JP7190271B2 - Sheet sticking device and sheet sticking method - Google Patents

Description

The present invention relates to a sheet sticking device and a sheet sticking method.

Conventionally, there has been known a sheet sticking device that sticks a second adhesive sheet to the second surface of an adherend having a first adhesive sheet stuck to the first surface (see, for example, Patent Document 1).

JP 2012-222308 A

However, in the conventional transfer device (sheet sticking device) described in Patent Document 1, through the first adhesive sheet S1 (first adhesive sheet) supported by the first sheet supporting means 3 (first supporting means), Since the wafer W (adherend) is pressed against the second adhesive sheet S2 (second adhesive sheet) by the pressing means 4 (pressing means), tension is applied to the first adhesive sheet. When tension is applied to the first adhesive sheet in this manner, problems such as breakage of the first adhesive sheet and separation of the first adhesive sheet from the first ring frame RL1, the first support means, and the like occur. , the adherend cannot be adhered to the second adhesive sheet in a desired state.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a sheet sticking apparatus and a sheet sticking method capable of sticking an adherend to a second adhesive sheet without applying tension to the first adhesive sheet stuck to the adherend as much as possible. That's what it is.

The present invention employs the configurations described in the claims.

According to the present invention, by expanding the expandable particles added to the first adhesive sheet, the adherend is pressed against the adhesive surface of the second adhesive sheet for attachment. The adherend can be attached to the second adhesive sheet without applying tension to the first adhesive sheet as much as possible.
Further, when the region to be singulated is formed on the adherend, the individual piece body can be formed from the region to be singulated, and the formed individual piece body can be attached to the second adhesive sheet.
Further, if the moving means is provided, the pressing means is moved to the region to be singulated to be displaced to form the individual piece body, and the formed individual piece body is attached to the second adhesive sheet, or is attached to the adherend. The individual pieces and the second adhesive sheet AS2 can be adhered while expelling air intervening between them.
Further, if the moving means moves the linear imparting region parallel to the first direction and further moves the linear imparting region parallel to the second direction, for example, the It is possible to form a quadrangular individual piece surrounded by two sides along one direction and two sides along a second direction, and to attach the formed individual piece to the second adhesive sheet.
Furthermore, if the pressing means comprises a first pressing means for applying the first energy and a second pressing means for applying the second energy, the first expandable particles that expand with the first energy and the second The second expandable particles, which are expanded by energy, are expanded with a time lag to attach the adherend to the second adhesive sheet.
Further, if the displacement suppressing means is provided, it is possible to prevent the adjacent regions to be singulated from being displaced together with the displaced region to be singulated, thereby preventing formation of cracks originating from the modified portion. can be done.
Furthermore, by peeling the first adhesive sheet from the adherend attached to the second adhesive sheet, the adherend can be transferred from the first adhesive sheet to the second adhesive sheet.

1A is an explanatory diagram of a sheet sticking device according to an embodiment of the present invention; FIG. (B) and (C) are diagrams for explaining the operation of the sheet sticking device. (A) to (D) are diagrams for explaining the operation of the sheet sticking device. (A) to (C) are explanatory diagrams of modifications of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION An embodiment of the present invention will be described below with reference to the drawings.
Note that the X-axis, Y-axis, and Z-axis in this embodiment are orthogonal to each other, and the X-axis and Y-axis are axes within a predetermined plane, and the Z-axis is an axis orthogonal to the predetermined plane. do. Furthermore, in the present embodiment, when the direction is indicated without designating the figure, "up" is the direction of the arrow of the Z-axis and "down" is the direction viewed from the front in the middle of FIG. 1(A). "Left" is the arrow direction of the X-axis, "Right" is the opposite direction, "Front" is the front direction in FIG. 1A parallel to the Y-axis, and "Back" is the opposite direction.

The sheet sticking apparatus EA of the present invention is a semiconductor wafer (hereinafter also simply referred to as "wafer") WF as an adherend having a first adhesive sheet AS1 stuck to a first surface WF1. An apparatus for attaching a sheet AS2, which includes a first supporting means 10 for supporting the wafer WF to which the first adhesive sheet AS1 is attached with the second surface WF2 of the wafer WF exposed, and a reforming section provided on the wafer WF. a modified portion forming means 20 for forming a MT and forming a singulated region WFP surrounded by the modified portion MT on the wafer WF; A second support means 30 arranged so that the bonding surface AS2A faces the second surface WF2 of the wafer WF supported by the first supporting means 10, and the second surface WF2 of the wafer WF is placed on the bonding surface AS2A of the second adhesive sheet AS2. A pressing means 40 for pressing and attaching, a moving means 50 for relatively moving the wafer WF and the pressing means 40, and a displacement suppressing means 60 for suppressing displacement of the wafer WF portion before being displaced by the pressing means 40. , and sheet peeling means 70 for peeling the first adhesive sheet AS1 from the wafer WF attached to the second adhesive sheet AS2.
The first adhesive sheet AS1 is added with expansive particles SG that expand when infrared rays IR as predetermined energy are applied. In this embodiment, the first adhesive sheet AS1 is composed of the base sheet BS1 and the adhesive layer AL1, and only the adhesive layer AL1 is added with the expandable particles SG. The second adhesive sheet AS2 is composed of the base sheet BS2 and the adhesive layer AL2. is the side opposite the laminated side.

The first support means 10 has a support surface 11A that can be adsorbed and held by decompression means (holding means) (not shown) such as a decompression pump and a vacuum ejector, and includes a first support table 11 that can transmit infrared rays IR. .

