JP6790017B2 - Small LED lamp - Google Patents

Small LED lamp Download PDF

Info

Publication number
JP6790017B2
JP6790017B2 JP2018075767A JP2018075767A JP6790017B2 JP 6790017 B2 JP6790017 B2 JP 6790017B2 JP 2018075767 A JP2018075767 A JP 2018075767A JP 2018075767 A JP2018075767 A JP 2018075767A JP 6790017 B2 JP6790017 B2 JP 6790017B2
Authority
JP
Japan
Prior art keywords
power supply
led
small
heat sink
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018075767A
Other languages
Japanese (ja)
Other versions
JP2019186046A (en
Inventor
藤 理 一 齋
藤 理 一 齋
Original Assignee
浜井電球工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 浜井電球工業株式会社 filed Critical 浜井電球工業株式会社
Priority to JP2018075767A priority Critical patent/JP6790017B2/en
Publication of JP2019186046A publication Critical patent/JP2019186046A/en
Application granted granted Critical
Publication of JP6790017B2 publication Critical patent/JP6790017B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

この発明は、フィラメントランプと互換性を有するLED(light emitting diode)ランプ技術に関連するものであり、特に、各種機器類に組み込まれる各種センサ用光源、表示用パイロットランプ、装飾用小型光源等に用いられて来たような従来型の小型フィラメントランプと交換可能な小型LEDランプを製造、提供する分野は勿論のこと、その輸送、保管、組み立ておよび設置に必要となる設備、器具類を提供、販売する分野から、それら資材や機械装置、部品類に必要となる素材、例えば、木材、石材、各種繊維類、プラスチック、各種金属材料等を提供する分野、それらに組み込まれる電子部品やそれらを集積した制御関連機器の分野、各種計測器の分野、当該設備、器具を動かす動力機械の分野、そのエネルギーとなる電力やエネルギー源である電気、オイルの分野といった一般的に産業機械と総称されている分野、更には、それら設備、器具類を試験、研究したり、それらの展示、販売、輸出入に係わる分野、将又、それらの使用の結果やそれを造るための設備、器具類の運転に伴って発生するゴミ屑の回収、運搬等に係わる分野、それらゴミ屑を効率的に再利用するリサイクル分野などの外、現時点で想定できない新たな分野までと、関連しない技術分野はない程である。 The present invention relates to LED (light emitting diode) lamp technology compatible with filament lamps, and is particularly used for various sensor light sources, display pilot lamps, small decorative light sources, etc. incorporated in various devices. We provide not only the field of manufacturing and providing small LED lamps that can be replaced with conventional small filament lamps such as those used, but also the equipment and fixtures necessary for their transportation, storage, assembly and installation. From the field of sale, the field of providing materials required for those materials, machinery and parts, such as wood, stone, various fibers, plastics, various metal materials, etc., the electronic parts incorporated in them and their integration Generally referred to as industrial machinery, such as the field of control-related equipment, the field of various measuring instruments, the field of power machinery that moves the equipment and equipment, and the field of electricity and oil that are the energy sources. For the field, as well as for testing and researching those facilities and appliances, for the fields related to their exhibition, sale and import / export, and for the operation of the results of their use and the facilities and appliances for making them. There are no unrelated technical fields, such as fields related to the collection and transportation of trash that accompany it, recycling fields that efficiently reuse these trash, and new fields that cannot be imagined at this time. ..

(着目点)
一般照明から大型の施設照明向けの光源はLED化が進み、フィラメント電球や蛍光灯は省エネの観点からも市場から急激に無くなりつつあるものの、機器組込み用のセンサ光源等光源単体で外径がφ20以下の小型ランプについては、砲弾型LEDを用いた表示用途を除き、それらの市場規模からも多くは商品化が進んでいなかった。
(Point of interest)
LED light sources for general lighting and large facility lighting are becoming more and more popular, and filament light bulbs and fluorescent lamps are rapidly disappearing from the market from the viewpoint of energy saving, but the outer diameter of a single light source such as a sensor light source for incorporating equipment is φ20. Most of the following small lamps have not been commercialized due to their market size, except for display applications using bullet-shaped LEDs.

(従来の技術)
こうした状況を把握できる幾つかの従来技術を参照すると、例えば、下記に示す特許文献1(1)に提案されているものに代表されるように、LED素子を外装するケーシングが筒状部と先端面部とを有し、先端面部に中央部を凸状、周辺の環状部を凹状とされたレンズが設けられてなるLEDランプや、同特許文献1(2)に見られるような、ソケットに対して脱着可能とされた口金の内部に、電源用回路が設けられた電源用基板の一端が装着されていて、該口金の開口から外がわに延伸された該電源用基板の他端に対し、LED素子の実装基板がT字形状に結合され、該口金の開口には、該電源用基板の他端がわ、および同電源用基板の他端に結合されたLED素子と、その実装基板とを包囲するガラス製またはプラスチック製の球体が外装されてなるLED照明器具、さらに、同特許文献1(3)に示されているような、口金類と、光源用LEDと、放熱体と、LED用電源回路や電子部品が搭載された回路基板とを備えたLED照明具において、回路基板が筒状の放熱体の内側に収容され、口金が前記放熱体に装備され、LEDが前記放熱体に搭載され、前記放熱体は高熱伝導率の炭素繊維を含む樹脂製であり、その放熱体の外周が熱伝導性のある絶縁塗料で被覆されたハロゲンランプ型LED照明具、そして、同特許文献1(4)に見られるような、照明源としての白熱ランプと、前記白熱ランプに給電するために特別に設計された電源とで構成された医用診断機器に用いられるアダプタであって、少なくとも1つのLEDを照明源、前記少なくとも1つのLEDと前記電源との間の極性を整合するための手段とを含む医療用アダプタ、および、該医療用アダプタが組み込まれた医療用診断器具などが散見される。
(Conventional technology)
With reference to some conventional techniques capable of grasping such a situation, for example, as represented by the one proposed in Patent Document 1 (1) shown below, the casing that exteriors the LED element has a tubular portion and a tip. For LED lamps having a surface portion, a lens having a convex central portion and a concave peripheral annular portion on the tip surface portion, and a socket as seen in Patent Document 1 (2). One end of the power supply board provided with the power supply circuit is mounted inside the detachable base, and the other end of the power supply board extended from the opening of the base to the outside. , The mounting board of the LED element is coupled in a T shape, and the other end of the power supply board is connected to the opening of the base, and the LED element coupled to the other end of the power supply board and the mounting board thereof. An LED lighting fixture with a glass or plastic sphere that surrounds it, and a base, a base LED, a radiator, and a radiator, as shown in Patent Document 1 (3). In an LED lighting fixture provided with a power supply circuit for an LED and a circuit board on which electronic components are mounted, the circuit board is housed inside a tubular radiator, a base is mounted on the radiator, and the LED is the radiator. The radiator is made of resin containing carbon fibers having high thermal conductivity, and the outer periphery of the radiator is coated with an insulating coating having thermal conductivity, and a halogen lamp type LED lighting fixture, and the patent document. An adapter used in a medical diagnostic device consisting of an incandescent lamp as an illumination source and a power supply specially designed to supply power to the incandescent lamp, as seen in 1 (4), at least 1. Medical adapters that include one LED as a lighting source, means for matching the polarity between the at least one LED and the power source, and medical diagnostic equipment incorporating the medical adapter are scattered. LED.

しかし、特許文献1(1)ないし許文献1(3)などに示されているようなフィラメントランプと互換性を有するLEDランプ技術は、一般照明から大型の施設照明向けの光源に有効なものとなっているが、各種機器類に組み込まれる各種センサ用光源、表示用パイロットランプ、装飾用小型光源、および、特許文献1(4)に見られるような医療用アダプタ、および、該医療用アダプタが組み込まれた医療用診断器具などに組み込まれるような、外径がφ20以下の小型ランプに利用する場合には、小型のLEDが搭載された実装基板を専用に開発しなければならない外、小型ランプ用の口金およびケーシングも新たに開発し、ケーシングに対して小型LEDを組み込む技術など、様々な課題を克服しなければならないため、それら各部品の設計や製造技術の開発に多大な労力と投資とを要することになってしまい経済的負担が大きいという欠点があった。
(1)特開2010−199056号公報 (2)特許第5653728号明細書 (3)特許第5666318号明細書 (4)米国特許第7276025号明細書
However, the LED lamp technology compatible with the filament lamp as shown in Patent Document 1 (1) to Patent Document 1 (3) is effective as a light source for general lighting to large-scale facility lighting. However, various sensor light sources, display pilot lamps, small decorative light sources, medical adapters as seen in Patent Document 1 (4), and medical adapters incorporated in various devices are used. When using it for a small lamp with an outer diameter of φ20 or less, which is incorporated in a built-in medical diagnostic instrument, a mounting board on which a small LED is mounted must be specially developed. Since it is necessary to overcome various problems such as the technology to incorporate a small LED into the casing by newly developing the base and the casing for the lighting, it takes a lot of labor and investment to design and develop the manufacturing technology of each of these parts. There was a drawback that the financial burden was heavy because it required.
(1) Japanese Patent Application Laid-Open No. 2010-199056 (2) Japanese Patent No. 5653728 (3) Japanese Patent No. 5666318 (4) US Pat. No. 7276025

(問題意識)
上述したとおり、従前までに提案のある各種フィラメントランプと互換性を有するLEDランプ技術は、何れも外径がφ20以下の特殊用途用とも云える小型LEDランプに応用しようとすると、その市場規模に対して、専用部品の開発、および、製造技術の開発に多大な労力と投資とを要するものとなってしまい、これまでなかなか低廉化された小型LEDランプの商品化が成されず、小型フィラメント電球に代わって広く普及するという段階に至らなかったという事情に鑑み、このような現状を打開できるLEDランプの新たな小型化技術の開発の可能性を痛感するに至ったものである。
(Problem awareness)
As mentioned above, the LED lamp technology that is compatible with the various filament lamps that have been proposed so far will reach the market scale when it is applied to small LED lamps with an outer diameter of φ20 or less, which can be said to be for special purposes. On the other hand, the development of dedicated parts and the development of manufacturing technology require a great deal of labor and investment, and it has not been possible to commercialize low-priced small LED lamps, and small filament light bulbs. In view of the fact that it has not reached the stage of widespread use in place of the above, it has come to realize the possibility of developing a new miniaturization technology for LED lamps that can overcome this situation.

(発明の目的)
そこで、この発明は、既存のフィラメントランプ用の部品製造技術を有効利用して、より迅速且つ経済的に製造可能なものとされた新たな小型LEDランプ技術の開発はできないものかとの判断から、逸速くその開発、研究に着手し、長期に渡る試行錯誤と幾多の試作、実験とを繰り返してきた結果、今回、遂に新規な構造の小型LEDランプを実現化することに成功したものであり、以下では、図面に示すこの発明を代表する実施例と共に、その構成を詳述することとする。
(Purpose of Invention)
Therefore, the present invention is based on the judgment that it is possible to develop a new small LED lamp technology that can be manufactured more quickly and economically by effectively utilizing the existing parts manufacturing technology for filament lamps. As a result of promptly starting its development and research, repeating trial and error over a long period of time, many trials, and experiments, we have finally succeeded in realizing a small LED lamp with a new structure. In the following, the configuration will be described in detail together with examples representing the present invention shown in the drawings.

(発明の構成)
図面に示すこの発明を代表する実施例からも明確に理解されるように、この発明の小型LEDランプは、基本的に次のような構成から成り立っている。
即ち、柱状の高熱伝導率素材からなり、基端がわに単一の機械的接続端を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、先端がわに光源装着筒壁が設けられ、内部に先端から基端に至る縦貫路が開口されたヒートシンク筐体を有し、該ヒートシンク筐体の先端の光源装着筒壁の中央にあって、該ヒートシンク筐体の縦貫路内の軸心上に配され、一面およびそれとは反対がわとなる他面の夫々に電子回路が設けられた電源用配線基板と、該電源用配線基板の先端に対し、側面視T字形となるよう結合され、LED素子が外向とされ、アノード端子が該電源用配線基板の一面の電子回路に接続され、カソード端子が該電源用配線基板の他面の電子回路に接続されたLED小型SMDチップと、該電源用配線基板から延伸されたアノードがわおよびカソードがわの一対の電源用ハーネスとを有するLEDユニットが、該ヒートシンク筐体に対して高熱伝導状態に搭載されると共に、これら一対の電源用ハーネスが、該ヒートシンク筐体の縦貫路を通じて機械的接続端から外がわへ露出するよう延出され、該LED小型SMDチップの外周囲に相当する該ヒートシンク筐体の先端の光源装着筒壁、および、該LED小型SMDチップそれ自体の外周囲の中の少なくとも何れか一方に、透光バルブが一体化されてなるものとした構成を要旨とする小型LEDランプである。
(Structure of Invention)
As is clearly understood from the examples representing the present invention shown in the drawings, the small LED lamp of the present invention basically has the following configuration.
That is, the space shape and size of the space for mounting a small filament lamp to be replaced, which is made of a columnar high thermal conductivity material, has a single mechanical connection end at the base end, and has a maximum outer diameter of 20 mm or less. The heat sink housing is set to an outer shell shape and outer shell dimensions that fit inside, has a light sink mounting cylinder wall at the tip, and has a heat sink housing in which a longitudinal path from the tip to the base end is opened. For power supply , which is located in the center of the wall of the heat sink mounting cylinder at the tip, is arranged on the axis in the longitudinal path of the heat sink housing, and has electronic circuits on one side and the other side opposite to it. The wiring board and the tip of the power supply wiring board are coupled so as to form a T-shape in a side view, the LED element is directed outward, the anode terminal is connected to the electronic circuit on one side of the power supply wiring board, and the cathode terminal. Is an LED unit having a small LED SMD chip connected to an electronic circuit on the other surface of the power supply wiring board and a pair of power supply harnesses having an anode and a cathode extending from the power supply wiring board. The pair of power supply harnesses are mounted on the heat sink housing in a high thermal conduction state, and are extended so as to be exposed to the outside from the mechanical connection end through the longitudinal path of the heat sink housing. A translucent valve is integrated into at least one of the light source mounting cylinder wall at the tip of the heat sink housing corresponding to the outer circumference of the LED small SMD chip and the outer circumference of the LED small SMD chip itself. It is a small LED lamp whose gist is a structure that is made up of.

この基本的な構成からなる小型LEDランプは、その表現を変えて示すならば、柱状の高熱伝導率素材からなり、基端がわに単一の機械的接続端を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、先端がわに光源装着筒壁が設けられ、内部に先端から基端に至る縦貫路が開口されたヒートシンク筐体を有し、該ヒートシンク筐体の先端の光源装着筒壁の中央にあって、該ヒートシンク筐体の縦貫路内の軸心上に配され、一面およびそれとは反対がわとなる他面の夫々に電子回路が設けられた電源用配線基板と、該電源用配線基板の先端に対し、側面視T字形となるよう結合され、LED素子が外向とされ、アノード端子が該電源用配線基板の一面の電子回路に接続され、カソード端子が該電源用配線基板の他面の電子回路に接続されたLED小型SMDチップと、該電源用配線基板から延伸されたアノードがわおよびカソードがわの一対の電源用ハーネスとを有するLEDユニットが、該ヒートシンク筐体に対して高熱伝導状態に搭載されると共に、これら一対の電源用ハーネスが、該ヒートシンク筐体の縦貫路を通じて機械的接続端から外がわへ露出するよう延出され、該LED小型SMDチップの外周囲に相当する該ヒートシンク筐体の先端の光源装着筒壁、および、該LED小型SMDチップそれ自体の外周囲の中の少なくとも何れか一方に、透光バルブが一体化され、既存の小型フィラメントランプと置き換え可能とされてなるものとした構成からなる小型LEDランプとなる。 In other words, a small LED lamp with this basic configuration is made of a columnar high thermal conductivity material, has a single mechanical connection end at the base end, and has a maximum outer diameter of 20 mm. The space shape and dimensions of the space for mounting the small filament lamp to be replaced below are set to the outer shape and outer dimensions that fit within the space dimensions, and the tip is provided with a light source mounting cylinder wall, and the inside is from the tip to the base end. It has a heat sink housing with an open vertical passage leading to it, is located in the center of the light source mounting cylinder wall at the tip of the heat sink housing, and is arranged on the axis in the vertical passage of the heat sink housing, and is arranged on one surface and the same. Is connected to the power supply wiring board on which electronic circuits are provided on the other side, which is the opposite side, and the tip of the power supply wiring board so as to form a T-shape in a side view, and the LED element is directed outward. The anode terminal was connected to the electronic circuit on one side of the power supply wiring board, and the cathode terminal was extended from the LED small SMD chip connected to the electronic circuit on the other side of the power supply wiring board and the power supply wiring board. An LED unit having a pair of power supply harnesses having an anode and a cathode is mounted in a high thermal conduction state with respect to the heat sink housing , and these pair of power supply harnesses vertically penetrate the heat sink housing. The light source mounting cylinder wall at the tip of the heat sink housing, which extends from the mechanical connection end through the path to be exposed to the outside and corresponds to the outer circumference of the LED small SMD chip, and the LED small SMD chip itself. A small LED lamp having a structure in which a translucent valve is integrated in at least one of the outer circumferences of the above and can be replaced with an existing small filament lamp.

さらに、別の表現で示すと、柱状の高熱伝導率素材からなり、基端がわに単一の機械的接続端を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、先端がわに光源装着筒壁が設けられ、内部に先端から基端に至る縦貫路が開口されたヒートシンク筐体を有し、該ヒートシンク筐体の先端の光源装着筒壁の中央にあって、該ヒートシンク筐体の縦貫路内の軸心上に配され、一面およびそれとは反対がわとなる他面の夫々に電子回路が設けられた電源用配線基板と、該電源用配線基板の先端に対し、側面視T字形となるよう結合され、LED素子が外向とされ、アノード端子が該電源用配線基板の一面の電子回路に接続され、カソード端子が該電源用配線基板の他面の電子回路に接続されたLED小型SMDチップと、該電源用配線基板から延伸されたアノードがわおよびカソードがわの一対の電源用ハーネスとを有するLEDユニットが、該ヒートシンク筐体に対して高熱伝導状態に搭載されると共に、これら一対の電源用ハーネスが、該ヒートシンク筐体の縦貫路を通じて機械的接続端から外がわへ露出するよう延出され、該LED小型SMDチップの外周囲に相当する該ヒートシンク筐体の先端の光源装着筒壁、および、該LED小型SMDチップそれ自体の外周囲の中の少なくとも何れか一方に、先端に集光レンズ部を有する透光バルブが一体化されてなるものとした構成からなる小型LEDランプとなる。 Furthermore, in other words, it is made of a columnar high thermal conductivity material, has a single mechanical connection end at the base end, and is used for mounting a small filament lamp to be replaced with a maximum outer diameter of 20 mm or less. It has a heat sink housing that is set to the outer shape and outer dimensions that fit within the space shape and dimensions of the space, has a light source mounting cylinder wall at the tip, and has a vertical passage from the tip to the base inside. However, the LED is located at the center of the light source mounting cylinder wall at the tip of the heat sink housing, is arranged on the axis in the longitudinal path of the heat sink housing, and has electrons on one side and the other side which is the opposite side. The power supply wiring board provided with the circuit is coupled to the tip of the power supply wiring board so as to form a T-shape in a side view, the LED element is directed outward, and the anode terminal is an electron on one side of the power supply wiring board. A pair of LED small SMD chips connected to a circuit and having a cathode terminal connected to an electronic circuit on the other side of the power supply wiring board, and an anode and a cathode extending from the power supply wiring board. The LED unit having the harness is mounted on the heat sink housing in a high thermal conduction state, and these pair of power supply harnesses are exposed from the mechanical connection end to the outside through the longitudinal path of the heat sink housing. On at least one of the light source mounting cylinder wall at the tip of the heat sink housing corresponding to the outer circumference of the LED small SMD chip and the outer circumference of the LED small SMD chip itself. It is a small LED lamp having a structure in which a translucent valve having a condensing lens portion at the tip is integrated.

より具体的には、円筒形の高熱伝導率素材からなり、該円筒形の軸心上の基端がわに単一の機械的接続端としての口金部を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、該円筒形の軸心上となる先端がわに光源装着筒壁が中心を一致するよう設けられ、該光源装着筒壁から口金部に至る該軸心に沿って縦貫路が開口されたヒートシンク筐体を有し、該ヒートシンク筐体の先端の光源装着筒壁の中央にあって、該ヒートシンク筐体の縦貫路内の軸心上に配され、一面およびそれとは反対がわとなる他面の夫々に電子回路が設けられた電源用配線基板と、該電源用配線基板の先端に対し、側面視T字形となるよう結合され、LED素子が外向とされ、アノード端子が該電源用配線基板の一面の電子回路に接続され、カソード端子が該電源用配線基板の他面の電子回路に接続されたLED小型SMDチップと、該電源用配線基板から延伸されたアノードがわおよびカソードがわの一対の電源用ハーネスとを有するLEDユニットが、該ヒートシンク筐体に対して高熱伝導状態に搭載されると共に、これら一対の電源用ハーネスが、該ヒートシンク筐体内の縦貫路を通じて前記機械的接続端としての口金部の中央から外がわへ露出するよう延出され、該LED小型SMDチップの外周囲に相当する該ヒートシンク筐体の先端の光源装着筒壁、および、該LED小型SMDチップそれ自体の外周囲の中の少なくとも何れか一方に、該LED小型SMDチップの外周囲を包囲する筒状基端と、該筒状基端の先端を密閉状に覆い、LED小型SMDチップに対峙する集光レンズ部とが、一体化された透光バルブが、同筒状基端を介して一体化されてなるものとした構成からなる小型LEDランプとなる。 More specifically, it is made of a cylindrical high thermal conductivity material, has a base end on the axis of the cylindrical shape, and has a base portion as a single mechanical connection end, and has a maximum outer diameter of 20 mm or less. The outer shape and outer dimensions of the space for mounting the small filament lamp to be replaced are set to fit within the space shape and dimensions, and the tip of the cylindrical shape on the axis coincides with the center of the light source mounting cylinder wall. It has a heat sink housing having a longitudinal path opened along the axis from the light source mounting cylinder wall to the base portion, and is located at the center of the light source mounting cylinder wall at the tip of the heat sink housing. A power supply wiring board arranged on the axis in the longitudinal path of the heat sink housing and provided with electronic circuits on one side and the other side opposite to the heat sink, and the tip of the power supply wiring board. On the other hand, they are coupled so as to have a T-shape in a side view, the LED element is directed outward, the anode terminal is connected to the electronic circuit on one side of the power supply wiring board, and the cathode terminal is the electron on the other side of the power supply wiring board. An LED unit having a small LED SMD chip connected to a circuit and a pair of power supply harnesses having an anode and a cathode extending from the power supply wiring board is in a high thermal conduction state with respect to the heat sink housing. The pair of power supply harnesses are extended from the center of the base portion as the mechanical connection end to the outside through a longitudinal path in the heat sink housing, and the LED small SMD chip is mounted on the heat sink. The outer circumference of the LED small SMD chip is surrounded by at least one of the light source mounting cylinder wall at the tip of the heat sink housing corresponding to the outer circumference of the heat sink housing and the outer circumference of the LED small SMD chip itself. A translucent valve in which the tubular base end and the condensing lens portion that covers the tip of the tubular base end in a hermetically sealed manner and faces the small LED SMD chip is integrated through the tubular base end. It is a small LED lamp having a structure that is integrated.

