JP2019179882A - Support body for resin sealing body and manufacturing method of semiconductor package using the same - Google Patents

Abstract

To provide a support body for a resin sealing body capable of excluding expensive equipment for an energy discharge, expecting a reduction of a cost, and preventing warping of a peripheral edge part of a plate material even if a large-sized plate material is used, and provide a manufacturing method of a semiconductor package using the same.SOLUTION: A support body for a resin sealing body comprises: a flat panel plate 11 supporting a resin sealing body of a semiconductor chip; and an adhesion region 12 detachably adhered to the resin sealing body while being formed onto the panel plate 11. The support body for manufacturing a semiconductor is usable in a temperature range of -50°C or more and 300°C or less. The adhesion region 12 is divided into a plurality of first adhesion regions 13 formed in at least peripheral edge part of a front surface which can be opposite to the resin sealing body of the panel plate 11; and a second adhesion region 13A formed in the region other than the formation region of the plurality of first adhesion regions 13. An adhesion force of the plurality of first adhesion regions 13 is set stronger than the adhesion force of the second adhesion region 13A.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a support for a resin sealing body used in semiconductor FOWLP technology, PLP technology, FOPLP technology, and the like, and a method of manufacturing a semiconductor package using the same.

  Various technologies are employed in the semiconductor manufacturing process (see Patent Document 1), but in a high-end manufacturing process, FOWLP (Fan Out Wafer Level Packaging), which can be expected to reduce the thickness of the module and reduce the manufacturing cost, is expected. Technology and PLP (Panel Level Packaging) technology are rapidly spreading (see Patent Document 2).

  When manufacturing a semiconductor package by the chip-first face-up method of the FOWLP technology, a plurality of semiconductor chips are first adhered to the surface of a temporarily fixed sheet of a wafer-level support plate at a predetermined interval, although not shown. A plurality of semiconductor chips are encapsulated with a mold resin to form a resin sealing body, and the mold resin surface of the resin sealing body is ground to form a plurality of semiconductor chips. The terminal surface of the semiconductor chip is exposed.

  The support plate is formed of a light-transmitting material, specifically, a flat glass plate or an acrylic plate. The temporary fixing sheet is formed of a material containing a predetermined resin and a light absorber, and is laminated and adhered to the surface of the support plate. As the resin for the temporary fixing sheet, an acrylic resin, an epoxy resin, or the like is used. The light absorber is made of, for example, carbon black, carbon fiber, aluminum or the like. When energy is radiated to the light-transmitting support plate, the light absorber is absorbed and converted into heat energy.

  Once the terminal surfaces of the plurality of semiconductor chips are exposed, a rewiring layer is formed on the exposed terminal surfaces of the plurality of semiconductor chips, the support plate is separated from the temporarily fixed sheet, and a pseudo wafer is formed. A semiconductor package can be manufactured by dicing the attached pseudo wafer into individual pieces.

  When the support plate is separated from the temporarily fixed sheet, energy is radiated to the temporarily fixed sheet through the light transmissive support plate. Then, the light-absorbing agent of the temporarily fixing sheet absorbs energy and converts it into heat energy, and the temperature of the temporarily fixing sheet rapidly increases. With this rapid temperature increase, the resin of the temporarily fixing sheet is thermally decomposed. Since the temporarily fixed sheet is partially collapsed, the support plate can be separated from the temporarily fixed sheet.

JP 2017-228645 A Japanese Patent Laid-Open No. 2018-032809

  The conventional semiconductor package is manufactured as described above, and when the support plate is separated from the temporary fixing sheet to form a pseudo wafer, the temporary fixing sheet is partially collapsed by radiating energy to the temporary fixing sheet. There is a problem that an expensive radiation device must be used for energy radiation. Further, since the temporarily fixed sheet is partially thermally decomposed, there is a problem that the temporarily fixed sheet cannot be reused and the running cost cannot be reduced. Furthermore, when the pseudo wafer is diced, the temporary fixing sheet and the resin sealing body are integrated, so that the operation of peeling the temporary fixing sheet is indispensable, which causes the complication and delay of the manufacturing operation. .