The reformed portion forming means 20 is composed of a plurality of arms, and is a so-called drive device capable of displacing, within its working range, what is supported by the distal end arm 21A, which is the working portion, to any position and at any angle. A multi-joint robot 21, a laser bracket 22 having a laser holding portion 22A in which a tip arm 21A of the multi-joint robot 21 is fitted and held by the multi-joint robot 21, and a wafer WF supported by the laser bracket 22 A laser irradiator 23 that irradiates a laser LS to form a modified portion MT, a first modified portion MTY along the Y-axis direction as a first direction, and A second modified portion MTX is formed along the X-axis direction, and a singulation planned region WFP surrounded by the first modified portion MTY and the second modified portion MTX is formed. The articulated robot 21 can be exemplified by, for example, the articulated robot 111 disclosed in JP-A-2016-81974.

The second support means 30 has a support surface 32A which is supported by a direct-acting motor 31 as a driving device and its output shaft 31A and which can be sucked and held by a decompression means (holding means) (not shown) such as a decompression pump or a vacuum ejector. and a second support table 32 having.

The pressing means 40 includes a light source box 41 supported by the moving means 50, a light source 42 supported in the light source box 41 for emitting infrared rays IR, and a light collecting plate for collecting the infrared rays IR emitted by the light emitting source 42. 43, and forms a line-shaped application region LG (see FIGS. 2A and 2B) in which the infrared IR application region extends in a predetermined direction at a position to which the infrared ray IR is applied. . Then, the pressing means 40 partially imparts the infrared rays IR to the first adhesive sheet AS1, and the first adhesive sheet portion AS1P (see FIGS. 2A and 2B) to which the infrared rays IR is imparted. Expanding the added expansive particles SG, displacing the dicing-scheduled regions WFP attached to the first adhesive sheet portion AS1P to dicing the wafer WF into chips CP as individual pieces. In this state, the second adhesive sheet AS2 is pressed and adhered to the adhesive surface AS2A of the second adhesive sheet AS2.

The moving means 50 is provided with a rotating motor 51 as a driving device and a linear motor 52 as a driving device supported by an output shaft 51A thereof and supporting the light source box 41 by its slider 52A. The linear imparting region LG is moved parallel to the Y-axis direction, and further the linear imparting region LG is moved parallel to the X-axis direction.

The displacement suppressing means 60 has an articulated robot 21 shared with the modified portion forming means 20, and a presser plate holding portion 61A into which the tip arm 21A of the articulated robot 21 is fitted and held by the articulated robot 21. A presser plate 61 is provided.

The sheet peeling means 70 includes a support roller 71 that supports the belt-shaped peeling tape PT as a holding means, a guide roller 72 that guides the peeling tape PT, and an output shaft 73A of a direct-acting motor 73 as a driving device. a drive roller 75 supported by a peeling roller 74, a drive roller 75 supported by an output shaft (not shown) of a rotating motor 75A as a drive device, and pinching the peeling tape PT between pinch rollers 75B, and an output shaft of the drive device (not shown). The second support means 30 is supported by the recovery roller 76 which is supported by the second supporting means 76 and the slider 77A of the recovery roller 76, which always applies a predetermined tension to the release tape PT existing between the pinch roller 75B and recovers the release tape PT. and a linear motor 77 as a driving device for driving.

The operation of the above sheet sticking apparatus EA will be described.
First, a user of the sheet sticking device EA (hereinafter simply referred to as "user") operates the operation panel or personal A signal for starting the operation is inputted via an operation means (not shown) such as a computer. Next, a user or sheet supply means (not shown) such as an articulated robot or an adhesive sheet supply device applies the second adhesive sheet AS2 to the support surface 32A of the second support table 32 as shown in FIG. 1(A). When they are brought into contact with each other, the second support means 30 drives the decompression means (not shown) to start sucking and holding the second adhesive sheet AS2 on the support surface 32A. After that, a user or a conveying means (not shown) such as an articulated robot or a belt conveyor applies the first adhesive sheet AS1 with the first adhesive sheet AS1 facing the support surface 11A as shown in FIG. 1(A). When the wafer WF is placed on the first support table 11, the first support means 10 drives the decompression means (not shown) to start sucking and holding the first adhesive sheet AS1 on the support surface 11A.

Next, the modified portion forming means 20 drives the articulated robot 21 and the laser irradiator 23 to move the laser irradiator 23 in the front-rear direction, and as shown in FIG. After forming the material portion MTY, the laser irradiator 23 is moved in the horizontal direction to form the second modified portion MTX on the wafer WF as shown in FIG. do. Then, after the modified portion forming means 20 drives the articulated robot 21 to return the laser irradiation device 23 to the initial position, the tip arm 21A is extracted from the laser holding portion 22A, and the tip arm 21A is moved to the pressing plate holding portion. 61A, and the holding plate 61 is held by the articulated robot 21. - 特許庁

Next, the pressing means 40 and the moving means 50 drive the light source 42 and the linear motor 52 to form the linear applying region LG extending in the Y-axis direction. It is moved from the left to the right, and the line-shaped imparting region LG is moved in parallel with the Y-axis direction. Then, the expansive particles SG added to the first adhesive sheet portion AS1P to which the infrared rays IR are imparted are successively expanded as shown in the figure, forming a myriad of protrusions CV on the adhesive layer AL1. As a result, the wafer WF is partially lifted and displaced from left to right, forming cracks CKY extending in the Y-axis direction starting from the first modified portions MTY. It becomes a strip-shaped wafer WFS extending in the direction.
In this embodiment, when the crack CKY is formed as described above, the pressing means 40 completely removes the individual expandable particles SG added to the first adhesive sheet portion AS1P to which the infrared rays IR is applied. The infrared rays IR are irradiated so as not to expand or to prevent expansion of all the expandable particles SG added to the first adhesive sheet portion AS1P to which the infrared rays IR is applied. Further, when the crack CKY is formed as described above, the displacement suppressing means 60 drives the multi-joint robot 21 to place the holding plate 61 on the singulation planned region WFP, which is not desired to be displaced, so that the reforming portion MT To prevent the formation of cracks CK originating from becoming impossible.

