JP2019114709A - Light emitting device and method of manufacturing the same - Google Patents

Abstract

To provide a light emitting device in which, when light is emitted, contrast between a light emitting area and a non-light emitting area is large, and, when light is not emitted, an entire top surface of the light emitting device is a color of a wavelength conversion member, and a method of manufacturing the same.SOLUTION: A light emitting device 100 includes: a light emitting element 1 having a light emitting surface and a side surface; a first reflecting member 2 provided on the side surface of the light emitting element 1; a wavelength conversion member 3 provided on the light emitting surface of the light emitting element 1 and on the first reflecting member 2; a second reflection member 4 covering an upper end to a lower end of an outer surface of the wavelength conversion member 3; and a covering member 5 for covering an outer side surface of the second reflecting member 4. A body color of the wavelength conversion member 3 and a body color of the covering member 5 are similar.SELECTED DRAWING: Figure 1B

Description

  The present disclosure relates to a light emitting device and a method of manufacturing the light emitting device.

  For example, Patent Document 1 describes a light emitting device in which a phosphor plate is adhered on a light emitting element and the periphery thereof is covered with a light reflective white member. The upper surface of such a light emitting device is configured by two colors of the color (for example, yellow) of the phosphor contained in the phosphor plate and the color (white) of the white member.

JP, 2013-12545, A

  When the conventional light emitting device is used as a light source of a lighting device such as a flash light of a camera of a smartphone, for example, the color of the phosphor and the color of the white member may be reflected on the lens when light is not emitted. Therefore, for example, depending on the design of the smartphone or the cover thereof, the conventional light emitting device may not have the appearance of the color of the wavelength conversion member when the entire top surface of the light emitting device does not emit light.

  The embodiment according to the present invention provides a light emitting device and a method of manufacturing the light emitting device in which the contrast between the light emitting region and the non-light emitting region is large when light is emitted, and the entire upper surface of the light emitting device is the color of the wavelength conversion member To be a task.

  A light emitting device according to an embodiment of the present disclosure includes a light emitting element having a light emitting surface and a side surface, a first reflecting member provided on the side surface of the light emitting element, an emitting surface of the light emitting element and an upper surface of the first reflecting member. And a second reflecting member for covering from the upper end to the lower end of the outer surface of the wavelength converting member, and a covering member for covering the outer surface of the second reflecting member, The body color of the conversion member and the body color of the covering member are similar.

  In a method of manufacturing a light emitting device according to an embodiment of the present disclosure, a light emitting surface is faced to the first surface of a wavelength conversion member having a first surface and a second surface opposite to the first surface. Mounting the light emitting element, covering the light emitting element with the first reflecting member, removing a part of the wavelength converting member around the light emitting element, and exposing the outer surface of the wavelength converting member; Covering the outside surface of the wavelength conversion member with a second reflection member, and covering the outside surface of the second reflection member with a covering member whose body color is the same color as the body color of the wavelength conversion member Including.

According to the light emitting device of the embodiment of the present invention, the contrast between the light emitting region and the non-light emitting region can be increased at the time of light emission, and the entire upper surface of the light emitting device can be the color of the wavelength conversion member at the time of non light emission.
According to the manufacturing method of the light emitting device of the embodiment according to the present invention, the light emission region and the non-light emitting region have a large contrast when light is emitted, and the light emission where the entire upper surface of the light emitting device is the color of the wavelength conversion member The device can be obtained.

It is a perspective view which shows typically the structure of the light-emitting device which concerns on embodiment. It is sectional drawing in the IB-IB line of FIG. 1A. It is a graph which shows typically the same-hue plane (5Y) of the hue in a Munsell color system. It is a flowchart of the manufacturing method of the light-emitting device which concerns on embodiment. In the manufacturing method of the light emitting device concerning an embodiment, it is a sectional view showing the process of forming a wavelength conversion member on a sheet. In the manufacturing method of the light emitting device concerning an embodiment, it is a sectional view showing the process of mounting a light emitting element. In the manufacturing method of the light-emitting device which concerns on embodiment, it is sectional drawing which shows the process of coat | covering a light emitting element etc. with a 1st reflection member. FIG. 7 is a cross-sectional view showing a step of exposing the outer side surface of the wavelength conversion member in the method of manufacturing the light emitting device according to the embodiment. It is sectional drawing which shows the process of coat | covering the outer surface of a wavelength conversion member with a 2nd reflection member in the manufacturing method of the light-emitting device which concerns on embodiment. In the manufacturing method of the light-emitting device which concerns on embodiment, it is sectional drawing which shows the process of coat | covering the outer surface of a 2nd reflection member with a covering member. In the manufacturing method of the light emitting device concerning an embodiment, it is a sectional view showing the process of exposing an electrode from the 1st reflective member. In the manufacturing method of the light-emitting device which concerns on embodiment, it is sectional drawing which shows the process transferred to another sheet | seat. In the manufacturing method of the light emitting device concerning an embodiment, it is a sectional view showing the process of adjusting the upper surface of a light emitting device. In the manufacturing method of the light emitting device concerning an embodiment, it is a sectional view showing the process of cutting for every device. It is sectional drawing which shows typically the structure of the light-emitting device which concerns on other embodiment. It is sectional drawing which shows typically the structure of the light-emitting device which concerns on other embodiment. It is sectional drawing which shows typically the structure of the light-emitting device which concerns on other embodiment. It is sectional drawing which shows typically the structure of the light-emitting device which concerns on other embodiment. It is a schematic diagram which shows the other structure of a 2nd reflection member. FIG. 14 is a cross-sectional view showing a step of exposing the outer side surface of the wavelength conversion member in another method of manufacturing a light emitting device according to the embodiment. In the other manufacturing method of the light-emitting device which concerns on embodiment, it is sectional drawing which shows the process of coat | covering the outer surface of a wavelength conversion member by a 2nd reflection member. FIG. 13 is a cross-sectional view showing a step of covering the outer side surface of the second reflecting member with a covering member in another method of manufacturing a light emitting device according to the embodiment. FIG. 14 is a cross-sectional view showing a step of exposing an electrode from the first reflection member in another method of manufacturing a light emitting device according to the embodiment. It is sectional drawing which shows the process of transcribe | transferring to another sheet | seat in the other manufacturing method of the light-emitting device which concerns on embodiment. FIG. 14 is a cross-sectional view showing a step of cutting each device in another method of manufacturing a light emitting device according to the embodiment. It is sectional drawing which shows typically the structure of the light-emitting device which concerns on other embodiment. It is sectional drawing which shows typically the structure of the light-emitting device which concerns on other embodiment.