これを換言すると、円筒形の高熱伝導率素材からなり、該円筒形の軸心上の基端がわに単一の機械的接続端としての口金部を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、該円筒形の軸心上となる先端がわに光源装着筒壁が中心を一致するよう設けられ、該光源装着筒壁から口金部に至る該軸心に沿って縦貫路が開口されたヒートシンク筐体を有し、該ヒートシンク筐体の先端の光源装着筒壁の中央にあって、該ヒートシンク筐体の縦貫路内の軸心上に配され、一面およびそれとは反対がわとなる他面の夫々に電子回路が設けられた電源用配線基板と、該電源用配線基板の先端に対し、側面視T字形となるよう結合され、LED素子が外向とされ、アノード端子が該電源用配線基板の一面の電子回路に接続され、カソード端子が該電源用配線基板の他面の電子回路に接続されたLED小型SMDチップと、該電源用配線基板の基端から延伸されたアノードがわおよびカソードがわの一対の電源用ハーネスとを有するLEDユニットが、該ヒートシンク筐体に対して高熱伝導状態に搭載されると共に、該一対の電源用ハーネスが、該ヒートシンク筐体内の縦貫路を通じて前記機械的接続端としての口金部の中央から外がわへ露出するよう延出され、該LED小型SMDチップの外周囲に相当する該ヒートシンク筐体の先端の光源装着筒壁、および、該LED小型SMDチップそれ自体の外周囲の中の少なくとも何れか一方に、該LED小型SMDチップの外周囲を包囲する筒状基端と、該筒状基端の先端を密閉状に覆い、LED小型SMDチップに対峙する集光レンズ部とが、一体化された透光バルブが、同筒状基端を介して一体化されてなるものとした構成からなる小型LEDランプとなる。 In other words, it is made of a cylindrical high thermal conductivity material, the base end on the axis of the cylindrical shape has a mouthpiece as a single mechanical connection end, and a replacement with a maximum outer diameter of 20 mm or less. The outer shape and outer dimensions of the space for mounting the target small filament lamp are set to fit within the space shape and dimensions, and the tip of the cylindrical shape on the axis coincides with the center of the light source mounting cylinder wall. It has a heat sink housing having a longitudinal path opened along the axis from the light source mounting cylinder wall to the base portion, and is located at the center of the light source mounting cylinder wall at the tip of the heat sink housing. On the power supply wiring board, which is arranged on the axis in the longitudinal path of the heat sink housing and has electronic circuits on one side and the other side, which is opposite to the heat sink housing, and the tip of the power supply wiring board. On the other hand, they are coupled so as to have a T-shape when viewed from the side , the LED element is directed outward , the anode terminal is connected to the electronic circuit on one side of the power supply wiring board, and the cathode terminal is the electronic circuit on the other side of the power supply wiring board. An LED unit having a small LED SMD chip connected to a power sink and a pair of power supply harnesses having an anode and a cathode extending from the base end of the power supply wiring board has high heat with respect to the heat sink housing. While mounted in a conductive state, the pair of power supply harnesses are extended from the center of the base portion as the mechanical connection end to the outside through a longitudinal path in the heat sink housing, and the LED is compact. The outer circumference of the LED small SMD chip is provided on at least one of the light source mounting cylinder wall at the tip of the heat sink housing corresponding to the outer circumference of the SMD chip and the outer circumference of the LED small SMD chip itself. A translucent valve in which the surrounding tubular base end and the condensing lens portion that covers the tip of the tubular base end in a sealed manner and faces the small LED SMD chip is integrated with the tubular base end. It is a small LED lamp having a structure in which it is integrated via a light source.

以上のとおり、この発明の小型LEDランプによれば、従前までのものとは違い、上記したとおりの固有の特徴ある構成から、既存のフィラメントランプ用の主要な構成部品の各要部の加工技術を有効利用して、より迅速且つ経済的に、最大外径20mm以下の小型LEDランプを製造可能とすることができるから、開発に要する時間と経費とを大幅削減することが可能となり、最新のLED光源技術の投入と相俟ってハロゲンランプにも劣らない高輝度を達成可能とすると共に、使用電力量および発光中の発熱量を大幅に低減することができ、従来型のフィラメントランプよりも格段に長い耐久寿命を達成可能とし、フィラメントランプ専用として開発、製造された既存の各種機器類の各種センサ用光源、表示用パイロットランプ、装飾用小型光源等に用いられて来た従来型のフィラメントランプと簡便に置き換えできるものとしてあるから、これまで進まなかった小型フィラメントランプの小型LEDランプへの置き換え需要を促進することができるものになるという秀でた特徴が得られるものである。 As described above, according to the small LED lamp of the present invention, unlike the conventional ones, the processing technology of each main component of the existing filament lamp is changed from the unique characteristic configuration as described above. It is possible to manufacture small LED lamps with a maximum outer diameter of 20 mm or less more quickly and economically by effectively using the above, so it is possible to significantly reduce the time and cost required for development, and the latest Combined with the introduction of LED light source technology, it is possible to achieve high brightness comparable to halogen lamps, and it is possible to significantly reduce the amount of power used and the amount of heat generated during light emission, compared to conventional filament lamps. A conventional filament that has been developed and manufactured exclusively for filament lamps and has been used for various sensor light sources, display pilot lamps, small decorative light sources, etc., which can achieve a significantly longer durable life. Since it can be easily replaced with a lamp, it is possible to obtain an excellent feature that it is possible to promote the demand for replacement of a small filament lamp with a small LED lamp, which has not progressed so far.

加えて、ヒートシンク筐体の先端の光源装着筒壁、および、該LED小型SMDチップそれ自体の外周囲の中の少なくとも何れか一方に、該LED小型SMDチップの外周囲を包囲する筒状基端と、該筒状基端の先端を密閉状に覆い、LED小型SMDチップに対峙する集光レンズ部とが、一体化された透光バルブが、同筒状基端を介して一体化されてなる小型LEDランプによると、従来型のフィラメントランプの製造技術を応用することによって経済的に製造された小型LEDランプ専用形状の筒状基端と集光レンズ部とを有する透光バルブ、および、従来型のフィラメントランプの製造技術の応用によって既存の規格の機械的接続端を有するものとして経済的に製造されたヒートシンク筐体の内部に、大量生産によって低廉化されたLED小型SMDチップが組み込まれてなるものとされたから、従来型のフィラメントランプと同様の交換作業により、利用者に新たな負担をかけることなく、簡便に従来型のフィラメントランプと交換可能なものとなり、LED小型SMDチップの搭載によって多少の価格上昇となっても、耐久寿命の延命化により、充分な経済性を達成することができるものとなるという優れた効果を発揮するものとなる。 In addition, at least one of the light source mounting cylinder wall at the tip of the heat sink housing and the outer circumference of the LED small SMD chip itself has a tubular base end surrounding the outer circumference of the LED small SMD chip. A translucent valve is integrated with the condensing lens portion that covers the tip of the tubular base end in a sealed manner and faces the LED small SMD chip, and is integrated via the tubular base end. According to the small LED lamp, which is economically manufactured by applying the conventional filament lamp manufacturing technology, a translucent valve having a tubular base end and a condensing lens portion shaped exclusively for the small LED lamp, and A small LED SMD chip that has been mass-produced and inexpensive is incorporated inside a heat sink housing that is economically manufactured as having a mechanical connection end of an existing standard by applying conventional filament lamp manufacturing technology. Therefore, by the same replacement work as the conventional filament lamp, it can be easily replaced with the conventional filament lamp without imposing a new burden on the user, and the LED small SMD chip is mounted. Even if the price rises to some extent, the extended life of the durable life will bring about an excellent effect that sufficient economic efficiency can be achieved.

そして、ヒートシンク筐体の縦貫路内の軸心上に配された電源用配線基板、該電源用配線基板の先端に搭載されたLED小型SMDチップ、および、該電源用配線基板の基端から延伸された電源用ハーネスを有するLEDユニットが設けられたものは、該電源用配線基板を介して、LED小型SMDチップが発光中に発する熱を、ヒートシンク筐体へ効率的に伝導可能なものとなる上、該電源用配線基板の両面と縦貫路の内壁面との間に、電源用ハーネスの配線空間や、電源用電子部品などの電子部品類の実装空間を確保することが可能となり、しかもその空間は、該電源用配線基板の両面がわとも同等に確保可能なものになって、多種、多様な機種の開発の可能性を高めることができるという利点が得られる。 Then, the power supply wiring board arranged on the axis in the longitudinal path of the heat sink housing, the LED small SMD chip mounted on the tip of the power supply wiring board, and the extension from the base end of the power supply wiring board. In the case where the LED unit having the power supply harness is provided, the heat generated by the small LED SMD chip during light emission can be efficiently conducted to the heat sink housing via the power supply wiring board. Above, it is possible to secure a wiring space for a power supply harness and a mounting space for electronic components such as power supply electronic components between both sides of the power supply wiring board and the inner wall surface of the longitudinal passage. The space can be secured on both sides of the power supply wiring board in the same manner, which has the advantage of increasing the possibility of developing a wide variety of models.

また、LEDユニットを有し、該LEDユニットが、基板素材の一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられた電源用配線基板の先端にLED小型SMDチップが側面視T字形となるよう配されると共に、該LED小型SMDチップのアノード端子と該一面の電子回路とを電気的および機械的に接続され、該電源用配線基板の一面の電子回路がアノード回路となり、該LED小型SMDチップのカソード端子と該他面の電子回路とを電気的および機械的に接続され、該電源用配線基板の他面の電子回路がカソード回路とされた上、該電源用配線基板の一面のアノード回路、および、他面のカソード回路から、夫々電源用ハーネスが延伸されてなるものは、ヒートシンク筐体の縦貫路内の該LED小型SMDチップから電源用ハーネスに至る範囲が、該ヒートシンク筐体の縦貫路内の軸心上に配された電源用配線基板によってアノード回路とカソード回路とに電気的および空間的に二等分されるから、短絡を効果的に防止することができると共に、配線および電子部品の実装効率を高め、組み立て作業性をより良くすることができるという効果を奏する。 Further, a small LED is provided at the tip of a power supply wiring board which has an LED unit and is provided with an electronic circuit which can be either an anode circuit or a cathode circuit on one side and the other side of the board material. The SMD chip is arranged so as to have a T-shape in a side view, and the anode terminal of the small LED SMD chip and the electronic circuit on one side are electrically and mechanically connected to each other, and the electronic circuit on one side of the power supply wiring board is connected. Is an anode circuit, the cathode terminal of the small LED SMD chip and the electronic circuit on the other surface are electrically and mechanically connected, and the electronic circuit on the other surface of the power supply wiring board is used as the cathode circuit. The power supply harness is extended from the anode circuit on one side of the power supply wiring board and the cathode circuit on the other side, respectively, from the LED small SMD chip in the longitudinal path of the heat sink housing to the power supply harness. Since the entire range is electrically and spatially divided into the anode circuit and the cathode circuit by the power supply wiring board arranged on the axis in the longitudinal path of the heat sink housing, the short circuit is effectively performed. In addition to being able to prevent this, it has the effect of increasing the mounting efficiency of wiring and electronic components and improving the workability of assembly.

LEDユニットの電源用配線基板が、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、予め、先端が小幅に設定された小幅基板部の基部と、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、該小幅基板部よりも幅広く設定された大幅基板部とが、分断容易な線状脆弱部を介して機械的に一体化されたものであって、大幅基板部が不要、または、小幅基板部が不要の何れか一方の場合に、線状脆弱部に沿って分離された小幅基板部および大幅基板部の中の何れか一方のみが選択的に、ヒートシンク筐体の縦貫路の内部に、ヒートシンク筐体の軸心上に配するよう収容搭載されてなるものとされたものは、ヒートシンク筐体の縦貫路の寸法の違いに応じて、寸法の異なる複数種類の電源用配線基板を個々に設計、製造する負担を大幅に軽減し、線状脆弱部に沿って分離することなく、小幅基板部および大幅基板部が一体のまま、ヒートシンク筐体に組み込まれたものとすることができる外、線状脆弱部に沿って分離された小幅基板部および大幅基板部の中の何れか一方のみが、ヒートシンク筐体に組み込まれたものとすることができ、大幅基板部のみを使用する場合には、後述する実施例には記載していないが、小幅基板部を使用する場合と同様に、大幅基板部の先端縁に対して、LED小型SMDチップが、側面視T字形となるよう電気的および機械的に接続されたものとすることができ、線状脆弱部に沿って分離された小幅基板部および大幅基板部は、何れも無駄になることなく、サイズの異なる夫々のヒートシンク筐体に組み込まれたものとすることができるという優れた経済性を達成できる。 The power supply wiring board of the LED unit is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side, respectively, and the base of the narrow board portion whose tip is set to a small width in advance and An electronic circuit that can be either an anode circuit or a cathode circuit is provided on one surface and the other surface, respectively, and a large substrate portion that is set wider than the narrow substrate portion is provided via a linear fragile portion that is easily separated. When either the large substrate portion is unnecessary or the narrow substrate portion is unnecessary, the narrow substrate portion and the large substrate separated along the linear fragile portion are mechanically integrated. Only one of the parts is selectively accommodated and mounted inside the longitudinal path of the heat insulating housing so as to be arranged on the axis of the heat insulating housing. The burden of individually designing and manufacturing multiple types of power supply wiring boards with different dimensions according to the difference in the dimensions of the longitudinal path is greatly reduced, and the narrow board and the narrow board without separation along the linear fragile part. Only one of the narrow board part and the large board part separated along the linear fragile part can be incorporated into the heat sink housing while the large board part is integrated. When it can be incorporated in the housing and only the large substrate portion is used, although not described in the examples described later, the large substrate portion is similarly used when the narrow substrate portion is used. The small LED SMD chip can be electrically and mechanically connected to the tip edge of the SMD so as to form a T-shape in the side view, and the narrow substrate portion and the narrow substrate portion separated along the linear fragile portion. It is possible to achieve excellent economic efficiency that the large-sized substrate portion can be incorporated into each heat sink housing of different sizes without wasting any of them.

さらに、LEDユニットの電源用配線基板が、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、予め、先端が小幅に設定された小幅基板部の基部と、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、該小幅基板部よりも幅広く設定された大幅基板部とが、分断容易な線状脆弱部を介して機械的に一体化され、LED小型SMDチップの実装基板および電源用配線基板が側面視T字形となるよう配されると共に、該LED小型SMDチップのアノード端子と該小幅基板部の一面の電子回路とが電気的および機械的に接続されて、該小幅基板部の一面の電子回路がアノード回路となり、該LED小型SMDチップのカソード端子と該小幅基板部の他面の電子回路とが電気的および機械的に接続されて、該小幅基板部の他面の電子回路がカソード回路とされ、該線状脆弱部に沿って該小幅基板部と該大幅基板部とが分離されることなく、しかも小幅基板部の一面のアノード回路と、大幅基板部の一面の電子回路とが該線状脆弱部を超えて電気的に接続されて該大幅基板部の電子回路がアノード回路とされ、該大幅基板部の少なくとも一面のアノード回路の途中に電源用電子部品が実装され、該大幅基板部のアノード回路の電源用電子部品よりも電源がわにアノードがわの電源用ハーネスが電気的および機械的に接続されると共に、該小幅基板部の他面のカソード回路の電源がわにカソードがわの電源用ハーネスが電気的および機械的に接続された上、該電源用配線基板が、ヒートシンク筐体の縦貫路の内部に、ヒートシンク筐体の軸心上に配するよう収容搭載されてなるものは、電源用電子部品が搭載可能となり、しかもヒートシンク筐体と電源用配線基板との熱伝達面積をより大きくし、LED小型SMDチップが発する熱を一段と効率よく放熱できるから、より高性能の小型LEDランプを提供可能となる。 Further, the power supply wiring board of the LED unit is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side, respectively, and the base portion of the narrow board portion whose tip is set to be narrow in advance. An electronic circuit that can be either an anode circuit or a cathode circuit is provided on one side and the other side, respectively, and the large board part that is set wider than the narrow board part is a linear fragile part that is easily separated. The small LED SMD chip mounting board and the power supply wiring board are arranged so as to have a T-shape in a side view, and the anode terminal of the small LED SMD chip and one surface of the narrow board portion are arranged mechanically. The electronic circuit is electrically and mechanically connected, the electronic circuit on one surface of the narrow substrate portion becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the electronic circuit on the other surface of the narrow substrate portion are connected. Electrically and mechanically connected, the electronic circuit on the other side of the narrow substrate is used as a cathode circuit, and the narrow substrate and the large substrate are not separated along the linear fragile portion. Moreover, the anode circuit on one surface of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion are electrically connected beyond the linear fragile portion, and the electronic circuit on the large substrate portion is used as an anode circuit. A power supply electronic component is mounted in the middle of the anode circuit on at least one surface of the large board section, and the power supply harness is electrically and mechanically connected to the power supply rather than the power supply electronic component of the large board section anode circuit. The power supply of the cathode circuit on the other side of the narrow board portion is electrically and mechanically connected to the power supply harness of the cathode, and the power supply wiring board is connected to the heat sink housing. Electronic components for power supply can be mounted on the inside of the longitudinal path of the body so as to be arranged on the axis of the heat sink housing, and the heat transfer area between the heat sink housing and the power supply wiring board. It is possible to provide a high-performance compact LED lamp because the heat generated by the small LED SMD chip can be dissipated more efficiently.

