JP2019128375A - Correction information generating method, drawing method, correction information generating system, and drawing system - Google Patents

Abstract

To provide a method for stably performing a pairing process for a marker required when generating a correction information used to correct the drawing data of an image drawn on a substrate.SOLUTION: In the method, the process (d) for associating a measurement position with a design position includes: a process (d-1) for collecting a measurement position arranged in one row manner in a first direction from multiple measurement positions as a measurement position row; a process (d-2) for collecting, among multiple design positions, a design position corresponding to the measurement position row as a design position row; and a process (d-3) for associating, among the design position row, the design position nearest to the measurement position with each measurement position constituting the measurement position row, and in which the processes (d-1), (d-2) and (d-3) are performed for each measurement position row arranged in a second direction orthogonal to the first direction.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a technology for generating correction information used to correct drawing data of an image drawn on a substrate based on position information of a mark on the substrate.

  Conventionally, a pattern can be drawn by irradiating a photosensitive material formed on a semiconductor substrate, a printed circuit board, a glass substrate for a plasma display device or a liquid crystal display device (hereinafter referred to as “substrate”) with light. It has been done. 2. Description of the Related Art In recent years, with the development of high definition patterns, drawing apparatuses that scan a light beam on a photosensitive material to directly draw a pattern have been used.

  For example, in the drawing apparatus of Patent Document 1, a pattern described in CAD data by irradiating a modulated laser beam from an optical head to a wafer (a so-called mold wafer) having a plurality of semiconductor chips mounted on the surface. Are drawn over each semiconductor chip.

JP 2017-68002 A

  By the way, in the mold wafer as described above, a positional deviation due to a positional deviation when mounting a semiconductor chip or a stress generated during a molding occurs. In order to perform drawing by correcting such discrete positional deviation, in the drawing apparatus described in Patent Document 1, one mark is taken as a mark of attention in a measurement image obtained by imaging the entire wafer, or from the measurement position in the vertical direction or A measurement position is acquired by extracting a mark included in an adjacent area centered on an adjacent center position that is separated by a predetermined distance in the horizontal direction as an adjacent mark. Such an acquisition process is repeated while using adjacent marks as new attention marks until the measurement positions of all the marks on the measurement image are acquired. Then, after performing a pairing process in which the measurement positions of all the marks on the measurement image are associated with the design positions of the marks, CAD data (drawing is drawn based on the difference between the measurement positions and the design positions of the corresponding marks. Correction information for correcting (data) is generated.

  However, the pairing process is based on the premise that all the marks are included in the measurement image and the marks are detected. Therefore, when a mark can not be detected due to dirt or the like on the substrate, the measurement position can not be obtained for the mark and the subsequent marks, and the pairing process can not be performed correctly.

  The present invention has been made in view of the above problems, and can stably perform mark pairing processing which is necessary when generating correction information used to correct drawing data of an image drawn on a substrate. The purpose is to provide technology.

  According to a first aspect of the present invention, there is provided a correction information generation method for generating correction information used for correcting drawing data of an image drawn on a substrate based on position information of a plurality of marks arranged in a lattice pattern on the substrate. (A) a step of preparing a design position of a plurality of landmarks, (b) a step of photographing a plurality of landmarks to obtain a measurement image, and (c) obtaining a measurement position of each landmark in the measurement image. A step of associating each measurement position acquired in steps (d) and (c) with a design position, and a difference between the measurement position and the design position associated in steps (e) and (d), A step of generating correction information used for correcting the drawing data, and the step (d) includes (d-1) measuring positions arranged in a line in the first direction from a plurality of measurement positions. Collecting as (d-2) multiple designs And collecting the design positions corresponding to the measurement position row as the design position row among the positions, and (d-3) designing the nearest measurement position among the design position rows for each measurement position constituting the measurement position row And (d-1), (d-2), and (d-3) are performed for each measurement position array arranged in the second direction orthogonal to the first direction. It is characterized by

  A second aspect of the present invention is a drawing method for drawing an image on a substrate, the step of obtaining correction information by the correction information generation method, and the drawing of an image to be drawn on a substrate using the correction information It is characterized by comprising the steps of: correcting the data; and scanning the light modulated on the basis of the corrected drawing data on the substrate.

  According to a third aspect of the present invention, correction information for generating correction information used for correcting drawing data of an image to be drawn on a substrate based on position information of a plurality of marks arranged in a grid pattern on the substrate. Acquired by a design position storage unit that stores design positions of a plurality of marks, a measurement position acquisition unit that acquires measurement positions of each mark in a measurement image obtained by photographing the plurality of marks, and a measurement position acquisition unit Correction information used for correcting drawing data based on the difference between the design position and the pairing processing unit that associates each measured position with the design position of the mark, and the pairing processing unit The pairing processing unit acquires a plurality of measurement positions arranged in a line from the plurality of measurement positions in the first direction as a measurement position sequence, and includes a plurality of designs. A column pairing operation is performed in which a plurality of design positions corresponding to the measurement position sequence are obtained as design position sequences, and the nearest design position in the design position sequence is associated with each measurement position constituting the measurement position sequence. It is characterized in that it is performed for each measurement position row arranged in the second direction orthogonal to the one direction.

