JP2019176113A - Package structure and electronic device - Google Patents

Abstract

To provide a package structure which makes waterproof performance less likely to be deteriorated.SOLUTION: A package structure includes a case 100 and a lid 200. The case 100 has an opening surface 101 on one surface. The opening surface 101 is attached to an attachment object 300 oriented to the attachment object 300 side. The lid 200 is joined to the case 100 so as to close the opening surface 101. The case 100 has a peripheral wall 103 at a periphery of the opening surface 101. The lid 200 at least partially enters into a space enclosed by the peripheral wall 103 and is joined to the case 100 in a portion enclosed by the peripheral wall 103.SELECTED DRAWING: Figure 1

Description

  The present disclosure relates to a package structure and an electronic device. Specifically, the present invention relates to a package structure for packaging electronic components and the like, and an electronic device in which an electronic device is packaged with this package structure.

  Patent Document 1 discloses an electronic device incorporating an electronic component. This electronic device includes an insulating base having a recess for accommodating an electronic component on the upper surface, a metal frame attached to the upper surface of the insulating base, and an outer peripheral portion of the lower surface joined to the upper surface of the metal frame. And a lid for closing.

JP 2006-332599 A

  However, in the electronic parts as described above, since the joint portion between the insulating base and the metal frame and the joint portion between the metal frame and the lid are exposed on the outer surface, mud, dust, etc. There was a problem that foreign matter easily reached and foreign matter easily entered the electronic device.

  The present disclosure has been made in view of the above points, and an object of the present disclosure is to provide a package structure in which foreign matter hardly enters the inside.

  A package structure according to an aspect of the present disclosure includes a case and a lid. The case has an opening surface on one side. The opening surface is attached to the attachment object toward the attachment object side. The lid is joined to the case so as to close the opening surface. The case has a peripheral wall around the opening surface. At least a part of the lid enters a space surrounded by the peripheral wall, and is joined to the case at a portion surrounded by the peripheral wall.

  The electronic device which concerns on 1 aspect of this indication is provided with the said package structure and the electronic device accommodated in the said case.

  In the present disclosure, there is an advantage that foreign matter hardly enters the package structure.

FIG. 1 is a perspective view showing an embodiment of an electronic device. FIG. 2A is a partially cutaway side view showing an embodiment of an electronic device. 2B is an enlarged cross-sectional view showing a portion Z1 in FIG. 2A. FIG. 3 is an exploded perspective view showing an embodiment of the electronic device. FIG. 4 is an enlarged perspective view showing a portion Z2 in FIG. FIG. 5 is a partial enlarged sectional view showing a conventional example.

(1) Outline FIG. 1, FIG. 2A and FIG. 2B show an electronic device 10 of the present embodiment. The electronic device 10 includes a package structure 1 and an electronic apparatus 400. The package structure 1 includes an electronic device 400. The electronic apparatus 400 constitutes various sensors such as an angular velocity sensor, a velocity sensor, an acceleration sensor, a position sensor, and a photoelectric sensor.

  The package structure 1 of this embodiment includes a case 100 and a lid 200. The case 100 has an opening surface 101 on one surface. The opening surface 101 is attached to the attachment object 300 toward the attachment object 300 side. The lid 200 is joined to the case 100 so as to close the opening surface 101. The case 100 has a peripheral wall 103 around the opening surface 101. At least a part of the lid 200 enters a space surrounded by the peripheral wall 103 and is joined to the case 100 at a portion surrounded by the peripheral wall 103.

  The package structure 1 of this embodiment includes a case 100 and a lid 200. In other words, the package structure 1 is configured by the case 100 and the lid 200. The case 100 has an opening surface 101 on one surface. The case 100 is formed in a bottomed cylindrical shape. The opening surface 101 is attached to the attachment object 300 toward the attachment object 300 side. In other words, the case 100 is attached to the attachment object 300 in a direction in which the opening surface 101 faces the attachment object 300. The lid 200 is joined to the case 100 so as to close the opening surface 101. That is, the lid 200 is closed so that the opening surface 101 is not exposed to the outside. The case 100 has a peripheral wall 103 around the opening surface 101. In other words, the opening surface 101 is surrounded by the peripheral wall 103. At least a part of the lid 200 enters a space surrounded by the peripheral wall 103. That is, the peripheral wall 103 is located around the lid body 200. The lid 200 is joined to the case 100 at a portion surrounded by the peripheral wall 103. That is, the peripheral wall 103 is positioned around the joint portion between the case 100 and the lid body 200.

