JP2019168390A - Method for manufacturing circuit board - Google Patents

Abstract

To provide a method for manufacturing an encoder circuit board which can prevent foreign substance from attaching on an optical module as a component of a position detection unit for an encoder, and can increase the yield and the productivity.SOLUTION: The circuit board on which an optical module as a component of a position detection unit for an encoder is mounted is manufactured by the method including: a cover attachment step of attaching a cover over the upper end surface of the optical module; a soldering step of soldering the optical module with the cover attached thereto to the circuit board by a reflow soldering or a separate soldering; and a cover removing step of removing the cover on the optical module.SELECTED DRAWING: Figure 5

Description

  The present application relates to a method of manufacturing a circuit board including an optical module.

  In order to increase the rotation accuracy of a general servo motor or the like, an encoder mounted on the servo motor is provided with optical components (light emitting element and light receiving element) in a position detection unit on a circuit board. The position detection unit is configured such that light emitted from the light emitting element is incident on the light receiving element via a disk on which an optical pattern is formed. When the disk rotates with the rotation of the shaft, the light is transmitted by the optical pattern. The position can be detected by being transmitted and blocked. Therefore, there is a problem that if there is a foreign substance that blocks light on the optical path, the position detection characteristics are affected, and the position detection accuracy deteriorates, and contamination resistance is required.

  In the prior art, the optical component is mounted on the circuit board 6 by reflow soldering or individual soldering in a state where the light emitting surface of the light emitting element or the light receiving surface of the light receiving element which is an optical component is exposed. However, there is no description regarding countermeasures against foreign matter adhering to the light receiving surface or light emitting surface of the optical component in the manufacturing process (see, for example, Patent Document 1).

JP, 2006-38253, A

  However, since the conventional technology is mounted on the circuit board 6 by reflow soldering or individual soldering with the light receiving surface or light emitting surface of the optical component exposed as described above, the light receiving surface or light emitting There was a problem that foreign matters such as dust or dust adhered to the surface, resulting in a defective product. Further, although there is no description about measures against foreign matter adhering to the light receiving surface or light emitting surface of the optical component in the manufacturing process, this measure is considered indispensable. In addition, for this measure, it is predicted that the number of man-hours for manufacturing (hereinafter simply referred to as man-hours for the sake of simplicity) will increase.

  In addition, due to the above problems, work such as foreign matter inspection or removal of foreign matter occurs in the subsequent process, which has an impact on productivity due to an increase in man-hours, which further adversely affects productivity. Has a point.

  Therefore, in order to solve the above-mentioned problems, in order to reduce the adhesion of foreign matter, the foreign matter on the light-receiving surface or light-emitting surface must be removed before a process with a high possibility of foreign matter such as reflow soldering or individual soldering. In order to prevent adhesion, it is conceivable to provide a sticking process for sticking the cover and then perform the remaining processes.

Hereinafter, this will be described in more detail with reference to the drawings.
FIG. 15 is an external perspective view showing an example of an optical module 1 including a light emitting element 2 and a light receiving element 3 which are optical components of a position detection unit provided in a general reflection type optical encoder. In this figure, the light-emitting element 2 is mounted on a light-emitting element storage part 4 a that is a part of the storage part of the package 4 of the optical module 1, and the light-receiving element 3 is a light-receiving element storage that is a part of the storage part of the package 4. It is mounted on the part 4b. The light emitting element 2 is soldered onto an electrode pattern (not shown) formed in the light emitting element storage portion 4a of the package 4, and the light receiving element 3 is formed in the light receiving element storage portion 4b of the package 4 (not shown). No) Soldered on the electrode pattern. The electrodes of the light emitting element 2 and the light receiving element 3 are electrically connected to electrode patterns (not shown) formed on the package 4 by bonding wires 14, respectively.

The optical module 1 configured as described above is soldered and fixed onto the rotating substrate 6 used for mounting the encoder component. The foreign matter generated during the soldering is the encoder optical component. If it adheres to a certain light emitting element 2 or light receiving element 3, the position detection performance of the optical encoder deteriorates, and this must be prevented.
As a countermeasure, it is conceivable to cover the above-mentioned optical component with a tape-shaped cover before the component mounting process.