In recent years, FOPLP (Fan Out Panel Level Packaging) technology that can promote FOWLP technology and can be applied to a large panel board to further reduce the manufacturing cost has been proposed and attracted attention as a next-generation technology. According to this FOPLP technology, semiconductor packages more than doubled can be manufactured in a lump, so that a significant reduction in manufacturing cost can be expected.
However, when using a panel plate larger than the wafer, the mere use of the large panel plate may deteriorate the posture of the peripheral edge of the panel plate along the bow, resulting in a decrease in yield. .

  The present invention has been made in view of the above, and an expensive apparatus for radiating energy can be omitted, and a reduction in cost can be expected. Even if a large plate is used, the peripheral portion of the plate is rebounded. It is an object of the present invention to provide a support for a resin-sealed body that can be prevented from being produced and a method for manufacturing a semiconductor package using the same.

In order to solve the above-described problems, the present invention includes a plate material that supports the resin sealing body, and an adhesive region that is formed on the plate material and is detachably adhered to the resin sealing body, and is −50 ° C. or higher and 300 ° C. or lower. Can be used in the temperature range of
A first adhesive region formed on at least the peripheral portion of the opposing surface capable of facing the resin sealing body of the plate material, and a second adhesive region formed other than the region where the first adhesive region is formed And the adhesive force of the first adhesive region is stronger than the adhesive force of the second adhesive region.

The resin sealing body is a sealing body having a size of 300 mm square or more and 500 mm square or less in which a plurality of semiconductor chips arranged at a predetermined interval are encapsulated with a resin composition,
The plate material is preferably a panel plate having a size of 300 mm square to 700 mm square.

In addition, a large number of adhesive materials are arranged at predetermined intervals in the first adhesive region, and a plurality of adhesive materials are arranged at predetermined intervals in the second adhesive region. It is preferable that at least one of the adhesive regions is a silicone-based adhesive material.
Further, the first adhesive region of the adhesive region is formed in a substantially planar polygon in the vicinity of the four corners of the opposing surface of the plate material, and the second adhesive region is formed in a region other than the vicinity of the four corners of the opposing surface of the plate material. And good.

Further, in the present invention, in order to solve the above-described problem, a semiconductor package manufacturing method for collectively assembling a large number of semiconductor packages with a large panel,
The large panel is a support for a resin sealing body according to any one of claims 1 to 4.

  A plurality of semiconductor chips are adhered and arranged on the carrier plate at predetermined intervals, and the terminal surfaces of the respective semiconductor chips are faced down, and the plurality of semiconductor chips are encapsulated with a resin composition to form a resin sealing body. After forming and separating the carrier plate material and the resin encapsulant and adhering the adhesive region of the resin encapsulant support to the non-adhesive surface of the resin encapsulant, it was exposed from the resin composition of the resin encapsulant A solder ball can be mounted by forming a rewiring layer on the terminal surfaces of a plurality of semiconductor chips.

  In addition, a plurality of semiconductor chips are adhered and arranged at predetermined intervals on the carrier plate material, and a terminal surface of each semiconductor chip is faced upward, and the plurality of semiconductor chips are encapsulated with a resin composition to form a resin sealing body. Forming and grinding the resin composition of the resin sealing body to expose the terminal surfaces of the plurality of semiconductor chips, separating the carrier plate material and the resin sealing body, and resin sealing the adhesive surface of the resin sealing body After adhering the adhesion region of the body support, a rewiring layer may be formed on the terminal surfaces of the plurality of semiconductor chips exposed from the resin composition of the resin encapsulant to mount solder balls.

  Here, the opposing surface of the plate material in the claims includes a front surface, a back surface, and a front surface and a back surface that can face the resin sealing body. The vicinity of the four corners of the opposing surface of the plate material includes the four corners of the opposing surface of the plate material and the periphery thereof. Further, the adhesive material can be appropriately formed into a circular shape, an elliptical shape, a polygonal shape, a fine filament, a strip shape, etc. in plan view, and may be transparent or opaque. The support for a resin encapsulant according to the present invention can be used at least in a semiconductor FOWLP technique, PLP technique, FOPLP technique manufacturing process, exposure process, inspection process, and the like. Furthermore, the carrier plate material can be configured to have a structure in which a weak adhesive sheet is laminated and adhered to at least one of both surfaces of the carrier plate.

