JP2019186046A - Small type led lamp - Google Patents

Abstract

To provide a small type LED lamp technology that can be manufactured more rapidly and economically under an effective utilization of a component manufacturing technology for an existing filament lamp.SOLUTION: In the small type LED lamp, a base end has a mechanical connecting end 20, an outer frame shape and an outer size are set to be stored in a space shape and a space size of a small type filament lamp installing space, its extremity end is provided with a light source installing cylindrical wall 21, there is provided a heat sink case 2 where a vertical passing passage 22 is opened from the extremity end to a base end, it is arranged at said light source installing cylindrical wall 21, an LED small type SMD chip 3 having LED element facing outside is mounted under a high heat conductive state in respect to said heat sink case 2, a power source harness 35 for said LED small type SMD chip 3 is extended from the mechanical connecting end 20 and a transparent bulb 5 having a condenser lens part 51 at its extremity end is integrated at an outer circumference of said LED small type SMD chip 3.SELECTED DRAWING: Figure 5

Description

    The present invention relates to LED (light emitting diode) lamp technology that is compatible with filament lamps. In particular, the present invention is applied to various sensor light sources, display pilot lamps, decorative small light sources, and the like incorporated in various devices. Providing equipment and equipment necessary for transportation, storage, assembly and installation, as well as the field of manufacturing and providing small LED lamps that can be replaced with conventional small filament lamps that have been used. From the field of sales, materials that are required for such materials, machinery and parts, such as wood, stone, various fibers, plastics, various metal materials, etc., electronic components incorporated in them, and integration of them The field of control related equipment, the field of various measuring instruments, the field of equipment, the power machine that moves the equipment, the energy Fields generally referred to as industrial machinery, such as the electric power and energy sources that serve as energy sources, and the oil field, as well as testing and researching those facilities and equipment, and displaying, selling, importing and exporting them Fields related to, generals, the results of their use, facilities for making them, fields related to the collection and transportation of trash generated by the operation of equipment, and efficient reuse of these trash There is no technical field that is not related to the recycling field and other new fields that cannot be envisaged at this time.

(Points of interest)
Although light sources for general facilities and large-scale facility lighting have been converted to LEDs, filament light bulbs and fluorescent lamps are rapidly disappearing from the market from the viewpoint of energy saving. Many of the following small lamps have not been commercialized due to their market size, except for display applications using bullet-type LEDs.

(Conventional technology)
Referring to some prior arts that can grasp such a situation, for example, as represented by the one proposed in Patent Document 1 (1) shown below, the casing for covering the LED element has a cylindrical portion and a tip. For LED lamps having a surface portion, a lens having a convex portion at the center at the tip surface portion and a concave shape at the peripheral annular portion, and sockets as seen in Patent Document 1 (2) One end of a power supply board provided with a circuit for power supply is attached to the inside of the base that can be detached and attached to the other end of the power supply board extended outward from the opening of the base. The LED element mounting substrate is coupled in a T shape, the other end of the power supply substrate is connected to the opening of the base, the LED element is coupled to the other end of the power supply substrate, and the mounting substrate A glass or plastic sphere that surrounds LED lighting fixtures that are mounted, and a circuit in which a base, an LED for a light source, a radiator, an LED power supply circuit and electronic components are mounted, as shown in Patent Document 1 (3) In an LED lighting device including a substrate, a circuit board is accommodated inside a cylindrical heat radiator, a base is mounted on the heat radiator, an LED is mounted on the heat radiator, and the heat radiator has a high thermal conductivity. Halogen lamp type LED illuminator made of resin containing carbon fiber, the outer periphery of the radiator being covered with a thermally conductive insulating paint, and an illumination source as seen in Patent Document 1 (4) An incandescent lamp, and a power supply specially designed to supply power to the incandescent lamp. The adapter is used in a medical diagnostic instrument, and includes at least one LED as an illumination source, and the at least one LED. Above Medical adapter and means for matching the polarity between the source and the medical diagnostic instruments in which the medical adapter is incorporated is scattered.

However, the LED lamp technology that is compatible with the filament lamp as shown in Patent Document 1 (1) to Permissible Document 1 (3) is effective as a light source for general lighting to large-scale facility lighting. However, various sensor light sources, display pilot lamps, small decorative light sources, medical adapters such as those disclosed in Patent Document 1 (4), and the medical adapters are incorporated in various devices. When used for a small lamp with an outer diameter of φ20 or less, which is incorporated in an incorporated medical diagnostic instrument, etc., a mounting substrate on which a small LED is mounted must be developed exclusively. New bases and casings have been developed, and various problems such as technologies for incorporating small LEDs into the casing must be overcome. Economic burden becomes it takes and investment and a great deal of effort to the development of design and manufacturing technology there has been a drawback that large.
(1) Japanese Patent Application Laid-Open No. 2010-199056 (2) Japanese Patent No. 5563728 (3) Japanese Patent No. 5666318 (4) US Patent No. 776025

(Awareness of problems)
As described above, the LED lamp technology that is compatible with the various filament lamps that have been proposed in the past will be on the market scale when applied to small LED lamps that can be used for special applications with an outer diameter of φ20 or less. On the other hand, the development of dedicated parts and the development of manufacturing technology will require a great deal of labor and investment, and it has been difficult to commercialize small LED lamps that have been reduced in price so far. In view of the fact that it has not reached the stage of widespread use instead of this, we have come to realize the possibility of developing a new miniaturization technology for LED lamps that can overcome this situation.

(Object of invention)
Therefore, the present invention is based on the judgment that it is possible to develop a new small LED lamp technology that can be manufactured more quickly and economically by effectively using the existing part lamp manufacturing technology. As a result of quick development and research and repeated trial and error over many years and many trial productions and experiments, this time, we succeeded in realizing a compact LED lamp with a new structure. In the following, the configuration will be described in detail together with an embodiment representative of the present invention shown in the drawings.

(Structure of the invention)
As clearly understood from the embodiments representing the present invention shown in the drawings, the small LED lamp of the present invention basically comprises the following configuration.
That is, it is made of a columnar high thermal conductivity material, the base end has a single mechanical connecting end, and the space shape and space dimensions of the space for mounting a small filament lamp to be replaced with a maximum outer diameter of 20 mm or less. A heat sink housing that is set in an outer shape and outer dimensions that fit inside, has a light source mounting cylinder wall at the distal end, and has a longitudinal passage extending from the distal end to the proximal end inside. An LED small SMD (Surface Mount Device) chip that is arranged in the center of the light source mounting cylinder wall at the front end and has an LED element facing outward is mounted in a highly thermally conductive state with respect to the heat sink housing, and the LED small SMD A power harness connected to the chip is extended from the mechanical connection end to the outside through the longitudinal path of the heat sink housing, and the LED small SMD A light-transmitting bulb is integrated with at least one of the light source mounting cylindrical wall at the tip of the heat sink housing corresponding to the outer periphery of the LED and the outer periphery of the LED small SMD chip itself. This is a small LED lamp having the structure as described above.

    If the expression is changed, the small LED lamp having this basic configuration is made of a columnar high thermal conductivity material, the base end has a single mechanical connection end, and a maximum outer diameter of 20 mm. The space for the installation of the small filament lamp to be replaced and the outer shape and the outer size that fit within the space dimensions are set, the light source mounting cylinder wall is provided at the tip, and the tip to the base end are provided inside. An LED small SMD chip having a heat sink housing having an open longitudinal passage and disposed at the center of the light source mounting cylinder wall at the tip of the heat sink housing, and the LED element facing outward, The power harness connected to the LED small SMD chip is extended to be exposed from the mechanical connection end to the outside through the longitudinal passage of the heat sink housing. A light-transmitting bulb is integrated with at least one of the light source mounting cylindrical wall at the tip of the heat sink housing corresponding to the outer periphery of the LED small SMD chip and the outer periphery of the LED small SMD chip itself. Thus, a small LED lamp having a configuration that can be replaced with an existing small filament lamp is obtained.

    Further, in another expression, it is made of a columnar high thermal conductivity material, the base end has a single mechanical connecting end, and for mounting a small filament lamp to be replaced with a maximum outer diameter of 20 mm or less. It has a heat sink housing that is set to an outer shape and outer size that fits within the space shape and dimensions of the space, has a light source mounting cylinder wall at the tip, and has an internal longitudinal passage from the tip to the base end. The LED small SMD chip, which is arranged in the center of the light source mounting cylinder wall at the tip of the heat sink housing and has the LED element facing outward, is mounted in a high heat conduction state with respect to the heat sink housing, and the LED A power harness connected to the small SMD chip is extended from the mechanical connection end through the longitudinal passage of the heat sink housing so as to be exposed to the outside, and corresponds to the outer periphery of the LED small SMD chip. A light-transmitting bulb having a condensing lens portion at the tip is integrated with at least one of the light source mounting cylinder wall at the tip of the heat sink housing and the outer periphery of the LED small SMD chip itself. It becomes a small LED lamp which consists of an intended structure.

    More specifically, it is made of a cylindrical high thermal conductivity material, and the base end on the cylindrical axis has a base portion as a single mechanical connecting end, and has a maximum outer diameter of 20 mm or less. The space for the small filament lamp to be replaced is set to the space shape and the outer shape and the outer size that fit within the space size, and the tip on the axis of the cylinder coincides with the center of the light source mounting cylinder wall A heat sink housing having a longitudinal passage opening along the axial center from the light source mounting cylinder wall to the base portion, and disposed at the center of the light source mounting cylinder wall at the tip of the heat sink casing The LED small SMD chip with the LED element facing outward is mounted in a state of high thermal conductivity with respect to the heat sink housing, and a power harness connected to the LED small SMD chip extends vertically in the heat sink housing. Through the road A light source mounting cylinder wall at the tip of the heat sink housing that extends from the center of the base portion as a mechanical connection end to be exposed to the outside and corresponds to the outer periphery of the LED small SMD chip, and the LED A cylindrical base end that surrounds the outer periphery of the LED small SMD chip and at least one of the outer periphery of the small SMD chip itself are hermetically covered, and the LED small SMD chip A light-emitting bulb integrated with a condenser lens portion facing the chip is a small LED lamp having a configuration in which the light-transmitting bulb is integrated via the cylindrical base end.

