JP2020009856A - Jig and installation method using jig - Google Patents

Abstract

To provide a jig that enables an elastic pad to be easily installed on the stage surface of a vacuum suction stage, and a method of installing an elastic pad on the vacuum suction stage using such a jig.SOLUTION: A vacuum hole for suctioning a processing object by vacuum are formed on the stage surface of a vacuum suction stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first protrusion that can be inserted into the vacuum hole of the vacuum suction stage, a supporting portion that contacts the stage surface with the first protrusion inserted into the vacuum hole, and a second projection that protrudes from the support portion on the opposite side to the first projection and can be inserted into the hole of the elastic pad.SELECTED DRAWING: Figure 11

Description

  The present invention relates to a jig and an installation method using the jig, and more specifically, a jig used to install an elastic pad on a stage surface of a vacuum suction stage, and an installation of an elastic pad using the jig. About the method.

  2. Description of the Related Art In recent years, a substrate processing apparatus has been used to perform various processes on a substrate such as a semiconductor wafer. As an example of the substrate processing apparatus, there is a CMP (Chemical Mechanical Polishing) apparatus for performing a polishing process on a substrate.

  The CMP apparatus includes a polishing unit for performing a polishing process on a substrate, a cleaning unit for performing a cleaning process and a drying process on the substrate, and a substrate that is transferred to the polishing unit and cleaned and dried by the cleaning unit. And a load / unload unit for receiving the data. Further, the CMP apparatus includes a transfer mechanism for transferring a substrate in the polishing unit, the cleaning unit, and the load / unload unit. The CMP apparatus sequentially performs various processes of polishing, cleaning, and drying while transporting the substrate by the transport mechanism. As the cleaning unit, there is disclosed one in which a cleaning member is brought into contact with a semiconductor substrate to perform scrub cleaning, and the cleaning member after cleaning is rubbed against a flat surface of a correction member 15 having a rough surface to perform self-cleaning (see Patent Document 1). ).

  Further, the substrate processing apparatus may include a buff processing apparatus. This buff processing apparatus performs at least one of a buff polishing process and a buff cleaning process on a substrate. The buff polishing process is a process in which the wafer and the buff pad are relatively moved while the buff pad is in contact with the wafer, and a slurry is interposed between the wafer and the buff pad to polish and remove the processing surface of the wafer. On the other hand, the buff cleaning process is to move the wafer and the buff pad relative to each other while bringing the buff pad into contact with the wafer, and to interpose a cleaning solution (chemical solution or a chemical solution and pure water) between the wafer and the buff pad. Is a process for removing contaminants on the wafer surface or modifying the processing surface.

  In a buff processing apparatus, a substrate is supported on a buff stage by vacuum suction. An elastic pad is attached to the buff stage in order to improve the suction force, and the elastic pad is treated as a consumable and is regularly replaced. When attaching the elastic pad to the buff stage, it is common for a worker to manually attach the elastic pad having an adhesive surface on the back surface to the buff stage.

JP-A-9-92633

In a vacuum suction stage that supports a substrate by vacuum suction, a vacuum hole connected to a vacuum source is formed on the stage surface. Further, holes are formed in the elastic pad so as to correspond to the vacuum holes. When attaching the elastic pad to the vacuum suction stage, if the position of the vacuum hole of the vacuum suction stage and the hole of the elastic pad do not match, a vacuum cannot be applied to the substrate, and the substrate may be sucked. Can not. However, if the elastic pad and the vacuum suction stage are displaced from each other and the elastic pad is peeled off from the vacuum suction stage, the adhesive force between the elastic pad and the vacuum suction stage decreases even if the elastic pad is repositioned and installed. . For this reason, when installing the elastic pad on the vacuum suction stage, it is necessary to match the positions of the plurality of vacuum holes and the plurality of holes of the elastic pad at the same time as much as possible. Each time, a variation occurs.

  The present invention has been made in view of the above-described problems, and has been made to a jig that enables an elastic pad to be easily installed on a stage surface of a vacuum suction stage, and a vacuum suction stage of an elastic pad using such a jig. One of the objectives is to propose a method of setting up.

According to one embodiment of the present invention, a jig used for installing an elastic pad on a stage surface of a vacuum suction stage is proposed. Here, a vacuum hole configured to be connectable to a vacuum source is formed on the stage surface, and a hole corresponding to the vacuum hole is formed on the elastic pad. The jig has a first convex portion that can be inserted into the vacuum hole of the vacuum suction stage, and a support portion that contacts the stage surface with the first convex portion being inserted into the vacuum hole. A second protrusion protruding to the opposite side to the first protrusion with respect to the support, and being insertable into the hole of the elastic pad.
According to such a jig, the first protrusion can be inserted into the vacuum hole of the vacuum suction stage and the second protrusion can be inserted into the hole of the elastic pad. Positioning can be easily performed.

According to one embodiment of the present invention, an installation method for installing an elastic pad on a stage surface of a vacuum suction stage is proposed. The method comprises the steps of: providing a jig according to one embodiment described above; inserting the first convex portion of the jig into a vacuum hole formed on a stage surface of the vacuum suction stage; Inserting the second convex portion of the jig into a hole corresponding to the vacuum hole in the pad.
According to such an installation method, the positioning of the vacuum suction stage and the elastic pad can be performed, and the elastic pad can be easily installed on the stage surface of the vacuum suction stage.

