JP2020039448A - Game machine - Google Patents

Abstract

To provide a game machine capable of preferably bending a flexible cable.SOLUTION: The game machine comprises a connection wiring member 50SG01 capable of connecting an image display device 5 and a presentation control board 12. The connection wiring member 50SG01 includes a first bent portion 50SG81 and a second bent portion 50SG82 which are caused to be in a bent state so that the routing direction of the connection wiring member 50SG01 can be switched in a state connected to the image display device 5 and the presentation control board 12. At positions corresponding to the first bent portion 50SG81 and the second bent portion 50SG82 in the connection wiring member 50SG01, first cutout recesses 50SG61A, 50SG61B, 50SG61A', 50SG61B' and second cutout recesses 50SG62A, 50SG62B, 50SG62A', 50SG62B' are provided.SELECTED DRAWING: Figure 41

Description

  The present invention relates to a gaming machine capable of playing a game.

  Some gaming machines, such as pachinko gaming machines and slot machines, use a flexible cable having flexibility as connection means for electrically connecting a plurality of electric components.

  In a game machine of this type, when a flexible cable is provided with a bent portion for length adjustment, a mark is provided at a predetermined position on the flexible cable in order to suppress variation in the bent position between individual flexible cables. There is a device in which a bent portion is provided on the basis of (for example, see Patent Document 1).

JP-A-2006-131659

  In the gaming machine described in Patent Literature 1, the mark only specifies the bending position, and is not for bending the flexible cable suitably.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide a gaming machine capable of suitably bending a flexible cable.

The gaming machine of the means 1 is
A gaming machine capable of playing a game (for example, a pachinko gaming machine 1),
A connection unit (for example, a connection wiring member 50SG01 or the like) capable of connecting a plurality of electric components (for example, the image display device 5 and the effect control board 12);
The connecting means has a bent portion (for example, a first bent portion 50SG81 or a second bent portion 50SG82) which is bent to switch the drawing direction of the connecting portion in a state where the connecting portion is connected to the plurality of electric components. And
A cutout portion (for example, first cutout recesses 50SG61A, 50SG61B, 50SG61A ', 50SG61B', and second cutout recesses 50SG62A, 50SG62B, 50SG62A ', 50SG62B') is provided at a position corresponding to the bent portion in the connection means (FIG. 41). , See FIG. 42)
It is characterized by:
According to this feature, the connection means is easily bent at the bent portion by the cutout portion, so that workability can be improved and the quality is stabilized.

The gaming machine according to the second aspect is the gaming machine according to the first aspect,
The cutouts (for example, the first cutouts 50SG61A, 50SG61B, 50SG61A ', 50SG61B', the second cutouts 50SG62A, 50SG62B, 50SG62A ', 50SG62B') are formed at the edges of the connection means (for example, the wiring pattern 50SG10). The outer edge 50SG50 and the outer edge 50SG51 of the wiring pattern 50SG2G are provided (see FIG. 42).
It is characterized by:
According to this feature, the notch can be provided so as not to affect the wiring.

The gaming machine of the means 3 is the gaming machine according to the means 1 or 2,
The notch,
A first notch (for example, first notch 50SG61A, 50SG61A ', a second notch) provided at a first edge (for example, outer edge 50SG50 of wiring pattern 50SG10) of the connection means (for example, connection wiring member 50SG01). Notched recesses 50SG62A, 50SG62A '),
A second notch (for example, the first notch) provided on a second edge (for example, the outer edge 50SG51 of the wiring pattern 50SG2G) opposite to the first edge of the connection means, corresponding to the first notch. Notch recesses 50SG61B, 50SG61B ', second notch recesses 50SG62B, 50SG62B'),
It is characterized by having.
According to this feature, since it is possible to bend in accordance with the first cutout and the second cutout, it is possible to bend accurately in the routing direction.

The gaming machine of the means 4 is the gaming machine according to any one of the means 1 to 3,
The connection means (for example, the connection wiring member 50SG01) has a conductor portion (for example, a wiring pattern 50SG10, 50SG2G, a ground layer 50SG3G, etc.) different from the signal wiring,
The notch portions (for example, the first notch concave portions 50SG61A, 50SG61B, 50SG61A ', 50SG61B', and the second notch concave portions 50SG62A, 50SG62B, 50SG62A ', 50SG62B') are provided in the conductor portion (see FIG. 41).
It is characterized by:
According to this feature, the width of the conductor is reduced by the notch, so that the conductor is easily bent.

The gaming machine of the means 5 is the gaming machine according to any one of the means 1 to 4,
The connection means (for example, the connection wiring member 50SG01 or the like) is routed in the bent portion (for example, the second bent portion 50SG82) in a direction obliquely intersecting the edge of the connection means,
The cutout portions (for example, the second cutout recesses 50SG62A, 50SG62B, 50SG62A ', 50SG62B') are formed obliquely with respect to the edge (for example, the outer edge 50SG01E) of the connection means (see FIG. 42).
It is characterized by:
According to this feature, the notch is formed along the fold, so that it is easy to bend.

The gaming machine of the means 6 is the gaming machine according to any of the means 1 to 5,
The connection means (for example, the connection wiring member 50SG01 and the like) is routed in the bent portion (for example, the second bent portion 50SG82) in a direction obliquely intersecting the edge (for example, the outer edge 50SG01E) of the connection means. And
The notch,
A first notch (for example, a second notch 50SG62A, 50SG62A ') provided at a first edge (for example, an outer edge 50SG50 of the wiring pattern 50SG10) of the connection means;
A second notch (for example, provided at a position other than a position facing the first notch at a second edge (for example, an outer edge 50SG51 of the wiring pattern 50SG2G) opposite to the first edge of the connection means). Second notch recesses 50SG62B, 50SG62B '),
(See FIG. 42)
It is characterized by:
According to this feature, it is possible to prevent the wiring from being narrowed by the first cutout and the second cutout.

The gaming machine of the means 7 is the gaming machine according to any one of the means 1 to 6,
The cutouts (for example, the first cutouts 50SG61A, 50SG61B, 50SG61A ', 50SG61B', the second cutouts 50SG62A, 50SG62B, 50SG62A ', 50SG62B') pass through the connection means (for example, the connection wiring member 50SG01). It is provided so as to be bent at a position that does not correspond to a hole (for example, through-hole 50SG1H, 50SG2H, etc.) (see FIG. 42).
It is characterized by:
According to this feature, the conductor portion can be prevented from being narrowed by the cutout portion and the through hole.

  Incidentally, the present invention may have only the matters specifying the invention described in the claims of the present invention, or may have a configuration other than the matters specifying the invention together with the matters specifying the invention described in the claims of the present invention. May be included.

It is a front view of the pachinko gaming machine in this embodiment. It is a block diagram showing various control boards and the like mounted on the pachinko gaming machine. It is a rear view of the frame for gaming machines. FIG. 4 is an exploded perspective view of a state where the substrate case is viewed. FIG. 4 is an exploded perspective view of a state where the substrate case is viewed. It is a 6th view showing a base member. It is a 6th view showing a cover member. FIG. 3 is a diagram illustrating a configuration example of a portion where a wiring pattern is formed. FIG. 3 is a diagram showing regions and sections for describing wiring patterns. It is an enlarged view of the area | region shown in FIG. FIG. 9 is a diagram illustrating a setting example corresponding to a wiring pattern. It is an enlarged view of the area | region shown in FIG. It is an enlarged view of the area | region shown in FIG. It is sectional drawing which shows the structural example of a main board. FIG. 11 is a diagram illustrating another configuration example of a wiring pattern. It is a figure showing the example of composition concerning feature part 42AK. It is a figure showing the example of composition where the 2nd shape part is formed in a different direction. FIG. 4 is a diagram illustrating a configuration example in which a plurality of signal wirings are formed with different wiring widths. It is a figure showing the example of composition where the 2nd shape part is formed correspondingly. FIG. 3 is a diagram illustrating a configuration example in which circuit components are mounted so as to be connected; It is a figure showing the example of composition concerning feature part 43AK. It is a figure showing the example of composition concerning characteristic part 44AK. It is an exploded perspective view of the board case, the board, and the heat sink of the gaming machine related to the characteristic portion 45AK as viewed from the rear. It is the exploded perspective view which looked at the board case, the board, and the heat sink of the game machine concerning the characteristic part 45AK from the front. FIG. 4 is a cross-sectional view illustrating a state in which a heat sink and a substrate are mounted on a substrate case in a mounting order ((a) to (b)). FIG. 26 is a cross-sectional view showing a state of attaching the heat sink and the substrate to the substrate case in the order of attachment ((a) to (b)), following FIG. 25. FIG. 3 is a plan view for explaining a relationship between a heat sink and an electronic component. It is an explanatory view for explaining a flow of air in a substrate case. FIG. 13 is a cross-sectional view showing a state where a heat sink and a substrate are mounted on a substrate case of a gaming machine according to another embodiment 1. FIG. 14 is a cross-sectional view showing a state where a heat sink and a substrate are mounted on a substrate case of a gaming machine according to another embodiment 2. It is a figure showing the example of composition concerning characteristic part 55AK. It is AA sectional drawing shown in FIG. It is a figure showing an example of connection of a production control board and an image display device. 34 is a top view of the connection wiring member in the connection example of FIG. 33. FIG. It is a figure showing another example of connection of a production control board and an image display device. FIG. 36 is a top view of the connection wiring member in the connection example of FIG. 35. It is a figure showing the example of composition concerning feature part 56AK. It is a figure showing other examples of composition about a plurality of electric parts. It is a figure which shows the example of a connection using the connection wiring member which the whole has a linear shape or a substantially linear shape. (A) is a figure which shows the example of a connection of an effect control board and an image display device, (B) is a right view of (A). (A) is a diagram showing a first wiring layer of the connection wiring member, (B) is a diagram showing a second wiring layer. 41A is an enlarged view of a main part of FIG. 41A, and FIGS. 41B and 41C are enlarged views of a main part of FIG. 42A is a sectional view taken along the line AA (A′-A ′) of FIG. 42, and FIG. 42B is a sectional view taken along the line BB (B′-B ′) of FIG. (A) is a diagram in which the first bent portion is formed on the basis of the convex portion, (B) is a side view of (A), (C) is a diagram in which the first bent portion is formed on the basis of the concave portion, and (D) is a diagram. It is a side view of (C). (A) is a diagram in which the second bent portion is formed on the basis of the convex portion, (B) is a side view of (A), (C) is a diagram in which the second bent portion is formed on the basis of the concave portion, and (D) is a diagram. It is a side view of (C). It is a figure which shows the modification 1 in the characteristic part 50SG. It is a figure which shows the modification 2 in the characteristic part 50SG. (A)-(C) is a figure which shows the modification 3 in the characteristic part 50SG.

  FIG. 1 is a front view of a pachinko gaming machine 1 according to this embodiment. The pachinko gaming machine 1 includes a gaming board 2 and a gaming machine frame 3. In addition, the pachinko gaming machine 1 includes an outer frame that rotatably supports the gaming machine frame 3 and the like. The game board 2 is a gauge board constituting a game board surface. The gaming machine frame 3 is an underframe to which the gaming board 2 is fixed. The game board 2 has a game area surrounded by guide rails and the like. A game ball (game medium) fired from the firing device passes through a firing path and is driven into a game area. In the gaming machine frame 3, a glass door frame having a glass window is provided rotatably.

  At a predetermined position of the game board 2, a first special symbol display device 4A, a second special symbol display device 4B, an image display device 5, an ordinary winning ball device 6A, an ordinary variable winning ball device 6B, a special variable winning ball device 7, A normal symbol display 20, a first reservation display 25A, a second reservation display 25B, a general reservation display 25C, a passage gate 41, and the like are provided. In addition, the game board surface in the game area may be provided with a windmill, a number of obstacle nails, a general winning opening, an out opening, and the like. A game effect lamp 9 is provided in a peripheral portion of the game area. Speakers 8L and 8R are provided at upper left and right positions of the gaming machine frame 3, respectively.

  At the lower right position of the gaming machine frame 3, a hit ball operation handle (operation knob) is provided. The hit ball operation handle is operated by a player or the like to shoot the game ball toward the game area, and the resilience of the game ball is adjusted according to the operation amount (the amount of rotation). At a predetermined position of the gaming machine frame 3 below the game area, an upper plate (hit ball supply plate) for holding (storing) game balls and a lower plate for holding (storing) surplus balls and the like from the upper plate are provided. Have been. A stick controller 31A is attached to a member forming the lower plate, and a push button 31B is provided to a member forming the upper plate.

  On the screens of the first special symbol display device 4A, the second special symbol display device 4B, the image display device 5, etc., variable display of special symbols and decorative symbols is performed. These variable displays are based on the occurrence of the first start winning prize due to the game ball passing (entering) the first starting winning opening formed in the normal winning prize ball device 6A, or on the normal variable winning prize ball device 6B. It becomes executable based on the occurrence of the second start winning due to the game ball passing (entering) the formed second start winning opening. The first special symbol display device 4A and the second special symbol display device 4B are each configured using, for example, an LED (light emitting diode) of a 7-segment or dot matrix, and are identified in a special figure game which is an example of a variable display game. A special symbol (special symbol), which is information (special identification information), is variably displayed (variably displayed). The image display device 5 is configured using, for example, an LCD (Liquid Crystal Display), and forms a display area for displaying various effect images. On the screen of the image display device 5, the variable display of the special symbol (first special symbol) by the first special symbol display device 4A and the special symbol (second special symbol) by the second special symbol display device 4B in the special symbol game are displayed. In accordance with each of the variable displays, for example, a decorative design which is identification information (decoration identification information) is variably displayed in a decorative design display area serving as a plurality of variable display portions, for example, three. The variable display of the decorative pattern is also included in the variable display game. As an example, “left”, “middle”, and “right” decorative symbol display areas 5L, 5C, and 5R are arranged on the screen of the image display device 5.

  On the screen of the image display device 5, a hold storage display area 5H is arranged. In the hold storage display area 5H, a hold display for variably displaying the number of holds (special figure hold storage number) corresponding to the special figure game is performed. The suspended display may be any display that can be displayed in accordance with the suspension storage of the information on the variable display. A hold display using the first hold display 25A and the second hold display 25B may be performed together with the hold storage display area 5H or instead of the hold storage display area 5H.

  FIG. 2 is a block diagram illustrating a configuration example of various substrates and peripheral devices. The pachinko gaming machine 1 is mounted with various control boards such as a main board 11, an effect control board 12, a sound control board 13, and a lamp control board 14 as shown in FIG. The pachinko gaming machine 1 also has a relay board 15, a driver board 19, a power supply board 92, and the like. In addition, various boards such as a payout control board, an information terminal board, a launch control board, an interface board, and a touch sensor board may be mounted. Various types of control boards realize specific electrical functions by mounting (mounting) electronic components on electronic circuit boards as well as electronic circuit boards such as printed wiring boards on which conductor patterns are formed and electrical components are mounted. This is a concept including an electronic circuit mounting board configured as described above.

  The power supply board 92 is configured to be able to supply electric power from an AC power supply as an external power supply (commercial power supply) to electric components including various control boards such as the main board 11 and the effect control board 12. The power supply board 92 includes, for example, a rectifier circuit for converting alternating current (AC) to direct current (DC), a power supply circuit for converting a predetermined direct current voltage to a specific direct current voltage (for example, 12 VDC or 5 VDC), and the like. , Have. The voltage generated by the power supply board 92 may be supplied to the main board 11 and the effect control board 12 via the drawer relay board.

  On the main board 11, a game control microcomputer 100, a switch circuit 110, a solenoid circuit 111, and the like are mounted. In the main board 11, signals taken from various detection switches such as a gate switch 21, a starting port switch (a first starting port switch 22 </ b> A and a second starting port switch 22 </ b> B), and a count switch 23 are transmitted via a switch circuit 110. It is transmitted to the game control microcomputer 100. The gate switch 21 detects a game ball (a gate passing ball) that has passed through the passing gate 41. Based on the detection of the ball passing through the gate by the gate switch 21, the variable display of the ordinary symbol by the ordinary symbol display 20 can be executed. The first starting port switch 22A detects a game ball that has passed (entered) the first starting winning port. The second starting port switch 22B detects a game ball that has passed (entered) the second starting winning port. The count switch 23 detects a game ball that has passed (entered) the special winning opening. When game balls passing through various winning ports, such as a first starting winning port, a second starting winning port, and a large winning port, are detected, a predetermined number of winning balls corresponding to the respective winning ports are detected. The game ball is paid out.

  On the main board 11, a solenoid drive signal from the game control microcomputer 100 is transmitted to a solenoid 81 for a normal electric accessory and a solenoid 82 for a special winning opening door via a solenoid circuit 111. The solenoid 81 for the ordinary electric accessory is in a state where the game ball hardly passes (or does not pass) and a state where the game ball easily passes (or passes) in the second starting winning opening formed in the normal variable winning ball device 6B. And changeable. The large winning opening door solenoid 82 allows the special winning opening formed in the special variable winning ball device 7 to be changed between a state where game balls cannot pass and a state where game balls can pass. From the main board 11, a command signal for performing display control of the first special symbol display device 4A, the second special symbol display device 4B, the ordinary symbol display device 20, and the like is transmitted.

  The game control microcomputer 100 mounted on the main board 11 is, for example, a one-chip microcomputer, and includes a ROM 101 that stores a game control program and fixed data, and a RAM 102 that provides a work area for the game control. A CPU 103 that executes a game control program to perform a control operation, a random number circuit 104 that updates numerical data indicating a random value independently of the CPU 103, and an I / O (Input / Output port) 105. It is configured with. As an example, in the game control microcomputer 100, a process for controlling the progress of the game in the pachinko gaming machine 1 is executed by the CPU 103 executing the program read from the ROM 101. In the game control microcomputer 100 mounted on the main board 11, various random numbers used for controlling the progress of the game are controlled by, for example, a random number circuit 104 or a game random counter provided in a predetermined area of the RAM 102. The indicated numerical data is counted (generated) in an updatable manner. The random numbers used to control the progress of the game are also called game random numbers.

  The effect control board 12 is based on the reception of the control signal (effect control command) transmitted from the main board 11 via the relay board 15, and based on the image display device 5, the speakers 8L and 8R, the game effect lamp 9, the effect motor It is possible to control the production operation by the production electric components such as the production LED 60 and the production LED 61. The effect control board 12 includes an effect control CPU 120, a ROM 121, a RAM 122, a display control unit 123, a random number circuit 124, an I / O 125, and the like.

  The effect control CPU 120 mounted on the effect control board 12 uses the effect control program and fixed data read from the ROM 121 to execute a process for controlling the effect operation by the effect electric components. The display control unit 123 mounted on the effect control board 12 determines the control content of the display operation in the image display device 5 based on a display control command or the like from the effect control CPU 120. For example, the display control unit 123 performs control for performing variable display of decorative symbols and various effect displays by determining the timing of switching effect images to be displayed on the display screen of the image display device 5.

  The controller sensor unit 35A and the push sensor 35B are connected to the effect control board 12. The controller sensor unit 35A includes a tilt direction sensor and a trigger sensor. The tilt direction sensor enables a plurality of sensors to detect the tilt direction of the operation rod when a tilt operation is performed on the operation rod of the stick controller 31A. The trigger sensor can detect the presence or absence of a push / pull operation on a trigger button provided on the operation stick of the stick controller 31A. That is, the controller sensor unit 35A can detect a player operation using the stick controller 31A, such as a tilting operation of the stick controller 31A with respect to the operation rod and a push / pull operation of the trigger button. With the push sensor 35B, it is possible to detect a player's operation using the push button 31B, such as a pressing operation on the push button 31B. In the effect control board 12, numerical data indicating various random numbers used for controlling the execution of the effect is renewably counted by, for example, a random number circuit 124 or an effect random counter provided in a predetermined area of the RAM 122. Generated). The random number used to control the execution of the effect is also referred to as an effect random number.

  The effect control board 12 has a first board 12A and a second board 12B that is connected to the first board 12A from board to board. The first substrate 12A is mounted with the effect control CPU 120 and the graphics processor of the display control unit 123, and the second substrate 12B is an electrical component that stores model-specific data such as the ROM 121 and the image data memory. Is installed. The graphics processor of the display control unit 123 may be a microprocessor in which the functions of the effect control CPU 120 are integrated, or may be a microprocessor configured as a separate chip from the effect control CPU 120.

  The sound control board 13 is a control board for sound output control provided separately from the effect control board 12, and outputs sound from the speakers 8L and 8R based on commands and control data from the effect control board 12. And a processing circuit for executing audio signal processing for causing the processing to be performed. Note that if the graphics controller or the like constituting the display control unit 123 mounted on the effect control board 12 can execute sound signal processing, the sound control board 13 may be provided with a band-pass filter, an amplifier circuit, or the like. Alternatively, the sound control board 13 may be omitted, and a band-pass filter, an amplification circuit, and the like may be mounted on the board of the effect control board 12. The lamp control board 14 is a control board for controlling the lamp output provided separately from the effect control board 12. Based on a command and control data from the effect control board 12, the lighting control of the game effect lamp 9 or the like is performed. A lamp driver circuit for turning off the light is mounted. The driver board 19 is a control board for driving electric components provided separately from the effect control board 12, and various motors included in the effect motor 60 based on commands and control data from the effect control board 12. A driver circuit and the like for controlling the rotation of the LED and lighting control of various LEDs included in the effect LED 61 are mounted. The output signal from the driver board 19 is transmitted to each motor included in the effect motor 60 and each LED included in the effect LED 61.

  In the pachinko gaming machine 1, a predetermined game using a game ball as a game medium is performed, and a predetermined game value can be given based on the game result. As an example of a game using a game ball, a predetermined operation (for example, a rotation operation) performed by a player on a hitting operation handle provided at a lower right position of the gaming machine frame 3 of the pachinko gaming machine 1 is determined. A game ball as a game medium is fired toward a game area by a firing motor or the like provided in the hit ball shooting device of the above. When a game ball that has flowed down the game area passes (enters) various winning ports, the game ball as a prize ball is paid out. When the variable display result of the special symbol or the decoration symbol becomes “big hit”, the big winning opening is opened and the game ball is easily passed (entered), which is an advantageous state that is advantageous to the player. Jackpot game state.

  The advantageous state is not limited to the big hit gaming state, and may include a special gaming state such as a time saving state or a probable change state. In addition, the upper limit number of round games that can be executed in the big hit game state is the first round number (for example, “15”) larger than the second round number (for example, “7”), and the round game can be executed in the time reduction state. The upper limit number of variable display is the first number (for example, “100”) larger than the second number (for example, “50”), and the big hit probability in the probable change state is higher than the second probability (for example, 1/50). 1 st probability (for example, 1/20), and the number of consecutive chan, which is the number of times repeatedly controlled to the big hit gaming state without being controlled to the normal state, is larger than the second consecutive chan number (for example, “5”). It may include a situation that is more advantageous for the player, such as a part or all of the number of consecutive chan (eg, “10”).

  In the main board 11, when power supply from the power supply board 92 is started, the CPU 103 of the game control microcomputer 100 is started, and the CPU 103 starts execution of the game control main process. In the game control main process, the CPU 103 performs necessary initial settings after setting interrupts to be prohibited. When the initialization is completed, the interrupt is permitted, and then the loop processing is started. Thereafter, an interrupt request signal is sent from the CTC to the CPU 103 every predetermined time (for example, every 2 milliseconds), and the CPU 103 periodically executes a game control timer interrupt process.

  The game control timer interrupt process includes a switch process, a main side error process, an information output process, a game random number update process, a special symbol process process, a normal symbol process process, a command control process, and the like. In the switch processing, the state of a detection signal input from various switches is determined. In the main-side error processing, an abnormality diagnosis of the pachinko gaming machine 1 is performed, and a warning can be generated if necessary. In the information output process, predetermined data supplied to the hall management computer is output. In the game random number updating process, at least a part of the game random number is updated by software. In the special symbol process process, various processes are selected and executed in order to perform display control of a special symbol and opening / closing operation setting of a special winning opening in a predetermined procedure. In the normal symbol process process, various processes are selected and executed in order to perform the display control of the normal symbol and the setting of the tilting operation of the movable wing piece in the normal variable winning ball device 6B in a predetermined procedure.

  In the special symbol process process, first, a start winning determination process is executed. After executing the start winning determination processing, the processing selected according to the value of the special figure process flag is executed. At this time, the selectable processing includes special symbol normal processing, fluctuation pattern setting processing, special symbol fluctuation processing, special symbol stop processing, big hit opening pre-processing, big hit opening processing, big hit opening processing, big hit end processing, and the like. I just need to be.

  In the start winning determination process, it is determined whether or not a first starting winning or a second starting winning has occurred, and if it has occurred, setting for updating the special figure reserved storage number is performed. In the special symbol normal processing, it is determined whether or not to start execution of the special figure game. In the special symbol normal process, it is determined whether or not the variable display result of the special symbol or the decorative symbol is set to “big hit”. Further, in the special symbol normal process, setting of a fixed special symbol in a special symbol game is performed in accordance with the variable display result. In the variation pattern setting process, a variation pattern is determined based on a variable display result or the like. In the special symbol variation processing, settings for varying the special symbol, settings for measuring the elapsed time from the start of the variation, and the like are performed. In the special symbol stop processing, setting for stopping the fluctuation of the special symbol and stopping and displaying (deriving) the fixed special symbol as a variable display result is performed.

  In the big hit opening process, setting for opening the big winning opening in the big hit gaming state is performed in accordance with the variable display result corresponding to "big hit". In the big hit opening processing, it is determined whether or not to return the big winning port from the open state to the closed state. In the post-opening jackpot process, after returning the special winning opening to the closed state, it is determined whether or not the number of rounds executed has reached the upper limit value. If not, the next round can be executed, and if it has been reached, Settings for terminating the big hit gaming state are performed. In the big hit end process, after waiting until the waiting time corresponding to the execution period of the ending effect for notifying the end of the big hit game state elapses, setting for starting the probability change control and the time saving control is performed.

  In the effect control board 12, when the power supply from the power supply board 92 is started, the effect control CPU 120 starts executing the effect control main process. In the effect control main process, after a predetermined initialization, every time a timer interrupt occurs, a command analysis process, an effect control process process, and an effect random number update process are executed. In the command analysis process, the effect control command transmitted from the main board 11 is analyzed, and a flag corresponding to the analysis result is set. In the effect control process, various processes are selected and executed in order to control the electric components for effect in accordance with a predetermined procedure. In the effect random number update process, a count value for generating effect random numbers is updated by software.

  In the effect control process process, first, the hold display update process is executed. After executing the hold display update process, the process selected according to the value of the rendering process flag is executed. The processes that can be selected at this time may include a variable display start waiting process, a variable display start setting process, a variable display effect process, a variable display stop process, a big hit display process, a big hit medium effect process, an ending effect process, and the like. .

  In the suspension display update processing, settings for updating the display of the suspension storage display area 5H in accordance with the number of special figure suspension storages are performed. In the variable display start waiting process, it is determined whether or not to start variable display of a special symbol or a decorative symbol. In the variable display start setting process, settings for starting variable display of decorative symbols are performed. In the variable display effect processing, settings for controlling the electric components for effect in accordance with the effect control pattern are performed in accordance with the variable display of the decorative symbol. In the variable display stop process, control for stopping the variable display of the decorative symbol and deriving a fixed decorative symbol as a variable display result is performed.

  In the big hit display process, control for executing an effect (fan fare effect) for notifying the occurrence of the big hit is performed in accordance with the variable display result corresponding to “big hit”. In the big hit production process, settings for controlling the electric components for production in accordance with the production control pattern are performed in accordance with the big hit game state. In the ending effect process, settings for controlling the execution of the ending effect are performed in response to the end of the big hit game state.

  FIG. 3 is a rear view of the gaming machine frame 3 provided in the pachinko gaming machine 1. A ball tank 150 and a terminal board 154 are provided on the upper rear surface of the gaming machine frame 3. Further, a supply passage 151, a payout device 152, and a prize ball passage 153 are provided. On the back of the game board 2, a board case 400 for a game control board, a board case 800 for an effect control board, and a cover body 301 are provided. The board case 400 houses the main board 11. The board case 800 houses the effect control board 12. The cover body 301 is made of a transparent synthetic resin or the like, and covers the board case 800 and the upper part of the board case 400. At a lower position of the game control board substrate case 400, a payout control board 91 and a power supply board 92 are provided so as to overlap each other.