  According to the present invention, the first adhesive region of the adhesive region adheres strongly through the adhesive material in the vicinity of the peripheral portion of the resin sealing body. Few.

  According to the present invention, there is an effect that an expensive device for energy emission can be omitted and cost reduction can be expected. Moreover, even if a large plate material is used, there is an effect that it is possible to suppress the peripheral portion of the plate material from warping.

  According to the invention of claim 2, the resin sealing body in which a plurality of semiconductor chips are encapsulated with a resin composition has a size of 300 mm square or more and 500 mm square or less, and the plate material is not a wafer of φ200 mm or φ300 mm, Since it is a large panel plate having a size of 300 mm square or more and 700 mm square or less, a plurality of semiconductor packages can be manufactured collectively.

  According to invention of Claim 3, since there are more adhesive materials of a 1st adhesion area | region than the adhesive material of a 2nd adhesion area | region, the adhesive force of a 1st adhesion area | region is more than the adhesive force of a 2nd adhesion area | region. It is possible to eliminate the possibility that the peripheral edge portion of the plate warps during adhesion between the resin sealing body and the adhesion region, resulting in a decrease in yield. In addition, if the adhesive material is a silicone-based adhesive material, excellent heat resistance, cold resistance, etc. can be obtained, so even if the working environment is in the temperature range of −50 ° C. to 300 ° C. Can be prevented from decreasing.

According to the invention described in claim 5, since the semiconductor package is manufactured by using a panel plate larger than the wafer, batch manufacturing of a plurality of semiconductor packages can be expected.
According to the sixth aspect of the present invention, it is possible to collectively manufacture a plurality of semiconductor packages by a chip-first face-down method.
According to the invention described in claim 7, it is possible to collectively manufacture a plurality of semiconductor packages by a chip-first face-up method.

It is a perspective explanatory view showing typically an embodiment of a support for resin sealing objects concerning the present invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows typically embodiment of the manufacturing method of the semiconductor package using the support body for resin sealing bodies which concerns on this invention, (a) A figure is sectional drawing which shows a carrier board | plate material, (b) figure is a carrier board | plate material. Sectional drawing which shows the state which adhered and arranged many semiconductor chips on the adhesive sheet, (c) The sectional view which shows the state which encapsulated many semiconductor chips with mold resin, and formed the resin sealing body, d) A cross-sectional view showing a state where the adhesive region of the support for a resin sealing body is adhered to the separated resin sealing body, and (e) is a diagram in which a large number of semiconductor chips are diced by dicing the resin sealing body. FIG. 5F is a cross-sectional view showing a state where a thin semiconductor package is manufactured by separating the resin sealing body support. BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows typically embodiment of the manufacturing method of the semiconductor package using the support body for resin sealing bodies which concerns on this invention, (a) A figure is sectional drawing which shows a carrier board | plate material, (b) figure is a carrier board | plate material. A cross-sectional view showing a state in which a large number of semiconductor chips are adhered and arranged on an adhesive sheet, and the terminal surface of each semiconductor chip is facing upward, and FIG. Sectional drawing which shows the state which formed the body, (d) figure is sectional drawing which shows the state which ground the resin sealing body surface and exposed the terminal surface of many semiconductor chips, (e) figure is carrier board material and resin Sectional drawing which shows the state which isolate | separated the sealing body and adhere | attached the adhesion area | region of the support body for resin sealing bodies on the resin sealing body, (f) FIG. Sectional drawing which shows the state separated, (g) figure isolate | separates the support body for resin sealing bodies Te is a sectional view showing a state in which manufacture a thin semiconductor package. It is a figure which shows typically 2nd Embodiment of the support body for resin sealing bodies which concerns on this invention, (a) A figure shows the state which changed the adhesive material of the 1st, 2nd adhesion area | region into the planar circle, respectively. The top view to show, (b) figure is a top view which shows the state which changed the 2nd adhesion area into the plane ellipse, (c) figure changed the 1st adhesion area into the plane frame shape, and the 2nd adhesion area It is a top view which shows the state which changed into flat rectangle.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. A support 10 for a resin sealing body in this embodiment is a resin sealing body of a semiconductor chip 4 as shown in FIGS. 6 and a panel plate 11 that supports 6 and an adhesive region 12 that is formed on the panel plate 11 and is detachably adhered to the resin sealing body 6, and can be used in a temperature range of −50 ° C. to 300 ° C. This is a support for production, and the adhesive region 12 is divided into first and second adhesive regions 13 and 13A, and the adhesive force of the first adhesive region 13 is set stronger than the adhesive force of the second adhesive region 13A. It is used for manufacturing the semiconductor package 22 using FOPLP technology or the like.