After that, when the light source box 41 reaches a predetermined position on the right side of the right end of the wafer WF, the pressing means 40 and the moving means 50 stop driving the light source 42 and the linear motor 52 , and then the moving means 50 rotates the rotating motor 51 to rotate the pressing means 40 counterclockwise in the XY plane by 90 degrees in a top view. Next, the second support means 30 drives the linear motion motor 31, and as shown in FIG. 2B, the second support table 32 supports the upper surface of the strip-shaped wafer WFS, that is, the second surface WF2 of the wafer WF. The second adhesive sheet AS2 is brought close to the second adhesive sheet AS2 so that the adhesive surface AS2A of the second adhesive sheet AS2 faces the second surface WF2 of the wafer WF.

Then, after the pressing means 40 and the moving means 50 drive the light source 42 and the linear motor 52 to form the linear imparting region LG extending in the X-axis direction, the light source box 41 is moved as shown in FIG. It is moved from the rear to the front, and the linear imparting region LG is moved in parallel with the X-axis direction. Then, as shown in the figure, the individual expansive particles SG added to the first adhesive sheet portion AS1P to which the infrared ray IR is imparted expand one after another, or the first adhesive sheet portion AS1P to which the infrared ray IR is imparted expands further. More of the expandable particles SG added to the adhesive sheet portion AS1P expand, and the myriad convex portions CV formed on the adhesive layer AL1 expand. As a result, the strip-shaped wafer WFS is partially lifted and displaced one after another from the rear to the front, and a crack CKX extending in the X-axis direction starting from the second modified region MTX is formed. CKX and the previously formed crack CKY form a plurality of chips CP, which are pressed and attached to the adhesive layer AL2 of the second adhesive sheet AS2. At this time as well, the displacement suppressing means 60 drives the articulated robot 21 to press the singulation planned region WFP, which is not desired to be displaced, with the pressing plate 61 .

Next, when the light source box 41 reaches a predetermined position in front of the front end portion of the wafer WF, the pressing means 40 stops driving the light source 42, and then the moving means 50 drives the rotating motor 51 and the linear motor 52, thereby The box 41 is returned to its initial position. After that, the displacement suppressing means 60 drives the articulated robot 21 to return the holding plate 61 to the initial position, then the tip arm 21A is pulled out from the holding plate holding portion 61A, and the laser bracket which has been returned to the initial position. The distal end arm 21A is fitted into the laser holding portion 22A of 22, the laser irradiator 23 is held by the articulated robot 21, and each arm is returned to its initial position.

Next, after the first support means 10 stops driving the decompressing means (not shown) and releases the adsorption and holding of the first adhesive sheet AS1 on the support surface 11A, the second support means 30 drives the direct-acting motor 31. , the second support table 32 is lifted, and the chip CP (wafer WF) having the first adhesive sheet AS1 and the second adhesive sheet AS2 adhered to the first surface WF1 and the second surface WF2 is lifted to a predetermined height position. . Then, the sheet peeling means 70 drives the linear motor 77 to convey the second support table 32 rightward, and as shown in FIG. When reaching just above the upper end, the driving of the linear motor 77 is stopped. Next, the sheet peeling means 70 drives the direct-acting motor 73 to raise the peeling roller 74 to apply the peeling tape PT to the right end of the first adhesive sheet AS1 as indicated by the two-dot chain line in FIG. 2(C). Paste. After that, the sheet peeling means 70 drives the linear motor 77 and the rotating motor 75A, and as shown in FIG. By collecting with the collecting roller 76, the first adhesive sheet AS1 is peeled off from the chip CP (wafer WF). At this time, the adhesion area between the adhesive layer AL1 and the chip CP is reduced by the numerous convex portions CV formed on the adhesive layer AL1, and the adhesive strength of the first adhesive sheet AS1 to the chip CP is reduced. Therefore, the risk of the chip CP being peeled from the second adhesive sheet AS2 together with the first adhesive sheet AS1 to be peeled is reduced. When the entire first adhesive sheet AS1 is peeled off from the chip CP, the sheet peeling means 70 drives the direct-acting motor 73 to return the peeling roller 74 to the initial position, and then stops driving the rotating motor 75A.

Next, when the second support table 32 holding the chip CP via the second adhesive sheet AS2 reaches a predetermined position on the right side of the peeling roller 74, the sheet peeling means 70 stops driving the linear motor 77. FIG. Then, when a user or a chip conveying means (not shown) such as a pick-up device or a holding device removes all the chips CP or a predetermined number of chips CP from the second adhesive sheet AS2 and conveys the chips CP to another process, A user or a removing means (not shown) such as a belt conveyor or an articulated robot supports the second adhesive sheet AS2. Next, when the second support means 30 stops driving the decompressing means (not shown) and releases the adsorption and holding of the second adhesive sheet AS2 on the support surface 32A, the user or the removal means (not shown) moves from the support surface 32A to the second adhesive. Remove the sheet AS2. After that, the sheet peeling means 70 drives the linear motor 77 to return the second support table 32 to the initial position, and the same operation as described above is repeated thereafter.

According to the embodiment as described above, by expanding the expandable particles SG added to the first adhesive sheet AS1, the wafer WF is pressed and attached to the adhesive surface AS2A of the second adhesive sheet AS2. The wafer WF can be attached to the second adhesive sheet AS2 without applying tension to the first adhesive sheet AS1 attached to the wafer WF as much as possible.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions or steps described for those means and steps. The process is not limited at all. For example, if the first support means can support the adherend to which the first adhesive sheet is attached with the second surface of the adherend exposed, There is no limitation as long as it is within the technical scope (other means and steps are the same).

