JP7057491B2 - Light emitting device and manufacturing method of light emitting device - Google Patents

Description

The present disclosure relates to a light emitting device and a method for manufacturing the light emitting device.

For example, Patent Document 1 describes a light emitting device in which a phosphor plate is adhered on a light emitting element and the periphery thereof is covered with a light-reflecting white member. The upper surface of such a light emitting device is composed of two colors, that is, the color of the phosphor contained in the phosphor plate (for example, yellow) and the color of the white member (white).

Japanese Unexamined Patent Publication No. 2013-12545

When the conventional light emitting device is used as a light source of a lighting device such as a flashlight of a smartphone camera, the color of the phosphor and the color of the white member are reflected on the lens when the light is not emitted. Therefore, for example, depending on the design of the smartphone or its cover, in the conventional light emitting device, the entire upper surface of the light emitting device does not become the color of the wavelength conversion member when the light is not emitted, and the appearance may not be preferred.

An embodiment of the present invention provides a light emitting device and a method for manufacturing a light emitting device, in which the contrast between the light emitting region and the non-light emitting region is large at the time of light emission, and the entire upper surface of the light emitting device becomes the color of the wavelength conversion member at the time of non-light emission. The task is to do.

The light emitting device according to the embodiment of the present disclosure includes a light emitting element having a light emitting surface and a side surface, a first reflecting member provided on the side surface of the light emitting element, and on the light emitting surface of the light emitting element and on the first reflecting member. The wavelength conversion member provided in the above, a second reflection member covering the outer surface of the wavelength conversion member from the upper end to the lower end, and a covering member covering the outer surface of the second reflection member. The body color of the conversion member and the body color of the covering member are similar colors.

In the method for manufacturing a light emitting device according to the embodiment of the present disclosure, a light emitting element is provided with a light emitting surface facing the first surface of a wavelength conversion member having a second surface on the opposite side of the first surface and the first surface. A step of placing the light emitting element, a step of covering the light emitting element with the first reflecting member, and a step of removing a part of the wavelength conversion member around the light emitting element to expose the outer surface of the wavelength conversion member. The step of covering the outer surface of the wavelength conversion member with the second reflecting member and the step of covering the outer surface of the second reflecting member with a covering member whose body color is similar to the body color of the wavelength conversion member. include.

According to the light emitting device of the embodiment according to the present invention, the contrast between the light emitting region and the non-light emitting region can be increased at the time of light emission, and the entire upper surface of the light emitting device can be used as the color of the wavelength conversion member at the time of non-light emission.
According to the method for manufacturing a light emitting device according to the present invention, the contrast between the light emitting region and the non-light emitting region at the time of light emission is large, and the entire upper surface of the light emitting device becomes the color of the wavelength conversion member at the time of non-light emission. You can get the device.

It is a perspective view which shows typically the structure of the light emitting device which concerns on embodiment. It is sectional drawing in the IB-IB line of FIG. 1A. It is a graph which shows typically the equihue plane (5Y) of the hue in the Munsell color system. It is a flowchart of the manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the process of forming the wavelength conversion member on the sheet in the manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the process of placing a light emitting element in the manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the step of covering the light emitting element and the like with the 1st reflective member in the manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the process of exposing the outer surface of the wavelength conversion member in the manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the step of covering the outer surface of the wavelength conversion member with the 2nd reflection member in the manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the step of covering the outer surface of the 2nd reflective member with a covering member in the manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the step of exposing an electrode from the 1st reflection member in the manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the step of transferring to another sheet in the manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the process of arranging the upper surface of a light emitting device in the manufacturing method of a light emitting device which concerns on embodiment. It is sectional drawing which shows the process of cutting for each device in the manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows typically the structure of the light emitting device which concerns on other embodiment. It is sectional drawing which shows typically the structure of the light emitting device which concerns on other embodiment. It is sectional drawing which shows typically the structure of the light emitting device which concerns on other embodiment. It is sectional drawing which shows typically the structure of the light emitting device which concerns on other embodiment. It is a schematic diagram which shows the other structure of the 2nd reflective member. It is sectional drawing which shows the step of exposing the outer surface of the wavelength conversion member in the other manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the step of covering the outer surface of the wavelength conversion member with the 2nd reflection member in the other manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the step of covering the outer surface of the 2nd reflection member with the covering member in the other manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the step of exposing an electrode from the 1st reflection member in the other manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the process of transferring to another sheet in the other manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows the process of cutting for each device in the other manufacturing method of the light emitting device which concerns on embodiment. It is sectional drawing which shows typically the structure of the light emitting device which concerns on other embodiment. It is sectional drawing which shows typically the structure of the light emitting device which concerns on other embodiment.

<Embodiment>
The embodiments will be described below with reference to the drawings. However, the embodiments shown below exemplify the light emitting device and the manufacturing method of the light emitting device for embodying the technical idea of the present embodiment, and are not limited to the following. Further, the dimensions, materials, shapes, relative arrangements, etc. of the components described in the embodiments are not intended to limit the scope of the present invention to the specific description, but are merely examples. It's just that. The size and positional relationship of the members shown in each drawing may be exaggerated for the sake of clarity.

[Light emitting device]
First, the light emitting device according to the embodiment will be described.
As shown in FIGS. 1A and 1B, the light emitting device 100 includes a light emitting element 1, a first reflecting member 2, a wavelength conversion member 3, a second reflecting member 4, and a covering member 5. Further, the light emitting device 100 is provided with a light guide member 6 on the side surface of the light emitting element 1.
The upper surface of the light emitting device 100 includes a light emitting region and a non-light emitting region. The light emitting region is a region (for example, a wavelength conversion member 3) that emits light at the time of light emission on the upper surface of the light emitting device 100, and the non-light emitting region is a region other than the light emitting region (for example, the second reflection member 4 and the coating). Member 5).