  Furthermore, a fourth aspect of the present invention is a drawing device that draws an image on a substrate, and uses the correction information generated by the light source unit, the correction information generation device, and the correction information generation device on the substrate. A drawing data correction unit that corrects drawing data of an image to be drawn, a light modulation unit that modulates light from the light source unit based on drawing data corrected by the drawing data correction unit, and light modulated by the light modulation unit And a scanning mechanism for scanning on the substrate.

  In the invention configured as described above, the measurement position sequence is collected from the measurement positions of the marks included in the measurement image, and the design position sequence corresponding to the measurement position sequence is collected. Thus, after the measurement position sequence and design position sequence related to each other are extracted, the measurement positions constituting the measurement position sequence are associated with the design positions of the design position sequence and paired. Therefore, even if the measurement position to be included in the measurement position sequence is originally missing, the other measurement positions are paired with the design position.

  As described above, according to the present invention, even when a part of a plurality of marks cannot be detected due to dirt on the substrate, the measurement position and the design position are associated with each other. It is possible to stabilize the pairing process.

FIG. 1 is a diagram showing a schematic configuration of a direct drawing apparatus 1 which is a drawing apparatus according to an embodiment of the present invention. It is a top view which shows an example of the upper surface of a board | substrate. It is a block diagram which shows the function of a control part. It is a figure which shows the flow of drawing of the image to a board | substrate. It is a flowchart which shows the pairing process performed when producing | generating correction information. It is a flowchart which shows calculation of the rotation angle performed by a pairing process. It is a figure which shows an example of the measurement position before and behind execution of rotation and an offset. It is a flowchart which shows a lower side search and collection process. It is a figure which shows typically the determination conditions performed in FIG. It is a flowchart which shows collection operation of the measurement position which constitutes the selected measurement position sequence.

  FIG. 1 is a diagram showing a schematic configuration of a direct drawing apparatus 1 which is a drawing apparatus according to an embodiment of the present invention. The direct writing apparatus 1 is an apparatus that applies light to the upper surface of a substrate 9 on which a photosensitive layer, which is a layer of a photosensitive material such as a resist, is formed, and draws an image of a pattern on the substrate 9. The substrate 9 is various substrates such as a semiconductor substrate, a printed wiring substrate, a color filter substrate, a liquid crystal display device, an organic EL display device, a glass substrate for a flat panel display device such as a plasma display device, a recording disk substrate, and the like. Good.

  The direct drawing apparatus 1 includes a stage 11, a stage moving mechanism 12, a light source unit 13, an optical head 14, a transport robot 15, a cassette mounting unit 16, a base 17, a cover 18, a control unit 19 and the like. The cover 18 covers the upper side of the base 17 and forms a processing space in which the substrate 9 is processed. In the processing space, a stage 11, a stage moving mechanism 12, a light source unit 13, an optical head 14, and a transfer robot 15 are arranged. The light source unit 13 may be disposed outside the processing space. The direct drawing apparatus 1 is also provided with an alignment unit (not shown).

  The stage moving mechanism 12 is disposed on the base 17. The stage moving mechanism 12 includes a Y-direction moving mechanism 121, an X-direction moving mechanism 122, and a rotation mechanism 123. The stage 11 holds the substrate 9 in the horizontal posture on the upper surface thereof. The stage moving mechanism 12 is a moving mechanism that moves the substrate 9 together with the stage 11. The rotation mechanism 123 rotates the stage 11 around a central axis that faces the Z direction that is the vertical direction. The X-direction moving mechanism 122 moves the rotation mechanism 123 and the stage 11 in the X direction which is the sub-scanning direction. The X direction is a horizontal direction perpendicular to the Z direction. The Y-direction moving mechanism 121 moves the X-direction moving mechanism 122, the rotating mechanism 123, and the stage 11 in the Y direction that is the main scanning direction. The Y direction is a horizontal direction perpendicular to the Z direction and the X direction.

  The Y-direction moving mechanism 121 has a linear motor and a guide rail 212, and moves the X-direction moving mechanism 122 along the guide rail 212 by the linear motor. The X-direction moving mechanism 122 also includes a linear motor 221 and a guide rail 222, and the rotating mechanism 123 is moved along the guide rail 222 by the linear motor 221.

  The light source unit 13 is supported by a support 131 fixed to the base 17. The optical head 14 is connected to the light source unit 13. The number of the optical heads 14 may be two or more. In this case, for example, the optical heads 14 are arranged in the X direction. The light source unit 13 includes a laser driving unit, a laser oscillator, and an optical system. The light beam generated by the light source unit 13 is guided to the optical head 14.