そして、LEDユニットの電源用配線基板が、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、予め、先端が小幅に設定された小幅基板部の基部と、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、該小幅基板部よりも幅広く設定された大幅基板部とが、分断容易な線状脆弱部を介して機械的に一体化され、該LED小型SMDチップの実装基板および電源用配線基板が側面視T字形となるよう配されると共に、該LED小型SMDチップのアノード端子と該小幅基板部の一面の電子回路とが電気的および機械的に接続されて、該小幅基板部の一面の電子回路がアノード回路となり、該LED小型SMDチップのカソード端子と該小幅基板部の他面の電子回路とが電気的および機械的に接続されて、該小幅基板部の他面の電子回路がカソード回路とされ、該線状脆弱部に沿って該小幅基板部と該大幅基板部とが分離されることなく、しかも該小幅基板部の一面のアノード回路と、該大幅基板部の一面の電子回路とが該線状脆弱部を超えて電気的に接続されて該大幅基板部の電子回路がアノード回路とされ、該線状脆弱部に沿って分離されることなく、しかも小幅基板部の一面のアノード回路と、大幅基板部の一面の電子回路とが該線状脆弱部を超えて電気的に接続され、該大幅基板部の一面のアノード回路の中途適所、および、該大幅基板部の他面の電子回路の中途適所の中の少なくとも一面のアノード回路の中途適所に電源用電子部品としての制限抵抗が実装されるか、または、該大幅基板部の一面の先端ランドと基端ランドとからなるアノード回路の該先端ランド、および、該大幅基板部の他面の先端ランドと基端ランドとからなる電子回路の該先端ランドがスルーホールで接続され、該大幅基板部の一面のアノード回路の基端ランド、および、該大幅基板部の他面の電子回路の基端ランドがスルーホールで接続され、該大幅基板部の他面の電子回路がアノード回路とされ、該大幅基板部の一面のアノード回路の先端ランドと基端ランドと間に電源用電子部品としての制限抵抗が搭載され、該大幅基板部の他面のアノード回路の先端ランドと基端ランドと間に電源用電子部品としての制限抵抗が搭載され、該大幅基板部の一面および他面のアノード回路の何れかの基端ランドにアノードがわの電源用ハーネスが電気的および機械的に接続されると共に、該小幅基板部の他面のカソード回路の電源がわにカソードがわの電源用ハーネスが電気的および機械的に接続された上、該電源用配線基板が、ヒートシンク筐体の縦貫路の内部に、ヒートシンク筐体の軸心上に配するよう収容搭載されてなるものは、該制限抵抗によって定電圧点灯できるものとなる上、万が一LED小型SMDチップが短絡した場合にも、小型LEDランプの装着対象物である、計器その他の装置類などに電圧上昇による悪影響を及ぼす虞を低減し、より安全性に優れたものとなり、しかも該大幅基板部の一面および他面の双方に制限抵抗が配置されるから、制限抵抗の発熱を大幅に抑制可能とし、より効率的に部品配置することが可能となり、より高出力、高性能な小型LEDランプの小型化に有利なものとなる。 Then, the power supply wiring board of the LED unit is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side, respectively, and the base portion of the narrow board portion whose tip is set to a small width in advance. An electronic circuit that can be either an anode circuit or a cathode circuit is provided on one side and the other side, respectively, and the large board part that is set wider than the narrow board part is a linear fragile part that is easily separated. The LED small SMD chip mounting board and the power supply wiring board are arranged so as to have a T-shape in a side view, and the anode terminal of the LED small SMD chip and the narrow board portion are mechanically integrated with each other. The electronic circuit on one side is electrically and mechanically connected, and the electronic circuit on one side of the narrow substrate portion becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the electronic circuit on the other surface of the narrow substrate portion Is electrically and mechanically connected, the electronic circuit on the other surface of the narrow substrate portion is used as a cathode circuit, and the narrow substrate portion and the large substrate portion are separated along the linear fragile portion. Moreover, the anode circuit on one surface of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion are electrically connected beyond the linear fragile portion, and the electronic circuit of the large substrate portion is connected to the anode circuit. The anode circuit on one side of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion are electrically connected beyond the linear fragile portion without being separated along the linear fragile portion. , The limiting resistance as an electronic component for power supply is provided in the middle of the anode circuit on one side of the large board and at least one of the electronic circuits on the other side of the large board. An electron that is mounted or consists of the tip land of the anode circuit consisting of the tip land and the proximal land on one surface of the large substrate portion, and the tip land and the proximal land on the other surface of the significant substrate portion. The tip land of the circuit is connected by a through hole, and the base end land of the anode circuit on one surface of the large board portion and the base end land of the electronic circuit on the other surface of the large board portion are connected by a through hole. The electronic circuit on the other side of the large board part is used as an anode circuit, and a limiting resistor as an electronic component for power supply is mounted between the tip land and the base end land of the anode circuit on one side of the large board part. A limiting resistor as an electronic component for power supply is mounted between the tip land and the base end land of the anode circuit on the other surface, and the anode is placed on either the base end land of the anode circuit on one side or the other side of the large board portion. My power harness Is electrically and mechanically connected, and the power supply of the cathode circuit on the other surface of the narrow substrate portion is electrically and mechanically connected to the power supply harness of the cathode and the power supply wiring. If the board is housed and mounted inside the longitudinal path of the heat sink housing so as to be arranged on the axis of the heat sink housing, it can be lit at a constant voltage by the limiting resistor, and in the unlikely event that the LED small SMD chip is installed. Even if a short circuit occurs, the risk of adverse effects due to a voltage rise on the instruments and other devices that are the objects to be mounted on the small LED lamp is reduced, and the safety is improved. Since the limiting resistor is arranged on both one side and the other side, it is possible to significantly suppress the heat generation of the limiting resistor, and it is possible to arrange the parts more efficiently, and the compact size of the small LED lamp with higher output and higher performance. It will be advantageous for conversion.

レンズバルプの集光レンズ部が、非球面の凸面レンズとされてなるものは、LED光源を大型化せずに照明効率を高め、LED小型SMDチップの光束をより効率的に照射可能とし、一段と優れた照明性能をより経済的に実現化できるものになる。
そして、透光バルブの筒状基端が、LED小型SMDチップの周囲に対して、該透光バルブの集光レンズ部の光軸と、LED小型SMDチップのLED素子の光軸とが、互いに同一軸心上に配すると共に、該LED小型SMDチップのLED素子の発光面から、透光バルブの集光レンズ部までの同一軸心上の距離が、集光レンズ部の焦点距離に一致するよう三次元的位置関係を調整された配置関係とするよう接着剤固定された上、該透光バルブの筒状基端の外周壁が、ヒートシンク筐体の光源装着筒壁の内壁に対して、該透光バルブの集光レンズ部およびLED小型SMDチップと、ヒートシンク筐体の機械的接続端との位置関係を調整された配置関係となるよう接着剤固定されてなるものとされたものは、高精度のネジ加工や嵌合構造などを要さずとも、そうした高精度の機械加工部品が組み合わせられたものと同等以上の高精度の製造を実現化することができるから、より低廉且つ効率的に大量生産可能なものとなる。
The condensing lens part of the lens valve is an aspherical convex lens, which improves the illumination efficiency without increasing the size of the LED light source and enables more efficient irradiation of the luminous flux of the small LED SMD chip, which is further excellent. It will be possible to realize more economical lighting performance.
Then, the tubular base end of the translucent valve has the optical axis of the condensing lens portion of the translucent valve and the optical axis of the LED element of the small LED SMD chip with respect to the periphery of the small LED SMD chip. The distance on the same axis from the light emitting surface of the LED element of the small LED SMD chip to the condensing lens portion of the translucent bulb matches the focal distance of the condensing lens portion. In addition to being fixed with adhesive so that the three-dimensional positional relationship is adjusted, the outer peripheral wall of the tubular base end of the translucent valve is relative to the inner wall of the light source mounting tubular wall of the heat sink housing. Those that are fixed with adhesive so that the positional relationship between the condensing lens portion of the light-transmitting valve and the small LED SMD chip and the mechanical connection end of the heat sink housing is adjusted are adjusted. It is cheaper and more efficient because it is possible to realize high-precision manufacturing equal to or higher than the combination of such high-precision machined parts without the need for high-precision screwing or fitting structure. It will be possible to mass-produce.

ヒートシンク筐体の縦貫路の内壁面と、LED小型SMDチップのLED素子の発光面とは反対がわとなる裏面と、電源用配線基板を有するものの場合には電源用配線基板と、該ヒートシンク筐体の縦貫路の内がわに配置された電源用ハーネスの一部との間の空間に、接着剤を兼ねた高熱伝導率の放熱樹脂が充填されてなる小型LEDランプによれば、該放熱樹脂が、LED小型SMDチップおよび電源用配線基板が発する熱を、ヒートシンク筐体に対し、より効率的に熱伝達できるものとなり、冷却性能を格段に高め、一段と高出力化および長寿命化を達成可能なものとすることができる。 The inner wall surface of the longitudinal path of the heat sink housing, the back surface opposite to the light emitting surface of the LED element of the small LED SMD chip, the power supply wiring board in the case of having a power supply wiring board, and the heat sink housing. According to a small LED lamp in which the space between a part of the power harness arranged in the vertical passage of the body and a part of the power harness is filled with a heat sink resin having high thermal conductivity that also serves as an adhesive, the heat dissipation The resin can transfer the heat generated by the small LED SMD chip and the wiring board for the power supply to the heat sink housing more efficiently, significantly improving the cooling performance, achieving higher output and longer life. It can be possible.

さらに、LED小型SMDチップが、それに搭載されたLEDチップの発光面上に適宜選択された蛍光体層を有するものとされてなるものによれば、色や光量などが重要視される医療用診断機器などに組み込まれる小型LEDランプの色調の調節を可能とし、従来型のフィラメントランプと交換しても違和感なく、従来型のフィラメントランプと同様に利用可能になるという、小型LEDランプの用途にとって非常に重要な効果を、それ以外の技術を用いた場合に比較して、格段に廉価にて達成可能とすることができる。 Further, according to a small LED SMD chip having a phosphor layer appropriately selected on the light emitting surface of the LED chip mounted therein, a medical diagnosis in which color, amount of light, etc. are important. It is very suitable for small LED lamp applications because it allows you to adjust the color tone of small LED lamps built into equipment, etc., and can be used in the same way as conventional filament lamps without any discomfort even if you replace it with a conventional filament lamp. It is possible to achieve the important effect at a much lower cost than when other technologies are used.

ヒートシンク筐体の機械的接続端が、M4mm、ピッチ0.7mmか、M5mm、ピッチ0.8mmか、M6mm、ピッチ1.0mmか、M8mm、ピッチ1.25mmかの何れか一の口金部である小型LEDランプは、同一寸法の口金部を有する従来型のフィラメントランプとの互換性を有するものとなり、前記各構造との相乗作用によってより高い効果を奏するものとなる。 The mechanical connection end of the heat sink housing is the base portion of any one of M4 mm, pitch 0.7 mm, M5 mm, pitch 0.8 mm, M6 mm, pitch 1.0 mm, M8 mm, and pitch 1.25 mm. The small LED lamp will be compatible with a conventional filament lamp having a base portion having the same dimensions, and will exert a higher effect by synergistic action with each of the above structures.

また、透光バルブの先端から、ヒートシンク筐体の機械的接続端の基端までの全長寸法が、20mmないし40mmに規制され、最大径となるヒートシンク筐体の外径が、6mmないし14mmに規制されてなる小型LEDランプは、従来型のフィラメントランプとの互換性を有するものとすることが可能となり、前記各構造との相乗作用によってより高い効果を奏するものとなる。 In addition, the total length from the tip of the light-transmitting bulb to the base of the mechanical connection end of the heat sink housing is restricted to 20 mm to 40 mm, and the outer diameter of the heat sink housing, which is the maximum diameter, is restricted to 6 mm to 14 mm. The small LED lamp to be formed can be made compatible with a conventional filament lamp, and a higher effect can be obtained by synergistic action with each of the above structures.

上記したとおりの構成からなるこの発明の実施に際し、その最良もしくは望ましい形態について説明を加えることにする。
LEDユニットは、LED小型SMDチップをヒートシンク筐体に組み込を可能とし、LED小型SMDチップに外部からの電力を供給可能とする機能を分担し、基本的に、ヒートシンク筐体の縦貫路内の軸心上に配された電源用配線基板と、該電源用配線基板の先端に側面視T字形となるよう搭載されたLED小型SMDチップと、該電源用配線基板の基端から延伸された電源用ハーネスとを有するものとすべきであり、後述する実施例にも示すように、ヒートシンク筐体の縦貫路内に納まる外郭寸法とされた基板素材の先端に先端接合縁が設けられ、該基板素材の一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられた電源用配線基板を有し、該電源用配線基板の先端接合縁が、該LED小型SMDチップのLED素子が実装された表面とは反対の裏面の中央に対して、該LED小型SMDチップのアノード端子が、該電源用配線基板の一面の電子回路に対応し、該LED小型SMDチップのカソード端子が、該電源用配線基板の他面の電子回路に対応し、該LED小型SMDチップの実装基板および電源用配線基板が側面視T字形となるよう配されると共に、該LED小型SMDチップのアノード端子と該一面の電子回路とが電気的および機械的に接続されて、該電源用配線基板の一面の電子回路がアノード回路となり、該LED小型SMDチップのカソード端子と該他面の電子回路とが電気的および機械的に接続されて、該電源用配線基板の他面の電子回路がカソード回路とされた上、該電源用配線基板の一面のアノード回路、および、他面のカソード回路の夫々から電源用ハーネスが延伸されてなるものとすべきである。
In carrying out the present invention having the above-described configuration, the best or desirable form thereof will be described.
The LED unit shares the function of allowing the small LED SMD chip to be incorporated into the heat sink housing and supplying power to the small LED SMD chip from the outside. Basically, it is inside the longitudinal path of the heat sink housing. A power supply wiring board arranged on the axis, a small LED SMD chip mounted on the tip of the power supply wiring board so as to have a T-shape in a side view, and a power supply extended from the base end of the power supply wiring board. It should have a harness for use, and as shown in Examples described later, a tip joining edge is provided at the tip of a substrate material having an outer size that fits in the longitudinal path of the heat sink housing, and the substrate is provided. A power supply wiring board provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side of the material, and the tip junction edge of the power supply wiring board is the LED small SMD. The anode terminal of the LED small SMD chip corresponds to the electronic circuit on one side of the power supply wiring board with respect to the center of the back surface opposite to the front surface on which the LED element of the chip is mounted, and the LED small SMD chip. The cathode terminal corresponds to the electronic circuit on the other surface of the power supply wiring board, and the mounting board of the LED small SMD chip and the power supply wiring board are arranged so as to have a T-shape in a side view, and the LED small SMD chip. The anode terminal and the electronic circuit on one side are electrically and mechanically connected, and the electronic circuit on one side of the power supply wiring board becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the electrons on the other side The circuit is electrically and mechanically connected, and the electronic circuit on the other side of the power supply wiring board is used as the cathode circuit, and the anode circuit on one side of the power supply wiring board and the cathode circuit on the other side. The power supply harness should be extended from each of the above.

LED小型SMDチップは、従来型の小型フィラメントランプの光源に置き換わり、光を照射可能とする機能を担い、砲弾型のLEDチップ、または、砲弾型のLEDチップが実装された基板の何れかと置き換えることが可能であるが、小型化、軽量化および大光量化を達成可能なSMDタイプのLEDとするのが望ましく、より具体的に示すと、高熱伝導率素材からなる実装基板の表面の中央に実装位置が設定され、該実装基板の表面の実装位置を挟み、互いに電気的に絶縁された適宜開き角度と、適宜距離とを隔てて対峙するよう配されたアノード端子およびカソード端子が、該実装基板の周縁に至るか、または、該実装基板の表面とは反対の裏面に至るかの何れか一方まで延伸され、該実装基板の実装位置に配されたLED素子が、該実装基板のアノード端子、およびカソード端子に接続されて実装されたものとするのが良く、後述する実施例にも示しているように、該実装基板の表面の実装位置を挟み、互いに電気的に絶縁された適宜開き角度と、適宜距離とを隔てて対峙するよう配されたアノード端子およびカソード端子が、該実装基板の表面とは反対の裏面に至るよう設けられた、既存のLED素子が実装位置に搭載されたSMDチップとすることができる。 The small LED SMD chip replaces the light source of the conventional small filament lamp and has the function of irradiating light, and replaces either the bullet-shaped LED chip or the substrate on which the bullet-shaped LED chip is mounted. However, it is desirable to use an SMD type LED that can achieve miniaturization, weight reduction, and high light intensity. More specifically, it is mounted in the center of the surface of a mounting substrate made of a high thermal conductivity material. The LED and cathode terminals, which are positioned and are arranged so as to face each other with an appropriate opening angle electrically insulated from each other and an appropriate distance between them, sandwiching the mounting position on the surface of the mounting board, are the mounting board. An LED element that is extended to either the peripheral edge of the mounting board or the back surface opposite to the front surface of the mounting board and arranged at the mounting position of the mounting board is an anode terminal of the mounting board. It is preferable that the LEDs are mounted by being connected to the cathode terminals, and as shown in Examples described later, the mounting positions on the surface of the mounting substrate are sandwiched, and the appropriate opening angles are electrically insulated from each other. An SMD in which an existing LED element is mounted at a mounting position, in which an anode terminal and a cathode terminal arranged so as to face each other at an appropriate distance are provided so as to reach the back surface opposite to the front surface of the mounting substrate. It can be a chip.

LED小型SMDチップの実装基板は、LED素子を配線容易に搭載可能とする機能を担い、高熱伝導率素材製のものとしなければならず、より具体的に示すと、セラミック基板、ガラス基板、紙フェノール基板、紙エポキシ基板、ガラスコンポジット基板、テフロン(登録商標)基板、またはその他の素材製の基板の何れかとすることが可能であり、また、小型LED光源が、それに搭載されたLED素子の発光面上に適宜選択された蛍光体層を有してなるものとするのが良い。 The mounting board of the LED small SMD chip has a function of easily mounting the LED element and must be made of a high thermal conductivity material. More specifically, a ceramic board, a glass board, or paper. It can be any of a phenolic substrate, a paper epoxy substrate, a glass composite substrate, a Teflon® substrate, or a substrate made of other materials, and a small LED light source emits light from the LED elements mounted on it. It is preferable to have an appropriately selected phosphor layer on the surface.

ヒートシンク筐体は、小型フィラメントランプの機械的接続端から透光バルブに至る間の外郭形状を、ガラスバルブに外装された小型フィラメントランプにおける相当部分の外郭形状を再現すると共に、LED小型SMDチップが発する熱を外部に伝達、放熱可能とする機能を担い、柱状の高熱伝導率素材からなり、基端がわに単一の機械的接続端を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、先端がわに光源装着筒壁が設けられ、内部に先端から基端に至る縦貫路が開口されたものとすべきであり、後述する実施例にも示しているとおり、円筒形の高熱伝導率素材からなり、該円筒形の軸心上の基端がわに単一の機械的接続端としての口金部を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、該円筒形の軸心上となる先端がわに光源装着筒壁が中心を一致するよう設けられ、該光源装着筒壁から口金部に至る該軸心に沿って縦貫路が開口されたものとするのが望ましい。 The heat sink housing reproduces the outer shape of the small filament lamp from the mechanical connection end to the light-transmitting valve, and the outer shape of a considerable part of the small filament lamp mounted on the glass valve, and the LED small SMD chip. It has the function of transferring the generated heat to the outside and dissipating it, and it is made of a columnar high thermal conductivity material, has a single mechanical connection end at the base end, and can be replaced with a maximum outer diameter of 20 mm or less. The outer shape and outer dimensions of the space for mounting small filament lamps are set to fit within the space shape and dimensions, a light source mounting cylinder wall is provided at the tip, and a longitudinal path from the tip to the base is opened inside. As shown in the examples described later, it is made of a cylindrical high thermal conductivity material, and the base end on the axis of the cylindrical shape is a single mechanical connection end. The outer shape and outer dimensions of the mounting space for the small filament lamp to be replaced, which has a base portion of 20 mm or less and has a maximum outer diameter of 20 mm or less, are set to the outer shape and outer dimensions that fit within the space dimensions, and on the axis of the cylindrical shape. It is desirable that the tip of the lamp is provided so that the light source mounting cylinder wall coincides with the center, and a longitudinal passage is opened along the axis from the light source mounting cylinder wall to the base portion.

ヒートシンク筐体を、より具体的なものとして示すと、その機械的接続端が、M4mm、ピッチ0.7mmか、M5mm、ピッチ0.8mmか、M6mm、ピッチ1.0mmか、M8mm、ピッチ1.25mmかの何れか一の口金部であるものであると云うことができ、銅合金、アルミニウム合金、鋼、ステンレス鋼、チタン合金、マグネシウム合金、その他の金属の何れかからなるものとすることができる外、それらの金属にニッケルメッキやクロームメッキが施されたもの、一部または全部にセラミック、合成樹脂、各種繊維強化樹脂などの何れかの素材が用いられたものなどとすることが可能であり、後述する実施例に示すように、開削黄銅棒が切削加工された上、ニッケルメッキされてなるものとすることが可能である。 To show the heat insulating housing as a more specific one, the mechanical connection ends thereof are M4 mm, pitch 0.7 mm, M5 mm, pitch 0.8 mm, M6 mm, pitch 1.0 mm, M8 mm, pitch 1. It can be said that it is the base portion of any one of 25 mm, and it may be made of any one of copper alloy, aluminum alloy, steel, stainless steel, titanium alloy, magnesium alloy, and other metals. In addition to being possible, it is possible to use metal with nickel plating or chrome plating, or part or all of which is made of any material such as ceramic, synthetic resin, or various fiber reinforced resins. Yes, as shown in Examples described later, it is possible that the excavated brass rod is machined and then nickel-plated.

ヒートシンク筐体の光源装着筒壁は、LED小型SMDチップの外周囲、および、透光バルブの筒状基端の少なくとも何れか一方の、ヒートシンク筐体の軸心の方向(照射方向)の進退調節、ヒートシンク筐体の軸心の方向(照射方向)に直交する仮想平面上の位置調節、および、ヒートシンク筐体の軸心の方向(照射方向)に対する傾き調節などを可能とすると共に、LED小型SMDチップの外周囲、および、透光バルブの筒状基端の少なくとも何れか一方を、該光源装着筒壁に対して、調節された姿勢に固着可能とする機能を担い、より具体的に示すと、LED小型SMDチップの外周囲、および、透光バルブの筒状基端の少なくとも何れか一方が、該ヒートシンク筐体の円筒形の軸心の方向に進退調節を可能とし、該軸心に対して直交する仮想平面上の該軸心の周囲360°方向への位置調節を可能とし、LED小型SMDチップの該軸心に対する傾きの調節を可能とし、さらに、透光バルブの筒状基端の該軸心に対する傾きの調節を可能とする寸法的余裕を確保された内径寸法に設定されたものとしなければならず、さらにまた、縦貫路と同じ内径、縦貫路よりも小さな内径、または、縦貫路よりも大きな内径の何れか一に設定されたものとすることが可能である。 The light source mounting cylinder wall of the heat sink housing adjusts the advance / retreat of the outer circumference of the small LED SMD chip and at least one of the tubular base ends of the translucent valve in the direction of the axis of the heat sink housing (irradiation direction). , The position on the virtual plane orthogonal to the direction of the axis of the heat sink housing (illumination direction), the tilt adjustment with respect to the direction of the axis of the heat sink housing (irradiation direction), etc. are possible, and the LED compact SMD More specifically, the outer periphery of the chip and at least one of the tubular base ends of the light-transmitting valve have a function of being able to be fixed to the light source mounting tubular wall in an adjusted posture. , At least one of the outer periphery of the LED small SMD chip and the tubular base end of the light transmissive valve enables advance / retreat adjustment in the direction of the cylindrical axis of the heat sink housing, with respect to the axis. It is possible to adjust the position of the LED small SMD chip with respect to the axis in the 360 ° direction around the axis on the virtual plane orthogonal to the axis, and further, it is possible to adjust the inclination of the LED small SMD chip with respect to the axis. It must be set to an inner diameter dimension that secures a dimensional allowance that allows adjustment of the inclination with respect to the axis, and further, the inner diameter is the same as that of the longitudinal passage, the inner diameter is smaller than that of the longitudinal passage, or the longitudinal passage is formed. It can be set to any one of the inner diameters larger than the road.