  The structure of the board case 800 for the effect control board will be described with reference to FIGS. FIG. 4 is an exploded perspective view showing a state where the board case 800 is viewed from obliquely above the rear left portion. FIG. 5 is an exploded perspective view showing a state where the board case 800 is viewed from obliquely above the right front part. FIG. 6 is a six-sided view showing the base member 801. FIG. 7 is a 6-side view showing the cover member 802. FIG. The board case 800 includes a base member 801 and a cover member 802, and is assembled so as to sandwich the effect control board 12 from front and rear. The base member 801 covers the front side of the effect control board 12, and the cover member 802 covers the rear side of the effect control board 12.

  The base member 801 is made of a transparent thermoplastic synthetic resin, and includes a base plate 801a formed in a vertically long and substantially rectangular shape, and side walls 801b to 801e erected on the upper, lower, left and right sides toward the back side. , Formed in a box shape opening toward the rear side. In the base plate 801a, bosses 803 and 804, a locking bar 805, a locking hook 806, a locking hole 807, a locked portion 808, a screw hole 810 of a one-way screw 809, a mounting hole 811, a substrate supporting rib 812, 813, steps 814 a and 814 b, and a rib 815 are provided.

  The cover member 802 is made of a transparent thermoplastic synthetic resin, and includes a base plate 821a formed in a vertically long and substantially rectangular shape, and side walls 821b to 811e standing upright and left and right sides toward the back side. , Formed in a box shape opening toward the rear side. The base plate 821a has a screw hole 823 into which the screw 822 is screwed, a positioning protrusion 824, a screw hole 826 into which the screw 825 is screwed, a positioning protrusion 827, a locking hook 831, a locking piece 832, and locking. A portion 833, a mounting piece 834 having a mounting hole 834a for the one-way screw 809, a switch opening 835 for exposing a volume control switch 835a to the outside, and connector openings 836 and 837 are provided.

  The connector opening 836 is formed on the upper right side of the base plate 821a so as to have a vertically long shape in order to expose the various board-side connectors KCN10 mounted on the first board 12A to the outside. The board-side connector KCN10 only needs to include the receptacles KRE1 to KRE4. The receptacle KRE1 is a connector port for main board wiring. The receptacle KRE2 is a connector port for power supply board wiring. The receptacle KRE3 is a connector port for driver board wiring. The receptacle KRE4 is a connector port for voice control board wiring. The arrangement of the receptacles and the wiring to be connected may be arbitrarily changed according to the specifications of the pachinko gaming machine 1.

  The main board wiring receptacle KRE1 has a configuration of a wiring connection device capable of detachably connecting a signal wiring (main board wiring) electrically connected to the main board 11. The receptacle KRE2 for power supply board wiring has a configuration of a wiring connection device capable of detachably connecting signal wiring (power supply board wiring) electrically connected to the power supply board 92. The receptacle KRE3 for the wiring of the driver board has a configuration of a wiring connection device capable of detachably connecting a signal wiring (driver board wiring) electrically connected to the driver board 19. The audio control board wiring receptacle KRE4 has a configuration of a wiring connection device capable of detachably connecting a signal wiring (audio control board wiring) electrically connected to the audio control board 13.

(Explanation about the characteristic part 30AK)
FIG. 8 shows an example of the configuration of a portion of the main board 11 where a wiring pattern for connecting the CPU 103 and the RAM 102 is formed on one substrate surface (front surface) of the characteristic portion 30AK of the present embodiment. In order to connect a plurality of electrical components, such as the RAM 102 and the CPU 103, by a plurality of signal wires, a wiring pattern forming the plurality of signal wires is formed on the main board 11. The CPU 103 is an electrical component configured to execute a predetermined process with respect to the control of the game in the pachinko gaming machine 1, and the RAM 102 is an electrical component configured to store information related to the execution of the process by the CPU 103.

  One or a plurality of ground conductors are arranged around the wiring patterns constituting the plurality of signal wirings or in a region between the signal wirings. The ground conductor functions as a reference ground or a characteristic impedance adjusting ground, and is maintained at the ground voltage. In the configuration example shown in FIG. 8, as the plurality of ground conductors, the ground conductors 30AK10G and 30AK11G are arranged in a region around the plurality of signal wires, and the ground conductor 30AK20G is arranged in a region between the plurality of signal wires. . As described above, one or a plurality of ground conductors may be provided in an empty area which is a blank area where a wiring pattern constituting a plurality of signal wirings is not provided. This can prevent or suppress electromagnetic interference caused by electromagnetic noise radiated from a plurality of signal wirings and electromagnetic noise between signal wirings.

  Note that the present invention is not limited to the configuration in which the plurality of ground conductors are arranged in both regions around the plurality of signal wirings and between the signal wirings. The ground conductor is provided only in one region around the plurality of signal wirings or in one region between the signal wirings. It may be arranged. Alternatively, such a ground conductor may not be provided.

  FIG. 9 shows regions and sections for describing the wiring patterns constituting the plurality of signal wirings shown in FIG. 8 in more detail. The region 30AK01R shown in FIG. 9 is a region at an end on the side where a plurality of signal wirings are connected to the CPU 103. The region 30AK10R shown in FIG. 9 is a region in which a plurality of signal wirings are linear or substantially linear and have a first shape that is parallel or substantially parallel to each other. The region 30AK11R and the region 30AK12R shown in FIG. This is a region where the signal wiring of the portion has a second shape that is different from the linear shape and the substantially linear shape and is not parallel or substantially parallel to other signal wirings. In a section 30AK0SC shown in FIG. 9, a short distance pattern in which some of the plurality of signal wirings are connected at the shortest or substantially shortest distance, and a signal wiring not included in the short distance pattern has a longer distance than the short distance pattern. And a long-distance pattern that is connected by a.

  FIG. 10 is an enlarged view of the region 30AK01R shown in FIG. In the region 30AK01R shown in FIG. 10, the wiring patterns constituting the plurality of signal wirings include the patterns 30AK10D to 30AK13D, the pattern 30AK10CK, the pattern 30AK10CS, the pattern 30AK10RS, and the patterns 30AK10A to 30AK14A.

  FIG. 11 shows a setting example regarding the signal type, the presence / absence of signal synchronization, and the presence / absence of a meandering shape corresponding to the wiring pattern shown in FIG. The signal types shown in FIG. 11 indicate the contents (uses) of the electric signals transmitted by the signal wirings formed by the wiring patterns. The signal synchronization shown in FIG. 11 indicates whether or not there is synchronization with an electric signal transmitted through another signal wiring. The meandering shape shown in FIG. 11 indicates whether or not each wiring pattern connecting the RAM 102 and the CPU 103 has a meandering shape different from the linear shape and the substantially linear shape. The meandering shape is also called a meander shape, a zigzag shape, or a folded shape, and the signal wiring is repeatedly bent with respect to the extending direction of the signal wiring in a predetermined section, for example, in a direction orthogonal or substantially orthogonal to the extending direction. Any shape may be used as long as the shape reciprocates.

  In the setting example shown in FIG. 11, the wiring patterns 30AK10D to 30AK13D all constitute signal wiring for transmitting data signals. A data signal transmitted on each signal line is transmitted in synchronization with a signal transmitted on another signal line, such as a clock signal and a data signal transmitted on another signal line. The wiring pattern 30AK10CK forms a signal wiring for transmitting a clock signal. The clock signal is transmitted in synchronization with a signal transmitted through another signal wiring, such as a data signal, an address signal, and a chip select signal. The wiring pattern 30AK10CS forms a signal wiring for transmitting a chip select signal. The chip select signal is transmitted in synchronization with a signal transmitted on another signal line, such as a clock signal, for example. The wiring pattern 30AK10RS forms a signal wiring for transmitting the reset signal. The reset signal is transmitted asynchronously without being synchronized with a signal transmitted through another signal line. Each of the wiring patterns 30AK10A to 30AK14A constitutes a signal wiring for transmitting an address signal. The address signal transmitted on each signal line is transmitted in synchronization with a signal transmitted on another signal line, such as a clock signal and an address signal transmitted on another signal line.

  Among the data signals, clock signals, chip select signals, and address signals transmitted in synchronization with the signals transmitted by other signal wirings, wiring patterns 30AK10D to 30AK13D constituting signal wirings for transmitting data signals are provided. , A wiring pattern 30AK10D having no meandering shape. At least a part of a wiring pattern constituting a signal wiring for transmitting a data signal, a clock signal, a chip select signal, and an address signal different from the data signal transmitted by the signal wiring composed of the wiring pattern 30AK10D has a linear shape. And a meandering shape different from the substantially straight shape.

  The signal wiring for transmitting the data signal formed by the wiring pattern 30AK10D has a larger number of connection lines between the RAM 102 and the CPU 103 than the signal wiring for transmitting other data signals, clock signals, chip select signals, and address signals. The distance is longer. Therefore, at least a part of a wiring pattern constituting a signal wiring for transmitting a data signal, a clock signal, a chip select signal, and an address signal different from the data signal transmitted by the signal wiring constituted by the wiring pattern 30AK10D is provided. With the meandering shape, the wiring length of each signal wiring is the same or substantially the same. On the other hand, it is not necessary to provide a meandering shape in the wiring pattern 30AK10D.

  As described above, of the signal wiring for transmitting the synchronization signal, the signal wiring in which the distance between the connection terminals of the plurality of electric components is longer than the distance between the other connection terminals is, for example, a meandering wiring portion. The wiring pattern may be formed so as not to include a wiring portion having a shape different from the linear shape and the substantially linear shape. Conversely, signal wiring that is formed in a wiring pattern that does not include a linear shape such as a meandering shape and a shape different from the substantially straight shape while having a shape such as a straight shape or a substantially straight shape, has a meandering shape. The distance between the connection terminals of the plurality of electrical components is longer than the signal wiring formed by the wiring pattern including a shape different from the simple linear shape and the substantially linear shape. Alternatively, among signal wirings for transmitting a synchronization signal, signal wirings in which the distance between connection terminals in a plurality of electrical components is longer than the distance between other connection terminals may be, for example, a meandering wiring portion. It is sufficient that the wiring pattern is formed so as not to include a wiring portion having a shape different from the shape parallel to and substantially parallel to the signal wiring. Conversely, the signal wiring formed by a wiring pattern that does not include a shape different from the parallel and substantially parallel shapes such as a meandering shape while having a shape parallel or substantially parallel to other signal wires has a meandering shape. The distance between the connection terminals of the plurality of electrical components is longer than that of a signal wiring formed by a wiring pattern including a shape different from a shape parallel or substantially parallel to other signal wires. This makes it possible to prevent or suppress the occurrence of a delay time difference (skew) between signals transmitted through a plurality of signal wirings by setting the wiring lengths of the signal wirings to be the same or substantially the same. By reducing the difference in delay time between signals transmitted through a plurality of signal lines, the reliability of signals transmitted through a plurality of signal lines can be improved.

  The meandering shape is not provided in the wiring pattern 30AK10RS. The wiring pattern 30AK10RS forms a signal wiring for transmitting a reset signal which is an asynchronous signal. When transmitting an asynchronous signal such as a reset signal, it is not necessary to consider a delay time difference from a signal transmitted by another signal wiring. Therefore, a meandering shape is not provided in a wiring pattern forming a signal wiring for transmitting an asynchronous signal, such as a wiring pattern 30AK10RS forming a signal wiring for transmitting a reset signal. If the meandering shape is not provided in the wiring pattern, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

  A wiring pattern forming a dummy wiring maintained at the ground voltage may be arranged as a wiring pattern having no meandering shape. For example, in the signal wiring formed by the wiring pattern 30AK10RS, the reset signal may be transmitted and the ground voltage may be maintained. The wiring pattern 30AK10RS includes a wiring pattern 30AK10D to 30AK13D forming a signal wiring for transmitting a data signal, a wiring pattern 30AK10CK forming a signal wiring for transmitting a clock signal, and a chip select signal. It is arranged between a group of patterns composed of wiring patterns 30AK10CS constituting signal wiring and a group of patterns composed of wiring patterns 30AK10A to 30AK14A constituting signal wiring for transmitting address signals. I have. By using signal wirings arranged between other signal wirings such as the wiring pattern 30AK10RS as dummy wirings maintained at the ground voltage, prevention or suppression of electromagnetic interference due to electromagnetic noise in a plurality of signal wirings is achieved. . As the wiring pattern without the meandering shape, a wiring pattern maintained at the power supply voltage may be arranged instead of the dummy wiring maintained at the ground voltage or together with the dummy wiring maintained at the ground voltage. For example, in the signal wiring constituted by the wiring pattern 30AK10RS, the power supply voltage may be maintained instead of transmitting the reset signal. If a wiring pattern maintained at the power supply voltage is arranged close to a wiring pattern forming another signal wiring, electromagnetic noise may be generated due to electromagnetic coupling between the signal wirings. Therefore, when arranging the wiring pattern maintained at the power supply voltage, compared with the case of arranging the wiring pattern maintained at the ground voltage, each wiring is arranged such that the distance from the signal wiring is longer. A pattern may be formed. Thereby, prevention or suppression of electromagnetic interference due to electromagnetic noise in the signal wiring is achieved.

  FIG. 12 is an enlarged view of the region 30AK10R shown in FIG. In the region 30AK10R, wiring patterns 30AK10CK, 30AK10CS, 30AK10RS, and 30AK10A to 14A are formed. These wiring patterns are formed such that all of the plurality of signal wirings have a linear shape or a substantially linear shape and are parallel or substantially parallel to each other in the region 30AK10R. As described above, in the region 30AK10R, the wiring patterns forming the plurality of signal wirings are formed so as to have a linear shape or a substantially linear shape, and the plurality of signal wirings have a shape parallel or substantially parallel to each other. A wiring pattern is formed.

  FIG. 13 is an enlarged view of the region 30AK11R shown in FIG. Similarly to the region 30AK10R, the wiring patterns 30AK10CK, 30AK10CS, 30AK10RS, and 30AK10A to 14A are formed in the region 30AK11R. The pattern of these wirings is such that at least one signal wiring is formed in the region 30AK11R so as to have a linear shape or a substantially linear shape, while the other signal wirings have a shape different from the linear shape or the substantially linear shape. It is formed so that it becomes. In the region 30AK11R shown in FIG. 13, for example, a wiring pattern 30AK10CK forming a signal wiring for transmitting a clock signal and a wiring pattern 30AK10CS forming a signal wiring for transmitting a chip select signal include a plurality of bent portions. However, both are formed to have a linear shape or a substantially linear shape. In the region 30AK11R shown in FIG. 13, the wiring pattern 30AK10RS forming the signal wiring for transmitting the reset signal is formed to have a linear shape or a substantially linear shape that does not include a bent portion. On the other hand, in the region 30AK11R shown in FIG. 13, the wiring patterns 30AK10A to 30AK14A constituting the signal wiring for transmitting the address signal have a meandering shape formed by a plurality of bent portions, and have a linear shape and a substantially linear shape. Are formed to have different shapes.

  In the portion where the meandering shape is formed, the signal wiring may be bent in a direction orthogonal to the original extending direction, for example, through a plurality of bent portions. In each bent portion, the signal wiring may be bent so as to form an angle (obtuse angle) larger than a right angle, so that a wiring pattern in which the extending direction of the signal wiring is changed may be formed. In this case, the signal wiring is bent such that the amount of bending at each bending portion is smaller than a right angle. In the portion where the meandering shape is formed, the signal wiring can be extended in a first extending direction and a second extending direction orthogonal or substantially orthogonal to the first extending direction. A plurality of bent portions may be provided between the wiring pattern forming the signal wiring in the direction and the wiring pattern forming the signal wiring in the second extending direction. As described above, the extending direction of the signal wiring is changed via the plurality of bent portions where the amount of bending of the signal wiring is smaller than the predetermined angle. By reducing the amount of bending, it is possible to suppress a large change in the wiring pattern width at the bent portion, to prevent a sudden change in the characteristic impedance of the transmission line, and to reduce the electromagnetic noise caused by electromagnetic noise in a plurality of signal wirings. Prevention or suppression of interference is achieved.

  In each signal wiring, a plurality of bent portions may be arranged so that the position of the bent portion is longer than a predetermined length from the position of the bent portion in another signal wiring. The predetermined length may be a predetermined length, for example, a predetermined length included in a range of 2 mm to 5 mm from the viewpoint of substrate design. At the bent portion of the signal wiring, electromagnetic noise is likely to be generated due to a change in characteristic impedance or the like. A bent portion formed by a wiring pattern forming one signal wiring included in the plurality of signal wirings is close to a bent portion formed by a wiring pattern forming another signal wiring included in the plurality of signal wirings. When they are arranged, there is a possibility that signals transmitted through the respective signal wirings are easily affected by electromagnetic wave noise. Therefore, a bent portion formed by a wiring pattern forming one signal wiring included in the plurality of signal wirings and a bent portion formed by a wiring pattern forming another signal wiring included in the plurality of signal wirings are formed. By arranging them at intervals so as to be longer than a predetermined length, it is possible to prevent or suppress electromagnetic interference due to electromagnetic noise in a plurality of signal wirings.

  In the region 30AK11R, at least one signal wiring is formed to have a shape different from parallel and substantially parallel. In the region 30AK11R shown in FIG. 13, for example, each of a wiring pattern 30AK10CK constituting a signal wiring for transmitting a clock signal and a wiring pattern 30AK10CS constituting a signal wiring for transmitting a chip select signal includes a plurality of patterns. The signal wirings are formed so as to have a parallel or substantially parallel shape as a whole, with the bent portions interposed therebetween. On the other hand, in the region 30AK11R shown in FIG. 13, the wiring patterns 30AK10A to 30AK14A constituting the signal wiring for transmitting the address signal are formed in a meandering shape by a plurality of bent portions, so that the wiring patterns 30AK10A to 30AK14A are formed as a whole. The signal wiring is formed so as to have a shape different from parallel or substantially parallel.

  In the region 30AK11R shown in FIG. 13, at least one of the plurality of signal wirings has a shape such as a meandering shape different from the parallel and substantially parallel shapes. In this region 30AK11R, a conductor is not provided on at least the same substrate as the signal wiring in the space region 30AK0SP adjacent to the wiring pattern forming the signal wiring. The space region 30AK0SP is, for example, close to the wiring patterns 30AK10A to 30AK13A in which the meandering shape is provided in the region 30AK11R among the wiring patterns 30AK10A to 30AK14A constituting the signal wiring for transmitting the address signal. Since no conductor is provided in the space region 30AK0SP, it is possible to prevent or suppress electromagnetic interference due to electromagnetic noise in a plurality of signal wirings. If a conductor is provided in an area close to the meandering wiring pattern, electromagnetic waves may be emitted from the signal wiring, and electromagnetic noise may be generated due to electromagnetic coupling between the signal wiring and the conductor. There is a possibility that. Therefore, for example, the conductor is not provided in a region close to the wiring pattern provided with the meandering shape, such as the space region 30AK0SP, thereby preventing or suppressing electromagnetic interference due to electromagnetic wave noise in a plurality of signal wirings. Can be

  FIG. 14 is a cross-sectional view illustrating a configuration example of a main board 11 formed as a multilayer wiring board. The main substrate 11 shown in FIG. 14 has a multilayer structure formed by laminating synthetic resins, and various wiring patterns can be formed on the surface of each layer or on the inner layer. A plurality of electronic components such as the RAM 102 and the CPU 103 are electrically connected via a wiring pattern formed on the main substrate 11 having such a multilayer structure. The multilayer structure of the main substrate 11 shown in FIG. 14 includes a surface layer 30AK1S, a ground layer 30AK1L, a power layer 30AK2L, a wiring layer 30AK3L, a power layer 30AK4L, and a back layer 30AK2S.

  A surface layer 30AK1S is provided on a surface of the main substrate 11 which is one substrate surface, and wiring patterns 30AK10P and 30AK11P constituting signal wiring are formed. A back surface layer 30AK2S is provided on the back surface serving as the other substrate surface of the main substrate 11, and a wiring pattern 30AK20P constituting a signal wiring is formed. The wiring pattern 30AK10P formed on the surface layer 30AK1S of the main substrate 11 is connected to the wiring pattern 30AK20P formed on the back layer 30AK2S via a through hole 30AK1H penetrating the surface layer 30AK1S and the back layer 30AK2S of the main substrate 11. It is electrically connected. The wiring pattern 30AK20P formed on the surface layer 30AK1S of the main substrate 11 is connected to the wiring pattern 30AK20P formed on the rear surface layer 30AK2S via a through hole 30AK2H penetrating the surface layer 30AK1S and the rear surface layer 30AK2S of the main substrate 11. It is electrically connected. As described above, in the main substrate 11, the wiring patterns 30AK10P and 30AK11P constituting the signal wiring in the surface layer 30AK1S provided on the surface serving as one substrate surface, and the back surface serving as the other substrate surface are provided. In the back layer 30AK2S, a through hole 30AK1H and a through hole 30AK2H capable of electrically connecting the wiring pattern 30AK20P constituting the signal wiring are provided.

  The wiring length of each signal wiring included in the plurality of signal wirings connecting the RAM 102 and the CPU 103 shown in FIG. 14 is determined by the wiring patterns 30AK10P and 30AK11P formed on the surface layer 30AK1S and the wiring length formed on the back layer 30AK2S. The same or substantially the same as the length of the through hole 30AK1H and the length of the through hole 30AK2H as well as the wiring length of the signal wiring formed by the pattern 30AK20P. In the main board 11 having the multilayer structure shown in FIG. 14, the wiring length of each signal wiring including the length of the through hole 30AK1H and the through hole 30AK2H is the same or substantially the same, and the signal transmitted through the plurality of signal wirings is The occurrence of the delay time difference can be prevented or suppressed. In a multilayer wiring board such as the main board 11, by reducing the delay time difference between signals transmitted through a plurality of signal wirings, the reliability of signals transmitted through a plurality of signal wirings can be improved.

  In the main substrate 11 having the multilayer structure shown in FIG. 14, a ground layer 30AK1L is provided as a conductor layer adjacent to the surface layer 30AK1S. One or more ground conductors are arranged on the ground layer 30AK1L, and the ground conductor is maintained at the ground voltage. The pattern 30AK10P and the pattern 30AK11P of the wiring forming the signal wiring in the surface layer 30AK1S have a shape different from the linear shape and the substantially linear shape, such as a meandering shape, in at least one of the patterns. What is necessary is just to be formed so that the area | region which becomes a shape different from a simple shape may be included. In the ground layer 30AK1L as a conductor layer adjacent to the surface layer 30AK1S, no signal is transmitted. Since signals are not transmitted in the conductor layer adjacent to the surface layer 30AK1S on which the wiring patterns 30AK10P and 30AK11P are formed, signals transmitted through a plurality of signal wirings formed by the wiring patterns 30AK10P and 30AK11P are electromagnetic waves. It is also possible to prevent or suppress the influence of the electromagnetic wave noise on other signal wirings due to being less affected by the noise.

  In the back surface layer 30AK2S of the main substrate 11 having the multilayer structure shown in FIG. 14, the wiring pattern 30AK20P constituting the signal wiring has a shape different from the linear shape and the substantially linear shape such as a meandering shape, and a plurality of signal wires are parallel and substantially parallel. It may be formed so as to include a region having a shape different from the parallel shape. In such a power supply layer 30AK4L as a conductor layer adjacent to the back surface layer 30AK2S, no signal is transmitted. One or more power supply conductors are arranged in the power supply layer 30AK4L, and the power supply conductors are maintained at the power supply voltage. Since signals are not transmitted in the conductor layer adjacent to the back surface layer 30AK2S on which the wiring pattern 30AK20P is formed, signals transmitted through a plurality of signal wirings formed by the wiring pattern 30AK20P are not easily affected by electromagnetic wave noise. Therefore, it is possible to prevent or suppress the influence of electromagnetic noise on other signal wirings. Signal transmission is not performed in a conductor layer adjacent to a layer on which a plurality of signal wirings are provided in a multilayer wiring board such as the main board 11, thereby preventing or suppressing electromagnetic interference due to electromagnetic noise in the plurality of signal wirings. It is planned.

  In the wiring layer 30AK3L of the main substrate 11 having the multilayer structure shown in FIG. 14, the wiring pattern forming the signal wiring has a shape different from the linear shape and the substantially linear shape, such as a meandering shape, and a plurality of signal wires are parallel and substantially parallel. It may be formed so as to include a region having a shape different from the desired shape. No signal is transmitted in the power supply layer 30AK2L or the power supply layer 30AK4L as a conductor layer adjacent to the wiring layer 30AK3L. Signal transmission is not performed in a conductor layer adjacent to the wiring layer 30AK3L in which a plurality of signal wirings are provided in a multilayer wiring board such as the main substrate 11, thereby preventing electromagnetic interference due to electromagnetic noise in the plurality of signal wirings or Suppression is achieved. However, when the wiring pattern constituting the signal wiring is formed in the wiring layer 30AK3L, which is the inner conductor layer provided on the multilayer wiring board, so as to include a region having a meandering shape or the like, the signal wiring is not formed. When a failure such as disconnection occurs, it may be difficult to confirm the state of the signal wiring in the wiring layer 30AK3L from outside the substrate. On the other hand, a region where the wiring pattern forming the signal wiring on the one substrate surface or the other substrate surface of the main substrate 11, such as the surface layer 30AK1S or the back surface layer 30AK2S of the main substrate 11, has a meandering shape or the like. When formed so as to include, in the event of a failure due to disconnection of the signal wiring or the like, an appropriate board configuration that allows the state of the signal wiring in the surface layer 30AK1S or the back layer 30AK2S to be easily confirmed from outside the board is possible. Become.

  The through-holes penetrating through the surface layer 30AK1S and the back surface layer 30AK2S of the main substrate 11 are not limited to the through-holes 30AK1H and 30AK2H shown in FIG. 14, but more through-holes are provided, and each signal in a plurality of signal wirings is provided. It may be used to make the wiring length of the wiring the same or substantially the same. Among the wiring patterns constituting the plurality of signal wirings, for example, the signal wirings are arranged only on the surface layer 30AK1S of the main substrate 11 without passing through through holes such as the through holes 30AK1H and 30AK2H. The formed pattern may be included. The signal wiring in which the distance between the connection terminals of a plurality of electrical components is longer than the distance between the other connection terminals, such as the signal wiring for transmitting the data signal formed by the wiring pattern 30AK10D, includes the through-hole 30AK1H and the through-hole. The signal wiring may be arranged only on the surface layer 30AK1S of the main substrate 11 without passing through a through hole such as the hole 30AK2H. Conversely, a signal wiring formed by a wiring pattern formed without a through hole in one conductor layer such as the surface layer 30AK1S is formed through a plurality of conductor layers such as the surface layer 30AK1S and the back surface layer 30AK2S. The distance between the connection terminals of the plurality of electric components is longer than that of the signal wiring formed by the wiring pattern formed so as to be electrically connectable through the wiring.

  When a plurality of signal wirings are provided adjacent to each other, a small blank area is formed like the space area 30AK0SP shown in FIG. It is also conceivable to provide a through-hole electrode in this blank area and to have a through-hole electrode in which a conductive material such as copper is embedded so as to be electrically connected to another conductor layer such as the ground layer 30AK1L. In a configuration in which a conductor such as a through-hole electrode is provided in a blank region, a large number of through-hole electrodes may be arranged, for example, in order to stabilize the electric field distribution in the blank region. In this case, not only the surface layer 30AK1S of the main substrate 11 but also the back layer 30AK2S are provided with structures corresponding to the through-hole electrodes, such as bumps, and the design of the wiring pattern on the substrate is restricted. Inconvenience may occur. In a case where a through-hole electrode is provided in the ground layer 30AK1L, the power supply layers 30AK2L, and 30AK4L, which are inner conductor layers provided on the multilayer wiring board, the pattern of the conductor layer is removed around the through-hole electrode. As a result, the pattern in the inner conductor layer such as the ground layer 30AK1L and the power supply layers 30AK2L and 30AK4L may be divided, which may cause a problem that the design of the pattern in the conductor layer becomes difficult. Furthermore, in a configuration in which a conductor such as a dummy pad is provided in a blank area instead of a through-hole electrode and is not connected to another conductor layer, for example, this conductor may be affected by external electromagnetic noise, This conductor may affect the plurality of signal wirings due to electromagnetic wave noise, thereby giving rise to a problem that adverse effects such as electromagnetic interference may occur. On the other hand, since no conductor is provided in the space region 30AK0SP adjacent to the wiring pattern forming the signal wiring, it is possible to prevent or suppress the occurrence of these inconveniences.

