JP2023005208A - Method for manufacturing chip with protective film - Google Patents

Abstract

To provide a method for manufacturing a chip with a protective film in which a process of manufacturing the chip with the protective film using a wafer can suppress formation of a region with a thickness thickened by flow of a resin film for forming the protective film when the resin film is stuck onto a surface having a projecting electrode of the wafer.SOLUTION: A manufacturing method includes sticking a curable resin film 12 in a sheet 1 for protective film formation onto a surface 9a having a projecting electrode 91 of a wafer 9 while heating the curable resin film under a reduced pressure environment using the sheet 1 for protective film formation having a support sheet 11 and the curable resin film provided on one surface 11a of the support sheet, curing the curable resin film after sticking and thereby forming a protective film 12' on the surface of the wafer, dividing the wafer after the protective film is formed and cutting the protective film, and thereby obtaining a chip 105 with a protective film having a chip 9' and a protective film 120' provided on a surface having the projecting electrode of the chip.SELECTED DRAWING: Figure 6

Description

The present invention relates to a method of manufacturing a chip with a protective film.

Conventionally, when a multi-pin LSI package used for an MPU, a gate array, etc. is mounted on a printed wiring board, a protruding electrode ("bump") made of eutectic solder, high-temperature solder, gold, etc. A flip-chip mounting method in which a chip on which a chip is formed is used, and the protruding electrodes are brought into face-to-face contact with corresponding terminal portions on a chip mounting substrate by a so-called face-down method, and are melted/diffusion bonded. has been adopted.

Chips used in this mounting method are obtained by singulating a wafer having protruding electrodes formed on its circuit surface. In this process, a curable resin film is usually applied to the circuit surface for the purpose of protecting the circuit surface and protruding electrodes of the wafer, and the resin film is cured to form a protective film on the circuit surface. do. The curable resin film is used in the form of a protective film-forming sheet, which is a laminate with a support sheet. In the protective film-forming sheet, a curable resin film is provided on the entire surface of one surface of the support sheet.

As a sheet for forming a protective film having such a structure, a protective tape in which an adhesive layer, a thermoplastic resin layer, and a base film layer are laminated in this order is known (see Patent Document 1). ). The adhesive layer has curability, and the cured product reinforces the protruding electrodes and suppresses breakage. That is, the cured adhesive layer functions as a protective film. The laminate of the thermoplastic resin layer and base film layer functions as a support sheet. Further, Japanese Patent Application Laid-Open No. 2002-200000 discloses that a vacuum pressure laminator is used to apply the protective tape to the surface of the wafer having protruding electrodes.

Japanese Patent No. 6328987

A relatively soft resin film is used for such a curable resin film so that it can be sufficiently adhered to the surface of the wafer having protruding electrodes (circuit surface) when it is attached to the wafer. However, when a curable resin film softened by heating is attached to a wafer, the following problems arise.

When a heated curable resin film is attached to the surface of the wafer having the protruding electrodes, pressure is applied to the curable resin film. The curable resin film is usually used in the form of a protective film-forming sheet that is a laminate with a support sheet, and such pressure is transmitted to the curable resin film via the support sheet. Then, this pressure causes the curable resin film to flow outward in the radial direction of the wafer, that is, from the area where it is attached to the wafer toward the area where it is not attached to the wafer. In the area where the curable resin film is not attached to the wafer, particularly in the area near the wafer, the curable resin film flows in a direction orthogonal to the radial direction of the wafer and from the curable resin film toward the wafer. Therefore, the thickness becomes thicker than the area attached to the wafer.

In this way, the thickened region of the curable resin film is an extra portion, and in the manufacturing process of the chip with the protective film, the side surface of the wafer or the manufacturing equipment of the chip with the protective film remains attached to the parts of the body and contaminates them.

On the other hand, Patent Document 1 does not disclose anything about the flow of the curable resin film (adhesive layer) and the accompanying increase in the thickness of the curable resin film. Therefore, it is not certain whether the protective film forming sheet (protective tape) disclosed in Patent Document 1 can solve such problems.

According to the present invention, in the process of manufacturing a chip with a protective film using a wafer, when a resin film for forming a protective film is attached to the surface of the wafer having protruding electrodes, the flow of the resin film causes the thickness of the film to increase. It is an object of the present invention to provide a method for manufacturing a chip with a protective film, which can suppress the formation of a thickened region.

The present invention employs the following configurations.
[1]. A method for manufacturing a chip with a protective film using a sheet for forming a protective film, wherein the chip with a protective film includes a chip and a protective film provided on a surface of the chip having protruding electrodes, The protective film forming sheet includes a support sheet and a curable resin film provided on one surface of the support sheet, and the curable resin film is attached to the surface of the wafer having the projecting electrodes. a resin film for forming a protective film on the surface of the wafer by curing, the support sheet having, on the one surface thereof, a first region provided with the curable resin film; a second region surrounding the first region and not provided with the curable resin film; A pressure-reduced bonding step of bonding to the surface of the wafer while heating, a curing step of forming a protective film on the surface of the wafer by curing the curable resin film after bonding, and the protective film and a processing step of obtaining the chips with the protective film by dividing the wafer after the formation of and cutting the protective film to obtain the chips with the protective film.
[2]. As the wafer, the area of the surface in a plan view is equal to or larger than the area of the surface of the curable resin film to be attached to the wafer, and in the reduced-pressure attaching step, the curable resin film The method for producing a chip with a protective film according to [1], wherein the entire sticking surface of is stuck to the surface of the wafer.
[3]. In the vacuum bonding step, the upper portion of the protruding electrode is protruded through the curable resin film, or in the processing step, the upper portion of the protruding electrode is protruded through the protective film. The method for manufacturing a chip with a protective film according to [1] or [2].

FIG. 1 is a cross-sectional view for schematically explaining the problem to be solved by the present invention. Of the regions where the curable resin film 62 is not adhered to the wafer 9, a region 622 near the peripheral portion includes a region 621 where the curable resin film 62 is adhered to the wafer 9 and a region 621 where the curable resin film 62 is adhered to the wafer 9. There is usually a region that is cooler than the region 620 near the wafer 9 that is not exposed. This is for the following reasons. That is, the region 621 of the curable resin film 62 attached to the wafer 9 is normally heated by using the heated wafer 9 as a heat source, for example, as described later. This is because the heat easily propagates and the temperature rises, whereas the heat hardly propagates to the region 622 in the vicinity of the peripheral edge, which is far away from the wafer 9 . As a result, the curable resin film 62 tends to flow easily between the region 621 attached to the wafer 9 and the region 620 near the wafer 9 not attached to the wafer 9, whereas the curable resin film 62 In the region 622 near the periphery where the temperature is low, the fluidity is low, and the flowing curable resin film 62 is blocked. Therefore, as described above, the region of the curable resin film 62 not attached to the wafer 9, particularly the region 620 near the wafer 9, is thicker than the region 621 attached to the wafer 9. The phenomenon of thickening becomes remarkable.

In contrast, in the method for manufacturing a chip with a protective film of the present invention, when the curable resin film in the protective film-forming sheet is attached to the surface of the wafer having the projecting electrodes, the curable resin film The area not attached to the wafer can be narrowed or eliminated, and the amount of flowing curable resin film can be reduced. Therefore, formation of a region where the curable resin film is thick can be suppressed. Furthermore, in the region near the periphery of the curable resin film, since there is no region where the temperature is low, the formation of the region where the curable resin film is thick can be suppressed to a greater extent. Furthermore, by attaching the curable resin film to the surface of the wafer having the projecting electrodes in a reduced pressure environment, the effect of suppressing the formation of the thickened area of the curable resin film as described above can be obtained. , significantly higher.

Further, according to the method for manufacturing chips with a protective film of the present invention, the side surface of the wafer or any portion of the device for manufacturing chips with a protective film is not contaminated by adhesion of excess portions of the curable resin film. can be highly suppressed.

FIG. 3 is a cross-sectional view for schematically explaining a problem to be solved by the present invention; 1 is a plan view schematically showing an example of a protective film forming sheet used in a method for manufacturing a chip with a protective film according to one embodiment of the present invention; FIG. FIG. 3 is a cross-sectional view of the protective film forming sheet shown in FIG. 2 taken along line II. FIG. 4 is a plan view schematically showing another example of the protective film forming sheet used in the method for manufacturing a chip with a protective film according to one embodiment of the present invention. FIG. 4 is a plan view schematically showing still another example of the protective film forming sheet used in the method for manufacturing a chip with a protective film according to one embodiment of the present invention. FIG. 2 is a cross-sectional view for schematically explaining an example of a method for manufacturing a chip with a protective film according to one embodiment of the present invention; FIG. 4A is a cross-sectional view for schematically explaining another example of the method for manufacturing a chip with a protective film according to one embodiment of the present invention.

<<Sheet for Forming Protective Film>>
First, a protective film forming sheet used in a method for manufacturing a chip with a protective film according to an embodiment of the present invention will be described.
The protective film forming sheet includes a support sheet and a curable resin film provided on one surface of the support sheet, and the curable resin film is attached to the surface of the wafer having the projecting electrodes. a resin film for forming a protective film on the surface of the wafer by curing and curing the support sheet, the one surface of the support sheet having a first region provided with the curable resin film; , and a second region surrounding the first region and not provided with the curable resin film.
Since the protective film-forming sheet has the first region and the second region in the support sheet, the curable resin film in the protective film-forming sheet serves as the protruding electrode of the wafer. When affixed to the surface having the curable resin film, it is possible to suppress the formation of a thickened region that is not affixed to the wafer of the curable resin film. On the other hand, the aforementioned Patent Document 1 does not disclose at all that the first region and the second region are present in the support sheet.
Hereinafter, the protective film-forming sheet will be described with reference to the drawings.

