JP7193334B2 - HEAD CHIP, LIQUID JET HEAD, LIQUID JET RECORDING APPARATUS, AND HEAD CHIP MANUFACTURING METHOD - Google Patents

Description

The present disclosure relates to a head chip and its manufacturing method, a liquid jet head, and a liquid jet recording apparatus.

2. Description of the Related Art A liquid jet recording apparatus having a liquid jet head is known as a recording apparatus for recording an image on a recording medium, and the liquid jet head includes a head chip for jetting liquid. In this liquid jet recording apparatus, liquid is jetted from the head chip onto the recording medium, so that an image is recorded on the recording medium.

The head chip includes an actuator plate that is electrically driven to eject liquid. The actuator plate is provided with a plurality of channels. An electrode is provided on the inner wall of this channel (see Patent Document 1, for example).

JP-A-2001-334657

If the electrode of the actuator plate corrodes, the reliability of the head chip may deteriorate.

Therefore, it is desired to provide a head chip that can improve reliability, a method of manufacturing the same, and a liquid jet head and a liquid jet recording apparatus having the head chip.

A head chip according to an embodiment of the present disclosure is a head chip that includes an actuator plate that applies pressure to a liquid and ejects the liquid, wherein the actuator plate has a first surface and a second surface facing away from the first surface. two surfaces, a channel communicating with a first opening provided in the first surface and having a depth direction in a direction from the first surface to the second surface; The electrode includes a first adhesion film covering a part thereof, and a first anti-corrosion film covering from one end of the first adhesion film on the first surface side to the other end on the second surface side of the first adhesion film. Further, the channel communicates with a second opening provided on the second surface together with the first opening, and the electrode further communicates with a second adhesion film provided on the second opening side of the first adhesion film. and a second anti-corrosion film covering at least part of the second adhesion film from the second surface side in the depth direction.

A liquid ejecting head according to an embodiment of the present disclosure includes a head chip that ejects liquid and a supply unit that supplies liquid to the head chip, and the head chip is the same as the head chip according to the embodiment of the present disclosure. It has a configuration of

A liquid jet recording apparatus according to an embodiment of the present disclosure includes a liquid jet head that jets liquid onto a recording medium, and a storage section that stores the liquid. has a configuration similar to that of the liquid jet head.

A method of manufacturing a head chip according to an embodiment of the present disclosure is a method of manufacturing a head chip that includes an actuator plate that applies pressure to a liquid and ejects the liquid, wherein the step of forming the actuator plate includes: providing a piezoelectric substrate having a second surface facing away from the first surface; forming a first opening in the first surface of the piezoelectric substrate and communicating with the first opening from the first surface to the second surface; a step of forming a channel having a depth direction in a facing direction; a step of forming a first adhesion film on the inner wall of the channel using a vapor deposition method; forming a first corrosion-resistant film covering from one end to the other end on the second surface side, and forming an electrode including the first adhesion film and the first corrosion-resistant film. In addition, the channel communicates with a second opening provided on the second surface as well as the first opening, and the electrode further includes a second adhesion film provided closer to the second opening than the first adhesion film. and a second anti-corrosion film covering at least part of the second adhesion film from the second surface side in the depth direction.

According to the head chip, liquid jet head, liquid jet recording apparatus, and head chip manufacturing method of one embodiment of the present disclosure, corrosion of the electrodes provided on the inner wall of the channel of the actuator plate is suppressed, and reliability is improved. becomes possible.

1 is a perspective view showing a schematic configuration of a liquid jet recording apparatus according to an embodiment of the present disclosure; FIG. 2 is a perspective view showing a schematic configuration of the liquid jet head shown in FIG. 1; FIG. 3 is a perspective view showing a schematic configuration of a liquid jet head chip shown in FIG. 2; FIG. 3 is another perspective view showing the schematic configuration of the liquid jet head chip shown in FIG. 2. FIG. 5 is a schematic cross-sectional view showing configurations of a cover plate and an actuator plate shown in FIG. 4; FIG. 6 is a schematic cross-sectional view showing an enlarged configuration of the drive electrode shown in FIG. 5; FIG. FIG. 4 is a flowchart showing an example of a method for manufacturing the liquid jet head chip shown in FIG. 3 and the like; FIG. FIG. 10 is an enlarged schematic cross-sectional view showing the configuration of a main part of a liquid jet head chip according to Comparative Example 1; FIG. 11 is a schematic cross-sectional view showing a schematic configuration of a liquid jet head chip according to a modification; FIG. 10 is a schematic cross-sectional view showing an enlarged configuration of the driving electrode shown in FIG. 9 ; 11 is a schematic cross-sectional view showing another example of the configuration of the drive electrodes shown in FIG. 10; FIG. FIG. 10 is a flowchart showing an example of a method for manufacturing the liquid jet head chip shown in FIG. 9; FIG. 13A and 13B are schematic cross-sectional views for explaining one step of the method of manufacturing the liquid jet head chip shown in FIG. 12; It is a cross-sectional schematic diagram showing the process following FIG. 13A. FIG. 13B is a schematic cross-sectional view showing a step following FIG. 13B; FIG. 13C is a schematic cross-sectional view showing a step following FIG. 13C; FIG. 13D is a schematic cross-sectional view showing a step following FIG. 13D; 13D is a schematic cross-sectional view showing a step following FIG. 13E; FIG. 8 is an enlarged schematic cross-sectional view showing the configuration of a main part of a liquid jet head chip according to Comparative Example 2. FIG.

Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. The description will be given in the following order.

1. Liquid jet recording device (head chip and liquid jet head)
1-1. Overall configuration 1-2. Configuration of liquid jet head 1-3. Configuration of Head Chip 1-4. Manufacturing method of head chip 1-5. Operation 1-6. Action and effect 2 . Modification 3. Other variations

<1. Liquid Jet Recording Apparatus (Head Chip and Liquid Jet Head)>
A liquid jet recording apparatus according to an embodiment of the present disclosure will be described.

It should be noted that each of the head chip and the liquid jet head according to an embodiment of the present disclosure is part of the liquid jet recording apparatus described here. Therefore, the head chip and the liquid jet head will be described together below.

The liquid jet recording apparatus described here is, for example, a printer that forms an image on a recording medium. The type of recording medium is not particularly limited, but includes, for example, paper, film, cloth and tile.

<1-1. Overall configuration>
First, the overall configuration of the liquid jet recording apparatus will be described.

FIG. 1 shows a perspective configuration of a printer 1, which is a specific example of a liquid jet recording apparatus (inkjet printer). In FIG. 1, the outer edge (contour) of the housing 10 is indicated by a dashed line.

This printer 1 is, for example, an inkjet printer that uses a recording liquid (ink 9). Specifically, for example, as shown in FIG. 1, the printer 1 includes a pair of transport mechanisms 2a and 2b, an ink tank 3, an inkjet head 4, a supply tube 50, and A scanning mechanism 6 is provided.

[Conveyance Mechanism and Ink Tank]
The transport mechanisms 2a and 2b are mechanisms for transporting the recording paper P loaded into the printer 1 in the transport direction D (X-axis direction). The ink tank 3 is a vessel that stores ink 9 . Here, the ink tank 3 is an embodiment of the "accommodating portion" of the present disclosure. Here, the printer 1 includes, for example, four ink tanks 3 (3Y, 3M, 3C, 3K) containing inks 9 of different colors. Each of the ink tanks 3Y, 3M, 3C, 3K For example, it contains yellow (Y) ink 9, magenta (M) ink 9, cyan (C) ink 9, and black (K) ink 9, respectively.

