JP7057491B2 - Light emitting device and manufacturing method of light emitting device - Google Patents

Light emitting device and manufacturing method of light emitting device Download PDF

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JP7057491B2
JP7057491B2 JP2017248300A JP2017248300A JP7057491B2 JP 7057491 B2 JP7057491 B2 JP 7057491B2 JP 2017248300 A JP2017248300 A JP 2017248300A JP 2017248300 A JP2017248300 A JP 2017248300A JP 7057491 B2 JP7057491 B2 JP 7057491B2
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light emitting
wavelength conversion
emitting device
emitting element
covering
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JP2019114709A (en
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啓 橋本
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Nichia Corp
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Nichia Corp
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Description

本開示は、発光装置および発光装置の製造方法に関する。 The present disclosure relates to a light emitting device and a method for manufacturing the light emitting device.

例えば特許文献1には、発光素子上に蛍光体板を接着し、その周囲を光反射性の白色部材で被覆した発光装置が記載されている。このような発光装置の上面は、蛍光体板に含有される蛍光体の色(例えば黄色)と、白色部材の色(白色)の2色で構成される。 For example, Patent Document 1 describes a light emitting device in which a phosphor plate is adhered on a light emitting element and the periphery thereof is covered with a light-reflecting white member. The upper surface of such a light emitting device is composed of two colors, that is, the color of the phosphor contained in the phosphor plate (for example, yellow) and the color of the white member (white).

特開2013-12545号公報Japanese Unexamined Patent Publication No. 2013-12545

従来の発光装置は、例えばスマートフォンのカメラのフラッシュライトなどの照明装置の光源として使用した場合、非発光時に、レンズに蛍光体の色と白色部材の色が写り込んでしまう。そのため、例えば、スマートフォンやそのカバーのデザインによっては、従来の発光装置は、非発光時に発光装置の上面全体が波長変換部材の色彩とならず、外観が好まれない場合がある。 When the conventional light emitting device is used as a light source of a lighting device such as a flashlight of a smartphone camera, the color of the phosphor and the color of the white member are reflected on the lens when the light is not emitted. Therefore, for example, depending on the design of the smartphone or its cover, in the conventional light emitting device, the entire upper surface of the light emitting device does not become the color of the wavelength conversion member when the light is not emitted, and the appearance may not be preferred.

本発明に係る実施形態は、発光時に発光領域と非発光領域とのコントラストが大きく、かつ、非発光時に発光装置の上面全体が波長変換部材の色彩となる発光装置および発光装置の製造方法を提供することを課題とする。 An embodiment of the present invention provides a light emitting device and a method for manufacturing a light emitting device, in which the contrast between the light emitting region and the non-light emitting region is large at the time of light emission, and the entire upper surface of the light emitting device becomes the color of the wavelength conversion member at the time of non-light emission. The task is to do.

本開示の実施形態に係る発光装置は、発光面と側面を有する発光素子と、前記発光素子の側面に設けられた第1反射部材と、前記発光素子の発光面上および前記第1反射部材上に設けられた波長変換部材と、前記波長変換部材の外側面の上端から下端までを被覆する第2反射部材と、前記第2反射部材の外側面を被覆する被覆部材と、を備え、前記波長変換部材の体色と前記被覆部材の体色は同系色である。 The light emitting device according to the embodiment of the present disclosure includes a light emitting element having a light emitting surface and a side surface, a first reflecting member provided on the side surface of the light emitting element, and on the light emitting surface of the light emitting element and on the first reflecting member. The wavelength conversion member provided in the above, a second reflection member covering the outer surface of the wavelength conversion member from the upper end to the lower end, and a covering member covering the outer surface of the second reflection member. The body color of the conversion member and the body color of the covering member are similar colors.

本開示の実施形態に係る発光装置の製造方法は、第1面と前記第1面の反対側に第2面を有する波長変換部材の前記第1面に、発光面を対面させて発光素子を載置する工程と、前記発光素子を第1反射部材で被覆する工程と、前記発光素子の周囲における前記波長変換部材の一部を除去し、前記波長変換部材の外側面を露出する工程と、前記波長変換部材の外側面を第2反射部材で被覆する工程と、前記第2反射部材の外側面を、体色が前記波長変換部材の体色と同系色である被覆部材で被覆する工程を含む。 In the method for manufacturing a light emitting device according to the embodiment of the present disclosure, a light emitting element is provided with a light emitting surface facing the first surface of a wavelength conversion member having a second surface on the opposite side of the first surface and the first surface. A step of placing the light emitting element, a step of covering the light emitting element with the first reflecting member, and a step of removing a part of the wavelength conversion member around the light emitting element to expose the outer surface of the wavelength conversion member. The step of covering the outer surface of the wavelength conversion member with the second reflecting member and the step of covering the outer surface of the second reflecting member with a covering member whose body color is similar to the body color of the wavelength conversion member. include.

本発明に係る実施形態の発光装置によれば、発光時に発光領域と非発光領域とのコントラストを大きくでき、かつ、非発光時に発光装置の上面全体を波長変換部材の色彩とすることができる。
本発明に係る実施形態の発光装置の製造方法によれば、発光時の発光領域と非発光領域とのコントラストが大きく、かつ、非発光時に発光装置の上面全体が波長変換部材の色彩となる発光装置を得ることができる。
According to the light emitting device of the embodiment according to the present invention, the contrast between the light emitting region and the non-light emitting region can be increased at the time of light emission, and the entire upper surface of the light emitting device can be used as the color of the wavelength conversion member at the time of non-light emission.
According to the method for manufacturing a light emitting device according to the present invention, the contrast between the light emitting region and the non-light emitting region at the time of light emission is large, and the entire upper surface of the light emitting device becomes the color of the wavelength conversion member at the time of non-light emission. You can get the device.

実施形態に係る発光装置の構成を模式的に示す斜視図である。It is a perspective view which shows typically the structure of the light emitting device which concerns on embodiment. 図1AのIB-IB線における断面図である。It is sectional drawing in the IB-IB line of FIG. 1A. マンセル表色系における色相の等色相面(5Y)を模式的に示すグラフである。It is a graph which shows typically the equihue plane (5Y) of the hue in the Munsell color system. 実施形態に係る発光装置の製造方法のフローチャートである。It is a flowchart of the manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の製造方法において、シート上に波長変換部材を形成する工程を示す断面図である。It is sectional drawing which shows the process of forming the wavelength conversion member on the sheet in the manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の製造方法において、発光素子を載置する工程を示す断面図である。It is sectional drawing which shows the process of placing a light emitting element in the manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の製造方法において、発光素子などを第1反射部材で被覆する工程を示す断面図である。It is sectional drawing which shows the step of covering the light emitting element and the like with the 1st reflective member in the manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の製造方法において、波長変換部材の外側面を露出する工程を示す断面図である。It is sectional drawing which shows the process of exposing the outer surface of the wavelength conversion member in the manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の製造方法において、波長変換部材の外側面を第2反射部材で被覆する工程を示す断面図である。It is sectional drawing which shows the step of covering the outer surface of the wavelength conversion member with the 2nd reflection member in the manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の製造方法において、第2反射部材の外側面を被覆部材で被覆する工程を示す断面図である。It is sectional drawing which shows the step of covering the outer surface of the 2nd reflective member with a covering member in the manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の製造方法において、第1反射部材から電極を露出させる工程を示す断面図である。It is sectional drawing which shows the step of exposing an electrode from the 1st reflection member in the manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の製造方法において、別のシートに転写する工程を示す断面図である。It is sectional drawing which shows the step of transferring to another sheet in the manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の製造方法において、発光装置の上面を整える工程を示す断面図である。It is sectional drawing which shows the process of arranging the upper surface of a light emitting device in the manufacturing method of a light emitting device which concerns on embodiment. 実施形態に係る発光装置の製造方法において、装置ごとに切断する工程を示す断面図である。It is sectional drawing which shows the process of cutting for each device in the manufacturing method of the light emitting device which concerns on embodiment. 他の実施形態に係る発光装置の構成を模式的に示す断面図である。It is sectional drawing which shows typically the structure of the light emitting device which concerns on other embodiment. 他の実施形態に係る発光装置の構成を模式的に示す断面図である。It is sectional drawing which shows typically the structure of the light emitting device which concerns on other embodiment. 他の実施形態に係る発光装置の構成を模式的に示す断面図である。It is sectional drawing which shows typically the structure of the light emitting device which concerns on other embodiment. 他の実施形態に係る発光装置の構成を模式的に示す断面図である。It is sectional drawing which shows typically the structure of the light emitting device which concerns on other embodiment. 第2反射部材の他の構成を示す模式図である。It is a schematic diagram which shows the other structure of the 2nd reflective member. 実施形態に係る発光装置の他の製造方法において、波長変換部材の外側面を露出する工程を示す断面図である。It is sectional drawing which shows the step of exposing the outer surface of the wavelength conversion member in the other manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の他の製造方法において、波長変換部材の外側面を第2反射部材で被覆する工程を示す断面図である。It is sectional drawing which shows the step of covering the outer surface of the wavelength conversion member with the 2nd reflection member in the other manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の他の製造方法において、第2反射部材の外側面を被覆部材で被覆する工程を示す断面図である。It is sectional drawing which shows the step of covering the outer surface of the 2nd reflection member with the covering member in the other manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の他の製造方法において、第1反射部材から電極を露出させる工程を示す断面図である。It is sectional drawing which shows the step of exposing an electrode from the 1st reflection member in the other manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の他の製造方法において、別のシートに転写する工程を示す断面図である。It is sectional drawing which shows the process of transferring to another sheet in the other manufacturing method of the light emitting device which concerns on embodiment. 実施形態に係る発光装置の他の製造方法において、装置ごとに切断する工程を示す断面図である。It is sectional drawing which shows the process of cutting for each device in the other manufacturing method of the light emitting device which concerns on embodiment. 他の実施形態に係る発光装置の構成を模式的に示す断面図である。It is sectional drawing which shows typically the structure of the light emitting device which concerns on other embodiment. 他の実施形態に係る発光装置の構成を模式的に示す断面図である。It is sectional drawing which shows typically the structure of the light emitting device which concerns on other embodiment.

<実施形態>
実施形態を、以下に図面を参照しながら説明する。ただし、以下に示す形態は、本実施形態の技術思想を具現化するための発光装置および発光装置の製造方法を例示するものであって、以下に限定するものではない。また、実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置などは、特定的な記載がない限り、本発明の範囲をそれのみに限定する趣旨ではなく、単なる例示に過ぎない。なお、各図面が示す部材の大きさや位置関係などは、説明を明確にするために誇張していることがある。
<Embodiment>
The embodiments will be described below with reference to the drawings. However, the embodiments shown below exemplify the light emitting device and the manufacturing method of the light emitting device for embodying the technical idea of the present embodiment, and are not limited to the following. Further, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention to the specific description, but are merely examples. It's just that. The size and positional relationship of the members shown in each drawing may be exaggerated for the sake of clarity.