  In the case of the package structure 1 of the present embodiment, the opening surface 101 faces the attachment target 300 side, and the joint portion between the lid 200 and the case 100 is surrounded by the peripheral wall 103. Therefore, as shown by the arrow in FIG. 2A, even if foreign matter such as mud and dust reaches the case 100 from the outside of the case 100, the foreign matter reaches the joint portion of the lid 200 and the case 100 and the opening surface 101. It becomes difficult to do. That is, the foreign matter does not easily enter a slight gap between the tip of the peripheral wall 103 and the surface of the attachment target 300, and does not easily reach the joint portion between the opening surface 101 and the lid 200 and the case 100. In the package structure 1 according to the present embodiment, not only foreign substances but also cleaning water does not easily reach the joint portion of the lid 200 and the case 100 and the opening surface 101, and the cleaning water does not easily enter the case 100. The waterproof performance is improved.

(2) Details The electronic device 10 of the present embodiment includes various electronic devices 400. That is, the electronic device 10 has the electronic device 400 built in the case 100. The electronic apparatus 400 constitutes various sensors such as an angular velocity sensor, a velocity sensor, an acceleration sensor, a position sensor, and a photoelectric sensor. In particular, the electronic device 10 is a device that is mounted on, for example, an agricultural machine, a two-wheeled vehicle, or a construction machine, and can be employed as a device that is attached to the outside of the vehicle body. Mud and dust tend to adhere to the electronic device 10 attached to the outside of the vehicle body. In addition, the cleaning water is easily sprayed onto the electronic device 10 when the vehicle body is cleaned. In such a case, the package structure 1 of the present embodiment is particularly useful.

  The electronic device 10 includes a package structure 1 and an electronic apparatus 400. As shown in FIG. 3, the electronic device 400 includes, for example, a chip 402 and a circuit board 401 on which the chip 402 is mounted. The chip 402 includes various sensor elements.

  The package structure 1 of this embodiment includes a case 100 and a lid 200. The case 100 has an opening surface 101 on one surface. The case 100 is formed in a cylindrical shape with a peripheral wall 103, and one end of the cylindrical peripheral wall 103 is closed with an outer surface portion 102. In the present embodiment, the four peripheral walls 103 are formed in a square cylinder shape. The end portion that is not closed by the outer surface portion 102 is formed as an opening surface 101. In the case of the four peripheral walls 103, the opening surface 101 is a quadrangle. The attachment surface 300 is attached to the attachment object 300 with the opening surface 101 facing the attachment object 300 side. That is, the case 100 is attached to the attachment target 300 with the opening surface 101 facing the attachment target 300. The attachment target 300 is to be mounted with the electronic device 10 on the outer surface, and is, for example, an exterior of a farm tool, a motorcycle, a construction machine, or the like.

  The case 100 is a molded product of a synthetic resin such as polycarbonate or acrylic. The case 100 includes an outer surface portion 102, a peripheral wall 103, an attachment portion 104 and a connector portion 105. In this case, the opening surface 101 is a surface opposite to the outer surface portion 102 of the case 100. The opening surface 101 is provided so as to face the surface of the attachment target 300 when the electronic device 10 is attached to the attachment target 300.

  The peripheral wall 103 protrudes in one direction from the peripheral end of the outer surface portion 102. The peripheral wall 103 is provided over the entire periphery of the outer surface portion 102. The outer surface portion 102 has a rectangular shape when viewed from the front. The case 100 has a peripheral wall 103 around the opening surface 101. That is, the opening surface 101 is surrounded by the tip of the peripheral wall 103 over the entire periphery. An opening surface 101 is formed inside the distal end portion of the peripheral wall 103. A corner portion of the peripheral wall 103 is formed into a curved surface with a direction orthogonal to the opening surface 101 as an axis. Further, the corner between the peripheral wall 103 and the outer surface 102 is also formed into a curved surface. When the corners of the case 100 are formed in a curved surface as described above, for example, even when sand, stones, or the like collide with the case 100, the corners of the case 100 are hardly chipped and the case 100 is not easily damaged. In the present embodiment, since the exterior of the vehicle body is the attachment object 300, a situation in which sand, stones, and the like collide with the case 100 is assumed, which is particularly useful.