[Inkjet head and supply tube]
The inkjet head 4 is a liquid ejecting head that ejects ink droplets 9 supplied from a supply tube 50 onto the recording paper P, and is, for example, an edge shoot type inkjet head. In the edge shoot type inkjet head 4, for example, as will be described later, each of the plurality of channels C1 extends in a predetermined direction (for example, the Z-axis direction), and each of the plurality of nozzle holes H2 has a plurality of channels C1. Ink 9 is jetted in the same direction (Z-axis direction) as the extending direction of each channel C1 (see FIG. 3). That is, the extending direction of each channel C1 and the direction in which the ink 9 is ejected from each nozzle hole H2 match each other.

Here, the printer 1 is provided with four inkjet heads 4 (4Y, 4M, 4C, 4K) for ejecting inks 9 of different colors, for example, as shown in FIG. A detailed configuration of the inkjet head 4 will be described later (see FIG. 2).

[Scanning Mechanism]
The scanning mechanism 6 is a mechanism for scanning the inkjet head 4 in a direction intersecting the transport direction D, and includes, for example, a pair of guide rails 61 a and 61 b, a carriage 62 and a drive mechanism 63 . For example, the carriage 62 includes a base 62a and a wall portion 62b, and is movable in a direction intersecting the transport direction D along guide rails 61a and 61b while supporting the inkjet head 4. As shown in FIG. The drive mechanism 63 includes, for example, a pair of pulleys 631a and 631b, an endless belt 632, and a drive motor 633. The belt 632 is connected to the carriage 62, for example.

<1-2. Configuration of Liquid Jet Head>
FIG. 2 shows an enlarged perspective view of the inkjet head 4 (4Y, 4M, 4C, 4K) shown in FIG.

The inkjet head 4 includes, for example, a fixing plate 40, an inkjet head chip 41, a supply mechanism 42, a control mechanism 43, and a base plate 44, as shown in FIG. An inkjet head chip 41 , a supply mechanism 42 (a channel member 42 a described later), and a base plate 44 are fixed to one surface of the fixed plate 40 , for example. Here, the inkjet head chip 41 is one embodiment of the "head chip" of the present disclosure.

[Inkjet head chip]
The inkjet head chip 41 is the main part of the inkjet head 4 that ejects the ink 9 . The detailed configuration of the inkjet head chip 41 will be described later (see FIGS. 3 to 5).

[Supply Mechanism]
The supply mechanism 42 supplies the ink 9 supplied through the supply tube 50 to the inkjet head chip 41 (an ink introduction hole 410a to be described later: see FIGS. 3 and 4). The supply mechanism 42 includes, for example, a channel member 42a and a pressure damper 42b which are connected to each other via an ink connection pipe 42c. The flow path member 42a is a flow path through which the ink 9 flows, and a supply tube 50, for example, is attached to the pressure buffer 42b having a storage chamber for the ink 9. As shown in FIG. Here, the supply mechanism 42 is one embodiment of the "supply mechanism" of the present disclosure.

[Control mechanism]
The control mechanism 43 includes, for example, a circuit board 43a, a drive circuit 43b, and a flexible board 43c. The circuit board 43a includes, for example, a drive circuit 43b for driving the inkjet head chip 41, and the drive circuit 43b includes, for example, an integrated circuit (IC). The flexible substrate 43c electrically connects the drive circuit 43b and the inkjet head chip 41 (drive electrodes Ed, which will be described later; see FIG. 5) to each other. Although not shown here, the flexible substrate 43c includes, for example, a plurality of terminals connected respectively to the drive circuit 43b and the plurality of drive electrodes Ed.

<1-3. Configuration of Head Chip>
FIG. 3 shows a state in which a series of components of the inkjet head chip 41 are combined with each other. On the other hand, FIG. 4 shows a state in which the series of constituent elements of the inkjet head chip 41 are separated from each other in order to facilitate viewing of the series of constituent elements. FIG. 5 shows the configuration of the XY cross section of the inkjet head chip 41 . In addition, in FIG. 5, the plurality of nozzle holes H2 are indicated by dashed lines. In FIG. 3, only a part of the outline of the flexible substrate 43c is indicated by a dashed line.

The inkjet head chip 41 includes, for example, a cover plate 410, an actuator plate 411, a nozzle plate (ejection hole plate) 412, and a support plate 413, as shown in FIGS. Cover plate 410 and actuator plate 411 are stacked on top of each other. The nozzle plate 412 is in contact with the support plate 413 in a state in which the cover plate 410 and the actuator plate 411 are fitted in, for example, fitting holes 413a provided in the support plate 413 .

The cover plate 410 is attached to the actuator plate 411 (more specifically, a surface 411f1 of the actuator plate 411 to be described later) via an adhesive, for example. The nozzle plate 412 is attached to one end of the cover plate 410 and the actuator plate 411 in the Z-axis direction via an adhesive.

[Actuator plate]
The actuator plate 411 is a member that is electrically driven to eject the ink 9 from the multiple nozzle holes H2.

Actuator plate 411 includes a plurality of drive walls Wd that define a plurality of channels C1. Here, the "channel C1" corresponds to a specific example of the "channel" of the present disclosure, and the "drive wall Wd" corresponds to a specific example of the "inner wall" of the present disclosure.

As shown in FIG. 5, the actuator plate 411 includes, for example, two piezoelectric substrates 411p and 411m with different polarization directions. The piezoelectric substrates 411p and 411m include, for example, one or more of piezoelectric materials such as lead zirconate titanate (PZT). The polarization direction of the piezoelectric substrate 411p is set along one of the thickness directions (Y-axis direction), and the polarization direction of the piezoelectric substrate 411m is set along the other thickness direction, for example. The actuator plate 411 is configured by stacking these two piezoelectric substrates 411p and 411m along the thickness direction (so-called chevron type). However, the configuration of the actuator plate 411 is not limited to this chevron type. That is, for example, the actuator plate 411 may be configured by one (single) piezoelectric substrate whose polarization direction is set in one direction along the thickness direction (a so-called cantilever type or monopole type substrate). ). The actuator plate 411 has a front surface 411f1 bonded to the cover plate 410 and a back surface 411f2 facing away from the front surface 411f1. For example, the front surface 411f1 is provided on the piezoelectric substrate 411p, and the back surface 411f2 is provided on the piezoelectric substrate 411m. Here, the front surface 411f1 corresponds to a specific example of the "first surface" of the present disclosure, and the back surface 411f2 corresponds to a specific example of the "second surface" of the present disclosure.

Each channel C1 is, for example, a non-through groove having a depth direction in the direction (Y-axis direction) from the front surface 411f1 of the actuator plate 411 to the rear surface 411f2. A surface 411f1 of the actuator plate 411 is provided with openings M1 communicating with each of the channels C1. Here, the opening M1 corresponds to a specific example of the "first opening" of the present disclosure.

A plurality of ejection channels (ejection channels) C1e and a plurality of dummy channels (non-ejection channels) C1d are arranged alternately in the X-axis direction, for example. Each ejection channel C1e communicates with each nozzle hole H2 and functions as a pressure chamber that applies pressure to the ink 9 . In other words, the ejection channel C1e is filled with the ink 9, while the dummy channel C1d is not filled with the ink 9. Further, as shown in FIG. 5, each ejection channel C1e communicates with a nozzle hole H2 in a nozzle plate 412, which will be described later, while each dummy channel C1d does not communicate with a nozzle hole H2, which will be described later. It is covered from above by a cover plate 410 .

