JP2020021914A - Sheet attaching device and sheet attaching method - Google Patents

Abstract

To provide a sheet attaching device and a sheet attaching method that can prevent an increase in the size of the device.SOLUTION: A sheet attaching device includes supporting means 10 for supporting an adherend WF in which a first adhesive sheet AS1 is attached to one surface WF1, supply means 20 for supplying a second adhesive sheet AS2, and attachment means 30 for attaching the second adhesive sheet AS2 supplied by the supply means 20 to the other surface WF2 of the adherend WF supported by the support means 10, and to the first adhesive sheet AS1, expandable particles SG that expand when a predetermined energy is applied thereto and reduce the adhesive force of the first adhesive sheet AS1 are added, the supporting means 10 includes energy application means 14 for applying energy to the first adhesive sheet AS1.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a sheet sticking apparatus and a sheet sticking method.

  2. Description of the Related Art Conventionally, a second adhesive sheet is attached to the other surface of an adherend having a first adhesive sheet attached to one surface, and the first adhesive sheet is applied with a predetermined energy to reduce the adhesive force of the first adhesive sheet. 2. Description of the Related Art A sheet sticking device for peeling an adhesive sheet is known (for example, see Patent Document 1).

JP 2000-068293 A

  However, in the conventional wafer transfer device (sheet sticking device) described in Patent Literature 1, the ultraviolet irradiation unit 300 (energy applying means) that applies ultraviolet light (energy) to the protective tape P (first adhesive sheet) is used alone. Due to the presence, there arises a disadvantage that the apparatus becomes large.

  An object of the present invention is to provide a sheet sticking apparatus and a sheet sticking method that can prevent an increase in the size of the apparatus.

  The present invention has adopted the configuration described in the claims.

According to the present invention, since the supporting means includes the energy applying means, the energy applying means does not exist alone, and it is possible to prevent the apparatus from being enlarged.
Further, if the attaching means is configured to attach the second adhesive sheet to the adherend and the frame member, the adherend can be integrated with the frame member.
Furthermore, if a sheet peeling means is provided, the first adhesive sheet can be peeled from the adherend when the first adhesive sheet becomes unnecessary.

(A)-(C) is explanatory drawing of the sheet sticking apparatus which concerns on embodiment of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other. The X axis and the Y axis are axes within a predetermined plane, and the Z axis is an axis orthogonal to the predetermined plane. I do. Furthermore, in the present embodiment, when the direction is indicated without designating the figure, “up” is “down” in the Z-axis arrow direction, based on the case of viewing from the Y-axis direction shown in FIG. 1 is the opposite direction, "left" is the direction of the arrow on the X axis, "right" is the opposite direction, "front" is the front direction in FIG. 1 parallel to the Y axis, and "rear" is the opposite direction.

The sheet sticking apparatus EA of the present invention includes a support unit 10 that supports a semiconductor wafer (hereinafter, also simply referred to as a “wafer”) WF as an adherend having the first adhesive sheet AS1 attached to one surface WF1, (2) Supply means 20 for supplying the adhesive sheet AS2, attaching means 30 for attaching the second adhesive sheet AS2 supplied by the supply means 20 to the other surface WF2 of the wafer WF supported by the supporting means 10, and And a sheet peeling means 40 for peeling off the one adhesive sheet AS1.
The first adhesive sheet AS1 includes a base sheet BS1 and an adhesive layer AL1, and expands by applying heat as a predetermined energy only to the adhesive layer AL1, thereby expanding the first adhesive sheet AS1. The second adhesive sheet AS2 is composed of a base sheet BS2 and an adhesive layer AL2.