Embodiment
Embodiments are described below with reference to the drawings. However, the form shown below illustrates the light-emitting device and the manufacturing method of a light-emitting device for embodying the technical thought of this embodiment, and is not limited to the following. Further, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention thereto alone, as long as there is no specific description. It is only Note that the sizes and positional relationships of members shown in each drawing may be exaggerated for the sake of clarity.

[Light Emitting Device]
First, the light emitting device according to the embodiment will be described.
As shown in FIGS. 1A and 1B, the light emitting device 100 includes a light emitting element 1, a first reflection member 2, a wavelength conversion member 3, a second reflection member 4, and a covering member 5. Further, in the light emitting device 100, the light guide member 6 is provided on the side surface of the light emitting element 1.
The top surface of the light emitting device 100 includes a light emitting region and a non-light emitting region. The light emitting region is a region (for example, the wavelength conversion member 3) which emits light when light is emitted on the upper surface of the light emitting device 100, and the non-light emitting region is a region other than the light emitting region (for example, the second reflecting member 4 and the coating) 5).

(Light emitting element)
The light emitting element 1 can use a semiconductor light emitting element such as an LED element. The light emitting element 1 may be any element structure formed of various semiconductors provided with the pair of positive and negative electrodes 11 and 12. In particular, the light emitting element 1, preferably those of the phosphor efficiently excitable nitride semiconductor _{(In x Al y Ga 1-} x-y N, 0 ≦ x, 0 ≦ y, x + y ≦ 1). Besides, the light emitting element 1 may be made of a zinc sulfide based semiconductor, a zinc selenide based semiconductor, or a silicon carbide based semiconductor.

(First reflection member)
The first reflection member 2 is for reflecting the light from the light emitting element 1 and extracting the light through the wavelength conversion member 3. The first reflection member 2 is a member for emitting light from the light emitting element 1 and reflecting light traveling in the lateral direction or downward direction to the wavelength conversion member 3 side which is a light emitting region of the light emitting device 100.
The first reflection member 2 is provided on the side surface of the light emitting element 1 and below the wavelength conversion member 3. Specifically, the first reflection member 2 covers the lower surface (electrodes 11 and 12 side) of the light emitting element 1. Furthermore, in the side surface of the light emitting element 1, the first reflective member 2 is covered so as to surround the region covered with the light guide member 6 via the light guide member 6, and is covered with the light guide member 6 The non-area covers the side of the light emitting element directly.
Here, although the first reflection member 2 is provided via the light guide member 6 formed on the side surface of the light emitting element 1, the side surface of the light emitting element 1 is directly provided without providing the light guide member 6. It may be provided in
The first reflection member 2 is, for example, a resin layer containing a reflection material. The first reflective member 2 may be configured by containing a filler in addition to the reflective substance in the resin to be the base material or the binder.

  The binder is a resin for binding the above-described reflective substance or filler to the side surface and the lower surface (the side of the electrodes 11 and 12) of the light emitting element 1 as the first reflective member 2. As a resin used as a binder, a polycarbonate resin, an epoxy resin, a phenol resin, a silicone resin, an acrylic resin, TPX resin, poly norbornene resin, a urethane resin etc. are mentioned, for example. Alternatively, as a resin to be a binder, for example, a hybrid resin containing one or more of these modified resins and one or more of these resins may be mentioned. Among them, silicone resins or modified resins thereof are preferable because they are excellent in heat resistance and light resistance and have little volume shrinkage after curing.

  The reflective substance is a substance that reflects the light emitted by the light emitting element 1. Examples of the reflective material include silica, titanium oxide, silicon oxide, aluminum oxide, potassium titanate, zinc oxide, boron nitride and the like. Alternatively, powder of resin such as silicone powder may be used.

  The filler is added to increase the strength of the first reflection member 2 which is a resin layer, or to increase the thermal conductivity of the first reflection member 2. Examples of the filler include glass fibers, whiskers, aluminum oxide, silicon oxide, boron nitride, zinc oxide, aluminum nitride and the like.

(Light guiding member)
The light guide member 6 is a member that facilitates extraction of light from the light emitting element 1 and guides the light from the light emitting element 1 to the wavelength conversion member 3. The light guide member 6 can improve the light beam and light extraction efficiency.
In the light guide member 6, an adhesive member for joining the wavelength conversion member 3 and the light emitting element 1 is formed by crawling up on the side surface of the light emitting element 1 (the upper and lower sides are manufactured at the time of manufacture) .
As the light guide member 6, for example, a translucent resin material can be used. The light guide member 6 may be a light transmitting adhesive material such as a base material of the first reflection member 2 or a resin serving as a binder. Moreover, diffusing agents such as silica, titanium oxide, silicon oxide, aluminum oxide, potassium titanate, zinc oxide, boron nitride and the like may be contained. Thereby, light can be more uniformly incident on the wavelength conversion member 3, and color unevenness of the light emitting device 100 can be suppressed.

