the diameter of the root 270 of the third cylindrical portion 27: the diameter of the fourth cylindrical portion 28 = 25: 45: 25: 42: 42.
The ratio of the length of each of the cylindrical portions and the ratio of the diameter of each of the cylindrical portions is an example, and is not limited thereto. For example, the end portion of the outer peripheral surface of the root 250 of the first cylindrical portion 25 may be widened. Also changes depending on the angle of the R-shaped inclination.

図2では、超音波発振部23における超音波の強さを示す振動分布も合わせて示している。超音波振動板29で発生した振動(Z軸方向の振動)は、ブースターである第3の円柱部27によって共振することで増幅され第2の円柱部26に伝えられる。図2中、(B)は超音波振動における腹の位置であり、(A)は超音波振動における節の位置(ノード点の位置)を示している。即ち、腹の位置はZ軸方向の振幅が最大(超音波振動が最大)であり、節の位置はZ軸方向の振幅が最小(超音波振動が最小)となる。   FIG. 2 also shows a vibration distribution indicating the intensity of the ultrasonic wave in the ultrasonic oscillation unit 23. The vibration (vibration in the Z-axis direction) generated by the ultrasonic vibration plate 29 is amplified by being resonated by the third cylindrical portion 27 which is a booster, and transmitted to the second cylindrical portion 26. In FIG. 2, (B) shows the position of the antinode in the ultrasonic vibration, and (A) shows the position of the node (the position of the node point) in the ultrasonic vibration. That is, the position of the antinode has the maximum amplitude in the Z-axis direction (the maximum ultrasonic vibration), and the position of the node has the minimum amplitude in the Z-axis direction (the minimum ultrasonic vibration).

さらに、第2の円柱部26から第1の円柱部25に伝達された超音波振動は、第1の円柱部25内においても増幅されて第1の円柱部25の上端面から水溜部20内の水に伝播する。   Further, the ultrasonic vibration transmitted from the second columnar portion 26 to the first columnar portion 25 is also amplified in the first columnar portion 25, and is amplified from the upper end surface of the first columnar portion 25 to the water reservoir 20. Of water.

本発明に係る超音波水噴射装置は、上記超音波水噴射装置2に限定されるものではなく、図5に示す超音波水噴射装置2Aであってもよい。超音波水噴射装置2Aは、図2に示す超音波水噴射装置2の構成の一部を変更したものである。即ち、超音波水噴射装置2Aの超音波発振部23Aは先に説明した超音波発振部23と異なり、ブースターとしての役割を果たす第3の円柱部27を備えない構成となっている。これに合わせて、超音波水噴射装置2Aは、胴体部24を備えない構成となっている。   The ultrasonic water injection device according to the present invention is not limited to the ultrasonic water injection device 2, but may be an ultrasonic water injection device 2A shown in FIG. The ultrasonic water injection device 2A is obtained by changing a part of the configuration of the ultrasonic water injection device 2 shown in FIG. That is, unlike the ultrasonic oscillator 23 described above, the ultrasonic oscillator 23A of the ultrasonic water injection device 2A does not include the third columnar portion 27 serving as a booster. In accordance with this, the ultrasonic water jetting device 2 </ b> A does not include the body portion 24.

超音波水噴射装置2Aにおいては、第2の円柱部26の自由端面26aに超音波振動板29が、例えば、固定ボルト283によって固定されている。なお、超音波振動板29は、第2の円柱部26の自由端面26aにろう付けされていてもよい。そして、水溜部20の側壁200の下端面(−Z方向側面)に、第2の円柱部26がゴム板263を介して接着固定された状態になっている。そして、水溜部20に第1の円柱部25を収容させ、水溜部20を形成する側壁200を超音波発振部23Aの長手方向(Z軸方向)において超音波振動がゼロになる部分に接続させている。   In the ultrasonic water jetting device 2A, an ultrasonic vibration plate 29 is fixed to the free end surface 26a of the second cylindrical portion 26 by, for example, a fixing bolt 283. The ultrasonic vibration plate 29 may be brazed to the free end surface 26a of the second cylindrical portion 26. The second cylindrical portion 26 is bonded and fixed to the lower end surface (side surface in the −Z direction) of the side wall 200 of the water reservoir 20 via the rubber plate 263. Then, the first cylindrical portion 25 is housed in the water reservoir 20, and the side wall 200 forming the water reservoir 20 is connected to a portion where ultrasonic vibration becomes zero in the longitudinal direction (Z-axis direction) of the ultrasonic oscillator 23A. ing.