  FIG. 16 is a diagram showing an example when the upper surface of the package 4 of the optical module 1 is covered with a tape-like cover 105. The tape-shaped cover 105 is attached to the upper surface of the package 4 with, for example, an adhesive so as to cover the entire upper surface of the package 4 including the light emitting element storage portion 4a and the light receiving element storage portion 4b (not shown).

  Thereafter, the optical module 1 having the tape-like cover 105 attached to the upper surface of the package 4 is soldered onto the circuit board 6 by reflow soldering or individual soldering (see FIG. 17). Here, the heat-resistant temperature of the tape-like cover 105 needs to be higher than the melting point of lead-free solder, and generally has to be 240 degrees or higher.

  As described above, it is considered that the foreign matter can be prevented from adhering to the light emitting element 2 or the light receiving element 3 which is an optical component of the encoder by covering the entire upper surface of the package 4 with the tape-like cover 105.

  However, when the upper surface of the package 4 is covered with the tape-like cover 105 as described above, and is put into a high-temperature environment such as a reflow furnace for soldering the mounted component and the rotating substrate, the tape-like cover 105 covers the package 4. The sealed space formed by the expansion and contraction due to the influence of the surrounding high temperature may cause the tape-like cover 105 to peel off, and foreign matter may enter from the peeled portion and adhere to the optical component.

  The present application provides a circuit board manufacturing method capable of improving productivity without the need for foreign matter inspection or foreign matter removal work in the subsequent process of component mounting by solving the above-described problems. With the goal.

The circuit board manufacturing method disclosed in the present application is:
An optical module for detecting the position of an encoder and an optical module having a package for housing the optical component, and a circuit board manufacturing method for mounting a mounting component composed of electronic circuit components other than the optical module,
After housing the optical component in the package, a die bonding step of bonding and fixing the optical component and the package;
A cover pasting step of pasting a tape-shaped cover having a vent on the surface of the package;
A component mounting step of applying the solder paste on the circuit board and mounting the mounting component including the package on which the tape-like cover is attached on the circuit board;
A soldering process for performing soldering joining between the mounting component and the circuit board;
A cover removing step for removing the tape-like cover attached to the surface of the package from the package after the soldering joining;
Is included.

The circuit board manufacturing method disclosed in the present application is:
Before mounting the optical component on the circuit board, the light receiving surface of the light receiving element that is the optical component or the light emitting surface of the light emitting element is covered and covered with a tape-shaped cover, so that in an assembly process such as reflow soldering of the optical component The risk of foreign matter adhering to the light receiving surface or the light emitting surface can be reduced, and the yield can be improved, or the subsequent foreign matter inspection or foreign matter removing operation is not required. Therefore, the number of steps in the manufacturing process can be reduced.

2 is an external perspective view showing an example of an optical module that constitutes the position detection unit of the encoder according to Embodiment 1. FIG. FIG. 3 is an exploded perspective view showing an optical module constituting the position detection unit of the encoder according to the first embodiment. FIG. 3 is a schematic diagram showing an optical module and a circuit board that constitute a position detection unit of the encoder according to the first embodiment. FIG. 3 is an external perspective view for explaining the arrangement of vent holes of a tape-like cover affixed to the optical module according to Embodiment 1. FIG. 5 is a flowchart for explaining a manufacturing process of the encoder circuit board according to the first embodiment. FIG. 5 is a cross-sectional view illustrating a die bonding process for an encoder circuit board according to the first embodiment. 6 is a cross-sectional view illustrating a wire bonding process for an encoder circuit board according to Embodiment 1. FIG. 6 is a cross-sectional view illustrating a resin sealing process for an encoder circuit board according to Embodiment 1. FIG. FIG. 6 is a cross-sectional view for explaining a cover pasting process of the encoder circuit board according to the first embodiment. 5 is a cross-sectional view illustrating a component mounting process of the encoder circuit board according to Embodiment 1. FIG. 6 is an external perspective view showing an example of an optical module that constitutes a position detection unit of an encoder according to Embodiment 2. FIG. FIG. 10 is an external perspective view showing an example of an optical module that constitutes a position detection unit of an encoder according to a fourth embodiment. FIG. 10 is an external perspective view showing an example of an optical module constituting a position detection unit of an encoder according to a fifth embodiment. It is a figure for demonstrating the manufacturing method of the tape-shaped cover stuck on the optical module which comprises the position detection part of the encoder by Embodiment 5. FIG. It is the perspective view which showed the main elements of the optical module which comprises the position detection part of the encoder for demonstrating the subject of this application. It is an external appearance perspective view at the time of covering the optical module which comprises the position detection part of the encoder for demonstrating the subject of this application with the tape-shaped cover. It is a schematic diagram which shows the optical module and circuit board of the encoder covered with the tape-shaped cover for demonstrating the subject of this application.