As shown in FIG. 1B, the light guide member 6 is formed in a triangular shape so that the member width is expanded from the lower surface (sides of the electrodes 11 and 12) of the light emitting element 1 toward the wavelength conversion member 3 in cross section. There is. With such a configuration, the light beam and light extraction efficiency is further improved. However, the shape of the light guide member 6 is not particularly limited. For example, the shape of the light guide member 6 may be convex toward the first reflective member 2 or may be concave toward the light emitting element 1.
The light guide member 6 may cover a part of the side surface of the light emitting element 1, and from the viewpoint of improving the light beam and light extraction efficiency, it is possible to cover substantially the entire side surface of the light emitting element 1 preferable.
Further, the light guide member 6 may be disposed between the wavelength conversion member 3 and the light emitting element 1.

(Wavelength conversion member)
The wavelength conversion member 3 is a member that contains a wavelength conversion material that absorbs part of the light of the wavelength emitted by the light emitting element 1 and converts the light into light of a different wavelength and emits the light. The wavelength conversion material used in the wavelength conversion member 3 is, for example, a phosphor. Hereinafter, the wavelength conversion material will be described as a phosphor.
The wavelength conversion member 3 is provided on the light emitting surface of the light emitting element 1 and on the first reflecting member 2.
The lower surface of the wavelength conversion member 3, that is, the surface facing the light emitting surface of the light emitting element 1 is formed larger than the light emitting surface which is the upper surface of the light emitting element 1.

  The base material or the binder of the wavelength conversion member 3 is preferably formed of a translucent resin. As a resin here, resin used as the base material of the above-mentioned 1st reflective member 2 or a binder is mentioned, for example. Among them, silicone resins or modified resins thereof are preferable because they are excellent in heat resistance and light resistance and have little volume shrinkage after curing. In addition to the resin, the base material or the binder of the wavelength conversion member 3 may be formed of glass.

  The phosphor contained in the wavelength conversion member 3 includes, for example, cerium-activated yttrium aluminum garnet, cerium-activated lutetium aluminum garnet, cerium-activated terbium aluminum garnet, europium and the like. Nitrogen-containing calcium aluminosilicate activated with any one or two of chromium, sialon activated with europium, silicate activated with europium, potassium fluoride silicate activated with manganese, etc. may be mentioned.

Here, as described later, as long as the body color of the wavelength conversion member 3 and the body color of the covering member 5 become similar, the body color of the phosphor itself may be any. The body color refers to the color of the member itself when the light emitting device 100 does not emit light.
For example, when the body color of the phosphor itself is white, the body color of the wavelength conversion member 3 is white. The body color of the second reflecting member 4 is also basically white. Therefore, as described later, when the body color of the wavelength conversion member 3 and the body color of the covering member 5 are the same color, the entire upper surface of the light emitting device 100 becomes a white color when not emitting light.

When the light emitting device 100 is used as a light source of white light of an illumination device such as a flash light of a camera, for example, a light emitting element emitting blue light and a yellow emitting light emitting material having yellow body color It is preferred to use. In addition, it is preferable to use a light-emitting element that emits blue light and a phosphor that emits orange light and whose body color is orange.
As a phosphor whose yellow body color is yellow and whose color is yellow, for example, yttrium aluminum garnet phosphor (YAG phosphor), lutetium aluminum garnet phosphor (LAG phosphor), terbium -Aluminum garnet fluorescent substance (TAG fluorescent substance) etc. are mentioned. Moreover, KSF is mentioned as a fluorescent substance whose body color is yellow and whose luminescent color is red. The body color of these phosphors is 10Y or 5Y in the Munsell hue ring of the Munsell color system (20 hues) described later.
As a fluorescent substance whose body color is orange and whose luminescent color is red, for example, SCASN, CASN and the like can be mentioned. The body color of these phosphors is 10YR or 5YR in the Munsell hue ring of the Munsell color system (20 hues) described later.
In addition, a yellow-based phosphor and a red-based phosphor may be mixed in the luminescent color, and the luminescent color may be an orange-based phosphor.

Moreover, as a color of the fluorescent substance of the yellowish-type fluorescent substance itself and an orange-type fluorescent substance, 5YR, 10YR, 5Y, 10Y in the Munsell hue ring of the Munsell color system (20 hues) mentioned later, for example The hue of
In the case of a yellow phosphor, the color of the phosphor itself is, for example, 10Y or 5Y. In the case of an orange-based phosphor, for example, 10YR and 5YR. The case where the body color of the phosphor itself is a yellowish phosphor and is 5Y in the Munsell hue ring of the Munsell color system (20 hues) will be described below as an example.
In the Munsell color system, the lightness is, for example, 7 or more and 9 or less.
Further, in the Munsell color system, the saturation is, for example, 4 or more and 14 or less.

  Further, as described later, when the covering member 5 contains a wavelength conversion substance, the wavelength conversion member 3 preferably contains a wavelength conversion substance having the same composition as the wavelength conversion substance contained in the covering member 5. According to such a configuration, the color of the entire top surface of the light emitting device 100 at the time of non-light emission tends to be the same as the color of the wavelength conversion member 3.

The wavelength conversion member 3 may contain a diffusing agent. The diffusing agent is added to efficiently diffuse the light emitted from the light emitting element 1 and the phosphor. As a spreading | diffusion agent, the thing similar to the reflective substance of the above-mentioned 1st reflective member 2 is mentioned, for example.
The thickness of the wavelength conversion member 3 in the vertical direction can be determined according to the content of the phosphor, the color tone after mixing of the light emitted by the light emitting element 1 and the light after wavelength conversion, and the like. The following can be made.

(Second reflector)
The second reflection member 4 is for reflecting the light from the light emitting element 1 and extracting the light through the wavelength conversion member 3. The second reflection member 4 is a member for emitting light from the light emitting element 1 and reflecting light traveling in the direction of the covering member 5 to the wavelength conversion member 3 side which is a light extraction surface. The second reflection member 4 is a member for increasing the contrast (difference in luminance) between the light emitting area and the non-light emitting area at the time of light emission.

