JP2020015883A - Resin composition for interlayer insulation layer, resin film for interlayer insulation layer, multilayer printed board and semiconductor package - Google Patents

Abstract

To provide a resin composition for interlayer insulation layer that is excellent in embedding property of a wiring pattern even when being highly filled with an inorganic filler, and a resin film for interlayer insulation layer, a multilayer printed wiring board and a semiconductor package using the resin composition for interlayer insulation layer.SOLUTION: There are provided a resin composition for interlayer insulation layer which contains (A) a thermosetting resin and (B) an inorganic filler, in which a content of (B) the inorganic filler in the resin composition for interlayer insulation layer is 55-90 vol.%, and a torque value Tafter 60 seconds from measurement start is 2.2 mN m or less when a torque value is temporally measured at 120°C using a gelation tester; and a resin film for interlayer insulation layer, a multilayer printed wiring board and a semiconductor package using the resin composition for interlayer insulation layer.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a resin composition for an interlayer insulating layer, a resin film for an interlayer insulating layer, a multilayer printed wiring board, and a semiconductor package.

  2. Description of the Related Art In recent years, there has been an increasing demand for multilayer printed wiring boards used for electronic devices, communication devices, and the like not only to reduce the size and weight and increase the wiring density, but also to increase the operation processing speed. Accordingly, as a method of manufacturing a multilayer printed wiring board, a build-up manufacturing technique of alternately stacking interlayer insulating layers on a wiring layer of a circuit board has attracted attention.

  The build-up layer is required to have a low coefficient of thermal expansion (low CTE) due to demand for processing dimensional stability and a reduction in the amount of warpage after semiconductor mounting, and efforts are being made to reduce the CTE ( For example, refer to Patent Documents 1 to 3. The most main method is a method in which a thermosetting resin is highly filled with an inorganic filler (for example, 40% by mass or more of a build-up layer is a silica filler).

JP 2006-527920 A JP 2007-87982 A JP 2009-280758 A

  The build-up layer is usually used in a form of being laminated on a roughened wiring pattern. At this time, if the fluidity of the build-up layer is low, irregularities on the wiring pattern cannot be sufficiently buried, and voids (voids) may be generated in the build-up layer in the thermosetting process. This problem tends to become more apparent as the filling rate of the inorganic filler increases. On the other hand, the demand for a low CTE for the build-up layer is increasing more and more, and a technique for achieving both a lower CTE by increasing the amount of an inorganic filler and a good embedding property of a wiring pattern is desired.

  The present invention has been made in order to solve such a problem, and even when highly filled with an inorganic filler, a resin composition for an interlayer insulating layer excellent in the embedding property of a wiring pattern, and for the interlayer insulating layer. An object of the present invention is to provide a resin film for an interlayer insulating layer, a multilayer printed wiring board, and a semiconductor package using a resin composition.

The present inventors have conducted intensive studies to solve the above-mentioned problems, and as a result, have found that the following problems can be solved by the present invention, and have completed the present invention.
That is, the present invention relates to the following [1] to [11].
[1] A resin composition for an interlayer insulating layer containing (A) a thermosetting resin and (B) an inorganic filler,
The content of the inorganic filler (B) in the resin composition for an interlayer insulating layer is 55 to 90% by volume,
Using gelation tester 120 when measured over time torque value at ° C., the torque value T ₆₀ of 60 seconds after the start of measurement is less than or equal 2.2mN · m, the interlayer insulating layer resin Composition.
[2] When the torque value after 10 seconds from the start of measurement was set to _{T 10,} the increasing rate above _{T 60} for _{T 10 [(T 60 -T 10} ) × 100 / T 10] it is, is 150% or less The resin composition for an interlayer insulating layer according to the above [1].
[3] The resin composition for an interlayer insulating layer according to the above [1] or [2], wherein the (B) inorganic filler is spherical silica.
[4]
(B) The resin composition for an interlayer insulating layer according to any one of the above [1] to [3], wherein the inorganic filler has an average particle size of 0.25 to 3 μm.
[5] The resin composition for an interlayer insulating layer according to any of the above [1] to [4], wherein the (A) thermosetting resin is an epoxy resin.
[6] The interlayer insulating layer according to any one of [1] to [5], further comprising (C) an active ester curing agent and a phenol resin as a curing agent, and (D) a phenoxy resin. Resin composition.
[7] The resin composition for an interlayer insulating layer according to any one of the above [1] to [6], comprising a support and a resin composition layer for an interlayer insulating layer, wherein the resin composition layer for an interlayer insulating layer is provided. A resin film for an interlayer insulating layer, which is a layer formed by layering an object.
[8] The resin film for an interlayer insulating layer according to the above [7], wherein the support is a polyethylene terephthalate film, and the thickness thereof is 75 μm or less.
[9] The resin film for an interlayer insulating layer according to the above [7] or [8], wherein the thickness of the resin composition layer for an interlayer insulating layer is 1 to 50 μm.
[10] The interlayer composition of the resin composition for an interlayer insulating layer according to any one of [1] to [6] and the resin film for an interlayer insulating layer according to any one of [7] to [9]. A multilayer printed wiring board containing at least one cured product selected from the group consisting of a layer resin composition layer.
[11] A semiconductor package obtained by mounting a semiconductor element on the multilayer printed wiring board according to the above [10].

  According to the present invention, even when highly filled with an inorganic filler, a resin composition for an interlayer insulating layer excellent in embedding of a wiring pattern, a resin film for an interlayer insulating layer using the resin composition for an interlayer insulating layer, A multilayer printed wiring board and a semiconductor package can be provided.

4 is an optical microscope photograph of the surface of an interlayer insulating layer (17 mm × 18 mm) obtained in Example 1. 5 is an optical microscope photograph of the surface of an interlayer insulating layer (17 mm × 18 mm) obtained in Comparative Example 1.

[Resin composition for interlayer insulating layer]
The resin composition for an interlayer insulating layer of the present embodiment (hereinafter, also simply referred to as “resin composition”)
A resin composition for an interlayer insulating layer, comprising (A) a thermosetting resin and (B) an inorganic filler.
The content of the inorganic filler (B) in the resin composition for an interlayer insulating layer is 55 to 90% by volume,
Using gelation tester 120 when measured over time torque value at ° C., the torque value T ₆₀ of 60 seconds after the start of measurement is less than or equal 2.2mN · m, the interlayer insulating layer resin A composition.
The interlayer insulating layer formed from the resin composition for an interlayer insulating layer of the present embodiment, even when highly filled with an inorganic filler, is excellent in the embedding property of a wiring pattern. It is suitable as an interlayer insulating layer for a build-up layer.

