JP2019172915A - Temporal adhesive film used for manufacturing electronic device, support substrate for manufacturing electronic package, and manufacturing method of electronic package - Google Patents

Abstract

To suppress generation of problems such as defective plating in a temporally adhered element in manufacturing an electronic package including a temporal adhesion process.SOLUTION: There is provided a temporal adhesive film used for manufacturing an electronic device, in which X-Xis 7 mass% or less, wherein Xmass% is amount of a carbon atom based on a copper atom when the temporal adhesive film and a first surface of a copper foil with arithmetic mean surface roughness of a first surface of 0.4 μm are thermal compression bond under a constant condition, the copper foil is peeled from the temporal adhesive film, and an element composition of the first surface of the peeled copper foil is measured by an energy dispersion type X ray analysis with an electron beam with accelerating voltage of 10 kV as a primary ray, and Xmass% is amount of the carbon atom based on the copper atom when the element composition of the first surface of the copper foil before thermal compression bond is measured by same energy dispersion type X ray analysis. There is provided a temporal adhesive film of which adhesive force is reduced or eliminated by exposure, and which can manufacture the temporal adhesive film by exposure with i ray of 2000 mJ/cm.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a temporary adhesive film used for manufacturing an electronic device, a support substrate for manufacturing an electronic package, and a method for manufacturing the electronic package. More specifically, the present invention relates to a temporary adhesive film used for manufacturing an electronic device, an electronic package manufacturing support substrate including the temporary adhesive film, and an electronic package manufacturing method using the support substrate.

  In manufacturing an electronic package, a process of temporarily fixing or bonding a substrate or an element to a support substrate (often referred to as temporary bonding or temporary fixing) may be performed. In addition, materials and processes for temporary bonding and temporary fixing are actively studied.

  For example, in Patent Document 1, as a solution to problems such as “easy temporary adhesion between a wafer and a support substrate”, a first temporary adhesive layer made of a polyimide resin film and an adhesive containing a curable silicone resin The laminated body for wafer processing which has a 2nd temporary adhesive material layer which consists of a cured film of an agent composition is described.

  Patent Document 2 discloses a technique that includes a temporary fixing process and that can achieve both thinning and low warpage of a semiconductor package and provide a thin semiconductor device with high yield. Specifically, after manufacturing a semiconductor package sealed with a sealing material, a step of temporarily fixing a warp correction substrate to the surface of the semiconductor package, a step of reflowing, and removing the warp correction substrate from the semiconductor package after reflow A method of manufacturing a semiconductor device including a process for performing the process is disclosed.

JP, 2006-86158, A JP 2006-072254 A

As described above, in the manufacture of electronic devices, various studies are being made on temporary bonding or temporary fixing (hereinafter, unified by the term “temporary bonding”).
However, according to the study by the present inventors, when the element or substrate temporarily bonded to the support substrate is peeled off from the support substrate and then further processing is performed on the element or substrate, a problem may occur. It was.
For example, when gold plating is applied to an element, a substrate, a wiring structure, etc. that are peeled off from a support substrate, gold plating cannot be performed properly, or gold cannot be properly deposited due to abnormal deposition. There was a case.

  The present invention has been made in view of such circumstances. An object of the present invention is to reduce the occurrence of defects such as defective plating in a temporarily bonded element, substrate, wiring structure, etc., in the manufacture of an electronic package including a temporary bonding step.

  The present inventors have examined the cause of the above-described problems and the solutions thereof from various viewpoints. As a result of the investigation, when the temporary adhesive film and a specific copper foil are thermocompression bonded and then the copper foil is peeled off, the micro organic matter that adheres to the copper foil surface is related to defects such as plating defects. I found out that it seems to be. Further studies were made based on this finding, and the following invention was completed.

According to the present invention,
A temporary adhesive film used in the manufacture of electronic devices,
Thermobonding the temporary adhesive film and the first surface of the first copper foil having an arithmetic average surface roughness Ra of 0.4 μm on the first surface at a temperature of 40 ° C., a pressure of 0.2 MPa, and a time of 30 seconds. And then temporarily bonded by heating at 150 ° C. for 1 hour, and the first copper foil is peeled off from the temporary adhesive film, and the elemental composition of the first surface of the peeled first copper foil is determined. The amount of carbon atoms relative to copper atoms when measured by an energy dispersive X-ray analysis method using an electron beam with an acceleration voltage of 10 kV as a primary line is _Xf mass%,
When when the elemental composition of the first surface of the first copper foil before the thermocompression bonding was measured by the energy dispersive X-ray analysis, the amount of carbon atoms to copper atoms was X _i mass%,
Temporary adhesive film in which the carbon atom increasing amount represented by X _f -X _i is equal to or less than 7 mass% is provided. This invention is also referred to as “first invention”.

Moreover, according to the present invention,
A first substrate;
Provided is a support substrate for manufacturing an electronic package comprising the temporary adhesive film of the first invention provided on one side of the first substrate. This invention is also referred to as “second invention”.

Moreover, according to the present invention,
A temporary bonding step of temporarily bonding the temporary adhesive film provided on the support substrate of the second invention and the second substrate to obtain a composite substrate;
An arrangement step of arranging an electronic element on the second substrate in the composite substrate when the composite substrate is viewed from above with a surface of the second substrate as an upper surface;
A sealing step of applying a sealing composition to the electronic elements arranged in the arrangement step, and obtaining a sealing substrate in which the electronic elements are sealed with a cured product of the sealing composition;
A cutting step of cutting at least a part of the sealing substrate;
A separation step of separating the support substrate and the second substrate;
A method for manufacturing an electronic package is provided. This invention is also referred to as “third invention”.

Moreover, according to the present invention,
A temporary adhesive film used in the manufacture of electronic devices,
The temporary adhesive film has the property that the adhesive strength is reduced or disappears by exposure,
The temporary adhesive film exposed with i-line of 2000 mJ / cm ² and the first surface of the first copper foil having an arithmetic average surface roughness Ra of 0.4 μm on the first surface, a temperature of 40 ° C. and a pressure Thermocompression bonding was performed at 0.2 MPa for 30 seconds, followed by temporary bonding at 150 ° C. for 1 hour, and the first copper foil was peeled off from the temporary adhesive film, and the first copper film was peeled off. When the elemental composition of the first surface of the copper foil is measured by energy dispersive X-ray analysis using an electron beam with an acceleration voltage of 10 kV as a primary line, the amount of carbon atoms relative to copper atoms is _Yf mass%,
When the elemental composition of the first surface of the first copper foil before the thermocompression bonding is measured by the energy dispersive X-ray analysis method, when the amount of carbon atoms relative to copper atoms is Y _i mass%,
Temporary adhesive film weight increased carbon atoms represented by Y _f -Y _i is less than 7 mass% is provided. This invention is also referred to as “fourth invention”.

Moreover, according to the present invention,
A first substrate;
Provided is a support substrate for manufacturing an electronic package comprising the temporary adhesive film of the fourth invention provided on one side of the first substrate. This invention is also referred to as “fifth invention”.

Moreover, according to the present invention,
Exposing the temporary adhesive film of the support substrate for manufacturing an electronic package of the fifth invention, and providing an area A having a strong adhesive force and a region B having a weaker adhesive force than the region A;
A temporary bonding step of temporarily bonding the temporary adhesive film and the second substrate exposed in the exposure step to obtain a composite substrate;
An arrangement step of arranging an electronic element so as to overlap with the region B when the composite substrate is viewed from above with a surface of the second substrate as an upper surface;
A sealing step of applying a sealing composition to the electronic elements arranged in the arranging step to obtain a sealing substrate in which the electronic elements are sealed with a cured product of the sealing composition; A cutting step of cutting at least a part of the sealing substrate;
A separation step of separating the support substrate and the second substrate;
A method for manufacturing an electronic package is provided. This invention is also referred to as “sixth invention”.

  ADVANTAGE OF THE INVENTION According to this invention, in manufacture of the electronic package including a temporary bonding process, it can reduce that malfunctions, such as a plating defect, arise in the element, the board | substrate, wiring structure, etc. which were temporarily bonded.

It is a figure which shows typically the manufacturing process etc. of the electronic package of 1st Embodiment. It is a figure which shows typically the manufacturing process etc. of the electronic package of 1st Embodiment. It is a figure which shows typically the manufacturing process etc. of the electronic package of 2nd Embodiment. It is a figure which shows typically the manufacturing process etc. of the electronic package of 2nd Embodiment. It is a figure which shows typically the measuring method of peeling strength.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In all the drawings, the same components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.
In order to avoid complications, (i) when there are a plurality of identical components in the same drawing, only one of them is given a reference, and all are not attached, or (ii) 2 and later, the same components as in FIG. 1 may not be denoted again.
All drawings are for illustrative purposes only. The shape and dimensional ratio of each member in the drawings do not necessarily correspond to an actual article.

In this specification, the term “substantially” means that it includes a range that takes into account manufacturing tolerances, assembly variations, and the like, unless otherwise specified.
In the present specification, the notation “ab” in the description of the numerical range represents a range from a to b unless otherwise specified. For example, “1 to 5% by mass” means “1 to 5% by mass”.

In the notation of a group (atomic group) in this specification, the notation which does not describe substitution or non-substitution includes both those having no substituent and those having a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
The notation “(meth) acryl” in the present specification represents a concept including both acrylic and methacrylic. The same applies to similar notations such as “(meth) acrylate”.
In this specification, an “electronic package” refers to an electronic element (typically a semiconductor chip) sealed in some form with a sealing material.

  Hereinafter, the first, second, and third embodiments will be described as <first embodiment>, and the fourth, fifth, and sixth embodiments will be described as <second embodiment>. To do.

<First Embodiment>
[Temporary adhesive film]
The temporary adhesive film of 1st Embodiment is used for manufacture of an electronic device.
This temporary adhesive film and the first surface of the first copper foil having an arithmetic average surface roughness Ra of 0.4 μm on the first surface are thermocompression bonded at a temperature of 40 ° C., a pressure of 0.2 MPa, and a time of 30 seconds. Then, heating is performed at 150 ° C. for 1 hour for temporary bonding, and the first copper foil is peeled off from the temporary bonding film, and the elemental composition of the first surface of the peeled first copper foil is changed to an acceleration voltage of 10 kV. The amount (ratio) of carbon atoms with respect to copper atoms when measured by an energy dispersive X-ray analysis method using an electron beam as a primary beam is _Xf mass%,
When the elemental composition of the first surface of the first copper foil before thermocompression bonding is measured by the same energy dispersive X-ray analysis method (using an electron beam with an acceleration voltage of 10 kV as a primary line) as described above, when the amount of carbon atoms (ratio) and X _i mass%,
Carbon atoms increase represented by X _f -X _i is less than 7 mass%.

  The reason why such a temporary adhesive film can reduce the occurrence of defects such as defective plating in the temporarily bonded elements, substrates, wiring structures, etc. can be explained as follows. The following description includes a guess, and the present invention is not limited to the following description.

The present inventors have examined the causes of defects such as poor plating in elements, substrates, wiring structures, etc. that have been temporarily bonded using conventional temporary bonding films from various viewpoints.
As a result of the study, the elements, substrates, wiring structures, etc. removed from the temporary adhesive film are clean at first glance, and the residue of the temporary adhesive film cannot be confirmed visually or with an optical microscope, but cannot be confirmed visually or with an optical microscope. It was speculated that an organic substance derived from a temporary adhesive film adhered, which caused plating defects and the like.

