JP2019140380A - Ledディスプレイパネル製造のためのマイクロledチップアレイ方法及びこれに用いられるマルチチップキャリア - Google Patents
Ledディスプレイパネル製造のためのマイクロledチップアレイ方法及びこれに用いられるマルチチップキャリア Download PDFInfo
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- JP2019140380A JP2019140380A JP2018230832A JP2018230832A JP2019140380A JP 2019140380 A JP2019140380 A JP 2019140380A JP 2018230832 A JP2018230832 A JP 2018230832A JP 2018230832 A JP2018230832 A JP 2018230832A JP 2019140380 A JP2019140380 A JP 2019140380A
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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Abstract
Description
本発明の他の目的は、各マイクロLEDチップのような微細なサイズの各LEDチップをばらつきなしで容易に集めて基材上に正確に移すのに用いられるマルチチップキャリアを提供することにある。
8 トランスファーフィルム
9 加圧ローラー
20 チップ維持フィルム
30 マイクロLEDチップ
32a、32b 電極パッド
40 マウント基板
45a、45b 電極
50 ソルダー
60 マルチチップキャリア
61 サクションプレート
62 チャック
70 マルチヒレ構造物
71 ヒレ
90 発熱ブロック
612 チップポケット
613 連結ホール
614 サクションホール
622 真空及び空気加圧通路
6121 スロープ
Claims (20)
- サクションホールを通じて減圧される複数のチップポケットが形成されたマルチチップキャリアを準備する段階と、
各マイクロLEDチップのそれぞれが前記各チップポケットのそれぞれの底に密着し、前記各マイクロLEDチップを前記各チップポケットにキャプチャリングする段階と、
前記各チップポケットにキャプチャリングされた前記各マイクロLEDチップを基材上にプレーシングする段階と、を含み、
前記各チップポケットのそれぞれは、前記底より大きい幅を有する入口から前記底までつながったスロープを含み、
前記スロープにより、前記基材上にプレーシングされた前記各マイクロLEDチップの中心間の間隔と前記各チップポケットの中心間の間隔とが同一であることを特徴とするマイクロLEDチップアレイ方法。 - 前記スロープにより、前記各チップポケット内に整列された前記各マイクロLEDチップのそれぞれの動きを規制することを特徴とする請求項1に記載のマイクロLEDチップアレイ方法。
- 前記各チップポケットのそれぞれの深さは、前記各マイクロLEDチップのそれぞれの厚さより小さいことを特徴とする請求項1に記載のマイクロLEDチップアレイ方法。
- 前記サクションホールは、前記マルチチップキャリアの前記底で前記各チップポケットのそれぞれに連結されて形成されることを特徴とする請求項1に記載のマイクロLEDチップアレイ方法。
- 前記各チップポケットのそれぞれに対する各サクションホールの個数は、複数個であることを特徴とする請求項4に記載のマイクロLEDチップアレイ方法。
- 前記マルチチップキャリアは、サクションプレートの一面に前記各チップポケットを形成し、前記サクションプレートの他面に前記各チップポケットの底で前記各チップポケットと連結される各サクションホールを形成したことを特徴とする請求項1に記載のマイクロLEDチップアレイ方法。
- 前記プレーシングする段階では、前記各マイクロLEDチップが前記基材上に置かれた状態で前記各チップポケット内部の圧力を増加させることを特徴とする請求項1に記載のマイクロLEDチップアレイ方法。
- 前記キャプチャリングする段階において、前記マイクロLEDチップの電極パッドは、前記マルチチップキャリアで前記各チップポケットを基準にして上側に位置し、前記プレーシングする段階において、前記マイクロLEDチップの電極パッドは、前記マルチチップキャリアで前記各チップポケットを基準にして下側に位置することを特徴とする請求項1に記載のマイクロLEDチップアレイ方法。
- 前記キャプチャリングする段階後、前記各チップポケットのそれぞれに前記マイクロLEDチップが整列された前記マルチチップキャリアを180度回転させることを特徴とする請求項1に記載のマイクロLEDチップアレイ方法。
- 前記キャプチャリングする段階では、前記各マイクロLEDチップのそれぞれの発光面が前記底と接し、前記各マイクロLEDチップのそれぞれの電極パッドが前記各チップポケットの外側に出るように、前記各マイクロLEDチップを前記各チップポケットにキャプチャリングすることを特徴とする請求項1に記載のマイクロLEDチップアレイ方法。