ヒートシンク筐体の機械的接続端は、小型フィラメントランプが組み込まれた対象機器類における、小型フィラメントランプの機械的接続端と同じ外郭形状および外郭寸法のものとしなければならず、例えば、後述する実施例にも示しているように、小型フィラメントランプの口金部と同じ外郭形状および外郭寸法とされたものとすることができる。
また、ヒートシンク筐体の縦貫路は、該ヒートシンク筐体の先端がわの光源装着筒壁と、該ヒートシンク筐体の基端がわの機械的接続端とを縦貫して繋ぎ、LED小型SMDチップの電源用ハーネスを機械的接続端から外部に露出するよう延伸可能とする機能を担い、より具体的なものとして示すならば、後述する実施例にも示しているが、LED小型SMDチップの実装基板のLED素子が実装された表面とは反対の裏面の中央に対して先端が側面視T字形となるよう配された電源用配線基板を、ヒートシンク筐体内に内装可能とする機能を担うものとすることが可能である。
The mechanical connection end of the heat sink housing must have the same outer shape and outer dimensions as the mechanical connection end of the small filament lamp in the target equipment in which the small filament lamp is incorporated. As shown in the example, the outer shape and the outer dimensions can be the same as those of the base portion of the small filament lamp.
Further, the longitudinal path of the heat sink housing vertically connects the light source mounting cylinder wall at the tip of the heat sink housing and the mechanical connection end at the base end of the heat sink housing, and is a small LED SMD chip. If it has a function of extending the power harness of the above from the mechanical connection end so as to be exposed to the outside and is shown as a more specific one, as shown in the examples described later, mounting of a small LED SMD chip. It has the function of enabling the interior of the power supply wiring board, which is arranged so that the tip is T-shaped in the side view with respect to the center of the back surface opposite to the front surface on which the LED element of the substrate is mounted, inside the heat sink housing. It is possible to do.

透光バルブは、ヒートシンク筐体の先端がわの光源装着筒壁に対して設けられたLED小型SMDチップを、高い透光性を有し且つ密閉状に包囲可能とする機能を担い、LED小型SMDチップの外がわを透光可能に覆うものとしなければならず、先端がU字断面形となる試験管の底部のような略均等肉厚の球面状のものとすることができる外、先端に集光レンズ部を有するものとすることが可能であり、後述する実施例にも示すように、LED小型SMDチップの外周囲を包囲する筒状基端と、該筒状基端の先端を密閉状に覆い、LED小型SMDチップに対峙する集光レンズ部とが、一体化されてなるものとすることができ、その一部が、透明、半透明、有色、無色、光沢ガラス状、および、磨りガラス状の少なくとも何れか一のガラス製のものとすることが出来る外、全体が透明または半透明の何れか一方、全体が有色または無色の何れか一方、および、全体が光沢ガラス状または磨りガラス状の何れか一方のガラス製のものとすることが可能であり、さらにまた、一部または全部が合成樹脂製のものとすることが可能である。 The translucent valve has a function of making it possible to enclose the small LED SMD chip provided on the wall of the light source mounting cylinder at the tip of the heat sink housing in a sealed manner with high translucency. The outside of the SMD chip must be transparently covered, and the tip can be spherical with a substantially uniform thickness, such as the bottom of a test tube with a U-shaped cross section. It is possible to have a condensing lens portion at the tip, and as shown in Examples described later, a tubular base end that surrounds the outer circumference of the LED small SMD chip and the tip of the tubular base end. Can be integrated with the condensing lens unit that faces the small LED SMD chip, and a part of it is transparent, translucent, colored, colorless, glossy glass, etc. And, in addition to being made of at least one glass of polished glass, the whole is either transparent or translucent, the whole is either colored or colorless, and the whole is glossy glass. Alternatively, it can be made of either one of the polished glass-like glass, and further, a part or all of it can be made of synthetic resin.

透光バルブの集光レンズ部は、LED小型SMDチップが発する光を、ヒートシンク筐体の先端方向の外側の適宜方向に向けて集光可能とする機能を分担するものであり、より具体的に示すならば、後述する実施例にも示すとおり、凸レンズ、セグメントレンズ、フレネルレンズ、非球面レンズ、などとすることが出来る外、同心円状、等高線上、等圧線状などのように中心から遠心方向に向けて次第に屈折が異なる透光素材からなり、レンズ部分の厚みが略同じであっても、集光機能を発揮可能な光学部品や、集光機能を発揮可能なプリズムなどに置き換えられたものとすることが可能である。 The condensing lens portion of the translucent valve shares the function of condensing the light emitted by the small LED SMD chip toward an appropriate direction outside the tip direction of the heat sink housing, and more specifically. If it is shown, as shown in Examples described later, it can be a convex lens, a segment lens, a Fresnel lens, an aspherical lens, etc., as well as concentric, contoured, isobaric, etc. in the centrifugal direction from the center. It is made of a translucent material whose refraction gradually differs toward the lens, and even if the thickness of the lens part is almost the same, it is replaced with an optical component that can exert a light-collecting function or a prism that can exert a light-collecting function. It is possible to do.

電源用配線基板は、LED小型SMDチップに対して電源用ハーネスを、短絡を阻止しつつ充分な強度をもって接続可能とする機能を分担し、高熱伝導率素材製のものとしなければならず、より具体的に示すと、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、予め、先端が小幅に設定された小幅基板部の基部と、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、該小幅基板部よりも幅広く設定された大幅基板部とが、分断容易な線状脆弱部を介して機械的に一体化され、大幅基板部が不要、または、小幅基板部が不要の何れか一方の場合には、線状脆弱部に沿って分離された小幅基板部および大幅基板部の何れか一方が選択的に、ヒートシンク筐体の縦貫路の内部に、ヒートシンク筐体の軸心上に配するよう収容搭載されてなるものとされたものとするのが望ましい。 The power supply wiring board must be made of a high thermal conductivity material by sharing the function of connecting the power supply harness to the small LED SMD chip with sufficient strength while preventing short circuits. Specifically, an electronic circuit that can be either an anode circuit or a cathode circuit is provided on one side and the other side, respectively, and the base of a narrow substrate portion whose tip is set to be narrow in advance, and one side and the other. An electronic circuit that can be either an anode circuit or a cathode circuit is provided on each surface, and a large substrate portion that is set wider than the narrow substrate portion is mechanically separated through a linear fragile portion that is easily divided. If either the large board part is unnecessary or the narrow board part is unnecessary, either the narrow board part or the large board part separated along the linear fragile part is selected. Therefore, it is desirable that the heat insulating housing is accommodated and mounted inside the longitudinal path of the heat insulating housing so as to be arranged on the axis of the heat insulating housing.

また、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、予め、先端が小幅に設定された小幅基板部の基部と、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、該小幅基板部よりも幅広く設定された大幅基板部とが、分断容易な線状脆弱部を介して機械的に一体化され、LED小型SMDチップの実装基板および電源用配線基板が側面視T字形となるよう配されると共に、該LED小型SMDチップのアノード端子と該小幅基板部の一面の電子回路とが電気的および機械的に接続されて、該小幅基板部の一面の電子回路がアノード回路となり、該LED小型SMDチップのカソード端子と該小幅基板部の他面の電子回路とが電気的および機械的に接続されて、該小幅基板部の他面の電子回路がカソード回路とされ、該線状脆弱部に沿って該小幅基板部と該大幅基板部とが分離されることなく、しかも小幅基板部の一面のアノード回路と、大幅基板部の一面の電子回路とが該線状脆弱部を超えて電気的に接続されて該大幅基板部の電子回路がアノード回路とされ、該大幅基板部の少なくとも一面のアノード回路の途中に電源用電子部品が実装され、該大幅基板部のアノード回路の電源用電子部品よりも電源がわにアノードがわの電源用ハーネスが電気的および機械的に接続されると共に、該小幅基板部の他面のカソード回路の電源がわにカソードがわの電源用ハーネスが電気的および機械的に接続された上、該電源用配線基板が、ヒートシンク筐体の縦貫路の内部に、ヒートシンク筐体の軸心上に配するよう収容搭載されてなるものとすることができる。 Further, an electronic circuit that can be either an anode circuit or a cathode circuit is provided on one side and the other side, respectively, and the base portion of the narrow substrate portion whose tip is set to a small width in advance and the one side and the other side respectively. An electronic circuit that can be either an anode circuit or a cathode circuit is provided, and a large substrate portion that is set wider than the narrow substrate portion is mechanically integrated via a linear fragile portion that is easily divided. , The mounting board of the LED small SMD chip and the power supply wiring board are arranged so as to have a T-shape in a side view, and the anode terminal of the LED small SMD chip and the electronic circuit on one side of the narrow board portion are electrically and mechanically arranged. The electronic circuit on one side of the narrow substrate portion becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the electronic circuit on the other surface of the narrow substrate portion are electrically and mechanically connected. The electronic circuit on the other surface of the narrow substrate portion is used as a cathode circuit, and the narrow substrate portion and the large substrate portion are not separated along the linear fragile portion, and the anode on one surface of the narrow substrate portion is used. The circuit and the electronic circuit on one surface of the large substrate portion are electrically connected beyond the linear fragile portion, and the electronic circuit on the large substrate portion is used as an anode circuit, and the anode circuit on at least one surface of the large substrate portion is used. A power supply electronic component is mounted in the middle of the circuit, and the power supply harness is electrically and mechanically connected to the power supply and the anode circuit, and the width is smaller than that of the power supply electronic component of the anode circuit of the board. The power supply of the cathode circuit on the other side of the board is electrically and mechanically connected to the power supply harness of the cathode, and the power supply wiring board is installed inside the longitudinal path of the heat sink housing. It can be accommodated and mounted so as to be arranged on the axis of the housing.

さらに具体的に示すと電源用配線基板は、セラミック基板、ガラス基板、紙フェノール基板、紙エポキシ基板、ガラスコンポジット基板、テフロン(登録商標)基板、またはその他の素材製の基板の何れかとすることが可能であり、後述する実施例にも示しているように、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、予め、先端が小幅に設定された小幅基板部の基部と、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、該小幅基板部よりも幅広く設定された大幅基板部とが、分断容易な線状脆弱部を介して機械的に一体化され、該LED小型SMDチップの実装基板および電源用配線基板が側面視T字形となるよう配されると共に、該LED小型SMDチップのアノード端子と該小幅基板部の一面の電子回路とが電気的および機械的に接続されて、該小幅基板部の一面の電子回路がアノード回路となり、該LED小型SMDチップのカソード端子と該小幅基板部の他面の電子回路とが電気的および機械的に接続されて、該小幅基板部の他面の電子回路がカソード回路とされ、該線状脆弱部に沿って該小幅基板部と該大幅基板部とが分離されることなく、しかも該小幅基板部の一面のアノード回路と、該大幅基板部の一面の電子回路とが該線状脆弱部を超えて電気的に接続されて該大幅基板部の電子回路がアノード回路とされ、該線状脆弱部に沿って分離されることなく、しかも小幅基板部の一面のアノード回路と、大幅基板部の一面の電子回路とが該線状脆弱部を超えて電気的に接続され、該大幅基板部の一面のアノード回路の中途適所、および、該大幅基板部の他面の電子回路の中途適所の中の少なくとも一面のアノード回路の中途適所に電源用電子部品としての制限抵抗が実装されるか、または、該大幅基板部の一面の先端ランドと基端ランドとからなるアノード回路の該先端ランド、および、該大幅基板部の他面の先端ランドと基端ランドとからなる電子回路の該先端ランドがスルーホールで接続され、該大幅基板部の一面のアノード回路の基端ランド、および、該大幅基板部の他面の電子回路の基端ランドがスルーホールで接続され、該大幅基板部の他面の電子回路がアノード回路とされ、該大幅基板部の一面のアノード回路の先端ランドと基端ランドと間に電源用電子部品としての制限抵抗が搭載され、該大幅基板部の他面のアノード回路の先端ランドと基端ランドと間に電源用電子部品としての制限抵抗が搭載され、該大幅基板部の一面および他面のアノード回路の何れかの基端ランドにアノードがわの電源用ハーネスが電気的および機械的に接続されると共に、該小幅基板部の他面のカソード回路の電源がわにカソードがわの電源用ハーネスが電気的および機械的に接続された上、該電源用配線基板が、ヒートシンク筐体の縦貫路の内部に、ヒートシンク筐体の軸心上に配するよう収容搭載されてなるものとすることが可能である。 More specifically, the power supply wiring substrate may be any of a ceramic substrate, a glass substrate, a paper phenol substrate, a paper epoxy substrate, a glass composite substrate, a Teflon (registered trademark) substrate, or a substrate made of other materials. It is possible, and as shown in Examples described later, an electronic circuit that can be either an anode circuit or a cathode circuit is provided on one side and each of the other side, and the tip is set to a small width in advance. An electronic circuit that can be either an anode circuit or a cathode circuit is provided on one side and each of the other side of the base portion of the narrow substrate portion, and a large substrate portion that is set wider than the narrow substrate portion can be easily separated. It is mechanically integrated via a linear fragile portion, and the mounting board of the LED small SMD chip and the power supply wiring board are arranged so as to have a T-shape in a side view, and also with the anode terminal of the LED small SMD chip. The electronic circuit on one side of the narrow substrate portion is electrically and mechanically connected, and the electronic circuit on one surface of the narrow substrate portion becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the other side of the narrow substrate portion. The electronic circuit on the surface is electrically and mechanically connected, and the electronic circuit on the other surface of the narrow substrate portion is used as a cathode circuit, and the narrow substrate portion and the large substrate portion are connected along the linear fragile portion. Is not separated, and the anode circuit on one side of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion are electrically connected beyond the linear fragile portion, and the electrons in the large substrate portion are electrically connected. The circuit is an anode circuit, and the anode circuit on one side of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion extend beyond the linear fragile portion without being separated along the linear fragile portion. Electronic components for power supply that are electrically connected and are located in the middle of the anode circuit on one side of the large board and at least one of the electronic circuits on the other side of the large board. The tip land of the anode circuit composed of the tip land and the base end land on one surface of the large board portion, and the tip land and the base end on the other surface of the large board portion. The tip land of the electronic circuit including the land is connected by a through hole, and the base end land of the anode circuit on one surface of the large board portion and the base end land of the electronic circuit on the other surface of the large board portion are through holes. The electronic circuit on the other side of the large board is used as the anode circuit, and a limiting resistor as an electronic component for power supply is mounted between the tip land and the base land of the anode circuit on one side of the large board. A limiting resistor as an electronic component for power supply is mounted between the tip land and the base end land of the anode circuit on the other surface of the large board portion, and either one of the anode circuits on one surface or the other surface of the large substrate portion is mounted. The power supply harness of the anode is electrically and mechanically connected to the base end land, and the power supply of the cathode circuit on the other surface of the narrow substrate portion is electrically and mechanically connected to the power supply harness of the cathode. It is possible that the power supply wiring board is accommodated and mounted inside the longitudinal path of the heat sink housing so as to be arranged on the axis of the heat sink housing.

電源用配線基板の線状脆弱部は、小幅基板部の基部と大幅基板部とを分断容易に一枚の基板に一体化する機能を分担し、剪断用工具類を用いて基板および回路に不要な損傷を与えることなく、小幅基板部の基部と大幅基板部とを容易に分断可能とされたもの、または、特別な工具類などを使用せずに、基板および回路に不要な損傷を与えることなく、小幅基板部の基部と大幅基板部とを容易に分断可能とされたものの何れか一方のものとしなければならず、電源用配線基板の表裏面に貫通するミシン孔線、電源用配線基板の表裏面の少なくとも何れか一方に設けられたミシン溝線、または、V字断面形やU字断面形の線状溝などとすることができる外、小幅基板部の基部と大幅基板部とを連結し、それら小幅基板部および大幅基板部よりも強度の低い素材製の連結用部に置き換えることが可能であり、また、小幅基板部の基部と大幅基板部とを機械的に嵌合可能であって、機械的に着脱可能な嵌着機構に置き換えることが可能である。 The linear fragile part of the power supply wiring board shares the function of easily separating the base part of the narrow board part and the large board part into one board, and is unnecessary for the board and the circuit by using shearing tools. It is possible to easily separate the base of the narrow board part from the large board part without causing any damage, or to give unnecessary damage to the board and circuit without using special tools. It is necessary to use one of the ones that can easily divide the base part of the narrow board part and the large board part, and the perforated wire penetrating the front and back surfaces of the power supply wiring board and the power supply wiring board. A perforated groove line provided on at least one of the front and back surfaces of the above, or a linear groove having a V-shaped cross section or a U-shaped cross section can be formed, and the base portion of the narrow substrate portion and the large substrate portion can be formed. It is possible to connect and replace them with connecting parts made of materials with lower strength than the narrow board part and the large board part, and the base part of the narrow board part and the large board part can be mechanically fitted. Therefore, it can be replaced with a mechanically removable fitting mechanism.

また、この発明の小型LEDランプは、ヒートシンク筐体の縦貫路の内部の、LED小型SMDチップや電源用配線基板などとの間にできる空隙に、接着剤を兼ねた高熱伝導率の放熱樹脂が充填されてなるものとすることができ、より具体的に示すならば、後述する実施例にも示すとおり、ヒートシンク筐体の縦貫路の内壁面と、LED小型SMDチップのLED素子の発光面とは反対がわとなる裏面と、電源用配線基板を有するものの場合には電源用配線基板と、該ヒートシンク筐体の縦貫路の内がわに配置された電源用ハーネスの一部との間の空間に、接着剤を兼ねた高熱伝導率の放熱樹脂が充填されてなるものとすることが可能であり、該放熱樹脂は、フィラーを混ぜたウレタン系やシリコーン系の高伝熱性を有する接着剤とすることができ、さらに、該放熱樹脂は、LED小型SMDチップや電源用配線基板などの内蔵部品類を、ヒートシンク筐体の縦貫路の内部に強固に一体化する硬質なものとすることができる外、充分な弾性を有し、LED小型SMDチップや電源用配線基板などの内蔵部品類を、ヒートシンク筐体や透光バルブなどに加わる外力から緩衝し保護可能なものとすることが可能である。
以下では、図面に示すこの発明を代表する実施例と共に、その構造について詳述することとする。
Further, in the small LED lamp of the present invention, a heat radiating resin having high thermal conductivity that also serves as an adhesive is placed in a gap formed between a small LED SMD chip and a power supply wiring board inside the longitudinal path of the heat sink housing. It can be filled, and more specifically, as shown in Examples described later, the inner wall surface of the longitudinal path of the heat sink housing and the light emitting surface of the LED element of the LED small SMD chip. Between the back side of the LED, the power supply wiring board if it has a power supply wiring board, and a part of the power supply harness arranged in the vertical passage of the heat sink housing. It is possible that the space is filled with a heat-dissipating resin having high thermal conductivity that also serves as an adhesive, and the heat-dissipating resin is a urethane-based or silicone-based heat-conducting adhesive mixed with a filler. Further, the heat radiating resin may be a rigid one that firmly integrates built-in parts such as a small LED SMD chip and a wiring board for a power supply inside the longitudinal path of the heat sink housing. In addition to being able to do so, it has sufficient elasticity and can protect built-in parts such as LED small SMD chips and power supply wiring boards by buffering them from external forces applied to heat sink housings and translucent valves. is there.
In the following, the structure thereof will be described in detail together with examples representing the present invention shown in the drawings.

図面は、この発明の小型LEDランプの技術的思想を具現化した代表的な幾つかの実施例を示すものである。
小型LEDランプを示す三面図である。 LED小型SMDチップの位置決め工程を示す三面図である。 LEDユニットの組み立て工程を示す三面図である。 透光バルブの位置決め組み込み工程を示す三面図である。 小型LEDランプの位置決め組み立て工程を示す三面図である。 大幅基板部から分離された小幅基板部を示す正面図である。 電源用配線基板を示す三面図である。 LED小型SMDチップの位置決め工程を示す正面図および側面図である。 LED小型SMDチップの位置決め工程を示す平面図である。 LED小型SMDチップが組み込まれた電源用配線基板を示す正面図および側面図である。 カソードがわの電源用ハーネスが配線された電源用配線基板を示す正面図である。 アノードがわの電源用ハーネスが配線された電源用配線基板を示す背面図である。 電源用ハーネスが配線された電源用配線基板を示す背面図および側面図である。 透光バルブの位置決め組み込み工程を示す三面図である。 補強チューブの装着工程を示す背面図である。 ヒートシンク筐体にLEDユニットを組み込む工程を示す背面図である。 LED小型SMDチップの位置決め結合工程を示す三面図である。 小型LEDランプの一例を示す正面図である。 小型LEDランプの他の例を示す正面図である。 小型LEDランプの他の例を示す正面図である。 小型LEDランプの他の例を示す正面図である。 小型LEDランプの他の例を示す正面図である。 小型LEDランプの他の例を示す正面図である。
The drawings show some typical examples that embody the technical idea of the small LED lamp of the present invention.
It is a three-sided view which shows a small LED lamp. It is a three-sided view which shows the positioning process of the LED small SMD chip. It is a three-view drawing which shows the assembly process of an LED unit. It is a three-view view which shows the positioning assembly process of a light-transmitting bulb. It is a three-sided view which shows the positioning assembly process of a small LED lamp. It is a front view which shows the narrow board part separated from the board part largely. It is a three-sided view which shows the wiring board for a power source. It is a front view and the side view which shows the positioning process of the LED small SMD chip. It is a top view which shows the positioning process of the LED small SMD chip. It is a front view and the side view which shows the wiring board for power-source which incorporated the LED small SMD chip. It is a front view which shows the power supply wiring board in which the power supply harness of the cathode is wired. It is a rear view which shows the wiring board for power source to which the harness for power source of the anode is wired. It is a rear view and the side view which shows the power supply wiring board to which the power supply harness is wired. It is a three-view view which shows the positioning assembly process of a light-transmitting bulb. It is a back view which shows the mounting process of a reinforcing tube. It is a rear view which shows the process of incorporating an LED unit into a heat sink housing. It is a three-sided view which shows the positioning coupling process of the LED small SMD chip. It is a front view which shows an example of a small LED lamp. It is a front view which shows another example of a small LED lamp. It is a front view which shows another example of a small LED lamp. It is a front view which shows another example of a small LED lamp. It is a front view which shows another example of a small LED lamp. It is a front view which shows another example of a small LED lamp.