    In other words, it is made of a cylindrical high thermal conductivity material, the base end on the cylindrical axis has a base part as a single mechanical connecting end, and has a maximum outer diameter of 20 mm or less. The outer shape and outer dimensions of the space for mounting the target small filament lamp are set within the space shape and the space dimensions, and the tip of the cylindrical axis is aligned with the center of the light source mounting cylinder wall. A heat sink housing in which a longitudinal passage is opened along the axial center from the light source mounting cylinder wall to the base portion, and at the center of the light source mounting cylinder wall at the tip of the heat sink casing, A power supply wiring board disposed on the axial center in the longitudinal passage of the heat sink housing, an LED small SMD chip mounted on the front end of the power supply wiring board with the LED element facing outward, and the power supply wiring Harness for power supply extended from the base end of the substrate Are mounted in a state of high thermal conductivity with respect to the heat sink casing, and the power harness is removed from the center of the base portion as the mechanical connection end through a longitudinal passage in the heat sink casing. A light source mounting cylinder wall at the tip of the heat sink housing, which extends to be exposed to the glue and corresponds to the outer periphery of the LED small SMD chip, and at least one of the outer periphery of the LED small SMD chip itself On the other hand, a cylindrical base end that surrounds the outer periphery of the LED small SMD chip and a condensing lens portion that covers the tip of the cylindrical base end in a sealed manner and faces the LED small SMD chip are integrated. The light-transmitting bulb thus formed is a small LED lamp having a configuration in which the light-transmitting bulb is integrated through the cylindrical base end.

    As described above, according to the small LED lamp of the present invention, unlike the conventional ones, from the characteristic features as described above, the processing technology for each main part of the main components for the existing filament lamp It is possible to manufacture small LED lamps with a maximum outer diameter of 20 mm or less more quickly and economically by making effective use of it, which makes it possible to greatly reduce development time and costs. Combined with the introduction of LED light source technology, it is possible to achieve high brightness comparable to that of halogen lamps, and can greatly reduce the amount of power used and the amount of heat generated during light emission, compared to conventional filament lamps. Remarkably long endurance life can be achieved, and light sources for various sensors, pilot lamps for display, and decorations for existing devices developed and manufactured exclusively for filament lamps It can be easily replaced with a conventional filament lamp that has been used for a mold light source, etc., so that the demand for replacing a small filament lamp that has not progressed so far with a small LED lamp can be promoted. Excellent features can be obtained.

    In addition, at least one of the light source mounting cylinder wall at the front end of the heat sink housing and the outer periphery of the LED small SMD chip itself, a cylindrical base end surrounding the outer periphery of the LED small SMD chip And a condensing lens portion that covers the tip of the cylindrical base end in a hermetically sealed manner and confronts the LED small SMD chip, and an integrated translucent bulb is integrated through the cylindrical base end. According to the small LED lamp, a translucent bulb having a cylindrical base end and a condensing lens part, which is economically manufactured by applying the manufacturing technology of a conventional filament lamp, and Low cost by mass production inside a heat sink housing economically manufactured with existing standard mechanical connection ends by application of conventional filament lamp manufacturing technology Since the D small SMD chip is built in, it can be easily replaced with a conventional filament lamp without placing a new burden on the user by the same replacement work as a conventional filament lamp. Even if the LED small SMD chip is mounted, even if the price is slightly increased, an excellent effect is achieved in that a sufficient economic efficiency can be achieved by extending the durability life.

    Then, a power supply wiring board disposed on the axial center in the longitudinal passage of the heat sink housing, an LED small SMD chip mounted on the front end of the power supply wiring board, and a base end of the power supply wiring board The one provided with the LED unit having the power supply harness can efficiently conduct heat generated by the LED small SMD chip to the heat sink housing through the power supply wiring board during light emission. In addition, it is possible to secure a wiring space for the power harness and a mounting space for electronic components such as a power electronic component between both surfaces of the power wiring board and the inner wall surface of the longitudinal passage. The space is such that both sides of the power supply wiring board can be assured equally, and there is an advantage that the possibility of developing various types of models can be increased.

    In addition, the LED unit has a small LED at the tip of a power supply wiring board provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side of the substrate material. The SMD chip is arranged in a T-shape when viewed from the side, and the anode terminal of the LED small SMD chip and the electronic circuit on the one surface are electrically and mechanically connected, and the electronic circuit on the one surface of the power supply wiring board Is an anode circuit, the cathode terminal of the LED small SMD chip and the electronic circuit on the other surface are electrically and mechanically connected, and the electronic circuit on the other surface of the power supply wiring board is a cathode circuit. The power supply harness is extended from the anode circuit on one side of the wiring board for power supply and the cathode circuit on the other side. The range from the LED small SMD chip to the power supply harness is electrically and spatially equal to the anode circuit and the cathode circuit by the power supply wiring board disposed on the axial center in the longitudinal passage of the heat sink housing. Therefore, it is possible to effectively prevent a short circuit, improve the mounting efficiency of wiring and electronic components, and improve the assembly workability.

    The power circuit board of the LED unit is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side, and a base portion of a narrow substrate portion whose tip is set to be narrow in advance, An electronic circuit that can be either an anode circuit or a cathode circuit is provided on each of the one surface and the other surface, and a large substrate portion that is set wider than the narrow substrate portion passes through a linear weak portion that is easily divided. In the case where either the large substrate portion is unnecessary or the small width substrate portion is unnecessary, the small width substrate portion and the large substrate separated along the line weakened portion are integrated. Any one of the parts is selectively mounted inside the longitudinal passage of the heat sink casing so as to be placed on the axis of the heat sink casing. Longitudinal Depending on the difference in law, the burden of designing and manufacturing multiple types of power supply wiring boards with different dimensions can be greatly reduced, and the narrow and large board sections can be separated without separation along the line weakened section. Can be integrated into the heat sink housing, and only one of the narrow substrate portion and the large substrate portion separated along the line weakened portion is attached to the heat sink housing. When using only the large substrate portion, it is not described in the embodiments described later, but as with the small substrate portion, the leading edge of the large substrate portion is used. On the other hand, the LED small SMD chip can be electrically and mechanically connected so as to be T-shaped in a side view, and the small substrate portion and the large substrate portion separated along the line weakened portion Are both useless And without an excellent economic efficiency that can be provided with built in different respective heat sink housing sizes can be achieved.

    Furthermore, the power circuit board of the LED unit is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side, and the base of the narrow board part whose tip is set to be narrow in advance And an electronic circuit that can be either an anode circuit or a cathode circuit on each of the one surface and the other surface, and a large substrate portion set wider than the narrow substrate portion is easily divided into linear weak portions The LED small SMD chip mounting substrate and the power supply wiring substrate are arranged in a T shape when viewed from the side, and the anode terminal of the LED small SMD chip and one surface of the small substrate portion Are electrically and mechanically connected to each other, and the electronic circuit on one surface of the small-width substrate portion becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the small circuit The electronic circuit on the other surface of the substrate portion is electrically and mechanically connected, and the electronic circuit on the other surface of the narrow substrate portion is used as a cathode circuit, and the narrow substrate portion and the electronic circuit along the linear weak portion The large substrate portion is not separated from the large substrate portion, and the anode circuit on one surface of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion are electrically connected across the linear weak portion. And an electronic circuit for power supply is mounted in the middle of the anode circuit on at least one surface of the large board portion. The power harness of the power supply is electrically and mechanically connected, and the power supply of the cathode circuit on the other surface of the narrow substrate portion is electrically and mechanically connected The power supply wiring board An electronic component for power supply can be mounted inside the vertical passage of the sink case so as to be placed on the axis of the heat sink case, and the heat between the heat sink case and the power supply wiring board can be mounted. Since the transmission area is further increased and the heat generated by the LED small SMD chip can be dissipated more efficiently, it is possible to provide a higher performance small LED lamp.

    The power circuit board of the LED unit is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side, and a base portion of a narrow board part whose tip is set to be narrow in advance. And an electronic circuit that can be either an anode circuit or a cathode circuit on each of the one surface and the other surface, and a large substrate portion set wider than the narrow substrate portion is easily divided into linear weak portions The LED small SMD chip mounting substrate and the power supply wiring substrate are arranged in a T-shape in a side view, and the LED small SMD chip anode terminal and the small substrate portion The electronic circuit on one surface is electrically and mechanically connected, and the electronic circuit on the one surface of the small-width substrate portion becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the The electronic circuit on the other surface of the width substrate portion is electrically and mechanically connected, and the electronic circuit on the other surface of the small width substrate portion is used as a cathode circuit, and the small width substrate portion is disposed along the linear fragile portion. The anode circuit on one surface of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion are electrically connected beyond the linear weak portion without being separated from the large substrate portion. The electronic circuit on the large substrate portion is an anode circuit, and the anode circuit on one surface of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion are not separated along the line weakened portion. An intermediate position of the anode circuit on one side of the large substrate portion, and an intermediate position of at least one of the anode circuits in the middle position of the electronic circuit on the other side of the large substrate portion, which are electrically connected across the weak portion Is a limiting resistor mounted as an electronic component for power supply? Alternatively, the tip land of the anode circuit composed of the tip land and the base land on one surface of the large substrate portion, and the tip land of the electronic circuit composed of the tip land and the base land on the other surface of the significant substrate portion. Are connected by a through hole, and the base end land of the anode circuit on one surface of the large substrate portion and the base end land of the electronic circuit on the other surface of the large substrate portion are connected by a through hole. The electronic circuit on the surface is an anode circuit, and a limiting resistor as an electronic component for power supply is mounted between the tip land and the base land of the anode circuit on one surface of the large substrate portion, and the anode on the other surface of the large substrate portion A limiting resistor as a power supply electronic component is mounted between the front end land and the base end land of the circuit, and the anode power supply harness is connected to any one of the base end lands of the anode circuit on one side and the other side of the large board portion. Are electrically and mechanically connected, and the power supply of the cathode circuit on the other surface of the narrow substrate portion is electrically and mechanically connected to the power supply harness of the cathode and the power supply wiring. If the substrate is housed and mounted inside the longitudinal passage of the heat sink housing so as to be placed on the axis of the heat sink housing, it can be lit at a constant voltage by the limiting resistor, and in the unlikely event an LED small SMD chip Even when the LED is short-circuited, the risk of adverse effects due to voltage rise on instruments and other devices, which are mounted objects of small LED lamps, is reduced, and the safety of the substrate is greatly improved. Since limiting resistors are arranged on both the one side and the other side, it is possible to greatly suppress the heat generated by the limiting resistors, and it is possible to arrange components more efficiently, resulting in higher power and higher performance small LEDs. It becomes advantageous to the miniaturization of the amplifier.