Hereinafter, each embodiment of the present application will be described with reference to the drawings.
Embodiment 1 FIG.
FIG. 1 shows an optical module 1 covered with a tape-like cover 5 having a vent hole 7 used for a soldering process during the manufacturing process of a circuit board including the optical module as a mounting component according to the first embodiment. It is a figure which shows an example.
In this example, a configuration in which the optical module 1 constituting the optical component for detecting the position of the encoder is covered with a tape-like cover 5 having a vent hole 7 is shown in an external perspective view.
FIG. 2 is an exploded perspective view showing the tape-shaped cover 5 having the air holes 7 and the optical module 1 in FIG.
As shown in FIG. 1 or FIG. 2, the optical module 1 includes a package 4 on which a light emitting element 2 and a light receiving element 3 are separately mounted. The light emitting element 2 is housed in the light emitting element housing portion 4 a in the housing portion of the package 4, and the light receiving element 3 is housed in the light receiving element housing portion 4 b in the housing portion of the package 4. A tape-like cover 5 having a vent hole 7 covering the optical module 1 is affixed to the upper surface (also referred to as a surface; hereinafter the same) of the package 4 of the optical module 1.
Here, the light emitting element 2 is soldered onto an electrode pattern (not shown) formed in the light emitting element storage portion 4a, and the light receiving element 3 is an electrode (not shown) formed in the light receiving element storage portion 4b. Soldered on the pattern.
The electrodes of the light emitting element 2 and the light receiving element 3 are electrically connected to electrode patterns (not shown) formed on the package 4 by bonding wires, respectively.
The tape-shaped cover 5 having the air holes 7 is attached to the upper surface of the package 4 with an adhesive or the like so as to cover the entire surface of the light emitting element storage portion 4a and the light receiving element storage portion 4b.

  FIG. 3 is a schematic diagram in which the optical module 1 according to Embodiment 1 is mounted on an encoder circuit board 6 by soldering or the like. Here, a tape-like cover 5 having a vent hole is attached to the upper surface of the package 4 on which the light emitting element 2 and the light receiving element 3 which are optical components of the optical module 1 are mounted. Then, the optical module 1 to which the tape-like cover 5 having the air holes is attached is soldered on the circuit board 6 by reflow soldering or individual soldering.

  Due to this soldering process, the heat-resistant temperature of the tape-shaped cover 5 having the air holes should be 240 ° C. or more, which is the temperature higher than the melting point of lead-free solder, as in the case of the tape-shaped cover 105 having no air holes. I must.

In this soldering process, as described in the section of the problem, when the upper surface of the package 4 is covered with the tape-like cover 105 having no air holes, the tape-like cover is used when put in a high-temperature environment such as a reflow furnace. The sealed space formed by covering with 105 may expand and contract under the influence of the surrounding high temperature, so that the tape-shaped cover 105 may be peeled off, and foreign matter may be mixed from the peeled portion and attached to the optical component. is there. Therefore, in the present application, the tape-shaped cover 5 provided with the air holes 7 is used as a cover for covering the optical component, instead of the tape-shaped cover 105 without the air holes.
In particular, in the tape-like cover 5 having the air holes 7 used here, the positions of the air holes are as shown by the frame shown by the dotted line in FIG. 4 and the light emitting element storage portion 4a and the light receiving element storage portion 4b. One location is provided corresponding to each.