  The supporting means 10 includes an outer table 11 having an upper surface serving as a holding surface 11A, a linear motor 12 as a driving device supported in a concave portion 11B formed in the outer table 11, and an output shaft 12A supported by an output shaft 12A. , An inner table 13 having a holding surface 13A, a heating unit 14 built in the inner table 13 and serving as an energy applying unit for applying heat to the first adhesive sheet AS1, and applying an attraction force to the holding surfaces 11A and 13A. A decompression unit (holding unit) (not shown) such as a decompression pump and a vacuum ejector is provided. A notch 11C into which the chuck arm 41E enters is formed at the rear edge of the outer table 11. The outer table 11 is provided outside the wafer WF so as to support a ring frame RF as a frame member.

  The supply means 20 includes a support roller 21 that supports the raw RS with the second adhesive sheet AS2 temporarily attached to one surface of the strip-shaped release sheet RL, a guide roller 22 that guides the raw RS, and a release edge 23A. The release sheet 23 is bent by bending the release sheet RL to release the second adhesive sheet AS2 from the release sheet RL, and the pinch roller 24B is supported by an output shaft (not shown) of a rotary motor 24A as a driving device. And a collection roller 25 as collection means for always applying a predetermined tension to the separation sheet RL existing between the drive roller 24 and the pinch roller 24B to collect the separation sheet RL. I have.

  The sticking means 30 includes a linear motor 31 as a driving device for supporting the outer table 11 with the slider 31A, a pressing roller 32 as a pressing means for pressing the second adhesive sheet AS2 onto the wafer WF and the ring frame RF and sticking the same. To form an integrated product WK in which the wafer WF and the ring frame RF are integrated via the second adhesive sheet AS2.

The sheet peeling means 40 includes a wafer reversing unit 41 for vertically reversing the wafer WF, and a sheet peeling unit 42 for peeling the first adhesive sheet AS1 from the wafer WF.
The wafer reversing unit 41 includes a rotary motor 41C as a driving device supported by a slider 41B of a linear motor 41A as a driving device, and a chuck arm 41E supported by an output shaft 41D and gripping an integrated object WK. A check motor 41F is provided as a device (holding means).
The sheet peeling section 42 is rotated by a support roller 42A that supports a strip-shaped peeling tape PT as a holding unit, a guide roller 42B that guides the peeling tape PT, and an output shaft 42D of a linear motor 42C that is a driving device. Between the peeling roller 42E, which is supported so as to be able to rotate, and a driving roller 42H, which is supported by an output shaft (not shown) of a rotary motor 42F as a driving device and sandwiches the peeling tape PT with the pinch roller 42G, and the pinch roller 42G. A recovery roller 42J is provided as recovery means for recovering the existing peeling tape PT by always applying a predetermined tension to the existing peeling tape PT.

The operation of the above-mentioned sheet sticking apparatus EA will be described.
First, a user of the sheet sticking apparatus EA (hereinafter, simply referred to as a “user”) receives the raw sheet RS and the peeling sheet for the sheet sticking apparatus EA in which each member is waiting at an initial position shown by a solid line in FIG. After the tape PT is set as shown in the figure, an automatic operation start signal is input via an operation unit (not shown) such as an operation panel or a personal computer. Then, the supply means 20 drives the rotation motor 24A to feed out the raw material RS, and the leading end of the leading second adhesive sheet AS2 in the feeding direction is separated from the release sheet RL by the release edge 23A of the release plate 23 for a predetermined length. Then, the driving of the rotation motor 24A is stopped.

