JP2019151003A - Substrate member, liquid ejection head, liquid ejection unit, device for ejecting liquid, manufacturing method for substrate member - Google Patents

Abstract

To provide a substrate member in which a fine structure such as a through-groove is formed, the substrate member being manufactured at a high yielding percentage without breaking the fine structure.SOLUTION: In a substrate member 200 in which a plurality of through-grooves 62 are arrayed in one direction, side wall parts 63 defining the through-grooves 62 adjacent to each other are in the form of a cantilever, in which one end orthogonal to the array direction of the through-grooves 62 are connected to a substrate body. In each side wall part 63, the areas of the end faces 64a, 65a of the end parts 64, 65 in the thickness direction of the substrate body are different one from the other. In addition, in each side wall part 63, the end face 64a of the one end part 64 of the ends in the thickness direction of the substrate body is located in a further receding position than the end face of the substrate body.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a substrate member, a liquid ejection head, a liquid ejection unit, an apparatus for ejecting liquid, and a method for manufacturing the substrate member.

  Nozzle holes for discharging liquid drops such as ink, liquid chambers (hereinafter also referred to as “individual liquid chambers”, “pressurized liquid chambers”, etc.) that communicate with the nozzle holes and store liquids, and individual liquids There is known a liquid discharge head including a common liquid chamber communicating with a chamber and an electromechanical conversion element such as a piezoelectric element that generates pressure fluctuation in each individual liquid chamber.

  In such a liquid discharge head, liquid is supplied to each individual liquid chamber through a common liquid chamber, and a pressure fluctuation is generated in the individual liquid chamber by a piezoelectric element to which a voltage is applied, thereby discharging a droplet from the nozzle. Can be made.

  The above-described droplet discharge head is a substrate bonded to a nozzle plate in which nozzle holes are formed or a substrate in which a liquid chamber is formed, and is a part of a flow path for supplying liquid to the liquid chamber from the outside A substrate member in which an opening to be formed is formed. Such a substrate member is formed, for example, by applying etching to a silicon substrate.

In recent years, there has been a demand for a liquid ejection head capable of ejecting particularly fine droplets with high accuracy, and the substrate is finely processed, and each member is miniaturized and mounted with high density. Yes.
However, in the liquid discharge head in which the nozzles are arranged at high density, the pressure fluctuation generated in one individual liquid chamber among the plurality of individual liquid chambers propagates to the common liquid chamber communicating with the individual liquid chamber, and other adjacent liquid chambers There is a possibility that mutual interference (crosstalk) that affects the pressure of the liquid in the individual liquid chamber occurs. When such mutual interference between the individual liquid chambers occurs, the discharge state when the liquid in the individual liquid chambers is discharged as droplets becomes unstable.

  In order to solve this problem, an optimum fluid resistance portion is provided between the individual liquid chamber and the common liquid chamber to converge the residual pressure of the pressurized liquid chamber after droplet discharge, and to maintain the own residual pressure and adjacent one. An ink jet head that suppresses residual pressure propagation to the pressurized liquid chamber and suppresses crosstalk has been proposed (see, for example, Patent Document 1).

  When a fine structure such as a fluid resistance portion is formed in the opening in order to suppress crosstalk as in the ink-jet head of Patent Document 1, the fine structure may be destroyed in the manufacturing process.

  For example, when a through-groove is formed on a substrate with a dry etching device, a support substrate is attached using a resin tape that can be peeled off in a later process so that the device susceptor is not exposed to plasma and damaged when the substrate penetrates. However, when the resin tape is peeled after dry etching, the fine pattern formed by the adhesive force of the resin tape may be damaged such as breaking or chipping.

  With the recent increase in the density of liquid discharge heads, the patterns that are formed become finer, so the above problems are not solved and high-precision substrate members can be manufactured with high yield. It becomes increasingly difficult.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate member that is manufactured with a high yield without destroying the microstructure, in the substrate member on which a microstructure such as a through groove is formed.

  In order to achieve such an object, a substrate member according to the present invention is a substrate member in which a plurality of through grooves arranged in one direction are formed, and a side wall portion that defines the adjacent through grooves is formed through the through holes. One end portion in a direction orthogonal to the direction in which the grooves are arranged has a cantilever shape connected to the substrate body, and the side wall portion has an area of an end surface of the end portion in the thickness direction of the substrate body as one and the other. It is a board | substrate member characterized by differing. Further, the substrate member is formed with a plurality of through grooves arranged in one direction, and the side wall portion defining the adjacent through grooves is one end in a direction orthogonal to the arrangement direction of the through grooves Is a cantilever shape connected to the substrate body, and the side wall portion has an end surface of one end portion in a thickness direction of the substrate body at a position recessed from the end surface of the substrate body. A substrate member characterized by the above.

  According to the present invention, it is an object of the present invention to provide a substrate member that is manufactured with a high yield without destroying the microstructure in the substrate member on which a microstructure such as a through groove is formed.

It is the top view and sectional drawing which show an example of the board | substrate member concerning this invention. It is a side view which shows the example of the shape of one edge part among the thickness direction edge parts of a side wall part. It is a top view from the nozzle surface side of the liquid discharge head concerning this invention. FIG. 4 is a cross-sectional view of the liquid discharge head according to the present invention, which is a cross-sectional view taken along X1-X2, Y1-Y2, and Y3-Y4 in FIG. It is a top view which shows an example of the sub-frame board | substrate of the liquid discharge head concerning this invention. It is sectional drawing which shows an example of the sub-frame board | substrate of the liquid discharge head concerning this invention. It is explanatory drawing which shows the manufacturing process (process AD) of the board | substrate member of Example 1. FIG. It is explanatory drawing which shows the manufacturing process (process EH) of the board | substrate member of Example 1. FIG. It is explanatory drawing which shows the manufacturing process (process AD) of the board | substrate member of Example 2. FIG. It is explanatory drawing which shows the manufacturing process (process EH) of the board | substrate member of Example 2. FIG. It is sectional drawing of the board | substrate member of Example 3 and Example 4. FIG. It is the top view and sectional drawing which show an example of the conventional board | substrate member. It is principal part plane explanatory drawing of an example of the apparatus which discharges the liquid concerning this invention. It is principal part side explanatory drawing of an example of the apparatus which discharges the liquid concerning this invention. It is principal part top explanatory drawing of an example of the liquid discharge unit concerning this invention. It is front explanatory drawing of an example of the liquid discharge unit concerning this invention.