[発光装置]
まず、実施形態に係る発光装置について説明する。
図1A、図1Bに示すように、発光装置100は、発光素子1と、第1反射部材2と、波長変換部材3と、第2反射部材4と、被覆部材5と、を備える。また、発光装置100は、発光素子1の側面に導光部材6が設けられている。
発光装置100の上面は、発光領域と非発光領域からなる。なお、発光領域とは、発光装置100の上面において、発光時に発光する領域(例えば、波長変換部材3)であり、非発光領域とは発光領域以外の領域(例えば、第2反射部材4および被覆部材5)である。
[Light emitting device]
First, the light emitting device according to the embodiment will be described.
As shown in FIGS. 1A and 1B, the light emitting device 100 includes a light emitting element 1, a first reflecting member 2, a wavelength conversion member 3, a second reflecting member 4, and a covering member 5. Further, the light emitting device 100 is provided with a light guide member 6 on the side surface of the light emitting element 1.
The upper surface of the light emitting device 100 includes a light emitting region and a non-light emitting region. The light emitting region is a region (for example, a wavelength conversion member 3) that emits light at the time of light emission on the upper surface of the light emitting device 100, and the non-light emitting region is a region other than the light emitting region (for example, the second reflection member 4 and the coating). Member 5).

(発光素子)
発光素子1は、LED素子などの半導体発光素子を用いることができる。発光素子1は、種々の半導体で構成される素子構造に正負一対の電極11,12が設けられたものであればよい。特に、発光素子1は、蛍光体を効率良く励起可能な窒化物半導体(InAlGa1-x-yN、0≦x、0≦y、x+y≦1)のものが好ましい。この他、発光素子1は、硫化亜鉛系半導体、セレン化亜鉛系半導体、炭化珪素系半導体のものでもよい。
(Light emitting element)
As the light emitting element 1, a semiconductor light emitting element such as an LED element can be used. The light emitting element 1 may be an element structure composed of various semiconductors provided with a pair of positive and negative electrodes 11 and 12. In particular, the light emitting device 1 is preferably a nitride semiconductor (In x Al y Ga 1-x-y N, 0 ≦ x, 0 ≦ y, x + y ≦ 1) capable of efficiently exciting a phosphor. In addition, the light emitting element 1 may be a zinc sulfide-based semiconductor, a zinc selenide-based semiconductor, or a silicon carbide-based semiconductor.

(第1反射部材)
第1反射部材2は、発光素子1からの光を反射して、波長変換部材3を介して光を取り出すためのものである。第1反射部材2は、発光素子1が発光し、横方向または下方向に進行する光を、発光装置100の発光領域である波長変換部材3側に反射するための部材である。
第1反射部材2は、発光素子1の側面および波長変換部材3の下方に設けられている。具体的には、第1反射部材2は、発光素子1の下面(電極11,12側)を被覆する。さらに、第1反射部材2は、発光素子1の側面のうち、導光部材6で被覆している領域は導光部材6を介して包囲するように被覆し、導光部材6で被覆していない領域は直接発光素子側面を被覆している。
なお、第1反射部材2は、ここでは、発光素子1の側面に形成された導光部材6を介して設けられているが、導光部材6を設けることなく、直接、発光素子1の側面に設けてもよい。
第1反射部材2は、例えば、反射物質を含有する樹脂層である。第1反射部材2は、母材あるいはバインダーとなる樹脂に、反射物質の他に、充填剤を含有して構成されてもよい。
(First reflective member)
The first reflecting member 2 is for reflecting the light from the light emitting element 1 and extracting the light through the wavelength conversion member 3. The first reflecting member 2 is a member for reflecting the light emitted by the light emitting element 1 and traveling in the lateral direction or the downward direction toward the wavelength conversion member 3 which is the light emitting region of the light emitting device 100.
The first reflection member 2 is provided on the side surface of the light emitting element 1 and below the wavelength conversion member 3. Specifically, the first reflective member 2 covers the lower surface (electrodes 11 and 12 sides) of the light emitting element 1. Further, in the first reflective member 2, the region of the side surface of the light emitting element 1 covered by the light guide member 6 is covered so as to be surrounded by the light guide member 6 and is covered with the light guide member 6. The area not directly covers the side surface of the light emitting element.
Although the first reflection member 2 is provided here via the light guide member 6 formed on the side surface of the light emitting element 1, the side surface of the light emitting element 1 is directly provided without providing the light guide member 6. It may be provided in.
The first reflective member 2 is, for example, a resin layer containing a reflective substance. The first reflective member 2 may be configured by containing a filler in addition to the reflective substance in a resin serving as a base material or a binder.

バインダーは、前記した反射物質や充填剤を、第1反射部材2として発光素子1の側面および下面(電極11,12側)に結着させるための樹脂である。バインダーとなる樹脂としては、例えば、ポリカーボネート樹脂、エポキシ樹脂、フェノール樹脂、シリコーン樹脂、アクリル樹脂、TPX樹脂、ポリノルボルネン樹脂、ウレタン樹脂などが挙げられる。または、バインダーとなる樹脂としては、例えば、これらの変性樹脂やこれらの樹脂を1種以上含むハイブリッド樹脂が挙げられる。なかでも、シリコーン樹脂またはその変性樹脂は、耐熱性や耐光性に優れ、硬化後の体積収縮が少ないため、好ましい。 The binder is a resin for binding the above-mentioned reflective substance or filler to the side surface and the lower surface (electrodes 11 and 12 sides) of the light emitting element 1 as the first reflective member 2. Examples of the resin serving as the binder include polycarbonate resin, epoxy resin, phenol resin, silicone resin, acrylic resin, TPX resin, polynorbornene resin, urethane resin and the like. Alternatively, examples of the resin serving as a binder include these modified resins and hybrid resins containing one or more of these resins. Of these, silicone resins or modified resins thereof are preferable because they are excellent in heat resistance and light resistance and have little volume shrinkage after curing.

反射物質は、発光素子1が発光した光を反射する物質である。反射物質としては、例えば、シリカ、酸化チタン、酸化ケイ素、酸化アルミニウム、チタン酸カリウム、酸化亜鉛、窒化硼素などが挙げられる。また、シリコーンパウダーなどの樹脂の粉末を用いてもよい。 The reflective substance is a substance that reflects the light emitted by the light emitting element 1. Examples of the reflective substance include silica, titanium oxide, silicon oxide, aluminum oxide, potassium titanate, zinc oxide, and boron nitride. Further, a resin powder such as silicone powder may be used.

充填剤は、樹脂層である第1反射部材2の強度を上げるため、または、第1反射部材2の熱伝導率を上げるためなどの理由から添加されるものである。充填剤としては、例えば、ガラス繊維、ウィスカー、酸化アルミニウム、酸化ケイ素、窒化硼素、酸化亜鉛、窒化アルミニウムなどが挙げられる。 The filler is added for reasons such as increasing the strength of the first reflective member 2 which is a resin layer, or increasing the thermal conductivity of the first reflective member 2. Examples of the filler include glass fiber, whiskers, aluminum oxide, silicon oxide, boron nitride, zinc oxide, aluminum nitride and the like.

(導光部材)
導光部材6は、発光素子1から光を取り出しやすくし、発光素子1からの光を波長変換部材3に導光する部材である。導光部材6は、光束および光の取り出し効率を向上させることができる。
導光部材6は、波長変換部材3と発光素子1とを接合する接着部材が、発光素子1の側面に這い上がって形成されたものである(製造時には上下が反対の状態で製造される)。
導光部材6としては、例えば、透光性の樹脂材料を用いることができる。また、導光部材6は、前記した第1反射部材2の母材あるいはバインダーとなる樹脂などの透光性接着材料が挙げられる。また、シリカ、酸化チタン、酸化ケイ素、酸化アルミニウム、チタン酸カリウム、酸化亜鉛、窒化硼素などの拡散剤が含有されていてもよい。これにより、波長変換部材3に、より均等に光を入射することができ、発光装置100の色ムラを抑制することができる。
(Light guide member)
The light guide member 6 is a member that facilitates the extraction of light from the light emitting element 1 and guides the light from the light emitting element 1 to the wavelength conversion member 3. The light guide member 6 can improve the efficiency of extracting light flux and light.
The light guide member 6 is formed by an adhesive member that joins the wavelength conversion member 3 and the light emitting element 1 so as to crawl up on the side surface of the light emitting element 1 (manufactured in an inverted state at the time of manufacture). ..
As the light guide member 6, for example, a translucent resin material can be used. Further, as the light guide member 6, a translucent adhesive material such as a resin serving as a base material or a binder of the first reflective member 2 described above can be mentioned. Further, a diffusing agent such as silica, titanium oxide, silicon oxide, aluminum oxide, potassium titanate, zinc oxide and boron nitride may be contained. As a result, light can be more evenly incident on the wavelength conversion member 3, and color unevenness of the light emitting device 100 can be suppressed.

導光部材6は、図1Bに示すように、断面視で、発光素子1の下面(電極11,12側)から波長変換部材3に向かって、部材幅が広がるように三角形状に形成されている。このような形態とすることで、光束および光の取り出し効率がより向上する。ただし、導光部材6の形状は、特に規定されるものではない。例えば、導光部材6の形状は、第1反射部材2側に凸形状でもよいし、発光素子1側に凹形状でもよい。
導光部材6は、発光素子1の側面の一部を被覆していてもよく、光束および光の取り出し効率を向上させる観点から、発光素子1の側面の略全部を被覆していることがより好ましい。
また、導光部材6は波長変換部材3と発光素子1の間に配置されてもよい。
As shown in FIG. 1B, the light guide member 6 is formed in a triangular shape so that the member width widens from the lower surface (electrodes 11 and 12 sides) of the light emitting element 1 toward the wavelength conversion member 3 in a cross-sectional view. There is. With such a form, the light flux and the light extraction efficiency are further improved. However, the shape of the light guide member 6 is not particularly specified. For example, the shape of the light guide member 6 may be a convex shape on the first reflecting member 2 side or a concave shape on the light emitting element 1 side.
The light guide member 6 may cover a part of the side surface of the light emitting element 1, and from the viewpoint of improving the light flux and the light extraction efficiency, the light guide member 6 may cover substantially the entire side surface of the light emitting element 1. preferable.
Further, the light guide member 6 may be arranged between the wavelength conversion member 3 and the light emitting element 1.