The first support means 10 may not be provided with a holding means, and if the adherend is capable of transmitting a predetermined energy, the first support table 11 may not be able to transmit the predetermined energy. , or may be made of a permeable material.
The first support means 10 supports a frame member such as a ring frame or a frame so as to surround the outside of the wafer WF or the wafer WF, and press the second surface WF2 of the wafer WF against the adhesive surface AS2A of the second adhesive sheet AS2. The frame member may also be pressed against the adhesive surface AS2A of the second adhesive sheet AS2 and attached. In this case, the first adhesive sheet AS1 may be attached to the frame member, or may If the first adhesive sheet AS1 is adhered to the frame member, expansion of the expandable particles SG causes the frame member to adhere to the adhesive surface of the second adhesive sheet AS2 in the same manner as the wafer WF. Alternatively, if the first adhesive sheet AS1 is not attached to the frame member, the adhesive surface AS2A of the second adhesive sheet AS2 is brought closer to the second surface WF2 of the wafer WF. At this time, the second adhesive sheet AS2 may be attached by being pressed against the frame member.

The modified portion forming means 20 may move the wafer WF to form the modified portion MT on the wafer WF without or while moving the laser irradiator 23 . One or a plurality of parallel modified portions MT may be formed, or one or a plurality of modified portions MT not parallel to the X-axis or Y-axis may be formed. Alternatively, a plurality of modified portions MT may be formed at uneven intervals, a plurality of modified portions MT may be formed parallel or not parallel to each other, or a plurality of modified portions MT that do not intersect each other may be formed. MT may be formed, or a plurality of modified portions MT may be formed that are orthogonal or oblique to each other, or may be formed in one or more directions other than the first and second directions. One or a plurality of modified portions MT may be formed in each, or one or a plurality of curved or polygonal modified portions MT may be formed. The formed singulation-scheduled regions WFP and chips CP may have any shape such as a circle, an ellipse, a triangle, or a polygon with more than a quadrangle.
The modified portion forming means 20 changes the properties, qualities, properties, materials, composition, configuration, dimensions, etc. of the wafer WF by applying laser light, electromagnetic waves, vibration, heat, chemicals, chemical substances, etc. The WF may be weakened, pulverized, liquefied, or hollowed to form the modified portion MT. Such a modified portion MT uses the expansion of the expandable particles SG as an external force to singulate the adherend. Any material can be used as long as it can form an individual piece.
The modified portion forming means 20 may be configured to hold and move the laser irradiator 23 with a driving device that is not shared with the displacement suppressing means 60, or the modified portion MT is formed on the wafer WF, and the modified portion MT is formed on the wafer WF. In the case where the singulation-scheduled region WFP surrounded by the portion MT or surrounded by the modified portion MT and the outer edge of the wafer WF is formed in advance, or when the wafer WF is not singulated and the second region WFP of the wafer WF is formed in advance. When attaching the second adhesive sheet AS2 to the surface WF2, the sheet attaching apparatus EA of the present invention may or may not be equipped with the second adhesive sheet AS2.

When arranging the second adhesive sheet AS2 supported by the second support table 32 so that the adhesive surface AS2A of the second adhesive sheet AS2 is opposed to the second surface WF2 of the wafer WF, the second support means 30 serves to adhere the second adhesive sheet AS2. Surface AS2A may or may not be brought into contact with second surface WF2 of wafer WFS, and first support means 10 releases first adhesive sheet AS1 from support surface 11A. If the first adhesive sheet AS1 can be peeled from the wafer WF only by lifting the second support table 32, the sheet peeling means can function, and the wafer WF supported by the first support means 10 can function as a sheet peeling means. , and the second adhesive sheet AS2 supported by the second support means 30, the second surface WF2 of the wafer WF is adhered to the second surface only by expanding the expandable particles SG by the pressing means 40. The direct motor 31 may be omitted as long as the distance is such that the sheet AS2 can be pressed and adhered to the adhesive surface AS2A.
The second support means 30 may hold the second adhesive sheet AS2 to which the frame member is attached, or may support the second support table 32 with the articulated robot 21 instead of the linear motion motor 31. When the articulated robot 21 supports the second support table 32 , the sheet peeling means 70 drives the articulated robot 21 without adopting the linear motor 77 to move the second support table 32 and the peeling roller 74 and the like. The first adhesive sheet AS1 may be separated from the wafer WF by relative movement. For example, when the sheet sticking apparatus EA of FIG. 1 is turned upside down, the holding means may not be provided.