図1ないし図7に示す事例は、柱状の高熱伝導率素材からなり、基端がわに単一の機械的接続端20を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、先端がわに光源装着筒壁21が設けられ、内部に先端から基端に至る縦貫路22が開口されたヒートシンク筐体2を有し、該ヒートシンク筐体2の先端の光源装着筒壁21の中央に配されたLED小型SMDチップ3が、該ヒートシンク筐体2に対して高熱伝導状態に搭載されると共に、該LED小型SMDチップ3に接続された電源用ハーネス35,35が、該縦貫路22を通じて機械的接続端20から外がわへ露出するよう延出され、該LED小型SMDチップ3の外周囲に相当する該光源装着筒壁21、および、該LED小型SMDチップ3それ自体の外周囲の中の少なくとも何れか一方に、透光バルブ5が一体化されてなるものとした、この発明の小型LEDランプにおける代表的な一実施例を示すものである。
以下では、この発明の小型LEDランプ1の製造工程の一例に従い順次、小型LEDランプ1の構造を示して行くこととする。
The examples shown in FIGS. 1 to 7 are small filament lamps made of a columnar high thermal conductivity material, having a single mechanical connection end 20 at the base end, and having a maximum outer diameter of 20 mm or less to be replaced. A heat sink that is set to the outer shape and outer dimensions that fit within the space shape and dimensions of the mounting space, has a light source mounting cylinder wall 21 at the tip, and has a longitudinal passage 22 from the tip to the base inside. A small LED SMD chip 3 having a housing 2 and arranged in the center of a light source mounting cylinder wall 21 at the tip of the heat insulating housing 2 is mounted on the heat insulating housing 2 in a high thermal conduction state. Power supply harnesses 35, 35 connected to the LED small SMD chip 3 are extended from the mechanical connection end 20 through the longitudinal passage 22 so as to be exposed to the outside, and are extended to the outer periphery of the LED small SMD chip 3. The small LED of the present invention, wherein the translucent valve 5 is integrated with at least one of the corresponding light source mounting cylinder wall 21 and the outer periphery of the LED small SMD chip 3 itself. It shows a typical example in a lamp.
In the following, the structure of the small LED lamp 1 will be sequentially shown according to an example of the manufacturing process of the small LED lamp 1 of the present invention.

それら各図からも明確に把握できるとおり、この発明の小型LEDランプ1は、基本的に、ヒートシンク筐体2に対して、LED小型SMDチップ3と電源用ハーネス35とを有するLEDユニットU、および、透光バルブ5が、該ヒートシンク筐体2、LED小型SMDチップ3および透光バルブ5の相互の配置関係を調節された状態に固着、一体化されたものであり、該ヒートシンク筐体2は、柱状の高熱伝導率素材である快削黄銅棒が切削加工され、ニッケルメッキされた円筒形の軸心C上の基端がわに単一の機械的接続端としてのM4mm、ピッチ0.7mmか、M5mm、ピッチ0.8mmか、M6mm、ピッチ1.0mmか、M8mm、ピッチ1.25mmかの何れか一の口金部20を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、該円筒形の軸心C上となる先端がわに光源装着筒壁21が、同光源装着筒壁21の中心を一致するよう設けられ、該光源装着筒壁21から口金部20に至る該軸心Cに沿って縦貫路22が開口されたものとなっている。 As can be clearly understood from each of these figures, the small LED lamp 1 of the present invention basically includes an LED unit U having a small LED SMD chip 3 and a power supply harness 35 with respect to the heat sink housing 2. The light-transmitting valve 5 is fixed and integrated in a state in which the mutual arrangement relationship between the heat-transmitting housing 2, the LED small SMD chip 3 and the light-transmitting valve 5 is adjusted, and the heat-transmitting housing 2 is integrated. Free-cutting brass rod, which is a columnar high thermal conductivity material, is machined, and the base end on the axis C of the nickel-plated cylindrical shape is M4 mm as a single mechanical connection end, pitch 0.7 mm. A small filament lamp having a base portion 20 of any one of M5 mm, pitch 0.8 mm, M6 mm, pitch 1.0 mm, M8 mm, and pitch 1.25 mm, and having a maximum outer diameter of 20 mm or less to be replaced. The light source mounting cylinder wall 21 is set to the outer shape and outer dimensions that fit within the space shape and space dimensions of the mounting space, and the tip on the cylindrical axis C is the light source mounting cylinder wall 21. It is provided so as to coincide with the center, and a longitudinal passage 22 is opened along the axis C from the light source mounting cylinder wall 21 to the base portion 20.

図2に示すように、LED小型SMDチップ3は、高熱伝導率素材である例えばセラミック製の実装基板30の表面の中央に実装位置31が設定され、該実装基板30の表面の実装位置31を挟み、互いに電気的に絶縁された適宜開き角度(例えば90°ないし180°)と、適宜距離とを隔てて対峙するよう配されたアノード端子32およびカソード端子33が、該実装基板30の互いに反対がわとなる周縁を回り込み、該実装基板30の表面とは反対の裏面に至り、互いに適宜間隔を隔て絶縁を保持するよう対峙する位置まで延伸されており、該実装基板30の表面の実装位置31にLED素子34が配され、該LED素子34の発光面上には、当該小型LEDランプ1の使用目的に適する発光色や色合いなどの各種条件に応じて適宜選択された蛍光体層37が設けられており、該実装基板30のアノード端子32およびカソード端子33に対して電気的および機械的に接続されて表面実装されたものでる。 As shown in FIG. 2, in the LED small SMD chip 3, the mounting position 31 is set in the center of the surface of the mounting substrate 30 made of, for example, ceramic, which is a high thermal conductivity material, and the mounting position 31 on the surface of the mounting substrate 30 is set. The anode terminals 32 and the cathode terminals 33, which are sandwiched and arranged so as to face each other with an appropriate opening angle (for example, 90 ° to 180 °) electrically insulated from each other and an appropriate distance, are opposite to each other of the mounting substrate 30. It wraps around the peripheral edge of the mounting substrate 30 and reaches the back surface opposite to the front surface of the mounting substrate 30, and is stretched to a position where it faces each other so as to maintain insulation at appropriate intervals, and the mounting position on the surface of the mounting substrate 30. An LED element 34 is arranged on the 31. On the light emitting surface of the LED element 34, a phosphor layer 37 appropriately selected according to various conditions such as a light emitting color and a hue suitable for the purpose of use of the small LED lamp 1 is formed. It is provided and is surface-mounted by being electrically and mechanically connected to the anode terminal 32 and the cathode terminal 33 of the mounting substrate 30.

図2および図6に示すように、該LED小型SMDチップ3には、該LED小型SMDチップ3の、LED素子34が搭載された表面とは反対がわとなる裏面のアノード端子32およびカソード端子33の間となる中央に、電源用配線基板4(小幅基板部42)が、該LED小型SMDチップ3のLED素子34の照射方向の軸心Z(C)に対して90°の角度をもつ仮想平面上の、該電源用配線基板4(小幅基板部42)の一面および他面に平行なX方向と、該電源用配線基板4(小幅基板部42)の一面および他面に直角なY方向との夫々に位置調節され、該LED小型SMDチップ3の実装位置31、および、該電源用配線基板4(小幅基板部42)の互いの形状重心が、同一の軸心Z(C)上に配列するよう位置決めされたものとなっている。 As shown in FIGS. 2 and 6, the LED small SMD chip 3 has an anode terminal 32 and a cathode terminal on the back surface of the LED small SMD chip 3 which are opposite to the front surface on which the LED element 34 is mounted. In the center between 33, the power supply wiring board 4 (small width board portion 42) has an angle of 90 ° with respect to the axis Z (C) in the irradiation direction of the LED element 34 of the LED small SMD chip 3. The X direction parallel to one surface and the other surface of the power supply wiring board 4 (narrow board portion 42) on the virtual plane and the Y perpendicular to one surface and the other surface of the power supply wiring board 4 (narrow board portion 42). The positions are adjusted in each direction, and the mounting position 31 of the LED small SMD chip 3 and the mutual shape center of gravity of the power supply wiring board 4 (narrow board portion 42) are on the same axis Z (C). It is positioned so that it is arranged in.

図2および図7に示すように、電源用配線基板4は、先端が、各種あるLED小型SMDチップ3の中でもより小型のものを搭載可能とするよう、ボトルネック状に小幅化された平面形とされ、胴部も先端より僅かに幅広な小幅寸法に設定された小幅基板部42の基部と、該小幅基板部42よりも幅寸法が、電源用電子部品(48:図10参照)を搭載可能とするよう大きく設定された大幅基板部45の先端とが、該小幅基板部42の基部と該大幅基板部45の先端との境界線上の一面および他面の少なくとも何れか一方に、線状脆弱部44となる直線状V字形溝44を介して一体化されたものとしてあり、該小幅基板部42の先端が、該小幅基板部42の一面および他面に対して直角となる先端接合縁43とされた上、該小幅基板部42の一面および他面の夫々に配線構造次第でアノード回路またはカソード回路の何れか一方と成り得る電子回路4a,4aが設けられ、該大幅基板部44の一面および他面の夫々には、配線構造次第でアノード回路またはカソード回路の何れか一方と成り得る電子回路4b,4bが設けられている。 As shown in FIGS. 2 and 7, the power supply wiring board 4 has a flat shape whose tip is narrowed in a bottleneck shape so that a smaller one among various small LED SMD chips 3 can be mounted. The base of the narrow board portion 42 whose body is set to a narrow dimension slightly wider than the tip, and the electronic component for power supply (48: see FIG. 10) having a width dimension wider than that of the narrow board portion 42 are mounted. The tip of the large substrate portion 45, which is set large so as to be possible, is linear on at least one of one surface and the other surface on the boundary line between the base portion of the narrow substrate portion 42 and the tip of the large substrate portion 45. It is integrated via a linear V-shaped groove 44 that serves as a fragile portion 44, and the tip of the narrow substrate portion 42 is a tip joining edge that is perpendicular to one surface and the other surface of the narrow substrate portion 42. In addition to being 43, electronic circuits 4a and 4a, which can be either an anode circuit or a cathode circuit depending on the wiring structure, are provided on one surface and the other surface of the narrow substrate portion 42, and the large substrate portion 44 is provided. Electronic circuits 4b and 4b, which can be either an anode circuit or a cathode circuit, are provided on each of the one side and the other side depending on the wiring structure.

電源用配線基板4の該小幅基板部42の一面および他面の夫々の電子回路4a,4aは互いに表裏同一の回路パターンとされ、また、大幅基板部45の一面および他面の夫々の電子回路4b,4bも互いに表裏同一の回路パターンとされ、さらに、線状脆弱部44となる直線状V字形溝44を境に小幅基板部42がわの一面の電子回路4aおよび他面の電子回路4a,4aと、大幅基板部45がわの一面の電子回路4bおよび他面の電子回路4bとに電気的に分離されており、該小幅基板部42の夫々の電子回路4a,4aには、夫々先端ランドa,aと基端ランドb,bとが設けられ、大幅基板部45の一面および他面の夫々の電子回路4b,4bには、夫々電源用電子部品(48:図10参照)を実装可能とする先端ランドc,cと基端ランドd,dとが設けられたものとなっている。 The electronic circuits 4a and 4a on one side and the other side of the narrow board portion 42 of the power supply wiring board 4 have the same circuit pattern on the front and back sides, and the electronic circuits on one side and the other side of the board portion 45 are significantly different. 4b and 4b also have the same circuit pattern on the front and back sides, and further, the electronic circuit 4a on one side of the narrow substrate portion 42 and the electronic circuit 4a on the other side are defined by the linear V-shaped groove 44 which is the linear fragile portion 44. , 4a and the electronic circuit 4b on one side of the large board portion 45 and the electronic circuit 4b on the other side are electrically separated, and the electronic circuits 4a and 4a of the narrow board portion 42 are respectively separated. Tip lands a and a and base end lands b and b are provided, and electronic components for power supply (48: see FIG. 10) are respectively provided in the electronic circuits 4b and 4b on one side and the other side of the substrate portion 45. The tip lands c and c and the base end lands d and d that can be mounted are provided.

図2、図3および図6に示すように、該LED小型SMDチップ3の実装位置31の裏面がわに相当し、実装基板30の裏面のアノード端子32およびカソード端子33の間となる中央に、該電源用配線基板4(小幅基板部42)の先端接合縁43が、側面視T字形となるよう接合された上、該電源用配線基板4(小幅基板部42)の一面の電子回路4aの先端ランドaに、該LED小型SMDチップ3のアノード端子32が、ハンダ付け部Pによって電気的および機械的に接続され、該電源用配線基板4(小幅基板部42)の一面の電子回路4aがアノード回路40となり、また、該電源用配線基板4(小幅基板部42)の他面の電子回路4aの先端ランドaに、該LED小型SMDチップ3のカソード端子33が、ハンダ付け部Pによって電気的および機械的に接続され、該電源用配線基板4(小幅基板部42)の他面の電子回路4aがカソード回路41となり、各ハンダ付け部P,Pによって該電源用配線基板4(小幅基板部42)が、該LED小型SMDチップ3の裏面の中央に結合されている。 As shown in FIGS. 2, 3 and 6, the back surface of the mounting position 31 of the small LED SMD chip 3 corresponds to a wrinkle, and is located in the center between the anode terminal 32 and the cathode terminal 33 on the back surface of the mounting board 30. The tip bonding edge 43 of the power supply wiring board 4 (small width substrate portion 42) is joined so as to have a T-shape in a side view, and then the electronic circuit 4a on one surface of the power supply wiring board 4 (small width substrate portion 42) is formed. The anode terminal 32 of the small LED SMD chip 3 is electrically and mechanically connected to the tip land a of the LED by the soldering portion P, and the electronic circuit 4a on one surface of the power supply wiring board 4 (small width substrate portion 42) is connected. Is the anode circuit 40, and the cathode terminal 33 of the LED small SMD chip 3 is attached to the tip land a of the electronic circuit 4a on the other surface of the power supply wiring board 4 (small width substrate portion 42) by the soldering portion P. The electronic circuit 4a on the other surface of the power supply wiring board 4 (small width board portion 42) is electrically and mechanically connected to serve as a cathode circuit 41, and the power supply wiring board 4 (small width) is formed by the soldering portions P and P. The substrate portion 42) is coupled to the center of the back surface of the small LED SMD chip 3.

図3および図6に示すように、LED小型SMDチップ3と結合された電源用配線基板4(小幅基板部42)は、線状脆弱部44としての直線状V字形溝44を境に、折り曲げるよう外力が加えられたり、裁断工具などで裁断されたりするなどされ、小幅基板部42の基部から大幅基板部44が取り去られた上、該小幅基板部42の一面のアノード回路40の基端ランドbと、他面のカソード回路41の基端ランドbとの夫々に対して電源用ハーネス35,35が各ハンダ付け部P,Pによって電気的および機械的に接続され、LEDユニットUが完成されたものとなる。 As shown in FIGS. 3 and 6, the power supply wiring board 4 (narrow board portion 42) coupled to the LED small SMD chip 3 is bent at the linear V-shaped groove 44 as the linear fragile portion 44. The substrate portion 44 is largely removed from the base portion of the narrow substrate portion 42 by applying an external force or cutting with a cutting tool or the like, and the base end of the anode circuit 40 on one surface of the narrow substrate portion 42. The power supply harnesses 35 and 35 are electrically and mechanically connected to the land b and the base end land b of the cathode circuit 41 on the other surface by the soldering portions P and P, respectively, and the LED unit U is completed. It will be the one that was done.

図4に示すように、LEDユニットUの小幅基板部42がT字断面形に結合されたLED小型SMDチップ3の外周囲に対して、LED素子34が実装された表面がわを覆うよう、該LED小型SMDチップ3の外周囲を包囲する筒状基端50と、該筒状基端50の先端を密閉状に覆い、該LED小型SMDチップ3のLED素子34に対峙する集光レンズ部51とが、一体化された透光バルブ5が、同筒状基端50を介して一体化されよう配され、該LED小型SMDチップ3のLED素子34の照射方向の軸心Z(C)方向(図4中に白抜き矢印で示す方向)、および、該LED素子34の照射方向の軸心Z(C)に対して90°の角度をもつ仮想平面上の、該電源用配線基板4(小幅基板部42)の一面および他面に平行なX方向と、該電源用配線基板4(小幅基板部42)の一面および他面に直角なY方向との夫々に焦点距離を含む位置の調節がなされた上、該LED小型SMDチップ3の外周囲壁と、透光バルブ5の筒状基端50の内周壁とが、シーリング機能を有する仮止め用接着か、および、強固に固着する接着剤かの何れか一方の接着剤A1によって接着材結合されたものとなっている。 As shown in FIG. 4, the surface on which the LED element 34 is mounted covers the outer periphery of the LED small SMD chip 3 in which the narrow substrate portion 42 of the LED unit U is coupled in a T-shaped cross section. A condensing lens unit that seals the tubular base end 50 that surrounds the outer periphery of the LED small SMD chip 3 and the tip of the tubular base end 50 and faces the LED element 34 of the LED small SMD chip 3. The translucent valve 5 integrated with the 51 is arranged so as to be integrated via the tubular base end 50, and the axis Z (C) of the LED element 34 of the LED compact SMD chip 3 in the irradiation direction. The power supply wiring board 4 on a virtual plane having an angle of 90 ° with respect to the direction (direction indicated by the white arrow in FIG. 4) and the axis Z (C) of the irradiation direction of the LED element 34. Positions including focal distances in the X direction parallel to one surface and the other surface of the (narrow board portion 42) and in the Y direction perpendicular to the one surface and the other surface of the power supply wiring substrate 4 (narrow substrate portion 42). After adjustment, the outer peripheral wall of the LED small SMD chip 3 and the inner peripheral wall of the tubular base end 50 of the translucent valve 5 are temporarily fixed with a sealing function or firmly fixed. The adhesive is bonded by the adhesive A1 of either one of the adhesives.

図4および図5に示すように、小幅基板部42に結合された電源用ハーネス35,35の基端は、適宜長さに設定され、その外径がヒートシンク筐体2の口金部20に開口する縦貫路22の内径よりも小さく設定された補強チューブ36が、その先端がわが縦貫路22内に装着され、その後端がわが縦貫路22外に露出するよう外装されたものとすることが可能であり、以上のように組み立てられた、LEDユニットUは、ヒートシンク筐体2の縦貫路22内に、電源用ハーネス35,35および補強チューブ36の後端がわが、口金部20の後端から露出し、透光バルブ5の集光レンズ部51がわが、光源装着筒壁21の先端から露出するよう組み合わせられ、該ヒートシンク筐体2の円筒形の軸心C(Z)方向の進退調節、および、該軸心C(Z)方向に直交する仮想平面上であって、しかも互いに直行するX,Y方向の、外郭寸法の調節を含む位置調節がされた上、ヒートシンク筐体2の光源装着筒壁21(縦貫路22)の内周壁と、透光バルブ5の筒状基端50の外周壁面との間、および、該光源装着筒壁21(縦貫路22)の内周壁と、LED小型SMDチップ3の外周囲壁との間の少なくとも何れか一方に注入された熱硬化性接着剤A2によって密閉状且つ強固に一体化されたものである。 As shown in FIGS. 4 and 5, the base ends of the power supply harnesses 35 and 35 coupled to the narrow substrate portion 42 are set to appropriate lengths, and the outer diameter thereof opens in the base portion 20 of the heat sink housing 2. It is possible that the reinforcing tube 36, which is set smaller than the inner diameter of the longitudinal passage 22 to be used, is mounted so that the tip thereof is inside the longitudinal passage 22 and the rear end is exposed to the outside of the longitudinal passage 22. The LED unit U assembled as described above has the rear ends of the power supply harnesses 35 and 35 and the reinforcing tube 36 in the longitudinal passage 22 of the heat sink housing 2 from the rear end of the base portion 20. The condensing lens portion 51 of the light transmissive valve 5 is combined so as to be exposed from the tip of the light source mounting cylinder wall 21, and the advance / retreat adjustment of the heat sink housing 2 in the cylindrical axis C (Z) direction is performed. In addition, the position of the heat sink housing 2 is mounted on the virtual plane orthogonal to the axis C (Z) direction, and the positions are adjusted in the X and Y directions orthogonal to each other, including the adjustment of the outer dimensions. Between the inner peripheral wall of the tubular wall 21 (longitudinal passage 22) and the outer peripheral wall surface of the tubular base end 50 of the translucent valve 5, the inner peripheral wall of the light source mounting tubular wall 21 (longitudinal passage 22), and the small LED. The SMD chip 3 is hermetically and firmly integrated with the heat-curable adhesive A2 injected into at least one of the outer peripheral walls of the SMD chip 3.

さらに、図5に示すように、ヒートシンク筐体2の縦貫路22の内壁面と、LED小型SMDチップ3のLED素子33の発光面とは反対がわとなる裏面と、電源用配線基板4の外周囲壁面と、該ヒートシンク筐体2の縦貫路22の内がわに配置された電源用ハーネス35の一部の外周壁と、その電源用ハーネス35に外装された補強チューブ36の外周壁との間の空間に、接着剤を兼ねた高熱伝導率のウレタン系およびシリコーン系の何れか一方の放熱樹脂A3が充填されてなるものとしてある。 Further, as shown in FIG. 5, the inner wall surface of the longitudinal passage 22 of the heat sink housing 2, the back surface opposite to the light emitting surface of the LED element 33 of the small LED SMD chip 3, and the power supply wiring board 4. The outer peripheral wall surface, a part of the outer peripheral wall of the power supply harness 35 arranged in the inner side of the longitudinal passage 22 of the heat sink housing 2, and the outer peripheral wall of the reinforcing tube 36 outer to the power supply harness 35. The space between them is filled with the heat-dissipating resin A3 of either urethane-based or silicone-based having high thermal conductivity that also serves as an adhesive.

