JP2020039717A5 - - Google Patents
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- JP2020039717A5 JP2020039717A5 JP2018170988A JP2018170988A JP2020039717A5 JP 2020039717 A5 JP2020039717 A5 JP 2020039717A5 JP 2018170988 A JP2018170988 A JP 2018170988A JP 2018170988 A JP2018170988 A JP 2018170988A JP 2020039717 A5 JP2020039717 A5 JP 2020039717A5
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- JP
- Japan
- Prior art keywords
- substrate
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- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 238000007747 plating Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000005034 decoration Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018170988A JP6982368B2 (ja) | 2018-09-12 | 2018-09-12 | 遊技機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018170988A JP6982368B2 (ja) | 2018-09-12 | 2018-09-12 | 遊技機 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020039717A JP2020039717A (ja) | 2020-03-19 |
| JP2020039717A5 true JP2020039717A5 (enrdf_load_stackoverflow) | 2021-05-06 |
| JP6982368B2 JP6982368B2 (ja) | 2021-12-17 |
Family
ID=69796957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018170988A Active JP6982368B2 (ja) | 2018-09-12 | 2018-09-12 | 遊技機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6982368B2 (enrdf_load_stackoverflow) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009089888A (ja) * | 2007-10-09 | 2009-04-30 | Nippon Pachinko Buhin Kk | 遊技機 |
| JP5263809B2 (ja) * | 2007-10-12 | 2013-08-14 | サミー株式会社 | 表示用基板及び遊技機 |
| JP4999206B2 (ja) * | 2009-11-27 | 2012-08-15 | 京楽産業．株式会社 | 遊技機 |
| JP5758092B2 (ja) * | 2010-08-20 | 2015-08-05 | 株式会社三共 | 遊技機 |
| JP5470428B2 (ja) * | 2012-09-19 | 2014-04-16 | 京楽産業．株式会社 | 遊技機 |
| JP6016967B2 (ja) * | 2015-03-23 | 2016-10-26 | 株式会社三共 | 遊技機 |
| JP6215870B2 (ja) * | 2015-06-15 | 2017-10-18 | 株式会社ニューギン | 遊技機 |
| JP6796792B2 (ja) * | 2016-08-24 | 2020-12-09 | パナソニックＩｐマネジメント株式会社 | 温度検出装置 |
| JP6839346B2 (ja) * | 2016-10-21 | 2021-03-10 | サミー株式会社 | 遊技機 |
| JP6437022B2 (ja) * | 2017-01-31 | 2018-12-12 | 株式会社大一商会 | 遊技機 |
| JP6824589B2 (ja) * | 2018-02-26 | 2021-02-03 | 株式会社大一商会 | 遊技機 |
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2018
- 2018-09-12 JP JP2018170988A patent/JP6982368B2/ja active Active