JP2019183163A - Adhesive composition, and manufacturing method of structure - Google Patents

Abstract

To provide an adhesive composition capable of providing high reaction rate even at a part to which a light is not directly irradiated when cured by irradiating the light, and providing excellent adhesiveness, and a manufacturing method of a connection structure.SOLUTION: An adhesive composition containing a radical polymerizable compound, a photoradical polymerization initiator, and a fluophor, and having a difference between absorption peak wavelength of the photoradical polymerization initiator and fluorescence peak wavelength of the fluophor of 100 nm or less is used. Since the photoradical polymerization initiator of a part to which the light is not directly irradiated generates radical due to light emission by the fluophor, high reaction rate is obtained even at a part to which a light is not directly irradiated, and excellent adhesiveness can be obtained.SELECTED DRAWING: None

Description

  The present invention relates to an adhesive composition for connecting circuit members, for example, and a method for producing a structure.

  In recent years, LCD (Liquid Crystal Display) panels have been narrowed and glass substrates have been made thinner, so that the glass substrate is warped during COG (Chip on Glass) mounting, and the liquid crystal screen around the COG mounting portion Color unevenness may occur. The cause of this color unevenness is a difference in thermal expansion between an IC (Integrated Circuit) and a glass substrate at the time of mounting, so that it is desired to lower the mounting temperature. As a low-temperature mounting, for example, Patent Document 1 proposes a method using ultraviolet rays.

  However, the portion on the terminal on the glass substrate is difficult for ultraviolet rays to reach and the curing reaction does not proceed sufficiently, so that excellent adhesion may not be obtained.

JP 2004-336063 A

  The present invention has been proposed in view of such a conventional situation, and a high reaction rate is obtained even in a portion where light is not directly irradiated when cured by irradiation with light, and excellent adhesiveness is obtained. An adhesive composition that can be used and a method for manufacturing the structure are provided.

  As a result of intensive studies, the inventor has found that by adding a phosphor to the radical polymerization type adhesive composition, the reaction rate of the portion not directly exposed to light is improved and excellent connectivity is obtained. .

That is, the adhesive composition according to the present invention contains a radical polymerizable compound, a photo radical polymerization initiator, and a phosphor comprising an anthracene derivative or a coumarin derivative, and the absorption peak wavelength of the photo radical polymerization initiator. And the fluorescence peak wavelength of the phosphor is 100 nm or less, and the difference between the absorption peak wavelength of the photo radical polymerization initiator and the excitation peak wavelength of the phosphor is 20 nm or less. .
The adhesive composition according to the present invention contains a radical polymerizable compound comprising a polyfunctional (meth) acrylate, a photo radical polymerization initiator, and a phosphor, and an absorption peak wavelength of the photo radical polymerization initiator. And the fluorescent peak wavelength of the phosphor is 100 nm or less.

Moreover, the manufacturing method of the structure which concerns on this invention is the fluorescent substance which consists of a 1st support substrate and a 2nd support substrate, a radically polymerizable compound, a photoradical polymerization initiator, an anthracene derivative, or a coumarin derivative. The difference between the absorption peak wavelength of the photo radical polymerization initiator and the fluorescence peak wavelength of the phosphor is 100 nm or less, the absorption peak wavelength of the photo radical polymerization initiator and the excitation peak of the phosphor The first support substrate and the second support substrate are bonded to each other by irradiating with light while pressure-bonding with an adhesive composition having a wavelength difference of 20 nm or less.
Further, in the method for producing a structure according to the present invention, a first support substrate and a second support substrate are divided into a radical polymerizable compound composed of polyfunctional (meth) acrylate, a photo radical polymerization initiator, and a phosphor. And the difference between the absorption peak wavelength of the photoradical polymerization initiator and the fluorescence peak wavelength of the phosphor is 100 nm or less, and is irradiated with light while being pressure-bonded with an adhesive composition interposed therebetween, The support substrate is bonded to the second support substrate.

