JP2019161151A - Electronic component, electronic device, and method of manufacturing electronic device - Google Patents

Abstract

To achieve alignment properly making good use of surface tension of molten metal in positioning between terminals.SOLUTION: An electronic components comprises: a first electrode terminal which is provided on a first electrode formation surface that a first element body comprises, and has a first molten metal joint surface; and a first positioning terminal which is provided on the first electrode formation surface, and has a second molten metal joint surface comprising a molten metal impregnation part. The electronic component when joined to another electronic component is aligned first with surface tension of a molten metal layer between the first positioning terminal and a second positioning terminal that the other electronic component comprises. Then the electronic component is impregnated with the molten metal impregnation part of the molten metal layer being molten to obtain further alignment effect with the surface temperature of the molten metal layer between the first electrode terminal and the second electrode terminal that the other electronic component comprises.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electronic component, an electronic device, and a method for manufacturing the electronic device.

  In recent years, the pitch of electrode connection terminals in semiconductor elements has been narrowed, and the arrangement of pads and bumps that form electrode connection terminals has also increased in density, so elements are stacked and the terminals are connected via a molten metal layer. There is a need for more accurate alignment when doing so. Conventionally, there is a case where alignment in joining of electrode connection terminals is performed using optical mark detection using visible light or infrared light. Also, a proposal is known in which soldering is performed using electrode pads and alignment pads, and alignment is performed by utilizing self-alignment due to surface tension between the pads (see, for example, Patent Document 1). .

Japanese Patent Laid-Open No. 10-50773

  However, when alignment is performed in joining electrode connection terminals using optical mark detection, the alignment accuracy is limited by the optical detection accuracy and the mechanical accuracy of the device that stacks elements. Further, in Patent Document 1, it is assumed that the solder between the electrode connection terminals also contacts when the surface tension between the alignment pads is exerted, and a sufficient alignment effect is not exhibited as a whole. In the future, it is assumed that such a phenomenon becomes remarkable when the pitch between the electrode connection terminals is narrowed.

  In one aspect, an object of the present disclosure is to perform alignment using the surface tension of molten metal appropriately in alignment between terminals.

  In one aspect, the electronic component is provided on a first electrode forming surface included in the first element body, and includes a first electrode terminal having a first molten metal bonding surface, and the first electrode forming surface. And a first alignment terminal having a second molten metal joint surface provided with a groove-shaped molten metal impregnated portion.

  In another aspect, the electronic device includes: a first electronic component including a first electrode terminal and a first alignment terminal on a first electrode formation surface included in the first element body; The first electrode is formed by a second electronic component having a second electrode terminal and a second alignment terminal on a second electrode forming surface of the element body, and a first molten metal layer. A second joining portion formed by a first joining portion joining the terminal and the second electrode terminal, and a second molten metal layer, joining the first alignment terminal and the second alignment terminal; The second joint portion enters the molten metal-impregnated portion of the first alignment terminal.

  Further, in another aspect, an electronic device manufacturing method includes a first electronic component including a first electrode terminal and a first alignment terminal, a second electrode terminal and a second alignment terminal. Two electronic components, a first joint portion is interposed between the first electrode terminal and the second electrode terminal, and the first alignment terminal and the second alignment terminal A method of manufacturing an electronic device in which a second bonding portion is interposed therebetween, wherein a molten metal layer between electrode terminals is provided between the first electrode terminal and the second electrode terminal, A step of disposing the first electronic component and the second electronic component facing each other in a state in which a molten metal layer between alignment terminals is provided between the first alignment terminal and the second alignment terminal; The first alignment terminal and the second alignment terminal are connected between the alignment terminals. A step of bringing the molten metal layer into contact with each other; a step of performing primary alignment while melting the molten metal layer between the alignment terminals to form the second bonding portion; and the second bonding portion in a molten state Is impregnated in the groove-shaped molten metal impregnated portion of the first alignment terminal, and is contacted via the molten metal layer between the electrode terminals, and the molten metal layer between the electrode terminals is used for the first And performing a secondary alignment while forming the joint portion.