  In addition, as in the space region 30AK0SP shown in FIG. 13, a blank region formed when a plurality of signal wirings are provided adjacent to each other is different from a constituent material of the substrate such as a screw hole for fixing the substrate. A structure using a material may not be provided. If a screw hole is provided for fixing the board, when the board is fixed by screwing, the material of the screw is affected by external electromagnetic noise, and other signal wiring is adversely affected by electromagnetic interference. Inconvenience may occur. In addition, a structure using a synthetic resin or a dielectric material having a different dielectric constant from the insulating layer included in the substrate, or a structure using a synthetic resin or a metal material having a different electrical conductivity from the conductor layer included in the substrate may be used. If these structures are provided in a blank area close to a plurality of signal wirings, these structures may be affected by external electromagnetic noise, or these structures may affect the plurality of signal wirings. Or adverse effects such as electromagnetic interference may occur. On the other hand, these inconveniences occur because a structure using a material different from the constituent material of the substrate is not provided in a blank region such as the space region 30AK0SP close to the wiring pattern constituting the signal wiring. Can be prevented or suppressed.

  In a section 30AK0SC shown in FIG. 9, one of the wiring patterns 30AK10D to 30AK13D forming a plurality of signal wirings for transmitting a data signal has a shape different from a linear shape and a substantially linear shape such as a meandering shape. Thus, the signal wiring is formed so as to include a portion of the signal wiring which has a shape different from the shape parallel and substantially parallel to the other signal wires. On the other hand, at least the pattern 30AK10D and the pattern 30AK11D are formed in the section 30AK0SC so as not to include a meandering shape, and to have a linear shape or a substantially linear shape, and signal wirings thereof are parallel or substantially parallel to each other. . Therefore, the pattern 30AK10D and the pattern 30AK11D are patterns in which the signal wiring connects the section 30AK0SC at the shortest or almost the shortest. On the other hand, the pattern 30AK12D and the pattern 30AK13D are patterns in which the signal wiring connects the section 30AK0SC at a longer distance than the pattern 30AK10D and the pattern 30AK11D.

  In the section 30AK0SC, in a portion where the signal wiring formed by the pattern 30AK13D has a shape different from a linear shape such as a meandering shape and a substantially linear shape, the signal wiring formed by the other patterns 30AK10D to 30AK12D has a linear shape or It is formed so as to have a substantially linear shape. As described above, in a portion where the signal wiring formed by one wiring pattern among the wiring patterns forming the plurality of signal wirings has a shape different from a linear shape such as a meandering shape and a substantially linear shape, other portions are used. May be formed so as to have a linear or substantially linear shape. A portion in which the signal wiring formed by one wiring pattern has a shape different from a linear shape such as a meandering shape and a substantially linear shape is a signal wiring formed by another wiring pattern having a linear shape or a substantially linear shape. It may be formed so as not to overlap with the portion. Wiring patterns are formed so that portions that are different from the linear shape and the substantially linear shape such as a meandering shape do not overlap with multiple signal wires, thereby suppressing an increase in the area of the substrate on which the wiring patterns are arranged. Thus, the size of the substrate can be reduced.

  FIG. 15 shows another example of formation of a wiring pattern in which portions in which a plurality of signal wirings have a meandering shape do not overlap. Also in the region 30AK20R shown in FIG. 15, in a portion where the signal wiring formed by one wiring pattern among the wiring patterns forming the plurality of signal wirings has a meandering shape, the signal formed by the other wiring pattern is used. The wiring is formed so as to have a linear shape or a substantially linear shape. Then, when the first meandering portion, which is a portion in which the first signal wiring formed by the first wiring pattern has a meandering shape, is completed, the second signal wiring formed by the second wiring pattern different from the first wiring pattern is completed. Wiring patterns forming a plurality of signal wirings are formed so that a second meandering part, which is a part where the signal wirings have a meandering shape, is started. In the first meandering section, the wiring patterns including the second wiring pattern forming the second signal wiring as the wiring patterns forming the signal wiring other than the first signal wiring are the signal wirings formed by the respective patterns. May be formed so as to have a parallel or substantially parallel shape. In the second meandering section, the wiring patterns including the first wiring patterns forming the first signal wirings as the wiring patterns forming the signal wirings other than the second signal wirings are the signal wirings formed by the respective patterns. May be formed so as to have a parallel or substantially parallel shape. Since the second meandering section is started after the first meandering section ends, the first meandering section is arranged so as not to overlap with the second meandering section. Thereby, even when a portion having a shape different from a linear shape such as a meandering shape and a substantially linear shape is provided for a large number of signal wirings, an increase in a substrate area for arranging wiring patterns is suppressed as much as possible. The size of the substrate can be reduced.

(Explanation about the characteristic part 42AK)
FIG. 16 shows a configuration example of a portion where a plurality of signal wirings configured by wiring patterns are formed, regarding the characteristic portion 42AK of the present embodiment. The wiring pattern shown in FIG. 16 may be any pattern that forms a plurality of signal wires connecting a plurality of electrical components such as the RAM 102 and the CPU 103 on the main board 11, for example. In the configuration example shown in FIG. 16, a wiring pattern forming two signal wirings is shown as a wiring pattern forming a plurality of signal wirings. FIG. 16A shows a case where W1 <W2 where the wiring interval W1 is smaller than the wiring interval W2, and FIG. 16B shows a case where W1> W2 where the wiring interval W1 is wider than the wiring interval W2. The wiring interval W1 is a wiring interval based on a wiring pattern in a portion where the same signal wiring has a meandering shape. The wiring interval W2 is a wiring interval between wiring patterns that are adjacent to each other in parallel or substantially parallel and that constitute different signal wirings.

  The wiring patterns included in the two signal wirings illustrated in FIG. 16A include a first wiring pattern 42AK10 and a second wiring pattern 42AK11. The first pattern 42AK10 of the wiring and the second pattern 42AK11 of the wiring are arranged such that each signal wiring includes the wiring part 42AK1Z and the wiring part 42AK2Z according to the shape of the signal wiring formed by the wiring pattern. Is formed.

  In the wiring portion 42AK1Z, the signal wiring formed by the first wiring pattern 42AK10 forms the second shape portion 42AK10M, and the signal wiring formed by the second wiring pattern 42AK11 forms the first shape portion 42AK11L. . In the wiring portion 42AK2Z, the signal wiring formed by the first wiring pattern 42AK10 forms the first shape portion 42AK10L, and the signal wiring formed by the second wiring pattern 42AK11 forms the second shape portion 42AK11M. . The first shape portions 42AK10L and 42AK11L are formed such that the signal wiring has a first shape of a linear shape or a substantially linear shape. The second shape portions 42AK10M and 42AK11M are formed such that the signal wiring has a second shape such as a meandering shape, which is different from a linear shape and a substantially linear shape. Note that the second shape portions 42AK10M and 42AK11M are not limited to the meandering shape, and may be formed in any shape different from the linear shape and the substantially linear shape.

  As described above, in the plurality of signal wirings configured by the first wiring pattern 42AK10 and the second wiring pattern 42AK11, the signal wiring configured by the second wiring pattern 42AK11 in the wiring section 42AK1Z has a linear shape or Corresponding to the first shape portion 42AK11L that is the first shape of the substantially linear shape, the signal wiring formed by the first pattern 42AK10 of the wiring has a second shape such as a meandering shape different from the first shape portion 42AK11L. The second shape portion 42AK10M is included. That is, in the wiring portion 42AK1Z, the signal wiring formed by the first pattern 42AK10 of the wiring includes the second shape portion 42AK11M corresponding to the first shape portion 42AK11L of the signal wiring formed by the second wiring pattern 42AK11. In.

  The plurality of signal wirings configured by the first wiring pattern 42AK10 and the second wiring pattern 42AK11 may be configured such that the signal wiring configured by the first wiring pattern 42AK10 has a linear shape or a substantially linear shape in the wiring portion 42AK2Z. The signal wiring formed by the second pattern 42AK11 of the wiring has a second shape such as a meandering shape different from the first shape portion 42AK10L, corresponding to the first shape portion 42AK10L of the first shape. Shape part 42AK11M is included. That is, in the wiring portion 42AK2Z, the signal wiring formed by the second pattern 42AK11 of the wiring includes the second shape portion 42AK11M corresponding to the first shape portion 42AK10L of the signal wiring formed by the first pattern 42AK10 of the wiring. In.

  The second shape portion 42AK10M and the second shape portion 42AK11M in which the signal wiring shown in FIG. 16A has a second shape such as a meandering shape include the second shape portion 42AK10M in the wiring portion 42AK1Z and the second shape portion 42AK11M. Are formed so as to be included in the wiring portion 42AK2Z. Thus, the second shape portions 42AK10M and the second shape portions 42AK11M do not overlap with each other. In addition, the wiring length of each signal wiring is formed to be the same or substantially the same. Since the signal wiring composed of the first wiring pattern 42AK10 and the second wiring pattern 42AK11 is formed so as to include the second shape portion 42AK10M and the second shape portion 42AK11M, the wiring pattern The increase in the area of the substrate on which is disposed is suppressed, and the size of the substrate can be reduced.

  The wiring patterns included in the two signal wirings illustrated in FIG. 16B include a third wiring pattern 42AK12 and a fourth wiring pattern 42AK13. Each of the third wiring pattern 42AK12 and the fourth wiring pattern 42AK13 includes a wiring portion 42AK3Z and a wiring portion 42AK4Z according to the shape of the signal wiring formed by the wiring pattern. Is formed.

  The signal wiring composed of the third wiring pattern 42AK12 and the fourth wiring pattern 42AK13 is a wiring section 42AK3Z in which the signal wiring composed of the fourth wiring pattern 42AK13 has a linear or substantially linear first shape. In correspondence with the first shape portion 42AK13L, the signal wiring formed by the third wiring pattern 42AK12 has a second shape portion 42AK12M having a second shape such as a meandering shape different from the first shape portion 42AK13L. Contains. That is, in the wiring portion 42AK3Z, the signal wiring formed by the third pattern 42AK12 of the wiring includes the second shape portion 42AK12M corresponding to the first shape portion 42AK13L of the signal wiring formed by the fourth pattern 42AK13 of the wiring. In.

  Further, the signal wiring constituted by the third wiring pattern 42AK12 and the fourth wiring pattern 42AK13 has a wiring portion 42AK4Z in which the signal wiring constituted by the third wiring pattern 42AK12 has a linear shape or a substantially linear shape. In correspondence with the first shape portion 42AK12L serving as the first shape, the second shape portion in which the signal wiring formed by the fourth pattern 42AK13 of the wiring has a second shape such as a meander shape different from the first shape portion 42AK12L. 42AK13M. That is, in the wiring portion 42AK4Z, the signal wiring formed by the fourth wiring pattern 42AK13 includes the second shaped portion 42AK13M, corresponding to the first shape portion 42AK12L of the signal wiring formed by the third wiring pattern 42AK12. In.

  The second shape portion 42AK12M and the second shape portion 42AK13M in which the signal wiring illustrated in FIG. 16B has a second shape such as a meandering shape include the second shape portion 42AK12M in the wiring portion 42AK3Z and the second shape portion 42AK13M. Are formed so as to be included in the wiring portion 42AK4Z. Thus, the second shape portions 42AK12M and the second shape portions 42AK13M do not overlap with each other. In addition, the wiring length of each signal wiring is formed to be the same or substantially the same. Since the signal wiring composed of the third wiring pattern 42AK12 and the fourth wiring pattern 42AK13 is formed so as to include the second shape portion 42AK12M and the second shape portion 42AK13L, the wiring pattern The increase in the area of the substrate on which is disposed is suppressed, and the size of the substrate can be reduced.

  In the configuration example shown in FIG. 16A, each signal wiring is formed such that the wiring interval W2 is wider than the wiring interval W1. For example, in the second shape portion 42AK10M and the second shape portion 42AK11M, the same signal wiring turned back by the bent portion forms a meandering shape that reciprocates at the wiring interval W1, whereas the first wiring pattern 42AK10 is used. When the signal wiring to be formed and the signal wiring formed by the second wiring pattern 42AK11 are parallel or substantially parallel to each other, the wiring interval W2 between adjacent signal wirings is set to be wider than the wiring interval W1. Signal wiring is formed. As described above, since the wiring interval W2 between adjacent signal wirings is wider than the wiring interval W1 in the same signal wiring, adverse effects due to a short circuit or the like generated in one signal wiring may be caused in other signal wirings. It is possible to prevent or suppress the transmission of the signal.

  In the configuration example shown in FIG. 16B, each signal wiring is formed such that the wiring interval W2 is smaller than the wiring interval W1. For example, in the second shape portion 42AK12M and the second shape portion 42AK13M, the same signal wiring folded by the bent portion forms a meandering shape that reciprocates at the wiring interval W1, whereas the third wiring pattern 42AK12 is used. When the signal wiring to be formed and the signal wiring formed by the fourth wiring pattern 42AK13 are parallel or substantially parallel to each other, the wiring interval W2 between adjacent signal wirings is smaller than the wiring interval W1. Signal wiring is formed. As described above, since the wiring interval W2 between adjacent signal wirings is narrower than the wiring interval W1 in the same signal wiring, one signal wiring and another signal wiring are shorter than a short circuit inside one signal wiring. Is more likely to occur. A short circuit that has occurred between one signal wiring and another signal wiring can be easily detected using test points provided on each signal wiring. For example, by making a test probe contact a test point provided in each signal wiring and performing an electrical characteristic test of the signal wiring, a short circuit generated between one signal wiring and another signal wiring can be detected. .

  As shown in FIG. 16A, on the other hand, the signal wiring constituted by the second wiring pattern 42AK11 corresponds to the wiring portion 42AK1Z forming the first shape portion 42AK11L, and the first wiring pattern 42AK10 is formed. Constitute the second shape portion 42AK10M. On the other hand, the signal wiring formed by the second wiring pattern 42AK11 corresponds to the wiring portion 42AK1Z forming the first shape portion 42AK10L, and the signal wiring formed by the second wiring pattern 42AK10L has the second shape. The portion 42AK11M is formed. As shown in FIG. 16B, on the other hand, the signal wiring constituted by the fourth wiring pattern 42AK13 corresponds to the wiring part 42AK3Z forming the first shape part 42AK13L, and the third wiring pattern 42AK12. Form the second shape portion 42AK12M. On the other hand, the signal wiring constituted by the third pattern 42AK12 of the wiring corresponds to the wiring part 42AK4Z forming the first shape part 42AK12L, and the signal wiring constituted by the fourth pattern 42AK13 of the wiring has the second shape. The portion 42AK13M is formed. The correspondence relationship between the signal wirings formed by the patterns of the wirings may be a predetermined arbitrary relationship such as an up-down relationship, a left-right relationship, or a range less than a predetermined distance when viewed from a direction perpendicular to the substrate surface such as the main substrate 11. The relationship may be satisfied if the signal wiring is within the position range, and not satisfied if the signal wiring is not within the position range.

  In the example shown in FIGS. 16A and 16B, the signal wiring formed by another wiring pattern corresponding to the first shape portion of the signal wiring formed by one wiring pattern is the second wiring. The signal line formed by one wiring pattern corresponding to the first shape portion of the signal wiring formed by the wiring portion forming the shape and the signal wiring formed by another wiring pattern forms the second shape. In the wiring section, each signal wiring is formed so that the wiring interval W1 is common and the wiring interval W2 is also common. More specifically, the signal wiring constituted by the first pattern 42AK10 of the wiring corresponds to the first shape portion 42AK11L in the signal wiring constituted by the second pattern 42AK11 of the wiring shown in FIG. The signal line formed by the second pattern 42AK11 of the wiring corresponds to the wiring part 42AK1Z forming the two-shaped part 42AK10M and the first shape part 42AK10L of the signal wiring formed by the first pattern 42AK10 of the wiring. Each signal wiring is formed such that the wiring interval W1 is common (constant) and the wiring interval W2 is also common (constant) with the wiring portion 42AK2Z forming the second shape portion 42AK11M. This facilitates wiring pattern design on the substrate surface. Further, since the difference in shape among the plurality of signal lines is suppressed, the variation in the characteristic impedance of each signal line is suppressed, and the signal quality of the plurality of signal lines is homogenized.

  In addition, a signal portion formed of another wiring pattern corresponds to a first shape portion of a signal wiring formed of one wiring pattern, and a wiring portion forming a second shape corresponds to a signal portion formed of another wiring pattern. One of the wiring interval W1 and the wiring interval W2 is different from the wiring portion in which the signal wiring formed by the one wiring pattern forms the second shape corresponding to the first shape portion in the signal wiring formed by the pattern. Alternatively, each signal wiring may be formed so that both are different. For example, in the wiring portion 42AK1Z and the wiring portion 42AK2Z shown in FIG. 16A, the wiring interval W2 is common, while the wiring interval W1 is wider in the wiring portion 42AK2Z than in the wiring portion 42AK1Z. Wiring may be formed. In such a case, it is possible to flexibly design a wiring pattern on the substrate surface.

  FIG. 17 shows a configuration example in which the second shape portions of a plurality of signal wirings formed by wiring patterns are formed in different directions. In the configuration example illustrated in FIG. 17A, a wiring pattern forming three signal wirings is illustrated as a wiring pattern forming a plurality of signal wirings. In the configuration example illustrated in FIG. 17B, wiring patterns forming four signal wirings are illustrated as wiring patterns forming a plurality of signal wirings.

  The wiring patterns included in the three signal wirings illustrated in FIG. 17A include a first wiring pattern 42AK20, a second wiring pattern 42AK21, and a third wiring pattern 42AK22. The signal wiring constituted by the first wiring pattern 42AK20 includes a portion forming the second shape portion 42AK20M. The signal wiring constituted by the wiring second pattern 42AK21 includes a portion forming the second shape portion 42AK21M. The signal wiring formed by the third wiring pattern 42AK22 includes a portion forming the second shape portion 42AK22M. The second shape portion 42AK20M and the second shape portion 42AK21M have a meandering shape that turns back and forth in a first direction, for example, a left-right direction. On the other hand, the second shape portion 42AK22M has a meandering shape that returns and reciprocates in a second direction different from the first direction, such as a vertical direction. In addition, each 2nd shape part is not limited to a meandering shape, What is necessary is just to be formed so that it may be arbitrary shapes different from a linear shape and a substantially linear shape.

  In this manner, the second shape portion 42AK20M in the signal wiring formed by the first wiring pattern 42AK20 is common (parallel) to the second shape portion 42AK21M in the signal wiring formed by the second wiring pattern 42AK21. It is formed in the direction. On the other hand, the second shape portion 42AK22M in the signal wiring formed by the third pattern 42AK22 of the wiring is the second shape portion 42AK20M formed by the first pattern of the wiring and the second shape formed by the second pattern of the wiring. It is formed in a second direction different from the first direction in which the shape portion 42AK21M is formed. By forming the second shape portions in different directions in a plurality of signal wirings, it is possible to easily and flexibly design wiring patterns on the substrate surface. Further, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

  The wiring patterns included in the four signal wirings illustrated in FIG. 17B include a fourth wiring pattern 42AK23, a fifth wiring pattern 42AK24, a sixth wiring pattern 42AK25, and a seventh wiring pattern 42AK26. . The signal wiring constituted by the fourth wiring pattern 42AK23 includes portions forming two second shape portions 42AK23M1 and 42AK23M2. The signal wiring constituted by the fifth wiring pattern 42AK24 includes a portion forming one second shape portion 42AK24M. The signal wiring constituted by the sixth wiring pattern 42AK25 includes a portion forming one second shape portion 42AK25M. The signal wiring constituted by the seventh wiring pattern 42AK26 includes portions forming two second shape portions 42AK26M1 and 42AK26M2. Among the plurality of second shape portions shown in FIG. 17B, the second shape portions 42AK23M1, 42AK25M, and 42AK26M2 have a meandering shape that returns and reciprocates in a first direction, such as a vertical direction. On the other hand, the second shape portions 42AK23M2, 42AK24M, and 42AK26M1 have a meandering shape that returns and reciprocates in a second direction different from the first direction, such as the left-right direction.

  As shown in FIG. 17B, a plurality of signal wirings configured by a wiring pattern include a signal wiring including a part forming one second shape part and a part forming a plurality of second shape parts. May be included. Alternatively, the plurality of signal wirings configured by the wiring pattern may include only a portion where each signal wiring forms one second shape portion. Alternatively, the plurality of signal wirings configured by the wiring pattern may include a portion where each signal wiring forms a plurality of second shape portions. The second shape portion 42AK23M1 in the signal wiring formed by the fourth pattern 42AK23 of the wiring shown in FIG. 17B is the second shape portion 42AK25M in the signal wiring formed by the sixth pattern 42AK25 of the wiring and the seventh shape of the wiring. It is formed in a first direction common (parallel) with the second shape portion 42AK26M2 in the signal wiring constituted by the pattern 42AK26. The second shape portion 42AK23M2 in the signal wiring formed by the fourth wiring pattern 42AK23 is configured by the second shape portion 42AK24M in the signal wiring formed by the fifth wiring pattern 42AK24 and the seventh pattern 42AK26 of the wiring. The second shape portion 42AK26M1 of the signal wiring is formed in a second direction common (parallel) to the second shape portion 42AK26M1. On the other hand, the second shape portions 42AK23M2, 42AK24M, and 42AK26M1 are formed in a second direction different from the first direction in which the second shape portions 42AK23M1, 42AK25M, and 42AK26M2 are formed.

  The signal wiring formed by the fourth wiring pattern 42AK23 includes a second shape part 42AK23M1 formed in the first direction and a second shape part 42AK23M2 formed in the second direction. The signal wiring constituted by the seventh wiring pattern 42AK26 includes a second shape portion 42AK26M1 formed in the second direction and a second shape portion 42AK26M2 formed in the first direction. As described above, even a single signal wiring formed by the same wiring pattern may include a plurality of second shape portions formed in different directions. Further, the signal wiring formed by one wiring pattern is different from the second shape part of the signal wiring formed by another wiring pattern in the common (parallel) direction. It may include a second shape portion formed in the direction. By forming the second shape portions in different directions in one or a plurality of signal wirings, it is possible to easily and flexibly design a wiring pattern on the substrate surface. Further, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

  FIG. 18 shows a configuration example in which a plurality of signal wirings configured by wiring patterns are formed with different wiring widths. In the configuration example shown in FIG. 18, a wiring pattern forming four signal wirings is shown as a wiring pattern forming a plurality of signal wirings. FIG. 18A shows a case where the wiring width is different for the entire signal wiring, and FIG. 18B shows a case where the wiring width is different for a part of the signal wiring.

  The wiring patterns included in the four signal wirings illustrated in FIG. 18A include a first wiring pattern 42AK30, a second wiring pattern 42AK31, a third wiring pattern 42AK32, and a fourth wiring pattern 42AK43. . The signal wiring constituted by the first wiring pattern 42AK30 includes a portion forming the second shape portion 42AK30M. The signal wiring constituted by the second wiring pattern 42AK31 includes a portion forming the second shape portion 42AK31M. The signal wiring formed by the third wiring pattern 42AK32 includes a portion forming the second shape portion 42AK32M. The signal wiring constituted by the fourth wiring pattern 42AK33 includes a portion forming the second shape portion 42AK33M.

  The signal wiring formed by the first wiring pattern 42AK30 is formed to have the same or substantially the same wiring width as the signal wiring formed by the second wiring pattern 42AK31. The signal wiring formed by the third wiring pattern 42AK32 is formed to have the same or substantially the same wiring width as the signal wiring formed by the fourth wiring pattern 42AK33. On the other hand, the signal wiring composed of the first wiring pattern 42AK30 and the signal wiring composed of the second wiring pattern 42AK31 are the signal wiring composed of the third wiring pattern 42AK32 and the fourth wiring pattern 42AK33. Is formed so that the wiring width of the entire signal wiring is wider than that of the signal wiring formed by the above. As described above, the first wiring pattern 42AK30 and the second wiring pattern 42AK31 constitute a signal wiring having a wide wiring width, and the third wiring pattern 42AK32 and the fourth wiring pattern 42AK33 constitute a narrow signal wiring. are doing.

  The signal wiring formed by the first wiring pattern 42AK30 and the signal wiring formed by the second wiring pattern 42AK31 transmit a common type of electrical signal such as a first type of differential signal. Good. In addition, the signal wiring formed by the third wiring pattern 42AK32 and the signal wiring formed by the fourth wiring pattern 42AK33 have a common type such as a second type of differential signal different from the first type. May be transmitted. On the other hand, the signal wiring formed by the first wiring pattern 42AK30 and the signal wiring formed by the second wiring pattern 42AK31, and the signal wiring formed by the third wiring pattern 42AK32 and the fourth wiring pattern 42AK33. Different types of electric signals may be transmitted to the signal wiring constituted by the above. As described above, the plurality of signal wirings configured by the wiring patterns may be formed to have different wiring widths depending on the type of the transmitted electric signal. Alternatively, a plurality of signal wirings configured by wiring patterns may be formed to have the same or substantially the same wiring width when the types of transmitted electric signals are common. Note that the plurality of signal wirings configured by the wiring patterns may include signal wirings formed to have different wiring widths, even when the type of the transmitted electric signal is common. Alternatively, the plurality of signal wirings formed by the wiring patterns include signal wirings formed to have the same or substantially the same wiring width even when the types of transmitted electric signals are different. Is also good. Since the plurality of signal lines are formed with different line widths, the characteristic impedance of each signal line can be easily adjusted, and appropriate transmission according to the type of the electric signal can be performed.

  The wiring patterns included in the four signal wirings illustrated in FIG. 18B include a fifth wiring pattern 42AK34, a sixth wiring pattern 42AK35, a seventh wiring pattern 42AK36, and an eighth wiring pattern 42AK37. . The signal wiring constituted by the fifth wiring pattern 42AK34 includes a portion forming the second shape portion 42AK34M. The signal wiring formed by the sixth wiring pattern 42AK35 includes a portion forming the second shape portion 42AK35M. The signal wiring formed by the wiring seventh pattern 42AK36 includes a portion forming the second shape portion 42AK36M. The signal wiring constituted by the eighth wiring pattern 42AK37 includes a portion forming the second shape portion 42AK37M.

  The signal wiring formed by the fifth wiring pattern 42AK34 and the signal wiring formed by the sixth wiring pattern 42AK35 are configured such that a part of the wiring width is different from that of the other part. For example, the second shape portion 42AK34M of the signal wiring constituted by the fifth pattern 42AK34 of the wiring is formed so that the wiring width is wider than other portions of the same signal wiring. The second shape portion 42AK35M of the signal wiring constituted by the sixth pattern 42AK35 of the wiring is formed so that the wiring width is wider than other portions of the same signal wiring. As described above, the fifth pattern 42AK34 of the wiring configures a signal wiring having a wide wiring width in the second shape portion 42AK34M, and configures a signal wiring having a small wiring width in a portion other than the second shape portion 42AK34M. The sixth pattern 42AK35 of the wiring forms a signal wiring having a wide wiring width in the second shape portion 42AK35M, and a signal wiring having a narrow wiring width in a portion other than the second shape portion 42AK35M. The second shape portion is not limited to a signal wire having a wide wiring width, and a first shape portion having a linear shape or a substantially linear shape forms a signal wire having a wide wiring width. Is also good.

  The signal wiring constituted by the fifth wiring pattern 42AK34 is formed such that the wiring width of the same signal wiring is different because the wiring width of the second shape portion 42AK34M is wider than other parts. The signal wiring constituted by the sixth wiring pattern 42AK35 is formed such that the wiring width of the same signal wiring is different because the wiring width of the second shape portion 42AK35M is wider than the other parts. On the other hand, the signal wiring composed of the seventh wiring pattern 42AK36 and the signal wiring composed of the eighth wiring pattern 42AK37 are formed so that the wiring width of the same signal wiring is the same or substantially the same. I have. Since one or a plurality of signal wirings are partially formed to have different wiring widths, it is possible to easily adjust the characteristic impedance of each signal wiring and to appropriately transmit according to the type of electric signal. Become.

  FIG. 19 shows a configuration example in which the second shape portions of a plurality of signal wirings configured by wiring patterns are formed correspondingly. In the configuration example shown in FIG. 19, a wiring pattern forming two signal wirings is shown as a wiring pattern forming a plurality of signal wirings. FIG. 19A shows a case where two signal wires meander in a substantially parallel manner, and FIG. 19B shows a case where two signal wires meander in a direction away from each other.