As shown in FIG. 3A, the pressing means 40 includes a light source 44 capable of applying infrared rays IR to the entire first adhesive sheet AS1 at once, and a reflector 45 for reflecting the infrared rays IR emitted by the light source 44. and an opening/closing plate 46 capable of opening/closing the opening 45A in the upper portion of the reflector 45 . In this case, the light source 44 is driven to emit an infrared ray IR, and the opening 45A is fully closed by the opening/closing plate 46, and then the opening/closing plate 46 is gradually moved from the left to the right. As shown in (A-1), cracks CKY are formed one after another from left to right to form strip-shaped wafers WFS extending in the Y-axis direction. Next, after the opening 45A is fully closed by the opening/closing plate 46, the pressing means 40 is rotated counterclockwise by 90 degrees within the XY plane as viewed from above. After that, the opening/closing plate 46 is gradually moved from the rear to the front to form cracks CKX one after another from the rear to the front as shown in FIG. The chip CP may be formed and the wafer WF may be used as the chip CP and pressed against the adhesive surface AS2A of the second adhesive sheet AS2 to be attached.
As shown in FIGS. 3(B-1) and 3(B-2), the pressing means 40 has a slit 47A in place of the opening/closing plate 46. The slit 47A forms the linear applying region LG with the infrared rays IR emitted by the light source 44. The movable plate 47 may be employed, the slit 47A may be provided with a lens for condensing the infrared rays IR or making parallel light, or the opening/closing plate 46 and the movable plate 47 may be provided, for example, by the first support. It may be provided on the table 11 side.
The pressing means 40 may not have the condensing plate 43 or the reflecting plate 45, or instead of or in combination with the condensing plate 43, a lens may be provided for condensing the infrared rays IR or converting them into parallel rays. Alternatively, the time for irradiating the first adhesive sheet AS1 with the infrared rays IR can be arbitrarily determined in consideration of the properties, characteristics, nature, material, composition, configuration, etc. of the expandable particles SG. , 44, LED (Light Emitting Diode) lamps, high pressure mercury lamps, low pressure mercury lamps, metal halide lamps, xenon lamps, halogen lamps, etc., or a combination thereof may be used. Alternatively, energy that imparts laser light, electromagnetic waves, vibration, heat, chemicals, chemical substances, or the like may be employed, or an appropriate combination thereof may be employed, and the expansive particles SG Any configuration can be adopted in consideration of the characteristics, characteristics, properties, material, composition, configuration, etc. of the second support means 30 and the second support means 30 when the adherend can transmit predetermined energy Adhesive sheet AS2 may be made of one that can transmit predetermined energy, and the predetermined energy may be applied to first adhesive sheet AS1 by transmitting through second support means 30, second adhesive sheet AS2, and the adherend. Alternatively, the predetermined energy may be applied from both the adherend side and the first adhesive sheet AS1 side.
In the above-described embodiment, the pressing means 40 forms the linear imparting region LG to partially impart the infrared rays IR to the first adhesive sheet AS1, and presses the chip CP against the adhesive surface AS2A of the second adhesive sheet AS2. However, the application area of the infrared ray IR forms a point-like application area in which the infrared ray IR is applied in a point shape, and the infrared ray IR is partially applied to the first adhesive sheet AS1, or the plane of the dicing planned area WFP is formed. Infrared rays IR may be partially imparted to the first adhesive sheet AS1 by forming a surface state imparting region corresponding to the shape or a surface state imparting region not corresponding to the planar shape of the region to be singulated WFP. Alternatively, the chip CP may be pressed and attached to the adhesive surface AS2A of the second adhesive sheet AS2. Infrared rays IR are applied only to the sheet portion AS1P, and the chip CP is formed by displacing the singulated region WFP consisting of one or a plurality of sections attached to the first adhesive sheet portion AS1P to form the chip CP. Alternatively, the first adhesive sheet AS1 may be partially irradiated with infrared rays IR radially from the central portion of the wafer WF, and the chip The CP may be attached by being pressed onto the adhesive surface AS2A of the second adhesive sheet AS2.
The pressing means 40 may press the wafer WF against the adhesive surface AS2A of the second adhesive sheet AS2 without singulating the wafer WF. That is, the pressing means 40 applies the infrared rays IR to the first adhesive sheet AS1 to expand the expansible particles SG, thereby displacing the wafer WF attached to the first adhesive sheet AS1, thereby displacing the wafer WF. The second surface WF2 may be pressed and attached to the adhesive surface AS2A of the second adhesive sheet AS2.
The pressing means 40 may collectively apply infrared rays IR to the entire first adhesive sheet AS1, and collectively press and attach the chip CP and the entire wafer WF to the adhesive surface AS2A of the second adhesive sheet AS2. , the moving means 50 may not be provided in the sheet sticking apparatus EA of the present invention.

As shown in FIG. 3C, the moving means 50 moves the linear imparting region LG (not shown) obliquely crossing the first modified region MTY and the second modified region MTX from one end to the other end of the wafer WF. Cracks CKY and CKX are formed at the same time starting from both the first and second modified portions MTY and MTX, and the chip CP thus formed is attached to the adhesive surface AS2A of the second adhesive sheet AS2. It may be attached by pressing (the first adhesive sheet AS1 attached to the wafer WF is not shown in FIG. 3(C)). In this case, the oblique angle may be any angle such as 1 degree, 5 degrees, 10 degrees, 45 degrees, 60 degrees, 89 degrees, etc. with respect to the X-axis and the Y-axis.
The moving means 50 moves the wafer WF without or while moving the pressing means 40, and rotates the wafer WF relative to the pressing means 40 by 90 degrees counterclockwise in a top view in the XY plane. good too.
The moving means 50 moves the wafer WF and the second adhesive sheet AS2 without or while moving the pressing means 40, moves the line-shaped imparting region LG parallel to the Y-axis direction, or moves the line-shaped imparting region LG parallel to the Y-axis direction. The linear shape imparting region LG can be moved so as to be parallel to the X-axis direction, the linear shape imparting region LG can be moved so as not to be parallel to the X-axis or Y-axis direction, or the linear shape imparting region LG can be moved to the right side of the wafer WF. from one side to the left, or from the front to the rear of the wafer WF, or from the other direction of the wafer WF to another direction. The second surface WF2 of the wafer WF may be pressed against the adhesive surface AS2A of the second adhesive sheet AS2 by pressing the second surface WF2 of the wafer WF against the adhesive surface AS2A of the second adhesive sheet AS2. 40 may be moved to gradually press the second surface WF2 of the wafer WF from one end to the other end to adhere to the adhesive surface AS2A of the second adhesive sheet AS2. In this way, if the second surface WF2 of the chip CP or wafer WF is gradually pressed against the adhesive surface AS2A of the second adhesive sheet AS2 from one end to the other end, the second surface of the chip CP or wafer WF can be obtained. It is possible to prevent air bubbles from forming between WF2 and the adhesive surface AS2A of the second adhesive sheet AS2.
The moving means 50 may rotate at least one of the pressing means 40 and the wafer WF by 90 degrees in the XY plane in the clockwise rotation direction when viewed from the top, or move at least one of the pressing means 40 and the wafer WF upward in the XY plane. The pressing means 40 and the wafer WF may be rotated by 90 degrees or less or 90 degrees or more in the direction of rotation of the watch, may be provided as components constituting the sheet sticking apparatus EA of the present invention, or may be other devices. When the second surface WF2 of the wafer WF is pressed against the adhesive surface AS2A of the second adhesive sheet AS2 to attach the second surface WF2 of the wafer WF to the adhesive surface AS2A of the second adhesive sheet AS2, the sheet attaching apparatus EA of the present invention may not be equipped with, for example, , a singulation-scheduled region WFP is formed only at one location on the wafer WF, and the pressing means 40 forms a planar shape imparting region that corresponds or does not correspond to the planar shape of the singulation-scheduled region WFP, In the case of applying infrared rays IR partially to one adhesive sheet AS1 and pressing and attaching one chip CP to the adhesive surface AS2A of the second adhesive sheet AS2, the sheet attaching apparatus EA of the present invention It doesn't have to be.