  Hereinafter, a substrate member, a liquid discharge head, a liquid discharge unit, an apparatus for discharging liquid, and a method for manufacturing a substrate member according to the present invention will be described with reference to the drawings. The present invention is not limited to the embodiments described below, and other embodiments, additions, modifications, deletions, and the like can be changed within a range that can be conceived by those skilled in the art, and any aspect is possible. As long as the functions and effects of the present invention are exhibited, the scope of the present invention is included.

An example of the substrate member according to the present invention is shown in FIG.
FIG. 1A is a plan view (top view) of a substrate member, and FIGS. 1B and 1C are cross-sectional views taken along line YY of FIG. 1A in the manufacturing process.
As shown in FIG. 1, the substrate member 200 according to the present embodiment includes a plurality of through grooves 62, comb teeth 61 including a plurality of side walls 63 that define the through grooves 62, and through holes 60.
The side wall portion 63 that defines the through groove 62 has a cantilever shape in which one end portion in a direction (X direction) orthogonal to the arrangement direction (Y direction) of the through grooves 62 is connected to the substrate body.

In the substrate member 200 of the first embodiment shown in the cross-sectional view of FIG. 1B, the end surfaces (64a, 65a) of the end portions (64, 65) of the side wall portion 63 in the thickness direction (Z direction) of the substrate body. Are different from one to the other.
In the cross-sectional view shown in FIG. 1B, the support substrate 600 is attached to the substrate member 200 via the resin tape 610 in the manufacturing process, but the side wall 63 that contacts the resin tape 610 is shown. The area of the end surface 64 a of the end portion 64 is smaller than the area of the end surface 65 a of the other end portion 65.

FIG. 1B shows an example in which the shape of one end portion 64 side of the side wall portion 63 is a wedge shape, but the shape of the end surface 64a may be smaller than the area of the end surface 65a. It is not limited to this. An example of another shape of the end portion 64 of the side wall portion 63 is shown in FIG. For example, a shape in which a step is formed in the cross section of the end portion 64 may be used as shown in FIG. 2A, or a shape in which a notch portion 64b is formed as shown in FIG. Good.
As will be described later, when the substrate member 200 is applied to a liquid discharge head, the end portion 64 preferably has a shape that does not trap bubbles contained in the liquid in the flow path or the liquid chamber.

In the substrate member 200 of the second embodiment shown in the cross-sectional view of FIG. 1C, one end portion 64 of the end portions (64, 65) of the side wall portion 63 in the thickness direction (Z direction) of the substrate body. The end face 64a is in a position recessed from the end face of the substrate body.
In the cross-sectional view shown in FIG. 1C, the support substrate 600 is attached via the resin tape 610 in the manufacturing process, but the position of the end face 64a facing the resin tape 610 is the substrate body. It is located inside the end face.

In FIG. 1C, the shape of the side wall 63 on one end 64 side is the same as the shape on the other end 65 side, and in this case, the area of the end face 64a is also equal to the area of the end face 65a. The end 64 may have a shape as shown in FIG. 1B or FIG.
That is, the side wall portion 63 has an area of the end surface 64a of one end portion 64 at a position recessed toward the inner side of the through hole from the end surface of the substrate body in the thickness direction (Z direction) of the substrate body. The shape may be smaller than the area of the end face 65a of 65.

  FIG. 12 shows an example of a conventional substrate member 201. As shown in FIG. 12B, since the end surface 64a of the side wall 63 formed in the through hole of the conventional substrate member 201 is in close contact with the resin tape 610, the adhesive of the resin tape 610 when the resin tape 610 is peeled off. The side wall 63 may be damaged or broken by force.

  On the other hand, the substrate member 200 of this embodiment shown in FIGS. 1B and 1C has a contact area between the end surface 64a of the end portion 64 of the side wall portion 63 of the formed microstructure and the resin tape 610. Since the end face 64a is not in contact with the resin tape 610, the side wall portion 63 is not broken when the resin tape 610 is peeled off, and thus it is manufactured with a high yield.

Further, the substrate member 200 of the present embodiment including the comb-tooth portion 61 including the side wall portion 63 manufactured with high accuracy is excellent in durability and reliability, and therefore, is applied as a substrate member constituting the liquid ejection head. Thus, propagation of the residual pressure can be effectively suppressed, and crosstalk can be reduced.
Hereinafter, a liquid discharge head including the substrate member 200 of the present embodiment and a method for manufacturing the substrate member 200 will be described.

As an example of the liquid discharge head of the present embodiment, a liquid discharge head that includes a piezoelectric actuator and discharges liquid droplets from nozzle holes will be described with reference to FIGS.
FIG. 3 is a plan view of the nozzle surface side. 4A shows the X1-X2 cross section of FIG. 3, FIG. 4B shows the Y1-Y2 cross section of FIG. 3, and FIG. 4C shows the Y3-Y4 cross section of FIG.

  The liquid discharge head according to the present embodiment includes a first substrate member (nozzle substrate) 300 in which nozzle holes 6 for discharging droplets are formed, and a liquid that is bonded to the first substrate member 300 and communicates with the nozzle holes 6. A second substrate member (actuator substrate) 100 in which the chamber 5 is formed, and a third substrate member (sub-substrate) bonded to the second substrate 100 and having a flow path for supplying liquid to the liquid chamber 5. And a frame 400 in which a part of the common liquid chamber 9 is formed.