  According to the present invention, since the phosphor added to the adhesive composition emits light when irradiated with light, the radical photopolymerization initiator in the portion that is not directly exposed to light also generates radicals, and thus the portion that is not directly exposed to light. In this case, a high reaction rate can be obtained and excellent adhesiveness can be obtained.

Hereinafter, embodiments of the present invention will be described in detail in the following order with reference to the drawings.
1. 1. Adhesive composition 2. Manufacturing method of connection structure Example

<1. Adhesive composition>
The adhesive composition according to the present embodiment contains a radical polymerizable compound, a photo radical polymerization initiator, and a phosphor, and the absorption peak wavelength of the photo radical polymerization initiator and the fluorescence peak wavelength of the phosphor (light emission). The difference from the peak wavelength is 100 nm or less. Although the shape of an adhesive composition is not specifically limited, Forming into a film shape and making it into an adhesive film is mentioned as a suitable form.

  As a radically polymerizable compound, it can select from the (meth) acrylate used in field | areas, such as an adhesive agent, and can use it suitably. In this specification, (meth) acrylate is meant to include acrylic acid ester (acrylate) and methacrylic acid ester (methacrylate).

  Specific examples of the radical polymerizable compound include isocyanuric acid EO-modified diacrylate, tricyclodecane dimethanol diacrylate, dimethylol-tricyclodecane diacrylate, polyethylene glycol diacrylate, urethane acrylate, 2-hydroxyethyl acrylate, 2-hydroxy Propyl acrylate, 4-hydroxybutyl acrylate, isobutyl acrylate, t-butyl acrylate, isooctyl acrylate, bisphenoxyethanol full orange acrylate, 2-acryloyloxyethyl succinic acid, lauryl acrylate, stearyl acrylate, isobornyl acrylate, cyclohexyl acrylate, Tris (2-hydroxyethyl) isocyanurate triacrylate, tetrahydro Examples include rufuryl acrylate, o-phthalic acid diglycidyl ether acrylate, ethoxylated bisphenol A dimethacrylate, bisphenol A type epoxy acrylate, epoxy acrylate, and (meth) acrylates corresponding to these, one or two of these. The above can be used. Among these, isocyanuric acid EO-modified diacrylate, tricyclodecane dimethanol diacrylate, and the like are preferably used. Specific examples available on the market include the product name “M-215” of Toagosei Co., Ltd. and the product name “DCP” of Shin-Nakamura Chemical Co., Ltd.

  The radical photopolymerization initiator can be appropriately selected from known radical photopolymerization initiators. Examples of the photoradical polymerization initiator include alkylphenone photopolymerization initiators, acylphosphine oxide photopolymerization initiators, titanocene photopolymerization initiators, and the like, and one or more of these are used. Can do.

  Specific examples of the photo radical polymerization initiator available on the market include bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide (IRGACURE819, BASF Japan Ltd., absorption peak wavelength: 370 nm), 2- Benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1 (IRGACURE369, BASF Japan Ltd., absorption peak wavelength: 320 nm), 2- (dimethylamino) -2-[(4-methyl Phenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone (IRGACURE379, BASF Japan Ltd., absorption peak wavelength: 320 nm), 1.2-octanedione, 1- [4- ( Phenylthio)-, 2- (O-benzoyloxime)] (IRGACUREO) XE01, BASF Japan Ltd., absorption peak wavelength: 360 nm), 2-hydroxy-2-cyclohexylacetophenone (IRGACURE184, BASF Japan Ltd., absorption peak wavelength: 240 nm), α-hydroxy-α, α′-dimethylacetophenone (DAROCUR1173, BASF Japan Ltd.), 2,2-dimethoxy-2-phenylacetophenone (IRGACURE651, BASF Japan Ltd.), 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone ( DAROCUR2959, BASF Japan Ltd.), 2-hydroxy-1- {4- [2-hydroxy-2-methyl-propionyl] -benzyl} phenyl} -2-methyl-propan-1-one (IRGAC RE) 127, BASF Japan Ltd.) and the like, can be used alone or in combination of two or more thereof.