The lens-valve condensing lens part is an aspherical convex lens, which improves the illumination efficiency without increasing the size of the LED light source, enables more efficient illumination of the light flux of the LED small SMD chip, and is even better Lighting performance can be realized more economically.
Then, the cylindrical base end of the light-transmitting bulb has an optical axis of the condensing lens portion of the light-transmitting bulb and an optical axis of the LED element of the LED small-size SMD chip with respect to the periphery of the LED small-size SMD chip. In addition to being arranged on the same axis, the distance on the same axis from the light emitting surface of the LED element of the LED small SMD chip to the condenser lens part of the light-transmitting bulb matches the focal length of the condenser lens part. After the adhesive is fixed so that the three-dimensional positional relationship is adjusted, the outer peripheral wall of the cylindrical base end of the light-transmitting bulb is What is supposed to be adhesive fixed so that the positional relationship between the condensing lens part of the light-transmitting bulb and the LED small SMD chip and the mechanical connection end of the heat sink housing is adjusted, High precision screw processing and mating structure Without requiring, since it is possible to realize the production of such high-precision machining those components are combined with equal or higher accuracy becomes more inexpensive and efficient can be mass produced.

    The inner wall surface of the longitudinal passage of the heat sink housing, the back surface opposite to the light emitting surface of the LED element of the LED small SMD chip, and the power supply wiring substrate in the case of the one having the power wiring substrate, the heat sink housing According to a small LED lamp in which a space between a part of a longitudinal harness of a body and a part of a power supply harness is filled with a heat radiation resin having a high thermal conductivity that also serves as an adhesive, The resin can more efficiently transfer the heat generated by the LED small SMD chip and the power supply wiring board to the heat sink housing, dramatically improving the cooling performance, and achieving higher output and longer life. Can be possible.

    Further, according to the LED small SMD chip having a phosphor layer appropriately selected on the light emitting surface of the LED chip mounted thereon, a medical diagnosis in which color, light quantity, etc. are regarded as important It is very useful for small LED lamps that can adjust the color tone of small LED lamps built into devices, and can be used in the same way as conventional filament lamps without any discomfort even if they are replaced with conventional filament lamps. Therefore, it is possible to achieve a significant effect at a much lower price than when other techniques are used.

    The mechanical connection end of the heat sink housing is one of M4 mm, pitch 0.7 mm, M5 mm, pitch 0.8 mm, M6 mm, pitch 1.0 mm, M8 mm, and pitch 1.25 mm. The small LED lamp has compatibility with a conventional filament lamp having a cap portion of the same size, and has a higher effect by synergistic action with each structure.

    The total length from the tip of the light-transmitting valve to the base end of the mechanical connection end of the heat sink housing is regulated to 20 mm to 40 mm, and the outer diameter of the heat sink housing that is the maximum diameter is regulated to 6 mm to 14 mm. The small LED lamp thus formed can be compatible with a conventional filament lamp, and can achieve a higher effect by synergistic action with each of the structures.

In implementing the present invention having the configuration as described above, the best or desirable mode will be described.
The LED unit allows the LED small SMD chip to be incorporated into the heat sink housing and shares the function of allowing the LED small SMD chip to be supplied with electric power from the outside. A power supply wiring board arranged on the axis, an LED small SMD chip mounted in a T-shape in a side view at the front end of the power supply wiring board, and a power supply extended from the base end of the power supply wiring board And, as shown in the embodiments described later, a tip joint edge is provided at the tip of the substrate material having an outer dimension that fits in the longitudinal passage of the heat sink housing, and the substrate A power circuit board is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one surface and the other surface of the material, and a leading edge of the power circuit board is connected to the LED. The anode terminal of the LED small SMD chip corresponds to the electronic circuit on one side of the power supply wiring board with respect to the center of the back surface opposite to the surface on which the LED element of the type SMD chip is mounted. The cathode terminal of the chip corresponds to the electronic circuit on the other side of the power supply wiring board, and the mounting board of the LED small SMD chip and the power supply wiring board are arranged in a T shape in side view, and the LED small size The anode terminal of the SMD chip and the electronic circuit on the one surface are electrically and mechanically connected, and the electronic circuit on one surface of the power supply wiring board becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the other surface Are electrically and mechanically connected to each other so that the electronic circuit on the other surface of the power wiring board is a cathode circuit, and the anode circuit on one surface of the power wiring board is And, the other surface of the cathode circuit power harness from each of the should be made is stretched.

    The LED small SMD chip replaces the light source of the conventional small filament lamp, has the function of enabling light irradiation, and is replaced with either a bullet-type LED chip or a board on which a bullet-type LED chip is mounted. However, it is desirable to use an SMD type LED that can achieve a reduction in size, weight and light intensity. More specifically, it is mounted on the center of the surface of a mounting substrate made of a material with high thermal conductivity. An anode terminal and a cathode terminal which are disposed so as to face each other with an appropriate opening angle and an appropriate distance sandwiched between the mounting positions on the surface of the mounting board, the positions of which are set and electrically insulated from each other. LED elements that are extended to either the peripheral edge of the mounting substrate or the back surface opposite to the front surface of the mounting substrate, and are arranged at the mounting position of the mounting substrate. It is preferable to be mounted and connected to the anode terminal and the cathode terminal of the mounting board, and as shown in the embodiments described later, the mounting position on the surface of the mounting board is sandwiched and electrically connected to each other. An existing LED element in which an anode terminal and a cathode terminal arranged so as to face each other with an appropriate opening angle and an appropriate distance are provided so as to reach the back surface opposite to the front surface of the mounting substrate. It can be an SMD chip mounted at a position.

    The mounting substrate of the LED small SMD chip has a function of easily mounting the LED element and must be made of a material with high thermal conductivity, and more specifically, a ceramic substrate, a glass substrate, paper It can be either a phenol substrate, a paper epoxy substrate, a glass composite substrate, a Teflon (registered trademark) substrate, or a substrate made of other materials, and a small LED light source emits light from an LED element mounted thereon. It is preferable to have a phosphor layer appropriately selected on the surface.

    The heat sink housing reproduces the outer shape from the mechanical connection end of the small filament lamp to the light-transmitting bulb, and the outer shape of a substantial portion of the small filament lamp that is mounted on the glass bulb. It has the function of transmitting heat to the outside and making it possible to dissipate heat. It is made of a columnar high thermal conductivity material. The base end has a single mechanical connection end. The maximum outer diameter is 20 mm or less. The outer shape and outer dimensions of the small filament lamp mounting space are set within the space shape and space dimensions, the light source mounting cylinder wall is provided at the tip, and a longitudinal passage from the tip to the base end is opened inside. As shown in the embodiments to be described later, it is made of a cylindrical high thermal conductivity material, and the base end on the cylindrical axis is a single mechanical connection. As a space for mounting a small filament lamp with a maximum outer diameter of 20 mm or less, and the outer shape and the outer size of the space to fit within the space size. It is desirable that the front end of the light source mounting cylinder wall is provided so that the center is aligned with the center, and a longitudinal passage is opened along the axis extending from the light source mounting cylinder wall to the base portion.

    When the heat sink housing is shown as a more specific one, its mechanical connection end is M4 mm, pitch 0.7 mm, M5 mm, pitch 0.8 mm, M6 mm, pitch 1.0 mm, M8 mm, pitch 1. It can be said that it is a base part of any one of 25 mm, and is made of any one of copper alloy, aluminum alloy, steel, stainless steel, titanium alloy, magnesium alloy, and other metals. In addition, the metal can be nickel-plated or chrome-plated, or part or all of it can be made of any material such as ceramic, synthetic resin, or various fiber-reinforced resins. Yes, as shown in the examples described later, the open-cut brass bar can be cut and then nickel-plated.

    The light source mounting cylinder wall of the heat sink casing is adjusted to advance or retreat in the direction of the axis of the heat sink casing (irradiation direction) of at least one of the outer periphery of the LED small SMD chip and the cylindrical base end of the light-transmitting bulb. In addition, it is possible to adjust the position on a virtual plane orthogonal to the direction (irradiation direction) of the axis of the heat sink housing, and to adjust the inclination with respect to the direction of the shaft center (irradiation direction) of the heat sink housing. The function of enabling at least one of the outer periphery of the chip and the cylindrical base end of the translucent bulb to be fixed to the light source mounting cylinder wall in an adjusted posture is shown more specifically. , At least one of the outer periphery of the LED small SMD chip and the cylindrical base end of the light-transmitting bulb can be advanced and retracted in the direction of the cylindrical axis of the heat sink housing. Straight It is possible to adjust the position in the 360 ° direction around the axis on the imaginary plane, to adjust the inclination of the LED small SMD chip with respect to the axis, and to the axis of the cylindrical base end of the translucent bulb It must be set to an inner diameter dimension that allows a dimensional margin to adjust the inclination with respect to the heart, and is also the same inner diameter as the longitudinal passage, smaller inner diameter than the longitudinal passage, or more than the longitudinal passage Can be set to any one of the large inner diameters.

The mechanical connection end of the heat sink housing must have the same outer shape and outer dimensions as the mechanical connection end of the small filament lamp in the target device in which the small filament lamp is incorporated. As shown in the example, the outer shape and outer dimensions of the cap portion of the small filament lamp may be the same.
Further, the longitudinal passage of the heat sink case connects the light source mounting cylinder wall at the tip of the heat sink case and the mechanical connection end of the heat sink case at the base end, and the LED small SMD chip. If the power harness is extended to be exposed to the outside from the mechanical connection end and is shown as a more specific one, it will be shown in the embodiments described later, but the LED small SMD chip is mounted. The power supply wiring board arranged so that the tip is T-shaped in a side view with respect to the center of the back surface opposite to the surface on which the LED element of the board is mounted bears the function of being able to be embedded in the heat sink housing Is possible.

