JP2019169726A - Semiconductor device, metal member and method of manufacturing semiconductor device - Google Patents

Abstract

To provide a semiconductor device, a metal member, and a method of manufacturing a semiconductor device which can eliminate assembly defects.SOLUTION: A flange 2 of one open end 10a of a tubular contact member 10 is joined to a conductive plate 22 of an insulating substrate by a solder 27. An external electrode terminal 25 is fitted to a main body tubular portion 1 of the tubular contact member 10. The tubular contact member 10 has a protruding portion 5 protruding inward from an inner wall 10c of the main body tubular portion 1. The protruding portion 5 is provided on an open end 10a side of the tubular contact member 10 over the entire circumference of the inner wall 10c of the main body tubular portion 1. The protruding portion 5 has a thickness t1 that is deformed by a load when the external electrode terminal 25 is press-fitted into the main body tubular portion 1. A height h1 at which the protruding portion 5 is arranged is set to a height that can block a solder 27a that has crawled up on the inner wall 10c of the main body tubular portion 1 so that a gap is formed with the lower end portion of the external electrode terminal 25 inserted to the predetermined depth of the main body tubular portion 1.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a semiconductor device, a metal member, and a method for manufacturing a semiconductor device.

  2. Description of the Related Art Conventionally, a semiconductor device such as a semiconductor module has a configuration in which a semiconductor chip or other constituent member is joined to a conductive plate on the surface of an insulating substrate with solder. As such a semiconductor module, by fitting external electrode terminals to a hollow cylindrical metal member (hereinafter referred to as a cylindrical contact member) joined to a conductive plate on the front surface of an insulating substrate by solder. An apparatus in which a conductive plate and an external electrode terminal are electrically connected has been proposed (see, for example, Patent Document 1 below). In the following Patent Document 1, the external electrode terminal and the cylindrical contact member are tightly fitted together by making the maximum dimension of the bottom surface of the external electrode terminal slightly larger than the diameter of the hollow portion of the cylindrical contact member.

  The configuration of the cylindrical contact member and the external electrode terminal of the conventional semiconductor module will be described. FIG. 12 is a cross-sectional view showing a configuration of a main part of a conventional semiconductor module. FIG. 13 is a plan view showing a configuration of a main part of a conventional semiconductor module. In FIG. 13, when the main body cylinder portion 101 of the cylindrical contact member 110 of FIG. 12 is cut along a cutting plane XY perpendicular to the central axis of the main body cylinder portion 101, the laminated substrate 120 side is viewed from the cutting plane XY. The planar shape of the cavity 104 of the cylindrical contact member 110 and the external electrode terminal 125 is shown. 12 and 13 correspond to FIGS. 14 and 12 of Patent Document 1 below, respectively.

  As shown in FIGS. 12 and 13, the cylindrical contact member 110 includes a hollow cylindrical main body cylinder portion 101 and flanges 102 and 103 provided at both open ends 110 a and 110 b of the main body cylinder portion 101, respectively. . The flange 102 of one open end 110a of the cylindrical contact member 110 is joined to the conductive plate 122 on the front surface of the multilayer substrate 120 by solder (not shown). The multilayer substrate 120 is formed by forming a conductive plate 122 with a copper (Cu) foil on the front surface of a ceramic substrate 121 and forming a copper foil 123 on the back surface of the ceramic substrate 121. The cylindrical contact member 110 is electrically connected to the semiconductor chip 124 via a conductive plate 122 and a wire (not shown).

  One end of the external electrode terminal 125 protrudes from the through hole 127 of the case 126 to the outside of the case 126. The other end of the external electrode terminal 125 is press-fitted into the main body cylinder portion 101 (cavity portion 104) of the cylindrical contact member 110 and is fixed by being fitted to the cylindrical contact member 110. The external electrode terminal 125 is electrically connected to the semiconductor chip 124 via the cylindrical contact member 110. The external electrode terminal 125 has a substantially regular quadrangular prism shape, and the maximum dimension (diagonal length) d102 of the bottom surface thereof is slightly larger than the inner diameter (diameter of the cavity 104) d101 of the main body cylindrical portion 101 of the cylindrical contact member 110. (D101 <d102). The planar shape of the main body cylinder portion 101 of the cylindrical contact member 110 is slightly deformed in accordance with the shape of the bottom surface of the external electrode terminal 125.

US Patent Application Publication No. 2009/194484

  However, in the conventional semiconductor module configured to press-fit and fit the external electrode terminal 125 into the main body cylinder portion 101 of the cylindrical contact member 110 shown in FIGS. 10 and 11 are cross-sectional views schematically showing a state in which a conventional semiconductor module is being assembled. FIG. 10 shows an example of a soldering failure that occurs due to solderability (solderability) when the cylindrical contact member 110 is soldered onto the laminated substrate 120. FIG. 11 shows an example of a defect that occurs when the external electrode terminal 125 is press-fitted into the main body cylinder portion 101 of the cylindrical contact member 110.

As shown in FIG. 10, when the flange 102 of one open end 110a of the cylindrical contact member 110 is joined to the laminated substrate 120 by the solder 128, the solder 128 crawls up to the inner wall 110c of the main body cylinder portion 101 by a capillary phenomenon. Go up. At this time, depending on the shape of the hollow portion 104 of the cylindrical contact member 110, the solder 128 tends to creep up on the inner wall 110 c of the main body cylindrical portion 101. Further, paste solder 128 is formed on the multilayer substrate 120, the cylindrical contact member 110 is placed on the solder 128, and heated in a reflow furnace, so that the multilayer substrate 120 and the cylindrical contact member 110 are soldered together. There is a way to do it. In this case, the internal pressure of the solder 128 is removed by reducing the pressure in the reflow furnace so that no voids are formed in the solder 128. However, when the internal gas of the solder 128 expands when the internal pressure of the reflow furnace is reduced. In addition, the solder 128 may be scattered. As a result, one open end 110a side of the cylindrical contact member 110 to the other open end 110b (insertion port for the external electrode terminal 125).
There is a risk that the solder 128a will crawl up the inner wall 110c of the main body cylinder portion 101 on the side and remain on the inner wall 110c of the main body cylinder portion 101 in a thick state such as, for example, solidified without spreading smoothly.

  When the solder 128a scoops up, as shown in FIG. 11A, the external electrode terminal 125 is inserted deeper (on the conductive plate 122 side) than the solder 128a attached to the inner wall 110c of the main body cylinder portion 101. Can not do it. Further, when the external electrode terminal 125 is press-fitted, a load is applied to the external electrode terminal 125 at a location where the solder 128a of the inner wall 110c of the main body cylinder portion 101 is attached. Accordingly, as shown in FIG. 11B, the external electrode terminal 125 is bent or broken. Alternatively, by inserting the external electrode terminal 125 with the solder 128a attached to the inner wall 110c of the main body cylinder portion 101, the solder 128 that joined the main body cylinder portion 101 and the conductive plate 122 is damaged, There is a possibility that the main body cylinder portion 101 may be removed from the conductive plate 122. Further, the external electrode terminal 125 is easily detached from the cylindrical contact member 110. For this reason, there is a possibility that poor connection between the semiconductor chip 124 and the external electrode terminal 125 may occur.