  The wiring patterns included in the two signal wirings illustrated in FIG. 19A include a first wiring pattern 42AK40 and a second wiring pattern 42AK41. The first pattern 42AK40 of the wiring and the second pattern 42AK41 of the wiring have a meandering shape that returns and reciprocates in a common (parallel) direction, for example, a vertical direction. In the meandering shape, when the signal wiring constituted by the first wiring pattern 42AK40 is bent and protruded in the direction approaching the signal wiring constituted by the second wiring pattern 42AK41 with respect to the extension direction DR1, The signal wiring formed by the second wiring pattern 42AK41 is bent and protrudes in the direction away from the signal wiring formed by the first wiring pattern 42AK40 with respect to the extending direction DR1. Thereafter, when the signal wiring composed of the first wiring pattern 42AK40 is bent in the direction away from the signal wiring composed of the second wiring pattern 42AK41 with respect to the extension direction DR1 and returned, The signal wiring constituted by the second pattern 42AK41 is bent and returned in the extending direction DR1 in a direction approaching the signal wiring constituted by the first pattern 42AK40 of the wiring. Further, in the meandering shape, the signal wiring constituted by the first wiring pattern 42AK40 is bent and protruded in the direction away from the signal wiring constituted by the second wiring pattern 42AK41 with respect to the extension direction DR1. In addition, the signal wiring formed by the second wiring pattern 42AK41 is bent and protruded from the extending direction DR1 in a direction approaching the signal wiring formed by the first wiring pattern 42AK40. Thereafter, when the signal wiring composed of the first wiring pattern 42AK40 is bent in the direction approaching the signal wiring composed of the second wiring pattern 42AK41 with respect to the extension direction DR1 and returned, The signal wiring formed by the second pattern 42AK41 is bent in the extending direction DR1 in a direction away from the signal wiring formed by the first pattern 42AK40, and returns. Thus, the first pattern 42AK40 of the wiring and the second pattern 42AK41 of the wiring form a meandering signal wiring that turns back and forth substantially in parallel while maintaining substantially the same wiring interval. The shape is not limited to the meandering shape, and may be any shape different from the linear shape and the substantially linear shape.

  As described above, the signal wiring formed by the first wiring pattern 42AK40 is formed parallel or substantially parallel to the signal wiring formed by the second wiring pattern 42AK41, and has a shape different from the linear shape and the substantially linear shape. It is formed so that it becomes. Since the second shape portion having a shape different from the straight line shape and the substantially straight line shape is formed while being parallel or substantially parallel in the plurality of signal wires, the wiring pattern design on the substrate surface is easy and flexible. Can be done. Further, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

  The wiring patterns included in the two signal wirings illustrated in FIG. 19B include a third wiring pattern 42AK42 and a fourth wiring pattern 42AK43. The third wiring pattern 42AK42 and the fourth wiring pattern 42AK43 have a meandering shape that reciprocates in a common (parallel) direction, for example, a vertical direction. In this meandering shape, when the signal wiring formed by the third wiring pattern 42 is bent and protruded in the direction away from the signal wiring formed by the fourth wiring pattern 42AK43 with respect to the extending direction DR1, The signal wiring formed by the fourth wiring pattern 42AK43 is bent and protrudes in the direction away from the signal wiring formed by the third wiring pattern 42AK42 in the extending direction DR1. When the signal wiring formed by the third wiring pattern 42AK42 is bent and returned from the protrusions due to these protrusions in the extending direction DR1 in a direction approaching the signal wiring formed by the fourth wiring pattern 42AK43. Then, the signal wiring formed by the fourth wiring pattern 42AK43 is bent and returned in the extending direction DR1 in a direction approaching the signal wiring formed by the third wiring pattern 42AK42. In this way, the third wiring pattern 42AK42 and the fourth wiring pattern 42AK43 form a meandering signal wiring that reciprocates in a reciprocating manner, protruding in a direction away from each other and returning in an approaching direction while changing the wiring interval. I have.

  As described above, the signal wiring formed by the third wiring pattern 42AK42 is formed in a direction common to (parallel to) the signal wiring formed by the fourth wiring pattern 42AK43, and is different from the linear shape and the substantially linear shape. It is formed to have a shape. The second shape portion having a shape different from the linear shape and the substantially linear shape is formed, such as a shape in which the plurality of signal wirings are bent in a direction away from each other, bent in a direction in which the signal wiring protrudes, and returned, so that the substrate surface is formed. In this case, the wiring pattern can be easily and flexibly designed. Further, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

  FIG. 20 shows a configuration example in which circuit components are mounted so as to be connected to a plurality of signal wirings configured by wiring patterns. In the configuration example illustrated in FIG. 20A, a wiring pattern forming four signal wirings is illustrated as a wiring pattern forming a plurality of signal wirings. The wiring patterns constituting these four signal wirings include a first wiring pattern 42AK50, a second wiring pattern 42AK51, a third wiring pattern 42AK52, and a fourth wiring pattern 42AK53. The signal wiring formed by the second wiring pattern 42AK51 includes a portion forming the first shape portion 42AK51L and a portion forming the second shape portion 42AK51M. The signal wiring constituted by the third wiring pattern 42AK52 includes a portion forming the first shape portion 42AK52L and a portion forming the second shape portion 42AK52M.

  A circuit component 42AK1R connected to the signal wiring formed by the first wiring pattern 42AK50 is provided on the second shape portion 42AK51M of the signal wiring formed by the second wiring pattern 42AK51 shown in FIG. Is mounted so as to be connected to the signal wiring constituted by the second pattern 42AK51. The circuit component 42AK1R may be any circuit element such as a resistance element. The circuit component 42AK1R may partially or entirely include a passive element such as a capacitor or a coil, for example, together with or instead of the resistance element. The circuit component 42AK1R may partially or entirely include a diode, a transistor such as a bipolar transistor or a MOS transistor, or an active element such as a thyristor, instead of or together with a passive element such as a resistance element, a capacitor, or a coil. . The circuit component 42AK1R may constitute a functional circuit such as a filter circuit, a noise prevention circuit, or another IC chip. The circuit component 42AK1R supplies a specific power supply voltage to the signal wiring configured by the second wiring pattern 42AK51 when the signal wiring configured by the first wiring pattern 42AK50 is maintained at a specific power supply voltage. It may function as an enabling pull-up resistor. Alternatively, the circuit component 42AK1R can supply the ground voltage to the signal wiring constituted by the second wiring pattern 42AK51 when the signal wiring constituted by the first wiring pattern 42AK50 is maintained at the ground voltage. May function as a pull-down resistor. Alternatively, the circuit component 42AK1R may be a functional circuit in which the resistance element can be switched between a pull-up resistor and a pull-down resistor by a polarity switching unit.

  FIG. 20B is an enlarged view showing a connection portion of the circuit component 42AK1R. In the second shape portion 42AK51M shown in FIG. 20 (B), three folded portions where the signal wiring constituted by the second pattern 42AK51 of the wiring is folded through the bent portion are shown. These three folded portions include a first folded portion 42AK51M1, a second folded portion 42AK51M2, and a third folded portion 42AK51M3. The circuit component 42AK1R is mounted in the second folded portion 42AK51M2 so as to be connected to the signal wiring formed by the second wiring pattern 42AK51 and the signal wiring formed by the first wiring pattern 42AK50. I have. In the second folded portion 42AK51M2 shown in FIG. 20B, the same signal wiring folded back through the bent portion forms a shape that reciprocates at the wiring interval W3. On the other hand, in the first folded portion 42AK51M1 and the third folded portion 42AK51M3, the same signal wiring that is folded through the bent portion is formed to reciprocate at the wiring interval W4. Further, the interval between the first folded portion 42AK51M1 and the second folded portion 42AK51M2 and the interval between the second folded portion 42AK51M2 and the third folded portion 42AK51M3 are also formed to be the wiring interval W4. The signal line is formed such that the line interval W3 is wider than the line interval W4. As described above, the wiring interval W3 in the second folded portion 42AK51M2 where the circuit component 42AK1R is mounted is wider than the wiring interval W4 in the portion where the circuit component 42AK1R is not mounted in the second shape portion 42AK51M. It can be easily mounted to appropriately adjust the transmission characteristics and the like in the signal wiring.

  The wiring interval W3 in the second folded portion 42AK51M2 where the circuit component 42AK1R is mounted is not limited to be wider than the wiring interval W4 in the portion where the circuit component 42AK1R is not mounted in the second shape portion 42AK51M. W3 may be the same or substantially the same as the wiring interval W4, or the wiring interval W3 may be formed to be smaller than the wiring interval W4. Further, the circuit component 42AK1R is not limited to being mounted so as to be connected to the signal wiring constituted by the second pattern 42AK52 of the wiring at the second folded portion 42AK51M2, but may be the first folded portion 42AK51M1 or the third folded portion. The portion 42AK51M3 may be mounted so as to be connected to the signal wiring constituted by the second wiring pattern 42AK52.

  As described above, the second shape portion 42AK51M of the signal wiring formed by the second pattern 42AK51 of the wiring shown in FIG. 20A and the like is connected to the signal wiring formed by the first wiring pattern 42AK50. Is provided with the circuit component 42AK1R mounted on the device. By mounting the circuit component on the second shape portion, it is possible to appropriately adjust transmission characteristics and the like in the signal wiring. Further, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

  In the first shape portion 42AK52L of the signal wiring formed by the third wiring pattern 42AK52 shown in FIG. 20A, a circuit component 42AK2R connected to the signal wiring formed by the fourth wiring pattern 42AK53 is provided. Is mounted so as to be connected to the signal wiring constituted by the third pattern 42AK52. The circuit component 42AK2R may be any circuit element such as a resistance element. The circuit component 42AK2R may partially or entirely include a passive element such as a capacitor or a coil together with or instead of the resistance element. The circuit component 42AK2R may partially or entirely include a diode, a transistor such as a bipolar transistor or a MOS transistor, or an active element such as a thyristor, instead of or in addition to a passive element such as a resistance element, a capacitor, or a coil. . The circuit component 42AK2R may constitute a functional circuit such as a filter circuit, a noise prevention circuit, or another IC chip. The circuit component 42AK2R supplies a specific power supply voltage to the signal wiring configured by the third wiring pattern 42AK52 when the signal wiring configured by the fourth wiring pattern 42AK53 is maintained at a specific power supply voltage. It may function as an enabling pull-up resistor. Alternatively, the circuit component 42AK2R can supply the ground voltage to the signal wiring constituted by the third wiring pattern 42AK52 when the signal wiring constituted by the fourth wiring pattern 42AK53 is maintained at the ground voltage. May function as a pull-down resistor. Alternatively, the circuit component 42AK2R may be a functional circuit in which the resistance element can be switched between a pull-up resistor and a pull-down resistor by a polarity switching unit.

  As described above, the signal pattern formed by the third pattern 42AK52 of the wiring shown in FIG. 20A is formed by the fourth pattern 42AK53 of the wiring at the first shape part 42AK52L different from the second shape part 42AK52M of the signal wiring. A circuit component 42AK2R mounted so as to be connected to the signal wiring is provided. By mounting the circuit component on a portion different from the second shape portion, it is possible to appropriately adjust the transmission characteristics and the like of the signal wiring. Further, an increase in the area of the substrate on which the wiring pattern is arranged is suppressed, and the size of the substrate can be reduced.

  Each signal wiring may be formed such that a wiring width in a portion where the circuit component 42AK1R or the circuit component 42AK2R is mounted is different from a wiring width in a portion where the circuit component 42AK1R or the circuit component 42AK2R is not mounted. For example, each signal wiring may be formed such that a wiring width in a portion where the circuit component 42AK1R or the circuit component 42AK2R is mounted is wider than a wiring width in a portion where the circuit component 42AK1R or the circuit component 42AK2R is not mounted. As described above, the plurality of signal wirings configured by the wiring pattern may be formed so as to have a wiring width different from that of the part where the circuit component is not mounted, corresponding to the part where the circuit component is mounted. Since the wirings are formed to have different wiring widths corresponding to the parts on which the circuit components are mounted, it is possible to easily adjust the characteristic impedance of each signal wiring and to appropriately transmit the signal wiring.

  When a signal wiring having the first shape portions 42AK10L, 42AK11L, 42AK12L, 42AK13L and the second shape portions 42AK10M, 42AK11M, 42AK12M, 42AK13M as shown in FIGS. 16A and 16B is formed. In a plurality of signal wirings constituted by wiring patterns, for example, as shown in FIG. 17, the second shape portions may be formed in different directions, and for example, as shown in FIG. The second shape portion may be formed in a different wiring width, for example, as shown in FIG. 19, the second shape portion may be formed in a direction substantially parallel or away from the second shape portion, for example, as shown in FIG. A circuit component connected to a portion different from the two-shaped portion may be mounted, or a part or all of these may be formed in combination. .

(Explanation about the characteristic part 43AK)
FIG. 21 shows an example of a configuration of the characteristic portion 43AK of the present embodiment in which a test point serving as a specific conductor portion for confirming connection is provided in a second shape portion of a plurality of signal wirings configured by a wiring pattern. ing. In the configuration example shown in FIG. 21, a wiring pattern forming two signal wirings is shown as a wiring pattern forming a plurality of signal wirings. The wiring patterns that form these two signal wirings include a first wiring pattern 43AK10 and a second wiring pattern 43AK11. The signal wiring constituted by the first wiring pattern 43AK10 includes a portion forming the first shape portion 43AK10L and a portion forming the second shape portion 43AK10M. The signal wiring formed by the second wiring pattern 43AK11 includes a portion forming the first shape portion 43AK11L and a portion forming the second shape portion 43AK11M. The first shape portions 43AK10L and 43AK11L are formed such that the signal wiring has a first shape of a linear shape or a substantially linear shape. The second shape portions 43AK10M and 43AK11M are formed such that the signal wiring has a second shape such as a meandering shape, which is different from a linear shape and a substantially linear shape. Note that the second shape portions 43AK10M and 43AK11M are not limited to the meandering shape, and may be formed in any shape different from the linear shape and the substantially linear shape.

  At least some of the plurality of signal wirings configured by the first wiring pattern 43AK10 and the second wiring pattern 43AK11 are, for example, the first wiring pattern 42AK10 and the second wiring pattern 42AK11 illustrated in FIG. Or the same as the third pattern 42AK12 of the wiring and the fourth pattern 42AK13 of the wiring shown in FIG. For example, the signal wiring constituted by the first pattern 43AK10 of the wiring corresponds to the first shape portion 43AK11L having the first shape of the linear shape or the substantially linear shape. However, the second shape portion 43AK10M having a meandering shape different from the first shape portion 43AK11L may be included. In addition, the signal wiring formed by the second pattern 43AK11 of the wiring corresponds to the first shape portion 43AK10L having the linear shape or the substantially linear shape, and the signal wiring formed by the first pattern 43AK10 of the wiring is formed by the first wiring. What is necessary is just to include the 2nd shape part 43AK10M, such as a meandering shape different from the shape part 43AK10L.

  A test point 43AK10TP is provided on the second shape portion 43AK10M of the signal wiring constituted by the first pattern 43AK10 of the wiring as a specific conductor part for confirming connection. A test point 43AK11TP is provided on the second shape portion 43AK11M of the signal wiring formed by the second pattern 43AK11 of the wiring as a specific conductor for connection confirmation. The test points 43AK10TP and 43AK11TP may be formed using a metal material such as solder or copper foil. The test points 43AK10TP and 43AK11TP have, for example, a diameter W6 when formed in a circular shape that is larger than a wiring width W5 of a signal wiring formed by the first wiring pattern 43AK10 and a signal wiring formed by the second wiring pattern 43AK11. , So as to be large (wide). Note that the test points 43AK10TP and 43AK11TP are not limited to those formed in a circular shape, but may be formed in any shape such as a square shape or a strip shape. Regardless of the shape of the test points 43AK10TP and 43AK11TP, any shape may be used as long as the average shape is larger (wider) than the wiring width of the signal wiring. By providing the test points 43AK10TP and 43AK11TP, the variation in the characteristic impedance of the plurality of signal lines may be suppressed. As a result, the signal quality of the plurality of signal wirings is made uniform.

  For example, by bringing the test probe into contact with the test points 43AK10TP and 43AK11TP, a short circuit occurs between the signal wiring formed by the first wiring pattern 43AK10 and the signal wiring formed by the second wiring pattern 43AK11. The presence or absence of occurrence can be inspected. Note that, in addition to the test points 43AK10TP and 43AK11TP, a test point serving as a specific conductor for confirming connection may be provided. As an example, a test point other than the test point 43AK10TP may be provided in the signal wiring constituted by the first pattern 43AK10 of the wiring. A test probe is brought into contact with this test point and a test point 43AK10TP provided on the second shape portion 43AK10M, thereby inspecting whether or not a disconnection has occurred in the signal wiring constituted by the first pattern 43AK10 of the wiring. be able to. It may be configured such that the presence or absence of occurrence of a short circuit or disconnection can be inspected, or alternatively, a signal waveform can be confirmed or inspected using an oscilloscope instead of the inspection.

  Thus, the test point 43AK10TP is provided in the second shape portion 43AK10M in which the signal wiring shown in FIG. 21 has a second shape such as a meandering shape, and the test point 43AK11TP is provided in the second shape portion 43AK11M. By providing test points in the second shape portion of the signal wiring, the wiring pattern is appropriately arranged, and various structures are appropriately arranged, thereby suppressing an increase in the substrate area and reducing the size of the substrate. be able to. The test points 43AK10TP and 43AK11TP are formed using a metal material, and are formed so as to be wider than the wiring width of the signal wiring. Since the test point is formed so as to be larger (wider) than the wiring width of the signal wiring, the test probe can be easily brought into contact, and the electrical characteristics of the signal wiring can be inspected. In addition, by appropriately arranging the wiring patterns and appropriately arranging various structures, an increase in the substrate area can be suppressed, and the size of the substrate can be reduced.

  In the case where test points 43AK10TP and 43AK11TP as shown in FIG. 21 are provided, a plurality of signal wirings configured by wiring patterns are formed such that the second shape portions are formed in different directions, for example, as shown in FIG. For example, as shown in FIG. 18, the whole or a part of the signal wiring may be formed to have a different wiring width, and for example, as shown in FIG. 19, the second shape portion may be formed in a direction substantially parallel or apart from each other. For example, as shown in FIG. 20, a circuit component connected to the second shape portion or a portion different from the second shape portion may be mounted, and a part or all of these may be formed in combination. Is also good.

(Explanation about the characteristic part 44AK)
FIG. 22 relates to a characteristic portion 44AK of the present embodiment, in which a signal wiring including a second shape is provided on one surface of a main substrate 11 configured as a multilayer wiring substrate, and a specific conductor portion for connection confirmation is provided on the other surface. 3 shows a configuration example in a case where test points are provided. At least a part of the characteristic portion 44AK shown in FIG. 22 may be formed in the same manner as in the configuration example shown in FIG. For example, the characteristic portion 44AK may have a multilayer structure formed by laminating synthetic resins. The multilayer structure of the main substrate 11 shown in FIG. 22 includes a surface layer 44AK1S, a ground layer 44AK1L, a power layer 44AK2L, a wiring layer 44AK3L, a power layer 44AK4L, and a back layer 44AK2S.

  A surface layer 44AK1S is provided on a surface of the main substrate 11 which is one substrate surface, and wiring patterns 44AK10P and 44AK11P constituting signal wiring are formed. On the back surface serving as the other substrate surface of the main substrate 11, a back surface layer 44AK2S is provided, and a wiring pattern 44AK20P constituting a signal wiring is formed. The wiring pattern 44AK10P formed on the surface layer 44AK1S of the main substrate 11 is connected to the wiring pattern 44AK20P formed on the back layer 44AK2S via a through hole 44AK1H penetrating the surface layer 44AK1S and the back layer 44AK2S of the main substrate 11. It is electrically connected. The wiring pattern 44AK11P formed on the surface layer 44AK1S of the main substrate 11 is connected to the wiring pattern 44AK20P formed on the back layer 44AK2S via a through hole 44AK2H penetrating the surface layer 44AK1S and the back layer 44AK2S of the main substrate 11. It is electrically connected. As described above, on the main substrate 11, the wiring patterns 44AK10P and 44AK11P constituting the signal wiring in the surface layer 44AK1S provided on the surface serving as one substrate surface and the back surface serving as the other substrate surface are provided. In the back surface layer 44AK2S, a through hole 44AK1H and a through hole 44AK2H capable of electrically connecting the wiring pattern 44AK20P constituting the signal wiring are provided.

  The wiring pattern 44AK10P formed on the surface layer 44AK1S includes, for example, a portion for forming a first shape portion and a second shape portion, like the first pattern 43AK10 and the second pattern 43AK11 of the wiring shown in FIG. It suffices if a plurality of signal wirings are formed so as to include them. The signal wiring constituted by the first wiring pattern 43AK10 and the second wiring pattern 43AK11 shown in FIG. 21 is different from the signal wiring constituted by the second wiring pattern 43AK11 in that the first wiring has a linear shape or a substantially linear shape. The signal wiring constituted by the first pattern 43AK10 of the wiring should just include the second shape part 43AK10M having a meandering shape different from the first shape part 43AK11L, corresponding to the first shape part 43AK11L. In addition, the signal wiring formed by the second pattern 43AK11 of the wiring corresponds to the first shape portion 43AK10L having the linear shape or the substantially linear shape, and the signal wiring formed by the first pattern 43AK10 of the wiring is formed by the first wiring. What is necessary is just to include the 2nd shape part 43AK10M, such as a meandering shape different from the shape part 43AK10L.

  The test point 44AK10TP shown in FIG. 22 corresponds to the wiring pattern 44AK10P corresponding to the test point 43AK10TP provided in the second shape part 43AK10M and the test point 43AK11TP provided in the second shape part 43AK11M shown in FIG. As long as it is provided on the signal wiring composed of The test point 44AK10TP may be connected to a different conductor layer, for example, a wiring pattern 44AK20P formed on the back surface layer 44AK2S via the through hole 44AK1H. Note that the test point 44AK10TP is not limited to the wiring pattern 44AK20P formed on the back surface layer 44AK2S, and may be an arbitrary pattern different from the surface layer 44AK1S on which the test point 44AK10TP is provided, such as a wiring pattern formed on the wiring layer 44AK3L. What is necessary is just to be connected to the conductor layer. By connecting the conductor layer different from the layer where the test point is provided and the test point via the through hole, it is possible to easily perform the electrical characteristic inspection of the signal wiring and the conductor layer. In addition, by appropriately arranging the wiring patterns and appropriately arranging various structures, an increase in the substrate area can be suppressed, and the size of the substrate can be reduced.

  The wiring pattern 44AK11P formed on the surface layer 44AK1S only needs to be formed with a plurality of signal wirings so as to include portions forming the first shape portion and the second shape portion. As described above, the plurality of signal wirings configured by the wiring pattern 44AK11P include a second shape portion different from the linear shape and the substantially linear shape, such as the surface layer 44AK1S of the main substrate 11, on one surface of the substrate. Is formed. On the other hand, a test point 44AK11TP is provided on the back surface layer 44AK2S. The test point 44AK11TP may be provided on, for example, a signal wiring constituted by the wiring pattern 44AK20P, and may be connected to a different conductor layer such as a wiring pattern 44AK11P formed on the surface layer 44AK1S via the through hole 44AK2H. . By providing the test points 44AK10TP and 44AK11TP, the variation in the characteristic impedance of the plurality of signal lines may be suppressed. As a result, the signal quality of the plurality of signal wirings is made uniform. Since the signal wiring including the second shape portion is provided on one surface of the substrate and the test points are provided on the other surface of the substrate, the electrical characteristics of the signal wiring and the conductor layer can be easily inspected. In addition, by appropriately arranging the wiring patterns and appropriately arranging various structures, an increase in the substrate area can be suppressed, and the size of the substrate can be reduced.

  For example, it is only necessary that a test probe be brought into contact with the test point 44AK10TP so that the presence / absence of a short circuit can be inspected in a plurality of signal wirings configured by the wiring pattern 44AK10P. Further, for example, by bringing a test probe into contact with the test points 44AK10TP and 44AK11TP, it is possible to determine whether or not a disconnection has occurred in the signal wiring formed by the wiring pattern 44AK20P formed in the back surface layer 44AK2S and the through hole 44AK1H. It is only necessary to be able to inspect. In addition, the presence / absence of disconnection in a plurality of signal wirings constituted by the wiring pattern 44AK10P, the presence / absence of a short circuit or disconnection in a plurality of signal wirings constituted by the wiring pattern 44AK11P, and the configuration of the wiring pattern 44AK20P. A test point may be provided to enable inspection of whether or not a short circuit has occurred in a plurality of signal wirings, whether or not a short circuit has occurred in the through hole 44AK1H, and whether or not a short circuit or disconnection has occurred in the through hole 44AK2H.

  The test points that serve as specific conductors for connection confirmation are not limited to those provided with dedicated electrode pads for contacting the test probe.For example, circuit components can be connected to adjust the characteristic impedance of signal wiring What is necessary is just to be what was comprised using arbitrary electrode pads, such as an electrode pad provided in. The specific conductor portion such as a test point is a conductor layer different from a layer provided with a plurality of signal wirings and test points among a plurality of layers included in the multilayer wiring board due to a through hole provided in the multilayer wiring board. And electrical connection, it is possible to appropriately perform an electrical characteristic test on the multilayer wiring board. Appropriate electrical characteristics inspection on multi-layered wiring boards is provided by providing specific conductors such as test points on the other board surface different from the one on which the wiring pattern is formed, such as the backside board surface. Can be done. In addition, by appropriately arranging the wiring patterns and appropriately arranging various structures, an increase in the substrate area can be suppressed, and the size of the substrate can be reduced.

  When test points 44AK10TP and 44AK11TP as shown in FIG. 22 are provided, a plurality of signal wirings configured by wiring patterns are formed by forming second shape portions in different directions as shown in FIG. 17, for example. For example, as shown in FIG. 18, the whole or a part of the signal wiring may be formed to have a different wiring width, and for example, as shown in FIG. 19, the second shape portion may be formed in a direction substantially parallel or apart from each other. For example, as shown in FIG. 20, a circuit component connected to the second shape portion or a portion different from the second shape portion may be mounted, and a part or all of these may be formed in combination. Is also good.

(Description on the characteristic part 45AK)
Hereinafter, the board case 45AK10 of the gaming machine related to the characteristic portion 45AK, and the board 45AK50 and the heat sink 45AK40 housed in the board case 45AK10 will be described in detail with reference to the drawings. FIG. 23 is an exploded perspective view of the board case 45AK10, the board 45AK50, and the heat sink 45AK40 of the gaming machine according to the embodiment of the present invention, as viewed from the rear. FIG. 24 is an exploded perspective view of the board case 45AK10, the board 45AK50, and the heat sink 45AK40 of the gaming machine according to the embodiment of the present invention, as viewed from the front. In the following description, in order to facilitate understanding, the front-back direction shown in FIG. 23 and the like is defined, and the up-down and left-right directions when the board case 45AK10 and the like are viewed from the front are defined as the up-down and left-right directions of the board case 45AK10 and the like. explain.

  The board case 45AK10 is configured by combining a front case 45AK20 forming the front and a rear case 45AK30 forming the rear. Inside the board case 45AK10, a housing space for housing a board 45AK50 on which electronic components such as a CPU, a ROM, and a connector are mounted, and a heat sink 45AK40 is formed.

  The front case 45AK20 is made of, for example, a synthetic resin having thermoplasticity, and is formed in a substantially rectangular shape in plan view. The front case 45AK20 has a box shape with an open rear. On the upper edge of the front case 45AK20, two projecting portions 45AK21 projecting upward are formed. Further, two projecting portions 45AK22 projecting downward are formed on the lower edge of the front case 45AK20.

  Like the front case 45AK20, the rear case 45AK30 is made of, for example, a synthetic resin having thermoplasticity, and is formed in a substantially rectangular shape in plan view. The rear case 45AK30 has a base plate 45AK30a that forms a rear surface, and an upper wall 45AK30b, a right wall 45AK30c, a lower wall 45AK30d, and a left wall 45AK30e that stand upright from the base plate 45AK30a. As a result, the rear case 45AK30 has a box shape with an open front, and its housing portion is deeper than that of the front case 45AK20. On the upper wall 45AK30b of the rear case 45AK30, two locking portions 45AK31 each having an insertion hole 45AK31a through which the protruding portion 45AK21 formed on the front case 45AK20 is inserted are formed. The lower wall 45AK30d of the rear case 45AK30 is formed with two locking portions 45AK38 (FIG. 24) on which the protruding portions 45AK22 formed on the front case 45AK20 are hooked.

  When combining the front case 45AK20 and the rear case 45AK30, first, the protrusion 45AK21 of the front case 45AK20 is inserted into the insertion hole 45AK31a of the rear case 45AK30. Then, the lower portion of the front case 45AK20 is pressed against the rear case 45AK30, and the protrusion 45AK22 of the front case 45AK20 is hooked on the locking portion 45AK38 of the rear case 45AK30. As a result, the front case 45AK20 and the rear case 45AK30 are combined to form an accommodation space for the board 45AK50 and the like inside.