The third substrate member 200 includes a through hole 60 that forms the flow path and a plurality of through grooves 62. The plurality of through grooves 62 are defined by a plurality of side wall portions 63, and a plurality of side wall portions 63 form comb teeth portions 61.
The side wall portion 63 has a cantilever shape in which one end portion in a direction orthogonal to the arrangement direction of the through grooves 62 is connected to the substrate body.

In the first embodiment, the areas of the end surfaces (64a, 65a) of the end portions (64, 65) in the thickness direction (Z direction) of the substrate body of the side wall portion 63 are different from each other.
In the second embodiment, the end surface 64a of one end portion 64 of the end portions (64, 65) of the side wall portion 63 in the thickness direction (Z direction) of the substrate body is at a position recessed from the end surface of the substrate body. is there. In this case, the side wall portion 63 has an area of the end surface 64a of one end portion 64 at a position recessed toward the inner side of the through hole from the end surface of the substrate body in the thickness direction (Z direction) of the substrate body. The shape may be smaller than the area of the end surface 65a of the portion 65.

As shown in FIG. 4, the liquid discharge head according to the present embodiment is formed by bonding the actuator substrate 100, the subframe substrate 200, and the nozzle substrate 300.
In addition, a passivation film 50 that protects the lead wiring 40 and a lead wiring pad 41 that is an opening are formed, and the wiring pattern 42 is formed at a location that becomes a joint with the subframe substrate 200.

The actuator substrate 100 includes a piezoelectric element 2 that generates liquid discharge energy and a diaphragm 3, and includes a pressurized liquid chamber partition wall 4, a liquid chamber (pressurized liquid chamber) 5, a fluid resistance portion 7, and a liquid introduction hole 8. Is formed. Each pressurized liquid chamber 5 is partitioned by a pressurized liquid chamber partition wall 4.
The pressurized liquid chamber 5 of the actuator substrate 100, the fluid resistance portion 7, the liquid introduction hole 8, and the through groove 62 of the subframe substrate 200 constitute an individual flow path. That is, the through groove 62 of the subframe substrate 200 communicates with the pressurized liquid chamber of the actuator substrate 100.
Nozzle holes 6 are formed in the nozzle substrate 300 at positions corresponding to the individual pressurized liquid chambers 5.

The piezoelectric element 2 is formed on the side facing the pressurizing liquid chamber 5 through the vibration plate 3 forming a partial wall surface of the pressurizing liquid chamber 5 and the vibration plate 3.
A part of the common liquid chamber 9 is formed in the frame 400 joined to the subframe substrate 200. That is, the common liquid chamber 9 is configured by the through hole 60 of the subframe substrate 200 and the flow path formed in the frame 400.

  The piezoelectric element 2 formed on the side facing the pressurized liquid chamber 5 through the vibration plate 3 is formed of the piezoelectric body 12 on the common electrode 10 and the individual electrode 11.

As shown in FIG. 4B, the side wall portion 63 of the sub-frame substrate 200 has an end surface 65a having a large area among end surfaces in the thickness direction of the substrate body formed on the actuator substrate 100, specifically, the actuator substrate 100. Bonded to the insulating film (passivation film 50) thus formed (deposited). In addition, an end surface having a small area among end surfaces in the thickness direction of the substrate body of the side wall portion 63 faces the common liquid chamber 9. (The tapered end portion side shown in FIG. 4B faces the common liquid chamber 9.)
Accordingly, a bonding area between the sub-frame substrate 200 and the actuator substrate 100 can be ensured, and the liquid can be smoothly supplied from the common liquid chamber 9 to the through groove 62.

  The through groove 62 of the subframe substrate 200 connects the common liquid chamber 9 and the liquid introduction hole 8, so that the residual pressure component of the pressure wave generated in the pressurized liquid chamber 5 propagates to the common liquid chamber 9. Since this can be suppressed, crosstalk between the adjacent pressurized liquid chambers 5 can be reduced.

In the droplet discharge head, a nozzle hole for discharging recording liquid based on image data from a control unit (not shown) in a state where each pressurized liquid chamber 5 is filled with a liquid, for example, a recording liquid (ink). A voltage pulse (for example, a pulse of 20 V) is applied to the individual electrode 11 corresponding to 6 through the connection hole 30 formed in the lead wiring 40 and the interlayer insulating film 45 by the oscillation circuit. The piezoelectric body 12 itself contracts in the direction parallel to the diaphragm 3 due to the electrostrictive effect by applying the voltage pulse, and the diaphragm 3 bends in the direction of the pressurized liquid chamber 5. As a result, the pressure in the pressurized liquid chamber 5 rises rapidly, and the recording liquid is ejected from the nozzle holes 6 communicating with the pressurized liquid chamber 5.
After application of the pulse voltage, as the contracted piezoelectric body 12 returns to its original position, the diaphragm 3 also returns to its original position, and the inside of the pressurized liquid chamber 5 becomes negative compared to the inside of the liquid introduction hole 8, and the external The ink supplied from the liquid supply port 66 through the liquid droplet supply port 66 is supplied from the common liquid chamber 9 and the liquid introduction hole 8 to the pressurized liquid chamber 5 through the fluid resistance portion 7.
By repeating the above operation, droplets are continuously ejected, and, for example, an image is formed on a recording medium (paper) disposed facing the droplet ejection head.

  The substrate member manufacturing method of the present embodiment is a manufacturing method of the substrate member 200 in which a plurality of through grooves 62 arranged in one direction are formed, and the side wall portion 63 that defines the adjacent through grooves 62 is formed as follows. Etching is included so that one end portion in a direction orthogonal to the arrangement direction of the through grooves 62 has a cantilever shape connected to the substrate body.