  The optical head 14 includes a spatial light modulator 141 that is a light modulation unit that modulates the light from the light source unit 13. The spatial light modulator 141 is, for example, GLV (registered trademark) (grating light valve). The spatial light modulator 141 may be a DMD (Digital Mirror Device) or the like. The optical head 14 is spatially modulated by the spatial light modulator 141 and an optical system that converts the light beam from the light source unit 13 into linear light whose beam cross section is linear and guides it to the spatial light modulator 141. And an optical system for guiding the light beam to the substrate 9.

  The unprocessed substrate 9 is placed on the cassette placing portion 16 while being accommodated in the cassette 161. The substrate 9 is taken out from the cassette 161 by the transfer robot 15 through the opening of the cover 18 and placed on the stage 11. Then, the control unit 19 controls the alignment unit, and the position and rotational position of the substrate 9 in the XY direction are adjusted.

  The stage 11 is moved in the Y direction by the Y direction moving mechanism 121, and in parallel, a light beam spatially modulated from the optical head 14 is emitted toward the substrate 9, and a pattern is drawn on the substrate 9. When the movement in the Y direction is completed, the stage 11 moves stepwise in the X direction by the X direction movement mechanism 122, and drawing is performed while moving in the opposite direction to the previous direction from the Y direction movement mechanism 121. When the above operation is repeated and drawing is performed on the entire area to be drawn on the substrate 9, the substrate 9 is transferred from the stage 11 to the cassette 161 by the transfer robot 15.

  In the direct drawing apparatus 1, the stage moving mechanism 12 is a scanning mechanism that scans the light modulated by the spatial light modulator 141 on the substrate 9. As the scanning mechanism, a mechanism for moving the optical head 14 in the X direction and the Y direction on the fixed stage 11 may be provided. The direct drawing apparatus 1 further includes an imaging unit 21 that images the upper surface 91 of the substrate 9. The imaging unit 21 is attached to, for example, the optical head 14.

  FIG. 2 is a plan view showing an example of the upper surface of the substrate. The substrate 9 is obtained by mounting a plurality of semiconductor chips 92 on a substantially disk-shaped semiconductor substrate and molding the plurality of semiconductor chips 92 with a resin (so-called mold substrate). Each semiconductor chip 92 has a substantially rectangular shape in plan view. In the example shown in FIG. 2, a mark 93 is provided at the upper left corner of each semiconductor chip 92. The mark 93 is, for example, an alignment mark provided on the upper surface of each semiconductor chip 92. The mark 93 may be a part of a pattern provided on the upper surface of the semiconductor chip 92. Although the mark 93 is shown as a black circle in FIG. 2, the shape of the mark 93 may be variously changed. Also, the number and arrangement of the semiconductor chips 92 and the number and arrangement of the marks 93 may be variously changed.

  The plurality of marks 93 are arranged in a lattice pattern on the substrate 9 in the horizontal direction (X direction) and the vertical direction (Y direction) in FIG. In the following description, the X direction and the Y direction will be simply referred to as "horizontal direction" and "longitudinal direction". In addition, as described later, since the measurement positions are collected in units of mark rows arranged in a line in the Y direction, as shown in FIG. 2, 4 arranged in a line in the Y direction on the most upstream side in the X direction. The three marks 93 are collectively called a mark row 941, and the four marks 93 constituting the mark row 941 are called marks 93 a to 93 d, respectively. Moreover, the same applies to the other mark rows 942 to 944. That is, the four marks 93 constituting the mark row 942 are referred to as marks 93e to 93h, the four marks 93 constituting the mark row 943 are referred to as marks 93i to 93l, respectively, and the four marks 93 constituting the mark row 944 are included. Are called marks 93m to 93p respectively.

  In the direct drawing apparatus 1, the drawing data of the image drawn on the substrate 9 is corrected by the control unit 19 based on the position information of the mark 93 on the substrate 9, and a plurality of semiconductor chips 92 are based on the corrected drawing data. A pattern is drawn on top. The correction of the drawing data will be described later. In the substrate 9, the upper surfaces of the plurality of semiconductor chips 92 are a plurality of pattern drawing areas in which patterns are drawn.

  FIG. 3 is a block diagram showing the function of the control unit. FIG. 3 also shows a part of the configuration of the direct drawing apparatus 1 connected to the control unit 19. The control unit 19 has a general computer system configuration including a CPU that performs various types of arithmetic processing, a ROM that stores a basic program, and a RAM that stores various information. The function of the control unit 19 may be realized by a dedicated electrical circuit, or a partially dedicated electrical circuit may be used.

  As shown in FIG. 3, the control unit 19 includes a correction information generation device 31 and a drawing data correction unit 32. The correction information generation device 31 includes a design position storage unit 311, a measurement position acquisition unit 312, a pairing processing unit 313, and a correction information generation unit 314. The correction information generation device 31 generates correction information used for correcting drawing data of an image drawn on the substrate 9 based on the position information of the mark 93 on the substrate 9. The drawing data correction unit 32 corrects the drawing data of the image to be drawn on the substrate 9 using the correction information generated by the correction information generation device 31.