  In order to eliminate the above-described problems caused by the prior art, the present invention provides a semiconductor device, a metal member, and a semiconductor device capable of eliminating assembly defects in a semiconductor device having a configuration in which an external electrode terminal is inserted and fitted into a cylindrical contact member. An object is to provide a method for manufacturing a semiconductor device.

  In order to solve the above-described problems and achieve the object of the present invention, a metal member according to the present invention has open ends at both ends, and one of the open ends can be joined to a semiconductor chip or a conductive plate with solder. A hollow cylindrical tube portion into which an external electrode terminal can be inserted and fitted from the other of the open ends; and an inner wall on the one open end side of the tube portion; And a first protrusion having a rectangular cross-sectional shape projecting inward in the orthogonal direction.

  In order to solve the above-described problems and achieve the object of the present invention, a metal member according to the present invention has open ends at both ends, and one of the open ends is joined to a semiconductor chip or a conductive plate by solder. A hollow cylindrical tube portion into which an external electrode terminal can be inserted and fitted from the other of the open ends, and an inner wall on the one open end side of the tube portion, the center of the tube portion And a first protrusion having a triangular or trapezoidal cross-sectional shape projecting inwardly in a direction perpendicular to the axis and having a thickness that decreases toward the vicinity of the central axis.

  In order to solve the above-described problems and achieve the object of the present invention, a metal member according to the present invention has open ends at both ends, and one of the open ends is joined to a semiconductor chip or a conductive plate by solder. A hollow cylindrical tube portion into which an external electrode terminal can be inserted and fitted from the other of the open ends, and an inner wall on the one open end side of the tube portion, the center of the tube portion A first protrusion projecting inward in a direction orthogonal to the axis, and fitting the first protrusion so as to be fixed to the inner wall on the one open end side of the cylindrical portion. It is characterized by becoming.

  In order to solve the above-described problems and achieve the object of the present invention, a metal member according to the present invention has open ends at both ends, and one of the open ends is joined to a semiconductor chip or a conductive plate by solder. A hollow cylindrical tube portion into which an external electrode terminal can be inserted and fitted from the other of the open ends, and an inner wall on the one open end side of the tube portion, the center of the tube portion A first protrusion projecting inward in a direction orthogonal to the axis. The first projecting portion is formed by plastically deforming a part of the side wall of the cylindrical portion inward along with the inner wall and the outer wall on the one open end side of the cylindrical portion. The inner wall and the outer wall on the one open end side of the cylindrical portion are flat and straight from the open end to the first protrusion.

  The metal member according to the present invention is characterized in that, in the above-described invention, the metal member has the first protrusion portion having a semicircular or semi-elliptical cross-sectional shape.

  The metal member according to the present invention is characterized in that, in the above-described invention, the metal member has the first protrusion over the entire circumference of the inner wall on the one open end side of the cylindrical portion.

  The metal member according to the present invention is characterized in that, in the above-described invention, the one open end has a flange projecting outward in a direction orthogonal to the central axis.

  The metal member according to the present invention is characterized in that, in the above-described invention, the thickness of the first protrusion is not less than 0.1 mm and not more than 1.6 mm.

  In the invention described above, the metal member according to the present invention has an inner diameter d that satisfies a ratio of 0.2 ≦ 2 × w / d ≦ 0.8 with respect to the width w of the first protrusion. And

  Further, in the metal member according to the present invention, in the above-described invention, the height at which the first protrusion is disposed is a height from the joint surface by the solder to the surface on the joint surface side of the first protrusion. Is 1 mm or more.

  In the above-described invention, the metal member according to the present invention has a second projecting portion projecting inward in a direction orthogonal to the central axis on the inner wall of the other open end side of the cylindrical portion. Features.

  In order to solve the above-described problems and achieve the object of the present invention, a metal member according to the present invention has open ends at both ends, and one of the open ends is joined to a semiconductor chip or a conductive plate by solder. A hollow cylindrical tube portion into which an external electrode terminal can be inserted and fitted from the other of the open ends, and an inner wall on the one open end side of the tube portion, the center of the tube portion A first protrusion projecting inward in a direction orthogonal to the axis; a second protrusion projecting inward in the direction orthogonal to the central axis on the inner wall on the other open end side of the cylindrical portion; Have The second projecting portion is fitted together so as to be fixed to the inner wall on the other open end side of the cylindrical portion.

  Further, in the metal member according to the present invention, in the above-described invention, the height at which the second protrusion is disposed is from the other open end to the surface of the second open end of the second protrusion. The height is 1 mm or more.

  The metal member according to the present invention is characterized in that, in the above-described invention, the first projecting portion is fitted so as to be fixed to the inner wall on the one open end side of the cylindrical portion. .

  The metal member according to the present invention is characterized in that, in the above-described invention, the second projecting portion is fitted so as to be fixed to the inner wall of the other open end side of the cylindrical portion. .

  In the metal member according to the present invention, in the above-described invention, the second projecting portion may be configured such that a part of the side wall of the cylindrical portion is located inside both the inner wall and the outer wall on the other open end side of the cylindrical portion. Deformed. The inner wall and the outer wall on the other open end side of the cylindrical portion are flat and straight from the open end to the second protrusion.

  The metal member according to the present invention is characterized in that, in the above-described invention, the second protrusion has a semicircular or semi-elliptical cross section.

  In order to solve the above-described problems and achieve the object of the present invention, the semiconductor device according to the present invention is such that the one open end of the metal member is joined to the semiconductor chip or the conductive plate by solder. It is characterized by that.

  In order to solve the above-described problems and achieve the object of the present invention, a semiconductor device manufacturing method according to the present invention includes a semiconductor device in which the semiconductor chip and the conductive plate are mounted on an insulating substrate. A manufacturing method having the following characteristics. First, a first step of joining the one open end of the metal member described above on the semiconductor chip or the conductive plate with solder is performed. Next, a second step of press-fitting the external electrode terminal from the other open end of the metal member and fitting the external electrode terminal to the metal member is performed.

  Also, the method of manufacturing a semiconductor device according to the present invention is characterized in that, in the above-described invention, the external electrode terminal having a sharp end is press-fitted.

  According to the above-described invention, when the metal member is soldered, the solder that scoops up or scatters the inner wall of the metal member is above the protrusion (the other end side not joined to the conductive plate on the insulating substrate). Can be prevented from climbing up. Thereby, the solder which scooped up or scattered the inner wall of the metal member can be blocked at the lower end side (one end side joined to the conductive plate on the insulating substrate) of the metal member. For this reason, when the external electrode terminal is inserted into the metal member, no load is applied to the external electrode terminal by the solder, or the load applied to the external electrode terminal is negligibly small. Accordingly, it is possible to prevent the external electrode terminal from being inserted to a predetermined depth or the external electrode terminal from being bent or broken due to the solder that has creeped up or scattered on the inner wall of the metal member. .

  According to the semiconductor device, the metal member, and the manufacturing method of the semiconductor device according to the present invention, it is possible to eliminate the assembly failure in the semiconductor device configured to insert and fit the external electrode terminal into the cylindrical contact member. Play.

