JP2019172918A - Temporal adhesive film used for manufacturing electronic device, support substrate for manufacturing electronic package, and manufacturing method of electronic package - Google Patents

Abstract

To enhance productivity in manufacturing an electronic package.SOLUTION: There is provided a temporal adhesive film used for manufacturing an electronic device, an area A with strong adhesive force and an area B with weaker adhesive force than the area A exist on a surface of the temporal adhesive film, and a relation of 0.1≤(xB/xA)≤0.5 is formed, wherein X[kN/m] is peeling strength of a copper foil at a part of the area A, and X[kN/m] is peeling strength of a copper foil at a part of the area B in a composite film by thermal compression binding the temporal adhesive film and the copper film with arithmetic mean surface roughness of 0.2 μm under a condition of temperature of 60°C, pressure 0.3 MPa, and time of 30 sec., then heating at 150°C for 1 hr and binding. There is provided a support substrate for manufacturing an electronic package having the temporal adhesive film and a first substrate. There is provided a manufacturing method of the electronic package using the temporal adhesive film or the support substrate.SELECTED DRAWING: Figure 2

Description

The present invention relates to a temporary adhesive film used for manufacturing an electronic device, a support substrate for manufacturing an electronic package, and a method for manufacturing the electronic package.
More specifically, the present invention relates to a temporary adhesive film used for manufacturing an electronic device, an electronic package manufacturing support substrate including the temporary adhesive film, and an electronic package manufacturing method using the support substrate.

  In manufacturing an electronic package, a process of temporarily fixing or bonding a substrate or an element (often referred to as temporary bonding or temporary fixing) may be performed. In addition, materials and processes for temporary bonding and temporary fixing are actively studied.

  For example, in Patent Document 1, as a solution to problems such as “easy temporary adhesion between a wafer and a support substrate”, a first temporary adhesive layer made of a polyimide resin film and an adhesive containing a curable silicone resin The laminated body for wafer processing which has a 2nd temporary adhesive material layer which consists of a cured film of an agent composition is described.

  Patent Document 2 discloses a technique that includes a temporary fixing process and that can achieve both thinning and low warpage of a semiconductor package and provide a thin semiconductor device with high yield. Specifically, after manufacturing a semiconductor package sealed with a sealing material, a step of temporarily fixing a warp correction substrate to the surface of the semiconductor package, a step of reflowing, and removing the warp correction substrate from the semiconductor package after reflow A method of manufacturing a semiconductor device including a process for performing the process is disclosed.

JP, 2006-86158, A JP 2006-072254 A

With the progress of semiconductor technology, further improvement in the productivity of electronic packages is required.
According to the knowledge of the present inventors, there is still room for improvement in the manufacturing technology of the conventional electronic package at least in terms of productivity.
Therefore, an object of the present invention is to increase productivity in manufacturing an electronic package.

  The inventors of the present invention considered various possibilities of applying temporary bonding technology in terms of improving the productivity of electronic packages, and conducted various studies. As a result, it was conceived that if an electronic package was manufactured by a novel method using a novel temporary adhesive film, the productivity of the electronic package could be improved, and the invention shown below was completed.

According to the present invention,
A temporary adhesive film used in the manufacture of electronic devices,
On the surface of the temporary adhesive film, there are a region A having a strong adhesive force and a region B having a weaker adhesive force than the region A,
The temporary adhesive film and a copper foil having an arithmetic average surface roughness of 0.2 μm were bonded by thermocompression bonding under conditions of a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and then heated at 150 ° C. for 1 hour. In the composite film, the peel strength of the copper foil at the region A is x _A [kN / m], and the peel strength of the copper foil at the region B is x _B [kN / m. ], _A temporary adhesive film satisfying a relationship of 0.1 ≦ (x _B / x _A ) ≦ 0.5 is provided.
This invention is also referred to as “first invention”.

Moreover, according to the present invention,
A first substrate;
Provided is a support substrate for manufacturing an electronic package comprising the temporary adhesive film provided on one side of the first substrate.
This invention is also referred to as “second invention”.

Moreover, according to the present invention,
A temporary bonding step of temporarily bonding the temporary adhesive film of the support substrate and the second substrate to obtain a composite substrate;
An arrangement step of disposing an electronic element so as to overlap the region B on the second substrate in the composite substrate when the composite substrate is viewed from above with the surface including the second substrate as an upper surface; ,
A sealing step of applying a sealing composition to the electronic elements arranged in the arrangement step, and obtaining a sealing substrate in which the electronic elements are sealed with a cured product of the sealing composition;
A cutting step of cutting at least a part of the sealing substrate;
A separation step of separating the support substrate and the second substrate;
A method for manufacturing an electronic package is provided.
This invention is also referred to as “third invention”.

Moreover, according to the present invention,
A temporary adhesive film used in the manufacture of electronic devices,
The temporary adhesive film has a property that the adhesive strength is reduced by exposure,
The unexposed temporary adhesive film and a copper foil having an arithmetic average surface roughness of 0.2 μm are thermocompression bonded at a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and then heated at 150 ° C. for 1 hour. The peel strength of the copper foil in the first composite film adhered in this manner is y _A [kN / m],
After thermobonding the temporary adhesive film exposed with i-line of 2000 mJ / cm ² and a copper foil having an arithmetic average surface roughness of 0.2 μm under conditions of a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, When the peel strength of the copper foil in the second composite film bonded by heating at 150 ° C. for 1 hour is y _B [kN / m], 0.1 ≦ (y _B / y _A ) ≦ 0.5 A temporary adhesive film that satisfies the above relationship is provided.
This invention is also referred to as “fourth invention”.

Moreover, according to the present invention,
A first substrate;
Provided is a support substrate for manufacturing an electronic package comprising the temporary adhesive film provided on one side of the first substrate.
This invention is also referred to as “fifth invention”.

Moreover, according to the present invention,
An exposure step of exposing the temporary adhesive film of the support substrate and providing a region A having a strong adhesive force and a region B having a weaker adhesive force than the region A;
A temporary bonding step of temporarily bonding the temporary adhesive film and the second substrate exposed in the exposure step to obtain a composite substrate;
An arrangement step of disposing an electronic element so as to overlap the region B on the second substrate in the composite substrate when the composite substrate is viewed from above with the surface including the second substrate as an upper surface; ,
A sealing step of applying a sealing composition to the electronic elements arranged in the arranging step to obtain a sealing substrate in which the electronic elements are sealed with a cured product of the sealing composition; A cutting step of cutting at least a part of the sealing substrate;
A separation step of separating the support substrate and the second substrate;
A method for manufacturing an electronic package is provided.
This invention is also referred to as “sixth invention”.

According to the present invention, productivity can be increased in the manufacture of electronic packages.
Briefly explaining that “productivity can be increased”, for example, in a process of sealing a plurality of electronic elements at once, it becomes easy to take out the sealed electronic elements. Details will be described in the embodiment of the present invention.

It is a figure which shows typically the manufacturing process etc. of an electronic package. It is a figure which shows typically the manufacturing process etc. of an electronic package. It is a figure which shows typically the example of how to provide "area | region A" and "area | region B" in a temporary adhesive film. It is a figure which shows typically the measuring method of peeling strength.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
In all the drawings, the same components are denoted by the same reference numerals, and description thereof will be omitted as appropriate.
In order to avoid complications, (i) when there are a plurality of identical components in the same drawing, only one of them is given a reference, and all are not attached, or (ii) 2 and later, the same components as in FIG. 1 may not be denoted again.
All drawings are for illustrative purposes only. The shape and dimensional ratio of each member in the drawings do not necessarily correspond to an actual article.

In this specification, the term “substantially” means that it includes a range that takes into account manufacturing tolerances, assembly variations, and the like, unless otherwise specified.
In the present specification, the notation “ab” in the description of the numerical range represents a range from a to b unless otherwise specified. For example, “1 to 5% by mass” means “1 to 5% by mass”.

In the notation of a group (atomic group) in this specification, the notation which does not describe substitution or non-substitution includes both those having no substituent and those having a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).
The notation “(meth) acryl” in the present specification represents a concept including both acrylic and methacrylic. The same applies to similar notations such as “(meth) acrylate”.
In this specification, an “electronic package” refers to an electronic element (typically a semiconductor chip) sealed in some form with a sealing material.

  Hereinafter, embodiments of the first invention, the second invention, and the third invention will be described as “first embodiment”. The embodiments of the fourth, fifth and sixth inventions will be described as “second embodiment”.

<First Embodiment>
[Temporary adhesive film]
The temporary adhesive film of 1st Embodiment is used for manufacture of an electronic device.
On the surface of the temporary adhesive film, there are a region A having a strong adhesive force and a region B having a weaker adhesive force than the region A.
Further, this temporary adhesive film and a copper foil having an arithmetic average surface roughness of 0.2 μm were thermocompression bonded at a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and then heated at 150 ° C. for 1 hour. In the bonded composite film, the peel strength of the copper foil at the region A is x _A [kN / m], and the peel strength of the copper foil at the region B is x _B [kN / m]. Then, the relationship of 0.1 ≦ (x _B / x _A ) ≦ 0.5 is established.

The value of x _B / _{x A} is may be a 0.1 to 0.5, preferably from 0.12 to 0.4, more preferably from 0.14 to 0.3.
The value of x _B is not particularly limited, preferably 0.01~0.3 [kN / m], more preferably 0.05~0.25 [kN / m], more preferably 0.1 to 0. 2 [kN / m].
By appropriately adjusting these values, it is possible to further increase the productivity of electronic package manufacturing described later.

It should be noted that the measurement of x _A and x _B, can be carried out by the method described in Examples set forth below, the measurement of such peeling strength of JIS C 6481, etc. in particular Section 5.7 Can be referred to.
In addition, as the “copper foil having an arithmetic average surface roughness of 0.2 μm” used in the measurement, for example, a glossy surface of a copper foil (product number: 3EC-M3-VLP, thickness 12 μm) manufactured by Mitsui Mining Co., Ltd. is used. be able to. Here, the “arithmetic average surface roughness” is specifically defined as Ra in JIS B 0601: 2013.

  The reason why the productivity of the electronic package can be improved by the temporary adhesive film of the first embodiment will be specifically described in the section of [Electronic Package Manufacturing Method] described later.

The method of providing the regions A and _B where x _A and x _B satisfy the above relationship is not particularly limited.
(I) The region A is composed of a thermosetting resin composition, and the region B is composed of a thermosetting resin composition or a thermoplastic resin film.
(II) Forming a film with a photocurable resin composition and irradiating a part of the film with light to provide region A and region B (the region irradiated with light was not irradiated with light Part becomes area A),
Such a method is applicable.