  The second reflection member 4 covers the outer side surface of the wavelength conversion member 3. Here, the second reflection member 4 covers the upper end to the lower end of the outer side surface of the wavelength conversion member 3. Further, the second reflection member 4 covers the outer side surface of the first reflection member 2. That is, the second reflection member 4 is continuously provided between the first reflection member 2 and the covering member 5 and between the wavelength conversion member 3 and the covering member 5.

The second reflection member 4 is, for example, a resin layer containing a reflection material, as in the first reflection member 2. The second reflective member 4 may be configured by containing a filler in addition to the reflective substance in the resin to be the base material or the binder. Examples of the resin of the second reflection member 4, the reflection member, and the filler include the resin of the first reflection member 2 described above, the reflection member, and the filler.
In addition, the second reflective member 4 may be an inorganic film such as aluminum oxide, zirconium oxide or titanium oxide.

  The second reflective member 4 may include at least one of a metal layer and a dielectric layer. For example, as shown in FIG. 9, a metal layer 42 and a dielectric layer 43 are laminated on the surface of the reflection layer 41 made of the material of the second reflection member 4 described above on the side to which the light from the light emitting element 1 hits. It may be Either the metal layer 42 or the dielectric layer 43 may be provided, or both may be provided. Also, in the case of providing both, the order of stacking may be first. The second reflective member 4 includes at least one of the metal layer 42 and the dielectric layer 43, whereby the reflectance of the second reflective member 4 is improved. Thereby, the contrast between the light emitting area at the time of light emission and the non-light emitting area is further increased.

  Examples of the metal layer 42 include layers made of copper, aluminum, gold, silver, platinum, titanium, tungsten, palladium, iron, nickel and the like. The metal layer 42 is preferably a layer made of gold or silver from the viewpoint of further improving the reflectance.

The dielectric layer 43 may be a dielectric multilayer film in which a plurality of dielectric layers are stacked. The dielectric multilayer film is one type of distributed Bragg reflector (DBR (Distributed Bragg Reflector)). The dielectric multilayer film is a film in which a plurality of dielectric layers of a low refractive index layer and a high refractive index layer are stacked over a plurality of groups, and selectively reflects light of a predetermined wavelength. . Specifically, it is a film in which two or more films different in refractive index are alternately stacked at a thickness of wavelength / 4n (n is a refractive index), and light of a predetermined wavelength can be highly efficiently reflected. The low refractive index material may be SiO ₂ , and the high refractive index material may be Nb ₂ O ₅ , TiO ₂ , ZrO ₂ , Ta ₂ O ₅ or the like. The dielectric multilayer film may be, for example, one in which a layer made of SiO ₂ and a layer made of Nb ₂ O ₅ are alternately stacked.

The thickness in the width direction of the second reflecting member 4 is preferably 0.1 μm or more and 5.0 μm or less. If the thickness in the width direction of the second reflecting member 4 is 0.1 μm or more, the contrast between the light emitting area at the time of light emission and the non-light emitting area can be further increased. On the other hand, when the thickness in the width direction of the second reflecting member 4 is 5.0 μm or less, the color of the entire top surface of the light emitting device 100 during non-emission tends to be the same as the color of the wavelength conversion member 3.
The thickness in the width direction of the second reflecting member 4 is preferably 0.3 μm or more, more preferably 0.5 μm or more, from the viewpoint of increasing the contrast between the light emitting area and the non-light emitting area at the time of light emission.
Further, the thickness in the width direction of the second reflecting member 4 is more preferably 2.0 μm or less from the viewpoint of making the color of the entire upper surface of the light emitting device 100 at the time of non-emission equal to the color of the wavelength conversion member 3. More preferably, it is 1.0 μm or less.

(Covering member)
The covering member 5 is a member that covers the outer side surface of the second reflecting member 4. Here, the covering member 5 covers the upper end to the lower end of the outer side surface of the second reflecting member 4. The covering member 5 forms a part of the side surface of the light emitting device 100.

  The covering member 5 is, for example, a resin layer. Examples of the resin used as the base material or binder of the covering member 5 include a resin serving as the base material or binder of the first reflection member 2 described above. Among them, epoxy resins or modified resins thereof are preferable because they are excellent in adhesion and gas barrier properties. In addition, silicone resins or modified resins thereof are preferable because they are excellent in heat resistance and light resistance, and have less volumetric shrinkage after curing.

The covering member 5 contains any one of a wavelength conversion substance, a pigment and a dye. As a wavelength conversion substance, the thing similar to the wavelength conversion substance contained in the wavelength conversion member 3 is mentioned.
The pigment is not particularly limited, and examples thereof include those using inorganic materials and organic materials, and those using the following materials can be mentioned.
As an inorganic material, for example, red iron oxide (Fe ₂ O ₃ ), red lead (Pb ₃ O ₄ ), titanium nickel antimony oxide, titanium nickel barium oxide, titanium chromium antimony oxide, titanium chromium niobium oxide Things etc.
Examples of organic materials include anthraquinones, azos, quinacridones, perylenes, diketopyrrolopyrroles, monoazos, disazos, pyrazolones, benzimidazolones, quinoxalines, azomethines, isoisodrinones, and the like. Isoisodrine and the like can be mentioned.

The dye is not particularly limited. For example, anthraquinone dyes, methine dyes, azomethine dyes, oxazine dyes, azo dyes, styryl dyes, coumarin dyes, porphyrin dyes, dibenzofuranone dyes And diketopyrrolopyrrole dyes, rhodamine dyes, xanthene dyes, and pyrromethene dyes.
It is preferable that the pigment and the dye basically do not convert the light from the light emitting element 1 into different wavelengths.