  As shown in FIGS. 2 and 3, the resin sealing body 6 of the semiconductor chip 4 has a size of 300 mm square to 500 mm square, preferably 320 mm square to 480 mm square, in order to reduce the manufacturing cost per semiconductor package. The semiconductor chip 4 is formed in a larger size than before, and a large number of semiconductor chips 4 are encapsulated with a mold resin 5. The mold resin 5 may be either a thermoplastic resin or a thermosetting resin, but an epoxy resin of a thermosetting resin that is excellent in insulation, mechanical strength, etc. is optimal.

  As shown in FIG. 1, the panel plate 11 of the support 10 for a resin sealing body is formed into a flat rectangular plate having a flat surface on both front and back surfaces by a predetermined material, and has a size of 300 mm square to 700 mm square. . Examples of the predetermined material of the panel plate 11 include materials that can be used without warping in a temperature range of −50 ° C. or more and 300 ° C. or less, specifically glass plates, metals, polyimide resins, and the like. Since the manufacturing environment of the semiconductor package 22 is a temperature range of −50 ° C. or more and 300 ° C. or less, the panel board 11 is formed of a material having cold resistance and heat resistance that can be used in this range.

  The material of the panel board 11 is changed depending on whether or not it is cut when the semiconductor package 22 is manufactured. That is, when the semiconductor package 22 is not cut together with the semiconductor chip 4 during manufacture, it is formed of a material such as iron that is difficult to cut, and when the semiconductor package 22 is cut together with the semiconductor chip 4, cutting is easy. It is made of a material such as a polyimide resin plate.

  The size of the panel plate 11 is set to be 300 mm square or more and 700 mm square or less, preferably 400 mm square or more and 650 mm square or less, more preferably 450 mm square or more and 620 mm square or less in consideration of the size of the large resin encapsulant 6. The For example, it is set to 450 mm × 600 mm, 457 mm × 610 mm, or the like. This is to reduce the manufacturing cost per semiconductor package in response to FOWLP technology, PLP technology, and FOPLP technology in which a large number of semiconductor packages 22 are assembled together with the large panel plate 11.

  As shown in FIG. 1, the adhesive region 12 includes a plurality of first adhesive regions 13 formed on at least a peripheral portion of the surface of the panel plate 11 that can face the resin sealing body 6, and the plurality of first adhesive regions 13. The first adhesive region 13 is divided into a second adhesive region 13A formed outside the adhesive region 13 formation region, and the plurality of first adhesive regions 13 surround the second adhesive region 13A. The plurality of first adhesive regions 13 are each formed in a substantially triangular shape in the vicinity of the peripheral edge where the panel plate 11 is easily warped, for example, in the vicinity of the four corners of the surface, and each first adhesive region 13 is formed in a planar right triangle. The oblique side of the first adhesive region 13 defines the second adhesive region 13A, and the adjacent side forms the peripheral edge of the panel plate 11.

  In the first adhesive region 13, as shown in the figure, a large number of adhesive materials 14 that can be used in a temperature range of −50 ° C. or more and 300 ° C. or less are arranged with printing at predetermined intervals. 14 is printed on a short filament having a thickness of about 10 μm. The large number of adhesive materials 14 are screen-printed for the convenience of printing over a large area at once. In addition, a narrow pitch is formed between the adjacent adhesive material 14 and the adhesive material 14 in order to enlarge the adhesive area of the first adhesive region 13.