1 is an explanatory diagram illustrating a configuration of a semiconductor device according to a first embodiment; 2 is an explanatory diagram illustrating in detail a configuration of a main part of the semiconductor device according to the first embodiment; FIG. FIG. 6 is a cross-sectional view illustrating a configuration of a semiconductor device according to a second embodiment. FIG. 7 is a cross-sectional view illustrating a configuration of a semiconductor device according to a third embodiment. FIG. 6 is a cross-sectional view showing a configuration of a semiconductor device according to a fourth embodiment. 6 is a chart showing results of verifying the width of a protrusion of a semiconductor device according to Example 1; 10 is a chart showing results of verifying the thickness of the protrusions of the semiconductor device according to Example 2; It is a graph which shows the result verified about the lower limit of the height which arrange | positions the projection part of the semiconductor device concerning Example 3. FIG. 12 is a chart showing results of verifying an upper limit value of a height at which a protrusion of a semiconductor device according to Example 3 is arranged. It is sectional drawing which shows typically the state in the middle of the assembly of the conventional semiconductor module. It is sectional drawing which shows typically the state in the middle of the assembly of the conventional semiconductor module. It is sectional drawing which shows the structure of the principal part of the conventional semiconductor module. It is a top view which shows the structure of the principal part of the conventional semiconductor module.

  Exemplary embodiments of a semiconductor device, a metal member, and a method for manufacturing a semiconductor device according to the present invention will be explained below in detail with reference to the accompanying drawings. Note that, in the following description of the embodiments and the accompanying drawings, the same reference numerals are given to the same components, and duplicate descriptions are omitted.

(Embodiment 1)
A configuration of the semiconductor device according to the first embodiment will be described. FIG. 1 is an explanatory diagram of a configuration of the semiconductor device according to the first embodiment. FIG. 2 is an explanatory diagram illustrating in detail a configuration of a main part of the semiconductor device according to the first embodiment. FIG. 1B shows a state in which the depth direction of the laminated substrate 20 is viewed from the cross section taken along the section line XX ′ in FIG. In FIG. 1, a case covering the front surface side of the multilayer substrate 20 is not shown. In FIG. 1A, the wire 26 of FIG. 1B is not shown. FIG. 2A is a cross-sectional view showing a cross-sectional structure of the cylindrical contact member 10 joined to the conductive plate 22. FIG. 2B is a plan view showing a planar structure when the cylindrical contact member 10 of FIG. 2A is viewed from the open end 10b side. FIG. 2C is a cross-sectional view showing a state in which the external electrode terminal 25 is fitted to the main body cylinder portion 1 of the cylindrical contact member 10. FIG. 2D is a plan view showing the planar shapes of the hollow portion 4 of the cylindrical contact member 10 and the external electrode terminal 25 when the laminated substrate 20 side is viewed from the cut surface X2 of FIG. .

The semiconductor device according to the first embodiment shown in FIG. 1 solders a semiconductor chip 24 and other components to a conductive plate 22 on the front surface of the multilayer substrate 20 in a predetermined planar layout based on design conditions ( It is a semiconductor module having a structure joined by (not shown). Specifically, in the semiconductor device according to the first embodiment, one open end 10a of the cylindrical contact member 10 is joined to the semiconductor chip 24 or the conductive plate 22 on the multilayer substrate 20 by the solder 27, and the other This is a semiconductor device in which an external electrode terminal 25 is inserted and fitted from the open end 10b. In the multilayer substrate 20, for example, a conductive plate 22 is formed from a copper (Cu) foil on the front surface of the insulating substrate 21, and a copper foil 23 is formed on the back surface of the insulating substrate 21. The insulating substrate 21 is made of ceramic such as alumina or aluminum nitride. The copper foil 23 on the back surface of the multilayer substrate 20 is soldered to, for example, a heat sink (not shown). A semiconductor chip 24 and a cylindrical contact member (metal member) 10 are disposed on the conductive plate 22 on the front surface of the multilayer substrate 20.
A back electrode (not shown) of the semiconductor chip 24 is joined to the conductive plate 22 by solder (not shown). The semiconductor chip 24 is provided with a front electrode (not shown), and the front surface electrode is electrically connected to the conductive plate 22 via a wire 26. The front electrode of the semiconductor chip 24 may be joined to one open end of the cylindrical contact member 10 via the solder 27.

  As shown in FIG. 2, the cylindrical contact member 10 includes a hollow cylindrical main body cylinder portion 1, flanges (ring edges) 2 and 3 provided at both open ends 10 a and 10 b of the main body cylinder portion 1, and And a protrusion 5 provided inside the main body cylinder portion 1 (cavity portion 4). The material of the cylindrical contact member 10 is preferably a material having excellent conductivity, satisfying a predetermined strength, and having excellent bonding properties with the solder 27. Particularly preferably, the cylindrical contact member 10 is made of, for example, copper or a copper alloy. Moreover, you may give copper plating and nickel (Ni) plating to the surface (inner wall 10c and outer wall) of the main body cylinder part 1 of the cylindrical contact member 10. FIG. The cylindrical contact member 10 is soldered onto the conductive plate 22 and is electrically connected to the front surface electrode of the semiconductor chip 24 via the conductive plate 22 and the wire 26. The cylindrical contact member 10 may be soldered directly to the front surface electrode of the semiconductor chip 24. External electrode terminals 25 are fitted into the main body cylinder portion 1 of the cylindrical contact member 10 and are electrically connected to the front surface electrode of the semiconductor chip 24 via the cylindrical contact member 10.

  Specifically, the main body cylinder portion 1 has a hollow cylinder shape having a predetermined length capable of stably fixing the external electrode terminal 25. The inner diameter (diameter of the cavity 4) d1 of the main body cylinder portion 1 is slightly larger than the diameter d2 of the external electrode terminal 25 to such an extent that the external electrode terminal 25 can be fitted. The flanges 2 and 3 are ring-shaped (gutter-shaped) projecting outward from the open ends 10a and 10b of the main body cylinder portion 1 to the outside in a direction orthogonal to the central axis of the main body cylinder portion 1 (lateral direction in FIG. 2). ), And is provided, for example, over the entire circumference of the outer wall of the main body cylinder portion 1. The flange 2 at one open end 10 a of the main body cylinder portion 1 is joined to the conductive plate 22 on the front surface of the multilayer substrate 20 by solder 27. The flange 2 may be provided only on the open end 10a of the main body cylinder portion 1 on the side to be soldered to the conductive plate 22. Thereby, as will be described later, the position of the protruding portion 5 arranged on the one open end 10a side of the main body cylindrical portion 1 can be confirmed by the presence or absence of the flange 2, and when the cylindrical contact member 10 is joined by soldering The directionality can be easily selected. On the other hand, by providing the flanges 2 and 3 at both open ends 10a and 10b of the main body cylindrical portion 1, respectively, the projecting portion 5 can be attached without selecting the directionality when the cylindrical contact member 10 is formed. The work efficiency when forming the cylindrical contact member 10 is improved. A method for forming the cylindrical contact member 10 will be described later.