Each of the plurality of channels C1 extends from one end of the actuator plate 411 (the end closer to the nozzle plate 412) toward the other end (the end farther from the nozzle plate 412) in the Z-axis direction. doing. However, each of the plurality of dummy channels C1d, for example, extends to the other end of the actuator plate 411 and terminates at the other end. On the other hand, each of the plurality of ejection channels C1e does not extend to the other end of the actuator plate 411, for example, and terminates midway (at a position between the one end and the other end). .

For example, as shown in FIGS. 3 and 4, the inner wall surface C1m that defines each ejection channel C1e is cut up near the end of each ejection channel C1e on the far side from the nozzle plate 412. As shown in FIG.

The actuator plate 411 includes, for example, a first channel forming portion 411a positioned on one end side and provided with both a plurality of ejection channels C1e and a plurality of dummy channels C1d, and a first channel forming portion 411a positioned on the other end side and provided with a plurality of channel forming portions 411a. and a second channel forming portion 411b in which no ejection channel C1e is provided and only a plurality of dummy channels C1d are provided. Since the plurality of drive walls Wd described above define the plurality of channels C1 (the plurality of ejection channels C1e and the plurality of dummy channels C1d), they are provided in the above-described first channel forming portion 411a.

Drive electrodes Ed are provided on each side surface of the plurality of drive walls Wd over the extending direction (Z-axis direction) of the channel C1 and the depth direction (Y-axis direction) of the channel C1. The drive electrode Ed is an electrode that electrically drives (deforms) the drive wall Wd in order to cause the plurality of ejection channels C1e to function as pressure chambers. Here, the drive electrode Ed corresponds to a specific example of the "electrode" of the present disclosure.

The drive electrodes Ed include a pair of common electrodes Edc provided on the side surfaces of the drive walls Wd defining the ejection channel C1e, and a pair of active electrodes Eda provided on the side surfaces of the drive walls Wd defining the dummy channel C1d. contains. Each of the active electrode Eda and the common electrode Edc extends, for example, to a position deeper than the boundary (joint surface) between the piezoelectric substrate 411p and the piezoelectric substrate 411m (for example, the positive position in the Y direction in FIG. 5). there is In each of FIGS. 3 and 4, illustration of the plurality of drive electrodes Ed is omitted.

The plurality of drive electrodes Ed and the circuit board 43a (drive circuit 43b) are connected to each other through the flexible board 43c as described above. For example, a pad portion (not shown) electrically connected to the drive electrode Ed is provided on the surface 411f1 of the actuator plate 411 on the other end side. By connecting the flexible substrate 43c to this pad portion, a drive voltage is applied to the plurality of drive electrodes Ed from the drive circuit 43b through the flexible substrate 43c. A pad portion connected to the common electrode Edc and a pad portion connected to the active electrode Eda are provided separately from each other. In this case, for example, drive voltages having different polarities are applied to each of the common electrode Edc and the active electrode Eda. The common electrode Edc is connected to, for example, a ground potential (GND potential), and the active electrode Eda is connected to a predetermined potential. The common electrode Edc may be connected to a negative potential, for example.

FIG. 6 shows a more specific configuration of the drive electrodes Ed shown in FIG. The drive electrode Ed includes an adhesion film CF1 and a corrosion-resistant film CF2, and the adhesion film CF1 and the corrosion-resistant film CF2 are laminated in this order from the drive wall Wd side. The adhesion film CF1 and the corrosion resistant film CF2 are each provided over the extending direction of the channel C1 and the depth direction of the channel C1. Here, the adhesion film CF1 corresponds to a specific example of the "first adhesion film" of the present disclosure, and the corrosion resistant film CF2 corresponds to a specific example of the "first corrosion resistant film" of the present disclosure.

The adhesion film CF1 is formed by, for example, a vapor deposition method, as will be described later. The adhesion film CF1 is, for example, in contact with the drive walls Wd (piezoelectric substrates 411p and 411m) and covers at least a portion of the drive walls Wd in the depth direction of the channel C1. The adhesion film CF1 may cover the entire driving wall Wd in the depth direction of the channel C1. The adhesion film CF1 has an upper end eu and a lower end eb in the depth direction of the channel C1. The upper end eu is provided on the front surface 411f1 (opening M1) side, and the lower end eb is provided on the rear surface 411f2 side. The upper end eu of the adhesion film CF1 may be provided on the outer surface 411f1 of the opening M1, or may be provided within the channel C1. For example, in a part of each of the plurality of drive electrodes Ed, the upper end eu of the adhesion film CF1 is provided on the outer surface 411f1 of the opening M1. Here, the upper end eu corresponds to a specific example of "one end" of the present disclosure, and the lower end eb corresponds to a specific example of "the other end" of the present disclosure.

The adhesion film CF1 is for adhering the corrosion-resistant film CF2 to the drive wall Wd, and has high adhesion to the piezoelectric substrates 411p and 411m. The adhesion film CF1 contains, for example, at least one of titanium (Ti), copper (Cu), nickel (Ni), chromium (Cr), and the like.

As will be described later, the corrosion resistant film CF2 is formed, for example, by vapor deposition after forming the adhesion film CF1, and is provided on the adhesion film CF1. That is, the adhesion film CF1 and the anti-corrosion film CF2 are composed of vapor deposition films. The corrosion resistant film CF2 functions as a main conductive film of the drive electrode Ed. This anti-corrosion film CF2 preferably has high corrosion resistance to the ink 9 . The corrosion resistant film CF2 is made of noble metal such as gold (Au), platinum (Pt) or palladium (Pd). By providing such a corrosion-resistant film CF2, corrosion of the drive electrode Ed can be suppressed.

In the present embodiment, the corrosion resistant film CF2 covers the adhesion film CF1 from the upper end eu to the lower end eb. In other words, the adhesion film CF1 is covered with the corrosion-resistant film CF2 over the entire depth direction of the channel C1, and the drive electrode Ed has a portion where the adhesion film CF1 is exposed from the corrosion-resistant film CF2. No. Although details will be described later, this makes it possible to suppress deterioration in the reliability of the inkjet head chip 41 due to corrosion of the drive electrodes Ed. For example, the thickness T2 of the corrosion-resistant film CF2 is substantially the same as the thickness T1 of the surrounding adhesion film CF1 (T1≈T2). In the corrosion-resistant film CF2, the upper and lower ends of the channel C1 in the depth direction are aligned with the upper end eu and the lower end eb of the adhesion film CF1, respectively. The laminated structure of the adhesion film CF1 and the corrosion resistant film CF2 is maintained. The thicknesses T1 and T2 of the adhesion film CF1 and the corrosion-resistant film CF2 may vary depending on the position in the depth direction of the channel C1. When compared, the thickness of the corrosion resistant film CF2 is substantially the same as the thickness of the adhesion film CF1.

[Cover plate]
The cover plate 410 is a member that covers the actuator plate 411 . A cover plate 410 is provided to face the actuator plate 411 .

Specifically, as shown in FIGS. 3 to 5, for example, the cover plate 410 has a concave ink introduction hole 410a provided with a plurality of slits 410b. Each slit 410b is, for example, a through groove extending in the same direction as the extending direction (Z-axis direction) of each channel C1.