- 前記基材は、電極を有するマウント基板であって、前記プレーシングする段階では、前記電極パッドが前記電極に近接するように前記各マイクロLEDチップを前記マウント基板上にプレーシングすることを特徴とする請求項10に記載のマイクロLEDチップアレイ方法。
- 前記基材は、接着フィルムであって、前記プレーシングする段階では、前記電極パッドが前記接着フィルムに付着するように前記各マイクロLEDチップを前記接着フィルム上にプレーシングすることを特徴とする請求項10に記載のマイクロLEDチップアレイ方法。
- 前記接着フィルム上に付着した各マイクロLEDチップをマウント基板上に転写する段階を更に含むことを特徴とする請求項12に記載のマイクロLEDチップアレイ方法。
- 前記キャプチャリングする段階では、前記各マイクロLEDチップのそれぞれの電極パッド側が前記底と接し、前記各マイクロLEDチップのそれぞれの発光面が前記各チップポケットの外側に出るように、前記各マイクロLEDチップを前記各チップポケットにキャプチャリングすることを特徴とする請求項1に記載のマイクロLEDチップアレイ方法。
- 複数のマイクロLEDチップを一定の配列で整列し、その整列された各マイクロLEDチップを基材上にプレーシングするためのマルチチップキャリアであって、
前記複数のマイクロLEDチップを吸入するように、サクションプレートの一面に一定の配列で形成された複数のチップポケットを含み、
前記各チップポケットのそれぞれの底の形状及びサイズは、該当のチップポケットに吸入された各マイクロLEDチップのそれぞれの動きを規制するように定められ、
前記各チップポケットのそれぞれは、前記底より大きい幅を有する入口から前記底までつながったスロープを含むことを特徴とするマルチチップキャリア。 - 前記各チップポケットのそれぞれの深さは、前記各マイクロLEDチップのそれぞれの厚さより小さいことを特徴とする請求項15に記載のマルチチップキャリア。
- 前記マルチチップキャリアは、前記各チップポケットのそれぞれの底で前記各チップポケットのそれぞれに連結される複数のサクションホールを更に含むことを特徴とする請求項15に記載のマルチチップキャリア。
- 前記各チップポケットのそれぞれに対する各サクションホールの個数は、複数個であることを特徴とする請求項17に記載のマルチチップキャリア。
- 前記各サクションホールは、外部真空源と連結されたことを特徴とする請求項17に記載のマルチチップキャリア。
- 前記マルチチップキャリアは、Si、GaAs、サファイア又はALN材料で形成されたことを特徴とする請求項15に記載のマルチチップキャリア。
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KR1020180123402A KR102646798B1 (ko) | 2018-10-16 | 2018-10-16 | 엘이디 디스플레이 패널 제조를 위한 마이크로 엘이디 칩 어레이 방법 및 이에 이용되는 멀티 칩 캐리어 |
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WO2021101341A1 (ko) * | 2019-11-22 | 2021-05-27 | 한국기계연구원 | 소자 전사방법 및 이를 이용한 전자패널 제조방법 |
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WO2020100298A1 (ja) * | 2018-11-16 | 2020-05-22 | 堺ディスプレイプロダクト株式会社 | マイクロledデバイスおよびその製造方法 |
KR20200070901A (ko) * | 2018-12-10 | 2020-06-18 | 삼성전자주식회사 | 디스플레이 모듈, 이를 포함하는 디스플레이 장치 및 디스플레이 모듈 제조 방법 |
CN111183511A (zh) * | 2019-09-30 | 2020-05-19 | 重庆康佳光电技术研究院有限公司 | 一种led巨量转移的方法及装置 |
CN113129843A (zh) * | 2019-12-31 | 2021-07-16 | Tcl集团股份有限公司 | 灯板、背光控制系统及显示设备 |
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CN113450653B (zh) * | 2021-06-30 | 2023-03-24 | 武汉天马微电子有限公司 | 可拉伸显示面板及其控制方法、显示装置 |
CN113611786B (zh) * | 2021-08-02 | 2022-09-27 | 东莞市中麒光电技术有限公司 | 剥离良率高且方便倒膜的led芯片巨量转移方法 |
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