Appropriately adjusting the components and amounts of the thermosetting resin composition in (I) to the photocurable resin composition in (II), and in the case of (II), the dose of light irradiation such as by appropriately adjusting, it can be x _a and x _B to produce a temporary adhesive film satisfying a predetermined relationship.
In particular, the amount of a filler (specifically, an inorganic filler) described later in the thermosetting resin composition or the photocurable resin composition is appropriately adjusted, or an adhesive component (epoxy resin or the like) is used. By appropriately adjusting the amount of the polymerizable (meth) acrylate compound or the like, it becomes easy to appropriately adjust the adhesive force or the peel strength.

  The case where the part of the region A in (I) is composed of a thermosetting resin composition and the part of the region B is composed of a thermosetting resin composition or a thermoplastic resin film will be described.

  Such a temporary adhesive film is, for example, a film formed of another thermosetting resin composition on the surface of the film (film 1) formed of an uncured or semi-cured thermosetting resin composition, or The film (film 2) of the thermoplastic resin film can be obtained by adhering or pasting.

In general, the size of the film 2 is smaller than the size of the film 1.
When a film formed of a thermosetting resin composition different from the film 1 is used as the film 2, typically, the strength of the adhesive force of the film 2 is weaker than the strength of the adhesive force of the film 1. (Specifically, a thermosetting resin composition having an adhesive force that satisfies the relationship of 0.1 ≦ (x _B / x _A ) ≦ 0.5 is selected). As a method for adjusting the strength of the adhesive force in this way, an appropriate amount of a filler (specifically an inorganic filler) described later is included in the thermosetting resin composition forming the film 2. There are methods such as appropriately adjusting the amount of an adhesive component (such as an epoxy resin or a polymerizable (meth) acrylate compound).

As a method for attaching or attaching the film 2 to the surface of the film 1, a known laminating technique (for example, a vacuum laminating technique) can be applied.
In the temporary adhesive film thus obtained, the part corresponding to the film 1 is usually the area A and the part corresponding to the film 2 is the area B.

  As the thermosetting resin composition constituting the region A, any thermosetting resin composition can be used as long as the above-mentioned peeling strength is satisfied, but it is selected from the group consisting of an epoxy compound and a polymerizable (meth) acrylate compound. It is preferable that it contains at least one polymerizable compound. By using such a thermosetting resin composition, it is easy to suppress a decrease in adhesive strength under high temperature conditions. This means that in the manufacture of an electronic package described later, it is resistant to various heating (exfoliation due to heating is unlikely to occur).

Specific examples of the epoxy compound and the polymerizable (meth) acrylate compound, the content in the composition, and the like are the epoxy compound and the polymerizable (meth) acrylate compound described as constituent components of the photocurable resin composition described later. It is the same.
In addition, the thermosetting resin composition can include, for example, a thermosetting catalyst, a filler, a solvent, and the like (components other than the photopolymerization initiator) described as components of the photocurable resin composition described later. .
In particular, when the thermosetting resin composition contains a filler, it is easy to adjust the adhesive strength or the peel strength to a desired value.

When the region B is composed of a thermosetting resin composition, as the thermosetting resin composition, for example, while using the same material as the thermosetting resin composition constituting the region A, the region B is bonded. Compositions with reduced force (adjusted to satisfy 0.1 ≦ (x _B / x _A ) ≦ 0.5) can be used.
In addition, as a method of appropriately reducing the adhesive strength, the adhesiveness in the composition, in which an appropriate amount of a filler (specifically, an inorganic filler) described later is included in the thermosetting resin composition, as described above. There are methods such as appropriately adjusting the amount of components to be shown (such as epoxy resin and polymerizable (meth) acrylate compound).

When the region B is composed of a thermoplastic resin film, the thermoplastic resin film is not particularly limited.
For example, polyolefin such as polyethylene, polypropylene, poly (4-methyl-1-pentene), poly (1-butene); polyester such as polyethylene terephthalate (PET), polybutylene terephthalate, polyethylene naphthalate; nylon-6, nylon- 66, polyamide such as polymetaxylene adipamide, polyvinyl chloride, polyvinylidene chloride, ethylene / vinyl acetate copolymer, polyvinyl alcohol, polycarbonate, polystyrene, ionomer, etc. A thermoplastic resin film can be mentioned.
A commercial item may be used for a thermoplastic resin film, and it may obtain by apply | coating the varnish solution containing a thermoplastic resin to a suitable base material, and drying a solvent. Examples of the “appropriate substrate” in the latter case include a PET film. Moreover, a comma coater etc. can be used for application | coating.
The thermoplastic resin film may be stretched or unstretched.

The thermoplastic resin film is preferably a polyvinyl alcohol film or a polypropylene film from the viewpoints of appropriate flexibility and softness.
Applying a thermoplastic resin film that is softened / melted moderately when heated to around 150 ° C. and is weakly bonded to the copper foil (which is weaker than the adhesive strength in region A, but is bonded to some extent). Thus, it is considered that merits such as improved adhesion to other substrates can be obtained in the manufacture of the electronic package described later.

Next, the case where the regions A and B are provided by forming a film with the photocurable resin composition (II) and irradiating a part of the film with light will be described.
As one aspect, the region A of the temporary adhesive film according to the first embodiment is preferably composed of a photocurable resin composition. Moreover, it is preferable that the part of the area | region B of the temporary adhesive film of 1st Embodiment is comprised with the hardened | cured material of the photopolymerizable resin composition.

  This temporary adhesive film is formed, for example, by (i) a film made of a photocurable resin composition that has adhesiveness and whose adhesiveness is reduced or lost by light irradiation, and (ii) It can be obtained by irradiating a partial region with light (the region irradiated with light becomes region B, and the region not irradiated with light becomes region A).

Irradiation light can be appropriately set based on the photosensitive characteristics of the photo-curable resin composition, and for example, light having a wavelength of 100 to 1000 nm, more specifically g-line, i-line, and the like are applied. The dose (dose) can also be appropriately set based on the photosensitive characteristics of the composition. For example, 10~10000mJ / cm ^2, preferably 50 to 5000 mJ / cm ^2, more preferably 100~3000mJ / cm ^2. As a light irradiation method, a contact exposure method, a projection exposure method, a contact proximity exposure method, or the like can be appropriately applied.
These light irradiation conditions can be appropriately adjusted so as to satisfy 0.1 ≦ (x _B / x _A ) ≦ 0.5.

  As the photocurable resin composition constituting the regions A and B, any one can be used as long as the above-mentioned peeling strength is satisfied, but from the group consisting of an epoxy compound and a polymerizable (meth) acrylate compound It is preferable that it contains at least one polymerizable compound selected and a photopolymerization initiator.

Hereinafter, components that can be contained in the photocurable resin composition, properties of the composition, and the like will be described.
In addition, as mentioned above, components other than a photoinitiator among the following components are preferably used also as a structural component of the above-mentioned thermosetting resin composition.

(Epoxy resin)
Examples of the epoxy resin include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, bisphenol E type epoxy resin, bisphenol M type epoxy resin, bisphenol P type epoxy resin, and bisphenol Z type epoxy resin. Bisphenol type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin and other novolak type epoxy resin, biphenyl type epoxy resin, aryl aralkyl type epoxy resin having biphenylene skeleton, arylalkylene type epoxy resin, naphthalene type epoxy resin, Anthracene type epoxy resin, phenoxy type epoxy resin, dicyclopentadiene type epoxy resin, norbornene type epoxy resin, adamantane type Epoxy resins, epoxy resins, such as a fluorene epoxy resin.

The epoxy equivalent of an epoxy resin is 100 or more, for example, 150-5000 are preferable, 150-1000 are more preferable, 150-500 are more preferable.
The epoxy resin includes an epoxy resin having at least one of an aromatic ring structure (such as a benzene ring structure) and an alicyclic structure (an alicyclic carbocyclic structure) as a curable resin having a polyfunctional epoxy group. Is preferred.
The epoxy resin is typically polyfunctional (bifunctional or higher).

As one aspect, the epoxy resin preferably contains a phenoxy resin.
Examples of the phenoxy resin include a phenoxy resin having a bisphenol skeleton, a phenoxy resin having a naphthalene skeleton, a phenoxy resin having an anthracene skeleton, a phenoxy resin having a biphenyl skeleton, and a phenoxy resin having an imide skeleton. A phenoxy resin having a structure having a plurality of these skeletons can also be used.

  Among these, it is preferable to use bisphenol A-type and bisphenol F-type phenoxy resins, phenoxy resins having an imide skeleton, and phenoxy resins having a bisphenolacetophenone skeleton. Moreover, you may use the phenoxy resin which has several frame | skeleton among the above.

Although the weight average molecular weight of a phenoxy resin is not specifically limited, 5.0 * 10 < ³ > or more and 8.0 * 10 < ⁴ > or less are preferable. In the present specification, the weight average molecular weight is a value in terms of polystyrene measured by gel permeation chromatography (GPC) unless otherwise specified.
Moreover, the epoxy equivalent of a phenoxy resin is 1000-30000, for example, More preferably, it is 5000-20000.

As one embodiment, it is preferable that an epoxy resin that is not a phenoxy resin and a phenoxy resin are used in combination. Thereby, the curing rate can be increased. As a result, an effect of increasing the throughput of the process can be expected in the manufacture of the electronic package described later.
The amount ratio between the epoxy resin that is not a phenoxy resin and the phenoxy resin is not particularly limited, but is, for example, 9: 1 to 5: 5, preferably 9: 1 to 6: 4 (mass ratio).

  The content of the epoxy resin in the composition (when a plurality of types of epoxy resins are used in combination) is, for example, 20 to 98% by mass, preferably 30 to 30%, based on the total amount of nonvolatile components in the composition. It is 96 mass%, More preferably, it is 35-90 mass%, More preferably, it is 55-90 mass%.

  As the epoxy resin (including phenoxy resin), a known one or a commercially available one can be used as appropriate. Commercial products are available from Mitsubishi Chemical Corporation, Nippon Kayaku Co., Ltd., Nippon Steel & Sumikin Chemical Co., Ltd., and the like.

(Polymerizable (meth) acrylate compound)
The polymerizable (meth) acrylate compound is a compound having a (meth) acryloyl group that can be polymerized by light, heat, or other external stimulus. The polymerizable (meth) acrylate compound is preferably bifunctional or more (having two or more (meth) acryloyl groups in one molecule), and more preferably 2 to 6 functional.