Since the position of each slit 410b corresponds to the position of each ejection channel C1e, the ink introduction hole 410a communicates with each ejection channel C1e via each slit 410b. As a result, the ink 9 is supplied to each of the ejection channels C1e through the slits 410b, so that the plurality of ejection channels C1e are filled with the ink 9. As shown in FIG.

[Nozzle plate]
The nozzle plate 412 has a plurality of nozzle holes H2 that are through holes and faces the actuator plate 411 . The plurality of nozzle holes H2 are arranged, for example, at intervals in the X-axis direction, and the opening shape of the nozzle holes H2, that is, the shape of the nozzle holes H2 viewed from the Z-axis direction is, for example, circular. The inner diameter of the nozzle hole H2 is, for example, gradually reduced in the direction in which the ink 9 is ejected. This is because the ejection speed and straightness of the ink 9 are thereby improved. The nozzle plate 412 includes, for example, one or more of insulating materials such as polyimide. The nozzle plate 412 may include, for example, any one or more of conductive materials such as stainless steel (SUS).

[Support plate]
For example, as shown in FIG. 4, the support plate 413 has a fitting hole 413a extending in the X-axis direction. They are stacked and fitted together.

<1-4. Manufacturing Method of Head Chip>
FIG. 7 shows an example of a method for manufacturing the inkjet head chip 41 in order of steps. Here, the manufacturing process of the actuator plate 411 will be mainly described with reference to FIG.

First, piezoelectric substrates 411p and 411m made of a piezoelectric material such as PZT are formed (step S1). Next, a resist film pattern is formed on the surface 411f1 of the piezoelectric substrates 411p and 411m (for example, the surface of the piezoelectric substrate 411p opposite to the surface bonded to the piezoelectric substrate 411m) (step S2). The resist film may be formed by coating the surface 411f1 with a photosensitive resin material, or by bonding a resist film to the surface 411f1. The pattern of this resist film is formed using, for example, a photolithographic method.

Next, a plurality of channels C1 are formed on the piezoelectric substrates 411p and 411m (step S3). The channel C1 is formed by grinding the piezoelectric substrate using, for example, a dicer. In this channel C1 formation process, a plurality of openings M1 are formed in the surface 411f1 along with the plurality of channels C1.

After forming the plurality of channels C1 on the piezoelectric substrates 411p and 411m, the adhesion film CF1 and the corrosion resistant film CF2 are formed in this order on the surface 411f1 and the inner wall surfaces of the channels C1 (steps S4 and S5). The adhesion film CF1 and the corrosion-resistant film CF2 are formed using, for example, an oblique vapor deposition method. In the oblique vapor deposition method, the direction of vapor deposition is tilted from the direction normal to the surface of the piezoelectric substrate, so the adhesion film CF1 and the anti-corrosion film CF2 can be formed over a wide range of the inner wall surface of the channel C1.

At this time, for example, the oblique evaporation method is performed so that the thickness T2 of the corrosion resistant film CF2 formed on the surface 411f1 is the same as the thickness T1 of the adhesion film CF1 formed on the surface 411f1. This makes it easier for the adhesion film CF1 to be covered with the corrosion-resistant film CF2 from the upper end eu to the lower end eb. When the adhesion film CF1 and the corrosion-resistant film CF2 are formed using the vapor deposition method, the thicknesses (thicknesses T1 and T2) of the adhesion film CF1 and the corrosion-resistant film CF2 formed on the surface 411f1 and the depth of the channel C1 This is because the sizes of the adhesion film CF1 and the corrosion resistant film CF2 formed in the direction have a correlation within a predetermined range. That is, as the thicknesses of the adhesion film CF1 and the corrosion-resistant film CF2 formed on the surface 411f1 increase, the sizes of the adhesion film CF1 and the corrosion-resistant film CF2 formed in the depth direction of the channel C1 also increase. In the vapor deposition method, the limits of the sizes of the adhesion film CF1 and the anti-corrosion film CF2 formed in the depth direction of the channel C1 are determined according to the vapor deposition direction. Within this limit, there is a correlation between the thicknesses of the adhesion film CF1 and the corrosion-resistant film CF2 formed on the surface 411f1 and the sizes of the adhesion film CF1 and the corrosion-resistant film CF2 formed in the depth direction of the channel C1.

After forming the adhesion film CF1 and the anti-corrosion film CF2 on the inner wall surface of the channel C1, the pattern of the resist film on the surface 411f1 is removed (step S6). Along with the resist film, the adhesion film CF1 and the corrosion resistant film CF2 adhering to the resist film are also removed. This resist film removing step is a so-called lift-off method. Thereby, the adhesion film CF1 and the corrosion-resistant film CF2 formed on the inner wall surface of the discharge channel C1e are electrically separated from the adhesion film CF1 and the corrosion-resistant film CF2 formed on the inner wall surface of the dummy channel C1d. That is, a common electrode Edc is formed on the ejection channel C1e, an active electrode Eda is formed on the dummy channel C1d, and a pad portion is formed on the surface 411f1.

After completing the actuator plate 411 in this manner, the actuator plate 411 and other plates (eg, the cover plate 410 and the nozzle plate 412, etc.) are assembled (step S7). As a result, the inkjet head chip 41 shown in FIGS. 3 and 4 is completed.

<1-5. Operation>
[Printer operation]
In this printer 1, the recording paper P is transported in the transport direction D, and the ink 9 is ejected onto the recording paper P while the inkjet head 4 reciprocates in the direction intersecting the transport direction D. As shown in FIG. Thus, an image is recorded on the recording paper P. FIG.

[Inkjet head operation]
The inkjet head 4 ejects the ink 9 onto the recording paper P using a shear mode, for example, according to the following procedure.

In the inkjet head 4, the drive circuit 43b applies a corresponding voltage to the nozzle plate 412 when the drive circuit 43b applies a drive voltage to the actuator plate 411 (the plurality of active electrodes Eda). In this case, each drive wall Wd bends and deforms in the Y-axis direction by utilizing the piezoelectric thickness sliding effect. As a result, the volume of each ejection channel C1e increases, so the ink 9 is guided to each ejection channel C1e. After that, when the drive voltage becomes zero (0V) and the corresponding voltage also becomes zero (0V), each drive wall Wd is deformed to return to its original state. As a result, the ink 9 guided to each ejection channel C1e is pressurized due to the decrease in the volume of each ejection channel C1e, so that the ink 9 is ejected onto the recording paper P from each nozzle hole H2. .

<1-6. Action and effect>
In the inkjet head chip 41, the inkjet head 4, and the printer 1 of the present embodiment, the drive electrode Ed of the actuator plate 411 includes the adhesion film CF1 and the anti-corrosion film CF2, and the anti-corrosion film CF2 is the upper end eu of the adhesion film CF1. to the lower end eb. As a result, deterioration in reliability of the inkjet head chip 41 due to corrosion of the drive electrodes Ed can be suppressed. Hereinafter, this effect will be described using a comparative example (comparative example 1).