It is a figure showing the schematic structure of the buff processing device by one embodiment. It is a figure showing an example of a schematic sectional view of a buff processing device. It is a perspective view which expands and shows a buff stage. FIG. 3 is an enlarged view showing a region surrounded by a dashed line in FIG. 2. It is a figure showing an example of an elastic pad. It is sectional drawing which shows an example of the elastic pad before sticking on a buff stage. It is a perspective view showing an example of the lower surface of the jig in this embodiment. It is a perspective view showing an example of the upper surface of the jig in this embodiment. It is a flowchart which shows an example of the installation method of the elastic pad of this embodiment. FIG. 7 is a diagram illustrating an example of a process of arranging a jig on a buff stage It is a figure which shows an example of the process of aligning an elastic pad using a jig. FIG. 4 is a cross-sectional view showing a state in which an elastic pad is positioned on a buff stage by a jig in the present embodiment. It is a figure showing an example of a sticking process of an elastic pad. It is a figure which shows an example of the process which removes a jig and sticks an elastic pad.

An embodiment of a jig according to the present invention and an installation method using the jig will be described below with reference to the accompanying drawings. Hereinafter, for convenience of explanation, first, a buff processing apparatus having a buff stage as an example of a vacuum suction stage will be described, and subsequently, a jig for installing an elastic pad on the buff stage, and using the jig The installation method will be described. In the accompanying drawings, the same or similar elements are denoted by the same or similar reference numerals, and in the description of each embodiment, the repeated description of the same or similar elements may be omitted. The features described in each embodiment can be applied to other embodiments as long as they do not contradict each other.

  FIG. 1 is a diagram illustrating a schematic configuration of a buff processing apparatus according to one embodiment. The buff processing apparatus illustrated in FIG. 1 can be configured as a part of a CMP apparatus that performs a polishing process on a substrate (a processing target) such as a semiconductor wafer or as one unit in the CMP apparatus. As an example, the buff processing apparatus can be incorporated in a CMP apparatus having a polishing unit, a cleaning unit, and a substrate transfer mechanism, for example, a CMP apparatus disclosed in JP-A-2010-504365. The buffing device can be used for finishing after main polishing in a CMP device.

In this specification, the buff processing includes at least one of a buff polishing processing and a buff cleaning processing.
The buff polishing process is a process of relatively moving the substrate and the buff pad while the buff pad is in contact with the substrate, and polishing and removing the processing surface of the substrate by interposing a slurry between the substrate and the buff pad. In the buffing process, when a substrate is cleaned by a physical action using a sponge material (for example, a PVA sponge material), a physical action force stronger than the physical action force applied to the substrate is applied to the substrate. This is a process that can be performed. Therefore, as the buff pad, for example, a pad obtained by laminating a foamed polyurethane and a non-woven fabric, specifically, a commercially available IC1000 (trademark) / SUBA (registered trademark) system or a suede-like porous polyurethane non-fibrous pad, specifically, For example, POLITEX (registered trademark) available on the market can be used. By the buff polishing process, removal of the surface layer portion where damage such as scratches or contaminants adhered, additional removal of parts that could not be removed by main polishing in the main polishing unit, or after main polishing, unevenness of minute regions and the entire substrate Improvement of morphology such as distribution of film thickness can be realized.

  The buff cleaning process is to move the substrate and the buff pad relative to each other while bringing the buff pad into contact with the substrate, and to interpose a cleaning treatment liquid (chemical solution or a chemical solution and pure water) between the substrate and the buff pad. This is a process for removing contaminants on the surface and modifying the treated surface. The buff cleaning process is a process that can apply a stronger physical action force to the substrate than a physical action force applied to the substrate when the substrate is cleaned by a physical action using a sponge material or the like. Therefore, as the buff pad, the above-described IC1000 (trademark) / SUBA (trademark) system, POLITEX (trademark), or the like is used. Further, in the buff processing apparatus of the present invention, it is possible to use a PVA sponge as a buff pad.

  FIG. 1 is a diagram schematically illustrating a configuration of a buff processing apparatus 300 in a state where a wafer Wf (substrate) is mounted according to an embodiment. The buff processing apparatus 300 can perform the above-described buff polishing processing and / or buff cleaning processing. As shown in FIG. 1, a buff processing apparatus 300 according to one embodiment includes a buff stage (vacuum suction stage) 400, a buff head 500, a buff arm 600, a liquid supply system 700, and a conditioning unit 800.

The buff stage (vacuum suction stage) 400 is provided for supporting the wafer Wf by vacuum suction. The buff stage 400 can be rotated around a rotation axis AA by a drive mechanism (not shown). In the present embodiment, the buff stage 400 supports the wafer Wf such that the processing surface of the wafer Wf faces horizontally upward. As will be described in detail later, an elastic pad 450 is attached to the stage surface 402 of the buff stage 400, and the buff stage 400 supports the wafer Wf via the elastic pad 450. However, for the sake of simplicity, in this specification, the support surface 452 of the elastic pad 450 that supports the wafer Wf is also referred to as the “support surface” of the buff stage 400.

  The buff head 500 is provided for performing a buff process on the wafer Wf installed on the buff stage 400. The buff head 500 is configured to be able to move up and down with respect to the buff stage 400. A buff pad 502 is attached to a surface of the buff head 500 facing the wafer Wf. The buff pad 502 is pressed against the wafer Wf held on the stage surface 402 of the buff stage 400 as the buff head 500 descends.