  Examples of the phosphor include anthracene derivatives, coumarin derivatives, azole derivatives, thiophene derivatives, carbazole derivatives, cyclopentadiene derivatives, pyridine derivatives, porphyrin derivatives, fluorene derivatives, phenanthroline derivatives, pyrene derivatives, and the like. Two or more kinds can be used. Among these, anthracene derivatives and coumarin derivatives are preferably used.

  The addition amount of the phosphor is preferably 0.01 parts by mass or more and 1 part by mass or less with respect to 1 part by mass of the radical photopolymerization initiator. If the added amount of the phosphor is too small, the reaction rate of the portion not directly exposed to light is lowered, and if the added amount of the phosphor is too large, radical generation of the photoradical polymerization initiator may be hindered.

  The above-mentioned photo radical polymerization initiator and phosphor can be appropriately selected from those having a difference between the absorption peak wavelength of the photo radical polymerization initiator and the fluorescence peak wavelength of the phosphor of 100 nm or less. When the difference between the absorption peak wavelength of the photo radical polymerization initiator and the fluorescence peak wavelength of the phosphor is 100 nm or less, the photo radical polymerization initiator generates a sufficient amount of radicals for curing in the phosphor emission wavelength region. Therefore, a high reaction rate can be obtained even in a portion that is not directly exposed to light.

  Further, the difference between the absorption peak wavelength of the photo radical polymerization initiator and the excitation peak wavelength of the phosphor is preferably 100 nm or less, more preferably 60 nm or less, and further preferably 20 nm or less. Since the difference between the absorption peak wavelength of the photoradical polymerization initiator and the excitation peak wavelength of the phosphor is small, the use of a long-life LED lamp enables curing of a portion that is not directly exposed to light.

  The phosphor preferably has an excitation peak wavelength of 300 nm to 400 nm and a fluorescence peak wavelength of 350 nm to 450 nm. Since the long wavelength region of 300 nm or more has excellent transparency, the phosphor existing in the adhesive can also emit light by having an excitation peak wavelength of 300 nm to 400 nm. Moreover, by having a fluorescence peak wavelength of 350 nm or more and 450 nm or less, it is possible to excite a photo radical polymerization initiator present in a portion where light does not directly hit. Specific examples of such phosphors include anthracene (excitation peak wavelength: 375 nm, fluorescence peak wavelength: 400 nm), 7-hydroxy-4-methylcoumarin (excitation peak wavelength: 325 nm, fluorescence peak wavelength: 380 nm), and the like. It is done.

  In addition, as other additives to be blended in the adhesive composition, if necessary, a film-forming resin, a silane coupling agent, an acrylic rubber, dilution monomers such as various acrylic monomers, a filler, a softener, a colorant, You may mix | blend a flame retardant, a thixotropic agent, etc. Moreover, it is good also as a conductive adhesive by adding a conductive filler.

  The film-forming resin corresponds to, for example, a high molecular weight resin having an average molecular weight of 10,000 or more, and preferably has an average molecular weight of about 10,000 to 80,000 from the viewpoint of film formability. Examples of the film-forming resin include various resins such as phenoxy resin, polyester resin, polyurethane resin, polyester urethane resin, acrylic resin, polyimide resin, and butyral resin. These may be used alone or in combination of two or more. May be used. Among these, it is preferable to use a phenoxy resin from the viewpoints of film formation state, connection reliability, and the like.

  Examples of silane coupling agents include epoxy, methacryloxy, amino, vinyl, mercapto, sulfide, and ureido. Among these, an epoxy-based silane coupling agent can be suitably used from the viewpoint of improving adhesion to glass and plastic. Specific examples that can be obtained on the market include trade name “KBM-403” (3-glycidoxypropyltrimethoxysilane) of Shin-Etsu Chemical Co., Ltd.

  Examples of the conductive filler include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, and gold, metal oxide, carbon, graphite, glass, ceramic, and plastic. The surface of the particles such as those coated with a metal, the surface of these particles further coated with an insulating thin film, and the like. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. The particles can be used.