  One open end 10a (lower end of the cylindrical contact member 10) of the cylindrical contact member 10 (main body cylindrical portion 1) is closed by soldering onto the conductive plate 22. That is, the end surface of the one open end 10 a of the cylindrical contact member 10 becomes a joint surface with the solder 27. One open end 10a of the cylindrical contact member 10 may not be completely closed by the solder 27, but the flange 2 and the conductive plate 22 are preferably soldered. The other open end 10 b (upper end of the cylindrical contact member 10) of the cylindrical contact member 10 (main body cylindrical portion 1) is opened and serves as an insertion port for the external electrode terminal 25. The protrusion 5 is disposed on the one open end 10 a side of the cylindrical contact member 10. Further, as shown in FIG. 2B, the protrusion 5 has a ring shape projecting from the inner wall 10c of the main body cylinder 1 to the inside in a direction orthogonal to the central axis of the main body cylinder 1 with a predetermined width w1, for example. The main body cylinder portion 1 is provided over the entire circumference of the inner wall 10c. The hollow portion 4 of the cylindrical contact member 10 is formed in the first region A on the other open end 10b side of the cylindrical contact member 10 from the protruding portion 5 and from the protruding portion 5 to the cylindrical shape. The contact member 10 is separated from the second region B on one open end 10a side. The protrusion 5 may be formed of a member different from the main body cylinder 1 or may be formed by deforming the main body cylinder 1. An example of the protrusion 5 formed by deforming the main body cylinder 1 will be described in a third embodiment to be described later.

  When the cylindrical contact member 10 is soldered, the protruding portion 5 crawls up to the inner wall 10c of the main body cylindrical portion 1 due to a capillary phenomenon, or the scattered solder 27a crawls up to the first region A on the upper end side of the cylindrical contact member 10. , Has a function to prevent scattering. The solder 27a creeps up and is prevented from scattering even if the solder 27a does not creep up or scatter from the lower end side of the cylindrical contact member 10 to the first region A, or even if the solder 27a crawls up or scatters to the first region A. It means that it does not cause assembly failure when the electrode terminal 25 is inserted. The assembly failure that occurs when the external electrode terminal 25 is inserted means that the external electrode terminal 25 cannot be inserted to a predetermined depth, or the external electrode terminal 25 is bent or broken during insertion. Further, the protruding portion 5 has a function of substantially blocking the solder 27 a that has been scooped up or scattered on the inner wall 10 c of the main body cylindrical portion 1 in the second region B on the lower end side of the cylindrical contact member 10. That is, the protruding portion 5 prevents the solder 27 that joins the cylindrical contact member 10 and the conductive plate 22 from being damaged and the main body cylindrical portion 1 from being removed from the conductive plate 22. Therefore, it is preferable that the protrusion 5 is provided over the entire circumference of the inner wall 10c of the main body cylinder portion 1. However, if the solder 27a can be prevented from scooping up and scattering, the protrusion 5 may not be provided over the entire circumference. It doesn't matter.

  The width w1 of the protrusion 5 is preferably narrower than ½ times the inner diameter d1 of the main body cylinder 1. Specifically, the width w1 of the protrusion 5 preferably satisfies 0.2 ≦ 2 × w1 / d1 ≦ 0.8 with respect to the inner diameter d1 of the main body cylinder portion 1. That is, the protrusion 5 only needs to be able to separate the inner wall 10c of the main body cylinder 1 and has the same outer diameter as the inner diameter d1 of the main body cylinder 1 and, for example, near the central axis of the main body cylinder 1 The ring-shaped planar shape which has the predetermined internal diameter w2 by the substantially circular hole 5a located is made. Therefore, the first region A and the second region B are not completely closed by the protrusion 5, and the first region A and the second region B are continuous regions.

  If the space between the first region A and the second region B is completely closed by the projection 5 having a circular planar shape (w2 = 0), the solder flux generated when soldering the cylindrical contact member 10 The molten gas (gas) such as can not escape to the outside of the cylindrical contact member 10. This molten gas causes voids (bubbles) inside the solder 27 and causes a solder failure. For this reason, the first region A and the second region B are connected in a direction parallel to the central axis of the main body cylinder portion 1, and the width in which the molten gas can flow outward from the other open end 10 b of the cylindrical contact member 10. It is preferable to provide the protrusion 5 in a ring-shaped planar shape with a hole 5a (hereinafter referred to as a hole).

  The hole 5a of the protrusion 5 has, for example, a circular planar shape. The inner diameter of the protrusion 5 (the width (diameter) of the hole 5a) w2 allows the molten gas generated during soldering of the cylindrical contact member 10 to sufficiently escape from the other open end 10b of the cylindrical contact member 10 to the outside. It is preferable that the dimension be able to be adjusted. The position, size, and planar shape of the hole 5a of the protrusion 5 can be a region in which the first region A and the second region B are connected in a direction parallel to the central axis of the main body tube portion 1, and the tube As long as it has a predetermined area that allows the molten gas generated during soldering of the cylindrical contact member 10 to sufficiently escape to the outside of the cylindrical contact member 10, various modifications can be made.

  Further, the protruding portion 5 has a substantially rectangular cross-sectional shape having a uniform thickness t1 in a direction orthogonal to the central axis of the main body cylindrical portion 1. By making the cross-sectional shape of the protrusion 5 substantially rectangular, it is possible to have a predetermined strength. Moreover, when the cross-sectional shape of the projection part 5 is made into a substantially rectangular shape, since the shape of the projection part 5 is simple, the cylindrical contact member 10 can be produced cheaply. The thickness t1 of the protruding portion 5 is set to a thickness at which the protruding portion 5 can be easily deformed by a load when the external electrode terminal 25 is press-fitted (inserted) into the main body cylindrical portion 1 of the cylindrical contact member 10. It is preferable. That is, the thickness t1 of the protruding portion 5 is set to a thickness that allows the hole 5a of the protruding portion 5 to be expanded and deformed by a load when the external electrode terminal 25 is inserted. Specifically, the thickness t1 of the protrusion 5 can be variously adjusted depending on the constituent material, the inner diameter w2, and the forming method of the protrusion 5, and may be, for example, about 0.1 mm to 1.6 mm (0 .1 mm ≦ t1 ≦ 1.6 mm). As shown in FIG. 2D, the planar shape (the shape of the bottom surface of the external electrode terminal 25) on the cut surface XY of the external electrode terminal 25 may be, for example, a substantially square shape. Accordingly, the external electrode terminal 25 can be firmly fitted to the main body cylinder portion 1 of the cylindrical contact member 10. The lower end portion (end portion on the laminated substrate 20 side) 25a of the external electrode terminal 25 is preferably chamfered or pointed. The reason is that, when the external electrode terminal 25 is press-fitted (inserted) into the main body cylindrical portion 1 of the cylindrical contact member 10, the protruding portion 5 is easily deformed by the lower end portion 25 a of the external electrode terminal 25. is there.

  The height h1 at which the protrusion 5 is disposed is such that the height from the lower surface of the flange 2 (the surface on the laminated substrate 20 side) of one open end 10a of the cylindrical contact member 10 to the lower surface of the protrusion 5 is, for example, about 1 mm or more. The height is preferably (h1 ≧ 1 mm). The reason is as follows. The height h2 of the lower end portion 25a of the external electrode terminal 25 when fitted to the cylindrical contact member 10 is, for example, 0.5 mm or more from the lower surface of the flange 2 of one open end 10a of the cylindrical contact member 10. It is about 0 mm or less. For this reason, even if the solder 27a crawls up or scatters on the inner wall 10c of the main body cylinder part 1 by setting the height h1 at which the protrusion part 5 is arranged to be about 1 mm or more, it reaches the lower end part 25a of the external electrode terminal 25. This is because the creeping and scattering of the solder 27a can be stopped in the gap. That is, the height h1 at which the protruding portion 5 is arranged has an inner wall 10c of the main body cylinder portion 1 so that a gap is formed between the lower end portion 25a of the external electrode terminal 25 inserted to a predetermined depth of the main body cylinder portion 1. The height is set so that the solder 27a creeping up or scattered can be blocked. When the flanges 2 and 3 are not disposed, the height h1 at which the protrusion 5 is disposed is a height from the end surface of one open end 10a of the cylindrical contact member 10 to the lower surface of the protrusion 5. is there.

