JP7059751B2 - Electronic components and manufacturing methods for electronic components - Google Patents

Description

The present invention relates to an electronic component and a method for manufacturing the electronic component.

Conventionally, there have been known electronic components having a multilayer ceramic capacitor having an external electrode, a lead terminal connected to the external electrode, and a joint portion for joining the lead terminal and the external electrode.

Japanese Unexamined Patent Publication No. 2009-26906 Japanese Patent Application Laid-Open No. 2003-303732 WO2006 / 126352A

However, in conventional electronic components, the monolithic ceramic capacitor tends to fall off from the lead terminal during reflow at high temperature, and cracks easily occur in the joint and the monolithic ceramic capacitor itself when an external force is applied. There is a problem that the bonding strength between the lead terminal and the lead terminal is not sufficient.

The present invention has been made in view of the above problems, and the monolithic ceramic capacitor is less likely to fall off from the lead terminal during reflow at high temperature, and cracks are less likely to occur in the joint and the monolithic ceramic capacitor even when an external force is applied. Moreover, it is an object of the present invention to provide an electronic component and a method for manufacturing the same, in which the bonding strength between the external electrode and the lead terminal is sufficient.

The electronic component according to the present invention includes a monolithic ceramic capacitor having an external electrode, a lead terminal, and a joint portion for joining the external electrode and the lead terminal. The external electrode contains 80% by mass or more of Ni. The joint contains 20-80% by mass of Ag and Sn which occupies 95% by mass or more of the balance, or 25-90% by mass of Cu, and Sn which occupies 95% by mass or more of the balance. ..
It is preferable that the Sn—Ag alloy or Sn—Cu alloy occupies 50% by mass or more of the joint portion. The alloy in the present invention is a concept including a solid solution alloy and an intermetallic compound.

Further, the joint portion can contain 25 to 70% by mass of Ag and Sn which occupies 95% by mass or more of the balance. Further, the joint portion can contain 35 to 80% by mass of Cu and Sn which occupies 95% by mass or more of the balance. In this case, a Sn—Ag alloy having a high mass% of Ag or a Sn—Cu alloy having a high mass% of Cu is widely present in the joint portion.

Further, the lead terminal may have a surface layer at a portion in contact with the joint portion.

The method for manufacturing an electronic component according to the present invention includes a step of joining a lead terminal and an external electrode of a monolithic ceramic capacitor, and the external electrode is a method for manufacturing an electronic component containing 80% by mass or more of Ni. In this method, the first metal-containing layer and the second metal-containing layer are arranged between the external electrode and the lead terminal in order from the external electrode side, step A.
The step B of melting the first metal-containing layer and the second metal-containing layer to form a joint portion between the external electrode and the lead terminal is provided, and the following (a) or (b) is provided. Meet either.
(A) The first metal-containing layer contains Ag or Cu, and the second metal-containing layer contains Sn.
(B) The second metal-containing layer contains Ag or Cu, and the first metal-containing layer contains Sn.

Here, when the above method satisfies (a), the said step A is performed.
A step of applying a paste containing Ag or Cu to the surface of the external electrode and then heating to form the first metal-containing layer on the surface of the external electrode, and
A step of supplying a paste containing Sn between the first metal-containing layer and the lead terminal to form the second metal-containing layer can be provided.

Further, the lead terminal may have a surface layer at a portion in contact with the second metal-containing layer. When the above method satisfies (b), it is preferable that the surface layer of the lead terminal contains 80% by mass or more of Ni.

According to the present invention, the laminated ceramic capacitor is less likely to fall off from the lead terminal during reflow at high temperature, cracks are less likely to occur in the joint and the laminated ceramic capacitor when an external force is applied, and the external electrode and lead terminal due to the joint are less likely to occur. Bonding strength with is ensured.

FIG. 1 is a cross-sectional view of an electronic component according to an embodiment of the present invention. FIG. 2 is a diagram illustrating a method of manufacturing an electronic component, and FIG. 2A is a cross-sectional view showing a state in which a first metal-containing layer and a second metal-containing layer are arranged between a laminated ceramic capacitor and a lead terminal. c) is a cross-sectional view showing a state in which the first metal-containing layer is formed on the external electrode 6 of the multilayer ceramic capacitor 10. FIG. 3 is an SEM photograph of a cross section of the joint portion of Example 3 and its vicinity.

(Electronic parts)
The electronic component 100 according to the embodiment of the present invention will be described with reference to FIG.