  Each adhesive material 14 is not particularly limited, and is formed of, for example, a silicone-based or fluorine-based adhesive having excellent heat resistance, weather resistance, flame resistance, electrical insulation, cold resistance, viscosity temperature characteristics, and the like. , Weak tackiness is imparted. When using a silicone-based pressure-sensitive adhesive, it is preferable to use an addition-reaction type liquid silicone pressure-sensitive adhesive having a fast curing time and almost no curing shrinkage.

  As shown in the figure, the second adhesive region 13A is formed in a plane rhombus in the vicinity of the center of the surface of the panel plate 11 except for the vicinity of the four corners of the surface of the panel plate 11, and includes a plurality of first adhesives. Surrounded by region 13. In this second adhesive region 13A, a plurality of adhesive materials 14A that can be used in a temperature range of −50 ° C. or more and 300 ° C. or less are arranged at predetermined intervals, and each adhesive material 14A has a thickness of 10 μm. Printed on long filaments. The plurality of adhesive materials 14A are screen-printed because they are printed at once. Further, a wide pitch is formed between the adjacent adhesive material 14A and the adhesive material 14A in order to weaken the adhesive force of the second adhesive region 13A.

  Each adhesive material 14 </ b> A is formed to be relatively longer than the adhesive material 14 in the first adhesive region 13. The pressure-sensitive adhesive material 14A is not particularly limited, but is formed of, for example, a silicone-based or fluorine-based pressure-sensitive adhesive having excellent heat resistance, weather resistance, flame retardancy, electrical insulation, cold resistance, viscosity temperature characteristics, and the like. , Weak tackiness is imparted. When a silicone-based pressure-sensitive adhesive is used, it is optimal to use an addition-reaction type liquid silicone pressure-sensitive adhesive having a fast curing time and almost no curing shrinkage.

  As described above, the adhesive region 12 has more adhesive materials 14 in the plurality of first adhesive regions 13 than the adhesive material 14A in the second adhesive region 13A. The adhesive force of the first adhesive region 13 is not substantially the same, and the adhesive force of the plurality of first adhesive regions 13 is stronger than the adhesive force of the second adhesive region 13A.

  In the above configuration, when the semiconductor package 22 is manufactured by the chip-first face-down method of the FOPLP technology, first, the carrier plate material 1 in which the weakly adhesive sheet 3 is laminated and adhered to the surface of the carrier plate 2 is prepared ( 2 (a)), a large number of semiconductor chips 4 are adhered at predetermined intervals in the surface XY direction of the adhesive sheet 3 of the carrier plate 1, and the terminal surface 4a of each semiconductor chip 4 is arranged on the adhesive sheet. 3 side downwards (see FIG. 2B).

  The carrier plate 2 of the carrier plate material 1 is not particularly limited, and is made of, for example, a glass reinforced epoxy resin plate or a glass plate that is excellent in strength, thermal conductivity, heat resistance, electrical characteristics, and the like. The carrier plate 2 is formed in a planar rectangle having the same size as the panel plate 11 in order to correspond to the FOWLP technology, the PLP technology, the FOPLP technology, and the like. Moreover, although the adhesive sheet 3 is not specifically limited, a silicone type or a fluorine type elastomer etc. are used, and it adheres to the terminal surface 4a of many semiconductor chips 4 so that attachment or detachment is possible.

  When a large number of semiconductor chips 4 are adhered and arranged on the pressure-sensitive adhesive sheet 3 of the carrier plate 1, a large number of semiconductor chips 4 are encapsulated with a mold resin 5 such as an epoxy resin, and a resin sealing body 6 having a thickness of 50 μm or more and 2000 μm or less. Is formed (see FIG. 2C), and the carrier plate 1 and the resin sealing body 6 are separated. At this time, the resin sealing body 6 is formed by a molten sealing sheet, a compression sealing molding machine, a vacuum laminating apparatus, or the like. Further, when separating the carrier plate 1 and the resin encapsulant 6, the pressure-sensitive adhesive sheet 3 is not strong adhesive but weak adhesive, so that the carrier plate 1 and resin encapsulant 6 are not used without using a dedicated peeling device. And the carrier plate 1 can be reused.