  According to the invention disclosed in this specification, it is possible to perform alignment using the surface tension of molten metal appropriately in alignment between terminals.

FIG. 1A is a cross-sectional view of the first electronic component without the first molten metal layer and the second molten metal layer of the embodiment, and FIG. 1B is a first embodiment of the first embodiment. It is sectional drawing of the 1st electronic component of the state which comprised the molten metal layer and the 2nd molten metal layer. FIG. 2 is a plan view of the first electronic component of the embodiment. FIG. 3A is a plan view showing the first alignment terminal and the second molten metal layer, and FIG. 3B is a side view showing the first alignment terminal and the second molten metal layer. is there. FIG. 4 is an explanatory view showing the relationship between the heights of the respective parts of the first electrode terminal and the first alignment terminal. FIG. 5 is a cross-sectional view of the second electronic component of the embodiment. 6A is a plan view showing the second alignment terminal, and FIG. 6B is a side view showing the second alignment terminal. It is explanatory drawing which shows the relationship of the height of each part of a 2nd electrode terminal and a 2nd alignment terminal. FIG. 8 is a cross-sectional view of the electronic device of the embodiment. FIG. 9A to FIG. 9E are explanatory views showing the steps of the electronic device manufacturing method according to the embodiment in time series. FIG. 10 shows a primary junction while melting the second molten metal layer and the fourth molten metal layer interposed between the first alignment terminal and the second alignment terminal to form a second joint portion. It is explanatory drawing which shows a mode that it arranges. FIG. 11 is an explanatory view showing a state in which the molten second impregnated portion is impregnated in the molten metal impregnated portion provided in the first alignment terminal. 12 (A) and 12 (B) are explanatory views showing a modification of the molten metal impregnated portion.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, in the drawings, the dimensions, ratios, and the like of each part may not be shown so as to completely match the actual ones. Further, depending on the drawings, components that are actually present may be omitted for convenience of explanation, or dimensions may be exaggerated from the actual drawing.

(Embodiment)
Referring to FIG. 1A, the first electronic component 10 includes a first element body 11 including a first electrode formation surface 11a. A first electrode terminal 12 which is a metal pillar is formed on the first electrode formation surface 11a. The first electrode terminal 12 includes a first molten metal joining surface 12a. The 1st electrode terminal 12 of this embodiment is formed in the column shape by Cu (copper). Here, referring to FIG. 2, a plurality of the first electrode terminals 12 are provided in a rectangular electrode formation region R partitioned by the first electrode formation surface 11 a of the rectangular first material body 11. . In FIG. 2, only some of the plurality of first electrode terminals 12 are depicted. The first electronic component 10 can be a chip such as a CPU (Central Processing Unit) or a memory. It can also be an interposer. The first electrode terminal 12 is formed as an electrode connection terminal corresponding to the function of the first electronic component 10. The first electrode terminal 12 may be formed of other materials. The first electrode terminal 12 can be provided as a pad or a bump. In the present embodiment, the first electrode terminal 12 is formed as a bump.

  A first alignment terminal 13 that is a metal pillar is provided on the first electrode formation surface 11a. The first alignment terminal 13 of the present embodiment is formed in a column shape from Cu (copper). The first alignment terminal 13 is provided around the electrode formation region R. Specifically, the first alignment terminals 13 are provided at the corners of the rectangular first electrode formation surface 11a and at the center of each side. The first alignment terminal 13 includes a second molten metal joint surface 13a. The first alignment terminal 13 includes a groove-shaped molten metal impregnated portion 13b. The molten metal impregnated portion 13b is provided in a cross shape on the second molten metal joint surface 13a. Referring to FIGS. 3A and 3B, the width of the molten metal impregnated portion 13b is W. As will be described later, the molten metal impregnated portion 13b has a function of impregnating the molten metal by a capillary phenomenon when the first electronic component 10 is joined to another electronic component, and adjusting the distance therebetween. The first alignment terminal 13 may be formed of other materials. The first alignment terminal 13 can be provided as a pad or a bump. In the present embodiment, the first alignment terminal 13 is formed as a bump.