And formation of the side wall part 63 includes the following steps (1) and / or (2).
(1) A step of etching so that the areas of the end faces (64a, 65a) of the end portions (64, 65) in the thickness direction of the substrate body are different in one and the other (2) The process of etching so that the end surface 64a of one end part 64 may be in a shape that is recessed from the end surface of the substrate body.

  In the formation of the side wall part 63, the end surface 64a of the one end part 64 in the thickness direction of the substrate body is in a state where the contact area with the other member (for example, the resin tape 610) is minimized or not in contact. It is preferable to perform etching.

When the comb-tooth portion 61 is formed by dry etching, the support substrate 600 is pasted with a resin tape 610 (for example, a thermal peeling tape) that can be peeled later so that the susceptor of the etcher is not exposed to plasma when the substrate penetrates. Since the comb teeth 61 formed by dry etching have a small width and a long side wall 63 constituting each comb, the comb teeth 61 may be damaged by stress when the resin tape 610 is peeled off.
On the other hand, in this embodiment, the comb-tooth part 61 is destroyed by making the contact area of the end surface 64a of the side wall part 63 in contact with the resin tape 610 as small as possible or not contacting as described above. Therefore, the resin tape 610 can be peeled off.

  By applying the substrate member 200 having the comb-tooth portion 61 having the fine structure thus manufactured to the liquid discharge head, it is possible to effectively suppress the propagation of the residual pressure from the adjacent individual pressurized liquid chamber. Stable droplet ejection characteristics can be obtained without being affected by the driving state of the adjacent individual pressurized liquid chambers.

Example 1
FIG. 5 is a plan view of a substrate member (subframe substrate) 200 constituting the liquid discharge head according to the present embodiment, and FIG. 6 is a sectional view thereof.
6A is a cross-sectional view of the comb-tooth portion 61 (the through groove 62 and the side wall portion 63) indicated by AA in FIG. 5, and FIG. 6B is a cross-sectional view of the right side of FIG. It is sectional drawing of the counterbore part 67 shown by BB.

Hereinafter, the first manufacturing method of the substrate member 200 shown in FIGS. 5 and 6 will be described.
When the substrate member 200 of the present embodiment is manufactured as a sub-frame substrate constituting the liquid ejection head, a pattern corresponding to a plurality of chips is formed on the wafer. 62 and the side wall part 63) and the manufacturing process for forming the counterbore part 67 located in the actuator part 68 of the actuator substrate 100 will be described with reference to FIGS.

  7 and 8 are cross-sectional views of the comb-tooth portion 61 (the through groove 62 and the side wall portion 63) indicated by AA in FIG. b) is a cross-sectional view of a counterbore part 67 indicated by BB in FIG. 5.

[Process A]
Step A in FIG. 7 will be described.
A silicon oxide film 51 is formed by a P-CVD method (for example, a film thickness of 1 μm) on the surface of a silicon single crystal substrate (for example, a film thickness of 400 μm) having a plane orientation (110) as the subframe substrate 200. The silicon oxide film 51 is used as a mask material for dry etching when forming a gap in the counterbore portion 67 later.

The film formed on the surface may be other than a silicon oxide film as long as it can serve as a mask for dry etching and can be removed by a simple method.
Moreover, the film thickness should just be a film thickness which is not lost at the time of the etching of the space | gap of the counterbore part 67. FIG.

[Process B]
Step B in FIG. 7 will be described.
In order to protect the susceptor of the etching apparatus from plasma damage when penetrating the subframe substrate 200 during dry etching of the comb-tooth portion 61, a resin tape 610 that can be peeled off later is provided on the back surface of the subframe substrate 200. A support substrate 600 (for example, a silicon substrate) is attached. As the resin tape 610, for example, a thermal peeling type can be applied.

  Note that in the case where the susceptor of the etching apparatus can be protected from damage during penetration with only the resin tape 610, the support substrate 600 may not be attached.

[Process C]
Step C in FIG. 7 will be described.
A resist 52 is applied on the silicon oxide film 51, and the silicon oxide film 51 at a portion that becomes a gap between the comb-tooth portion 61 and the counterbore portion 67 is removed by a lithoetch method. Thereafter, the resist 52 is removed.

[Process D]
Step D in FIG. 7 will be described.
A resist 52 is applied again, and a portion corresponding to the comb tooth portion 61 shown in FIG.
In the counterbore part 67 shown in (b), the gap is etched after the through-groove 62 is formed.

[Process E]
Step E in FIG. 8 will be described.
In the comb tooth portion 61 shown in FIG. 5A, the bulk Si of the comb tooth portion 61 is etched by dry etching and penetrated. As a dry etching method, for example, a Bosch process can be used with an ICP etcher.

At this time, the etching is performed so that the contact area between the end surface 64a of the end portion 64 of the side wall portion 63 constituting the comb tooth portion 61 and the resin tape 610 is as small as possible.
For example, after the resin tape 610 is exposed, the end portion 64 of the side wall portion 63 is side-etched by changing the etching conditions so as to be slightly isotropic etching conditions.
Thereby, the area of the end surface 64 a of the end portion 64 of the side wall portion 63 is smaller than the area of the end surface 65 a of the other end portion 65. Such a cross-sectional shape on the end 64 side includes a wedge shape as shown in the figure, but is not limited thereto.
In the counterbore part 67 shown in (b), as in the step D, it is covered with a resist 52.

[Process F]
Step F in FIG. 8 will be described.
In the counterbore part 67 shown in FIG. 5B, the silicon substrate in the gap of the counterbore part 67 is etched by about 20 μm using the silicon oxide film 51 as an etching mask.

[Process G]
Process G in FIG. 8 will be described.
The resin tape 610 and the support substrate 600 are peeled off and removed.
When a thermal peeling tape is applied as the resin tape 610, the support substrate 600 can be easily peeled from the subframe substrate 200 by heating to a peeling temperature (for example, 150 ° C.) or higher with a hot plate or the like.