FIG. 2 is a plan view schematically showing an example of the protective film-forming sheet, and FIG. 3 is a cross-sectional view of the protective film-forming sheet shown in FIG. 2 taken along line II.
In the drawings used in the following description, in order to make it easier to understand the features of the present invention, there are cases where the main parts are enlarged for convenience, and the dimensional ratio of each component is the same as the actual one. Not necessarily.
In the drawings after FIG. 3, the same constituent elements as those shown in already explained figures are denoted by the same reference numerals as in the already explained figures, and detailed explanation thereof will be omitted.

(support sheet)
The protective film forming sheet 1 shown here includes a support sheet 11 and a curable resin film 12 provided on one surface 11 a of the support sheet 11 .
The support sheet 11 surrounds the first region 111a provided with the curable resin film 12 and the first region 111a on one surface 11a, that is, the surface on the curable resin film 12 side. and a second region 112a where is not provided. That is, in the support sheet 11 , the entire first region 111 a is covered with the curable resin film 12 , and the entire second region 112 a is not covered with the curable resin film 12 .

The second region 112a on one surface 11a of the support sheet 11 is preferably exposed (exposed surface).

The curable resin film 12 is a resin film for forming a protective film on the surface of the wafer having the protruding electrodes by being adhered to the surface having the protruding electrodes of the wafer and being cured.
As used herein, the term "wafer" refers to elemental semiconductors such as silicon, germanium, and selenium, and compound semiconductors such as GaAs, GaP, InP, CdTe, ZnSe, and SiC. Semiconductor wafers; An insulator wafer made of an insulator can be mentioned.

A circuit is formed on one surface of these wafers, and in this specification, the surface of the wafer on which the circuit is formed is referred to as a "circuit surface". The surface of the wafer opposite to the circuit surface is called the "back surface". The surface of the wafer having protruding electrodes and the circuit surface are synonymous.
The wafer is divided into chips by means of dicing or the like. In this specification, as in the case of a wafer, the side of the chip on which the circuit is formed is called the "circuit side", and the side opposite to the circuit side of the chip is called the "back side".
Protrusive electrodes such as bumps and pillars are provided on both the circuit surface of the wafer and the circuit surface of the chip. The projecting electrodes are preferably made of solder.

The support sheet 11 supports the curable resin film 12 . As the support sheet 11, more specifically, for example, a sheet consisting only of a base material having such a support function; a release film; mentioned. The adhesive sheet may be attached to a jig such as a ring frame at its peripheral portion. Moreover, since the support sheet 11 is the release film, it may be easier to manufacture a protective film-forming sheet as described later.

The planar shape of the support sheet 11, that is, the shape of the one surface 11a is circular. For example, when the support sheet 11 is a pressure-sensitive adhesive sheet or, as will be described later, has a jig adhesive layer along its outer periphery, the planar shape of the support sheet 11 is circular. is particularly preferred. The reason for this is that the planar shape of the support sheet 11 is a shape that matches the inner circumference of a jig such as a ring frame, which is usually circular, so that the support sheet 11 is attached to a jig such as a ring frame. This is because there is no need to cut the

(Curable resin film)
The planar shape of the curable resin film 12, that is, the shape of the surface 12a opposite to the support sheet 11 (in other words, the surface of the curable resin film 12 attached to the wafer) is circular. The wafer may be provided with an orientation flat or a notch for recognizing or aligning the crystal orientation, and the shape of the wafer may not be a perfect circle. It can be made into the plane shape which united.

When the protective film forming sheet 1 is viewed from above on the curable resin film 12 side in plan view, the centers of the supporting sheet 11 and the curable resin film 12 are aligned and concentrically arranged. are placed.
The maximum width of the support sheet ₁₁ , that is, the diameter D11, is larger than the maximum width of the curable resin film ₁₂ , that is, the diameter D12.

The planar shape and size of the first region 111a of the support sheet 11 are the same as the planar shape and size of the curable resin film ₁₂ , and are circular with a diameter D12.
The planar shape of the second region 112a of the support sheet 11 is a ring with a width of (D ₁₁ -D ₁₂ )/2.

The area of the surface 12a of the curable resin film 12 opposite to the support sheet 11 side (the area of the first region 111a of the support sheet 11) is the area of the circuit surface of the wafer to which the curable resin film 12 is attached ( It is preferably equal to or less than the area of the surface of the wafer having the protruding electrodes in a plan view). By selecting such a curable resin film 12, when the curable resin film 12 in the protective film forming sheet 1 is adhered to the surface of the wafer having the projecting electrodes, the second region 112a of the support sheet 11 can be obtained. The upward protrusion amount of the curable resin film 12 can be further reduced. As a result, it is possible to further suppress the formation of thick regions of the curable resin film 12 that are not attached to the wafer.

The maximum width (diameter) D12 of the curable resin film ₁₂ is preferably equal to or less than the maximum diameter (for example, diameter) of the wafer to which the curable resin film 12 is attached.
Wafers having a circular planar shape include, for example, those having diameters of 6 inches, 8 inches, 12 inches and 18 inches. A preferable curable resin film ₁₂ to which any one of these wafers is attached is, for example, a maximum width (diameter) D12 of 140 to 150 mm, 190 to 200 mm, 290 to 300 mm, or 440 mm. ~450 mm.

On the one surface 11a of the support sheet 11, the width of the second region 112a ((D ₁₁ −D ₁₂ )/2) is 0 with respect to the maximum width (D ₁₂ ) of the first region 111a. It is preferably 0.05 to 0.4 times, more preferably 0.07 to 0.3 times. Since the width of the second region 112a is equal to or greater than the lower limit value, when the support sheet 11 is an adhesive sheet or has the jig adhesive layer, the support sheet 11 can be used as a ring frame or the like. can reduce the possibility of the curable resin film 12 coming into contact with the jig. Since the width of the second region 112a is equal to or less than the upper limit value, it is possible to prevent the area of the second region 112a from becoming excessively wide.

On the surface of the wafer to which the curable resin film 12 is to be attached, the surface having the protruding electrodes is formed with grooves that serve as wafer division points when the wafer is divided into individual chips. good too. That is, the curable resin film 12 is adhered to the surface of the wafer which has the protruding electrodes and is formed with grooves to be divided into the wafer. It may be a resin film for forming a protective film on the surface.
The grooves are formed on the surface of the wafer having protruding electrodes in a form corresponding to the size and shape of the intended chip.

For example, by grinding the surface (back surface) opposite to the surface of the wafer having the grooves formed on the surface having the protruding electrodes until the grooves appear, the wafer is divided at the grooves. You get good chips. At this time, the groove is filled with the curable resin film 12 by attaching the curable resin film 12, and as a result, when the groove is filled with the cured product of the curable resin film 12, that is, the protective film, the chip is removed. After obtaining, by cutting the protective film between the chips, the chip is obtained as a chip with a protective film having a protective film not only on the surface having the protruding electrodes but also on four side surfaces thereof. . A chip whose side surface is also protected in this way can obtain a higher protective effect due to the protective film.

The support sheet 11 and the curable resin film 12 may each consist of one layer (single layer), or may consist of two or more layers. When the support sheet 11 or the curable resin film 12 consists of multiple layers, these multiple layers may be the same or different, and the combination of these multiple layers is not particularly limited.

In the present specification, not only in the case of the support sheet 11 and the curable resin film 12, "the plurality of layers may be the same or different" means "all the layers may be the same, All of the layers may be different, or only some of the layers may be the same." means that one is different from the other.

The thickness T12 of the curable resin film ₁₂ is not particularly limited, but is preferably 10 μm or more, more preferably 20 μm or more, and even more preferably 25 μm or more. Since T12 is a certain value or more in this way, when the curable resin film ₁₂ is attached to the surface of the wafer having the protruding electrodes and the grooves formed, the grooves are filled with the curable resin. The film 12 can be filled to a higher degree without gaps. In addition, the base portions of the protruding electrodes of the wafer near the circuit surface can be covered more highly without gaps. That is, the curable resin film 12 is more advantageous in that it fills the grooves and covers the bases of the projecting electrodes.

The upper limit of the thickness T12 of the curable resin film ₁₂ is not particularly limited. For example, in terms of avoiding an excessive thickness of the curable resin film ₁₂ , T12 is preferably 200 μm or less, more preferably 130 μm or less, and even more preferably 80 μm or less.

As used herein, the term "thickness of the curable resin film" means the thickness of the entire curable resin film. means the total thickness of all layers

In the protective film forming sheet 1, strain is generated in a test piece of the curable resin film 12 having a diameter of 25 mm and a thickness of 1 mm under conditions of a temperature of 90° C. and a frequency of 1 Hz, and the storage elastic modulus of the test piece is measured. Then, when the storage elastic modulus of the test piece when the strain of the test piece is 1% is Gc1, and the storage elastic modulus of the test piece when the strain of the test piece is 300% is Gc300, the following formula :
X=Gc1/Gc300
The X value calculated by is preferably 19 or more and less than 10,000. When such a curable resin film 12 is attached to the surface of the wafer having the protruding electrodes while being heated, the protruding electrodes easily penetrate the curable resin film 12, and the upper portions of the protruding electrodes are curable. It easily protrudes from the resin film 12 . In addition, such a curable resin film 12 is soft and suitable for sticking to a sticking object having an uneven surface, such as a wafer having protruding electrodes and a wafer having the grooves.

The test piece is film-shaped and has a circular planar shape.
The test piece may be a single-layer curable resin film 12 with a thickness of 1 mm. It is preferable that the laminated film is composed of
The thicknesses of the plurality of single-layer curable resin films 12 constituting the laminated film may all be the same, all may be different, or only some may be the same, It is preferable that they are all the same from the viewpoint of ease of production.