  Next, in order to prevent distortion of the separated resin sealing body 6, the adhesive region 12 of the resin sealing body support 10 is adhered to the surface which is a non-adhesive surface of the resin sealing body (see FIG. 2D). Each of the terminal surfaces 4 a of the semiconductor chips 4 exposed from the mold resin 5 of the resin sealing body 6 is inspected. At this time, since the plurality of first adhesive regions 13 adhere to each other in the vicinity of the peripheral portion of the non-adhesive surface of the resin sealing body 6 through a large number of adhesive materials 14, the panel plate is attached to the non-adhesive surface of the resin sealing body 6. 11 adheres properly without warping. With this proper adhesion, a probe or the like can be easily brought into contact with the terminal surface 4a of the semiconductor chip 4, and the inspection can be simplified and speeded up.

  When the inspection of the semiconductor chip 4 is completed, a thin redistribution layer 20 is formed of a photoresist or the like on the terminal surfaces 4a of a large number of semiconductor chips 4 exposed from the mold resin 5 of the resin sealing body 6, and solder balls 21 are mounted. Then, after the resin sealing body 6 is diced to separate a large number of semiconductor chips 4 (see FIG. 2 (e)), if the resin sealing body support 10 is separated, the thin semiconductor package 22 can be quickly formed. (See FIG. 2 (f)). As a method for forming the rewiring layer 20, for example, a metal seed layer is formed on the exposed semiconductor chip 4 using a known method such as a vacuum film forming method, and then a known method such as a semi-additive method. A method of forming the rewiring layer 20 is enumerated.

  When dicing the resin sealing body 6 and dicing the resin sealing body support 10 together with the semiconductor chip 4 into individual pieces, the panel plate 11 of the resin sealing body support 10 is preliminarily made of polyimide resin. It can be used as a board. On the other hand, when it is desired to reuse the support 10 for the resin sealing body without separating it into individual pieces, the panel plate 11 of the support 10 for the resin sealing body may be previously set as a glass plate or a metal plate. .

  Next, when the semiconductor package 22 is manufactured by the chip-first face-up method of the FOPLP technology, first, the carrier plate material 1 is prepared in which the weakly adhesive sheet 3 is laminated and adhered to the surface of the carrier plate 2 (see FIG. 3 (a)), a large number of semiconductor chips 4 are adhered and arranged at predetermined intervals in the surface XY direction of the pressure-sensitive adhesive sheet 3 of the carrier plate material 1, and the terminal surface 4 a of each semiconductor chip 4 is arranged on the pressure-sensitive adhesive sheet 3. It is assumed to face upward on the opposite side (see FIG. 3B).

  When a large number of semiconductor chips 4 are adhered and arranged on the pressure-sensitive adhesive sheet 3 of the carrier plate 1 in this way, a large number of semiconductor chips 4 are encapsulated with a mold resin 5 such as an epoxy resin, and a resin sealing body having a thickness of 50 μm or more and 2000 μm or less. 6 (see FIG. 3C), the mold resin 5 on the surface of the resin sealing body 6 is ground to expose the terminal surfaces 4a of a large number of semiconductor chips 4 (see FIG. 3D). The terminal surfaces 4a and the like of the large number of semiconductor chips 4 are inspected. A method for grinding the resin sealing body 6 is not particularly limited, and examples thereof include a grinding method using a grindstone that rotates at high speed.

  Subsequently, in order to isolate | separate the carrier board | plate material 1 and the resin sealing body 6, and prevent the distortion | strain of the isolate | separated resin sealing body 6, the back surface which is the adhesion surface of the resin sealing body 6 of the support body 10 for resin sealing bodies is carried out. The adhesive region 12 is adhered (see FIG. 3E). At this time, the plurality of first adhesive regions 13 adhere to each other in the vicinity of the peripheral portion of the adhesive surface of the resin sealing body 6 via a large number of adhesive materials 14, so that the panel plate 11 is attached to the adhesive surface of the resin sealing body 6. Adheres properly without warping.