<2. Manufacturing method of connection structure>
In the manufacturing method of the connection structure according to the present embodiment, the first circuit member in which the first terminal is formed on the first support substrate, and the second terminal on the second support substrate are formed. The second circuit member contains a radical polymerizable compound, a photo radical polymerization initiator, and a phosphor, and the absorption peak wavelength of the photo radical polymerization initiator and the fluorescence peak wavelength (emission peak) of the phosphor. The first terminal and the second terminal are connected by irradiating with light while pressure-bonding with an adhesive composition having a wavelength difference of 100 nm or less.

  There is no restriction | limiting in particular in a 1st circuit member and a 2nd circuit member, According to the objective, it can select suitably. Examples of the first circuit member include glass substrates for LCD (Liquid Crystal Display) panels and plasma display panels (PDP), printed wiring boards (PWB), and the like. Examples of the second circuit member include flexible substrates (FPC: Flexible Printed Circuits) such as IC (Integrated Circuit) and COF (Chip On Film), and tape carrier package (TCP) substrates.

  In the case where the first terminal of the first circuit member and the second terminal of the second circuit member are connected using the adhesive composition described above, the second terminal is used by using a crimping tool such as a heat tool, for example. This is performed by irradiating ultraviolet rays while pressing the circuit member. Here, the predetermined temperature refers to the temperature of the adhesive composition at the time of pressure bonding. Moreover, it is preferable that predetermined temperature is 80 degreeC or more and 160 degrees C or less.

  Moreover, it is preferable to irradiate ultraviolet rays several seconds after starting the heat pressing with the crimping tool. This eliminates the adhesive composition from between the first terminal and the second terminal, and after securing sufficient contact between the terminals, the adhesive composition can be cured, thus providing excellent conduction. Resistance can be obtained.

  Although it does not specifically limit as an ultraviolet irradiation device, It is preferable to radiate | emit the ultraviolet-ray of 300 nm or more long wavelength range which is excellent in the transmittance | permeability. Examples of the ultraviolet irradiator include an LED lamp having a peak wavelength of 300 nm to 500 nm, a mercury lamp that emits ultraviolet light of 254 nm, 303 nm, and 313 nm, a metal halide, etc. having a main wavelength of 365 nm, and one or more of these. Can be used. For example, a phosphor excitation lamp and a radical photopolymerization initiator lamp may be installed.

  Further, a buffer material may be interposed between the crimping tool and the second circuit member for crimping. By interposing the cushioning material, it is possible to reduce pressure variation and prevent the crimping tool from becoming dirty. There is no restriction | limiting in particular as a crimping | compression-bonding tool, According to the objective, it can select suitably, You may perform a press once using the pressing member which is a larger area than a press target, The pressing may be performed in several times using a pressing member having a small area. There is no restriction | limiting in particular as a front-end | tip shape of a crimping | compression-bonding tool, According to the objective, it can select suitably, For example, planar shape, curved surface shape, etc. are mentioned. In addition, when the tip shape is a curved surface shape, it is preferable to press along the curved surface shape.

<3. Example>
Examples of the present invention will be described below. In this example, a glass substrate and an IC were connected using an adhesive film containing a phosphor to produce a connection structure. Then, the die shear strength of the connection structure and the reaction rate of the light shielding part were evaluated. The present invention is not limited to these examples.

[Preparation of adhesive film]
A composition containing a desired material from the following was applied to a PET film and dried to prepare an adhesive film having a thickness of 20 μm.
Phenoxy resin: YP50, Nippon Steel & Sumikin Chemical Co., Ltd.
Isocyanuric acid EO-modified diacrylate: M-215, Toagosei Co., Ltd.
Tricyclodecane dimethanol diacrylate: DCP, Shin-Nakamura Chemical Co., Ltd.
Silane coupling agent: KBM-403, Shin-Etsu Chemical Co., Ltd.
Phosphor A (excitation peak wavelength: 375 nm, fluorescence peak wavelength: 400 nm): anthracene, Wako Pure Chemical Industries, Ltd.
Phosphor B (excitation peak wavelength: 325 nm, fluorescence peak wavelength: 380 nm): 7-hydroxy-4-methylcoumarin, Wako Pure Chemical Industries, Ltd.
Photoradical polymerization initiator A (absorption peak wavelength: 370 nm): IRGACURE 819, BASF Japan Ltd.
Photoradical polymerization initiator B (absorption peak wavelength: 240 nm): IRGACURE184, BASF Japan Ltd.
Photoradical polymerization initiator C (absorption peak wavelength: 320 nm): IRGACURE369, BASF Japan K.K.
Photoradical polymerization initiator D (absorption peak wavelength: 320 nm): IRGACURE 379, BASF Japan K.K.
Photoradical polymerization initiator E (absorption peak wavelength: 360 nm): IRGACUREOXE01, BASF Japan Ltd.

