JP2019200373A5 - - Google Patents
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- Publication number
- JP2019200373A5 JP2019200373A5 JP2018095993A JP2018095993A JP2019200373A5 JP 2019200373 A5 JP2019200373 A5 JP 2019200373A5 JP 2018095993 A JP2018095993 A JP 2018095993A JP 2018095993 A JP2018095993 A JP 2018095993A JP 2019200373 A5 JP2019200373 A5 JP 2019200373A5
- Authority
- JP
- Japan
- Prior art keywords
- clad layer
- optical waveguide
- layer
- angle
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000010410 layer Substances 0.000 claims 28
- 230000003287 optical effect Effects 0.000 claims 19
- 239000012792 core layer Substances 0.000 claims 15
- 239000000758 substrate Substances 0.000 claims 6
- 239000012790 adhesive layer Substances 0.000 claims 3
- 230000001154 acute effect Effects 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 238000005253 cladding Methods 0.000 claims 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018095993A JP7118731B2 (ja) | 2018-05-18 | 2018-05-18 | 光導波路搭載基板、光送受信装置 |
| US16/411,656 US10935719B2 (en) | 2018-05-18 | 2019-05-14 | Optical waveguide having support member, optical waveguide mounting substrate and optical transceiver |
| US17/155,289 US11378763B2 (en) | 2018-05-18 | 2021-01-22 | Optical waveguide having support member, optical waveguide mounting substrate and optical transceiver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018095993A JP7118731B2 (ja) | 2018-05-18 | 2018-05-18 | 光導波路搭載基板、光送受信装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2019200373A JP2019200373A (ja) | 2019-11-21 |
| JP2019200373A5 true JP2019200373A5 (enExample) | 2021-04-01 |
| JP7118731B2 JP7118731B2 (ja) | 2022-08-16 |
Family
ID=68532547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018095993A Active JP7118731B2 (ja) | 2018-05-18 | 2018-05-18 | 光導波路搭載基板、光送受信装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (2) | US10935719B2 (enExample) |
| JP (1) | JP7118731B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021106378A1 (ja) * | 2019-11-28 | 2021-06-03 | 京セラ株式会社 | 光学素子搭載モジュール |
| JP7358224B2 (ja) * | 2019-12-09 | 2023-10-10 | 新光電気工業株式会社 | 光モジュール及びその製造方法 |
| US11677472B2 (en) | 2020-08-28 | 2023-06-13 | Avicenatech Corp. | Hybrid integration of microLED interconnects with ICs |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000227524A (ja) * | 1999-02-05 | 2000-08-15 | Sony Corp | 光導波装置および光送受信装置、ならびにそれらの製造方法 |
| TW460717B (en) * | 1999-03-30 | 2001-10-21 | Toppan Printing Co Ltd | Optical wiring layer, optoelectric wiring substrate mounted substrate, and methods for manufacturing the same |
| TWI239798B (en) * | 1999-05-28 | 2005-09-11 | Toppan Printing Co Ltd | Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate |
| JP2003294965A (ja) * | 2002-04-04 | 2003-10-15 | Hitachi Chem Co Ltd | 光導波路デバイス、その製造方法及び基板 |
| JP4447428B2 (ja) * | 2004-10-19 | 2010-04-07 | 新光電気工業株式会社 | 光導波路の製造方法 |
| JP2006330067A (ja) * | 2005-05-23 | 2006-12-07 | Hitachi Cable Ltd | 直角曲げ導波路及びその製造方法 |
| JP2006330066A (ja) * | 2005-05-23 | 2006-12-07 | Hitachi Cable Ltd | 光反射面及びその形成方法 |
| TW200807047A (en) | 2006-05-30 | 2008-02-01 | Sumitomo Bakelite Co | Substrate for mounting photonic device, optical circuit substrate, and photonic device mounting substrate |
| JP4704322B2 (ja) * | 2006-11-30 | 2011-06-15 | 新光電気工業株式会社 | 光電気混載基板の製造方法 |
| JP5155596B2 (ja) * | 2007-05-14 | 2013-03-06 | 新光電気工業株式会社 | 光電気混載基板の製造方法 |
| JP2009251034A (ja) * | 2008-04-01 | 2009-10-29 | Shinko Electric Ind Co Ltd | 光導波路の製造方法、光導波路及び光送受信装置 |
| KR100975052B1 (ko) * | 2008-09-29 | 2010-08-11 | 주식회사 와이텔포토닉스 | 광모듈 및 그 제조방법 |
| JP2010139562A (ja) * | 2008-12-09 | 2010-06-24 | Shinko Electric Ind Co Ltd | 光導波路、光導波路搭載基板及び光送受信装置 |
| JP5550535B2 (ja) | 2010-11-26 | 2014-07-16 | 新光電気工業株式会社 | 光導波路装置及びその製造方法 |
| JP6395134B2 (ja) * | 2014-12-26 | 2018-09-26 | 新光電気工業株式会社 | 光導波路装置の製造方法及びレーザ加工装置 |
| US9721812B2 (en) * | 2015-11-20 | 2017-08-01 | International Business Machines Corporation | Optical device with precoated underfill |
| US10025044B1 (en) * | 2017-01-17 | 2018-07-17 | International Business Machines Corporation | Optical structure |
| US10168495B1 (en) * | 2017-06-28 | 2019-01-01 | Kyocera Corporation | Optical waveguide and optical circuit board |
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2018
- 2018-05-18 JP JP2018095993A patent/JP7118731B2/ja active Active
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2019
- 2019-05-14 US US16/411,656 patent/US10935719B2/en active Active
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2021
- 2021-01-22 US US17/155,289 patent/US11378763B2/en active Active