  Next, the flow of drawing an image on the substrate 9 by the direct drawing apparatus 1 will be described with reference to FIG. In the direct drawing apparatus 1, first, the design positions of the plurality of marks 93 arranged in a grid pattern in the vertical direction and the horizontal direction on the substrate 9 are stored in the design position storage unit 311 of the correction information generation apparatus 31. It is prepared (step S1). That is, the set positions of the marks 93 a to 93 p are extracted from, for example, CAD data that is design data of an image to be drawn on the substrate 9 and stored in the design position storage unit 311. For this reason, the correction information generation device 31 can appropriately collect all or part of the set positions of the marks 93a to 93p.

  In the design data, the Y-direction interval (interval PT in FIG. 9 described later) of the mark 93 in each of the mark rows 941 to 944 and the X-direction interval of the mark rows 941 to 944 are both set to about 2 mm. However, they may be different from each other. Moreover, it is not limited to 2 mm.

  Subsequently, the upper surface 91 of the substrate 9 on the stage 11 is imaged by the imaging unit 21, and an image of the substrate 9 (hereinafter referred to as “measurement image”) is acquired (step S2). The measurement image of the substrate 9 is an image obtained by photographing all the marks 93 on the substrate 9. The measurement image acquired by the imaging unit 21 is sent to the measurement position acquisition unit 312 of the control unit 19.

  The measurement position acquisition unit 312 recognizes a mark image (not shown) included in the measurement image, acquires the positions of all the marks 93, and temporarily stores them in the RAM (step S3). In the following description, the position of the mark on the measurement image is referred to as “measurement position”, and the measurement positions Pa (xa, ya) to Pp (xp) are the measurement positions of the marks 93a to 93p acquired by executing step S3. , Yp), or simply as measurement positions Pa to Pp. In addition, since the conventionally well-known thing can be used about the method of calculating | requiring the measurement position of the mark 93 from a measurement image, detailed description is abbreviate | omitted here.

  Thus, when the acquisition of the design position and the measurement position for all the marks 93 is completed, the pairing processing unit 313 executes the pairing process, and the measurement positions of the marks 93 are associated with the design positions (step S4). The pairing process will be described in detail later.

  In the next step S5, for each mark 93, correction information used for correcting drawing data is generated based on the difference between the measurement position and the design position associated with each other by the pairing process. Specifically, the deviation of the measurement position of each mark 93 from the design position is acquired as the position deviation from the design position of the semiconductor chip 92 corresponding to each mark 93, and the positions of all the semiconductor chips 92 on the substrate 9 are obtained. Correction information for correcting the deviations is generated. In the case where rotation correction or shift correction is performed in the pairing process as will be described later, generation of correction information is performed in consideration of these correction contents.

  When the correction information is acquired as described above, the drawing data correction unit 32 corrects the drawing data of the image to be drawn on the substrate 9 using the correction information (step S6). Specifically, the position of the pattern to be drawn on each semiconductor chip 92 included in the drawing data is corrected based on the correction information indicating the positional deviation from the design position of each semiconductor chip 92. The modulated light is scanned on the substrate by controlling the spatial light modulator 141 and the stage moving mechanism 12 based on the corrected drawing data. Thereby, the pattern for each semiconductor chip 92 included in the drawing data is accurately drawn on each corresponding semiconductor chip 92 in consideration of the positional deviation of the semiconductor chip 92 (step S7).

  Next, the pairing process will be described in detail with reference to FIGS. FIG. 5 is a flowchart showing the pairing process performed when the correction information is generated. This pairing process is a process of associating the position of each mark 93 measured based on the measurement image, that is, the measurement position with the design position. In this embodiment, not only the positional deviation of the semiconductor chip 92 with respect to the substrate 9 is generated, but the substrate 9 itself is rotated with respect to a preset reference position or is shifted and placed on the stage 11. There is a possibility. When such rotation or shift displacement is large, if the pairing process is performed while such rotation or shift displacement is generated, the accuracy may be reduced. Therefore, in this embodiment, by performing steps S41 to S43 before pairing the measurement position and the design position as shown in FIG. 4, the stage 11 on which the substrate 9 is mounted is actually rotated. In addition, the measurement position on the data is corrected for rotation without shifting in the X direction or the Y direction, and the measurement position is offset by shift correction. Including misalignment components due to shift displacement is suppressed.

  More specifically, the pairing processing unit 313 executes the process of calculating the rotation angle (step S41) shown in FIG. 6 to calculate the rotation angle of the substrate 9. In this calculation processing, instead of using the measurement positions of all the marks 93, a measurement position sequence arranged in a line in the Y direction is extracted and the measurement position sequence is used. For example, when the measurement positions Pa (xa, ya) to Pd (xd, yd) of the marks 93a to 93d constituting the mark array 941 are used, they are extracted from all the measurement positions and used as the measurement position array for calculating the rotation angle. Function. In the following, the “measurement position sequence” described above means a measurement position group arranged in a line in the Y direction. For example, in FIG. 7, the measurement positions Pa (xa, ya) of the mark row 941 ) To Pd (xd, yd), and a measurement position sequence P942 including measurement positions Pe (xe, ye) to Ph (xh, yh) of the mark array 942 are illustrated. .

