JP2019176092A - Electronic component and method of manufacturing the same - Google Patents

Abstract

To provide an electronic component etc. with sufficient joining strength between an external electrode and a lead terminal in which, when reflowing at high temperature, a multilayer ceramic capacitor is unlikely to fall off the lead terminal, even when external force is applied, cracks are unlikely to occur in a joint and the multilayer ceramic capacitor.SOLUTION: An electronic component 100 includes: a multilayer ceramic capacitor 10 having external electrodes 6; a lead terminal 80; and a joint 60 for joining the external electrode 6 and the lead terminal 80. The external electrode 6 contains 80 mass% or more of Ni. The joint 60 includes 20 to 80% by mass of Ag, and Sn occupying 95% by mass or more of the remainder. Alternatively, 25 to 90% by mass of Cu and Sn occupying 95% by mass or more of the remainder are included.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component and a method for manufacturing the electronic component.

  Conventionally, an electronic component having a multilayer ceramic capacitor having an external electrode, a lead terminal connected to the external electrode, and a joint for joining the lead terminal and the external electrode is known.

JP 2009-26906 A JP 2003-303732 A WO 2006/126352

  However, in conventional electronic components, the multilayer ceramic capacitor tends to drop off from the lead terminal during reflow at high temperatures, and cracks are likely to occur in the joint and the multilayer ceramic capacitor itself when an external force is applied. There is a problem that the bonding strength between the lead terminal and the lead terminal is not sufficient.

  The present invention has been made in view of the above problems, and it is difficult for the multilayer ceramic capacitor to drop off from the lead terminal during reflow at a high temperature, and even when an external force is applied, cracks are unlikely to occur in the joint and the multilayer ceramic capacitor. And it aims at providing the electronic component and its manufacturing method with sufficient joining strength of an external electrode and a lead terminal.

An electronic component according to the present invention includes a multilayer ceramic capacitor having an external electrode, a lead terminal, and a joint portion that joins the external electrode and the lead terminal. The external electrode contains 80% by mass or more of Ni. The joint includes 20 to 80% by mass of Ag and Sn occupying 95% by mass or more of the remaining part, or 25 to 90% by mass of Cu and Sn occupying 95% by mass or more of the remaining part. .
It is preferable that Sn-Ag alloy or Sn-Cu alloy occupy 50 mass% or more of the joint. In addition, the alloy in this invention is the concept containing a solid solution alloy and an intermetallic compound.

  Moreover, the said junction part can contain Sn which occupies 25-70 mass% Ag and 95 mass% or more of remainder. Moreover, a junction part can contain Sn which occupies 35-80 mass% Cu and 95 mass% or more of remainders. In this case, a wide range of Sn—Ag alloys with a high mass% of Ag or Sn—Cu alloys with a high mass% of Cu exist in the joint.

  In addition, the lead terminal may have a surface layer at a portion in contact with the joint portion.

The method for manufacturing an electronic component according to the present invention is a method for manufacturing an electronic component comprising a step of joining a lead terminal and an external electrode of a multilayer ceramic capacitor, wherein the external electrode contains 80 mass% or more of Ni. In this method, A step of arranging a first metal-containing layer and a second metal-containing layer in order from the external electrode side between the external electrode and the lead terminal,
And B step of melting the first metal-containing layer and the second metal-containing layer to form a joint between the external electrode and the lead terminal, and the following (a) or (b) Satisfy either.
(A) The first metal-containing layer contains Ag or Cu, and the second metal-containing layer contains Sn.
(B) The second metal-containing layer contains Ag or Cu, and the first metal-containing layer contains Sn.

Here, when the above method satisfies (a), the step A includes
Applying a paste containing Ag or Cu on the surface of the external electrode, and then heating to form the first metal-containing layer on the surface of the external electrode; and
Supplying a paste containing Sn between the first metal-containing layer and the lead terminal to form the second metal-containing layer.

  The lead terminal may have a surface layer at a portion in contact with the second metal-containing layer. When the above method satisfies (b), the surface layer of the lead terminal preferably contains 80% by mass or more of Ni.

  According to the present invention, the multilayer ceramic capacitor is unlikely to drop off from the lead terminal during reflow at a high temperature, and cracks are unlikely to occur in the joint and the multilayer ceramic capacitor when an external force is applied. And bonding strength is ensured.