[Production of connection structure]
A glass substrate for evaluation in which an Al terminal was formed on a glass surface having a thickness of 0.5 mm was prepared. Further, an IC (bump height: 15 μm) having an outer shape of 1.8 mm × 20 mm was prepared. An adhesive film having a thickness of 20 μm is attached to a glass substrate, an IC is mounted thereon, and then UV is irradiated from the glass substrate side while pressing with a heat tool at 100 ° C.-80 MPa-5 sec. Was made. UV irradiation starts at 2 seconds from the start of heating and pressing at an illuminance of 50 mW / cm ² using a mercury lamp that emits ultraviolet light of 254 nm, 303 nm, and 313 nm with a main wavelength of 365 nm, and 3 seconds after the start of irradiation. Irradiation was terminated.

[Die shear strength measurement]
The die shear strength of IC / adhesive film / glass substrate was measured. The die shear strength was measured when the IC was pushed horizontally from the side with a shear tool and the joint surface between the IC and the glass substrate was broken. The tool speed was 100 μm / sec.

[Measurement of reaction rate of light shielding part]
The IC was peeled off from the connection structure, and the adhesive film was sampled from the light-shielding portion on the terminal and measured using an HPLC analyzer. 0.005 mg of a sample was dissolved in acetonitrile and injected into a separation column (10 cm, 40 ° C.) to obtain a chromatogram. The analysis conditions were as follows.
Acetonitrile room temperature extraction-HPLC / DAD method Extraction: Acetonitrile 40 μL
Equipment: UPLC (manufactured by Waters), Method: Hannorutu
Gradient conditions: A 60%, B 40% (hold for 1 minute) → A 1%, B 99% (hold for 6 minutes) after 5 minutes, A is water, B is acetonitrile Analysis wavelength: 210-400 nm

  The measured intensity of the acrylic monomer was determined from the obtained chromatogram, and the reaction rate of the light-shielding part was calculated from the relationship line between the measured intensity of the acrylic monomer prepared in advance and the reaction rate.

<Comparative Example 1>
As shown in Table 1, 50 parts by mass of phenoxy resin, 50 parts by mass of EO-modified diacrylate of isocyanuric acid, 1 part by mass of silane coupling agent, and 1 part by mass of radical photopolymerization initiator A are blended to form an adhesive film. Produced. The die shear strength of the connection structure produced using this adhesive film was less than 10 kgf, and the reaction rate of the light shielding part on the terminal was 3%.

<Comparative example 2>
As shown in Table 1, 50 parts by mass of phenoxy resin, 50 parts by mass of EO-modified diacrylate of isocyanuric acid, 1 part by mass of silane coupling agent, 0.5 parts by mass of phosphor A, and radical photopolymerization initiator B 1 mass part was mix | blended, and the adhesive film was produced. The die shear strength of the connection structure produced using this adhesive film was 22 kgf, and the reaction rate of the light shielding part on the terminal was 12%.

<Example 1>
As shown in Table 1, 50 parts by mass of phenoxy resin, 50 parts by mass of EO-modified diacrylate of isocyanuric acid, 1 part by mass of silane coupling agent, 0.01 part by mass of phosphor A, photoradical polymerization initiator A 1 mass part was mix | blended, and the adhesive film was produced. The die shear strength of the connection structure produced using this adhesive film was 102 kgf, and the reaction rate of the light shielding part on the terminal was 80%.