<Torque value of resin composition for interlayer insulating layer>
The resin composition of the present embodiment, by using a gelation tester, when measured over time torque value at 120 ° C., the torque value T ₆₀ of 60 seconds after the start of measurement, 2.2mN · m It is as follows.
The torque value in the present embodiment is a value measured by the following apparatus and conditions, and more specifically, a value measured by the method described in the examples.
<Measurement conditions>
-Measuring device: Automatic curing time measuring device "Madoka" (Matsuo Sangyo Co., Ltd., trade name)
-Sample (resin composition) amount: 0.3 g
・ Terminal model number: 4JC-3A45W
・ Terminal shape: Pin ・ Terminal diameter: 1mm
・ Rotation speed: 240 rpm
・ Revolution speed: 33.2 rpm
・ Stage temperature: 120 ° C

Torque value _{T 60} of 60 seconds after the start of the measurement, is not more than 2.2mN · m, filling properties of excellent wiring pattern.
From the same viewpoint, the torque value _{T 60} is preferably not more than 2.0 mN · m, more preferably not more than 1.8mN · m, more preferably less 1.6mN · m, still more or less 1.4mN · m preferably , 1.0 mN · m or less, particularly preferably 0.5 mN · m or less.
On the other hand, the lower limit value of the torque value _{T 60,} from the viewpoint of improving the thickness accuracy of the interlayer insulating layer is preferably not less than 0.05mN · m, more preferably at least 0.1 mN · m, more than 0.15 mN · m More preferred.

In the measurement of the torque value, when the torque value after 10 seconds from the start of the measurement and _{T 10,} the rate of increase in _{T 60} for _{T 10 [(T 60 -T 10} ) × 100 / T 10] is even more excellent From the viewpoint of obtaining the embeddability of the formed wiring pattern, 150% or less is preferable, 120% or less is more preferable, and 105% or less is further preferable.
On the other _hand, the lower limit of the rate of increase in _{T 60} for _{T 10,} from the viewpoint of improving the productivity, preferably at least 40%, more preferably 50% or more, further preferably 60% or more.

In the measurement of the torque value, when T ₁₀ a torque value after 10 seconds from the start of _measurement, a torque value after X seconds from the start of the measurement was T _x, the rate of increase in torque value T _x for T ₁₀ [(T _{x -T 10) × 100 / T 10} ] is 100% of the time S is preferably from 30 seconds to 180 seconds, more preferably from 45 to 150 seconds, more preferably 60 to 120 seconds. When the time S is in the above range, the balance between the embedding property of the wiring pattern and the productivity is further improved.

The torque value T ₆₀ , the rate of increase of T ₆₀ with respect to T ₁₀ , and the time S are, for example, the type and amount of the resin in the resin composition, the type and amount of the inorganic filler, and the curing accelerator used as necessary It can be adjusted by appropriately selecting the type and the amount of the compound.
Next, each component contained in the resin composition of the present embodiment will be described.

<(A) Thermosetting resin>
(A) As the thermosetting resin, epoxy resin, phenol resin, unsaturated imide resin, cyanate resin, isocyanate resin, benzoxazine resin, oxetane resin, amino resin, unsaturated polyester resin, allyl resin, dicyclopentadiene resin, Silicone resin, triazine resin, melamine resin and the like can be mentioned. Among these, epoxy resins are preferred from the viewpoints of heat resistance, adhesion to the conductor layer, moldability and electrical insulation.
As the thermosetting resin (A), one type may be used alone, or two or more types may be used in combination.

As the epoxy resin, for example, an epoxy resin having two or more epoxy groups in one molecule is preferably exemplified. Specific examples of the epoxy resin include bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, and other bisphenol epoxy resins; phenol novolak epoxy resins, cresol novolak epoxy resins, anthracene novolak epoxy resins, Novolak epoxy resins such as bisphenol A novolak epoxy resin, bisphenol S novolak epoxy resin, aralkyl novolak epoxy resin, naphthol novolak epoxy resin; dicyclopentadiene epoxy resin, biphenol epoxy resin, aralkyl epoxy resin, tert -Butyl-catechol type epoxy resin, fluorene type epoxy resin, xanthene type epoxy resin, naphthalene type epoxy resin, Such as anthracene type epoxy resins.
In the present embodiment, the “dicyclopentadiene-type epoxy resin” means an epoxy resin containing a dicyclopentadiene skeleton. For example, when the dicyclopentadiene-type epoxy resin has a novolak structure, the dicyclopentadiene-type epoxy resin is used. Resins are also classified as novolak epoxy resins.
Among these, aralkyl novolak type epoxy resins and dicyclopentadiene type epoxy resins are preferred from the viewpoint of heat resistance and smear processability. As the aralkyl novolak epoxy resin, an aralkyl novolak epoxy resin having a biphenyl skeleton is preferable. As the dicyclopentadiene type epoxy resin, dicyclopentadiene phenol novolak type epoxy resin is preferable.

(A) When a solid epoxy resin is used as the thermosetting resin, the solid epoxy resin is used in combination with a liquid epoxy resin such as a bisphenol A type epoxy resin and a bisphenol F type epoxy resin from the viewpoint of handleability of the obtained resin film. Is preferred. In this case, the content ratio (solid epoxy resin / liquid epoxy resin) (mass ratio) is preferably 0.5 to 7, and 1 to 6 is preferable from the viewpoints of handleability, electric characteristics, and heat resistance of the obtained resin film. More preferably, 1.2 to 5 is even more preferable. The aralkyl novolak type epoxy resin or the dicyclopentadiene phenol novolak type epoxy resin is preferable as the solid epoxy resin, and the bisphenol A type epoxy resin is preferable as the liquid epoxy resin.
Properties such as “solid” and “liquid” in the present specification mean a state at room temperature (25 ° C.).

  A commercially available epoxy resin may be used. Commercially available epoxy resins include “NC-3000-H”, “NC-3000-L”, “NC-3100”, and “NC-3000” (trade names, manufactured by Nippon Kayaku Co., Ltd., biphenyl skeleton) Aralkyl novolak type epoxy resin having the following properties), "NC-7000-L" (trade name, manufactured by Nippon Kayaku Co., Ltd., naphthol novolak type epoxy resin), "Epiclon (registered trademark) N673" (trade name, manufactured by DIC Corporation) , Cresol novolak type epoxy resin), "Epiclon (registered trademark) 840S" (trade name, manufactured by DIC Corporation, liquid bisphenol A type epoxy resin), "XD-1000" (trade name, manufactured by Nippon Kayaku Co., Ltd.) Cyclopentadiene-type epoxy resin), "TSR601" (trade name, manufactured by DIC Corporation, rubber-modified epoxy resin), "YED 216D "(trade name, Mitsubishi Chemical Co., Ltd., alkyl glycidyl ether), and the like.