  In the rear case 45AK30, a plurality of air holes 45AK32 are formed in the upper wall 45AK30b, and a plurality of air holes 45AK33 (FIG. 24) are formed in the lower wall 45AK30d. Thereby, a passage for air along the up-down direction is secured in the board case 45AK10. The base plate 45AK30a of the rear case 45AK30 has four insertion projections 45AK36 for positioning the board 45AK50, screw holes 45AK37a to 45AK37e for screwing the board 45AK50, and four corners of the heat sink 45AK40. Four positioning portions 45AK34 for positioning and six support portions 45AK35 that contact and support the heat sink 45AK40 positioned at the four positioning portions 45AK34 are formed.

  The insertion protrusions 45AK36 are formed at four corners of the base plate 45AK30a. Each of the insertion protrusions 45AK36 is a columnar protrusion inserted into an insertion hole 45AK50a formed in the substrate 45AK50.

  Each of the four positioning portions 45AK34 has an angle shape and is arranged so as to be able to abut on a corner of the heat sink 45AK40 on an orthogonal surface.

  As shown in the enlarged view of FIG. 24, the support portion 45AK35 is disposed in the notch 45AK30f of the base plate 45AK30a, and has a protruding portion 45AK35a protruding forward from the base plate 45AK30a. The support portion 45AK35 is in a cantilever state in which only one end is supported by the base plate 45AK30a. Therefore, when a rearward stress acts on the protruding portion 45AK35a, the support portion 45AK35 is elastically deformed and displaced rearward. On the other hand, when the rearward stress does not act on the protruding portion 45AK35a, the support portion 45AK35 returns to the front and returns to the original state.

  The heat sink 45AK40 is formed, for example, by processing aluminum having excellent heat conductivity. The heat sink 45AK40 includes a rectangular base plate 45AK41, and five rectangular fins 45AK42 erected on the base plate 45AK41. Each of the fins 45AK42 extends in the up-down direction and is arranged in parallel in the left-right direction.

  The board 45AK50 is, for example, a printed board on which various electronic components such as a CPU, a ROM, and a connector are mounted. The board 45AK50 has four insertion holes 45AK50a provided at positions corresponding to the insertion protrusions 45AK36 formed on the rear case 45AK30, and screw insertion holes 45AK55a into which screws 45AK81a to 45AK81e for fixing the substrate 45AK50 are inserted. To 45AK55e.

  Further, the substrate 45AK50 is provided with a heat-generating electronic component 45AK60, and non-heat-generating electronic components 45AK51 and 45AK52. The electronic component 45AK60, the electronic component 45AK51, and the electronic component 45AK52 have a rectangular shape. In particular, the electronic component 45AK60 has a substantially square shape. Further, among the non-heat-generating electronic components, the electronic component 45AK52 has a higher height (thickness) than the electronic component 45AK51. In other words, in FIG. 23, the electronic component 45AK52 protrudes greatly behind the electronic component 45AK51. Here, the heat-generating electronic component refers to an electronic component that generates enough heat to take measures against heat radiation to prevent malfunction of the electronic component. On the other hand, a non-heat-generating electronic component refers to an electronic component that generates heat only to the extent that heat radiation measures need not be taken, or generates no heat at all.

  Among the non-heat-generating electronic components, the electronic component 45AK51 having a lower height is disposed above the heat-generating electronic component 45AK60. Among the non-heat-generating electronic components, the tall electronic component 45AK52 is disposed to the right of the heat-generating electronic component 45AK60. The directions of the non-heat-generating electronic components 45AK51 and 45AK52 are arranged such that each side is parallel to the side of the rectangular substrate 45AK50 when viewed in plan. On the other hand, the heat-generating electronic component 45AK60 is arranged such that each side is not parallel to the side of the rectangular substrate 45AK50 when viewed in plan. The heat-generating electronic component 45AK60 has a heat conductive sheet 45AK70 attached between the electronic component 45AK60 and the heat sink 45AK40 to transmit the generated heat to the heat sink 45AK40. The heat conductive sheet 45AK70 covers substantially the entire electronic component 45AK60.

  The heat conductive sheet 45AK70 can be adopted from a known heat conductive sheet of a type in which both surfaces are adhered, or a flexible heat conductive sheet mainly made of silicone, non-silicone, or ceramic. The heat conductive sheet 45AK70 is interposed between the electronic component 45AK60 and the heat sink 45AK40, and adheres them.

(Attachment of heat sink 45AK40 and substrate 45AK50)
Next, a procedure for attaching the heat sink 45AK40 and the substrate 45AK50 to the substrate case 45AK10 will be described. FIG. 25 is a cross-sectional view showing the manner in which the heat sink 45AK40 and the substrate 45AK50 are mounted on the substrate case 45AK10 in the mounting order ((a) to (b)). FIG. 26 is a cross-sectional view showing the manner of attaching the heat sink 45AK40 and the board 45AK50 to the board case 45AK10 in the order of attachment ((a) to (b)) subsequent to FIG. The drawings shown in FIGS. 25 and 26 are cross-sectional views taken along a cross-sectional line AA in FIG.

  As shown in FIG. 25A, first, the rear case 45AK30 is placed on a table or the like, and the heat sink 45AK40 is installed on the rear case 45AK30. As shown in FIG. 25 (b), the heat sink 45AK40 is mounted so that the fins 45AK42 extend in the up-down direction, as shown in FIG. As a result, the heat sink 45AK40 can be positioned with respect to the rear case 45AK30. At this time, the fins 45AK42b and the fins 45AK42d of the heat sink 45AK40 are in contact with the protruding portions 45AK35a of the support portions 45AK35.

  Subsequently, as shown in FIG. 25B, a substrate 45AK50 in which a heat conductive sheet 45AK70 is adhered to the electronic component 45AK60 is placed in the rear case 45AK30. At this time, the insertion protrusion 45AK36 formed in the rear case 45AK30 is inserted into the insertion hole 45AK50a formed in the substrate 45AK50 shown in FIG. Place on. In this manner, the insertion of the insertion protrusion 45AK36 into the insertion hole 45AK50a positions the board 45AK50 with respect to the rear case 45AK30.

  Subsequently, as shown in FIG. 26A, the screws 45AK81a to 45AK81e (only the screw 45AK81e is shown in FIG. 26A) are inserted into the substrate 45AK50 and tightened into the corresponding screw holes 45AK37a to 45AK37e. Thus, the heat sink 45AK40 and the board 45AK50 supported by the support portion 45AK35 are pressed toward the rear case 45AK30. As a result, as shown in FIG. 26B, the support portion 45AK35 is elastically deformed, and its tip is displaced backward by the distance L. The support portion 45AK35 elastically deformed in this manner presses the contacting heat sink 45AK40 forward. On the other hand, the screws 45AK81a to 45AK81e press the substrate 45AK50 pressed forward via the heat sink 45AK40. As a result, the heat sink 45AK40 and the heat conductive sheet 45AK70 adhere to each other, and the electronic component 45AK60 and the heat conductive sheet 45AK70 adhere to each other. With such a configuration, heat generated from the electronic component 45AK60 is transmitted to the heat sink 45AK40 via the heat conductive sheet 45AK70, and is radiated from the heat sink 45AK40.

(About the effect of the characteristic part 45AK)
The effects of the gaming machine related to the characteristic portion 45AK will be described with reference to the drawings. FIG. 27 is a plan view for explaining the relationship between the heat sink 45AK40 and the electronic component 45AK60. FIG. 28 is an explanatory diagram for explaining the flow of air in the board case 45AK10. Since FIG. 27 is a view of the heat sink 45AK40 viewed from the fin 45AK42 side, the electronic component 45AK60 is shown by a broken line which is a hidden line. Further, the heat conduction sheet 45AK70 is interposed between the heat sink 45AK40 and the electronic component 45AK60 to conduct heat. However, for convenience, the illustration of the heat conduction sheet 45AK70 is omitted and the heat sink 45AK60 is disposed on the entire surface of the electronic component 45AK60. It is assumed that heat is conducted to 45AK40. The electronic component 45AK61 indicated by a two-dot chain line is a comparative example shown for comparison with the electronic component 45AK60.

  As shown in FIG. 27, when viewed in a plan view, the rectangular electronic components 45AK60 are arranged such that the sides 45AK60a to 45AK60d are not parallel to the sides 45AK40a to 45AK40d of the rectangular heat sink. In other words, the electronic component 45AK61 can be arranged by rotating the electronic component 45AK61 arranged so that each side thereof is parallel to the sides 45AK40a to 45AK40d of the heat sink by a predetermined angle θ about the center point O. The predetermined angle θ is, for example, approximately 45 °. In addition, since the electronic component 45AK60 has a substantially square shape, the diagonal line of the electronic component 45AK60 points in the up, down, left, and right directions. With such an arrangement of the electronic component 45AK60, the vertex 45AK60f of the electronic component 45AK60 is on the right side (left side in the drawing) of the fin 45AK42b, and the vertex 45AK60e of the electronic component 45AK60 is on the left side (right side in the drawing) of the fin 45AK42d. Can be arranged. On the other hand, in the electronic component 45AK61 of the comparative example arranged so that the direction thereof coincides with that of the heat sink 45AK40, any part is on the right side (left side in the figure) of the fin 45AK42b or on the left side of the fin 45AK42d (right side in the figure). ) Not located. Accordingly, the electronic component 45AK60 can transmit a large amount of heat to the fins 45AK42b and 45AK42d, and can effectively use the fins 45AK42b and 45AK42d when radiating heat. Thereby, the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced. In the above, the arrangement of the electronic component 45AK60 with respect to the heat sink 45AK40 has been described. However, this is, of course, technically equivalent even if the arrangement of the heat sink 45AK40 with respect to the electronic component 45AK60 is described.

  Further, the heat generated from the electronic component 45AK60 is not only transmitted to the heat sink 45AK40 and dissipated, but a part of the heat is directly dissipated upward from the electronic component 45AK60. As described above, the amount of heat radiated directly upward from the electronic component 45AK60 increases as the length of the electronic component 45AK60 in the left-right direction increases. Here, as shown in FIG. 27, the horizontal width W1 of the electronic component 45AK60 is larger than the horizontal width W2 of the electronic component 45AK61 of the comparative example. Therefore, when the electronic component 45AK60 is arranged, more heat generated from the electronic component 45AK60 can be directly radiated upward. Thereby, the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced.

  Further, as shown in FIG. 28, an air hole 45AK33 for allowing air to flow in is formed in a lower portion of the rear case 45AK30, and an air hole 45AK32 for discharging air is formed in an upper portion of the rear case 45AK30. . Thus, an air passage along the vertical direction is secured in the board case 45AK10. The air (arrow Y1) flowing from the air hole 45AK33 moves upward. The air that has moved upward eventually passes between the fins 45AK42 formed on the heat sink 45AK40 (arrow Y2). At this time, the heat of the heat sink 45AK40 is taken away, and the air is warmed. The warmed air passes between the low-height electronic components 45AK51 arranged above the heat sink 45AK40 (arrow Y3), or passes behind the low-height electronic components 45AK51 (arrow Y4) and moves upward. And move. Eventually, the air that has moved upward is discharged from an air hole 45AK32 formed in the upper part of the rear case 45AK30 (arrow Y5). Thus, by arranging the low-height electronic components 45AK51 above the heat sink 45AK40, air can be passed not only between the electronic components 45AK51 but also behind the electronic components 45AK51. On the other hand, the high electronic component 45AK52 is not disposed above and below the heat sink 45AK40, but is disposed on the right (left side in the drawing). Thereby, the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced without obstructing the flow of the air moving upward from below.

  In addition, by making the longitudinal direction of the electronic components 45AK51 coincide with the up-down direction, the space between the electronic components 45AK51 can be made large. Thus, the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced without obstructing the flow of the air moving upward.

  Further, the heat sink 45AK40 is arranged so that the fins 45AK42 arranged in parallel in the left-right direction face the up-down direction. Thereby, the air moving upward from below can be passed between the fins 45AK42 along the vertical direction. Thereby, the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced without obstructing the flow of the air moving upward.

  Further, the heat conductive sheet 45AK70 interposed between the electronic component 45AK60 and the heat sink 45AK40 is a flexible heat conductive sheet having both surfaces adhered. Therefore, the heat conductive sheet 45AK70 can be closely adhered to the electronic component 45AK60 and the heat sink 45AK40 without any gap. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transmitted to the heat sink 45AK40 via the heat conductive sheet 45AK70.

  Further, the rear case 45AK30 is provided with a support portion 45AK35 for pressing the heat sink 45AK40 against the heat-generating electronic component 45AK60. As a result, the heat sink 45AK40 and the electronic component 45AK60 press the heat conductive sheet 45AK70 and adhere to the heat conductive sheet 45AK70 without any gap. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transmitted to the heat sink 45AK40 via the heat conductive sheet 45AK70.

  23 and 33, the board 45AK50 is attached to the rear case 45AK30 by a plurality of screws 45AK81a to 45AK81e. Of the plurality of screws 45AK81a to 45AK81e, the screw 45AK81d and the screw 45AK81e are inserted into the screw insertion holes 45AK55d and 45AK55e near the electronic component 45AK60, and are fastened to the rear case 45AK30. In this manner, by fastening the screws 45AK81d and the screws 45AK81e to the rear case 45AK30 in the vicinity of the electronic component 45AK60, the heat sink 45AK40 bonded to the electronic component 45AK60 can be reliably pressed down to the rear case 45AK30. Thereby, adhesion between the heat sink 45AK40 and the electronic component 45AK60 can be ensured.

  The support portion 45AK35 is disposed in the notch 45AK30f of the base plate 45AK30a, and a slight gap t (FIG. 25A) is provided between the support portion 45AK35 and the notch 45AK30f. . From this gap t, heat transmitted to the heat sink 45AK40 can be released to the outside of the board case 45AK10. Thereby, the heat generated from the electronic component 45AK60 can be efficiently radiated.

  When the board 45AK50 is not installed on the rear case 45AK30, the support portion 45AK35 is flush with the base plate 45AK30a of the rear case 45AK30 except for the protruding portion 45AK35a. On the other hand, when the board 45AK50 is installed on the rear case 45AK30, the support portion 45AK35 bends backward and shifts from the base plate 45AK30a. As described above, the displacement generated between the support portion 45AK35 and the base plate 45AK30a makes it easier to release heat from the gap t. Thereby, the heat generated from the electronic component 45AK60 can be efficiently radiated.

(Other Embodiment 1)
FIG. 29 is a cross-sectional view showing a state where a heat sink and a substrate are mounted on a substrate case of a gaming machine according to another embodiment 1. In addition, in the following description about other forms, it demonstrates focusing on the point different from the above-mentioned form. It is to be noted that the same members as those in the above embodiment are denoted by the same reference numerals, and description thereof will be omitted. As shown in FIG. 29, the rear case 45AK130 is provided with a spring 45AK135 which abuts and supports the fin 45AK42 of the heat sink 45AK40 instead of the support portion 45AK35 shown in FIG. The spring 45AK135 is a compression coil spring, but may be a leaf spring such as a spring washer. In the rear case 45AK130, a plurality of air holes 45AK138 for releasing the heat of the heat sink 45AK40 to the outside are formed. The manner of mounting the heat sink 45AK40 and the rear case 45AK130 of the substrate 45AK50 is the same as in the above embodiment. That is, the heat sink 45AK40 is placed in alignment with the positioning portion 45AK134. At this time, the fin 45AK42 is placed on the spring 45AK135. Then, the board | substrate 45AK50 with which the heat conductive sheet 45AK70 was affixed to the electronic component 45AK60 is inserted in the insertion convex part 45AK136, is positioned, and is mounted on the heat sink 45AK40. Subsequently, the screw 45AK81e is inserted into the board 45AK50 and fastened to the screw hole 45AK37e. Accordingly, the spring 45AK135 is pressed by the fins 45AK42 and contracts, and presses the fins 45AK42 toward the substrate 45AK50. Thus, the heat conductive sheet 45AK70 can be brought into close contact with the heat sink 45AK40 and the electronic component 45AK60.

(Other Embodiment 2)
FIG. 30 is a cross-sectional view showing a state where a heat sink and a substrate are mounted on a substrate case of a gaming machine according to another embodiment 2. As shown in FIG. 30, unlike the above embodiment, the rear case 45AK230 is not provided with a member that supports the fins 45AK242, such as the support portion 45AK35 (FIG. 24) and the spring 45AK135 (FIG. 29). The rear case 45AK230 has a plurality of air holes 45AK238 for releasing the heat of the heat sink 45AK240 to the outside.

  The board 45AK250 is formed with a screw insertion hole 45AK252 for passing the screw 45AK251. The heat sink 45AK240 has a screw hole 45AK243 for tightening the screw 45AK251. By inserting the screw 45AK251 into the screw insertion hole 45AK252 formed in the substrate 45AK250 and tightening it into the screw hole 45AK243 formed in the heat sink 45AK240, the heat sink 45AK240 and the substrate 45AK250 can be integrated. At this time, by sufficiently tightening the screw 45AK251, the heat sink 45AK240 is drawn to the substrate 45AK250 side. Thereby, the heat conductive sheet 45AK270 can be brought into close contact with the heat sink 45AK240 and the electronic component 45AK260.

(Explanation about the characteristic part 55AK)
FIG. 31 shows a configuration example of the connection wiring member 55AK01 regarding the characteristic portion 55AK of the present embodiment. The connection wiring member 55AK01 is a connection member that can electrically connect a plurality of electric components, such as the effect control board 12 and the image display device 5, for example. The connection wiring member 55AK01 may be made of a material that is partially or entirely flexible, such as a flexible wiring board or a flexible flat cable. In the connection wiring member 55AK01, a wiring pattern forming a plurality of signal wirings is formed in order to connect a plurality of electric components by a plurality of signal wirings. In the connection wiring member 55AK01, the wiring patterns constituting the plurality of signal wirings include the wiring patterns 55AK10 to 55AK22.

  One end of the signal wiring constituted by the wiring patterns 55AK10 to 55AK22 is connected to the connector plug 55AK1P, and the other end is connected to the connector plug 55AK2P. The connector plug 55AK1P is a wiring connection component that enables one electrical component, such as the effect control board 12, to be electrically connected to a plurality of signal wires. The connector plug 55AK2P is a wiring connection component that enables the other electrical component, such as the image display device 5, to be electrically connected to a plurality of signal wires.

  The wiring pattern 55AK10 forms a signal wiring maintained at a reference voltage such as a ground voltage. As the wiring pattern 55AK10, a linear signal wiring may be formed, or a planar signal wiring may be formed partially or entirely. The wiring patterns 55AK11 to 55AK22 may be configured by combining two signal wirings to form a pair of signal wirings. For example, a signal wiring formed by the wiring pattern 55AK11 is combined with a signal wiring formed by the wiring pattern 55AK12 to form a pair of signal wirings.

  In the configuration example of FIG. 31, the meandering shape is not provided in the wiring patterns 55AK21 and 55AK22. The wiring patterns 55AK11 to 55AK20 are provided with a meandering shape at least in part. For example, in a plurality of signal wirings configured by the wiring patterns 55AK11 to 55AK20, some or all of the signal wirings in the region 55AK10Z illustrated in FIG. 31 meander differently from the first shape having a linear shape or a substantially linear shape. It becomes a second shape such as a shape. On the other hand, the signal wiring constituted by the wiring patterns 55AK21 and 55AK22 has a first shape of a linear shape or a substantially linear shape in the region 55AK10Z shown in FIG. Among the plurality of signal wirings configured by the wiring patterns 55AK11 to 55AK20, the signal wiring configured by the wiring patterns 55AK11 and 55AK12 is the first linear or substantially linear configuration in the region 55AK10Z illustrated in FIG. Shape. On the other hand, the signal wiring constituted by the wiring patterns 55AK11 and 55AK12 is formed in a region other than the region 55AK10Z (a region closer to the connector plug 55AK1P than the region 55AK10Z) shown in FIG. The second shape is different from the shape.

  A plurality of signal wirings configured by the wiring patterns 55AK10 to 55AK22 illustrated in FIG. For example, a plurality of signal wirings configured by wiring patterns 55AK11 to 55AK22 have the same or substantially the same wiring length. Among these, at least a part of the plurality of signal wirings configured by the wiring patterns 55AK11 to 55AK20 has a meandering shape, and thus has the same or substantially the same wiring length as the signal wiring configured by the wiring patterns 55AK21 and 55AK22. It should just be. The signal wiring formed by the wiring patterns 55AK21 and 55AK22 is different from the signal wiring formed by the wiring patterns 55AK10 to 55AK20 in the connection between the connector plug 55AK1P and the connector plug 55AK2P on the signal wiring surface of the connection wiring member 55AK01. The distance between the terminals may be longer. In the connection wiring member 55AK01, a parallel wiring portion in which a plurality of signal wirings have a first shape that is parallel or substantially parallel, and a second shape in which at least one of the plurality of signal wirings is not parallel to other signal wirings. A wiring pattern may be formed so as to include the specific wiring portion. Accordingly, an increase in the area of the connection member on which the wiring pattern is arranged is suppressed, and the configuration can be reduced in size. A wiring pattern is formed so that the wiring length of at least a part of the signal wiring is the same or substantially the same, so that the delay time difference between signals transmitted through the plurality of signal wirings is reduced, and the plurality of signal wirings are reduced. Can improve the reliability of the signal transmitted by the transmission.

  The connection wiring member 55AK01 is formed so as to have an L-shape or a substantially L-shape as a whole by bending in the region 55AK2Z. As described above, the connection wiring member 55AK01 is provided with the region 55AK2Z to be a bent portion. In a section from the connector plug 55AK1P to the region 55AK2Z in the connection wiring member 55AK01, a plurality of signal wirings formed by the wiring patterns 55AK11 to 55AK22 extend in a first direction, for example, a direction along the X axis shown in FIG. It is formed to be. In the section from the region 55AK2Z to the connector plug 55AK2P in the connection wiring member 55AK01, the plurality of signal wirings formed by the wiring patterns 55AK11 to 55AK22 are different from the first direction, for example, the direction along the Z axis shown in FIG. It is formed to extend in the second direction. In the region 55AK2Z of the connection wiring member 55AK01, the extending direction is changed from the first direction to the second direction for a plurality of signal wirings configured by the wiring patterns 55AK11 to 55AK22. The first direction and the second direction may be any directions as long as they intersect each other. The region 55AK2Z may have a rectangular shape having a predetermined angle or an arc shape having a predetermined curvature. Note that, when the signal wiring constituted by the wiring pattern 55AK10 partially or entirely includes a surface signal wiring, unlike a linear signal wiring, the extension direction may not be specified in some cases. However, the entire signal wiring may be formed so as to extend from the connector plug 55AK1P to the connector plug 55AK2P via the region 55AK2Z, similarly to the other wiring patterns 55AK11 to 55AK22. .

  FIG. 32 is a sectional view taken along line AA shown in FIG. The connection wiring member 55AK01 has a multilayer structure formed by laminating synthetic resins such as polyimide resins, for example, and is capable of forming various wiring patterns on the surface or inner layer of each layer. A plurality of electric components such as the effect control board 12 and the image display device 5 are electrically connected via the wiring pattern formed on the connection wiring member 55AK01 having such a multilayer structure. The multilayer structure of the connection wiring member 55AK01 shown in FIG. 32 includes a surface layer 55AK1S, a power supply layer 55AK1L, a wiring layer 55AK2L, and a back layer 55AK2S. The surface layer 55AK1S is covered and protected by the cover layer 55AK1V. The back surface layer 55AK2S is covered and protected by the cover layer 55AK2V.

  A surface layer 55AK1S is provided on one surface of the connection wiring member 55AK01, and wiring patterns 55AK10 to 55AK22 constituting signal wiring are formed. A back surface layer 55AK2S is provided on the other back surface of the connection wiring member 55AK01. The wiring patterns 55AK30 to 55AK42 constituting a plurality of signal wirings may be formed on the back surface layer 55AK2S in correspondence with the plurality of signal wirings constituted by the wiring patterns 55AK10 to 55AK22. As described above, the wiring patterns constituting the plurality of signal wirings may be formed on both surfaces of the connection wiring member 55AK01.

  The wiring pattern 55AK11 formed on the surface layer 55AK1S of the connection wiring member 55AK01 is formed on the back surface layer 55AK2S through a through-hole such as a through hole 55AK1H penetrating the surface layer 55AK1S and the back surface layer 55AK2S of the connection wiring member 55AK01. Is electrically connected to the wiring pattern 55AK31. The wiring pattern 55AK12 formed on the surface layer 55AK1S of the connection wiring member 55AK01 is formed on the back surface layer 55AK2S via a penetrating portion such as a through hole 55AK2H penetrating the surface layer 55AK1S and the back surface layer 55AK2S of the connection wiring member 55AK01. Is electrically connected to the wiring pattern 55AK32. In addition, the wiring patterns 55AK10, 55AK13 to 55AK22 formed on the surface layer 55AK1S of the connection wiring member 55AK01 are connected to the wiring patterns 55AK30, 55AK33 to 55AK42 formed on the back layer 55AK2S via through portions such as through holes. It only needs to be electrically connected. Among the plurality of signal wirings configured by the wiring patterns 55AK10 to 55AK22, the signal wiring formed only on the surface layer 55AK1S of the connection wiring member 55AK01 and not electrically connected to the signal wiring formed on the back layer 55AK2S. May be included. In a region 55AK2Z of the connection wiring member 55AK01, a wiring pattern constituting a signal wiring in a surface layer 55AK1S provided on one surface, such as through holes 55AK1H and 55AK2H, and a back surface serving as another surface. In the back layer 55AK2S, a penetrating portion capable of electrically connecting a wiring pattern forming a signal wiring is provided.

  FIG. 33 shows a connection example between the effect control board 12 and the image display device 5 using the connection wiring member 55AK01. The connector plug 55AK1P of the connection wiring member 55AK01 is inserted into a connector port 55AK1ST provided on the effect control board 12. The connector plug 55AK2P included in the connection wiring member 55AK01 is inserted into a connector port 55AK2ST provided in the image display device 5. The connector port 55AK1ST provided on the effect control board 12 and the connector port 55AK2ST provided on the image display device 5 are the same electrical components as the receptacles KRE1 to KRE4 described in the above embodiment, and are different from other electrical components. What is necessary is just to have the structure of the wiring connection apparatus which can connect the signal wiring electrically connected between them detachably. For example, the connector port 55AK1ST, which is one of the electrical components, is provided on the effect control board 12, and the connector plug 55AK1P of the connection wiring member 55AK01 is configured to be detachable. The connector plug 55AK2P of the connection wiring member 55AK01 is provided in the device 5 so as to be detachable. By attaching the connector plug 55AK1P to the connector port 55AK1ST and attaching the connector plug 55AK2P to the connector port 55AK2ST, a plurality of signal wirings formed by the wiring patterns 55AK10 to 55AK22 formed on the connection wiring member 55AK01 are connected to one electrical line. The connector port 55AK1ST as a component and the connector port 55AK2ST as the other electrical component can be electrically connected.

  FIG. 34 is a top view of the connection wiring member 55AK01 in the connection example shown in FIG. In the connection wiring member 55AK01, at least the region 55AK1Z has flexibility. Thereby, when the connector plug 55AK1P is mounted on the connector port 55AK1ST and the connector plug 55AK2P is mounted on the connector port 55AK2ST, the connection wiring member 55AK01 is bent so as to be curved in the region 55AK1Z, and the connector plug 55AK1P and the connector plug 55AK1P. The direction of 55AK2P can be adjusted according to the directions of connector port 55AK1ST and connector port 55AK2ST. In the example shown in FIGS. 33 and 34, the connector plug 55AK1P of the connection wiring member 55AK01 is inserted into the connector port 55AK1ST provided on the effect control board 12 by inserting the connector plug 55AK1P from the Y axis positive direction to the Y axis negative direction. . The connector plug 55AK2P of the connection wiring member 55AK01 is inserted into the connector port 55AK2ST provided in the image display device 5 by inserting the connector plug 55AK2P from the negative Z-axis direction to the positive Z-axis direction. For example, first, the connector plug 55AK2P is inserted and attached to the connector port 55AK2ST, and then the connector plug 55AK1P is inserted and attached to the connector port 55AK1ST. By mounting in this order, the connection wiring member 55AK01 can be easily mounted due to the flexibility of the region 55AK1Z of the connection wiring member 55AK01.