  In this embodiment, the pairing processing unit 313 is provided with two types of storage units, that is, a ListMes storage unit 313a and a ListLeft storage unit 313b, in order to extract the measurement position sequence. In addition, the pairing processing unit 313 further includes a ListCAD storage unit 313c for pairing processing described later. Among these, the ListMes storage unit 313a stores all measurement positions Pa (xa, ya) to Pp (xp, yp) immediately after the start of the rotation angle calculation process (step S411).

  In the next step S412, the measurement positions Pa (xa, ya) to Pp (xp, yp) stored in the ListMes storage unit 313a are sorted in ascending order by the X coordinate. For example, as shown in the column (a) of FIG. 7, when the measurement position Pa is located at the uppermost stream in the X direction, the measurement position Pa (xa, ya) is set to ListMes according to the arrangement order of the marks 93a to 93d. It is located at the top in the storage unit 313a. On the other hand, when the measurement position Pb is located at the uppermost stream in the X direction as shown in the column (b) of FIG. 9, the measurement position Pb (xb, yb) is located at the head in the ListMes storage unit 313a. Then, the measurement position located at the head of the ListMes storage unit 313a that has been subjected to the ascending sort is extracted from the ListMes storage unit 313a, and stored in the ListLeft storage unit 313b of the pairing processing unit 313 as the position P0 (step S413).

  This position P0 means the extraction start position of the measurement position row, and the lower search / collection process (step S414) of the measurement position from which the measurement position is searched and collected toward the lower side of FIG. The upper search and collection process (step S415) of the measurement position to search and collect the measurement position toward the upper side of FIG. 7 is sequentially executed. Since these two processes are substantially the same except that the search directions are opposite, the lower search / collection process (step S414) will be described in detail with reference to FIG. 8 and FIG. Description of the upper search / collection process (step S415) is omitted.

  FIG. 8 is a flowchart showing a lower side search / collection process in which measurement positions arranged in a line in the Y direction are searched, extracted, and collected. FIG. 9 is a diagram schematically showing the determination conditions executed in FIG. Here, the position P0 is first set as the reference position p_ref (xr, yr) (step S414a). Then, the measurement position p_ref. Is lower than the reference position p_ref (xr, yr) (lower side in FIG. 9). It is determined whether next () exists (step S414b). For example, as shown in the column (a) of FIG. 9, when another measurement position exists at the lower position away from the reference position p_ref (xr, yr) by the interval PT, it is measured position p_ref. While it corresponds to next (), as shown in the column (b) of the same figure, the measurement position is missing at the above-mentioned near position, and it is a distance away from the reference position p_ref (xr, yr) by an interval (2 × PT) If another measurement position exists in the position, it is determined by the measurement position p_ref. Corresponds to next (). In addition, below the reference position p_ref (xr, yr), the measurement position p_ref. If next () does not exist ("NO" in step S414b), the lower search / collection process (step S414) is terminated, and the process proceeds to the upper search / collection process (step S415).

In step S414b, the measurement position p_ref. When the presence of next () is confirmed, as shown in FIGS. 8 and 9, the measurement position p_ref. Next () is set (step S414c), and the process proceeds to step S414d. In step S414d, it is determined whether the following determination condition A is satisfied. This determination condition A has a condition related to the X coordinate and a condition related to the Y coordinate. Specifically, the condition regarding the X coordinate is the X coordinate p_cur. x is the following inequality p_ref. x-α <p_cur. x <p_ref. x + α
However, p_ref. x is the X coordinate of the reference position p_ref, that is, xr,
α is an allowable value of displacement, for example, a value of 1/10 of the interval PT,
Means to satisfy.

Further, the condition regarding the Y coordinate of the determination condition A is that the Y coordinate p_cur. y is the following inequality p_ref. y-PT + α <p_cur. y <p_ref. y-3 × PT-α
However, p_ref. y is the Y coordinate of the reference position p_ref, that is, xy,
Means to satisfy. That is, satisfying the determination condition A including these is within the allowable area indicated by the broken line in FIG. 9, for example, and the measurement position p_cur is aligned in the Y direction below the reference position p_ref (xr, yr). It means that the measurement positions are included in the measurement position sequence.

  Thus, when the determination condition A is satisfied and “True” is determined in step S414d, the measurement position p_cur is extracted from the ListMes storage unit 313a as the measurement position constituting the measurement position sequence and stored in the ListLeft storage unit 313b. At the same time as (step S414e), the measurement position p_cur is set to a new reference position p_ref (step S414f), and then the process returns to step S414b. Therefore, while it is determined “True” in step S414d, the measurement positions arranged in a line in the Y direction are sequentially extracted from the ListMes storage unit 313a and stored in the ListLeft storage unit 313b.