The epoxy equivalent of the epoxy resin is preferably from 100 to 500 g / eq, more preferably from 170 to 400 g / eq, and more preferably from 200 to 300 g / eq, from the viewpoint of obtaining an interlayer insulating layer having small surface roughness and excellent adhesion to the conductor layer. eq is more preferred.
Here, the epoxy equivalent means the mass (g / eq) of the epoxy resin per epoxy group of the epoxy resin, and can be measured according to the method specified in JIS K7236.

The content of the (A) thermosetting resin in the resin composition of the present embodiment is not particularly limited, but is preferably 100 parts by mass in terms of solid content of the resin composition from the viewpoints of smear removal, dielectric loss tangent, and heat resistance. On the other hand, it is preferably 3 to 40 parts by mass, more preferably 5 to 35 parts by mass, still more preferably 7 to 30 parts by mass, and particularly preferably 10 to 25 parts by mass.
Here, in this specification, "solid content conversion" means that only non-volatile components excluding volatile components such as organic solvents are used as a reference. That is, 100 parts by mass in terms of solid content means equivalent to 100 parts by mass of the nonvolatile content.
The content of the epoxy resin in the resin composition of the present embodiment is the same as the preferable content of (A) the thermosetting resin.

<(B) inorganic filler>
The resin composition of the present embodiment contains 55 to 90% by volume of the inorganic filler (B).
(B) When the content of the inorganic filler is 55% by volume or more, it is possible to enhance the adhesion to the conductor layer while increasing the low thermal expansion property. When the content of the inorganic filler (B) is 90% by volume or less, good embedding into a wiring pattern and good adhesion to a conductor layer can be obtained.
From the above viewpoint, the content of the (B) inorganic filler in the resin composition of the present embodiment is preferably from 55 to 90% by volume, more preferably from 57 to 80% by volume, and still more preferably from 58 to 65% by volume. .

(B) As the inorganic filler, silica, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum borate, barium titanate , Strontium titanate, calcium titanate, bismuth titanate, titanium oxide, barium zirconate, calcium zirconate, and the like. Among these, silica is preferred because of its low cost.
(B) As the inorganic filler, one type may be used alone, or two or more types may be used in combination.

(B) The shape of the inorganic filler is not particularly limited, but is preferably spherical (hereinafter, the spherical inorganic filler is also referred to as “spherical filler”). Therefore, it is more preferable that the inorganic filler (B) is spherical silica.
(B) When the shape of the inorganic filler is spherical, the fluidity (embedding property of the wiring pattern) when laminating the obtained resin film becomes excellent while improving the low thermal expansion property.
In this specification, the term “spherical” includes a substantially spherical shape such as a true spherical shape and an elliptical shape, and those having irregularities on their surfaces. The aspect ratio (major axis / minor axis) of the spherical filler is, for example, preferably 2 or less, more preferably 1.5 or less, and still more preferably 1.2 or less. The aspect ratio is obtained, for example, by observing the shape of arbitrary 50 particles using a scanning electron microscope (SEM), measuring the major axis and minor axis of these particles, and averaging the aspect ratio. Can be.
(B) The inorganic filler may contain an inorganic filler other than the spherical filler, but the content of the spherical filler in the (B) inorganic filler is not particularly limited. It is preferably 90% by mass or more, more preferably 95% by mass or more, particularly preferably 98% by mass or more, and may be 100% by mass.

  (B) The average particle size of the inorganic filler is preferably from 0.25 to 3 μm, more preferably from 0.3 to 2 μm, from the viewpoints of good embedding property of the circuit board and insulation reliability between layers and wirings. .35 to 1 μm is more preferable, and 0.4 to 0.8 μm is particularly preferable. Here, the average particle size is a particle size at a point corresponding to a volume of 50% when a cumulative frequency distribution curve based on the particle size is determined with the total volume of the particles being 100%. Can be measured by a particle size distribution measuring device or the like.

  (B) As the inorganic filler, a commercially available product may be used. Commercially available inorganic fillers include spherical silica, "SO-C1" (average particle size: 0.25 m) and "SO-C2" (average particle size: 0.5 m) manufactured by Admatechs Co., Ltd. “SO-C3” (average particle size: 0.9 μm), “SO-C5” (average particle size: 1.6 μm), “SO-C6” (average particle size: 2.2 μm) (all of which are trade names) ) And the like.

(B) The inorganic filler may be surface-treated with a surface treatment agent such as a silane coupling agent from the viewpoint of improving moisture resistance. The silane coupling agent is preferably one that has been surface-treated with an aminosilane coupling agent from the viewpoint of enhancing the uniformity of the resin surface after the obtained interlayer insulating layer has been subjected to wet roughening treatment.
(B) The inorganic filler may be used in the form of a slurry previously dispersed in a solvent.

  The resin composition of the present embodiment preferably further contains at least one selected from the group consisting of (C) a curing agent, (D) a phenoxy resin, and (E) a curing accelerator.

<(C) curing agent>
(C) The curing agent is not particularly limited. Examples of the curing agent for the epoxy resin include an active ester curing agent, a phenol resin, an acid anhydride, an amine, and a hydrazite. Among them, an active ester curing agent and a phenol resin are preferable from the viewpoint of mechanical properties, curing time and dielectric properties of the obtained interlayer insulating layer.
As the curing agent (C), one type may be used alone, or two or more types may be used in combination.

(Active ester curing agent)
(C) The active ester curing agent used as a curing agent is not particularly limited as long as it functions as a curing agent for an epoxy resin and has an active ester group.
Examples of the active ester curing agent include compounds having a highly reactive ester group such as phenol esters, thiophenol esters, N-hydroxyamine esters, and heterocyclic hydroxy ester compounds, and having an epoxy resin curing action. Etc. can be used.

As the active ester curing agent, a compound having two or more active ester groups in one molecule is preferable, and two compounds in one molecule obtained from a compound having a polyvalent carboxylic acid and an aromatic compound having a phenolic hydroxyl group are preferable. An aromatic compound having the above active ester group is more preferable, and is an aromatic compound obtained from a compound having at least two or more carboxylic acids in one molecule and an aromatic compound having a phenolic hydroxyl group, and An aromatic compound having two or more ester groups in the molecule of the aromatic compound is more preferable. Further, the active ester curing agent may contain a linear or multi-branched polymer.
When the compound having at least two or more carboxylic acids in one molecule is a compound containing an aliphatic chain, (A) compatibility with the thermosetting resin can be increased, and the compound has an aromatic ring. If it is a compound, heat resistance can be increased. In particular, from the viewpoint of heat resistance and the like, the active ester curing agent is preferably an active ester compound obtained from a carboxylic acid compound and a phenol compound or a naphthol compound.