FIG. 8 is an enlarged view of the configuration of the main part of an inkjet head chip 141 according to Comparative Example 1. As shown in FIG. FIG. 8 corresponds to FIG. 6 showing the inkjet head chip 41 . In the inkjet head chip 141, similarly to the inkjet head chip 41, the drive electrodes Ed include the adhesion film CF1 and the anti-corrosion film CF2. However, in the inkjet head chip 141, the drive electrode Ed is provided with a portion where the adhesion film CF1 is exposed from the anti-corrosion film CF2. Specifically, the corrosion-resistant film CF2 is formed shallower than the adhesion film CF1, and the corrosion-resistant film CF2 does not cover a portion of the adhesion film CF1 on the lower end eb side. When the contact film CF1 is exposed from the anti-corrosion film CF2 in a portion of the drive electrode Ed in this manner, the contact film CF1 is likely to come into contact with the ink 9. As shown in FIG. Since the adhesion film CF1 has lower corrosion resistance than the corrosion-resistant film DF2, corrosion is likely to occur at the portion where the ink 9 and the adhesion film CF1 contact each other. As a result, the drive electrode Ed becomes defective, and the reliability of the inkjet head chip 141 is lowered.

On the other hand, in the drive electrode Ed of the inkjet head chip 41, the anti-corrosion film CF2 covers the adhesion film CF1 from the upper end eu to the lower end eb. Therefore, the adhesion film CF1 is covered with the anti-corrosion film CF2 at any portion of the drive electrode Ed, and contact between the adhesion film CF1 and the ink 9 can be suppressed.

Further, in the depth direction of the channel C1, the size of the corrosion resistant film CF2 is substantially the same as the size of the adhesion film CF1, and the position of the lower end of the corrosion resistant film CF2 is aligned with the position of the lower end eb of the adhesion film CF1. is preferred. At this time, for example, the thickness T2 of the corrosion-resistant film CF2 is the same as the thickness T1 of the surrounding adhesion film CF1 (T1≈T2). If, in the depth direction of the channel C1, the size of the corrosion-resistant film CF2 is made larger than the size of the adhesion film CF1, a part of the lower end side of the corrosion-resistant film CF2 is not connected to the drive wall Wd without passing through the adhesion film CF1. be provided. In this case, peeling occurs from the lower end side of the corrosion-resistant film CF2, and there is a risk of contamination due to the peeling of the drive electrode Ed. By aligning the position of the lower end of the corrosion-resistant film CF2 with the position of the lower end eb of the adhesion film CF1 in the depth direction of the channel C1, it is possible to suppress the occurrence of contamination due to such peeling of the drive electrode Ed. .

As described above, in the inkjet head chip 41 of the present embodiment, since the adhesion film CF1 is covered with the anti-corrosion film CF2 over the depth direction of the channel C1, the driving force caused by the contact between the adhesion film CF1 and the ink 9 is reduced. Corrosion of the electrode Ed is suppressed. Therefore, the reliability of the inkjet head chip 41, the inkjet head 4 and the printer 1 can be improved.

<2. Variation>
FIG. 9 shows a schematic cross-sectional configuration of a main part of an inkjet head chip 41A according to a modification. FIG. 9 corresponds to FIG. 5 showing the inkjet head chip 41 according to the above embodiment. In the inkjet head chip 41A according to the modified example, each of the plurality of channels C1 penetrates the actuator plate 411 from the front surface 411f1 to the rear surface 411f2. That is, each of the plurality of channels C1 communicates with the opening M1 provided on the front surface 411f1 of the actuator plate 411 and communicates with the opening M2 provided on the back surface 411f2 of the actuator plate 411 . As a result, on the inner wall surface of the channel C1, a vapor deposition film (adhesion film CF3 and corrosion resistant film CF4 described later) formed from the front surface 411f1 side of the actuator plate 411 and a vapor deposition film (adhesion film CF1 described later) formed from the back surface 411f2 side are formed. and the corrosion resistant film CF2).

Here, the back surface 411f2 corresponds to a specific example of the "first surface" of the present disclosure, and the front surface 411f1 corresponds to a specific example of the "second surface" of the present disclosure. Further, the opening M2 corresponds to a specific example of the "first opening" of the present disclosure, and the opening M1 corresponds to a specific example of the "second opening" of the present disclosure.

The inkjet head chip 41A includes an actuator plate 411 and a cover plate 410, as well as a sealing plate 415 bonded to the back surface 411f2 of the actuator plate 411. As shown in FIG. That is, each of the plurality of openings M2 provided on the rear surface 411f2 of the plurality of actuator plates 411 is closed by the sealing plate 415. As shown in FIG. The sealing plate 415 faces the cover plate 410 with the actuator plate 411 therebetween. The sealing plate 415 is made of PZT, silicon, or the like, for example.

FIG. 10 shows a more specific configuration of the drive electrodes Ed shown in FIG. The drive electrode Ed includes an adhesion film CF3 and a corrosion-resistant film CF4 extending from the front surface 411f1 of the actuator plate 411 to the rear surface 411f2 side, and an adhesion film CF1 and a corrosion-resistant film CF2 extending from the rear surface 411f2 to the front surface 411f1 side. I'm in. On the front surface 411f1 side (opening M1 side), the adhesion film CF3 and the corrosion-resistant film CF4 are laminated in this order from the drive wall Wd side, and on the back surface 411f2 side (opening M2 side), the adhesion film CF1 and the corrosion-resistant film CF2 are laminated in this order. Laminated. At least one of the adhesion film CF3 and the corrosion resistant film CF4 is connected to at least one of the adhesion film CF1 and the corrosion resistant film CF2. As will be described later, after forming the adhesion film CF3 and the corrosion-resistant film CF4 from the front surface 411f1 side of the actuator plate 411, the adhesion film CF1 and the corrosion-resistant film CF2 are formed from the rear surface 411f2 side.

Here, the adhesion film CF3 corresponds to a specific example of the "second adhesion film" of the present disclosure, and the corrosion resistant film CF4 corresponds to a specific example of the "second corrosion resistant film" of the present disclosure.

The adhesion film CF3 is formed by, for example, a vapor deposition method, as will be described later. This adhesion film CF3 is in contact with, for example, the drive walls Wd (piezoelectric substrates 411p and 411m). The adhesion film CF3 is provided closer to the opening M1 than the adhesion film CF1, and covers at least part of the driving wall Wd from the opening M1 side. The adhesion film CF3 covers, for example, a portion of the driving wall Wd on the opening M1 side, but may cover the entire driving wall Wd from the opening M1 to the opening M2. The adhesion film CF3 has an upper end eu3 and a lower end eb3 in the depth direction (Y direction in FIG. 10) of the channel C1. The upper end eu3 is provided on the front surface 411f1 (opening M1) side, and the lower end eb3 is provided on the rear surface 411f2 side (opening M2). For example, in a part of each of the plurality of drive electrodes Ed, the upper end eu of the adhesion film CF3 is provided on the outer surface 411f1 of the opening M1. Here, the upper end eu3 corresponds to a specific example of "one end of the second adhesion film" of the present disclosure, and the lower end eb3 corresponds to a specific example of "the other end of the second adhesion film" of the present disclosure. The adhesion film CF3 is for adhering the anti-corrosion film CF4 to the drive wall Wd, and has high adhesion to the piezoelectric substrates 411p and 411m. The adhesion film CF3 contains, for example, at least one of titanium (Ti), copper (Cu), nickel (Ni), chromium (Cr), and the like.

As will be described later, the corrosion resistant film CF4 is formed, for example, by vapor deposition after forming the adhesion film CF3, and is provided on the adhesion film CF3. In other words, the adhesion film CF3 and the anti-corrosion film CF4 are composed of vapor deposition films. For example, in the depth direction of the channel C1, the size of the corrosion-resistant film CF4 is smaller than the size of the adhesion film CF3, and the lower end of the corrosion-resistant film CF4 is provided closer to the surface 411f1 than the lower end eb3 of the adhesion film CF3. It is The corrosion resistant film CF4 preferably has high corrosion resistance to the ink 9 . The corrosion resistant film CF4 is made of noble metal such as gold (Au), platinum (Pt) or palladium (Pd).