Based on the above assumption, the present inventors first represented a first copper foil having an arithmetic average surface roughness Ra of 0.4 μm as a representative element or substrate that can come into contact with the temporary adhesive film. Prepared. Then, when the first surface of the first copper foil and the temporary adhesive film are bonded, and then the first copper foil is peeled off, “organic matter attached to the first surface of the first copper foil, etc. With the amount of "a" as a control factor, we designed a temporary adhesive film with this value below a certain value to solve problems such as plating defects.
In addition, energy dispersive X-rays using an electron beam with an accelerating voltage of 10 kV as a primary line for quantification of minute organic substances that adhere to the first surface of the first copper foil and cannot be confirmed visually or with an optical microscope. We decided to use the analytical method.

As a result of various studies, the present inventors have
-Temporary adhesion of the temporary adhesive film and the first copper foil under conditions close to the actual process (temperature 40 ° C, pressure 0.2 MPa, time 30 seconds, then heated at 150 ° C for 1 hour), Thereafter, the first copper foil is peeled off, and the elemental composition of the first surface of the first copper foil is measured by energy dispersive X-ray analysis using an electron beam with an acceleration voltage of 10 kV as a primary line. The amount (ratio) of carbon atoms to atoms is X _f mass%,
Energy dispersive X-ray similar to the above (with an electron beam with an accelerating voltage of 10 kV as the primary line) for the elemental composition of the first surface of the first copper foil before being thermocompression bonded / temporarily bonded to the temporary adhesive film when measured by analytical method, when the amount of carbon atoms to copper atoms (ratio) was X _i mass%,
X _f -X carbon atoms increase represented by _i is newly designed temporary adhesive film equal to or less than 7 mass%. With such a temporary adhesive film, defects such as plating defects could be reduced.

Such a temporary adhesive film can be obtained by appropriately devising the type and amount of components constituting the temporary adhesive film, the method for producing the temporary adhesive film, and the like. The temporary adhesive film is typically composed of a thermosetting resin composition.
More specifically, at least one polymerizable compound selected from the group consisting of an epoxy compound and a polymerizable (meth) acrylate compound is used as a material for the temporary adhesive film, filler particles are used, and these amounts are determined. be suitably, such as by devising a method of preparing or film, it is possible to obtain a temporary adhesive film carbon atoms increase represented by X _f -X _i is equal to or less than 7 mass%.
Details of the types and blending amounts of each component constituting the temporary adhesive film, the manufacturing method, and the like will be described later.

It goes without saying that the value of X _f −X _i is preferably as close to 0 as possible. The value of X _f -X _i is preferably 5 mass% or less, more preferably 4 wt% or less, still more preferably less 3 wt%.

It supplements about "the first copper foil" and "energy dispersive X-ray analysis method".
The first copper foil is, for example, a glossy surface of copper foil (product number: 3EC-M3-VLP, thickness: 12 μm, arithmetic average surface roughness Ra: 0.2 μm of glossy surface) manufactured by Mitsui Mining & Mining Co., Ltd. It can obtain by performing the process like. Of course, the method of obtaining the first copper foil is not limited to this.
(1) First, the copper foil is immersed in a pre-etching treatment solution (for example, product name: CA-5330A manufactured by MEC Co., Ltd. diluted to 50 vol% with pure water). The temperature of the pretreatment liquid is adjusted to about 25 ° C., and the immersion time is about 10 seconds.
(2) Subsequently, the pretreated copper foil is placed on a horizontal line and sprayed with a copper etching solution (for example, trade name: CZ-8101 stock solution manufactured by MEC Co., Ltd.). The spray pressure is about 0.2 MPa, and the spraying time is about 30 seconds. The temperature of the copper etchant is adjusted to about 25 ° C.
(3) The copper foil after the spray treatment is immersed in a rust inhibitor (for example, product name: CL-8301, diluted with pure water to 50 vol%). The temperature of the rust inhibitor is adjusted to about 25 ° C. The immersion time is about 15 seconds.
(4) After the immersion, the copper foil is dried. Drying conditions are about 120 ° C. and about 30 minutes.

  For the convenience of forming a rust preventive film on the surface by the rust preventive treatment of (3) above, the surface of the copper foil obtained by the above method is typically about 3% by mass with respect to copper atoms. Inevitable amounts of carbon atoms (can be confirmed by energy dispersive X-ray analysis).

  Incidentally, the definition / measurement method of Ra is based on JIS B 0601: 2013.

The energy dispersive X-ray analysis method is a technique for performing elemental analysis and composition analysis by detecting characteristic X-rays generated by electron beam irradiation and performing spectral analysis with energy. Since characteristic X-rays have energy inherent to each element, elemental analysis can be performed by measuring this characteristic X-ray.
Energy dispersive X-ray analysis is an acronym for Energy Dispersive X-ray Spectroscopy and is also called EDX or EDS.
An apparatus for performing energy dispersive X-ray analysis is often attached to a scanning electron microscope (SEM) or transmission electron microscope (TEM).
In 1st Embodiment (and 2nd Embodiment mentioned later), the residue of the temporary adhesive film adhering to the surface when peeling copper foil is set by making the acceleration voltage of the electron beam (primary line) to irradiate into 10 kV. Can be appropriately evaluated.

Moreover, the temporary adhesive film of 1st Embodiment and the one side of the 2nd copper foil whose arithmetic mean surface roughness Ra of at least one side is 0.2 micrometer are temperature 60 degreeC, pressure 0.3 MPa, time 30 seconds. After that, when the second copper foil is peeled off from the temporary adhesive film, the peel strength is 0.1 [kN / m] or more. It is preferable that
When the peel strength is 0.1 [kN / m] or more, a sufficient adhesive force can be obtained. And in the manufacture of the electronic package described later, it is possible to reduce problems such as peeling of the second substrate.
The peel strength is preferably 0.1 to 0.5 [kN / m], more preferably 0.15 to 0.4 [kN / m], and still more preferably 0.2 to 0.3. [KN / m].

  The method of adjusting the peel strength is not particularly limited, but the peel strength is adjusted by appropriately devising the type and amount of each component constituting the temporary adhesive film and the method of manufacturing the temporary adhesive film. can do. In particular, the use of at least one polymerizable compound selected from the group consisting of an epoxy compound and a polymerizable (meth) acrylate compound as a material, the use of filler particles, the appropriate amount thereof, preparation and production The peel strength can be adjusted appropriately by devising the film method.

  In addition, as the second copper foil, for example, the above-mentioned copper foil manufactured by Mitsui Mining Co., Ltd. (product number: 3EC-M3-VLP, thickness: 12 μm, arithmetic average surface roughness Ra: 0.2 μm of glossy surface) A glossy surface can be used.

The components contained in the temporary adhesive film of the first embodiment will be described.
Note that the temporary adhesive film of the first embodiment is typically a thermosetting resin composition. And preferably, 1 type or 2 types or more of the component demonstrated below is included.

(Epoxy resin)
The temporary adhesive film of the first embodiment preferably contains an epoxy resin and / or a polymerizable (meth) acrylate compound described later.
Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, bisphenol M type epoxy resin, bisphenol P type epoxy resin, and bisphenol Z type epoxy resin. Bisphenol type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin and other novolak type epoxy resin, biphenyl type epoxy resin, aryl aralkyl type epoxy resin having biphenylene skeleton, arylalkylene type epoxy resin, naphthalene type epoxy resin, Anthracene type epoxy resin, phenoxy type epoxy resin, dicyclopentadiene type epoxy resin, norbornene type epoxy resin, adamantane type Epoxy resins, epoxy resins, such as a fluorene epoxy resin.

The epoxy equivalent of an epoxy resin is 100 or more, for example, 150-5000 are preferable, 150-1000 are more preferable, 150-500 are more preferable.
The epoxy resin includes an epoxy resin having at least one of an aromatic ring structure (such as a benzene ring structure) and an alicyclic structure (an alicyclic carbocyclic structure) as a curable resin having a polyfunctional epoxy group. Is preferred.
The epoxy resin is typically polyfunctional (bifunctional or higher).

As one aspect, the epoxy resin preferably contains a phenoxy resin.
Examples of the phenoxy resin include a phenoxy resin having a bisphenol skeleton, a phenoxy resin having a naphthalene skeleton, a phenoxy resin having an anthracene skeleton, a phenoxy resin having a biphenyl skeleton, and a phenoxy resin having an imide skeleton. A phenoxy resin having a structure having a plurality of these skeletons can also be used.

  In particular, it is preferable to use a bisphenol A type, bisphenol F type phenoxy resin, a phenoxy resin having an imide skeleton, or a phenoxy resin having a bisphenolacetophenone skeleton. Moreover, you may use the phenoxy resin which has several frame | skeleton among the above.

Although the weight average molecular weight of a phenoxy resin is not specifically limited, 5.0 * 10 < ³ > -8.0 * 10 < ⁴ > is preferable. In the present specification, the weight average molecular weight is a value in terms of polystyrene measured by gel permeation chromatography (GPC) unless otherwise specified.
Moreover, the epoxy equivalent of a phenoxy resin is 1000-30000, for example, More preferably, it is 5000-20000.

As one embodiment, it is preferable that an epoxy resin that is not a phenoxy resin and a phenoxy resin are used in combination. Thereby, the curing rate can be increased. As a result, an effect of increasing the throughput of the process can be expected in the manufacture of the electronic package described later.
The amount ratio between the epoxy resin that is not a phenoxy resin and the phenoxy resin is not particularly limited, but is, for example, 9: 1 to 5: 5, preferably 9: 1 to 6: 4 (mass ratio).

  The content of the epoxy resin in the temporary adhesive film (when a plurality of types of epoxy resins are used in combination) is, for example, 20 to 98% by mass, preferably 30 to 96% by mass, and more preferably 35 to 90% by mass. %, More preferably 55 to 90% by mass.

  As the epoxy resin (including phenoxy resin), a known one or a commercially available one can be used as appropriate. As a commercial item, things, such as Mitsubishi Chemical Corporation, Nippon Kayaku Co., Ltd., Nippon Steel & Sumikin Chemical Co., Ltd., are mentioned, for example.

(Polymerizable (meth) acrylate compound)
The polymerizable (meth) acrylate compound is a compound having a (meth) acryloyl group that can be polymerized by light, heat, or other external stimulus. The polymerizable (meth) acrylate compound is preferably bifunctional or more (having two or more (meth) acryloyl groups in one molecule), and more preferably 2 to 6 functional.

  Specific examples of polymerizable (meth) acrylate compounds include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, and tetraethylene glycol. Di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, 1,4 -(Meth) acrylic acid and polyhydric alcohols such as butylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, glycerin di (meth) acrylate Esterified products; ester (meth) acrylate oligomers; cyanurate-based compounds having a carbon-carbon double bond-containing group such as 2-propenyl-di-3-butenyl cyanurate; tris (2-acryloxyethyl) Isocyanurate, tris (2-methacryloxyethyl) isocyanurate, 2-hydroxyethylbis (2-acryloxyethyl) isocyanurate, bis (2-acryloxyethyl) 2-[(5-acryloxyhexyl) -oxy] Ethyl isocyanurate, tris (1,3-diacryloxy-2-propyl-oxycarbonylamino-n-hexyl) isocyanurate, tris (1-acryloxyethyl-3-methacryloxy-2-propyl-oxycarbonylamino-n-hexyl) ) Isocyanurate, Tris (4 Isocyanurate compounds having carbon-carbon double bond-containing groups such as (acryloxy-n-butyl) isocyanurate; commercially available oligoester acrylates, aromatic and aliphatic urethane (meth) acrylates, etc. Can be mentioned.