  Specific examples of polymerizable (meth) acrylate compounds include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, and tetraethylene glycol. Di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dipentaerythritol hexa (meth) acrylate, dipentaerythritol monohydroxypenta (meth) acrylate, 1,4 -(Meth) acrylic acid and polyhydric alcohols such as butylene glycol di (meth) acrylate, polyethylene glycol di (meth) acrylate, glycerin di (meth) acrylate Esterified products; ester (meth) acrylate oligomers; cyanurate compounds having a carbon-carbon double bond-containing group such as 2-propenyl-di-3-butenyl cyanurate; tris (2-acryloxyethyl) Isocyanurate, tris (2-methacryloxyethyl) isocyanurate, 2-hydroxyethylbis (2-acryloxyethyl) isocyanurate, bis (2-acryloxyethyl) 2-[(5-acryloxyhexyl) -oxy] Ethyl isocyanurate, tris (1,3-diacryloxy-2-propyl-oxycarbonylamino-n-hexyl) isocyanurate, tris (1-acryloxyethyl-3-methacryloxy-2-propyl-oxycarbonylamino-n-hexyl) ) Isocyanurate, Tris (4 Isocyanurate compounds having a carbon-carbon double bond-containing group such as acryloxy-n-butyl) isocyanurate; commercially available oligoester acrylates, aromatic and aliphatic urethane (meth) acrylates, etc. Can be mentioned.

  As an aspect, the polymerizable (meth) acrylate compound is preferably urethane (meth) acrylate. Specifically, as this aspect, a polyol compound such as a polyester type or a polyether type and a polyvalent isocyanate compound (for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3- A terminal isocyanate urethane prepolymer obtained by reacting xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenylmethane 4,4-diisocyanate, etc.) with a (meth) acrylate having a hydroxyl group (for example, 2 -Hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, polyethylene glycol (meth) acrylate and the like), and the like.

Only one type of polymerizable (meth) acrylate compound may be used, or two or more types may be used in combination.
The content of the curable (meth) acrylate compound in the composition (when using a plurality of types in combination, the total amount thereof) is, for example, 10 to 85% by mass, preferably based on the total amount of nonvolatile components in the composition, preferably It is 20-80 mass%, More preferably, it is 25-75 mass%.

(Photopolymerization initiator)
By including a photopolymerization initiator in the photocurable resin composition, it is possible to optimize the peel strength of the region A and the region B, increase the productivity by reducing the exposure amount, and the like.
As the photopolymerization initiator, a known photoradical polymerization initiator or photocationic polymerization initiator can be appropriately selected based on the exposure wavelength in the above-described exposure step.

Specific examples of the radical photopolymerization initiator include 2,2-dimethoxy-1,2-diphenylethane-1-one and 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2. -Methyl-1-propan-1-one, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl] phenyl} -2-methyl-propan-1-one, Benzyldiphenyl sulfide, tetramethylthiuram monosulfide, 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α-hydroxy-α, α′-dimethylacetophenone, 2-methyl-2-hydroxypro Piophenone, 1-hydroxycyclohexyl phenyl ketone, Michler's ketone, acetophenone, methoxyacetate Phenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1- [4- (methylthio) -phenyl] -2-morpholinopropane-1, benzoin methyl ether, benzoin ethyl Ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl, benzoin, dibenzyl, α-hydroxycyclohexyl phenyl ketone, benzyl dimethyl ketal, 2-hydroxymethylphenylpropane, 2-naphthalenesulfonyl chloride, 1-phenone-1, 1-propanedione-2- (o-ethoxycarbonyl) oxime, benzophenone, benzoylbenzoic acid, 4,4'-dimethylaminobenzophenone, 4,4'-diethylaminobenzene Nzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-4-methoxybenzophenone, o-acryloxybenzophenone, p-acryloxybenzophenone, o-methacryloxybenzophenone, p-methacryloxybenzophenone, p- (meta ) Benzophenone-4- of acrylate such as acrylicoxyethoxybenzophenone, 1,4-butanediol mono (meth) acrylate, 1,2-ethanediol mono (meth) acrylate, 1,8-octanediol mono (meth) acrylate Carboxylic acid ester, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethyl Thioxanthone, 2,4-diisopropylthioxanthone, azobisisobutyronitrile, β-chloranthraquinone, camphorquinone, halogenated ketone, acyl phosphinoxide, acyl phosphonate, polyvinyl benzophenone, chlorothioxanthone, dodecyl thioxanthone, Examples thereof include dimethylthioxanthone, diethylthioxanthone, 2-ethylanthraquinone, t-butylanthraquinone, 2,4,5-triallylimidazole dimer, and the like.
The radical photopolymerization initiator is preferably at least one selected from benzophenone derivatives and alkylphenone derivatives.

As a photocationic polymerization initiator, the thing of an onium salt structure is mentioned, for example. More specifically, a Lewis acid generation type such as a diazonium salt, a Bronsted acid generation type such as an iodonium salt and a sulfonium salt, and the like can be mentioned.
The cationic photopolymerization initiator particularly acts on the epoxy group of the epoxy resin to advance the curing reaction.

  When the photocationic polymerization initiator has an onium salt structure, specific examples of the onium cation structure include diphenyliodonium, 4-methoxydiphenyliodonium, bis (4-methylphenyl) iodonium, bis (4-tert- Butylphenyl) iodonium, bis (dodecylphenyl) iodonium, triphenylsulfonium, diphenyl-4-thiophenoxyphenylsulfonium, bis [4- (diphenylsulfonio) -phenyl] sulfide, bis [4- (di (4- ( 2-hydroxyethyl) phenyl) sulfonio) -phenyl] sulfide, η5-2,4- (cyclopentadienyl) [1,2,3,4,5,6-η- (methylethyl) benzene] -iron ( 1+) and the like.

  When the photocationic polymerization initiator has an onium salt structure, examples of the anion include borate, phosphate, antimonate, and sulfonate anion. More specific anions include, for example, the following (i) to (iii).

(I) Halogenated complex: For example, borate such as tetrafluoroborate, phosphate such as hexafluorophosphate, antimonate such as hexafluoroantimonate and hexachloroantimonate.
(Ii) Organic acid anion: For example, trifluoromethanesulfonate ion, toluenesulfonate ion, trinitrotoluenesulfonate ion, and the like.
(Iii) Aromatic anions: Specific examples include tetra (fluorophenyl) borate, tetra (difluorophenyl) borate, tetra (trifluorophenyl) borate, tetra (tetrafluorophenyl) borate, tetra (pentafluorophenyl) borate Tetra (perfluorophenyl) borate, tetra (trifluoromethylphenyl) borate, tetra (di (trifluoromethyl) phenyl) borate and the like.

  Preferred photocationic polymerization initiators include diphenyliodonium tetrafluoroborate, triphenylsulfonium hexafluoroantimonate, 2,4,6-triphenylthiopyrylium hexafluorophosphate, 4-isobutylphenyl (4-methylphenyl) iodonium, Hexafluorophosphate) and the like.

Only one type of photopolymerization initiator may be used, or two or more types may be used in combination. Moreover, you may use together a radical photopolymerization initiator and a photocationic polymerization initiator. Of course, two or more types of photo radical polymerization initiators may be used, or two or more types of photo cationic polymerization initiators may be used.
The content of the photopolymerization initiator in the composition (when used in combination of a plurality of types) is, for example, 0.1 to 15% by mass, preferably, based on the total amount of nonvolatile components in the composition, preferably It is 0.3-10 mass%, More preferably, it is 0.5-8 mass%.

(Thermosetting catalyst)
By using the thermosetting catalyst, effects such as an improvement in throughput due to a reduction in time and an improvement in adhesion to other members can be expected in the manufacture of an electronic package described later.
As the thermosetting catalyst, imidazoles are preferably used. Specifically, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-ethylimidazole, 2-phenyl-4-ethylimidazole, 2-phenyl-4-methyl-5-hydroxyimidazole, Examples include 2-phenyl-4-methyl-5-hydroxymethylimidazole and 2-phenyl-4,5-dihydroxyimidazole.
Moreover, an onium salt compound is also preferable as the thermosetting catalyst. Usable onium salt compounds are not particularly limited. For example, tetraphenylphosphonium tetraphenylborate (TPP-K), tetraphenylphosphonium tetrakis (4-methylphenyl) borate (TPP-MK), tetraphenylphosphonium bis And quaternary phosphonium compounds such as (naphthalene-2,3-dioxy) phenylsilicate adduct.

Only one type of thermosetting catalyst may be used, or two or more types may be used in combination.
The content of the thermosetting catalyst in the composition (the total amount when a plurality of types are used in combination) is, for example, 0.1 to 15% by mass, preferably based on the total amount of nonvolatile components in the composition, preferably It is 0.3-10 mass%, More preferably, it is 0.5-8 mass%.
A commercially available product may be used as the thermosetting catalyst. For example, the “Curazole” series of Shikoku Chemicals Co., Ltd. can be used.

(Filler)
The photocurable resin composition preferably contains a filler (filler).
The filler may be any filler, and may be an organic filler or an inorganic filler. From the viewpoint of heat resistance in the semiconductor process, an inorganic filler is preferably used rather than an organic filler.

  By the filler, the adhesive force of the region A and / or the region B can be appropriately adjusted (typically weakened), the ratio of the adhesive force of the region A and the region B can be made appropriate, etc. Can be expected. In other words, the use of the filler makes it easy to adjust and optimize the adhesive strength or peel strength to a desired value.

  The filler is not particularly limited, but for example, one or two types selected from the group consisting of silica such as fused silica and crystalline silica, alumina, aluminum hydroxide, silicon nitride, barium sulfate, talc, boron nitride and aluminum nitride. The above inorganic fillers can be included. Among these, silica and alumina are preferable in terms of availability and the effect of adjusting the adhesive strength.

  Although the average particle diameter of a filler is not specifically limited, For example, in the measured value by a laser diffraction type particle size distribution meter, Preferably it is 0.2-2.0 micrometers, More preferably, it is 0.2-1.0 micrometers. Moreover, it is preferable that the shape of a filler is a substantially perfect circle shape.

  When the filler is used, the amount used is not particularly limited. For example, the amount used is, for example, 10 to 80% by mass, preferably 20 to 70% by mass, and more preferably 20 to 60% by mass with respect to the total amount of nonvolatile components in the composition. %.

(Composition properties, solvents, etc.)
The property of the photocurable resin composition before the temporary adhesive film is not particularly limited, and may be, for example, a liquid or a film.
When the photocurable resin composition is liquid, the photocurable resin composition typically contains a solvent.
The solvent is required when the photocurable resin composition is applied on a suitable substrate to form a film as a pre-stage for forming the region A and the region B. Here, examples of the “appropriate base material” include the first substrate 10 described in the section “Support substrate” described later.
In addition, even when a temporary adhesive film is formed by a laminating method instead of coating, first, a liquid composition is prepared by dissolving each component such as the epoxy resin in a solvent, and then the composition is A solvent is considered necessary for uniform application on a substrate.