The adhesion film CF1 is, for example, in contact with the drive wall Wd (piezoelectric substrates 411p and 411m) near the opening M2, and covers at least a portion of the drive wall Wd from the opening M2 side. The adhesion film CF1 covers, for example, part of the driving wall on the opening M2 side, but may cover the entire driving wall Wd from the opening M2 to the opening M1. The lower end eb of the adhesion film CF1 is provided on the back surface 411f2 (opening M2) side, and the upper end eu is provided on the front surface 411f1 (opening M1) side. The lower end eb of the adhesion film CF1 may be provided on the back surface 411f2 outside the opening M2, or may be provided within the channel C1. Here, the lower end eb corresponds to a specific example of "one end of the first adhesion film" of the present disclosure, and the upper end eu corresponds to a specific example of "the other end of the first adhesion film" of the present disclosure.

The corrosion-resistant film CF2 covers the adhesion film CF1 from the lower end eb to the upper end eu, and the drive electrode Ed does not have a portion where the adhesion film CF1 is exposed from the corrosion-resistant film CF2. As described in the above embodiment, this makes it possible to suppress deterioration in reliability of the inkjet head chip 41 due to corrosion of the drive electrodes Ed. For example, the thickness T2 of the corrosion-resistant film CF2 is substantially the same as the thickness T1 of the adhesion film CF1 around it, or the thickness T2 of the corrosion-resistant film CF2 is larger than the thickness T1 of the adhesion film CF1 around it. (T1≦T2). For example, in the depth direction of the channel C1, the size of the corrosion-resistant film CF2 is larger than the size of the adhesion film CF1, and the upper end of the corrosion-resistant film CF2 is provided closer to the surface 411f1 than the upper end eu of the adhesion film CF1. It is The size of the corrosion-resistant film CF2 in the depth direction of the channel C1 should be equal to or larger than the size of the adhesion film CF1, and the upper end of the corrosion-resistant film CF2 is aligned with the upper end eu of the adhesion film CF1. good too. For example, the position of the lower end of the corrosion resistant film CF2 is aligned with the position of the lower end eb of the adhesion film CF1. As described in the above embodiment, the thicknesses T1 and T2 of the adhesion film CF1 and the corrosion resistant film CF2 may vary depending on the position in the depth direction of the channel C1. Comparing the respective top to bottom ends of the adhesion film CF1 and the corrosion resistant film CF2, the thickness of the corrosion resistant film CF2 is equal to or greater than the thickness of the adhesion film CF1.

Preferably, the upper end eu of the adhesion film CF1 is provided on the corrosion-resistant film CF4, and at least part of the adhesion film CF1 overlaps the corrosion-resistant film CF4. In other words, the drive electrode Ed preferably has an overlapping portion OP where the adhesion film CF1 and the corrosion resistant film CF4 overlap. As a result, as described above, even if a portion of the adhesion film CF3 on the side of the lower end eb3 is exposed from the corrosion-resistant film CF4, the exposed portion of the adhesion film CF3 is covered with the corrosion-resistant film CF2. Therefore, corrosion of the drive electrodes Ed due to contact between the adhesion film CF3 and the ink 9 can be suppressed. Moreover, since the driving electrode Ed has the overlapping portion OP, peeling of the adhesion film CF1 can be suppressed for the following reasons.

For example, in the drive electrode Ed that does not have the overlapping portion OP, the upper end eu of the adhesion film CF1 is arranged closer to the back surface 411f2, and the adhesion film CF1 is closer to the adhesion film CF3 than the adhesion film CF3 or the corrosion resistant film CF4. overlaps only with In this case, the adhesion between the adhesion film CF1 and the adhesion film CF3 is low, and the adhesion film CF1 may be peeled off. Also, the resistance of the drive electrode Ed tends to increase. These are caused by the passive film formed on the surface of the adhesion film CF1. On the other hand, it is difficult to form a passive film on the surface of the corrosion resistant film CF4. Therefore, since the drive electrode Ed has the overlapping portion OP, the adhesion film CF1 is in close contact with the anti-corrosion film CF4 in the overlapping portion OP, so that peeling of the adhesion film CF1 can be suppressed. Moreover, it becomes possible to lower the resistance of the drive electrode Ed. In such an overlapping portion OP, the adhesion film CF1, the corrosion-resistant film CF2, the adhesion film CF3, and the corrosion-resistant film CF4 are laminated in this order from the driving wall Wd side.

FIG. 11 shows another example of the configuration of the drive electrodes Ed shown in FIG. In this manner, the corrosion resistant film CF2 may cover the adhesion film CF1 from the lower end eb to the upper end eu, and the corrosion resistant film CF4 may cover the adhesion film CF3 from the upper end eu3 to the lower end eb3. This makes it easier to form the overlapping portion OP, and it is possible to more effectively suppress peeling of the adhesion film CF1. Also, the resistance of the drive electrode Ed can be further reduced. At this time, for example, the positions of the upper end and the lower end of the corrosion resistant film CF4 are aligned with the positions from the upper end to the lower end of the adhesion film CF3, and the thickness T4 of the corrosion resistant film CF4 is equal to the thickness T3 of the adhesion film CF3 around it. is almost the same as

Next, a method for manufacturing the inkjet head chip 41A will be described with reference to FIGS. 12 to 13F. FIGS. 12A to 12F show an example of a method of manufacturing the inkjet head chip 41A in order of steps, and FIGS. 13A to 13F are cross-sectional views for explaining each step shown in FIG.

First, in the same manner as described in the manufacturing method of the inkjet head chip 41 (see FIG. 7), formation of the piezoelectric substrate (step S1) and pattern formation of the resist film (step S2) are performed in this order. In the piezoelectric substrate forming step (step S1), as shown in FIG. 13A, two piezoelectric substrates (piezoelectric substrate 411pZ and piezoelectric substrate 411mZ) polarized in the thickness direction (Y-axis direction) are prepared, They are stacked so that their polarization directions are opposite to each other. Thereafter, the piezoelectric substrate 411pZ is ground as necessary to adjust the thickness of the piezoelectric substrate 411pZ. This forms the piezoelectric substrate 411p and the surface 411f1. Next, a resist film pattern (pattern RP1 in FIG. 13B) is formed on the surface 411f1. The pattern RP1 of this resist film has a pad portion (not shown) electrically connected to each of the common electrode Edc and the active electrode Eda on the surface 411f1, and a pad portion for connecting the common electrode Edc and the active electrode Eda to the pad portion. It is for forming wiring.

Subsequently, as shown in FIG. 13B, trenches C1U are formed at positions where the plurality of channels C1 are to be formed (step S3). A plurality of channels C1 are formed by the plurality of trenches C1U. The trench C1U is formed, for example, by grinding the surface 411f1 using a dicing blade or the like. Thus, along with the plurality of trenches C1U, a plurality of openings M1 communicating with each of the plurality of trenches C1U are formed in the surface 411f1.