  In addition, the height h1 at which the protruding portion 5 is disposed preferably satisfies h1 ≦ 2 × h2 with respect to the height h2 of the lower end portion 25a of the external electrode terminal 25. Specifically, the height h1 at which the protrusion 5 is disposed is preferably about 4 mm or less (h1 ≦ 4 mm), for example. When the height h1 at which the protrusion 5 is disposed is larger than 4 mm, the ratio of the second region B (the region in which the solder 27a crawls up or scatters) in the cavity 4 increases, and the external electrode terminal 25 has a second height. The ratio of the part exposed to 2 area | region B also becomes large. For this reason, even if the creeping and scattering of the solder 27a are blocked in the second region B, the adverse effect of the solder 27a creeping and scattering in the second region B is prevented from reaching the external electrode terminal 25. Because you can't. Therefore, it is preferable that the height h1 at which the protrusions 5 are disposed satisfies 1 ≦ h1 ≦ 2 × h2.

  In this manner, the protrusion 5 has a width w1 that can block the scooping up and scattering of the solder 27a in the second region B when the cylindrical contact member 10 is soldered, and the external electrode terminal 25 It has a thickness t1 that does not hinder the insertion. Further, the protruding portion 5 is arranged at a height h 1 at which the adverse effect of the solder 27 a that crawls up or scatters in the second region B from the lower end of the cylindrical contact member 10 does not reach the external electrode terminal 25. The constituent material of the protruding portion 5 is preferably the same metal material as that of the main body cylindrical portion 1 of the cylindrical contact member 10. The reason is that both conductivity and strength are excellent. In addition, when the cylindrical contact member 10 and the protrusion 5 are made of different materials, there is a risk that electrical resistance increases or cracking due to stress occurs at the joint between the cylindrical contact member 10 and the protrusion 5. It is. However, the constituent material of the protrusion 5 may be a material different from that of the main body cylinder 1 depending on the method of forming the protrusion 5, or may be a material having poor solder wettability such as carbon or ceramics. When the cylindrical contact member 10 and the protrusion 5 are made of different materials, it is desirable that the constituent material of the protrusion 5 is a material that does not react with the sealing material and can withstand heating during solder bonding.

  In order to manufacture (manufacture) the semiconductor device according to the first embodiment, first, one open end of the cylindrical contact member 10 is formed on the semiconductor chip 24 or the conductive plate 22 mounted on the insulating substrate 21. 10a is joined by solder 27 (first step). Then, the external electrode terminal 25 may be press-fitted from the other open end 10b of the cylindrical contact member 10, and the external electrode terminal 25 may be fitted to the cylindrical contact member 10 (second step). Specifically, in the first step, a paste-like or plate-like solder 27 is formed on the semiconductor chip 24 or the conductive plate 22, and one open end 10 a of the cylindrical contact member 10 is placed on the insulating substrate on the solder 27. It is made by installing on the 21st side and heating in a reflow furnace. In this manner, one open end 10 a of the cylindrical contact member 10 is joined to the front electrode or conductive plate 22 of the semiconductor chip 24 by the solder 27. In the second step, the external electrode terminal 25 is press-fitted and fitted into the other open end 10 b of the cylindrical contact member 10. As a result, the external electrode terminal 25 is fitted into the cylindrical contact member 10 by deforming the protruding portion 5 formed on the inner wall 10 c of the one open end 10 a of the cylindrical contact member 10.

  Next, a method for forming the cylindrical contact member 10 will be described. First, the cylindrical contact member 10 having the main body cylindrical portion 1 and the flanges 2 and 3 and the protruding portion 5 having a ring-shaped planar shape are respectively formed (formed). Next, for example, the positioning jig is inserted into the inside of the main body cylindrical portion 1 from the one open end 10a side of the cylindrical contact member 10 so that the surface of the positioning jig is positioned at the height h1 where the protrusion 5 is disposed. To do. Next, the protruding portion 5 is inserted into the main body cylindrical portion 1 from the other open end 10b side of the cylindrical contact member 10, and the protruding portion 5 is fitted to the main body cylindrical portion 1 in accordance with the height position of the positioning jig. Include. At this time, it is desirable that the diameter of the protruding portion 5 is about 100 μm larger than the inner diameter of the main body cylindrical portion 1. Accordingly, it is possible to prevent the protrusion 5 from being detached from the main body cylinder 1 after the protrusion 5 is fitted into the main body cylinder 1. Alternatively, the protrusion 5 may be disposed on the positioning jig, and the main body cylinder 1 may be fitted into the positioning jig from above. In this way, the cylindrical contact member 10 having the main body cylindrical portion 1, the flanges 2, 3 and the protruding portion 5 is completed. As a material for the positioning jig, an alloy such as stainless steel or a cemented carbide such as tungsten carbide is preferable from the viewpoint of strength. According to this method, the cylindrical contact member 10 having the protrusions 5 can be formed regardless of the constituent material of the protrusions 5.

  As described above, according to the first embodiment, the protrusion having a ring-like planar shape is provided over the entire circumference of the inner wall of the main body cylindrical portion so as to be arranged on the lower end side of the cylindrical contact member. Thus, when soldering the cylindrical contact member, it is possible to prevent the solder that scoops up or scatters from the inner wall of the main body cylindrical portion from scooping up to the first region above the protruding portion. Thereby, the solder which scooped up and scattered the inner wall of the main body cylinder part can be blocked by the lower end side of the cylindrical contact member. For this reason, when the external electrode terminal is inserted into the cylindrical contact member, no load is applied to the external electrode terminal by solder, or the load applied to the external electrode terminal is negligibly small. For this reason, it is possible to eliminate assembly defects such as the external electrode terminal being unable to be inserted to a predetermined depth or the external electrode terminal being bent or broken due to solder that has creeped up or scattered on the inner wall of the main body cylinder. be able to. Therefore, the yield rate can be improved.

  Further, according to the first embodiment, the external electrode terminal is formed on the cylindrical contact member by forming the protrusion with a dimension that allows the external electrode terminal to deform the protrusion by a load due to the press-fitting of the external electrode terminal. The service terminal can be inserted to a predetermined depth. For this reason, it is difficult to remove the external electrode terminal from the cylindrical contact member. In addition, according to the first embodiment, it is possible to eliminate an assembly failure at the time of insertion of the external electrode terminal, and therefore there is a process or facility for detecting the occurrence of a defect related to the fitting between the external electrode terminal and the cylindrical contact member. It becomes unnecessary. In addition, according to the first embodiment, by providing a protrusion on the cylindrical contact member, the solder material specification change, the surface treatment of the multilayer substrate, etc., which are performed in order to suppress the creeping up and scattering of the solder, etc. Compared with other measures, it is possible to easily obtain the effect of preventing the solder from creeping up and scattering.