  The peripheral wall 103 has a joint 106. The joining part 106 has a joining surface 107 for joining the lid 200. The joint portion 106 is provided so as to protrude from the inner surface of the peripheral wall 103. The joint 106 is provided over the entire length of the case 100 in the circumferential direction. The joint 106 is integral with the peripheral wall 103. A surface (for example, a lower end surface) facing the attachment target 300 in the bonding portion 106 is the bonding surface 107. The joint surface 107 is provided over the entire circumference of the opening surface 101, that is, the entire length in the circumferential direction of the case 100. As shown in FIG. 4, the joint surface 107 is located inside the case 100 with respect to the front end surface of the peripheral wall 103. A step is formed between the front end surface of the peripheral wall 103 and the joint surface 107. The joint surface 107 is a flat surface in a direction orthogonal to the outer surface of the peripheral wall 103. The joint surface 107 is located inside the case 100 with respect to the opening surface 101. The joint surface 107 is at a position facing the end portion of the opening surface 101 along the peripheral wall 103. In the present embodiment, the joint 106 is integral with the peripheral wall 103. In other words, a portion that is lowered by one step in the direction away from the attachment target 300 with respect to the distal end surface of the peripheral wall 103 functions as the joint portion 106.

  As shown in FIG. 4, the bonding surface 107 has a groove 108. The groove 108 is provided on the joint surface 107 over the entire circumferential length of the case 100. For example, the groove 108 is formed as a V groove, but the shape is not particularly limited, and may be a semicircular groove as an example.

  There are a plurality of attachment portions 104, which are provided so as to protrude from both side surfaces of the case 100. Each mounting portion 104 has a surface facing the mounting target 300. Each mounting portion 104 has a hole 111 that penetrates in the thickness direction. That is, the hole 111 passes through each mounting portion 104 in a direction orthogonal to the opening surface 101. The surface on the attachment target 300 side of the attachment portion 104 is formed at the same height as the opening surface 101. As a result, the gap between the opening surface 101 and the surface of the mounting target 300 becomes relatively small in a state where the case 100 is mounted on the mounting target 300, and foreign matter and cleaning water enter the case 100 even more. There is an advantage that it becomes difficult. One end of the hole portion 111 is open on the surface of the attachment portion 104 facing the attachment object 300 side. The other end of the hole 111 is open on the surface of the mounting portion 104 facing the side opposite to the mounting target 300 side. Note that the attachment portion 104 may be provided on the front surface or the rear surface of the case 100 in addition to the side surface of the case 100 or instead of the side surface of the case 100. Or the attaching part 104 may be provided in the outer peripheral surface of the case 100 along the opening surface 101 over the full length.

  The connector portion 105 is provided so as to protrude from the front surface of the case 100. On the outer surface of the connector part 105, a guide part 113 is provided for positioning when connecting to another connector.

  The lid 200 is a molded product of synthetic resin such as polycarbonate or acrylic. The lid 200 can be formed as a translucent member, and can have a light transmittance of 30% or more, for example. The lid 200 has a similar external shape to the opening surface 101 and is a flat plate having substantially the same size or a slightly smaller size than the opening surface 101. When the outer shape of the lid 200 is slightly smaller than the opening surface 101, the lid 200 is likely to be fitted into the opening surface 101, and the lid 200 can be easily joined to the case 100. The thickness of the lid 200 is formed to be larger than the step between the distal end surface of the peripheral wall 103 and the joint surface 107. Therefore, when the lid body 200 is joined to the joint surface 107 and attached to the case 100, the surface of the lid body 200 on the attachment target 300 side is positioned on the outer side (attachment target 300 side) than the opening surface 101.