In the present specification, not only the Gc1 and Gc300, but also the "storage modulus of the test piece" means "a test piece of a curable resin film having a diameter of 25 mm and a thickness of 1 mm under conditions of a temperature of 90°C and a frequency of 1 Hz. is the storage elastic modulus of the test piece corresponding to this strain when a strain is generated.

When the curable resin film 12 is attached to the surface of the wafer having the protruding electrodes, it is preferable that the upper portions of the protruding electrodes penetrate the curable resin film 12 and protrude. The curable resin film 12 spreads between the protruding electrodes so as to cover the protruding electrodes, adheres closely to the surface of the wafer having the protruding electrodes, and covers the surface of the protruding electrodes, particularly the protruding electrodes of the wafer. The base of the protruding electrode is embedded by covering the surface in the vicinity of the surface having the protruding electrode. In this state, if the remaining of the curable resin film 12 is suppressed on the upper part including the top of the protruding electrode, the protective film 12', which is a cured product of the curable resin film 12, naturally adheres. suppressed by

The X value is preferably 5,000 or less, more preferably 2,000 or less, and further preferably 1,000 or less in order to increase the effect of the curable resin film 12 covering the base of the projecting electrode. It is preferably 500 or less, particularly preferably 500 or less, and may be, for example, any of 300 or less, 100 or less, and 70 or less.
The X value is 25 or more in terms of the effect of suppressing the remaining of the curable resin film 12 and the effect of sufficiently filling the groove with the curable resin film 12 above the protruding electrodes. is preferably 30 or more, more preferably 40 or more, particularly preferably 50 or more, and may be, for example, 60 or more.

^In the curable resin film ¹² , ^Gc1 is not particularly limited. It is more preferably 10 ⁵ Pa, and even more preferably 5×10 ⁴ to 5×10 ⁵ Pa.

In the curable resin film 12, Gc300 is not particularly limited, but Gc300 is preferably less than 15,000 Pa, and is 10,000 Pa or less in terms of increasing the effect of sufficiently filling the grooves with the curable resin film 12. It is more preferably 5000 Pa or less, particularly preferably 4000 Pa or less, and may be, for example, 3500 Pa or less.
Gc300 is preferably 100 Pa or more, more preferably 500 Pa or more, and even more preferably 1000 Pa or more, in order to increase the effect of the curable resin film 12 covering the base of the projecting electrode. .

In the curable resin film 12, both Gc1 and Gc300 preferably satisfy any of the numerical ranges described above.

The storage elastic modulus of the curable resin film 12 is not limited to Gc1 and Gc300, and can be adjusted, for example, by adjusting the components contained in the curable resin film 12 and their contents. More specifically, for example, by using polyvinyl acetal as the polymer component (A) or the polymer (b) having no energy ray-curable group, which will be described later, the Gc300 is adjusted to an appropriate value, and X It becomes easier to adjust the value to an appropriate value. Further, by adjusting the type or content of additive (I) described later, it becomes easier to adjust the Gc1 to an appropriate value and adjust the X value to an appropriate value. In addition, by increasing the content of one or both of the filler (D) and the additive (I) described later, Gc1 can be easily adjusted to a large value, and as a result, the X value can be adjusted to a large value. easy.
Components contained in the curable resin film 12 will be described separately.

(Structure of Protective Film Forming Sheet)
Although the thickness of the support sheet 11 is not particularly limited, it is preferably 50 to 850 μm, more preferably 75 to 700 μm. When the thickness of the support sheet 11 is equal to or greater than the lower limit value, the strength of the support sheet 11 becomes higher. When the thickness of the support sheet 11 is equal to or less than the upper limit, the flexibility of the support sheet 11 is improved, and the handleability is further improved.

As used herein, the term "thickness of the support sheet" means the thickness of the entire support sheet. means

FIG. 4 is a plan view schematically showing another example of the protective film forming sheet.
The protective film forming sheet 2 shown here includes a support sheet 21 and a curable resin film 12 provided on one surface 21 a of the support sheet 21 .

The support sheet 21 is long and strip-shaped, and a plurality of curable resin films 12 are arranged in a line in the longitudinal direction. The support sheet 21 is the same as the support sheet 11 in the protective film-forming sheet 1 shown in FIGS. 2 and 3, except that the shape and size in plan view are different. For example, the thickness of the support sheet 21 is the same as the thickness of the support sheet 11 .
The protective film forming sheet 2 includes a supporting sheet 21 in place of the supporting sheet 11, and the protective film forming sheet 1 shown in FIGS. is the same as

The protective film-forming sheet 2 is suitable for continuously attaching the curable resin film 12 to the surfaces of a plurality of wafers having protruding electrodes.

One surface 21a of the support sheet 21, that is, the surface on the side of the curable resin film 12, includes a plurality of first regions 211a provided with the curable resin film 12, and surrounding the first regions 211a. and a second region 212a where the flexible resin film 12 is not provided. That is, in the support sheet 21 , the entire first regions 211 a are covered with the curable resin film 12 , and the entire second regions 112 a are not covered with the curable resin film 12 .
The second region 212a on one surface 21a of the support sheet 21 is preferably exposed (exposed surface).

The planar shape of the support sheet 21, that is, the shape of the one surface 21a is rectangular, preferably strip-shaped.
When the protective film forming sheet 2 is viewed from above on the curable resin film 12 side in plan view, all the curable resin films 12 are provided on the support sheet 21 at regular intervals.
All the curable resin films 12 in the protective film forming sheet 2 have the same shape and size. All the curable resin films 12 are arranged in the same position in the width direction of the protective film-forming sheet 2 (direction perpendicular to the longitudinal direction), and are located in the middle of the protective film-forming sheet 2 in the width direction. match the position.
The maximum width D21 of the support sheet ₂₁ is larger than the maximum width D12 of the curable resin film ₁₂ , that is, the diameter D12. Here, since the width of the support sheet 21 is constant in the longitudinal direction of the support sheet 21 , the maximum width of the support sheet 21 simply means the width of the support sheet 21 .

The planar shape and size of the first region 211a of the support sheet 21 are the same as the planar shape and size of the curable resin film ₁₂ , and are circular with a diameter D12.
The planar shape of the second region 212a of the support sheet 21 is a shape in which a plurality of circles with a diameter D of ₁₂ are removed in a line from a rectangle.

On the one surface 21a of the support sheet 21, the minimum value of the line segment connecting one point on the outer periphery of the first region 211a and _one point on the outer periphery of the support sheet 21 is defined as L1, and two adjacent curability When the distance between the resin films 12 is L ₂ , the smaller value of L ₁ and L ₂ /2 is 0.03 to 0.03 with respect to the maximum width (D ₁₂ ) of the first region 211a. 0.25 times is preferable, and 0.05 to 0.2 times is more preferable. The value may be appropriately adjusted, for example, according to the specifications of an apparatus for continuously applying the curable resin film 12 to the surfaces of a plurality of wafers having protruding electrodes. Here, the case where L ₁ is equal to (D ₂₁ −D ₁₂ )/2 is shown, but the formula expressing L ₁ is the arrangement position of the first region 211a on the one surface 21a of the support sheet 21, It depends on the size of the first area 211a.

The protective film-forming sheet is not limited to those shown in FIGS. 2 to 4, and may be those shown in FIGS.
For example, in the protective film forming sheet 1 shown in FIG. 2, as shown in FIG. , a band-shaped (in this case, annular) jig adhesive layer 13 may be provided. The jig adhesive layer 13 is a layer for fixing the protective film forming sheet 1 to a jig such as a ring frame.
Similarly, also in the protective film forming sheet 2 shown in FIG. A ring-shaped jig adhesive layer surrounding the first region 211a may be provided.

For example, in the protective film forming sheet 1 shown in FIG. 2, when the support sheet 11 is an adhesive sheet, a jig adhesive layer (for example, the jig shown in FIG. 5) is further formed on the adhesive layer of the adhesive sheet. An instrument adhesive layer 13) may be provided.

For example, in the protective film forming sheet 1 shown in FIG. 2 and the protective film forming sheet 2 shown in FIG. 4, the planar shape of the curable resin film 12 is circular. , and may be non-circular such as square.

For example, in the protective film forming sheet 2 shown in FIG. may not be the same in shape and size. Moreover, in the width direction of the protective film forming sheet 2 , the arrangement positions of some or all of the curable resin films 12 may not be the same.

For example, in the protective film forming sheet 2 shown in FIG. 4, the number of the curable resin films 12 is three or more, but the number of the curable resin films 12 is not limited to this.

For example, in the protective film forming sheet 1 shown in FIG. 2 or the protective film forming sheet 2 shown in FIG. A support sheet may be provided on the opposite side 12a). For example, in the protective film forming sheet 2 shown in FIG. 4, the support sheet 11 shown in FIG. good too. In this case, the support sheet 21 is a release film, and the support sheet 11 is an adhesive sheet or a support sheet having the jig adhesive layer (for example, the jig adhesive layer 13 shown in FIG. 5). is preferred. By using the protective film forming sheet of such a form, continuous supply of the protective film forming sheet 1 shown in FIG. 2 is facilitated. In the protective film forming sheet having such a configuration, both the support sheet 11 and the support sheet 21 have a second region where the curable resin film 12 is not provided. However, the support sheet 11 normally functions as a support sheet having the effects of the present invention.

(Constituent material of curable resin film)
The curable resin film constituting the protective film-forming sheet may be either thermosetting or energy ray-curable, or may have both thermosetting and energy ray-curable properties. good.

As used herein, the term "energy ray" means an electromagnetic wave or charged particle beam that has energy quanta. Examples of energy rays include ultraviolet rays, radiation, electron beams, and the like. Ultraviolet rays can be applied by using, for example, a high-pressure mercury lamp, a fusion lamp, a xenon lamp, a black light, an LED lamp, or the like as an ultraviolet light source. The electron beam can be generated by an electron beam accelerator or the like.
As used herein, "energy ray-curable" means the property of being cured by irradiation with an energy ray.