  Referring to FIG. 1A again, the diameter R2 of the second molten metal bonding surface 13a of the first alignment terminal 13 is equal to the diameter R2 of the first molten metal bonding surface 12a of the first electrode terminal 12. It is larger than the diameter R1. As will be described later, the first electrode terminal 12 and the first alignment terminal 13 both exhibit an alignment function due to the surface tension of the molten metal, but have a large diameter and a large area. Can exert a larger alignment function.

  Referring to FIG. 1B and FIG. 3, a first molten metal layer 14 is formed on the first molten metal bonding surface 12 a of the first electrode terminal 12. A second molten metal layer 15 is formed on the second molten metal joint surface 13 a of the first alignment terminal 13. The first molten metal layer 14 and the second molten metal layer 15 of the present embodiment are both SnAg (tin silver) solder, but other materials may be used. The 1st molten metal layer 14 is contained in the molten metal layer between electrode terminals. The second molten metal layer 15 is included in the molten metal layer between alignment terminals.

  Referring to FIG. 4, the height of the first electrode terminal 12 is ha1. The height of the first molten metal layer 14 is ha2. The height from the first electrode formation surface 11a to the top of the first molten metal layer 14 is ha. On the other hand, the height of the first alignment terminal 13 is hb1. The height of the second molten metal layer 15 is hb2. The height from the first electrode formation surface 11a to the top of the second molten metal layer 15 is hb. In the present embodiment, the height ha1 of the first electrode terminal 12 and the height hb1 of the first alignment terminal 13 are matched. The height ha2 of the first molten metal layer 14 is set lower than the height hb2 of the second molten metal layer 15. As a result, the height hb from the first electrode formation surface 11 a to the top of the second molten metal layer 15 is higher than the height ha from the first electrode formation surface 11 a to the top of the first molten metal layer 14. Is also expensive. As a result, the second molten metal layer 15 comes into contact with the other alignment terminal or molten metal layer prior to contact between the first molten metal layer 14 and the electrode terminal or molten metal layer of the other electronic component. It becomes easy. As a result, the alignment function by the alignment terminal is easily performed prior to the alignment function by the electrode terminal.

  The first electronic component 10 includes a groove-shaped molten metal impregnated portion 13 b in the first alignment terminal 13, so that the alignment function by the first alignment terminal 13 is higher than the alignment function by the first electrode terminal 12. Can be demonstrated in advance. That is, the first electronic component 10 exhibits an alignment function when the second molten metal layer 15 provided in the first alignment terminal 13 first contacts the other alignment terminal or the molten metal layer. . And the 1st electronic component 10 approaches the other electronic components, and the 1st molten metal provided in the 1st electrode terminal 12 because the groove-shaped molten metal impregnation part 13b impregnates a molten metal. Layer 14 is brought into contact with the electrode terminals or molten metal layer of the other electronic component to obtain further alignment functions. Thus, the first electronic component 10 has high self-alignment.

  Next, the second electronic component 30 which is another electronic component will be described with reference to FIGS. 5 to 6B. The second electronic component 30 includes a second element body 31 including a second electrode formation surface 31a. A second electrode terminal 32 that is a metal pillar is formed on the second electrode formation surface 31a. The second electrode terminal 32 includes a third molten metal bonding surface 32a. The 2nd electrode terminal 32 of this embodiment is formed in the column shape with Cu (copper). A plurality of second electrode terminals 32 are provided corresponding to the arrangement of the first electrode terminals 12. The second electronic component 30 can be various components that can be used by being joined to the first electronic component 10. For example, when the first electronic component 10 is a CPU, the second electronic component 30 can be a memory. The second electrode terminal 32 is formed as an electrode connection terminal corresponding to the function of the second electronic component 30. The second electrode terminal 32 may be formed of other materials. The second electrode terminal 32 can be provided as a pad or a bump. In the present embodiment, the second electrode terminal 32 is formed as a bump. The diameter of the third molten metal joint surface 32a that is the second electrode terminal 32 is R1, similarly to the diameter of the first molten metal joint surface 12a that the first electrode terminal 12 has.