  On the other hand, when the determination condition A is not satisfied in step S414d and the determination is "False", the process proceeds to step S414g, and the ListMes storage unit 313a causes the next measurement position p_cur. It is determined whether next () exists. Then, the next measurement position p_cur. If next () exists, this is set as a new measurement position p_cur (step S414h), and the process returns to step S414d.

  By executing such a series of processes, the measurement positions arranged in a line in the Y direction from the head position P0 are taken out from the ListMes storage unit 313a. For example, in the case shown in column (a) of FIG. 7, the measurement positions Pa to Pd are taken out and collected, while in the case shown in column (b) of FIG. 7, the measurement positions Pb to Pd are taken out and collected.

  If only the lower search / collection process (step S414) is performed, in the case shown in the column (b) of FIG. 7, the collection of the measurement position Pa that should be collected is forgotten. By executing the upper search / collection process (step S415) following (step S), the measurement position Pa in the case of the (b) column of FIG. 7 is also reliably collected. Therefore, in the present embodiment, as described above, the lower search / collection process (step S414) and the upper search / collection process (step S415) are continuously performed. Then, it is determined whether or not the number of measurement positions collected following these, that is, the number of collection, exceeds a predetermined threshold (step S416).

  If “NO” is determined in step S416, in other words, if the measurement position sufficient for calculating the rotation angle has not been collected, the stored content of the ListLeft storage unit 313b is cleared (step S417) and the measurement position is set. The first position to be extracted (memory address at which the measurement position is first extracted from the ListMes storage unit 313a) is changed (step S418). After that, the process returns to step S413 and the above series of processing (steps S413 to S416) is repeated. As a result, another measurement position row P942 and the like are newly taken out for rotation correction instead of the measurement position row P941.

  On the other hand, if “YES” is determined in step S416, that is, if the measurement position sequence extends to some extent in the Y direction and the tilt of the measurement position sequence, that is, the rotation angle of the substrate 9 can be calculated, The process proceeds to step S419. Here, the rotation angle is calculated by line segment approximation based on the collected measurement positions.

  Returning to FIG. When the calculation of the rotation angle (step S41) is completed as described above, all the measurement positions Pa to Pp are rotated in the opposite direction by the rotation angle, and the rotation correction of the measurement position is executed (step S42). Further, all the measurement positions Pa to Pp whose rotation has been corrected are shifted in the X direction and the Y direction, and the offset of the measurement positions Pa to Pp is executed (step S43). As a result, for example, as shown in the column (c) of FIG. 7, the measurement positions Pa to Pp are aligned with respect to the design position (square marks in the figure). As a result, the influence of the rotation of the substrate 9 and the mounting displacement of the substrate 9 on the stage 11 can be suppressed.

  Next, steps S44 to S48 are repeated by the number of measurement position rows P941 to P944, and the measurement position and the design position are paired for each measurement position row. That is, one of the measurement position sequences P941 to P944 for which pairing has not been completed is selected (step S44), and the measurement positions constituting the selected measurement position sequence are collected (step S45).

  FIG. 10 is a flowchart showing the collection operation of the measurement positions constituting the selected measurement position sequence. In this collection operation (step S45), all of the measurement positions subjected to the rotation correction and the shift correction are stored in the ListMes storage unit 313a (step S450) and then sorted in ascending order by the X coordinate (step S451). Then, measurement positions for one column are collected in the Y direction from the measurement positions sorted in ascending order (steps S452 to S459). The specific collection method is basically the same as the lower search / collection (steps S414a to S414h) shown in FIG. For example, when the most upstream measurement position sequence P941 in the X direction is collected, the first measurement position stored in the ListMes storage unit 313a after the ascending sort is extracted as the position P0 and stored in the ListLeft storage unit 313b. Then, the position P0 is set as the reference position p_ref (xr, yr) (step S452).

Next, below the reference position p_ref (xr, yr), the measurement position p_ref. It is determined whether next () exists (step S453), and the measurement position p_ref. When the presence of next () is confirmed, the measurement position p_ref. Next () is set (step S454), and the process proceeds to step S455. In step S455, it is determined whether the following determination condition C is satisfied. This determination condition C is composed only of conditions relating to the X coordinate. This is because the measurement positions stored in the ListMes storage unit 313a have undergone rotation correction and shift correction, and the measurement positions to be collected are arranged in a line in the Y direction. . Therefore, in step S455, the X coordinate p_cur. Of the position p_cur. x is the following inequality p_ref. x-α <p_cur. x <p_ref. x + α
Whether or not the above is satisfied is determined. If it is determined that the determination condition C is satisfied (“True” in step S456), that is, the measurement position p_cur is a measurement position constituting the measurement position sequence to be collected, the measurement position p_cur is paired. The target measurement position is extracted from the ListMes storage unit 313a and stored in the ListLeft storage unit 313b (step S456), and the measurement position p_cur is set as a new reference position p_ref (step S457), and then the process returns to step S453. Therefore, while it is determined as “True” in step S455, the measurement positions to be collected are sequentially extracted from the ListMes storage unit 313a as pairing targets and stored in the ListLeft storage unit 313b.

