JP2019530505A - 血管内撮像デバイス用のフレキシブルフェーズドアレイトランスデューサ並びに関連のデバイス、システム及び方法 - Google Patents
血管内撮像デバイス用のフレキシブルフェーズドアレイトランスデューサ並びに関連のデバイス、システム及び方法 Download PDFInfo
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Abstract
Description
Claims (20)
- 複数の超音波材料層間に交互パターンで配置される複数の犠牲材料層を有する積層構造を形成するステップと、
それぞれが前記複数の超音波材料層によって画定される超音波素子のアレイ及び前記複数の犠牲材料層によって画定されるスペーサを含む複数の伸長ストリップを形成するように、前記積層構造をダイシングするステップと、
前記複数の伸長ストリップのうちの第1の伸長ストリップを、フレキシブル回路基板に結合するステップと、
前記フレキシブル回路基板から前記第1の伸長ストリップの前記スペーサを除去するステップと、
を含む、血管内撮像デバイスを製造する方法。 - 前記積層構造をダイシングするステップは、第1の平面に沿って前記積層構造をダイシングするステップを含む、請求項1に記載の方法。
- 前記積層構造をダイシングするステップは、前記第1の平面に垂直な第2の平面に沿って前記積層構造をダイシングするステップを含む、請求項2に記載の方法。
- 前記ダイシング後、前記第1の平面に沿って前記積層構造全体に追加の犠牲層を形成するステップを更に含む、請求項2に記載の方法。
- 前記フレキシブル回路基板から前記第1の伸長ストリップの前記スペーサを除去するステップは、前記スペーサを画定する前記複数の犠牲材料層をエッチング除去するステップを含む、請求項1に記載の方法。
- ポスト犠牲材料層が前記複数の伸長ストリップの前記第1の伸長ストリップ及び第2の伸長ストリップを一緒に保持することによって、複合ストリップを形成するステップと、
前記第1の伸長ストリップ及び前記第2の伸長ストリップが、前記フレキシブル回路基板に結合されるように、前記複合ストリップを前記フレキシブル回路基板に結合するステップと、
前記フレキシブル回路基板から前記複合ストリップの前記ポスト犠牲材料層及び前記第2の伸長ストリップのスペーサを除去するステップと、
を更に含む、請求項1に記載の方法。 - 前記フレキシブル回路基板を支持部材の周りに巻き付けるステップと、
前記フレキシブル回路基板を前記支持部材にしっかりと固定するステップと、
前記支持部材を血管内デバイスの遠位部に結合するステップと、
を更に含む、請求項1に記載の方法。 - 犠牲材料でできた基板に複数の凹部を形成するステップと、
前記基板の前記複数の凹部の少なくとも一部を、超音波材料で充填するステップと、
前記超音波材料によって画定される超音波素子のアレイ及び前記犠牲材料によって画定されるスペーサを含む伸長ストリップを形成するように、前記基板をダイシングするステップと、
前記伸長ストリップをフレキシブル回路基板に結合するステップと、
前記フレキシブル回路基板から前記伸長ストリップの前記スペーサを除去するステップと、
を含む、血管内撮像デバイスを製造する方法。 - 前記基板をダイシングするステップは、前記伸長ストリップが、第2の超音波素子のアレイから離間された第1の超音波素子のアレイを含むように、前記基板をダイシングするステップを含む、請求項8に記載の方法。
- 前記第1の超音波素子のアレイの超音波素子は、前記第2の超音波素子のアレイの超音波素子と整列する、請求項9に記載の方法。
- 前記基板に前記複数の凹部を形成するステップは、第2の一連の凹部と整列する第1の一連の凹部を形成するステップを含む、請求項10に記載の方法。
- 前記第1の超音波素子のアレイの超音波素子は、前記第2の超音波素子のアレイの超音波素子に対してオフセットされている、請求項9に記載の方法。
- 前記基板に前記複数の凹部を形成するステップは、第1の一連の凹部を、第2の一連の凹部に対してオフセットさせて形成するステップを含む、請求項12に記載の方法。
- 前記フレキシブル回路基板から前記伸長ストリップの前記スペーサを除去するステップは、前記スペーサを画定する前記犠牲材料をエッチング除去するステップを含む、請求項8に記載の方法。
- 近位部及び遠位部を有するフレキシブル伸長部材と、
前記フレキシブル伸長部材の前記遠位部に結合される血管内撮像アセンブリと、
を含む、血管内撮像デバイスであって、
前記血管内撮像アセンブリは、
フレキシブル回路と、
前記フレキシブル回路上に配置される超音波トランスデューサアレイと、
を含み、
前記超音波トランスデューサアレイは、最小の所定信号分解能の血管内画像の作成を容易にするように、10マイクロメートル未満のピッチ幅だけ離間された複数の超音波素子を含む、血管内撮像デバイス。 - 前記超音波トランスデューサアレイは、単一のアレイで構成される、請求項15に記載の血管内撮像デバイス。
- 前記超音波トランスデューサアレイは、第2の超音波素子のアレイから離間された第1の超音波素子のアレイを含む、請求項15に記載の血管内撮像デバイス。
- 前記第1の超音波素子のアレイの超音波素子は、前記第2の超音波素子のアレイの超音波素子と整列する、請求項17に記載の血管内撮像デバイス。
- 前記第1の超音波素子のアレイの超音波素子は、前記第2の超音波素子のアレイの超音波素子に対してオフセットされている、請求項17に記載の血管内撮像デバイス。
- 前記複数の超音波素子間の前記ピッチ幅は、前記複数の超音波素子間に配置される犠牲材料の除去によって画定されている、請求項15に記載の血管内撮像デバイス。
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Application Number | Priority Date | Filing Date | Title |
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US201662401409P | 2016-09-29 | 2016-09-29 | |
US62/401,409 | 2016-09-29 | ||
PCT/EP2017/074158 WO2018060109A1 (en) | 2016-09-29 | 2017-09-25 | Flexible phased array transducer for intravascular imaging device and associated devices, systems, and methods |