  By using the tape-like cover 5 having the vent holes, in the soldering process for joining the mounting component and the circuit board with the solder, the tape-like cover without the gas generated in a high-temperature environment such as a reflow furnace or the like. The sealed space formed by 105 can be evacuated, the cover can be prevented from peeling off, and foreign matters can be prevented from adhering to the optical component from the part where the cover is peeled off.

  The vent hole 7 is arranged as far as possible from the position directly above the light emitting element 2 and the light receiving element 3. By arranging in this way, it is possible to reduce the risk of foreign matter adhering to the light emitting surface or light receiving surface of the element. In the present embodiment, the vent hole 7 is formed in a circular shape. However, the shape is not limited to this shape, and may be a shape other than a circle such as an ellipse or a rectangle.

  As described above, when the optical module 1 is soldered and joined to the circuit board 6 (particularly when joined by reflow soldering), the light-emitting element storage portion 4a is obtained by using the tape-like cover 5 having air holes. It is possible to protect the entire surface of the light receiving element storage portion 4b and to prevent foreign matter from adhering to the light emitting surface of the light emitting element 2 or the light receiving surface of the light receiving element 3 by soldering after component mounting. Yield improvement, foreign matter inspection, and foreign matter removal work can be abolished, thereby improving productivity.

A method for manufacturing the circuit board 6 including the optical module 1 having the above configuration will be described below in order.
FIG. 5 is a flowchart showing an example of a manufacturing process related to manufacturing the circuit board 6 having the optical module 1.

  In the die bonding step of Step 1 (S1), as shown in FIG. 6, the light emitting element 2 and the light receiving element 3 are respectively placed on the element mounting electrode patterns 12 formed on the package 4 with a die bonding material 13 interposed therebetween. Mounted. Thereafter, the light emitting element 2 and the light receiving element 3 are bonded to the package by heat treatment.

  In the wire bonding step of Step 2 (S2), as shown in FIG. 7, the light emitting element 2 and the light receiving element 3 are electrically connected to the electrode pattern 12 of the package 4 through the bonding wires.

  Next, in the resin sealing step of Step 3 (S3), as shown in FIG. 8, a silicone-based resin is injected into the light emitting element storage portion 4a and / or the light receiving element storage portion 4b. Thereafter, the resin is cured by heat treatment, and the light-emitting element 2 and the light-receiving element 3 are sealed with the cured resin (hereinafter referred to as a sealing resin) 8. This resin sealing step is not essential and can be omitted. In the first embodiment, both the case where the resin sealing step of step 3 (S3) is included (in this case, the optical module 1a) and the case where it is not included (in this case, the optical module 1) are assumed. . The details of the case where the resin sealing step of Step 3 (S3) is included will be described in a little more detail in another embodiment described below.

  Subsequently, in the cover pasting step of pasting the tape-shaped cover in step 4 (S4), as shown in FIG. 9, the tape-shaped cover 5 is pasted on the upper end surface of the package 4 by the tape pasting device.

  In the component mounting process of the next step 5 (S5), as shown in FIG. 10, a solder paste 15 is printed on the circuit board 6 by a solder printer, and the optical module 1 and other mounted components are mounted on a mounter (automatic mounting machine). ) On the circuit board 6.

  In the reflow soldering process of step 6 (S6), the circuit board 6 is put into a reflow furnace, and each mounting component and the circuit board 6 are soldered and joined. During the flow of this process, the light-emitting surface of the light-emitting element 2 or the light-receiving surface of the light-receiving element 3 is protected by the tape-like cover 5, so that the light-receiving surface of the element in a reflow furnace where foreign matter such as dust or dust is likely to adhere. Alternatively, foreign matter can be prevented from adhering to the light-emitting surface, and the yield can be improved. Furthermore, foreign matter inspection or foreign matter removal work after the reflow process is not required, productivity is improved, and manufacturing costs can be reduced.