  Next, as shown in FIG. 1 (A), the user or a transporting device (not shown) such as a driving device or a conveyor places the ring frame RF on the holding surface 11A and places the first adhesive sheet AS1 on the lower side. When the wafer WF is placed on the holding surface 13A, the support means 10 drives a pressure reducing means (not shown) to start suction holding of the wafer WF and the ring frame RF on the holding surfaces 11A and 13A. After that, the support means 10 drives the linear motor 12 so that the other surface WF2 of the wafer WF is positioned on the same plane as the upper surface of the ring frame RF as shown in the figure denoted by reference numeral AA in FIG. After the inner table 13 is raised to a height that is appropriate, the sticking means 30 drives the linear motor 31 to move the slider 31A to the left. Next, when the ring frame RF reaches a predetermined position with respect to the supply means 20, the supply means 20 drives the rotation motor 24A, and feeds out the raw material RS in accordance with the moving speed of the slider 31A. Thereby, the second adhesive sheet AS2 is peeled off from the release sheet RL, and the second adhesive sheet AS2 peeled off from the release sheet RL is pressed by the pressing roller 32 as shown by a two-dot chain line in FIG. The upper surface of the frame RF and the other surface WF2 of the wafer WF are pressed and adhered to each other to form an integral body WK. Then, when the leading end of the next second adhesive sheet AS2 in the feeding direction is peeled off from the peeling sheet RL by the peeling edge 23A of the peeling plate 23 for a predetermined length, the supply means 20 stops driving the rotary motor 24A.

  Next, when the notch 11C reaches the front of the chuck arm 41E due to the leftward movement of the slider 31A, the sticking means 30 stops driving the linear motor 31. Thereafter, the sheet peeling means 40 drives the check motor 41F, and as shown by the two-dot chain line in FIG. 1 (B), holds the integrated object WK by the chuck arm 41E, and then the supporting means 10 drives the pressure reducing means (not shown). Is stopped, and the suction holding of the integrated object WK on the holding surfaces 11A and 13A is released. Next, the sheet peeling means 40 drives the linear motor 41A and the rotation motor 41C, and lifts the integrated object WK held by the chuck arm 41E to a predetermined height as shown by a two-dot chain line in FIG. After that, the integrated object WK is turned upside down. Then, after the supporting means 10 drives the linear motion motor 12 and returns the inner table 13 to the initial position, the sheet peeling means 40 drives the linear motor 41A, and the second adhesive sheet AS2 is placed on the lower side with the integrated body. The WK is placed on the holding surfaces 11A and 13A. Next, when the supporting means 10 drives the pressure reducing means (not shown) to start the suction holding of the integrated object WK on the holding surfaces 11A and 13A, the sheet peeling means 40 drives the check motor 41F to move the chuck arm 41E to the initial position. Let it return.

  Thereafter, the sticking means 30 drives the linear motor 31 to move the slider 31A to the left, and the left end of the first adhesive sheet AS1 in the integrated object WK is peeled off as shown by the two-dot chain line in FIG. When it reaches just below the lowermost end of the roller 42E, the sticking means 30 stops driving the linear motor 31. Next, the sheet peeling means 40 drives the linear motion motor 42C, lowers the peeling roller 42E, and affixes the peeling tape PT to the left end portion of the first adhesive sheet AS1, and the affixing means 30 and the sheet peeling means 40 move linearly. The motor 31 and the rotation motor 42F are driven, and as shown in FIG. 3C, the peeling tape PT is sent toward the collection roller 42J in accordance with the moving speed of moving the slider 31A to the left. As a result, when the first adhesive sheet AS1 is peeled off from the wafer WF and an integrated body WK from which the first adhesive sheet AS1 has been removed (hereinafter, simply referred to as an “unified sheet-free integrated body WK”) is formed, After the peeling means 40 drives the linear motor 42C to return the peeling roller 42E to the initial position, the driving of the rotating motor 42F is stopped. Then, when the integrated article WK from which the unnecessary sheet has been removed reaches a predetermined position to the left of the sheet peeling means 40, the attaching means 30 and the supporting means 10 stop driving the linear motor 31 and the pressure reducing means (not shown), and Is stopped, and the suction holding of the integrated material WK from which the unnecessary sheet has been removed on the holding surfaces 11A and 13A is released. Next, when the user or the conveying means (not shown) conveys the integrated sheet WK from which the unnecessary sheet has been removed to the next process, the sticking means 30 drives the linear motor 31 to return the slider 31A to the initial position. Repeated.