The displacement suppressing means 60 may or may not contact the holding plate 61 on the singulation planned region WFP, which is not desired to be displaced. It is also possible to adopt another configuration that suppresses the displacement of the wafer WF portion before being pushed, or suppresses the displacement of the wafer WF portion before being displaced by the pressing means 40 with a pulley and a belt. Alternatively, a driving device that does not share the reformed portion forming means 20 may hold and move the pressing plate 61. Alternatively, a driving device that moves the pressing plate 61 in one direction (e.g., left and right) may be used. A separate driving device for moving the presser plate in the other direction (for example, in the front-rear direction) may be employed, or the sheet sticking apparatus EA of the present invention may not include it.

The sheet peeling means 70 may peel the first adhesive sheet AS1 from the wafer WF by moving the peeling roller 74 or the like without or while moving the second support table 32. A strip-shaped or sheet-shaped peeling tape PT may be employed, or a holding member that is supported by the output shaft of a direct-acting motor as a driving device and capable of being sucked and held by a decompression means such as a decompression pump or a vacuum ejector. 1 adhesive sheet AS1 is held, and the first adhesive sheet AS1 held by the holding member is separated from the wafer WF and peeled off. It is also possible to adopt a material that reduces the adhesive strength of the adhesive layer AL1 by electromagnetic waves such as rays or gamma rays, or adhesive strength reducing energy such as hot water or hot air. In this case, an adhesion-reducing energy imparting means for applying the adhesion-reducing energy is employed so that the first adhesive sheet AS1 is irradiated with the adhesion-reducing energy before the first adhesive sheet AS1 is peeled off from the wafer WF. do it.
The sheet peeling means 70 can, for example, only lift the second support table 32 by the second support means 30 without releasing the adsorption and holding of the first adhesive sheet AS1 on the support surface 11A by the first support means 10. When the first adhesive sheet AS1 can be peeled from the wafer WF, when the first adhesive sheet AS1 is peeled from the wafer WF by another device, when the first adhesive sheet AS1 is not peeled from the wafer WF, etc. It may not be provided in the sheet sticking apparatus EA of the present invention.

For example, the expandable particles SG are first expandable particles (not shown) that expand with thermal energy of 80° C. as the first energy, and second expandable particles (not shown) that expand with thermal energy of 120° C. as the second energy. and the pressing means 40 may include a first pressing means (not shown) that applies thermal energy of 80°C and a second pressing means (not shown) that applies thermal energy of 120°C. In this case, in the same operation as in the above embodiment, the pressing means 40 applies thermal energy of 80° C. to form the crack CKY starting from the first modified region MTY, and then applies thermal energy of 120° C. Cracks CKX are formed starting from the second modified portions MTX, and the chip CP can be pressed and attached to the adhesive surface AS2A of the second adhesive sheet AS2. Note that the first energy and the second energy may be any number of thermal energies, and the expandable particles SG have other expandable particles that expand with thermal energy at temperatures other than the first and second energies. In this case, the pressing means 40 can be additionally provided with other pressing means for applying heat energy at another temperature.
As the expandable particles SG, first expandable particles (not shown) that expand with infrared rays as the first energy and second expandable particles (not shown) that expand with ultraviolet rays as the second energy are added. The adhesive sheet AS1 may be employed, and the pressing means 40 may include a first pressing means (not shown) for applying infrared rays and a second pressing means (not shown) for applying ultraviolet rays. In this case, in the same operation as in the above embodiment, the pressing means 40 applies infrared rays to form cracks CKY starting from the first modified portion MTY, and then applies ultraviolet rays to form the second modified portion MTX. A crack CKX may be formed as a starting point, and the chip CP may be pressed and attached to the adhesive surface AS2A of the second adhesive sheet AS2. The combination of the first energy and the second energy applies the other energy when the first adhesive sheet AS1 to which other expandable particles that expand with energy other than the above is added is adopted. Other pressing means can be added.
Furthermore, in the above embodiment, the linear imparting region LG is gradually moved from one end of the wafer WF toward the other end, but the linear imparting region LG is located only at the position where the modified portion MT is formed. to form a crack CK starting from the modified portion MT, turn off the light emitting sources 42 and 44, and form the line-shaped imparting region LG at the position where the modified portion MT is formed. After moving the pressing means 40 and the slit 47A so as to position , the light emitting sources 42 and 44 may be driven to form the crack CK starting from the modified portion MT.
As the first adhesive sheet AS1, expandable particles SG are added that expand by using electromagnetic waves such as ultraviolet rays, visible rays, sound waves, X-rays or gamma rays, or heat such as hot water or hot air as predetermined energy. The pressing means 40 expands the expandable particles SG in consideration of the properties, properties, properties, materials, composition, configuration, etc. of the expandable particles SG, and adheres to the first adhesive sheet AS1. Any structure may be used as long as the wafer WF and the chip CP can be displaced and pressed against the adhesive surface AS2A of the second adhesive sheet AS2.
The sheet sticking apparatus EA may be one in which the transfer means or the user transfers the chips CP and wafers WF together with the second adhesive sheet AS2 to another process without removing the chips CP and wafers WF from the second adhesive sheet AS2. .