  Then, with the electronic device 400 housed in the case 100, the lid 200 is joined to the case 100 so as to close the opening surface 101. That is, the case 100 is sealed by the lid 200 with the opening surface 101 closed. The term “joining” in the present disclosure includes various modes for mechanically joining two members such as adhesion, adhesion, welding, and pressure bonding.

  As one mode of bonding, the case 100 and the lid 200 are bonded with an adhesive or the like. If bonding is performed with an adhesive, the case 100 and the lid 200 can be bonded with a relatively simple operation. Even if there are irregularities between the bonding surface 107 and the lid 200, the irregularities are filled with the adhesive. And there is an advantage that a gap is hardly generated between the joint surface 107 and the lid 200. As one mode of adhesion, the case 100 and the lid 200 are bonded together with a single-sided or double-sided adhesive tape or the like. Joining with an adhesive tape has the advantage that the joining process and the drying process are scarcely required and joining can be performed easily compared to joining with an adhesive. As one mode of welding, there are laser welding, ultrasonic welding, thermal welding, and the like. According to the welding, a part of the case 100 and a part of the lid 200 are melted and integrated, so that the joint portion is less likely to deteriorate with time due to ultraviolet rays or the like, and the joint strength between the case 100 and the lid 200 is increased. There are advantages such as being difficult to reduce. In particular, in the case of welding, the waterproof performance is improved because the case 100 and the lid 200 are integrated, and therefore the waterproof performance is likely to be further improved by a synergistic effect with the peripheral wall 103. One aspect of the pressure bonding is thermocompression bonding or ultrasonic heat welding.

  As shown in FIG. 2B, at least a part of the lid 200 enters the space surrounded by the peripheral wall 103, and is joined to the case 100 at a portion surrounded by the peripheral wall 103. That is, the peripheral wall 103 exists around the joint portion between the lid 200 and the case 100, and is difficult to be exposed to the outside. In the present embodiment, the lid body 200 is thicker than the step between the distal end surface of the peripheral wall 103 and the joint surface 107. Therefore, at least a part of the lid 200 protrudes from the space surrounded by the peripheral wall 103.

  The electronic device 10 formed as described above is attached to the attachment object 300 by the attachment portion 104. At this time, the attachment part 104 is fixed to the attachment object 300 in a state where the surface of the hole 111 that is open at one end is in contact with the surface of the attachment object 300. When fixing the mounting portion 104 to the mounting target 300, a fixing tool such as a screw is inserted into the hole 111 and the fixing tool is screwed into the mounting target 300. At this time, the surface of the attachment portion 104 on the attachment target 300 side is positioned outside the outer surface of the lid body 200 (surface opposite to the case 100 side) and the front end surface (for example, the lower end surface) of the peripheral wall 103. Therefore, a gap 120 is provided between the outer surface of the lid 200 and the front end surface of the peripheral wall 103 and the surface of the attachment target 300. In addition, the mounting portion 104 is provided so as to protrude from the outer surface of the case 100, and the hole 111 is open on the side opposite to the mounting target 300. Therefore, when the fixture is inserted into the hole 111, the hole 111 is easily visible. The case 100 does not get in the way. Therefore, it is easy to attach the electronic device 10 to the attachment target 300.

  When the electronic device 10 is attached to the attachment target 300 as described above, the opening surface 101 of the case 100 faces the attachment target 300 and faces the surface of the attachment target 300 in a state of being closed by the lid 200. Yes. Therefore, it is difficult for foreign matter to reach the opening surface 101 from the attachment target 300 side, and foreign matter does not easily enter the case 100.

  In addition, the joint surface 107 of the case 100 joined to the lid 200 is positioned inside the case 100 with respect to the opening surface 101 and is surrounded by the peripheral wall 103. That is, a step is formed between the distal end surface of the peripheral wall 103 and the joint surface 107, and a portion that is stepped down in a direction away from the attachment object 300 with respect to the distal end surface of the peripheral wall 103 becomes the joint surface 107. For this reason, it is difficult for foreign matter and cleaning water to reach the joint between the case 100 and the lid 200 from the outside, and there is an advantage that the waterproofness and dustproofness in the case 100 can be easily obtained.