  In the case of the present embodiment, when the wafer WF is placed on the holding surface 13A, the sheet pasting device EA drives the heating unit 14 to drive the first adhesive sheet adhered to the wafer WF. Heat is applied to AS1. Then, as shown in FIG. 1 (A), the expandable particles SG added to the adhesive layer AL1 of the first adhesive sheet AS1 expand and the countless protrusions on the adhesive layer AL1. A portion CV is formed. When the innumerable convex portions CV are formed on the adhesive layer AL1, the area of adhesion of the adhesive layer AL1 to the wafer WF decreases, the adhesive force of the first adhesive sheet AS1 to the wafer WF decreases, and the first adhesive The sheet AS1 can be easily separated from the wafer WF.

  According to the sheet sticking apparatus EA as described above, since the supporting means 10 includes the heating means 14, the heating means 14 does not exist alone, and it is possible to prevent the apparatus from being enlarged.

  The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions or steps described for the means and steps, much less the constituents of only one embodiment shown in the above embodiment and There is no limitation to the process at all. For example, the supply means is not limited as long as it can supply the second adhesive sheet, in light of the common general technical knowledge at the beginning of the application, and is not limited as long as it is within the technical scope (other means and steps). The same).

The support means 10 moves the outer table 11 up and down without moving the inner table 13 up and down, or moves up and down both the inner table 13 and the outer table 11 so that the upper surface of the wafer WF is the same as the upper surface of the ring frame RF. The inner table 13 and the outer table 11 may be configured so as not to be moved up and down, may not be divided into the inner table 13 and the outer table 11, and may be configured to be located in a plane. The structure which does not support a member may be sufficient, and the holding means may not be provided.
The timing at which the supporting unit 10 drives the heating unit 14 may be, for example, after the wafer WF is placed on the holding surface 13A, or the second bonding sheet AS2 may be attached to the other surface WF2 of the wafer WF by the attaching unit 30. The timing may be after the attachment, before the wafer WF is placed on the holding surface 13A, or at any timing before the first adhesive sheet AS1 is peeled from the wafer WF by the sheet peeling means 40.
The support means 10 may employ a coil heater, a heating side of a heat pipe, or the like as the heating means 14, or, if a light emitting source that emits light is employed as the energy applying means, the issuing source may be, for example, Any of an LED (Light Emitting Diode) lamp, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, a xenon lamp, a halogen lamp, and the like, or a combination thereof may be used.

  The supply means 20 is configured such that a predetermined cut-off area is formed by forming a notch in a closed loop shape or a short width direction entirely in a strip-shaped adhesive sheet base material temporarily attached to the release sheet RL. (2) The raw sheet RS formed as the adhesive sheet AS2 may be fed out, or the raw sheet RS in which a strip-shaped adhesive sheet base material is temporarily attached to the release sheet RL is used, and the adhesive sheet base material has a closed loop shape or a short width. A notch in the entire direction is formed by a cutting means, and a predetermined area partitioned by the notch may be used as the second adhesive sheet AS2, or a plate-like sheet may be used instead of the rollers such as the support roller 21 and the guide roller 22. The raw material RS or the release sheet RL may be supported or guided by a member or a shaft member, or may be supported, for example, by fanfold folding without winding the raw material RS. Is analogous without winding The release sheet RL may be collected by fanfold folding, may be cut and collected by a shredder or the like, or may be simply collected and collected without winding or fanfold folding. .

  The attaching unit 30 may attach the second adhesive sheet AS2 to the other surface WF2 of the wafer WF by moving the pressing roller 32 without moving the supporting unit 10 or while moving the supporting unit 10. A configuration in which the supplied second adhesive sheet AS2 is held by a holding member from the side opposite to the adhesive surface and a driving device as a pressing unit for attaching the held second adhesive sheet AS2 to the other surface WF2 of the wafer WF may be provided. Alternatively, the second adhesive sheet AS2 may be stuck on the other surface WF2 of the wafer WF by being placed upside down or arranged sideways, or a pressing operation for separating the pressing roller 32 from the wafer WF. A driving device as a member contacting / separating means may be employed to prevent the wafer WF from being stressed or damaged. 10 of moving at least one, if sticking the second adhesive sheet AS2 to the other surface WF2 of the wafer WF, or only the pressing roller 32.