  As an aspect, the polymerizable (meth) acrylate compound is preferably urethane (meth) acrylate. Specifically, as this aspect, a polyol compound such as a polyester type or a polyether type and a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3- A terminal isocyanate urethane prepolymer obtained by reacting xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.) with a (meth) acrylate having a hydroxyl group (for example, 2 -Hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, polyethylene glycol (meth) acrylate and the like), and the like.

  Urethane (meth) acrylate is advantageous in terms of adhesive force due to its urethane bond and the like. That is, for example, it is considered preferable to use urethane (meth) acrylate in terms of appropriately adjusting the aforementioned peeling strength.

Only one type of polymerizable (meth) acrylate compound may be used, or two or more types may be used in combination.
The content of the curable (meth) acrylate compound in the temporary adhesive film (when a plurality of types are used in combination, the total amount) is, for example, 10 to 85% by mass, preferably 20 to 80% by mass, more preferably 25 to 25%. 75% by mass.

(Thermosetting catalyst)
The temporary adhesive film of the first embodiment preferably includes a thermosetting catalyst.
By including a thermosetting catalyst, effects such as improved throughput due to time reduction and improved adhesion to other members can be expected in the manufacture of electronic packages described below.
As the thermosetting catalyst, imidazoles and / or onium salt compounds are preferably used.
Specific examples of imidazoles include 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-ethylimidazole, 2-phenyl-4-ethylimidazole, 2-phenyl-4-methyl-5- Examples include hydroxyimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and 2-phenyl-4,5-dihydroxyimidazole.
The onium salt compound used as the thermosetting catalyst is not particularly limited. For example, tetraphenylphosphonium / tetraphenylborate (TPP-K), tetraphenylphosphonium / tetrakis (4-methylphenyl) borate (TPP-MK), tetra Quaternary phosphonium compounds such as bis (naphthalene-2,3-dioxy) phenyl silicate adducts of phenylphosphonium are exemplified.

Only one type of thermosetting catalyst may be used, or two or more types may be used in combination.
The content of the thermosetting catalyst in the temporary adhesive film (when used in combination of a plurality of types) is, for example, 0.1 to 15% by mass, preferably 0.3 to 10% by mass, more preferably 0.5-8 mass%.
A commercially available product may be used as the thermosetting catalyst. For example, the “Curazole” series of Shikoku Chemicals Co., Ltd. can be used.
A commercially available product may be used as the thermosetting catalyst. For example, the “Curazole” series of Shikoku Chemicals Co., Ltd. can be used.

(Filler particles)
The temporary adhesive film of the first embodiment preferably includes filler particles (filler).
The filler particles may be arbitrary filler particles, and may be organic filler particles or inorganic filler particles. From the viewpoint of heat resistance in a semiconductor process, inorganic filler particles are preferably used rather than organic filler particles.

The filler particles can control the fluidity of the temporary adhesive film during temporary adhesion (when heat or pressure is applied). Specifically, the fluidity of the resin component (for example, the aforementioned epoxy compound or polymerizable (meth) acrylate compound) can be suppressed by including the filler particles in the temporary adhesive film. Thereby, it is considered that the “wetting property” between the temporary adhesive film and the substrate (for example, a second substrate described later) is reduced. As a result, it is considered that the residue is less likely to remain (X _f -X _i is easily set to 7% by mass or less).

Moreover, it is thought that the effective area itself in which a resin component contacts a board | substrate (for example, 2nd board | substrate mentioned later) becomes small because a temporary adhesive film contains a filler particle. This also residues (easily the X _f -X _i and 7 wt% or less) remaining hardly made is in particular considered to contribute.

  The filler particles are not particularly limited, but for example, one or two types selected from the group consisting of silica such as fused silica and crystalline silica, alumina, aluminum hydroxide, silicon nitride, barium sulfate, talc, boron nitride and aluminum nitride. The above inorganic filler particles can be included. Among these, silica and alumina are preferable in terms of availability and the effect of adjusting the adhesive strength.

  Although the average particle diameter of a filler particle is not specifically limited, For example, in the measured value by a laser diffraction type particle size distribution meter, Preferably it is 0.2-2.0 micrometers, More preferably, it is 0.2-1.0 micrometers. Moreover, it is preferable that the shape of an inorganic filler is a substantially perfect circle shape.

  When the filler particles are used, the amount used is not particularly limited, but for example, for example, 10 to 80% by mass, preferably 20 to 70% by mass, and more preferably 20 to 60% by mass with respect to the total amount of nonvolatile components in the composition. %.

(About film thickness of temporary adhesive film, manufacturing method, etc.)
The temporary adhesive film of the first embodiment can be obtained, for example, by dissolving the above-described components in an appropriate solvent to form a coating solution, and forming a film using the coating solution.

More specifically, a temporary adhesive film can be obtained by applying the coating solution on a suitable substrate to form a film and drying the solvent. Here, examples of the “appropriate base material” include the first substrate 10 described in the section “Support substrate” described later.
Alternatively, a temporary adhesive film can be obtained by applying the above coating liquid to a suitable film-like substrate (a synthetic resin film such as a PET film). The temporary adhesive film thus obtained is applied to an appropriate base material (for example, the first substrate 10 described in the following [Support substrate] section) by a known laminating method (for example, vacuum laminating method). By bonding, a support substrate described later can be obtained.

  The method for applying the coating solution is not particularly limited, and known coating methods such as roll coating, comma coating, spin coating, slit coating, curtain coating, and bar coating can be applied.

The solvent used when each of the above components is used as a coating solution is not particularly limited as long as each component can be uniformly dissolved or dispersed. The solvent that can be used is typically an organic solvent. Examples of the organic solvent include acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, cyclohexane, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, cellosolve, carbitol, anisole, N-methylpyrrolidone etc. are mentioned. These may be used alone or in combination of two or more.
In the case of using a solvent, the amount used is not particularly limited, and may be appropriately adjusted according to the coating film thickness and the like. For example, the concentration of the nonvolatile component in the coating solution is 30 to 80% by mass, preferably 40 to 70% by mass. % To be used.

  Although the thickness of the temporary adhesive film of 1st Embodiment is not specifically limited, For example, 1-100 micrometers, Preferably it is 3-80 micrometers, More preferably, it is 5-50 micrometers. Adjustment of the thickness of a temporary adhesive film can be performed by adjusting the density | concentration of said coating liquid, adjusting a coating method / coating amount.

  Although the magnitude | size and shape of the temporary adhesive film of 1st Embodiment are not specifically limited, For example, they are the substantially rectangular shape or the substantially square shape of 50-1000 mm long and 50-1000 mm wide. Moreover, the substantially circular shape etc. of diameter 50-1000mm may be sufficient.

[Support substrate]
The electronic package manufacturing support substrate (also referred to simply as “support substrate”) of the first embodiment includes a first substrate and a temporary adhesive film (referred to as “temporary adhesive film” provided on one surface of the first substrate). ).
An example of this support substrate is schematically shown in FIG.
In FIG. 1I, the support substrate 3 includes a first substrate 10 and a temporary adhesive film 12 provided on one surface thereof.

The material, thickness, size, shape, and the like of the first substrate 10 are not particularly limited, but are preferably described below.
Examples of the material of the first substrate 10 include metals and synthetic resins. In consideration of various processes (including heating and the like) described later, a material that can withstand a certain high temperature is preferable. In this respect, the first substrate 10 is preferably made of metal. More preferably, iron, stainless steel, copper or the like is used. Among these, stainless steel is preferable.
Further, when the material of the first substrate 10 is a synthetic resin, it is preferable to use a thermosetting resin. For example, a phenol resin, a melamine resin, a urea resin, etc. are mentioned. Moreover, when the material of the 1st board | substrate 10 is a synthetic resin, components, such as a filler and a fiber, may be contained. These components can be expected to improve strength.

The thickness of the first substrate 10 is preferably 30 μm or more, more preferably 40 μm or more, and further preferably 50 μm or more. By setting the thickness to a certain value or more, the first substrate 10 has sufficient strength and rigidity. Therefore, for example, in the electronic package manufacturing method described later, deformation of the first substrate 10 can be suppressed. That is, an electronic package can be manufactured stably.
Moreover, the thickness of the 1st board | substrate 10 is 1000 micrometers or less, for example, Preferably it is 500 micrometers or less, More preferably, it is 200 micrometers or less. By making the thickness equal to or less than a certain value, an increase in the weight of the first substrate 10 can be suppressed, so that handling properties are improved.

The size and shape of the first substrate 10 is, for example, a substantially rectangular shape or a substantially square shape with a length of 50 to 1000 mm and a width of 50 to 1000 mm. Moreover, the substantially circular shape etc. of diameter 50-1000mm may be sufficient.
The first substrate 10 preferably has at least one surface (surface on which the temporary adhesive film 12 is formed) substantially flat.

Examples of the method of providing the temporary adhesive film 12 on one surface of the first substrate 10 include methods by coating and laminating as described above.
The thickness of the temporary adhesive film 12 is also as described above. That is, for example, the thickness is 1 to 100 μm, preferably 3 to 80 μm, more preferably 5 to 50 μm.

[Electronic Package Manufacturing Method]
In the electronic package manufacturing method of the first embodiment, an electronic package can be manufactured using the temporary adhesive film or the support substrate.
The manufacturing method of the electronic package of 1st Embodiment can include a temporary adhesion process, an arrangement | positioning process, a sealing process, a cutting process, and a isolation | separation process. Each of these steps will be described with reference to the drawings.

-Temporary bonding process (Fig. 1 (ii))
In the temporary bonding step, the temporary bonding film 12 included in the support substrate 3 and the second substrate 14 are brought into close contact with each other, and at least three layers of the first substrate 10, the temporary bonding film 12, and the second substrate 14 are formed. A composite substrate is provided.

Specific examples of the second substrate 14 include a semiconductor wafer (such as a silicon wafer), an organic substrate, and various package substrates typified by an interposer substrate. In the present embodiment, an interposer substrate can be preferably applied.
The interposer substrate is typically for electrically connecting different electronic elements in the electronic package. For this reason, the interposer substrate typically includes or exposes metal wiring such as copper wiring.

In recent years, there has been a demand for thinner electronic devices (packages). Therefore, the interposer substrate is also required to be thin. It is possible to suppress bending and cracking of the interposer substrate by using a material with high rigidity as the material of the interposer. However, selection and improvement of the material alone are not sufficient for the recent demand for thin film. It may be possible.
According to the electronic package manufacturing method of the first embodiment, the second substrate 14 (specifically, the interposer substrate) can be prevented from being bent or cracked due to the rigidity of the first substrate 10.
Further, when a material having high rigidity is used as the material of the interposer substrate, the interposer substrate can be designed to be thinner.

  The second substrate 14 (interposer substrate or the like) preferably has an alignment mark (not shown) for alignment. Thereby, it becomes easy to align the first substrate 10 and the second substrate 14, and it becomes easy to place the electronic element 16 in an appropriate position in an arrangement step described later, and an appropriate position in a cutting step described later. There are effects such as easy cutting.

Although the specific method of a temporary adhesion process is not specifically limited, For example, the lamination method can be used. Specifically, after the second substrate 14 and the temporary adhesive film 12 are brought into close contact, they can be bonded by vacuum lamination under conditions of 30 to 100 ° C. and 0.1 to 1 MPa.
Further, for example, after the laminating step, the entire first substrate 10, temporary adhesive film 12, and second substrate 14 may be heated at 100 to 200 ° C. for 10 to 120 minutes by putting them in an oven. . Thereby, effects such as adhesion can be expected.