(実施例1の作用・効果)
以上のとおりの構成からなるこの発明の小型LEDランプ1は、図2中に示すように、LED小型SMDチップ3に結合される前段階の電源用配線基板4が、小幅基板部42および大幅基板部45が一体のままのものとすることが可能であり、LED小型SMDチップ3に対する小幅基板部42の軸心C(Z)の傾きをより高精度で直角に調節し、結合することが容易になり、しかも、電源用配線基板4の小幅基板部42および大幅基板部45の各一面および他面の電子回路4a,4a,4b,4bが、何れも配線接続の構造次第で、アノード回路40またはカソード回路41の何れか一方と成り得るものであるから、LED小型SMDチップ3と電源用配線基板4の小幅基板部42との結合作業に際して、回路の組み合わせを気にせず、双方の部品の位置決め精度を高めることに集中することができるから、製造および品質管理が容易になり、高品質な小型LEDランプ1を格段に効率よく生産可能なものとなる。
(Action / Effect of Example 1)
In the small LED lamp 1 of the present invention having the above-described configuration, as shown in FIG. 2, the power supply wiring board 4 in the previous stage, which is coupled to the small LED SMD chip 3, has a narrow board portion 42 and a large board. It is possible to keep the portion 45 as one piece, and it is easy to adjust the inclination of the axis C (Z) of the narrow substrate portion 42 with respect to the LED small SMD chip 3 at a right angle with higher accuracy and to connect the portions 45. Moreover, the electronic circuits 4a, 4a, 4b, and 4b on one side and the other side of the narrow board portion 42 and the large board portion 45 of the power supply wiring board 4 all depend on the wiring connection structure, and the anode circuit 40 Alternatively, since it can be either one of the cathode circuits 41, when the small LED SMD chip 3 and the narrow board portion 42 of the power supply wiring board 4 are connected to each other, the combination of circuits is not a concern and both components are connected. Since it is possible to concentrate on improving the positioning accuracy, manufacturing and quality control become easy, and a high-quality compact LED lamp 1 can be produced remarkably efficiently.

図7ないし図17に示す事例は、LEDユニットUのLED小型SMDチップ3に結合された電源用配線基板4のアノード回路40の中途適所に電源用電子部品48が設けられた、この発明の小型LEDランプにおける他の実施例を示すものである。
以下では、この発明の小型LEDランプの製造工程の他の例に従い順次、小型LEDランプ1の構造につて示して行くこととする。
In the example shown in FIGS. 7 to 17, the small size of the present invention is provided in which the power supply electronic component 48 is provided at an appropriate position in the anode circuit 40 of the power supply wiring board 4 coupled to the LED small size SMD chip 3 of the LED unit U. It shows another embodiment in the LED lamp.
In the following, the structure of the small LED lamp 1 will be sequentially shown according to another example of the manufacturing process of the small LED lamp of the present invention.

この他の実施例に示す小型LEDランプ1に用いるLEDユニットUの電源用配線基板4は、前記実施例1の図7に示すものと同一部品4であり、一面および他面の夫々にアノード回路40またはカソード回路41の何れか一方と成り得る電子回路4a,4aが設けられ、予め、先端が小幅に設定された小幅基板部42の基部と、一面および他面の夫々にアノード回路40またはカソード回路41の何れか一方と成り得る電子回路4b,4bが設けられ、該小幅基板部42よりも幅広く設定された大幅基板部45とが、分断容易な線状脆弱部44を介して機械的に一体化され、該線状脆弱部44に沿って分離されることなくそのまま利用されたものとなっている。 The power supply wiring board 4 of the LED unit U used for the small LED lamp 1 shown in the other embodiment is the same component 4 as that shown in FIG. 7 of the first embodiment, and has an anode circuit on one side and the other side, respectively. Electronic circuits 4a and 4a, which can be either 40 or the cathode circuit 41, are provided, and the base of the narrow substrate portion 42 whose tip is set to be narrow in advance, and the anode circuit 40 or the cathode on one side and the other side, respectively. Electronic circuits 4b and 4b, which can be one of the circuits 41, are provided, and the large board portion 45, which is set wider than the narrow board portion 42, mechanically communicates with the linear fragile portion 44 which is easily divided. It is integrated and used as it is without being separated along the linear fragile portion 44.

図8および図9に示すように、該LED小型SMDチップ3の実装位置31の裏面がわに相当し、実装基板30の裏面のアノード端子32およびカソード端子33の間となる中央に、該電源用配線基板4(小幅基板部42)の先端接合縁43が、側面視T字形となるよう接合された上、該電源用配線基板4(小幅基板部42)の一面の電子回路4aの先端ランドaに、該LED小型SMDチップ3のアノード端子32が、ハンダ付け部Pによって電気的および機械的に接続され、該電源用配線基板4(小幅基板部42)の一面の電子回路4aが、アノード回路40となり、また、該電源用配線基板4(小幅基板部42)の他面の電子回路4aの先端ランドaに、該LED小型SMDチップ3のカソード端子33が、ハンダ付け部Pによって電気的および機械的に接続され、該電源用配線基板4(小幅基板部42)の他面の電子回路4aが、カソード回路41となり、該電源用配線基板4(小幅基板部42)が、該LED小型SMDチップ3の裏面の中央に結合されたものとなっている。 As shown in FIGS. 8 and 9, the power supply corresponds to the back surface of the mounting position 31 of the small LED SMD chip 3 and is located in the center between the anode terminal 32 and the cathode terminal 33 on the back surface of the mounting board 30. The tip bonding edge 43 of the power supply wiring board 4 (small width board portion 42) is joined so as to have a T-shape in a side view, and the tip land of the electronic circuit 4a on one surface of the power supply wiring board 4 (small width board portion 42). The anode terminal 32 of the LED small SMD chip 3 is electrically and mechanically connected to a by a soldering portion P, and the electronic circuit 4a on one surface of the power supply wiring board 4 (narrow substrate portion 42) is an anode. The circuit 40 is formed, and the cathode terminal 33 of the small LED SMD chip 3 is electrically connected to the tip land a of the electronic circuit 4a on the other surface of the power supply wiring board 4 (small width board portion 42) by the soldering portion P. And mechanically connected, the electronic circuit 4a on the other surface of the power supply wiring board 4 (narrow board portion 42) becomes the cathode circuit 41, and the power supply wiring board 4 (small width substrate portion 42) becomes the LED small size. It is coupled to the center of the back surface of the SMD chip 3.

図10および図11に示すように、電源用配線基板4における、小幅基板部42の一面のアノード回路40および他面のカソード回路41と、大幅基板部45の一面の電子回路4bおよび他面の電子回路4bとは、線状脆弱部44である直線状V字形溝44の部分で小幅基板部42がわと大幅基板部45がわとに電気的に分離されたものであるから、該電源用配線基板4の小幅基板部42の一面のアノード回路40の基端ランドbと、大幅基板部45の一面の電子回路4bの先端ランドcとの間に、例えば錫メッキ線やエナメル線などの短尺な接続導線47が架けわたされてハンダ付け部Pを介して機械的および電気的に接続され、大幅基板部45の一面の電子回路4bがアノード回路40となる。 As shown in FIGS. 10 and 11, in the power supply wiring board 4, the anode circuit 40 on one side of the narrow board portion 42 and the cathode circuit 41 on the other side, and the electronic circuit 4b and the other side on one side of the large board portion 45. Since the electronic circuit 4b is a portion of the linear V-shaped groove 44 which is a linear fragile portion 44, the narrow substrate portion 42 and the large substrate portion 45 are electrically separated from each other. Between the base end land b of the anode circuit 40 on one surface of the narrow substrate portion 42 of the wiring board 4 and the tip land c of the electronic circuit 4b on one surface of the large substrate portion 45, for example, a tin-plated wire or an enamel wire. A short connecting lead wire 47 is hung and mechanically and electrically connected via the soldering portion P, and the electronic circuit 4b on one surface of the substrate portion 45 becomes the anode circuit 40.

電源用配線基板4の大幅基板部45は、一面の電子回路4b(アノード回路40)の先端ランドcと他面の電子回路4bの先端ランドcとがスルーホールHで接続され、大幅基板部45の一面の電子回路4b(アノード回路40)の基端ランドdと他面の電子回路4bの基端ランドdとがスルーホールHで接続され、大幅基板部45の他面の電子回路4bがアノード回路40となり、大幅基板部45の一面の電子回路4b(アノード回路40)の先端ランドcと基端ランドdとの間に、電源用電子部品48としての制限抵抗48がハンダ付け部P,Pを介して電気的および機械的に固着され、また、大幅基板部45の他面の電子回路4b(アノード回路40)の先端ランドcと基端ランドdとの間に、電源用電子部品48としての前記のものと同一の抵抗値の制限抵抗48がハンダ付け部P,Pを介して電気的および機械的に固着されて実装されたものとなっている。 In the large board portion 45 of the power supply wiring board 4, the tip land c of the electronic circuit 4b (anodic circuit 40) on one side and the tip land c of the electronic circuit 4b on the other side are connected by a through hole H, and the large board portion 45 The base end land d of the electronic circuit 4b (anode circuit 40) on one side and the base end land d of the electronic circuit 4b on the other side are connected by a through hole H, and the electronic circuit 4b on the other side of the substrate portion 45 is largely an anode. It becomes a circuit 40, and a limiting resistor 48 as a power supply electronic component 48 is formed between the tip land c and the base end land d of the electronic circuit 4b (anode circuit 40) on one surface of the board portion 45. As an electronic component 48 for power supply, it is electrically and mechanically fixed via the above, and is also between the tip land c and the base end land d of the electronic circuit 4b (anode circuit 40) on the other surface of the substrate portion 45. The limiting resistor 48 having the same resistance value as that of the above is mounted by being electrically and mechanically fixed via the soldering portions P and P.

図11ないし図13に示すように、電源用配線基板4の小幅基板部42の他面の電子回路4a(カソード回路41)の基端ランドbに対し、大幅基板部45の他面の電源用電子部品48としての制限抵抗48を迂回するよう基板上を這わせられたカソード回路41がわの電源用ハーネス35が、ハンダ付け部Pを介して電気的および機械的に接続され、また、該電源用配線基板4の大幅基板部45の一面の電子回路4b(アノード回路40)の基端ランドdには、アノード回路40がわの電源用ハーネス35がハンダ付け部Pを介して電気的および機械的に接続されたものとなっている。 As shown in FIGS. 11 to 13, for the power supply on the other surface of the board portion 45 with respect to the base end land b of the electronic circuit 4a (cathode circuit 41) on the other surface of the narrow substrate portion 42 of the power supply wiring board 4. The power supply harness 35 of the cathode circuit 41, which is laid on the substrate so as to bypass the limiting resistor 48 as the electronic component 48, is electrically and mechanically connected via the soldering portion P, and the said At the base end land d of the electronic circuit 4b (anode circuit 40) on one side of the large board portion 45 of the power supply wiring board 4, the power supply harness 35 of the anode circuit 40 is electrically and electrically connected via the soldering portion P. It is mechanically connected.

図14に示すように、LED小型SMDチップ3の外周囲に対して、LED素子34が実装された表面がわを覆うよう、該LED小型SMDチップ3の外周囲を包囲する筒状基端50と、該筒状基端50の先端を密閉状に覆い、該LED小型SMDチップ3のLED素子34に対峙する集光レンズ部51とが、一体化された透光バルブ5が、同筒状基端50を介して一体化されよう配され、該LED小型SMDチップ3のLED素子34の照射方向の軸心Z(C)方向、および、該LED素子34の照射方向の軸心Z(C)に対して90°の角度をもつ仮想平面上の、該電源用配線基板4(小幅基板部42)の一面および他面に平行なX方向と、該電源用配線基板4(小幅基板部42)の一面および他面に直角なY方向との夫々に焦点距離(白抜き矢印で示す)を含む位置の調節がなされた上、該LED小型SMDチップ3の外周囲壁と、透光バルブ5の筒状基端50の内周壁とが、シーリング機能を有する仮止め用接着か、および、強固に固着する接着剤かの何れか一方の接着剤A1によって接着材結合されたものとなっている。 As shown in FIG. 14, the tubular base end 50 surrounding the outer circumference of the LED small SMD chip 3 so that the surface on which the LED element 34 is mounted covers the outer circumference of the LED small SMD chip 3. And the light-transmitting valve 5 in which the tip of the tubular base end 50 is hermetically covered and the condensing lens portion 51 facing the LED element 34 of the LED small SMD chip 3 is integrated. Arranged so as to be integrated via the base end 50, the axis Z (C) direction of the irradiation direction of the LED element 34 of the LED small SMD chip 3 and the axis Z (C) of the irradiation direction of the LED element 34. In the X direction parallel to one surface and the other surface of the power supply wiring board 4 (narrow board portion 42) on a virtual plane having an angle of 90 ° with respect to the power supply wiring board 4 (narrow board portion 42). ), The positions including the focal distance (indicated by white arrows) are adjusted for each of the Y direction perpendicular to the other surface, and the outer peripheral wall of the LED small SMD chip 3 and the translucent valve 5 The inner peripheral wall of the tubular base end 50 of the above is bonded by an adhesive A1 which is either a temporary fixing adhesive having a sealing function or an adhesive which firmly adheres. ..

図15ないし図17に示すように、電源用配線基板4(小幅基板部42および大幅基板部45)に結合され、大幅基板部45の基端から延伸された電源用ハーネス35,35の基端がわには、適宜長さに設定され、その外径がヒートシンク筐体2の口金部20に開口する縦貫路22の内径よりも小さく設定された補強チューブ36が、その先端がわが縦貫路22内に装着され、その後端がわが縦貫路22外に露出するよう外装されたものとすることが可能であり、LED小型SMDチップ3および電源用配線基板4(小幅基板部42および大幅基板部45)を有するLEDユニットUは、ヒートシンク筐体2の縦貫路22内に、電源用ハーネス35,35および補強チューブ36の後端がわが、口金部20の後端から露出し、透光バルブ5の集光レンズ部51がわが、光源装着筒壁21の先端から露出するよう組み合わせられ、該ヒートシンク筐体2の円筒形の軸心C(Z)方向の進退調節(白抜き矢印で示す)、および、該軸心C(Z)方向に直交する仮想平面上であって、しかも互いに直行するX,Y方向の、外郭寸法の調節を含む位置調節がされた上、ヒートシンク筐体2の光源装着筒壁21(縦貫路22)の内周壁と、透光バルブ5の筒状基端50の外周壁面との間、および、該光源装着筒壁21(縦貫路22)の内周壁と、LED小型SMDチップ3の外周囲壁との間の少なくとも何れか一方に注入された熱硬化性接着剤A2によって密閉状且つ強固に一体化されたものとなっている。 As shown in FIGS. 15 to 17, the base ends of the power supply harnesses 35 and 35 that are coupled to the power supply wiring board 4 (narrow board portion 42 and large board portion 45) and extended from the base end of the large board portion 45. A reinforcing tube 36 whose outer diameter is set to an appropriate length and whose outer diameter is smaller than the inner diameter of the longitudinal passage 22 which opens to the base 20 of the heat sink housing 2 is provided at the tip of the longitudinal passage 22. It is possible that the rear end is mounted inside and the rear end is exposed to the outside of my longitudinal path 22, and the LED small SMD chip 3 and the power supply wiring board 4 (narrow board portion 42 and large board portion 45) can be used. The rear end of the power harnesses 35, 35 and the reinforcing tube 36 is exposed from the rear end of the base portion 20 in the longitudinal passage 22 of the heat sink housing 2, and the light transmitting valve 5 of the LED unit U has The condensing lens portion 51 is combined so as to be exposed from the tip of the cylinder wall 21 for mounting the light source, and the heat sink housing 2 is adjusted in the cylindrical axis C (Z) direction (indicated by a white arrow), and The position is adjusted including the adjustment of the outer dimensions in the X and Y directions orthogonal to each other on the virtual plane orthogonal to the axis C (Z) direction, and the light source mounting cylinder of the heat sink housing 2 is adjusted. Between the inner peripheral wall of the wall 21 (longitudinal passage 22) and the outer peripheral wall surface of the tubular base end 50 of the translucent valve 5, the inner peripheral wall of the light source mounting tubular wall 21 (longitudinal passage 22), and a small LED SMD. It is hermetically and firmly integrated by the heat-curable adhesive A2 injected into at least one of the outer peripheral walls of the chip 3.

さらに、図17に示すように、ヒートシンク筐体2の縦貫路22の内壁面と、LED小型SMDチップ3のLED素子33の発光面とは反対がわとなる裏面と、電源用配線基板4の外周囲壁面と、該ヒートシンク筐体2の縦貫路22の内がわに配置された電源用ハーネス35の一部の外周壁と、その電源用ハーネス35に外装された補強チューブ36の外周壁との間の空間に、接着剤を兼ねた高熱伝導率のウレタン系およびシリコーン系の何れか一方の放熱樹脂A3が充填されてなるものとしてある。 Further, as shown in FIG. 17, the inner wall surface of the longitudinal passage 22 of the heat sink housing 2, the back surface opposite to the light emitting surface of the LED element 33 of the small LED SMD chip 3, and the power supply wiring board 4. The outer peripheral wall surface, a part of the outer peripheral wall of the power supply harness 35 arranged in the inner side of the longitudinal passage 22 of the heat sink housing 2, and the outer peripheral wall of the reinforcing tube 36 outer to the power supply harness 35. The space between them is filled with the heat-dissipating resin A3 of either urethane-based or silicone-based having high thermal conductivity that also serves as an adhesive.

(実施例2の作用・効果)
この発明の小型LEDランプ1は、図8、図14および図17に示すように、ヒートシンク筐体2の円筒形の軸心C(Z)上に電源用配線基板4(大幅基板部45)が収納され、大幅基板部45のスルーホールH,Hで繋がれた両面の電子回路4b,4bの各先端ランドcおよび基端ランドd間の夫々に、同一抵抗値且つ表裏一対の制限抵抗48,48が搭載されたものとされているから、小径のヒートシンク筐体2の縦貫路22内の電源用配線基板4(大幅基板部45)の両面への部品搭載空間を大きく確保することができる上、LED小型SMDチップ3と電源用配線基板4とがT字形に組み合わせられたLEDユニットUの組み立て工程、LEDユニットUへの透光バルブ5の組み込み工程、および、LEDユニットUのヒートシンク筐体2への組み立て工程の各工程において、ヒートシンク筐体2の円筒形の軸心C(Z)方向の進退調節(白抜き矢印で示す方向)、および、該軸心C(Z)方向に直交する平面上の該軸心C(Z)に直行するX,Y方向の位置調節がより高精度且つ容易に行えるものとなる。
(Action / Effect of Example 2)
In the small LED lamp 1 of the present invention, as shown in FIGS. 8, 14 and 17, a power supply wiring board 4 (significantly board portion 45) is placed on a cylindrical axis C (Z) of the heat sink housing 2. The same resistance value and a pair of front and back limiting resistors 48, respectively, between the tip land c and the base end land d of the electronic circuits 4b and 4b on both sides, which are housed and connected by the through holes H and H of the substrate portion 45. Since it is assumed that 48 is mounted, it is possible to secure a large space for mounting components on both sides of the power supply wiring board 4 (significant board portion 45) in the longitudinal passage 22 of the small-diameter heat sink housing 2. , The process of assembling the LED unit U in which the LED small SMD chip 3 and the power supply wiring board 4 are combined in a T shape, the process of incorporating the translucent valve 5 into the LED unit U, and the heat sink housing 2 of the LED unit U. In each step of the assembly process of the heat sink housing 2, the advance / retreat adjustment of the cylindrical center C (Z) direction (direction indicated by the white arrow) and the plane orthogonal to the axis C (Z) direction. The position adjustment in the X and Y directions orthogonal to the axial center C (Z) above can be performed more accurately and easily.

図18ないし図23に示す事例は、この発明の小型LEDランプ1の実際の各部寸法を示すものであって、ヒートシンク筐体2、LEDユニットU、および透光バルブ5のより具体的な構造は、前記実施例1または実施例2の何れか一方に示したものと基本的に同一のものとされており、図18の小型LEDランプ1は、全長Lが20mm、ヒートシンク筐体2の長さL0が17mm、透光バルブ5突出長L1が3mm、ヒートシンク筐体2の直径D0がΦ6.0mm、透光バルブ5の直径D1がΦ4.9mm、口金部20の寸法NがM4,P0.7であり、図19の小型LEDランプ1は、全長Lが27mm、ヒートシンク筐体2の長さL0が24mm、透光バルブ5突出長L1が3mm、ヒートシンク筐体2の直径D0がΦ6.22mm、透光バルブ5の直径D1がΦ4.9mm、口金部20の寸法NがM5,P0.8である。 The examples shown in FIGS. 18 to 23 show the actual dimensions of each part of the small LED lamp 1 of the present invention, and more specific structures of the heat sink housing 2, the LED unit U, and the translucent valve 5 are shown. The small LED lamp 1 of FIG. 18 has a total length L of 20 mm and a heat sink housing 2 length, which is basically the same as that shown in either the first or second embodiment. L0 is 17 mm, the light-transmitting valve 5 protrusion length L1 is 3 mm, the diameter D0 of the heat sink housing 2 is Φ6.0 mm, the diameter D1 of the light-transmitting valve 5 is Φ4.9 mm, and the dimension N of the base 20 is M4, P0.7. The small LED lamp 1 shown in FIG. 19 has a total length L of 27 mm, a heat sink housing 2 length L0 of 24 mm, a translucent valve 5 protruding length L1 of 3 mm, and a heat sink housing 2 diameter D0 of Φ6.22 mm. The diameter D1 of the light transmissive valve 5 is Φ4.9 mm, and the dimensions N of the base portion 20 are M5 and P0.8.