The curable resin film can be formed using a curable resin film-forming composition containing the constituent materials. For example, the curable resin film can be formed by applying the curable resin film-forming composition to the surface to be formed, and drying if necessary. In the curable resin film-forming composition, the content ratio of the components that do not vaporize at room temperature is usually the same as the content ratio of the components in the curable resin film. As used herein, the term "ordinary temperature" means a temperature that is not particularly cooled or heated, that is, a normal temperature.

The coating of the curable resin film-forming composition may be performed by a known method, for example, air knife coater, blade coater, bar coater, gravure coater, roll coater, roll knife coater, curtain coater, die coater, A method using various coaters such as a knife coater, a screen coater, a Meyer bar coater and a kiss coater can be used.

Drying conditions for the curable resin film-forming composition are not particularly limited, regardless of whether the curable resin film is thermosetting or energy ray-curable. However, when the curable resin film-forming composition contains a solvent, which will be described later, it is preferable to heat and dry the composition. The solvent-containing curable resin film-forming composition is preferably dried by heating, for example, at 70 to 130° C. for 10 seconds to 5 minutes. However, the thermosetting resin film-forming composition is preferably dried by heating so that the composition itself and the thermosetting resin film formed from the composition are not thermally cured.

Examples of thermosetting resin films include those containing a polymer component (A) and a thermosetting component (B).
Examples of the thermosetting resin film-forming composition include a thermosetting resin film-forming composition (III) containing a polymer component (A) and a thermosetting component (B) (this specification may be simply referred to as "composition (III)").

The polymer component (A) is preferably polyvinyl acetal from the viewpoint of facilitating the adjustment of the above Gc300 to an appropriate value and the X value to an appropriate value.
Examples of the polyvinyl acetal in the polymer component (A) include known ones. Among them, preferred polyvinyl acetals include, for example, polyvinyl formal and polyvinyl butyral, with polyvinyl butyral being more preferred.

Examples of the thermosetting component (B) include epoxy thermosetting resins composed of an epoxy resin (B1) and a thermosetting agent (B2); polyimide resins; and unsaturated polyester resins.

The thermosetting resin film and the composition (III) may further contain other components that are neither the polymer component (A) nor the thermosetting component (B).
Examples of the other components include a curing accelerator (C), a filler (D), a coupling agent (E), a cross-linking agent (F), an energy ray-curable resin (G), a photopolymerization initiator (H ), additive (I), solvent, and the like.

By adjusting the content of the filler (D), the X value can be adjusted more easily.
The filler (D) may be either an organic filler or an inorganic filler, but is preferably an inorganic filler. Preferable inorganic fillers include, for example, powders of silica, alumina, talc, calcium carbonate, titanium white, iron oxide, silicon carbide, boron nitride; beads obtained by spheroidizing these inorganic fillers; and surface modification of these inorganic fillers. products; single crystal fibers of these inorganic fillers; glass fibers and the like.
Among these, the inorganic filler is preferably silica or alumina.

From the viewpoint of further improving the filling property of the thermosetting resin film into the grooves of the wafer, in the thermosetting resin film and the composition (III), the filler (D ) is preferably 5 to 45% by mass, more preferably 5 to 40% by mass, even more preferably 5 to 30% by mass.

Examples of the additive (I) include colorants, plasticizers, antistatic agents, antioxidants, gettering agents, rheology control agents, surfactants, and silicone oils.
Additives (I) that are preferable in that the above-mentioned Gc1 can be adjusted appropriately and the X value can be easily adjusted include, for example, rheology control agents, surfactants, silicone oils, and the like.

More specifically, examples of the rheology control agent include polyhydroxycarboxylic acid esters, polyvalent carboxylic acids, and polyamide resins.
Examples of the surfactant include modified siloxane and acrylic polymer.
Examples of the silicone oil include aralkyl-modified silicone oil, modified polydimethylsiloxane, and the like, and the modifying group includes an aralkyl group; a polar group such as a hydroxy group; a group having an unsaturated bond such as a vinyl group and a phenyl group. is mentioned.

From the viewpoint of facilitating the adjustment of the X value, in the thermosetting resin film and the composition (III), the ratio of the content of the additive (I) to the total content of all components other than the solvent is , preferably 0.5 to 10% by mass, more preferably 0.5 to 7% by mass, and even more preferably 0.5 to 5% by mass.

The thermosetting resin film and the polymer component (A) contained in the composition (III), the thermosetting component (B), the curing accelerator (C), the filler (D), the coupling agent (E), Each component such as a cross-linking agent (F), an energy ray-curable resin (G), a photopolymerization initiator (H), an additive (I), a solvent, etc. may be of only one kind, or two kinds thereof. or more, and when there are two or more types, their combination and ratio can be arbitrarily selected.

Examples of the energy ray-curable resin film include those containing the energy ray-curable component (a). The energy ray-curable component (a) is a compound having an energy ray-curable group. Examples of the energy ray-curable group include a functional group having an unsaturated bond between carbon atoms such as a vinyl group, an acryloyl group and a methacryloyl group, and a cationically polymerizable functional group such as an epoxy group and an oxetanyl group. be done.
Examples of the energy ray-curable resin film-forming composition include, for example, the energy ray-curable resin film-forming composition (IV) containing the energy ray-curable component (a) (in the present specification, simply “composition (IV)” may be abbreviated) and the like.

The energy ray-curable resin film and composition (IV) may further contain other components other than the energy ray-curable component (a).
Examples of the other components include a polymer (b) having no energy ray-curable group, a thermosetting component, a filler, a coupling agent, a cross-linking agent, a photopolymerization initiator, an additive, a solvent, and the like. be done.

The polymer (b) having no energy ray-curable group is preferably polyvinyl acetal from the viewpoint of facilitating the adjustment of the above Gc300 to an appropriate value and the X value to an appropriate value.

The energy ray-curable resin film and the thermosetting component, filler, coupling agent, cross-linking agent, photopolymerization initiator, additive and solvent in the composition (IV) are the above-described thermosetting resin film and the Thermosetting component (B), filler (D), coupling agent (E), cross-linking agent (F), photopolymerization initiator (H), additive (I) and solvent in composition (III) belongs to.

Energy ray-curable resin film and energy ray-curable component (a) contained in composition (IV), polymer (b) having no energy ray-curable group, thermosetting component, filler, coupling agent , a cross-linking agent, a photopolymerization initiator, an additive, each component such as a solvent may be only one type, or may be two or more types, and when there are two or more types, a combination thereof and ratio can be selected arbitrarily.

(Layer structure and constituent materials of support sheet)
The support sheet that constitutes the protective film-forming sheet may be a known one.
For example, various resins can be used as the constituent material of the support sheet consisting of only the base material.
Examples of the resin include polyethylene; polyolefins other than polyethylene such as polypropylene; ethylene-based copolymers (copolymers obtained using ethylene as a monomer); vinyl chloride-based resins (using vinyl chloride as a monomer Polystyrene; Polycycloolefin; Polyester; Copolymer of two or more of the above polyesters; Poly(meth)acrylate; Polyurethane; Polyurethane acrylate; polyphenylene oxide; polyphenylene sulfide; polysulfone; polyether ketone;
Examples of the resin include polymer alloys such as mixtures of the polyester and other resins.
Further, as the resin, for example, a crosslinked resin in which one or more of the resins exemplified above are crosslinked; Resins may also be mentioned.

As used herein, "(meth)acrylic acid" is a concept that includes both "acrylic acid" and "methacrylic acid". The same applies to terms similar to (meth)acrylic acid. For example, "(meth)acrylate" is a concept that includes both "acrylate" and "methacrylate."

The number of resins constituting the support sheet consisting of only the base material may be one, or two or more.

From the viewpoint of versatility, in the method for manufacturing a chip with a protective film described later, when the curable resin film provided with the support sheet is thermoset, heat resistance can be imparted to the support sheet. From the viewpoint of easily preventing warpage, the resin is preferably polyester such as polyethylene terephthalate or polybutylene terephthalate; polypropylene or the like. In this case, the support sheet (substrate) may be a single layer as long as it has one or more layers selected from the group consisting of a layer containing polyester and a layer containing polypropylene. However, it may be a multiple layer of two or more layers.

A support sheet consisting of only the substrate and containing a resin can be produced by molding a resin composition containing the resin.

The release film as the support sheet itself is made of a material having releasability, or is provided with an easily peelable layer, so that the curable resin film can be easily peeled off. It may be a release film. The release film is the same as the support sheet consisting only of the base material, except that the release film itself is made of a releasable material or has an easily peelable layer on the base material. you can

Examples of the material having releasability include fluororesin and the like.
Examples of the easily peelable layer include a layer composed of a release agent such as a silicone-based release agent or an alkyd-based release agent.

The pressure-sensitive adhesive sheet as the support sheet usually comprises a film-like or sheet-like base material and an adhesive layer, and furthermore, protruding electrodes are embedded between the base material and the pressure-sensitive adhesive layer. It may have an intermediate layer for
Examples of the base material in the pressure-sensitive adhesive sheet include the same as the support sheet consisting of only the base material.
Examples of the adhesive contained in the adhesive layer in the adhesive sheet include acrylic adhesives, rubber adhesives, urethane adhesives, and the like. The pressure-sensitive adhesive layer may be one whose adhesiveness is reduced by irradiation with energy rays.
Examples of components contained in the intermediate layer in the pressure-sensitive adhesive sheet include cured products of urethane (meth)acrylate compounds, thermoplastic polyolefin resins (thermoplastic resins having structural units derived from olefins), and the like.