The body color of the wavelength conversion member 3 and the body color of the covering member 5 are similar. Here, similar colors refer to the Munsell color system (20 hues),
Hue: Within 3 range of hue circle Lightness: Within 3 range Saturation: Within 3 range That is, in the same hue plane of the Munsell color system (20 hues), the hue, the lightness, and the saturation are both similar colors up to both sides.

Specifically, as shown in FIG. 2, for example, in a case where a specific color is a color a in an iso-hue plane (5Y) of a hue of Y (yellow) system, the range A is a similar color.
The measurement of the body color can be performed, for example, using a measuring instrument such as a spectrocolorimeter CM series (manufactured by Konica Minolta Co., Ltd.) or a color difference meter CR series (manufactured by Konica Minolta Co., Ltd.). Among such measuring instruments, a light source of a xenon lamp and a light receiving element of a silicon photodiode may be used, which can be dispersed by a plane diffraction grating and capable of outputting in the Munsell color system.

When the body color of the wavelength conversion member 3 and the body color of the covering member 5 are the same color, the entire top surface of the light emitting device 100 can be the color of the wavelength conversion member 3 when not emitting light.
In addition, when the entire upper surface of the light emitting device 100 is the color of the wavelength conversion member 3 during non-emission, the case where the color of the entire upper surface of the light emitting device 100 is the same as the color of the wavelength conversion member 3 Also includes. The same degree can be, for example, up to both of the hue, the lightness, and the saturation on the same hue plane of the Munsell color system (20 hues) described above.

  The thickness in the width direction of the covering member 5 is preferably 20 μm or more and 200 μm or less. If the thickness in the width direction of the covering member 5 is 20 μm or more, the color of the entire top surface of the light emitting device 100 at the time of non-emission tends to be the same as the color of the wavelength conversion member 3. On the other hand, when the thickness in the width direction of the covering member 5 is 200 μm or less, downsizing of the light emitting device 100 can be achieved.

<Operation of light emitting device>
Next, the operation of the light emitting device 100 will be described.
When the light emitting device 100 is driven, power is supplied from the external power supply to the light emitting element 1 through the electrodes 11 and 12, and the light emitting element 1 emits light. A part of the light emitted from the light emitting element 1 is reflected by the first reflecting member 2 and the second reflecting member 4, passes through the wavelength conversion member 3, and is extracted to the outside. At this time, the contrast (difference in luminance) between the light emitting area and the non-light emitting area on the top surface of the light emitting device 100 is increased by providing the second reflecting member 4.

[Method of manufacturing light emitting device]
Next, an example of a method of manufacturing the light emitting device 100 according to the embodiment will be described with reference to FIGS. 3 to 7B. 4A to 7B schematically show one light emitting device 100 when manufacturing a plurality of light emitting devices 100 simultaneously.

As shown in FIG. 3, in the method of manufacturing the light emitting device 100 according to the embodiment, a step S101 of forming a wavelength conversion member on a sheet, a step S102 of mounting a light emitting element, and a step S103 of covering with a first reflective member. Step S104 of exposing the outer surface of the wavelength conversion member, step S105 of covering with the second reflecting member, step S106 of covering with the covering member, step S107 of exposing the electrode, and transferring to another sheet Step S108, a step S109 of adjusting the upper surface of the light emitting device, and a step S110 of cutting are performed in this order.
In addition, since the material and arrangement of each member are as described in the description of the light emitting device 100 described above, the description is appropriately omitted here.

(Step of forming a wavelength conversion member on a sheet)
Step S101 of forming the wavelength conversion member on the sheet is a step of forming the wavelength conversion member 3 on the sheet 20 of resin or the like as shown in FIG. 4A.
The formation of the wavelength conversion member 3 on the sheet 20 can be performed by, for example, a printing method, a compression molding method, a phosphor electrodeposition method, or a method of laminating plate-like wavelength conversion members.

(Step of mounting the light emitting element)
The step S102 of mounting the light emitting element is, as shown in FIG. 4B, the first surface 3a and the first surface 3a of the wavelength conversion member 3 having the second surface 3b on the opposite side of the first surface 3a. And the light emitting element 1 is placed.
In this step S102, the light emitting element 1 is bonded to the opposite surface of the light emitting element 1 on the side where the electrodes 11 and 12 are provided, that is, the light emitting surface 1a to the first surface 3a of the wavelength conversion member 3 via an adhesive member. Do. At this time, in terms of light distribution and the like, it is preferable to join the center of the first surface 3 a of the wavelength conversion member 3 and the center of the light emitting surface 1 a of the light emitting element 1.

Here, by adjusting the amount of the bonding member, the bonding member can be scooped up on the side surface of the light emitting element 1, and the bonding member can be formed on the side surface of the light emitting element 1. Thus, the light emitting device 100 has a form in which the light guide member 6 which is an adhesive member is provided on the side surface of the light emitting element 1.
Further, the light guide member 6 which is an adhesive member may be disposed between the light emitting surface 1 a of the light emitting element 1 and the first surface 3 a of the wavelength conversion member 3 with a predetermined thickness in the vertical direction. Thereby, the light emitting element 1 and the wavelength conversion member 3 can be bonded more firmly. Although not shown, the bonding member in an extremely thin state between the light emitting surface 1a of the light emitting element 1 and the first surface 3a of the wavelength converting member 3 for bonding the light emitting element 1 and the wavelength converting member 3 here. Is intervened.

(Step of covering with the first reflecting member)
Step S103 of covering with the first reflection member is a step of covering the light emitting element 1 placed on the wavelength conversion member 3 with the first reflection member 2 as shown in FIG. 4C.
In this step S103, the whole of the light emitting element 1 including the electrodes 11 and 12 is covered with the first reflection member 2. In the step S103, the first reflection member 2 is provided from the surface of the wavelength conversion member 3 to the top surfaces of the electrodes 11 and 12.