FIG. 1 is a cross-sectional view of an electronic component according to an embodiment of the present invention. FIG. 2 is a diagram for explaining a method for manufacturing an electronic component, and FIG. 2A is a cross-sectional view showing a state in which a first metal-containing layer and a second metal-containing layer are arranged between a multilayer ceramic capacitor and a lead terminal. c) is a cross-sectional view showing a state in which a first metal-containing layer is formed on the external electrode 6 of the multilayer ceramic capacitor 10. FIG. 3 is an SEM photograph of a cross section of the joint portion of Example 3 and the vicinity thereof.

(Electronic parts)
An electronic component 100 according to an embodiment of the present invention will be described with reference to FIG.

  The electronic component 100 includes a multilayer ceramic capacitor 10, a lead terminal 80, and a joint portion 60.

The multilayer ceramic capacitor 10 includes a capacitor chip 3 and external electrodes 6. The capacitor chip 3 has a large number of internal electrodes 1 that are spaced apart in the thickness direction and a ceramic layer 2 that insulates the internal electrodes 1 from each other.
The material of the internal electrode 1 can be a metal material such as Ni, Cu, or Pd.
The material of the ceramic layer 2 can be a ceramic such as barium titanate.

  The external electrodes 6 are respectively disposed at both ends of the capacitor chip 3. Some internal electrodes 1 are electrically connected to one external electrode 6, and the remaining internal electrodes 1 are electrically connected to the other external electrode 6. In the capacitor chip 3, the internal electrodes 1 connected to the external electrode 6 on one side and the internal electrodes 1 connected to the external electrode 6 on the other side are alternately arranged in the stacking direction.

  The external electrode 6 is a layer of a conductive material containing 80% by mass or more of Ni. The content of Ni can be 90% by mass or more.

The external electrode 6 preferably contains Ni and glass frit from the viewpoint of adhesiveness with the capacitor chip 3. The amount of glass frit can be 3 to 10% by mass. The glass frit is mainly composed of at least two kinds of oxides selected from Sr, Ca, Ba, Bi, Si, B and Zn, such as Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ glass. It is preferable that

  In addition to the external electrode 6, another conductive layer containing 80% by mass or more of one or more metals selected from the group consisting of Cu, Ag, and Pd may be provided between the external electrode 6 and the capacitor chip 3. . For example, in a typical embodiment, another conductive layer may contain 80% by weight or more of Cu. Another conductive layer may contain 80% by mass or more of Ag or Ag—Pd. When there is another conductive layer, the external electrode 6 does not need to contain glass frit, and it is preferable to contain glass frit in another conductive layer.

  The lead terminal 80 has a main body portion 81 and a surface layer 82 provided on the surface of the main body portion 81. The lead terminal 80 of the present embodiment has an L shape, and one end faces the external electrode 6.

  The material of the main body 81 can be a metal material such as Fe, Ni, or Cu.

  The material of the surface layer 82 of the main body 81 is not particularly limited, but as a typical embodiment, Ag can be contained in an amount of 80% by mass or more, or 90% by mass or more. It can be contained by mass% or more, or 90 mass% or more. Such a surface layer 82 can be formed by plating.

  The joint portion 60 is joined to the surface layer 82 of the lead terminal 80 and the external electrode 6, and electrically connects them. The thickness of the junction 60 (the length in the direction in which the current flows) is not particularly limited, but can be, for example, 50 to 500 μm.

  The joint 60 includes 20 to 80% by mass of Ag and Sn occupying 95% by mass or more of the balance (first composition), or 25 to 90% by mass of Cu and 95% by mass of the balance. It contains Sn occupying the above (second composition). Examples of inevitable impurities in the junction 60 are Na, S, Cl, and Bi.

In the joint portion 60 of the first composition, when the mass% of Ag is 20% or more, the portion having a low melting point is reduced and the heat resistance of the joint portion is improved, so that the multilayer ceramic capacitor does not easily fall off. . When the mass% of Ag is 80% or less, the portion with low bonding strength is reduced, and the strength of the bonding portion can be ensured.
In the joint portion 60 of the second composition, when the mass% of Cu is 25% or more, the portion having a low melting point is reduced and the heat resistance of the joint portion is improved, so that the multilayer ceramic capacitor does not easily fall off. . When the mass% of Cu is 90% or less, the portion with low bonding strength is reduced, and the high strength of the bonding portion can be ensured.