  In addition, the adhesiveness of the temporary adhesive film 12 is appropriate (specifically, the peeling strength is 0.1 [kN / m] or more, as described above), so that the first adhesive film 12 is sufficiently strong. The first substrate 10 and the second substrate 14 can be bonded.

Placement process (FIG. 1 (iii))
In the arranging step, the electronic element 16 is arranged on the second substrate 14 of the composite substrate when the surface of the composite substrate obtained in the temporary bonding step and including the second substrate 14 is viewed from above.

  In the arranging step, it is preferable to arrange a plurality of electronic elements 16. By doing so, further improvement in the productivity of electronic packages can be expected. In the electronic package manufacturing method of the present embodiment, the number of electronic elements 16 disposed at a time is, for example, 2 to 2000, preferably 4 to 1000. The relative arrangement positions of the plurality of electronic elements 16 are not particularly limited, but are typically arranged at substantially equal intervals.

  The electronic element 16 to be arranged is not particularly limited as long as it is an individual component that is a component of an apparatus / electronic circuit or the like and has an independent unique function. Examples of the electronic element 16 include a semiconductor chip.

  The electronic element 16 to be arranged may be fixed or temporarily fixed by an additional appropriate process so that the arrangement position is not shifted in the subsequent sealing process or for other purposes.

For example, when the second substrate 14 is an interposer substrate, it is preferable to include a process of connecting the interposer substrate and the electronic element 16. Specifically, a so-called reflow process is performed, that is, the solder previously applied to the second substrate 14 and / or the electronic element 16 is melted by an appropriate means (for example, by heating the entire substrate), The step of connecting the second substrate 14 and the electronic element 16 may be performed. The conditions for the reflow process are, for example, 1 to 10 minutes at a temperature of 250 to 300 ° C.
In addition to the reflow process, a known bump formation technique, chip connection technique, or the like may be applied to the fixing or temporary fixing here.

・ Sealing process (FIG. 1 (iv))
In the sealing process, the sealing composition is applied to the electronic element 16 arranged in the arranging process, and the electronic element 16 is sealed with a cured product (cured product 18) of the sealing composition. A substrate 20 is obtained.

Although it will not specifically limit if the composition for sealing can seal the electronic element 16, For example, what contains a thermosetting resin etc. is mentioned preferably.
As the sealing composition, a known composition can be appropriately applied.
The sealing composition preferably contains a thermosetting resin (A) described below as one embodiment. In addition, components such as a curing agent (B), a curing catalyst (C), and an inorganic filler (D) may be contained. Hereinafter, these components will be described.

(Thermosetting resin (A))
The thermosetting resin (A) is, for example, one or more selected from the group consisting of epoxy resins, phenol resins, oxetane resins, (meth) acrylate resins, unsaturated polyester resins, diallyl phthalate resins, and maleimide resins. Can be included. Among these, an epoxy resin can be included from the viewpoint of improving curability, storage stability, heat resistance, moisture resistance, and chemical resistance.

  As the epoxy resin contained in the thermosetting resin (A), monomers, oligomers and polymers generally having two or more epoxy groups in one molecule can be used, and the molecular weight and molecular structure are not particularly limited.

  Examples of the epoxy resin include a biphenyl type epoxy resin; a bisphenol type epoxy resin such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a tetramethylbisphenol F type epoxy resin; a stilbene type epoxy resin; a phenol novolac type epoxy resin, and a cresol novolak type. Novolak type epoxy resins such as epoxy resins; polyfunctional epoxy resins such as trisphenol type epoxy resins exemplified by triphenolmethane type epoxy resins and alkyl-modified triphenolmethane type epoxy resins; phenol aralkyl type epoxy resins having a phenylene skeleton , Naphthol aralkyl epoxy resin having phenylene skeleton, phenol aralkyl epoxy resin having biphenylene skeleton, biphenylene skeleton Phenolic aralkyl type epoxy resins such as phthalol aralkyl type epoxy resins; Dihydroxynaphthalene type epoxy resins, naphthol type epoxy resins such as epoxy resins obtained by dimerizing dihydroxynaphthalene to glycidyl ether; Triglycidyl isocyanurate, monoallyldi One or two or more types selected from the group consisting of triazine nucleus-containing epoxy resins such as glycidyl isocyanurate; bridged cyclic hydrocarbon compound-modified phenolic epoxy resins such as dicyclopentadiene-modified phenolic epoxy resins can be included. . Among these, the inclusion of one or more selected from a novolac type epoxy resin, a biphenyl type epoxy resin, and a phenol aralkyl type epoxy resin improves the balance of various properties such as fillability, heat resistance, and moisture resistance. From the viewpoint of making it.

  The content of the thermosetting resin (A) is preferably 2 to 50% by mass, more preferably 3 to 30% by mass, and still more preferably 4 to 15% by mass with respect to the whole sealing composition. By setting it to an appropriate content, improvement in filling property and molding stability, improvement in moisture resistance reliability and reflow resistance can be expected.

(Curing agent (B))
It is preferable that the composition for sealing contains a hardening | curing agent (B). The curing agent (B) can be roughly classified into three types, for example, a polyaddition type curing agent, a catalyst type curing agent, and a condensation type curing agent.

  Examples of polyaddition type curing agents include aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA), and metaxylylene diamine (MXDA), diaminodiphenylmethane (DDM), m-phenylenediamine (MPDA), and diamino. In addition to aromatic polyamines such as diphenylsulfone (DDS), polyamine compounds including dicyandiamide (DICY), organic acid dihydrazide, and the like; alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA) , Acid anhydrides including aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), and benzophenone tetracarboxylic acid (BTDA); novolac-type phenolic resin, polyvinyl phenol Selected from the group consisting of phenolic resin-based curing agents such as aralkyl-type phenolic resins; polymercaptan compounds such as polysulfides, thioesters and thioethers; isocyanate compounds such as isocyanate prepolymers and blocked isocyanates; organic acids such as carboxylic acid-containing polyester resins Including one or more types.

  Catalytic curing agents include tertiary amine compounds such as benzyldimethylamine (BDMA) and 2,4,6-trisdimethylaminomethylphenol (DMP-30); 2-methylimidazole, 2-ethyl-4-methyl Imidazole compounds such as imidazole (EMI24); one or more selected from the group consisting of Lewis acids such as BF3 complexes.

  The condensation type curing agent includes, for example, one type or two or more types selected from the group consisting of a resol type phenol resin; a urea resin such as a methylol group-containing urea resin; and a melamine resin such as a methylol group-containing melamine resin.

  Among these, it is more preferable to include a phenol resin-based curing agent from the viewpoint of improving the balance of flame resistance, moisture resistance, electrical characteristics, curability, storage stability, and the like. As the phenol resin-based curing agent, monomers, oligomers, and polymers in general having two or more phenolic hydroxyl groups in one molecule can be used, and the molecular weight and molecular structure are not particularly limited.

  The phenol resin-based curing agent used as the curing agent (B) is, for example, a novolac type phenol resin such as a phenol novolak resin, a cresol novolac resin, or a bisphenol novolac; a polyvinyl phenol; a polyfunctional phenol resin such as a triphenolmethane type phenol resin; Modified phenol resins such as terpene-modified phenol resin and dicyclopentadiene-modified phenol resin; phenol aralkyl resins having a phenylene skeleton and / or biphenylene skeleton, phenol aralkyl type phenol resins such as naphthol aralkyl resin having phenylene and / or biphenylene skeleton; bisphenol One type or two or more types selected from the group consisting of bisphenol compounds such as A and bisphenol F are included. Among these, it is more preferable that at least one of a novolac type phenol resin and a phenol aralkyl type phenol resin is included from the viewpoint of improving the curability of the sealing composition.

  It is preferable that content of a hardening | curing agent (B) is 1-40 mass% with respect to the whole composition for sealing, It is more preferable that it is 2-25 mass%, It is 3-10 mass% Is more preferable. By appropriately adjusting the content of the curing agent (B), improvement in filling property and moldability, improvement in moisture resistance reliability and reflow resistance can be expected.

(Curing catalyst (C))
The composition for sealing may further contain a curing catalyst (C). The curing catalyst (C) promotes a crosslinking reaction between the thermosetting resin (A) (for example, epoxy group of epoxy resin) and the curing agent (B) (for example, phenolic hydroxyl group of phenol resin-based curing agent). What is necessary is just to be made, and what is used for a well-known sealing composition can be used.

  Curing catalysts (C) are, for example, organic phosphines, tetra-substituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, phosphorus atom-containing compounds such as adducts of phosphonium compounds and silane compounds, imidazole compounds, triazines An isocyanuric acid adduct of 2-phenylimidazole, an isocyanuric acid adduct of 2-phenylimidazole, an isocyanuric acid adduct of 2-methylimidazole, and an amine curing accelerator such as 1,8-diazabicyclo [5.4.0] undecene 1 type or 2 types or more can be included. Among these, from the viewpoint of improving the balance of burr suppression, filling properties, and curability, it is more preferable to include one or more selected from phosphorus atom-containing compounds and imidazole compounds. Moreover, it is more preferable that a phosphorus atom containing compound is included from a viewpoint of improving sclerosis | hardenability.

  The content of the curing catalyst (C) is preferably 0.05 to 2.0% by mass, more preferably 0.1 to 1.0% by mass with respect to the entire sealing composition, More preferably, it is 0.15-0.5 mass%. By appropriately adjusting the content of the curing catalyst (C), an improvement in curability and an improvement in filling property due to an improvement in fluidity can be expected.

(Inorganic filler (D))
The composition for sealing may contain an inorganic filler (D) (filler). The inorganic filler (D) can include one or more selected from the group consisting of silica such as fused silica and crystalline silica, alumina, aluminum hydroxide, silicon nitride, and aluminum nitride. Among these, it is preferable that a silica is included from a versatility viewpoint, and it is more preferable that a fused silica is included. Moreover, it is more preferable that aluminum hydroxide is included from a viewpoint of improving the flame retardance of sealing resin formed using the composition for sealing. In particular, a case where both silica and aluminum hydroxide are contained can be mentioned as a preferred example.

  The content of the inorganic filler (D) is preferably 60 to 90% by mass, and more preferably 70 to 85% by mass with respect to the entire sealing composition. By appropriately adjusting the content, improvement in moisture resistance reliability, reflow resistance, and improvement in filling properties can be expected.

(Other ingredients)
The sealing composition may be one of various additives such as a coupling agent, a release agent, a colorant, an ion scavenger, an oil, a low stress agent, a flame retardant, and an antioxidant, if necessary. More than one species can be appropriately blended.

The coupling agent may include known coupling agents such as various silane compounds, titanium compounds, aluminum chelates, and aluminum / zirconium compounds. Among these, epoxy silane or aminosilane is more preferable, and secondary aminosilane is more preferable.
The releasability-imparting agent is, for example, one or two selected from natural waxes such as carnauba wax, synthetic waxes such as montanic acid ester wax and oxidized polyethylene wax, higher fatty acids such as zinc stearate and metal salts thereof, and paraffin. More than one type may be included.
The colorant may contain, for example, one or both of carbon black and black titanium oxide.
The ion scavenger may include, for example, hydrotalcite.
The oil may include, for example, silicone oil.
The low stress agent may include, for example, silicone rubber.
The flame retardant may include one or more selected from, for example, magnesium hydroxide, zinc borate, zinc molybdate, and phosphazene.
The antioxidant may include one kind or two or more kinds selected from a phenol-based antioxidant, a phosphorus-based antioxidant, and a thioether-based antioxidant.