  The active ester curing agent can be produced by a known method. Specifically, it can be obtained by a condensation reaction of a carboxylic acid compound and / or a thiocarboxylic acid compound with a hydroxy compound and / or a thiol compound.

Examples of the carboxylic acid compound include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Among these, from the viewpoint of heat resistance, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, and terephthalic acid are preferable, and isophthalic acid and terephthalic acid are more preferable.
Examples of the thiocarboxylic acid compound include thioacetic acid and thiobenzoic acid.

Examples of the phenol compound or naphthol compound include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalin, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol , Dicyclopentadienyl diphenol, phenol novolak and the like. Among them, from the viewpoint of heat resistance and solubility, bisphenol A, bisphenol F, bisphenol S, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, catechol, 1,5-dihydroxynaphthalene, 1,6- Dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadienyldiphenol, and phenol novolak are preferred, and dicyclopentadienyldiphenol and phenol novolak are preferred. More preferably, dicyclopentadienyl diphenol is even more preferable.
Examples of the thiol compound include benzenedithiol and triazinedithiol.

As the active ester curing agent, an active ester curing agent disclosed in JP-A-2004-277460 may be used, or a commercial product may be used.
Examples of commercially available active ester curing agents include those containing a dicyclopentadienyl diphenol structure, acetylated phenol novolaks, and benzoylated phenol novolaks. Among these, dicyclopentadienyl diphenol structures Is preferred. Specifically, those containing a dicyclopentadienyl diphenol structure include “EXB9451”, “EXB9460”, “EXB9460S-65T”, and “HPC-8000-65T” (trade names, manufactured by DIC Corporation, Group equivalent: 223 g / eq), acetylated phenol novolac "DC808" (trade name, manufactured by Mitsubishi Chemical Corporation, ester group equivalent: 149 g / eq), and benzoylated phenol novolak: "YLH1026" (trade name, Mitsubishi Chemical Co., Ltd.) Company-made, ester group equivalent 200 g / eq).

  When the resin composition of the present embodiment contains an active ester curing agent, the content is not particularly limited, but from the viewpoint of the mechanical properties, curing time and dielectric properties of the obtained interlayer insulating layer, the solid content of the resin composition 2 to 30 parts by mass, more preferably 3 to 20 parts by mass, even more preferably 4 to 15 parts by mass, per 100 parts by mass in terms of minute.

(Phenolic resin)
(C) As a phenol resin used as a curing agent, a phenol resin having two or more phenolic hydroxyl groups in one molecule is preferable. Specifically, compounds having two phenolic hydroxyl groups in one molecule such as resorcin, catechol, bisphenol A, bisphenol F and substituted or unsubstituted biphenol; aralkyl-type phenolic resins; dicyclopentadiene-type phenolic resins; Phenylmethane type phenolic resin; phenol novolak resin, cresol novolak resin, cresol novolak resin containing triazine skeleton, bisphenol A novolak resin, novolak type phenolic resin modified with aminotriazine, etc .; resol type phenolic resin; benzaldehyde type phenol and aralkyl Phenol resin copolymerized with phenol; p-xylylene and / or m-xylylene-modified phenol resin; melamine-modified phenol resin; Phenol resins; dicyclopentadiene type naphthol resins; cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified phenolic resins; and biphenyl type phenolic resins. Among these, from the viewpoint of improving reliability, a novolak-type phenol resin is preferable, and a cresol novolak resin and a triazine skeleton-containing cresol novolak resin are more preferable.

The hydroxyl group equivalent of the phenol resin is preferably from 60 to 250 g / eq, more preferably from 80 to 200 g / eq, even more preferably from 100 to 170 g / eq.
Here, the hydroxyl group equivalent (g / eq) can be determined, for example, by titration by an acetylation method using acetic anhydride using an automatic titrator.

  When the resin composition of the present embodiment contains a phenolic resin, the content is not particularly limited, but from the viewpoint of the mechanical properties, curing time, and dielectric properties of the obtained interlayer insulating layer, the solid content of the resin composition is reduced. 0.5 to 20 parts by mass, preferably 1 to 10 parts by mass, more preferably 1.2 to 7 parts by mass, and particularly preferably 1.5 to 5 parts by mass with respect to 100 parts by mass.

<(D) Phenoxy resin>
The resin composition of the present embodiment preferably contains (D) a phenoxy resin. (D) By containing a phenoxy resin, the adhesion between the obtained interlayer insulating layer and the conductor layer tends to be improved, and the surface of the interlayer insulating layer tends to have a small and rough surface. . Further, when the conductor layer is formed on the interlayer insulating layer by using the electroless plating method, the generation of plating blisters is suppressed, and the adhesive strength between the interlayer insulating layer and the solder resist tends to be improved.
In addition, it is preferable that the resin composition of this embodiment contains (C) an active ester curing agent and a phenol resin as a curing agent, and (D) a phenoxy resin.
(D) The phenoxy resin may be used alone or in combination of two or more.

Here, “phenoxy resin” is a general term for polymers whose main chain is a polyaddition structure of an aromatic diol and an aromatic diglycidyl ether, and in this specification, the weight average molecular weight is 10,000. Refers to the above. When a polymer whose main chain is a polyaddition structure of an aromatic diol and an aromatic diglycidyl ether has an epoxy group, a polymer having a weight average molecular weight of 10,000 or more is classified as (D) a phenoxy resin. Those having an average molecular weight of less than 10,000 are classified as epoxy resins.
(D) The weight average molecular weight of the phenoxy resin is preferably from 10,000 to 100,000 from the viewpoint of improving the solubility in an organic solvent and the mechanical strength and chemical resistance of the interlayer insulating layer. When the weight average molecular weight is in the above range, the occurrence of blisters in the conductor layer tends to be suppressed.
The weight average molecular weight was measured by gel permeation chromatography (GPC) (manufactured by Tosoh Corporation) using a calibration curve of standard polystyrene.

(D) Phenoxy resins include bisphenol A skeleton, bisphenol F skeleton, bisphenol S skeleton, bisphenol AF skeleton, bisphenol trimethylcyclohexane skeleton, bisphenol acetophenone skeleton, novolak skeleton, biphenyl skeleton, fluorene skeleton, dicyclopentadiene skeleton, norbornene skeleton, Examples include those having at least one skeleton selected from a naphthalene skeleton, an anthracene skeleton, an adamantane skeleton, a terpene skeleton, a trimethylcyclohexane skeleton, and a copolymer skeleton of styrene and glycidyl methacrylate. Among them, phenoxy having a biphenyl skeleton is preferred from the viewpoint of improving the chemical resistance of the interlayer insulating layer and roughening, desmearing, etc., from the viewpoint of facilitating imparting appropriate unevenness to the interlayer insulating layer with an oxidizing agent. Resins are preferred.
(D) The terminal of the phenoxy resin may be either a phenolic hydroxyl group or an epoxy group.

