JP2019220405A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2019220405A5 JP2019220405A5 JP2018118397A JP2018118397A JP2019220405A5 JP 2019220405 A5 JP2019220405 A5 JP 2019220405A5 JP 2018118397 A JP2018118397 A JP 2018118397A JP 2018118397 A JP2018118397 A JP 2018118397A JP 2019220405 A5 JP2019220405 A5 JP 2019220405A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- manufacturing
- emitting module
- height
- main surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009792 diffusion process Methods 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 6
- 230000001070 adhesive Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
Claims (7)
発光面となる第１主面と、前記第１主面と反対側の第２主面と、を備える導光板を準備する工程と、
前記導光板の前記第２主面上に、複数の接合部材を配置する工程と、
前記複数の接合部材の上面の高さを揃える工程と、
前記各接合部材上に、前記電極を上にして発光素子を載置する工程と、
前記電極を含む発光素子を被覆する被覆部材を配置する工程と、
前記電極が露出するまで前記被覆部材を除去する工程と、
前記複数の発光素子を電気的に接続する導電部材を形成する工程と、
を備える発光モジュールの製造方法。 A step of preparing a light-emitting element comprising a semiconductor laminate and an electrode,
A step of preparing a light guide plate including a first main surface serving as a light emitting surface and a second main surface opposite to the first main surface;
Arranging a plurality of joining members on the second main surface of the light guide plate;
Aligning the height of the upper surface of the plurality of joining members,
A step of mounting a light emitting element on each of the joining members with the electrodes facing up,
A step of arranging a covering member covering the light emitting element including the electrode,
Removing the covering member until the electrode is exposed;
Forming a conductive member that electrically connects the plurality of light emitting elements;
A method for manufacturing a light emitting module comprising:
前記接合部材は、前記拡散部材上に配置される、請求項１〜請求項３のいずれか１項に記載の発光モジュールの製造方法。 The light guide plate has a concave portion on the second main surface side, and has a step of disposing a diffusion member in the concave portion,
The method according to claim 1, wherein the joining member is disposed on the diffusion member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018118397A JP6963183B2 (en) | 2018-06-22 | 2018-06-22 | Manufacturing method of light emitting module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018118397A JP6963183B2 (en) | 2018-06-22 | 2018-06-22 | Manufacturing method of light emitting module |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019220405A JP2019220405A (en) | 2019-12-26 |
| JP2019220405A5 true JP2019220405A5 (en) | 2020-04-02 |
| JP6963183B2 JP6963183B2 (en) | 2021-11-05 |
Family
ID=69096886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018118397A Active JP6963183B2 (en) | 2018-06-22 | 2018-06-22 | Manufacturing method of light emitting module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6963183B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7148810B2 (en) * | 2020-02-18 | 2022-10-06 | 日亜化学工業株式会社 | Light-emitting module manufacturing method and light-emitting module |
| JP7328568B2 (en) | 2021-06-30 | 2023-08-17 | 日亜化学工業株式会社 | Light source, light source device, and light source manufacturing method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5052860B2 (en) * | 2005-12-15 | 2012-10-17 | 三菱電機株式会社 | Planar light source device and display device using the same |
| EP2466366A1 (en) * | 2009-08-13 | 2012-06-20 | Taica Corporation | Gel member for optical use, method for assembling optical device using same, and optical device |
| DE102010018260A1 (en) * | 2010-01-29 | 2011-08-04 | OSRAM Opto Semiconductors GmbH, 93055 | lighting device |
| EP2378322B1 (en) * | 2010-04-10 | 2014-01-08 | LG Innotek Co., Ltd. | Light source device |
| JP6413631B2 (en) * | 2014-10-28 | 2018-10-31 | 日亜化学工業株式会社 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD |
-
2018
- 2018-06-22 JP JP2018118397A patent/JP6963183B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5843859B2 (en) | Manufacturing method of semiconductor light emitting device | |
| JP2018511186A5 (en) | ||
| US10600941B2 (en) | Electronic device and method for fabricating the same | |
| JP2015076612A5 (en) | ||
| JP2012109566A5 (en) | ||
| JP2007288050A5 (en) | ||
| WO2009044698A1 (en) | Semiconductor light-emitting device and method for manufacturing semiconductor light-emitting device | |
| JP2014110333A5 (en) | Manufacturing method of LED device | |
| JP2020526004A5 (en) | ||
| JP2011249807A5 (en) | ||
| US8536592B2 (en) | LED package device | |
| JP2014078749A5 (en) | ||
| JP2020522117A5 (en) | ||
| JP2018032792A5 (en) | ||
| JP2019220405A5 (en) | ||
| JP5432045B2 (en) | Manufacturing method of semiconductor light emitting device | |
| JP2014139979A (en) | LED device | |
| US9543279B2 (en) | Method of manufacturing a single light-emitting structure | |
| JP2006049735A5 (en) | ||
| JP2013168599A5 (en) | ||
| EP2492981A3 (en) | Method for producing light-emitting diode device | |
| JP2007043178A5 (en) | ||
| EP2571069A3 (en) | Package structure of semiconductor light emitting element | |
| JP2012023375A5 (en) | Light emitting device | |
| JP6963183B2 (en) | Manufacturing method of light emitting module |