  In the illustrated embodiment, the buff pad 502 has a size smaller than the diameter of the buff stage 400 and the wafer Wf to be buffed. By performing buffing using a buff pad smaller in size than the wafer Wf to be buffed, flattening unevenness locally generated on the wafer Wf, buffing only a specific portion of the wafer Wf, polishing the wafer It becomes easy to adjust the amount of polishing according to the position of Wf. However, the buff head 500 is not limited to such an example, and a cleaning brush or a sponge material may be used.

  The buff arm 600 holds the buff head 500. The buff arm 600 can rotate the buff head 500 around the rotation axis BB and swing the buff head 500 in the radial direction of the wafer Wf as shown by an arrow CC. Also, as shown in FIG. 2, the buff arm 600 can move the buff head 500 to a position where the buff pad 502 faces the conditioning unit 800.

  The liquid supply system 700 is provided to supply various processing liquids to the processing surface of the wafer Wf or the buff stage 400 (elastic pad 450). In the present embodiment, the liquid supply system 700 includes a pure water nozzle 710 for supplying pure water (DIW) and a chemical liquid nozzle 720 for supplying a chemical solution (Chemi). The pure water nozzle 710 is connected to a pure water supply source 714 via a pure water pipe 712. The pure water pipe 712 is provided with an on-off valve 716 that can open and close the pure water pipe 712. The chemical liquid nozzle 720 is connected to a chemical liquid supply source 724 via a chemical liquid pipe 722. The chemical liquid pipe 722 is provided with an on-off valve 726 that can open and close the chemical liquid pipe 722.

  The buff processing apparatus 300 according to the embodiment of FIG. 1 can selectively supply pure water, chemical solution, or slurry to the processing surface of the wafer Wf or the support surface of the buff stage 400 via the buff arm 600, the buff head 500, and the buff pad 502. It has become.

  That is, the branch pure water pipe 712 a branches from the pure water supply source 714 and the on-off valve 716 in the pure water pipe 712. In addition, a branch chemical solution pipe 722a branches from the chemical solution supply source 724 and the on-off valve 726 in the chemical solution pipe 722. The branch pure water pipe 712a, the branch chemical liquid pipe 722a, and the slurry pipe 732 connected to the slurry supply source 734 join the liquid supply pipe 740. The branch pure water pipe 712a is provided with an on-off valve 718 that can open and close the branch pure water pipe 712a. The branch chemical solution pipe 722a is provided with an on-off valve 728 that can open and close the branch chemical solution pipe 722a. The slurry pipe 732 is provided with an on-off valve 736 that can open and close the slurry pipe 732.

The first end of the liquid supply pipe 740 is connected to three lines of a branch pure water pipe 712a, a branch chemical liquid pipe 722a, and a slurry pipe 732. The liquid supply pipe 740 extends through the inside of the buff arm 600, the center of the buff head 500, and the center of the buff pad 502. The second end of the liquid supply pipe 740 opens toward the processing surface of the wafer Wf or the support surface of the buff stage 400 for supporting the wafer Wf. The control device (not shown) controls the opening and closing of the on-off valve 718, the on-off valve 728, and the on-off valve 736 to support the processing target surface of the wafer Wf or the wafer Wf of the buff stage 400 at an arbitrary timing. Any one of pure water, a chemical solution, and a slurry, or a mixed solution of any combination thereof can be supplied to the supporting surface of the substrate.

  The buff processing apparatus 300 according to the illustrated embodiment supplies the processing liquid to the wafer Wf via the liquid supply pipe 740, rotates the buff stage 400 around the rotation axis AA, and presses the buff pad 502 against the processing surface of the wafer Wf. By swinging the buff pad 502 in the direction of the arrow CC while rotating the buff pad 502 about the rotation axis BB, the buffing process can be performed on the wafer Wf.

  In such a buff processing apparatus 300, while the wafer Wf is supported by the buff stage 400, the processing liquid is supplied to the wafer Wf by the liquid supply system 700, and the buff stage 400 is rotated around the rotation axis AA. Further, the buff processing apparatus 300 can perform the buff processing on the wafer Wf by pressing the buff pad 502 against the processing surface of the wafer Wf and swinging the buff pad 502 around the rotation axis BB in the direction of arrow CC. it can.

  The conditioning unit 800 is provided for conditioning the surface of the buff pad 502. The conditioning unit 800 includes a dress table 810 and a dresser 820 installed on the dress table 810. The dress table 810 can be rotated around the rotation axis DD by a drive mechanism (not shown). Dresser 820 is formed of a diamond dresser, a brush dresser, or a combination thereof.

  When conditioning the buff pad 502, the buff processing apparatus 300 rotates the buff arm 600 until the buff pad 502 is at a position facing the dresser 820 (see FIG. 2). The buff processing apparatus 300 performs conditioning of the buff pad 502 by rotating the dress table 810 around the rotation axis DD and rotating the buff head 500 and pressing the buff pad 502 against the dresser 820.

  When there is no wafer Wf on the buff stage 400, the buff stage 400 may be cleaned. In cleaning the buff stage 400, a chemical solution is sprayed from the chemical solution nozzle 720 on the support surface 452 to clean the support surface 452. By using a chemical solution, abrasive grains and polishing products adhered to the support surface 452 can be more effectively cleaned. Thereafter, pure water is supplied to the support surface 452 from the pure water nozzle 710, and the support surface 452 is further cleaned.