  When the resin sealing body 6 and the adhesive region 12 of the resin sealing body support 10 are adhered in this manner, thin film rewiring is performed on the terminal surfaces 4a of the many semiconductor chips 4 exposed from the mold resin 5 of the resin sealing body 6. The layer 20 is formed of a photoresist or the like, the solder balls 21 are mounted, the resin sealing body 6 is diced to separate a large number of semiconductor chips 4 (see FIG. 3F), and then the resin sealing body If the supporting body 10 is separated, the thin semiconductor package 22 can be quickly manufactured (see FIG. 3G).

  When dicing the resin sealing body 6, when it is desired to separate the resin sealing body support 10 together with the semiconductor chip 4, the panel plate 11 of the resin sealing body support 10 is preliminarily used as a polyimide resin plate or the like. It ’s fine. On the other hand, when it is desired to reuse the resin-encapsulated support 10 without dicing, the panel plate 11 of the resin-encapsulated support 10 may be placed in advance as a glass plate or a metal plate.

  According to the above, since the pressure-sensitive adhesive sheet 3 of the carrier plate 2 and the pressure-sensitive adhesive region 12 of the resin-encapsulated support 10 are detachable, when separating the carrier plate 2 and the resin-encapsulated support 10, the laser There is no need to irradiate energy such as light. Therefore, an expensive radiating device for energy radiation can be omitted, and the manufacturing equipment can be reduced. Further, since the carrier plate 1 can be reused, the running cost can be reduced. Further, since the resin-encapsulated support 10 can be reused by selecting the material, the running cost can be reduced.

  In addition, since the plurality of first adhesive regions 13 are strongly adhered to each other in the vicinity of the peripheral edge of the resin sealing body 6 via a large number of adhesive materials 14, even if the resin sealing body 6 contracts, the panel plate 11 It is possible to eliminate the possibility that the peripheral edge or the like warps like a bow and causes a decrease in yield. Further, since the panel plate 11 has a size of not less than 300 mm square and not more than 700 mm square, it is possible to manufacture the semiconductor package 22 twice to four times as large as the conventional one.

  Next, FIG. 4 shows a second embodiment of the present invention. In this case, the shape of the adhesive materials 14 and 14A of the adhesive region 12 can be changed as needed, or the first and second The shape of the adhesive regions 13 and 13A is changed.

  Specifically, in the case of FIG. 4A, a large number of adhesive materials 14 are printed and arranged at predetermined intervals in the plurality of first adhesive regions 13, and the adjacent adhesive materials 14 and adhesive materials are arranged. In order to increase the adhesive area of the first adhesive region 13, a narrow pitch is formed, and each adhesive material 14 is printed in a small circle having a thickness of about 10 μm. In addition, a plurality of adhesive materials 14A are printed and arranged at predetermined intervals in the second adhesive region 13A, and a wide pitch is formed between the adjacent adhesive materials 14A and 14A. The adhesive material 14A is printed on a large circle having a thickness of about 10 μm.

In the case of FIG. 4B, the first adhesive region 13 is formed in a single plane substantially frame shape, the hollow at the center thereof defines a plane substantially elliptical shape, and the second adhesive region 13A is a plane. It is formed in an oval shape and is surrounded by the first adhesive region 13.
In the case of FIG.4 (c), the 1st adhesion area | region 13 is formed in the single plane substantially frame shape, and the hollow of the center part divides plane planar rectangle (rectangle), and the 2nd adhesion area | region 13A. Is formed in a plane rectangle (rectangle) and is surrounded by the first adhesive region 13. The other parts are the same as those in the above embodiment, and the description thereof is omitted.

  In this embodiment, the same effects as those of the above embodiment can be expected, and it is obvious that the shapes of the first and second adhesive regions 13 and 13A and the adhesive materials 14 and 14A can be diversified. is there.

  In the above embodiment, the adhesive region 12 is printed on the front surface of the panel board 11, but the adhesive region 12 may be printed on the front and back surfaces of the panel plate 11. Moreover, the panel board 11 does not specifically ask transparency, opaqueness, and translucency. In the above embodiment, the adhesive materials 14 and 14A are screen-printed. However, the present invention is not limited to this, and dispenser coating or gravure printing may be performed. The material, length, shape, and width of the adhesive materials 14 and 14A may be freely changed as necessary.