The sheet peeling means 40 may be configured to hold at least one of the ring frame RF, the first adhesive sheet AS1, the wafer WF, and the second adhesive sheet AS2 attached to the wafer WF in the integrated object WK. The outer table 11 or the inner table 13 may be moved without moving the object WP, and the integrated object WK may be turned upside down. Alternatively, the second adhesive sheet may be attached to the other surface WF2 of the wafer WF by the attaching means 30. Before attaching AS2, the first adhesive sheet AS1 may be peeled off from the wafer WF, or may be configured to be supported by the support means 10.
The sheet peeling unit 40 may not have the wafer reversing unit 41 as long as the first adhesive sheet AS1 can be peeled from the wafer WF without turning the wafer WF upside down.
The sheet peeling means 40 may affix the peeling tape PT to the left end of the first adhesive sheet AS1 without stopping the movement of the slider 31A, or may have a configuration in which the peeling roller 42E does not move up and down, and may be driven. The first adhesive sheet AS1 is held by a holding member supported by an output shaft of a linear motion motor as a device and capable of being suction-held by a decompression means such as a decompression pump or a vacuum ejector, and the first adhesive sheet held by the holding member The configuration may be such that the AS1 is separated from the wafer WF and peeled off, or it may be configured to be supported by the support means 10, or a single-piece peeling tape PT may be attached to the first adhesive sheet AS1 and The first adhesive sheet AS1 may be peeled off from the wafer WF by applying tension to the peeling tape PT, or may be moved without moving the wafer WF. Meanwhile, the first adhesive sheet AS1 may be configured to move and peel off the first adhesive sheet AS1 from the wafer WF. For example, electromagnetic waves such as infrared rays, ultraviolet rays, visible rays, sound waves, X-rays or gamma rays, and hot water or hot air may be used. The one in which the adhesive force of the adhesive layer AL1 is reduced by the force reducing energy may be employed. In this case, an adhesive force reducing energy applying unit that irradiates the adhesive force reducing energy is adopted, and the first adhesive sheet AS1 is irradiated with the adhesive force reducing energy before the first adhesive sheet AS1 is peeled from the wafer WF. do it.
The sheet peeling means 40 may not be provided in the sheet sticking apparatus EA of the present invention.

As the first adhesive sheet AS1, heat such as hot water or hot air, a cooling medium such as a cooled gas or liquid, electromagnetic waves of any wavelength such as ultraviolet rays, visible rays, sound waves, X-rays or gamma rays, vibrations, chemicals, chemical substances, etc. May be used as a predetermined energy, and expanded energy is applied to the first adhesive sheet AS1 to expand the particles, and expandable particles SG that reduce the adhesive force of the first adhesive sheet AS1 may be used. The means considers the characteristics, characteristics, properties, materials, compositions, configurations, and the like of the expandable particles SG, and imparts heat, a cooling medium, electromagnetic waves of any wavelength, vibrations, chemicals, chemical substances, and the like to the expandable particles SG. May be of any configuration as long as it can expand the adhesive force of the first adhesive sheet AS1.
The first adhesive sheet AS1 may be one in which the expandable particles SG are added only to the base sheet BS1 constituting the first adhesive sheet AS1, or the adhesive layer AL1 and the base sheet BS1 may be used. May be employed in which the expandable particles SG are added to both of them, or one or a plurality of intermediate layers are present between the adhesive layer AL1 and the base sheet BS1, and the intermediate layer, the adhesive At least one or at least two of the layer AL1 and the base sheet BS1 to which the expandable particles SG are added may be employed, or may be affixed to the surface of the wafer WF on which the circuit is formed. Good, may be affixed to a surface where a circuit is not formed, or may be a case where expandable particles SG are added to both the adhesive layer AL1 and the base sheet BS1, an intermediate layer, an adhesive layer AL1 If at least two to expandable particles SG of the base sheet BS1 is added and they expandable particles SG may be identical ones or may be ones not identical.
In the wafer WF, a predetermined circuit may be formed on at least one of the one surface WF1 and the other surface WF2, or a circuit may not be formed on both of them. Another adhesive sheet may be attached, and when the other adhesive sheet is previously attached to the other surface WF2, the second adhesive sheet AS2 is attached to the wafer WF via the other adhesive sheet. Alternatively, a known sheet peeling means for appropriately peeling off such another adhesive sheet may be employed.
The frame member may be annular or non-annular, and may not be used in the sheet sticking apparatus EA of the present invention. When the frame member is not used, the sticking means 30 is attached to the second adhesive sheet AS2. May be attached only to the wafer WF.