Examples of the solvent include acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, cyclohexane, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, cellosolve, carbitol, anisole, and Organic solvents such as N-methylpyrrolidone can be mentioned. These may be used alone or in combination of two or more.
When the solvent is used, the amount used is not particularly limited. For example, the solvent is used so that the concentration is 30 to 80% by mass, preferably 40 to 70% by mass based on the total amount of nonvolatile components of the composition. The

  Although the thickness of the temporary adhesive film of 1st Embodiment is not specifically limited, For example, 1-100 micrometers, Preferably it is 3-80 micrometers, More preferably, it is 5-50 micrometers. Adjustment of the thickness of the temporary adhesive film is performed by adjusting the concentration of the thermosetting resin composition or the photocurable resin composition, adjusting the coating method / coating amount, adjusting the thickness of the thermoplastic resin film, and the like. be able to.

  Although the magnitude | size and shape of the temporary adhesive film of 1st Embodiment are not specifically limited, For example, they are the substantially rectangular shape or the substantially square shape of 50-1000 mm long and 50-1000 mm wide. Moreover, the substantially circular shape etc. of diameter 50-1000mm may be sufficient.

In the temporary adhesive film of the first embodiment, where the region A and the region B are provided is not particularly limited. For example, as shown in FIG. 3I, in the rectangular temporary adhesive film, the region A can be provided around the central region B (rectangular shape). In addition, the region A and the region B may be provided as shown in any of FIGS. 3 (ii) to (v). Of course, the method of providing the region A and the region B may not correspond to these.
From the viewpoint of ease of the cutting process in [Electronic package manufacturing method] to be described later and ease of taking out the electronic package thereafter, the boundary between the region A and the region B may be linear (not curved). preferable.
(In FIG. 3, the temporary adhesive film 12 is shown as an embodiment provided on the first substrate 10 described later.)

[Support substrate]
The electronic package manufacturing support substrate (also referred to simply as “support substrate”) of the first embodiment includes a first substrate and a temporary adhesive film (referred to as “temporary adhesive film” provided on one surface of the first substrate). ).
An example of this support substrate is schematically shown in FIG.

  In FIG. 1I, the support substrate 3 includes a first substrate 10 and a temporary adhesive film 12 provided on one surface thereof. The temporary adhesive film 12 has regions A and B as described above.

The material, thickness, size, shape, and the like of the first substrate 10 are not particularly limited, but are preferably described below.
Examples of the material of the first substrate 10 include metals and synthetic resins. In consideration of various processes (including heating and the like) described later, a material that can withstand a certain high temperature is preferable. In this respect, the first substrate 10 is preferably made of metal. More preferably, iron, stainless steel, copper or the like is used. Among these, stainless steel is preferable.
Further, when the material of the first substrate 10 is a synthetic resin, it is preferable to use a thermosetting resin. For example, a phenol resin, a melamine resin, a urea resin, etc. are mentioned. Moreover, when the material of the 1st board | substrate 10 is a synthetic resin, components, such as a filler and a fiber, may be contained. These components can be expected to improve strength.

The thickness of the first substrate 10 is preferably 30 μm or more, more preferably 40 μm or more, and further preferably 50 μm or more. By setting the thickness to a certain value or more, the first substrate 10 has sufficient strength and rigidity, so that deformation of the first substrate 10 can be suppressed in a later step. That is, an electronic package can be manufactured stably.
Moreover, the thickness of the 1st board | substrate 10 is 1000 micrometers or less, for example, Preferably it is 500 micrometers or less, More preferably, it is 200 micrometers or less. By making the thickness equal to or less than a certain value, an increase in the weight of the first substrate 10 can be suppressed, so that handling properties are improved.

The size and shape of the first substrate 10 is, for example, a substantially rectangular shape or a substantially square shape with a length of 50 to 1000 mm and a width of 50 to 1000 mm. Moreover, the substantially circular shape etc. of diameter 50-1000mm may be sufficient.
The first substrate 10 preferably has at least one surface (surface on which the temporary adhesive film 12 is formed) substantially flat.

Examples of the method of providing the temporary adhesive film 12 on one surface of the first substrate 10 include methods by coating and laminating as described above. The method of providing the regions A and B in the temporary adhesive film 12 is also as described above.
The thickness of the temporary adhesive film 12 is also as described above. That is, for example, the thickness is 1 to 100 μm, preferably 3 to 80 μm, more preferably 5 to 50 μm.

[Electronic Package Manufacturing Method]
In the electronic package manufacturing method of the first embodiment, an electronic package can be manufactured using the temporary adhesive film or the support substrate.
This manufacturing method can include a temporary bonding step, an arrangement step, a sealing step, a cutting step, and a separation step. Each of these steps will be described with reference to the drawings.

-Temporary bonding process (Fig. 1 (ii))
In the temporary bonding step, the temporary bonding film 12 (including the regions A and B) included in the support substrate 3 and the second substrate 14 are brought into close contact with each other, and the first substrate 10, the temporary bonding film 12, and the second substrate 14 are brought into close contact with each other. A composite substrate comprising at least three layers of the substrate 14 is obtained.

Specific examples of the second substrate 14 include a semiconductor wafer (such as a silicon wafer), an organic substrate, and various package substrates typified by an interposer substrate. In the first embodiment, an interposer substrate can be preferably applied.
The interposer substrate is typically for electrically connecting different electronic elements in the electronic package. For this reason, the interposer substrate typically includes copper wiring and the like.

In recent years, there has been a demand for thinner electronic devices (packages). Therefore, the interposer substrate is also required to be thin. It is possible to suppress bending and cracking of the interposer substrate by using a material with high rigidity as the material of the interposer. However, selection and improvement of the material alone are not sufficient for the recent demand for thin film. It may be possible.
According to the electronic package manufacturing method of the first embodiment, the second substrate 14 (specifically, the interposer substrate) can be prevented from being bent or cracked due to the rigidity of the first substrate 10.
Further, when a material having high rigidity is used as the material of the interposer substrate, the interposer substrate can be designed to be thinner.

  The second substrate 14 (interposer substrate or the like) preferably has an alignment mark (not shown) for alignment. Thereby, it becomes easy to align the first substrate 10 and the second substrate 14, and it becomes easy to place the electronic element 16 in an appropriate position in an arrangement step described later, and an appropriate position in a cutting step described later. There are effects such as easy cutting.

Although the specific method of a temporary adhesion process is not specifically limited, For example, the lamination method can be used. Specifically, after the second substrate 14 and the temporary adhesive film 12 are brought into close contact, they can be bonded by vacuum lamination under conditions of 30 to 100 ° C. and 0.1 to 1 MPa.
Further, for example, after the laminating step, the entire first substrate 10, temporary adhesive film 12, and second substrate 14 may be heated at 100 to 200 ° C. for 10 to 120 minutes by putting them in an oven. . Thereby, effects such as adhesion can be expected.

Placement process (FIG. 1 (iii))
In the arranging step, the surface of the composite substrate obtained in the temporary bonding step is overlapped with the region B when the surface including the second substrate 14 is viewed from above, and electrons are placed on the second substrate 14 in the composite substrate. The element 16 is disposed.
By arranging in this way, the bottom surface of the electronic package cut out through a cutting process, a separation process, and the like, which will be described later, comes into contact with the region B having a relatively weak adhesive force. Therefore, it becomes easy to separate the electronic package from the first substrate 10 after the cutting process. That is, the productivity of electronic package manufacturing can be increased (this will be described in more detail in the cutting step and the separation step described later).

  In the arranging step, it is preferable to arrange a plurality of electronic elements 16. By doing so, further improvement in the productivity of electronic packages can be expected. In the electronic package manufacturing method of the first embodiment, the number of electronic elements 16 disposed at a time is, for example, 2 to 2000, preferably 4 to 1000. The relative arrangement positions of the plurality of electronic elements 16 are not particularly limited, but are typically arranged at substantially equal intervals.

  The electronic element 16 to be arranged is not particularly limited as long as it is an individual component that is a component of an apparatus / electronic circuit or the like and has an independent unique function. Examples of the electronic element 16 include a semiconductor chip.

  The electronic element 16 to be arranged may be fixed or temporarily fixed by an additional appropriate process so that the arrangement position is not shifted in the subsequent sealing process or for other purposes.

For example, when the second substrate 14 is an interposer substrate, it is preferable to include a process of connecting the interposer substrate and the electronic element 16. Specifically, a so-called reflow process is performed, that is, the solder previously applied to the second substrate 14 and / or the electronic element 16 is melted by an appropriate means (for example, by heating the entire substrate), The step of connecting the second substrate 14 and the electronic element 16 may be performed. The conditions for the reflow process are, for example, 1 to 10 minutes at a temperature of 250 to 300 ° C.
In addition to the reflow process, a known bump formation technique, chip connection technique, or the like may be applied to the fixing or temporary fixing here.

・ Sealing process (FIG. 1 (iv))
In the sealing process, the sealing composition is applied to the electronic element 16 arranged in the arranging process, and the electronic element 16 is sealed with a cured product (cured product 18) of the sealing composition. A substrate 20 is obtained.

Although it will not specifically limit if the composition for sealing can seal the electronic element 16, For example, what contains a thermosetting resin etc. is mentioned preferably.
As the sealing composition, a known composition can be appropriately applied.
The sealing composition preferably contains a thermosetting resin (A) described below as one embodiment. In addition, components such as a curing agent (B), a curing catalyst (C), and an inorganic filler (D) may be contained. Hereinafter, these components will be described.

(Thermosetting resin (A))
The thermosetting resin (A) is, for example, one or more selected from the group consisting of epoxy resins, phenol resins, oxetane resins, (meth) acrylate resins, unsaturated polyester resins, diallyl phthalate resins, and maleimide resins. Can be included. Among these, an epoxy resin can be included from the viewpoint of improving curability, storage stability, heat resistance, moisture resistance, and chemical resistance.

  As the epoxy resin contained in the thermosetting resin (A), monomers, oligomers and polymers generally having two or more epoxy groups in one molecule can be used, and the molecular weight and molecular structure are not particularly limited.