The electronic component 100 includes a monolithic ceramic capacitor 10, a lead terminal 80, and a joint portion 60.

The monolithic ceramic capacitor 10 has a capacitor chip 3 and an external electrode 6. The capacitor chip 3 has a large number of internal electrodes 1 arranged apart from each other in the thickness direction, and a ceramic layer 2 that insulates between the internal electrodes 1.
The material of the internal electrode 1 can be a metal material such as Ni, Cu, or Pd.
The material of the ceramic layer 2 can be a ceramic such as barium titanate.

The external electrodes 6 are arranged at both ends of the capacitor chip 3, respectively. A part of the internal electrodes 1 are electrically connected to the external electrode 6 on one side, and the remaining internal electrodes 1 are electrically connected to the external electrode 6 on the other side. In the capacitor chip 3, the internal electrodes 1 connected to the external electrode 6 on one side and the internal electrodes 1 connected to the external electrode 6 on the other side are alternately arranged in the stacking direction.

The external electrode 6 is a layer of a conductive material containing 80% by mass or more of Ni. The Ni content can be 90% by mass or more.

The external electrode 6 preferably contains Ni and glass frit from the viewpoint of adhesiveness to the capacitor chip 3. The amount of glass frit can be 3-10% by mass. The glass frit is mainly composed of at least two oxides selected from Sr, Ca, Ba, Bi, Si, B and Zn, such as Bi ₂ O ₃ -B ₂ O ₃ -SiO ₂ glass. Is preferable.

In addition to the external electrode 6, another conductive layer containing 80% by mass or more of one or more metals selected from the group consisting of Cu, Ag, and Pd may be provided between the external electrode 6 and the capacitor chip 3. .. For example, in a typical embodiment, another conductive layer may contain 80% by mass or more of Cu. Further, another conductive layer may contain Ag or Ag—Pd in an amount of 80% by mass or more. When there is another conductive layer, it is not necessary for the external electrode 6 to contain the glass frit, and it is preferable that the other conductive layer contains the glass frit.

The lead terminal 80 has a main body portion 81 and a surface layer 82 provided on the surface of the main body portion 81. The lead terminal 80 of the present embodiment has an L-shape, and one end thereof faces the external electrode 6.

The material of the main body 81 can be a metal material such as Fe, Ni, or Cu.

The material of the surface layer 82 of the main body 81 is not particularly limited, but as a typical embodiment, Ag can be contained in an amount of 80% by mass or more, or 90% by mass or more, and in another embodiment, Ni is 80. It can be contained in an amount of% by mass or more, or 90% by mass or more. Such a surface layer 82 can be formed by plating.

The joining portion 60 is joined to the surface layer 82 of the lead terminal 80 and the external electrode 6, respectively, and these are electrically connected to each other. The thickness of the joint portion 60 (the length in the direction in which the current flows) is not particularly limited, but may be, for example, 50 to 500 μm.

The joint 60 contains 20-80% by mass of Ag and Sn which occupies 95% by mass or more of the balance (first composition), or 25-90% by mass of Cu, and 95% by mass of the balance. It contains Sn that occupies the above (second composition). Examples of unavoidable impurities in the junction 60 are Na, S, Cl, Bi.

In the joint portion 60 having the first composition, when the mass% of Ag is 20% or more, the portion having a low melting point is reduced and the heat resistance of the joint portion is improved, so that the multilayer ceramic capacitor is less likely to fall off. .. When the mass% of Ag is 80% or less, the portion having low joint strength is reduced, and the high strength of the joint portion can be ensured.
In the joint portion 60 having the second composition, when the mass% of Cu is 25% or more, the portion having a low melting point is reduced and the heat resistance of the joint portion is improved, so that the multilayer ceramic capacitor is less likely to fall off. .. When the mass% of Cu is 90% or less, the portion having low bonding strength is reduced, and the high strength of the bonding portion can be ensured.

Further, the joint portion 60 of the first composition preferably contains 25 to 70% by mass of Ag and Sn which occupies 95% by mass or more of the balance. In this case, a Sn—Ag alloy having a high mass% of Ag is widely present in the joint portion 60. Further, the joint portion 60 of the second composition preferably contains 35 to 80% by mass of Cu and Sn which occupies 95% by mass or more of the balance. In this case, a Sn—Cu alloy having a high mass% of Cu is widely present in the joint portion 60. Since the amount of liquid phase in the joint portion of the electronic component having such characteristics is small in an environment of 250 ° C., the heat resistance can be improved and the monolithic ceramic capacitor can be prevented from falling off.