The covering of the light emitting element 1 can be performed using, for example, a discharge device (dispenser) that can move (move) the sheet 20 in the vertical direction or the horizontal direction, etc. on the upper side of the fixed sheet 20. . The coating of the first reflection member 2 can be performed by filling the resin or the like constituting the first reflection member 2 on the wavelength conversion member 3 using a discharge device.
Moreover, it is also possible to coat by a compression molding method, a transfer molding method, or the like.

(Step of exposing the outer surface of the wavelength conversion member)
The step S104 of exposing the outside surface of the wavelength conversion member is a step of removing a part of the wavelength conversion member 3 around the light emitting element 1 and exposing the outside surface 3c of the wavelength conversion member 3 as shown in FIG. 5A. is there. Here, the removal of part of the wavelength conversion member 3 is performed from the side of the first reflection member 2 which is the side of the first surface 3 a of the wavelength conversion member 3.

In this step S104, the recess 30 is formed so as to penetrate the first reflection member 2 and the wavelength conversion member 3 and reach the thickness of the sheet 20. In this step S104, when the light emitting element 1 is singulated, the recess 30 is formed at the position where the second reflection member 4 and the covering member 5 are formed. The outer surface 3 c of the wavelength conversion member 3 is exposed by the formation of the recess 30.
The formation of the recess 30 can be performed, for example, by removing the member with a predetermined width from the upper surface of the first reflection member 2 toward the sheet 20 in a vertical direction or at an incline. In detail, the formation of the recess 30 can be performed by penetrating the first reflection member 2 and further penetrating the wavelength conversion member 3 and removing a part of the sheet 20.
In addition, formation of the recessed part 30 may be performed by a laser beam, and may be performed by an etching.
Also, the recess 30 may be formed anywhere as long as it is around the light emitting element 1. When the light guide member 6 is disposed on the side surface of the light emitting element 1, the recess 30 may be formed so as to remove a part of the light guide member 6. In order to enhance the light emission efficiency, as shown in FIG. 5A, it is preferable to form it outside the light guide member 6.

(Step of covering with the second reflecting member)
The step S105 of covering with the second reflective member is a step of covering the outer side surface 3c of the wavelength conversion member 3 with the second reflective member 4 as shown in FIG. 5B.
In the step S105, the second reflection member 4 is formed on the upper surface of the first reflection member 2 and the inner side surface of the recess 30.
The formation of the second reflective member 4 can be performed by, for example, electrolytic plating, electroless plating, vapor deposition, sputtering or the like. Moreover, when using resin as the 2nd reflection member 4, it can carry out by the printing method, the compression molding method, etc. as a method of forming the 2nd reflection member 4, for example.

(Step of covering with a covering member)
The step S106 of covering with the covering member is a step of covering the outside surface 4a of the second reflecting member 4 with the covering member 5 whose body color is the same color as the body color of the wavelength conversion member 3 as shown in FIG. 5C. is there.
In step S106, the covering member 5 is filled in the recess 30, and the covering member 5 is formed through a procedure of covering the outer side surface 4a of the second reflecting member 4 with the covering member 5. In the step S106, the covering member 5 is formed on the surface of the second reflecting member 4 in the recess 30.

The filling of the covering member 5 can be performed by, for example, a printing method, a compression molding method, an electrodeposition method, or the like. Further, the filling of the covering member 5 can be performed using the above-described resin discharge device.
Here, the material is selected so that the body color of the wavelength conversion member 3 and the body color of the covering member 5 become the same color.

(Step of exposing the electrode)
In the step S107 of exposing the electrode, as shown in FIG. 6A, a part of the first reflecting member 2, a part of the second reflecting member 4 and a part of the covering member 5 on the side of the electrodes 11 and 12 In this step, the electrodes 11 and 12 of the light emitting element 1 are removed so as to be exposed.
In this step S107, for example, the surfaces of the first reflecting member 2, the second reflecting member 4 and the covering member 5 are removed from the side of the electrodes 11 and 12 until the electrodes 11 and 12 are exposed. As a method of removing the 1st reflective member 2, the 2nd reflective member 4, and covering member 5, there are grinding, polish, blast etc., for example.

(Step of transferring to another sheet)
Step S108 of transferring to another sheet is a step of transferring the structure in which the electrodes 11 and 12 are exposed to another sheet 21 such as resin as shown in FIG. 6B.
In this step S108, the structure is placed on the sheet 21 so that the electrodes 11 and 12 exposed from the first reflection member 2 adhere to the sheet 21.
Before or after transfer to another sheet 21, the sheet 20 used for forming the wavelength conversion member 3 is removed.

(Step of adjusting the top of the light emitting device)
In step S109 for adjusting the upper surface of the light emitting device, as shown in FIG. 7A, a part of the second reflection member 4 exposed on the second surface 3b side of the wavelength conversion member 3 by removing the sheet 20, and a covering member It is the process of removing a part of 5 and adjusting the upper surface of the light emitting device.
In this step S109, for example, the upper surface of the light emitting device is smoothed along the second surface 3b of the wavelength conversion member 3 by removing a part of the upper surface of the light emitting device.

(Step of cutting)
The cutting step S110 is a step of cutting along a cutting line including the covering member 5 as shown in FIG. 7B. That is, the cutting step S110 is a step of singulating the assembly of the light emitting devices 100.
In this step S110, cutting lines for dividing the assembly of the light emitting devices 100 into pieces are predetermined. The cutting line is defined so that the cutting groove 31 is located on the center side of the covering member 5 and the covering member 5 can be disposed on the left and right of the cutting groove 31. That is, when dividing the assembly into individual pieces, the covering member 5 is divided into the left and right of the cutting groove 31 and cut, and the cutting line is defined so as to be finally formed as the covering member 5 on the outer periphery of the light emitting device 100 deep.