  Examples of the epoxy resin include a biphenyl type epoxy resin; a bisphenol type epoxy resin such as a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, and a tetramethylbisphenol F type epoxy resin; a stilbene type epoxy resin; a phenol novolac type epoxy resin, and a cresol novolak type. Novolak type epoxy resins such as epoxy resins; polyfunctional epoxy resins such as trisphenol type epoxy resins exemplified by triphenolmethane type epoxy resins and alkyl-modified triphenolmethane type epoxy resins; phenol aralkyl type epoxy resins having a phenylene skeleton , Naphthol aralkyl epoxy resin having phenylene skeleton, phenol aralkyl epoxy resin having biphenylene skeleton, biphenylene skeleton Phenolic aralkyl type epoxy resins such as phthalol aralkyl type epoxy resins; Dihydroxynaphthalene type epoxy resins, naphthol type epoxy resins such as epoxy resins obtained by dimerizing dihydroxynaphthalene to glycidyl ether; Triglycidyl isocyanurate, monoallyldi One or two or more types selected from the group consisting of triazine nucleus-containing epoxy resins such as glycidyl isocyanurate; bridged cyclic hydrocarbon compound-modified phenolic epoxy resins such as dicyclopentadiene-modified phenolic epoxy resins can be included. . Among these, the inclusion of one or more selected from a novolac type epoxy resin, a biphenyl type epoxy resin, and a phenol aralkyl type epoxy resin improves the balance of various properties such as fillability, heat resistance, and moisture resistance. From the viewpoint of making it.

  The content of the thermosetting resin (A) is preferably 2 to 50% by mass, more preferably 3 to 30% by mass, and still more preferably 4 to 15% by mass with respect to the whole sealing composition. By setting it to an appropriate content, improvement in filling property and molding stability, improvement in moisture resistance reliability and reflow resistance can be expected.

(Curing agent (B))
It is preferable that the composition for sealing contains a hardening | curing agent (B). The curing agent (B) can be roughly classified into three types, for example, a polyaddition type curing agent, a catalyst type curing agent, and a condensation type curing agent.

  Examples of polyaddition type curing agents include aliphatic polyamines such as diethylenetriamine (DETA), triethylenetetramine (TETA), and metaxylylene diamine (MXDA), diaminodiphenylmethane (DDM), m-phenylenediamine (MPDA), and diamino. In addition to aromatic polyamines such as diphenylsulfone (DDS), polyamine compounds including dicyandiamide (DICY), organic acid dihydrazide, and the like; alicyclic acid anhydrides such as hexahydrophthalic anhydride (HHPA) and methyltetrahydrophthalic anhydride (MTHPA) , Acid anhydrides including aromatic acid anhydrides such as trimellitic anhydride (TMA), pyromellitic anhydride (PMDA), and benzophenone tetracarboxylic acid (BTDA); novolac-type phenolic resin, polyvinyl phenol Selected from the group consisting of phenolic resin-based curing agents such as aralkyl-type phenolic resins; polymercaptan compounds such as polysulfides, thioesters and thioethers; isocyanate compounds such as isocyanate prepolymers and blocked isocyanates; organic acids such as carboxylic acid-containing polyester resins Including one or more types.

  Catalytic curing agents include tertiary amine compounds such as benzyldimethylamine (BDMA) and 2,4,6-trisdimethylaminomethylphenol (DMP-30); 2-methylimidazole, 2-ethyl-4-methyl Imidazole compounds such as imidazole (EMI24); one or more selected from the group consisting of Lewis acids such as BF3 complexes.

  The condensation type curing agent includes, for example, one type or two or more types selected from the group consisting of a resol type phenol resin; a urea resin such as a methylol group-containing urea resin; and a melamine resin such as a methylol group-containing melamine resin.

  Among these, it is more preferable to include a phenol resin-based curing agent from the viewpoint of improving the balance of flame resistance, moisture resistance, electrical characteristics, curability, storage stability, and the like. As the phenol resin-based curing agent, monomers, oligomers, and polymers in general having two or more phenolic hydroxyl groups in one molecule can be used, and the molecular weight and molecular structure are not particularly limited.

  The phenol resin-based curing agent used as the curing agent (B) is, for example, a novolac type phenol resin such as a phenol novolak resin, a cresol novolac resin, or a bisphenol novolac; a polyvinyl phenol; a polyfunctional phenol resin such as a triphenolmethane type phenol resin; Modified phenol resins such as terpene-modified phenol resin and dicyclopentadiene-modified phenol resin; phenol aralkyl resins having a phenylene skeleton and / or biphenylene skeleton, phenol aralkyl type phenol resins such as naphthol aralkyl resin having phenylene and / or biphenylene skeleton; bisphenol One type or two or more types selected from the group consisting of bisphenol compounds such as A and bisphenol F are included. Among these, it is more preferable that at least one of a novolac type phenol resin and a phenol aralkyl type phenol resin is included from the viewpoint of improving the curability of the sealing composition.

  It is preferable that content of a hardening | curing agent (B) is 1-40 mass% with respect to the whole composition for sealing, It is more preferable that it is 2-25 mass%, It is 3-10 mass% Is more preferable. By appropriately adjusting the content of the curing agent (B), improvement in filling property and moldability, improvement in moisture resistance reliability and reflow resistance can be expected.

(Curing catalyst (C))
The composition for sealing may further contain a curing catalyst (C). The curing catalyst (C) promotes a crosslinking reaction between the thermosetting resin (A) (for example, epoxy group of epoxy resin) and the curing agent (B) (for example, phenolic hydroxyl group of phenol resin-based curing agent). What is necessary is just to be made, and what is used for a well-known sealing composition can be used.

  Curing catalysts (C) are, for example, organic phosphines, tetra-substituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, phosphorus atom-containing compounds such as adducts of phosphonium compounds and silane compounds, imidazole compounds, triazines An isocyanuric acid adduct of 2-phenylimidazole, an isocyanuric acid adduct of 2-phenylimidazole, an isocyanuric acid adduct of 2-methylimidazole, and an amine curing accelerator such as 1,8-diazabicyclo [5.4.0] undecene 1 type or 2 types or more can be included. Among these, from the viewpoint of improving the balance of burr suppression, filling properties, and curability, it is more preferable to include one or more selected from phosphorus atom-containing compounds and imidazole compounds. Moreover, it is more preferable that a phosphorus atom containing compound is included from a viewpoint of improving sclerosis | hardenability.

  The content of the curing catalyst (C) is preferably 0.05 to 2.0% by mass, more preferably 0.1 to 1.0% by mass with respect to the entire sealing composition, More preferably, it is 0.15-0.5 mass%. By appropriately adjusting the content of the curing catalyst (C), an improvement in curability and an improvement in filling property due to an improvement in fluidity can be expected.

(Inorganic filler (D))
The composition for sealing may contain an inorganic filler (D) (filler). The inorganic filler (D) can include one or more selected from the group consisting of silica such as fused silica and crystalline silica, alumina, aluminum hydroxide, silicon nitride, and aluminum nitride. Among these, it is preferable that a silica is included from a versatility viewpoint, and it is more preferable that a fused silica is included. Moreover, it is more preferable that aluminum hydroxide is included from a viewpoint of improving the flame retardance of sealing resin formed using the composition for sealing. In particular, a case where both silica and aluminum hydroxide are contained can be mentioned as a preferred example.

  The content of the inorganic filler (D) is preferably 60 to 90% by mass, and more preferably 70 to 85% by mass with respect to the entire sealing composition. By appropriately adjusting the content, improvement in moisture resistance reliability, reflow resistance, and improvement in filling properties can be expected.

(Other ingredients)
The sealing composition may be one of various additives such as a coupling agent, a release agent, a colorant, an ion scavenger, an oil, a low stress agent, a flame retardant, and an antioxidant, if necessary. More than one species can be appropriately blended.

The coupling agent may include known coupling agents such as various silane compounds, titanium compounds, aluminum chelates, and aluminum / zirconium compounds. Among these, epoxy silane or aminosilane is more preferable, and secondary aminosilane is more preferable.
The releasability-imparting agent is, for example, one or two selected from natural waxes such as carnauba wax, synthetic waxes such as montanic acid ester wax and oxidized polyethylene wax, higher fatty acids such as zinc stearate and metal salts thereof, and paraffin. More than one type may be included.
The colorant may contain, for example, one or both of carbon black and black titanium oxide.
The ion scavenger may include, for example, hydrotalcite.
The oil may include, for example, silicone oil.
The low stress agent may include, for example, silicone rubber.
The flame retardant may include one or more selected from, for example, magnesium hydroxide, zinc borate, zinc molybdate, and phosphazene.
The antioxidant may include one kind or two or more kinds selected from a phenol-based antioxidant, a phosphorus-based antioxidant, and a thioether-based antioxidant.

(Properties of sealing composition)
The properties of the sealing composition may be in the form of granules, liquid, film (formed in a film on an appropriate support), and the like. The sealing composition is typically granular.

A sealing process can be performed as follows, for example.
First, the sealing substrate (typically, the granular sealing composition containing the components described above) is added in an amount sufficient to bury the arranged electronic elements 16 in the second substrate 14. This is applied to the upper surface and the side surface of the arranged electronic element 16. At this time, attention should be paid so that the positions of the arranged electronic elements 16 do not shift.
Next, sealing molding is performed by a method such as compression molding. Thereby, the sealing substrate 20 in which the electronic element 16 is sealed with the cured product 18 is obtained. The compression molding can be performed at a temperature of 120 to 180 ° C., for example.
Moreover, in order to harden the composition for sealing reliably, it is preferable to perform a heating process after compression molding. This heating can be performed at a temperature of 120 to 250 ° C. for about 1 to 10 hours using an oven, for example.
Of course, you may perform a sealing process by methods other than the above. For example, as a sealing composition, a fluid paste may be used instead of granules.

・ Cutting process and separation process (Fig. 2)
A structure in which the electronic element 16 is sealed with the cured product 18 by the cutting step of cutting at least a part of the sealing substrate 20 and the separation step of separating the support substrate 3 and the second substrate 14 ( Electronic package).

As an example of cutting, a portion where the electronic element 16 is present is cut out with the surface of the sealing substrate 20 on which the cured product 18 is present as an upper surface (FIG. 2 (v-1)). Thereby, the electronic package can be separated from the sealing substrate 20.
The cutting here is performed, for example, at least at a depth from the upper surface of the cured product 18 to the portion of the second substrate 14 (FIG. 2 (v-1) schematically shows the case of cutting in this way. ) Of course, the depth of cutting is not limited to “from the upper surface of the cured product 18 to the portion of the second substrate 14”. You may cut from the upper surface of the hardened | cured material 18 to the 1st board | substrate 10 (from the top to the bottom).