<Example 2>
As shown in Table 1, 50 parts by mass of phenoxy resin, 50 parts by mass of EO-modified diacrylate of isocyanuric acid, 1 part by mass of silane coupling agent, 0.05 part by mass of phosphor A, photoradical polymerization initiator A 1 mass part was mix | blended, and the adhesive film was produced. The die shear strength of the connection structure produced using this adhesive film was 103 kgf, and the reaction rate of the light shielding part on the terminal was 82%.

<Example 3>
As shown in Table 1, 50 parts by mass of phenoxy resin, 50 parts by mass of EO-modified diacrylate of isocyanuric acid, 1 part by mass of silane coupling agent, 0.1 part by mass of phosphor A, photoradical polymerization initiator A 1 mass part was mix | blended, and the adhesive film was produced. The die shear strength of the connection structure produced using this adhesive film was 101 kgf, and the reaction rate of the light shielding part on the terminal was 88%.

<Example 4>
As shown in Table 1, 50 parts by mass of the phenoxy resin, 50 parts by mass of the EO-modified diacrylate of isocyanuric acid, 1 part by mass of the silane coupling agent, 0.5 parts by mass of the phosphor A, and the radical photopolymerization initiator A 1 mass part was mix | blended, and the adhesive film was produced. The connection structure produced using this adhesive film had a die shear strength of 105 kgf and a reaction rate of the light shielding part on the terminal of 91%.

<Example 5>
As shown in Table 1, 50 parts by mass of phenoxy resin, 50 parts by mass of tricyclodecane dimethanol diacrylate, 1 part by mass of silane coupling agent, 0.5 part by mass of phosphor A, photoradical polymerization initiator 1 part by mass of A was blended to produce an adhesive film. The connection structure produced using this adhesive film had a die shear strength of 105 kgf, and the reaction rate of the light shielding part on the terminal was 90%.

<Example 6>
As shown in Table 1, 50 parts by mass of phenoxy resin, 50 parts by mass of isocyanuric acid EO-modified diacrylate, 1 part by mass of silane coupling agent, 1 part by mass of phosphor A, and 1 photoradical polymerization initiator A An adhesive film was prepared by blending parts by mass. The die shear strength of the connection structure produced using this adhesive film was 100 kgf, and the reaction rate of the light shielding part on the terminal was 89%.

<Example 7>
As shown in Table 1, 50 parts by mass of phenoxy resin, 50 parts by mass of EO-modified diacrylate of isocyanuric acid, 1 part by mass of silane coupling agent, 0.5 parts by mass of phosphor A, and photoradical polymerization initiator C 1 mass part was mix | blended, and the adhesive film was produced. The die shear strength of the connection structure produced using this adhesive film was 111 kgf, and the reaction rate of the light shielding part on the terminal was 81%.

<Example 8>
As shown in Table 1, 50 parts by mass of phenoxy resin, 50 parts by mass of EO-modified diacrylate of isocyanuric acid, 1 part by mass of silane coupling agent, 0.5 part by mass of phosphor A, and radical photopolymerization initiator D 1 mass part was mix | blended, and the adhesive film was produced. The die shear strength of the connection structure produced using this adhesive film was 107 kgf, and the reaction rate of the light shielding part on the terminal was 84%.

<Example 9>
As shown in Table 1, 50 parts by mass of phenoxy resin, 50 parts by mass of EO-modified diacrylate of isocyanuric acid, 1 part by mass of silane coupling agent, 0.5 part by mass of phosphor A, photoradical polymerization initiator E 1 mass part was mix | blended, and the adhesive film was produced. The die shear strength of the connection structure produced using this adhesive film was 100 kgf, and the reaction rate of the light shielding part on the terminal was 83%.

<Example 10>
As shown in Table 1, 50 parts by mass of phenoxy resin, 50 parts by mass of EO-modified diacrylate of isocyanuric acid, 1 part by mass of silane coupling agent, 0.5 part by mass of phosphor B, photoradical polymerization initiator A 1 mass part was mix | blended, and the adhesive film was produced. The connection structure produced using this adhesive film had a die shear strength of 105 kgf, and the reaction rate of the light shielding part on the terminal was 85%.