  Further, according to the step between the front end surface of the peripheral wall 103 and the joint surface 107, the path from the outer surface of the peripheral wall 103 through the joint surface 107 to the inside of the case 100 meanders, and therefore the outer surface of the case 100 and the case 100 You can earn a creepage distance between the inside. Therefore, there is an advantage that it is easy to ensure electrical insulation between the electronic device 400 housed inside the case 100 and the outside of the case 100. In addition, since the groove 108 is formed on the bonding surface 107, the path from the outer surface of the peripheral wall 103 to the inside of the case 100 through the bonding surface 107 is longer than that without the groove 108. The distance can be increased.

  The outer portion at the tip of the peripheral wall 103 has an inclined portion 110. As shown in FIG. 3, the inclined portion 110 is provided at the tip of the peripheral wall 103 over the entire length in the circumferential direction of the case 100. The inclined part 110 is formed by chamfering, for example. In this way, when the outer corner portion at the lower end of the peripheral wall 103 is removed and the inclined portion 110 is provided, it becomes difficult for stones or the like to hit the corner portion of the peripheral wall 103. For this reason, there exists an advantage that the damage of the surrounding wall 103 can be reduced. Further, the inclined portion 110 is formed in a planar shape by C chamfering. That is, the inclined portion 110 is a flat surface that is inclined to the side opposite to the opening surface 101. If the inclined portion 110 is a flat surface, for example, the pressure of the cleaning water that acts on the peripheral wall 103 is likely to be reduced. Further, the inclined portion 110 is inclined toward the opposite side of the lid 200 with respect to the opening surface 101. That is, the inclined portion 110 is inclined toward the outside of the case 100 in a direction away from the lid 200 side. Therefore, the inclined portion 110 is inclined in the direction facing the outside of the case 100 with respect to the direction orthogonal to the opening surface 101.

  The lid 200 and the case 100 are joined to each other at least surfaces facing each other in a direction orthogonal to the opening surface 101. That is, the one surface of the lid 200 and the joint surface 107 that is the tip surface of the joint portion 106 of the case 100 are joined. The joint surface 107 is joined over the entire periphery with the peripheral end portion of the surface of the lid 200 facing into the case 100. Accordingly, a gap is less likely to be generated between the lid 200 and the case 100, and foreign matter and cleaning water are less likely to enter the case 100.

  The case 100 and the lid body 200 are joined at the welded portion 112. That is, the joint surface 107 provided on the case 100 and one surface of the lid 200 are joined by, for example, laser welding, ultrasonic welding, or thermal welding. The weld 112 is formed over the entire length of the joint surface 107 so as to surround the opening surface 101. Thereby, it is difficult to form a gap between the lid 200 and the bonding surface 107, and there is an advantage that intrusion of foreign matter and cleaning water into the case 100 is reduced. A gap 202 is provided between the peripheral wall 103 and the end surface 201 of the lid 200. That is, the end surface 201 of the lid 200 is not in contact with the peripheral wall 103 and is positioned inside the case 100. Further, a groove 108 is provided on the inner side of the joint portion (welded portion 112) between the lid 200 and the case 100. That is, the lid 200 is joined to the joining surface 107 by the welded portion 112 outside the groove 108. When the case 100 and the lid body 200 are joined by the welded portion 112, the molten resin may flow into the groove 108. For this reason, it is reduced that the molten resin flows into the case 100, and there is an advantage that the resin hardly adheres to the electronic device 400 accommodated in the case 100.

  Further, since the joint portion between the lid body 200 and the joint surface 107 is surrounded by the tip of the peripheral wall 103, the stress acts on the joint portion between the lid body 200 and the joint surface 107 even when the cleaning water hits the peripheral wall 103. It becomes difficult and the attachment strength of the lid 200 is improved. For example, as in the conventional example of FIG. 5, even when the wall portion 501 is provided at the peripheral end portion of the lid body 500, the cleaning water does not directly hit the joint portion 503 between the case 502 and the lid body 500. However, the stress generated when the cleaning water hits the wall portion 501 acts as a shear stress on the joint portion 503. On the other hand, in the present embodiment, even if the peripheral wall 103 is washed with water, shear stress hardly acts on the joint portion (welded portion 112) between the lid 200 and the joint surface 107. This is because a step is formed between the front end surface of the peripheral wall 103 and the joint surface 107. For this reason, there is an advantage that the shear stress hardly acts on the joint surface 107, and the joint strength between the case 100 and the lid 200 is difficult to decrease.