  Moreover, it is preferable that the junction part 60 of a 1st composition contains 25-70 mass% Ag and Sn which occupies 95 mass% or more of remainder. In this case, a wide range of Sn—Ag alloys having a high mass% of Ag exist in the joint portion 60. Moreover, it is preferable that the junction part 60 of a 2nd composition contains 35-80 mass% Cu and Sn which occupies 95 mass% or more of remainder. In this case, a wide range of Sn—Cu alloys having a high Cu mass% are present in the joint portion 60. Since the electronic component having such characteristics has a small amount of liquid phase at the joint in an environment of 250 ° C., the heat resistance can be improved and the multilayer ceramic capacitor can be prevented from falling off.

  In the joint portion 60, Sn can be 98 mass% or more of the balance.

When the joining part 60 contains 20 to 80% by mass of Ag and Sn occupying 95% by mass or more of the balance, 50% by mass or more (preferably 70% by mass or more) of the joining part 60 is obtained by the Sn-Ag alloy. It is preferable to occupy. Moreover, when the junction part 60 contains Sn which occupies 25-90 mass% Cu and 95 mass% or more of remainder, 50 mass% or more (preferably 70 mass% or more) of the junction part 60 is Sn-Cu. It is preferred that the alloy occupies. In the present specification, an alloy is a concept including a solid solution alloy and an intermetallic compound.
When the mass percentage of the Sn—Ag alloy or Sn—Cu alloy in the joint 60, that is, the alloy ratio is 50 mass% or more, there is almost no single metal portion in the joint 60 and few brittle portions. Therefore, cracks are less likely to occur.

  In the present embodiment, the use of the lead terminal 80 can relieve the stress applied to the multilayer ceramic capacitor 10, so that the occurrence of cracks in the multilayer ceramic capacitor 10 itself can be reduced. In addition, when the lead terminal 80 has the surface layer 82 which has Ag as a main component, there exists an effect that joining with a wiring circuit is performed more reliably.

(Production method)
Next, a method for manufacturing the above-described electronic component will be described with reference to FIGS.

  First, the multilayer ceramic capacitor 10 and the lead terminal 80 are prepared.

  Next, as shown in FIG. 2A, the first metal-containing layer 20 and the second metal-containing layer 40 are sequentially disposed between the external electrode 6 and the lead terminal 80 from the external electrode 6 side. Deploy.

  Here, the first metal-containing layer 20 is in contact with the external electrode 6 and the second metal-containing layer 40. The second metal-containing layer 40 is in contact with the first metal-containing layer 20 and the surface layer 82 of the lead terminal 80.

  Here, the 1st metal content layer 20 and the 2nd metal content layer 40 satisfy either of the following (a) and (b).

(A) The 1st metal content layer 20 contains Ag or Cu, and the 2nd metal content layer 40 contains Sn.
(B) The 2nd metal content layer 40 contains Ag or Cu, and the 1st metal content layer 20 contains Sn.

(A) The 1st metal content layer 20 can contain 95 mass% or more of Ag or Cu as a metal component, and the 2nd metal content layer 40 can contain 95 mass% or more of Sn as a metal component. .
(B) The 2nd metal content layer 40 can contain 95 mass% or more of Ag or Cu as a metal component, and the 1st metal content layer 20 can contain 95 mass% or more of Sn as a metal component.

When each metal-containing layer contains Ag or Cu, it is more preferable that each metal-containing layer contains 99% by mass or more of Ag or Cu as a metal component.
When each metal containing layer contains Sn, it is more preferable that each metal containing layer contains 99 mass% or more of Sn as a metal component.
Such a metal-containing layer can be a metal paste layer. The metal paste contains a metal component such as metal powder and a non-metal component. The nonmetallic component includes a resin component and a solvent. Examples of metal particles are Ag particles, Cu particles, and Sn particles.
The metal-containing layer may be a metal paste layer, or may be a metal layer obtained by baking (heat treatment) the metal paste layer to remove the resin component and the solvent in the paste.

  Of (a) and (b), (a) is preferred from the viewpoint of the cost of the manufacturing process.

  In the case of (a), it is preferable to do the following. First, a paste containing Ag or Cu is applied to the surface of the external electrode 6, and then the paste is heat-treated to contain Ag or Cu on the external electrode 6 as shown in FIG. The first metal-containing layer 20 is formed. Thereafter, the lead terminal 80 is arranged so that a gap is formed between the surface layer 82 of the lead terminal 80 and the first metal-containing layer 20, and a paste containing Sn is supplied into the gap, and Sn is used as a metal component. The 2nd metal containing layer 40 to contain is formed.