  Since the side wall part 63 which comprises the comb-tooth part 61 is a fine pattern, when peeling the bonded resin tape 610, it may be damaged. In this embodiment, since the end surface 64a of the end portion 64 is etched so that the contact area with the resin tape 610 becomes as small as possible in the process E, the influence of the adhesive force is reduced to prevent the side wall portion 63 from being damaged. be able to.

[Process H]
Step H in FIG. 8 will be described.
The silicon oxide film 51 is removed with an HF solution, and the substrate member 200 of this embodiment is obtained.

  In applying the substrate member 200 of the present embodiment to a liquid discharge head, if the liquid to be discharged is a liquid that erodes silicon, the film is resistant to the liquid and has sufficient adhesion to the silicon substrate. Is preferably formed. For example, it is preferable to form a silicon oxide film, a tantalum oxide film, or the like having an appropriate thickness so as to cover the entire surface of the obtained substrate member 200.

  As described above, the substrate member 200 of the present embodiment is manufactured with a high yield without breaking the comb-tooth portion 61 having a fine structure. Further, by applying the manufactured substrate member 200 as a subframe substrate to a liquid discharge head, stable droplet discharge characteristics can be obtained.

(Example 2)
A second manufacturing method of the substrate member 200 will be described.
As in the first embodiment, a manufacturing process for forming the comb-tooth portion 61 (the through groove 62 and the side wall portion 63) and the counterbore portion 67 located in the actuator portion 68 of the actuator substrate 100 will be described with reference to FIGS.
9 and 10 are cross-sectional views of the comb tooth portion 61 (the through groove 62 and the side wall portion 63) indicated by AA in FIG. b) is a cross-sectional view of a counterbore part 67 indicated by BB in FIG. 5.

[Process A]
Process A in FIG. 9 will be described.
A silicon oxide film 51 serving as a dry etching mask is formed on both surfaces of a silicon single crystal substrate (for example, 400 μm thick) as a subframe substrate 200 by a thermal orientation method (for example, each film thickness is 1 μm). )

The film formed on the surface may be other than a silicon oxide film as long as it can serve as a mask for dry etching and can be removed by a simple method.
Moreover, the film thickness should just be a film thickness which is not lost at the time of the etching of the space | gap of the counterbore part 67. FIG.

[Process B]
Step B in FIG. 9 will be described.
In the comb tooth portion 61 shown in FIG. 6A, the silicon oxide film 51 on one surface (back surface) of the region where the comb tooth portion 61 is formed is removed by a lithoetch method. In the figure, the removed region is indicated by 51a.
If the silicon oxide film 51 remains in the region, when the comb-tooth portion 61 is etched and penetrates through the subframe substrate 200, the silicon oxide film 51 may be buckled and cracked due to the compressive stress of the silicon oxide film 51. Because.

[Process C]
Step C in FIG. 9 will be described.
In order to protect the susceptor of the etching apparatus from plasma damage when penetrating the subframe substrate 200 during dry etching of the comb-tooth portion 61, a resin tape 610 that can be peeled off later is provided on the back surface of the subframe substrate 200. A support substrate 600 (for example, a silicon substrate) is attached. As the resin tape 610, for example, a thermal peeling type can be applied.

  Note that in the case where the susceptor of the etching apparatus can be protected from damage during penetration with only the resin tape 610, the support substrate 600 may not be attached.

[Process D]
Step D in FIG. 9 will be described.
A resist 52 is applied, and the silicon oxide film 51 at a portion that becomes a gap between the comb-tooth portion 61 and the counterbore portion 67 is removed by a lithoetch method. Thereafter, the resist 52 is removed.

[Process E]
Step E in FIG. 10 will be described.
A resist 52 is applied again, and a portion corresponding to the comb tooth portion 61 shown in FIG.
In the counterbore part 67 shown in (b), the gap is etched after the through-groove 62 is formed.

[Process F]
The process F in FIG. 10 will be described.
In the comb tooth portion 61 shown in FIG. 5A, the bulk Si of the comb tooth portion 61 is etched by dry etching and penetrated. As a dry etching method, for example, a Bosch process can be used with an ICP etcher.

At this time, etching is performed so that the cross-sectional shape of the side wall portion 63 constituting the comb tooth portion 61 on the end portion 64 side becomes a wedge shape as shown in the figure. For example, after the resin tape 610 is exposed, the end portion 64 of the side wall portion 63 is side-etched by changing the etching conditions so as to be slightly isotropic etching conditions.
Thereby, the area of the end surface 64 a of the end portion 64 of the side wall portion 63 is smaller than the area of the end surface 65 a of the other end portion 65.
In the counterbore part 67 shown in (b), as in the step D, it is covered with a resist 52.

In the present embodiment, there is a step due to the removal of the silicon oxide film 51 of the comb tooth portion 61 in the step B, and the end face 64 a of the side wall portion 63 is not in contact with the resin tape 610.
The cross-sectional shape of the side wall 63 on the end 64 side is not limited to the wedge shape as long as the area of the end face 64a is smaller than the area of the end face 65a of the other end 65.

[Process G]
The process G in FIG. 10 will be described.
The resin tape 610 and the support substrate 600 are peeled off and removed.
When a thermal peeling tape is applied as the resin tape 610, the support substrate 600 can be easily peeled from the subframe substrate 200 by heating to a peeling temperature (for example, 150 ° C.) or higher with a hot plate or the like.

  Since the side wall portion 63 constituting the comb tooth portion 61 is a fine pattern, the side wall portion 63 may be damaged when the bonded resin tape 610 is peeled off. In this embodiment, the end portion 64 of the side wall portion 63 is Since it is not in contact with the resin tape 610, the side wall 63 can be prevented from being damaged without being affected by the adhesive force of the resin tape 610.