  Moreover, since the clearance gap 120 is provided between the front-end | tip part of the surrounding wall 103, and the attachment target 300, even if washing water enters into this clearance gap 120, the pressure of washing water reduces. Therefore, the washing water acts on the joint portion between the lid 200 and the case 100 in a state where the pressure is weakened, and there is an advantage that the waterproof performance is improved.

  In this embodiment, waterproof performance is difficult to reduce even with high-pressure cleaning such as IP69K (protection rules for high-temperature, high-pressure water and steam jet cleaning defined in German standard DIN40050 PART9). That is, in IP69K, high-pressure cleaning water may be sprayed from the outside to the cleaning target while rotating the cleaning target, but in this embodiment, the opening surface 101 of the case 100 faces the attachment target 300 side. . In addition, since the case 100 and the lid 200 are joined inside the case 100 and the joined portion is surrounded by the peripheral wall 103, even if it is high-pressure washing water, the case 100 enters the case 100. Can be reduced.

(Modification)
The groove 108 can be provided not only inside the joint portion between the lid 200 and the case 100 but also outside the joint portion between the lid 200 and the case 100. Further, the groove 108 can be provided on both the inside and outside of the joint portion between the lid 200 and the case 100. Further, the groove 108 may be provided not only on the bonding surface 107 of the case 100 but also on the surface of the lid 200, or on both the bonding surface 107 and the surface of the lid 200. When the plurality of grooves 108 are provided in this way, the path from the outer surface of the peripheral wall 103 to the inside of the case 100 through the joint surface 107 can be further increased, and the creeping distance can be increased.

  In fixing the mounting portion 104 to the mounting target 300, not only a fixing tool such as a screw but also a fastening tool made of, for example, a bolt and a nut can be used. Further, an adhesive may be used to fix the attachment portion 104 to the attachment object 300.

  The joining portion 106 is not limited to being integrated with the peripheral wall 103, and may be a separate body from the peripheral wall 103. In this case, for example, the joint 106 and the peripheral wall 103 may be made of different materials, and there may be a gap between the joint 106 and the peripheral wall 103.

  The case 100 is not limited to the configuration in which the case 100 is joined to the lid 200 only by the surface of the joint portion 106 facing the attachment target 300 (that is, the joint surface 107), but in addition to or instead of the joint surface 107. It may be joined to the lid 200 on the inner peripheral surface. That is, the case 100 only needs to be joined to the lid 200 at a portion surrounded by the peripheral wall 103, and may be joined to the lid 200 at any surface in the portion surrounded by the peripheral wall 103. Specifically, the case 100 and the lid 200 may be joined to a surface of the peripheral wall 103 that faces the end surface 201 of the lid 200, that is, an inner peripheral surface of the peripheral wall 103. In this case, since the gap 202 (see FIG. 2B) does not occur between the end surface 201 of the lid body 200 and the inner circumferential surface of the peripheral wall 103, even if pressure acts on the end surface 201 of the lid body 200, Shear stress is less likely to act on the joint portion (welded portion 112) with the joint surface 107.

  The inclined portion 110 of the peripheral wall 103 may not be provided, and in this case, the outer periphery of the lower end of the peripheral wall 103 has an angular shape. The inclined portion 110 may be formed not only in a planar shape but also in a curved surface such as an R surface.

(Summary)
The package structure (1) according to the first aspect includes a case (100) and a lid (200). The case (100) has an opening surface (101) on one side. The opening surface (101) is attached to the attachment object (300) toward the attachment object (300). The lid (200) is joined to the case (100) so as to close the opening surface (101). The case (100) has a peripheral wall (103) around the opening surface (101). At least a part of the lid (200) enters the space surrounded by the peripheral wall (103), and is joined to the case (100) at a portion surrounded by the peripheral wall (103).