When the back surface of the wafer, which will be described later, is ground while the support sheet is attached to the curable resin film, the support sheet preferably has the characteristics required for a backgrinding tape. Further, when the support sheet is removed before the curing step, which will be described later, a separate back grind tape may be attached to the curable resin film when grinding the back surface of the wafer. In this case, the curing step is accompanied by heating of the curable resin film, and the support sheet is deformed by heating, or the support sheet has an adhesive layer, and the adhesive layer is softened by heating. However, since the support sheet is removed before the curing step, problems such as deformation of the support sheet and softening of the pressure-sensitive adhesive layer can be avoided.

The jig adhesive layer may have, for example, a single-layer structure containing an adhesive component, or may contain a sheet serving as a core material and an adhesive component provided on both sides of the sheet. You may have a multi-layer structure with a layer that As the layer containing an adhesive component, the same ones as the adhesive layer in the adhesive sheet can be used.

<<Method for manufacturing sheet for forming protective film>>
The protective film-forming sheet can be produced by sequentially laminating the above-described layers (supporting sheet, curable resin film, jig adhesive layer, etc.) so as to have corresponding positional relationships. The method for forming each layer is as described above. Moreover, the shape of each layer may be adjusted at any timing before or after lamination, as required.

For example, at the time of manufacturing the protective film-forming sheet, the curable resin film-forming composition is applied onto one surface of the support sheet, and if necessary, dried to obtain the curable composition on the support sheet. A flexible resin film can be laminated.
In the production of the protective film-forming sheet, a release film is used as a support sheet, and the curable resin film-forming composition is applied onto one surface (release-treated surface) of the release film, and if necessary By drying accordingly, the curable resin film is formed on the release film to obtain a sheet for forming a protective film. In this way, when the release film is used as the support sheet, after the curable resin film is formed on substantially the entire surface of the release film, the shape (for example, circle) that is the same as the shape assumed as the first region of the release film is formed. It is preferable in that the protective film forming sheet can be easily obtained by cutting the curable resin film into pieces and removing the excess curable resin film so as to form the second region. Further, when a strip-shaped release film is used as the support sheet, the protective film forming sheet 2 shown in FIG. It is preferable in that it is In addition, the exposed surface of the curable resin film of the protective film forming sheet 2 (the surface opposite to the release film side) is attached to the adhesive surface of the support sheet that is an adhesive sheet (for example, the exposed surface of the adhesive layer). After combining, the adhesive sheet is cut into a concentric shape larger than the curable resin film 12, and the excess adhesive sheet is continuously removed, so that the protective film forming sheet 1 shown in FIG. 2 is a strip-shaped release film. It is preferable in that it can be obtained in a state of being continuously provided on the top. In this case, the release film on the curable resin film can be removed when the protective film forming sheet is used.

<<Method for manufacturing chip with protective film>>
Next, a method for manufacturing a chip with a protective film according to one embodiment of the present invention will be described.
The method for manufacturing a chip with a protective film according to the present embodiment includes a reduced-pressure bonding step of bonding the curable resin film in the protective film-forming sheet to the surface of the wafer having protruding electrodes while heating the curable resin film in the protective film-forming sheet in a reduced-pressure environment. and a curing step of forming a protective film on the surface of the wafer by curing the curable resin film after attachment, and dividing the wafer after forming the protective film and cutting the protective film. and a processing step of obtaining a chip with a protective film having the chip and the protective film after cutting provided on the surface of the chip having the protruding electrodes.
According to the method for manufacturing a chip with a protective film of the present embodiment, in the attaching step, it is possible to highly suppress the formation of a thickened region of the curable resin film that is not attached to the wafer. As a result, in the steps after the attaching step, contamination of the side surface of the wafer or any portion of the protective film-attached chip manufacturing apparatus due to adhesion of the excess portion of the curable resin film can be highly suppressed.

FIG. 6 is a cross-sectional view for schematically explaining an example of the method for manufacturing a chip with a protective film according to this embodiment.
Here, the case of using the protective film forming sheet 1 shown in FIGS. 2 and 3 will be described as an example, but the protective film forming sheet 2 shown in FIG. Even when it is used, the gist of the method for manufacturing a chip with a protective film is the same.

(Reduced pressure application process)
In the depressurized attaching step, the curable resin film 12 in the protective film forming sheet 1 is attached to the surface 9a of the wafer 9 having the projecting electrodes 91 under a depressurized environment while being heated. As a result, as shown in FIG. 6(a), the surface 12a of the protective film forming sheet 1 and the curable resin film 12 in the protective film forming sheet 1 opposite to the support sheet 11 side. A wafer 101 with a protective film forming sheet, comprising a wafer 9 provided with a protective film, wherein the bases of protruding electrodes 91 on the wafer 9 near the surface 9a are covered with a curable resin film 12 can get. 6A shows a state in which the top of the projecting electrode 91 is covered with the curable resin film 12, but the top of the projecting electrode 91 is not covered with the curable resin film 12. In FIG. It may be in an exposed state. Further, when the support sheet 11 is a pressure-sensitive adhesive sheet or a support sheet having a jig adhesive layer, the peripheral portion of the support sheet 11 may be attached to a jig (not shown) such as a ring frame. good.

The support sheet 11 in the protective film forming sheet 1 has a second region 112a on one surface 11a. Therefore, when the curable resin film 12 in the protective film forming sheet 1 is attached to the surface 9a having the protruding electrodes of the wafer 9, the area of the curable resin film 12 not attached to the wafer 9 is narrowed. Or it can be eliminated, reducing the amount of flowing curable resin film. In addition, of the regions where the curable resin film 12 is not attached to the wafer 9, the region near the peripheral portion does not become low temperature. As a result, in the vacuum bonding step, the curable resin film 12 receives pressure during bonding in the thickness direction, thereby causing the wafer 9 to move outward in the radial direction (leftward, rightward or leftward and rightward in FIG. 6(a)). direction), that is, from the area attached to the wafer 9 (on the first area 111a of the support sheet 11) toward the area not attached to the wafer 9 (on the second area 112a of the support sheet 11). Even so, it is possible to suppress formation of a region where the curable resin film 12 is thicker on the second region 112 a of the support sheet 11 . Furthermore, by attaching the curable resin film 12 to the surface 9a of the wafer 9 under a reduced pressure environment, the effect of suppressing the formation of the thickened area of the curable resin film 12 as described above can be obtained. , significantly higher. In addition, the hardening resin film 12 can be filled in the base of the protruding electrode 91 to a higher degree without gaps.

A plurality of grooves 90 are formed on the surface 9a of the wafer 9 having the protruding electrodes 91 to serve as division points of the wafer 9 when the wafer 9 is divided into individual chips. In this case, in the depressurized attaching step, part or all of the grooves 90 are filled with the curable resin film 12 when the curable resin film 12 is attached to the surface 9 a of the wafer 9 . FIG. 6A shows a state in which the entire area of the groove 90 is filled with the curable resin film 12 . Furthermore, by attaching the curable resin film 12 to the surface 9a of the wafer 9 under a reduced pressure environment, the grooves 90 can be filled with the curable resin film 12 to a higher degree without gaps.

The grooves 90 can be formed, for example, by forming cuts in the thickness direction of the wafer 9 from the surface 9a of the wafer 9 using a known dicing technique. This technique is sometimes referred to as "half-cutting" in the art. Examples of the dicing method include blade dicing and plasma dicing, and are not particularly limited.

The depth of the groove 90 is not particularly limited as long as it is less than the thickness of the wafer 9, but is preferably 30 to 700 μm, more preferably 60 to 600 μm, even more preferably 100 to 500 μm. . When the depth of the groove 90 is equal to or greater than the lower limit value, the ground surface easily reaches the wafer 9 by grinding the back surface 9b of the wafer 9 in the processing step described later, so that the wafer 9 can be divided more easily. . Since the depth of the groove 90 is equal to or less than the upper limit, the strength of the wafer 9 before grinding becomes higher.

The width of the groove 90 is preferably 10-2000 μm, more preferably 30-1000 μm, even more preferably 40-500 μm, and particularly preferably 50-300 μm. When the width of the groove 90 is equal to or greater than the lower limit value, it becomes easy to prevent chips after singulation from coming into contact with each other due to grinding vibration when grinding the back surface 9b of the wafer 9 in the processing step described later. Since the width of the groove 90 is equal to or less than the upper limit value, the strength of the wafer 9 before grinding becomes higher.

The groove 90 is normally formed in the surface 9 a of the wafer 9 by connecting two points on the outer peripheral portion in a straight line, and the groove 90 is exposed on the outer peripheral surface of the wafer 9 . Therefore, in the reduced-pressure bonding step, the curable resin film 12 not only adheres to the surface 9a of the wafer 9, but also the inside of the groove 90 is decompressed so that the curable resin film 12 is highly gapped by the groove 90. filled without

The height of the projecting electrode 91 is not particularly limited, but is preferably 30 to 300 μm, more preferably 60 to 250 μm, even more preferably 80 to 200 μm. When the height of the protruding electrode 91 is equal to or higher than the lower limit value, the function of the protruding electrode 91 can be further improved. Since the height of the protruding electrodes 91 is equal to or less than the upper limit value, the protruding electrodes 91 can be easily provided at a high density, and the possibility of damage to the protruding electrodes 91 during handling of the wafer 9 is reduced. can.
In this specification, the "height of the protruding electrodes" means the height of the protruding electrodes at the highest position from the surface of the wafer having the protruding electrodes (circuit surface).

Although the thickness of the wafer 9 is not particularly limited, it is preferably 100 to 1000 μm, more preferably 200 to 900 μm, even more preferably 300 to 800 μm. When the thickness of the wafer 9 is equal to or greater than the lower limit value, it becomes easy to suppress warpage due to shrinkage of the curable resin film 12 during curing. Since the thickness of the wafer 9 is equal to or less than the upper limit value, it is possible to reduce the grinding amount of the back surface 9b of the wafer 9 and shorten the time required for grinding in the later-described processing steps.