  Examples of the expandable particles SG include, for example, fine particles in which a substance that easily gasifies and expands by heating, such as isobutane, propane, and pentane, is contained in an elastic shell. Japanese Patent Application No. 2017-73236, -159743, JP-A-2012-167151, JP-A-2001-123002 and the like, and heat-expandable fine particles disclosed in JP-A-2013-47321, JP-A-2007-254580, JP-A-2011-212528, JP-A-2003-261842 and the like. It is not limited at all, such as the expandable particles disclosed in, for example, by pyrolysis, water, carbon dioxide, adopting a foaming agent that produces a similar effect to the expandable particles by generating nitrogen Or azotization which generates gas by ultraviolet rays disclosed in JP-A-2006-53115 and JP-A-7-278333. May be one that expands the shell in a gas generator such as an object, for example, it may be a rubber or resin that expands by heating, other, baking soda, sodium bicarbonate, or a baking powder or the like.

  The materials, types, shapes, and the like of the first and second adhesive sheets AS1, AS2 and the adherend in the present invention are not particularly limited. For example, the first and second adhesive sheets AS1 and AS2 and the adherend may be circular, elliptical, polygonal such as triangular or square, or other shapes, or may be the first and second adhesive sheets AS1 and AS2. The AS2 may be in an adhesive form such as pressure-sensitive adhesiveness or heat-sensitive adhesiveness. When the heat-sensitive adhesive first and second adhesive sheets AS1 and AS2 are employed, the first and second adhesive sheets are used. What is necessary is just to adhere | attach by an appropriate method, such as providing an appropriate coil heater for heating the adhesive sheets AS1 and AS2 or a heating means such as a heating side of a heat pipe. Further, such first and second adhesive sheets AS1 and AS2 are, for example, those having a single layer of only the adhesive layers AL1 and AL2, and intermediate between the base sheets BS1 and BS2 and the adhesive layers AL1 and AL2. So-called double-sided bonding that can peel the base sheets BS1, BS2 from the adhesive layers AL1, AL2, such as those having a layer, those having a cover layer on the upper surface of the base sheets BS1, BS2, and the like. The double-sided adhesive sheet may be a sheet or the like, and the double-sided adhesive sheet may have a single-layer or multiple-layer intermediate layer, or may have a single-layer or multiple-layer without an intermediate layer. Examples of the adherend include food, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit boards, information recording substrates such as optical discs, glass plates, steel plates, pottery, wood plates, and resin alone. It may be an object, a composite formed of two or more of them, and a member or an article of any form can be targeted. In addition, the first and second adhesive sheets AS1 and AS2 may be replaced with functional and intended reading methods, for example, a label for information writing, a label for decoration, a protective sheet, a dicing tape, a die attach film, a die bonding tape, and recording. Any sheet such as a layer-forming resin sheet, a film, a tape, or the like may be used.