[Process H]
Step H in FIG. 8 will be described.
The silicon oxide film 51 is removed with an HF solution, and the substrate member 200 of this embodiment is obtained.

  In applying the substrate member 200 of the present embodiment to a liquid discharge head, if the liquid to be discharged is a liquid that erodes silicon, the film is resistant to the liquid and has sufficient adhesion to the silicon substrate. Is preferably formed. For example, it is preferable to form a silicon oxide film, a tantalum oxide film, or the like having an appropriate thickness so as to cover the entire surface of the obtained substrate member 200.

The substrate member 200 of this embodiment can reliably prevent the comb-tooth portion 61 having a fine structure from being damaged when the resin tape 610 is peeled off, and is manufactured with a high yield.
In addition, by applying the manufactured substrate member 200 as a sub-frame substrate to a liquid discharge head, a high-quality and highly reliable actuator can be realized, and stable droplet discharge characteristics can be obtained.

(Example 3)
A method for manufacturing the substrate member 200 in which the cross section of the comb tooth portion 61 (the through groove 62 and the side wall portion 63) shown in FIG. 5 has the shape shown in FIG. 11A will be described.
In the substrate member 200 of the present embodiment, the end surface 64a of one end portion 64 of the side wall portion 63 in the thickness direction of the substrate body is in a position recessed from the end surface of the substrate body. That is, it is located inside by the length indicated by d in the figure.

In the process B shown in FIG. 9 of the manufacturing process of the second embodiment described above, the silicon oxide film 51 on one surface (back surface) of the region where the comb-tooth portion 61 is formed is removed by the litho-etching method, and then etching is performed. Thus, a recess having a length indicated by d is formed.
Other processes can be manufactured in the same manner as in Example 2 except that the etching process is not performed so that the shape on the end portion 64 side becomes a wedge shape in the process F.

Example 4
A method for manufacturing the substrate member 200 in which the cross section of the comb tooth portion 61 (the through groove 62 and the side wall portion 63) shown in FIG. 5 has the shape shown in FIG. 11B will be described.
In the substrate member 200 of the present embodiment, the end surface 64a of one end portion 64 of the side wall portion 63 in the thickness direction of the substrate body is in a position recessed from the end surface of the substrate body, and the area of the end surface 64a of the end portion 64 is larger. The area of the other end portion 65 is smaller than the area of the end surface 65a.

In the process B shown in FIG. 9 of the manufacturing process of the second embodiment described above, the silicon oxide film 51 on one surface (back surface) of the region where the comb-tooth portion 61 is formed is removed by the litho-etching method, and then etching is performed. Thus, a recess having a length indicated by d is formed.
Other processes can be produced in the same manner as in Example 2.

The substrate members 200 according to the third and fourth embodiments can be reliably prevented from being damaged when the comb-tooth portions 61 having a fine structure are peeled off when the resin tape 610 is peeled off, and are manufactured with a high yield.
In addition, by applying the manufactured substrate member 200 as a sub-frame substrate to a liquid discharge head, a high-quality and highly reliable actuator can be realized, and stable droplet discharge characteristics can be obtained.

Next, a liquid discharge unit and a device for discharging a liquid according to the present invention will be described.
The liquid discharge unit of this embodiment includes the substrate member or the liquid discharge head of the above-described embodiment.
In addition, the apparatus for discharging a liquid according to the present embodiment includes the substrate member or the liquid discharge head according to the above-described embodiment.

  An example of an apparatus for ejecting liquid according to the present invention will be described with reference to FIGS. FIG. 13 is an explanatory plan view of the main part of the apparatus, and FIG. 14 is an explanatory side view of the main part of the apparatus.

  This apparatus is a serial type apparatus, and the carriage 403 reciprocates in the main scanning direction by the main scanning moving mechanism 493. The main scanning movement mechanism 493 includes a guide member 401, a main scanning motor 405, a timing belt 408, and the like. The guide member 401 spans the left and right side plates 491A and 491B and holds the carriage 403 so as to be movable. The carriage 403 is reciprocated in the main scanning direction by the main scanning motor 405 via the timing belt 408 spanned between the driving pulley 406 and the driven pulley 407.

  A liquid discharge unit 440 in which the liquid discharge head 404 and the head tank 441 according to the present invention are integrated is mounted on the carriage 403. The liquid discharge head 404 of the liquid discharge unit 440 discharges, for example, yellow (Y), cyan (C), magenta (M), and black (K) liquids. The liquid ejection head 404 is mounted with a nozzle row composed of a plurality of nozzle holes 6 arranged in the sub-scanning direction orthogonal to the main scanning direction and with the ejection direction facing downward.

  The liquid stored in the liquid cartridge 450 is supplied to the head tank 441 by the supply mechanism 494 for supplying the liquid stored outside the liquid discharge head 404 to the liquid discharge head 404.

  The supply mechanism 494 includes a cartridge holder 451 that is a filling unit for mounting the liquid cartridge 450, a tube 456, a liquid feeding unit 452 including a liquid feeding pump, and the like. The liquid cartridge 450 is detachably attached to the cartridge holder 451. Liquid is fed from the liquid cartridge 450 to the head tank 441 by the liquid feeding unit 452 via the tube 456.

  This apparatus includes a transport mechanism 495 for transporting the paper 410. The transport mechanism 495 includes a transport belt 412 serving as transport means, and a sub-scanning motor 416 for driving the transport belt 412.

  The conveyance belt 412 adsorbs the paper 410 and conveys it at a position facing the liquid ejection head 404. The transport belt 412 is an endless belt and is stretched between the transport roller 413 and the tension roller 414. The adsorption can be performed by electrostatic adsorption or air suction.

  The transport belt 412 rotates in the sub-scanning direction when the transport roller 413 is rotationally driven by the sub-scanning motor 416 via the timing belt 417 and the timing pulley 418.