  The cutting position (position where the blade is inserted) of the sealing substrate 20 is not particularly limited, and may be any position as long as an electronic package can be obtained. However, preferably, a portion corresponding to the region B when the sealing substrate 20 is viewed from above with the surface on which the cured product 18 of the sealing substrate 20 is present as an upper surface (particularly close to the boundary with the region A in the region B). Cut part). By doing in this way, the bottom face of the electronic package to be separated after the cutting process (the portion of the second substrate 14 that is in contact with the temporary adhesive film 12) is in contact only with the region B having a relatively low adhesive force. . That is, there is an advantage that the electronic package can be separated more easily.

On the other hand, when it is desired that the electronic package is temporarily bonded to a certain extent after cutting, it is not always necessary to perform cutting as described above. As a precaution, the portion corresponding to the region A should not be cut in the first embodiment.
The cutting is usually performed so as not to damage the electronic element 16.

When cutting and separating, the adhesive force of the region B is smaller than the adhesive force of the region A (specifically, 0.1 ≦ (x _B / x _A ) ≦ 0.5), thereby separating the electronic package. There is an advantage that is easy.
Further, the x _B not zero (region B, although weaker than the region A, some having adhesive force) by electrons package cut out, "fly" in an unintended direction by a cutting force such It is hard to happen.

Furthermore, an additional merit that the residue of the temporary adhesive film hardly adheres to the second substrate can be considered. This is considered important in terms of improving the yield of electronic packages.
In particular, in 1st Embodiment, the adhesive force with respect to copper foil of the area | region B is comparatively weak. Accordingly, even when an interposer substrate (typically including a copper member such as a copper wiring) is used as the second substrate 14, the residue of the temporary adhesive film tends not to adhere. This effect is particularly considered to be remarkable when _{x B} is 0.01~0.3 [kN / m].

On the other hand, since the adhesive strength of the region A is relatively large, problems such as peeling of the support substrate 3 are unlikely to occur in the cutting process and the above-described processes.
In particular, since the region A has a certain amount of adhesive strength even after heating, it is considered that the adhesion between the first substrate 10 and the second substrate 14 can be maintained even if the above-described reflow process is performed. It is done.

Further, through the above-described series of steps, the second substrate 14 (interposer substrate or the like) can be bonded to the plurality of electronic elements 16 at once, or the plurality of electronic elements 16 can be collectively sealed. can do.
Furthermore, in the cutting, the presence of the first substrate 10 stabilizes the entire sealing substrate 20.

  That is, by using the temporary adhesive film or the support substrate according to the first embodiment to manufacture an electronic package by the above-described process, the electronic package can be manufactured efficiently.

As an example of cutting different from the above, the first substrate which is a part of the sealing substrate 20 after cutting from the upper surface side with the surface of the first substrate 10 in the sealing substrate 20 as the upper surface. 10 and the temporary adhesive film 12 (a part of the support substrate 3) may be separated (FIG. 2 (v-2)).
This cutting is performed, for example, at least from the upper surface of the first substrate 10 to the depth of the temporary adhesive film 12 portion. Of course, the depth of cutting is not limited to “from the upper surface of the first substrate 10 to the portion of the temporary adhesive film 12”. You may make it cut from the upper surface of the 1st board | substrate 10 to the hardened | cured material 18 (from the top to the bottom).

  Also in this case, the cutting position (position where the blade is inserted) of the sealing substrate 20 is not particularly limited, and may be any position as long as an electronic package can be obtained. However, preferably, a portion corresponding to the region B when the surface of the sealing substrate 20 is viewed from above with the surface of the sealing substrate 20 where the first substrate 10 is provided as the upper surface (particularly, the boundary between the region B and the region A). Cut the part close to. By doing in this way, the part which touches the 2nd board | substrate 14 of the support substrate 3 isolate | separated after a cutting process becomes only the area | region B with comparatively small adhesive force. That is, there is an advantage that the electronic package and the support substrate can be more easily separated.

On the other hand, when it is desired that the electronic package is temporarily bonded to a certain extent after cutting, it is not always necessary to perform cutting as described above. As a precaution, the portion corresponding to the region A should not be cut in the first embodiment.
The cutting is usually performed so as not to damage the electronic element 16.

  Even in the case of cutting as shown in FIG. 2 (v-2), due to the presence of the region A and the region B, separation is easy, and the support substrate 3 is difficult to peel off at each step, and the electronic devices 16 are collectively collected. Advantages such as being able to bond the second substrate 14 (interposer substrate or the like) and sealing a plurality of electronic elements 16 at a time are obtained.

  A known cutting technique can be appropriately applied to the cutting. Specifically, cutting using a known dicing saw, that is, a dicing blade (a diamond circular rotary blade is commonly used) is rotated at a high speed and cut while being cooled with pure water or the like and washed away with cutting waste. A method such as a method, a method by laser dicing, or a combination of these methods can be applied.

  If the electronic package (including the plurality of electronic elements 16) separated by cutting is further cut, an electronic package in which each electronic element 16 is sealed is obtained.

  In addition, although the example (2 examples) which cuts out the electronic package containing the some electronic element 16 was demonstrated above, naturally the aspect cut | disconnected so that each electronic element 16 may be cut out is also included in a cutting process. It is.

  To repeat, the first embodiment is not a complicated process of covering each individual electronic package with a sealing composition and then heating and sealing it, but the simpler process makes the final electronic There is a merit of productivity improvement in terms of obtaining a package.

<Second Embodiment>
[Temporary adhesive film]
The temporary adhesive film of 2nd Embodiment is used for manufacture of an electronic device.
This temporary adhesive film has a property that the adhesive strength is reduced by exposure.
In addition, an unexposed temporary adhesive film and a copper foil having an arithmetic average surface roughness of 0.2 μm were thermocompression bonded under the conditions of a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and then heated at 150 ° C. for 1 hour. The peel strength of the copper foil in the first composite film adhered in this manner is y _A [kN / m],
After heat-bonding a temporary adhesive film exposed with i-line of 2000 mJ / cm ² and a copper foil having an arithmetic average surface roughness of 0.2 μm under the conditions of a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, 150 When the peel strength of the copper foil in the second composite film adhered by heating at 0 ° C. for 1 hour is y _B [kN / m],
The relationship of 0.1 ≦ (y _B / y _A ) ≦ 0.5 is established.

_The value of y B / _{y A} is may be a 0.1 to 0.5, preferably 0.15 to 0.45, more preferably 0.2 to 0.4.
Further, the value of _{y B} is not particularly limited, preferably 0.01~0.3 [kN / m], more preferably 0.05~0.27 [kN / m], more preferably 0.15 to It is 0.25 [kN / m].
The specific method for measuring y _A and y _{B is} the same as the specific method for measuring x _A and x _B in the first embodiment. For details, refer to Examples described later.

The temporary adhesive film of 2nd Embodiment forms a film | membrane with a photocurable resin composition like (II) of the above-mentioned 1st Embodiment, and light-irradiates a part of the film | membrane, and the area | region A and It can be said that it is a “previous stage” film of the temporary adhesive film provided with the region B.
That is, by irradiating a part of the temporary adhesive film of the second embodiment with i-rays of about 2000 mJ / cm ² , the adhesive strength of the irradiated portion is reduced, and the “region A” and “ Region B "can be provided.

  Such advantages (obtained effects) of the temporary adhesive film provided with “region A” and “region B” have been described in the first embodiment. Therefore, a renewed description is omitted.

Moreover, about the raw material of the temporary adhesive film of 2nd Embodiment, the thing similar to the photocurable resin composition demonstrated in the temporary adhesive film of 1st Embodiment can be mentioned.
That is, the temporary adhesive film of the second embodiment is preferably at least one polymerizable compound selected from the group consisting of an epoxy compound and a polymerizable (meth) acrylate compound, a photopolymerization initiator, and optionally other It can be obtained using a photocurable resin composition containing an optional component (for example, a filler, preferably an inorganic filler).
The details of the photocurable resin composition will not be described again.

As a merit unique to the temporary adhesive film of the second embodiment, there is a point that the adhesive force is “adjustable”.
In the temporary adhesive film of the first embodiment, x _B / x _A is basically a constant value. On the other hand, in the temporary adhesive film of 2nd Embodiment, adhesive force can be adjusted by adjusting the exposure amount at the time of providing the area | region B. FIG. This means that, for example, one kind of temporary adhesive film can be applied to the manufacture of a wide variety of electronic packages (a new temporary adhesive film does not have to be prepared from scratch with the change of the electronic package). ).

Specifically, the temporary adhesive film of the second embodiment exposed with i-line of 500 mJ / cm ² and the copper foil having an arithmetic average surface roughness of 0.2 μm were heated at 60 ° C., pressure 0.3 MPa, and time. When the peel strength of the copper foil in the third composite film bonded by heating at 150 ° C. for 1 hour after thermocompression bonding under a condition of 30 seconds is y _c [kN / m], y _B <y _c <y It holds the relationship of _a, and it is preferable to hold the 0.2 ≦ relationship _{(y c / y a) ≦} 0.7.

  Moreover, there exists the point that the area | regions A and B can be provided freely as a further merit specific to the temporary adhesive film of 2nd Embodiment. This also means that one type of temporary adhesive film can be applied to manufacture a wide variety of electronic packages.

[Support substrate]
The support substrate for manufacturing an electronic package according to the second embodiment (also simply referred to as “support substrate”) includes a first substrate and a temporary adhesive film (referred to as “temporary adhesive film” provided on one surface of the first substrate). ).
The specific mode, use, etc. of the support substrate are the same as those of the support substrate of the first embodiment. Therefore, a renewed description is omitted (however, the temporary adhesive film is that of the second embodiment).

[Electronic Package Manufacturing Method]
The method for manufacturing an electronic package of the second embodiment can include an exposure process, a temporary bonding process, an arrangement process, a sealing process, a cutting process, and a separation process.
Of these steps, steps other than the exposure step are the same as those in the electronic package manufacturing method according to the first embodiment, and thus a description thereof is omitted.

The exposure process will be described.
In the exposure step, the temporary adhesive film of the support substrate described above can be exposed to provide a region A having a strong adhesive force and a region B having a weaker adhesive force than the region A.
The light to be exposed can be set as appropriate based on the photosensitive characteristics of the photocurable resin composition. For example, light having a wavelength of 100 to 1000 nm, more specifically g-line, i-line, or the like is applied. The exposure amount (dose) can also be appropriately set based on the photosensitive characteristics of the composition. For example, 10~10000mJ / cm ^2, preferably 50 to 5000 mJ / cm ^2, more preferably 100~3000mJ / cm ^2. As an exposure method, a contact exposure method, a projection exposure method, a contact proximity exposure method, or the like can be appropriately applied. As for the exposure conditions, for example, the peel strength of the exposed portion (measured in the same manner as y _A or y _B ) when the unexposed portion is used as a reference is 0.1 to 0.5 times. Is adjusted as appropriate.