  In the tape-like cover peeling step in step 7 (S7), the tape-like cover 5 is removed from the optical module 1.

  In the lens adhering step of step 8 (S8), the circuit board 6 mounted on the encoder is attached by adhering a condensing lens for condensing light emitted from the light emitting element 2 to the upper part of the light emitting element 2 with an adhesive. Is assembled.

Embodiment 2. FIG.
Next, a method for manufacturing a circuit board using the optical module 1 covered with another tape-like cover 5a according to Embodiment 2 will be described.
FIG. 11 is an external perspective view of the optical module 1 provided with a tape-like cover 5a different from the first embodiment. The difference from the first embodiment is that, as shown in FIG. 11, the tape-like cover 5a is smaller than the surface area value determined by the size of each side of the outer frame of the package 4 (the two adjacent outermost peripherals on the upper surface of the package 4). The value obtained by multiplying the size of the side is smaller than the value in the case of the surface area), and the size fits in the package 4 (however, larger than the frame size outside the storage portion). Other than this, the contents are the same as those described in the first embodiment.

  In the first embodiment, after the configured optical module 1 is joined to the circuit board 6 by soldering, the appearance state of soldering is usually inspected by an appearance inspection apparatus. When the tape-like cover 5 protrudes from the outer frame of the package 4 during the inspection, the protruding portion of the tape-like cover 5 covers the soldered portion on the package when viewed from the upper surface. Therefore, in the inspection from the upper surface, the soldered portion on the package cannot be directly visually recognized, which may affect the inspection of the appearance.

Thus, in the second embodiment, the tape-like cover 5a to be attached is accommodated in the package 4. This makes it possible to visually recognize the soldering portion from the upper surface, and the appearance of soldering can be inspected.
In consideration of the influence on the adjacent parts, it is possible to reduce the distance to the adjacent parts by accommodating the tape-like cover 5a in the package 4, thereby improving the mounting density of the circuit board 6 and further improving the encoder itself. Miniaturization is also possible.

  By arranging the vent hole 7 so as not to be directly above the light emitting element 2 and the light receiving element 3, it is possible to reduce the risk of foreign matter adhering to the light emitting surface of the light emitting element or the light receiving surface of the light receiving element. In the present embodiment, the vent hole 7 is circular, but may be oval or rectangular.

Embodiment 3 FIG.
Next, a method for manufacturing a circuit board using an optical module 1a different from the second embodiment provided with the tape-like cover 5a will be described.
The cross section of the optical module 1a having the silicone-based sealing resin 8 according to the third embodiment is shown in FIG. 9, in which the length of the tape-like cover 5 is set smaller than the length of the bottom side of the package 4 and the tape-like cover 5a. It corresponds to the case. The optical module 1a is different from the second embodiment in that the housing portion of the package of the optical module 1 is filled with a silicone-based sealing resin 8. In this case, the optical module 1a includes a package 4 on which the light emitting element 2 and the light receiving element 3 are mounted, and the light emitting element storage portion 4a and the light receiving element storage portion 4b are filled with a silicone-based sealing resin 8. ing. The optical module 1a has a tape-like cover 5a having a vent 7 on the upper surface of the package.

The light-emitting element 2 and the light-receiving element 3 are soldered to electrode patterns 12 (not shown) formed in the light-emitting element storage part 4a and the light-receiving element storage part 4b of the package 4, respectively.
The electrodes of the light emitting element 2 and the light receiving element 3 are electrically connected to electrode pads formed on the package by bonding wires, respectively.
Thereafter, a silicone-based resin is injected into the light-emitting element storage portion 4a and the light-receiving element storage portion 4b. After the silicone-based resin is cured in a high temperature environment, the tape cover 5a having the air holes 7 is formed into the optical module 1a. It is affixed on the top surface.