In the reduced-pressure application step, after placing the wafer 9 and the protective film forming sheet 1 in a reduced-pressure environment, application of the curable resin film 12 to the surface 9a of the wafer 9 is started. It is preferable to maintain the reduced pressure environment until the bonding of the curable resin film 12 to the wafer 9 is completed.

The pressure (degree of vacuum) in the reduced pressure environment is preferably 10 kPa or less, more preferably 1 kPa or less, and even more preferably 0.5 kPa or less. When the pressure is equal to or less than the upper limit value, the effect obtained by reducing the pressure, that is, the effect of suppressing the formation of a thickened region of the curable resin film 12 that is not attached to the wafer. , higher. Furthermore, the effect of filling the base of the protruding electrode 91 and the groove 90 with the curable resin film 12 without gaps is further enhanced.

The lower limit of the pressure in the reduced pressure environment is not particularly limited. The pressure is preferably 0.01 kPa or higher, more preferably 0.03 kPa or higher, and even more preferably 0.05 kPa or higher, in order to more easily realize a reduced pressure environment.

The heating of the curable resin film 12 when the curable resin film 12 is attached to the surface 9a of the wafer 9 while being heated can be performed by a known method. For example, the wafer may be heated by increasing the temperature of the table on which the wafer is placed, and the curable resin film 12 may be heated using the heated wafer as a heat source.

The temperature (heating temperature) of the curable resin film 12 when the curable resin film 12 is attached to the surface 9a of the wafer 9 while being heated is not particularly limited, but is preferably 50 to 150°C. , 60 to 130°C, more preferably 70 to 110°C. When the temperature is equal to or higher than the lower limit, the curable resin film 12 can be filled in the bases of the protruding electrodes 91 and the grooves 90 to a higher degree without gaps. When the temperature is equal to or lower than the upper limit, it is possible to suppress problems caused when the fluidity of the curable resin film 12 is too high.

The pressure applied to the curable resin film 12 (applied pressure in the thickness direction of the wafer 9) when the curable resin film 12 is attached to the surface 9a of the wafer 9 while being heated is not particularly limited. It is preferably 0.1 kPa to 1.5 MPa, more preferably 0.1 MPa to 1 MPa. When the pressure is equal to or higher than the lower limit, the grooves 90 of the wafer 9 can be filled with the curable resin film 12 to a higher degree without gaps. Since the pressure is equal to or less than the upper limit, breakage of the wafer 9 can be highly suppressed.

In the reduced-pressure attachment step, for example, the space facing the surface of the protective film forming sheet 1 on which the curable resin film 12 is provided, that is, the surface to be attached to the wafer 9, is decompressed, and , the surface of the protective film forming sheet 1 opposite to the side on which the curable resin film 12 is provided is set to atmospheric pressure or pressurized, so that the protective film forming sheet 1 is a wafer. 9 is adsorbed and attached. In this manner, it is preferable to apply the curable resin films 12 sequentially radially from the central portion of the surface 9a of the wafer 9 toward the outer peripheral portion. By sticking the curable resin film 12 under a reduced pressure environment in this way, the curable resin film 12 being stuck has a central portion (a portion corresponding to the central portion of the surface 9a of the wafer 9) to the outer peripheral side. The application pressure is evenly applied to the equidistant sites.
In the reduced-pressure application step, the use of the protective film forming sheet 1 itself has the effect of suppressing the formation of thickened regions of the curable resin film 12 that are not adhered to the wafer. Furthermore, even if the curable resin film 12 protrudes onto the second region 112a of the support sheet 11 by uniformly applying the sticking pressure to the curable resin film 12 in this way, typically the wafer Since the curable resin film 12 protrudes over the entire area along the outer periphery of the wafer 9, the amount of protrusion of the curable resin film 12 is dispersed over the entire area along the outer periphery of the wafer 9. As a result, the curable resin film 12 The amount of protrusion of is reduced.
Thus, in the reduced-pressure application step, the region where the thickness of the curable resin film 12 is thickened due to the use of the protective film forming sheet 1 and the application of the curable resin film 12 under a reduced pressure environment. The effect of suppressing the formation of is remarkably enhanced.

On the other hand, when the curable resin film 12 is adhered to the surface 9a of the wafer 9 while being heated, the surface 9a of the wafer 9 is stretched from one end to this end using only roller pressure. When the curable resin film 12 is successively attached linearly toward the end on the opposite side across the center, the curable resin film 12 extends from the area where the curable resin film is attached to the wafer to the area where the curable resin film is not attached to the wafer. , and the flow direction of the curable resin film is biased toward the direction of travel of the roller. Therefore, the area of the curable resin film that is not attached to the wafer tends to be thicker than the area that is attached to the wafer.

In the depressurized pasting step, when the curable resin film 12 is pasted from the central portion to the outer peripheral portion of the surface 9a of the wafer 9, not only the protective film forming sheet 1 itself is adhered by suction, but also a diaphragm or the like is adhered. The protective film forming sheet 1 may be adhered to the wafer 9 by the pressing means. For example, a sheet sticking apparatus includes a table that supports a plate-like member, and a pressing member that applies a pressing force to a sheet arranged along the plate-like member, wherein the pressing member The central portion is composed of a pressing surface provided in an inclined or curved shape that is closer to the plate-shaped member than the outer peripheral side, and a deformation-allowing portion continuously provided on the outer peripheral side of the pressing surface, and the deformation By deforming the allowance portion with respect to its initial shape, the pressing surface is brought closer to the sheet, and by deforming the pressing surface so as to be substantially parallel to the plate-like member, the pressing member A sheet sticking device can be used that sticks the sheet to the plate-like member from the central portion toward the outer periphery. As such a sheet sticking device, for example, there is a device disclosed in Japanese Unexamined Patent Application Publication No. 2008-66597.

As for the wafer 9, the area of the surface 9a having the protruding electrodes 91 when viewed from above (that is, the area of the surface 9a in plan view) is the same as the support sheet 11 side of the curable resin film 12. is equal to or greater than the area of the opposite surface 12a (that is, the area of the surface of the curable resin film 12 attached to the wafer 9).
In the vacuum bonding step, it is preferable to use such a wafer 9 and bond the entire surface 12a (surface to be bonded to the wafer 9) of the curable resin film 12 to the surface 9a of the wafer 9. .
Since the entire surface 12a of the curable resin film 12 is covered with the surface 9a of the wafer 9 in this manner, the amount of protrusion of the curable resin film 12 onto the second region 112a of the support sheet 11 can be further reduced. As a result, it is possible to further suppress the formation of thick regions of the curable resin film 12 that are not attached to the wafer.

In this way, in terms of further suppressing the formation of the thickened region of the curable resin film 12, the combination of the curable resin film 12 and the wafer 9, which is suitable for use in the vacuum bonding step, is, for example, a combination of a curable resin film ₁₂ having a maximum width (diameter) D12 of 140 to 150 mm and a wafer ₉ having a standard diameter of 6 inches; A combination of a curable resin film ₁₂ having a diameter of 200 mm and a wafer 9 having a standard diameter of 8 inches; Combination with wafer 9: A combination of a curable resin film ₁₂ having a maximum width (diameter) D12 of 440 to 450 mm and a wafer 9 having a standard diameter of 18 inches can be mentioned.

(Curing process)
In the curing step, by curing the curable resin film 12 after being attached to the wafer 9, a protective film 12' is formed on the surface 9a of the wafer 9 as shown in FIG. 6(b). As a result, a protective film-attached wafer 102 including the wafer 9 and the protective film 12' provided on the surface 9a of the wafer 9 having the projecting electrodes 91 is obtained. The protective film 12 ′ in the protective film-attached wafer 102 further has a support sheet 11 on the surface 12 b ′ opposite to the wafer 9 side. In FIG. 6B, reference numeral 12a' denotes the surface of the protective film 12' opposite to the support sheet 11 side.

In the protective film-attached wafer 102, formation of a region where the protective film 12' is thickened is remarkably suppressed. Furthermore, the base of the protruding electrode 91 is filled with the protective film 12' to a higher degree without gaps. Furthermore, the grooves 90 are also filled with the protective film 12' to a higher degree without gaps.

Curing of the curable resin film 12 may be performed by a known method according to the properties of the curable resin film 12 . For example, when the curable resin film 12 is thermosetting, the curable resin film 12 is cured by heating, and when the curable resin film 12 is energy ray-curable, the curable resin film 12 is cured by irradiating, for example, ultraviolet rays as energy rays.

When the curable resin film 12 is thermally cured, the heating temperature is preferably 100 to 200.degree. C., more preferably 120 to 150.degree. The heating time is preferably 0.5 to 5 hours, more preferably 1 to 3 hours.
When the curable resin film 12 is cured with ultraviolet rays, the illuminance of ultraviolet rays is preferably 180 to 280 mW/cm ² and the amount of ultraviolet light is preferably 450 to 1000 mJ/cm ² .

A chip with a protective film, which is finally obtained using the curable resin film 12 and will be described later, is flip-chip connected to connection pads on the circuit board at the tops of protruding electrodes 91 therein. In the manufacturing method, the curing step is performed before the processing step described below. As a result, the protruding electrodes 91 can be protected by the protective film 12' even in a process, such as a processing step, which is performed until the chip with the protective film is connected to the circuit board. 3, the curable resin film 12 inside the groove 90 has already been hardened and has become the protective film 12' at the stage of performing the processing process, so that the processing process can be easily performed. Connection to the circuit forming surface of the chip is usually performed after the processing step. Therefore, in the curing step, the curable resin film 12 is cured without joining the projecting electrodes 91 to other electrodes. In this regard, a so-called NCF (Non-Conductive Film) is used in which a curable film is interposed between the chip and the circuit forming surface, the chip is mounted on the circuit forming surface, and then the curable film is cured. The manufacturing method of the semiconductor chip described above and the manufacturing method of this embodiment are essentially completely different.