  With such a structure, the opening surface (101) faces the attachment target (300) side, and it is difficult for foreign matter and cleaning water to act directly, and the joint between the case (100) and the lid (200) is also provided. Surrounded by the peripheral wall (103), the foreign matter and the washing water are less likely to act directly, and the waterproof performance and dustproof performance are unlikely to deteriorate.

  In the package structure (1) according to the second aspect, in the first aspect, the lid body (200) and the case (100) are bonded to each other at least surfaces facing each other in a direction orthogonal to the opening surface (101). Has been.

  With such a structure, even when cleaning water is sprayed onto the peripheral wall (103), shearing stress is hardly applied to the joint portion between the case (100) and the lid (200), and the lid (200) is attached. Strength is difficult to decrease.

  The package structure (1) according to the third aspect has a gap (202) between the peripheral wall (103) and the end face of the lid (200) in the first or second aspect.

  With such a structure, even when cleaning water is sprayed onto the peripheral wall (103), it is difficult to apply force to the lid (200) due to the buffering of the gap (202), and the mounting strength of the lid (200) is reduced. Hard to do.

  The package structure (1) according to the fourth aspect is the structure according to any one of the first to third aspects, wherein at least one of the lid (200) and the case (100) includes the lid (200) and the case (100). A groove (108) is provided on at least one of the inside and the outside of the joint portion.

  With such a structure, when the joint between the lid (200) and the case (100) is welded, the melted portion of the lid (200) and the case (100) enters the groove (108). Thus, the mounting strength of the lid (200) is unlikely to decrease.

  In the package structure (1) according to the fifth aspect, in any one of the first to fourth aspects, the front end surface of the peripheral wall (103) is opposite to the lid (200) with respect to the opening surface (101). It has the inclination part (110) which inclines toward.

  With such a structure, it is possible to reduce the pressure of the cleaning water that enters around the tip surface of the peripheral wall (103), and the waterproof performance is unlikely to deteriorate.

  In the package structure (1) according to the sixth aspect, in the fifth aspect, the inclined portion (110) is planar.

  With such a structure, it is possible to further reduce the pressure of the cleaning water that enters around the tip surface of the peripheral wall (103), and the waterproof performance is unlikely to deteriorate.

  In the package structure (1) according to the seventh aspect, in any one of the first to sixth aspects, the case (100) and the lid (200) are joined by the welded portion (112).

  With such a structure, the adhesiveness of the joint portion between the case (100) and the lid (200) is improved, and the waterproof performance and the mounting strength of the lid (200) are unlikely to decrease.

  An electronic device (10) according to an eighth aspect includes a package structure (1) according to any one of the first to seventh aspects, and an electronic device (400) accommodated in a case (100).

  With such a structure, the electronic device (400) can be protected from the cleaning water by the package structure (1), and damage to the electronic device (400) due to the cleaning water can be easily reduced.

DESCRIPTION OF SYMBOLS 1 Package structure 10 Electronic device 100 Case 101 Opening surface 103 Perimeter wall 108 Groove 110 Inclination part 112 Welding part 200 Lid 202 Gap 300 Attachment object 400 Electronic device

Claims (8)

A case having an opening surface on one surface and being attached to the attachment object with the opening surface facing the attachment object side;
A lid joined to the case so as to close the opening surface,
The case has a peripheral wall around the opening surface,
The package structure in which at least a part of the lid enters a space surrounded by the peripheral wall and is joined to the case at a portion surrounded by the peripheral wall. The package structure according to claim 1, wherein surfaces of the lid and the case that face each other in at least a direction orthogonal to the opening surface are bonded to each other. The package structure according to claim 1, wherein a gap is provided between the peripheral wall and the end surface of the lid. The package structure according to any one of claims 1 to 3, wherein at least one of the lid and the case has a groove on at least one of an inner side and an outer side of a joint portion between the lid and the case. The package structure according to any one of claims 1 to 4, wherein a distal end surface of the peripheral wall includes an inclined portion that is inclined toward the opposite side of the lid body with respect to the opening surface. The package structure according to claim 5, wherein the inclined portion is planar. The package structure as described in any one of Claims 1 thru | or 6. The said case and the said cover body are joined by the welding part. The package structure according to any one of claims 1 to 7,
And an electronic device housed in the case.

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