At the joint 60, Sn can be 98% by mass or more of the balance.

When the joint portion 60 contains 20 to 80% by mass of Ag and Sn which occupies 95% by mass or more of the balance, the Sn—Ag alloy comprises 50% by mass or more (preferably 70% by mass or more) of the joint portion 60. It is preferable to occupy. Further, when the joint portion 60 contains 25 to 90% by mass of Cu and Sn which occupies 95% by mass or more of the balance, 50% by mass or more (preferably 70% by mass or more) of the joint portion 60 is Sn—Cu. It is preferable that the alloy occupies. As used herein, an alloy is a concept including a solid solution alloy and an intermetallic compound.
When the mass% of the Sn—Ag alloy or Sn—Cu alloy in the joint portion 60, that is, the alloy ratio is 50% by mass or more, there is almost no single metal portion in the joint portion 60, and there are few brittle portions. Therefore, cracks are less likely to occur.

In the present embodiment, the stress applied to the monolithic ceramic capacitor 10 can be relaxed by using the lead terminal 80, so that the occurrence of cracks in the monolithic ceramic capacitor 10 itself can be reduced. When the lead terminal 80 has a surface layer 82 containing Ag as a main component, there is an effect that the connection with the wiring circuit is performed more reliably.

(Production method)
Subsequently, the method for manufacturing the above-mentioned electronic component will be described with reference to FIGS. 2 (a) to 2 (b).

First, a monolithic ceramic capacitor 10 and a lead terminal 80 are prepared.

Next, as shown in FIG. 2A, a first metal-containing layer 20 and a second metal-containing layer 40 are placed between the external electrode 6 and the lead terminal 80 in this order from the external electrode 6 side. Deploy.

Here, the first metal-containing layer 20 is in contact with the external electrode 6 and the second metal-containing layer 40. Further, the second metal-containing layer 40 is in contact with the first metal-containing layer 20 and the surface layer 82 of the lead terminal 80.

Here, the first metal-containing layer 20 and the second metal-containing layer 40 satisfy any of the following (a) and (b).

(A) The first metal-containing layer 20 contains Ag or Cu, and the second metal-containing layer 40 contains Sn.
(B) The second metal-containing layer 40 contains Ag or Cu, and the first metal-containing layer 20 contains Sn.

(A) The first metal-containing layer 20 can contain 95% by mass or more of Ag or Cu as a metal component, and the second metal-containing layer 40 can contain 95% by mass or more of Sn as a metal component. ..
(B) The second metal-containing layer 40 can contain Ag or Cu in an amount of 95% by mass or more as a metal component, and the first metal-containing layer 20 can contain Sn in an amount of 95% by mass or more as a metal component.

When each metal-containing layer contains Ag or Cu, it is more preferable that each metal-containing layer contains 99% by mass or more of Ag or Cu as a metal component.
When each metal-containing layer contains Sn, it is more preferable that each metal-containing layer contains 99% by mass or more of Sn as a metal component.
Such a metal-containing layer can be a metal paste layer. The metal paste contains a metal component such as a metal powder and a non-metal component. The non-metal component includes a resin component and a solvent. Examples of metal particles are Ag particles, Cu particles, and Sn particles.
The metal-containing layer may be a metal paste layer, or may be a metal layer obtained by baking (heat-treating) the metal paste layer to remove the resin component and the solvent in the paste.

Of (a) and (b), (a) is more preferable from the viewpoint of cost of the manufacturing process.

In the case of (a), it is preferable to do as follows. First, a paste containing Ag or Cu is applied to the surface of the external electrode 6, and then the paste is heat-treated to contain Ag or Cu on the external electrode 6 as shown in FIG. 2 (b). The first metal-containing layer 20 is formed. After that, the lead terminal 80 is arranged so that a gap is formed between the surface layer 82 of the lead terminal 80 and the first metal-containing layer 20, and a paste containing Sn is supplied to the gap to generate Sn as a metal component. The second metal-containing layer 40 to be contained is formed.

In the case of (b), it is preferable to do as follows. First, a paste containing Ag or Cu is applied to the surface of the surface layer 82 of the lead terminal 80, and then the paste is heat-treated to form a second metal-containing layer 40 containing Ag or Cu on the lead terminal 80. Form. After that, the multilayer ceramic capacitor 10 is arranged so as to form a gap between the external electrode 6 and the second metal-containing layer 40, and a paste containing Sn is supplied to the gap to contain Sn as a metal component. The first metal-containing layer 20 is formed. In this case, the surface layer 82 of the lead terminal 80 preferably contains 80% by mass or more of Ni. Since Ag and Cu do not easily react with Ni under the condition of 500 ° C. or lower, they can easily form an alloy with Sn.