  As mentioned above, although embodiment of this invention was described, these are illustrations of this invention and can employ | adopt various structures other than the above. Further, the present invention is not limited to the above-described embodiment, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.

  Embodiments of the present invention will be described in detail based on examples and comparative examples. In addition, this invention is not limited to an Example.

I. Example in which a temporary adhesive film was prepared from a thermosetting resin composition and / or a thermoplastic resin film

1. Production of Temporary Adhesive Film / Support Substrate of Example 1 and Comparative Example 1 By the following steps, a region A was provided around a central region B (rectangular shape) as shown in FIG. A rectangular temporary adhesive film was obtained. Further, a support substrate provided with the temporary adhesive film on one side was obtained.

(1) A commercially available thermoplastic resin film (described in the table below) was prepared and cut into an appropriate size. (This was a thermoplastic resin film that would be the element of region B.)
(2) A component of “region A composition” in the table below was dissolved in methyl ethyl ketone to prepare a coating solution having a concentration of 60% by mass.
(3) The above coating solution was applied to a first PET film (TR1 (film thickness: 38 μm) manufactured by Unitika) using a comma coater, and the solvent was dried. The film thickness at this time was 20 μm. (The film formed in this way was used as a thermosetting resin composition that would be the raw material of region A.)
(4) The film prepared in (1) above was placed on the coating surface of the film formed in (3) above. Further, a second PET film (TR1 (film thickness: 38 μm) manufactured by Unitika Co., Ltd.) was further placed thereon. These were laminated together with a vacuum laminator. Lamination conditions were 60 ° C./0.3 MPa / 30 sec.
(5) The 1st PET film in the laminate structure obtained by said (4) was peeled, and it was made to contact | adhere with the stainless steel 1st board | substrate (100 micrometers in thickness, 70 mm long x 200 mm wide). Thereafter, vacuum lamination was performed using a vacuum laminator apparatus (MVLP-500 / 600IIA manufactured by Meiki Seisakusho Co., Ltd.) at 50 ° C. and 0.3 MPa. As a result, a support substrate in which a temporary adhesive film having regions A and B was provided on one surface of the first stainless steel substrate was obtained.
The first PET film has the following 3. Immediately before the measurement of the above or 4. It peeled just before the process of (2).

2. Preparation of temporary adhesive films / support substrates of Examples 2 to 6 and Comparative Example 2 In Example 1, a temporary adhesive film and a support substrate were obtained in the same manner except that a film prepared as follows was used in place of a commercially available thermoplastic resin film (part of region B). The temporary adhesive film here is also a rectangular shape in which a region A is provided around a central region B (rectangular shape).

The components of “Region B composition” in the table below were dissolved in methyl ethyl ketone to prepare a coating solution having a concentration of 60% by mass. This coating solution was applied to a PET film (TR1 manufactured by Unitika (film thickness 38 μm)) using a comma coater, and the solvent was dried. The film thickness at this time was 10 μm.
The film formed in this manner was used as a region B element.

3. As the copper foil measuring the arithmetic average surface roughness 0.2μm of x _A and _{x B,} Mitsui Mining & Smelting Mining Co. copper foil (product number: 3EC-M3-VLP, thickness: 12 [mu] m) and the wide strips 25mm Prepared what was cut.
Place the copper foil so as to straddle the area A and the area B of the temporary adhesive film, and apply the glossy surface (arithmetic average surface roughness: 0.2 μm) of the copper foil to both the areas A and B of the temporary adhesive film. Made contact. This was thermocompression-bonded (vacuum lamination) under the conditions of a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and further heated at 150 ° C. for 1 hour using an oven. Then, it stood to cool at room temperature.

The copper foil bonded to the temporary adhesive film was peeled off in the vertical direction as shown in FIG. 4 at a speed of 50 mm / min. The peel strength (unit: kN) at this time is divided by the width of the copper foil of 0.025 m, and the peel strength x _{A at the} area _A and the peel strength x _B at the area _B are Asked.
A precision universal testing machine (Autograph AG-X plus) manufactured by Shimadzu Corporation was used to measure peeling at a constant speed and peeling strength. In addition, the measurement conditions and the like that are not specified here are based on JIS C 6481, particularly, section 5.7.

4). Manufacture of electronic package (1) Production of support substrate And 2. As described above, a support substrate was prepared in which a temporary adhesive film having regions A and B was provided on a stainless steel first substrate.

(2) Temporary bonding step A temporary adhesive film of the support substrate and a second substrate (interposer substrate with an alignment mark) prepared in advance are combined with a vacuum laminator device (MVLP-500 manufactured by Meiki Seisakusho Co., Ltd.). / 600IIA) and bonded by vacuum lamination under conditions of 60 ° C. and 0.3 MPa.
The interposer substrate used had a thickness of 80 μm, and the vertical and horizontal sizes were substantially the same as those of the first substrate. This interposer substrate is mainly composed of epoxy resin, and is provided with unit structures (including copper wiring and solder bump structures etc. for electrically connecting the upper and lower sides of the interposer) at substantially equal intervals. The part where the structure was not provided was substantially flat.
After bonding by vacuum laminating, heat treatment was performed at 150 ° C. for 1 hour using an oven to ensure adhesion, and then allowed to cool.
As a result, a composite substrate having a three-layer structure of a first substrate, a temporary adhesive film, and a second substrate (interposer substrate) was obtained.

(3) Placement process (including reflow process)
A plurality of electronic elements were arranged on the unit structure portion of the interposer substrate of the composite substrate obtained in (2) above. In the present example and the comparative example, the arrangement positions of the electronic elements are such that all the electronic elements overlap with the region B when the composite substrate is viewed from above.
Thereafter, the composite substrate on which the electronic elements were arranged was put into a reflow furnace (NRY-325-5Z manufactured by Yamato Seisakusho Co., Ltd.), and reflow treatment (furnace atmosphere temperature 260 ° C., throwing time 5 minutes) was performed. Thereby, the interposer substrate and the electronic element were connected.

(4) Sealing Step First, an encapsulating composition in an amount that sufficiently hides the electronic device was applied to the upper surface of the substrate (the surface on which the electronic device was placed) after the placement step. As the sealing composition, a known granular sealing composition (containing epoxy resin, silica particles, curing agent, etc.) was used.
Thereafter, the sealing composition was sealed under conditions of a temperature of 175 ° C., a pressure of 10 MPa, and a time of 120 seconds, and cured in an oven at a temperature of 175 ° C. for a time of 5 hours to obtain a sealing substrate.

(5) Cutting process By appropriately cutting the sealing material and the second substrate (interposer substrate) in the sealing substrate obtained above, an electronic package in which a plurality of electronic elements are sealed is obtained. Cut out.
As a cutting device, a dicing machine DAD3240 manufactured by DISCO Corporation was used. A dicing blade having a model number ZH05-SD2000 was used.
Regarding the “position” of cutting, the peripheral portion of the portion corresponding to the region B when the sealing substrate is viewed from above is cut into a rectangular shape.

5. Evaluation (1) Substrate adhesiveness In the arrangement process (including the reflow process) of (3), it was confirmed whether or not peeling of the substrate occurred after the reflow process. A case where peeling or swelling of the substrate (first substrate and / or second substrate) did not occur was evaluated as “good”, and a case where peeling or swelling occurred was evaluated as “poor”.

(2) Electronic package separability 4. The electronic package cut out in the cutting step (5) was evaluated according to the following criteria.
○ (good): At the end of cutting, the electronic package was adhered to the temporary adhesive film, but could be easily peeled off and the electronic package could be separated.
Δ (somewhat good): At the end of cutting, the electronic package had already peeled off from the temporary adhesive film.
X (Bad): The electronic package could not be easily peeled from the temporary adhesive film, or when the electronic package was peeled from the temporary adhesive film, damage was observed on the second substrate.

(3) Residue adhesion or not 4. After the cutting step (5), the electronic package was separated from the first substrate, and the bottom surface (second substrate) was observed with a metal microscope. When the residue of the temporary adhesive film did not adhere to the bottom surface, it was rated as “good”, and when the residue of the temporary adhesive film adhered to the bottom surface, it was marked as “poor”.

Table 1 shows the constitution or composition of regions A and B, 3. Measurements of _{x A} and _{x B,} above 5. The evaluation results are summarized.
In Table 1, the amount of each component is parts by mass.

Where to find what is listed in Table 1 (and Table 2 below) is as follows.
・ Epoxy resin 1: YX6954BH30 (phenoxy resin) manufactured by Mitsubishi Chemical Corporation ・ Epoxy resin 2: 1256B40 (phenoxy resin) manufactured by Mitsubishi Chemical Corporation ・ Epoxy resin 3: YL6810 (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation ・ Epoxy resin 4: NC3000 (BA type epoxy resin) Nippon Kayaku Co., Ltd., acrylate 1: NK oligo UA-122P (urethane acrylate compound) Shin Nakamura Chemical Co., Ltd., acrylate 2: NK oligo UA-160TM (urethane acrylate compound) Shin Nakamura Chemical -Photopolymerization initiator 1: Irgacure 651 (photo radical polymerization initiator, compound name: 2,2-dimethoxy-1,2-diphenylethane-1-one) manufactured by BASF; thermosetting catalyst: 2PZ-PW ( Imidazole-based epoxy resin curing ) Shikoku Kasei Co., Ltd., inorganic filler: SO-C2 (fused silica with an average particle size of 0.5 μm) Admatechs, Inc. Thermoplastic film 1: VF-J100 (polyvinyl alcohol film, thickness 18 μm) Kuraray Co., Ltd., heat Plastic film 2: Stretched polypropylene film

As shown in Table 1, in Examples 1 to 6 in which an electronic package was manufactured using a temporary adhesive film having a value of x _B / x _A of 0.1 to 0.5, the substrate adhesion, the electronic package Good results were obtained with respect to separability and residue adhesion. It has been shown that the productivity of manufacturing electronic packages can be improved by the process of collectively sealing a plurality of electronic elements.
On the other hand, x _B is "zero" (areas completely adhesiveness is not in B) Comparative Example 1 was a result of inferior in electronic package separability. Further, x B _/ value of x _A is (too is highly adhesive in the region B) of greater than 0.5 Comparative Example 2 was poorer results in adhesion whether electronic package separability and residues.

II. Example in which a temporary adhesive film was prepared from a photocurable resin composition

1. Preparation of Temporary Adhesive Film / Support Substrate The components shown in Table 2 below were dissolved in methyl ethyl ketone to prepare a coating solution (photocurable resin composition) having a concentration of 60% by mass. This coating solution was applied to a PET film (TR1 manufactured by Unitika (film thickness 38 μm)) using a comma coater, and the solvent was dried. About the application quantity, it adjusted suitably so that the film thickness after drying might be set to about 10 micrometers.