  In the case of (b), the following is preferable. First, a paste containing Ag or Cu is applied to the surface of the surface layer 82 of the lead terminal 80, and then the paste is heat-treated to form the second metal-containing layer 40 containing Ag or Cu on the lead terminal 80. Form. Thereafter, the multilayer ceramic capacitor 10 is arranged so that a gap is formed between the external electrode 6 and the second metal-containing layer 40, and a paste containing Sn is supplied into the gap, and Sn is contained as a metal component. The first metal-containing layer 20 is formed. In this case, the surface layer 82 of the lead terminal 80 preferably contains 80% by mass or more of Ni. Since Ag and Cu do not easily react with Ni under conditions of 500 ° C. or lower, it is easy to form an alloy suitably with Sn.

  Subsequently, the first metal-containing layer 20 and the second metal-containing layer 40 are heat-treated and melted to form a joint portion 60 containing an alloy that joins the external electrode 6 and the lead terminal 80, and the electrons shown in FIG. A part 100 is obtained. Conventionally, the heat treatment could not be sufficiently melted unless the temperature of the heat treatment is 600 ° C. or higher. However, according to this embodiment, the temperature of the heat treatment may be equal to or higher than the melting point of Sn, and is 232 to 500 ° C. Can be.

  According to such a method, Ag or Cu interdiffuses with Sn rather than Ni of the external electrode 6, so that it is easy to form the joint 60 including the Sn—Ag alloy and the Sn—Cu alloy. Specifically, a Sn-Ag alloy having a high Ag mass% concentration or a Sn-Cu alloy having a high Cu mass% concentration can exist widely in the joint portion 60. Accordingly, an electronic component having a joint including such an alloy has improved heat resistance because the amount of liquid phase in the joint is small even under an environment of 250 ° C.

(Function)
The electronic component 100 according to the present embodiment includes the external electrode 6 containing 80% by mass or more of Ni and the joint portion 60 having the above-described composition. While Ni and Ag or Ni and Cu are poorly reactive with each other, Ag or Cu is easily diffused into Sn melted by heat treatment. Therefore, a Sn—Ag alloy or a Sn—Cu alloy having a high melting point and high bonding strength is easily formed at the joint. Further, the use of the lead terminal 80 can relieve the stress applied to the multilayer ceramic capacitor 10. As a result, the multilayer ceramic capacitor 10 is unlikely to drop off from the lead terminal 80 during reflow at a high temperature, and even when an external force is applied to the electronic component 100, cracks are unlikely to occur in the joint 60 and the multilayer ceramic capacitor 10, and external The bonding strength between the electrode 6 and the lead terminal 80 is sufficient.

  The present invention is not limited to the above embodiment, and various modifications can be made.

  The shape of the lead terminal 80 is not particularly limited, and can be appropriately changed according to the form of the multilayer ceramic capacitor, the place where the electronic component is connected, and the like.

  In the above embodiment, the lead terminal 80 has the surface layer 82. However, the lead terminal 80 can be implemented without the surface layer 82.

  In this specification, the metal is a concept including an alloy.

(Examples 1 to 5, Comparative Examples 1 and 2)
A multilayer ceramic capacitor was prepared. This capacitor has external electrodes 6 at both ends. The external electrode 6 is a layer containing glass frit and Ni. The glass frit was mainly composed of SrO—B ₂ O ₃ —SiO ₂ glass. The Ni content of the external electrode 6 is 90% by mass.

Next, an Ag paste containing Ag metal powder and a vehicle is applied onto the external electrode 6 to form an Ag paste layer, and the Ag paste layer is baked in N ₂ at 500 ° C. An Ag layer was formed as the first metal-containing layer 20.

  Next, an L-shaped lead terminal 80 having an Ag surface layer 82 obtained by plating on the surface of the Fe plate was prepared. The lead terminal 80 and the multilayer ceramic are formed so that a certain gap is generated between the Ag surface layer 82 of the lead terminal 80 and the first metal-containing layer (Ag layer) 20 provided on the external electrode 6 of the multilayer ceramic capacitor 10. The capacitor 10 was placed, and Sn solder paste was injected into the gap between the Ag surface layer and the Ag layer to form a Sn solder paste layer (second metal-containing layer).

  The first metal-containing layer and the second metal-containing layer were heat-treated at 300 ° C. for 10 minutes, and these metals were alloyed to form the joint portion 60 to obtain an electronic component.