Subsequently, the first metal-containing layer 20 and the second metal-containing layer 40 are heat-treated and melted to form a joint portion 60 containing an alloy for joining the external electrode 6 and the lead terminal 80, and the electrons shown in FIG. 1 are formed. Obtain the component 100. Conventionally, the heat treatment could not be sufficiently melted unless the temperature of the heat treatment was 600 ° C. or higher, but according to the present embodiment, the heat treatment temperature may be 232 to 500 ° C. as long as it is equal to or higher than the melting point of Sn. There can be.

According to such a method, since Ag or Cu mutually diffuses with Sn more than Ni of the external electrode 6, it is easy to form the joint portion 60 containing the Sn—Ag alloy and the Sn—Cu alloy. Specifically, in the joint portion 60, a Sn—Ag alloy having a high mass% concentration of Ag or a Sn—Cu alloy having a high mass% concentration of Cu can be widely present. Therefore, the electronic component having the joint portion containing such an alloy has a small amount of liquid phase in the joint portion even in an environment of 250 ° C., so that the heat resistance is improved.

(Action)
According to the electronic component 100 according to the present embodiment, it has an external electrode 6 containing 80% by mass or more of Ni, and a joint portion 60 having the above-mentioned composition. While Ni and Ag, or Ni and Cu are poorly reactive with each other, Ag or Cu easily diffuses into Sn that is melted by heat treatment. Therefore, a Sn—Ag alloy or a Sn—Cu alloy having a high melting point and a high bonding strength is likely to be formed at the bonding portion. Further, the use of the lead terminal 80 can relieve the stress applied to the monolithic ceramic capacitor 10. As a result, the monolithic ceramic capacitor 10 is less likely to fall off from the lead terminal 80 during reflow at high temperature, cracks are less likely to occur in the joint 60 and the monolithic ceramic capacitor 10 even when an external force is applied to the electronic component 100, and the outside. The bonding strength between the electrode 6 and the lead terminal 80 is sufficient.

The present invention is not limited to the above embodiment, and various modifications can be taken.

The shape of the lead terminal 80 is not particularly limited, and can be appropriately deformed according to the form of the monolithic ceramic capacitor, the place where the electronic component is connected, and the like.

Further, in the above embodiment, the lead terminal 80 has the surface layer 82, but it can be carried out even if the lead terminal 80 does not have the surface layer 82.

In addition, in this specification, a metal is a concept including an alloy.

(Examples 1 to 5, Comparative Examples 1 and 2)
A monolithic ceramic capacitor was prepared. This capacitor has external electrodes 6 at both ends. The external electrode 6 is a layer containing glass frit and Ni. The main component of the glass frit was SrO-B ₂ O ₃ -SiO ₂ glass. The Ni content of the external electrode 6 is 90% by mass.

Next, an Ag paste containing a metal powder of Ag and a vehicle is applied onto the external electrode 6 to form an Ag paste layer, and the Ag paste layer is baked in _N2 at 500 ° C. onto the external electrode 6. An Ag layer was formed as the first metal-containing layer 20.

Next, an L-shaped lead terminal 80 having an Ag surface layer 82 obtained by plating on the surface of the Fe plate was prepared. The lead terminal 80 and the laminated ceramic so that a certain gap is formed between the Ag surface layer 82 of the lead terminal 80 and the first metal-containing layer (Ag layer) 20 provided on the external electrode 6 of the laminated ceramic capacitor 10. A capacitor 10 was arranged, and Sn solder paste was injected into the gap between the Ag surface layer and the Ag layer to form a Sn solder paste layer (second metal-containing layer).

The first metal-containing layer and the second metal-containing layer were heat-treated at 300 ° C. for 10 minutes, and these metals were alloyed to form a joint portion 60 to obtain an electronic component.

By adjusting the masses of the Ag layer as the first metal-containing layer and the Sn solder paste layer as the second metal-containing layer, Examples 1 to 5 and Comparative Examples 1 and 2 having different compositions of Sn and Ag at the joint were prepared. bottom. In each example, 100 samples were prepared. The conditions and results are shown in Tables 1 and 2. FIG. 3 shows an SEM photograph of the joint portion of Example 3 and its vicinity.