(Light emitting element)
As the light emitting element 1, a semiconductor light emitting element such as an LED element can be used. The light emitting element 1 may be an element structure composed of various semiconductors provided with a pair of positive and negative electrodes 11 and 12. In particular, the light emitting device 1 is preferably a nitride semiconductor (In _x Al _y Ga _1-x-y N, 0 ≦ x, 0 ≦ y, x + y ≦ 1) capable of efficiently exciting a phosphor. In addition, the light emitting element 1 may be a zinc sulfide-based semiconductor, a zinc selenide-based semiconductor, or a silicon carbide-based semiconductor.

(First reflective member)
The first reflecting member 2 is for reflecting the light from the light emitting element 1 and extracting the light through the wavelength conversion member 3. The first reflecting member 2 is a member for reflecting the light emitted by the light emitting element 1 and traveling in the lateral direction or the downward direction toward the wavelength conversion member 3 which is the light emitting region of the light emitting device 100.
The first reflection member 2 is provided on the side surface of the light emitting element 1 and below the wavelength conversion member 3. Specifically, the first reflective member 2 covers the lower surface (electrodes 11 and 12 sides) of the light emitting element 1. Further, in the first reflective member 2, the region of the side surface of the light emitting element 1 covered by the light guide member 6 is covered so as to be surrounded by the light guide member 6 and is covered with the light guide member 6. The area not directly covers the side surface of the light emitting element.
Although the first reflection member 2 is provided here via the light guide member 6 formed on the side surface of the light emitting element 1, the side surface of the light emitting element 1 is directly provided without providing the light guide member 6. It may be provided in.
The first reflective member 2 is, for example, a resin layer containing a reflective substance. The first reflective member 2 may be configured by containing a filler in addition to the reflective substance in a resin serving as a base material or a binder.

The binder is a resin for binding the above-mentioned reflective substance or filler to the side surface and the lower surface (electrodes 11 and 12 sides) of the light emitting element 1 as the first reflective member 2. Examples of the resin serving as the binder include polycarbonate resin, epoxy resin, phenol resin, silicone resin, acrylic resin, TPX resin, polynorbornene resin, urethane resin and the like. Alternatively, examples of the resin serving as a binder include these modified resins and hybrid resins containing one or more of these resins. Of these, silicone resins or modified resins thereof are preferable because they are excellent in heat resistance and light resistance and have little volume shrinkage after curing.

The reflective substance is a substance that reflects the light emitted by the light emitting element 1. Examples of the reflective substance include silica, titanium oxide, silicon oxide, aluminum oxide, potassium titanate, zinc oxide, and boron nitride. Further, a resin powder such as silicone powder may be used.

The filler is added for reasons such as increasing the strength of the first reflective member 2 which is a resin layer, or increasing the thermal conductivity of the first reflective member 2. Examples of the filler include glass fiber, whiskers, aluminum oxide, silicon oxide, boron nitride, zinc oxide, aluminum nitride and the like.

(Light guide member)
The light guide member 6 is a member that facilitates the extraction of light from the light emitting element 1 and guides the light from the light emitting element 1 to the wavelength conversion member 3. The light guide member 6 can improve the efficiency of extracting light flux and light.
The light guide member 6 is formed by an adhesive member that joins the wavelength conversion member 3 and the light emitting element 1 so as to crawl up on the side surface of the light emitting element 1 (manufactured in an inverted state at the time of manufacture). ..
As the light guide member 6, for example, a translucent resin material can be used. Further, as the light guide member 6, a translucent adhesive material such as a resin serving as a base material or a binder of the first reflective member 2 described above can be mentioned. Further, a diffusing agent such as silica, titanium oxide, silicon oxide, aluminum oxide, potassium titanate, zinc oxide and boron nitride may be contained. As a result, light can be more evenly incident on the wavelength conversion member 3, and color unevenness of the light emitting device 100 can be suppressed.

As shown in FIG. 1B, the light guide member 6 is formed in a triangular shape so that the member width widens from the lower surface (electrodes 11 and 12 sides) of the light emitting element 1 toward the wavelength conversion member 3 in a cross-sectional view. There is. With such a form, the light flux and the light extraction efficiency are further improved. However, the shape of the light guide member 6 is not particularly specified. For example, the shape of the light guide member 6 may be a convex shape on the first reflecting member 2 side or a concave shape on the light emitting element 1 side.
The light guide member 6 may cover a part of the side surface of the light emitting element 1, and from the viewpoint of improving the light flux and the light extraction efficiency, the light guide member 6 may cover substantially the entire side surface of the light emitting element 1. preferable.
Further, the light guide member 6 may be arranged between the wavelength conversion member 3 and the light emitting element 1.

(Wavelength conversion member)
The wavelength conversion member 3 is a member containing a wavelength conversion substance that absorbs a part of light having a wavelength emitted by the light emitting element 1 and converts it into light having a different wavelength to emit light. The wavelength conversion substance used in the wavelength conversion member 3 is, for example, a phosphor. Hereinafter, the wavelength conversion substance will be described as being a phosphor.
The wavelength conversion member 3 is provided on the light emitting surface of the light emitting element 1 and on the first reflecting member 2.
The lower surface of the wavelength conversion member 3, that is, the surface facing the light emitting surface of the light emitting element 1, is formed larger than the light emitting surface which is the upper surface of the light emitting element 1.