Subsequently, the buff stage 400 provided for vacuum-sucking the wafer Wf will be described in more detail. FIG. 2 is a diagram illustrating an example of a schematic cross-sectional view of a buff processing apparatus, and FIG. 3 is a perspective view illustrating a buff stage in an enlarged manner. As shown in FIGS. 2 and 3, a plurality of first openings (vacuum holes) 404 for vacuum-adsorbing the wafer Wf to the stage surface 402 are formed on the stage surface 402 of the buff stage 400. Further, the buff stage 400 includes a first fluid passage 410 extending to the first opening 404 inside the buff stage 400. First fluid passage 410 is connected to a vacuum source 746. Further, the first fluid passage 410 is connected to a pure water supply source 714 and a nitrogen source 744 that can be used when the wafer Wf is detached from the stage surface 402. Further, the first fluid passage 410 may include an atmosphere release valve (not shown) that opens the inside of the first fluid passage 410 to the atmosphere. For example, when the wafer Wf is desorbed, the vacuum in the first fluid passage 410 is released, pure water is supplied to the first fluid passage 410 for a predetermined time, and then nitrogen is supplied for a predetermined time. it can. Opening / closing valves 750, 754, and 756 are provided in a pipe for supplying pure water and nitrogen gas to the first fluid passage 410 of the buff stage 400 and a pipe for evacuating the first fluid passage 410, respectively. By controlling the opening and closing of the on-off valves 750, 754, 756 using a control device (not shown), pure water and nitrogen gas can be supplied to the support surface through the first fluid passage 410 of the buff stage 400 at an arbitrary timing. The first fluid passage 410 can be evacuated at an arbitrary timing.

  Further, as shown in FIG. 2, the buff stage 400 has, as a transfer mechanism, lift pins 480 for receiving the wafer Wf transferred by a transfer robot (not shown) and mounting the wafer Wf of the buff stage 400. A plurality (for example, four) of the lift pins 480 are arranged along the outer periphery of the buff stage 400, and the lift pins 480 expand and contract by a mechanism (not shown). The lift pins 480 support and receive the outer peripheral portion of the wafer Wf in a state where the lift pins 480 protrude, and thereafter, the lift pins 480 recede to place the wafer Wf on the support surface of the buff stage 400. After the buffing is completed, the lift pins 480 protrude to support and lift the outer peripheral portion of the wafer Wf, and the transfer robot scoops up the wafer Wf from below.

  As shown in FIG. 3, a concave portion 426 is formed on the periphery of the buff stage 400. The recess 426 is provided corresponding to the lift pin 480, and the lift pin 480 expands and contracts along the recess 426. Further, a groove 424 is formed along the periphery of the stage surface 402 at the periphery of the buff stage 400. In other words, the groove 424 at least partially surrounds the region where the first opening 404 is arranged. In the present embodiment, the groove 424 is formed along the periphery of the stage surface 402 except for the vicinity of the concave portion 426.

  FIG. 4 is an enlarged view of a region surrounded by a chain line in FIG. As described above, in the present embodiment, the first fluid passage 410 is connected to the plurality of first openings 404 of the buff stage 400. The first fluid passage 410 basically extends perpendicular to the stage surface 402 and is connected to the first opening 404 (see FIG. 2). On the other hand, in the present embodiment, as shown in FIG. 4, the fastener 412 is located below the outermost first opening 404 (404a) of the plurality of first openings 404. . Therefore, the first fluid passage 410 connected to the outermost first opening 404a is inclined with respect to the stage surface 402 (omitted in FIG. 2). Further, as shown in FIG. 4, a second opening 425 (omitted in FIGS. 2 and 3) is formed near the outer periphery of the buff stage 400. The second opening 425 is formed in the groove 424, and is opened to the outside of the buff stage 400 via the second fluid passage 420. That is, the groove 424 connects the plurality of second openings 425 on the stage surface 402. The groove 424 and the second opening 425 make it possible to prevent the processing liquid from being sucked between the wafer Wf and the support surface of the buff stage 400.

  Further, as shown in FIG. 3 in particular, an elastic pad 450 is attached to the stage surface 402 of the buff stage 400, and the buff stage 400 supports the wafer Wf via the elastic pad 450. The elastic pad 450 attached to the buff stage 400 can be formed, for example, from foamed polyurethane having elasticity. The elastic pad 450 serves as a cushioning material between the buff stage 400 and the wafer Wf to prevent the wafer Wf from being damaged and to reduce the influence of the surface irregularities of the buff stage 400 on the buffing process. it can. The elastic pad 450 is attached to the stage surface 402 of the buff stage 400 by an adhesive layer 458 (see FIGS. 4 and 6) provided on one surface. As the elastic pad 450, a pad provided with a hole (through hole) 454 at a position corresponding to the first opening 404 of the buff stage 400 can be used (see FIG. 3).