  A second alignment terminal 33 that is a metal pillar is provided on the second electrode formation surface 31a. The second alignment terminal 33 of the present embodiment is formed in a cylindrical shape from Cu (copper). The second alignment terminal 33 is provided so as to correspond to the arrangement of the first alignment terminal 13. That is, the second alignment terminal 33 is provided so as to overlap the first alignment terminal 13 when the first electrode formation surface 11a and the second electrode formation surface 31a are opposed to each other.

  The second alignment terminal 33 includes a fourth molten metal joint surface 33a. The second alignment terminal 33 may be formed of other materials. The second alignment terminal 33 can be provided as a pad or a bump. In the present embodiment, the second alignment terminal 33 is formed as a bump. The diameter of the fourth molten metal joint surface 33a included in the second alignment terminal 33 is R2, similar to the diameter of the second molten metal joint surface 13a included in the first alignment terminal 13.

  Referring to FIG. 5 and FIG. 7, a third molten metal layer 34 is formed on the third molten metal bonding surface 32 a of the second electrode terminal 32. A fourth molten metal layer 35 is formed on the fourth molten metal joint surface 33 a of the second alignment terminal 33. The third molten metal layer 34 and the fourth molten metal layer 35 of the present embodiment are both SnAg (tin silver) solder, but other materials may be used. The third molten metal layer 34 is included in the molten metal layer between the electrode terminals. The fourth molten metal layer 35 is included in the molten metal layer between alignment terminals. In the present embodiment, since the first molten metal layer 14 is provided on the first molten metal joining surface 12a, the third molten metal layer 34 may be omitted. Similarly, in the present embodiment, since the second molten metal layer 15 is provided on the second molten metal joint surface 13a, the fourth molten metal layer 35 may be omitted. Conversely, the first molten metal layer 14 may be eliminated and the third molten metal layer 34 may be employed. The second molten metal layer 15 may be eliminated and the fourth molten metal layer 35 may be employed. That is, the molten metal layer may be provided on any one of the electronic components, or may be provided on both of the electronic components.

  Referring to FIG. 7, the height of the second electrode terminal 32 is hc1. The height of the third molten metal layer 34 is hc2. The height from the second electrode formation surface 31a to the top of the third molten metal layer 34 is hc. On the other hand, the height of the second alignment terminal 33 is set to hd1. The height of the fourth molten metal layer 35 is hd2. The height from the second electrode formation surface 31a to the top of the fourth molten metal layer 35 is hd. In the present embodiment, the height hc1 of the second electrode terminal 32 and the height hd1 of the second alignment terminal 33 are matched. The height hc2 of the third molten metal layer 34 is set lower than the height hd2 of the fourth molten metal layer 35. As a result, the height hd from the second electrode formation surface 31 a to the top of the fourth molten metal layer 35 is higher than the height hc from the second electrode formation surface 31 a to the top of the third molten metal layer 34. Is also expensive.