(波長変換部材)
波長変換部材3は、発光素子1が発光する波長の光の一部を吸収し、異なる波長の光に変換して発光する波長変換物質を含有する部材である。波長変換部材3で用いられる波長変換物質は、例えば蛍光体である。以下、波長変換物質は蛍光体であるものとして説明する。
波長変換部材3は、発光素子1の発光面上および第1反射部材2上に設けられている。
波長変換部材3の下面、すなわち、発光素子1の発光面と対面する面は、発光素子1の上面である発光面よりも大きく形成されている。
(Wavelength conversion member)
The wavelength conversion member 3 is a member containing a wavelength conversion substance that absorbs a part of light having a wavelength emitted by the light emitting element 1 and converts it into light having a different wavelength to emit light. The wavelength conversion substance used in the wavelength conversion member 3 is, for example, a phosphor. Hereinafter, the wavelength conversion substance will be described as being a phosphor.
The wavelength conversion member 3 is provided on the light emitting surface of the light emitting element 1 and on the first reflecting member 2.
The lower surface of the wavelength conversion member 3, that is, the surface facing the light emitting surface of the light emitting element 1, is formed larger than the light emitting surface which is the upper surface of the light emitting element 1.

波長変換部材3の母材あるいはバインダーは、透光性の樹脂によって形成されていることが好ましい。ここでの樹脂としては、例えば、前記した第1反射部材2の母材あるいはバインダーとなる樹脂が挙げられる。なかでも、シリコーン樹脂またはその変性樹脂は、耐熱性や耐光性に優れ、硬化後の体積収縮が少ないため、好ましい。また、波長変換部材3の母材あるいはバインダーは、樹脂の他、ガラスによって形成されてもよい。 The base material or binder of the wavelength conversion member 3 is preferably formed of a translucent resin. Examples of the resin here include the resin used as the base material or the binder of the first reflective member 2 described above. Of these, silicone resins or modified resins thereof are preferable because they are excellent in heat resistance and light resistance and have little volume shrinkage after curing. Further, the base material or the binder of the wavelength conversion member 3 may be formed of glass as well as resin.

波長変換部材3に含有される蛍光体としては、例えば、セリウムで賦活されたイットリウム・アルミニウム・ガーネット、セリウムで賦活されたルテチウム・アルミニウム・ガーネット、セリウムで賦活されたテルビウム・アルミニウム・ガーネット、ユウロピウムおよびクロムのうちのいずれか1つまたは2つで賦活された窒素含有アルミノ珪酸カルシウム、ユウロピウムで賦活されたサイアロン、ユウロピウムで賦活されたシリケート、マンガンで賦活されたフッ化珪酸カリウムなどが挙げられる。 Examples of the phosphor contained in the wavelength conversion member 3 include yttrium aluminum garnet activated with cerium, lutetium aluminum garnet activated with cerium, terbium aluminum garnet activated with cerium, europium, and the like. Examples thereof include nitrogen-containing calcium aluminosilicate activated by any one or two of chromium, cerium activated by europium, silicate activated by europium, potassium fluoride activated by manganese, and the like.

ここで、後述するように、波長変換部材3の体色と被覆部材5の体色が同系色となれば、蛍光体自体の体色はどのようなものであってもよい。体色とは、発光装置100の非発光時における部材自体の色彩をいう。
例えば、蛍光体自体の体色が白色系の蛍光体を用いた場合、波長変換部材3の体色は白色系となる。また、第2反射部材4の体色も基本的に白色系となる。そのため、後述するように、波長変換部材3の体色と被覆部材5の体色を同系色とすると、非発光時に発光装置100の上面全体が白色系の色彩となる。
Here, as will be described later, any body color of the phosphor itself may be used as long as the body color of the wavelength conversion member 3 and the body color of the covering member 5 are similar colors. The body color refers to the color of the member itself when the light emitting device 100 does not emit light.
For example, when a phosphor whose body color is white is used, the body color of the wavelength conversion member 3 is white. Further, the body color of the second reflective member 4 is basically white. Therefore, as will be described later, if the body color of the wavelength conversion member 3 and the body color of the covering member 5 are similar colors, the entire upper surface of the light emitting device 100 becomes a white color when no light is emitted.

発光装置100を例えばカメラのフラッシュライトなどの照明装置の白色光の光源として使用する場合、発光色が青色系の発光素子と、発光色が黄色系であり、体色が黄色系の蛍光体を用いることが好ましい。また、発光色が青色系の発光素子と、発光色が橙色系であり、体色が橙色系の蛍光体を用いることが好ましい。
体色が黄色系で、発光色が黄色の蛍光体としては、例えば、イットリウム・アルミニウム・ガーネット系蛍光体(YAG系蛍光体)、ルテチウム・アルミニウム・ガーネット系蛍光体(LAG系蛍光体)、テルビウム・アルミニウム・ガーネット系蛍光体(TAG系蛍光体)などが挙げられる。また、体色が黄色系で、発光色が赤色系の蛍光体としては、KSFが挙げられる。これらの蛍光体の体色は、後述するマンセル表色系(20色相)のマンセル色相環において、10Y、または、5Yである。
体色が橙色系で、発光色が赤色系の蛍光体としては、例えば、SCASN、CASNなどが挙げられる。これらの蛍光体の体色は、後述するマンセル表色系(20色相)のマンセル色相環において、10YR、または、5YRである。
また、発光色が黄色系蛍光体と発光色が赤色系蛍光体を混合し、発光色が橙色系の蛍光体とすることができる。
When the light emitting device 100 is used as a light source for white light of a lighting device such as a flash light of a camera, a light emitting element having a blue light emitting color and a phosphor having a yellow light emitting color and a yellow body color are used. It is preferable to use it. Further, it is preferable to use a light emitting element having a blue emission color and a phosphor having an orange emission color and an orange body color.
Examples of the fluorescent substance having a yellow body color and a yellow emission color include yttrium aluminum garnet fluorescent substance (YAG fluorescent substance), lutetium aluminum garnet fluorescent substance (LAG fluorescent substance), and terbium. -Aluminum garnet-based fluorescent material (TAG-based fluorescent material) and the like can be mentioned. Further, examples of the phosphor having a yellow body color and a red emission color include KSF. The body color of these phosphors is 10Y or 5Y in the Munsell color wheel of the Munsell color system (20 hues) described later.
Examples of the fluorescent substance having an orange body color and a red emission color include SCASN and CASN. The body color of these phosphors is 10YR or 5YR in the Munsell color wheel of the Munsell color system (20 hues) described later.
Further, a fluorescent substance having a yellow emission color and a phosphor having a emission color of red can be mixed to obtain a phosphor having an emission color of orange.

また、蛍光体自体の体色が黄色系の蛍光体および橙色系の蛍光体の色としては、例えば、後述するマンセル表色系(20色相)のマンセル色相環において、5YR、10YR、5Y、10Yの色相が挙げられる。
蛍光体自体の色としては、黄色系の蛍光体の場合、例えば、10Y、5Yである。橙色系の蛍光体の場合、例えば、10YR、5YRである。蛍光体自体の体色が黄色系の蛍光体で、マンセル表色系(20色相)のマンセル色相環において5Yの場合を例にとり、以下に説明する。
マンセル表色系において、明度は、例えば、7以上9以下である。
また、マンセル表色系において、彩度は、例えば、4以上14以下である。
The colors of the yellow-based phosphor and the orange-based phosphor of the phosphor itself are, for example, 5YR, 10YR, 5Y, and 10Y in the Munsell hue circle of the Munsell color system (20 hues) described later. Hue can be mentioned.
The color of the fluorescent substance itself is, for example, 10Y and 5Y in the case of a yellowish fluorescent substance. In the case of an orange-based phosphor, for example, 10YR and 5YR. The case where the body color of the phosphor itself is a yellowish phosphor and the Munsell color wheel of the Munsell color system (20 hues) is 5Y will be described below as an example.
In the Munsell color system, the brightness is, for example, 7 or more and 9 or less.
Further, in the Munsell color system, the saturation is, for example, 4 or more and 14 or less.

また、後述するように、被覆部材5が波長変換物質を含む場合、波長変換部材3は、被覆部材5に含まれる波長変換物質と同じ組成の波長変換物質を含むことが好ましい。このような構成によれば、非発光時における発光装置100の上面全体の色彩が波長変換部材3の色彩と同じになりやすくなる。 Further, as will be described later, when the covering member 5 contains a wavelength conversion substance, the wavelength conversion member 3 preferably contains a wavelength conversion substance having the same composition as the wavelength conversion substance contained in the covering member 5. According to such a configuration, the color of the entire upper surface of the light emitting device 100 at the time of non-light emission tends to be the same as the color of the wavelength conversion member 3.

波長変換部材3には、拡散剤を含有させてもよい。拡散剤は、発光素子1および蛍光体の発する光を効率良く拡散するために添加されるものである。拡散剤としては、例えば、前記した第1反射部材2の反射物質と同様のものが挙げられる。
波長変換部材3の上下方向の厚みは、蛍光体の含有量、発光素子1が発光する光と、波長変換後の光との混色後の色調などによって定めることができるが、例えば、50μm以上300μm以下とすることができる。
The wavelength conversion member 3 may contain a diffusing agent. The diffusing agent is added in order to efficiently diffuse the light emitted by the light emitting element 1 and the phosphor. Examples of the diffusing agent include the same as the reflective substance of the first reflective member 2 described above.
The vertical thickness of the wavelength conversion member 3 can be determined by the content of the phosphor, the color tone of the light emitted by the light emitting element 1 and the color tone of the light after wavelength conversion, and the like, and is, for example, 50 μm or more and 300 μm. It can be as follows.

(第2反射部材)
第2反射部材4は、発光素子1からの光を反射して、波長変換部材3を介して光を取り出すためのものである。第2反射部材4は、発光素子1が発光し、被覆部材5の方向に進行する光を、光取り出し面である波長変換部材3側に反射するための部材である。また、第2反射部材4は、発光時の発光領域と非発光領域とのコントラスト(輝度の差)を大きくするための部材である。
(Second reflective member)
The second reflecting member 4 is for reflecting the light from the light emitting element 1 and extracting the light through the wavelength conversion member 3. The second reflecting member 4 is a member for reflecting the light emitted by the light emitting element 1 in the direction of the covering member 5 toward the wavelength conversion member 3 which is the light extraction surface. Further, the second reflective member 4 is a member for increasing the contrast (difference in luminance) between the light emitting region and the non-light emitting region at the time of light emission.

第2反射部材4は、波長変換部材3の外側面を被覆している。ここでは、第2反射部材4は、波長変換部材3の外側面の上端から下端までを被覆している。また、第2反射部材4は、第1反射部材2の外側面を被覆している。すなわち、第2反射部材4は、第1反射部材2と被覆部材5との間、および、波長変換部材3と被覆部材5との間に連続して設けられている。 The second reflective member 4 covers the outer surface of the wavelength conversion member 3. Here, the second reflective member 4 covers from the upper end to the lower end of the outer surface of the wavelength conversion member 3. Further, the second reflective member 4 covers the outer surface of the first reflective member 2. That is, the second reflective member 4 is continuously provided between the first reflective member 2 and the covering member 5 and between the wavelength conversion member 3 and the covering member 5.