FIG. 5 is a diagram illustrating an example of the elastic pad. The elastic pad 450 has a plurality of holes 454 corresponding to the plurality of first openings 404 formed on the stage surface 402 of the buff stage 400. The elastic pad 450 has a notch 476 corresponding to the recess 426 formed in the buff stage 400 and a groove 474 corresponding to the groove 424 formed in the buff stage 400. I have. Here, each of the plurality of holes 454, notches 476, and grooves 474 formed in the elastic pad 450 is formed by the plurality of first openings 404, recesses 426, and grooves 424 formed in the buff stage 400. The dimensions are preferably slightly larger than each. By doing so, it is possible to allow a margin for the alignment between the elastic pad 450 and the buff stage 400. Thus, when the elastic pad 450 is attached to the buff stage 400, it is possible to prevent the opening formed in the buff stage 400 from being closed by the elastic pad 450.

  FIG. 6 is a cross-sectional view illustrating an example of the elastic pad before being attached to the buff stage. In the present embodiment, an adhesive layer 458 is provided on one surface of the elastic pad 450, and a separate film 460 is attached to the one surface for easy carrying. The separate film 460 can be peeled off from the adhesive layer 458, and is peeled off from the elastic pad 450 when the elastic pad 450 is installed on the buff stage 400. In addition, a protective sheet 470 formed of a material (for example, PET or the like) having lower elasticity than the elastic pad 450 is attached to the surface of the elastic pad 450 opposite to the surface on which the adhesive layer 458 is provided. I have. The protection sheet 470 protects the elastic pad 450 when the elastic pad 450 is carried and installed, and is separated from the elastic pad 450 after being installed on the buff stage 400. In the present embodiment, openings are formed in the separate film 460 and the protective sheet 470 in the same manner as the plurality of openings (holes 454, cutouts 476, and grooves 474) of the elastic pad 450 (not shown). . Such a protective sheet 470 can suppress expansion and contraction of the elastic pad 450 when the elastic pad 450 is installed on the buff stage 400, as described later, and facilitate alignment of the elastic pad 450 and the buff stage 400. can do. However, the present invention is not limited to such an example, and at least one of the separate film 460 and the protective sheet 470 may not have an opening. Further, the protective sheet 470 may not be attached to the elastic pad 450.

  Next, a jig used to install the elastic pad 450 on the buff stage 400 will be described. FIG. 7 is a perspective view showing an example of the lower surface of the jig in the present embodiment, and FIG. 8 is a perspective view showing an example of the upper surface of the jig in the present embodiment. As shown in the drawing, the jig 40 of the present embodiment includes a plate-shaped portion 41 having a lower surface 42 (see FIG. 7) and an upper surface 45 (see FIG. 8). It has a provided shape. Such a jig 40 can be formed, for example, by injection molding a synthetic resin such as PVC (polyvinyl chloride). However, the invention is not limited to such an example, and the jig 40 may be formed of a metal such as aluminum.

  The lower surface 42 of the jig 40 has at least one (two in the example of FIG. 7) first protrusion 43 and a third protrusion 44. The first protrusion 43 has a size slightly smaller than the diameter of the plurality of first openings 404 of the buff stage 400. When there are a plurality of first protrusions 43, the positions of the plurality of first protrusions 43 are provided so as to correspond to the positions of the plurality of first openings 404. That is, the first protrusion 43 of the jig 40 can be inserted into the first opening 404 of the buff stage 400. Further, the third convex portion 44 is configured to correspond to the concave portion 426 formed on the peripheral portion of the buff stage 400. Then, by aligning the third convex portion 44 with the concave portion 426 of the buff stage 400 and inserting the first convex portion 43 into the first opening 404 of the buff stage 400, the lower surface 42 of the jig 40 is moved to the buff stage. The jig 40 comes into contact with the stage surface 402 of the buff stage 400 and is set on the buff stage 400. Here, in the present embodiment, the lower surface 42 that comes into contact with the stage surface 402 with the first protrusion 43 inserted into the first opening 404 constitutes a “supporting portion”.

In the present embodiment, when the third convex portion 44 is aligned with the concave portion 426 of the buff stage 400, the first convex portion 43 forms the second first opening portion 404 (from the outer peripheral side of the buff stage 400). 404b). As described above, in the present embodiment, the first fluid passage 410 is inclined at the outermost first opening 404a of the buff stage 400 (see FIG. 4), and it is difficult to fit the jig 40. For this reason, in the present embodiment, the jig 40 is configured to use the second first opening 404b from the outer peripheral side. However, the present invention is not limited to such an example, and the first convex portion 43 of the jig 40 may be provided so as to correspond to the outermost first opening 404.

  The upper surface 45 of the jig 40 has at least one (two in the example of FIG. 8) second convex portion 46 and a fourth convex portion 47. The second convex portion 46 protrudes on the side opposite to the first convex portion 43, and is preferably provided at a position corresponding to the first convex portion 43 in the plate-shaped portion 41. However, the present invention is not limited to such an example, and the number of the second convex portions 46 may be different from the number of the first convex portions 43, or may be provided at a position different from the first convex portions 43 not corresponding to the first convex portions 43. It may be provided. The second convex portion 46 has a tapered shape in which the distal end portion 46a has a size smaller than the hole 454 of the elastic pad 450 and the diameter increases as the distance from the distal end portion 46a increases. In the present embodiment, the base 46 b of the second convex portion 46 has a size larger than the hole 454 of the elastic pad 450. Further, when there are a plurality of second protrusions 46, the positions of the plurality of second protrusions 46 are provided so as to correspond to the positions of the plurality of holes 454 of the elastic pad 450. At least a part of the second convex portion 46 of the jig 40 can be inserted into the hole 454 of the elastic pad 450. Further, the fourth convex portion 47 is configured to correspond to the notch 476 formed in the peripheral portion of the elastic pad 450. The jig 40 and the elastic pad 450 are attached by aligning the fourth convex portion 47 with the notch 476 of the elastic pad 450 and inserting the second convex portion 46 into the hole 454 of the elastic pad 450. Done.