The base material or binder of the wavelength conversion member 3 is preferably formed of a translucent resin. Examples of the resin here include the resin used as the base material or the binder of the first reflective member 2 described above. Of these, silicone resins or modified resins thereof are preferable because they are excellent in heat resistance and light resistance and have little volume shrinkage after curing. Further, the base material or the binder of the wavelength conversion member 3 may be formed of glass as well as resin.

Examples of the phosphor contained in the wavelength conversion member 3 include yttrium aluminum garnet activated with cerium, lutetium aluminum garnet activated with cerium, terbium aluminum garnet activated with cerium, europium, and the like. Examples thereof include nitrogen-containing calcium aluminosilicate activated by any one or two of chromium, cerium activated by europium, silicate activated by europium, potassium fluoride activated by manganese, and the like.

Here, as will be described later, any body color of the phosphor itself may be used as long as the body color of the wavelength conversion member 3 and the body color of the covering member 5 are similar colors. The body color refers to the color of the member itself when the light emitting device 100 does not emit light.
For example, when a phosphor whose body color is white is used, the body color of the wavelength conversion member 3 is white. Further, the body color of the second reflective member 4 is basically white. Therefore, as will be described later, if the body color of the wavelength conversion member 3 and the body color of the covering member 5 are similar colors, the entire upper surface of the light emitting device 100 becomes a white color when no light is emitted.

When the light emitting device 100 is used as a light source for white light of a lighting device such as a flash light of a camera, a light emitting element having a blue light emitting color and a phosphor having a yellow light emitting color and a yellow body color are used. It is preferable to use it. Further, it is preferable to use a light emitting element having a blue emission color and a phosphor having an orange emission color and an orange body color.
Examples of the fluorescent substance having a yellow body color and a yellow emission color include yttrium aluminum garnet fluorescent substance (YAG fluorescent substance), lutetium aluminum garnet fluorescent substance (LAG fluorescent substance), and terbium. -Aluminum garnet-based fluorescent material (TAG-based fluorescent material) and the like can be mentioned. Further, examples of the phosphor having a yellow body color and a red emission color include KSF. The body color of these phosphors is 10Y or 5Y in the Munsell color wheel of the Munsell color system (20 hues) described later.
Examples of the fluorescent substance having an orange body color and a red emission color include SCASN and CASN. The body color of these phosphors is 10YR or 5YR in the Munsell color wheel of the Munsell color system (20 hues) described later.
Further, a fluorescent substance having a yellow emission color and a phosphor having a emission color of red can be mixed to obtain a phosphor having an emission color of orange.

The colors of the yellow-based phosphor and the orange-based phosphor of the phosphor itself are, for example, 5YR, 10YR, 5Y, and 10Y in the Munsell hue circle of the Munsell color system (20 hues) described later. Hue can be mentioned.
The color of the fluorescent substance itself is, for example, 10Y and 5Y in the case of a yellowish fluorescent substance. In the case of an orange-based phosphor, for example, 10YR and 5YR. The case where the body color of the phosphor itself is a yellowish phosphor and the Munsell color wheel of the Munsell color system (20 hues) is 5Y will be described below as an example.
In the Munsell color system, the brightness is, for example, 7 or more and 9 or less.
Further, in the Munsell color system, the saturation is, for example, 4 or more and 14 or less.

Further, as will be described later, when the covering member 5 contains a wavelength conversion substance, the wavelength conversion member 3 preferably contains a wavelength conversion substance having the same composition as the wavelength conversion substance contained in the covering member 5. According to such a configuration, the color of the entire upper surface of the light emitting device 100 at the time of non-light emission tends to be the same as the color of the wavelength conversion member 3.

The wavelength conversion member 3 may contain a diffusing agent. The diffusing agent is added in order to efficiently diffuse the light emitted by the light emitting element 1 and the phosphor. Examples of the diffusing agent include the same as the reflective substance of the first reflective member 2 described above.
The vertical thickness of the wavelength conversion member 3 can be determined by the content of the phosphor, the color tone of the light emitted by the light emitting element 1 and the color tone of the light after wavelength conversion, and the like, and is, for example, 50 μm or more and 300 μm. It can be as follows.

(Second reflective member)
The second reflecting member 4 is for reflecting the light from the light emitting element 1 and extracting the light through the wavelength conversion member 3. The second reflecting member 4 is a member for reflecting the light emitted by the light emitting element 1 in the direction of the covering member 5 toward the wavelength conversion member 3 which is the light extraction surface. Further, the second reflective member 4 is a member for increasing the contrast (difference in luminance) between the light emitting region and the non-light emitting region at the time of light emission.

The second reflective member 4 covers the outer surface of the wavelength conversion member 3. Here, the second reflective member 4 covers from the upper end to the lower end of the outer surface of the wavelength conversion member 3. Further, the second reflective member 4 covers the outer surface of the first reflective member 2. That is, the second reflective member 4 is continuously provided between the first reflective member 2 and the covering member 5 and between the wavelength conversion member 3 and the covering member 5.

The second reflective member 4 is, for example, a resin layer containing a reflective substance, similarly to the first reflective member 2. The second reflective member 4 may be configured by containing a filler in addition to the reflective substance in a resin serving as a base material or a binder. Examples of the resin, the reflective member and the filler of the second reflective member 4 include the resin, the reflective member and the filler of the first reflective member 2 described above.
Further, the second reflective member 4 may be an inorganic film such as aluminum oxide, zirconium oxide, or titanium oxide.