  Here, assuming that the heights of the electrode terminals and the alignment terminals are the same in each electronic component, the dimensions of the respective parts in the first electronic component 10 and the second electronic component 30 have the following relationship. . That is, the relationship ha2 + hc2 <hb2 + hd2 is established between ha2 + hc2 which is the dimension of the molten metal layer between the electrode terminals and hb2 + hd which is the dimension of the molten metal layer between the alignment terminals. Accordingly, when the first electrode forming surface 11a and the second electrode forming surface 31a are opposed to each other and the two are brought close to each other, the molten metal layer between the alignment terminals contacts the molten metal layer between the electrode terminals in advance. To do. The dimensions of each terminal and the molten metal layer can be changed as appropriate. However, when the first electrode forming surface 11a and the second electrode forming surface 31a are opposed to each other and the two are brought close to each other, the molten metal layer between the alignment terminals contacts the molten metal layer between the electrode terminals in advance. The condition is that the relationship is maintained.

  Next, with reference to FIG. 8, the electronic apparatus 1 of the present embodiment will be described. The electronic device 1 is formed by bonding the first electronic component 10 and the second electronic component 30 with the first electrode forming surface 11a and the second electrode forming surface 31a facing each other. The 1st electrode terminal 12 and the 2nd electrode terminal 32 are joined by the 1st junction part 2, and electrical conduction between both is taken. The first alignment terminal 13 and the second alignment terminal 33 are joined by the second joining portion 3. The first alignment terminal 13 and the second alignment terminal 33 exhibit an alignment function, but are used as electrodes because they are electrically connected by the second joint 3. You can also. For example, the first alignment terminal 13 and the second alignment terminal 33 may be used as a power source or a ground line.

  Since the electronic device 1 includes the first electronic component 10 having high self-alignment property, the electronic device 1 has high alignment accuracy between the first electronic component 10 and the second electronic component 30.

  Next, an example of a method for manufacturing the electronic device 1 according to the present embodiment will be described with reference to FIGS.

  First, the first electronic component 10 and the second electronic component 30 are prepared. In the first electronic component 10, an organic resin insulating film is formed in advance on a first element body 11 to be a semiconductor element substrate, and positions corresponding to the first electrode terminals 12 and the first alignment terminals 13 by photolithography. Opened.

  Next, a Ti / Cu layer was formed as a seed layer. Then, after opening with a resist for bumps, a 1 μm thick Ni layer and SnAg solder with a thickness of 2 μm (= ha2) are formed on a Cu pillar of φ10 μm (= R1) and height 10 μm (= ha1) by electroplating. The first electrode terminal 12 was formed. The SnAg solder corresponds to the first molten metal layer 14 and was 3 μm after reflow. The first electrode terminals 12 were provided at a pitch of 20 μm.

  Further, a bump of the first alignment terminal 13 is formed around the first electrode terminal 12 on a Cu pillar having a diameter of 20 μm (= R2) and a height of 10 μm (= hb1). It was formed with a thickness of 10 μm (= hb2) and reflowed. At this time, the molten metal impregnated portion 13b was formed by performing patterning so that a cross-shaped groove having a width W = 4 μm was formed. As a result, the first alignment terminal 13 is divided into four regions. Here, since the first alignment terminal 13 has a diameter of 20 μm and the groove width of the molten metal impregnated portion 13b is W = 4 μm, the electrode occupation ratio in the first alignment terminal 13 is 44.3%. . The electrode occupation ratio is an area ratio of the remaining portion of the first alignment terminal 13 excluding the area of the molten metal impregnated portion 13b from the second molten metal bonded surface 13a to the second molten metal bonded surface 13a. Note that the SnAg solder corresponds to the second molten metal layer 15 and was 15 μm after reflow.

  In the second electronic component 30, an organic resin insulating film is formed in advance on a second element body 31 to be a semiconductor element substrate, and positions corresponding to the second electrode terminals 32 and the second alignment terminals 33 by photolithography. Opened.

  Next, a Ti / Cu layer was formed as a seed layer. Then, after opening with a resist for bumps, a Cu pillar having a diameter of 10 μm (= R1) and a height of 5 μm (= hc1 = hd1) was formed by electroplating. The second electrode terminals 32 were provided at a pitch of 20 μm.