Above 1. The coating film on the PET film obtained in the above was adhered to a first stainless steel substrate (thickness 100 μm, length 70 mm × width 200 mm). Thereafter, vacuum lamination was performed using a vacuum laminator apparatus (MVLP-500 / 600IIA manufactured by Meiki Seisakusho Co., Ltd.) at 50 ° C. and 0.3 MPa. This prepared the support substrate by which the temporary adhesive film was provided in the single side | surface of the 1st board | substrates made from stainless steel.
In addition, PET film has the following 2. 2. Immediately before the measurement of It peeled just before the process of (2).

2. Measurement of y _A , y _B and y _{C As} the copper foil, I. 3. I prepared the same thing.
First, the above 1. A portion of the temporary adhesive film (unexposed) on the support substrate obtained in (1) was irradiated with i-line of 2000 mJ / cm ² to provide portions corresponding to regions A and B. The exposure was performed with a high-pressure mercury lamp (i-line exposure machine) EXM-1201 manufactured by Oak.
A copper foil was placed so as to straddle these two regions, and the glossy surface of the copper foil was brought into contact with the temporary adhesive film. This was thermocompression-bonded (vacuum lamination) under the conditions of a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and further heated at 150 ° C. for 1 hour using an oven. Then, it stood to cool at room temperature.
Thereafter, the above I.D. 3. In the same manner, the copper foil was peeled off, and y _A and y _B were determined.

Moreover, the temporary adhesive film of the same composition was prepared separately, and 500 mJ / cm < ² > i line | wire was irradiated to this. And the copper foil was put in this exposure part, and the glossy surface of copper foil was made to contact a temporary adhesive film. This was thermocompression-bonded (vacuum lamination) under the conditions of a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and further heated at 150 ° C. for 1 hour using an oven. Then, it stood to cool at room temperature.
Thereafter, the above I.D. 3. Peeled copper foil in the same manner as to determine the y _C.

3. Manufacture of electronic package (1) Creation of support substrate As described above, a support substrate in which a photosensitive temporary adhesive film was provided on a first stainless steel substrate was prepared.

(2) Formation of regions A and B by exposure process Pattern exposure was performed on the temporary adhesive film on the support substrate. Thereby, the adhesive force of the exposure part was reduced and the area | region B was provided.
The exposure was performed with a high-pressure mercury lamp (i-line exposure machine) EXM-1201 manufactured by Oak.
As for the exposure pattern, as shown in FIG. 1 (i), a rectangular region B was provided at the center of the temporary adhesive film, and the region A surrounded the region.
The exposure amount was 2000 mJ / cm ² for the exposure region (region B).

(3) Temporary bonding step 4). It carried out like (2).

(4) Placement process (including reflow process)
I. above. 4). It carried out like (3).

(5) Sealing step 4). It carried out like (4).

(6) Cutting process 4). It carried out like (5).

4). Evaluation Regarding the substrate adhesiveness, the electronic package separability, and the presence or absence of residues, I. 5. And evaluated in the same manner.

Table 2 shows the above 1. 1. Composition of coating solution (photo-curable resin composition) used in 1. 3. Measurement results of y _A , y _B and y _C of 4. The evaluation results are summarized.
The amount of each component in Table 2 is parts by mass.
The source of each component described in Table 2 is the same as in Table 1.

As shown in Table 2, in Examples 2-1 to 2-8 in which an electronic package was manufactured using a temporary adhesive film having a value of y _B / y _A of 0.1 to 0.5, substrate adhesion Good results were obtained with respect to the properties, the electronic package separability and the presence or absence of residues.
(For Example 2-7, the evaluation of the presence or absence of residue adhesion is poor, but this is because the adhesive strength of the exposed portion (region B) is as high as in other examples due to the fact that no inorganic filler is used. This is presumed to be due to the fact that it did not decrease, but the substrate adhesion and electronic package separation were good, and the effects of being able to seal and take out the electronic elements in a lump were a problem. It can be put to practical use if it does not become a use.)

On the other hand, Comparative Example 2-1 in which y _B / y _A is smaller than 0.1 was originally poor in substrate adhesion. Further, Comparative Example 2-2 in which y _B / y _A was larger than 0.5 was a bad result with respect to the electronic package separability and the presence or absence of residue adhesion. The same applies to Comparative Example 2-3 (the photosensitive adhesive is not contained in the temporary adhesive film and the adhesive strength is not reduced in the exposed area).

3 Support substrate 10 First substrate 12 Temporary adhesive film 14 Second substrate 16 Electronic element 18 Cured material 20 Sealing substrate

Claims (20)

A temporary adhesive film used in the manufacture of electronic devices,
On the surface of the temporary adhesive film, there are a region A having a strong adhesive force and a region B having a weaker adhesive force than the region A,
The temporary adhesive film and a copper foil having an arithmetic average surface roughness of 0.2 μm were bonded by thermocompression bonding under conditions of a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and then heated at 150 ° C. for 1 hour. In the composite film, the peel strength of the copper foil at the region A is x _A [kN / m], and the peel strength of the copper foil at the region B is x _B [kN / m. ], _A temporary adhesive film in which a relationship of 0.1 ≦ (x _B / x _A ) ≦ 0.5 is established. The temporary adhesive film according to claim 1,
Temporary adhesive film wherein _{x B} is 0.01~0.3 [kN / m]. The temporary adhesive film according to claim 1 or 2,
The region A is composed of a thermosetting resin composition,
A temporary adhesive film in which the region B is composed of a thermosetting resin composition or a thermoplastic resin film. The temporary adhesive film according to claim 3,
The thermosetting resin composition constituting the region A and / or the region B includes at least one polymerizable compound selected from the group consisting of an epoxy compound and a polymerizable (meth) acrylate compound. Temporary adhesive film. The temporary adhesive film according to claim 1 or 2,
The region A is composed of a photocurable resin composition,
The temporary adhesive film in which the portion of the region B is composed of a cured product of the photocurable resin composition. The temporary adhesive film according to claim 5,
The temporary adhesive film in which the said photocurable resin composition contains at least 1 sort (s) of polymeric compounds selected from the group which consists of an epoxy compound and a polymeric (meth) acrylate compound, and a photoinitiator. The temporary adhesive film according to claim 5 or 6,
The temporary adhesive film in which the said photocurable resin composition contains a filler. The temporary adhesive film according to claim 7,
The temporary adhesive film in which the filler includes an inorganic filler. A first substrate;
A support substrate for manufacturing an electronic package, comprising: the temporary adhesive film according to claim 1 provided on one side of the first substrate. A temporary bonding step of temporarily bonding the temporary adhesive film of the support substrate according to claim 9 and the second substrate to obtain a composite substrate,
An arrangement step of disposing an electronic element so as to overlap the region B on the second substrate in the composite substrate when the composite substrate is viewed from above with the surface including the second substrate as an upper surface; ,
A sealing step of applying a sealing composition to the electronic elements arranged in the arrangement step, and obtaining a sealing substrate in which the electronic elements are sealed with a cured product of the sealing composition;
A cutting step of cutting at least a part of the sealing substrate;
A separation step of separating the support substrate and the second substrate;
An electronic package manufacturing method including: It is a manufacturing method of the electronic package according to claim 10,
When the sealing substrate is viewed from above with the surface of the sealing substrate provided with the cured product of the sealing composition as the upper surface, the cutting step is a step of cutting a portion corresponding to the region B. Electronic package manufacturing method. A temporary adhesive film used in the manufacture of electronic devices,
The temporary adhesive film has a property that the adhesive strength is reduced by exposure,
The unexposed temporary adhesive film and a copper foil having an arithmetic average surface roughness of 0.2 μm are thermocompression bonded at a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, and then heated at 150 ° C. for 1 hour. The peel strength of the copper foil in the first composite film adhered in this manner is y _A [kN / m],
After thermobonding the temporary adhesive film exposed with i-line of 2000 mJ / cm ² and a copper foil having an arithmetic average surface roughness of 0.2 μm under conditions of a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, When the peel strength of the copper foil in the second composite film bonded by heating at 150 ° C. for 1 hour is y _B [kN / m], 0.1 ≦ (y _B / y _A ) ≦ 0.5 Temporary adhesive film that holds the relationship. The temporary adhesive film according to claim 12,
temporary adhesive film y _B is 0.01~0.3 [kN / m]. The temporary adhesive film according to claim 12 or 13,
After thermobonding the temporary adhesive film exposed with i-line of 500 mJ / cm ² and a copper foil having an arithmetic average surface roughness of 0.2 μm under the conditions of a temperature of 60 ° C., a pressure of 0.3 MPa, and a time of 30 seconds, When the peeling strength of the copper foil in the third composite film adhered by heating at 150 ° C. for 1 hour is y _c [kN / m], the relationship y _B <y _c <y _A is satisfied, and _A temporary adhesive film satisfying a relationship of 0.2 ≦ (y _c / y _A ) ≦ 0.7. The temporary adhesive film according to any one of claims 12 to 14,
A temporary adhesive film comprising at least one polymerizable compound selected from the group consisting of an epoxy compound and a polymerizable (meth) acrylate compound, and a photopolymerization initiator. The temporary adhesive film according to any one of claims 12 to 15,
Temporary adhesive film containing filler. The temporary adhesive film according to claim 16,
The temporary adhesive film in which the filler includes an inorganic filler. A first substrate;
An electronic package manufacturing support substrate comprising the temporary adhesive film according to any one of claims 12 to 17 provided on one side of the first substrate. An exposure step of exposing the temporary adhesive film of the support substrate according to claim 18 to provide a region A having a strong adhesive force and a region B having a weaker adhesive force than the region A;
A temporary bonding step of temporarily bonding the temporary adhesive film and the second substrate exposed in the exposure step to obtain a composite substrate;
An arrangement step of disposing an electronic element so as to overlap the region B on the second substrate in the composite substrate when the composite substrate is viewed from above with the surface including the second substrate as an upper surface; ,
A sealing step of applying a sealing composition to the electronic elements arranged in the arranging step to obtain a sealing substrate in which the electronic elements are sealed with a cured product of the sealing composition; A cutting step of cutting at least a part of the sealing substrate;
A separation step of separating the support substrate and the second substrate;
An electronic package manufacturing method including: The method of manufacturing an electronic package according to claim 19,
When the sealing substrate is viewed from above with the surface of the sealing substrate provided with the cured product of the sealing composition as the upper surface, the cutting step is a step of cutting a portion corresponding to the region B. Electronic package manufacturing method.

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