図5では、超音波発振部23Aにおける超音波の強さを示す振動分布も合わせて示している。図5中、(B)は超音波振動における腹の位置であり、(A)は超音波振動における節の位置(ノード点の位置)を示している。即ち、腹の位置は振幅が最大(超音波振動が最大)であり、節の位置は振幅が最小(超音波振動が最小)となる。   FIG. 5 also shows a vibration distribution indicating the intensity of the ultrasonic wave in the ultrasonic oscillation unit 23A. In FIG. 5, (B) shows the position of the antinode in the ultrasonic vibration, and (A) shows the position of the node (the position of the node point) in the ultrasonic vibration. That is, the position of the antinode has the maximum amplitude (the maximum ultrasonic vibration), and the position of the node has the minimum amplitude (the minimum ultrasonic vibration).

超音波発振部23Aの超音波振動板29で発生した振動(Z軸方向の振動)は、第2の円柱部26に伝達され、さらに、第1の円柱部25内において増幅されて第1の円柱部25の上端面から水溜部20内の水に伝播する。
なお、第1の円柱部25の各寸法を適切な長さ及び適切な直径等に設定することで、第1の円柱部25内でも超音波振動の振幅の増減を行う事が上記に示したように可能であるが、図2に示す超音波水噴射装置2のようにブースターとしての役割を果たす第3の円柱部27を備えることで、より広範囲に超音波振動の振幅を調整することが可能となる。
The vibration (vibration in the Z-axis direction) generated by the ultrasonic vibration plate 29 of the ultrasonic oscillation unit 23A is transmitted to the second cylindrical part 26, and further amplified in the first cylindrical part 25 to be amplified in the first cylindrical part 25. The water propagates from the upper end surface of the cylindrical portion 25 to the water in the water reservoir 20.
In addition, as described above, the amplitude of the ultrasonic vibration is increased or decreased even in the first cylindrical portion 25 by setting each dimension of the first cylindrical portion 25 to an appropriate length and an appropriate diameter. Although it is possible as described above, the amplitude of the ultrasonic vibration can be adjusted over a wider range by providing the third cylindrical portion 27 serving as a booster as in the ultrasonic water injection device 2 shown in FIG. It becomes possible.

以下に、図1に示す研削装置1により保持手段3に保持された被加工物Wを研削する場合の、研削装置1の動作及び超音波水噴射装置2の動作について説明する。
図1に示す被加工物Wは、例えば、外形が円形板状の半導体ウエーハであり、被加工物Wの裏面Wbが、研削加工が施される被研削面となる。デバイス等が形成されている被加工物Wの表面Waは、図示しない保護テープが貼着されて保護されている。
The operation of the grinding device 1 and the operation of the ultrasonic water jet device 2 when the workpiece W held by the holding means 3 is ground by the grinding device 1 shown in FIG. 1 will be described below.
The workpiece W shown in FIG. 1 is, for example, a semiconductor wafer having an outer shape of a circular plate, and a back surface Wb of the workpiece W is a ground surface to be ground. The front surface Wa of the workpiece W on which devices and the like are formed is protected by attaching a protection tape (not shown).

まず、着脱領域内において、被加工物Wが、裏面Wbが上側になるように保持手段3の保持面30a上に載置される。そして、図示しない吸引源により生み出される吸引力が保持面30aに伝達され、保持手段3が保持面30a上で被加工物Wを吸引保持する。   First, in the attachment / detachment area, the workpiece W is placed on the holding surface 30a of the holding means 3 so that the back surface Wb is on the upper side. Then, a suction force generated by a suction source (not shown) is transmitted to the holding surface 30a, and the holding means 3 suction-holds the workpiece W on the holding surface 30a.

次いで、被加工物Wを保持した保持手段3が、着脱領域から研削領域内の研削手段7の下まで+Y方向へ移動し、研削砥石740に対して被加工物Wが所定の位置に位置付けられる。該位置付けは、例えば、研削砥石740の回転中心が被加工物Wの回転中心に対して所定の距離だけ水平方向にずれ、研削砥石740の回転軌跡が被加工物Wの回転中心を通るように行われる。また、モータ72が回転軸70を回転駆動し、これに伴って研削ホイール74も回転する。研削手段7が研削送り手段5により−Z方向へと送られ、回転する研削砥石740が被加工物Wの裏面Wbに当接することで研削が行われる。研削中は、保持手段3が回転するのに伴って、保持面30a上に保持された被加工物Wも回転するので、研削砥石740が被加工物Wの裏面Wbの全面の研削加工を行う。   Next, the holding means 3 holding the workpiece W moves in the + Y direction from the attachment / detachment area to below the grinding means 7 in the grinding area, and the workpiece W is positioned at a predetermined position with respect to the grinding wheel 740. . The positioning is performed, for example, such that the rotation center of the grinding wheel 740 is horizontally shifted by a predetermined distance with respect to the rotation center of the workpiece W, and the rotation locus of the grinding wheel 740 passes through the rotation center of the workpiece W. Done. Further, the motor 72 drives the rotation shaft 70 to rotate, and accordingly, the grinding wheel 74 also rotates. The grinding unit 7 is fed in the −Z direction by the grinding feed unit 5, and the rotating grinding wheel 740 comes into contact with the back surface Wb of the workpiece W to perform grinding. During the grinding, the workpiece W held on the holding surface 30a also rotates as the holding means 3 rotates, so that the grinding wheel 740 performs the entire grinding of the back surface Wb of the workpiece W. .