(Example 6)
In Example 6, a sample was prepared as follows.
The same monolithic ceramic capacitor 10 and lead terminal 80 as in Example 1 were prepared. Next, an Ag paste containing an Ag metal powder and a vehicle is applied onto the Ag surface layer 82 on the lead terminal side to form an Ag paste layer, and the Ag paste layer is baked in _N2 at 500 ° C. to form an Ag surface layer. An Ag layer was formed on the 82 as the second metal-containing layer 40.

Next, the lead terminal 80 and the laminated ceramic capacitor 10 are arranged so that a certain gap is formed between the external electrode 6 of the laminated ceramic capacitor 10 and the top of the second metal-containing layer 40, and the external electrode and the Ag layer are arranged. Sn solder paste was injected into the gap between the two to form a Sn solder paste layer (first metal-containing layer).

The first metal-containing layer and the second metal-containing layer were heat-treated at 300 ° C. for 10 minutes, and these metals were alloyed to form a joint portion 60 to obtain an electronic component. The composition of the joint was the same as in Example 3.

(Example 7)
The surface layer 82 on the lead terminal side was the same as in Example 6 except that a Ni surface layer was used instead of an Ag surface layer.

(Examples 8 to 11, Comparative Examples 3 and 4)
Instead of Ag paste, Cu paste containing Cu metal powder and vehicle is prepared, applied on an external electrode to form a Cu paste layer, and the Cu paste layer is baked in _N2 at 500 ° C. to form an external electrode. A Cu layer was formed on the first metal-containing layer.

Other than this, the same as in Example 1 was performed, and electronic components of Examples 8 to 11 and Comparative Examples 3 and 4 having different Sn and Cu compositions were obtained. The conditions are shown in Table 1.

(Comparative Example 5)
Comparative Example 5 is the same as that of Example 1 except that the Pd paste is used instead of the Ag paste as the first metal-containing layer to form the Pd layer and the metal composition of the joint is as shown in Table 1. bottom.

(Comparative Example 6)
Instead of a laminated ceramic capacitor having a layer containing glass frit and Ni as an external electrode, a layer containing glass frit and Cu and a laminated ceramic capacitor having a Ni plating layer were prepared as external electrodes in order from the capacitor chip side. .. A Sn layer was formed by plating on the outermost Ni layer of the external electrode as a first metal-containing layer. Further, the Sn solder paste was injected into the gap between the Sn layer and the Ag layer of the lead terminal to form a Sn solder paste layer (second metal-containing layer). From this point onward, the same procedure as in Example 1 was applied.

(Comparative Example 7)
As an external electrode, a laminated ceramic capacitor having a layer containing glass frit and Cu (90% by mass) was prepared instead of the layer containing glass frit and Ni. Next, an Ag paste containing Ag metal powder and a vehicle is applied onto an external electrode to form an Ag paste layer, and the Ag paste layer is baked in _N2 at 500 ° C. to form a first metal on the external electrode. An Ag layer was formed as a content layer. Further, Sn solder paste was injected into the gap between the Ag layer and the Ag layer of the lead terminal to form a Sn solder paste layer (second metal-containing layer). From this point onward, the same procedure as in Example 1 was applied.

(Initial strength measurement method)
The two lead terminals 80 of the electronic component 100 are fixed to each jig, and as shown in FIG. 1, one jig is pulled in the X direction and the other jig is pulled in the −X direction, and the tension value at the time of breaking is determined. The strength was set.

(Method of measuring strength after heat treatment cycle)
The printed circuit board and the electronic component were bonded using an Ag-based conductive adhesive. The round trip between −55 ° C. and 250 ° C. was regarded as one cycle of heat treatment, and one cycle of heat treatment was performed over 1 hour, and a total of 1000 cycles of heat treatment were performed to examine the damaged state of electronic components. The strength after the heat treatment cycle was measured by the same method as the initial strength.

(Laminate ceramic capacitor dropout rate)
In an atmosphere of 250 ° C., a load of 10 N (a level that does not cause actual damage) is applied from top to bottom on the monolithic ceramic capacitor 10 of the electronic component 100 in the state of FIG. 1, and the joint portion 60 is remelted to cause a lead. It was investigated whether or not the monolithic ceramic capacitor 10 was dropped from the terminal 80. A numerical value (multilayer ceramic capacitor dropout rate) consisting of 100 samples out of 100 samples was obtained.