The first adhesive sheet AS1 may be one in which expandable particles SG are added only to the base sheet BS1 constituting the first adhesive sheet AS1, or the adhesive layer AL1 and the base sheet BS1 may be , and one or more intermediate layers exist between the adhesive layer AL1 and the base sheet BS1, and the intermediate layer, the adhesive Expandable particles SG may be added to at least one or at least two of the layer AL1 and the base sheet BS1, or may be attached to the circuit-formed surface of the wafer WF. However, it may be attached to a surface on which no circuit is formed, or when expandable particles SG are added to both the adhesive layer AL1 and the base sheet BS1, or when the intermediate layer, the adhesive layer AL1 and When expandable particles SG are added to at least two of the base sheets BS1, the expandable particles SG may or may not be identical.
Another adhesive sheet may be attached in advance to the other surface WF2 of the wafer WF, or the other adhesive sheet may be pressed against the adhesive surface AS2A of the second adhesive sheet AS2 to be attached. A known sheet peeling means for suitably peeling such other adhesive sheets may be employed.
The individual piece is not limited to the chip CP, and may be, for example, a strip-shaped wafer WFS. The means 50 moves the linear imparting region LG formed by the pressing means 40 only in one direction (for example, the Y-axis, the X-axis, or another direction) to move the strip-shaped wafer WFS to the adhesive surface AS2A of the second adhesive sheet AS2. It may be attached by pressing against the surface.
If the adherend is a strip-shaped wafer WFS in advance, the moving means 50 moves the linear applying region LG formed by the pressing means 40 in one direction (for example, the Y axis, the X axis, or another direction). , and the chip CP may be pressed and attached to the adhesive surface AS2A of the second adhesive sheet AS2.
The dicing-scheduled region WFP may be surrounded by the modified region MT and the outer edge of the wafer WF. A fan-shaped one formed by one side, one side parallel to the Y axis, and the outer edge of the wafer WF, or two sides parallel to the X axis, one side parallel to the Y axis, and the outer edge of the wafer WF. It may be of any shape, such as a shape formed by
The expandable particles SG are, for example, fine particles in which substances such as isobutane, propane, and pentane that are easily gasified and expanded by heating are enclosed in elastic shells. -159743, JP-A-2012-167151, thermally expandable fine particles disclosed in JP-A-2001-123002, JP-A-2013-47321, JP-A-2007-254580, JP-A-2011-212528, JP-A-2003-261842, etc. is not limited in any way, such as the expandable particles disclosed in , for example, a foaming agent that is thermally decomposed to generate water, carbon dioxide gas, and nitrogen to produce an effect similar to that of the expandable particles is adopted. Alternatively, the shell may be expanded with a gas generating agent such as an azo compound that generates gas by ultraviolet rays disclosed in JP-A-2016-53115 and JP-A-7-278333. For example, rubber that expands when heated , resin, etc., baking soda, sodium bicarbonate, baking powder, etc. may also be used.
A predetermined circuit may be formed on at least one of the first surface and the second surface of the wafer WF, or no circuit may be formed on both of them.
The first adhesive sheet AS1 may have a reduced adhesive area with the chip CP and a reduced adhesive strength with the chip CP by forming a myriad of protrusions CV. need not decrease.

The sheet sticking apparatus EA of the present invention may be provided with a known grinding (polishing) means for grinding (polishing) the wafer WF to a predetermined thickness, or a known pickup for removing the chip CP from the second adhesive sheet AS2. Alternatively, a known bonding means for bonding the chip CP removed from the second adhesive sheet AS2 to another member such as a substrate or a mounting table may be provided.

The material, type, shape, etc. of the first and second adhesive sheets AS1 and AS2 in the present invention are not particularly limited. For example, the first and second adhesive sheets AS1 and AS2 may be circular, elliptical, polygonal such as triangular or square, or other shapes. When the first and second heat-sensitive adhesive sheets AS1 and AS2 are employed, appropriate coil heaters and heat pipes for heating the first and second adhesive sheets AS1 and AS2 may be used. Adhesion may be performed by an appropriate method such as providing a heating means such as a heating side. Further, such first and second adhesive sheets AS1 and AS2 are, for example, single-layer ones consisting only of the adhesive layers AL1 and AL2, and intermediate adhesive sheets BS1 and BS2 between the base sheets BS1 and BS2 and the adhesive layers AL1 and AL2. 3 layers or more, such as those having a cover layer on the upper surfaces of the base sheets BS1 and BS2, and a so-called double-sided adhesive that allows the base sheets BS1 and BS2 to be separated from the adhesive layers AL1 and AL2. It may be in the form of a sheet, and the double-sided adhesive sheet may have a single or multiple intermediate layer, or may be a single or multiple layer without an intermediate layer. Examples of adherends include food, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, information recording substrates such as circuit boards and optical discs, glass plates, steel plates, pottery, wooden boards, and resins. It may be an object, or a composite formed by two or more of them, and any form of member or article may also be targeted. In addition, the first and second adhesive sheets AS1 and AS2 can be read in terms of functionality and usage, such as information recording labels, decorative labels, protective sheets, dicing tapes, die attach films, die bonding tapes, recording Any sheet such as a layer-forming resin sheet, a film, a tape, or the like may be used.