(Properties of sealing composition)
The properties of the sealing composition may be in the form of granules, liquid, film (formed in a film on an appropriate support), and the like. The sealing composition is typically granular.

A sealing process can be performed as follows, for example.
First, the sealing substrate (typically, the granular sealing composition containing the components described above) is added in an amount sufficient to bury the arranged electronic elements 16 in the second substrate 14. This is applied to the upper surface and the side surface of the arranged electronic element 16. At this time, attention should be paid so that the positions of the arranged electronic elements 16 do not shift.
Next, sealing molding is performed by a method such as compression molding. Thereby, the sealing substrate 20 in which the electronic element 16 is sealed with the cured product 18 is obtained. The compression molding can be performed at a temperature of 120 to 180 ° C., for example.
Moreover, in order to harden the composition for sealing reliably, it is preferable to perform a heating process after compression molding. This heating can be performed at a temperature of 120 to 250 ° C. for about 1 to 10 hours using an oven, for example.
Of course, you may perform a sealing process by methods other than the above. For example, as a sealing composition, a fluid paste may be used instead of granules.

・ Cutting process and separation process (Fig. 2)
A structure in which the electronic element 16 is sealed with the cured product 18 by the cutting step of cutting at least a part of the sealing substrate 20 and the separation step of separating the support substrate 3 and the second substrate 14 ( Electronic package).

As an example of cutting, a portion where the electronic element 16 is present is cut out with the surface of the sealing substrate 20 on which the cured product 18 is present as an upper surface (FIG. 2 (v-1)). Thereby, the electronic package can be separated from the sealing substrate 20.
The cutting here is performed, for example, at least at a depth from the upper surface of the cured product 18 to the portion of the second substrate 14 (FIG. 2 (v-1) schematically shows the case of cutting in this way. ) Of course, the depth of cutting is not limited to “from the upper surface of the cured product 18 to the portion of the second substrate 14”. You may cut from the upper surface of the hardened | cured material 18 to the 1st board | substrate 10 (from the top to the bottom).

At the time of separation of the electronic package, when the carbon atom increase amount represented by X _f -X _i of the temporary adhesive film 12 is 7% by mass or less, the bottom surface (second substrate) of the separated electronic package is formed. Microscopic residue that adheres can be reduced. As a result, it is possible to reduce defects in the case where the separated electronic package is further subjected to a plating process or the like.

In the cutting and separation, the adhesive strength of the temporary adhesive film 12 is moderately strong (specifically, the above-mentioned peeling strength is 0.1 [kN / m] or more). It is considered that a situation such as the temporary adhesive film 12 and the second substrate 14 peeling off due to vibration or the like hardly occurs.
Further, since the adhesive strength of the temporary adhesive film 12 is not too strong (specifically, the above-mentioned peeling strength is 0.5 [kN / m] or less), the electronic package can be easily separated. Benefits are gained.

As another example of cutting, the surface of the first substrate 10 in the sealing substrate 20 is cut from the upper surface side, and then the first substrate 10 and the temporary substrate which are part of the sealing substrate 20 are temporarily cut. The adhesive film 12 may be separated (FIG. 2 (v-2)).
This cutting is performed, for example, at least from the upper surface of the first substrate 10 to the depth of the temporary adhesive film 12 portion. Of course, the depth of cutting is not limited to “from the upper surface of the first substrate 10 to the portion of the temporary adhesive film 12”. You may make it cut from the upper surface of the 1st board | substrate 10 to the hardened | cured material 18 (from the top to the bottom).

Also in this case, when the carbon atom increase amount represented by X _f -X _i of the temporary adhesive film 12 is 7% by mass or less, a micro residue adhering to the bottom surface (second substrate) of the electronic package is removed. It is possible to reduce the number of defects, and it is possible to reduce defects in plating processing of the separated electronic package.

  A known cutting technique can be appropriately applied to the cutting. Specifically, cutting using a known dicing saw, that is, a dicing blade (a diamond circular rotary blade is commonly used) is rotated at a high speed and cut while being cooled with pure water or the like and washed away with cutting waste. A method such as a method, a method by laser dicing, or a combination of these methods can be applied.

  If the electronic package (including the plurality of electronic elements 16) separated by cutting is further cut, an electronic package in which each electronic element 16 is sealed is obtained.

  In addition, although the example which cuts out the electronic package containing the some electronic element 16 was demonstrated above, you may cut so that the electronic element 16 may be cut out naturally.

-Supplement The electronic package manufacturing method according to the first embodiment has an advantage that the manufacturing of the electronic package can be made more efficient especially when a plurality of electronic elements 16 are arranged in the arranging step.
In other words, each electronic package is connected to the second substrate 14 (interposer substrate or the like), covered with a sealing composition, and heated and sealed. An electronic package can be obtained by an efficient process in which the elements 16 are collectively connected to the second substrate 14, are collectively covered with a sealing composition, and are collectively heated and sealed.

  In other words, by manufacturing the electronic package using the temporary adhesive film or the support substrate of the first embodiment, it is possible to receive the benefit of increasing the manufacturing efficiency of the electronic package.

<Second Embodiment>
[Temporary adhesive film]
The temporary adhesive film of 2nd Embodiment is used for manufacture of an electronic device.
This temporary adhesive film has a property that the adhesive strength is reduced or disappears by exposure.
And the temporary adhesive film exposed with i line | wire of 2000 mJ / cm < ² > and the 1st surface of the 1st copper foil whose arithmetic mean surface roughness Ra of a 1st surface is 0.4 micrometer, temperature 40 degreeC, pressure 0.2 MPa, thermocompression bonding for 30 seconds, and then temporarily bonded at 150 ° C. for 1 hour, and then the first copper foil is peeled off from the temporary adhesive film. When the elemental composition of the first surface is measured by energy dispersive X-ray analysis using an electron beam with an acceleration voltage of 10 kV as a primary line, the amount (ratio) of carbon atoms with respect to copper atoms is _Yf mass%,
When the elemental composition of the first surface of the first copper foil before thermocompression bonding is measured by the same energy dispersive X-ray analysis method as above, the amount (ratio) of carbon atoms relative to copper atoms is Y _i mass%. When
Amount increasing carbon atoms represented by Y _f -Y _i is not more than 7 wt%.

The method for measuring Y _f and Y _i here is the same as the method for measuring X _f and X _i in the first embodiment. That is, for such measuring apparatus and available copper foil, may be similar to the measurement of X _f and X _i in the first embodiment.
Further, the value of Y _f −Y _i is preferably as close to 0 as possible. The value of Y _f -Y _i is preferably 5% by mass or less, more preferably 4% by mass or less, and still more preferably 3% by mass or less.

It can be said that the temporary adhesive film of the second embodiment is a “previous stage” film of the temporary adhesive film of the first embodiment.
In other words, a part or all of the temporary adhesive film of the second embodiment is irradiated with i-rays of about 2000 mJ / cm ² to reduce the adhesive strength of the irradiated portion, thereby implementing the first implementation. A temporary adhesive film in which a micro residue is difficult to adhere to copper, such as a temporary adhesive film of a form, can be obtained.

Temporary adhesive film of the second embodiment (To be precise, the temporary adhesive film of the second embodiment was irradiated with i-rays of about 2000 mJ / cm ² to set the value of Y _f -Y _i to 7 mass% or less. The merit of the film is the same as that described in the first embodiment (a method for manufacturing the temporary adhesive film, the support substrate, and the electronic package), and therefore will not be described in detail again.
However, the temporary adhesive film of 2nd Embodiment has an additional merit by having the property in which adhesive force falls or lose | disappears by exposure. This will be described later in [Electronic Package Manufacturing Method].

Also,
The temporary adhesive film (unexposed) of the second embodiment and the one side of the second copper foil having an arithmetic average surface roughness Ra of 0.2 μm on at least one side, a temperature of 60 ° C., a pressure of 0.3 MPa, When the thermocompression bonding is carried out for 30 seconds and then heated and bonded at 150 ° C. for 1 hour, the peel strength of the second copper foil is 0.35 [kN / m] or more,
The thermobonding of the temporary adhesive film of the second embodiment exposed with i-line of 2000 mJ / cm ² and the one side of the second copper foil at a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and then When bonding is performed by heating at 150 ° C. for 1 hour, the peel strength of the second copper foil is preferably 0.3 [kN / m] or less. By designing the temporary adhesive film in this way, moderate adhesion to the second substrate 14 described later (appropriately strong adhesion), easier separation of the electronic package in the separation process described later, etc. It is thought that the merit of

The temporary adhesive film of the second embodiment is typically composed of a photocurable resin composition.
The photocurable resin composition here is, for example, the components described as the components of the thermosetting resin composition in the first embodiment (epoxy resin, polymerizable (meth) acrylate compound, thermosetting catalyst, filler particles, etc. 1) or two or more of the above and can be cured by light. About preferable content of each component, it is as the description in 1st Embodiment.
The photocurable resin composition preferably contains one or more components described as components of the thermosetting resin composition in the first embodiment and a photopolymerization initiator.

The photopolymerization initiator will be described.
Examples of the photopolymerization initiator include known radical photopolymerization initiators and cationic photopolymerization initiators.

Specific examples of the radical photopolymerization initiator include 2,2-dimethoxy-1,2-diphenylethane-1-one and 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2. -Methyl-1-propan-1-one, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propan-1-one, Benzyldiphenyl sulfide, tetramethylthiuram monosulfide, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α′-dimethylacetophenone, 2-methyl-2-hydroxypro Piophenone, 1-hydroxycyclohexyl phenyl ketone, Michler's ketone, acetophenone, methoxyacetate Phenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -phenyl] -2-morpholinopropane-1, benzoin methyl ether, benzoin ethyl Ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl, benzoin, dibenzyl, α-hydroxycyclohexyl phenyl ketone, benzyl dimethyl ketal, 2-hydroxymethylphenylpropane, 2-naphthalenesulfonyl chloride, 1-phenone-1, 1-propanedione-2- (o-ethoxycarbonyl) oxime, benzophenone, benzoylbenzoic acid, 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzene Nzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-4-methoxybenzophenone, o-acryloxybenzophenone, p-acryloxybenzophenone, o-methacryloxybenzophenone, p-methacryloxybenzophenone, p- (meta ) Benzophenone-4- of acrylate such as acrylicoxyethoxybenzophenone, 1,4-butanediol mono (meth) acrylate, 1,2-ethanediol mono (meth) acrylate, 1,8-octanediol mono (meth) acrylate Carboxylic acid ester, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethyl Thioxanthone, 2,4-diisopropylthioxanthone, azobisisobutyronitrile, β-chloranthraquinone, camphorquinone, halogenated ketone, acyl phosphinoxide, acyl phosphonate, polyvinyl benzophenone, chlorothioxanthone, dodecyl thioxanthone, Examples thereof include dimethylthioxanthone, diethylthioxanthone, 2-ethylanthraquinone, t-butylanthraquinone, 2,4,5-triallylimidazole dimer, and the like.
The radical photopolymerization initiator is preferably at least one selected from benzophenone derivatives and alkylphenone derivatives.

As a photocationic polymerization initiator, the thing of an onium salt structure is mentioned, for example. More specifically, a Lewis acid generation type such as a diazonium salt, a Bronsted acid generation type such as an iodonium salt and a sulfonium salt, and the like can be mentioned.
The cationic photopolymerization initiator particularly acts on the epoxy group of the epoxy resin to advance the curing reaction.