    The light-transmitting bulb has a function of enabling a small LED SMD chip provided on the light source mounting cylinder wall at the tip of the heat sink housing to have a high light-transmitting property and be hermetically enclosed. The outer surface of the SMD chip must be transparent to cover the outer surface, and can be a spherical surface having a substantially uniform wall thickness, such as the bottom of a test tube having a U-shaped cross-section at the tip. It is possible to have a condensing lens portion at the tip, and as shown in the examples described later, a cylindrical base end that surrounds the outer periphery of the LED small SMD chip, and a tip of the cylindrical base end And a condensing lens part facing the LED small SMD chip can be integrated, part of which is transparent, translucent, colored, colorless, glossy glass, And at least any one glass of frosted glass Made of glass that is either transparent or translucent as a whole, either colored or colorless as a whole, and either glossy glass or polished glass as a whole In addition, a part or all of them can be made of synthetic resin.

    The condensing lens part of the translucent bulb shares the function of condensing the light emitted from the LED small SMD chip in an appropriate direction outside the front end direction of the heat sink housing. If shown, as shown also in the examples described later, it can be a convex lens, a segment lens, a Fresnel lens, an aspherical lens, etc., and from the center to the centrifugal direction such as concentric, contour lines, isobaric lines, etc. It is made of translucent materials with gradually different refractions, and even if the lens part has approximately the same thickness, it has been replaced with an optical component that can exhibit the condensing function or a prism that can exhibit the condensing function. Is possible.

    The power supply wiring board must share the function of enabling the power harness to be connected to the LED small SMD chip with sufficient strength while preventing a short circuit, and must be made of a high thermal conductivity material. Specifically, an electronic circuit that can be either an anode circuit or a cathode circuit is provided on each of the one surface and the other surface, and the base portion of the small-width substrate portion whose tip is set to be narrow in advance, one surface and the other An electronic circuit that can be either an anode circuit or a cathode circuit is provided on each of the surfaces, and a large substrate portion that is set wider than the narrow substrate portion is mechanically separated through a linear weak portion that is easily divided. If either the large board part is unnecessary or the narrow board part is not required, either the small board part or the large board part separated along the line weakened part is selected. In Inside the running through passage of the heat sink housing, it is desirable to to that shall become housed mounted so arranging on the axis of the heat sink housing.

    Further, an electronic circuit that can be either an anode circuit or a cathode circuit is provided on each of the one surface and the other surface, and the base portion of the small-width substrate portion whose tip is set to a small width in advance and each of the one surface and the other surface are provided. An electronic circuit that can be either an anode circuit or a cathode circuit is provided, and a large substrate portion that is set wider than the narrow substrate portion is mechanically integrated through a linear weak portion that is easily divided. The LED small SMD chip mounting substrate and the power supply wiring substrate are arranged in a T-shape when viewed from the side, and the anode terminal of the LED small SMD chip and the electronic circuit on one surface of the small width substrate portion are electrically and mechanically The electronic circuit on one surface of the small substrate portion becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the electronic circuit on the other surface of the small substrate portion are electrically connected. The electronic circuit on the other surface of the narrow substrate portion is a cathode circuit, and the narrow substrate portion and the large substrate portion are not separated along the linear weakened portion. An anode circuit on one surface of the narrow substrate portion and an electronic circuit on one surface of the large substrate portion are electrically connected across the linear fragile portion so that the electronic circuit of the large substrate portion becomes an anode circuit, and the large substrate A power supply electronic component is mounted in the middle of the anode circuit on at least one surface of the section, and the power harness of the anode gap is electrically and mechanically more than the power supply electronic component of the anode circuit of the substrate section. In addition to being connected, the power supply of the cathode circuit on the other side of the narrow substrate portion is electrically and mechanically connected to the power harness of the cathode and the power supply wiring board is connected to the heat sink housing. Inside the longitudinal passage, heat Can be made are accommodated mounted so arranging on the axis of the tank housing.

    More specifically, the power supply wiring substrate may be a ceramic substrate, a glass substrate, a paper phenol substrate, a paper epoxy substrate, a glass composite substrate, a Teflon (registered trademark) substrate, or a substrate made of other materials. As shown in the embodiments described later, an electronic circuit that can be either an anode circuit or a cathode circuit is provided on each of the one surface and the other surface, and the tip is set to be narrow in advance. The base part of the narrow substrate part and the electronic circuit that can be either an anode circuit or a cathode circuit are provided on each of the one surface and the other surface, and the large substrate part set wider than the narrow substrate part can be easily separated. When the LED small SMD chip mounting substrate and the power supply wiring substrate are arranged in a T-shape when viewed from the side, In addition, the anode terminal of the LED small SMD chip and the electronic circuit on one surface of the narrow substrate portion are electrically and mechanically connected, and the electronic circuit on the one surface of the narrow substrate portion becomes an anode circuit, and the LED small SMD The cathode terminal of the chip and the electronic circuit on the other surface of the narrow substrate portion are electrically and mechanically connected, and the electronic circuit on the other surface of the narrow substrate portion is used as a cathode circuit along the linear fragile portion. Thus, the small substrate portion and the large substrate portion are not separated, and the anode circuit on one surface of the small substrate portion and the electronic circuit on one surface of the large substrate portion are electrically connected to the linear weak portion. The electronic circuit of the large substrate portion is connected to each other as an anode circuit, and is separated along the line weakened portion, and the anode circuit on one surface of the narrow substrate portion and the electron on one surface of the large substrate portion The circuit is over the linear fragile part The power supply electronics are electrically connected to each other in the middle of the anode circuit on one side of the large board portion, and in the middle of the anode circuit in the middle of the electronic circuit on the other side of the large board portion. A limiting resistor as a component is mounted, or the front end land of the anode circuit including the front end land and the base end land on one surface of the large board portion, and the front end land and the base on the other surface of the large board portion The leading end land of the electronic circuit composed of the end land is connected by a through hole, and the proximal end land of the anode circuit on one surface of the large substrate portion and the proximal land of the electronic circuit on the other surface of the large substrate portion are through. Connected with a hole, the electronic circuit on the other surface of the large substrate portion is an anode circuit, and a limiting resistor as a power supply electronic component is mounted between the leading land and the proximal land of the anode circuit on one surface of the large substrate portion A limiting resistor as an electronic component for power supply is mounted between the front end land and the base end land of the anode circuit on the other surface of the large substrate portion, and one of the anode circuits on one surface and the other surface of the large substrate portion is mounted. A power harness for the anode is electrically and mechanically connected to the proximal land, and a power supply for the cathode circuit on the other side of the small-width substrate section is electrically and mechanically connected In addition, the power supply wiring board may be housed and mounted inside the longitudinal passage of the heat sink casing so as to be disposed on the axis of the heat sink casing.

    The line weakened part of the power circuit board shares the function of easily integrating the base part of the narrow board part and the large board part into one board, and is unnecessary for the board and circuit using shearing tools. That can easily divide the base of the narrow board part and the large board part without damaging the board, or causing unnecessary damage to the board and circuit without using special tools. The base portion of the narrow substrate portion and the large substrate portion can be easily separated from each other, and the perforated hole line penetrating the front and back surfaces of the power supply wiring substrate, the power supply wiring substrate In addition to the machine groove line provided on at least one of the front and back surfaces, or a linear groove having a V-shaped cross-section or U-shaped cross-section, the base portion of the narrow substrate portion and the large substrate portion Connected and stronger than those small and large board parts It is possible to replace it with a connecting part made of a low material, and it is possible to mechanically fit the base part of the narrow board part and the large board part, and replace it with a mechanically detachable fitting mechanism. It is possible.

In addition, in the small LED lamp of the present invention, a high thermal conductivity heat radiation resin that also serves as an adhesive is formed in the gap between the LED small SMD chip and the power supply wiring board inside the longitudinal passage of the heat sink housing. More specifically, as shown in the examples described later, the inner wall surface of the longitudinal passage of the heat sink housing, the light emitting surface of the LED element of the LED small SMD chip, and more specifically, Is between the back side that is the opposite side, and in the case of having a power supply wiring board, between the power supply wiring board and a part of the power supply harness arranged in the vertical passage of the heat sink housing It is possible to fill the space with a heat dissipation resin having a high thermal conductivity that also serves as an adhesive, and the heat dissipation resin is a urethane or silicone adhesive having a high heat conductivity mixed with a filler. To do In addition, the heat-dissipating resin can be hard enough to firmly integrate built-in components such as LED small SMD chips and power wiring boards into the longitudinal passage of the heat sink housing. Therefore, it is possible to protect the built-in components such as the LED small SMD chip and the power supply wiring board from the external force applied to the heat sink housing or the light-transmitting bulb.
In the following, the structure of the present invention will be described in detail together with an embodiment representative of the present invention shown in the drawings.

The drawings show some typical embodiments embodying the technical idea of the small LED lamp of the present invention.
It is a three-plane figure which shows a small LED lamp. It is a three-plane figure which shows the positioning process of LED small SMD chip | tip. It is a three-plane figure which shows the assembly process of an LED unit. It is a three-plane figure which shows the positioning assembly process of a translucent valve. It is a three-plane figure which shows the positioning assembly process of a small LED lamp. It is a front view which shows the narrow board | substrate part isolate | separated from the large board | substrate part. It is a three-plane figure which shows the wiring board for power supplies. It is the front view and side view which show the positioning process of LED small SMD chip | tip. It is a top view which shows the positioning process of LED small SMD chip | tip. It is the front view and side view which show the wiring board for power sources with which LED small SMD chip | tip was integrated. It is a front view which shows the wiring board for power supplies with which the harness for power supplies of the cathode gawa was wired. It is a rear view which shows the power supply wiring board by which the power harness for anodes was wired. It is the rear view and side view which show the wiring board for power supplies with which the harness for power supplies was wired. It is a three-plane figure which shows the positioning assembly process of a translucent valve. It is a rear view which shows the mounting process of a reinforcement tube. It is a rear view which shows the process of incorporating an LED unit in a heat sink housing. It is a three-plane figure which shows the positioning coupling | bonding process of LED small SMD chip | tip. It is a front view which shows an example of a small LED lamp. It is a front view which shows the other example of a small LED lamp. It is a front view which shows the other example of a small LED lamp. It is a front view which shows the other example of a small LED lamp. It is a front view which shows the other example of a small LED lamp. It is a front view which shows the other example of a small LED lamp.

