JP2019192684A - 排気ノズルユニット、ロードポート、及びefem - Google Patents
排気ノズルユニット、ロードポート、及びefem Download PDFInfo
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- JP2019192684A JP2019192684A JP2018080406A JP2018080406A JP2019192684A JP 2019192684 A JP2019192684 A JP 2019192684A JP 2018080406 A JP2018080406 A JP 2018080406A JP 2018080406 A JP2018080406 A JP 2018080406A JP 2019192684 A JP2019192684 A JP 2019192684A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/005—Nozzles or other outlets specially adapted for discharging one or more gases
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
- B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
- B05B1/3013—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages the controlling element being a lift valve
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
2…ロードポート
23…載置台
3…搬送室
31…搬送ロボット
3S…搬送空間
4…基板収納容器,容器(FOUP)
41…搬出入口
40…ポート
9…排気ノズルユニット(パージノズルユニット)
91…ノズル
911…第1ノズル
912…第2ノズル
92…ハウジング
93…動作調整空間
P…パージ装置
W…搬送対象物(ウェーハ)
Claims (6)
- 搬出入口を有する基板収納容器から、当該容器内の気体雰囲気を当該容器の底面に有するポートを通して外部に排出可能な排気ノズルユニットであって、
前記ポートの弁を押圧することによって当該ポートを閉止状態から開放状態に切替可能なノズルと、
前記ノズルを、前記ポートを開放状態にする使用姿勢と前記ポートを閉止状態にする待機姿勢との間で昇降可能に保持するハウジングとを備えていることを特徴とする排気ノズルユニット。 - 前記ノズルは、前記ポートの外縁に密着可能な第1ノズルと、前記弁を押圧する第2ノズルとを備えたものである請求項1に記載の排気ノズルユニット。
- 前記ノズルと前記ハウジングとの間に動作調整空間を有し、前記動作調整空間に対してノズル制御用気体を出し入れすることにより前記ノズルを前記使用姿勢と前記待機姿勢との間で動作させる請求項1又は2に記載の排気ノズルユニット
- 前記容器を載置する載置台と、
前記載置台の所定箇所に配置された請求項1乃至3の何れかに記載の排気ノズルユニットとを備えていることを特徴とするロードポート。 - 搬出入口を有する容器と搬送空間との間で搬送対象物を搬送する搬送ロボットが配置される搬送室と、前記容器が載置される載置台を有するロードポートとを備えるEFEMであって、
前記ロードポートは、前記容器内の気体雰囲気を環境ガスに置換可能なパージ装置を備えたものであり、
前記パージ装置は、前記載置台の所定箇所に配置され、且つ前記容器の底面に1つ以上設けられたポートに接続される1つ以上の排気ノズルユニットを備えたものであり、
前記排気ノズルユニットは、前記ポートの弁を押圧することによって当該ポートを閉止状態から開放状態に切替可能なノズルと、前記ノズルを、前記ポートを開放状態にする使用姿勢と前記ポートを閉止状態にする待機姿勢との間で昇降可能に保持するハウジングとを備えていることを特徴とするEFEM。 - 前記搬送空間には下降気流が形成され、前記下降気流を、前記容器の内部に前記搬出入口を介して導入可能に構成している請求項5に記載のEFEM。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018080406A JP7100243B2 (ja) | 2018-04-19 | 2018-04-19 | 排気ノズルユニット、ロードポート、及びefem |
KR1020190045454A KR20190122161A (ko) | 2018-04-19 | 2019-04-18 | 배기 노즐 유닛, 로드 포트 및 efem |
CN201910315022.XA CN110391160B (zh) | 2018-04-19 | 2019-04-18 | 排气喷嘴单元、装载端口和设备前端模块 |
TW108113683A TWI826438B (zh) | 2018-04-19 | 2019-04-18 | 排氣噴嘴單元、裝載端口和設備前端模塊 |
US16/387,792 US11658047B2 (en) | 2018-04-19 | 2019-04-18 | Exhaust nozzle unit, load port, and EFEM |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018080406A JP7100243B2 (ja) | 2018-04-19 | 2018-04-19 | 排気ノズルユニット、ロードポート、及びefem |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019192684A true JP2019192684A (ja) | 2019-10-31 |
JP7100243B2 JP7100243B2 (ja) | 2022-07-13 |
Family
ID=68238108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018080406A Active JP7100243B2 (ja) | 2018-04-19 | 2018-04-19 | 排気ノズルユニット、ロードポート、及びefem |
Country Status (5)
Country | Link |
---|---|
US (1) | US11658047B2 (ja) |
JP (1) | JP7100243B2 (ja) |
KR (1) | KR20190122161A (ja) |
CN (1) | CN110391160B (ja) |
TW (1) | TWI826438B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11139188B2 (en) * | 2017-04-28 | 2021-10-05 | Sinfonia Technology Co., Ltd. | Gas supply device, method for controlling gas supply device, load port, and semiconductor manufacturing apparatus |
US11373891B2 (en) * | 2018-10-26 | 2022-06-28 | Applied Materials, Inc. | Front-ducted equipment front end modules, side storage pods, and methods of operating the same |
US11244844B2 (en) | 2018-10-26 | 2022-02-08 | Applied Materials, Inc. | High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods |
KR102662971B1 (ko) * | 2019-04-26 | 2024-05-03 | 엔테그리스, 아이엔씨. | 기판 컨테이너용 퍼지 연결부 및 모듈 |
KR102388390B1 (ko) * | 2020-01-06 | 2022-04-21 | 세메스 주식회사 | 로드 포트 유닛, 이를 포함하는 저장 장치 및 배기 방법 |
JP7422577B2 (ja) * | 2020-03-23 | 2024-01-26 | 平田機工株式会社 | ロードポート及び制御方法 |
US11276599B2 (en) * | 2020-06-09 | 2022-03-15 | Tdk Corporation | Load port apparatus, EFEM, and method of installing load port apparatus |
US11810805B2 (en) | 2020-07-09 | 2023-11-07 | Applied Materials, Inc. | Prevention of contamination of substrates during gas purging |
CN112242338B (zh) * | 2020-12-18 | 2021-03-02 | 西安奕斯伟硅片技术有限公司 | 能够保持foup的盖部的洁净度的装载端口及设备前端模块 |
US12076854B2 (en) * | 2021-03-18 | 2024-09-03 | Applied Materials, Inc. | Increased number of load ports on factory interface with robot that moves on track |
US20240125491A1 (en) * | 2022-10-13 | 2024-04-18 | Applied Materials, Inc. | Filter isolation for equipment front end module |
CN116525508B (zh) * | 2023-05-23 | 2024-03-26 | 乐孜芯创半导体设备(上海)有限公司 | 一种密闭式晶圆盒装载口及其气体置换方法 |
Citations (5)
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JP2007005599A (ja) * | 2005-06-24 | 2007-01-11 | Kondo Kogyo Kk | シャッター付きブレスフィルター装置および該装置に使用するシャッター押上げロッド並びにシャッター押上げロッド付きノズル |
JP2011166047A (ja) * | 2010-02-15 | 2011-08-25 | Tadashi Kamimura | ガス導入装置およびガス導入の方法 |
JP2013258206A (ja) * | 2012-06-11 | 2013-12-26 | Sinfonia Technology Co Ltd | パージノズルユニット、パージ装置、ロードポート |
JP2014036185A (ja) * | 2012-08-10 | 2014-02-24 | Sinfonia Technology Co Ltd | パージノズルユニット、パージ装置、ロードポート |
JP2017108048A (ja) * | 2015-12-11 | 2017-06-15 | Tdk株式会社 | Efem |
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JP3367421B2 (ja) * | 1998-04-16 | 2003-01-14 | 東京エレクトロン株式会社 | 被処理体の収納装置及び搬出入ステージ |
JP4585514B2 (ja) * | 2004-06-21 | 2010-11-24 | 株式会社ライト製作所 | ロードポート |
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JP6024980B2 (ja) | 2012-10-31 | 2016-11-16 | Tdk株式会社 | ロードポートユニット及びefemシステム |
JP6459462B2 (ja) * | 2014-12-11 | 2019-01-30 | 東京エレクトロン株式会社 | リーク判定方法、基板処理装置及び記憶媒体 |
JP6565336B2 (ja) * | 2015-05-28 | 2019-08-28 | Tdk株式会社 | ガスパージユニット、ロードポート装置およびパージ対象容器の設置台 |
JP6561700B2 (ja) * | 2015-09-04 | 2019-08-21 | シンフォニアテクノロジー株式会社 | ガス注入装置 |
-
2018
- 2018-04-19 JP JP2018080406A patent/JP7100243B2/ja active Active
-
2019
- 2019-04-18 CN CN201910315022.XA patent/CN110391160B/zh active Active
- 2019-04-18 TW TW108113683A patent/TWI826438B/zh active
- 2019-04-18 KR KR1020190045454A patent/KR20190122161A/ko not_active Application Discontinuation
- 2019-04-18 US US16/387,792 patent/US11658047B2/en active Active
Patent Citations (5)
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JP2007005599A (ja) * | 2005-06-24 | 2007-01-11 | Kondo Kogyo Kk | シャッター付きブレスフィルター装置および該装置に使用するシャッター押上げロッド並びにシャッター押上げロッド付きノズル |
JP2011166047A (ja) * | 2010-02-15 | 2011-08-25 | Tadashi Kamimura | ガス導入装置およびガス導入の方法 |
JP2013258206A (ja) * | 2012-06-11 | 2013-12-26 | Sinfonia Technology Co Ltd | パージノズルユニット、パージ装置、ロードポート |
JP2014036185A (ja) * | 2012-08-10 | 2014-02-24 | Sinfonia Technology Co Ltd | パージノズルユニット、パージ装置、ロードポート |
JP2017108048A (ja) * | 2015-12-11 | 2017-06-15 | Tdk株式会社 | Efem |
Also Published As
Publication number | Publication date |
---|---|
US20190326134A1 (en) | 2019-10-24 |
JP7100243B2 (ja) | 2022-07-13 |
TW201944517A (zh) | 2019-11-16 |
US11658047B2 (en) | 2023-05-23 |
KR20190122161A (ko) | 2019-10-29 |
CN110391160A (zh) | 2019-10-29 |
TWI826438B (zh) | 2023-12-21 |
CN110391160B (zh) | 2024-03-26 |
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