  FIG. 35 shows another connection example. In the connection example shown in FIG. 35 as well, the connector plug 55AK1P provided in the connection wiring member 55AK01 is inserted into the connector port 55AK1ST provided in the effect control board 12, and the connector plug 55AK2P provided in the connection wiring member 55AK01 is provided in the image display device 5. Connector port 55AK2ST. The connector port 55AK1ST of the effect control board 12 is disposed on the rear side of the cover body 301 which is on the Y axis positive direction side when viewed from the cover body 301. It is arranged on the front side of the cover body 301 on the direction side. In the connection wiring member 55AK01, the connector plug 55AK1P is attached to the connector port 55AK1ST of the effect control board 12 via the opening 55AK30 formed in the cover body 301, and the connector plug 55AK2P is attached to the connector port 55AK2ST of the image display device 5. Is done.

  FIG. 36 is a top view of the connection wiring member 55AK01 in the connection example as shown in FIG. In the connection wiring member 55AK01, the region 55AK10Z may have flexibility in addition to the region 55AK1Z. In the connection example shown in FIG. 35, when the connector plug 55AK1P is mounted on the connector port 55AK1ST and the connector plug 55AK2P is mounted on the connector port 55AK2ST, the connection wiring member 55AK01 is bent in the region 55AK10Z in addition to the region 55AK1Z. And the direction of the connector plug 55AK1P and the connector plug 55AK2P can be adjusted according to the direction of the connector port 55AK1ST and the connector port 55AK2ST. In the example shown in FIGS. 35 and 36, similarly to the examples shown in FIGS. 33 and 34, first, the connector plug 55AK2P is inserted into the connector port 55AK2ST and mounted. Subsequently, the connection wiring member 55AK01 is drawn from the front side to the rear side of the cover body 301 by passing the connection wiring member 55AK01 from the connector plug 55AK1P to the opening 55AK30 of the cover body 301. Thereafter, the connector plug 55AK1P is inserted into the connector port 55AK1ST and mounted. If the connection wiring member 55AK01 is mounted in such an order, the connection wiring member 55AK01 can be easily mounted by being folded back at the opening 55AK30 of the cover body 301 due to the flexibility of the region 55AK10Z of the connection wiring member 55AK01. it can.

  In the connection examples shown in FIGS. 33 to 36, the connection wiring member 55AK01 is bent so as to be curved when the connection wiring member 55AK01 is attached due to the flexibility of the region 55AK1Z and the region 55AK10Z of the connection wiring member 55AK01. As described above, the connection wiring member 55AK01 has, for example, a flexible base body formed in a flexible sheet shape, and the region 55AK1Z and the region 55AK10Z have flexibility. The reinforcing member 55AK02 is attached to the connection wiring member 55AK01. The reinforcing member 55AK02 may be made of a synthetic resin material such as an acrylic resin material, a quartz-based material such as quartz glass, a ceramic-based material, or any other material so as to have no flexibility. Good. At a position where the reinforcing member 55AK02 is attached, for example, a circuit component 55AK1R connected to a signal wiring constituted by a wiring pattern 55AK10 is mounted. The circuit component 55AK1R may be any component that constitutes a circuit element or a functional circuit, similarly to the circuit component 42AK1R in the above embodiment. For example, the circuit component 55AK1R is configured as a noise elimination circuit that prevents generation of noise in the signal wiring when the signal wiring configured by the wiring pattern 55AK10 is maintained at a ground voltage serving as a reference voltage or a predetermined power supply voltage. May be done. Since the circuit component 55AK1R is mounted at the position where the non-flexible reinforcing member 55AK02 is attached, compared with the case where the circuit component 55AK1R is mounted at the position having flexibility, Dropping and disconnection of the signal wiring hardly occur.

  Wiring patterns forming a plurality of signal wirings are formed on both surfaces of the connection wiring member 55AK01, and a through hole as a through portion is provided in a region 55AK2Z of the connection wiring member 55AK01. Thereby, the signal wiring provided on the front surface which becomes one surface of the connection wiring member 55AK01 and the signal wiring provided on the back surface which becomes the other surface of the connection wiring member 55AK01 can be electrically connected. In the connection examples shown in FIGS. 33 to 36, the connection wiring member 55AK01 is bent so as to be curved when the connection wiring member 55AK01 is attached due to the flexibility of the region 55AK1Z and the region 55AK10Z of the connection wiring member 55AK01. On the other hand, the region 55AK2Z of the connection wiring member 55AK01 is not bent when the connection wiring member 55AK01 is mounted. As described above, when a plurality of electric components are connected by a plurality of signal wires, the through-holes as through portions are not provided in the regions 55AK1Z and the regions 55AK10Z where the shape is changed by the connection wiring member 55AK01. Since the penetrating portion is not provided at the position where the shape changes, the strength of the connection wiring member 55AK01 and the disconnection of the signal wiring are less likely to occur as compared with the case where the penetration portion is provided at the position where the shape changes. In a position where a through portion such as a through hole is provided, as a base of the connection wiring member 55AK01, for example, a member similar to the reinforcing member 55AK02, such as a rigid wiring board, or a member formed of a material different from the reinforcing member 55AK02 For example, a member having no flexibility may be used. Further, the through portion is not limited to a through hole penetrating the surface layer 55AK1S serving as one surface of the connection wiring member 55AK01 and the back surface layer 55AK2S serving as the other surface. It may be a via or the like penetrating the conductor layer formed as the inner layer of 55AK01.

(Explanation about the characteristic part 56AK)
FIG. 37 shows a configuration example of a connector plug and a connector port regarding the characteristic portion 56AK of the present embodiment. FIG. 37A shows a configuration example of a connector port 56AK01 that can be attached by inserting the connector plug 55AK1P of the connection wiring member 55AK01. FIG. 37B shows a configuration example of a connector port 56AK02 that can be attached by inserting the connector plug 55AK2P of the connection wiring member 55AK01. The connector port 56AK01 may be any port as long as it is used as the connector port 55AK1ST of the effect control board 12 shown in FIGS. 33 and 35, for example. The connector port 56AK02 may be any port that is used as the connector port 55AK2ST included in the image display device 5 shown in FIGS. 33 and 35, for example.

  In the connector port 56AK01, a plurality of terminals connected to a plurality of signal wirings are provided at a first pitch W10. In the connector port 56AK02, a plurality of terminals connected to a plurality of signal wirings are provided at a second pitch W11 different from the first pitch W10. For example, in the connector port 56AK01, a plurality of terminals may be arranged side by side so that the first pitch W10 is 1 mm or more and less than 3 mm. In the connector port 56AK02, a plurality of terminals may be arranged side by side so that the second pitch W11 is 3 mm or more and less than 5 mm. The first pitch W10 may be set to be shorter than the second pitch W11, or the first pitch W10 may be set to be longer than the second pitch W11. As described above, the connector port 56AK01 is a first component in which terminals as a plurality of conductors are provided at the first pitch W10, and the connector port 56AK02 is a first component in which terminals as a plurality of conductors are provided at the second pitch W11. It becomes two parts. The connector port 56AK01 has a plurality of wiring patterns 55AK10 to 55AK22 formed on the connection wiring member 55AK01 by being inserted and fitted with a connector plug 55AK1P provided at one end of the connection wiring member 55AK01. This is a wiring connection component that allows the signal wiring of the above to be detachably connected. The connector port 56AK02 has a plurality of wiring patterns 55AK10 to 55AK22 formed on the connection wiring member 55AK01 by being inserted and fitted with a connector plug 55AK2P provided on the other end of the connection wiring member 55AK01. This is a wiring connection component that enables signal wiring to be detachably connected.

  In the connector port 56AK01, a plurality of terminals are arranged at a first pitch W10. On the other hand, a connector plug 55AK1P provided at one end of the connection wiring member 55AK01 has a plurality of contact conductors corresponding to a plurality of signal wirings at the first pitch W10. It is formed to have an interval corresponding to W10. In the connector port 56AK02, a plurality of terminals are arranged at the second pitch W11. On the other hand, the connector plug 55AK2P provided at the other end of the connection wiring member 55AK01 has a plurality of contact conductors corresponding to a plurality of signal wirings. It is formed to have an interval corresponding to the pitch W11. In the vicinity of the connector plug 55AK1P in the connection wiring member 55AK01, a first adjustment unit that adjusts the plurality of signal wirings to have an interval corresponding to the first pitch W10 may be provided. In the vicinity of the connector plug 55AK2P in the connection wiring member 55AK01, a second adjustment unit that adjusts the plurality of signal wirings to have an interval corresponding to the second pitch W11 may be provided. In the connection wiring member 55AK01, among a plurality of signal wirings configured by the wiring patterns 55AK10 to 55AK22, at least some of the signal wirings have the same or substantially the same wiring length.

  FIG. 38 shows another configuration example of a plurality of electric components. FIG. 38A illustrates a configuration example of an electronic component 56AK1IC that can be electrically connected to a plurality of signal wirings including a wiring pattern. FIG. 38B illustrates a configuration example of an electronic component 56AK2IC that can be electrically connected to a plurality of signal wirings including a wiring pattern. The electronic component 56AK1IC and the electronic component 56AK2IC may be functional circuits (for example, a processor or a memory) such as an IC chip mounted on a predetermined member such as a control board such as the main board 11 or the effect control board 12. When one or both of the electronic component 56AK1IC and the electronic component 56AK2IC shown in FIG. 38 are used, for example, a plurality of electrical components are formed by a plurality of signal wirings formed by a wiring pattern or the like in the characteristic portion 30AK shown in FIG. What is necessary is just to be able to be electrically connected. It is not limited to the wiring pattern in the characteristic portion 30AK shown in FIG. 8, and is, for example, the wiring pattern in the characteristic portion 42AK shown in FIGS. 16 to 20, or the wiring pattern in the characteristic portion 43AK shown in FIG. A plurality of signal wirings having the same or substantially the same wiring length of some or all signal wirings, such as the wiring pattern in the feature portion 44AK shown in FIG. 22, can electrically connect a plurality of electrical components. Is good enough. Thereby, the delay time difference between the signals transmitted through the plurality of signal lines can be reduced, and the reliability of the signals transmitted through the plurality of signal lines can be improved. In addition, an increase in the area for arranging the wiring pattern in the control board or the internal circuit of the electric device is suppressed, and the board and the device can be reduced in size.

  In the connection conductor portion 56AK1PD provided corresponding to the electronic component 56AK1IC, connection conductors (for example, connection pads) corresponding to a plurality of terminals connected to a plurality of signal wirings are provided at a first pitch W10. In the connection conductor portion 56AK2PD provided corresponding to the electronic component 56AK2IC, connection conductors (for example, connection pads) corresponding to a plurality of terminals connected to a plurality of signal wirings have a second pitch W11 different from the first pitch W10. It is provided in. The first pitch W10 and the second pitch W11 may be set similarly to the case of the connector port 56AK01 and the connector port 56AK02 shown in FIG. As described above, the electronic component 56AK1IC is a first component in which terminals and connection conductors as a plurality of conductors are provided at the first pitch W10, and the electronic component 56AK2IC has terminals and connection conductors as a plurality of conductors. The second component is provided at two pitches W11. The electronic component 56AK1IC and the electronic component 56AK2IC include, for example, an electrical component that can be electrically connected to another electrical component by connecting connection conductors corresponding to a plurality of terminals to a signal wiring configured by a wiring pattern. Become. The method of joining the connection conductor to the signal wiring may be a metal joining method using solder or the like, or an adhesive joining method such as conductive resin joining or anisotropic conductive member joining. The plurality of signal wires are not limited to the case where the plurality of signal wirings are joined to the plurality of connection conductors at the connection conductor portion 56AK1PD or the connection conductor portion 56AK2PD. Good.

  In the electronic component 56AK1IC, the plurality of terminals are arranged at the first pitch W10, while the wiring pattern is such that the plurality of signal wires are connected to the electronic component 56AK1IC at one end and the plurality of signal wires are arranged at the first pitch W10. It is formed to have a corresponding interval. In the electronic component 56AK2IC, the plurality of terminals are arranged at the second pitch W11, while the wiring pattern is such that the plurality of signal wires are connected to the electronic component 56AK2IC at the other end and the plurality of signal wires are connected to the second pitch W11. Are formed so as to correspond to the intervals. A first adjustment unit that adjusts a plurality of signal wirings so as to have an interval corresponding to the first pitch W10 may be provided near the electronic component 56AK1IC in the wiring pattern. A second adjustment unit that adjusts the plurality of signal wirings so as to have an interval corresponding to the second pitch W11 may be provided near the electronic component 56AK2IC in the wiring pattern. Thereby, when various components are connected, the wiring interval can be adjusted, and a plurality of components can be appropriately connected. In addition, an increase in the area of the connection means for arranging the wiring patterns is suppressed, and the size of the configuration can be reduced.

  One of the connector ports 56AK01 and 56AK02 shown in FIG. 37 and one of the electronic components 56AK1IC and 56AK2IC shown in FIG. You may comprise combining two parts. For example, the connector port 56AK01 shown in FIG. 37A is used as a first component, and the electronic component 56AK2IC shown in FIG. A wiring pattern to be configured may be formed. Alternatively, for example, using the electronic component 56AK1IC shown in FIG. 38A as a first component and the connector port 56AK02 shown in FIG. 37B as a second component, a plurality of signals connectable to a plurality of electrical components. A wiring pattern that forms the wiring may be formed.

  In addition, when one or both of the connector ports 56AK01 and 56AK02 shown in FIG. 37 are used, or when one or both of the electronic components 56AK1IC and 56AK2IC shown in FIG. 38 are used, FIG. A connection unit having a part or all of the features of the connection wiring member 55AK01 in the characteristic portion 55AK may be used. For example, as in the region 55AK10Z shown in FIG. 31, the connection means in which a wiring pattern forming a plurality of signal wirings has at least one of the plurality of signal wirings has a linear shape or a substantially linear shape. While having the first shape, another signal wiring may include a region having a second shape such as a meandering shape different from the first shape. The connecting means may be formed so as to have an L-shape or a substantially L-shape as a whole by bending similarly to the area 55AK2Z shown in FIG. The connecting means may be provided with a bent portion similar to the area 55AK2Z shown in FIG. The connection means may have wiring patterns constituting a plurality of signal wirings formed on both sides, as in the cross-sectional view of FIG. The connection means is formed, for example, by forming the base into a flexible sheet, and in addition to the flexible member, similarly to the regions 55AK1Z and 55AK10Z shown in FIG. 31, a reinforcing member 55AK02 shown in FIG. Similarly, a circuit component that includes a non-flexible member and that is mounted with a non-flexible member so as to be connected to a signal wiring, similarly to the circuit component 55AK1R illustrated in FIG. May be provided. Similar to the through-holes 55AK1H and 55AK2H shown in FIG. 32, the connection means can electrically connect the signal wiring provided on one surface and the signal wiring provided on the other back surface. When a plurality of electrical components are connected by a plurality of signal wirings, a through-hole may not be provided in a region where the shape changes.

(Other Embodiment 3)
In the above-described embodiment, the connection wiring member 55AK01 has been described as being formed so as to have an L-shape or a substantially L-shape as a whole by bending in the region 55AK2Z. However, the present invention is not limited to this, and the connection wiring member may be formed so as to have a linear shape or a substantially linear shape as a whole. For example, the connection wiring member may be configured such that the base is formed in a flexible sheet shape, and is bent so as to be curved at an arbitrary portion when mounted.

  FIG. 39 shows an example of the connection between the effect control board 12 and the image display device 5 when the connection wiring member 55AK01A is used as the connection wiring member having a linear shape or a substantially linear shape as a whole. The connection wiring member 55AK01A is configured such that, when the connector plug 55AK1P is mounted on the connector port 55AK1ST and the connector plug 55AK2P is mounted on the connector port 55AK2ST, the extending directions of a plurality of signal wirings formed by the wiring pattern are changed. At the bending position 55AK01B. Further, the connection wiring member 55AK01A is bent in a region similar to the region 55AK1Z shown in FIG. Accordingly, the direction of the connector plugs 55AK1P and 55AK2P may be adjusted in accordance with the directions of the connector ports 55AK1ST and 55AK2ST.

(Explanation about the characteristic part 50SG)
Next, the characteristic portion 50SG of the present embodiment will be described with reference to FIGS. 40A is a diagram showing an example of connection between the effect control board and the image display device, and FIG. 40B is a right side view of FIG. 41A is a diagram illustrating a first wiring layer of a connection wiring member, and FIG. 41B is a diagram illustrating a second wiring layer. 42A is an enlarged view of a main part of FIG. 41A, and FIGS. 42B and 42C are enlarged views of a main part of FIG. 43A is a sectional view taken along line AA (A'-A ') of FIG. 42, and FIG. 43B is a sectional view taken along line BB (B'-B') of FIG. 44A is a diagram showing a first bent portion formed on the basis of a convex portion, FIG. 44B is a schematic side view of FIG. 44A, and FIG. 44C is a diagram showing a first bent portion formed on the basis of a concave portion. (D) is a side view of (C). 45 (A) is a diagram showing the formation of the second bent portion with reference to the convex portion, (B) is a side view of (A), (C) is a diagram showing the formation of the second bent portion with reference to the concave portion, (D) is a side view of (C). FIG. 46 is a diagram illustrating Modification Example 1 of the feature unit 50SG. FIG. 47 is a diagram illustrating Modification Example 2 of the feature unit 50SG. FIGS. 48A to 48C are diagrams illustrating Modification Example 3 of the characteristic portion 50SG. FIGS. 44 to 47 are schematic diagrams for easily explaining main parts of the connection wiring member.

  40 to 43 show a configuration example of the connection wiring member 50SG01 with respect to the characteristic portion 50SG of the present embodiment. The connection wiring member 50SG01 is a connection member (connection means) that can electrically connect a plurality of electric components, such as the effect control board 12 and the image display device 5, for example. The connection wiring member 50SG01 may be made of a material that is partially or entirely flexible, such as a flexible flat cable or a flexible wiring board. In the connection wiring member 50SG01, a wiring pattern constituting a plurality of signal wirings is formed in order to connect a plurality of electric components by a plurality of signal wirings. In the connection wiring member 50SG01, the wiring patterns constituting the plurality of signal wirings include the wiring patterns 50SG10 to 50SG30, 50SG1G, and 50SG2G.

  One end of the signal wiring constituted by the wiring patterns 50SG10 to 50SG30, 50SG1G, and 50SG2G is connected to the connector plug 50SG1P, and the other end is connected to the connector plug 50SG2P. The connector plug 50SG1P is a wiring connection component that enables one electrical component such as the effect control board 12 to be electrically connected to a plurality of signal wires. The connector plug 50SG2P is a wiring connection component that enables the other electrical component, such as the image display device 5, to be electrically connected to a plurality of signal wires.

  The power supply wiring is formed as the wiring pattern 50SG10, for example. As the wiring pattern 50SG10, a linear wiring may be formed, or a planar wiring may be formed partially or entirely. The wiring patterns 50SG11 to 50SG30 may be configured by combining two signal wirings to form a pair of signal wirings. For example, the signal wiring constituted by the wiring pattern 50SG11 forms a pair of signal wirings in combination with the signal wiring constituted by the wiring pattern 50SG12.

  In the plurality of signal wirings including the wiring patterns 50SG11 to 50SG30 illustrated in FIG. 41A, at least some of the signal wirings have the same or substantially the same wiring length. For example, a plurality of signal wirings configured by the wiring patterns 50SG11 to 50SG30 have the same or substantially the same wiring length. In the connection wiring member 50SG01, a parallel wiring portion in which a plurality of signal wirings have a first shape that is parallel or substantially parallel, and a second shape in which at least one signal wiring of the plurality of signal wirings is not parallel to other signal wirings. A wiring pattern may be formed so as to include the specific wiring portion. Accordingly, an increase in the area of the connection member on which the wiring pattern is arranged is suppressed, and the configuration can be reduced in size. A wiring pattern is formed so that the wiring length of at least a part of the signal wiring is the same or substantially the same, so that the delay time difference between signals transmitted through the plurality of signal wirings is reduced, and the plurality of signal wirings are reduced. Can improve the reliability of the signal transmitted by the transmission.

  A plurality of wiring patterns 50SG1G and 50SG2G are arranged around the wiring patterns constituting the plurality of signal wirings or in an area between the signal wirings. The patterns 50SG1G and 50SG2G function as reference grounds and characteristic impedance adjustment grounds, and are maintained at the ground voltage. As described above, one or a plurality of ground conductors may be provided in an empty area which is a blank area where a wiring pattern constituting a plurality of signal wirings is not provided. This can prevent or suppress electromagnetic interference caused by electromagnetic noise radiated from a plurality of signal wirings and electromagnetic noise between signal wirings.

  In addition, the wiring pattern 50SG10, the wiring patterns 50SG1G, 50SG2G, and the ground layer 50SG3G are formed wider in the direction (width direction) along the X-axis than the wiring patterns 50SG11 to 50SG30, which are signal wirings. .

  As shown in FIG. 43, the connection wiring member 50SG01 has a multilayer structure in which insulating layers 50SG1S and 50SG2S made of a synthetic resin such as a polyimide resin are stacked, and various wirings are provided on the surface or inner layer of each layer. A pattern can be formed. For example, a plurality of electric components such as the effect control board 12 and the image display device 5 are electrically connected via a wiring pattern formed on the connection wiring member 50SG01 having such a multilayer structure. The multilayer structure of the connection wiring member 50SG01 illustrated in FIG. 43 includes a wiring layer 50SG1L and a ground layer 50SG3G. The surface of the wiring layer 50SG1L is covered and protected by the cover layer 50SG1V.

  In the wiring layer 50SG1L, a wiring pattern 50SG10 forming a power supply wiring, wiring patterns 50SG1G and 50SG2G forming a ground conductor, and wiring patterns 50SG11 to 50SG30 forming a signal wiring are formed. A ground layer 50SG3G is arranged on the surface of the insulating layer 50SG2S which is the back surface of the connection wiring member 50SG01. The ground layer 50SG3G functions as a reference ground or a characteristic impedance adjusting ground, and is maintained at the ground voltage.

  The connection wiring member 50SG01 has a first layer (FIG. 41A) composed of an insulating layer 50SG1S having a conductive layer (wiring pattern) formed on the surface, and a conductive layer (wiring pattern) formed on the surface. And a second layer (FIG. 41B) made of the insulating layer 50SG2S, and has a two-layer structure in which the insulating layer 50SG1S is formed on the surface of the insulating layer 50SG2S. May have a one-layer structure in which a conductor layer is formed on only one surface, or may have a two-layer structure in which a conductor layer is formed on both surfaces of one insulating layer. Further, it may have a multilayer structure having three or more conductor layers.

  The wiring pattern 50SG10 formed on the wiring layer 50SG1L of the connection wiring member 50SG01 is formed through a through-hole such as a plurality of through holes 50SG1H penetrating the insulating layers 50SG1S, 50SG2S and the ground layer 50SG3G of the connection wiring member 50SG01. Is electrically connected to Further, the wiring patterns 50SG1G and 50SG2G formed in the wiring layer 50SG1L of the connection wiring member 50SG01 pass through through-holes such as a plurality of through holes 50SG2H penetrating the insulating layers 50SG1S and 50SG2S of the connection wiring member 50SG01 and the ground layer 50SG3G. Is electrically connected to the ground layer 50SG3G.

  As shown in FIGS. 41 (A) and 42 (A), a first cutout recess 50SG61A is formed at a first position in a direction (wiring direction) along the Z-axis at an outer edge 50SG50 of the wiring pattern 50SG10. A second notch recess 50SG62A is formed at a second position closer to the connector plug 50SG2P than the first position.

  In addition, a first notch 50SG61B is formed at a first corresponding position in a direction (wiring direction) along the Z-axis on the outer edge 50SG51 of the wiring pattern 50SG2G, and a first cutout concave portion 50SG61B is located closer to the connector plug 50SG2P than the first corresponding position. The second notch recess 50SG62B is formed at the position corresponding to 2.

  The first notch recesses 50SG61A and 50SG61B are composed of two recesses 50SG63A and 50SG63B, and a projection 50SG63C formed between the two recesses 50SG63A and 50SG63B. The second notch recesses 50SG62A and 50SG62B include two recesses 50SG64A and 50SG64B, and a projection 50SG64C formed between the two recesses 50SG64A and 50SG64B.

  The first notch 50SG61A and the first notch 50SG61B are at the same position in the direction along the Z-axis (the longitudinal direction of the connection wiring member 50SG01) and along the X-axis orthogonal to the direction along the Z-axis. They are arranged so as to face each other at different positions in the direction (the width direction of the connection wiring member 50SG01).

  On the other hand, the second notch recess 50SG62A and the second notch recess 50SG62B are located at different positions in the direction along the Z-axis (the longitudinal direction of the connection wiring member 50SG01), and are orthogonal to the direction along the Z-axis. (The width direction of the connection wiring member 50SG01). That is, they are arranged at different positions in the direction along the XZ axis, which is inclined at about 45 degrees with respect to the direction along the Z axis.

  Also, as shown in FIGS. 42 (B) and 42 (C), the sides 50SG65A and 50SG65B of the connector plug 50SG1P side in the recesses 50SG64A and 50SG64B of the second notch 50SG62A, and the connectors 50SG64A and 50SG64B of the second notch 50SG62B. The sides 50SG65A and 50SG65B on the plug 50SG2P side are inclined in the direction along the XZ axis. The side opposite to the sides 50SG65A and 50SG65B and the side opposite to the sides 50SG65A and 50SG65B extend in the direction along the X axis without being inclined in the direction along the XZ axis. No sharp corners are formed.

  As shown in FIG. 41 (B), the first notch recesses 50SG61A and 50SG61B correspond to the first notch recesses 50SG61A and 50SG61B (the positions along the Y axis in the first notch recesses 50SG61A and 50SG61B), and the first notch recesses 50SG61A and 50SG61B. The first notch recesses 50SG61A ′ and 50SG61B ′ having the same shape as the above are formed. In the ground layer 50SG3G, at positions corresponding to the second notch recesses 50SG62A and 50SG62B (positions along the Y axis in the second notch recesses 50SG62A and 50SG62B), the second notch recesses 50SG62A having the same shape as the second notch recesses 50SG62A and 50SG62B. ', 50SG62B' are formed.

  As shown in FIGS. 42 (B), (C) and 43, the outer edge 50SG50 of the wiring pattern 50SG10 and the outer edge 50SG51 of the wiring pattern 50SG2G are formed inward from the outer edges 50SG01E of the insulating layers 50SG1S, 50SG2S and the cover layer 50SG1V. It is located at a position separated by a predetermined dimension L1, and corresponds to the first cutouts 50SG61A, 50SG61B, 50SG61A ', 50SG61B' and the second cutouts 50SG62A, 50SG62B, 50SG62A ', 50SG62B' in the insulating layers 50SG1S, 50SG2S and the cover layer 50SG1V. The notched portion is not formed in the portion to be cut. Therefore, the insulating layers 50SG1S, 50SG2S and 50SG2S are provided so that the first notched concave portions 50SG61A, 50SG61B, 50SG61A ', 50SG61B' and the second notched concave portions 50SG62A, 50SG62B, 50SG62A ', 50SG62B' in the wiring patterns 50SG10, 50SG2G are not exposed to the outside. It is protected by the cover layer 50SG1V.

  Therefore, the first cutouts 50SG61A, 50SG61B, 50SG61A ', 50SG61B' and the second cutouts 50SG62A, 50SG62B, 50SG62A ', 50SG62B' are formed of other members or other structures when the connection wiring member 50SG01 is manufactured or when wiring is performed. This prevents the wiring patterns 50SG10 and 50SG2G from being damaged due to, for example, being in contact with and being caught by an object or the like, thereby preventing disconnection or the like.

  As shown in FIG. 42 (A), a region between the first notch concave portion 50SG61A and the first notch concave portion 50SG61B, a region between the second notch concave portion 50SG62A and the second notch concave portion 50SG62B in the connection wiring member 50SG01, In other words, since the through-hole 50SG2H is not formed in a region where the first bent portion 50SG81 and the second bent portion 50SG82, which will be described later, can be formed, the through-hole 50SG2H is deformed and collapsed by bending, or is applied to the inner peripheral surface. It is prevented that the broken conductor is peeled off and the disconnection occurs. Further, by providing the region without the through hole 50SG2H in this manner, it can be used as a guide for the position where the first bent portion 50SG81 and the second bent portion 50SG82 are formed.