  When the optical module 1a shown in the present embodiment is joined to the circuit board 6 by reflow soldering, gas is generated from the sealing resin 8 due to the high temperature in the reflow furnace. This generated gas may increase the pressure in the light emitting element storage portion 4a and the light receiving element storage portion 4b, and the tape-like cover 5a may be peeled off. For this reason, by using the tape-like cover 5a provided with the vent holes 7, it becomes possible to exhaust the generated gas, and the tape-like cover 5a can be prevented from peeling off, and the light emitting surface of the light emitting element 2 or the light receiving element 3 can receive light. The risk of foreign matter adhering to the surface can be reduced.

  In the present embodiment, both the light emitting element storage portion 4a and the light receiving element storage portion 4b are filled with the sealing resin 8. However, only one of them may be filled with the sealing resin 8.

Embodiment 4 FIG.
Next, the manufacturing method of the circuit board using the optical module 1 provided with the tape-shaped cover 5b is demonstrated using figures.
FIG. 12 is an external perspective view of the optical module 1 including the tape-like cover 5b having the notch 9 according to the fourth embodiment. By attaching the tape-like cover 5b having the notch 9 to the upper surface of the optical module 1, the notch 9 of the tape-like cover 5b, the light-emitting element accommodating part 4a, and the light-receiving element accommodating part 4b provide a vent hole. 7 can be configured. The vent 7 formed by the notch 9, the light emitting element storage 4a, and the light receiving element storage 4b makes it possible to exhaust the air in the storage space of each element or the gas generated from the sealing resin 8. Further, it is possible to prevent the tape-like cover 5b from peeling off and reduce the risk of foreign matter adhesion.

  Here, the tape-like cover 5b is generally manufactured by die cutting using a mold. In the case of forming a vent hole in the tape-like cover 5b during this processing, two or more unnecessary portions are generated after the die-cutting process, which increases the burden of removing unnecessary portions. By using the notch portion as in the present embodiment, it is possible to make unnecessary portions generated after the die cutting process continuous, and it is possible to easily remove the unnecessary portions.

Embodiment 5 FIG.
Next, the manufacturing method of the circuit board using the optical module 1 provided with the tape-shaped cover 5c is demonstrated using figures. The fifth embodiment is different from the above-described embodiments in that the shape of the vent hole of the tape-like cover is a slit shape. In FIG. 13, the external view of the tape-shaped cover 5c which has the slit-shaped ventilation hole 10 of this Embodiment is shown.
When the tape-like cover 5c is bonded to the upper surface of the optical module 1, the slit-shaped vent hole 10 is positioned so that the slit-shaped vent hole 10 is located in the region of the light-emitting element storage portion 4a and the light-receiving element storage portion 4b. Is provided. Further, the slit-shaped vent hole 10 is not disposed immediately above the light emitting element 2 and the light receiving element 3.

  The optical module 1 is mounted on the circuit board 6 with the tape-like cover 5c of the present embodiment attached to the upper surface of the optical module 1, and joined by reflow soldering.

  As described above, in the present embodiment, by making the vent hole into a slit shape, the air in the light emitting element storage portion 4a and the light receiving element storage portion 4b expands under a high temperature environment in the reflow furnace. The slit-shaped vent hole 10 expands, and the air in the element housing portion can be exhausted, and the tape-shaped cover 5 can be prevented from peeling off in the reflow furnace. That is, the vent hole of the tape-like cover 5c of the present embodiment is a vent hole that does not have a hole in a temperature environment of room temperature or lower, and forms a hole for the first time in a high temperature environment exceeding 200 ° C. in a reflow furnace. It is a feature. In this case, the size of the vent hole in a high temperature environment exceeding 200 ° C. is set so that the short side is 0.05 mm or less and the long side is 2 mm or less when the slit shape is rectangular.

  Therefore, in a room temperature environment outside the reflow furnace, the pressure in the element storage portion decreases and the slit-shaped vent hole 10 is closed, thereby reducing the risk of foreign matter entering the element storage portion.