The second reflective member 4 may include at least one of a metal layer and a dielectric layer. For example, as shown in FIG. 9, the metal layer 42 and the dielectric layer 43 are laminated on the surface of the reflective layer 41 made of the material of the second reflective member 4 on the side exposed to the light from the light emitting element 1. May be. Either one of the metal layer 42 and the dielectric layer 43 may be provided, or both may be provided. Further, when both are provided, either of them may be stacked first. When the second reflective member 4 includes at least one of the metal layer 42 and the dielectric layer 43, the reflectance of the second reflective member 4 is improved. As a result, the contrast between the light emitting region and the non-light emitting region at the time of light emission becomes larger.

Examples of the metal layer 42 include layers made of copper, aluminum, gold, silver, platinum, titanium, tungsten, palladium, iron, nickel and the like. The metal layer 42 is preferably a layer made of gold or silver from the viewpoint of further improving the reflectance.

Examples of the dielectric layer 43 include a dielectric multilayer film in which a plurality of dielectric layers are laminated. The dielectric multilayer film is a kind of distributed Bragg Reflector (DBR). Further, the dielectric multilayer film is a film in which a set of dielectrics composed of a low refractive index layer and a high refractive index layer is laminated over a plurality of sets, and selectively reflects light having a predetermined wavelength. .. Specifically, it is a film in which two or more kinds of films having different refractive indexes are alternately laminated with a thickness of wavelength / 4n (n is a refractive index), and can reflect light of a predetermined wavelength with high efficiency. Examples of the low refractive index material include SiO ₂ , and examples of the high refractive index material include Nb ₂ O ₅ , TiO ₂ , ZrO ₂ , and Ta ₂ O ₅ . Examples of the dielectric multilayer film include those in which layers made of SiO ₂ and layers made of Nb ₂ O ₅ are alternately laminated.

The thickness of the second reflective member 4 in the width direction is preferably 0.1 μm or more and 5.0 μm or less. When the thickness of the second reflective member 4 in the width direction is 0.1 μm or more, the contrast between the light emitting region and the non-light emitting region at the time of light emission can be further increased. On the other hand, when the thickness of the second reflective member 4 in the width direction is 5.0 μm or less, the color of the entire upper surface of the light emitting device 100 at the time of non-light emission tends to be the same as the color of the wavelength conversion member 3.
The thickness of the second reflective member 4 in the width direction is more preferably 0.3 μm or more, still more preferably 0.5 μm or more, from the viewpoint of increasing the contrast between the light emitting region and the non-light emitting region at the time of light emission.
Further, the thickness of the second reflective member 4 in the width direction is more preferably 2.0 μm or less from the viewpoint of making it easier to make the color of the entire upper surface of the light emitting device 100 the same as the color of the wavelength conversion member 3 when the light is not emitted. More preferably, it is 1.0 μm or less.

(Coating member)
The covering member 5 is a member that covers the outer surface of the second reflective member 4. Here, the covering member 5 covers from the upper end to the lower end of the outer surface of the second reflective member 4. The covering member 5 forms a part of the side surface of the light emitting device 100.

The covering member 5 is, for example, a resin layer. Examples of the resin used as the base material or the binder of the covering member 5 include the resin used as the base material or the binder of the first reflective member 2 described above. Of these, epoxy resins or modified resins thereof are preferable because they have excellent adhesiveness and gas barrier properties. Further, a silicone resin or a modified resin thereof is preferable because it has excellent heat resistance and light resistance and has less volume shrinkage after curing.

The covering member 5 contains any one of a wavelength converting substance, a pigment and a dye. Examples of the wavelength conversion substance include the same wavelength conversion substances contained in the wavelength conversion member 3.
The pigment is not particularly limited, and examples thereof include those using an inorganic material and an organic material, and examples thereof include those using the following materials.
Examples of inorganic materials include Bengara (Fe ₂ O ₃ ), Lead Tan (Pb ₃ O ₄ ), Titanium Nickel Antimon Oxide, Titanium Nickel Barium Oxide, Titanium Chromium Antimon Oxide, and Titanium Chromium Niobium Oxide. Things and the like can be mentioned.
Examples of organic materials include anthraquinone, azo, quinacridone, perylene, diketopyrrolopyrrole, monoazo, disazo, pyrazolone, benzimidazolone, quinoxaline, azomethin, and isoisodrinone. Examples include isoisodrine type.

The dye is not particularly limited, but for example, anthraquinone dye, methine dye, azomethine dye, oxazine dye, azo dye, styryl dye, coumarin dye, porphyrin dye, dibenzofuranone dye. , Diketopyrrolopyrrole dyes, rodamine dyes, xanthene dyes, pyromethene dyes and the like.
The pigments and dyes are basically those that do not convert the light from the light emitting element 1 into different wavelengths.

The body color of the wavelength conversion member 3 and the body color of the covering member 5 are similar colors. Here, the similar color means in the Munsell color system (20 hues).
Hue: Within 3 ranges of the hue circle Brightness: Within 3 ranges Saturation: Within 3 ranges. That is, on the equihue plane of the Munsell color system (20 hues), the hue, the lightness, and the saturation are all similar colors up to both sides.

Specifically, as shown in FIG. 2, for example, when a specific color is a color a on the equihue plane (5Y) of a Y (yellow) hue, the range A is a similar color.
The body color can be measured using, for example, a measuring instrument such as a spectrophotometer CM series (manufactured by Konica Minolta) or a color difference meter CR series (manufactured by Konica Minolta). Among such measuring instruments, one that is provided with a light source of a xenon lamp and a light receiving element of a silicon photodiode, can be separated by a plane diffraction grating, and can be output in the Munsell color system may be used.