  Further, a bump of the second alignment terminal 33 is formed around the second electrode terminal 32 as a Cu pillar having a diameter of 20 μm (= R2) and a height of 5 μm (= hd1).

  In addition, the 1st electronic component 10 and the 2nd electronic component 30 can be prepared with a conventionally well-known process, and illustration is abbreviate | omitted.

  After preparing the first electronic component 10 and the second electronic component 30, first, as shown in FIG. 9A, the first element body 11 and the second electronic component 30 of the first electronic component 10. The second element body 31 is arranged in a state where the first electrode forming surface 11a and the second electrode forming surface 31a are opposed to each other. Thereby, between the 1st electrode terminal 12 and the 2nd electrode terminal 32, the state by which the 1st molten metal layer 14 and the 3rd molten metal layer 34 as a molten metal layer between electrode terminals were provided, and Become. Further, the second molten metal layer 15 and the fourth molten metal layer 35 as the molten metal layer between the alignment terminals are provided between the first alignment terminal 13 and the second alignment terminal 33. It becomes a state.

  In this state, alignment using optical means is performed. The alignment using the optical means may be performed by providing a dedicated optical detection mark, but in the present embodiment, the first alignment terminal 13 and the second alignment terminal 33 are used. In the present embodiment, alignment using optical means is referred to as zero-order alignment for convenience.

  After the alignment using the optical means, the first electronic component 10 and the second electronic component are brought close to each other as shown in FIG. 9B, and the second molten metal layer 15 and the fourth molten metal are brought together. The layer 35 is brought into contact, and the bonding of both is started by a flip chip bonder. The shift amount between the first element body 11 and the second element body 31 after the zero-order alignment, that is, the joining accuracy was about 2 to 5 μm. This bonding accuracy depends on alignment using optical means.

  When the reflow in the reducing atmosphere is started by the flip chip bonder, the second molten metal layer 15 and the fourth molten metal interposed between the first alignment terminal 13 and the second alignment terminal 33 are used. Layer 35 begins to melt. At this time, as shown in FIG. 9C and FIG. 10, the first molten metal layer 14 and the third molten metal layer 34 are separated from each other, and the molten second molten metal layer is formed. 15 and the 4th molten metal layer 35 are united, and the 2nd junction part 3 is formed. The molten second joint 3 exhibits an alignment function due to surface tension. Thereby, the primary alignment is performed following the zero-order alignment. The amount of deviation between the first element body 11 and the second element body 31 after the primary alignment, that is, the bonding accuracy was about 1 μm.

  When the reflow is continued, the melted second molten metal layer 15 and the fourth molten metal layer 35, that is, the groove-shaped molten metal impregnated portion provided in the first alignment terminal 13 in the second bonding portion 3. 13b is impregnated. The molten second joint 3 is impregnated in the molten metal impregnated portion 13b by capillary action. As a result, the height of the second bonding portion 3 is reduced, the first electrode forming surface 11a and the second electrode forming surface 31a approach each other, and the first molten metal layer 14 and the third molten metal layer. 34 comes into contact. That is, the first electrode terminal 12 and the second electrode terminal 32 are in contact with each other via the first molten metal layer 14 and the third molten metal layer 34. The melted first molten metal layer 14 and the third molten metal layer 34 are integrated to form the first joint 2. The molten first joint 2 exhibits an alignment function due to surface tension. Thereby, secondary alignment is implemented following primary alignment. The alignment function resulting from the surface tension is exhibited at each electrode terminal. The amount of deviation between the first element body 11 and the second element body 31 after the secondary alignment, that is, the bonding accuracy was 1 μm or less.

  Through the above steps, the electronic device 1 shown in FIG. 9E can be obtained. The electronic device 1 is aligned with high accuracy by adjusting the alignment a plurality of times.