Further, on one side of the carriage 403 in the main scanning direction, a maintenance / recovery mechanism 420 that performs maintenance / recovery of the liquid ejection head 404 is disposed on the side of the transport belt 412.
The maintenance / recovery mechanism 420 includes, for example, a cap member 421 for capping the nozzle surface (surface on which the nozzle holes 6 are formed) of the liquid ejection head 404, a wiper member 422 for wiping the nozzle surface, and the like.

  The main scanning movement mechanism 493, the supply mechanism 494, the maintenance / recovery mechanism 420, and the transport mechanism 495 are attached to a housing including the side plates 491A and 491B and the back plate 491C.

In this apparatus configured as described above, the paper 410 is fed and sucked onto the transport belt 412, and the paper 410 is transported in the sub-scanning direction by the circular movement of the transport belt 412.
Therefore, the liquid ejection head 404 is driven in accordance with the image signal while moving the carriage 403 in the main scanning direction, thereby ejecting liquid onto the stopped paper 410 to form an image.

  As described above, since the apparatus for ejecting liquid according to the present embodiment includes the liquid ejection head according to the present embodiment described above, a high-quality image can be stably formed.

  Next, a liquid discharge unit according to the present invention will be described with reference to FIG. FIG. 15 is an explanatory plan view of a main part of an example of the liquid discharge unit.

  The liquid discharge unit includes a casing portion composed of side plates 491A and 491B and a back plate 491C, a main scanning moving mechanism 493, a carriage 403, and a liquid among the members constituting the liquid discharge device. The discharge head 404 is configured.

  Note that a liquid discharge unit in which at least one of the above-described maintenance and recovery mechanism 420 and the supply mechanism 494 is further attached to, for example, the side plate 491B of the liquid discharge unit may be configured.

  Next, still another example of the liquid discharge unit according to the present invention will be described with reference to FIG. FIG. 16 is an explanatory front view of the unit.

  This liquid discharge unit includes a liquid discharge head 404 to which a flow path component 444 is attached, and a tube 456 connected to the flow path component 444.

  The flow path component 444 is disposed inside the cover 442. A head tank 441 may be included instead of the flow path component 444. In addition, a connector 443 that is electrically connected to the liquid ejection head 404 is provided above the flow path component 444.

  In the present application, the “apparatus for discharging liquid” is an apparatus that includes a liquid discharge head or a liquid discharge unit and drives the liquid discharge head to discharge liquid. The apparatus for ejecting liquid includes not only an apparatus capable of ejecting liquid to an object to which liquid can adhere, but also an apparatus for ejecting liquid toward the air or liquid.

  This “apparatus for discharging liquid” may include means for feeding, transporting, and discharging a liquid to which liquid can adhere, as well as a pre-processing apparatus and a post-processing apparatus.

  For example, as a “liquid ejecting device”, an image forming device that forms an image on paper by ejecting ink, a powder is formed in layers to form a three-dimensional model (three-dimensional model) There is a three-dimensional modeling apparatus (three-dimensional modeling apparatus) that discharges a modeling liquid onto the powder layer.

  Further, the “apparatus for ejecting liquid” is not limited to an apparatus in which significant images such as characters and figures are visualized by the ejected liquid. For example, what forms a pattern etc. which does not have a meaning in itself, and what forms a three-dimensional image are also included.

  The above-mentioned “applicable liquid” means that the liquid can be attached at least temporarily and adheres and adheres, or adheres and penetrates. Specific examples include recording media such as paper, recording paper, recording paper, film, and cloth, electronic parts such as electronic substrates and piezoelectric elements, powder layers (powder layers), organ models, and test cells. Yes, unless specifically limited, includes everything that the liquid adheres to.

  The material of the above-mentioned “applicable liquid” is temporary liquid such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, ceramics, building materials such as wallpaper and flooring, textiles for clothing, etc. However, it only needs to be attached.

  In addition, “liquid” includes ink, processing liquid, DNA sample, resist, pattern material, binder, modeling liquid, or a solution and dispersion containing amino acid, protein, calcium, and the like.

  In addition, the “device for ejecting liquid” includes a device in which the liquid ejection head and the device to which the liquid can adhere move relatively, but is not limited thereto. Specific examples include a serial type apparatus that moves the liquid discharge head, a line type apparatus that does not move the liquid discharge head, and the like.

  In addition to the “device for discharging liquid”, a processing liquid coating apparatus for discharging a processing liquid onto a sheet for applying a processing liquid to the surface of the sheet for the purpose of modifying the surface of the sheet, or a raw material There is an injection granulator for granulating raw material fine particles by spraying a composition liquid dispersed in a solution through a nozzle.

  A “liquid ejection unit” is a unit in which functional parts and mechanisms are integrated with a liquid ejection head, and is an assembly of parts related to liquid ejection. For example, the “liquid discharge unit” includes a combination of at least one of a head tank, a carriage, a supply mechanism, a maintenance / recovery mechanism, and a main scanning movement mechanism with a liquid discharge head.

  Here, the term “integrated” refers to, for example, a liquid discharge head, a functional component, and a mechanism that are fixed to each other by fastening, adhesion, engagement, etc., and one that is held movably with respect to the other. Including. Further, the liquid discharge head, the functional component, and the mechanism may be configured to be detachable from each other.

  For example, there is a liquid discharge unit in which a liquid discharge head and a head tank are integrated as in the liquid discharge unit 440 shown in FIG. Also, there are some in which the liquid discharge head and the head tank are integrated by being connected to each other by a tube or the like. Here, a unit including a filter may be added between the head tank and the liquid discharge head of these liquid discharge units.

  In addition, there is a liquid discharge unit in which a liquid discharge head and a carriage are integrated.