Since the body color of the wavelength conversion member 3 and the body color of the covering member 5 are similar colors, the entire upper surface of the light emitting device 100 can be the color of the wavelength conversion member 3 when no light is emitted.
The fact that the entire upper surface of the light emitting device 100 becomes the color of the wavelength conversion member 3 when the light emitting device 100 does not emit light means that the color of the entire upper surface of the light emitting device 100 is the same as or the same as the color of the wavelength conversion member 3. Also includes. The same degree can be defined as, for example, on both sides of the above-mentioned Munsell color system (20 hues) in terms of hue, lightness, and saturation.

The thickness of the covering member 5 in the width direction is preferably 20 μm or more and 200 μm or less. When the thickness of the covering member 5 in the width direction is 20 μm or more, the color of the entire upper surface of the light emitting device 100 at the time of non-light emission tends to be the same as the color of the wavelength conversion member 3. On the other hand, if the thickness of the covering member 5 in the width direction is 200 μm or less, the light emitting device 100 can be downsized.

<Operation of light emitting device>
Next, the operation of the light emitting device 100 will be described.
When the light emitting device 100 is driven, electric power is supplied to the light emitting element 1 from an external power source via the electrodes 11 and 12, and the light emitting element 1 emits light. A part of the light emitted by the light emitting element 1 is reflected by the first reflecting member 2 and the second reflecting member 4, passes through the wavelength conversion member 3, and is taken out to the outside. At this time, since the second reflective member 4 is provided, the contrast (difference in luminance) between the light emitting region and the non-light emitting region on the upper surface of the light emitting device 100 becomes large.

[Manufacturing method of light emitting device]
Next, an example of the manufacturing method of the light emitting device 100 according to the embodiment will be described with reference to FIGS. 3 to 7B. Note that FIGS. 4A to 7B schematically show one light emitting device 100 when a plurality of light emitting devices 100 are manufactured at the same time.

As shown in FIG. 3, the manufacturing method of the light emitting device 100 of the embodiment includes a step S101 for forming a wavelength conversion member on a sheet, a step S102 for placing a light emitting element, and a step S103 for covering with a first reflecting member. A step S104 for exposing the outer surface of the wavelength conversion member, a step S105 for covering with the second reflective member, a step S106 for covering with the covering member, and a step S107 for exposing the electrodes, and a step of transferring to another sheet. S108, a step S109 for preparing the upper surface of the light emitting device, and a step S110 for cutting are included, and the steps are performed in this order.
Since the materials and arrangements of the respective members are as described in the above description of the light emitting device 100, the description thereof will be omitted here as appropriate.

(Step of forming a wavelength conversion member on the sheet)
The step S101 for forming the wavelength conversion member on the sheet is a step of forming the wavelength conversion member 3 on the sheet 20 such as resin, as shown in FIG. 4A.
The wavelength conversion member 3 can be formed on the sheet 20 by, for example, a printing method, a compression molding method, a phosphor electrodeposition method, or a method of laminating plate-shaped wavelength conversion members.

(Step of mounting the light emitting element)
In the step S102 for mounting the light emitting element, as shown in FIG. 4B, the light emitting surface 1a is formed on the first surface 3a of the wavelength conversion member 3 having the second surface 3b on the opposite side of the first surface 3a and the first surface 3a. This is a step of mounting the light emitting element 1 so as to face each other.
In this step S102, the light emitting element 1 joins the opposite surface of the light emitting element 1 on the side where the electrodes 11 and 12 are provided, that is, the light emitting surface 1a, to the first surface 3a of the wavelength conversion member 3 via the adhesive member. do. At this time, from the viewpoint of light distribution and the like, it is preferable to join the wavelength conversion member 3 so that the center of the first surface 3a and the center of the light emitting surface 1a of the light emitting element 1 coincide with each other.

Here, by adjusting the amount of the adhesive member, the adhesive member can be made to crawl up to the side surface of the light emitting element 1 and the adhesive member can be formed on the side surface of the light emitting element 1. As a result, the light emitting device 100 is provided with a light guide member 6 which is an adhesive member on the side surface of the light emitting element 1.
Further, the light guide member 6 which is an adhesive member may be arranged between the light emitting surface 1a of the light emitting element 1 and the first surface 3a of the wavelength conversion member 3 with a predetermined thickness in the vertical direction. As a result, the light emitting element 1 and the wavelength conversion member 3 can be more firmly bonded to each other. Although not shown, here, an adhesive member is formed in an extremely thin state between the light emitting surface 1a of the light emitting element 1 and the first surface 3a of the wavelength conversion member 3 because the light emitting element 1 and the wavelength conversion member 3 are joined. Is intervening.

(Step of covering with the first reflective member)
The step S103 of covering with the first reflecting member is a step of covering the light emitting element 1 mounted on the wavelength conversion member 3 with the first reflecting member 2, as shown in FIG. 4C.
In this step S103, the entire light emitting element 1 including the electrodes 11 and 12 is covered with the first reflecting member 2. In this step S103, the first reflection member 2 is provided from the surface of the wavelength conversion member 3 to the upper surfaces of the electrodes 11 and 12.

The coating of the light emitting element 1 can be performed, for example, by using a discharge device (dispenser) capable of moving (moving) the light emitting element 1 in the vertical direction or the horizontal direction with respect to the sheet 20 on the upper side of the fixed sheet 20. .. The coating of the first reflective member 2 can be performed by filling the wavelength conversion member 3 with a resin or the like constituting the first reflective member 2 using a discharge device.
It is also possible to cover by a compression molding method, a transfer molding method, or the like.