(Processing process)
In the processing step, the wafer 9 (in the protective film-attached wafer 102) after forming the protective film 12' is divided. As a result, the wafer 9 is singulated into chips 9', and as shown in FIG. ' and the protective film-equipped wafer divided body 103 having the uncut continuous (one piece) protective film 12' provided in the ' is obtained.

The division of the wafer 9 can be performed, for example, by grinding the surface (back surface) 9b of the wafer 9 opposite to the surface 9a having the projecting electrodes 91 using a grinding means such as a grinder. At this time, the wafer 9 is ground from the rear surface 9b of the wafer 9 toward the surface 9a until the ground surface reaches the groove 90 (until the groove 90 appears). By doing so, the thickness of the wafer 9 is reduced, and the wafer 9 is divided using the grooves 90 as division points. The back surface 9b of the wafer 9 is ground until the thickness of the chip 9' reaches a target value.

In the processing step, before cutting the protective film 12', the dicing sheet 8 is attached to the rear surface 9b' of all the chips 9' in the wafer divided body 103 with the protective film, and the protective film 12' is cut. remove the support sheet 11 from the As a result, as shown in FIG. 6(d), the protective film-attached wafer division 103 is provided on one surface of the dicing sheet 8 with the chips 9' therein facing the dicing sheet 8 side. A dicing sheet laminate 104 is obtained.

The dicing sheet 8 may be a known one. Examples of the dicing sheet 8 include a sheet consisting of only a base material; a sheet including a base material and an adhesive layer provided on one surface of the base material. When the dicing sheet 8 having the base material and the adhesive layer is used, the adhesive layer is adhered to the back surface 9b' of the chip 9'.

In this specification, the protective film forming sheet (for example, protective film forming sheet 1 shown in FIGS. 2 to 3, protective film forming sheet 2 shown in FIG. 4) and the dicing sheet (for example, When considering both the dicing sheet 8) shown in FIG. 2 Substrates” to distinguish between these substrates.

Both the second base material and the adhesive layer in the dicing sheet 8 may be known ones.
Examples of the second base material include those similar to those of the first base material.
Examples of the pressure-sensitive adhesive layer include an energy ray-curable or non-curable pressure-sensitive adhesive layer.
As used herein, the term "non-curing" means the property of not being cured by any means such as heating or energy ray irradiation.

When the protective film-attached wafer divisions 103 are held by the support sheet 11 on a jig such as a ring frame, for example, before attaching the dicing sheet 8 to the protective film-attached wafer divisions 103, the wafer with the protection film is held. In the divided body 103, the support sheet 11 may be cut along the outline of the aggregate of the chips 9', that is, along the portion corresponding to the outer circumference of the wafer 9 before division. As a result, the jig and the protective film-attached wafer divided body 103 are separated. If the protective film 12′ does not fit in the shape of the support sheet 11 when the wafer divided body 103 with the protective film is viewed from above the chip 9′ side in a plan view, the protective film 12′ from the support sheet 11 is removed. Cut off the protruding part at the same time. FIG. 6(d) shows the case where the support sheet 11 and protective film 12' are cut in this way.

In the processing step, the surface layer portion of the surface 12b' opposite to the chip 9' side of the protective film 12' is removed by cleaning. As a result, the upper portion of the protruding electrode 91 is protruded (exposed) through the protective film 12'. As shown in FIG. 6A, when the top of the projecting electrode 91 is covered with the curable resin film 12, it is preferable to perform such cleaning. In the reduced-pressure attaching step, unlike the case of FIG. 6A, when the curable resin film 12 is attached to the surface 9a of the wafer 9, the upper portions of the protruding electrodes 91 are simultaneously attached to the curable resin film 12. Cleaning of the surface layer portion of the protective film 12' may not be necessary if it can be made to penetrate and protrude.

The surface layer portion of the surface 12b' of the protective film 12' can be cleaned by a known method such as plasma irradiation.

In the processing step, the protective film 12' is further cut to form a chip 9' and a cut protective film 120' provided on the chip 9' as shown in FIG. 6(e). A plurality of protective film-attached chips 105 are obtained. In this specification, the "protective film after cutting" may be simply referred to as "protective film". More specifically, the protective film 120' after cutting is provided on the surface 9a' having the projecting electrodes 91 of the chip 9'.

The protective film 12' is cut along the outer circumference (in other words, side surface) of the chip 9'. At this time, it is preferable to cut the protective film 12' filled between the adjacent chips 9' along the outer periphery (side surface) of the chips 9' to divide them into two. By doing so, the protective film 120' after cutting is also provided on each side surface of the adjacent chips 9', and for each chip 9', the surface 9a' having the projecting electrodes 91, Since a total of five surfaces including four side surfaces are protected by the protective film 120', a remarkably high protective effect of the protective film 120' can be obtained in the chip 9'.

The protective film 12' can be cut by known methods. For example, a known cutting means such as a dicing blade can be used to cut the protective film 12'.

After the processing step, the obtained chips 105 with protective films are separated from the dicing sheet 8 and picked up.
Chip 105 with a protective film can be picked up by a known method.

When the dicing sheet 8 having the adhesive layer is used, the protective film-attached chip 105 can be separated from the adhesive layer and picked up.
When the adhesive layer is curable, the chip 105 with the protective film can be picked up more easily after the adhesive layer is cured.

So far, in the processing steps, the case where the dicing sheet 8 is used to cut the protective film 12' has been described as an example. may be further protected. In that case, instead of the dicing sheet 8, a protective film forming sheet comprising a support sheet and a protective film forming film for forming a protective film on one surface of the support sheet is used. can be used Here, the support sheet may comprise a substrate and an adhesive layer, and in this case, the protective film-forming film is provided on the surface of the adhesive layer opposite to the substrate side. It is
When the protective film forming sheet is used, the protective film forming film is attached to the rear surface 9b' of the chip 9'.

In this specification, the protective film forming sheet for forming a protective film on the surface of the wafer having the protruding electrodes (for example, the protective film forming sheet 1 shown in FIGS. When considering both the protective film forming sheet 2) shown and the protective film forming sheet provided with the protective film forming film, the protective film for forming the protective film on the surface of the wafer having the protruding electrodes The film-forming sheet is referred to as "first protective film-forming sheet", and the protective film-forming sheet provided with the protective film-forming film is referred to as "second protective film-forming sheet". distinguish between
Furthermore, in this case, the support sheet in the protective film forming sheet for forming the protective film on the surface of the wafer having the protruding electrodes (for example, the support sheet 11 shown in FIGS. 2 to 3, the support sheet 11 shown in FIG. The support sheet 21) is referred to as "first support sheet", and the support sheet among the protective film-forming sheets provided with the protective film-forming film is referred to as "second support sheet" to distinguish between these support sheets. The same applies to the pressure-sensitive adhesive layer provided in the support sheet, the pressure-sensitive adhesive layer in the first support sheet is referred to as the "first pressure-sensitive adhesive layer", and the pressure-sensitive adhesive layer in the second support sheet is referred to as the "second pressure-sensitive adhesive layer." These pressure-sensitive adhesive layers are distinguished by the term "layer".
Furthermore, in this case, a protective film formed from the curable resin film (for example, a protective film 12′ shown in FIG. 6B and the like) is referred to as a “first protective film”, and The formed protective film (for example, the protective film provided on the rear surface 9b' of the chip 9') is referred to as a "second protective film" to distinguish between these protective films.

The second support sheet in the second protective film-forming sheet may be the same as the first support sheet in the first protective film-forming sheet.

The protective film-forming film in the second protective film-forming sheet may be curable or non-curable.
The curable protective film-forming film may be either thermosetting or energy ray-curable, or may have both thermosetting and energy ray-curable properties.
Non-curable overcoat-forming films are considered overcoats after they are applied (formed) to the intended object (ie, wafer).

In the processing step, when the second protective film forming sheet having the curable protective film forming film is used, the second protective film forming sheet (the protective film forming film) is placed on the back surface of the chip 9'. After sticking to 9b', a 2nd protective film can be formed by hardening a protective film formation film at any stage. In addition, the protective film-forming film or the second protective film is cut along the outer periphery of the chip 9' before the chip 105 with the protective film is separated from the second support sheet and picked up.

When the sheet for forming the second protective film is used, the chip 105 with the protective film is further provided with the protective film-forming film after cutting or the second protective film on the rear surface 9b' of the chip 9'. It can be picked up by pulling away from the second support sheet in this state.
When the second support sheet has a curable adhesive layer, the chip 105 with the protective film can be picked up more easily after the adhesive layer is cured.

<Modification>
The method for manufacturing a chip with a protective film according to the present embodiment includes the above-described manufacturing method (hereinafter sometimes referred to as "manufacturing method 1") as long as it includes the vacuum bonding step, the curing step, and the processing step in this order. , and part of the configuration may be changed, deleted, or added in the above-described manufacturing method (manufacturing method 1).

For example, up to this point, in manufacturing method 1, a protective film forming sheet is attached to a wafer having grooves on the surface having protruding electrodes, and the back surface of the wafer is ground to separate the wafer into chips. Although the case has been described, a wafer having no grooves may be used and a dicing blade may be used to cut such a wafer into individual chips by a so-called full cut.
Alternatively, a wafer having no grooves may be used, and a modified layer serving as a starting point for the division may be provided in advance by laser irradiation, and the sheet provided with the wafer may be expanded, or the wafer may be expanded. The wafer may be singulated into chips by utilizing the impact during grinding of the back surface.
In these modified examples, the wafer is divided into chips (individualization) and the protective film is cut at the same time.