  By adjusting the masses of the Ag layer serving as the first metal-containing layer and the Sn solder paste layer serving as the second metal-containing layer, Examples 1 to 5 and Comparative Examples 1 and 2 having different compositions of Sn and Ag in the joint were created. did. In each example, 100 samples were prepared. The conditions and results are shown in Tables 1 and 2. The SEM photograph of the joint part of Example 3 and its vicinity is shown in FIG.

(Example 6)
In Example 6, a sample was prepared as follows.
The same multilayer ceramic capacitor 10 and lead terminal 80 as those of Example 1 were prepared. Next, an Ag paste containing Ag metal powder and a vehicle is applied on the Ag surface layer 82 on the lead terminal side to form an Ag paste layer, and the Ag paste layer is baked in N ₂ at 500 ° C. An Ag layer was formed as the second metal-containing layer 40 on 82.

  Next, the lead terminal 80 and the multilayer ceramic capacitor 10 are arranged so that a certain gap is generated between the external electrode 6 of the multilayer ceramic capacitor 10 and the second metal-containing layer 40, and the external electrode, Ag layer, An Sn solder paste layer (first metal-containing layer) was formed by injecting Sn solder paste into the gap.

  The first metal-containing layer and the second metal-containing layer were heat-treated at 300 ° C. for 10 minutes, and these metals were alloyed to form the joint portion 60 to obtain an electronic component. The composition of the joint was the same as in Example 3.

(Example 7)
As the surface layer 82 on the lead terminal side, it was the same as Example 6 except that the Ni surface layer was used instead of the Ag surface layer.

(Examples 8 to 11, Comparative Examples 3 and 4)
Instead of the Ag paste, a Cu paste containing a Cu metal powder and a vehicle is prepared, applied on the external electrode to form a Cu paste layer, and the Cu paste layer is baked in N ₂ at 500 ° C. A Cu layer was formed thereon as a first metal-containing layer.

  Except this, it carried out similarly to Example 1, and obtained the electronic components of Examples 8-11 and Comparative Examples 3 and 4 from which the composition of Sn and Cu differed. The conditions are shown in Table 1.

(Comparative Example 5)
Comparative Example 5 was the same as Example 1 except that Pd paste was used instead of Ag paste as the first metal-containing layer, a Pd layer was formed, and the metal composition of the joint was as shown in Table 1. did.

(Comparative Example 6)
Instead of the multilayer ceramic capacitor having a layer containing glass frit and Ni as an external electrode, a multilayer ceramic capacitor having a layer containing glass frit and Cu and a Ni plating layer in order from the capacitor chip side was prepared as an external electrode. . An Sn layer as a first metal-containing layer was formed on the outermost Ni layer of the external electrode by plating. Further, Sn solder paste was injected into the gap between this Sn layer and the Ag layer of the lead terminal to form a Sn solder paste layer (second metal-containing layer). The subsequent steps were the same as in Example 1.

(Comparative Example 7)
As an external electrode, a multilayer ceramic capacitor having a layer containing glass frit and Cu (90% by mass) instead of the layer containing glass frit and Ni was prepared. Next, an Ag paste containing an Ag metal powder and a vehicle is applied onto the external electrode to form an Ag paste layer, and the Ag paste layer is baked in N ₂ at 500 ° C. to form the first metal on the external electrode. An Ag layer was formed as the containing layer. Furthermore, Sn solder paste was injected into the gap between this Ag layer and the Ag layer of the lead terminal to form a Sn solder paste layer (second metal-containing layer). The subsequent steps were the same as in Example 1.

(Initial strength measurement method)
The two lead terminals 80 of the electronic component 100 are each fixed to a jig, and as shown in FIG. 1, the tension value when one jig is pulled in the X direction and the other jig is pulled in the -X direction and is broken. Strength.

(Measurement method of strength after heat treatment cycle)
The printed circuit board and the electronic component were joined using an Ag-based conductive adhesive. The reciprocation between −55 ° C. and 250 ° C. was one cycle of heat treatment, one cycle of heat treatment was performed for 1 hour, and a total of 1000 cycles of heat treatment was performed to examine the damaged state of the electronic components. The strength after the heat treatment cycle was measured by the same method as the initial strength.

(Multilayer ceramic capacitor drop-off rate)
In the atmosphere of 250 ° C., the multilayer ceramic capacitor 10 of the electronic component 100 is loaded with a load of 10 N (a level without any actual harm) from the top to the bottom in the state shown in FIG. It was examined whether the multilayer ceramic capacitor 10 was dropped from the terminal 80. Among 100 samples, a numerical value (multilayer ceramic capacitor drop-off rate) consisting of the number of samples from which the capacitors dropped / 100 was obtained.