The singulation of the assembly is performed, for example, by cutting the sheet 21 along the vicinity of the center of the cutting groove 31 in the width direction. The cutting groove 31 is preferably cut so as to reach a part of the sheet 21.
The singulation of the assembly can be performed by a conventionally known method such as a dicing method of cutting with a blade along the cutting groove 31.
A plurality of light emitting devices 100 can be obtained by singulating the assembly.

When the plurality of light emitting elements 1 are disposed and formed on the sheets 20 and 21, the cutting groove 31 may be formed between all the light emitting elements, or may be formed for each of the plurality of light emitting elements 1.
For example, the light emitting device as shown in FIG. 12A is formed by forming the recess 30 for each light emitting element 1, forming the cutting groove 31 for every two light emitting elements, and cutting with the cutting groove 31 for every two light emitting elements 1. 100E is obtained.
Further, for example, by forming the recess 30 and the cutting groove 31 for every two light emitting elements 1 and cutting with the cutting groove 31, a light emitting device 100F as shown in FIG. 12B can be obtained.

As described above, the light emitting device and the method for manufacturing the light emitting device according to the present embodiment have been specifically described by the embodiments for carrying out the invention. However, the scope of the present invention is not limited to these descriptions, and should be broadly interpreted based on the description of the claims. Moreover, what was variously changed and changed based on these descriptions is also included in the meaning of the present invention.
Hereinafter, other embodiments will be described.

As in the light emitting device 100A shown in FIG. 8A, the second reflecting member 4 covers only the upper end to the lower end of the outer surface of the wavelength conversion member 3, and the covering member 5 covers the outer surface of the first reflecting member 2. It may be
Further, as in the light emitting device 100B shown in FIG. 8B, the second reflection member 4 covers only the upper end to the lower end of the outer surface of the wavelength conversion member 3, and the covering member 5 covers only the second reflection member 4 It may be
Further, as in a light emitting device 100C shown in FIG. 8C, the second reflecting member 4 covers the outer side surface of the wavelength conversion member 3 and the outer side surface of the first reflecting member 2, and the covering member 5 Only the outer surface of the second reflecting member 4 covering the outer surface may be coated.

According to these configurations, the light emitting device can be reduced in weight. In addition, the light emitting device has a reduced material cost.
The light emitting devices 100A, 100B, and 100C can be manufactured by performing etching, using a mask, or the like in the step S105 of covering with the second reflective member and the step S106 of covering with the covering member.

The second reflective member 4 may include at least one of a metal layer and a dielectric layer. When the second reflection member 4 includes the metal layer 42, the formation of the metal layer 42 can be performed by electrolytic plating, electroless plating, vapor deposition, sputtering or the like in the step S105 of covering with the second reflection member. .
When the second reflective member 4 includes the dielectric layer 43, the dielectric layer 43 can be formed by sputtering, ALD, CVD, PVD or the like in the step S105 of covering with the second reflective member.

  Moreover, the light guide member 6 may not be provided. The light guide member 6 may be provided not only on the side surface of the light emitting element 1 but also between the light emitting element 1 and the wavelength conversion member 3 as in the light emitting device 100D shown in FIG. 8D. In this case, the thickness of the light guide member 6 in the vertical direction is 0.5 μm or more and 20 μm or less from the viewpoint of bonding the light emitting element 1 and the wavelength conversion member 3 more firmly and from the viewpoint of improving the light flux and light extraction efficiency. Is preferably 0.5 μm or more and 10 μm or less. In addition to the single light emitting element 1, a plurality of light emitting elements 1 may be provided. The light emitting device may also include a mounting substrate on which the light emitting device 100 is mounted.

  Moreover, the wavelength conversion member 3 can also be made not only a single layer structure but a multilayer structure. The wavelength conversion member 3 may be formed by laminating a plurality of wavelength conversion members containing different wavelength conversion substances as long as the body color of the covering member 5 is the same color. In addition, the wavelength conversion member 3 may include a light transmitting layer containing no wavelength conversion substance. Further, on the wavelength conversion member 3, a light transmission member such as a light transmission layer not containing the wavelength conversion member 3, a layer containing a diffusing agent, a layer having unevenness on the surface, or a convex lens may be laminated. In FIG. 8D, the light transmitting layer 7 is stacked on the wavelength conversion member 3. By laminating the light transmitting layer 7, the wavelength conversion substance can be protected from the external environment.

When the wavelength conversion member 3 is a laminate and includes a light transmission layer containing no wavelength conversion material, it is preferable to dispose the light transmission layer 7 on the second surface 3b of the wavelength conversion member 3 as shown in FIG. 8D. . In this case, the light transmitting layer 7 may be a part of the wavelength conversion member 3, but as a layer not containing the wavelength conversion substance, it is a layer different from the wavelength conversion member 3 containing the wavelength conversion substance be able to. By arranging the light transmitting layer 7 on the second surface 3b of the wavelength conversion member 3, the sheet 20 is removed, and when the light emitting device 100D is obtained, the light transmitting layer 7 becomes a protective layer and the wavelength conversion material is Can be protected.
The light transmitting layer 7 is a transparent member, and examples of the light transmitting layer 7 include light transmitting resins such as resins that can be used for the wavelength conversion member 3, and glass.

  In the step of forming the wavelength conversion member, the light transmitting layer 7 containing no wavelength conversion substance is provided on the second surface 3b side of the wavelength conversion member 3 so that the light emission can be easily performed in the step S109 of adjusting the upper surface of the light emitting device. The top of the device can be trimmed. In detail, when adjusting the upper surface of the light emitting device, the change of emission color and the wavelength conversion member can be obtained by removing a part of the light transmitting layer 7 not containing the wavelength conversion material without removing the wavelength conversion member 3 3 body color change can be suppressed.