<Example 11>
As shown in Table 1, 50 parts by mass of phenoxy resin, 50 parts by mass of EO-modified diacrylate of isocyanuric acid, 1 part by mass of silane coupling agent, 0.001 part by mass of phosphor A, photoradical polymerization initiator A 1 mass part was mix | blended, and the adhesive film was produced. The connection structure produced using this adhesive film had a die shear strength of 36 kgf, and the reaction rate of the light shielding part on the terminal was 34%.

  When the phosphor was not added as in Comparative Example 1, the reaction rate of the light shielding part on the terminal was low, and the die shear strength was also low. In addition, when the absorption peak wavelength and the fluorescence peak wavelength were 100 nm or more apart as in Comparative Example 2, the reaction rate of the light shielding part on the terminal was low, and the die shear strength was also low.

On the other hand, when the difference between the absorption peak wavelength and the fluorescence peak wavelength was 100 nm or less as in Examples 1 to 11, the reaction rate was high in the light shielding portion on the terminal, and the high die shear strength was also high. In addition, in Examples 1 to 4 and 6, the addition amount of the phosphor is set to 0.01 parts by mass or more and 1 part by mass or less with respect to 1 part by mass of the radical photopolymerization initiator. A high reaction rate could be obtained, and a high die shear strength could be obtained. Further, even in the case where the amount of the phosphor is extremely small as in Example 11, the reaction rate of the light shielding portion on the terminal is high and the die shear strength is higher than that in Comparative Example 2 in which the absorption peak wavelength and the fluorescence peak wavelength are separated by 100 nm or more The effect of the present invention was confirmed.

Claims (8)

Containing a radical polymerizable compound, a photo radical polymerization initiator, and a phosphor comprising an anthracene derivative or a coumarin derivative,
The difference between the absorption peak wavelength of the radical photopolymerization initiator and the fluorescence peak wavelength of the phosphor is 100 nm or less,
An adhesive composition in which a difference between an absorption peak wavelength of the photo radical polymerization initiator and an excitation peak wavelength of the phosphor is 20 nm or less. Containing a radically polymerizable compound comprising a polyfunctional (meth) acrylate, a radical photopolymerization initiator, and a phosphor,
The adhesive composition in which the difference between the absorption peak wavelength of the photo radical polymerization initiator and the fluorescence peak wavelength of the phosphor is 100 nm or less.   The adhesive composition according to claim 2, wherein the phosphor is an anthracene derivative or a coumarin derivative.   The adhesive composition according to claim 2 or 3, wherein a difference between an absorption peak wavelength of the photo radical polymerization initiator and an excitation peak wavelength of the phosphor is 100 nm or less.   The adhesive composition according to any one of claims 1 to 4, wherein the phosphor has an excitation peak wavelength of 300 nm to 400 nm and a fluorescence peak wavelength of 350 nm to 450 nm.   The adhesive composition according to any one of claims 1 to 5, wherein an addition amount of the phosphor is 0.01 parts by mass or more and 1 part by mass or less with respect to 1 part by mass of the radical photopolymerization initiator.   The first support substrate and the second support substrate contain a radical polymerizable compound, a photo radical polymerization initiator, and a phosphor composed of an anthracene derivative or a coumarin derivative, and the absorption of the photo radical polymerization initiator Adhesive composition in which difference between peak wavelength and fluorescent peak wavelength of phosphor is 100 nm or less, and difference between absorption peak wavelength of photo radical polymerization initiator and excitation peak wavelength of phosphor is 20 nm or less A method of manufacturing a structure in which light is irradiated while pressure bonding with an object interposed therebetween, and the first support substrate and the second support substrate are bonded. The first support substrate and the second support substrate contain a radical polymerizable compound composed of polyfunctional (meth) acrylate, a photo radical polymerization initiator, and a phosphor, and absorb the photo radical polymerization initiator. The difference between the peak wavelength and the fluorescence peak wavelength of the phosphor is 100 nm or less, and light irradiation is performed while pressing the adhesive composition to bond the first support substrate and the second support substrate. Method for manufacturing the structure.