  (D) A commercially available product may be used as the phenoxy resin. Commercially available (D) phenoxy resins include bisphenol AF skeleton-containing phenoxy resins “YL 7383” and “YL 7384”, and bisphenol A skeleton-containing phenoxy resins “1256” and “4250” (trade names, Mitsubishi Chemical Corporation) Co., Ltd.), "YP-50" (trade name, manufactured by Nippon Steel & Sumitomo Metal Corporation), "YX8100" which is a phenoxy resin having a bisphenol S skeleton, and "YX6954" which is a phenoxy resin having a bisphenol acetophenone skeleton (and above, (Trade name, manufactured by Mitsubishi Chemical Corporation), “FX-293”, a phenoxy resin containing a fluorene skeleton (trade name, manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.), “YX7200”, a phenoxy resin containing a bisphenoltrimethylcyclohexane skeleton Name, manufactured by Mitsubishi Chemical Corporation And “FX-280” (trade name, manufactured by Nippon Steel & Sumitomo Metal Corporation), “YL7553”, “YL6794”, “YL7290”, “YL7482” (trade name, manufactured by Mitsubishi Chemical Corporation), etc. Is mentioned.

  (D) The phenoxy resin is, for example, a bisphenol compound and a bifunctional epoxy resin as raw materials, and has an equivalent ratio of epoxy group to phenolic hydroxyl group of about 1: 0.9 to 1: 1 according to a known method for producing a phenoxy resin. It can be produced by reacting within the range of 1.

  When the resin composition of the present embodiment contains (D) a phenoxy resin, the content thereof is not particularly limited, but is preferably 0.1 to 20 parts by mass with respect to 100 parts by mass of the resin composition in terms of solid content. Preferably, it is 0.2 to 10 parts by mass, more preferably 0.5 to 3 parts by mass. When the content of (D) the phenoxy resin is at least the lower limit, sufficient flexibility is obtained, the handleability is excellent, and the adhesion to the conductive layer formed by plating tends to be excellent, When it is less than the above upper limit, sufficient fluidity is obtained at the time of lamination, and an appropriate roughness tends to be obtained.

<(E) Curing accelerator>
The resin composition of the present embodiment preferably contains (E) a curing accelerator from the viewpoint of enabling curing at a low temperature and in a short time.
(E) As a curing accelerator, imidazole compounds such as 2-phenylimidazole, 4-dimethylaminopyridine, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate; triphenylphosphine and the like Onium salts such as phosphonium borate; amines such as 1,8-diazabicycloundecene; 3- (3,4-dichlorophenyl) -1,1-dimethylurea, 4-dimethylaminopyridine and the like. No.
(E) As the curing accelerator, one type may be used alone, or two or more types may be used in combination.

  When the resin composition of the present embodiment contains (E) a curing accelerator, the content thereof is not particularly limited, but is 0.01 to 0.5 with respect to 100 parts by mass of the resin composition in terms of solid content. A mass part is preferred, 0.015-0.4 mass part is more preferred, and 0.02-0.3 mass part is still more preferred. (E) When the content of the curing accelerator is equal to or more than the above lower limit, a sufficient curing speed is obtained, the flatness of the resin layer on the inner layer pattern, and the interlayer insulating layer obtained by curing with the support. Excellent appearance. When the content of the curing accelerator (E) is equal to or less than the above upper limit, handling and embedding of the obtained resin film are excellent.

<(F) Other components>
The resin composition of the present embodiment may contain (F) other components other than the above components as long as the effects of the present invention are not impaired. (F) Other components include, for example, resin components, additives, organic solvents, and the like other than the above components.
(F) For each of the other components, one type may be used alone, or two or more types may be used in combination.

(Additive)
Additives include flame retardants such as inorganic flame retardants and resin flame retardants; thickeners such as orben and benton; adhesion promoters such as imidazole, thiazole, triazole and silane coupling agents; rubber particles; phthalocyanine blue And phthalocyanine green, iodine green, disazo yellow, carbon black and the like.

(Organic solvent)
The resin composition of the present embodiment is formed into a varnish-like resin composition containing an organic solvent (hereinafter, also referred to as “resin varnish”) from the viewpoint of facilitating handling and facilitating formation of a resin film. Is also good.
Examples of the organic solvent include ketone solvents such as acetone, methyl ethyl ketone (hereinafter also referred to as “MEK”), methyl isobutyl ketone, and cyclohexanone; acetic acid such as ethyl acetate, butyl acetate, cellosolve acetate, propylene glycol monomethyl ether acetate, and carbitol acetate; Ester solvents; carbitol solvents such as cellosolve and butyl carbitol; aromatic hydrocarbon solvents such as toluene and xylene; amide solvents such as dimethylformamide, dimethylacetamide and N-methylpyrrolidone. One organic solvent may be used alone, or two or more organic solvents may be used in combination. Among these, ketone solvents are preferred from the viewpoint of solubility, and MEK and methyl isobutyl ketone are more preferred.

  The resin composition of the present embodiment can be produced by mixing the above components. As a mixing method, a known method can be applied, and known kneading and dispersing methods such as a kneader, a ball mill, a bead mill, a three-roll mill, and a nanomizer can be applied.

[Resin film for interlayer insulating layer]
The resin film for an interlayer insulating layer of the present embodiment (hereinafter, also simply referred to as “resin film”) includes a support, a resin composition layer for an interlayer insulating layer (hereinafter, also simply referred to as “resin composition layer”), Wherein the resin composition layer for an interlayer insulating layer is a layer formed by forming the resin composition for an interlayer insulating layer of the present embodiment.
The resin film of the present embodiment is used for a build-up type multilayer printed wiring board, and can form a conductor layer having high adhesive strength on a smooth interlayer insulating layer. In the present embodiment, “smooth” means that the surface roughness Ra is less than 0.3 μm.

<Resin composition layer for interlayer insulating layer>
The resin composition layer is a layer formed by layering the resin composition of the present embodiment.When a multilayer printed wiring board is manufactured using the resin film of the present embodiment, the resin composition layer is directly applied to a circuit board during lamination. This layer is in contact with, melts, flows into the wiring pattern and embeds the circuit board. Also, when there are through holes, via holes, and the like in the circuit board, they flow into these and fill the holes.
The resin composition layer is obtained by forming a layer of the resin composition of the present embodiment. The layer can be formed, for example, by dissolving and / or dispersing the resin composition of the present embodiment in the organic solvent to form a resin varnish, followed by coating and drying.