  When the photocationic polymerization initiator has an onium salt structure, specific examples of the onium cation structure include diphenyliodonium, 4-methoxydiphenyliodonium, bis (4-methylphenyl) iodonium, bis (4-tert- Butylphenyl) iodonium, bis (dodecylphenyl) iodonium, triphenylsulfonium, diphenyl-4-thiophenoxyphenylsulfonium, bis [4- (diphenylsulfonio) -phenyl] sulfide, bis [4- (di (4- ( 2-hydroxyethyl) phenyl) sulfonio) -phenyl] sulfide, η5-2,4- (cyclopentadienyl) [1,2,3,4,5,6-η- (methylethyl) benzene] -iron ( 1+) and the like.

  When the photocationic polymerization initiator has an onium salt structure, examples of the anion include borate, phosphate, antimonate, and sulfonate anion. More specific anions include, for example, the following (i) to (iii).

(I) Halogenated complex: For example, borate such as tetrafluoroborate, phosphate such as hexafluorophosphate, antimonate such as hexafluoroantimonate and hexachloroantimonate.
(Ii) Organic acid anion: For example, trifluoromethanesulfonate ion, toluenesulfonate ion, trinitrotoluenesulfonate ion, and the like.
(Iii) Aromatic anions: Specific examples include tetra (fluorophenyl) borate, tetra (difluorophenyl) borate, tetra (trifluorophenyl) borate, tetra (tetrafluorophenyl) borate, tetra (pentafluorophenyl) borate Tetra (perfluorophenyl) borate, tetra (trifluoromethylphenyl) borate, tetra (di (trifluoromethyl) phenyl) borate and the like.

  Preferred photocationic polymerization initiators include diphenyliodonium tetrafluoroborate, triphenylsulfonium hexafluoroantimonate, 2,4,6-triphenylthiopyrylium hexafluorophosphate, 4-isobutylphenyl (4-methylphenyl) iodonium, Examples include hexafluorophosphate.

Only one type of photopolymerization initiator may be used, or two or more types may be used in combination. Moreover, you may use together a radical photopolymerization initiator and a photocationic polymerization initiator. Of course, two or more types of photo radical polymerization initiators may be used, or two or more types of photo cationic polymerization initiators may be used.
The amount of the photopolymerization initiator in the temporary adhesive film of the second embodiment (when used in combination of a plurality of types) is, for example, 0.1 to 15% by mass, preferably 0.3 to 10% by mass. %, More preferably 0.5 to 8% by mass.

The method for obtaining the temporary adhesive film of the second embodiment can be the same as the method for obtaining the temporary adhesive film of the first embodiment. That is, as described in the first embodiment, it can be obtained by dissolving the above-described components in an appropriate solvent to form a coating solution, and forming a film using the coating solution. The specific method of coating, the substrate for forming the coating film, the solvent for preparing the coating solution, the concentration of the coating solution, and the like are also as described above.
Further, the thickness, size, shape, and the like of the temporary adhesive film of the second embodiment can be the same as those of the temporary adhesive film of the first embodiment.

[Support substrate]
The support substrate for manufacturing an electronic package according to the second embodiment (also simply referred to as “support substrate”) includes a first substrate and a temporary adhesive film (referred to as “temporary adhesive film” provided on one surface of the first substrate). ).

The support substrate can be schematically illustrated as shown in FIG.
In FIG.3 (i), the support substrate 3 is provided with the 1st board | substrate 10 and the temporary adhesive film 12 provided in the single side | surface.
The specific mode of the temporary adhesive film 12, the method of providing the temporary adhesive film 12 on one side of the first substrate 10, and the like are as described in the above section [Temporary adhesive film].
Specific modes (material, thickness, size, shape, etc.) of the first substrate 10 are the same as those of the first substrate 10 in the first embodiment.

[Electronic Package Manufacturing Method]
The method for manufacturing an electronic package of the second embodiment can include an exposure process, a temporary bonding process, an arrangement process, a sealing process, a cutting process, and a separation process. Hereinafter, these steps will be described.

・ Exposure process (Fig. 3 (ii))
In the exposure step, the temporary adhesive film 12 of the support substrate 3 described above can be exposed to provide a region A having a strong adhesive force and a region B having a weaker adhesive force than the region A.
The light to be exposed can be appropriately selected based on the photosensitive characteristics of the photocurable resin composition, and for example, light having a wavelength of 100 to 1000 nm, more specifically g-line, i-line, and the like are applied. The exposure amount (dose) can also be appropriately set based on the photosensitive characteristics of the composition. For example, 10~10000mJ / cm ^2, preferably 50 to 5000 mJ / cm ^2, more preferably 100~3000mJ / cm ^2. As an exposure method, a contact exposure method, a projection exposure method, a contact proximity exposure method, or the like can be appropriately applied.

As for the exposure conditions, for example, in the region B, the amount of increase in carbon atoms (value of Y _f -Y _i ) measured by the above-described method is 7% by mass or less, that is, the degree to which micro residue adhesion is suppressed. It is preferable to reduce the adhesive force by exposing to the surface. Thereby, the defect etc. of the plating of the semiconductor package obtained through the subsequent temporary bonding process to the separation process can be reduced.
Regarding the exposure conditions, as another viewpoint, (i) in the region A, the peel strength of the second copper foil described above is 0.35 [kN / m] or more, and (ii) the region B The peel strength of the second copper foil is preferably 0.3 [kN / m] or less.
(The method for measuring the peel strength can be the same as in the first embodiment.)

-Temporary bonding process (Fig. 3 (iii))
In the temporary bonding step, the temporary bonding film 12 (including the regions A and B) included in the support substrate 3 and the second substrate 14 are brought into close contact with each other, and the first substrate 10, the temporary bonding film 12, and the second substrate 14 are brought into close contact with each other. A composite substrate comprising at least three layers of the substrate 14 is obtained.
As a specific method for obtaining the composite substrate, a method similar to the temporary bonding step of the first embodiment can be applied.

Placement process (Fig. 3 (iv))
In the placement step, the surface of the composite substrate obtained in the temporary bonding step is provided with the second substrate 14 as an upper surface, and when viewed from above, the second substrate in the composite substrate overlaps with the region B. An electronic element 16 is arranged on the top 14.
By disposing the electronic element 16 in this manner, the bottom surface of the electronic package cut out through a cutting process, a separation process, and the like, which will be described later, comes into contact with the region B having a relatively weak adhesive force. Therefore, it becomes easy to separate the electronic package from the first substrate 10 after the cutting process. That is, the productivity of electronic package manufacturing can be increased. This is a merit unique to the second embodiment.
This will be described in more detail in the cutting process and the separation process described later.

  The number of electronic elements 16 arranged in the arrangement process, the relative arrangement position, specific examples of the electronic elements 16, the presence / absence of additional processes such as a fixing / temporary fixing / reflow process, and the like are described in the arrangement process of the first embodiment. Can be the same as described in.

・ Sealing process (Fig. 3 (v))
In the sealing process, the sealing composition is applied to the electronic element 16 arranged in the arranging process, and the electronic element 16 is sealed with a cured product (cured product 18) of the sealing composition. A substrate 20 is obtained.
The aspect (components and properties) of the sealing composition, the specific method of sealing, and the like can be the same as those described in the disposing step of the first embodiment.

・ Cutting process and separation process (Fig. 4)
A structure in which the electronic element 16 is sealed with the cured product 18 by the cutting step of cutting at least a part of the sealing substrate 20 and the separation step of separating the support substrate 3 and the second substrate 14 ( Electronic package).

As an example, a portion corresponding to the region B when the sealing substrate 20 is viewed from the top surface with the surface having the cured product 18 in the sealing substrate 20 as an upper surface (particularly, a portion close to the boundary with the region A in the region B). To cut.
(As a reminder, in this embodiment, the portion corresponding to the region A should not be cut. In addition, the cutting is usually performed so as not to damage the electronic element 16. )

  After the cutting, the second substrate 14, the cured product 18, and the electronic element 16 corresponding to the region B, which are a part of the sealing substrate 20, are separated. Thus, the electronic package can be cut out and separated from the sealing substrate 20 (FIG. 4 (vi-1)).

  The cutting here is performed, for example, at least at a depth from the upper surface of the cured product 18 to the portion of the second substrate 14 (FIG. 4 (vi-1) schematically shows the case of cutting in this way. Shown). Of course, the depth of cutting is not limited to “from the upper surface of the cured product 18 to the portion of the second substrate 14”. You may make it cut from the upper surface of the hardened | cured material 18 to the 1st board | substrate 10 (from the top to the bottom).

At the time of cutting and separation, since the adhesive force in the region B is smaller than the adhesive force in the region A, there is an advantage that the electronic package can be easily separated. In addition, since the adhesive force of the region A is relatively large, there is an advantage that troubles such as the support substrate 3 being peeled off from the second substrate 14 are less likely to occur in the cutting process and the above-described processes.
That is, in the second embodiment, (i) since the region A having a relatively strong adhesive force exists, the second substrate 14 and the like can strongly adhere to the support substrate 3 as a whole, and (ii) The presence of the region B having a relatively weak adhesive force facilitates the separation of the semiconductor package from the support substrate. That is, the second embodiment has an additional merit that is not found in the first embodiment.

As a cutting / separation method different from that shown in FIG. 4 (vi-1), a portion of the sealing substrate 20 corresponding to the region B when the surface of the first substrate 10 is the top surface and the sealing substrate 20 is viewed from above. You may cut the peripheral part of (FIG. 4 (vi-2)).
This cutting is performed, for example, at least from the upper surface of the first substrate 10 to the depth of the temporary adhesive film 12 portion. Of course, the depth of cutting is not limited to “from the upper surface of the first substrate 10 to the portion of the temporary adhesive film 12”. You may make it cut from the upper surface of the 1st board | substrate 10 to the hardened | cured material 18 (from the top to the bottom).
The cutting and separating method as shown in FIG. 4 (vi-2) has the same merit as the cutting as shown in FIG. 4 (vi-1).

It should be noted that an apparatus that can be used for cutting, an electronic package (including a plurality of electronic elements 16) separated by cutting may be further cut, and cutting may be performed so that each electronic element 16 is cut out. The other features are the same as in the first embodiment.
In addition, by manufacturing an electronic package by the method for manufacturing an electronic package of the second embodiment, not only the “additional merits” described above but also the merits of the first embodiment can be enjoyed. For example, the final electronic package can be obtained by a simpler process than the complicated process of covering each of the electronic packages with a sealing composition and heating and sealing them. That is, the merit of productivity improvement can be enjoyed.

  As mentioned above, although embodiment of this invention was described, these are illustrations of this invention and can employ | adopt various structures other than the above. Further, the present invention is not limited to the above-described embodiment, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.

  Embodiments of the present invention will be described in detail based on examples and comparative examples. In addition, this invention is not limited to an Example.

I. Example of producing a temporary adhesive film from a thermosetting resin composition (non-photosensitive)

1. Production of Temporary Adhesive Film / Support Substrate A temporary adhesive film was produced by the following procedures (1) to (3), and the support substrate was produced by adhering it to one surface of a stainless steel first substrate.