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JP2019530505A true JP2019530505A (ja) | 2019-10-24 |
JP2019530505A5 JP2019530505A5 (ja) | 2020-11-12 |
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US (1) | US11497470B2 (ja) |
EP (1) | EP3519110A1 (ja) |
JP (1) | JP2019530505A (ja) |
WO (1) | WO2018060109A1 (ja) |
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JPH0213099A (ja) * | 1988-06-30 | 1990-01-17 | Toshiba Corp | アレイ型超音波探触子の製造方法 |
JPH10315472A (ja) * | 1997-05-23 | 1998-12-02 | Tec Corp | インクジェットプリンタヘッド及びその製造方法 |
JPH11501245A (ja) * | 1995-12-26 | 1999-02-02 | エンドーソニックス・コーポレイション | 柔軟な基板を有する高分解能血管内超音波変換器装置 |
JPH11274592A (ja) * | 1998-03-19 | 1999-10-08 | Olympus Optical Co Ltd | 圧電セラミクス構造体製造方法及び複合圧電振動子 |
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US5359760A (en) | 1993-04-16 | 1994-11-01 | The Curators Of The University Of Missouri On Behalf Of The University Of Missouri-Rolla | Method of manufacture of multiple-element piezoelectric transducer |
DE69516444T2 (de) | 1994-03-11 | 2001-01-04 | Intravascular Res Ltd | Ultraschall Wandleranordnung und Verfahren zu dessen Herstellung |
US5539965A (en) | 1994-06-22 | 1996-07-30 | Rutgers, The University Of New Jersey | Method for making piezoelectric composites |
US6183578B1 (en) | 1998-04-21 | 2001-02-06 | Penn State Research Foundation | Method for manufacture of high frequency ultrasound transducers |
CA2429940C (en) | 2000-12-01 | 2008-07-08 | The Cleveland Clinic Foundation | Miniature ultrasound transducer |
JP3849976B2 (ja) | 2001-01-25 | 2006-11-22 | 松下電器産業株式会社 | 複合圧電体と超音波診断装置用超音波探触子と超音波診断装置および複合圧電体の製造方法 |
JP5036284B2 (ja) | 2006-11-22 | 2012-09-26 | 日本碍子株式会社 | セラミックス構造体の製造方法 |
US20150305716A1 (en) | 2014-04-28 | 2015-10-29 | Koninklijke Philips N.V | Ultrasound Transducer Array Apparatus and Method of Imaging Using Transducer Arrays |
-
2017
- 2017-09-25 US US16/336,352 patent/US11497470B2/en active Active
- 2017-09-25 EP EP17776992.4A patent/EP3519110A1/en not_active Withdrawn
- 2017-09-25 JP JP2019516615A patent/JP2019530505A/ja active Pending
- 2017-09-25 WO PCT/EP2017/074158 patent/WO2018060109A1/en unknown
Patent Citations (4)
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JPH0213099A (ja) * | 1988-06-30 | 1990-01-17 | Toshiba Corp | アレイ型超音波探触子の製造方法 |
JPH11501245A (ja) * | 1995-12-26 | 1999-02-02 | エンドーソニックス・コーポレイション | 柔軟な基板を有する高分解能血管内超音波変換器装置 |
JPH10315472A (ja) * | 1997-05-23 | 1998-12-02 | Tec Corp | インクジェットプリンタヘッド及びその製造方法 |
JPH11274592A (ja) * | 1998-03-19 | 1999-10-08 | Olympus Optical Co Ltd | 圧電セラミクス構造体製造方法及び複合圧電振動子 |
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EP3519110A1 (en) | 2019-08-07 |
US11497470B2 (en) | 2022-11-15 |
US20190216426A1 (en) | 2019-07-18 |
WO2018060109A1 (en) | 2018-04-05 |
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