  The thickness of the resin composition layer can be appropriately determined according to the desired performance. For example, since the thickness of the conductor layer formed on the printed wiring board is usually 5 to 70 μm, the thickness of the resin composition layer is preferably 10 to 100 μm while having a thickness of the conductor layer or more. And 15 to 80 μm is more preferable, and 20 to 50 μm is still more preferable. From the viewpoint of making the multilayer printed wiring board thinner, the thickness of the resin composition layer is preferably from 1 to 50 μm, more preferably from 10 to 45 μm.

<Support>
The support used for the resin film of the present embodiment is not particularly limited, and examples thereof include an organic resin film, a metal foil, and release paper.
Examples of the material of the organic resin film include polyolefins such as polyethylene and polyvinyl chloride; polyesters such as polyethylene terephthalate (hereinafter also referred to as “PET”) and polyethylene naphthalate; polycarbonates and polyimides. Among them, PET is preferable from the viewpoint of price and handling.
Examples of the metal foil include a copper foil and an aluminum foil. When a copper foil is used for the support, a circuit can be formed by using the copper foil as a conductor layer as it is. In this case, as the copper foil, rolled copper, electrolytic copper foil, or the like can be used. Further, the thickness of the copper foil is not particularly limited, and for example, a copper foil having a thickness of 2 to 36 μm can be used. When a thin copper foil is used, a copper foil with a carrier may be used from the viewpoint of improving workability.

The support may be subjected to a mat treatment, a corona treatment, a release treatment or the like.
The thickness of the support is usually from 10 to 150 μm, preferably from 25 to 50 μm. When the thickness of the support is 10 μm or more, handleability becomes easy. On the other hand, since the support is usually finally peeled or removed, it is preferable that the thickness be 75 μm or less from the viewpoint of energy saving and the like.
The support is preferably a polyethylene terephthalate film having a thickness of 75 μm or less from the viewpoint of cost and handleability.

<Protective film>
The resin film of the present embodiment may have a protective film. The protective film is provided on the surface opposite to the surface on which the resin film support of the present embodiment is provided, and is used for the purpose of preventing adhesion of foreign substances and the like to the resin film and damage thereto. You. The protective film is peeled off before laminating the resin film of the present embodiment on a circuit board or the like by lamination, hot pressing or the like.
As the protective film, for example, the same material as the support can be used. The thickness of the protective film is, for example, 1 to 40 μm.

<Production method of resin film>
As a method for producing the resin film of the present embodiment, for example, a method of coating a varnish-like resin composition of the present embodiment on a support and then drying the same to form a resin composition layer is exemplified.
Examples of a method of applying the resin composition include a method of applying using a known coating device such as a comma coater, a bar coater, a kiss coater, a roll coater, a gravure coater, and a die coater. The coating device may be appropriately selected according to the target film thickness.

The drying conditions after applying the resin composition of the present embodiment are preferably such that the content of the organic solvent in the dried resin film is 10% by mass or less, preferably 5% by mass or less. More preferred. Since the drying conditions also affect the temperature-melt viscosity curve of the resin composition of the present embodiment, it is preferable to set the drying conditions so as to satisfy the handleability of the film.
Specific drying conditions vary depending on the amount and type of the organic solvent in the resin varnish. For example, in the case of a resin varnish containing 30 to 80% by mass of an organic solvent, about 50 to 150 ° C. for about 3 to 10 minutes. By drying, a resin film can be formed.
It is preferable to set appropriate drying conditions as appropriate by simple experiments.
Further, the resin film can be wound up in a roll shape and stored and stored.

[Multilayer printed wiring board]
The multilayer printed wiring board of the present embodiment contains one or more cured products selected from the group consisting of the resin composition of the present embodiment and the resin composition layer of the resin film of the present embodiment. .
The multilayer printed wiring board of the present embodiment can be manufactured, for example, by laminating the resin film of the present embodiment on a circuit board. Specifically, the following steps (1) to (6) [however, step (3) is optional. ], And the support may be peeled off or removed after the step (1), (2) or (3).

(1) A step of laminating the resin film of the present embodiment on one or both sides of a circuit board [hereinafter, referred to as a laminating step (1)].
(2) A step of thermosetting the resin composition layer of the laminated resin film to form an insulating layer (hereinafter, referred to as an insulating layer forming step (2)).
(3) A step of making a hole in the circuit board on which the insulating layer is formed [hereinafter referred to as a hole making step (3)].
(4) A step of roughening the surface of the insulating layer with an oxidizing agent [hereinafter referred to as a roughening step (4)].
(5) A step of forming a conductor layer on the surface of the roughened insulating layer by plating [hereinafter referred to as a conductor layer forming step (5)].
(6) A step of forming a circuit on the conductor layer [hereinafter referred to as a circuit forming step (6)].

  The laminating step (1) is a step of laminating the resin film of the present embodiment on one or both sides of a circuit board using a vacuum laminator or the like. As the vacuum laminator, a commercially available vacuum laminator can be used. Commercially available vacuum laminators include Nichigo Morton's vacuum applicator, Meiki Seisakusho Co., Ltd. Laminator and the like.

When a protective film is provided on the resin film, after peeling or removing the protective film, the resin composition layer of the resin film is pressed against the circuit board while applying pressure and heat so that the resin composition layer is in contact with the circuit board. By doing so, it can be laminated.
For the lamination, for example, after the resin film and the circuit board are preheated as required (preheating), the pressing temperature (lamination temperature) is 60 to 140 ° C., and the pressing pressure is 0.1 to 1.1 MPa (9. 8 × 10 ^{4 to} 107.9 × 10 ⁴ N / m ² ) and an air pressure of 20 mmHg (26.7 hPa) or less. The lamination method may be a batch method or a continuous method using a roll.

In the insulating layer forming step (2), first, the resin film laminated on the circuit board in the laminating step (1) is cooled to around room temperature.
In the case of peeling the support, after peeling, the resin composition layer of the resin film laminated on the circuit board is heated and cured to form an insulating layer, that is, an insulating layer which will later become an “interlayer insulating layer”.
The conditions for heat curing are selected in the range of 150 to 220 ° C for 20 to 120 minutes, and more preferably in the range of 160 to 200 ° C for 30 to 120 minutes. In the case where a support subjected to a release treatment is used, the support may be peeled off after being thermally cured.
Further, the thermal curing may be divided into two or more stages. For example, after heating at 150 ° C. or lower for about 30 minutes, the composition may be cured by heating at 160 to 200 ° C. for 20 to 120 minutes.

