JP2019528972A5 - - Google Patents

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Publication number
JP2019528972A5
JP2019528972A5 JP2019517313A JP2019517313A JP2019528972A5 JP 2019528972 A5 JP2019528972 A5 JP 2019528972A5 JP 2019517313 A JP2019517313 A JP 2019517313A JP 2019517313 A JP2019517313 A JP 2019517313A JP 2019528972 A5 JP2019528972 A5 JP 2019528972A5
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JP
Japan
Prior art keywords
layer
catheter assembly
backing
imaging catheter
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2019517313A
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English (en)
Japanese (ja)
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JP7239467B2 (ja
JP2019528972A (ja
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Publication date
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Priority claimed from PCT/EP2017/075052 external-priority patent/WO2018065400A1/en
Publication of JP2019528972A publication Critical patent/JP2019528972A/ja
Publication of JP2019528972A5 publication Critical patent/JP2019528972A5/ja
Priority to JP2022202113A priority Critical patent/JP2023036758A/ja
Application granted granted Critical
Publication of JP7239467B2 publication Critical patent/JP7239467B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2019517313A 2016-10-03 2017-10-03 管腔内撮像デバイス用の温度に反応しないバッキング構造 Active JP7239467B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022202113A JP2023036758A (ja) 2016-10-03 2022-12-19 管腔内撮像デバイス用の温度に反応しないバッキング構造

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201662403431P 2016-10-03 2016-10-03
US62/403,431 2016-10-03
US201662437724P 2016-12-22 2016-12-22
US62/437,724 2016-12-22
PCT/EP2017/075052 WO2018065400A1 (en) 2016-10-03 2017-10-03 Temperature insenstive backing structure for intraluminal imaging devices

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022202113A Division JP2023036758A (ja) 2016-10-03 2022-12-19 管腔内撮像デバイス用の温度に反応しないバッキング構造

Publications (3)

Publication Number Publication Date
JP2019528972A JP2019528972A (ja) 2019-10-17
JP2019528972A5 true JP2019528972A5 (https=) 2020-11-12
JP7239467B2 JP7239467B2 (ja) 2023-03-14

Family

ID=60019893

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2019517313A Active JP7239467B2 (ja) 2016-10-03 2017-10-03 管腔内撮像デバイス用の温度に反応しないバッキング構造
JP2022202113A Pending JP2023036758A (ja) 2016-10-03 2022-12-19 管腔内撮像デバイス用の温度に反応しないバッキング構造

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022202113A Pending JP2023036758A (ja) 2016-10-03 2022-12-19 管腔内撮像デバイス用の温度に反応しないバッキング構造

Country Status (4)

Country Link
US (2) US11813116B2 (https=)
EP (1) EP3518775B1 (https=)
JP (2) JP7239467B2 (https=)
WO (1) WO2018065400A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12138116B2 (en) 2018-05-02 2024-11-12 Koninklijke Philips N.V. Intraluminal medical imaging interface devices and systems
US11123173B2 (en) 2019-09-11 2021-09-21 Gary A. Zwick Implant comprising first and second sets of pillars for attaching a tendon or a ligament to a hard tissue
US11731165B2 (en) * 2019-12-20 2023-08-22 GE Precision Healthcare LLC Stressed-skin backing panel for image artifacts prevention
GB2614239A (en) * 2021-12-17 2023-07-05 Darkvision Tech Inc Ultrasound interconnect stack and method of manufacturing same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6605043B1 (en) * 1998-11-19 2003-08-12 Acuson Corp. Diagnostic medical ultrasound systems and transducers utilizing micro-mechanical components
JP4137328B2 (ja) * 1999-12-28 2008-08-20 光正 小柳 3次元半導体集積回路装置の製造方法
US8354773B2 (en) * 2003-08-22 2013-01-15 Siemens Medical Solutions Usa, Inc. Composite acoustic absorber for ultrasound transducer backing material
US7285897B2 (en) * 2003-12-31 2007-10-23 General Electric Company Curved micromachined ultrasonic transducer arrays and related methods of manufacture
US20080315331A1 (en) * 2007-06-25 2008-12-25 Robert Gideon Wodnicki Ultrasound system with through via interconnect structure
CN101969764B (zh) * 2007-12-06 2014-06-04 精量电子(美国)有限公司 用于超声波换能器的多层背衬吸收器
US20110166455A1 (en) * 2010-01-07 2011-07-07 Cully Edward H Catheter
EP2563043A4 (en) 2010-04-23 2017-05-31 Hitachi, Ltd. Ultrasound probe, production method therefor, and ultrasound diagnostic equipment
KR101525336B1 (ko) 2011-01-06 2015-06-02 가부시키가이샤 히타치 메디코 초음파 탐촉자
JP5550706B2 (ja) 2012-10-31 2014-07-16 日立アロカメディカル株式会社 超音波探触子
SG10201407632UA (en) * 2013-11-26 2015-06-29 Agency Science Tech & Res Transducer and method for forming the same
US9833219B2 (en) * 2014-03-26 2017-12-05 Siemens Medical Solutions Usa, Inc. Angle oriented array for medical ultrasound
BR112017000134A2 (pt) * 2014-07-08 2017-11-07 Qualcomm Inc transdutor ultrassônico piezoelétrico e processo
KR102271172B1 (ko) * 2014-07-14 2021-06-30 삼성메디슨 주식회사 초음파 흡음 부재, 이를 포함하는 초음파 프로브 및 그 제조 방법

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