Driving devices in the embodiment include electric devices such as a rotary motor, a linear motion motor, a linear motor, a single-axis robot, a multi-joint robot having two or three or more joints, an air cylinder, a hydraulic cylinder, and a rodless. Actuators, such as cylinders and rotary cylinders, can be employed, and those obtained by directly or indirectly combining them can be employed.
In the embodiment, when a rotating member such as a roller is employed, a driving device for rotating the rotating member may be provided, or the surface of the rotating member or the rotating member itself may be deformable such as rubber or resin. It may be constituted by a member, may be constituted by a member that does not deform the surface of the rotating member or the rotating member itself, or adopts another member such as a shaft or a blade that rotates or does not rotate instead of a roller Alternatively, when a member that presses a pressed object such as a pressing member or a pressing member such as a pressing roller or a pressing head is used, instead of or in combination with the above-described examples, a roller, a round bar, or a blade A member such as a material, rubber, resin, sponge, or the like may be employed, or a configuration in which the member is pressed by blowing a gas such as air or gas may be employed, or a deformable portion such as rubber or resin may be used as the member to be pressed. May be constituted by a member that does not deform, or may be constituted by a member that separates an object to be peeled, such as a peeling means such as a peeling plate or a peeling roller, or a peeling member, as exemplified above. A member such as a plate-like member, a round bar, a roller, or the like may be employed instead of or in combination with the member, or a member to be peeled may be formed of a deformable member such as rubber or resin. When a member that supports or holds a supported member such as a supporting (holding) means or a supporting (holding) member is employed, a holding means such as a mechanical chuck or a chuck cylinder, or a coulomb may be used. A configuration in which the supported member is supported (held) by force, an adhesive (adhesive sheet, adhesive tape), an adhesive (adhesive sheet, adhesive tape), a magnetic force, Bernoulli suction, suction suction, a driving device, or the like may be employed. Cutting means and cutting parts When cutting a member to be cut or the like, or a member that forms a cut or a cutting line in the member to be cut is adopted, instead of or in combination with those exemplified above, a cutter blade, a laser cutter, an ion beam It is possible to adopt a tool that cuts by thermal power, heat, water pressure, heating wire, spraying of gas or liquid, etc., or to move and cut a tool that is cut with a combination of appropriate driving devices. Is also good.

EA: sheet sticking device 10: supporting means 14: heating means (energy applying means)
Reference Signs List 20 feeding means 30 sticking means 40 sheet peeling means AS1 first adhesive sheet AS2 second adhesive sheet RF ring frame (frame member)
SG: expandable particles WF: semiconductor wafer (adherend)
WF1 ... One side WF2 ... The other side

Claims (4)

Support means for supporting the adherend having the first adhesive sheet attached to one surface,
Supply means for supplying a second adhesive sheet;
Affixing means for affixing the second adhesive sheet supplied by the supply means to the other surface of the adherend supported by the support means,
The first adhesive sheet expands when given energy is applied, and expandable particles that reduce the adhesive force of the first adhesive sheet are added,
The sheet sticking apparatus, wherein the supporting means includes an energy applying means for applying the energy to the first adhesive sheet. The support means supports a frame member outside the adherend,
The sheet sticking apparatus according to claim 1, wherein the sticking unit sticks the second adhesive sheet to the adherend and the frame member.   3. The sheet sticking apparatus according to claim 1, further comprising a sheet peeling unit that peels the first adhesive sheet from the adherend. 4. A supporting step of supporting the adherend to which the first adhesive sheet is attached on one surface by a supporting means,
A supply step of supplying a second adhesive sheet,
Performing an attaching step of attaching the second adhesive sheet supplied in the supplying step to the other surface of the adherend supported by the support means,
The first adhesive sheet expands when given energy is applied, and expandable particles that reduce the adhesive force of the first adhesive sheet are added,
In the supporting step, an energy applying step of applying the energy to the first adhesive sheet by the supporting means is performed.