The example shown in FIGS. 1 to 7 is a small filament lamp which is made of a columnar high thermal conductivity material, has a base end with a single mechanical connecting end 20 and has a maximum outer diameter of 20 mm or less. A heat sink in which the outer shape and outer dimensions are set to fit within the space shape and space dimensions of the mounting space, the light source mounting cylinder wall 21 is provided at the distal end, and the longitudinal passage 22 from the distal end to the proximal end is opened inside. An LED small SMD chip 3 having a housing 2 and arranged in the center of the light source mounting cylindrical wall 21 at the tip of the heat sink housing 2 is mounted in a high heat conduction state with respect to the heat sink housing 2, Power supply harnesses 35, 35 connected to the LED small SMD chip 3 are extended from the mechanical connection end 20 through the longitudinal passage 22 so as to be exposed to the outside, and around the LED small SMD chip 3. The light-emitting bulb 5 is integrated with at least one of the light source mounting cylindrical wall 21 and the outer periphery of the LED small SMD chip 3 itself. 1 shows a typical example of a lamp.
In the following, the structure of the small LED lamp 1 will be shown sequentially in accordance with an example of the manufacturing process of the small LED lamp 1 of the present invention.

    As can be clearly seen from these drawings, the small LED lamp 1 of the present invention basically has an LED unit U having an LED small SMD chip 3 and a power supply harness 35 with respect to the heat sink housing 2, and The translucent bulb 5 is fixed and integrated in a state in which the positional relationship among the heat sink housing 2, the LED small SMD chip 3 and the translucent bulb 5 is adjusted, and the heat sink housing 2 is A free-cutting brass rod, which is a columnar high thermal conductivity material, is machined and the base end on the nickel-plated cylindrical axis C is M4mm as the single mechanical connecting end, pitch 0.7mm Or M5 mm, pitch 0.8 mm, M6 mm, pitch 1.0 mm, M8 mm, pitch 1.25 mm, any one of the base parts 20, and a replacement object having a maximum outer diameter of 20 mm or less The outer shape and outer dimensions of the small filament lamp mounting space are set within the space shape and the space size, and the tip of the cylindrical axis C on the alligator light source mounting cylinder wall 21 is mounted on the light source. The cylindrical wall 21 is provided so as to coincide with the center, and a longitudinal passage 22 is opened along the axis C extending from the light source mounting cylindrical wall 21 to the base portion 20.

    As shown in FIG. 2, the LED small SMD chip 3 has a mounting position 31 set at the center of the surface of a mounting board 30 made of, for example, ceramic, which is a high thermal conductivity material, and the mounting position 31 on the surface of the mounting board 30 is set. An anode terminal 32 and a cathode terminal 33 which are disposed so as to face each other with an appropriate opening angle (for example, 90 ° to 180 °) electrically insulated from each other and an appropriate distance are opposite to each other on the mounting substrate 30. The mounting position on the surface of the mounting substrate 30 is extended to a position that wraps around the periphery that becomes the gap, reaches the back surface opposite to the front surface of the mounting substrate 30, and holds the insulation at an appropriate interval from each other. The LED element 34 is disposed on the light emitting surface of the LED element 34. The LED element 34 is appropriately selected on the light emitting surface according to various conditions such as light emission color and hue suitable for the purpose of use of the small LED lamp 1. The phosphor layer 37 is provided and is surface-mounted by being electrically and mechanically connected to the anode terminal 32 and the cathode terminal 33 of the mounting substrate 30.

    As shown in FIGS. 2 and 6, the LED small SMD chip 3 includes an anode terminal 32 and a cathode terminal on the back surface of the LED small SMD chip 3 opposite to the surface on which the LED element 34 is mounted. In the center between 33, the power supply wiring substrate 4 (small substrate portion 42) has an angle of 90 ° with respect to the axis Z (C) in the irradiation direction of the LED element 34 of the LED small SMD chip 3. On the virtual plane, the X direction parallel to one surface and the other surface of the power supply wiring board 4 (small width substrate portion 42), and Y perpendicular to the one surface and the other surface of the power supply wiring board 4 (small width substrate portion 42). The mounting position 31 of the LED small SMD chip 3 and the center of gravity of each shape of the power supply wiring board 4 (small board part 42) are on the same axis Z (C). Is positioned to align with To have.

    As shown in FIGS. 2 and 7, the power wiring board 4 has a planar shape whose tip is reduced in a bottleneck shape so that a smaller one of various LED small SMD chips 3 can be mounted. The base portion of the narrow substrate portion 42 set to a small width dimension slightly wider than the tip and the electronic component for power supply (48: see FIG. 10) having a width dimension larger than that of the narrow substrate portion 42 are mounted. The leading end of the large substrate portion 45 set so as to be large is linear on at least one of the one surface and the other surface on the boundary line between the base portion of the small substrate portion 42 and the leading end of the large substrate portion 45. It is assumed that they are integrated via a straight V-shaped groove 44 to be a weakened portion 44, and the tip end of the narrow substrate portion 42 is perpendicular to one surface and the other surface of the narrow substrate portion 42. 43 of the narrow substrate portion 42 Electronic circuits 4a and 4a that can be either an anode circuit or a cathode circuit depending on the wiring structure are provided on each of the surface and the other surface. Depending on the wiring structure, one surface and the other surface of the large substrate portion 44 are provided. The electronic circuits 4b and 4b that can be either an anode circuit or a cathode circuit are provided.

    The electronic circuits 4a and 4a on the one surface and the other surface of the narrow substrate portion 42 of the power supply wiring board 4 have the same circuit pattern on the front and back, and the electronic circuits on the one surface and the other surface of the large substrate portion 45, respectively. The circuit patterns 4b and 4b are also identical to each other, and the electronic circuit 4a on one surface of the narrow substrate portion 42 and the electronic circuit 4a on the other surface are separated by the straight V-shaped groove 44 serving as the line weakened portion 44. 4a and the large substrate portion 45 are electrically separated into an electronic circuit 4b on one side and an electronic circuit 4b on the other side, and the electronic circuits 4a and 4a of the narrow substrate portion 42 are respectively Leading lands a, a and base lands b, b are provided, and electronic components for power supply (48: see FIG. 10) are respectively provided on the electronic circuits 4b, 4b on one side and the other side of the large board portion 45, respectively. Tip lands c, c and base end that can be mounted Command d, has been assumed that the d provided.

    As shown in FIGS. 2, 3, and 6, the back surface of the mounting position 31 of the LED small SMD chip 3 corresponds to a trap and in the center between the anode terminal 32 and the cathode terminal 33 on the back surface of the mounting substrate 30. The power supply wiring board 4 (small board part 42) is joined so that the front end joining edge 43 has a T-shape when viewed from the side, and the electronic circuit 4a on one surface of the power wiring board 4 (small board part 42). The anode terminal 32 of the LED small SMD chip 3 is electrically and mechanically connected to the front end land a by a soldering portion P, and the electronic circuit 4a on one surface of the power supply wiring substrate 4 (small substrate portion 42). Becomes the anode circuit 40, and the cathode terminal 33 of the LED small SMD chip 3 is connected to the soldering portion P on the tip land a of the electronic circuit 4a on the other surface of the power supply wiring substrate 4 (small substrate portion 42). By Electrically and mechanically connected, the electronic circuit 4a on the other surface of the power supply wiring board 4 (small-width substrate part 42) becomes a cathode circuit 41, and the power-supply wiring board 4 (small-width) is formed by the soldering portions P and P. A substrate portion 42) is coupled to the center of the back surface of the LED small SMD chip 3.

    As shown in FIG. 3 and FIG. 6, the power supply wiring board 4 (small board part 42) combined with the LED small SMD chip 3 is bent with a straight V-shaped groove 44 serving as the linear weak part 44 as a boundary. The external substrate is applied with an external force or is cut with a cutting tool or the like, and the large substrate portion 44 is removed from the base portion of the narrow substrate portion 42, and the base end of the anode circuit 40 on one surface of the narrow substrate portion 42 The power harnesses 35 and 35 are electrically and mechanically connected to the land b and the base end land b of the cathode circuit 41 on the other surface by the soldering portions P and P, and the LED unit U is completed. Will be.

    As shown in FIG. 4, the surface on which the LED element 34 is mounted covers the outer periphery of the LED small SMD chip 3 in which the narrow substrate portion 42 of the LED unit U is joined in a T-shaped cross section. A cylindrical base end 50 that surrounds the outer periphery of the LED small SMD chip 3, and a condensing lens unit that covers the tip of the cylindrical base end 50 in a sealed manner and faces the LED element 34 of the LED small SMD chip 3. 51 is arranged so as to be integrated through the cylindrical base end 50, and an axis Z (C) in the irradiation direction of the LED element 34 of the LED small SMD chip 3. The power supply wiring board 4 on a virtual plane having an angle of 90 ° with respect to the direction (direction indicated by a white arrow in FIG. 4) and the axis Z (C) of the irradiation direction of the LED element 34 An X direction parallel to one surface and the other surface of the (small substrate portion 42); The position including the focal length is adjusted in one direction and the Y direction perpendicular to the other surface of the power supply wiring board 4 (small-width substrate portion 42), and the outer peripheral wall of the LED small SMD chip 3 is transparent. The inner peripheral wall of the cylindrical base end 50 of the light valve 5 is bonded with an adhesive by either an adhesive for temporary fixing having a sealing function or an adhesive A1 that is firmly fixed; It has become.