  FIG. 40 shows an example of connection between the effect control board 12 and the image display device 5 using the connection wiring member 50SG01. The connector plug 50SG1P included in the connection wiring member 50SG01 is inserted into the connector port 50SG1ST provided on the effect control board 12. The connector plug 50SG2P provided in the connection wiring member 50SG01 is inserted into a connector port 50SG2ST provided in the image display device 5. The connector port 50SG1ST provided on the effect control board 12 and the connector port 50SG2ST provided on the image display device 5 are wiring connections capable of detachably connecting signal wires electrically connected to other electrical components. What is necessary is just to have the structure of an apparatus. For example, the connector port 50SG1ST, which is one of the electric components, is provided on the effect control board 12, and the connector plug 50SG1P of the connection wiring member 50SG01 is configured to be detachable. The connector port 50SG2ST, which is the other electric component, has an image display function. The connector plug 50SG2P of the connection wiring member 50SG01 is provided in the device 5, and is configured to be detachable. By attaching the connector plug 50SG1P to the connector port 50SG1ST and attaching the connector plug 50SG2P to the connector port 50SG2ST, a plurality of signal wirings formed by the wiring patterns 50SG11 to 50SG30 formed on the connection wiring member 50SG01 are connected to one electrical line. The connector port 50SG1ST as a component and the connector port 50SG2ST as the other electrical component can be electrically connected.

  The entire area of the connection wiring member 50SG01 has flexibility. Accordingly, when the connector plug 50SG1P is mounted on the connector port 50SG1ST and the connector plug 50SG2P is mounted on the connector port 50SG2ST, the first position and the first corresponding position where the first cutout recesses 50SG61A and 50SG61B are formed, and At the second position and the second corresponding position where the two notch recesses 50SG62A and 50SG62B are formed, the connection wiring member 50SG01 is bent so as to be bent, and the directions of the connector plug 50SG1P and the connector plug 50SG2P are changed to the connector port 50SG1ST. It can be routed in the direction of the connector port 50SG2ST.

  More specifically, the substrate case 800 is attached to the back of a cover 50SG70 that covers the back of the image display device 5, and the cover 50SG70 has an opening 50SG71. The connector plug 50SG1P of the connection wiring member 50SG01 is inserted into the connector port 50SG1ST provided on the effect control board 12 from the X-axis positive direction to the X-axis negative direction. Then, after the connection wiring member 50SG01 is inserted into the opening 50SG71 and routed toward the front side of the cover body 50SG70, the wiring routing direction is formed at the first bent portion 50SG81 formed at the first position and the first corresponding position. Is changed along the fold line along the X-axis in order to change about 180 degrees from the X-axis positive direction to the opposite X-axis negative direction.

  Next, at the second bent portion 50SG82 formed at the second position and the second corresponding position, along the XZ axis to change the wiring direction from the negative X axis to the negative Z axis by about 90 degrees. After bending along the fold, the connector plug 50SG2P of the connection wiring member 50SG01 is inserted into the connector port 50SG2ST provided in the image display device 5 from the positive Z-axis direction to the negative Z-axis direction.

  Here, for example, when it is necessary to replace the effect control board 12 with a model-specific effect control board due to a model change, the arrangement position of the board case 800 with respect to the image display device 5, more specifically, provided on the image display device 5. When the arrangement position of the connector port 50SG1ST provided on the effect control board 12 with respect to the provided connector port 50SG1ST is common to a plurality of other types of models including the pachinko gaming machine 1, the image display device 5 and the effect control board 12 Also, the connection wiring member 50SG01 having the same length can be used in common by a plurality of models as the connection wiring member that electrically connects the two.

  In this case, since the connection wiring member 50SG01 is routed in the same manner, the first position and the first corresponding position where the first bent portion 50SG81 is formed and the second position where the second bent portion 50SG82 is formed in the connection wiring member 50SG01. The second corresponding position is also common among a plurality of models.

  Therefore, in the manufacturing process of the connection wiring member 50SG01, when forming the wiring patterns 50SG10, 50SG2G and the ground layer 50SG3G, the first cutout recesses 50SG61A, 50SG61B, 50SG61A ', 50SG61B' are formed at the first position and the first corresponding position. By forming in advance and forming the second notch recesses 50SG62A, 50SG62B, 50SG62A ', and 50SG62B' at the second position and the second corresponding position in advance, the first notch recesses 50SG61A and 50SG61B which can be visually recognized from the surface among these. The first bent portion 50SG81 and the second bent portion 50SG82 can be easily formed using the second notched concave portions 50SG62A and 50SG62B as a guide.

  By doing so, the marks and the like are formed at the first position and the first corresponding position where the first bent portion 50SG81 is formed, and the second position and the second corresponding position where the second bent portion 50SG82 is formed, as in the related art. Is unnecessary, and thus the manufacturing process of the connection wiring member 50SG01 can be simplified.

  As shown in FIGS. 44A and 44B, when forming the first bent portion 50SG81 with reference to the convex portions 50SG63C of the first notched concave portions 50SG61A, 50SG61B, 50SG61A ', and 50SG61B', the fold C1 is formed on both sides in the width direction. The connecting wiring member 50SG01 may be folded such that both side portions of the fold C1 overlap each other so as to pass through the convex portion 50SG63C. At this time, since the concave portions 50SG63A and 50SG63B are formed in the wiring patterns 50SG10 and 50SG2G and the ground layer 50SG3G made of copper foil, the convex portion 50SG63C having a small area of the copper foil is weakened. In addition, the connection wiring member 50SG01 can be easily bent at the first corresponding position, and the bending state is suitably maintained because the elastic force is weakened.

  Further, as shown in FIGS. 44 (C) and (D), when forming the first bent portion 50SG81 based on the concave portion 50SG63B (or the concave portion 50SG63A) of the first notched concave portions 50SG61A, 50SG61B, 50SG61A ', and 50SG61B' as a reference. The connection wiring member 50SG01 may be folded such that both side portions of the fold C2 overlap so that C2 passes through the concave portions 50SG63B (or concave portions 50SG63A) on both sides in the width direction. At this time, since the concave portions 50SG63A and 50SG63B are formed in the wiring patterns 50SG10 and 50SG2G and the ground layer 50SG3G made of copper foil, the area of the copper foil is narrowed and weakened. The connection wiring member 50SG01 can be easily bent at the corresponding position, and the elastic force is weakened, so that the bent state is suitably maintained.

  As shown in FIGS. 45A and 45B, when the second bent portion 50SG82 is formed based on the convex portion 50SG64C of the second notched concave portions 50SG62A, 50SG62B, 50SG62A ′, and 50SG62B ′, the fold C3 is formed on both sides in the width direction. The connecting wiring member 50SG01 may be folded such that both side portions of the fold C3 overlap each other so as to pass through the convex portion 50SG64C. At this time, since the concave portions 50SG64A and 50SG64B are formed in the wiring patterns 50SG10 and 50SG2G and the ground layer 50SG3G made of copper foil, the convex portion 50SG64C having a small area of the copper foil is fragile. In addition, the connection wiring member 50SG01 can be easily bent at the second corresponding position, and the bending state is suitably maintained because the elastic force is weakened.

  Further, as shown in FIGS. 44 (C) and (D), when forming the second bent portion 50SG82 with reference to the concave portion 50SG64B (or the concave portion 50SG64A) of the second cutout concave portions 50SG62A, 50SG62B, 50SG62A ′, and 50SG62B ′, The connection wiring member 50SG01 may be folded such that both side portions of the fold C4 overlap so that C4 passes through the concave portions 50SG64B (or the concave portions 50SG64A) on both sides in the width direction. At this time, since the concave portions 50SG64A and 50SG64B are formed in the wiring patterns 50SG10 and 50SG2G and the ground layer 50SG3G made of copper foil, the area of the copper foil is narrowed and weakened. The connection wiring member 50SG01 can be easily bent at the corresponding position, and the elastic force is weakened, so that the bent state is suitably maintained.

  Further, such a first bent portion 50SG81 and a second bent portion 50SG82 may be formed by a machine in a manufacturing process of the connection wiring member 50SG01, or a wiring operation for connecting the effect control board 12 and the image display device 5 to each other. At times, it may be formed manually by an operator or the like.

  Since the front and back surfaces of the ground layer 50SG3G are covered with the insulating layers 50SG1S and 50SG2S, it is difficult to visually confirm the first cutout recesses 50SG61A ′ and 50SG61B ′ and the second cutout recesses 50SG62A ′ and 50SG62B ′. However, since the cover layer 50SG1V has transparency, the first cutout recesses 50SG61A and 50SG61B and the second cutout recesses 50SG62A and 50SG62B can be visually recognized through the cover layer 50SG1V.

  Further, the first cutout recesses 50SG61A, 50SG61B and the second cutout recesses 50SG62A, 50SG62B are composed of two recesses 50SG63A, 50SG63B and a protrusion 50SG63C formed between the two recesses 50SG63A, 50SG63B. Thus, even when the length of the first cutout recesses 50SG61A and 50SG61B and the second cutout recesses 50SG62A and 50SG62B in the direction along the Z axis is large, the folds C1 to C4 are formed at accurate positions using the protrusions 50SG63C as an index. Can be.

(Explanation on deformation and application)
The present invention is not limited to the above embodiment, and various modifications and applications are possible. For example, the pachinko gaming machine 1 does not need to have all the technical features shown in the above-described embodiment, and a part described in the above-described embodiment so as to solve at least one problem in the related art. May be provided. For example, among the features described in the above embodiment, any feature may be used as long as it has at least one feature that enables an appropriate substrate configuration. Further, even if the configuration is not described in the above embodiment, at least one problem included in the same or similar problem as the case where the configuration described in the above embodiment is provided is solved, or the above embodiment is used. As long as it can achieve at least one object or effect included in the same or similar object or effect as in the case of having the structure described in the above, together with the structure described in the above embodiment, or in the above embodiment, Instead of the configuration described above, it may be provided.

  In the above embodiment, the first cutouts 50SG61A, 50SG61B, 50SG61A ', 50SG61B' and the second cutouts 50SG62A, 50SG62B, 50SG62A ', 50SG62B' are formed of two recesses 50SG63A, 50SG63B and 50SG63A, 50SG63B. Although the form constituted by the convex portion 50SG63C formed between them has been exemplified, the present invention is not limited to this. For example, as shown in a first modification of FIG. The cutout recesses 50SG61A1 and 50SG61B1 may be configured.

  In the above-described embodiment, an example in which the first notch recesses 50SG61A, 50SG61B, 50SG61A ', 50SG61B' and the second notch recesses 50SG62A, 50SG62B, 50SG62A ', 50SG62B' which are formed in a concave shape are applied as the notch portions. However, the present invention is not limited to this, and the shape of the cutout portion is arbitrary, and for example, can be deformed into various shapes such as a substantially V shape, a substantially U shape, and a substantially semicircular shape. .

  In the above-described embodiment, the first notch recesses 50SG61A and 50SG61B and the second notch recesses 50SG62A and 50SG62B are formed on the outer edge 50SG50 of the wiring pattern 50SG10 and the outer edge 50SG51 of the wiring pattern 50SG2G. However, the present invention is not limited to this, and the notch may not be formed in the outer edge 50SG01E of the connection wiring member 50SG01. For example, as shown in Modification 2 of FIG. 47, the first notch 50SG61A2 , 50SG61B2, etc. may be formed on the inner edge 50SG50A of the wiring pattern 50SG10 and the inner edge 50SG51A of the wiring pattern 50SG2G, or the wiring pattern provided at a position distant from the outer edge 50SG01E in the width direction of the connection wiring member 50SG01. It may be provided in such edge portions of the down 50SG11～50SG30.

  In the above-described embodiment, the connection wiring member 50SG01 connects the effect control board 12 fixedly attached to the pachinko gaming machine 1 to the image display device 5, but the present invention is not limited to this. However, at least one of a plurality of electrical components that can be electrically connected by a connecting member (connecting means) (for example, a movable body for production and auxiliary image display devices 5A and 5B to be described later). May be operably provided.

  For example, the pachinko gaming machine 1 is provided with an auxiliary image provided to be movable (movable) in the left-right direction between the origin position on the front left and right sides of the image display device 5 and the effect position on the front side of the display area of the image display device 5. The display devices 5A and 5B, and the connection wiring members 50SG01A and 50SG01B capable of electrically connecting the auxiliary image display devices 5A and 5B and the effect control board 12 are provided. The connection wiring members 50SG01A and 50SG01B display auxiliary images. In the case where the connection wiring members 50SG01A and 50SG01B have a deformed portion that is deformed in accordance with the operation of the devices 5A and 5B, the first bent portion 50SG81A that is bent when the auxiliary image display devices 5A and 5B are located at the origin position. A second bent portion 50SG82A that is bent when the auxiliary image display devices 5A and 5B are located at the rendering position. The corresponding position may be formed with the first cutout recess 50SG61A3,50SG61B3 a second cutout recess 50SG62A3,50SG62B3.

  By doing so, when the auxiliary image display devices 5A and 5B are located at the origin position and the rendering position, the connection wiring members 50SG01A and 50SG01B are suitably bent at the first bent portion 50SG81A and the second bent portion 50SG82A. Accordingly, the connection wiring members 50SG01A and 50SG01B are bent in an unintended direction by the elastic return force of the insulating layers 50SG1S and 50SG2S, and the connector plugs 50SG1P and 50SG2P are detached from the connector ports 50SG1ST and 50SG2ST. Etc. can be prevented.

  In addition, since the auxiliary image display devices 5A and 5B are located at the origin position for a longer time than the rendering position, the first notch concave portions 50SG61A3 are provided only at positions corresponding to the first bent portions 50SG81A. 50SG61B3 may be formed. Also, a notch recess is formed between the first notch recesses 50SG61A3, 50SG61B3 and the second notch recesses 50SG62A3, 50SG62B3, and the deformed portions of the connection wiring members 50SG01A, 50SG01B when the auxiliary image display devices 5A, 5B move. You may make it bend suitably.

  In the above-described embodiment, the connection wiring member 50SG01 that can connect the effect control board 12 provided in the pachinko gaming machine 1 and the image display device 5 is applied as the connection means that can connect a plurality of electric components. However, the present invention is not limited to this, and the plurality of electric components are not limited to the effect control board 12 and the image display device 5, but the main board 11, the power supply board 92, and the motor. , A solenoid, a sensor, or a relay board to which these are connected.

  Further, in the above-described embodiment, the form in which the connection wiring member 50SG01, which is a flexible flat cable, is applied as the connection means capable of connecting a plurality of electric components is exemplified, but the present invention is not limited to this. It is sufficient that a part or the whole such as a flexible wiring board is made of a material having flexibility.

  Further, in the above-described embodiment, an embodiment in which the first bent portion 50SG81 and the second bent portion 50SG82 are formed at the first position and the first corresponding position and the second position and the second corresponding position in the connection wiring member 50SG01. Although illustrated, the present invention is not limited to this, and a bent portion may be provided at a position other than these two positions, or a bent portion may be provided at only one position.

  In the above-described embodiment, the first notch recesses 50SG61A and 50SG61B and the second notch recesses 50SG62A and 50SG62B are provided at the first and second positions on one side of the connection wiring member 50SG01 and on the other side opposite to the one side. Although the form formed on both sides in the width direction of the first corresponding position and the second corresponding position has been exemplified, the present invention is not limited to this, and one side or the other side of the connection wiring member 50SG01. It may be formed only on one of them.

  In the above-described embodiment, the first notch recesses 50SG61A, 50SG61B and the second notch recesses 50SG62A, 50SG62B are formed in the wiring patterns 50SG10, 50SG2G, and the ground layer 50SG3G, which are conductor portions of the connection wiring member 50SG01. Although illustrated, the present invention is not limited to this, and the first cutouts 50SG61A, 50SG61B and the second cutouts 50SG62A, 50SG62B are formed in at least one of the wiring patterns 50SG10, 50SG2G and the ground layer 50SG3G. It may be. Furthermore, in addition to the above-described conductor part, it may be formed on at least one of the insulating layers 50SG1S, 50SG2S and the cover layer 50SG1V other than the conductor part.

  Further, in the above-described embodiment, the first bent portion 50SG81 and the second bent portion 50SG82 are formed by bending at predetermined positions of the connection wiring member 50SG01 so that both side portions of the folds C1 to C4 are overlapped. However, the present invention is not limited to this, and the bent state is not only a state of being bent at an acute angle along the fold, but also a state of being bent at an obtuse angle along the fold, The connection wiring member 50SG01 may include a state where the connection wiring member 50SG01 is bent so as not to be creased.

  In the above-described embodiment, in the first bent portion 50SG81 of the connection wiring member 50SG01, the wiring direction is changed by about 180 degrees from the positive X-axis direction to the opposite X-axis negative direction, and the second bent portion 50SG82 Although the form in which the wiring direction is changed by about 90 degrees from the negative direction of the X axis to the negative direction of the Z axis is illustrated, the present invention is not limited to this, and the wiring direction and the bending angle of the wiring are arbitrary. It is not limited to the above embodiment.

  Further, in the above embodiment, the connection wiring member 50SG01 includes the wiring patterns 50SG10 to 50SG30, 50SG1G, and 50SG2G which constitute a plurality of signal wirings, but the present invention is not limited to this. The wiring pattern can be arbitrarily changed. For example, the wiring patterns 55AK10 to 55AK22 described in the characteristic portion 55AK, the wiring patterns 30AK10D to 30AK13D described in the characteristic portion 30AK, the pattern 30AK10CK, the pattern 30AK10CS, It may include the pattern 30AK10RS, the patterns 30AK10A to 30AK14A, and the like.

  In the above embodiment, at least one of the plurality of signal wirings electrically connecting the plurality of electric components has a shape different from the linear shape and the substantially linear shape, and is parallel to the other signal wirings. The shape different from the substantially parallel shape has been described as including a portion having a shape called a meandering shape, meander shape, zigzag shape, or folded shape. On the other hand, a shape different from the linear shape and the substantially linear shape, or a shape different from the shape parallel or substantially parallel to other signal wires is different from the meandering shape such as a curved shape or a spiral shape, and the wiring length of the signal wire is different from the meandering shape. May be any shape that can be extended or adjusted. At least one signal wiring of the plurality of signal wirings electrically connecting the plurality of electric components includes a portion having a shape capable of extending the wiring length, so that each signal wiring included in the plurality of signal wirings is formed. It suffices if the wiring lengths are the same or substantially the same, and a delay time difference between signals transmitted through a plurality of signal wirings can be prevented or suppressed.

  The plurality of electric components electrically connected by the plurality of signal wirings are not limited to the RAM 102 and the CPU 103 mounted on the main board 11, and may be any electric components included in a gaming machine such as the pachinko gaming machine 1. . For example, as a plurality of electrical components, the effect control CPU 120 and the RAM 122 mounted on the effect control board 12 are electrically connected by a plurality of signal wires, and at least one of the plurality of signal wires has a linear shape and The wiring pattern may be formed so as to have a shape different from the substantially straight line shape and a shape different from the shape parallel or substantially parallel to other signal wires. In this case, the effect control CPU 120 is an electrical component configured to be able to execute a predetermined process with respect to the effect control in the pachinko gaming machine 1, and the RAM 122 is capable of storing information relating to the execution of the process by the effect control CPU 120. It is an electric component configured as follows. Alternatively, an electrical component that can store information related to the execution of processing by the CPU 103, such as the ROM 101, instead of the RAM 102 in the above embodiment, may be used. Alternatively, an electrical component such as a graphics processor included in the display control unit 123 instead of the effect control CPU 120 that can execute a process related to an effect different from the effect control CPU 120 may be used. Further, instead of the RAM 122, an electrical component such as the ROM 121 that can store information related to the execution of the processing by the effect control CPU 120 may be used. Further, instead of the RAM 122, an electrical component such as an image data memory capable of storing information relating to execution of processing by the graphics processor of the effect control CPU 120 or the display control unit 123 may be used.

  The effect control board 12 may be configured as a multilayer wiring board, similarly to the main board 11 in the above embodiment. The plurality of signal wirings in the above-described embodiment is configured such that a plurality of processing devices such as a graphics processor included in the effect control CPU 120 and the display control unit 123 mounted on the effect control board 12 are electrically connected, for example. A wiring pattern may be formed. Alternatively, the plurality of signal wirings are wiring patterns formed such that a plurality of electrical components such as a graphics processor included in the display control unit 123 and an input / output port for a video signal are electrically connected. It may be. A wiring pattern is formed on a plurality of signal wires to which the plurality of electrical components are connected, such that an arbitrary electrical circuit different from the plurality of electrical components, such as a filter circuit or a buffer circuit, is interposed. It may be something. In the plurality of signal wirings, for example, digital video signals indicating respective levels (RGB values) of display colors R (red), G (green), and B (blue) on the image display device 5 are transmitted in a parallel signal system. May be done. Alternatively, in the plurality of signal wirings, signals related to game control and performance control may be transmitted by a parallel signal method such as an LVDS (Low Voltage Differential Signal) method. In these parallel signal systems, synchronized signal transmission may be required in a plurality of signal lines. Therefore, as in the above embodiment, by forming a wiring pattern so that a portion having a meandering shape or the like is provided, the wiring length of each signal wiring included in the plurality of signal wirings is the same or substantially equal. It becomes the same, and it is possible to reduce a delay time difference between signals transmitted through a plurality of signal wirings.

  In addition, it is not limited to the signal transmitted by the parallel signal system, and for example, a video signal supplied to the image display device 5 or an effect such as the speakers 8L and 8R, the game effect lamp 9, the effect motor 60, and the effect LED 61. When the control signal supplied to the electric component is transmitted by the serial signal system, the signal wiring for transmitting the clock signal and the signal wiring for transmitting the data signal are a plurality of signal wirings in the above embodiment. It may be included in the signal wiring. Further, when the video signal and the control signal are transmitted by the serial signal method, the signal wiring for transmitting the signal by the differential signal transmission method may be included in the plurality of signal wirings in the above embodiment.

  For example, a signal wiring in which the distance between connection terminals in a plurality of electrical components is longer than other signal wirings, such as a signal wiring formed by a wiring pattern 30AK10D, has a shape different from the linear shape and the substantially linear shape, The wiring pattern may be formed so as to include a portion having a shape different from a shape parallel or substantially parallel to other signal wires. Even if the distance between the connection terminals in the plurality of electrical components is shorter than the other signal wiring, the wiring length may be longer than the other signal wiring depending on the design of the wiring pattern on the substrate. In such a case, the selection between the signal wiring including a portion having a meandering shape or the like among the plurality of signal wirings and the signal wiring not including such a portion depends on the design of the wiring pattern on the substrate. It may be arbitrarily changed accordingly.

  The plurality of signal wirings configured by the wiring patterns are not limited to those having the same or substantially the same wiring length, and are formed in combination with an arbitrary configuration capable of adjusting a delay time difference (skew). It may be. For example, of a plurality of signal wirings, the relative permittivity of a dielectric disposed corresponding to one signal wiring is different from the relative permittivity of an insulator disposed corresponding to another signal wiring. Thus, by changing the propagation speed of the signal, the delay time difference (skew) in each signal wiring can be adjusted, so that at least one signal wiring has the first shape of the linear shape and the substantially linear shape. May include a second shape portion having a different second shape.

  In the above embodiment, as shown in FIG. 28, the electronic components arranged with the sides inclined in the vertical and horizontal directions are the heat-generating electronic component 45AK60 and the electronic component 45AK62 provided around the electronic component 45AK60. . However, the arrangement may be such that only the heat-generating electronic component 45AK60 is inclined and the other electronic components are not inclined. Further, the electronic component 45AK60 may be arranged so as to be inclined.

  Further, the inclination angle of the heat sink with respect to the heat-producing square electronic component is not limited to 45 °. That is, the degree of the inclination angle is not particularly limited as long as the heat sink is arranged so that the range in which the electronic components are in contact with the fins can be sufficiently secured in the arrangement direction.

  Further, the shape of the heat-generating electronic component does not need to be substantially square, but may be rectangular. Even when adopting a rectangular electronic component, the heat generated from the electronic component is arranged by arranging the heat sink so that the direction in which the fins are arranged matches the direction in which the diagonal line of the electronic component extends. Can enhance the heat radiation effect.

  In addition, the heat conductive sheet attached to the heat-generating electronic component may be provided in a range sufficient to conduct heat generated from the electronic component. For example, it may be provided in a range that covers the entire electronic component, or may be provided only in a range in which heat is generated (only a partial range of the electronic component). It is preferable that the heat conductive sheet has a size that does not make contact with the wiring of the substrate even when the heat conductive sheet is provided to cover the entire electronic component.

  The receptacle KRE1 is not limited to the one mounted on the surface of the effect control substrate 12, but may be any one mounted on an arbitrary substrate such as the main substrate 11. The various power supply voltages are not limited to those supplied to the effect control board 12, and may be those supplied to any control board such as the main board 11 or the payout control board. Various electric circuits and electric components are not limited to those arranged on the effect control board 12, but may be arranged on any control board such as the main board 11 or the payout control board.

  The connection wiring member 55AK01 has been described as having a multilayer structure including a conductor layer serving as an internal layer, such as the power supply layer 55AK1L and the wiring layer 55AK2L as shown in FIG. On the other hand, the connection wiring member 55AK01 may be configured not to include a conductor layer serving as an internal layer. Also in this case, the wiring pattern forming the signal wiring on the front surface layer 55AK1S provided on one surface and the wiring pattern forming the signal wiring on the back surface layer 55AK2S provided on the other back surface are formed. Alternatively, a through portion such as a through hole that can be electrically connected may be provided. By configuring so as not to include the conductor layer serving as the inner layer, the flexibility of the connection wiring member 55AK01 can be increased, and the direction of the connector plug 55AK1P or the connector plug 55AK2P can be easily adjusted.

  Regardless of whether a conductor layer serving as an internal layer is included or not, a wiring pattern forming a signal wiring is formed on a surface layer 55AK1S provided on one surface, whereas a back surface serving as another surface is provided on the other surface. The wiring pattern constituting the signal wiring may not be formed on the provided rear surface layer 55AK2S. The wiring pattern that forms the plurality of signal wirings may be formed on one surface or the other surface of the connection wiring member 55AK01, such as the surface layer 55AK1S or the back surface layer 55AK2S, or may be formed on the wiring layer 55AK2L shown in FIG. It may be formed on the inner layer. Also in these cases, the wiring pattern may be formed so that the wiring length of at least a part of the signal wiring is the same or substantially the same. Accordingly, an appropriate wiring configuration that reduces the delay time difference between signals transmitted through a plurality of signal wirings can be realized.

  In the connection wiring member 55AK01 shown in FIG. 31, the signal wiring composed of the wiring patterns 55AK13 to 55AK16 is formed in the region 55AK1Z so as to have a meandering shape. On the other hand, in the region 55AK1Z, the plurality of signal wirings configured by the wiring patterns have a first shape of a linear shape or a substantially linear shape, and do not have a second shape such as a meander shape different from the first shape. May be formed. As described above, when a plurality of electric components are connected by a plurality of signal wirings, in the region 55AK1Z or the region 55AK10Z where the shape is changed by the connection wiring member 55AK01, a plurality of signal wirings configured by a wiring pattern are formed. It may be formed so as not to have two shapes. When the signal wiring of the second shape is provided at a position where the shape changes, the signal wiring may be affected by external electromagnetic noise or the signal wiring may affect other conductors by the electromagnetic noise. As a result, inconveniences such as electromagnetic interference may be caused. On the other hand, if the signal wiring of the second shape is not provided at the position where the shape changes, the occurrence of these inconveniences can be prevented or suppressed. In addition, if the signal wiring of the second shape is not provided at a position where the shape changes, it is possible to prevent or suppress the complicated adjustment of the characteristic impedance of each signal wiring.

  The wiring pattern constituting the plurality of signal wirings has the same wiring length in at least a part of the signal wiring in an internal circuit in a control board such as the main board 11 or the effect control board 12 or an electric device such as the image display device 5. Alternatively, they may be formed so as to be substantially the same. On the other hand, when the wiring pattern constituting the plurality of signal wirings is not adjusted by the wiring length of the signal wirings in the internal circuit of the control board or the electric device, and the connection means such as the connection wiring member 55AK01 is used, At least some of the signal wires may be formed to have the same or substantially the same wire length. If the wiring length of the signal wiring is not adjusted by the internal circuit of the control board or the electric equipment, the delay time difference of the signal transmitted by the multiple signal wiring is reduced by using the connecting means, and the transmission is performed by the multiple signal wiring. The reliability of the signal to be obtained can be improved. In addition, it is possible to easily and flexibly design a wiring pattern in a control board or an internal circuit of an electric device, and it is possible to suppress an increase in an area for arranging a wiring pattern in the control substrate or an internal circuit of the electric device. The size of the device can be reduced.