  Next, a method of installing the elastic pad 450 using the jig 40 will be described. FIG. 9 is a flowchart illustrating an example of an elastic pad installation method according to the present embodiment. When installing the elastic pad 450 on the buff stage 400, first, the elastic pad 450 and the jig 40 are prepared (S10). Now, as the elastic pad 450, an elastic pad as shown in FIG. 6 described above, in which the separate film 460 is attached to the surface having the adhesive layer 458 and the protective sheet 470 is attached to the opposite surface, is prepared. Shall be. Further, it is assumed that openings are formed in the separate film 460 and the protection sheet 470 in the same manner as the openings (holes 454, notches 476, and grooves 474) of the elastic pad 450. Further, it is assumed that the jig 40 as shown in FIGS. 7 and 8 is prepared. In this embodiment, two jigs 40 are used, but the present invention is not limited to such an example.

  Subsequently, the prepared jig 40 is placed on the buff stage 400 (S12). FIG. 10 is a diagram illustrating an example of a process of arranging the jig 40 on the buff stage 400. As shown in FIG. 10, the first protrusion 43 of the jig 40 is inserted into the first opening 404 of the buff stage 400 (the second opening 404b from the outer peripheral side), and the lower surface 42 of the jig 40 ( The jig 40 can be installed on the buff stage 400 by bringing the support portion) into contact with the stage surface 402. In the present embodiment, the jig 40 is formed with the third convex portion 44 corresponding to the concave portion 426 on the peripheral edge of the buff stage 400. For this reason, the worker aligns the third convex portion 44 of the jig 40 with the concave portion 426 of the buff stage 400, and arranges the jig 40 on the buff stage 400, which causes a variation in the installation method for each worker. Can be suppressed. In the example shown in FIG. 10, two jigs 40 are arranged on the peripheral edge of the buff stage 400 separated by 90 °. However, the present invention is not limited to such an example. Should just be arranged.

Next, a part of the separate film 460 is removed from the elastic pad 450 (S14), and the position of the elastic pad 450 is adjusted using the jig 40 on the buff stage 400 (S16). FIG. 11 is a diagram illustrating an example of a process of performing the alignment of the elastic pad 450 using the jig 40. In FIG. 11, the area of the elastic pad 450 from which the separate film 460 is removed is hatched. In the example shown in FIG. 11, as a partial region (first region) of the elastic pad 450, the separate film 460 in a half region of the whole is removed. Then, in a region where the separate film 460 is not removed, the second protrusion 46 of the jig 40 and the hole 454 of the elastic pad 450 (the second hole 454 b from the outer peripheral side in this embodiment) and the notch 476 are provided. The elastic pad 450 is positioned so that the fourth protrusion 47 is inserted. In the present embodiment, an opening is formed in the separate film 460 and the protective sheet 470 attached to the elastic pad 450, similarly to the elastic pad 450. Therefore, the elastic pad 450 can be positioned on the buff stage 400 using the jig 40 with the separate film 460 and the protection sheet 470 attached.

  FIG. 12 is a cross-sectional view showing a state in which the elastic pad 450 is positioned on the buff stage 400 by the jig 40 in the present embodiment. Since the tip portion 46 a of the jig 40 of the present embodiment has a thin tapered shape, it is easy to insert the second protrusion 46 into the hole 454 of the elastic pad 450. it can. Further, in the present embodiment, since the base 46b of the second convex portion 46 is larger than the hole 454 of the elastic pad 450, the upper surface 45 of the jig 40 does not contact the elastic pad 450, and the elastic pad 450 is Can be supported. Thus, the operation of lifting the elastic pad 450 from the jig 40 and the buff stage 400 can be easily performed. In the present embodiment, the alignment is performed with the separate film 460 attached to the elastic pad 450. However, the alignment of the elastic pad 450 is performed using the jig 40 with the separate film 460 removed. May be. Even in such a case, according to the jig 40 of the present embodiment, the position of the elastic pad 450 can be adjusted without bringing the upper surface 45 of the jig 40 into contact with the adhesive layer 458 of the elastic pad 450. In the flowchart shown in FIG. 9, after the separation film 460 is removed from the first region of the elastic pad 450, the positioning of the elastic pad 450 is performed using the jig 40. However, the present invention is not limited to such an example. After the alignment of the elastic pad 450 using the jig 40, the separate film 460 may be removed from at least a part of the area of the elastic pad 450.