  In the present embodiment, the slit-shaped vent hole 10 is provided at one location for each of the light-emitting element storage portion 4a and the light-receiving element storage portion 4b. However, the slit-shaped vent holes 10 are provided at two or more locations. The provided structure may be used.

  A method for manufacturing the tape-shaped cover having the above-described configuration will be described below by taking up the tape-shaped cover 5c as a representative.

In the present embodiment, the base material of the tape-like cover 5c is composed mainly of a heat-resistant resin such as a polyimide resin.
The base material of the tape-like cover 5c bonded on the mount 11 is created by die-cutting only the base material with a mold. When performing die cutting, the die blade is set to cut down to the thickness of the tape base material. At the time of the die cutting process, the aforementioned slit-shaped air holes 10 are simultaneously formed by the die cutting process. The die-cut tape is wound around a reel core and stored in a reel shape.

  As shown in FIG. 14, when the slit-shaped vent hole 10 is formed, the slit angle is formed in parallel with the reel unwinding direction. By forming the setting angle of the slit-shaped vent hole 10 in parallel with the reel unwinding direction, the tape-shaped cover 5c is torn starting from the slit-shaped vent hole 10 when the tape-shaped cover 5c is peeled off from the mount. Risk can be reduced.

  In the present embodiment, the tape-like cover 5c is made of a heat-resistant tape, but the cover material may be a metal or resin cover. By installing a metal and resin cover on the upper end surface of the optical module 1, the risk of foreign matter adhering to the light emitting surface of the light emitting element 2 or the light receiving surface of the light receiving element 3 is reduced as in the case of the above-described embodiment. Reduction is possible and yield can be improved.

  In the present application, the embodiments can be combined, or the embodiments can be appropriately modified or omitted. For example, in the fourth and fifth embodiments, the surface area of the tape cover attached to the package has been described on the assumption that the surface area of the package surface is smaller than the surface area of the package surface. It may be affixed so as to cover the entire surface of the package, i.e., having a larger area than the surface area of the surface of the package.

    DESCRIPTION OF SYMBOLS 1, 1a Optical module, 2 Light emitting element, 3 Light receiving element, 4 Package, 4a Light emitting element accommodating part, 4b Light receiving element accommodating part, 5, 5a, 5b, 5c Tape-like cover (with a vent hole), 6 Circuit board, 7 Vent hole, 8 sealing resin, 9 notch, 10 slit-shaped vent hole, 11 mount, 12 electrode pattern, 13 die bonding material, 14 bonding wire, 15 solder paste, 105 tape-shaped cover (no vent hole)

Claims (6)

An optical module for detecting the position of an encoder and an optical module having a package for housing the optical component, and a circuit board manufacturing method for mounting a mounting component composed of electronic circuit components other than the optical module,
A die-bonding step of bonding and fixing the optical component and the package after the optical component is housed in the package;
A cover pasting step of pasting a tape-shaped cover having a vent on the surface of the package;
A component mounting step of applying the solder paste on the circuit board and mounting the mounting component including the package on which the tape-like cover is attached on the circuit board;
A soldering process for performing soldering joining between the mounting component and the circuit board;
A cover removing step for removing the tape-like cover attached to the surface of the package from the package after the soldering joining;
A method for manufacturing a circuit board, comprising:   2. The circuit board according to claim 1, wherein after the die bonding step is finished, a resin is injected into the package containing the optical component to seal the optical component, and then the tape-like cover is pasted. Production method.   3. The circuit board according to claim 1, wherein the tape-like cover is attached so as to cover the entire surface of the package, and the soldering joining is performed by reflow soldering or individual soldering. Production method.   3. The method of manufacturing a circuit board according to claim 1, wherein in the cover pasting step, a surface area of the tape-like cover stuck to the package is smaller than a surface area of the surface of the package.   The method for manufacturing a circuit board according to claim 1, wherein the tape-like cover has a notch.   The method for manufacturing a circuit board according to claim 1, wherein the shape of the vent hole is a slit shape.

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