After forming a plurality of trenches C1U in the piezoelectric substrate 411Z, as shown in FIG. 13C, an adhesion film CF3 and a corrosion-resistant film CF4 are formed in this order by vapor deposition, for example (steps S12 and S13). The adhesion film CF3 and the anti-corrosion film CF4 are formed on the inner wall surface and surface 411f1 of the plurality of trenches C1U. In the step of forming the adhesion film CF3 and the corrosion resistant film CF4 (steps S12 and S13), it is preferable to use an oblique vapor deposition method. As described in the above embodiment, this makes it possible to form the adhesion film CF3 and the corrosion resistant film CF4 widely over the depth direction of the trench C1U (the Y-axis direction in FIG. 13C). At this time, a part of the lower end (lower end eb3 in FIG. 10) of the adhesion film CF3 may be exposed from the anti-corrosion film CF4 (see FIG. 10), or the adhesion film CF3 may extend in the depth direction of the trench C1U. It may be covered with a corrosion resistant film CF4 (see FIG. 11).

After forming the adhesion film CF3 and the corrosion resistant film CF4, the pattern RP1 of the resist film is removed (step S14). As a result, the adhesion film CF3 and the corrosion-resistant film CF4 adhering to the pattern RP1 of the resist film are also removed (lift-off method), and the adhesion film CF3 and the corrosion-resistant film CF4 on the inner wall surface of the trench C1U and selective regions of the surface 411f1 are removed. The adhesion film CF3 and the anti-corrosion film CF4 provided in the region remain. For example, the adhesion film CF3 and the anti-corrosion film CF4 provided in selective regions of the surface 411f1 form wirings and pads (not shown) electrically connected to the drive electrodes Ed.

Thereafter, as shown in FIG. 13D, the cover plate 410 is attached to the surface 411f1 from which the resist film pattern RP1 has been removed (step S15). Subsequently, as shown in FIG. 13E, the piezoelectric substrate 411mZ is ground from the rear surface (the surface opposite to the piezoelectric substrate 411p) (step S16). In this grinding step (step S16), a plurality of trenches C1U are exposed in the back surface 411f2, and openings M2 communicating with the plurality of channels C1 are formed in the back surface 411f2. Thereby, the thickness of the piezoelectric substrate 411mZ is adjusted, and the piezoelectric substrate 411m is formed.

After forming the plurality of openings M2 on the back surface 411f2, as shown in FIG. 13F, a resist film pattern RP2 is formed on the back surface 411f2 (step S17).

After the pattern RP2 of the resist film is formed on the back surface 411f2, the adhesion film CF1 and the anti-corrosion film CF2 are formed in this order by, for example, vapor deposition (steps S18 and S19). The adhesion film CF1 and the corrosion resistant film CF2 are formed to cover the inner wall surfaces of the plurality of channels C1 and the resist film pattern RP2. In the step of forming the adhesion film CF1 and the corrosion resistant film CF2 (steps S18 and S19), it is preferable to use an oblique vapor deposition method. As described in the above embodiment, this makes it possible to form the adhesion film CF1 and the corrosion resistant film CF2 widely over the depth direction of the channel C1. At this time, the adhesion film CF1 is formed so as to overlap the corrosion-resistant film CF4 (overlapping portion OP in FIGS. 10 and 11). Further, the thickness T2 of the corrosion resistant film CF2 formed on the back surface 411f2 is the same as the thickness T1 of the adhesion film CF1 formed on the back surface 411f2, or is larger than the thickness T1 of the adhesion film CF1 formed on the back surface 411f2. Then, the oblique vapor deposition method is performed. As a result, the adhesion film CF1 is covered with the corrosion-resistant film CF2 from the lower end eb to the upper end eu.

After forming the adhesion film CF1 and the corrosion resistant film CF2, the pattern RP2 of the resist film is removed (step S20). Thereby, unnecessary portions of the adhesion film CF1 and the corrosion-resistant film CF2 formed on the back surface 411f2 are removed (lift-off method). Accordingly, the drive electrodes Ed are formed by the adhesion films CF1 and CF3 and the anti-corrosion films CF2 and CF4 covering the inner surface of the channel C1, and the common electrode Edc of the ejection channel C1e and the active electrode Eda of the dummy channel C1d are electrically connected. physically separated.

After the actuator plate 411 is formed in this way, the sealing plate 415 is attached to the rear surface 411f2 from which the resist film pattern RP2 has been removed (step S21). Finally, the cover plate 410, the actuator plate 411, the sealing plate 415, and other plates (for example, the nozzle plate 412, etc.) are assembled (step S7). As a result, the inkjet head chip 41A shown in FIG. 9 and the like is completed.

Also in the inkjet head chip 41A according to this modification, the corrosion-resistant film CF2 covers from the lower end eb to the upper end eu of the adhesive film CF1 over the depth direction of the channel C1. As a result, deterioration in reliability of the inkjet head chip 41A due to corrosion of the drive electrodes Ed can be suppressed. Hereinafter, this effect will be described using a comparative example (comparative example 2).

FIG. 14 is an enlarged view of the configuration of the main part of an inkjet head chip 141A according to Comparative Example 2. As shown in FIG. FIG. 14 corresponds to FIG. 10 showing the inkjet head chip 41A. The inkjet head chip 141A has drive electrodes Ed including adhesion films CF1, CF3 and anti-corrosion films CF2, CF4, similarly to the inkjet head chip 41A. However, the adhesion film CF1 is exposed from the anti-corrosion film CF2 in a part of the drive electrode Ed. Specifically, the corrosion-resistant film CF2 is formed shallower than the adhesion film CF1, and the corrosion-resistant film CF2 does not cover a part of the adhesion film CF1 on the upper end eu side. As a result, in the same manner as described in Comparative Example 1, problems occur in the drive electrodes Ed, and the reliability of the inkjet head chip 141A is lowered.

On the other hand, in the drive electrode Ed of the inkjet head chip 41A, the anti-corrosion film CF2 covers the adhesion film CF1 from the lower end eb to the upper end eu. Further, the drive electrode Ed has an overlapping portion OP where the adhesion film CF1 and the anti-corrosion film CF4 overlap. As a result, the adhesion films CF1 and CF3 are covered with the corrosion-resistant film CF2 or the corrosion-resistant film CF4 at any portion of the drive electrode Ed. Therefore, contact between the adhesion films CF1 and CF3 and the ink 9 can be suppressed, and the reliability of the inkjet head chip 41A can be improved.

In the inkjet head chip 41A, the drive electrodes Ed include the adhesion film CF3 and the corrosion-resistant film CF4 formed from the front surface 411f1 side, and the adhesion film CF1 and the corrosion-resistant film CF2 formed from the rear surface 411f2 side. , the drive electrode Ed can be formed more widely on the inner wall (drive wall Wd) of the channel C1 than when the drive electrode Ed is formed only from either the front surface 411f1 side or the rear surface 411f2 side. This reduces variations in the formation area of the drive electrodes Ed among the plurality of channels C1. Therefore, in the inkjet head chip 41A, it is possible to suppress the variation in the ejection amount due to the variation in the formation area of the drive electrodes Ed.

<3. Other modified examples>
Although the present disclosure has been described above with reference to the embodiment and modifications, the aspect of the present disclosure is not limited to the aspects described in the above-described embodiment and the like, and various modifications are possible.

Specifically, for example, one liquid ejecting head (liquid ejecting head chip) does not eject one color of liquid (ink), and the one liquid ejecting head ejects a plurality of different colors (for example, two colors). etc.).

Further, for example, the liquid ejecting head is not limited to the edge shoot type liquid ejecting head described above, and may be a side shoot type liquid ejecting head. In this side-shoot type liquid jet head, when each channel provided in the actuator plate extends in a specific direction, each nozzle hole provided in the nozzle plate intersects with the extending direction of each channel. Ink is ejected in a direction.