(1) The components listed in Table 1 below were dissolved in methyl ethyl ketone to prepare a coating solution having a concentration of 60% by mass.
(2) The above coating solution was applied to a PET film (TR1 (film thickness: 38 μm) manufactured by Unitika Ltd.) using a comma coater, and the solvent was dried. The film thickness (at the time of drying) at this time was 10 μm. Thereby, the laminated | multilayer film with which the temporary adhesive film was formed in the single side | surface of PET film were obtained.
(3) The surface on which the temporary adhesive film of the laminated film of (2) was formed was brought into close contact with a stainless steel first substrate (thickness 100 μm, length 70 mm × width 200 mm), and vacuum lamination was performed. A vacuum laminator (MVLP-500 / 600IIA manufactured by Meiki Seisakusho Co., Ltd.) was used for vacuum lamination, and the lamination conditions were 50 ° C./0.3 MPa.
In addition, PET film has the following 2. Immediately before each measurement of the above or the following 3. It peeled just before the process of (1).

2. Measurements of X _f and _{X i,} and, peeling strength measurements (1) _{X f} and _{X i} of the measurement Mitsui Kinzoku Mining Co. copper foil (product number: 3EC-M3-VLP, thickness: 12 [mu] m, the glossy surface The glossy surface having arithmetic average surface roughness Ra: 0.2 μm was subjected to the following treatments (i) to (iv) to prepare a first copper foil having arithmetic average surface roughness Ra of 0.4 μm. .
(I) First, the copper foil was immersed for 10 seconds in an etching pretreatment solution adjusted to 25 ° C. (trade name: CA-5330A manufactured by MEC Co., Ltd. diluted to 50 vol% with pure water).
(Ii) Subsequently, the copper foil subjected to the above pretreatment was placed on a horizontal line and the temperature of the copper etching solution adjusted to 25 ° C. (trade name: CZ-8101 stock solution, manufactured by MEC Co., Ltd.) was sprayed at a spray pressure of 0. Sprayed at 2 MPa for 30 seconds.
(Iii) The copper foil after the spray treatment was immersed for 15 seconds in a rust inhibitor (trade name: CL-8301, manufactured by MEC Co., Ltd. diluted to 50 vol% with pure water) whose temperature was adjusted to 25 ° C. .
(Iv) After the immersion, the copper foil was dried at 120 ° C. for 30 minutes.

  The surface having the arithmetic average surface roughness Ra of the copper foil of 0.4 μm is referred to as 1. It was made to adhere to the temporary adhesion film on the 1st substrate obtained by. Then, thermocompression bonding was performed at a temperature of 40 ° C., a pressure of 0.2 MPa, and a time of 30 seconds using a vacuum laminator (manufactured by Meiki Seisakusho, MVLP-500 / 600IIA), and then further using an oven at 150 ° C. for 1 hour. Heated. After the heating, it was allowed to cool at room temperature.

The thermocompression-bonded copper foil was slowly peeled off so as not to break the copper foil, and energy dispersive X-ray analysis was performed on the thermocompression-bonded surface.
Specifically, first, using a scanning electron microscope JSM-7900F (manufactured by JEOL Ltd.), an appropriate portion of the measurement object (copper portion peeled off from the temporary adhesive film) is enlarged (magnification 1000 times), Using the energy dispersive X-ray analyzer JED-2300 Analysis Station Plus (also made by JEOL Ltd.), the range is irradiated with an electron beam having an acceleration voltage of 10 kV as a primary line, and a spectrum is obtained. The amount of was determined.

The amount (ratio) of carbon atoms with respect to copper atoms determined by the above measurement was _Xf mass%. Moreover, the quantity (ratio) of the carbon atom with respect to a copper atom calculated | required similarly to the above by calculating | requiring the surface where arithmetic mean surface roughness Ra of the copper foil before making it adhere | attach with a temporary adhesive film is 0.4 micrometer is carried out. It was X _i mass%. _Then, to determine the _(X f -X _i) mass%.

(2) Measurement of peel strength First, as a copper foil having an arithmetic average surface roughness Ra of 0.2 μm, a copper foil (product number: 3EC-M3-VLP, thickness: 35 μm) manufactured by Mitsui Mining Co., Ltd. A 25 mm strip was prepared.
Next, the surface of this copper foil having an arithmetic average surface roughness of 0.2 μm is treated as 1. Then, the film was brought into contact with the temporary adhesive film formed on the stainless steel substrate. This was thermocompression-bonded (vacuum lamination) under the conditions of a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and further heated at 150 ° C. for 1 hour using an oven. Then, it stood to cool at room temperature.

Thereafter, the copper foil bonded to the temporary adhesive film was peeled off in the vertical direction as shown in FIG. 5 at a speed of 50 mm / min. The value obtained by dividing the peel strength (unit: kN) by the width of the copper foil 0.025 m was defined as the peel strength (unit: kN / m).
A precision universal testing machine (Autograph AG-X plus) manufactured by Shimadzu Corporation was used for peeling (measurement of peeling strength). In addition, the measurement conditions and the like that are not specified here are based on JIS C 6481, particularly, section 5.7.

3. Manufacture of electronic package The electronic package was manufactured in the following procedures (1) to (4).

(1) Temporary adhesion process A temporary adhesion film which a support substrate has and a second substrate (an interposer substrate with an alignment mark) prepared in advance are combined with a vacuum laminator device (MVLP-500 manufactured by Meiki Seisakusho Co., Ltd.). / 600IIA) and bonded by vacuum lamination under conditions of 60 ° C. and 0.3 MPa.
The interposer substrate used had a thickness of 80 μm, and the vertical and horizontal sizes were substantially the same as those of the first substrate. This interposer substrate is mainly composed of epoxy resin, and is provided with unit structures (including copper wiring and solder bump structures etc. for electrically connecting the upper and lower sides of the interposer) at substantially equal intervals. The part where the structure was not provided was substantially flat.
After bonding by vacuum laminating, heat treatment was performed at 150 ° C. for 1 hour using an oven to ensure adhesion, and then allowed to cool.
As a result, a composite substrate having a three-layer structure of a first substrate, a temporary adhesive film, and a second substrate (interposer substrate) was obtained.

(2) Placement process (including reflow process)
A plurality of electronic elements were arranged in the unit structure portion of the interposer substrate of the composite substrate obtained in (1) above.
Thereafter, the composite substrate on which the electronic elements were arranged was put into a reflow furnace (NRY-325-5Z manufactured by Yamato Seisakusho Co., Ltd.), and reflow treatment (furnace atmosphere temperature 260 ° C., throwing time 5 minutes) was performed. Thereby, the interposer substrate and the electronic element were connected.

(3) Sealing Step First, an amount of the sealing composition that sufficiently hides the electronic device was applied to the upper surface of the substrate (the surface on which the electronic device was placed) after the placement step. As the sealing composition, a known granular sealing composition (containing epoxy resin, silica particles, curing agent, etc.) was used.
Thereafter, the sealing composition was sealed under conditions of a temperature of 175 ° C., a pressure of 10 MPa, and a time of 120 seconds, and cured in an oven at a temperature of 175 ° C. for a time of 5 hours to obtain a sealing substrate.

(4) Cutting step and separation step A plurality of electronic elements are sealed by appropriately cutting the sealing material and the second substrate (interposer substrate) in the sealing substrate obtained above. The electronic package was cut out.
As a cutting device, a dicing machine DAD3240 manufactured by DISCO Corporation was used. A dicing blade having a model number ZH05-SD2000 was used.

4). Evaluation (1) Plating property (gold plating)
3. above. The gold plating process was performed with respect to the interposer board | substrate part (a copper wiring etc. exist) of the electronic package obtained by (1).
Specifically, at least the interposer substrate portion of the electronic package is immersed in Tempe Resist EX (manufactured by Nippon Kogyo Chemical Co., Ltd.), which is an electrolytic gold plating solution (at 65 ° C. for 2 minutes), and a current density of 0.2-0. The treatment was performed under the condition of 4 A / dm ² .
After the gold plating process, observe the interposer substrate part of the electronic package. ○ (good) if gold plating was possible without any problems, or if gold was not deposited without gold deposition or abnormal gold deposition was observed. (Bad).

(2) Substrate adhesion 3. In the arrangement process (including the reflow process) of (2), it was confirmed whether or not peeling of the substrate occurred after the reflow process. A case where peeling or swelling of the substrate (first substrate and / or second substrate) did not occur was evaluated as “good”, and a case where peeling or swelling occurred was evaluated as “poor”.

(3) Electronic package separability The electronic package cut out in the cutting step (4) was evaluated according to the following criteria.
○ (good): At the end of cutting, the electronic package was adhered to the temporary adhesive film, but could be easily peeled off and the electronic package could be separated.
Δ (slightly bad): At the end of cutting, the electronic package had already peeled from the temporary adhesive film.
X (Bad): The electronic package could not be easily peeled from the temporary adhesive film, or when the electronic package was peeled from the temporary adhesive film, damage was observed on the second substrate.

Table 1 shows the composition of the temporary adhesive film (thermosetting resin composition), 3. Measurement results and 4. above. The evaluation results are summarized.
In Table 1, the unit of the amount of each component is part by mass.

Where to find what is listed in Table 1 (and Table 2 below) is as follows.
・ Epoxy resin 1: YX6954BH30 (phenoxy resin) manufactured by Mitsubishi Chemical Corporation ・ Epoxy resin 2: 1256B40 (phenoxy resin) manufactured by Mitsubishi Chemical Corporation ・ Epoxy resin 3: YL6810 (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation ・ Epoxy resin 4: NC3000 (BA type epoxy resin) Nippon Kayaku Co., Ltd., acrylate 1: NK oligo UA-122P (urethane acrylate compound) Shin Nakamura Chemical Co., Ltd., acrylate 2: NK oligo UA-160TM (urethane acrylate compound) Shin Nakamura Chemical Photopolymerization initiator manufactured by the company: Irgacure 651 (photo radical polymerization initiator, compound name: 2,2-dimethoxy-1,2-diphenylethane-1-one) Thermosetting catalyst manufactured by BASF: 2PZ-PW (imidazole) Epoxy resin curing agent Shikoku Chemicals Corporation Inorganic filler particles: SO-C2 (mean particle size 0.5μm fused silica) Admatechs Co.

As shown in Table 1, when producing an electronic package using a temporary adhesive film of Examples 1 to 7 carbon atoms increase represented by X _f -X _i is equal to or less than 7 wt%, coatability was good Met.
Moreover, about Examples 1-5 and 7 whose peeling strength is 0.1 [kN / m] or more, substrate adhesiveness, electronic package separability, etc. were also favorable. It can be seen that various favorable effects can be obtained in electronic package manufacturing by appropriately adjusting the adhesive strength of the temporary adhesive film.

On the other _hand, in Comparative Examples 1 to 3 X f -X _i exceeds 7 mass%, resulting in poor plating property. Moreover, it turned out that electronic package separation property is bad and it is hard to use for practical use.

II. Example of producing a temporary adhesive film from a photosensitive resin composition

1. Manufacture of Temporary Adhesive Film / Support Substrate A temporary adhesive film was provided on one side of the first stainless steel substrate (ie, a support substrate was manufactured) by the following procedures (1) to (3).

(1) The components listed in Table 2 below were dissolved in methyl ethyl ketone to prepare a coating liquid (photocurable resin composition) having a concentration of 60% by mass.
(2) The above coating solution was applied to a PET film (TR1 (film thickness: 38 μm) manufactured by Unitika Ltd.) using a comma coater, and the solvent was dried. About the application quantity, it adjusted suitably so that the film thickness after drying might be set to about 10 micrometers. Thereby, the laminated | multilayer film with which the temporary adhesive film was formed in the single side | surface of PET film were obtained.
(3) The surface on which the temporary adhesive film of the laminated film of (2) was formed was brought into close contact with a stainless steel first substrate (thickness 100 μm, length 70 mm × width 200 mm), and vacuum lamination was performed. A vacuum laminator (MVLP-500 / 600IIA manufactured by Meiki Seisakusho Co., Ltd.) was used for vacuum lamination, and the lamination conditions were 50 ° C./0.3 MPa.
In addition, PET film has the following 2. Immediately before each measurement of the above or the following 3. It peeled just before the process of (1).