第2反射部材4は、例えば、第1反射部材2と同様に、反射物質を含有する樹脂層である。第2反射部材4は、母材あるいはバインダーとなる樹脂に、反射物質の他に、充填剤を含有して構成されてもよい。第2反射部材4の樹脂、反射部材および充填剤は、例えば、前記した第1反射部材2の樹脂、反射部材および充填剤が挙げられる。
また、第2反射部材4は、酸化アルミニウム、酸化ジルコニウム、酸化チタン等の無機膜であってもよい。
The second reflective member 4 is, for example, a resin layer containing a reflective substance, similarly to the first reflective member 2. The second reflective member 4 may be configured by containing a filler in addition to the reflective substance in a resin serving as a base material or a binder. Examples of the resin, the reflective member and the filler of the second reflective member 4 include the resin, the reflective member and the filler of the first reflective member 2 described above.
Further, the second reflective member 4 may be an inorganic film such as aluminum oxide, zirconium oxide, or titanium oxide.

第2反射部材4は、金属層および誘電体層の少なくとも1つを含むものであってもよい。例えば、図9に示すように、前記した第2反射部材4の材料からなる反射層41における、発光素子1からの光が当たる側の表面に、金属層42および誘電体層43を積層したものであってもよい。金属層42および誘電体層43はいずれか一方を設けてもよく、両方を設けてもよい。また、両方を設ける場合、積層する順序はどちらが先でもよい。第2反射部材4が、金属層42および誘電体層43の少なくとも一方を含むことで、第2反射部材4の反射率が向上する。これにより、発光時の発光領域と非発光領域とのコントラストがより大きくなる。 The second reflective member 4 may include at least one of a metal layer and a dielectric layer. For example, as shown in FIG. 9, the metal layer 42 and the dielectric layer 43 are laminated on the surface of the reflective layer 41 made of the material of the second reflective member 4 on the side exposed to the light from the light emitting element 1. May be. Either one of the metal layer 42 and the dielectric layer 43 may be provided, or both may be provided. Further, when both are provided, either of them may be stacked first. When the second reflective member 4 includes at least one of the metal layer 42 and the dielectric layer 43, the reflectance of the second reflective member 4 is improved. As a result, the contrast between the light emitting region and the non-light emitting region at the time of light emission becomes larger.

金属層42としては、例えば、銅、アルミニウム、金、銀、プラチナ、チタン、タングステン、パラジウム、鉄、ニッケルなどからなる層が挙げられる。金属層42は、反射率をより向上させる観点から、好ましくは金または銀からなる層である。 Examples of the metal layer 42 include layers made of copper, aluminum, gold, silver, platinum, titanium, tungsten, palladium, iron, nickel and the like. The metal layer 42 is preferably a layer made of gold or silver from the viewpoint of further improving the reflectance.

誘電体層43としては、複数の誘電体層が積層された誘電体多層膜が挙げられる。誘電体多層膜は、分布ブラッグ反射膜(DBR(Distributed Bragg Reflector))の1種である。また、誘電体多層膜は、低屈折率層と高屈折率層とからなる1組の誘電体を、複数組にわたって積層させた膜であり、所定の波長光を選択的に反射するものである。具体的には屈折率の異なる2種以上の膜を波長/4n(nは屈折率)の厚みで交互に積層した膜であり、所定の波長の光を高効率に反射できる。低屈折率材料としてはSiOが挙げられ、また、高屈折率材料としてはNb、TiO、ZrO、Taなどが挙げられる。誘電体多層膜は、例えば、SiOからなる層とNbからなる層とを交互に積層したものが挙げられる。 Examples of the dielectric layer 43 include a dielectric multilayer film in which a plurality of dielectric layers are laminated. The dielectric multilayer film is a kind of distributed Bragg Reflector (DBR). Further, the dielectric multilayer film is a film in which a set of dielectrics composed of a low refractive index layer and a high refractive index layer is laminated over a plurality of sets, and selectively reflects light having a predetermined wavelength. .. Specifically, it is a film in which two or more kinds of films having different refractive indexes are alternately laminated with a thickness of wavelength / 4n (n is a refractive index), and can reflect light of a predetermined wavelength with high efficiency. Examples of the low refractive index material include SiO 2 , and examples of the high refractive index material include Nb 2 O 5 , TiO 2 , ZrO 2 , and Ta 2 O 5 . Examples of the dielectric multilayer film include those in which layers made of SiO 2 and layers made of Nb 2 O 5 are alternately laminated.

第2反射部材4の幅方向の厚みは、0.1μm以上5.0μm以下であることが好ましい。第2反射部材4の幅方向の厚みが0.1μm以上であれば、発光時の発光領域と非発光領域とのコントラストをより大きくすることができる。一方、第2反射部材4の幅方向の厚みが5.0μm以下であれば、非発光時における発光装置100の上面全体の色彩が波長変換部材3の色彩と同じになりやすくなる。
第2反射部材4の幅方向の厚みは、発光時の発光領域と非発光領域とのコントラストをより大きくする観点から、より好ましくは0.3μm以上、さらに好ましくは0.5μm以上である。
また、第2反射部材4の幅方向の厚みは、非発光時における発光装置100の上面全体の色彩を波長変換部材3の色彩とより同じにしやすくする観点から、より好ましくは2.0μm以下、さらに好ましくは1.0μm以下である。
The thickness of the second reflective member 4 in the width direction is preferably 0.1 μm or more and 5.0 μm or less. When the thickness of the second reflective member 4 in the width direction is 0.1 μm or more, the contrast between the light emitting region and the non-light emitting region at the time of light emission can be further increased. On the other hand, when the thickness of the second reflective member 4 in the width direction is 5.0 μm or less, the color of the entire upper surface of the light emitting device 100 at the time of non-light emission tends to be the same as the color of the wavelength conversion member 3.
The thickness of the second reflective member 4 in the width direction is more preferably 0.3 μm or more, still more preferably 0.5 μm or more, from the viewpoint of increasing the contrast between the light emitting region and the non-light emitting region at the time of light emission.
Further, the thickness of the second reflective member 4 in the width direction is more preferably 2.0 μm or less from the viewpoint of making it easier to make the color of the entire upper surface of the light emitting device 100 the same as the color of the wavelength conversion member 3 when the light is not emitted. More preferably, it is 1.0 μm or less.

(被覆部材)
被覆部材5は、第2反射部材4の外側面を被覆する部材である。ここでは、被覆部材5は、第2反射部材4の外側面の上端から下端までを被覆している。被覆部材5は、発光装置100の側面の一部を形成している。
(Coating member)
The covering member 5 is a member that covers the outer surface of the second reflective member 4. Here, the covering member 5 covers from the upper end to the lower end of the outer surface of the second reflective member 4. The covering member 5 forms a part of the side surface of the light emitting device 100.

被覆部材5は、例えば、樹脂層である。被覆部材5の母材あるいはバインダーとして用いられる樹脂としては、例えば、前記した第1反射部材2の母材あるいはバインダーとなる樹脂が挙げられる。なかでも、エポキシ樹脂またはその変性樹脂は、接着性やガスバリア性に優れるため、好ましい。また、シリコーン樹脂またはその変性樹脂は、耐熱性や耐光性に優れ、硬化後の体積収縮が少ないため、好ましい。 The covering member 5 is, for example, a resin layer. Examples of the resin used as the base material or the binder of the covering member 5 include the resin used as the base material or the binder of the first reflective member 2 described above. Of these, epoxy resins or modified resins thereof are preferable because they have excellent adhesiveness and gas barrier properties. Further, a silicone resin or a modified resin thereof is preferable because it has excellent heat resistance and light resistance and has less volume shrinkage after curing.

被覆部材5は、波長変換物質、顔料および染料のいずれか1つを含む。波長変換物質としては、波長変換部材3に含有する波長変換物質と同様のものが挙げられる。
顔料としては特に限定されるものではないが、例えば、無機系材料や有機系材料を用いたものがあり、以下の材料を用いたものが挙げられる。
無機系材料として、例えば、べんがら(Fe)、鉛丹(Pb)、チタンニッケルアンチモン系酸化物、チタンニッケルバリウム系酸化物、チタンクロムアンチモン系酸化物、チタンクロムニオブ系酸化物などが挙げられる。
有機系材料として、例えば、アントラキノン系、アゾ系、キナクリドン系、ペリレン系、ジケトピロロピロール系、モノアゾ系、ジスアゾ系、ピラゾロン系、ベンツイミダゾロン系、キノキサリン系、アゾメチン系、イソイソドリノン系、イソイソドリン系などが挙げられる。
The covering member 5 contains any one of a wavelength converting substance, a pigment and a dye. Examples of the wavelength conversion substance include the same wavelength conversion substances contained in the wavelength conversion member 3.
The pigment is not particularly limited, and examples thereof include those using an inorganic material and an organic material, and examples thereof include those using the following materials.
Examples of inorganic materials include Bengara (Fe 2 O 3 ), Lead Tan (Pb 3 O 4 ), Titanium Nickel Antimon Oxide, Titanium Nickel Barium Oxide, Titanium Chromium Antimon Oxide, and Titanium Chromium Niobium Oxide. Things and the like can be mentioned.
Examples of organic materials include anthraquinone, azo, quinacridone, perylene, diketopyrrolopyrrole, monoazo, disazo, pyrazolone, benzimidazolone, quinoxaline, azomethin, and isoisodrinone. Examples include isoisodrine type.

染料としては特に限定されるものではないが、例えば、アントラキノン系染料、メチン系染料、アゾメチン系染料、オキサジン系染料、アゾ系染料、スチリル系染料、クマリン系染料、ポルフィリン系染料、ジベンゾフラノン系染料、ジケトピロロピロール系染料、ロダミン系染料、キサンテン系染料、ピロメテン系染料などが挙げられる。
なお、顔料および染料は、基本的に発光素子1からの光を異なる波長に変換しないものがよい。
The dye is not particularly limited, but for example, anthraquinone dye, methine dye, azomethine dye, oxazine dye, azo dye, styryl dye, coumarin dye, porphyrin dye, dibenzofuranone dye. , Diketopyrrolopyrrole dyes, rodamine dyes, xanthene dyes, pyromethene dyes and the like.
The pigments and dyes are basically those that do not convert the light from the light emitting element 1 into different wavelengths.