図6に示すように、研削加工中においては、研削中の被加工物Wからはみ出した研削砥石740の研削面(下端面)に対して超音波水噴射装置2の上端である噴射口21が対向する。そして、水供給源22から洗浄水が所定の流量で超音波水噴射装置2の水溜部20に供給される。水溜部20においては、噴射口21から水が+Z方向に向かって噴射されると共に、水が水溜部20内に所定量常に溜められる。   As shown in FIG. 6, during the grinding, the injection port 21 which is the upper end of the ultrasonic water injection device 2 is placed on the ground surface (lower end surface) of the grinding wheel 740 protruding from the workpiece W being ground. opposite. Then, the washing water is supplied from the water supply source 22 to the water reservoir 20 of the ultrasonic water injection device 2 at a predetermined flow rate. In the water reservoir 20, water is injected from the injection port 21 in the + Z direction, and water is constantly stored in the water reservoir 20 by a predetermined amount.

また、電源295から、例えば、周波数16kHzから80kHzの高周波電力が超音波振動板29に供給されることで、超音波振動板29に交流電圧が印加されて、超音波振動板29がZ軸方向に振動する。   Further, when high-frequency power having a frequency of, for example, 16 kHz to 80 kHz is supplied to the ultrasonic vibration plate 29 from the power supply 295, an AC voltage is applied to the ultrasonic vibration plate 29, and the ultrasonic vibration plate 29 is moved in the Z-axis direction. Vibrates.

先に説明したとおりに、超音波振動板29は発振した超音波振動が第1の円柱部25に至るまでに増幅されて第1の円柱部25の上端面から水溜部20内の水に伝播する。その結果、噴射口21から噴射される水が超音波振動を伴う超音波水となる。なお、超音波振動は、超音波水の噴射方向の所定範囲(例えば、噴射口21から+Z方向に向かって幅数ミリ〜数十ミリ程度の範囲)内で発生する。例えば、この所定範囲の中間領域に研削砥石740の研削面が位置するように、超音波水噴射装置2のZ軸方向の位置が図示しない移動手段によって可変となっていてもよい。   As described above, the ultrasonic vibration plate 29 amplifies the oscillated ultrasonic vibration before reaching the first cylindrical portion 25 and propagates the water from the upper end surface of the first cylindrical portion 25 to the water in the water reservoir 20. I do. As a result, the water injected from the injection port 21 becomes ultrasonic water accompanied by ultrasonic vibration. The ultrasonic vibration is generated within a predetermined range of the ultrasonic water jetting direction (for example, a range of several millimeters to several tens of millimeters in width from the injection port 21 in the + Z direction). For example, the position of the ultrasonic water injection device 2 in the Z-axis direction may be made variable by a moving unit (not shown) so that the grinding surface of the grinding wheel 740 is located in the intermediate region of the predetermined range.

超音波水噴射装置2から研削砥石740の研削面に噴射された水に超音波振動が伝播されていることで、研削砥石740の研削面に目詰まりした研削屑のような大きな汚れのみならず、例えば研削砥石740の目つぶれにより研削面から砥石内部にまで食い込んだ研削屑をも除去して研削砥石740の研削力を維持しつつ、被加工物Wを所望の研削厚みまで研削することができる。   Since the ultrasonic vibration is propagated to the water jetted from the ultrasonic water jetting device 2 to the grinding surface of the grinding wheel 740, not only large dirt such as grinding dust clogged on the grinding surface of the grinding wheel 740, but also For example, it is possible to grind the workpiece W to a desired grinding thickness while maintaining the grinding force of the grinding wheel 740 by also removing grinding debris that has penetrated from the grinding surface to the inside of the grinding wheel due to the grinding of the grinding wheel 740. it can.