  On the other hand, if the determination condition C is not satisfied in step S455 and the determination is “False”, the process proceeds to step S458, and the ListMes storage unit 313a causes the measurement position p_cur. It is determined whether next () exists. Then, the next measurement position p_cur. If next () exists, this is set as a new measurement position p_cur (step S459), and the process returns to step S455. By executing such a series of processes, the measurement positions arranged in a line in the Y direction from the position P0 are taken out from the ListMes storage unit 313a and collected, and a measurement position string for pairing is obtained.

  Returning to FIG. 5 again, the description will be continued. In the next step S46, the design position for one column corresponding to the measurement position column is collected from the design position storage unit 311 as a pairing candidate and stored in the ListCAD storage unit 313c (step S46). Subsequently, the measurement position stored in the ListLeft storage unit 313b is associated with the nearest one of the design positions stored in the ListCAD storage unit 313c, and pairing is performed (step S47).

  Such a series of processing (steps S44 to S47) is repeated while there is a measurement position sequence that has not been paired (“YES” in step S48). Then, when pairing is completed for all measurement processing sequences, the pairing process (step S4) is ended, and after the correction information generation (step S5) and the drawing data correction (step S6) described above are performed, the substrate The drawing for 9 is executed (step S7).

  As described above, according to the present embodiment, the measurement positions Pa to Pd arranged in a line in the Y direction from the measurement positions Pa to Pp of the marks 93a to 93p included in the measurement image are collected as the measurement position array P941. (Step S45), and a design position sequence corresponding to the measurement position sequence P941 is collected (step S46). Then, the measurement positions Pa to Pd constituting the measurement position row P941 are paired in association with the design position of the design position row (step S47). Therefore, even if some of the measurement positions that should be included in the measurement position row P941 are missing, the other measurement positions are reliably paired with the design position. Such a column pairing operation (steps S45 to S47) is performed in the same manner for the other measurement position columns P942 to P944 arranged in the X direction. Therefore, even when a part of the plurality of marks 93 cannot be detected due to dirt on the substrate 9, the measurement position and the design position can be correctly associated with the remaining marks 93, and pairing is performed. Processing can be stabilized.

  In addition, since the pairing process can be accurately and stably performed as described above, the semiconductor chips 92 can be mounted on the substrate 9 with high density.

  Thus, in this embodiment, steps S1, S2, S3, S4, and S5 are respectively “(a) step”, “(b) step”, “(c) step”, and “(d) step” of the present invention. , “(E) step”. In addition, steps SS41, S42, S43, S45, S46, and S47 are the “(d-4) step”, “(d-5) step”, “(d-6) step”, “(d− This corresponds to an example of “1) step”, “(d-2) step”, and “(d-3) step”. Further, steps S45 to S47 correspond to an example of the "column pairing operation" in the present invention. Further, the Y direction (vertical direction) and the X direction (horizontal direction) correspond to the “first direction” and the “second direction” of the present invention, respectively.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above embodiment, the measurement position sequence is acquired by collecting the measurement positions in the Y direction, but the measurement position sequence may be acquired by collecting the measurement positions in other directions, for example, the X direction.

  In the above embodiment, the column pairing operation (steps S45 to S47) is repeatedly performed based on the measurement position after the rotation correction (step S42) and the shift correction (step S43) are performed. And at least one of the shift correction may be omitted. That is, the column pairing operation is executed based on the measurement position where only rotation correction is performed, the measurement position where only shift correction is performed, or the measurement position obtained in step S3 without performing any rotation correction and shift correction. May be

  In the above embodiment, the rotation correction (step S42) and the shift correction (step S43) are performed on the data without performing the rotation and offset of the substrate 9. However, in the pairing process, the rotation correction (step S42) is performed. ), The rotation is corrected by rotating the stage 11, and instead of the shift correction (step S43), the stage 11 is shifted in the X direction and the Y direction to perform the shift correction. The substrate 9 may be mechanically aligned. In this case, it is desirable to newly acquire the measurement image after the alignment and acquire the measurement positions of all the marks on the measurement image.

  In the above-described embodiment, the rotation correction is performed using the measurement position. However, when a plurality of alignment marks are provided on the upper surface 91 of the substrate 9 in addition to the mark 93, these alignment marks are imaged. Rotational correction or shift correction may be performed based on the position information obtained as a result.

  Further, the correction information generating device 31 is a device that generates correction information used for correcting drawing data of an image drawn on the substrate 9 based on the position information of the mark on the substrate 9 (for example, a computer system as described above). ) May be used alone. Alternatively, the correction information generation device 31 may be used together with a device other than the direct drawing device 1.