波長変換部材3の体色と被覆部材5の体色は同系色である。ここで、同系色とは、マンセル表色系(20色相)において、
色相:色相環の3レンジ以内
明度:3レンジ以内
彩度:3レンジ以内
を意味する。すなわち、マンセル表色系(20色相)の等色相面において、色相、明度、彩度とも両隣までが同系色とする。
The body color of the wavelength conversion member 3 and the body color of the covering member 5 are similar colors. Here, the similar color means in the Munsell color system (20 hues).
Hue: Within 3 ranges of the hue circle Brightness: Within 3 ranges Saturation: Within 3 ranges. That is, on the equihue plane of the Munsell color system (20 hues), the hue, the lightness, and the saturation are all similar colors up to both sides.

具体的には、図2に示すように、例えば、Y(黄色)系の色相の等色相面(5Y)で、特定の色彩を色彩aとした場合、範囲Aが同系色である。
体色の測定は、例えば、分光測色計 CMシリーズ(コニカミノルタ社製)、色彩色差計 CRシリーズ(コニカミノルタ社製)などの測定器を用いて行うことができる。このような測定器のうち、キセノンランプの光源とシリコンフォトダイオードの受光素子を備え、平面回折格子で分光でき、マンセル表色系での出力が可能なものを用いればよい。
Specifically, as shown in FIG. 2, for example, when a specific color is a color a on the equihue plane (5Y) of a Y (yellow) hue, the range A is a similar color.
The body color can be measured using, for example, a measuring instrument such as a spectrophotometer CM series (manufactured by Konica Minolta) or a color difference meter CR series (manufactured by Konica Minolta). Among such measuring instruments, one that is provided with a light source of a xenon lamp and a light receiving element of a silicon photodiode, can be separated by a plane diffraction grating, and can be output in the Munsell color system may be used.

波長変換部材3の体色と被覆部材5の体色が同系色であることで、非発光時に発光装置100の上面全体を波長変換部材3の色彩とすることができる。
なお、非発光時に発光装置100の上面全体が波長変換部材3の色彩となるとは、発光装置100の上面全体の色彩が波長変換部材3の色彩と同じとなる場合の他、同程度となる場合も含む。同程度とは、例えば、前述したマンセル表色系(20色相)の等色相面において、色相、明度、彩度とも両隣までとすることができる。
Since the body color of the wavelength conversion member 3 and the body color of the covering member 5 are similar colors, the entire upper surface of the light emitting device 100 can be the color of the wavelength conversion member 3 when no light is emitted.
The fact that the entire upper surface of the light emitting device 100 becomes the color of the wavelength conversion member 3 when the light emitting device 100 does not emit light means that the color of the entire upper surface of the light emitting device 100 is the same as or the same as the color of the wavelength conversion member 3. Also includes. The same degree can be defined as, for example, on both sides of the above-mentioned Munsell color system (20 hues) in terms of hue, lightness, and saturation.

被覆部材5の幅方向の厚みは、20μm以上200μm以下であることが好ましい。被覆部材5の幅方向の厚みが20μm以上であれば、非発光時における発光装置100の上面全体の色彩が波長変換部材3の色彩と同じになりやすくなる。一方、被覆部材5の幅方向の厚みが200μm以下であれば、発光装置100の小型化を図ることができる。 The thickness of the covering member 5 in the width direction is preferably 20 μm or more and 200 μm or less. When the thickness of the covering member 5 in the width direction is 20 μm or more, the color of the entire upper surface of the light emitting device 100 at the time of non-light emission tends to be the same as the color of the wavelength conversion member 3. On the other hand, if the thickness of the covering member 5 in the width direction is 200 μm or less, the light emitting device 100 can be downsized.

<発光装置の動作>
次に、発光装置100の動作について説明する。
発光装置100を駆動すると、電極11,12を介して外部電源から発光素子1に電力が供給され、発光素子1が発光する。発光素子1が発光した光の一部は、第1反射部材2および第2反射部材4で反射し、波長変換部材3を通過して外部に取り出される。この際、第2反射部材4が設けられていることで、発光装置100の上面における発光領域と非発光領域とのコントラスト(輝度の差)が大きくなる。
<Operation of light emitting device>
Next, the operation of the light emitting device 100 will be described.
When the light emitting device 100 is driven, electric power is supplied to the light emitting element 1 from an external power source via the electrodes 11 and 12, and the light emitting element 1 emits light. A part of the light emitted by the light emitting element 1 is reflected by the first reflecting member 2 and the second reflecting member 4, passes through the wavelength conversion member 3, and is taken out to the outside. At this time, since the second reflective member 4 is provided, the contrast (difference in luminance) between the light emitting region and the non-light emitting region on the upper surface of the light emitting device 100 becomes large.

[発光装置の製造方法]
次に、実施形態に係る発光装置100の製造方法の一例について、図3~図7Bを参照して説明する。なお、図4A~図7Bは、複数の発光装置100を同時に製造するときの1つの発光装置100を模式的に示している。
[Manufacturing method of light emitting device]
Next, an example of the manufacturing method of the light emitting device 100 according to the embodiment will be described with reference to FIGS. 3 to 7B. Note that FIGS. 4A to 7B schematically show one light emitting device 100 when a plurality of light emitting devices 100 are manufactured at the same time.

図3に示すように、実施形態の発光装置100の製造方法は、シート上に波長変換部材を形成する工程S101と、発光素子を載置する工程S102と、第1反射部材で被覆する工程S103と、波長変換部材の外側面を露出する工程S104と、第2反射部材で被覆する工程S105と、被覆部材で被覆する工程S106と、電極を露出させる工程S107と、別のシートに転写する工程S108と、発光装置の上面を整える工程S109と、切断する工程S110と、を含み、この順に行う。
なお、各部材の材質や配置などについては、前記した発光装置100の説明で述べた通りであるので、ここでは適宜、説明を省略する。
As shown in FIG. 3, the manufacturing method of the light emitting device 100 of the embodiment includes a step S101 for forming a wavelength conversion member on a sheet, a step S102 for placing a light emitting element, and a step S103 for covering with a first reflecting member. A step S104 for exposing the outer surface of the wavelength conversion member, a step S105 for covering with the second reflective member, a step S106 for covering with the covering member, and a step S107 for exposing the electrodes, and a step of transferring to another sheet. S108, a step S109 for preparing the upper surface of the light emitting device, and a step S110 for cutting are included, and the steps are performed in this order.
Since the materials and arrangements of the respective members are as described in the above description of the light emitting device 100, the description thereof will be omitted here as appropriate.

(シート上に波長変換部材を形成する工程)
シート上に波長変換部材を形成する工程S101は、図4Aに示すように、樹脂などのシート20上に波長変換部材3を形成する工程である。
シート20上への波長変換部材3の形成は、例えば、印刷法、圧縮成形法、蛍光体電着法、または、板状の波長変換部材を積層する方法などにより行うことができる。
(Step of forming a wavelength conversion member on the sheet)
The step S101 for forming the wavelength conversion member on the sheet is a step of forming the wavelength conversion member 3 on the sheet 20 such as resin, as shown in FIG. 4A.
The wavelength conversion member 3 can be formed on the sheet 20 by, for example, a printing method, a compression molding method, a phosphor electrodeposition method, or a method of laminating plate-shaped wavelength conversion members.

(発光素子を載置する工程)
発光素子を載置する工程S102は、図4Bに示すように、第1面3aと第1面3aの反対側に第2面3bを有する波長変換部材3の第1面3aに、発光面1aを対面させて発光素子1を載置する工程である。
この工程S102では、発光素子1は、発光素子1の電極11,12が設けられた側の反対面、すなわち、発光面1aを、接着部材を介して波長変換部材3の第1面3aに接合する。このとき、配光などの観点において、波長変換部材3の第1面3aの中心と発光素子1の発光面1a中心が一致するように接合することが好ましい。
(Step of mounting the light emitting element)
In the step S102 for mounting the light emitting element, as shown in FIG. 4B, the light emitting surface 1a is formed on the first surface 3a of the wavelength conversion member 3 having the second surface 3b on the opposite side of the first surface 3a and the first surface 3a. This is a step of mounting the light emitting element 1 so as to face each other.
In this step S102, the light emitting element 1 joins the opposite surface of the light emitting element 1 on the side where the electrodes 11 and 12 are provided, that is, the light emitting surface 1a, to the first surface 3a of the wavelength conversion member 3 via the adhesive member. do. At this time, from the viewpoint of light distribution and the like, it is preferable to join the wavelength conversion member 3 so that the center of the first surface 3a and the center of the light emitting surface 1a of the light emitting element 1 coincide with each other.

ここで、接着部材の量を調整することで、接着部材を発光素子1の側面に這い上がらせ、発光素子1の側面に接着部材を形成することができる。これにより、発光装置100は、発光素子1の側面に接着部材である導光部材6が設けられた形態となる。
また、発光素子1の発光面1aと波長変換部材3の第1面3aの間に接着部材である導光部材6が上下方向の所定の厚みで配置されてもよい。これにより、発光素子1と波長変換部材3をより強固に接着することができる。なお、図示しないが、ここでは発光素子1の発光面1aと波長変換部材3の第1面3aの間には、発光素子1と波長変換部材3との接合のため、極薄い状態で接着部材が介在している。
Here, by adjusting the amount of the adhesive member, the adhesive member can be made to crawl up to the side surface of the light emitting element 1 and the adhesive member can be formed on the side surface of the light emitting element 1. As a result, the light emitting device 100 is provided with a light guide member 6 which is an adhesive member on the side surface of the light emitting element 1.
Further, the light guide member 6 which is an adhesive member may be arranged between the light emitting surface 1a of the light emitting element 1 and the first surface 3a of the wavelength conversion member 3 with a predetermined thickness in the vertical direction. As a result, the light emitting element 1 and the wavelength conversion member 3 can be more firmly bonded to each other. Although not shown, here, an adhesive member is formed in an extremely thin state between the light emitting surface 1a of the light emitting element 1 and the first surface 3a of the wavelength conversion member 3 because the light emitting element 1 and the wavelength conversion member 3 are joined. Is intervening.

(第1反射部材で被覆する工程)
第1反射部材で被覆する工程S103は、図4Cに示すように、波長変換部材3上に載置した発光素子1を第1反射部材2で被覆する工程である。
この工程S103では、電極11,12を含めた発光素子1の全部を第1反射部材2で被覆する。この工程S103では、波長変換部材3の面から電極11,12の上面まで第1反射部材2が設けられている。
(Step of covering with the first reflective member)
The step S103 of covering with the first reflecting member is a step of covering the light emitting element 1 mounted on the wavelength conversion member 3 with the first reflecting member 2, as shown in FIG. 4C.
In this step S103, the entire light emitting element 1 including the electrodes 11 and 12 is covered with the first reflecting member 2. In this step S103, the first reflection member 2 is provided from the surface of the wavelength conversion member 3 to the upper surfaces of the electrodes 11 and 12.