上記のように図2、図6に示す本発明に係る超音波水噴射装置2又は図5に示す超音波水噴射装置2Aは、水供給源22から供給される水を一時的に溜める筒状の水溜部20と、水溜部20の一方の端側から水を噴射する噴射口21と、噴射口21に対向して水溜部20の他方の端側に配設され水溜部20内の水に超音波振動を伝播させる超音波発振部23と、を備え、超音波発振部23は、第1の円柱部25と、第1の円柱部25と中心軸を同じくして連結され第1の円柱部25の直径より大きい直径の第2の円柱部26と、第2の円柱部26の自由端側に配設される超音波振動板29と、を備え、水溜部20に第1の円柱部25を収容させ、水溜部20を形成する側壁200を超音波発振部23の長手方向において超音波振動がゼロになる部分に接続させているため、大きな振幅の超音波振動を水に伝播させる事ができる。また、大きな振幅の超音波振動を伝播させた水を被洗浄物である研削砥石740に噴射し、従来の超音波ノズルでは除去できなかった研削屑のような大きなゴミを除去することが可能となる。
なお、図2に示すように超音波水噴射装置2においては、胴体部24の側壁も超音波発振部23の長手方向(Z軸方向)において超音波振動がゼロになる部分に接続させているため、超音波振動板29が大きな振幅の超音波を水に伝播させ、キャビテーションにより水に細かい気泡を発生させ洗浄効果を向上させている。
As described above, the ultrasonic water jetting device 2 according to the present invention shown in FIGS. 2 and 6 or the ultrasonic water jetting device 2A shown in FIG. 5 has a cylindrical shape for temporarily storing water supplied from the water supply source 22. A water reservoir 20, a jet 21 for injecting water from one end of the water reservoir 20, and a water in the water reservoir 20 disposed at the other end of the water reservoir 20 facing the jet 21. An ultrasonic oscillator 23 for transmitting ultrasonic vibrations, wherein the ultrasonic oscillator 23 is connected to the first cylindrical portion 25 and the first cylindrical portion 25 with the same central axis as the first cylindrical portion. A second cylindrical portion having a diameter larger than the diameter of the portion; and an ultrasonic vibration plate disposed on a free end side of the second cylindrical portion; The ultrasonic vibration is reduced to zero in the longitudinal direction of the ultrasonic oscillating section 23 by holding the side wall 200 forming the water basin 20. Since the is connected to a portion, ultrasonic vibration of a large amplitude can be propagated in water. In addition, it is possible to remove water that has propagated ultrasonic vibration having a large amplitude onto a grinding wheel 740, which is an object to be cleaned, to remove large dust such as grinding dust that could not be removed by a conventional ultrasonic nozzle. Become.
As shown in FIG. 2, in the ultrasonic water injection device 2, the side wall of the body portion 24 is also connected to a portion where the ultrasonic vibration becomes zero in the longitudinal direction (Z-axis direction) of the ultrasonic oscillator 23. Therefore, the ultrasonic vibration plate 29 transmits ultrasonic waves having a large amplitude to the water, and fine bubbles are generated in the water by cavitation, thereby improving the cleaning effect.

なお、本発明に係る超音波水噴射装置は上記3つの例に限定されるものではなく、また、添付図面に図示されている超音波水噴射装置2、胴体部24を備えない超音波水噴射装置2、及び超音波水噴射装置2Aの各構成の形状や大きさ等についても、これに限定されず、本発明の効果を発揮できる範囲内で適宜変更可能である。
また、上記実施形態では、研削砥石740の下面を被洗浄物としているが、保持テーブルに保持されたウエーハ等の被加工物の上面に本発明に係る超音波水噴射装置から超音波水を噴射させて、被加工物の上面を洗浄してもよい。
The ultrasonic water injection device according to the present invention is not limited to the above three examples, and the ultrasonic water injection device 2 shown in the accompanying drawings and the ultrasonic water injection device without the body 24 are not shown. The shape, size, and the like of each component of the device 2 and the ultrasonic water injection device 2A are not limited thereto, and can be appropriately changed as long as the effects of the present invention can be exhibited.
In the above embodiment, the lower surface of the grinding wheel 740 is used as the object to be cleaned. However, ultrasonic water is sprayed from the ultrasonic water spray device according to the present invention onto the upper surface of a workpiece such as a wafer held on a holding table. Then, the upper surface of the workpiece may be cleaned.