After forming the insulating layer by the above method, a drilling step (3) may be performed as necessary.
The drilling step (3) is a step of drilling holes in the circuit board and the formed insulating layer by a method such as drilling, laser, plasma, or a combination thereof to form via holes, through holes, and the like. As the laser, a carbon dioxide laser, a YAG laser, a UV laser, an excimer laser, or the like is used.
The support may be peeled off after step (3). In recent years, in order to perform drilling in a short time by increasing the intensity of the laser, in a state where the support is attached, drilling is performed using a carbon dioxide gas laser, and the support film may be peeled off after drilling. .

In the roughening treatment step (4), the surface of the insulating layer is roughened with an oxidizing agent. In the case where via holes, through holes, and the like are formed in the insulating layer and the circuit board, so-called "smear" generated when these are formed may be removed with an oxidizing agent. The roughening treatment and the removal of smear can be performed simultaneously.
In the method for manufacturing a multilayer printed wiring board according to the present embodiment, it is preferable to perform a wet roughening treatment.
Examples of the oxidizing agent include permanganate (such as potassium permanganate and sodium permanganate), dichromate, ozone, hydrogen peroxide, sulfuric acid, and nitric acid. Among them, alkaline permanganate solutions (eg, potassium permanganate, sodium permanganate hydroxide), which are oxidizing agents commonly used for roughening insulating layers in the manufacture of multilayer printed wiring boards by the build-up method, Sodium aqueous solution).
By the roughening treatment, an uneven anchor is formed on the surface of the insulating layer.

In the conductor layer forming step (5), a conductor layer is formed by plating on the surface of the insulating layer on which the roughened anchors are formed.
Examples of the plating method include an electroless plating method and an electrolytic plating method. The metal for plating is not particularly limited as long as it can be used for plating.
It is also possible to adopt a method in which a plating resist having a pattern opposite to that of the conductor layer (wiring pattern) is formed first, and then the conductor layer (wiring pattern) is formed only by electroless plating.
After the formation of the conductor layer, for example, annealing may be performed at 150 to 200 ° C. for 20 to 90 minutes. By performing the annealing treatment, the adhesion between the interlayer insulating layer and the conductor layer tends to be further improved and stabilized.
In the circuit forming step (6), a known method such as a subtractive method and a semi-additive method (SAP) can be applied as a method of patterning the conductor layer.
The surface of the produced conductor layer may be roughened from the viewpoint of improving the adhesion to the resin in contact with the conductor layer.

The circuit board used for the multilayer printed wiring board of the present embodiment is not particularly limited, and may be provided on one or both sides of a substrate such as a glass epoxy, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, and a thermosetting polyphenylene ether substrate. And those on which a patterned conductor layer (circuit) is formed.
Also, a multilayer printed wiring board having a conductor layer (circuit) in which conductor layers and insulating layers are alternately formed and patterned on one or both sides, the resin film of the present embodiment on one or both sides of the circuit board Having a conductor layer (circuit) patterned on one or both sides thereof, and having one or both sides of a cured product formed by laminating and curing the resin film of the present embodiment. A circuit board having a patterned conductor layer (circuit) is also included in the circuit board.
The surface of the conductor layer of the circuit board may be subjected to a roughening treatment such as a blackening treatment from the viewpoint of the adhesion of the interlayer insulating layer to the circuit board.

[Semiconductor package]
The semiconductor package of the present embodiment is obtained by mounting a semiconductor on the multilayer printed wiring board of the present embodiment. The semiconductor package of the present embodiment can be manufactured by mounting a semiconductor chip, a memory, and the like at a predetermined position of the multilayer printed wiring board of the present embodiment by a known method.

  Hereinafter, the present invention will be described specifically with reference to Examples, but the present invention is not limited to these Examples.

[Preparation of resin film for interlayer insulating layer]
Examples 1-4, Comparative Examples 1-4
Each component was blended according to the blending composition shown in Table 1 (unit: parts by mass; however, in the case of a solution or dispersion, the solid content is shown), mixed, and subjected to bead mill dispersion treatment to prepare a resin varnish.
The resin varnish is applied on a PET film (trade name: SY-01, thickness: 38 μm, manufactured by Toray Film Processing Co., Ltd.) as a support, and then dried to form an interlayer insulating layer on the support. A resin film having a resin composition layer (hereinafter, also simply referred to as “resin composition layer”) was produced.
The coating thickness was adjusted so that the thickness of the resin composition layer after drying was 40 μm, and the drying was performed such that the residual solvent in the resin composition layer was 3.0% by mass. After drying, a polyethylene film (manufactured by Tamapoly Corporation, trade name: NF-13, thickness: 25 μm) is laminated on the surface of the resin composition layer side as a protective film, and the obtained film is wound into a roll. Was.
The resin film obtained above was evaluated by the following method. Table 1 shows the results.

[Measurement of torque value]
The film-shaped resin composition obtained by removing the protective film and the support from the resin film obtained in each example was pulverized into resin powder. The torque value of the obtained resin powder was measured at 120 ° C. over time using an automatic curing time measuring device “Madoka” (trade name, manufactured by Matsuo Sangyo Co., Ltd.).
At this time, after the resin powder is placed on the stage, the time when the resin powder comes into contact with the measurement terminal is defined as the measurement start time, and the torque value T ₁₀ 10 seconds after the start of the measurement and the torque value T 60 seconds after the measurement is started. _60, were _measured to calculate the rate of increase in _{T 60} for _{T 10 [(T 60 -T 10} ) × 100 / T 10].
The time from the start of placing the resin powder on the stage until the contact between the resin powder and the measurement terminal was adjusted to be 20 seconds.
<Measurement conditions>
-Sample (resin composition) amount: 0.3 g
・ Terminal model number: 4JC-3A45W
・ Terminal shape: Pin ・ Terminal diameter: 0.6mm
・ Rotation speed: 240 rpm
・ Revolution speed: 33.2 rpm
・ Gap: 0.3mm
・ Stage temperature: 120 ° C

[Measurement of number of voids in interlayer insulating layer]
After cutting the resin film obtained in each example into a 150 mm square, the protective film was peeled off, and the resin composition layer was placed so as to face the circuit surface of the printed wiring board, and then laminated.
The printed wiring board is a grid-like circuit formed by a subtractive method on a copper-clad laminate “MCL-E-700FG” (trade name, manufactured by Hitachi Chemical Co., Ltd., having a total thickness of 0.6 mm) having a 35 μm thick copper layer. The processed one was used. The printed wiring board used was subjected to a drying treatment at 105 ° C. for 30 minutes before lamination.
The laminate was evacuated at 110 ° C. for 30 seconds using a vacuum pressurized laminator “MVLP-500 / 600IIA” (trade name, manufactured by Meiki Seisakusho Co., Ltd.), and then pressurized at 0.5 MPa for 30 seconds. Thereafter, hot pressing was performed at 110 ° C. for 60 seconds at 0.5 MPa. Next, after cooling to room temperature, curing was performed in an explosion-proof drier at 130 ° C. for 30 minutes and then at 180 ° C. for 30 minutes with the support attached, to produce a cured substrate.
The support of the resin film was peeled off from the obtained cured substrate, and the number of voids present on the surface of the interlayer insulating layer exposed on the cured substrate was visually measured.