  The present invention can be applied to all techniques for generating correction information used for correcting drawing data of an image drawn on the substrate based on position information of a mark on the substrate.

1 ... Direct drawing device (drawing device)
9 ... Substrate 12 ... Stage moving mechanism (scanning mechanism)
DESCRIPTION OF SYMBOLS 13 ... Light source part 31 ... Correction information generation apparatus 32 ... Drawing data correction part 93a-93p ... Mark 141 ... Spatial light modulator (light modulation part)
311 ... Design position storage unit 312 ... Measurement position acquisition unit 313 ... Pairing processing unit 313a ... ListMes storage unit 313b ... ListLeft storage unit 313c ... ListCAD storage unit 314 ... Correction information generation unit P941-P944 ... Measurement position sequence Pa-Pp ... Measurement position

Claims (6)

A correction information generation method for generating correction information used for correcting drawing data of an image to be drawn on the substrate based on position information of a plurality of marks arranged in a grid pattern on the substrate,
(A) preparing a design position of the plurality of landmarks;
(B) photographing the plurality of landmarks to obtain a measurement image;
(C) obtaining a measurement position of each mark in the measurement image;
(D) associating each measurement position acquired in the step (c) with the design position;
(E) generating correction information used for correcting drawing data based on the difference between the measurement position and the design position associated in the step (d),
The step (d)
(D-1) collecting measurement positions arranged in a line in a first direction from the plurality of measurement positions as a measurement position string;
(D-2) collecting, as a design position sequence, design positions corresponding to the measurement position sequence among the plurality of design positions;
(D-3) associating a design position nearest to the measurement position in the design position sequence for each measurement position constituting the measurement position sequence,
The step (d-1), the step (d-2), and the step (d-3) are performed for each of the measurement position rows arranged in a second direction orthogonal to the first direction. Correction information generation method to be performed. The correction information generation method according to claim 1,
The step (d)
(D-4) determining a rotation angle at which the measurement position acquired by the step (c) is rotating with respect to the design position on a plane including the first direction and the second direction;
(D-5) correcting the measurement position by rotating the measurement position relative to the design position by the rotation angle;
Prior to executing the step (d-1), the step (d-2) and the step (d-3) for all the measurement position sequences, the step (d-4) and the step (d-5) And performing the steps (d-1), (d-2) and (d-3) based on the corrected measurement positions obtained by executing the step (d-5). Correction information generation method to be executed. The correction information generation method according to claim 1,
The step (d)
(D-4) determining a rotation angle at which the measurement position acquired by the step (c) is rotating with respect to the design position on a plane including the first direction and the second direction;
(D-5) correcting by relatively rotating the measurement position with respect to the design position by the rotation angle;
(D-6) including a step of correcting the measurement position corrected by the step (d-5) in the plane by shifting the measurement position with respect to the design position.
Prior to executing the step (d-1), the step (d-2) and the step (d-3) for all the measurement position sequences, the step (d-4), the step (d-5) And the step (d-6), the step (d-1), the step (d-2) and the step (d-6) based on the corrected measurement position obtained by the step (d-6). A correction information generation method for executing the step (d-3). A drawing method for drawing an image on a substrate,
A process of acquiring correction information by the correction information generation method according to any one of claims 1 to 3.
Correcting the drawing data of the image drawn on the substrate using the correction information;
Scanning light modulated based on the corrected drawing data on the substrate;
A drawing method comprising: A correction information generating device that generates correction information used for correcting drawing data of an image drawn on the substrate, based on position information of a plurality of marks arranged in a lattice pattern on the substrate,
A design position storage unit for storing design positions of the plurality of landmarks;
A measurement position acquisition unit that acquires a measurement position of each mark in a measurement image obtained by photographing the plurality of marks;
A pairing processing unit that associates each measurement position acquired by the measurement position acquisition unit with the design position of the mark;
A correction information generating unit that generates correction information used for correcting drawing data based on a difference between a measurement position and a design position associated with each other by the pairing processing unit;
The pairing processing unit acquires a plurality of measurement positions arranged in a line in a first direction from the plurality of measurement positions as a measurement position string, and a plurality of measurement positions corresponding to the measurement position string among the plurality of design positions The design position sequence is acquired as a design location sequence, and the nearest paired design location in the design location sequence is associated with each measurement location constituting the measurement location sequence. A correction information generation apparatus, which is performed for each measurement position sequence arranged in a direction. A drawing device for drawing an image on a substrate,
A light source unit,
A correction information generating device according to claim 5;
A drawing data correction unit for correcting drawing data of an image to be drawn on a substrate using the correction information generated by the correction information generation device;
A light modulation unit that modulates the light from the light source unit based on the drawing data corrected by the drawing data correction unit;
A scanning mechanism that scans the light modulated by the light modulator on the substrate;
A drawing apparatus comprising:

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