  Subsequently, a partial area of the elastic pad 450 is attached to the buff stage 400 (S18). FIG. 13 is a diagram illustrating an example of a step of attaching the elastic pad 450. Now, since the position of the elastic pad 450 and the buff stage 400 is adjusted by the jig 40, the elastic pad 450 and the buff stage 400 can be attached in a state where they are aligned. In the present embodiment, an elastic pad is used in a part of the area (the area hatched by hatching in the figure) from which the separate film 460 is removed (the area hatched by hatching in the figure). 450 is attached to the buff stage 400. As an example, the area between the elastic pad 450 and the stage surface 402 in one third of the entire area is set so that the area less than a predetermined distance from the area where the separate film 460 is left is not attached to the buff stage 400. It is preferable to perform the attachment. This makes it easy to separate the remaining separate film 460 from the elastic pad 450. In the example shown in FIG. 13, the air between the elastic pad 450 and the stage surface 402 is evacuated by pressing the elastic pad 450 using the second jig 50 having a flat bottom surface. It is preferable that air be removed by the jig 50 by pressing the elastic pad 450 from the end to the center of the elastic pad 450 as indicated by a thick arrow in FIG. Here, as described above, a protective sheet 470 having lower elasticity than the elastic pad 450 is attached to the elastic pad 450 of the present embodiment. Therefore, when the elastic pad 450 is attached to the buff stage 400, it is possible to prevent the elastic pad 450 from expanding and contracting to shift the position of the hole 454 and the first opening 404 of the buff stage 400.

  After a part of the elastic pad 450 is attached to the buff stage 400, the jig 40 is removed from the buff stage 400 and the elastic pad 450 (S22), and the rest of the elastic pad 450 is attached to the buff stage 400 (S24). FIG. 14 is a diagram illustrating an example of a process of removing the jig and attaching the elastic pad. The jig 40 may be removed while the elastic pad 450 is being bent. Since a part of the elastic pad 450 is already attached to the buff stage 400 in a state where the elastic pad 450 and the buff stage 400 are already aligned, even if the jig 40 is removed, the elastic pad 450 and the buff stage 400 are removed. And maintain the aligned state. Then, by attaching the remaining area of the elastic pad 450 to the buff stage 400, the elastic pad 450 can be easily attached to the buff stage 400. At this time, as shown in FIG. 14, it is preferable to evacuate the air between the elastic pad 450 and the stage surface 402 by pressing the elastic pad 450 using the second jig 50 having a flat bottom surface. . Since the protective sheet 470 is attached to the elastic pad 450, similarly to S18, the position of the hole 454 of the elastic pad 450 and the first opening 404 of the buff stage 400 are prevented from being shifted in the air bleeding step. it can. Then, by removing the protection sheet 470 from the elastic pad 450 (S26), the installation of the elastic pad 450 using the jig 40 is completed.

  The jig 40 of the present embodiment described above includes a first convex portion 43 that can be inserted into the first opening 404 of the buff stage 400, and a stage in which the first convex portion 43 is inserted into the first opening 404. It has a lower surface 42 in contact with the surface 402 and a second convex portion 46 protruding on the side opposite to the first convex portion 43 and insertable into the hole 454 of the elastic pad 450. According to such a jig 40, by inserting the first protrusion 43 of the jig 40 into the first opening 404 of the buff stage 400 and inserting the second protrusion 46 into the hole 454 of the elastic pad 450, The positioning between the buff stage 400 and the elastic pad 450 can be easily performed.

  The jig 40 of the embodiment described above has two first convex portions 43, but is not limited to such an example, and may have one or three or more first convex portions 43. . Further, the jig 40 has the third convex portion 44 corresponding to the concave portion 426 of the buff stage 400, but is not limited to such an example, and may not have the third convex portion 44, for example. Further, the jig 40 has two second convex portions 46, but is not limited to such an example, and may have one or three or more second convex portions 46. Further, the second protrusion 46 has a tapered shape in which the base 46 b is larger than the hole 454 of the elastic pad 450. However, the present invention is not limited to this example. It may be present or may not be tapered. Furthermore, the jig 40 has the fourth convex portion 47 corresponding to the notch 476 of the elastic pad 450, but is not limited to such an example, and may not have the fourth convex portion 47, for example.

The present invention can also be described as the following forms.
[Mode 1] According to Mode 1, a jig used for installing an elastic pad on a stage surface of a vacuum suction stage is proposed, and a vacuum hole configured to be connectable to a vacuum source is provided on the stage surface. A hole corresponding to the vacuum hole is formed in the elastic pad; and the jig includes a first convex portion that can be inserted into the vacuum hole of the vacuum suction stage; A supporting portion that is in contact with the stage surface in a state where the convex portion is inserted into the vacuum hole, and a second portion that protrudes on the opposite side to the first convex portion with respect to the supporting portion and that can be inserted into the hole of the elastic pad. And two convex portions. According to the first aspect, the first convex portion can be inserted into the vacuum hole of the vacuum suction stage and the second convex portion can be inserted into the hole of the elastic pad. The alignment can be easily performed.

[Mode 2] According to Mode 2, in the jig of Mode 1, a concave portion is formed in a peripheral portion of the vacuum suction stage, and the jig further includes a third convex portion corresponding to the concave portion. Prepare. According to the second aspect, it is possible to fit the third convex portion of the jig to the peripheral portion of the vacuum suction stage, and it is possible to suppress a variation in mounting of the vacuum suction stage and the elastic pad by an operator.

[Mode 3] According to Mode 3, in the jig of Mode 1 or 2, the jig has two or more of the first convex portion and the second convex portion. According to the third aspect, the positioning between the vacuum suction stage and the elastic pad can be performed more accurately.