図20の小型LEDランプ1は、全長Lが25mm、ヒートシンク筐体2の長さL0が20mm、透光バルブ5突出長L1が5mm、ヒートシンク筐体2の直径D0がΦ7.3mm、透光バルブ5の直径D1がΦ6.2mm、口金部20の寸法NがM5,P0.8であり、図21の小型LEDランプ1は、全長Lが34mm、ヒートシンク筐体2の長さL0が28mm、透光バルブ5突出長L1が6mm、ヒートシンク筐体2の直径D0がΦ8.2mm、透光バルブ5の直径D1がΦ7mm、口金部20の寸法NがM6,P1.0である。 The small LED lamp 1 shown in FIG. 20 has a total length L of 25 mm, a heat sink housing 2 length L0 of 20 mm, a translucent valve 5 protruding length L1 of 5 mm, a heat sink housing 2 diameter D0 of Φ7.3 mm, and a translucent valve. The diameter D1 of 5 is Φ6.2 mm, the dimensions N of the base portion 20 are M5 and P0.8, and the small LED lamp 1 in FIG. 21 has a total length L of 34 mm, a heat sink housing 2 length L0 of 28 mm, and transparency. The protrusion length L1 of the optical valve 5 is 6 mm, the diameter D0 of the heat sink housing 2 is Φ8.2 mm, the diameter D1 of the translucent valve 5 is Φ7 mm, and the dimensions N of the base portion 20 are M6 and P1.0.

図22の小型LEDランプ1は、全長Lが36mm、ヒートシンク筐体2の長さL0が26mm、透光バルブ5突出長L1が10mm、ヒートシンク筐体2の直径D0がΦ12mm、透光バルブ5の直径D1がΦ10mm、口金部20の寸法NがM6,P1.0であり、図23の小型LEDランプ1は、全長Lが40mm、ヒートシンク筐体2の長さL0が26mm、透光バルブ5突出長L1が14mm、ヒートシンク筐体2の直径D0がΦ14mm、透光バルブ5の直径D1がΦ12mm、口金部20の寸法NがM8,P1.25である。 The small LED lamp 1 of FIG. 22 has a total length L of 36 mm, a heat sink housing 2 length L0 of 26 mm, a light-transmitting valve 5 protruding length L1 of 10 mm, a heat sink housing 2 diameter D0 of Φ12 mm, and a light-transmitting valve 5. The diameter D1 is Φ10 mm, the dimensions N of the base portion 20 are M6 and P1.0, and the small LED lamp 1 in FIG. 23 has a total length L of 40 mm, a heat sink housing 2 length L0 of 26 mm, and a light transmitting valve 5 protruding. The length L1 is 14 mm, the diameter D0 of the heat sink housing 2 is Φ14 mm, the diameter D1 of the translucent valve 5 is Φ12 mm, and the dimensions N of the base portion 20 are M8 and P1.25.

(実施例3の作用・効果)
この発明の小型LEDランプ1は、図18ないし図23に示すように、何れも、基端がわに単一の口金部20を有するヒートシンク筐体2の外郭形状および外郭寸法、ヒートシンク筐体2の先端に露出する透光バルブ5の外郭形状および外郭寸法が、既存の小型フィラメントランプの外郭形状および寸法に準ずるものとなるよう設定されているから、従来型の小型フィラメントランプの使用を前提として生産された検査機器、試験機器、実験機器などの様々な機器類の小型LEDランプへの交換需要に対応可能なものとなる。
(Action / Effect of Example 3)
As shown in FIGS. 18 to 23, the small LED lamp 1 of the present invention has the outer shape and outer dimensions of the heat sink housing 2 having a single base portion 20 at the base end, and the heat sink housing 2. Since the outer shape and outer dimensions of the light-transmitting valve 5 exposed at the tip of the light-transmitting bulb 5 are set to conform to the outer shape and dimensions of the existing small filament lamp, it is assumed that a conventional small filament lamp is used. It will be possible to meet the replacement demand for small LED lamps of various equipment such as manufactured inspection equipment, test equipment, and experimental equipment.

(結 び)
叙述の如く、この発明の小型LEDランプは、その新規な構成によって所期の目的を遍く達成可能とするものであり、しかも製造も容易で、従前からの小型フィラメントランプ技術に比較して大幅に消費電力量を削減し、軽量化して耐久寿命を延命化し、遥かに経済的なものとすることができる上、生産性を高め、良品率を格段に高め、低廉化することができるから、これまで広く普及することが無かった小型LEDランプの市場を活性化できるものとなり、小型フィラメントランプが組み込まれた各種機器類を使用する企業や団体、および、LEDランプの製造、販売業界などはもとより、小型LEDランプが組み込まれた各種機器類を開発、製造、提供する各種機器類の製造業界においても高く評価され、広範に渡って利用、普及していくものになると予想される。
(Conclusion)
As described above, the small LED lamp of the present invention makes it possible to achieve the intended purpose all over by its new configuration, and it is easy to manufacture, and it is significantly compared with the conventional small filament lamp technology. This is because it can reduce power consumption, reduce weight, extend the life of the durable life, make it much more economical, increase productivity, significantly increase the non-defective rate, and reduce the cost. It has become possible to revitalize the market for small LED lamps that have not been widely used until now, and not only companies and organizations that use various devices incorporating small filament lamps, but also the LED lamp manufacturing and sales industries. It is expected that it will be highly evaluated in the manufacturing industry of various devices that develop, manufacture, and provide various devices incorporating small LED lamps, and will be widely used and spread.

1 小型LEDランプ
2 ヒートシンク筐体
20 同 口金部(機械的接続端)
21 同 光源装着筒壁
22 同 縦貫路
C ヒートシンク筐体の軸心
U LEDユニット
3 LED小型SMDチップ
30 同 実装基板
31 同 実装位置
32 同 アノード端子
33 同 カソード端子
34 同 LED素子
35 同 電源用ハーネス
36 同 補強チューブ
37 同 蛍光体層
Z LED素子の照射方向の軸心
4 電源用配線基板
40 同 アノード回路
41 同 カソード回路
42 同 小幅基板部
4a 同 電子回路
a 同 先端ランド
b 同 基端ランド
43 同 先端接合縁
44 同 直線状V字形溝(線状脆弱部)
45 同 大幅基板部
4b 同 電子回路
c 同 先端ランド
d 同 基端ランド
H 同 スルーホール
47 同 接続導線
48 同 制限抵抗(電源用電子部品)
X 電源用配線基板の一面および他面に平行な方向
Y 電源用配線基板の一面および他面に直角な方向
5 透光バルブ
50 同 筒状基端
51 同 集光レンズ部
P ハンダ付け部
A1 接着剤
A2 熱硬化性接着剤
A3 放熱樹脂
L 小型LEDランプの全長
L0 ヒートシンク筐体の長さ
L1 透光バルブの突出長
D0 ヒートシンク筐体の直径
D1 透光バルブの直径
N 口金部の寸法
1 Small LED lamp 2 Heat sink housing
20 Same mouthpiece (mechanical connection end)
21 Cylinder wall with the same light source
22 Same longitudinal path C Axial center of heat sink housing U LED unit 3 LED small SMD chip
30 Same mounting board
31 Same mounting position
32 Same anode terminal
33 Same cathode terminal
34 Same LED element
35 Harness for the same power supply
36 Reinforcing tube
37 Fluorescent layer Z The axis of the LED element in the irradiation direction 4 Power supply wiring board
40 Same anode circuit
41 Same cathode circuit
42 Same width board part
4a Same electronic circuit
a Same tip land
b Same base land
43 Same tip joint edge
44 Same straight V-shaped groove (linear fragile part)
45 Same as the large board part
4b Same electronic circuit
c Same tip land
d Same base land
H same through hole
47 Same connection wire
48 Same limiting resistor (electronic component for power supply)
X Direction parallel to one side and other side of the power supply wiring board Y Direction perpendicular to one side and other side of the power supply wiring board 5 Translucent bulb
50 Same tubular base end
51 Same condensing lens part P Soldering part A1 Adhesive A2 Thermo-curable adhesive A3 Heat dissipation resin L Total length of small LED lamp L0 Length of heat sink housing L1 Protruding length of light-transmitting valve D0 Diameter of heat sink housing D1 Transparent Optical valve diameter N Dimensions of the base

Claims (15)