(Step of exposing the outer surface of the wavelength conversion member)
The step S104 for exposing the outer surface of the wavelength conversion member is a step of removing a part of the wavelength conversion member 3 around the light emitting element 1 and exposing the outer surface 3c of the wavelength conversion member 3, as shown in FIG. 5A. be. Here, the removal of a part of the wavelength conversion member 3 is performed from the side of the first reflection member 2 which is the side of the first surface 3a of the wavelength conversion member 3.

In this step S104, the recess 30 is formed through the first reflection member 2 and the wavelength conversion member 3 and reaches within the thickness of the sheet 20. In this step S104, when the light emitting element 1 is fragmented, the recess 30 is formed at a position where the second reflective member 4 and the covering member 5 are formed. By forming the recess 30, the outer surface 3c of the wavelength conversion member 3 is exposed.
The recess 30 can be formed, for example, by removing the member by using a blade having a predetermined width in a vertical direction or at an angle from the upper surface of the first reflective member 2 toward the sheet 20. Specifically, the concave portion 30 can be formed by penetrating the first reflective member 2 and further penetrating the wavelength conversion member 3 to remove a part of the sheet 20.
The recess 30 may be formed by laser light or by etching.
Further, the recess 30 may be formed anywhere as long as it is around the light emitting element 1. When the light guide member 6 is arranged on the side surface of the light emitting element 1, the recess 30 may be formed so as to remove a part of the light guide member 6. In order to increase the luminous efficiency, it is preferable to form it outside the light guide member 6 as shown in FIG. 5A.

(Step of covering with the second reflective member)
The step S105 of covering with the second reflecting member is a step of covering the outer surface 3c of the wavelength conversion member 3 with the second reflecting member 4, as shown in FIG. 5B.
In this step S105, the second reflective member 4 is formed on the upper surface of the first reflective member 2 and the inner surface of the recess 30.
The second reflective member 4 can be formed by, for example, electrolytic plating, electroless plating, thin film deposition, sputtering, or the like. When a resin is used as the second reflective member 4, the method for forming the second reflective member 4 can be, for example, a printing method, a compression molding method, or the like.

(Process of covering with a covering member)
In the step S106 of covering with the covering member, as shown in FIG. 5C, the outer surface 4a of the second reflecting member 4 is covered with the covering member 5 whose body color is similar to the body color of the wavelength conversion member 3. be.
In this step S106, the covering member 5 is formed through a procedure of filling the recess 30 with the covering member 5 and covering the outer surface 4a of the second reflective member 4 with the covering member 5. By this step S106, the covering member 5 is formed on the surface of the second reflective member 4 in the recess 30.

The covering member 5 can be filled by, for example, a printing method, a compression molding method, an electrodeposition method, or the like. Further, the covering member 5 can be filled by using the resin discharge device described above.
Here, the material is selected so that the body color of the wavelength conversion member 3 and the body color of the covering member 5 have similar colors.

(Process to expose electrodes)
In the step S107 for exposing the electrodes, as shown in FIG. 6A, a part of the first reflective member 2, a part of the second reflective member 4, and a part of the covering member 5 on the electrodes 11 and 12 sides are formed. This is a step of removing the electrodes 11 and 12 of the light emitting element 1 so as to be exposed.
In this step S107, for example, the surfaces of the first reflective member 2, the second reflective member 4, and the covering member 5 are removed from the electrodes 11 and 12 until the electrodes 11 and 12 are exposed. As a method for removing the first reflective member 2, the second reflective member 4, and the covering member 5, for example, there are grinding, polishing, blasting, and the like.

(Process to transfer to another sheet)
The step S108 of transferring to another sheet is a step of transferring the structure in which the electrodes 11 and 12 are exposed to another sheet 21 such as resin, as shown in FIG. 6B.
In this step S108, the structure is placed on the sheet 21 so that the electrodes 11 and 12 exposed from the first reflective member 2 adhere to the sheet 21.
The sheet 20 used for forming the wavelength conversion member 3 is removed before or after the transfer to another sheet 21.

(Process to prepare the upper surface of the light emitting device)
In the step S109 of preparing the upper surface of the light emitting device, as shown in FIG. 7A, a part of the second reflective member 4 exposed on the second surface 3b side of the wavelength conversion member 3 by removing the sheet 20 and a covering member. This is a step of removing a part of 5 and preparing the upper surface of the light emitting device.
In this step S109, for example, by removing a part of the upper surface of the light emitting device, the upper surface of the light emitting device is smoothed along the second surface 3b of the wavelength conversion member 3.

(Cut process)
The cutting step S110 is a step of cutting at a cutting line including the covering member 5, as shown in FIG. 7B. That is, the cutting step S110 is a step of individualizing the aggregate of the light emitting device 100.
In this step S110, a cutting line for individualizing the aggregate of the light emitting device 100 is predetermined. This cutting line is defined so that the cutting groove 31 is located on the center side of the covering member 5 and the covering member 5 can be arranged on the left and right sides of the cutting groove 31. That is, when the aggregate is individualized, a cutting line is defined so that the covering member 5 is cut separately on the left and right sides of the cutting groove 31 and finally formed as the covering member 5 on the outer periphery of the light emitting device 100. back.

The individualization of the aggregate is performed, for example, by cutting up to the sheet 21 along the vicinity of the center in the width direction of the cutting groove 31. The cutting groove 31 is preferably cut so as to reach a part of the sheet 21.
The individualization of the aggregate can be performed by a conventionally known method such as a dicing method of cutting along the cutting groove 31 with a blade.
Then, by individualizing this aggregate, a plurality of light emitting devices 100 can be obtained.