  The electronic device 1 of the present embodiment realizes a joining accuracy that is higher than the optical alignment accuracy by performing a plurality of adjustment processes using the surface tension of the molten metal, and can join the electrode connection terminals with a narrow pitch. This can be performed reliably and a highly reliable joint can be provided. The present embodiment can also be applied to high-density mounting such as three-dimensional and 2.5-dimensional mounting by using, for example, a semiconductor element or an interposer in which a through silicon via is previously formed on a chip.

(Modification)
As shown in FIG. 3A, the molten metal impregnated portion 13b of the present embodiment is provided in a cross shape. The molten metal impregnated portion 13b has a function of adjusting the height of the second joint portion 3 by impregnating the molten metal. For this reason, by adjusting the electrode occupation ratio and adjusting the amount of impregnation of the molten metal, an appropriate surface tension can be exhibited, and highly accurate self-alignment can be obtained. Therefore, as shown in FIG. 12 (A), the amount of impregnation of the molten metal can be increased by providing groove expansion portions 13b1 at four locations in the central portion of the fan shape. Further, in the case where it is not necessary to increase the amount of molten metal impregnation as much as the example shown in FIG. 12A, for example, as shown in FIG. You may make it provide the expansion part 13b1 of a groove | channel. The shape of the groove is not limited to these shapes, and can be a shape capable of realizing a necessary impregnation amount of the molten metal.

  Although the preferred embodiment of the present invention has been described in detail above, the present invention is not limited to the specific embodiment, and various modifications, within the scope of the gist of the present invention described in the claims, It can be changed.

In addition, the following additional notes are disclosed regarding the above description.
(Additional remark 1) The 1st electrode terminal which is provided in the 1st electrode formation surface with which the 1st element body is provided, and has the 1st molten metal joined surface,
A first alignment terminal provided on the first electrode forming surface and having a second molten metal joint surface provided with a groove-shaped molten metal impregnated portion;
With electronic components.
(Additional remark 2) The electronic component of Additional remark 1 by which the 1st molten metal layer was formed in the said 1st molten metal joining surface, and the 2nd molten metal layer was formed in the said 2nd molten metal joining surface.
(Additional remark 3) The height from the said 1st electrode formation surface to the top part of the said 2nd molten metal layer is higher than the height from the said 1st electrode formation surface to the top part of the said 1st molten metal layer The electronic component according to appendix 2.
(Supplementary note 4) The electronic component according to any one of supplementary notes 1 to 3, wherein a diameter of the second molten metal joint surface is larger than a diameter of the first molten metal joint surface.
(Additional remark 5) The 1st electronic component provided with the 1st electrode terminal and the 1st alignment terminal in the 1st electrode formation surface with which the 1st element body is provided,
A second electronic component comprising a second electrode terminal and a second alignment terminal on a second electrode forming surface provided in the second element body;
A first joining portion formed by a first molten metal layer and joining the first electrode terminal and the second electrode terminal;
A second joining portion that is formed by a second molten metal layer and joins the first alignment terminal and the second alignment terminal;
The electronic device in which the second joint portion enters a groove-shaped molten metal impregnation portion of the first alignment terminal.
(Additional remark 6) As for the said 1st electrode terminal, the 1st molten metal layer is formed in the 1st molten metal joint surface, and the said 1st alignment terminal is the 2nd on a 2nd molten metal joint surface. The electronic device according to appendix 5, wherein a molten metal layer is formed.
(Supplementary Note 7) The height from the first electrode formation surface to the top of the second molten metal layer is higher than the height from the first electrode formation surface to the top of the first molten metal layer. The electronic device according to attachment 6.
(Supplementary note 8) The electronic device according to supplementary note 6 or 7, wherein a diameter of the second molten metal joint surface is larger than a diameter of the first molten metal joint surface.
(Supplementary Note 9) A first electronic component including a first electrode terminal and a first alignment terminal, and a second electronic component including a second electrode terminal and a second alignment terminal are the first electronic component. A first joint between the electrode terminal and the second electrode terminal, and a second joint between the first alignment terminal and the second alignment terminal. A method of manufacturing an electronic device to be joined,
An inter-electrode molten metal layer is provided between the first electrode terminal and the second electrode terminal, and the inter-alignment terminal melting is performed between the first alignment terminal and the second alignment terminal. A step of disposing the first electronic component and the second electronic component opposite to each other in a state where a metal layer is provided;
Contacting the first alignment terminal and the second alignment terminal through the molten metal layer between the alignment terminals;
Melting the molten metal layer between the alignment terminals and performing the primary alignment while forming the second joint portion;
A step of contacting the molten metal impregnated portion of the first alignment terminal through the molten metal layer between the electrode terminals while impregnating the molten second impregnated portion with the groove-shaped molten metal impregnated portion provided in the first alignment terminal;
Performing a secondary alignment while forming the first joint with the molten metal layer between the electrode terminals,
Manufacturing method of electronic device having