[Embodiment 4] According to Embodiment 4, in the jigs of Embodiments 1 to 3, the second convex portion has a tapered shape that becomes larger as the distance from the distal end portion increases. According to the fourth aspect, the second convex portion of the jig can be easily inserted into the hole of the elastic pad.

[Mode 5] According to Mode 5, in the jig of Mode 4, the second convex portion has the tapered shape that increases to a size larger than the hole of the elastic pad. According to the fourth aspect, a gap is formed between the elastic pad and the vacuum suction stage by the jig, and the position of the elastic pad and the vacuum suction stage is set in a state where the bonding surface of the elastic pad does not contact the bonding surface of the vacuum suction stage. Matching can be performed.

[Embodiment 6] According to Embodiment 6, an installation method of installing an elastic pad on the stage surface of a vacuum suction stage is proposed. The setting method includes: preparing a jig of the first to fifth aspects; inserting the first convex portion of the jig into a vacuum hole formed on a stage surface of the vacuum suction stage; Inserting the second convex portion of the jig into a hole corresponding to the vacuum hole in the pad. According to the sixth aspect, the positioning of the vacuum suction stage and the elastic pad can be performed, and the elastic pad can be easily installed on the stage surface of the vacuum suction stage.

[Mode 7] According to Mode 7, in the installation method of Mode 6, one surface of the elastic pad is an adhesive surface, and a separate film is attached to the adhesive surface. Removing the separate film from a first area, which is a partial area of the bonding surface and does not include a hole into which the second convex portion of the jig is inserted; and Adhering at least a part of one region to the stage surface of the vacuum suction stage. According to the seventh aspect, at least a part of the first region of the elastic pad can be bonded to the vacuum suction stage in a state where the elastic pad and the vacuum suction stage are positioned by the jig.

[Mode 8] According to Mode 8, in the installation method of Mode 6 or 7, the method further includes the step of pressing the elastic pad to release air between the elastic pad and the vacuum suction stage. According to the eighth aspect, it is possible to suppress the air from remaining between the vacuum suction stage and the elastic pad.

[Mode 9] According to Mode 9, in the installation method according to Modes 6 to 8, further comprising the step of preparing the elastic pad having at least one surface to which a protective sheet having lower elasticity than the elastic pad is attached. . According to the ninth aspect, it is possible to prevent the elastic pad from expanding and contracting when the elastic pad is installed.

Although the embodiments of the present invention have been described above, the embodiments of the present invention described above are intended to facilitate understanding of the present invention, and do not limit the present invention. The present invention can be changed and improved without departing from the spirit thereof, and it is needless to say that the present invention includes equivalents thereof. In addition, any combination of the embodiments and the modifications is possible within a range in which at least a part of the above-described problem can be solved, or a range in which at least a part of the effects is achieved, and described in the claims and the description. Arbitrary combinations of the components described above or omissions are possible.

Reference numeral 40: jig 41: plate-like portion 42: lower surface 43: first convex portion 44: third convex portion 45: upper surface 46: second convex portion 46a: distal end portion 46b: base portion 47: fourth convex portion 50: second Jig 300 buffing device 400 buff stage 402 stage surface 404 first opening 424 groove 426 recess 450 elastic pad 452 support surface 454 hole 458 adhesive layer 460 separate film 470 protection Sheet 474: Groove 476: Notch 500: Buff head 600: Buff arm 700: Liquid supply system 800: Conditioning unit

Claims (9)

A jig used to install an elastic pad on the stage surface of the vacuum suction stage,
A vacuum hole configured to be connectable to a vacuum source is formed on the stage surface,
A hole corresponding to the vacuum hole is formed in the elastic pad,
The jig is
A first protrusion that can be inserted into the vacuum hole of the vacuum suction stage;
A support portion that contacts the stage surface in a state where the first convex portion is inserted into the vacuum hole;
A second protrusion protruding on the opposite side to the first protrusion with respect to the support portion and being insertable into the hole of the elastic pad;
A jig. At the periphery of the vacuum suction stage, a concave portion is formed,
The jig according to claim 1, wherein the jig further includes a third convex portion corresponding to the concave portion.   The jig according to claim 1, wherein the jig has two or more of the first convex portion and the second convex portion.   4. The jig according to claim 1, wherein the second convex portion has a tapered shape that becomes larger as the distance from the distal end portion increases. 5.   The jig according to claim 4, wherein the second convex portion has the tapered shape that increases to a size larger than a hole of the elastic pad. An installation method of installing an elastic pad on a stage surface of a vacuum suction stage,
Preparing a jig according to any one of claims 1 to 5,
Inserting the first convex portion of the jig into a vacuum hole formed on a stage surface of the vacuum suction stage;
Inserting the second convex portion of the jig into a hole corresponding to the vacuum hole in the elastic pad;
Installation method including. One surface of the elastic pad is an adhesive surface, and a separate film is attached to the adhesive surface,
The installation method,
Removing the separate film from a first region which is a partial region of the bonding surface and does not include a hole into which the second convex portion of the jig is inserted;
Adhering at least a part of the first region on the adhesion surface to the stage surface of the vacuum suction stage;
The installation method according to claim 6, further comprising:   8. The installation method according to claim 6, further comprising a step of pressing the elastic pad to release air between the elastic pad and the vacuum suction stage. The installation method according to any one of claims 6 to 8, further comprising a step of preparing the elastic pad to which a protective sheet having lower elasticity than the elastic pad is attached to at least one surface.

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