発光素子1の被覆は、例えば、固定されたシート20の上側において、シート20に対して上下方向あるいは水平方向などに移動(可動)させることができる吐出装置(ディスペンサー)を用いて行うことができる。第1反射部材2の被覆は、吐出装置を用いて、第1反射部材2を構成する樹脂などを波長変換部材3上に充填することにより行うことができる。
また、圧縮成形法、トランスファー成形法などによって被覆することも可能である。
The coating of the light emitting element 1 can be performed, for example, by using a discharge device (dispenser) capable of moving (moving) the light emitting element 1 in the vertical direction or the horizontal direction with respect to the sheet 20 on the upper side of the fixed sheet 20. .. The coating of the first reflective member 2 can be performed by filling the wavelength conversion member 3 with a resin or the like constituting the first reflective member 2 using a discharge device.
It is also possible to cover by a compression molding method, a transfer molding method, or the like.

(波長変換部材の外側面を露出する工程)
波長変換部材の外側面を露出する工程S104は、図5Aに示すように、発光素子1の周囲における波長変換部材3の一部を除去し、波長変換部材3の外側面3cを露出する工程である。波長変換部材3の一部の除去は、ここでは、波長変換部材3の第1面3a側となる第1反射部材2側から行う。
(Step of exposing the outer surface of the wavelength conversion member)
The step S104 for exposing the outer surface of the wavelength conversion member is a step of removing a part of the wavelength conversion member 3 around the light emitting element 1 and exposing the outer surface 3c of the wavelength conversion member 3, as shown in FIG. 5A. be. Here, the removal of a part of the wavelength conversion member 3 is performed from the side of the first reflection member 2 which is the side of the first surface 3a of the wavelength conversion member 3.

この工程S104では、第1反射部材2、波長変換部材3を貫通し、シート20の厚み内に至るまで凹部30が形成される。この工程S104では、発光素子1を個片化した際に、第2反射部材4および被覆部材5が形成される位置に凹部30を形成する。この凹部30の形成により、波長変換部材3の外側面3cが露出する。
凹部30の形成は、例えば、所定幅のブレードを用いて、第1反射部材2の上面からシート20に向けて垂直方向または、傾斜をつけて、部材を除去することにより行うことができる。詳細には、凹部30の形成は、第1反射部材2を貫通し、さらに波長変換部材3を貫通して、シート20の一部を除去することにより行うことができる。
なお、凹部30の形成は、レーザー光により行ってもよく、エッチングにより行ってもよい。
また、凹部30は、発光素子1の周囲であればどこに形成してもよい。発光素子1の側面に導光部材6が配置されている場合、導光部材6の一部を除去するように凹部30を形成してもよい。発光効率を高めるためには、図5Aに示すように、導光部材6より外側に形成することが好ましい。
In this step S104, the recess 30 is formed through the first reflection member 2 and the wavelength conversion member 3 and reaches within the thickness of the sheet 20. In this step S104, when the light emitting element 1 is fragmented, the recess 30 is formed at a position where the second reflective member 4 and the covering member 5 are formed. By forming the recess 30, the outer surface 3c of the wavelength conversion member 3 is exposed.
The recess 30 can be formed, for example, by removing the member by using a blade having a predetermined width in a vertical direction or at an angle from the upper surface of the first reflective member 2 toward the sheet 20. Specifically, the concave portion 30 can be formed by penetrating the first reflective member 2 and further penetrating the wavelength conversion member 3 to remove a part of the sheet 20.
The recess 30 may be formed by laser light or by etching.
Further, the recess 30 may be formed anywhere as long as it is around the light emitting element 1. When the light guide member 6 is arranged on the side surface of the light emitting element 1, the recess 30 may be formed so as to remove a part of the light guide member 6. In order to increase the luminous efficiency, it is preferable to form it outside the light guide member 6 as shown in FIG. 5A.

(第2反射部材で被覆する工程)
第2反射部材で被覆する工程S105は、図5Bに示すように、波長変換部材3の外側面3cを第2反射部材4で被覆する工程である。
この工程S105では、第1反射部材2の上面および凹部30の内側面に第2反射部材4を形成する。
第2反射部材4の形成は、例えば、電解めっき、無電解めっき、蒸着、スパッタなどにより行うことができる。また、第2反射部材4として樹脂を用いる場合には、第2反射部材4を形成する方法として、例えば、印刷法、圧縮成形法などにより行うことができる。
(Step of covering with the second reflective member)
The step S105 of covering with the second reflecting member is a step of covering the outer surface 3c of the wavelength conversion member 3 with the second reflecting member 4, as shown in FIG. 5B.
In this step S105, the second reflective member 4 is formed on the upper surface of the first reflective member 2 and the inner surface of the recess 30.
The second reflective member 4 can be formed by, for example, electrolytic plating, electroless plating, thin film deposition, sputtering, or the like. When a resin is used as the second reflective member 4, the method for forming the second reflective member 4 can be, for example, a printing method, a compression molding method, or the like.

(被覆部材で被覆する工程)
被覆部材で被覆する工程S106は、図5Cに示すように、第2反射部材4の外側面4aを、体色が波長変換部材3の体色と同系色である被覆部材5で被覆する工程である。
この工程S106では、凹部30内に被覆部材5を充填して第2反射部材4の外側面4aを被覆部材5で被覆する手続きを経て被覆部材5を形成する。この工程S106により、凹部30内の第2反射部材4の表面に被覆部材5が形成される。
(Process of covering with a covering member)
In the step S106 of covering with the covering member, as shown in FIG. 5C, the outer surface 4a of the second reflecting member 4 is covered with the covering member 5 whose body color is similar to the body color of the wavelength conversion member 3. be.
In this step S106, the covering member 5 is formed through a procedure of filling the recess 30 with the covering member 5 and covering the outer surface 4a of the second reflective member 4 with the covering member 5. By this step S106, the covering member 5 is formed on the surface of the second reflective member 4 in the recess 30.

被覆部材5の充填は、例えば、印刷法、圧縮成形法、電着法などにより行うことができる。また、被覆部材5の充填は、前記した樹脂吐出装置を用いて行うことができる。
ここで、波長変換部材3の体色と被覆部材5の体色とが同系色となるように材料を選択する。
The covering member 5 can be filled by, for example, a printing method, a compression molding method, an electrodeposition method, or the like. Further, the covering member 5 can be filled by using the resin discharge device described above.
Here, the material is selected so that the body color of the wavelength conversion member 3 and the body color of the covering member 5 have similar colors.

(電極を露出させる工程)
電極を露出させる工程S107は、図6Aに示すように、電極11,12側における、第1反射部材2の一部、第2反射部材4の一部、および、被覆部材5の一部を、発光素子1の電極11,12を露出させるように除去する工程である。
この工程S107では、例えば、電極11,12側から、第1反射部材2、第2反射部材4、および、被覆部材5の表面を電極11,12が露出するまで除去する。第1反射部材2、第2反射部材4、および、被覆部材5を除去する方法として、例えば、研削、研磨、ブラストなどがある。
(Process to expose electrodes)
In the step S107 for exposing the electrodes, as shown in FIG. 6A, a part of the first reflective member 2, a part of the second reflective member 4, and a part of the covering member 5 on the electrodes 11 and 12 sides are formed. This is a step of removing the electrodes 11 and 12 of the light emitting element 1 so as to be exposed.
In this step S107, for example, the surfaces of the first reflective member 2, the second reflective member 4, and the covering member 5 are removed from the electrodes 11 and 12 until the electrodes 11 and 12 are exposed. As a method for removing the first reflective member 2, the second reflective member 4, and the covering member 5, for example, there are grinding, polishing, blasting, and the like.

(別のシートに転写する工程)
別のシートに転写する工程S108は、図6Bに示すように、電極11,12を露出させた構造体を、樹脂などの別のシート21に転写する工程である。
この工程S108では、第1反射部材2から露出する電極11,12がシート21に接着するように、シート21上に構造体を載置する。
なお、別のシート21に転写する前、または後に、波長変換部材3の形成に用いたシート20を除去する。
(Process to transfer to another sheet)
The step S108 of transferring to another sheet is a step of transferring the structure in which the electrodes 11 and 12 are exposed to another sheet 21 such as resin, as shown in FIG. 6B.
In this step S108, the structure is placed on the sheet 21 so that the electrodes 11 and 12 exposed from the first reflective member 2 adhere to the sheet 21.
The sheet 20 used for forming the wavelength conversion member 3 is removed before or after the transfer to another sheet 21.

(発光装置の上面を整える工程)
発光装置の上面を整える工程S109は、図7Aに示すように、シート20を除去することで波長変換部材3の第2面3b側に露出した第2反射部材4の一部、および、被覆部材5の一部を除去し、発光装置の上面を整える工程である。
この工程S109では、例えば、発光装置の上面の一部を除去することで、波長変換部材3の第2面3bに沿って発光装置の上面を平滑にする。
(Process to prepare the upper surface of the light emitting device)
In the step S109 of preparing the upper surface of the light emitting device, as shown in FIG. 7A, a part of the second reflective member 4 exposed on the second surface 3b side of the wavelength conversion member 3 by removing the sheet 20 and a covering member. This is a step of removing a part of 5 and preparing the upper surface of the light emitting device.
In this step S109, for example, by removing a part of the upper surface of the light emitting device, the upper surface of the light emitting device is smoothed along the second surface 3b of the wavelength conversion member 3.

(切断する工程)
切断する工程S110は、図7Bに示すように、被覆部材5を含む切断ラインで切断する工程である。すなわち、切断する工程S110は、発光装置100の集合体を個片化する工程である。
この工程S110では、発光装置100の集合体を個片化するための切断ラインを予め定めておく。この切断ラインは、被覆部材5の中心側に切断溝31が位置して切断溝31の左右に被覆部材5が配置できるように定めておく。すなわち、集合体を個片化する際に、被覆部材5が切断溝31の左右に分かれて切断され、最終的に発光装置100の外周に被覆部材5として形成されるように切断ラインを定めておく。
(Cut process)
The cutting step S110 is a step of cutting at a cutting line including the covering member 5, as shown in FIG. 7B. That is, the cutting step S110 is a step of individualizing the aggregate of the light emitting device 100.
In this step S110, a cutting line for individualizing the aggregate of the light emitting device 100 is predetermined. This cutting line is defined so that the cutting groove 31 is located on the center side of the covering member 5 and the covering member 5 can be arranged on the left and right sides of the cutting groove 31. That is, when the aggregate is individualized, a cutting line is defined so that the covering member 5 is cut separately on the left and right sides of the cutting groove 31 and finally formed as the covering member 5 on the outer periphery of the light emitting device 100. back.