DESCRIPTION OF SYMBOLS 1 Electronic device 2 1st junction part 3 2nd junction part 10 1st electronic component 11 1st element main body 11a 1st electrode formation surface 12 1st electrode terminal 12a 1st molten metal junction surface 13 1st 1 alignment terminal 13a 2nd molten metal joint surface 13b molten metal impregnation part 14 1st molten metal layer 15 2nd molten metal layer 30 2nd electronic component 31 2nd element main body 31a 2nd electrode formation Surface 32 Second electrode terminal 33 Second alignment terminal 34 Third molten metal layer 35 Fourth molten metal layer

Claims (6)

A first electrode terminal provided on a first electrode forming surface provided in the first element body and having a first molten metal bonding surface;
A first alignment terminal provided on the first electrode forming surface and having a second molten metal joint surface provided with a groove-shaped molten metal impregnated portion;
With electronic components.   The electronic component according to claim 1, wherein a first molten metal layer is formed on the first molten metal bonding surface, and a second molten metal layer is formed on the second molten metal bonding surface.   The height from the first electrode formation surface to the top of the second molten metal layer is higher than the height from the first electrode formation surface to the top of the first molten metal layer. The electronic component described.   4. The electronic component according to claim 1, wherein a diameter of the second molten metal bonding surface is larger than a diameter of the first molten metal bonding surface. 5. A first electronic component comprising a first electrode terminal and a first alignment terminal on a first electrode forming surface provided in the first element body;
A second electronic component comprising a second electrode terminal and a second alignment terminal on a second electrode forming surface provided in the second element body;
A first joining portion formed by a first molten metal layer and joining the first electrode terminal and the second electrode terminal;
A second joining portion that is formed by a second molten metal layer and joins the first alignment terminal and the second alignment terminal;
The electronic device in which the second joint portion enters a groove-shaped molten metal impregnation portion of the first alignment terminal. A first electronic component comprising a first electrode terminal and a first alignment terminal; a second electronic component comprising a second electrode terminal and a second alignment terminal; and the first electrode terminal Electrons that are joined by interposing a first joint between the second electrode terminal and a second joint between the first alignment terminal and the second alignment terminal. A device manufacturing method comprising:
An inter-electrode molten metal layer is provided between the first electrode terminal and the second electrode terminal, and the inter-alignment terminal melting is performed between the first alignment terminal and the second alignment terminal. A step of disposing the first electronic component and the second electronic component opposite to each other in a state where a metal layer is provided;
Contacting the first alignment terminal and the second alignment terminal through the molten metal layer between the alignment terminals;
Melting the molten metal layer between the alignment terminals and performing the primary alignment while forming the second joint portion;
A step of contacting the molten metal impregnated portion of the first alignment terminal through the molten metal layer between the electrode terminals while impregnating the molten second impregnated portion with the groove-shaped molten metal impregnated portion provided in the first alignment terminal;
Performing a secondary alignment while forming the first joint with the molten metal layer between the electrode terminals,
Manufacturing method of electronic device having

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