  The present invention is applicable not only to the pachinko gaming machine 1 but also to slot machines and the like. The slot machine is an arbitrary gaming machine that performs a predetermined game, for example, a variable display of a symbol serving as a plurality of types of identification information, and can provide a predetermined game value based on the game result, more specifically, A variable display device that allows a game to be started by setting a predetermined number of bets (the number of medals or the number of credits) for one game, and variably displays a plurality of types of identification information (symbols) each of which can be identified. One game is completed by displaying and displaying the display results of a plurality of reels, for example, and a prize is won according to the display result (for example, a prize of a cherry, a prize of a watermelon, a prize of a bell, a prize of a replay, a BB prize, a RB prize, etc.) Is a gaming machine that can be generated. In such a slot machine, the hardware resources including the game control microcomputer for performing the game control and the software for performing the predetermined processing cooperate with each other, so that the pachinko game described in the above embodiment is performed. What is necessary is just to be comprised so that it may have all or some of the features which the machine 1 has.

  In addition, the device configuration and various operations of the gaming machine can be arbitrarily changed and modified without departing from the spirit of the present invention. In addition, the gaming machine of the present invention is not limited to a payout-type gaming machine that pays out a predetermined number of game media as a prize based on the occurrence of a prize, but is not limited to a payout-type gaming machine that encloses a game medium and scores based on the occurrence of a prize. Can also be applied to an enclosed game machine. Slot machines are not limited to those in which the number of bets is set using medals and credits as gaming values, but only slot machines in which the number of bets are set using gaming balls as gaming values, or only credits as gaming values May be used to set a bet amount.

  The embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

(Explanation on problem solving means and effects)
As explained above, the gaming machine of the means 1 according to the present application is:
A gaming machine capable of playing a game (for example, a pachinko gaming machine 1),
A connection unit (for example, a connection wiring member 50SG01 or the like) capable of connecting a plurality of electric components (for example, the image display device 5 and the effect control board 12);
The connecting means has a bent portion (for example, a first bent portion 50SG81 or a second bent portion 50SG82) which is bent to switch the drawing direction of the connecting portion in a state where the connecting portion is connected to the plurality of electric components. And
A cutout portion (for example, first cutout recesses 50SG61A, 50SG61B, 50SG61A ', 50SG61B', and second cutout recesses 50SG62A, 50SG62B, 50SG62A ', 50SG62B') is provided at a position corresponding to the bent portion in the connection means (FIG. 41). , See FIG. 42)
It is characterized by:
According to this feature, the connection means is easily bent at the bent portion by the cutout portion, so that workability can be improved and the quality is stabilized.
More specifically, the first cutouts 50SG61A, 50SG61B, 50SG61A ', 50SG61B', and the second cutouts 50SG62A, 50SG62B, 50SG62A ', 50SG62B' serve as indices indicating positions where the first bent portion 50SG81 and the second bent portion 50SG82 are provided. In addition, the first cutout recess and the second cutout recess make the conductor portion easier to bend because the widthwise region of the conductor portion is reduced. In addition, by forming a notch portion instead of a hole portion such as a through hole, it is possible to preferably avoid affecting a signal.

The gaming machine according to the second aspect is the gaming machine according to the first aspect,
The cutouts (for example, the first cutouts 50SG61A, 50SG61B, 50SG61A ', 50SG61B', the second cutouts 50SG62A, 50SG62B, 50SG62A ', 50SG62B') are formed at the edges of the connection means (for example, the wiring pattern 50SG10). The outer edge 50SG50 and the outer edge 50SG51 of the wiring pattern 50SG2G are provided (see FIG. 42).
It is characterized by:
According to this feature, the notch can be provided so as not to affect the wiring.
More specifically, the position of the notch can be easily specified as compared with the case where the notch is provided at the edge of the wiring pattern 50SG11 to 50SG30 near the center in the width direction of the connection wiring member 50SG01.

The gaming machine of the means 3 is the gaming machine according to the means 1 or 2,
The notch,
A first notch (for example, first notch 50SG61A, 50SG61A ', a second notch) provided at a first edge (for example, outer edge 50SG50 of wiring pattern 50SG10) of the connection means (for example, connection wiring member 50SG01). Notched recesses 50SG62A, 50SG62A '),
A second notch (for example, the first notch) provided on a second edge (for example, the outer edge 50SG51 of the wiring pattern 50SG2G) opposite to the first edge of the connection means, corresponding to the first notch. Notch recesses 50SG61B, 50SG61B ', second notch recesses 50SG62B, 50SG62B'),
It is characterized by having.
According to this feature, since it is possible to bend in accordance with the first cutout and the second cutout, it is possible to bend accurately in the routing direction.
Specifically, since the connection wiring member 50SG01 can be creased using the notches on both sides in the width direction of the connection wiring member 50SG01 as an index, it is possible to bend in a more accurate direction.

The gaming machine of the means 4 is the gaming machine according to any one of the means 1 to 3,
The connection means (for example, the connection wiring member 50SG01) has a conductor portion (for example, a wiring pattern 50SG10, 50SG2G, a ground layer 50SG3G, etc.) different from the signal wiring,
The notch portions (for example, the first notch concave portions 50SG61A, 50SG61B, 50SG61A ', 50SG61B', and the second notch concave portions 50SG62A, 50SG62B, 50SG62A ', 50SG62B') are provided in the conductor portion (see FIG. 41).
It is characterized by:
According to this feature, the width of the conductor is reduced by the notch, so that the conductor is easily bent.
More specifically, since the wiring pattern 50SG10 and the wiring patterns 50SG1G and 50SG2G in which the cutouts are formed are power supplies and grounds having a wider dimension than the wiring patterns 50SG11 to 50SG30, which are signal wirings, the bottleneck due to the cutouts. It is not easily affected by such factors.

The gaming machine of the means 5 is the gaming machine according to any one of the means 1 to 4,
The connection means (for example, the connection wiring member 50SG01 or the like) is routed in the bent portion (for example, the second bent portion 50SG82) in a direction obliquely intersecting the edge of the connection means,
The cutout portions (for example, the second cutout recesses 50SG62A, 50SG62B, 50SG62A ', 50SG62B') are formed obliquely with respect to the edge (for example, the outer edge 50SG01E) of the connection means (see FIG. 42).
It is characterized by:
According to this feature, the notch is formed along the fold, so that it is easy to bend.
Specifically, as shown in FIGS. 42B and 42C, the sides 50SG65A and 50SG65B of the second notch 50SG62A and the sides 50SG65A and 50SG65B of the second notch 50SG62B incline in the direction along the XZ axis. As a result, the directions of the folds C3 and C4 can be easily identified visually. In addition, to form the notch obliquely with respect to the outer edge 50SG01E, all the sides do not have to be oblique if at least one of the plurality of sides forming the notch concavity is oblique. . Also, all sides may be oblique.

The gaming machine of the means 6 is the gaming machine according to any of the means 1 to 5,
The connection means (for example, the connection wiring member 50SG01 and the like) is routed in the bent portion (for example, the second bent portion 50SG82) in a direction obliquely intersecting the edge (for example, the outer edge 50SG01E) of the connection means. And
The notch,
A first notch (for example, a second notch 50SG62A, 50SG62A ') provided at a first edge (for example, an outer edge 50SG50 of the wiring pattern 50SG10) of the connection means;
A second notch (for example, provided at a position other than a position facing the first notch at a second edge (for example, an outer edge 50SG51 of the wiring pattern 50SG2G) opposite to the first edge of the connection means). Second notch recesses 50SG62B, 50SG62B '),
(See FIG. 42)
It is characterized by:
According to this feature, it is possible to prevent the wiring from being narrowed by the first cutout and the second cutout.
Further, by being provided at different positions of the edges, particularly the second notch recess 50SG62A ′ and the second notch recess 50SG62B ′, they are provided at opposing positions like the first notch recess 50SG61B and the first notch recess 50SG61A ′. It is less susceptible to bottlenecks and the like than in the case.

The gaming machine of the means 7 is the gaming machine according to any one of the means 1 to 6,
The cutouts (for example, the first cutouts 50SG61A, 50SG61B, 50SG61A ', 50SG61B', the second cutouts 50SG62A, 50SG62B, 50SG62A ', 50SG62B') pass through the connection means (for example, the connection wiring member 50SG01). It is provided so as to be bent at a position that does not correspond to a hole (for example, through-hole 50SG1H, 50SG2H, etc.) (see FIG. 42).
It is characterized by:
According to this feature, the conductor portion can be prevented from being narrowed by the cutout portion and the through hole.

(Explanation on the problem solving means and effects of the characteristic unit 30AK)
For example, as shown in FIG. 8, a game machine such as the pachinko gaming machine 1 which can play a game has a plurality of signal wiring patterns formed therein, and a plurality of electric wirings such as the RAM 102 and the CPU 103 are formed by the plurality of signal wirings. The board includes a substrate such as the main board 11 to which components are connected, and a pattern includes a parallel wiring portion having a first shape in which a plurality of signal wirings are parallel or substantially parallel, such as a region 30AK10R, and a plurality of signal wirings such as a region 30AK11R. At least one signal wiring among the wirings includes a specific wiring part having a second shape that is not parallel to other signal wirings, and a wiring length of each signal wiring included in the plurality of signal wirings is the same or substantially the same. Become. This makes it possible to provide an appropriate board configuration that reduces a difference in delay time between signals transmitted through a plurality of signal wirings.

  For example, a signal wiring that does not include the second shape, such as a signal wiring formed by the wiring pattern 30AK10D, has a distance between connection terminals in a plurality of electrical components that is equal to the second wiring, such as a signal wiring formed by the wiring patterns 30AK11D to 30AK13D. It may be longer than the signal wiring including the shape. This suppresses an increase in the area of the substrate on which the wiring pattern is arranged, and enables an appropriate substrate configuration to reduce the size of the substrate.

  For example, the conductor may not be provided in a predetermined area near the signal wiring having the second shape, such as the space area 30AK0SP. This makes it possible to provide an appropriate board configuration in which electromagnetic interference due to electromagnetic noise in a plurality of signal wirings is prevented or suppressed.

  The substrate is provided with through holes such as through holes 30AK1H and 30AK2H, which can electrically connect signal wiring provided on one surface of the substrate and signal wiring provided on the other surface of the substrate. May be the same or substantially the same, including the length of the through hole, for the signal wiring connected by the through hole. This makes it possible to provide an appropriate board configuration that reduces a difference in delay time between signals transmitted through a plurality of signal wirings.

  The substrate includes a plurality of layers such as a surface layer 30AK1S, a ground layer 30AK1L, a power supply layer 30AK2L, a wiring layer 30AK3L, a power supply layer 30AK4L, and a back surface layer 30AK2S, and a signal wiring having a second shape among the plurality of layers is provided. Signal transmission may not be performed in a conductor layer such as the ground layer 30AK1L adjacent to the layer. This makes it possible to provide an appropriate board configuration in which electromagnetic interference due to electromagnetic noise in a plurality of signal wirings is prevented or suppressed.

  As the plurality of electrical components, a processing unit such as the CPU 103 that can execute a predetermined process and a storage unit such as the RAM 102 that can store information related to the execution of the process may be connected. This makes it possible to provide an appropriate board configuration that reduces a delay time difference between signals transmitted through a plurality of signal wirings connected to the processing unit and the storage unit as a plurality of electric components.

  Alternatively, for example, a gaming machine such as the pachinko gaming machine 1 which can play a game, in which a pattern forming a plurality of signal wirings is formed and a plurality of signal wirings such as the RAM 102 and the CPU 103 are formed as shown in FIG. The substrate includes a substrate such as the main substrate 11 to which the electrical components are connected. The pattern includes a plurality of parallel wiring portions, such as a region 30AK10R, having a first shape in which a plurality of signal wirings are parallel or substantially parallel. And a specific wiring portion having a second shape different from the first shape, and the wiring length of each signal wiring included in the plurality of signal wirings may be the same or substantially the same. This makes it possible to provide an appropriate board configuration that reduces a difference in delay time between signals transmitted through a plurality of signal wirings.

  Alternatively, for example, a gaming machine such as the pachinko gaming machine 1 which can play a game, in which a pattern forming a plurality of signal wirings is formed and a plurality of signal wirings such as the RAM 102 and the CPU 103 are formed as shown in FIG. The first pattern includes at least one signal wiring of a plurality of signal wirings, such as a wiring pattern 30AK10D, including a linear shape or a substantially linear shape. And a second pattern in which other signal wirings not included in the first pattern among a plurality of signal wirings, such as wiring patterns 30AK11D to 30AK13D, have a second shape different from the first shape. Wherein the first pattern and the second pattern have the same or substantially the same wiring length of each signal wiring included in the plurality of signal wirings. It may be. This makes it possible to provide an appropriate board configuration that reduces a difference in delay time between signals transmitted through a plurality of signal wirings.

  Alternatively, for example, a gaming machine such as the pachinko gaming machine 1 which can play a game, in which a pattern forming a plurality of signal wirings is formed and a plurality of signal wirings such as the RAM 102 and the CPU 103 are formed as shown in FIG. A pattern such that at least one signal wiring among a plurality of signal wirings connects a predetermined section such as the section 30AK0SC at a shortest or substantially shortest distance. Wiring patterns 30AK12D, 30AK13D, etc., in which a first pattern such as the patterns 30AK10D and 30AK11D and other signal wirings not included in the first pattern among a plurality of signal wirings connect a predetermined section at a longer distance than the first pattern. And the second pattern is included in the plurality of signal wirings. The wiring length of the signal wiring may be made the same or substantially the same. This makes it possible to provide an appropriate board configuration that reduces a difference in delay time between signals transmitted through a plurality of signal wirings.

  The first pattern may have a longer distance between the connection terminals of the plurality of electric components than the second pattern. This suppresses an increase in the area of the substrate on which the wiring pattern is arranged, and enables an appropriate substrate configuration to reduce the size of the substrate.

  For example, a conductor may not be provided in a predetermined area close to the second pattern, such as the space area 30AK0SP. This makes it possible to provide an appropriate board configuration in which electromagnetic interference due to electromagnetic noise in a plurality of signal wirings is prevented or suppressed.

  The substrate includes a plurality of layers such as a surface layer 30AK1S, a ground layer 30AK1L, a power layer 30AK2L, a wiring layer 30AK3L, a power layer 30AK4L, and a back layer 30AK2S. The signal wiring included in the second pattern among the plurality of layers is provided. Signal transmission may not be performed in a conductor layer such as the ground layer 30AK1L adjacent to the layer to be formed. This makes it possible to provide an appropriate board configuration in which electromagnetic interference due to electromagnetic noise in a plurality of signal wirings is prevented or suppressed.

(Explanation on the means for solving the problem and the effect of the characteristic portion 42AK)
For example, as shown in FIG. 16A, a game machine such as the pachinko gaming machine 1 which can play a game has a plurality of signal wirings, for example, a first wiring pattern 42AK10 and a second wiring pattern. A first pattern and a second pattern, such as a pattern 42AK11, are formed, and a substrate such as a main substrate 11 to which a plurality of electrical components such as a RAM 102 and a CPU 103 are connected by a plurality of signal wirings is provided. The signal wiring constituted by one of the first and second patterns corresponds to a first shape portion such as the first shape portion 42AK10L, which has a straight or substantially straight first shape. The signal wiring constituted by the pattern described above has a second shape different from the first shape, such as the second shape portion 42AK11M. For example, the signal wiring composed of one pattern, such as the second shape part 42AK10M, corresponding to the first shape part in the signal wiring composed of the other pattern, such as the first shape part 42AK11L, includes the shape part. A second shape portion is included. This suppresses an increase in the area of the substrate on which the wiring pattern is arranged, and enables an appropriate substrate configuration to reduce the size of the substrate.

  The first pattern and the second pattern may be formed such that the wiring length of each signal wiring is the same or substantially the same. This makes it possible to provide an appropriate board configuration that reduces a difference in delay time between signals transmitted through a plurality of signal wirings.

  For example, as shown in FIG. 17, the second shape portion may be formed in a different direction between the signal wiring formed by the first pattern and the signal wiring formed by the second pattern. This makes it possible to easily and flexibly design the wiring pattern on the substrate surface, suppress an increase in the area of the substrate on which the wiring pattern is arranged, and reduce the size of the substrate.

  For example, as shown in FIG. 18, the second shape portion may be formed to have a different wiring width between the signal wiring formed by the first pattern and the signal wiring formed by the second pattern. This makes it possible to easily adjust the characteristic impedance of each signal wiring and perform appropriate transmission according to the type of electric signal and the like.

  For example, as shown in FIG. 19A, the second shape part is a parallel wiring part in which the signal wiring formed by the first pattern and the signal wiring formed by the second pattern are formed in parallel or substantially parallel. May be included. This makes it possible to easily and flexibly design the wiring pattern on the substrate surface, suppress an increase in the area of the substrate on which the wiring pattern is arranged, and reduce the size of the substrate.

  For example, as shown in FIG. 20A and FIG. 20B, the signal wiring formed by the first pattern or the second pattern is connected to the signal wiring formed by another pattern at the second shape portion. A circuit component such as the circuit component 42AK1R mounted as described above may be provided. This makes it possible to appropriately adjust the transmission characteristics and the like of the signal wiring, suppress an increase in the area of the substrate on which the wiring pattern is arranged, and reduce the size of the substrate.

  For example, as shown in FIG. 20A, the signal wiring formed by the first pattern or the second pattern is mounted so as to be connected to a wiring portion such as a first shape portion 42AK52L different from the second shape portion in the signal wiring. A circuit component such as the circuit component 42AK2R may be provided. This makes it possible to appropriately adjust the transmission characteristics and the like of the signal wiring, suppress an increase in the area of the substrate on which the wiring pattern is arranged, and reduce the size of the substrate.

(Explanation on problem solving means and effects of the characteristic part 43AK)
For example, as shown in FIG. 21, as a pattern constituting a plurality of signal wirings, for example, a first wiring pattern 43AK10 and a second wiring pattern 43AK11 as shown in FIG. And a substrate such as a main substrate 11 to which a plurality of electrical components such as a RAM 102 and a CPU 103 are connected by a plurality of signal wirings. One of the first pattern and the second pattern is provided. The signal wiring constituted by the pattern described above corresponds to the first shape portion having a straight or substantially straight first shape such as the first shape portions 43AK10L and 43AK11L, for example, and the other of the first pattern and the second pattern. The signal wiring constituted by the pattern has the first shape such as the second shape portion 43AK10M or 43AK11M. It includes a second profiles made different from the second shape, for example, test points 43AK10P, etc. 43AK11P, certain conductor portions for connection confirmation to the second shaped portion is provided. This makes it possible to appropriately arrange the wiring patterns, appropriately arrange various structures, suppress an increase in the substrate area, and reduce the size of the substrate.

  The specific conductor portion is formed using, for example, a metal material such as solder or copper foil. For example, as shown in FIG. 21, the wiring width W5 <diameter W6 shown in FIG. It may be formed to be wider than the wiring width. As a result, the electrical characteristics of the signal wiring can be easily inspected, the wiring patterns can be appropriately arranged, and various structures can be appropriately arranged, thereby suppressing an increase in the board area and miniaturizing the board. Can be achieved.

  The substrate includes a plurality of layers such as a surface layer 44AK1S, a ground layer 44AK1L, a power supply layer 44AK2L, a wiring layer 44AK3L, a power supply layer 44AK4L, and a back surface layer 44AK2S shown in FIG. 22, and the specific conductor portion is a specific one of the plurality of layers. It may be connected to a conductor layer different from the layer in which the conductor portion is provided, for example, by through holes such as through holes 44AK1H and 44AK2H. As a result, the electrical characteristics of the signal wiring and the conductor layer can be easily inspected, and the wiring pattern is appropriately arranged, and various structures are appropriately arranged, thereby suppressing an increase in the board area. Can be reduced in size.

(Explanation on the means for solving the problem and the effect of the characteristic unit 44AK)
For example, as shown in FIG. 21, as a pattern constituting a plurality of signal wirings, for example, a first wiring pattern 43AK10 and a second wiring pattern 43AK11 as shown in FIG. And a substrate such as a main substrate 11 to which a plurality of electrical components such as a RAM 102 and a CPU 103 are connected by a plurality of signal wirings. One of the first pattern and the second pattern is provided. The signal wiring constituted by the pattern described above corresponds to the first shape portion having a straight or substantially straight first shape such as the first shape portions 43AK10L and 43AK11L, for example, and the other of the first pattern and the second pattern. The signal wiring constituted by the pattern has the first shape such as the second shape portion 43AK10M or 43AK11M. A signal including a second shape portion having a different second shape and including a second shape portion such as a signal wiring constituted by, for example, wiring patterns 44AK10P and 44AK11P on one surface of the substrate such as a surface layer 44AK1S shown in FIG. Wiring is provided, and a specific conductor portion for connection confirmation, such as a test point 44AK11TP, is provided on the other surface of the substrate, for example, the back surface layer 44AK2S. As a result, the electrical characteristics of the signal wiring and the conductor layer can be easily inspected, and the wiring pattern is appropriately arranged, and various structures are appropriately arranged, thereby suppressing an increase in the board area. Can be reduced in size.

(Explanation on problem solving means and effects of the characteristic part 45AK)
As shown in FIG. 27, when viewed in a plan view, the rectangular electronic components 45AK60 are arranged such that the sides 45AK60a to 45AK60d are not parallel to the sides 45AK40a to 45AK40d of the rectangular heat sink. Thereby, the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced.

  The electronic component 45AK61 can be arranged by rotating the electronic component 45AK61 arranged so that each side is parallel to the sides 45AK40a to 45AK40d of the heat sink by a predetermined angle θ about the center point O. The predetermined angle θ is, for example, approximately 45 °. Thereby, the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced.

  The heat sink 45AK40 is arranged so that the fins 45AK42 arranged in parallel in the left-right direction face the up-down direction. Accordingly, air moving upward from below can be passed between the fins 45AK42 along the vertical direction, and the heat generated from the electronic component 45AK60 can be maintained without obstructing the flow of air moving upward. Can enhance the heat radiation effect.

  The heat conductive sheet 45AK70 interposed between the electronic component 45AK60 and the heat sink 45AK40 is a flexible heat conductive sheet having both surfaces adhered. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transmitted to the heat sink 45AK40 via the heat conductive sheet 45AK70, and the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced.

  The rear case 45AK30 is provided with a supporting portion 45AK35 for pressing the heat sink 45AK40 against the heat-producing electronic component 45AK60. Thereby, the heat generated from the electronic component 45AK60 can be smoothly transmitted to the heat sink 45AK40 via the heat conductive sheet 45AK70, and the heat radiation effect of the heat generated from the electronic component 45AK60 can be enhanced.

(Explanation on the means for solving the problem and the effect of the characteristic portion 55AK)
For example, as shown in FIG. 31, for example, as shown in FIG. 31, a wiring pattern 55AK10 to 55AK22 or the like is formed as a pattern configuring a plurality of signal wirings, For example, a connection wiring member 55AK01 is provided as a connection means capable of connecting the effect control board 12 and a plurality of electric components such as the image display device 5 by wiring, and the pattern is formed by, for example, a plurality of signal wirings in a region 55AK10Z shown in FIG. While at least one of the signal wirings has a straight or substantially straight first shape, the other signal wiring includes a specific shape portion having a second shape different from the first shape, and is included in the plurality of signal wirings. At least some of the signal wires have the same or substantially the same wire length. Accordingly, an appropriate wiring configuration that reduces the delay time difference between signals transmitted through a plurality of signal wirings can be realized. Further, the wiring length can be made the same or substantially the same in a narrow range by using the connecting means, the increase in the area for arranging the wiring patterns is suppressed, and an appropriate wiring configuration for miniaturizing the substrate and the device is provided. Becomes possible.

  The connection means may have an L-shape or a substantially L-shape, for example, like a connection wiring member 55AK01 shown in FIG. As a result, the wiring length can be made the same or substantially the same in a narrow range, an increase in the area for arranging the wiring patterns is suppressed, and an appropriate wiring configuration for miniaturizing the substrate and the device becomes possible. .

  A bent portion such as a region 55AK2Z shown in FIG. 31 may be provided in the connection means. As a result, the wiring length can be made the same or substantially the same in a narrow range, an increase in the area for arranging the wiring patterns is suppressed, and an appropriate wiring configuration for miniaturizing the substrate and the device becomes possible. .

  For example, the pattern may be formed on both surfaces of the connection means, such as the wiring patterns 55AK11, 55AK12, 55AK31, and 55AK32 shown in FIG. As a result, the wiring length can be made the same or substantially the same in a narrow range, an increase in the area for arranging the wiring patterns is suppressed, and an appropriate wiring configuration for miniaturizing the substrate and the device becomes possible. .

  The connection means includes a flexible first member such as a base of the connection wiring member 55AK01, and a non-flexible second member such as the reinforcing member 55AK02. For example, a circuit component 55AK1R or the like may be provided as a circuit component mounted so as to be connected thereto. As a result, it is possible to provide an appropriate wiring configuration in which dropout of circuit components and disconnection of signal wiring do not easily occur.

  The connection means includes, for example, a signal wiring provided on one surface of the connection means, such as a signal wiring constituted by wiring patterns 55AK11 and 55AK12 provided on the surface layer 55AK1S shown in FIG. A signal wiring provided on the other surface of the connection means, such as a signal wiring composed of wiring patterns 55AK31 and 55AK32 provided on the 55AK2S, as a through portion that can be electrically connected, for example, through holes 55AK1H and 55AK2H. When a plurality of electrical components are connected by a plurality of signal wirings, a penetrating portion is provided in a deformed portion whose shape is changed by the connecting means, for example, in a region 55AK1Z shown in FIG. It does not have to be. As a result, an appropriate wiring configuration in which the strength of the connecting means is not reduced and the disconnection of the signal wiring is less likely to occur.

(Explanation on the means for solving the problem and the effect of the characteristic portion 56AK)
For example, as shown in FIG. 31, a connection wiring member in which a plurality of signal wirings are formed as wiring patterns 55AK10 to 55AK22, for example, as shown in FIG. 55AK01 and a plurality of electrical components, a plurality of conductors connected to a plurality of signal wires are provided at a first pitch such as a first pitch W10, for example, at a first component at a second pitch, A second component, such as W11, provided at a second pitch different from the first pitch, and the pattern includes one end where a plurality of signal wirings are connected to the first component, as shown in FIGS. 37 and 38, for example. In the above, a plurality of signal wires are formed at intervals corresponding to the first pitch, and at the other end where the plurality of signal wires are connected to the second component, the plurality of signal wires are formed at the second pitch. The wiring lengths of the signal wirings included in the plurality of signal wirings are the same or substantially the same, and the first component and the second component are connected to a plurality of signal ports such as the connector ports 56AK01 and 56AK02. It is a wiring connection component that allows signal wiring to be detachably connected. Accordingly, an appropriate wiring configuration that reduces the delay time difference between signals transmitted through a plurality of signal wirings can be realized. Further, the wiring length can be made the same or substantially the same in a narrow range by using the connecting means, the increase in the area for arranging the wiring patterns is suppressed, and an appropriate wiring configuration for miniaturizing the substrate and the device is provided. Becomes possible.

  Alternatively, the first component and the second component are electronic components mounted on a predetermined member, such as the electronic components 56AK1IC and 56AK2IC. Accordingly, an appropriate wiring configuration that reduces the delay time difference between signals transmitted through a plurality of signal wirings can be realized. Further, the wiring length can be made the same or substantially the same in a narrow range by using the connecting means, the increase in the area for arranging the wiring patterns is suppressed, and an appropriate wiring configuration for miniaturizing the substrate and the device is provided. Becomes possible.

  Alternatively, one of the first component and the second component is a wiring connection component capable of detachably connecting a plurality of signal wires, such as the connector ports 56AK01 and 56AK02, and the other of the first component and the second component is , Electronic components 56AK1IC, 56AK2IC, etc., mounted on predetermined members. Accordingly, an appropriate wiring configuration that reduces the delay time difference between signals transmitted through a plurality of signal wirings can be realized. Further, the wiring length can be made the same or substantially the same in a narrow range by using the connecting means, the increase in the area for arranging the wiring patterns is suppressed, and an appropriate wiring configuration for miniaturizing the substrate and the device is provided. Becomes possible.

50SG01 Connection wiring member 50SG10 to 50SG30 Pattern 50SG1L Wiring layer 50SG1S Insulation layer 50SG2S Insulation layer 50SG3G Ground layer 50SG61A, 50SG61B First cutout recess 50SG62A, 50SG62B Second cutout recess 50SG81 First bent portion 50SG82 Second bent portion

Claims (1)

A gaming machine that can play games,
Comprising a connection means capable of connecting a plurality of electric components,
The connection unit has a bent portion in a bent state to switch a routing direction of the connection unit in a state where the connection unit is connected to the plurality of electric components,
A gaming machine comprising a notch at a position corresponding to the bent portion in the connection means.

Images