Further, for example, the liquid ejecting head may be a circulating liquid ejecting head in which the ink 9 is circulated by a circulation mechanism between the inkjet head 4 and the ink tank 3, or may be a non-circulating liquid ejecting head. There may be.

Further, in the above embodiments and the like, the case where the adhesion films CF1, CF3 and the corrosion-resistant films CF2, CF4 are patterned using the lift-off method has been described. may be performed using other methods such as laser irradiation.

Further, in the above embodiments and the like, the case where the adhesion films CF1 and CF3 and the anti-corrosion films CF2 and CF4 are formed using the vapor deposition method has been described. The vapor deposition method here is a so-called physical vapor deposition method, and includes a vacuum vapor deposition method, a sputtering method, an ion plating method, and the like.

Further, for example, in the above embodiment and the like, the case where the opening shape of the nozzle hole H2 is circular has been described, but the opening shape of the nozzle hole H2 may be, for example, an elliptical shape, a polygonal shape such as a triangular shape, or a star shape. Other shapes such as a mold shape may be used.

Further, for example, applications to which the liquid jet head chip, liquid jet head, and liquid jet recording apparatus of the present disclosure are respectively applied are not limited to inkjet printers, and may be other uses. Other applications are other devices such as facsimiles and print-on-demand machines, for example.

Note that the effects described in this specification are merely examples and are not limited, and other effects may be provided.

In addition, the present disclosure can also be configured as follows.
(1)
A head chip that ejects the liquid, comprising an actuator plate that applies pressure to the liquid,
The actuator plate is
a first surface and a second surface facing away from the first surface;
a channel communicating with a first opening provided in the first surface and having a depth direction in a direction from the first surface to the second surface;
a first adhesion film provided on the inner wall of the channel and covering at least part of the inner wall; and a first adhesion film covering from one end of the first adhesion film on the first surface side to the other end on the second surface side. and an electrode including a corrosion resistant film.
(2)
The head chip according to (1), wherein the thickness of the first anti-corrosion film is equal to or greater than the thickness of the first adhesion film.
(3)
the channel communicates with the first opening and a second opening provided on the second surface;
The electrode further includes a second adhesion film provided closer to the second opening than the first adhesion film, and covering at least part of the second adhesion film from the second surface side in the depth direction. The head chip according to (1) or (2), further comprising a second anti-corrosion film.
(4)
the electrode has an overlapping portion where the second corrosion resistant film and the first adhesive film overlap,
In the overlapping portion, the second adhesion film, the second anti-corrosion film, the first adhesion film and the first anti-corrosion film are laminated in this order from the inner wall side. The head according to (3) above. chips.
(5)
The head chip according to (4), wherein the second anti-corrosion film covers from one end of the second adhesion film on the second surface side to the other end on the first surface side.
(6)
The head chip according to any one of (1) to (5), wherein the first corrosion-resistant film contains at least one of gold (Au), platinum (Pt), and palladium (Pd). .
(7)
The head chip according to any one of (1) to (6) above, wherein the first adhesion film and the first anti-corrosion film are deposited films.
(8)
a head chip according to any one of (1) to (7);
and a supply mechanism for supplying the liquid to the head chip.
(9)
the liquid jet head according to (8);
A liquid jet recording apparatus comprising: a storage section that stores the liquid.
(10)
A method for manufacturing a head chip that includes an actuator plate that applies pressure to a liquid and ejects the liquid,
The step of forming the actuator plate includes:
providing a piezoelectric substrate having a first side and a second side facing away from the first side;
forming a first opening in the first surface of the piezoelectric substrate and forming a channel communicating with the first opening and having a depth direction in a direction from the first surface to the second surface;
forming a first adhesion film on the inner wall of the channel using a vapor deposition method;
forming a first corrosion-resistant film covering from one end of the first adhesion film on the first surface side to the other end on the second surface side by vapor deposition; A method of manufacturing a head chip, comprising: forming an electrode including a film.

DESCRIPTION OF SYMBOLS 1... Printer 3... Ink tank 4... Inkjet head 9... Ink 41, 41A... Inkjet head chip 42... Supply mechanism 410... Cover plate 411... Actuator plate 411p, 411z... Piezoelectric substrate 411f1... Front surface 411f2 Back surface 412 Nozzle plate 413 Support plate 415 Sealing plate C1 Channel C1d Dummy channel C1e Ejection channel Ed Drive electrode CF1, CF3 Adhesion film CF2, CF4: anti-corrosion film, eu, eu3: upper end, ed, ed3: lower end, Eda: active electrode, Edc: common electrode, H2: nozzle hole, P: recording paper, Wd: driving wall.

Claims (9)

A head chip that ejects the liquid, comprising an actuator plate that applies pressure to the liquid,
The actuator plate is
a first surface and a second surface facing away from the first surface;
a channel communicating with a first opening provided in the first surface and having a depth direction in a direction from the first surface to the second surface;
a first adhesion film provided on the inner wall of the channel and covering at least part of the inner wall; and a first adhesion film covering from one end of the first adhesion film on the first surface side to the other end on the second surface side. and an electrode including a corrosion resistant film ,
the channel communicates with the first opening and a second opening provided on the second surface;
The electrode further includes a second adhesion film provided closer to the second opening than the first adhesion film, and covering at least part of the second adhesion film from the second surface side in the depth direction. a second corrosion resistant film;
head tip. 2. The head chip according to claim 1, wherein the thickness of said first anti-corrosion film is the same as or greater than the thickness of said first adhesion film. the electrode has an overlapping portion where the second corrosion resistant film and the first adhesive film overlap,
3. In the overlapping portion, the second adhesion film, the second anti-corrosion film, the first adhesion film, and the first anti-corrosion film are laminated in this order from the inner wall side. Head tip as described. 4. The head chip according to claim 3 , wherein said second anti-corrosion film covers from one end of said second adhesive film on the second surface side to the other end on the first surface side of said second adhesion film. 5. The head chip according to claim 1 , wherein said first anti-corrosion film contains at least one of gold (Au), platinum (Pt) and palladium (Pd). 6. The head chip according to claim 1 , wherein said first adhesion film and said first anti-corrosion film are deposited films. a head chip according to any one of claims 1 to 6 ;
and a supply mechanism for supplying the liquid to the head chip. a liquid jet head according to claim 7 ;
A liquid jet recording apparatus comprising: a storage section that stores the liquid. A method for manufacturing a head chip that includes an actuator plate that applies pressure to a liquid and ejects the liquid,
The step of forming the actuator plate includes:
providing a piezoelectric substrate having a first side and a second side facing away from the first side;
forming a first opening in the first surface of the piezoelectric substrate and forming a channel communicating with the first opening and having a depth direction in a direction from the first surface to the second surface;
forming a first adhesion film on the inner wall of the channel using a vapor deposition method;
A vapor deposition method is used to form a first corrosion resistant film covering from one end of the first adhesion film on the first surface side to the other end on the second surface side, and the first adhesion film and the first corrosion resistance film are formed. forming an electrode comprising a membrane ;
said channel communicates with said first opening as well as a second opening provided in said second surface;
The electrode further includes a second adhesion film provided closer to the second opening than the first adhesion film, and covers at least part of the second adhesion film from the second surface side in the depth direction. and a second anti-corrosion film
A method of manufacturing a head chip.

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