JP2019527477A5 - - Google Patents
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- Publication number
- JP2019527477A5 JP2019527477A5 JP2019501489A JP2019501489A JP2019527477A5 JP 2019527477 A5 JP2019527477 A5 JP 2019527477A5 JP 2019501489 A JP2019501489 A JP 2019501489A JP 2019501489 A JP2019501489 A JP 2019501489A JP 2019527477 A5 JP2019527477 A5 JP 2019527477A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- donor
- backing
- remaining
- donor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 9
- 239000000463 material Substances 0.000 claims 4
Claims (1)
- 第１の面および第２の面を含むドナー基材を準備すること、
前記第１の面を裏当て基材に付着させること、
前記ドナー基材を処理して、内部応力を生成すること、
前記第２の面を標的基材に接合すること、
前記ドナー基材を切断領域で切断して、材料の層を前記標的基材に移転させ、前記ドナー基材の残りの材料は前記裏当て基材に付着されたままであること、および
前記ドナー基材の前記第１の面が前記裏当て基材に付着されたままの状態で、前記残りの材料を再生すること
を含む方法。
Applications Claiming Priority (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662361468P | 2016-07-12 | 2016-07-12 | |
| US62/361,468 | 2016-07-12 | ||
| US201662367911P | 2016-07-28 | 2016-07-28 | |
| US62/367,911 | 2016-07-28 | ||
| US15/643,370 US20180019169A1 (en) | 2016-07-12 | 2017-07-06 | Backing substrate stabilizing donor substrate for implant or reclamation |
| US15/643,384 | 2017-07-06 | ||
| US15/643,370 | 2017-07-06 | ||
| US15/643,384 US20180033609A1 (en) | 2016-07-28 | 2017-07-06 | Removal of non-cleaved/non-transferred material from donor substrate |
| PCT/IB2017/054209 WO2018011731A1 (en) | 2016-07-12 | 2017-07-12 | Method of a donor substrate undergoing reclamation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2019527477A JP2019527477A (ja) | 2019-09-26 |
| JP2019527477A5 true JP2019527477A5 (ja) | 2020-08-20 |
Family
ID=65658530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019501489A Pending JP2019527477A (ja) | 2016-07-12 | 2017-07-12 | ドナー基材を再生するための方法 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3485505A1 (ja) |
| JP (1) | JP2019527477A (ja) |
| KR (1) | KR20190027821A (ja) |
| CN (1) | CN109478493A (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190163B (zh) * | 2019-05-24 | 2020-04-28 | 康佳集团股份有限公司 | 图形化衬底、外延片、制作方法、存储介质及led芯片 |
| JP6915191B1 (ja) * | 2021-01-21 | 2021-08-04 | 信越エンジニアリング株式会社 | ワーク分離装置及びワーク分離方法 |
| US20240030055A1 (en) | 2021-02-04 | 2024-01-25 | Mitsubishi Electric Corporation | Method of manufacturing semiconductor substrate and method of manufacturing semiconductor device |
| JP7484773B2 (ja) | 2021-03-04 | 2024-05-16 | 信越半導体株式会社 | 紫外線発光素子用エピタキシャルウェーハの製造方法、紫外線発光素子用基板の製造方法及び紫外線発光素子用エピタキシャルウェーハ |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2834123B1 (fr) * | 2001-12-21 | 2005-02-04 | Soitec Silicon On Insulator | Procede de report de couches minces semi-conductrices et procede d'obtention d'une plaquette donneuse pour un tel procede de report |
| EP1777735A3 (fr) * | 2005-10-18 | 2009-08-19 | S.O.I.Tec Silicon on Insulator Technologies | Procédé de recyclage d'une plaquette donneuse épitaxiée |
| JP4519199B2 (ja) * | 2007-09-03 | 2010-08-04 | パナソニック株式会社 | ウエハ再生方法およびウエハ再生装置 |
| SG159484A1 (en) * | 2008-09-05 | 2010-03-30 | Semiconductor Energy Lab | Method of manufacturing soi substrate |
| US8679942B2 (en) * | 2008-11-26 | 2014-03-25 | Soitec | Strain engineered composite semiconductor substrates and methods of forming same |
| JP2014157979A (ja) * | 2013-02-18 | 2014-08-28 | Sumitomo Electric Ind Ltd | Ｉｉｉ族窒化物複合基板およびその製造方法、積層ｉｉｉ族窒化物複合基板、ならびにｉｉｉ族窒化物半導体デバイスおよびその製造方法 |
| WO2016007582A1 (en) * | 2014-07-11 | 2016-01-14 | Gtat Corporation | Support substrate for ion beam exfoliation of a crystalline lamina |
-
2017
- 2017-07-12 EP EP17755560.4A patent/EP3485505A1/en not_active Withdrawn
- 2017-07-12 JP JP2019501489A patent/JP2019527477A/ja active Pending
- 2017-07-12 CN CN201780042232.5A patent/CN109478493A/zh active Pending
- 2017-07-12 KR KR1020197001310A patent/KR20190027821A/ko unknown
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