(Embodiment 2)
Next, the configuration of the semiconductor device according to the second embodiment will be described. FIG. 3 is a cross-sectional view illustrating the configuration of the semiconductor device according to the second embodiment. In the semiconductor device according to the second embodiment, the cross-sectional shape of the protrusions 31 and 32 for preventing the solder 27a from creeping up and scattering, provided on the inner wall 10c of the main body cylinder portion 1 of the cylindrical contact member 10, is shown in the embodiment. 1 is different from the semiconductor device according to 1.

Specifically, as shown in FIG. 3, a substantially triangular cross section in which the thickness t <b> 1 is reduced toward the vicinity of the central axis of the main body cylindrical portion 1 inside the main body cylindrical portion 1 of the cylindrical contact member 10. The protrusion 31 having a shape (FIG. 3A) and the protrusion 32 having a substantially trapezoidal cross-sectional shape (FIG. 3B)
) Is provided. The width w1 and the inner diameter w2 of the protrusions 31 and 32 and the height h1 at which the protrusions 31 and 32 are arranged are the same as in the first embodiment (see FIG. 2). The method of forming the cylindrical contact member 10 provided with the protrusions 31 and 32 having a substantially triangular shape or a substantially trapezoidal cross-sectional shape is the same as that of the first embodiment. By making the cross-sectional shape of the protrusions 31 and 32 substantially triangular or trapezoidal, when the external electrode terminal 25 is press-fitted into the cylindrical contact member 10, the force that deforms the protrusions 31 and 32 is reduced. Can do. Therefore, the external electrode terminal 25 can be press-fitted to a predetermined depth of the cylindrical contact member 10 with a light force.

  As described above, according to the second embodiment, the same effect as in the first embodiment can be obtained.

(Embodiment 3)
Next, the configuration of the semiconductor device according to the third embodiment will be described. FIG. 4 is a cross-sectional view illustrating the configuration of the semiconductor device according to the third embodiment. The difference between the semiconductor device according to the third embodiment and the semiconductor device according to the first embodiment is that the side wall of the main body cylinder portion 1 is plastically deformed inward to thereby prevent the solder 27a from creeping up and from being scattered. Is the point that forms. Specifically, as shown in FIG. 4, a substantially semicircular shape or a substantially round shape formed by plastically deforming a part of the main body cylinder portion 1 over the entire circumference of the side wall of the main body cylinder portion 1 of the cylindrical contact member 30. A protrusion 33 having a semi-elliptical cross-sectional shape is provided.

  The height h1 at which the protrusion 33 is disposed, and the width w1 and the inner diameter w2 of the protrusion 33 are the same as those in the first embodiment (see FIG. 2). The height h1 that forms the protruding portion 33 is the height from the lower surface of the flange 2 of one open end 10a of the cylindrical contact member 30 to the lower end portion (end portion on the laminated substrate 20 side) 33a of the protruding portion 33. is there. The end portions 33a and 33b of the protruding portion 33 are locations where the side wall of the main body cylindrical portion 1 begins to bend. The width w1 of the protruding portion 33 is a distance from the inner wall 10c of the main body cylinder portion 1 to the most protruding vertex portion 33c of the protruding portion 33. The inner diameter w <b> 2 of the protrusion 33 is a distance between the most protruding vertex portions 33 c of the protrusion 33.

  The width w1 and the thickness t3 of the protrusion 33 correspond to the diameter of the protrusion 33 when the cross-sectional shape of the protrusion 33 is substantially semicircular, and are respectively the protrusion when the protrusion 33 has a substantially semi-elliptical shape. It corresponds to the length of 1/2 of the major axis of 33 and the length of the minor axis. The projecting portion 33 is a portion where the metal thickness is reduced by plastically deforming a part of the side wall of the main body cylindrical portion 1 and bending it into a substantially semicircular shape or a substantially semielliptical shape. The width w1 and the thickness t3 of the protrusion 33 are such that the portion where the metal thickness is reduced by plastic deformation of a part of the side wall of the main body tube portion 1 is caused by the load when the external electrode terminal 25 is press-fitted. The dimension is set so that the metal thickness can be reduced to such an extent that it can be crushed to the inner wall 10c side.

  The cylindrical contact member 30 provided with the protrusion 33 having a substantially semicircular or substantially semi-elliptical cross-sectional shape may be formed as follows, for example. First, the cylindrical contact member 30 having the main body cylinder portion 1 and the flanges 2 and 3 is formed by, for example, integral molding. Next, the main body cylinder part 1 of the cylindrical contact member 30 is mounted on a lathe. Next, by rotating the cylindrical contact member 30 around the central axis while pressing a predetermined-shaped bite against the outer wall of the main body cylinder portion 1, a part of the main body cylinder portion 1 is moved over the entire circumference of the side wall of the main body cylinder portion 1. It is plastically deformed inside. Thereby, the cylindrical contact member 30 provided with the protrusion 33 having a substantially semicircular or substantially semi-elliptical cross-sectional shape is completed.

  As described above, according to the third embodiment, the same effect as in the first and second embodiments can be obtained.

(Embodiment 4)
Next, the configuration of the semiconductor device according to the fourth embodiment will be described. FIG. 5 is a cross-sectional view illustrating the configuration of the semiconductor device according to the fourth embodiment. The difference between the semiconductor device according to the fourth embodiment and the semiconductor device according to the first embodiment is that the solder contact 27a is also squeezed and spattered on the other open end 10b side of the cylindrical contact member 40. A portion (hereinafter, referred to as a second protrusion) 41 is provided. That is, the inner wall 10c of the main body cylindrical portion 1 of the cylindrical contact member 40 is provided with the first protrusion 5 on one open end 10a side of the cylindrical contact member 40 and the second on the other open end 10b side. A protrusion 41 is provided.

  In the fourth embodiment, it is preferable to provide a symmetrical structure by providing flanges 2 and 3 at any open end 10a and 10b of the cylindrical contact member 40, respectively. The reason is as follows. The inner wall 10c of the main body cylinder portion 1 is also provided with first and second protrusions 5 and 41 on the open ends 10a and 10b side, respectively, and has a symmetrical structure. For this reason, even if the flanges 2 and 3 of any of the open ends 10a and 10b of the cylindrical contact member 40 are used as the joint surfaces with the conductive plate 22, the solder 27a that has creeped up or scattered on the inner wall 10c of the main body cylindrical portion 1 is formed. It is possible to prevent the scooping up and scattering to the upper end side of the tubular contact member 40 beyond the projecting portion (the first projecting portion 5 or the second projecting portion 41) disposed on the lower end side of the cylindrical contact member 40. Because. That is, the cylindrical contact member 40 has a structure that can be soldered without selecting the directionality. In addition, since the flanges 2 and 3 on the open ends 10a and 10b side of the cylindrical contact member 40 may be used as a joint surface with the conductive plate 22, it is possible to reduce an assembly failure due to an assembly error or the like. Work efficiency is improved.