    As shown in FIGS. 4 and 5, the base ends of the power harnesses 35, 35 coupled to the narrow board portion 42 are set to appropriate lengths, and the outer diameter thereof opens to the base portion 20 of the heat sink housing 2. The reinforcing tube 36 set to be smaller than the inner diameter of the longitudinal passage 22 is attached to the outer end of the longitudinal tube 22 so that the distal end of the reinforcing tube 36 is exposed inside the longitudinal passage 22. The LED unit U assembled as described above has the rear ends of the power harnesses 35 and 35 and the reinforcing tube 36 in the longitudinal passage 22 of the heat sink housing 2 from the rear end of the base portion 20. The condensing lens portion 51 of the light-transmitting bulb 5 that is exposed is combined so that it is exposed from the tip of the light source mounting cylindrical wall 21, and the forward / backward adjustment of the heat sink housing 2 in the direction of the cylindrical axis C (Z) And the axis On the virtual plane orthogonal to the C (Z) direction, the position is adjusted including the adjustment of the outer dimensions in the X and Y directions perpendicular to each other, and the light source mounting cylinder wall 21 (longitudinal through) of the heat sink housing 2 is adjusted. Between the inner peripheral wall of the path 22) and the outer peripheral wall surface of the cylindrical base end 50 of the light-transmitting bulb 5, and the inner peripheral wall of the light source mounting cylindrical wall 21 (longitudinal path 22), and the outside of the LED small SMD chip 3. It is tightly and tightly integrated with a thermosetting adhesive A2 injected into at least one of the surrounding walls.

    Further, as shown in FIG. 5, the inner wall surface of the longitudinal passage 22 of the heat sink housing 2, the back surface opposite to the light emitting surface of the LED element 33 of the LED small SMD chip 3, and the wiring board 4 for power supply An outer peripheral wall surface, a part of the outer peripheral wall of the power harness 35 disposed on the inside of the longitudinal passage 22 of the heat sink housing 2, and an outer peripheral wall of the reinforcing tube 36 sheathed on the power harness 35 The space between the two is filled with either a heat-radiating resin A3 of either urethane or silicone having high thermal conductivity that also serves as an adhesive.

(Operation / Effect of Example 1)
As shown in FIG. 2, the small LED lamp 1 of the present invention having the configuration as described above includes a power supply wiring board 4 connected to the LED small SMD chip 3, and includes a small-width substrate portion 42 and a large-sized substrate. It is possible to keep the portion 45 integrated, and it is easy to adjust the inclination of the axis C (Z) of the small width substrate portion 42 with respect to the LED small SMD chip 3 to a right angle with higher accuracy and to combine them. In addition, the electronic circuit 4a, 4a, 4b, 4b on one surface and the other surface of the narrow substrate portion 42 and the large substrate portion 45 of the power supply wiring substrate 4 are all dependent on the wiring connection structure, and the anode circuit 40 Alternatively, since either one of the cathode circuits 41 can be formed, the combination of the circuits is not considered when the LED small SMD chip 3 and the narrow substrate portion 42 of the power supply wiring board 4 are coupled. Since it is possible to concentrate on increasing the component positioning accuracy, it simplifies the manufacture and quality control, becomes much that can be efficiently produced a high quality compact LED lamp 1.

The example shown in FIGS. 7 to 17 is a small size of the present invention in which a power supply electronic component 48 is provided at an appropriate position in the middle of the anode circuit 40 of the power supply wiring board 4 coupled to the LED small size SMD chip 3 of the LED unit U. The other Example in an LED lamp is shown.
In the following, the structure of the small LED lamp 1 will be described sequentially according to another example of the manufacturing process of the small LED lamp of the present invention.

    The power supply wiring board 4 of the LED unit U used in the small LED lamp 1 shown in the other embodiment is the same component 4 as that shown in FIG. 7 of the first embodiment, and the anode circuit is provided on each of the one surface and the other surface. 40 and cathode circuit 41 are provided. Electronic circuits 4a and 4a are provided, and the anode circuit 40 or cathode is provided on the base portion of the narrow substrate portion 42 whose tip is set to be narrow in advance, and on one surface and the other surface, respectively. An electronic circuit 4b, 4b that can be either one of the circuits 41 is provided, and a large substrate portion 45 set wider than the narrow substrate portion 42 is mechanically connected via a linear weakened portion 44 that can be easily divided. They are integrated and used as they are without being separated along the line weakened portion 44.

    As shown in FIGS. 8 and 9, the back surface of the mounting position 31 of the LED small SMD chip 3 corresponds to a trap, and the power source is located at the center between the anode terminal 32 and the cathode terminal 33 on the back surface of the mounting substrate 30. The front-end joining edge 43 of the wiring board 4 (small-width board portion 42) is joined so as to have a T-shape when viewed from the side, and the front-end land of the electronic circuit 4a on one surface of the power-supply wiring board 4 (small-width board portion 42). a) the anode terminal 32 of the LED small SMD chip 3 is electrically and mechanically connected by the soldering portion P, and the electronic circuit 4a on one surface of the power wiring board 4 (small substrate portion 42) is connected to the anode The cathode terminal 33 of the LED small SMD chip 3 is electrically connected by the soldering part P to the tip land a of the electronic circuit 4a on the other surface of the power supply wiring board 4 (small board part 42). And the electronic circuit 4a on the other surface of the power supply wiring board 4 (small-width substrate portion 42) becomes a cathode circuit 41, and the power-supply wiring board 4 (small-width substrate portion 42) is connected to the LED. The small SMD chip 3 is coupled to the center of the back surface.

    As shown in FIGS. 10 and 11, in the power supply wiring board 4, the anode circuit 40 and the cathode circuit 41 on the one surface of the narrow substrate portion 42, the electronic circuit 4 b on the one surface of the large substrate portion 45, and the other surface. The electronic circuit 4b is obtained by electrically separating the small substrate portion 42 and the large substrate portion 45 from each other at the portion of the linear V-shaped groove 44 that is the linear weak portion 44. For example, a tin-plated wire or an enamel wire is provided between the base end land b of the anode circuit 40 on one surface of the narrow substrate portion 42 of the wiring board 4 and the tip land c of the electronic circuit 4b on one surface of the large substrate portion 45. A short connecting conductor 47 is bridged and mechanically and electrically connected via the soldering portion P, and the electronic circuit 4b on one surface of the large substrate portion 45 becomes the anode circuit 40.

    In the large circuit board portion 45 of the power supply wiring board 4, the tip land c of the electronic circuit 4 b (anode circuit 40) on one surface and the tip land c of the electronic circuit 4 b on the other surface are connected by a through hole H. The base end land d of the electronic circuit 4b on one side (anode circuit 40) and the base end land d of the electronic circuit 4b on the other side are connected by a through hole H, and the electronic circuit 4b on the other side of the substrate portion 45 is anode. A limiting resistor 48 as a power supply electronic component 48 is connected to the soldered portions P and P between the front end land c and the base end land d of the electronic circuit 4b (anode circuit 40) on one surface of the large board portion 45. As an electronic component 48 for power supply between the front end land c and the base end land d of the electronic circuit 4b (anode circuit 40) on the other surface of the large board portion 45. Of the above Soldering section limiting resistor 48 of the same resistance value P, has to have been implemented are electrically and mechanically secured through the P.

    As shown in FIG. 11 to FIG. 13, the power supply wiring board 4 has a power supply board on the other surface of the large board portion 45 with respect to the base end land b of the electronic circuit 4 a (cathode circuit 41) on the other surface of the narrow substrate section 42. A power supply harness 35 is electrically and mechanically connected via a soldering portion P to a cathode circuit 41 wound on the substrate so as to bypass the limiting resistor 48 as the electronic component 48. On the base end land d of the electronic circuit 4 b (anode circuit 40) on one surface of the large-sized substrate portion 45 of the power supply wiring board 4, the power supply harness 35 is electrically connected to the anode circuit 40 via the soldering portion P. It is mechanically connected.

    As shown in FIG. 14, a cylindrical base end 50 that surrounds the outer periphery of the LED small SMD chip 3 so that the surface on which the LED element 34 is mounted covers the outer periphery of the LED small SMD chip 3. And the condensing lens part 51 which covers the tip of the cylindrical base end 50 in a sealed manner and confronts the LED element 34 of the LED small SMD chip 3 is integrated into the same cylindrical shape. The LED element 34 of the LED small SMD chip 3 is arranged so as to be integrated via the base end 50, and the axis Z (C) of the irradiation direction of the LED element 34 and the axis Z (C of the irradiation direction of the LED element 34) ) On the virtual plane having an angle of 90 ° with respect to the X direction parallel to one surface and the other surface of the power supply wiring substrate 4 (small-width substrate portion 42), and the power-supply wiring substrate 4 (small-width substrate portion 42). ) In the Y direction perpendicular to one surface and the other surface ( And the position of the outer peripheral wall of the LED small SMD chip 3 and the inner peripheral wall of the cylindrical base end 50 of the light-transmitting bulb 5 have a sealing function. The adhesive is bonded by an adhesive A1 which is either an adhesive or an adhesive that is firmly fixed.

    As shown in FIGS. 15 to 17, the base ends of the power supply harnesses 35, 35 coupled to the power supply wiring board 4 (the narrow board portion 42 and the large board portion 45) and extended from the base end of the large board portion 45. The reinforcing tube 36 whose outer diameter is set to an appropriate length and whose outer diameter is set to be smaller than the inner diameter of the longitudinal passage 22 opening in the base portion 20 of the heat sink housing 2 has a distal end at which the longitudinal passage 22 extends. It can be mounted inside, and the outer end thereof can be externally exposed to the outside of the longitudinal passage 22, and the LED small SMD chip 3 and the power supply wiring substrate 4 (the small width substrate portion 42 and the large width substrate portion 45). ) In the longitudinal passage 22 of the heat sink housing 2, the rear ends of the power harnesses 35, 35 and the reinforcing tube 36 are exposed from the rear end of the base portion 20, and the translucent bulb 5 The optical lens unit 51 is combined so as to be exposed from the tip of the light source mounting cylindrical wall 21, and is advanced and retracted in the direction of the cylindrical axis C (Z) of the heat sink housing 2 (indicated by a white arrow); The light source mounting cylinder wall of the heat sink housing 2 is adjusted on the imaginary plane orthogonal to the axial center C (Z) direction and adjusted in the X and Y directions perpendicular to each other, including the adjustment of the outer dimensions. 21 (vertical passage 22) and the outer peripheral wall surface of the cylindrical base end 50 of the light-transmitting bulb 5, the inner peripheral wall of the light source mounting cylindrical wall 21 (vertical passage 22), and the LED small SMD chip 3 is tightly and firmly integrated with a thermosetting adhesive A2 injected into at least one of the three outer peripheral walls.