The drive device in the above embodiment includes a rotating motor, a linear motor, a linear motor, a single-axis robot, an electric device such as a multi-joint robot having two or more joints, an air cylinder, a hydraulic cylinder, and a rodless robot. Actuators such as cylinders and rotary cylinders can be used, and a direct or indirect combination thereof can also be used.
In the above embodiments, when a rotating member such as a roller is employed, a drive device for rotating the rotating member may be provided, or the surface of the rotating member or the rotating member itself may be made of deformable material such as rubber or resin. It may be composed of a member, the surface of the rotating member or the rotating member itself may be composed of a member that does not deform, or other members such as a shaft or a blade that rotates or does not rotate instead of the roller. Alternatively, if a pressing means such as a pressing roller or a pressing head or a pressing member that presses an object to be pressed is adopted, a roller, a round bar, a blade can be used instead of or in combination with the above examples A member such as material, rubber, resin, sponge, etc. may be adopted, or a configuration in which pressure is applied by blowing gas such as air or gas may be adopted. It may be configured with a member that does not deform. A member such as a plate-shaped member, a round bar, or a roller may be adopted instead of or in combination with the object, and the object to be peeled may be configured with a deformable member such as rubber or resin, or may be deformed. If a support (holding) means or support (holding) member that supports or holds the supported member is employed, gripping means such as a mechanical chuck or chuck cylinder, coulomb A configuration in which the supported member is supported (held) by force, adhesive (adhesive sheet, adhesive tape), adhesive (adhesive sheet, adhesive tape), magnetic force, Bernoulli adsorption, suction adsorption, drive equipment, etc. may be adopted. However, if a cutting means or cutting member that cuts the member to be cut or forms a cut or a cutting line in the member to be cut is employed, a cutter may be used in place of or in combination with the above examples. Use blades, laser cutters, ion beams, thermal power, heat, water pressure, heating wires, spraying gas or liquid, etc., or move the cutting object with a combination of appropriate driving equipment. You may make it cut|disconnect.

EA... Sheet sticking device 10... First supporting means 20... Modified portion forming means 30... Second supporting means 40... Pressing means 50... Moving means 60... Displacement suppressing means 70... Sheet peeling means AS1... First adhesive sheet AS2... Second adhesive sheet AS2A... Adhesive surface AS1P... First adhesive sheet portion CP... Semiconductor chip (individual piece)
IR: Infrared (energy)
LG... linear imparting region MT... modified portion MTX... second modified portion MTY... first modified portion SG... expandable particles WF... semiconductor wafer (adherend)
WF1...First surface WF2...Second surface WFP...Region to be singulated

Claims (10)

A sheet applying device for applying a second adhesive sheet to the second surface of an adherend having the first adhesive sheet applied to the first surface,
a first support means for supporting the adherend to which the first adhesive sheet is attached in a state where the second surface of the adherend is exposed;
a second support means for supporting the second adhesive sheet and arranging the adhesive surface of the second adhesive sheet to face the second surface of the adherend supported by the first support means;
a pressing means for pressing and attaching the second surface of the adherend to the adhesive surface of the second adhesive sheet;
The first adhesive sheet is added with expandable particles that expand when given energy is applied,
The pressing means imparts the energy to the first adhesive sheet to expand the expandable particles, thereby displacing the adherend attached to the first adhesive sheet, thereby displacing the adherend. A sheet sticking device, wherein the second surface is pressed against the adhesive surface of the second adhesive sheet for sticking. 2. The sheet sticking apparatus according to claim 1, further comprising moving means for relatively moving the adherend and the pressing means. A modification in which a modified portion is formed in the adherend, and a region to be singulated surrounded by the modified portion or surrounded by the modified portion and the outer edge of the adherend is formed in the adherend. A part forming means is provided,
The pressing means partially applies the energy to the first adhesive sheet, expands the expansive particles added to the portion of the first adhesive sheet to which the energy is applied, and expands the first adhesive sheet. It is characterized by displacing the region to be singulated attached to the sheet portion to be singulated, and pressing and attaching the adherend to the adhesive surface of the second adhesive sheet in a state where the adherend is made into an individual piece. The sheet sticking device according to claim 1. A modified portion is formed on the adherend, and a region to be singulated surrounded by the modified portion or surrounded by the modified portion and the outer edge of the adherend is formed in advance,
The pressing means partially applies the energy to the first adhesive sheet, expands the expansive particles added to the portion of the first adhesive sheet to which the energy is applied, and expands the first adhesive sheet. It is characterized by displacing the region to be singulated attached to the sheet portion to be singulated, and pressing and attaching the adherend to the adhesive surface of the second adhesive sheet in a state where the adherend is made into an individual piece. The sheet sticking device according to claim 1. 5. The sheet sticking apparatus according to claim 3, further comprising moving means for relatively moving the adherend and the pressing means. The reforming section includes a first reforming section along a first direction and a second reforming section along a second direction intersecting the first direction,
The pressing means forms a line-shaped application area where the energy application area extends in a predetermined direction at the position to which the energy is applied,
The moving means moves the linear imparting region parallel to the first direction, and further moves the linear imparting region parallel to the second direction. Item 6. The sheet sticking device according to item 5. The expandable particles have first expandable particles that expand with a first energy and second expandable particles that expand with a second energy,
7. The pressing means according to any one of claims 1 to 6, wherein the pressing means comprises first pressing means for applying the first energy and second pressing means for applying the second energy. Sheet sticking device as described. 8. The sheet sticking apparatus according to claim 1, further comprising displacement suppressing means for suppressing displacement of the adherend portion before being displaced by said pressing means. 9. The sheet sticking apparatus according to claim 1, further comprising sheet peeling means for peeling the first adhesive sheet from the adherend adhered to the second adhesive sheet. . In a sheet attaching method for attaching a second adhesive sheet to the second surface of an adherend having the first adhesive sheet attached to the first surface,
a first supporting step of supporting the adherend to which the first adhesive sheet is attached in a state where the second surface of the adherend is exposed;
a second supporting step of supporting the second adhesive sheet and arranging the adhesive surface of the second adhesive sheet so as to face the second surface of the adherend supported in the first supporting step;
a pressing step of pressing and attaching the second surface of the adherend to the adhesive surface of the second adhesive sheet;
The first adhesive sheet is added with expandable particles that expand when given energy is applied,
In the pressing step, the energy is applied to the first adhesive sheet to expand the expandable particles, thereby displacing the adherend adhered to the first adhesive sheet, thereby displacing the adherend. A method of attaching a sheet, wherein the second surface is pressed against the adhesive surface of the second adhesive sheet for attachment.

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