  In the method of manufacturing the light emitting device described above, in the step S104 of exposing the outer side surface of the wavelength conversion member, the removal of a part of the wavelength conversion member 3 is performed from the first surface 3a side of the wavelength conversion member 3. However, as shown in FIG. 10A, removal of a part of the wavelength conversion member 3 may be performed from the second surface 3 b side of the wavelength conversion member 3. In this case, the concave portion 30 can be formed by removing the member 20 with the sheet 20 up and vertically or obliquely from the upper surface of the sheet 20 toward the first reflecting member 2. The formation of the recess 30 can be performed by penetrating the sheet 20 and further penetrating the wavelength conversion member 3 and removing a part of the first reflection member 2. At this time, the first reflection member 2 may be removed to a position below the lower surfaces of the electrodes 11 and 12 with the electrodes 11 and 12 of the light emitting element 1 down. The thickness of the first reflection member 2 in the vertical direction may be adjusted appropriately, assuming a position where the first reflection member 2 is removed.

Next, as shown in FIG. 10B, in the light emitting device manufacturing method, the second reflection member 4 is formed on the inner side surface of the recess 30, and the outer side surface 3c of the wavelength conversion member 3 is covered with the second reflection member 4. Next, as shown in FIG. 10C, in the method of manufacturing the light emitting device, the outer surface 4a of the second reflecting member 4 is covered with the covering member 5 whose body color is the same as the body color of the wavelength conversion member 3. Next, as shown in FIG. 11A, in the method of manufacturing the light emitting device, a part of the first reflecting member 2, a part of the second reflecting member 4, and a part of the covering member 5 on the electrodes 11 and 12 side. Are removed to expose the electrodes 11 and 12 of the light emitting element 1. Next, as shown in FIG. 11B, in the method of manufacturing the light emitting device, the structure in which the electrodes 11 and 12 are exposed is transferred to another sheet 21 such as a resin. After transfer, the sheet 20, a part of the second reflection member 4, a part of the covering member 5, and a part of the wavelength conversion member 3 are removed. Next, as shown in FIG. 11C, in the method of manufacturing the light emitting device, cutting is performed at a cutting line including the covering member 5.
The step S109 of adjusting the upper surface of the light emitting device may not be performed, and may be performed to make the upper surface of the light emitting device smoother.
The other matters are the same as the above-described method of manufacturing the light emitting device.

  Moreover, the manufacturing method of a light-emitting device may include another process between or before and / or after each process, as long as the process is not adversely affected. For example, a foreign matter removal step of removing foreign matter mixed in the middle of the production may be included.

  The light emitting device according to the embodiment of the present invention can be used for various illumination devices such as a flash light of a camera and general illumination.

Reference Signs List 1 light emitting element 1a light emitting surface of light emitting element 2 first reflecting member 3 wavelength converting member 3a first surface 3b of wavelength converting member second surface 3c of wavelength converting member second surface 3c outer surface of wavelength converting member 4 second reflecting member 4a second reflection Outer surface 5 of the member Covering member 6 Light guiding member 7 Light transmitting layers 11, 12 Electrodes 20, 21 Sheet 30 Recess 31 Cutting groove 41 Reflective layer 42 Metal layer 43 Dielectric layer 100, 100A, 100B, 100C, 100D, 100E, 100F light emitting device a specific color A range of color

Claims (13)

A light emitting element having a light emitting surface and a side surface;
A first reflecting member provided on the side surface of the light emitting element;
A wavelength conversion member provided on the light emitting surface of the light emitting element and on the first reflecting member;
A second reflecting member that covers from the upper end to the lower end of the outer surface of the wavelength conversion member;
And a covering member covering an outer side surface of the second reflecting member.
The light-emitting device in which the body color of the wavelength conversion member and the body color of the covering member are similar.   The light emitting device according to claim 1, wherein the second reflection member covers an outer surface of the first reflection member.   The light emitting device according to claim 1, wherein the covering member covers an outer surface of the first reflecting member.   The light emitting device according to claim 2, wherein the covering member covers an outer surface of the second reflecting member.   The light emitting device according to any one of claims 1 to 4, wherein the covering member contains any one of a wavelength conversion substance, a pigment and a dye.   The light emitting device according to claim 5, wherein the wavelength conversion member includes a wavelength conversion material having the same composition as the wavelength conversion material contained in the covering member.   The light emitting device according to any one of claims 1 to 6, wherein a thickness of the second reflection member is 0.1 μm or more and 5.0 μm or less.   The light emitting device according to any one of claims 1 to 7, wherein the first reflecting member is provided on a side surface of the light emitting element via a light guiding member.   The light emitting device according to any one of claims 1 to 8, wherein the second reflection member includes at least one of a metal layer and a dielectric layer. Mounting a light emitting element with the light emitting surface facing the first surface of the wavelength conversion member having the first surface and the second surface opposite to the first surface;
Covering the light emitting element with a first reflecting member;
Removing a portion of the wavelength converting member around the light emitting element to expose the outer surface of the wavelength converting member;
Covering the outer surface of the wavelength conversion member with a second reflecting member;
A method of manufacturing a light emitting device, comprising the step of covering the outer side surface of the second reflection member with a covering member whose body color is the same color as the body color of the wavelength conversion member. The step of removing a part of the wavelength conversion member is
The manufacturing method of the light-emitting device of Claim 10 performed from the 1st surface side of the said wavelength conversion member. The step of removing a part of the wavelength conversion member is
The manufacturing method of the light-emitting device of Claim 10 performed from the 2nd surface side of the said wavelength conversion member. The step of mounting the light emitting element is
The manufacturing method of the light-emitting device of any one of Claims 10-12 including the process of providing a light guide member so that the side surface of at least one part of the said light emitting element may be covered.

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