(Measurement method of cracks)
The presence or absence of cracks in the joint 60 and the multilayer ceramic capacitor 10 itself after the load application in the capacitor drop test was examined. Among 100 samples, a numerical value (crack occurrence rate) consisting of the number of cracked samples / 100 was obtained. The crack was confirmed by polishing the cross section of the joint portion 60 and the multilayer ceramic capacitor 10 and visually.

(Measuring method of metal composition at the joint)
The metal composition in the joint 60 was obtained by polishing an electronic component and analyzing the cross section of the joint with EDX (energy dispersive fluorescent X-ray). For one example, five different analyzes were performed on different portions of the joint section, and the average value was obtained.

(Measurement method of mass% (alloy rate) of alloy in joint)
For the joint formed between the external electrode and the lead terminal of the multilayer ceramic capacitor, a cross section parallel to the direction connecting the external electrode and the lead terminal is formed (see FIG. 3), and the boundary between the joint 60 and the external electrode 6 is formed. To the boundary between the joint 60 and the lead terminal 80, line analysis was performed by EDX, and the concentration (composition) of each atom at each point on the line was analyzed. A place where two or more kinds of metals existed was judged as an alloy. Line analysis was performed at five different points in the same cross section, and the alloy ratio (mass%) of the joint was determined from the average of the ratio of the length of the alloy part in the total length of the line analysis.

  In the embodiment, the multilayer ceramic capacitor does not easily fall off from the lead terminal during reflow at a high temperature, and even when an external force is applied, the joint and the multilayer ceramic capacitor are not likely to crack, and the joint between the external electrode and the lead terminal The strength was sufficient. In Comparative Example 1, the dropping rate of the multilayer ceramic capacitor was higher than in Examples 1 to 5, and in Comparative Example 2, the bonding strength was lower than in Examples 1 to 5. In Comparative Example 3, the multilayer ceramic capacitor drop-off rate was higher than in Examples 8 to 11, and in Comparative Example 4, the bonding strength was lower than in Examples 8 to 11. In Comparative Example 5, since the joint portion did not contain Cu and Ag, the joint portion became a brittle material and cracks were likely to occur. In Comparative Example 6, since the joining portion is only Sn, when it is placed in a high temperature environment, the melting point of Sn is low, so that the multilayer ceramic capacitor easily falls off. In Comparative Example 7, since the external electrode contained a large amount of Cu instead of Ni, the reaction between Cu and Ag progressed, and the diffusion of Ag into Sn was not sufficient, so the bonding strength was low.

  DESCRIPTION OF SYMBOLS 6 ... External electrode, 10 ... Multilayer ceramic capacitor, 20 ... 1st metal containing layer, 40 ... 2nd metal containing layer, 60 ... Joint part, 80 ... Lead terminal, 82 ... Surface layer, 100 ... Electronic component.

Claims (4)

A multilayer ceramic capacitor having external electrodes;
A lead terminal;
A joint for joining the external electrode and the lead terminal;
The external electrode contains 80% by mass or more of Ni,
The joint includes 20 to 80% by mass of Ag and Sn occupying 95% by mass or more of the remaining part, or 25 to 90% by mass of Cu and Sn occupying 95% by mass or more of the remaining part. , Electronic components.   The electronic component according to claim 1, wherein an Sn—Ag alloy or an Sn—Cu alloy occupies 50 mass% or more of the joint. The method includes the step of joining a lead terminal and an external electrode of a multilayer ceramic capacitor, wherein the external electrode contains 80% by mass or more of Ni,
A step of arranging a first metal-containing layer and a second metal-containing layer in order from the external electrode side between the external electrode and the lead terminal;
And B step of melting the first metal-containing layer and the second metal-containing layer to form a joint between the external electrode and the lead terminal, and the following (a) or (b) An electronic component manufacturing method that satisfies any of the above.
(A) The first metal-containing layer contains Ag or Cu, and the second metal-containing layer contains Sn.
(B) The second metal-containing layer contains Ag or Cu, and the first metal-containing layer contains Sn. Satisfy (a)
The step A includes
Applying a paste containing Ag or Cu on the surface of the external electrode, and then heating to form the first metal-containing layer on the surface of the external electrode;
Supplying a paste containing Sn between the first metal-containing layer and the lead terminal to form the second metal-containing layer.