Further, in the manufacturing method 1, instead of using a protective film forming sheet prepared in advance in the reduced pressure application step, the step of completing the protective film forming sheet and the reduced pressure application step are continuously performed. may More specifically, in manufacturing method 1, the curable resin film formed on substantially the entire surface of the support sheet is cut into the same shape as the shape assumed for the first region of the support sheet, and the second region is cut. A cutting step of completing the protective film-forming sheet by removing the excess curable resin film so as to generate a cutting step may be provided immediately before the vacuum bonding step. Completion of the protective film forming sheet and application to the wafer can be performed on the same production line by using an apparatus that continuously performs such a cutting process and the vacuum application process.

FIG. 7 is a cross-sectional view for schematically explaining another example of the method for manufacturing a chip with a protective film according to the present embodiment (hereinafter sometimes referred to as "manufacturing method 2"). Manufacturing method 2 described below corresponds to manufacturing method 1 described above with the order of some of the steps changed.

In the manufacturing method 2, first, the vacuum bonding step is performed in the same manner as in the manufacturing method 1, and a wafer 101 with a protective film forming sheet is produced as shown in FIG. 7(a).
Also in the manufacturing method 2, as in the case of the manufacturing method 1, it is possible to suppress the formation of a region where the curable resin film 12 is thicker on the second region 112a of the support sheet 11. FIG.

In the curing step of manufacturing method 2, prior to curing the curable resin film 12, the support sheet 11 and the curable resin film 12 are cut along the outer circumference of the wafer 9 in the wafer 101 with the protective film forming sheet. . When the support sheet 11 is a pressure-sensitive adhesive sheet or a support sheet having a jig adhesive layer, before cutting the support sheet 11 and the curable resin film 12, the peripheral edge of the support sheet 11 is attached to a ring frame or the like. It may be attached to a jig (not shown). Alternatively, the support sheet 11 and the curable resin film 12 may be cut, or the support sheet 11 may be removed from the curable resin film 12 without cutting.

In the curing step of manufacturing method 2, the curable resin film 12 after being attached to the wafer 9 is cured in the same manner as in the curing step of manufacturing method 1, so that, as shown in FIG. A protective film 12 ′ is formed on the surface 9 a of the wafer 9 . As a result, a protective film-attached wafer 102 having the same structure as in the manufacturing method 1 is obtained. However, unlike the manufacturing method 1, the protective film 12' in the protective film-attached wafer 102 further includes the support sheet 11 after cutting on the surface 12b' opposite to the wafer 9 side, Alternatively, the support sheet 11 is not provided. FIG. 7B shows a case where the support sheet 11 is not provided.

In manufacturing method 2, similarly to manufacturing method 1, the curing step is performed before the processing step, that is, before the chip with the protective film is connected to the circuit forming surface of the circuit board, the curable resin film 12 is formed. to cure.

In the processing step of manufacturing method 2, prior to dividing the wafer 9, the surface layer portion of the surface 12b' of the protective film 12' opposite to the wafer 9 side is removed by cleaning. As a result, the upper portion of the protruding electrode 91 is protruded (exposed) through the protective film 12'. Further, a back grind tape 7 different from the support sheet 11 is attached to the surface 12b' of the protective film 12' after cleaning. In manufacturing method 1, since the processing step is performed without removing the support sheet 11 from the wafer 9 on which the protective film 12' is formed (wafer 102 with protective film), cleaning cannot be performed before the wafer 9 is divided. Therefore, in the manufacturing method 2, the thickness of the protective film 12' in the state of the wafer 9 on which the protective film 12' is formed is thinner than the initial thickness due to the cleaning. 103.

In the manufacturing method 2, the surface layer portion of the surface 12b' of the protective film 12' can be cleaned by the same method as in the manufacturing method 1. FIG.
As in the case of manufacturing method 1, in the reduced-pressure attaching step, unlike the case of FIG. If the upper portion of 91 can be protruded through the curable resin film 12, cleaning of the surface layer portion of the protective film 12' may be unnecessary.

In the processing step of manufacturing method 2, the wafer 9 (in the protective film-equipped wafer 102) after forming the protective film 12' is then divided. As a result, the wafer 9 is singulated into chips 9', and as shown in FIG. ' and the protective film-equipped wafer divided body 103' provided with the uncut continuous (one sheet) protective film 12' is obtained.

In the manufacturing method 2, the division of the wafer 9 can be performed in the same manner as in the manufacturing method 1. FIG.

In the processing step of manufacturing method 2, then, prior to cutting the protective film 12', the dicing sheet 8 is attached to the back surface 9b' of all the chips 9' in the wafer divided body 103' with the protective film. Then, the back grind tape 7 is removed from the protective film 12'. As a result, as shown in FIG. 7(d), the protective film-attached wafer division 103' is provided on one surface of the dicing sheet 8 with the chips 9' therein facing the dicing sheet 8 side. A structured dicing sheet laminate 104' is obtained.

In the processing step of manufacturing method 2, the protective film 12' is then cut to obtain a chip 105 with a protective film having the same configuration as in manufacturing method 1, as shown in FIG. 7(e).

In manufacturing method 2, the protective film 12' can be cut in the same manner as in manufacturing method 1. FIG.
Also in the manufacturing method 2, for the same reason as in the manufacturing method 1, when the protective film 12' is cut along the outer periphery (in other words, the side surface) of the chip 9', the protection filled between the adjacent chips 9' is removed. The membrane 12' is preferably cut along the periphery (side surface) of the chip 9' to divide it in two.

After the processing step of manufacturing method 2, the obtained chip 105 with a protective film is separated from the dicing sheet 8 and picked up in the same manner as in manufacturing method 1. FIG.

In the processing step of manufacturing method 2, as in the case of manufacturing method 1, a wafer having no grooves may be used and singulated into chips.
Moreover, as in the case of the manufacturing method 1, the manufacturing method 2 may have the cutting step immediately before the pressure-reduced application step.

In the manufacturing method 1, after dividing the wafer in the processing step and before cutting the protective film, the surface layer portion of the protective film is removed by cleaning, so that the upper part of the protruding electrode protrudes through the protective film. The case of (exposure) has been explained.
In the manufacturing method 2, before the wafer is divided in the processing step, the surface layer portion of the protective film is removed by cleaning, so that the upper part of the protruding electrode protrudes (exposes) through the protective film. ,explained.
In the present embodiment, the timing for projecting the upper part of the projecting electrode is not limited to these, and may be from the time of attaching the curable resin film to the wafer in the vacuum bonding step, to the time of dividing the wafer in the processing step, or At any stage up to the cutting of the protective film, the upper part of the protruding electrode can be protruded. For example, the upper portion of the protruding electrode may protrude through a curable resin film instead of the protective film.
In the present embodiment, in the vacuum bonding step, the upper portion of the protruding electrode is protruded through the curable resin film, or in the processing step, the upper portion of the protruding electrode is removed from the protective film. It is preferable to protrude through the membrane.

In either case of manufacturing method 1 or manufacturing method 2, the chip 105 with the protective film obtained above is flip-chipped to the connection pad portion on the circuit board at the top of the projecting electrode 91 therein. By connecting them, a substrate device can be produced (not shown). At this time, the protective film-attached chip 105 is connected to the circuit forming surface of the circuit board. For example, if a semiconductor wafer is used as the wafer, the substrate device may be a semiconductor device.

INDUSTRIAL APPLICABILITY The present invention can be used to manufacture a chip or the like having projecting electrodes and having a protective film on the surface having the projecting electrodes. A chip provided with such a protective film is suitable for fabricating a substrate device by flip-chip connecting it to a connection pad on a circuit board.

1, 2... Protective film forming sheet 11, 21... Supporting sheet 11a, 21a... One side of supporting sheet (side of supporting sheet on curable resin film side) 111a, 211a. 1st region on one side of support sheet 112a, 212a 2nd region on one side of support sheet 12 curable resin film 12a curable resin film support sheet 12′ Protective film 120′ Protective film after cutting 9 Wafer 91 Wafer protruding electrodes (protrusive electrodes of chip), 9a surface of wafer having protruding electrodes (circuit surface), 90 grooves of wafer, 9′ chip, 9a′ chip surface having projecting electrodes, 9a′ surface having projecting electrodes of chip, 105 chip with protective film

Claims (3)

A method for manufacturing a chip with a protective film using a protective film-forming sheet, comprising:
The chip with a protective film includes a chip and a protective film provided on a surface of the chip having protruding electrodes,
The protective film forming sheet comprises a support sheet and a curable resin film provided on one surface of the support sheet,
The curable resin film is a resin film for forming a protective film on the surface of the wafer by being adhered to the surface of the wafer having the projecting electrodes and cured,
The support sheet has, on the one surface thereof, a first region provided with the curable resin film and a second region surrounding the first region and not provided with the curable resin film. have
The manufacturing method includes a reduced-pressure attaching step of attaching to the surface of the wafer while heating the curable resin film in the protective film-forming sheet in a reduced-pressure environment;
a curing step of forming a protective film on the surface of the wafer by curing the curable resin film after sticking;
and a processing step of obtaining the chips with the protective film by dividing the wafer on which the protective film is formed and cutting the protective film. As the wafer, the area of the surface in plan view is equal to or greater than the area of the surface of the curable resin film attached to the wafer,
2. The method of manufacturing a chip with a protective film according to claim 1, wherein in said vacuum bonding step, the entire bonding surface of said curable resin film is bonded to said surface of said wafer. In the vacuum bonding step, the upper portion of the protruding electrode is protruded through the curable resin film, or in the processing step, the upper portion of the protruding electrode is protruded through the protective film. 3. The method for manufacturing a chip with a protective film according to claim 1 or 2, wherein

Images