  The configuration of the first protrusion 5 is the same as that of the first embodiment. The configuration of the second protrusion 41 is the same as that of the first protrusion 5, for example. For example, the first and second protrusions 5 and 41 pass through a depth that is ½ of the total length in the central axis direction of the main body cylinder portion 1 and are approximately the cutting plane that is orthogonal to the central axis of the main body cylinder portion 1. They are arranged in plane symmetry. Moreover, the 2nd protrusion part 41 should just satisfy | fill the conditions of the width | variety w1 mentioned above, the internal diameter w2, and the height h1 to arrange | position, and the structure different from the 1st protrusion part 5 may be sufficient as it. The height h1 at which the second projecting portion 41 is disposed refers to the lower surface of the flange 3 of the other open end 10b of the cylindrical contact member 40 to the upper surface of the second projecting portion 41 (the other open end 10b of the cylindrical contact member 40). It is the height to the side surface). The cylindrical contact member 40 may be formed by disposing the first and second protrusions 5 and 41 apart from the positioning jig and fitting the main body cylinder 1 into the positioning jig from above.

  As described above, according to the fourth embodiment, the same effects as in the first to third embodiments can be obtained.

Example 1
Next, the width w1 of the protrusion 5 for preventing the solder 27a from creeping and scattering was verified. FIG. 6 is a table showing the results of verifying the width of the protrusions of the semiconductor device according to the first example. According to the configuration of the semiconductor device according to the first embodiment, a plurality of soldered cylindrical contact members 10 having different ratios (= 2 × w1 / d1) between the width w1 of the protrusion 5 and the inner diameter d1 of the main body cylinder 1 A sample of was prepared. The height h1 at which the protrusion 5 is disposed is 1 mm, and the thickness t1 of the protrusion 5 is 0.1 mm. A hollow cylindrical member having an inner diameter d1 of 1 mm was used for the main body cylindrical portion 1. FIG. 6 shows the result of determining whether or not the solder 27a creeped up or scattered in each of these samples. In FIG. 6, the case where it was possible to prevent the solder 27a from creeping up and scattering into the first region A was marked as ◯, and the case where the solder 27a creeped up and scattered up to the first region A was marked as x.

  From the result shown in FIG. 6, when the ratio between the width w1 of the protrusion 5 and the inner diameter d1 of the main body cylinder portion 1 satisfies 0.2 ≦ 2 × w1 / d1 ≦ 0.8, It was confirmed that creeping and scattering of the solder 27a to the region A can be prevented. At this time, it was confirmed that the wet thickness t2 of the solder 27a was 0.3 mm. The wet thickness t2 of the solder 27a is based on the surface tension of the solder 27a that has creeped up or scattered on the inner wall 10c of the main body cylinder portion 1 (interfacial tension between the solder 27a and the inner wall 10c of the main body cylinder portion 1). This is the maximum thickness of the bulge of the solder 27a that bulges in an arc shape on the inner wall 10c of the portion 1. For this reason, it is preferable that the width | variety w1 of the projection part 5 is 0.3 mm or more. For example, when the inner diameter d1 of the main body cylinder portion 1 is 1 mm, the minimum width w1 of the protrusion 5 in the above range is 0.1 mm (0.2 = 2 × w1 [mm] / 1 [mm]). Therefore, it was confirmed that if the width w1 of the protrusion 5 is 1/3 or more of the thickness t2 where the solder 27a is wet, the solder 27a is prevented from creeping up and scattering (w1 ≧ t2 / 3). Although illustration is omitted, the inventors have confirmed that the same result can be obtained even if the height h1 at which the protrusion 5 is disposed is higher than 1 mm. Further, the inventors have confirmed that the same result can be obtained even when the thickness t1 of the protrusion 5 is greater than 0.1 mm.

(Example 2)
Next, the thickness t1 of the protrusion 5 for preventing the solder 27a from creeping and scattering was verified. FIG. 7 is a table showing results of verifying the thickness of the protrusions of the semiconductor device according to the second example. According to the configuration of the semiconductor device according to the first embodiment, the cylindrical contact member 10 having the protrusion portion 5 having a different thickness t1 is soldered, and the external electrode terminal 25 is press-fitted into the main body cylindrical portion 1 of the cylindrical contact member 10. A plurality of samples were prepared. The pressurizing force for press-fitting the external electrode terminal 25 was 5 kgf. FIG. 7 shows the result of determining whether or not the protrusion 5 could be deformed in each of these samples. In FIG. 7, the case where the protrusion 5 was able to be deformed was marked with ◯, and the case where the protrusion 5 could not be deformed was marked with x. In addition, height h1 which arrange | positions the projection part 5 was 1 mm. The ratio (= 2 × w1 / d1) between the width w1 of the protrusion 5 and the inner diameter d1 of the main body cylinder portion 1 was set to 0.2.

  From the result shown in FIG. 7, when the thickness t1 of the protrusion 5 is within the range of 0.1 mm to 1.6 mm, the protrusion 5 is deformed by the load when the external electrode terminal 25 is press-fitted. It was confirmed that

Example 3
Next, the height h1 at which the protrusions 5 for preventing the solder 27a from creeping and scattering were disposed was verified. FIG. 8 is a table showing the results of verifying the lower limit value of the height at which the protrusions of the semiconductor device according to Example 3 are arranged. FIG. 9 is a table showing the results of verifying the upper limit value of the height at which the protrusions of the semiconductor device according to Example 3 are arranged. According to the configuration of the semiconductor device according to the first embodiment, the cylindrical contact member 10 having a different height h1 for arranging the protrusion 5 is soldered, and the external electrode terminal 25 is attached to the main body cylindrical portion 1 of the cylindrical contact member 10. A plurality of samples were prepared by press-fitting. The ratio (= 2 × w1 / d1) between the width w1 of the protrusion 5 and the inner diameter d1 of the main body cylinder 1 was set to 0.2. The thickness t1 of the protrusion 5 was 0.2 mm. 8 and 9, even if the solder 27a does not crawl up or scatter in the first region A on the upper end side of the cylindrical contact member 10, and the solder 27a crawls up or scatters in the first region A, the external electrode terminal 25 is used. The case where no assembly failure occurred during insertion of the solder was marked as ◯, and the case where the assembly failure occurred due to the solder 27a scooping up or scattering in the first region A was marked as x.

  From the result shown in FIG. 8, when the height h1 at which the protrusion 5 is disposed is 1 mm or more, the solder 27a does not creep up or scatter to the first region A, or the solder 27a is not in the first region A. It was confirmed that even if they were scooped up or scattered, it was good enough not to cause assembly failure when the external electrode terminal 25 was inserted. It was also confirmed that the solder 27a can be prevented from creeping up and scattering within the gap of the height h2 to the lower end 25a of the external electrode terminal 25. From the result shown in FIG. 9, the upper limit value of the height h1 at which the protrusions 5 are arranged is set to h1 ≦ 2 × h2 with respect to the height h2 of the lower end portion 25a of the external electrode terminal 25, whereby the first region The solder 27a does not creep up or scatter to A, or even if the solder 27a crawls or scatters in the first region A, it should be good enough not to cause assembly failure when the external electrode terminal 25 is inserted. confirmed. Specifically, it was confirmed that the height h1 at which the protrusion 5 is disposed is preferably 1 mm or more and 4 mm or less (1 mm ≦ h1 ≦ 4 mm). FIG. 9 shows an example in which the height h2 to the lower end portion 25a of the external electrode terminal 25 is 2 mm, but when the height h2 to the lower end portion 25a of the external electrode terminal 25 is variously changed. In addition, the inventors have confirmed that the same result can be obtained by setting the height h1 at which the protrusion 5 is disposed within the above range.