    Further, as shown in FIG. 17, the inner wall surface of the longitudinal passage 22 of the heat sink housing 2, the back surface opposite to the light emitting surface of the LED element 33 of the LED small SMD chip 3, and the wiring board 4 for power supply An outer peripheral wall surface, a part of the outer peripheral wall of the power harness 35 disposed on the inside of the longitudinal passage 22 of the heat sink housing 2, and an outer peripheral wall of the reinforcing tube 36 sheathed on the power harness 35 The space between the two is filled with either a heat-radiating resin A3 of either urethane or silicone having high thermal conductivity that also serves as an adhesive.

(Operation / Effect of Example 2)
As shown in FIGS. 8, 14 and 17, the small LED lamp 1 of the present invention has a power supply wiring board 4 (substantially board portion 45) on a cylindrical axis C (Z) of the heat sink housing 2. A pair of limiting resistors 48 having the same resistance value and the front and back sides of each of the front-end lands c and the base-end lands d of the double-sided electronic circuits 4b, 4b that are housed and connected by the through holes H of the board portion 45, 48 is mounted, it is possible to secure a large component mounting space on both surfaces of the power supply wiring board 4 (substantially board portion 45) in the longitudinal passage 22 of the small-diameter heat sink housing 2. The assembly process of the LED unit U in which the LED small SMD chip 3 and the power supply wiring board 4 are combined in a T shape, the assembly process of the translucent bulb 5 into the LED unit U, and the heat sink of the LED unit U In each step of the assembly process to the body 2, the advancement / retraction adjustment (direction indicated by the white arrow) of the cylindrical heat sink housing 2 in the direction of the cylindrical axis C (Z) and orthogonal to the axis C (Z) direction The position adjustment in the X and Y directions perpendicular to the axis C (Z) on the plane to be performed can be performed with higher accuracy and ease.

    The examples shown in FIGS. 18 to 23 show actual dimensions of the small LED lamp 1 of the present invention. More specific structures of the heat sink housing 2, the LED unit U, and the light-transmitting bulb 5 are as follows. These are basically the same as those shown in either the first embodiment or the second embodiment. The small LED lamp 1 shown in FIG. 18 has a total length L of 20 mm and the length of the heat sink housing 2. L0 is 17 mm, the translucent bulb 5 protruding length L1 is 3 mm, the heat sink housing 2 has a diameter D0 of Φ6.0 mm, the translucent bulb 5 has a diameter D1 of Φ4.9 mm, and the dimension N of the base 20 is M4, P0.7 19 has a total length L of 27 mm, a length L0 of the heat sink housing 2 of 24 mm, a translucent bulb 5 protruding length L1 of 3 mm, a diameter D0 of the heat sink housing 2 of Φ6.22 mm, The diameter D1 of the light valve 5 is Fai4.9Mm, dimension N of the mouthpiece portion 20 is M5, a P0.8.

    20 has a total length L of 25 mm, a length L0 of the heat sink housing 2 of 20 mm, a translucent bulb 5 protruding length L1 of 5 mm, a diameter D0 of the heat sink housing 2 of Φ7.3 mm, and a translucent bulb. 5 has a diameter D1 of Φ6.2 mm, a size N of the base portion 20 of M5 and P0.8, and the small LED lamp 1 of FIG. 21 has an overall length L of 34 mm, a heat sink housing 2 has a length L0 of 28 mm, The protruding length L1 of the light valve 5 is 6 mm, the diameter D0 of the heat sink housing 2 is Φ8.2 mm, the diameter D1 of the light-transmitting valve 5 is Φ7 mm, and the dimension N of the base 20 is M6 and P1.0.

    The small LED lamp 1 of FIG. 22 has a total length L of 36 mm, a length L0 of the heat sink housing 2 of 26 mm, a translucent bulb 5 protruding length L1 of 10 mm, a diameter D0 of the heat sink housing 2 of Φ12 mm, The diameter D1 is Φ10 mm, the dimension N of the base part 20 is M6, P1.0. The small LED lamp 1 in FIG. 23 has a total length L of 40 mm, a heat sink housing 2 length L0 of 26 mm, and a translucent bulb 5 protruding. The length L1 is 14 mm, the diameter D0 of the heat sink housing 2 is Φ14 mm, the diameter D1 of the translucent bulb 5 is Φ12 mm, and the dimension N of the base 20 is M8, P1.25.

(Operation / Effect of Example 3)
As shown in FIGS. 18 to 23, each of the small LED lamps 1 of the present invention has an outer shape and outer dimensions of a heat sink housing 2 having a base part 20 at the base end. Since the outer shape and outer dimensions of the light-transmitting bulb 5 exposed at the tip of the lamp are set to conform to the outer shape and dimensions of the existing small filament lamp, it is assumed that the conventional small filament lamp is used. It will be possible to meet the demand for replacement of various equipment such as produced inspection equipment, test equipment, and experimental equipment with small LED lamps.

(Conclusion)
As described above, the small LED lamp of the present invention can achieve the intended purpose evenly by its novel configuration, and is easy to manufacture, which is much larger than the conventional small filament lamp technology. This can reduce power consumption, reduce weight and extend durability life, make it much more economical, increase productivity, significantly increase the yield rate, and reduce costs. In addition to companies and organizations that use various devices incorporating small filament lamps, as well as LED lamp manufacturing and sales industries, etc., It has been highly evaluated in the manufacturing industry for various devices that have developed, manufactured, and provided small LED lamps, and is widely used and popularized. It is expected to be the thing.

1 Small LED lamp 2 Heat sink housing
20 Joint part (Mechanical connection end)
21 Cylinder wall with light source
22 Longitudinal passage C Same axis of heat sink housing U LED unit 3 LED small SMD chip
30 Same mounting board
31 Same mounting position
32 Same anode terminal
33 Same cathode terminal
34 Same LED element
35 Same power harness
36 Same reinforcement tube
37 Same phosphor layer Z Axial axis of LED element 4 Wiring board for power supply
40 Same anode circuit
41 Same cathode circuit
42 Same narrow substrate
4a Same electronic circuit
a Same tip land
b Basic Land
43 Same tip joint edge
44 Same V-shaped groove (linear weak part)
45 Same board part
4b Electronic circuit
c Advanced Land
d Basic Land
H Same through hole
47 Same connecting wire
48 Same limiting resistor (electronic components for power supply)
X Direction parallel to one side and the other side of the wiring board for power supply Y Direction perpendicular to one side and the other side of the wiring board for power supply 5 Translucent valve
50 Same cylindrical base end
51 Condenser Lens P P Solder A1 Adhesive A2 Thermosetting Adhesive A3 Heat Dissipation Resin L Total Length of Small LED Lamp L0 Length of Heat Sink Housing L1 Projection Length of Translucent Valve D0 Diameter of Heat Sink Housing D1 Through Diameter of light bulb N Dimensions of base

Claims (15)