柱状の高熱伝導率素材からなり、基端がわに単一の機械的接続端を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、先端がわに光源装着筒壁が設けられ、内部に先端から基端に至る縦貫路が開口されたヒートシンク筐体を有し、該ヒートシンク筐体の先端の光源装着筒壁の中央にあって、該ヒートシンク筐体の縦貫路内の軸心上に配され、一面およびそれとは反対がわとなる他面の夫々に電子回路が設けられた電源用配線基板と、該電源用配線基板の先端に対し、側面視T字形となるよう結合され、LED素子が外向とされ、アノード端子が該電源用配線基板の一面の電子回路に接続され、カソード端子が該電源用配線基板の他面の電子回路に接続されたLED小型SMDチップと、該電源用配線基板から延伸されたアノードがわおよびカソードがわの一対の電源用ハーネスとを有するLEDユニットが、該ヒートシンク筐体に対して高熱伝導状態に搭載されると共に、これら一対の電源用ハーネスが、該ヒートシンク筐体の縦貫路を通じて機械的接続端から外がわへ露出するよう延出され、該LED小型SMDチップの外周囲に相当する該ヒートシンク筐体の先端の光源装着筒壁、および、該LED小型SMDチップそれ自体の外周囲の中の少なくとも何れか一方に、透光バルブが一体化されてなるものとしたことを特徴とする小型LEDランプ。 Within the spatial shape and dimensions of the mounting space for small filament lamps to be replaced, which are made of columnar high thermal conductivity material, have a single mechanical connection end at the base end, and have a maximum outer diameter of 20 mm or less. It has a heat sink housing that is set to fit in the outer shell shape and outer dimensions, has a light source mounting cylinder wall at the tip, and has a vertical passage from the tip to the base end inside, and the tip of the heat sink housing. A power supply wiring board located in the center of the wall for mounting the light source , arranged on the axis in the longitudinal path of the heat sink housing, and provided with electronic circuits on one side and the other side opposite to it. And, it is coupled to the tip of the power supply wiring board so as to form a T-shape in a side view, the LED element is directed outward, the anode terminal is connected to the electronic circuit on one side of the power supply wiring board, and the cathode terminal is said. An LED unit having an LED small SMD chip connected to an electronic circuit on the other surface of the power supply wiring board and a pair of power supply harnesses having an anode and a cathode extending from the power supply wiring board is said to be the same. While being mounted in a high thermal conductivity state with respect to the heat sink housing, these pair of power supply harnesses are extended from the mechanical connection end to the outside through the longitudinal path of the heat sink housing, and the LED is small. A translucent valve is integrated with at least one of the light source mounting cylinder wall at the tip of the heat sink housing corresponding to the outer circumference of the SMD chip and the outer circumference of the LED small SMD chip itself. A small LED lamp characterized by being made. 柱状の高熱伝導率素材からなり、基端がわに単一の機械的接続端を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、先端がわに光源装着筒壁が設けられ、内部に先端から基端に至る縦貫路が開口されたヒートシンク筐体を有し、該ヒートシンク筐体の先端の光源装着筒壁の中央にあって、該ヒートシンク筐体の縦貫路内の軸心上に配され、一面およびそれとは反対がわとなる他面の夫々に電子回路が設けられた電源用配線基板と、該電源用配線基板の先端に対し、側面視T字形となるよう結合され、LED素子が外向とされ、アノード端子が該電源用配線基板の一面の電子回路に接続され、カソード端子が該電源用配線基板の他面の電子回路に接続されたLED小型SMDチップと、該電源用配線基板から延伸されたアノードがわおよびカソードがわの一対の電源用ハーネスとを有するLEDユニットが、該ヒートシンク筐体に対して高熱伝導状態に搭載されると共に、これら一対の電源用ハーネスが、該ヒートシンク筐体の縦貫路を通じて機械的接続端から外がわへ露出するよう延出され、該LED小型SMDチップの外周囲に相当する該ヒートシンク筐体の先端の光源装着筒壁、および、該LED小型SMDチップそれ自体の外周囲の中の少なくとも何れか一方に、透光バルブが一体化され、既存の小型フィラメントランプと置き換え可能とされてなるものとしたことを特徴とする小型LEDランプ。 Within the spatial shape and dimensions of the mounting space for small filament lamps to be replaced, which are made of columnar high thermal conductivity material, have a single mechanical connection end at the base end, and have a maximum outer diameter of 20 mm or less. It has a heat sink housing that is set to fit in the outer shell shape and outer dimensions, has a light source mounting cylinder wall at the tip, and has a vertical passage from the tip to the base end inside, and the tip of the heat sink housing. A power supply wiring board located in the center of the wall for mounting the light source , arranged on the axis in the longitudinal path of the heat sink housing, and provided with electronic circuits on one side and the other side opposite to it. And, it is coupled to the tip of the power supply wiring board so as to form a T-shape in a side view, the LED element is directed outward, the anode terminal is connected to the electronic circuit on one side of the power supply wiring board, and the cathode terminal is said. An LED unit having an LED small SMD chip connected to an electronic circuit on the other surface of the power supply wiring board and a pair of power supply harnesses having an anode and a cathode extending from the power supply wiring board is said to be the same. While being mounted in a high thermal conductivity state with respect to the heat sink housing, these pair of power supply harnesses are extended from the mechanical connection end to the outside through the longitudinal path of the heat sink housing, and the LED is small. A translucent valve is integrated into at least one of the light source mounting cylinder wall at the tip of the heat sink housing corresponding to the outer circumference of the SMD chip and the outer circumference of the LED small SMD chip itself. A small LED lamp characterized in that it can be replaced with the small filament lamp of. 柱状の高熱伝導率素材からなり、基端がわに単一の機械的接続端を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、先端がわに光源装着筒壁が設けられ、内部に先端から基端に至る縦貫路が開口されたヒートシンク筐体を有し、該ヒートシンク筐体の先端の光源装着筒壁の中央にあって、該ヒートシンク筐体の縦貫路内の軸心上に配され、一面およびそれとは反対がわとなる他面の夫々に電子回路が設けられた電源用配線基板と、該電源用配線基板の先端に対し、側面視T字形となるよう結合され、LED素子が外向とされ、アノード端子が該電源用配線基板の一面の電子回路に接続され、カソード端子が該電源用配線基板の他面の電子回路に接続されたLED小型SMDチップと、該電源用配線基板から延伸されたアノードがわおよびカソードがわの一対の電源用ハーネスとを有するLEDユニットが、該ヒートシンク筐体に対して高熱伝導状態に搭載されると共に、これら一対の電源用ハーネスが、該ヒートシンク筐体の縦貫路を通じて機械的接続端から外がわへ露出するよう延出され、該LED小型SMDチップの外周囲に相当する該ヒートシンク筐体の先端の光源装着筒壁、および、該LED小型SMDチップそれ自体の外周囲の中の少なくとも何れか一方に、先端に集光レンズ部を有する透光バルブが一体化されてなるものとしたことを特徴とする小型LEDランプ。 Within the spatial shape and dimensions of the mounting space for small filament lamps to be replaced, which are made of columnar high thermal conductivity material, have a single mechanical connection end at the base end, and have a maximum outer diameter of 20 mm or less. It has a heat sink housing that is set to fit in the outer shell shape and outer dimensions, has a light source mounting cylinder wall at the tip, and has a vertical passage from the tip to the base end inside, and the tip of the heat sink housing. A power supply wiring board located in the center of the wall for mounting the light source , arranged on the axis in the longitudinal path of the heat sink housing, and provided with electronic circuits on one side and the other side opposite to it. And, it is coupled to the tip of the power supply wiring board so as to form a T-shape in a side view, the LED element is directed outward, the anode terminal is connected to the electronic circuit on one side of the power supply wiring board, and the cathode terminal is said. An LED unit having an LED small SMD chip connected to an electronic circuit on the other surface of the power supply wiring board and a pair of power supply harnesses having an anode and a cathode extending from the power supply wiring board is said to be the same. While being mounted in a high thermal conductivity state with respect to the heat sink housing, these pair of power supply harnesses are extended from the mechanical connection end to the outside through the longitudinal path of the heat sink housing, and the LED is small. A transparent lens portion having a condensing lens portion at the tip of at least one of the light source mounting cylinder wall at the tip of the heat sink housing corresponding to the outer circumference of the SMD chip and the outer circumference of the LED small SMD chip itself. A small LED lamp characterized by an integrated optical valve. 円筒形の高熱伝導率素材からなり、該円筒形の軸心上の基端がわに単一の機械的接続端としての口金部を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、該円筒形の軸心上となる先端がわに光源装着筒壁が中心を一致するよう設けられ、該光源装着筒壁から口金部に至る該軸心に沿って縦貫路が開口されたヒートシンク筐体を有し、該ヒートシンク筐体の先端の光源装着筒壁の中央にあって、該ヒートシンク筐体の縦貫路内の軸心上に配され、一面およびそれとは反対がわとなる他面の夫々に電子回路が設けられた電源用配線基板と、該電源用配線基板の先端に対し、側面視T字形となるよう結合され、LED素子が外向とされ、アノード端子が該電源用配線基板の一面の電子回路に接続され、カソード端子が該電源用配線基板の他面の電子回路に接続されたLED小型SMDチップと、該電源用配線基板から延伸されたアノードがわおよびカソードがわの一対の電源用ハーネスとを有するLEDユニットが、該ヒートシンク筐体に対して高熱伝導状態に搭載されると共に、これら一対の電源用ハーネスが、該ヒートシンク筐体内の縦貫路を通じて前記機械的接続端としての口金部の中央から外がわへ露出するよう延出され、該LED小型SMDチップの外周囲に相当する該ヒートシンク筐体の先端の光源装着筒壁、および、該LED小型SMDチップそれ自体の外周囲の中の少なくとも何れか一方に、該LED小型SMDチップの外周囲を包囲する筒状基端と、該筒状基端の先端を密閉状に覆い、LED小型SMDチップに対峙する集光レンズ部とが、一体化された透光バルブが、同筒状基端を介して一体化されてなるものとしたことを特徴とする小型LEDランプ。 A small filament made of a cylindrical high thermal conductivity material, having a base end on the axis of the cylindrical shape as a single mechanical connection end, and having a maximum outer diameter of 20 mm or less to be replaced. The outer shape and outer dimensions of the space for mounting the lamp are set to fit within the space shape and dimensions, and the tip of the cylindrical shape on the axis is provided so that the light source mounting cylinder wall coincides with the center. The heat sink housing has a heat sink housing in which a longitudinal path is opened along the axis extending from the light source mounting cylinder wall to the base portion, and is located at the center of the light source mounting cylinder wall at the tip of the heat sink housing. A side view T with respect to the power supply wiring board, which is arranged on the axis in the longitudinal path and has electronic circuits on one side and the other side opposite to each other, and the tip of the power supply wiring board. An LED that is coupled to form a shape, the LED element is outward, the anode terminal is connected to the electronic circuit on one side of the power supply wiring board, and the cathode terminal is connected to the electronic circuit on the other side of the power supply wiring board. An LED unit having a small SMD chip and a pair of power supply harnesses having an anode and a cathode extended from the power supply wiring board is mounted on the heat sink housing in a high thermal conduction state. These pair of power supply harnesses extend from the center of the base portion as the mechanical connection end to the outside through a longitudinal path in the heat sink housing, and correspond to the outer circumference of the LED small SMD chip. At least one of the light source mounting cylinder wall at the tip of the heat sink housing and the outer circumference of the LED small SMD chip itself, and a tubular base end surrounding the outer circumference of the LED small SMD chip. A translucent valve in which the tip of the tubular base end is hermetically covered and a condensing lens unit facing the small LED SMD chip is integrated is integrated via the tubular base end. A small LED lamp characterized by the fact that 円筒形の高熱伝導率素材からなり、該円筒形の軸心上の基端がわに単一の機械的接続端としての口金部を有し、最大外径20mm以下の交換対象となる小型フィラメントランプの装着用空間の空間形状および空間寸法内に納まる外郭形状および外郭寸法に設定され、該円筒形の軸心上となる先端がわに光源装着筒壁が中心を一致するよう設けられ、該光源装着筒壁から口金部に至る該軸心に沿って縦貫路が開口されたヒートシンク筐体を有し、該ヒートシンク筐体の先端の光源装着筒壁の中央にあって、該ヒートシンク筐体の縦貫路内の軸心上に配され、一面およびそれとは反対がわとなる他面の夫々に電子回路が設けられた電源用配線基板と、該電源用配線基板の先端に対し、側面視T字形となるよう結合され、LED素子が外向とされ、アノード端子が該電源用配線基板の一面の電子回路に接続され、カソード端子が該電源用配線基板の他面の電子回路に接続されたLED小型SMDチップと、該電源用配線基板の基端から延伸されたアノードがわおよびカソードがわの一対の電源用ハーネスとを有するLEDユニットが、該ヒートシンク筐体に対して高熱伝導状態に搭載されると共に、これら一対の電源用ハーネスが、該ヒートシンク筐体内の縦貫路を通じて前記機械的接続端としての口金部の中央から外がわへ露出するよう延出され、該LED小型SMDチップの外周囲に相当する該ヒートシンク筐体の先端の光源装着筒壁、および、該LED小型SMDチップそれ自体の外周囲の中の少なくとも何れか一方に、該LED小型SMDチップの外周囲を包囲する筒状基端と、該筒状基端の先端を密閉状に覆い、LED小型SMDチップに対峙する集光レンズ部とが、一体化された透光バルブが、同筒状基端を介して一体化されてなるものとしたことを特徴とする小型LEDランプ。 A small filament made of a cylindrical high thermal conductivity material, having a base end on the axis of the cylindrical shape as a single mechanical connection end, and having a maximum outer diameter of 20 mm or less to be replaced. The outer shape and outer dimensions of the space for mounting the lamp are set to fit within the space shape and dimensions, and the tip of the cylindrical shape on the axis is provided so that the light sink mounting cylinder wall coincides with the center. The heat sink housing has a heat sink housing in which a longitudinal path is opened along the axis extending from the light source mounting cylinder wall to the base portion, and is located at the center of the light sink mounting cylinder wall at the tip of the heat sink housing. arranged on the axis of the running through passage, against the one surface and the other surface of the respective and power wiring board for an electronic circuit provided at the tip of the wiring board for the power supply on the side opposite to that, viewed from the side T An LED that is coupled to form a shape , the LED element is outward , the anode terminal is connected to the electronic circuit on one side of the power supply wiring board, and the cathode terminal is connected to the electronic circuit on the other side of the power supply wiring board. An LED unit having a small SMD chip and a pair of power supply harnesses having an anode and a cathode extending from the base end of the power supply wiring board is mounted on the heat sink housing in a high thermal conduction state. At the same time, these pair of power supply harnesses are extended from the center of the base portion as the mechanical connection end to the outside through a longitudinal path in the heat sink housing, and the outer periphery of the LED small SMD chip. A tubular base that surrounds the outer circumference of the LED small SMD chip on at least one of the light source mounting cylinder wall at the tip of the heat sink housing and the outer circumference of the LED small SMD chip itself. A translucent valve in which the end and the condensing lens portion facing the LED small SMD chip, which covers the tip of the tubular base end in a hermetically sealed manner, is integrated is integrated via the tubular base end. A small LED lamp characterized by being made of LEDユニットのLED小型SMDチップが、高熱伝導率素材からなる実装基板の表面の中央に実装位置が設定され、該実装基板の表面の実装位置を挟み、互いに電気的に絶縁された適宜開き角度と、適宜距離とを隔てて対峙するよう配されたアノード端子およびカソード端子が、該実装基板の周縁に至るか、または、該実装基板の表面とは反対の裏面に至るかの何れか一方まで延伸され、該実装基板の実装位置に配されたLED素子が、該実装基板のアノード端子、およびカソード端子に接続されて実装されたものであって、LEDユニットは、ヒートシンク筐体の縦貫路内に納まる外郭寸法とされた基板素材の先端に先端接合縁が設けられ、該基板素材の一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられた電源用配線基板を有し、該電源用配線基板の先端接合縁が、該LED小型SMDチップのLED素子が実装された表面とは反対の裏面の中央に対して、該LED小型SMDチップのアノード端子が、該電源用配線基板の一面の電子回路に対応し、該LED小型SMDチップのカソード端子が、該電源用配線基板の他面の電子回路に対応し、該LED小型SMDチップの実装基板および電源用配線基板が側面視T字形となるよう配されると共に、該LED小型SMDチップのアノード端子と該一面の電子回路とが電気的および機械的に接続されて、該電源用配線基板の一面の電子回路がアノード回路となり、該LED小型SMDチップのカソード端子と該他面の電子回路とが電気的および機械的に接続されて、該電源用配線基板の他面の電子回路がカソード回路とされた上、該電源用配線基板の一面のアノード回路、および、他面のカソード回路の夫々から電源用ハーネスが延伸されてなる、請求項5記載の小型LEDランプ。 The LED small SMD chip of the LED unit has a mounting position set in the center of the surface of a mounting board made of a high thermal conductivity material, sandwiches the mounting position on the surface of the mounting board, and has an appropriate opening angle that is electrically insulated from each other. , The anode terminal and the cathode terminal arranged so as to face each other at appropriate distances extend to either the peripheral edge of the mounting board or the back surface opposite to the front surface of the mounting board. The LED element arranged at the mounting position of the mounting board is mounted by being connected to the anode terminal and the cathode terminal of the mounting board, and the LED unit is mounted in the longitudinal path of the heat sink housing. Power supply wiring in which a tip bonding edge is provided at the tip of a substrate material having an outer size that fits, and an electronic circuit that can be either an anode circuit or a cathode circuit is provided on one side and the other side of the board material. The anode terminal of the LED small SMD chip has a substrate, and the tip bonding edge of the power supply wiring board has the anode terminal of the LED small SMD chip with respect to the center of the back surface opposite to the front surface on which the LED element of the LED small SMD chip is mounted. The cathode terminal of the LED small SMD chip corresponds to the electronic circuit on one side of the power supply wiring board, and corresponds to the electronic circuit on the other side of the power supply wiring board, and is used for the mounting board and power supply of the LED small SMD chip. The wiring board is arranged so as to have a T-shape when viewed from the side, and the anode terminal of the small LED SMD chip and the electronic circuit on one side are electrically and mechanically connected to form an electron on one side of the power supply wiring board. The circuit became an anode circuit, the cathode terminal of the small LED SMD chip and the electronic circuit on the other surface were electrically and mechanically connected, and the electronic circuit on the other surface of the power supply wiring board became the cathode circuit. The small LED lamp according to claim 5, wherein a power supply harness is extended from each of an anode circuit on one side of the power supply wiring board and a cathode circuit on the other side. LEDユニットの電源用配線基板が、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、予め、先端が小幅に設定された小幅基板部の基部と、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、該小幅基板部よりも幅広く設定された大幅基板部とが、分断容易な線状脆弱部を介して機械的に一体化され、大幅基板部が不要、または、小幅基板部が不要の何れか一方の場合には、線状脆弱部に沿って分離された小幅基板部および大幅基板部の何れか一方が選択的に、ヒートシンク筐体の縦貫路の内部に、ヒートシンク筐体の軸心上に配するよう収容搭載されてなるものとされた、請求項5または6何れか一方記載の小型LEDランプ。 The power supply wiring board of the LED unit is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side, respectively, and the base of the narrow board portion whose tip is set to a small width in advance and An electronic circuit that can be either an anode circuit or a cathode circuit is provided on one surface and the other surface, respectively, and a large substrate portion that is set wider than the narrow substrate portion is provided via a linear fragile portion that is easily separated. If either the large substrate part is not required or the narrow substrate portion is not required, either the narrow substrate portion or the large substrate portion separated along the linear fragile portion. The small LED lamp according to any one of claims 5 or 6, wherein one of them is selectively accommodated and mounted inside a longitudinal path of the heat insulating housing so as to be arranged on the axis of the heat insulating housing. .. LEDユニットの電源用配線基板が、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、予め、先端が小幅に設定された小幅基板部の基部と、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、該小幅基板部よりも幅広く設定された大幅基板部とが、分断容易な線状脆弱部を介して機械的に一体化され、LED小型SMDチップの実装基板および電源用配線基板が側面視T字形となるよう配されると共に、該LED小型SMDチップのアノード端子と該小幅基板部の一面の電子回路とが電気的および機械的に接続されて、該小幅基板部の一面の電子回路がアノード回路となり、該LED小型SMDチップのカソード端子と該小幅基板部の他面の電子回路とが電気的および機械的に接続されて、該小幅基板部の他面の電子回路がカソード回路とされ、該線状脆弱部に沿って該小幅基板部と該大幅基板部とが分離されることなく、しかも小幅基板部の一面のアノード回路と、大幅基板部の一面の電子回路とが該線状脆弱部を超えて電気的に接続されて該大幅基板部の電子回路がアノード回路とされ、該大幅基板部の少なくとも一面のアノード回路の途中に電源用電子部品が実装され、該大幅基板部のアノード回路の電源用電子部品よりも電源がわにアノードがわの電源用ハーネスが電気的および機械的に接続されると共に、該小幅基板部の他面のカソード回路の電源がわにカソードがわの電源用ハーネスが電気的および機械的に接続された上、該電源用配線基板が、ヒートシンク筐体の縦貫路の内部に、ヒートシンク筐体の軸心上に配するよう収容搭載されてなるものとされた、請求項5または6何れか一方記載の小型LEDランプ。 The power supply wiring board of the LED unit is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side, respectively, and the base of the narrow board portion whose tip is set to a small width in advance and An electronic circuit that can be either an anode circuit or a cathode circuit is provided on one surface and the other surface, respectively, and a large substrate portion that is set wider than the narrow substrate portion is provided via a linear fragile portion that is easily separated. The small LED SMD chip mounting board and power supply wiring board are arranged so as to have a T-shape in a side view, and the anode terminal of the small LED SMD chip and the electrons on one surface of the narrow board portion. The circuit is electrically and mechanically connected, the electronic circuit on one surface of the narrow substrate portion becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the electronic circuit on the other surface of the narrow substrate portion are electrically connected. And mechanically connected, the electronic circuit on the other surface of the narrow substrate portion is used as a cathode circuit, and the narrow substrate portion and the large substrate portion are not separated along the linear fragile portion, and moreover. The anode circuit on one surface of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion are electrically connected beyond the linear fragile portion, and the electronic circuit of the large substrate portion is used as an anode circuit. An electronic component for power supply is mounted in the middle of the anode circuit on at least one surface of the circuit board, and the power supply harness for the power supply is electrically and mechanically higher than the electronic component for power supply in the anode circuit of the large board portion. At the same time, the power supply of the cathode circuit on the other surface of the narrow board portion is electrically and mechanically connected to the power supply harness of the cathode, and the power supply wiring board is connected to the heat sink housing. The small LED lamp according to claim 5 or 6, wherein the small LED lamp is accommodated and mounted inside a longitudinal path so as to be arranged on the axis of a heat sink housing. LEDユニットの電源用配線基板が、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、予め、先端が小幅に設定された小幅基板部の基部と、一面および他面の夫々にアノード回路またはカソード回路の何れか一方と成り得る電子回路が設けられ、該小幅基板部よりも幅広く設定された大幅基板部とが、分断容易な線状脆弱部を介して機械的に一体化され、該LED小型SMDチップの実装基板および電源用配線基板が側面視T字形となるよう配されると共に、該LED小型SMDチップのアノード端子と該小幅基板部の一面の電子回路とが電気的および機械的に接続されて、該小幅基板部の一面の電子回路がアノード回路となり、該LED小型SMDチップのカソード端子と該小幅基板部の他面の電子回路とが電気的および機械的に接続されて、該小幅基板部の他面の電子回路がカソード回路とされ、該線状脆弱部に沿って該小幅基板部と該大幅基板部とが分離されることなく、しかも該小幅基板部の一面のアノード回路と、該大幅基板部の一面の電子回路とが該線状脆弱部を超えて電気的に接続されて該大幅基板部の電子回路がアノード回路とされ、該線状脆弱部に沿って分離されることなく、しかも小幅基板部の一面のアノード回路と、大幅基板部の一面の電子回路とが該線状脆弱部を超えて電気的に接続され、該大幅基板部の一面のアノード回路の中途適所、および、該大幅基板部の他面の電子回路の中途適所の中の少なくとも一面のアノード回路の中途適所に電源用電子部品としての制限抵抗が実装されるか、または、該大幅基板部の一面の先端ランドと基端ランドとからなるアノード回路の該先端ランド、および、該大幅基板部の他面の先端ランドと基端ランドとからなる電子回路の該先端ランドがスルーホールで接続され、該大幅基板部の一面のアノード回路の基端ランド、および、該大幅基板部の他面の電子回路の基端ランドがスルーホールで接続され、該大幅基板部の他面の電子回路がアノード回路とされ、該大幅基板部の一面のアノード回路の先端ランドと基端ランドと間に電源用電子部品としての制限抵抗が搭載され、さらに、該大幅基板部の他面のアノード回路の先端ランドと基端ランドと間に電源用電子部品としての制限抵抗が搭載されるかの何れか一方とされ、該大幅基板部の一面および他面のアノード回路の何れかの基端ランドにアノードがわの電源用ハーネスが電気的および機械的に接続されると共に、該小幅基板部の他面のカソード回路の電源がわにカソードがわの電源用ハーネスが電気的および機械的に接続された上、該電源用配線基板が、ヒートシンク筐体の縦貫路の内部に、ヒートシンク筐体の軸心上に配するよう収容搭載されてなるものとされた、請求項5、6および8の何れか一記載の小型LEDランプ。 The power supply wiring board of the LED unit is provided with an electronic circuit that can be either an anode circuit or a cathode circuit on one side and the other side, respectively, and the base of the narrow board portion whose tip is set to a small width in advance and An electronic circuit that can be either an anode circuit or a cathode circuit is provided on one side and the other side, respectively, and a large board portion that is set wider than the narrow board portion is provided via a linear fragile portion that is easily separated. The LED small SMD chip mounting board and the power supply wiring board are arranged so as to have a T-shape in a side view, and the anode terminal of the LED small SMD chip and one surface of the narrow board portion. The electronic circuit is electrically and mechanically connected, the electronic circuit on one surface of the narrow substrate portion becomes an anode circuit, and the cathode terminal of the LED small SMD chip and the electronic circuit on the other surface of the narrow substrate portion are electrically connected. Targeted and mechanically connected, the electronic circuit on the other surface of the narrow substrate portion is used as a cathode circuit, and the narrow substrate portion and the large substrate portion are not separated along the linear fragile portion. Moreover, the anode circuit on one surface of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion are electrically connected beyond the linear fragile portion, and the electronic circuit on the large substrate portion is used as an anode circuit. The anode circuit on one side of the narrow substrate portion and the electronic circuit on one surface of the large substrate portion are electrically connected beyond the linear fragile portion without being separated along the linear fragile portion. Limiting resistance as an electronic component for power supply is mounted in the middle of the anode circuit on one side of the large board part and in the middle part of the anode circuit on at least one side of the electronic circuit on the other side of the large board part. Or, the tip land of the anode circuit consisting of the tip land and the proximal land on one surface of the large substrate portion, and the electronic circuit consisting of the distal land and the proximal land on the other surface of the significant substrate portion. The tip land is connected by a through hole, and the base end land of the anode circuit on one surface of the large board portion and the base end land of the electronic circuit on the other surface of the large board portion are connected by a through hole, and the large substrate is connected. The electronic circuit on the other side of the part is an anode circuit, and a limiting resistor as an electronic component for power supply is mounted between the tip land and the base end land of the anode circuit on one side of the large board part. any limiting resistor as a power supply for electronic components between the tip land and proximal land other surface of the anode circuit is the one of the mounting Luke, the one surface and the other surface of the anode circuit of the large width substrate portion Anoh on the base land The power supply harness of the LED is electrically and mechanically connected, and the power supply of the cathode circuit on the other surface of the narrow substrate portion is electrically and mechanically connected to the power supply harness of the cathode. In addition, any of claims 5, 6 and 8, wherein the power supply wiring board is accommodated and mounted inside the longitudinal path of the heat sink housing so as to be arranged on the axis of the heat sink housing. The small LED lamp described in Kaichi. レンズバルプの集光レンズ部が、非球面の凸面レンズとされてなる、請求項3ないし9何れか一記載の小型LEDランプ。 The small LED lamp according to any one of claims 3 to 9, wherein the condensing lens portion of the lens valve is an aspherical convex lens. 透光バルブの筒状基端が、LED小型SMDチップの周囲に対して、該透光バルブの集光レンズ部の光軸と、LED小型SMDチップのLED素子の光軸とが、互いに同一軸心上に配すると共に、該LED小型SMDチップのLED素子の発光面ら、透光バルブの集光レンズ部までの同一軸心上の距離が、集光レンズ部の焦点距離に一致するよう三次元的位置関係を調整された配置関係とするよう接着剤固定された上、該透光バルブの筒状基端の外周壁が、ヒートシンク筐体の光源装着筒壁の内壁に対して、該透光バルブの集光レンズ部およびLED小型SMDチップと、ヒートシンク筐体の機械的接続端との位置関係を調整された配置関係となるよう接着剤固定されてなるものとされた、請求項3ないし10何れか一記載の小型LEDランプ。 The tubular base end of the light-transmitting valve has the same axis as the optical axis of the condensing lens portion of the light-transmitting valve and the optical axis of the LED element of the small LED SMD chip with respect to the periphery of the small LED SMD chip. together disposed on the heart, so that the light emitting surface or these LED elements of the LED small SMD chips, the distance on the same axis to the condenser lens of the transparent bulb, matches the focal length of the condenser lens portion In addition to being fixed with adhesive so that the three-dimensional positional relationship is adjusted, the outer peripheral wall of the tubular base end of the translucent valve is the inner wall of the light source mounting tubular wall of the heat sink housing. 3. Claim 3 of the light transmitting valve, which is fixed with an adhesive so that the positional relationship between the condensing lens portion and the small LED SMD chip and the mechanical connection end of the heat sink housing is adjusted. A small LED lamp according to any one of 10. ヒートシンク筐体の縦貫路の内壁面と、LED小型SMDチップ3のLED素子の発光面とは反対がわとなる裏面と、電源用配線基板を有するものの場合には電源用配線基板と、該ヒートシンク筐体の縦貫路の内がわに配置された電源用ハーネスの一部との間の空間に、接着剤を兼ねた高熱伝導率の放熱樹脂が充填されてなる請求項1ないし11何れか一記載の小型LEDランプ。 An inner wall surface of the longitudinal path of the heat sink housing, a back surface opposite to the light emitting surface of the LED element of the small LED SMD chip 3, a power supply wiring board in the case of having a power supply wiring board, and the heat sink. the space between a portion of running through passage of the housing of the alligator arranged power harness, heat dissipation resin having high thermal conductivity, which also serves as an adhesive is filled, in any one of claims 1 to 11 One small LED lamp described. LED小型SMDチップが、それに搭載されたLEDチップの発光面上に適宜選択された蛍光体層を有するものとされてなる、請求項1ないし12何れか一記載の小型LEDランプ。 The small LED lamp according to any one of claims 1 to 12, wherein the LED small SMD chip has a phosphor layer appropriately selected on the light emitting surface of the LED chip mounted therein. ヒートシンク筐体の機械的接続端が、M4mm、ピッチ0.7mmか、M5mm、ピッチ0.8mmか、M6mm、ピッチ1.0mmか、M8mm、ピッチ1.25mmかの何れか一の口金部である、請求項1ないし13何れか一記載の小型LEDランプ。 The mechanical connection end of the heat sink housing is the base portion of any one of M4 mm, pitch 0.7 mm, M5 mm, pitch 0.8 mm, M6 mm, pitch 1.0 mm, M8 mm, and pitch 1.25 mm. , The small LED lamp according to any one of claims 1 to 13. 透光バルブの先端から、ヒートシンク筐体の機械的接続端の基端までの全長寸法が、20mmないし40mmに規制され、最大径となるヒートシンク筐体の外径が、6mmないし14mmに規制されてなる、請求項1ないし14何れか一記載の小型LEDランプ。 The total length from the tip of the light-transmitting bulb to the base of the mechanical connection end of the heat sink housing is regulated to 20 mm to 40 mm, and the outer diameter of the heat sink housing, which is the maximum diameter, is regulated to 6 mm to 14 mm. The small LED lamp according to any one of claims 1 to 14.
JP2018075767A 2018-04-10 2018-04-10 Small LED lamp Active JP6790017B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2018075767A JP6790017B2 (en) 2018-04-10 2018-04-10 Small LED lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018075767A JP6790017B2 (en) 2018-04-10 2018-04-10 Small LED lamp

Publications (2)

Publication Number Publication Date
JP2019186046A JP2019186046A (en) 2019-10-24
JP6790017B2 true JP6790017B2 (en) 2020-11-25

Family

ID=68341757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018075767A Active JP6790017B2 (en) 2018-04-10 2018-04-10 Small LED lamp

Country Status (1)

Country Link
JP (1) JP6790017B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7328690B2 (en) * 2019-11-19 2023-08-17 株式会社ウイルダイフレックス display unit for electronics

Also Published As

Publication number Publication date
JP2019186046A (en) 2019-10-24

Similar Documents

Publication Publication Date Title
US8324835B2 (en) Modular LED lamp and manufacturing methods
US8525396B2 (en) Illumination source with direct die placement
JP6105811B2 (en) LIGHTING DEVICE AND METHOD FOR MANUFACTURING LIGHTING DEVICE
TWI553271B (en) Solid state light with optical guide and integrated thermal guide
US9310052B1 (en) Compact lens for high intensity light source
US8829774B1 (en) Illumination source with direct die placement
US20140091697A1 (en) Illumination source with direct die placement
US8884517B1 (en) Illumination sources with thermally-isolated electronics
US20110204779A1 (en) Illumination Source and Manufacturing Methods
CN108431497A (en) Thermal conductivity flexible PCB and all-plastic radiator for LED bulb transformation
EP3208522B1 (en) Omnidirectional light emission led lamp
US20160169477A9 (en) Reflector for a led light source and related led lighting device
JP6490753B2 (en) Lighting device
JP6790017B2 (en) Small LED lamp
TW201506296A (en) Light emitting diode bulb
JP6331193B2 (en) LED unit and lighting apparatus using the same
US8847472B1 (en) Laminate support structure for an LED in a liquid-filled bulb
US20140369037A1 (en) Omnidirectional Lamp
JP6699987B2 (en) LED lamp and heat dissipation method of LED lamp
JP6078902B2 (en) Illumination light source and illumination device
JP5948666B2 (en) Illumination light source and illumination device
EP3330607B1 (en) Led bulb
JP2017062935A (en) Lamp device
CN109790971A (en) Compact LED light emitting device and its manufacturing method
CN207394756U (en) Lighting device

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20190305

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20191227

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20200204

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20200402

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20200430

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20201006

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20201104

R150 Certificate of patent or registration of utility model

Ref document number: 6790017

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250