1:研削装置 10:ベース 11:コラム
3:保持手段 30:吸着部 31:枠体 39:カバー
5:研削送り手段 50:ボールネジ 51:ガイドレール 52:モータ 53:昇降板
7:研削手段 70:回転軸 71:ハウジング 72:モータ 73:マウント
74:研削ホイール 75:ホルダ
2:超音波水噴射装置 20:水溜部 200:側壁 200a:水供給口 21:噴射口
24:胴体部 240:進入口
23:超音波発振部
25:第1の円柱部
26:第2の円柱部 263:ゴム板
27:第3の円柱部 274:連結板 275:ゴム板 277:連結ねじ
28:第4の円柱部 283:固定ボルト
29:超音波振動板 291:第1の圧電素子 292:第2の圧電素子 293:配線 295:電源
2A:超音波水噴射装置
1: grinding device 10: base 11: column 3: holding means 30: suction unit 31: frame body 39: cover
5: Grinding feed means 50: Ball screw 51: Guide rail 52: Motor 53: Elevating plate 7: Grinding means 70: Rotating shaft 71: Housing 72: Motor 73: Mount
74: grinding wheel 75: holder 2: ultrasonic water injection device 20: water reservoir 200: side wall 200a: water supply port 21: injection port
24: body part 240: entrance 23: ultrasonic oscillation part
25: 1st column part
26: second cylindrical portion 263: rubber plate 27: third cylindrical portion 274: connecting plate 275: rubber plate 277: connecting screw 28: fourth cylindrical portion 283: fixing bolt 29: ultrasonic vibration plate 291: first 1st piezoelectric element 292: 2nd piezoelectric element 293: Wiring 295: Power supply 2A: Ultrasonic water injection device

Claims (2)

超音波振動を伝播させた水を噴射する超音波水噴射装置であって、
水供給源から供給される水を一時的に溜める筒状の水溜部と、該水溜部の一方の端側から水を噴射する噴射口と、該噴射口に対向して該水溜部の他方の端側に配設され該水溜部内の水に超音波振動を伝播させる超音波発振部と、を備え、
該超音波発振部は、第1の円柱部と、該第1の円柱部と中心軸を同じくして連結され該第1の円柱部の直径より大きい直径の第2の円柱部と、該第2の円柱部の自由端側に配設される超音波振動板と、を備え、
該水溜部に該第1の円柱部を収容させ、該超音波水噴射装置を形成する側壁を該超音波発振部の長手方向において超音波振動がゼロになる部分に接続させた超音波水噴射装置。
An ultrasonic water injection device that injects water propagated by ultrasonic vibration,
A cylindrical water reservoir for temporarily storing water supplied from a water supply source, an injection port for injecting water from one end of the water storage, and the other of the water storage opposed to the injection port. An ultrasonic oscillator that is disposed on the end side and propagates ultrasonic vibration to water in the water reservoir,
The ultrasonic oscillating portion includes a first columnar portion, a second columnar portion having the same central axis as the first columnar portion, and having a diameter larger than the diameter of the first columnar portion. An ultrasonic vibration plate disposed on the free end side of the second cylindrical portion,
Ultrasonic water injection wherein the first cylindrical portion is accommodated in the water reservoir, and a side wall forming the ultrasonic water injection device is connected to a portion where ultrasonic vibration is zero in the longitudinal direction of the ultrasonic oscillation portion. apparatus.
16kHzから80kHzの高周波電力を前記超音波振動板に供給する請求項1記載の超音波水噴射装置。   The ultrasonic water injection device according to claim 1, wherein high-frequency power of 16 kHz to 80 kHz is supplied to the ultrasonic vibration plate.
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153766A (en) * 1974-11-07 1976-05-12 Kaijo Denki Kk NOZURUGATACHOONPASENJOSOCHI
JPS55153150U (en) * 1979-04-17 1980-11-05
JPS60183067U (en) * 1984-05-15 1985-12-04 株式会社村田製作所 ultrasonic nozzle
JPH08215621A (en) * 1995-02-10 1996-08-27 Sanden Corp Ultrasonic atomizer
JP2003340387A (en) * 2002-05-23 2003-12-02 Noritz Corp Cleaning apparatus
JP2007190522A (en) * 2006-01-20 2007-08-02 Matsushita Electric Works Ltd Ultrasonic cleaning apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5153766A (en) * 1974-11-07 1976-05-12 Kaijo Denki Kk NOZURUGATACHOONPASENJOSOCHI
JPS55153150U (en) * 1979-04-17 1980-11-05
JPS60183067U (en) * 1984-05-15 1985-12-04 株式会社村田製作所 ultrasonic nozzle
JPH08215621A (en) * 1995-02-10 1996-08-27 Sanden Corp Ultrasonic atomizer
JP2003340387A (en) * 2002-05-23 2003-12-02 Noritz Corp Cleaning apparatus
JP2007190522A (en) * 2006-01-20 2007-08-02 Matsushita Electric Works Ltd Ultrasonic cleaning apparatus

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