Details of each material shown in Table 1 are shown below.
[(A) Thermosetting resin]
-840S: bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, trade name, solid content concentration 100% by mass, epoxy equivalent: 184 to 194 g / eq)
NC-3000-H: biphenylaralkyl type epoxy resin (manufactured by Nippon Kayaku Co., Ltd., trade name, solid content concentration 100% by mass, epoxy equivalent: 288 g / eq)
XD-1000: dicyclopentadiene type epoxy resin (trade name, manufactured by Nippon Kayaku Co., Ltd., solid content concentration 100% by mass, epoxy equivalent: 245 to 260 g / eq)
YED-216D: alkyl glycidyl ether (manufactured by Mitsubishi Chemical Corporation, trade name, solid content concentration 100% by mass, epoxy equivalent: 110 to 130 g / eq)
TSR601: rubber-modified epoxy resin (manufactured by DIC Corporation, trade name, solid content concentration 100% by mass, epoxy equivalent: 450 to 500 g / eq)
[(B) inorganic filler]
The surface of spherical silica “SO-C2” (trade name, manufactured by Admatechs Co., Ltd., average particle size: 0.5 μm) is treated with an aminosilane coupling agent, and further dispersed in MEK (solid content concentration). 70% by mass)
[(C) curing agent]
-HPC-8000-65T: active ester curing agent (active ester compound containing dicyclopentadiene-type diphenol structure) (manufactured by DIC Corporation, trade name, solid content concentration: 65% by mass, ester group equivalent: 223 g / mol, toluene) cut)
LA-3018-50P: Triazine skeleton-containing cresol novolak resin (manufactured by DIC Corporation, trade name, solid content concentration 50% by mass, propylene glycol monomethyl ether (PGM) cut, hydroxyl equivalent: 151 g / eq)
KA1165: Cresol novolak type phenol resin (manufactured by DIC Corporation, trade name, solid content concentration 100% by mass, hydroxyl equivalent: 119 g / eq)
[(D) phenoxy resin]
YX7200B35: Phenoxy resin containing a skeleton derived from a biphenyl type epoxy resin and a bisphenol compound having a trimethylcyclohexane structure (1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane) (Mitsubishi) (Chemical Co., Ltd., trade name, solid content concentration 35% by mass, MEK cut, weight average molecular weight: 3.0 × 10 ⁴ , epoxy equivalent: 9000 g / eq)
[(E) Curing accelerator]
-4-DMAP: 4-dimethylaminopyridine (manufactured by Wako Pure Chemical Industries, Ltd., solid content concentration 100% by mass)
[(F) additive]
-BYK-310: Polyester-modified polydimethylsiloxane solution (manufactured by BYK Japan KK, trade name, solid content concentration 25% by mass, xylene cut)

From Table 1, the interlayer insulating layers formed in Examples 1 to 4 using the resin composition of the present embodiment, even when highly filled with an inorganic filler, have significantly reduced the number of voids, It can be seen that the embedding property of the wiring pattern is excellent.
On the other hand, the torque value T ₆₀ is an interlayer insulating layer formed in Comparative Examples 1 to 4 using the resin composition exceeds 2.2mN · m, the number of voids is large and has an inferior embedding of the wiring pattern .
FIG. 1 shows an optical microscope photograph of the surface of the interlayer insulating layer obtained in Example 1, and FIG. 2 shows an optical microscope photograph of the surface of the interlayer insulating layer obtained in Comparative Example 1. In FIG. 1, the presence of voids is not confirmed, but in FIG. 2, the presence of a plurality of voids is confirmed (note that only some of the voids are denoted by reference numerals in the drawing).
From these results, it can be seen that the interlayer insulating layer formed from the resin composition of the present embodiment retains sufficient fluidity when attaching a resin film by a vacuum laminator, and is suitable for embedding a wiring pattern.

  Even when the resin composition of the present embodiment is highly filled with an inorganic filler, since the filling property of the wiring pattern is excellent, an interlayer insulating layer having both low thermal expansion property and filling property of the wiring pattern is formed. Can be. Therefore, the resin composition of the present embodiment can be widely used for electric products such as computers, mobile phones, digital cameras, and televisions; and vehicles such as motorcycles, automobiles, trains, ships, and aircraft.

1 void

Claims (11)

A resin composition for an interlayer insulating layer, comprising (A) a thermosetting resin and (B) an inorganic filler.
The content of the inorganic filler (B) in the resin composition for an interlayer insulating layer is 55 to 90% by volume,
Using gelation tester 120 when measured over time torque value at ° C., the torque value T ₆₀ of 60 seconds after the start of measurement is less than or equal 2.2mN · m, the interlayer insulating layer resin Composition. When the torque value after 10 seconds from the measurement start and _{T 10,} the rate of increase in _{T 60} for _{T 10 [(T 60 -T 10} ) × 100 / T 10] is 150% or less, according to claim 1 3. The resin composition for an interlayer insulating layer according to item 1.   3. The resin composition for an interlayer insulating layer according to claim 1, wherein (B) the inorganic filler is spherical silica.   The resin composition for an interlayer insulating layer according to any one of claims 1 to 3, wherein the inorganic filler has an average particle size of 0.25 to 3 µm.   The resin composition for an interlayer insulating layer according to any one of claims 1 to 4, wherein (A) the thermosetting resin is an epoxy resin.   The resin composition for an interlayer insulating layer according to any one of claims 1 to 5, further comprising (C) an active ester curing agent and a phenol resin as a curing agent, and (D) a phenoxy resin.   It has a support body and the resin composition layer for interlayer insulation layers, Comprising: The said resin composition layer for interlayer insulation layers forms the resin composition for interlayer insulation layers as described in any one of Claims 1-6. A resin film for an interlayer insulating layer.   The resin film for an interlayer insulating layer according to claim 7, wherein the support is a polyethylene terephthalate film, and the thickness thereof is 75 µm or less.   The resin film for an interlayer insulating layer according to claim 7, wherein the thickness of the resin composition layer for an interlayer insulating layer is 1 to 50 μm.   The resin composition for an interlayer insulating layer according to any one of claims 1 to 6, and the resin composition for an interlayer insulating layer included in the resin film for an interlayer insulating layer according to any one of claims 7 to 9. A multilayer printed wiring board containing one or more cured products selected from the group consisting of layers.   A semiconductor package comprising a semiconductor element mounted on the multilayer printed wiring board according to claim 10.