集合体の個片化は、例えば、切断溝31の幅方向の中央付近に沿ってシート21まで切断することにより行う。なお、切断溝31は、シート21の一部まで達するように切断することが好ましい。
集合体の個片化は、切断溝31に沿ってブレードで切断するダイシング方法など、従来公知の方法により行うことができる。
そして、この集合体の個片化により、複数の発光装置100が得られる。
The individualization of the aggregate is performed, for example, by cutting up to the sheet 21 along the vicinity of the center in the width direction of the cutting groove 31. The cutting groove 31 is preferably cut so as to reach a part of the sheet 21.
The individualization of the aggregate can be performed by a conventionally known method such as a dicing method of cutting along the cutting groove 31 with a blade.
Then, by individualizing this aggregate, a plurality of light emitting devices 100 can be obtained.

なお、シート20,21上に複数の発光素子1を配置し形成する場合、切断溝31は全ての発光素子間に形成されてもよく、複数の発光素子1ごとに形成されてもよい。
例えば、凹部30を発光素子1ごとに形成し、切断溝31を2つの発光素子ごとに形成し、2つの発光素子1ごとに切断溝31で切断することで、図12Aに示すような発光装置100Eが得られる。
また、例えば、凹部30および切断溝31を2つの発光素子1ごとに形成し、切断溝31で切断することで、図12Bに示すような発光装置100Fが得られる。
When a plurality of light emitting elements 1 are arranged and formed on the sheets 20 and 21, the cutting groove 31 may be formed between all the light emitting elements, or may be formed for each of the plurality of light emitting elements 1.
For example, a light emitting device as shown in FIG. 12A is formed by forming a recess 30 for each light emitting element 1, forming a cutting groove 31 for each of two light emitting elements, and cutting each of the two light emitting elements 1 with the cutting groove 31. 100E is obtained.
Further, for example, by forming the recess 30 and the cutting groove 31 for each of the two light emitting elements 1 and cutting at the cutting groove 31, the light emitting device 100F as shown in FIG. 12B can be obtained.

以上、本実施形態に係る発光装置および発光装置の製造方法について、発明を実施するための形態により具体的に説明した。しかし、本発明の趣旨はこれらの記載に限定されるものではなく、特許請求の範囲の記載に基づいて広く解釈されなければならない。また、これらの記載に基づいて種々変更、改変などしたものも本発明の趣旨に含まれる。
以下、他の実施形態について説明する。
As described above, the light emitting device and the method for manufacturing the light emitting device according to the present embodiment have been specifically described with reference to the embodiment for carrying out the invention. However, the gist of the present invention is not limited to these descriptions, and must be broadly interpreted based on the description of the scope of claims. Further, various changes and modifications based on these descriptions are also included in the gist of the present invention.
Hereinafter, other embodiments will be described.

図8Aに示す発光装置100Aのように、第2反射部材4が、波長変換部材3の外側面の上端から下端までのみを被覆し、被覆部材5が、第1反射部材2の外側面を被覆したものであってもよい。
また、図8Bに示す発光装置100Bのように、第2反射部材4が、波長変換部材3の外側面の上端から下端までのみを被覆し、被覆部材5が、第2反射部材4のみを被覆したものであってもよい。
また、図8Cに示す発光装置100Cのように、第2反射部材4が、波長変換部材3の外側面および第1反射部材2の外側面を被覆し、被覆部材5が、波長変換部材3の外側面を被覆する第2反射部材4の外側面のみを被覆したものであってもよい。
As in the light emitting device 100A shown in FIG. 8A, the second reflecting member 4 covers only the outer surface of the wavelength conversion member 3 from the upper end to the lower end, and the covering member 5 covers the outer surface of the first reflecting member 2. It may be the one that has been used.
Further, as in the light emitting device 100B shown in FIG. 8B, the second reflecting member 4 covers only from the upper end to the lower end of the outer surface of the wavelength conversion member 3, and the covering member 5 covers only the second reflecting member 4. It may be the one that has been used.
Further, as in the light emitting device 100C shown in FIG. 8C, the second reflective member 4 covers the outer surface of the wavelength conversion member 3 and the outer surface of the first reflective member 2, and the covering member 5 is the wavelength conversion member 3. Only the outer surface of the second reflective member 4 that covers the outer side surface may be covered.

これらの構成によれば、発光装置は、軽量化を図ることができる。また、発光装置は、材料費が削減される。
発光装置100A,100B,100Cは、第2反射部材で被覆する工程S105や被覆部材で被覆する工程S106において、エッチングを行ったり、マスクを用いたりすることなどで製造することができる。
According to these configurations, the light emitting device can be reduced in weight. In addition, the material cost of the light emitting device is reduced.
The light emitting devices 100A, 100B, and 100C can be manufactured by etching or using a mask in the step S105 of covering with the second reflective member and the step S106 of covering with the covering member.

第2反射部材4は、金属層および誘電体層の少なくとも1つを含むものであってもよい。第2反射部材4が金属層42を含む場合には、金属層42の形成は、第2反射部材で被覆する工程S105において、電電解めっき、無電解めっき、蒸着、スパッタなどにより行うことができる。
第2反射部材4が誘電体層43を含む場合には、第2反射部材で被覆する工程S105において、誘電体層43の形成は、スパッタ、ALD、CVD、PVDなどにより行うことができる。
The second reflective member 4 may include at least one of a metal layer and a dielectric layer. When the second reflective member 4 includes the metal layer 42, the metal layer 42 can be formed by electroplating, electroless plating, thin film deposition, spatter, or the like in step S105 of coating with the second reflective member. ..
When the second reflective member 4 includes the dielectric layer 43, the dielectric layer 43 can be formed by sputtering, ALD, CVD, PVD, or the like in the step S105 of covering with the second reflective member.

また、導光部材6は設けないものであってもよい。また、導光部材6は、図8Dに示す発光装置100Dのように、発光素子1の側面だけでなく、発光素子1と波長変換部材3の間にも設けてもよい。この場合、発光素子1と波長変換部材3をより強固に接着する観点から、また、光束および光の取り出し効率を向上させる観点から、導光部材6の上下方向の厚みは0.5μm以上20μm以下であることが好ましく、0.5μm以上10μm以下であることがより好ましい。また、発光素子1は、1つの場合の他、複数設けてもよい。また、発光装置は、発光装置100を実装する実装基板を備えるものであってもよい。 Further, the light guide member 6 may not be provided. Further, the light guide member 6 may be provided not only on the side surface of the light emitting element 1 but also between the light emitting element 1 and the wavelength conversion member 3 as in the light emitting device 100D shown in FIG. 8D. In this case, the vertical thickness of the light guide member 6 is 0.5 μm or more and 20 μm or less from the viewpoint of more firmly adhering the light emitting element 1 and the wavelength conversion member 3 and from the viewpoint of improving the light flux and light extraction efficiency. It is preferably 0.5 μm or more and 10 μm or less. Further, the light emitting element 1 may be provided in a plurality of cases in addition to the case of one. Further, the light emitting device may include a mounting board on which the light emitting device 100 is mounted.

また、波長変換部材3は、単層構造だけではなく、多層構造とすることもできる。波長変換部材3は、被覆部材5の体色と同系色となれば、異なる波長変換物質を含有している波長変換部材を複数積層したものでもよい。また、波長変換部材3は、波長変換物質を含有しない透光層を含んでいてもよい。また、波長変換部材3の上に、波長変換部材3を含有しない透光層、拡散剤を含有する層、表面に凹凸を有する層、凸レンズなどの透光部材を積層してもよい。なお、図8Dは、波長変換部材3の上に透光層7を積層している。透光層7を積層することで、波長変換物質を外部環境より保護することができる。 Further, the wavelength conversion member 3 may have a multi-layer structure as well as a single-layer structure. The wavelength conversion member 3 may be a stack of a plurality of wavelength conversion members containing different wavelength conversion substances as long as the color is similar to the body color of the covering member 5. Further, the wavelength conversion member 3 may include a light-transmitting layer that does not contain a wavelength conversion substance. Further, a translucent member such as a translucent layer that does not contain the wavelength conversion member 3, a layer that contains a diffusing agent, a layer that has irregularities on the surface, and a convex lens may be laminated on the wavelength conversion member 3. In FIG. 8D, the translucent layer 7 is laminated on the wavelength conversion member 3. By laminating the light-transmitting layer 7, the wavelength conversion substance can be protected from the external environment.

波長変換部材3が積層体で、波長変換物質を含有しない透光層を含む場合は、図8Dのように、透光層7を波長変換部材3の第2面3b上に配置することが好ましい。なお、この場合、透光層7は波長変換部材3の一部としてもよいが、波長変換物質を含有しない層として、波長変換物質を含有する波長変換部材3とは異なる層であるものとすることができる。透光層7を波長変換部材3の第2面3b上に配置することにより、シート20を除去し、発光装置100Dとしたときに、透光層7が保護層となり波長変換物質を外部環境より保護することができる。
透光層7は透明部材であり、透光層7としては、波長変換部材3に用いることができる樹脂などの透光性の樹脂や、ガラスなどが挙げられる。
When the wavelength conversion member 3 is a laminated body and includes a light-transmitting layer containing no wavelength conversion substance, it is preferable to arrange the light-transmitting layer 7 on the second surface 3b of the wavelength conversion member 3 as shown in FIG. 8D. .. In this case, the translucent layer 7 may be a part of the wavelength conversion member 3, but it is assumed that the layer does not contain the wavelength conversion substance and is different from the wavelength conversion member 3 containing the wavelength conversion substance. be able to. By arranging the translucent layer 7 on the second surface 3b of the wavelength conversion member 3, when the sheet 20 is removed and the light emitting device 100D is used, the translucent layer 7 becomes a protective layer and the wavelength conversion substance is separated from the external environment. Can be protected.
The translucent layer 7 is a transparent member, and examples of the translucent layer 7 include a translucent resin such as a resin that can be used for the wavelength conversion member 3, glass, and the like.

なお、波長変換部材を形成する工程において波長変換部材3の第2面3b側に波長変換物質を含有しない透光層7を設けておくことで、発光装置の上面を整える工程S109で容易に発光装置の上面を整えることができる。詳細には、発光装置の上面を整える際に、波長変換部材3を除去することなく、波長変換物質を含有しない透光層7の一部を除去することで、発光色の変化および波長変換部材3の体色変化を抑制することができる。 In the step of forming the wavelength conversion member, by providing the translucent layer 7 containing no wavelength conversion substance on the second surface 3b side of the wavelength conversion member 3, light emission can be easily performed in the step S109 of preparing the upper surface of the light emitting device. The top surface of the device can be trimmed. Specifically, when the upper surface of the light emitting device is prepared, a part of the translucent layer 7 containing no wavelength conversion substance is removed without removing the wavelength conversion member 3, thereby changing the emission color and the wavelength conversion member. It is possible to suppress the change in body color of 3.