When a plurality of light emitting elements 1 are arranged and formed on the sheets 20 and 21, the cutting groove 31 may be formed between all the light emitting elements, or may be formed for each of the plurality of light emitting elements 1.
For example, a light emitting device as shown in FIG. 12A is formed by forming a recess 30 for each light emitting element 1, forming a cutting groove 31 for each of two light emitting elements, and cutting each of the two light emitting elements 1 with the cutting groove 31. 100E is obtained.
Further, for example, by forming the recess 30 and the cutting groove 31 for each of the two light emitting elements 1 and cutting at the cutting groove 31, the light emitting device 100F as shown in FIG. 12B can be obtained.

As described above, the light emitting device and the method for manufacturing the light emitting device according to the present embodiment have been specifically described with reference to the embodiment for carrying out the invention. However, the gist of the present invention is not limited to these descriptions, and must be broadly interpreted based on the description of the scope of claims. Further, various changes and modifications based on these descriptions are also included in the gist of the present invention.
Hereinafter, other embodiments will be described.

As in the light emitting device 100A shown in FIG. 8A, the second reflecting member 4 covers only the outer surface of the wavelength conversion member 3 from the upper end to the lower end, and the covering member 5 covers the outer surface of the first reflecting member 2. It may be the one that has been used.
Further, as in the light emitting device 100B shown in FIG. 8B, the second reflecting member 4 covers only from the upper end to the lower end of the outer surface of the wavelength conversion member 3, and the covering member 5 covers only the second reflecting member 4. It may be the one that has been used.
Further, as in the light emitting device 100C shown in FIG. 8C, the second reflective member 4 covers the outer surface of the wavelength conversion member 3 and the outer surface of the first reflective member 2, and the covering member 5 is the wavelength conversion member 3. Only the outer surface of the second reflective member 4 that covers the outer side surface may be covered.

According to these configurations, the light emitting device can be reduced in weight. In addition, the material cost of the light emitting device is reduced.
The light emitting devices 100A, 100B, and 100C can be manufactured by etching or using a mask in the step S105 of covering with the second reflective member and the step S106 of covering with the covering member.

The second reflective member 4 may include at least one of a metal layer and a dielectric layer. When the second reflective member 4 includes the metal layer 42, the metal layer 42 can be formed by electroplating, electroless plating, thin film deposition, spatter, or the like in step S105 of coating with the second reflective member. ..
When the second reflective member 4 includes the dielectric layer 43, the dielectric layer 43 can be formed by sputtering, ALD, CVD, PVD, or the like in the step S105 of covering with the second reflective member.

Further, the light guide member 6 may not be provided. Further, the light guide member 6 may be provided not only on the side surface of the light emitting element 1 but also between the light emitting element 1 and the wavelength conversion member 3 as in the light emitting device 100D shown in FIG. 8D. In this case, the vertical thickness of the light guide member 6 is 0.5 μm or more and 20 μm or less from the viewpoint of more firmly adhering the light emitting element 1 and the wavelength conversion member 3 and from the viewpoint of improving the light flux and light extraction efficiency. It is preferably 0.5 μm or more and 10 μm or less. Further, the light emitting element 1 may be provided in a plurality of cases in addition to the case of one. Further, the light emitting device may include a mounting board on which the light emitting device 100 is mounted.

Further, the wavelength conversion member 3 may have a multi-layer structure as well as a single-layer structure. The wavelength conversion member 3 may be a stack of a plurality of wavelength conversion members containing different wavelength conversion substances as long as the color is similar to the body color of the covering member 5. Further, the wavelength conversion member 3 may include a light-transmitting layer that does not contain a wavelength conversion substance. Further, a translucent member such as a translucent layer that does not contain the wavelength conversion member 3, a layer that contains a diffusing agent, a layer that has irregularities on the surface, and a convex lens may be laminated on the wavelength conversion member 3. In FIG. 8D, the translucent layer 7 is laminated on the wavelength conversion member 3. By laminating the light-transmitting layer 7, the wavelength conversion substance can be protected from the external environment.

When the wavelength conversion member 3 is a laminated body and includes a light-transmitting layer containing no wavelength conversion substance, it is preferable to arrange the light-transmitting layer 7 on the second surface 3b of the wavelength conversion member 3 as shown in FIG. 8D. .. In this case, the translucent layer 7 may be a part of the wavelength conversion member 3, but it is assumed that the layer does not contain the wavelength conversion substance and is different from the wavelength conversion member 3 containing the wavelength conversion substance. be able to. By arranging the translucent layer 7 on the second surface 3b of the wavelength conversion member 3, when the sheet 20 is removed and the light emitting device 100D is used, the translucent layer 7 becomes a protective layer and the wavelength conversion substance is separated from the external environment. Can be protected.
The translucent layer 7 is a transparent member, and examples of the translucent layer 7 include a translucent resin such as a resin that can be used for the wavelength conversion member 3, glass, and the like.

In the step of forming the wavelength conversion member, by providing the translucent layer 7 containing no wavelength conversion substance on the second surface 3b side of the wavelength conversion member 3, light emission can be easily performed in the step S109 of preparing the upper surface of the light emitting device. The top surface of the device can be trimmed. Specifically, when the upper surface of the light emitting device is prepared, a part of the translucent layer 7 containing no wavelength conversion substance is removed without removing the wavelength conversion member 3, thereby changing the emission color and the wavelength conversion member. It is possible to suppress the change in body color of 3.

