JP2019501279A5 - - Google Patents

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Publication number
JP2019501279A5
JP2019501279A5 JP2018521042A JP2018521042A JP2019501279A5 JP 2019501279 A5 JP2019501279 A5 JP 2019501279A5 JP 2018521042 A JP2018521042 A JP 2018521042A JP 2018521042 A JP2018521042 A JP 2018521042A JP 2019501279 A5 JP2019501279 A5 JP 2019501279A5
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JP
Japan
Prior art keywords
wall
force
holding
holding device
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2018521042A
Other languages
English (en)
Japanese (ja)
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JP6605730B2 (ja
JP2019501279A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/EP2016/077325 external-priority patent/WO2018086698A1/en
Publication of JP2019501279A publication Critical patent/JP2019501279A/ja
Publication of JP2019501279A5 publication Critical patent/JP2019501279A5/ja
Application granted granted Critical
Publication of JP6605730B2 publication Critical patent/JP6605730B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2018521042A 2016-11-10 2016-11-10 基板を保持するための保持装置、保持装置を含むキャリア、キャリアを用いた処理システム、および基板を保持装置から解放する方法 Active JP6605730B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2016/077325 WO2018086698A1 (en) 2016-11-10 2016-11-10 Holding arrangement for holding a substrate, carrier including the holding arrangement, processing system employing the carrier, and method for releasing a substrate from a holding arrangement

Publications (3)

Publication Number Publication Date
JP2019501279A JP2019501279A (ja) 2019-01-17
JP2019501279A5 true JP2019501279A5 (enExample) 2019-04-18
JP6605730B2 JP6605730B2 (ja) 2019-11-13

Family

ID=57421819

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018521042A Active JP6605730B2 (ja) 2016-11-10 2016-11-10 基板を保持するための保持装置、保持装置を含むキャリア、キャリアを用いた処理システム、および基板を保持装置から解放する方法

Country Status (6)

Country Link
US (1) US11186906B2 (enExample)
JP (1) JP6605730B2 (enExample)
KR (1) KR101983674B1 (enExample)
CN (1) CN108291296B (enExample)
TW (1) TWI645503B (enExample)
WO (1) WO2018086698A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102762931B1 (ko) * 2018-10-18 2025-02-04 어플라이드 머티어리얼스, 인코포레이티드 기판을 유지하기 위한 유지 디바이스, 기판을 유지하기 위한 캐리어, 및 유지 디바이스로부터 기판을 해제하기 위한 방법
WO2022011193A1 (en) 2020-07-08 2022-01-13 Nanogriptech, Inc. Dry adhesive for temporary bonding of semiconductor devices
KR102214706B1 (ko) * 2020-10-11 2021-02-10 주식회사 지논 평판 이송용 패드 구조체
EP4638117A1 (en) * 2022-12-21 2025-10-29 Shin-Etsu Chemical Co., Ltd. A low-residue high temperature-resistant dry adhesive and methods of use

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6589809B1 (en) * 2001-07-16 2003-07-08 Micron Technology, Inc. Method for attaching semiconductor components to a substrate using local UV curing of dicing tape
JP4137471B2 (ja) * 2002-03-04 2008-08-20 東京エレクトロン株式会社 ダイシング方法、集積回路チップの検査方法及び基板保持装置
US7372549B2 (en) 2005-06-24 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP4746003B2 (ja) * 2007-05-07 2011-08-10 リンテック株式会社 移載装置及び移載方法
US8236129B2 (en) 2007-05-23 2012-08-07 GM Global Technology Operations LLC Attachment pad with thermal reversible adhesive and methods of making and using the same
JP5169589B2 (ja) * 2008-07-31 2013-03-27 株式会社デンソー 接着用シート、及びその製造方法
JP4630377B2 (ja) * 2009-03-11 2011-02-09 古河電気工業株式会社 半導体装置の製造方法
US8192901B2 (en) * 2010-10-21 2012-06-05 Asahi Glass Company, Limited Glass substrate-holding tool
JP4785995B1 (ja) * 2011-02-28 2011-10-05 信越エンジニアリング株式会社 ワーク粘着チャック装置及びワーク貼り合わせ機
WO2012117509A1 (ja) 2011-02-28 2012-09-07 信越エンジニアリング株式会社 薄板状ワークの粘着保持方法及び薄板状ワークの粘着保持装置並びに製造システム
JP2013060489A (ja) * 2011-09-12 2013-04-04 Three M Innovative Properties Co 部材剥離方法及び部材剥離装置
JP6055239B2 (ja) * 2012-08-29 2016-12-27 ファスフォードテクノロジ株式会社 ダイボンディング装置並びにダイピックアップ装置及びダイピックアップ方法
CN104904004B (zh) * 2013-01-09 2017-05-31 信越工程株式会社 工件粘附卡盘装置及工件贴合机

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