  Moreover, in the said embodiment, after grind | polishing the mold resin 5 of the resin sealing body 6 surface and exposing the terminal surface 4a of many semiconductor chips 4, the carrier board material 1 and the resin sealing body 6 are isolate | separated, resin Although the support 10 for resin sealing bodies was adhere | attached on the sealing body 6, it is not limited to this at all. For example, after separating the carrier plate material 1 and the resin sealing body 6 and sticking the adhesive region 12 of the resin sealing body support 10 to the back surface of the resin sealing body 6, the mold resin on the surface of the resin sealing body 6 5 may be ground to expose the terminal surfaces 4a of a large number of semiconductor chips 4.

  The support for a resin sealing body and the method for manufacturing a semiconductor package using the same according to the present invention are used in the field of semiconductor manufacturing.

DESCRIPTION OF SYMBOLS 1 Carrier board material 2 Carrier board 3 Adhesive sheet 4 Semiconductor chip 4a Terminal surface 5 Mold resin (resin composition)
6 Resin Encapsulant 10 Resin Encapsulant Support 11 Panel Board (Plate Material)
12 Adhesive Area 13 First Adhesive Area 13A Second Adhesive Area 14 Adhesive Material 14A Adhesive Material 20 Rewiring Layer 21 Solder Ball 22 Semiconductor Package

Claims (7)

A resin sealing body comprising a plate material that supports the resin sealing body, and an adhesive region that is formed on the plate material and is detachably adhered to the resin sealing body, and can be used in a temperature range of -50 ° C to 300 ° C. A support for
A first adhesive region formed on at least the peripheral portion of the opposing surface capable of facing the resin sealing body of the plate material, and a second adhesive region formed other than the region where the first adhesive region is formed A support for a resin-encapsulated body, wherein the adhesive force of the first adhesive region is stronger than the adhesive force of the second adhesive region. The resin sealing body is a sealing body having a size of 300 mm square or more and 500 mm square or less, in which a plurality of semiconductor chips arranged at predetermined intervals are encapsulated with a resin composition,
The support for a resin-sealed body according to claim 1, wherein the plate material is a panel plate having a size of 300 mm square to 700 mm square.   A number of adhesive materials are arranged at predetermined intervals in the first adhesive region, and a plurality of adhesive materials are arranged at predetermined intervals in the second adhesive region. The support for a resin-encapsulated body according to claim 1 or 2, wherein at least one of the adhesive materials in the region is a silicone-based adhesive material.   The first adhesive region of the adhesive region is formed in a plane substantially polygonal shape near each of the four corners of the opposing surface of the plate material, and the second adhesive region is formed other than near the four corner portions of the opposing surface of the plate material. The support body for resin sealing bodies of 1, 2, or 3. A method of manufacturing a semiconductor package in which a large number of semiconductor packages are assembled together with a large panel,
A method for producing a semiconductor package, characterized in that the large-sized panel is the support for a resin sealing body according to any one of claims 1 to 4.   A plurality of semiconductor chips are adhered and arranged on the carrier plate at a predetermined interval, and a terminal surface of each semiconductor chip is faced downward, and a plurality of semiconductor chips are encapsulated with a resin composition to form a resin sealing body. Then, after separating the carrier plate material and the resin sealing body and sticking the adhesive region of the support for the resin sealing body to the non-adhesive surface of the resin sealing body, a plurality of the resin sealing body exposed from the resin composition 6. The method of manufacturing a semiconductor package according to claim 5, wherein a solder ball is mounted by forming a rewiring layer on the terminal surface of the semiconductor chip.   A plurality of semiconductor chips are adhered and arranged on a carrier plate with a predetermined interval, and a terminal surface of each semiconductor chip is faced upward, and a plurality of semiconductor chips are encapsulated with a resin composition to form a resin sealing body. The resin composition of this resin encapsulant is ground to expose the terminal surfaces of a plurality of semiconductor chips, and the carrier plate material and the resin encapsulant are separated to form an adhesive surface on the resin encapsulant for the resin encapsulant. The semiconductor package manufacturing method according to claim 5, wherein after adhering the adhesive region of the support, a rewiring layer is formed on the terminal surfaces of the plurality of semiconductor chips exposed from the resin composition of the resin sealing body, and solder balls are mounted. Method.

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