In the method for manufacturing the light emitting device described above, in the step S104 for exposing the outer surface of the wavelength conversion member, a part of the wavelength conversion member 3 is removed from the first surface 3a side of the wavelength conversion member 3. However, as shown in FIG. 10A, the removal of a part of the wavelength conversion member 3 may be performed from the second surface 3b side of the wavelength conversion member 3. In this case, the recess 30 can be formed by removing the member in the vertical direction or at an angle from the upper surface of the sheet 20 toward the first reflective member 2 with the sheet 20 facing up. The recess 30 can be formed by penetrating the sheet 20 and further penetrating the wavelength conversion member 3 to remove a part of the first reflective member 2. At this time, the first reflective member 2 may be removed to a position below the lower surface of the electrodes 11 and 12 with the electrodes 11 and 12 of the light emitting element 1 facing down. The thickness of the first reflective member 2 in the vertical direction may be adjusted as appropriate, assuming a position where the first reflective member 2 is removed.

Next, as shown in FIG. 10B, in the method of manufacturing a light emitting device, a second reflective member 4 is formed on the inner surface of the recess 30, and the outer surface 3c of the wavelength conversion member 3 is covered with the second reflective member 4. Next, as shown in FIG. 10C, in the method of manufacturing the light emitting device, the outer surface 4a of the second reflecting member 4 is covered with the covering member 5 whose body color is similar to the body color of the wavelength conversion member 3. Next, as shown in FIG. 11A, the method of manufacturing the light emitting device is as follows: a part of the first reflecting member 2, a part of the second reflecting member 4, and a part of the covering member 5 on the electrodes 11 and 12. Is removed so as to expose the electrodes 11 and 12 of the light emitting element 1. Next, as shown in FIG. 11B, in the method of manufacturing the light emitting device, the structure in which the electrodes 11 and 12 are exposed is transferred to another sheet 21 such as resin. After the transfer, the sheet 20, a part of the second reflective member 4, a part of the covering member 5, and a part of the wavelength conversion member 3 are removed. Next, as shown in FIG. 11C, the method of manufacturing the light emitting device is to cut at a cutting line including the covering member 5.
The step S109 for preparing the upper surface of the light emitting device may not be performed, or may be performed in order to make the upper surface of the light emitting device smoother.
Other matters are the same as the above-mentioned manufacturing method of the light emitting device.

Further, the method for manufacturing the light emitting device may include other steps during or before and after each of the steps as long as the steps are not adversely affected. For example, a foreign matter removing step of removing foreign matter mixed in during manufacturing may be included.

The light emitting device according to the embodiment of the present invention can be used for various lighting devices such as a flashlight of a camera and general lighting.

1 Light emitting element 1a Light emitting surface of light emitting element 2 First reflecting member 3 Wavelength conversion member 3a First surface of wavelength conversion member 3b Second surface of wavelength conversion member 3c Outer surface of wavelength conversion member 4 Second reflection member 4a Second reflection Outer surface of member 5 Coating member 6 Light guide member 7 Translucent layer 11, 12 Electrode 20, 21 Sheet 30 Recess 31 Cutting groove 41 Reflective layer 42 Metal layer 43 Dielectric layer 100, 100A, 100B, 100C, 100D, 100E, 100F Light emitting device a Specific color A Color range

Claims (11)

A light emitting element having a light emitting surface and a side surface,
The first reflective member provided on the side surface of the light emitting element and
A wavelength conversion member provided on the light emitting surface of the light emitting element and on the first reflecting member, and
A second reflective member that covers the outer surface of the wavelength conversion member from the upper end to the lower end,
A covering member that covers the outer surface of the second reflective member is provided.
The body color of the wavelength conversion member and the body color of the covering member are similar colors .
The covering member contains a wavelength conversion substance and contains.
The wavelength conversion member is a light emitting device containing a wavelength conversion substance having the same composition as the wavelength conversion substance contained in the covering member . The light emitting device according to claim 1, wherein the second reflective member covers the outer surface of the first reflective member. The light emitting device according to claim 1, wherein the covering member covers the outer surface of the first reflection member. The light emitting device according to claim 2, wherein the covering member covers the outer surface of the second reflecting member. The light emitting device according to any one of claims 1 to 4 , wherein the thickness of the second reflective member is 0.1 μm or more and 5.0 μm or less. The light emitting device according to any one of claims 1 to 5 , wherein the first reflecting member is provided on the side surface of the light emitting element via a light guide member. The light emitting device according to any one of claims 1 to 6 , wherein the second reflective member includes at least one of a metal layer and a dielectric layer. A step of mounting a light emitting element with a light emitting surface facing the first surface of a wavelength conversion member having a second surface on the opposite side of the first surface and the first surface.
The step of covering the light emitting element with the first reflective member and
A step of removing a part of the wavelength conversion member around the light emitting element to expose the outer surface of the wavelength conversion member.
The step of covering the outer surface of the wavelength conversion member with the second reflective member,
A method for manufacturing a light emitting device, comprising a step of covering the outer surface of the second reflective member with a covering member whose body color is similar to the body color of the wavelength conversion member. The step of removing a part of the wavelength conversion member is
The method for manufacturing a light emitting device according to claim 8 , wherein the method is performed from the first surface side of the wavelength conversion member. The step of removing a part of the wavelength conversion member is
The method for manufacturing a light emitting device according to claim 8 , wherein the method is performed from the second surface side of the wavelength conversion member. The step of mounting the light emitting element is
The method for manufacturing a light emitting device according to any one of claims 8 to 10 , further comprising a step of providing a light guide member so as to cover at least a part of a side surface of the light emitting element.

Images