2. Measurement of Y _f and Y _i and measurement of peel strength (1) Measurement of Y _f and Y _i First, the above 1. A part of the temporary adhesive film present on one side of the support substrate obtained in the above was irradiated with 2000 mJ / cm ² of i-line using an exposure machine (High Pressure Mercury Lamp EXM-1201 manufactured by Oak Co.). Thereby, the area | region (area | region B) where the adhesive force fell and the area | region (area | region A) where the adhesive force was not exposed and were comparatively strong were provided.
Next, the above I.D. 2. The surface of the same copper foil as prepared in (1) having an arithmetic average surface roughness Ra of 0.4 μm was brought into close contact with the region B. And using a vacuum laminator device (MVLP-500 / 600IIA manufactured by Meiki Seisakusho Co., Ltd.), thermocompression bonding was performed at a temperature of 40 ° C., a pressure of 0.2 MPa, and a time of 30 seconds, and further using an oven at 150 ° C. for 1 hour. Heated. After the heating, it was allowed to cool at room temperature.
Thereafter, the above I.D. 2. In the same manner as (1), the copper foil was peeled off, and energy dispersive X-ray analysis measurement was performed.

The amount (ratio) of carbon atoms to copper atoms on the surface of the peeled copper foil adhered to the temporary adhesive film was defined as _Yf mass%. Further, the copper foil prior to contact with the temporary adhesive film, the arithmetic average surface roughness Ra of the surface is 0.4 .mu.m, the amount of carbon atoms to copper atoms (ratio) was Y _i mass%. _Then, to determine the Y f -Y _i.

(2) Measurement of peel strength First, the above 1. A part of the temporary adhesive film present on one side of the support substrate obtained in the above was irradiated with 2000 mJ / cm ² of i-line using an exposure machine (High Pressure Mercury Lamp EXM-1201 manufactured by Oak Co.). Thereby, the area | region (area | region B) where the adhesive force fell and the area | region (area | region A) where the adhesive force was not exposed and were comparatively strong were provided.
Next, the above I.D. 2. A surface of the same copper foil as that used in (2) having an arithmetic average surface roughness Ra of 0.2 μm was brought into contact with both regions A and B. This was thermocompression-bonded (vacuum lamination) under the conditions of a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and further heated at 150 ° C. for 1 hour using an oven. Then, it stood to cool at room temperature.
Thereafter, the above I.D. 2. In the same manner as (2), the copper foil was peeled off in the vertical direction, and the peel strength (unit: kN / m) was determined.

3. Manufacture of electronic package The electronic package was manufactured in the following procedures (1) to (5).

(1) Exposure step A part of the temporary adhesive film present on one side of the support substrate obtained in the above was subjected to pattern irradiation with i-line of 2000 mJ / cm ² using an exposure machine (high pressure mercury lamp EXM-1201 manufactured by Oak Co.). Thereby, the area | region (area | region B) where the adhesive force fell and the area | region (area | region A) where the adhesive force was not exposed and were comparatively strong were provided.
As for the exposure pattern, as shown in FIG. 3 (ii), a rectangular area B was provided at the center of the temporary adhesive film, and the area A surrounded the area.

(2) Temporary bonding step 3. In the same manner as (1), a composite substrate having a three-layer structure of a first substrate, a temporary adhesive film, and a second substrate (interposer substrate) was obtained.

(3) Placement process (including reflow process)
I. above. 3. Same as (2). However, regarding the arrangement positions of the plurality of electronic elements, all the electronic elements overlap with the region B when the composite substrate obtained in (2) is viewed from above.

(4) Sealing step 3. Same as (3).

(5) Cutting process and separation process 3. Same as (4). However, with regard to the “position” of cutting, the peripheral portion of the portion corresponding to the region B when the sealing substrate is viewed from above is cut into a rectangular shape.

4). Evaluation Regarding the plating property (gold plating), the substrate adhesiveness and the electronic package separability, the above I.D. 4). And evaluated in the same manner.

Table 2 shows the composition of the temporary adhesive film (photo-curable resin composition), 3. Measurement results and 4. above. The evaluation results are summarized.
In Table 2, the unit of the amount of each component is part by mass.
The sources of the items listed in Table 2 are as described in Table 1.

As shown in Table 2, when manufacturing an electronic package using a temporary adhesive film of Example 2-1 to 2-8 carbon atoms increase represented by Y _f -Y _i is not more than 7 wt%, The plating property was good.
Further, the peel strength of the unexposed portion (region A) is 0.35 [kN / m] or more, and the peel strength of the exposed portion (region B) is 0.3 [kN / m] or less. In Examples 2-1 to 2-7, the substrate adhesiveness and the electronic package separability were also good. It can be seen that various favorable effects can be obtained in electronic package manufacturing by appropriately adjusting the adhesive strength of the temporary adhesive film.

On the other hand, in Comparative Examples 2-1 to 2-3 in which Y _f -Y _i exceeds 7 mass%, the plating property was poor.

3 Support substrate 10 First substrate 12 Temporary adhesive film 14 Second substrate 16 Electronic element 18 Cured material 20 Sealing substrate

Claims (18)

A temporary adhesive film used in the manufacture of electronic devices,
Thermobonding the temporary adhesive film and the first surface of the first copper foil having an arithmetic average surface roughness Ra of 0.4 μm on the first surface at a temperature of 40 ° C., a pressure of 0.2 MPa, and a time of 30 seconds. And then temporarily bonded by heating at 150 ° C. for 1 hour, and the first copper foil is peeled off from the temporary adhesive film, and the elemental composition of the first surface of the peeled first copper foil is determined. The amount of carbon atoms relative to copper atoms when measured by energy dispersive X-ray analysis using an electron beam with an acceleration voltage of 10 kV as a primary line is _Xf mass%,
When when the elemental composition of the first surface of the first copper foil before the thermocompression bonding was measured by the energy dispersive X-ray analysis, the amount of carbon atoms to copper atoms was X _i mass%,
Temporary adhesive film in which the carbon atom increasing amount represented by X _f -X _i is equal to or less than 7 wt%. The temporary adhesive film according to claim 1,
The temporary adhesive film and at least one side of the second copper foil having an arithmetic average surface roughness Ra of 0.2 μm are thermocompression bonded at a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and then Temporary adhesion by heating for 1 hour at 150 ° C. and peeling off when the second copper foil is peeled off from the temporary adhesion film is 0.1 [kN / m] or more . The temporary adhesive film according to claim 1 or 2,
A temporary adhesive film comprising at least one polymerizable compound selected from the group consisting of an epoxy compound and a polymerizable (meth) acrylate compound. The temporary adhesive film according to any one of claims 1 to 3,
A temporary adhesive film containing a urethane (meth) acrylate compound. The temporary adhesive film according to any one of claims 1 to 4,
Temporary adhesive film containing filler particles. The temporary adhesive film according to claim 5,
The temporary adhesive film in which the filler particles include inorganic filler particles. A first substrate;
A support substrate for manufacturing an electronic package, comprising: the temporary adhesive film according to claim 1 provided on one side of the first substrate. A temporary bonding step of temporarily bonding the temporary adhesive film and the second substrate included in the electronic package manufacturing support substrate according to claim 7 to obtain a composite substrate,
An arrangement step of arranging an electronic element on the second substrate in the composite substrate when the composite substrate is viewed from above with a surface of the second substrate as an upper surface;
A sealing step of applying a sealing composition to the electronic elements arranged in the arrangement step, and obtaining a sealing substrate in which the electronic elements are sealed with a cured product of the sealing composition;
A cutting step of cutting at least a part of the sealing substrate;
A separation step of separating the support substrate and the second substrate;
An electronic package manufacturing method including: A temporary adhesive film used in the manufacture of electronic devices,
The temporary adhesive film has the property that the adhesive strength is reduced or disappears by exposure,
The temporary adhesive film exposed with i-line of 2000 mJ / cm ² and the first surface of the first copper foil having an arithmetic average surface roughness Ra of 0.4 μm on the first surface, a temperature of 40 ° C. and a pressure Thermocompression bonding was performed at 0.2 MPa for 30 seconds, followed by temporary bonding at 150 ° C. for 1 hour, and the first copper foil was peeled off from the temporary adhesive film, and the first copper film was peeled off. When the elemental composition of the first surface of the copper foil is measured by energy dispersive X-ray analysis using an electron beam with an acceleration voltage of 10 kV as a primary line, the amount of carbon atoms relative to copper atoms is _Yf mass%,
When the elemental composition of the first surface of the first copper foil before the thermocompression bonding is measured by the energy dispersive X-ray analysis method, when the amount of carbon atoms relative to copper atoms is Y _i mass%,
Temporary adhesive film weight increased carbon atoms represented by Y _f -Y _i is less than 7 mass%. The temporary adhesive film according to claim 9,
Thermocompression bonding the unexposed temporary adhesive film and the one surface of the second copper foil having an arithmetic average surface roughness Ra of at least one surface of 0.2 μm at a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds. Then, when bonded by heating at 150 ° C. for 1 hour, the peel strength of the second copper foil is 0.35 [kN / m] or more,
The temporary adhesive film exposed with i-line of 2000 mJ / cm ² and the one side of the second copper foil are thermocompression bonded at a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and then at 150 ° C. for 1 A temporary adhesive film having a peel strength of 0.3 [kN / m] or less when the second copper foil is bonded by heating for a period of time. The temporary adhesive film according to claim 9 or 10,
The temporary adhesive film comprised with the photocurable resin composition. The temporary adhesive film according to any one of claims 9 to 11,
A temporary adhesive film comprising at least one compound selected from the group consisting of an epoxy resin and a polymerizable (meth) acrylate compound. The temporary adhesive film according to any one of claims 9 to 12,
Temporary adhesive film containing filler particles. The temporary adhesive film according to claim 13,
The temporary adhesive film in which the filler particles include inorganic filler particles. The temporary adhesive film according to claim 13 or 14,
The temporary adhesive film whose average particle diameter of the said filler particle is 0.05-10 micrometers. A first substrate;
A support substrate for manufacturing an electronic package, comprising: the temporary adhesive film according to any one of claims 9 to 15 provided on one side of the first substrate. An exposure process for exposing the temporary adhesive film of the support substrate for manufacturing an electronic package according to claim 16, and providing a region A having a strong adhesive force and a region B having a weaker adhesive force than the region A;
A temporary bonding step of temporarily bonding the temporary adhesive film and the second substrate exposed in the exposure step to obtain a composite substrate;
An arrangement step of arranging an electronic element so as to overlap with the region B when the composite substrate is viewed from above with a surface of the second substrate as an upper surface;
A sealing step of applying a sealing composition to the electronic elements arranged in the arranging step to obtain a sealing substrate in which the electronic elements are sealed with a cured product of the sealing composition; A cutting step of cutting at least a part of the sealing substrate;
A separation step of separating the support substrate and the second substrate;
An electronic package manufacturing method including: A method of manufacturing an electronic package according to claim 17,
When the sealing substrate is viewed from above with the surface of the sealing substrate having the cured product of the sealing composition as an upper surface, the cutting step is a step of cutting a portion corresponding to the region B Package manufacturing method.

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