    It is made of a columnar high thermal conductivity material, the base end has a single mechanical connection end, and within the space shape and space dimensions of a small filament lamp mounting space to be replaced with a maximum outer diameter of 20 mm or less. It has a heat sink housing that is set to the outer shape and outer dimensions to be accommodated, is provided with a light source mounting cylinder wall at the distal end, and has a longitudinal passage extending from the distal end to the proximal end inside. An LED small SMD chip that is arranged in the center of the light source mounting cylinder wall and has an LED element facing outward is mounted in a high thermal conduction state with respect to the heat sink housing, and is connected to the LED small SMD chip. A harness extends from the mechanical connection end through the longitudinal passage of the heat sink housing to be exposed to the outer edge, and the tip of the heat sink housing corresponds to the outer periphery of the LED small SMD chip. Light source mounting tubular wall, and, the LED miniature SMD chip itself on one outer at least one of the surrounding of a small LED lamp is characterized in that it is assumed that transparent bulb is formed by integrally.     It is made of a columnar high thermal conductivity material, the base end has a single mechanical connection end, and within the space shape and space dimensions of a small filament lamp mounting space to be replaced with a maximum outer diameter of 20 mm or less. It has a heat sink housing that is set to the outer shape and outer dimensions to be accommodated, is provided with a light source mounting cylinder wall at the distal end, and has a longitudinal passage extending from the distal end to the proximal end inside. An LED small SMD chip that is arranged in the center of the light source mounting cylinder wall and has an LED element facing outward is mounted in a high thermal conduction state with respect to the heat sink housing, and is connected to the LED small SMD chip. A harness extends from the mechanical connection end through the longitudinal passage of the heat sink housing to be exposed to the outer edge, and the tip of the heat sink housing corresponds to the outer periphery of the LED small SMD chip. A light-transmitting bulb is integrated with at least one of the light source mounting cylindrical wall and the outer periphery of the LED small SMD chip itself, and can be replaced with an existing small filament lamp. A small LED lamp characterized by     It is made of a columnar high thermal conductivity material, the base end has a single mechanical connection end, and within the space shape and space dimensions of a small filament lamp mounting space to be replaced with a maximum outer diameter of 20 mm or less. It has a heat sink housing that is set to the outer shape and outer dimensions to be accommodated, is provided with a light source mounting cylinder wall at the distal end, and has a longitudinal passage extending from the distal end to the proximal end inside. An LED small SMD chip that is arranged in the center of the light source mounting cylinder wall and has an LED element facing outward is mounted in a high thermal conduction state with respect to the heat sink housing, and is connected to the LED small SMD chip. A harness extends from the mechanical connection end through the longitudinal passage of the heat sink housing to be exposed to the outer edge, and the tip of the heat sink housing corresponds to the outer periphery of the LED small SMD chip. A light-transmitting bulb having a condensing lens portion at the tip is integrated with at least one of a light source mounting cylindrical wall and an outer periphery of the LED small SMD chip itself. Small LED lamp.     A small filament which is made of a cylindrical high thermal conductivity material, has a base portion as a single mechanical connecting end on the cylindrical axis, and has a maximum outer diameter of 20 mm or less. The outer shape and outer dimensions of the lamp mounting space are set so as to fit within the space shape and the space dimensions, and the tip of the cylindrical axis is provided so that the light source mounting cylinder wall coincides with the center, A heat sink housing having a longitudinal passage opening along the axial center from the light source mounting cylindrical wall to the base portion, and disposed at the center of the light source mounting cylindrical wall at the tip of the heat sink housing, with the LED element facing outward The LED small SMD chip is mounted on the heat sink casing in a high thermal conduction state, and the power harness connected to the LED small SMD chip is mechanically connected through a longitudinal path in the heat sink casing. end A light source mounting cylindrical wall at the tip of the heat sink housing corresponding to the outer periphery of the LED small SMD chip, and the LED small SMD chip. A cylindrical base end that surrounds the outer periphery of the LED small SMD chip and a tip of the cylindrical base end are hermetically covered on at least one of the outer periphery of the LED small SMD chip so as to face the LED small SMD chip. A small LED lamp characterized in that a light-transmitting bulb integrated with a condensing lens portion is integrated through the cylindrical base end.     A small filament which is made of a cylindrical high thermal conductivity material, has a base portion as a single mechanical connecting end on the cylindrical axis, and has a maximum outer diameter of 20 mm or less. The outer shape and outer dimensions of the lamp mounting space are set so as to fit within the space shape and the space dimensions, and the tip of the cylindrical axis is provided so that the light source mounting cylinder wall coincides with the center, A heat sink housing having a longitudinal passage opened along the axis extending from the light source mounting cylindrical wall to the base portion, and at the center of the light source mounting cylindrical wall at the tip of the heat sink housing; From a power supply wiring board disposed on the axis in the longitudinal path, an LED small SMD chip mounted on the front end of the power supply wiring board with the LED element facing outward, and a base end of the power supply wiring board LED having stretched power harness A knit is mounted on the heat sink housing in a high thermal conductivity state, and the power harness is exposed to the outside from the center of the base as the mechanical connection end through a longitudinal passage in the heat sink housing. At least one of the light source mounting cylinder wall at the tip of the heat sink housing corresponding to the outer periphery of the LED small SMD chip and the outer periphery of the LED small SMD chip itself, A light transmitting unit in which a cylindrical base end that surrounds the outer periphery of the LED small SMD chip and a condensing lens unit that covers the tip of the cylindrical base end in a sealed manner and faces the LED small SMD chip are integrated. A small LED lamp characterized in that the bulb is integrated through the cylindrical base end.     The LED small SMD chip of the LED unit has a mounting position set in the center of the surface of the mounting substrate made of a high thermal conductivity material, and an appropriate opening angle that is electrically insulated from each other with the mounting position on the surface of the mounting substrate sandwiched between The anode terminal and the cathode terminal arranged so as to face each other at an appropriate distance extend to either the peripheral edge of the mounting substrate or the back surface opposite to the front surface of the mounting substrate. The LED element disposed at the mounting position of the mounting substrate is mounted by being connected to the anode terminal and the cathode terminal of the mounting substrate, and the LED unit is disposed in the longitudinal passage of the heat sink housing. A tip joint edge is provided at the tip of the substrate material having an outline size to be accommodated, and can be either an anode circuit or a cathode circuit on one surface and the other surface of the substrate material, respectively. A power supply wiring board provided with a child circuit, and the leading edge of the power supply wiring board is centered on the back surface opposite to the surface on which the LED element of the LED small SMD chip is mounted. The anode terminal of the LED small SMD chip corresponds to an electronic circuit on one side of the power wiring board, and the cathode terminal of the LED small SMD chip corresponds to an electronic circuit on the other side of the power wiring board. The small SMD chip mounting substrate and the power supply wiring substrate are arranged in a T-shape when viewed from the side, and the anode terminal of the LED small SMD chip and the electronic circuit on the one surface are electrically and mechanically connected. The electronic circuit on one surface of the power supply wiring board becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the electronic circuit on the other surface are electrically and mechanically connected to each other. 6. The electronic circuit on the other surface of the substrate is a cathode circuit, and a power harness is extended from each of the anode circuit on one surface of the power wiring board and the cathode circuit on the other surface. Small LED lamp.     The power circuit board of the LED unit is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side, and a base portion of a narrow substrate portion whose tip is set to be narrow in advance, An electronic circuit that can be either an anode circuit or a cathode circuit is provided on each of the one surface and the other surface, and a large substrate portion that is set wider than the narrow substrate portion passes through a linear weak portion that is easily divided. If either the large board part is unnecessary or the narrow board part is unnecessary, either the narrow board part or the large board part separated along the line weakened part. The small LED lamp according to claim 5 or 6, wherein one is selectively housed and mounted inside the longitudinal passage of the heat sink housing so as to be disposed on the axis of the heat sink housing. .     The power circuit board of the LED unit is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side, and a base portion of a narrow substrate portion whose tip is set to be narrow in advance, An electronic circuit that can be either an anode circuit or a cathode circuit is provided on each of the one surface and the other surface, and a large substrate portion that is set wider than the narrow substrate portion passes through a linear weak portion that is easily divided. The LED small SMD chip mounting substrate and the power supply wiring substrate are arranged in a T-shape when viewed from the side, and the anode terminal of the LED small SMD chip and the electron on one surface of the small substrate portion are arranged. The circuit is electrically and mechanically connected, and the electronic circuit on one surface of the small-width substrate portion becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the small-width substrate portion The electronic circuit on the other surface is electrically and mechanically connected, and the electronic circuit on the other surface of the small-width substrate portion is a cathode circuit, and the small-width substrate portion and the large-sized substrate portion are along the linear weakened portion. Are separated from each other, and the anode circuit on one surface of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion are electrically connected across the linear weakened portion, and the electronic circuit of the large substrate portion Is an anode circuit, and an electronic component for power supply is mounted in the middle of the anode circuit on at least one surface of the large substrate portion. The harness for electrical connection is electrically and mechanically connected, and the power supply for the cathode circuit on the other surface of the narrow substrate portion is electrically and mechanically connected to the power supply harness for the cathode Wiring board for heat sink Inside the running through passage of the body, which is assumed to become housed mounted so arranging on the axis of the heat sink housing, according to claim 5 or 6 either one described compact LED lamp.     The power circuit board of the LED unit is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side, and a base portion of a narrow substrate portion whose tip is set to be narrow in advance, An electronic circuit that can be either an anode circuit or a cathode circuit is provided on each of the one surface and the other surface, and a large substrate portion that is set wider than the narrow substrate portion passes through a linear weak portion that is easily divided. The LED small SMD chip mounting substrate and the power supply wiring substrate are arranged in a T shape in a side view, and the anode terminal of the LED small SMD chip and one surface of the small width substrate portion are arranged. The electronic circuit is electrically and mechanically connected, and the electronic circuit on one surface of the narrow substrate portion becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the narrow substrate The electronic circuit on the other surface is electrically and mechanically connected, and the electronic circuit on the other surface of the small-width substrate portion is used as a cathode circuit, and the small-width substrate portion and the large-sized substrate are formed along the linear fragile portion. The anode circuit on one surface of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion are electrically connected across the linear weak portion without being separated from each other. The electronic circuit is not separated along the linear fragile portion, and the anode circuit on one side of the narrow substrate portion and the electronic circuit on the one side of the large substrate portion divide the linear fragile portion. And connected to the middle of the anode circuit on one side of the large board portion, and at least one half of the anode circuit on the middle of the electronic circuit on the other side of the large board portion. A limiting resistor as an electronic component is mounted, or The front end land of the anode circuit composed of the front end land and the base end land on one surface of the large substrate portion, and the front end land of the electronic circuit composed of the front end land and the base end land on the other surface of the large substrate portion pass through. And a base land of the anode circuit on one surface of the large substrate portion and a base land of the electronic circuit on the other surface of the large substrate portion are connected by a through hole. The electronic circuit is an anode circuit, and a limiting resistor as a power supply electronic component is mounted between the front end land and the base end land of the anode circuit on one side of the large board portion. A limiting resistor as an electronic component for power supply is mounted between the front end land and the base end land, and the power harness of the anode gap is electrically connected to one of the base end lands of the anode circuit on one side and the other side of the large board portion. Target And the power supply harness of the cathode circuit is electrically and mechanically connected to the power supply wiring of the cathode circuit on the other surface of the small-width substrate part, and the power supply wiring board includes: The small LED lamp according to any one of claims 5, 6 and 8, wherein the LED lamp is housed and mounted inside a longitudinal passage of the heat sink housing so as to be disposed on an axis of the heat sink housing.     The small LED lamp according to any one of claims 3 to 9, wherein the condenser lens portion of the lens valve is an aspherical convex lens.     The cylindrical base end of the translucent bulb is such that the optical axis of the condensing lens portion of the translucent bulb and the optical axis of the LED element of the miniature LED SMD chip are the same axis with respect to the periphery of the LED miniature SMD chip. Third order so that the distance on the same axis from the light emitting surface of the LED element of the LED small SMD chip to the condensing lens part of the translucent bulb coincides with the focal length of the condensing lens part. The adhesive is fixed so that the original positional relationship is adjusted, and the outer peripheral wall of the cylindrical base end of the translucent bulb is in contact with the inner wall of the light source mounting cylindrical wall of the heat sink housing. The adhesive is fixed so that the positional relationship between the condensing lens portion of the light bulb and the LED small SMD chip and the mechanical connection end of the heat sink housing is adjusted. Small LED run according to any one of 10 .     The inner wall surface of the longitudinal passage of the heat sink housing, the back surface opposite to the light emitting surface of the LED element of the LED small SMD chip 3, and the power wiring substrate in the case of the one having the power wiring substrate, the heat sink 12. A heat dissipation resin having high thermal conductivity that also serves as an adhesive is filled in a space between a part of a harness for power supply disposed inside a vertical passage of a housing and the heat dissipation resin serving as an adhesive. A small LED lamp according to claim 1.     The small LED lamp according to any one of claims 1 to 12, wherein the LED small SMD chip has a phosphor layer appropriately selected on a light emitting surface of the LED chip mounted thereon.     The mechanical connection end of the heat sink housing is one of M4 mm, pitch 0.7 mm, M5 mm, pitch 0.8 mm, M6 mm, pitch 1.0 mm, M8 mm, and pitch 1.25 mm. A small LED lamp according to any one of claims 1 to 13. The overall length from the tip of the light-transmitting valve to the base end of the mechanical connection end of the heat sink housing is regulated to 20 mm to 40 mm, and the outer diameter of the heat sink housing that is the maximum diameter is regulated to 6 mm to 14 mm. The small LED lamp according to any one of claims 1 to 14.

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