(Measurement method of crack)
After the load was applied in the capacitor dropout test, the presence or absence of cracks in the joint portion 60 and the multilayer ceramic capacitor 10 itself was examined. A numerical value (crack generation rate) consisting of the number of samples in which cracks occurred / 100 out of 100 samples was obtained. The cracks were visually confirmed by polishing the cross sections of the joint portion 60 and the multilayer ceramic capacitor 10.

(Measuring method of metal composition at the joint)
The composition of the metal in the joint portion 60 was determined by polishing the electronic component and analyzing the cross section of the joint portion with EDX (energy dispersive X-ray fluorescence). For one example, different parts of the cross section of the joint were analyzed five times, and the average value was obtained.

(Measuring method of alloy mass% (alloy ratio) at the joint)
Regarding the joint formed between the external electrode and the lead terminal of the multilayer ceramic capacitor, a cross section parallel to the direction connecting the external electrode and the lead terminal is formed (see FIG. 3), and the boundary between the joint 60 and the external electrode 6 is formed. Then, line analysis was performed with EDX up to the boundary between the junction 60 and the lead terminal 80, and the concentration (composition) of each atom at each point on the line was analyzed. The place where two or more kinds of metals existed was judged to be an alloy. Line analysis was performed at five different locations within the same cross section, and the alloy ratio (mass%) of the joint was determined from the average of the ratio of the length of the alloy portion to the total length of the line analysis.

In the embodiment, the monolithic ceramic capacitor does not easily fall off from the lead terminal during reflow at high temperature, cracks do not easily occur in the joint and the monolithic ceramic capacitor even when an external force is applied, and the external electrode and the lead terminal are joined. The strength was sufficient. In Comparative Example 1, the dropout rate of the laminated ceramic capacitor was larger than in Examples 1 to 5, and in Comparative Example 2, the bonding strength was lower than that in Examples 1 to 5. In Comparative Example 3, the dropout rate of the laminated ceramic capacitor was larger than in Examples 8 to 11, and in Comparative Example 4, the bonding strength was lower than that in Examples 8 to 11. In Comparative Example 5, since the joint portion did not contain Cu and Ag, the joint portion became a brittle material and cracks were likely to occur. In Comparative Example 6, since the joint portion is only Sn, the melting point of Sn is low when it is placed in a high temperature environment, so that the multilayer ceramic capacitor easily falls off. In Comparative Example 7, since the external electrode contained a large amount of Cu instead of Ni, the reaction between Cu and Ag proceeded, and the diffusion of Ag into Sn was not sufficient, so that the bonding strength was low.

6 ... External electrodes, 10 ... Multilayer ceramic capacitors, 20 ... First metal-containing layer, 40 ... Second metal-containing layer, 60 ... Joints, 80 ... Lead terminals, 82 ... Surface layers, 100 ... Electronic components.

Claims (4)

Multilayer ceramic capacitors with external electrodes and
With the lead terminal
A joint portion for joining the external electrode and the lead terminal is provided.
The external electrode contains 80% by mass or more of Ni and contains 80% by mass or more.
The joint contains 20 to 80% by mass of Ag and Sn which occupies 95% by mass or more of the balance, or 25 to 90% by mass of Cu, and Sn which occupies 95% by mass or more of the balance. fruit,
An electronic component in which the external electrode and the joint are in direct contact with each other . The electronic component according to claim 1, wherein 50% by mass or more of the joint portion is occupied by a Sn—Ag alloy or a Sn—Cu alloy. The method for manufacturing an electronic component according to claim 1 or 2 , further comprising a step of joining a lead terminal and an external electrode of a monolithic ceramic capacitor, wherein the external electrode contains 80% by mass or more of Ni.
Step A, in which the first metal-containing layer and the second metal-containing layer are arranged in order from the external electrode side between the external electrode and the lead terminal.
The step B of melting the first metal-containing layer and the second metal-containing layer to form a joint portion between the external electrode and the lead terminal is provided, and the following (a) or (b) is provided. A method of manufacturing electronic components that meets any of the above requirements.
(A) The first metal-containing layer contains Ag or Cu, and the second metal-containing layer contains Sn.
(B) The second metal-containing layer contains Ag or Cu, and the first metal-containing layer contains Sn. Satisfy (a)
The step A is
A step of applying a paste containing Ag or Cu to the surface of the external electrode and then heating to form the first metal-containing layer on the surface of the external electrode.
The method according to claim 3, further comprising a step of supplying a paste containing Sn between the first metal-containing layer and the lead terminal to form the second metal-containing layer.

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