  In addition, there is a liquid discharge unit in which the liquid discharge head and the scanning movement mechanism are integrated by holding the liquid discharge head movably on a guide member that constitutes a part of the scanning movement mechanism. As shown in FIG. 15, there is a liquid discharge unit in which a liquid discharge head, a carriage, and a main scanning movement mechanism are integrated.

  Also, there is a liquid discharge unit in which a cap member that is a part of the maintenance / recovery mechanism is fixed to a carriage to which the liquid discharge head is attached, and the liquid discharge head, the carriage, and the maintenance / recovery mechanism are integrated. .

  Further, as shown in FIG. 16, there is a liquid discharge unit in which a tube is connected to a liquid discharge head to which a head tank or a flow path component is attached, and the liquid discharge head and a supply mechanism are integrated. .

  The main scanning movement mechanism includes a guide member alone. The supply mechanism includes a single tube and a single loading unit.

  The “liquid discharge head” is not limited to the pressure generating means to be used. For example, in addition to the piezoelectric actuator as described in the above embodiment (a multilayer piezoelectric element may be used), a thermal actuator using an electrothermal conversion element such as a heating resistor, a diaphragm and a counter electrode are included. An electrostatic actuator or the like may be used.

  In addition, the terms “image formation”, “recording”, “printing”, “printing”, “printing”, “modeling” and the like in the terms of the present application are all synonymous.

2 Piezoelectric element 3 Diaphragm 4 Pressurized liquid chamber partition wall 5 Liquid chamber (pressurized liquid chamber)
6 Nozzle hole 7 Fluid resistance part 8 Common liquid chamber 9 Common droplet supply path 10 Common electrode 11 Individual electrode 12 Piezoelectric body 30 Connection hole 40 Lead wire 41 Lead wire pad 42 Wiring pattern 45 Interlayer insulating film 50 Passivation film 51 Silicon oxide film 52 resist 60 through-hole 61 comb-tooth part 62 through-groove 63 side wall part 64 end part (one end part in the thickness direction)
64a end face 65 end (the other end in the thickness direction)
65a End face 66 Droplet supply port 67 Gap 68 Actuator 100 Actuator substrate (third substrate member)
200 substrate member (second substrate member, subframe substrate)
201 Subframe substrate 300 Nozzle substrate (first substrate member)
400 Frame 404 Liquid discharge head 600 Support substrate 610 Resin tape

JP 2003-237065 A

Claims (10)

A substrate member in which a plurality of through grooves arranged in one direction are formed,
The side wall portion that defines the adjacent through groove is a cantilever shape in which one end portion in a direction orthogonal to the arrangement direction of the through grooves is connected to the substrate body,
The board | substrate member characterized by the area of the end surface of the thickness direction edge part of the said board | substrate body differing in the said side wall part by one side and the other. A substrate member in which a plurality of through grooves arranged in one direction are formed,
The side wall portion that defines the adjacent through groove is a cantilever shape in which one end portion in a direction orthogonal to the arrangement direction of the through grooves is connected to the substrate body,
The said side wall part is a board | substrate member in which the end surface of one edge part is dented rather than the end surface of the said board | substrate body among the thickness direction edge parts of the said board | substrate body.   The side wall portion has an area of an end surface of one end portion at a position recessed from an end surface of the substrate main body in an end portion in the thickness direction of the substrate main body, which is smaller than an area of an end surface of the other end portion. The board | substrate member of Claim 2 characterized by the above-mentioned. A first substrate member formed with nozzle holes for discharging droplets;
A second substrate member bonded to the first substrate member and formed with a liquid chamber communicating with the nozzle hole;
A liquid ejection head comprising: a third substrate member bonded to the second substrate member and having a flow path for supplying a liquid to the liquid chamber;
The third substrate member has a plurality of through grooves arranged in one direction,
The side wall portion that defines the adjacent through groove is a cantilever shape in which one end portion in a direction orthogonal to the arrangement direction of the through grooves is connected to the substrate body,
The board | substrate member characterized by the area of the end surface of the thickness direction edge part of the said board | substrate body differing in the said side wall part by one side and the other. A first substrate member formed with nozzle holes for discharging droplets;
A second substrate member bonded to the first substrate member and formed with a liquid chamber communicating with the nozzle hole;
A liquid ejection head comprising: a third substrate member bonded to the second substrate member and having a flow path for supplying a liquid to the liquid chamber;
The third substrate member has a plurality of through grooves arranged in one direction,
The side wall portion that defines the adjacent through groove is a cantilever shape in which one end portion in a direction orthogonal to the arrangement direction of the through grooves is connected to the substrate body,
The said side wall part is a board | substrate member in which the end surface of one edge part is dented rather than the end surface of the said board | substrate body among the thickness direction edge parts of the said board | substrate body.   The side wall portion has an area of an end surface of one end portion at a position recessed from an end surface of the substrate main body in an end portion in the thickness direction of the substrate main body, which is smaller than an area of an end surface of the other end portion. The board | substrate member of Claim 5 characterized by the above-mentioned.   A liquid discharge unit comprising the liquid discharge head according to claim 4.   An apparatus for discharging a liquid, comprising the liquid discharge head according to claim 4. A method of manufacturing a substrate member in which a plurality of through grooves arranged in one direction are formed,
Etching the side walls defining the adjacent through grooves so that one end in a direction perpendicular to the direction in which the through grooves are arranged has a cantilever shape connected to the substrate body;
The side wall,
The shape of the end surface of the thickness direction end of the substrate body is different in one and the other, and / or the end surface of one end of the thickness direction ends of the substrate body is recessed from the end surface of the substrate body. A substrate member manufacturing method, wherein etching is performed so as to obtain a shape to be a position.   10. The substrate member according to claim 9, wherein, in the etching of the side wall portion, etching is performed in a state where one end portion of the end portions in the thickness direction of the substrate body is not in contact with another member. Manufacturing method.