前記した発光装置の製造方法は、波長変換部材の外側面を露出する工程S104において、波長変換部材3の一部の除去は、波長変換部材3の第1面3a側から行うものとした。しかしながら、図10Aに示すように、波長変換部材3の一部の除去は、波長変換部材3の第2面3b側から行うものであってもよい。この場合、シート20を上にして、シート20の上面から第1反射部材2に向けて垂直方向または、傾斜をつけて、部材を除去することにより凹部30を形成することができる。凹部30の形成は、シート20を貫通し、さらに波長変換部材3を貫通して、第1反射部材2の一部を除去することにより行うことができる。この際、第1反射部材2は、発光素子1の電極11,12を下にして、電極11,12の下面よりも下方の位置まで除去すればよい。なお、第1反射部材2の上下方向の厚みは、第1反射部材2を除去する位置を想定し、適宜、調整しておけばよい。 In the method for manufacturing the light emitting device described above, in the step S104 for exposing the outer surface of the wavelength conversion member, a part of the wavelength conversion member 3 is removed from the first surface 3a side of the wavelength conversion member 3. However, as shown in FIG. 10A, the removal of a part of the wavelength conversion member 3 may be performed from the second surface 3b side of the wavelength conversion member 3. In this case, the recess 30 can be formed by removing the member in the vertical direction or at an angle from the upper surface of the sheet 20 toward the first reflective member 2 with the sheet 20 facing up. The recess 30 can be formed by penetrating the sheet 20 and further penetrating the wavelength conversion member 3 to remove a part of the first reflective member 2. At this time, the first reflective member 2 may be removed to a position below the lower surface of the electrodes 11 and 12 with the electrodes 11 and 12 of the light emitting element 1 facing down. The thickness of the first reflective member 2 in the vertical direction may be adjusted as appropriate, assuming a position where the first reflective member 2 is removed.

次に、図10Bに示すように、発光装置の製造方法は、凹部30の内側面に第2反射部材4を形成し、波長変換部材3の外側面3cを第2反射部材4で被覆する。次に、図10Cに示すように、発光装置の製造方法は、第2反射部材4の外側面4aを、体色が波長変換部材3の体色と同系色である被覆部材5で被覆する。次に、図11Aに示すように、発光装置の製造方法は、電極11,12側における、第1反射部材2の一部、第2反射部材4の一部、および、被覆部材5の一部を、発光素子1の電極11,12を露出させるように除去する。次に、図11Bに示すように、発光装置の製造方法は、電極11,12を露出させた構造体を、樹脂などの別のシート21に転写する。転写後、シート20、第2反射部材4の一部、被覆部材5の一部、および、波長変換部材3の一部を除去する。次に、図11Cに示すように、発光装置の製造方法は、被覆部材5を含む切断ラインで切断する。
なお、発光装置の上面を整える工程S109は、行わなくてもよいし、発光装置の上面をより平滑にするために行ってもよい。
その他の事項については、前記した発光装置の製造方法と同様である。
Next, as shown in FIG. 10B, in the method of manufacturing a light emitting device, a second reflective member 4 is formed on the inner surface of the recess 30, and the outer surface 3c of the wavelength conversion member 3 is covered with the second reflective member 4. Next, as shown in FIG. 10C, in the method of manufacturing the light emitting device, the outer surface 4a of the second reflecting member 4 is covered with the covering member 5 whose body color is similar to the body color of the wavelength conversion member 3. Next, as shown in FIG. 11A, the method of manufacturing the light emitting device is as follows: a part of the first reflecting member 2, a part of the second reflecting member 4, and a part of the covering member 5 on the electrodes 11 and 12. Is removed so as to expose the electrodes 11 and 12 of the light emitting element 1. Next, as shown in FIG. 11B, in the method of manufacturing the light emitting device, the structure in which the electrodes 11 and 12 are exposed is transferred to another sheet 21 such as resin. After the transfer, the sheet 20, a part of the second reflective member 4, a part of the covering member 5, and a part of the wavelength conversion member 3 are removed. Next, as shown in FIG. 11C, the method of manufacturing the light emitting device is to cut at a cutting line including the covering member 5.
The step S109 for preparing the upper surface of the light emitting device may not be performed, or may be performed in order to make the upper surface of the light emitting device smoother.
Other matters are the same as the above-mentioned manufacturing method of the light emitting device.

また、発光装置の製造方法は、前記各工程に悪影響を与えない範囲において、前記各工程の間、あるいは前後に、他の工程を含めてもよい。例えば、製造途中に混入した異物を除去する異物除去工程などを含めてもよい。 Further, the method for manufacturing the light emitting device may include other steps during or before and after each of the steps as long as the steps are not adversely affected. For example, a foreign matter removing step of removing foreign matter mixed in during manufacturing may be included.

本発明の実施形態に係る発光装置は、カメラのフラッシュライト、一般照明などの各種照明装置に利用することができる。 The light emitting device according to the embodiment of the present invention can be used for various lighting devices such as a flashlight of a camera and general lighting.

1 発光素子
1a 発光素子の発光面
2 第1反射部材
3 波長変換部材
3a 波長変換部材の第1面
3b 波長変換部材の第2面
3c 波長変換部材の外側面
4 第2反射部材
4a 第2反射部材の外側面
5 被覆部材
6 導光部材
7 透光層
11,12 電極
20,21 シート
30 凹部
31 切断溝
41 反射層
42 金属層
43 誘電体層
100,100A,100B,100C,100D,100E,100F 発光装置
a 特定の色彩
A 色彩の範囲
1 Light emitting element 1a Light emitting surface of light emitting element 2 First reflecting member 3 Wavelength conversion member 3a First surface of wavelength conversion member 3b Second surface of wavelength conversion member 3c Outer surface of wavelength conversion member 4 Second reflection member 4a Second reflection Outer surface of member 5 Coating member 6 Light guide member 7 Translucent layer 11, 12 Electrode 20, 21 Sheet 30 Recess 31 Cutting groove 41 Reflective layer 42 Metal layer 43 Dielectric layer 100, 100A, 100B, 100C, 100D, 100E, 100F Light emitting device a Specific color A Color range

Claims (11)

発光面と側面を有する発光素子と、
前記発光素子の側面に設けられた第1反射部材と、
前記発光素子の発光面上および前記第1反射部材上に設けられた波長変換部材と、
前記波長変換部材の外側面の上端から下端までを被覆する第2反射部材と、
前記第2反射部材の外側面を被覆する被覆部材と、を備え、
前記波長変換部材の体色と前記被覆部材の体色は同系色であり、
前記被覆部材は、波長変換物質を含み、
前記波長変換部材は、前記被覆部材に含まれる前記波長変換物質と同じ組成の波長変換物質を含む発光装置。
A light emitting element having a light emitting surface and a side surface,
The first reflective member provided on the side surface of the light emitting element and
A wavelength conversion member provided on the light emitting surface of the light emitting element and on the first reflecting member, and
A second reflective member that covers the outer surface of the wavelength conversion member from the upper end to the lower end,
A covering member that covers the outer surface of the second reflective member is provided.
The body color of the wavelength conversion member and the body color of the covering member are similar colors .
The covering member contains a wavelength conversion substance and contains.
The wavelength conversion member is a light emitting device containing a wavelength conversion substance having the same composition as the wavelength conversion substance contained in the covering member .
前記第2反射部材は、前記第1反射部材の外側面を被覆する、請求項1に記載の発光装置。 The light emitting device according to claim 1, wherein the second reflective member covers the outer surface of the first reflective member. 前記被覆部材は、前記第1反射部材の外側面を被覆する、請求項1に記載の発光装置。 The light emitting device according to claim 1, wherein the covering member covers the outer surface of the first reflection member. 前記被覆部材は、前記第2反射部材の外側面を被覆する、請求項2に記載の発光装置。 The light emitting device according to claim 2, wherein the covering member covers the outer surface of the second reflecting member. 前記第2反射部材の厚みは、0.1μm以上5.0μm以下である、請求項1から請求項のいずれか1項に記載の発光装置。 The light emitting device according to any one of claims 1 to 4 , wherein the thickness of the second reflective member is 0.1 μm or more and 5.0 μm or less. 前記発光素子の側面に導光部材を介して前記第1反射部材が設けられる請求項1から請求項のいずれか1項に記載の発光装置。 The light emitting device according to any one of claims 1 to 5 , wherein the first reflecting member is provided on the side surface of the light emitting element via a light guide member. 前記第2反射部材は、金属層および誘電体層の少なくとも1つを含む、請求項1から請求項のいずれか1項に記載の発光装置。 The light emitting device according to any one of claims 1 to 6 , wherein the second reflective member includes at least one of a metal layer and a dielectric layer. 第1面と前記第1面の反対側に第2面を有する波長変換部材の前記第1面に、発光面を対面させて発光素子を載置する工程と、
前記発光素子を第1反射部材で被覆する工程と、
前記発光素子の周囲における前記波長変換部材の一部を除去し、前記波長変換部材の外側面を露出する工程と、
前記波長変換部材の外側面を第2反射部材で被覆する工程と、
前記第2反射部材の外側面を、体色が前記波長変換部材の体色と同系色である被覆部材で被覆する工程を含む、発光装置の製造方法。
A step of mounting a light emitting element with a light emitting surface facing the first surface of a wavelength conversion member having a second surface on the opposite side of the first surface and the first surface.
The step of covering the light emitting element with the first reflective member and
A step of removing a part of the wavelength conversion member around the light emitting element to expose the outer surface of the wavelength conversion member.
The step of covering the outer surface of the wavelength conversion member with the second reflective member,
A method for manufacturing a light emitting device, comprising a step of covering the outer surface of the second reflective member with a covering member whose body color is similar to the body color of the wavelength conversion member.
前記波長変換部材の一部を除去する工程は、
前記波長変換部材の第1面側から行う、請求項に記載の発光装置の製造方法。
The step of removing a part of the wavelength conversion member is
The method for manufacturing a light emitting device according to claim 8 , wherein the method is performed from the first surface side of the wavelength conversion member.
前記波長変換部材の一部を除去する工程は、
前記波長変換部材の第2面側から行う、請求項に記載の発光装置の製造方法。
The step of removing a part of the wavelength conversion member is
The method for manufacturing a light emitting device according to claim 8 , wherein the method is performed from the second surface side of the wavelength conversion member.
前記発光素子を載置する工程は、
前記発光素子の少なくとも一部の側面を覆うように導光部材を設ける工程を含む、請求項から請求項10のいずれか1項に記載の発光装置の製造方法。
The step of mounting the light emitting element is
The method for manufacturing a light emitting device according to any one of claims 8 to 10 , further comprising a step of providing a light guide member so as to cover at least a part of a side surface of the light emitting element.
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