JP2019503433A5 - - Google Patents

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Publication number
JP2019503433A5
JP2019503433A5 JP2018530087A JP2018530087A JP2019503433A5 JP 2019503433 A5 JP2019503433 A5 JP 2019503433A5 JP 2018530087 A JP2018530087 A JP 2018530087A JP 2018530087 A JP2018530087 A JP 2018530087A JP 2019503433 A5 JP2019503433 A5 JP 2019503433A5
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JP
Japan
Prior art keywords
sih
film
precursor
reaction chamber
layer
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JP2018530087A
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English (en)
Japanese (ja)
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JP2019503433A (ja
JP6956086B2 (ja
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Priority claimed from US14/986,286 external-priority patent/US9719167B2/en
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JP2018530087A 2015-12-31 2016-12-12 コバルト含有フィルム形成組成物、それらの合成およびフィルム析出における使用 Active JP6956086B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/986,286 2015-12-31
US14/986,286 US9719167B2 (en) 2015-12-31 2015-12-31 Cobalt-containing film forming compositions, their synthesis, and use in film deposition
PCT/IB2016/001940 WO2017115138A1 (en) 2015-12-31 2016-12-12 Cobalt-containing film forming compositions, their synthesis, and use in film deposition

Publications (3)

Publication Number Publication Date
JP2019503433A JP2019503433A (ja) 2019-02-07
JP2019503433A5 true JP2019503433A5 (enExample) 2020-01-23
JP6956086B2 JP6956086B2 (ja) 2021-10-27

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ID=55791519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018530087A Active JP6956086B2 (ja) 2015-12-31 2016-12-12 コバルト含有フィルム形成組成物、それらの合成およびフィルム析出における使用

Country Status (6)

Country Link
US (1) US9719167B2 (enExample)
EP (1) EP3397790B1 (enExample)
JP (1) JP6956086B2 (enExample)
KR (1) KR102653603B1 (enExample)
CN (1) CN108431295B (enExample)
WO (1) WO2017115138A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10290540B2 (en) 2016-11-01 2019-05-14 Versum Materials Us, Llc Disubstituted alkyne dicobalt hexacarbonyl compounds, method of making and method of use thereof
US20180134738A1 (en) * 2016-11-01 2018-05-17 Versum Materials Us, Llc Disubstituted alkyne dicobalt hexacarbonyl compounds, method of making and method of use thereof
CN113195783A (zh) * 2018-12-19 2021-07-30 恩特格里斯公司 在还原共反应剂存在下沉积钨或钼层的方法
TWI819180B (zh) * 2019-01-17 2023-10-21 荷蘭商Asm 智慧財產控股公司 藉由循環沈積製程於基板上形成含過渡金屬膜之方法

Family Cites Families (17)

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US6984591B1 (en) * 2000-04-20 2006-01-10 International Business Machines Corporation Precursor source mixtures
JP5290488B2 (ja) 2000-09-28 2013-09-18 プレジデント アンド フェロウズ オブ ハーバード カレッジ 酸化物、ケイ酸塩及びリン酸塩の気相成長
US6464779B1 (en) * 2001-01-19 2002-10-15 Novellus Systems, Inc. Copper atomic layer chemical vapor desposition
US9051641B2 (en) 2001-07-25 2015-06-09 Applied Materials, Inc. Cobalt deposition on barrier surfaces
KR100539278B1 (ko) * 2003-09-22 2005-12-27 삼성전자주식회사 코발트 실리사이드막 형성 방법 및 반도체 장치의 제조방법.
US20060121192A1 (en) 2004-12-02 2006-06-08 Jurcik Benjamin J Liquid precursor refill system
US20080132050A1 (en) * 2006-12-05 2008-06-05 Lavoie Adrien R Deposition process for graded cobalt barrier layers
KR101629965B1 (ko) 2007-04-09 2016-06-13 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 구리 배선용 코발트 질화물층 및 이의 제조방법
KR20100017171A (ko) * 2007-05-21 2010-02-16 레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 반도체 적용을 위한 신규 코발트 전구체
US20090246952A1 (en) 2008-03-28 2009-10-01 Tokyo Electron Limited Method of forming a cobalt metal nitride barrier film
WO2014052316A1 (en) * 2012-09-25 2014-04-03 Advanced Technology Materials, Inc. Cobalt precursors for low temperature ald or cvd of cobalt-based thin films
KR102209476B1 (ko) * 2013-01-31 2021-01-28 레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 코발트-함유 화합물, 이의 합성, 및 코발트-함유 필름 침착에서의 용도
US9005704B2 (en) 2013-03-06 2015-04-14 Applied Materials, Inc. Methods for depositing films comprising cobalt and cobalt nitrides
US9385033B2 (en) * 2013-09-27 2016-07-05 Intel Corporation Method of forming a metal from a cobalt metal precursor
US9362228B2 (en) 2013-10-22 2016-06-07 Globalfoundries Inc. Electro-migration enhancing method for self-forming barrier process in copper metalization
US9601431B2 (en) * 2014-02-05 2017-03-21 Applied Materials, Inc. Dielectric/metal barrier integration to prevent copper diffusion
US10011903B2 (en) * 2015-12-31 2018-07-03 L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Manganese-containing film forming compositions, their synthesis, and use in film deposition

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