  Although not shown, the inventors have confirmed that the results of Examples 1 to 3 described above can be obtained for the semiconductor devices according to the second to fourth embodiments as in the first embodiment.

  As described above, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

  As described above, a semiconductor device, a metal member, and a method for manufacturing a semiconductor device according to the present invention include a semiconductor module having a configuration in which a semiconductor chip or other constituent member is joined to a conductive plate on the surface of a multilayer substrate by soldering. It is useful for a semiconductor device in which electrical connection with a conductive plate is ensured by fitting an external electrode terminal to a cylindrical contact member.

DESCRIPTION OF SYMBOLS 1 Body cylinder part 2,3 Flange 4 Cavity part 5,31-33,41 Projection part 5a Hole part of projection part 10,30,40 Cylindrical contact member 10a, 10b Open end of cylindrical contact member 10c of main body cylinder part Inner wall 20 Laminated substrate 21 Ceramic substrate 22 Conductive plate 23 Copper foil 24 Semiconductor chip 25 External electrode terminal 25a Lower end of external electrode terminal 26 Wire 27, 27a Solder 33a, 33b Substantially semicircular or substantially semi-elliptical protrusion End of part 33c Apex part of substantially semicircular or substantially semi-elliptical protrusion A A first area of cavity B second area of cavity d1 inner diameter of main body cylinder part d2 diameter of terminal for external electrode h1 protrusion H2 Height of the lower end of the external electrode terminal t1 Thickness of the projection t2 Thickness of the solder wet t3 Substantially semicircular or semi-elliptical The inner diameter of the width w2 protruding portion in the thickness w1 protrusion raised portion

Claims (20)

A metal member that has open ends at both ends, and can be joined to one of the open ends by solder on a semiconductor chip or a conductive plate,
A hollow cylindrical tube portion into which external electrode terminals can be inserted and fitted from the other open end; and
A first protrusion having a rectangular cross-sectional shape projecting inwardly in a direction orthogonal to the central axis of the cylindrical portion on the inner wall on the one open end side of the cylindrical portion;
Metal member characterized by having. A metal member that has open ends at both ends, and can be joined to one of the open ends by solder on a semiconductor chip or a conductive plate,
A hollow cylindrical tube portion into which external electrode terminals can be inserted and fitted from the other open end; and
A triangular or trapezoidal cross section that protrudes inwardly in the direction perpendicular to the central axis of the cylindrical part on the inner wall on the one open end side of the cylindrical part, and whose thickness decreases toward the vicinity of the central axis. A first protrusion having a shape;
Metal member characterized by having. A metal member that has open ends at both ends, and can be joined to one of the open ends by solder on a semiconductor chip or a conductive plate,
A hollow cylindrical tube portion into which external electrode terminals can be inserted and fitted from the other open end; and
A first projecting portion projecting inward in a direction perpendicular to the central axis of the cylindrical portion on the inner wall on the one open end side of the cylindrical portion;
Have
The metal member, wherein the first projecting portion is fitted together so as to be fixed to the inner wall on the one open end side of the cylindrical portion. A metal member that has open ends at both ends, and can be joined to one of the open ends by solder on a semiconductor chip or a conductive plate,
A hollow cylindrical tube portion into which external electrode terminals can be inserted and fitted from the other open end; and
A first projecting portion projecting inward in a direction perpendicular to the central axis of the cylindrical portion on the inner wall on the one open end side of the cylindrical portion;
Have
The first projecting portion is formed by plastically deforming a part of the side wall of the cylindrical portion inward with the inner wall and the outer wall on the one open end side of the cylindrical portion,
The metal member, wherein an inner wall and an outer wall on the one open end side of the cylindrical portion are flat and straight from the open end to the first protrusion.   The metal member according to claim 4, wherein the first protrusion has a semicircular or semi-elliptical cross-sectional shape.   The metal member according to any one of claims 1 to 5, further comprising the first projecting portion over the entire circumference of the inner wall on the one open end side of the cylindrical portion.   The metal member according to any one of claims 1 to 6, wherein the one open end has a flange projecting outward in a direction orthogonal to the central axis.   The thickness of the said 1st projection part is 0.1 mm or more and 1.6 mm or less, The metal member as described in any one of Claims 1-7 characterized by the above-mentioned.   The ratio of the width of the first protrusions to the width w has an inner diameter d that satisfies 0.2 ≦ 2 × w / d ≦ 0.8. Metal member.   The height from which the 1st projection part is arrange | positioned is the height from the joint surface by the said solder to the surface by the side of the said joint surface of the said 1st projection part is 1 mm or more, It is characterized by the above-mentioned. The metal member according to any one of 9.   The second projecting portion that protrudes inward in a direction orthogonal to the central axis is provided on the inner wall of the other open end side of the cylindrical portion. Metal parts. A metal member that has open ends at both ends, and can be joined to one of the open ends by solder on a semiconductor chip or a conductive plate,
A hollow cylindrical tube portion into which external electrode terminals can be inserted and fitted from the other open end; and
A first projecting portion projecting inward in a direction perpendicular to the central axis of the cylindrical portion on the inner wall on the one open end side of the cylindrical portion;
A second protrusion projecting inward in a direction orthogonal to the central axis on the inner wall of the other open end side of the cylindrical portion;
Have
The metal member, wherein the second projecting portion is fitted together so as to be fixed to the inner wall on the other open end side of the cylindrical portion.   The height at which the second protrusion is arranged is such that the height from the other open end to the surface on the other open end of the second protrusion is 1 mm or more. The metal member according to 11 or 12.   3. The metal member according to claim 1, wherein the first protrusion is fitted so as to be fixed to an inner wall on the one open end side of the cylindrical portion.   The metal member according to claim 11 or 12, wherein the second projecting portion is fitted so as to be fixed to an inner wall on the other open end side of the cylindrical portion. The second projecting portion is formed by plastically deforming a part of the side wall of the cylindrical portion inward along with the inner wall and the outer wall on the other open end side of the cylindrical portion,
13. The metal member according to claim 11, wherein an inner wall and an outer wall on the other open end side of the cylindrical portion are flat and linear from the open end to the second protrusion.   17. The metal member according to claim 16, wherein the second protrusion has a semicircular or semi-elliptical cross-sectional shape.   A semiconductor device, wherein the one open end of the metal member according to claim 1 is joined to the semiconductor chip or the conductive plate by solder. A method of manufacturing a semiconductor device in which the semiconductor chip and the conductive plate are mounted on an insulating substrate,
A first step of joining the one open end of the metal member according to any one of claims 1 to 17 on the semiconductor chip or the conductive plate by solder,
A second step of press-fitting the external electrode terminal from the other open end of the metal member and fitting the external electrode terminal to the metal member;
A method for manufacturing a semiconductor device, comprising:   20. The method of manufacturing a semiconductor device according to claim 19, wherein the external electrode terminal having a sharp end is press-fitted.

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