CN110010745A - The manufacturing method of light emitting device and light emitting device - Google Patents
The manufacturing method of light emitting device and light emitting device Download PDFInfo
- Publication number
- CN110010745A CN110010745A CN201811570316.9A CN201811570316A CN110010745A CN 110010745 A CN110010745 A CN 110010745A CN 201811570316 A CN201811570316 A CN 201811570316A CN 110010745 A CN110010745 A CN 110010745A
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- Prior art keywords
- component
- light
- emitting device
- light emitting
- wavelength convert
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
When shining, the contrast of light emitting region and non-luminous region is big and the upper surface of light emitting device integrally becomes the light emitting device of the color of wavelength conversion section part and the manufacturing method of light emitting device when non-luminescent for present invention offer.Light emitting device (100) has: the light-emitting component (1) with light-emitting surface and side；It is set to the reflection component (2) of the side of light-emitting component (1)；Be arranged on the light-emitting surface of light-emitting component (1) and reflection component (2) on wavelength convert component (3)；And coating coating component (5) is carried out from upper end to lower end to the lateral surface of wavelength convert component (3), coating component (5) contain reflecting material and coloring material, and the body colour of wavelength convert component (3) and the body colour of coating component (5) are homology color.
Description
Technical field
This disclosure relates to the manufacturing method of light emitting device and light emitting device.
Background technique
Such as patent document 1 records bonding fluorophor plate on light emitting elements, and by the white component quilt of light reflective
Cover surrounding light emitting device.The upper surface of such light emitting device as the fluorophor contained by fluorophor plate color (such as
Yellow) and white component color (white) the two colors composition.
Patent document 1: Japanese Unexamined Patent Publication 2013-12545 bulletin
The light sources of lighting devices such as flash lamp of the previous light emitting device for example as the camera of smart phone and use
In the case of, when non-luminescent, lens is caused to mirror the color of fluorophor and the color of white component.Thus, for example, according to intelligence
The difference of the design of mobile phone, its shell, the upper surface of light emitting device is whole when non-luminescent sometimes for previous light emitting device
The color of wavelength convert component is not become, appearance is not preferred.
Summary of the invention
It is big that the project of embodiments of the present invention is to provide the contrast of light emitting region and non-luminous region when shining,
And the upper surface of light emitting device integrally becomes the light emitting device of the color of wavelength conversion section part and the dress that shines when non-luminescent
The manufacturing method set.
The light emitting device of embodiment of the present disclosure has: light-emitting component, with light-emitting surface and side；Reflection component,
Its side for being set to above-mentioned light-emitting component；Wavelength convert component, be arranged on the light-emitting surface of above-mentioned light-emitting component and on
It states on reflection component；And coating component, to being coated from upper end to lower end for the lateral surface of above-mentioned wavelength convert component,
Above-mentioned coating component contains reflecting material and coloring material, the body of the body colour of above-mentioned wavelength convert component and above-mentioned coating component
Color is homology color.
The manufacturing method of the light emitting device of embodiment of the present disclosure include: have the first face and with above-mentioned first face
Above-mentioned first face of the wavelength convert component in the second face of opposite side by make light-emitting surface with above-mentioned first it is aspectant in a manner of carry
The process for setting light-emitting component；The process of above-mentioned light-emitting component is coated by reflection component；It will be upper around above-mentioned light-emitting component
The a part for stating wavelength convert component removes, and the process for exposing the lateral surface of above-mentioned wavelength convert component；And by containing
There are reflecting material and coloring material and body colour is the coating component with the body colour homology color of above-mentioned wavelength convert component to be coated
The process of the lateral surface of above-mentioned wavelength convert component.
The light emitting device of embodiment according to the present invention, the comparison of light emitting region and non-luminous region when can make to shine
Degree becomes larger, and the upper surface of light emitting device integrally becomes the color of wavelength conversion section part when can make non-luminescent.
The manufacturing method of the light emitting device of embodiment according to the present invention, light emitting region when can obtain luminous with it is non-
The upper surface of light emitting device integrally becomes the color of wavelength conversion section part when the contrast of light emitting region becomes larger and is non-luminescent
Light emitting device.
Detailed description of the invention
Figure 1A is the perspective view for schematically showing the structure of light emitting device of embodiment.
Figure 1B is the cross-sectional view of the IB-IB line of Figure 1A.
Fig. 1 C is the top view for schematically showing the structure of light emitting device of embodiment.
Fig. 1 D is the bottom view for schematically showing the structure of light emitting device of embodiment.
Fig. 2 be schematically show Meng Saier colour system form and aspect etc. form and aspect face (5Y) figure.
Fig. 3 is the flow chart of the manufacturing method of the light emitting device of embodiment.
Fig. 4 A is to indicate to form wavelength convert component on sheet material in the manufacturing method of the light emitting device of embodiment
The cross-sectional view of process.
Fig. 4 B is the cross-sectional view for indicating to load the process of light-emitting component in the manufacturing method of the light emitting device of embodiment.
Fig. 4 C is to indicate to be coated light-emitting component etc. by reflection component in the manufacturing method of the light emitting device of embodiment
The cross-sectional view of process.
Fig. 5 A is to indicate to make in the manufacturing method of the light emitting device of embodiment the lateral surface of wavelength convert component to expose
Process cross-sectional view.
Fig. 5 B is to indicate to make in the manufacturing method of the light emitting device of embodiment the lateral surface of wavelength convert component to expose
Process top view.
Fig. 6 A is indicated in the manufacturing method of the light emitting device of embodiment, is coated wavelength convert by coating component
The cross-sectional view of the process of the lateral surface of component.
Fig. 6 B is the process for indicating to expose electrode from reflection component
Cross-sectional view.
Fig. 7 A is the section view for indicating to be needed on the process of other sheet materials in the manufacturing method of the light emitting device of embodiment
Figure.
Fig. 7 B is to indicate to arrange the upper surface of light emitting device in the manufacturing method of the light emitting device of embodiment
Process cross-sectional view.
Fig. 7 C is the process for indicating to be cut off in the manufacturing method of the light emitting device of embodiment by each device
Cross-sectional view.
Fig. 8 A is the cross-sectional view for schematically showing the structure of light emitting device of other embodiments.
Fig. 8 B is the cross-sectional view for schematically showing the structure of light emitting device of other embodiments.
Fig. 9 A is the lateral surface for indicating to make in other manufacturing methods of the light emitting device of embodiment wavelength convert component
The cross-sectional view of the process of exposing.
Fig. 9 B is to indicate to be coated wavelength convert by coating component in other manufacturing methods of the light emitting device of embodiment
The cross-sectional view of the process of the lateral surface of component.
Figure 10 A is to indicate to expose electrode from reflection component in other manufacturing methods of the light emitting device of embodiment
The cross-sectional view of process.
Figure 10 B is the process for indicating to be needed on other sheet materials in other manufacturing methods of the light emitting device of embodiment
Cross-sectional view.
Figure 10 C is the work for indicating to be cut off in other manufacturing methods of the light emitting device of embodiment by each device
The cross-sectional view of sequence.
Figure 11 is the cross-sectional view for schematically showing the structure of light emitting device of other embodiments.
Figure 12 is the flow chart of the manufacturing method of the light emitting device of the other embodiments of Figure 11.
Figure 13 A is the work for indicating to prepare in the manufacturing method of the light emitting device of the other embodiments of Figure 11 coating component
The cross-sectional view of sequence.
Figure 13 B is to indicate to pass through in the manufacturing method of the light emitting device of the other embodiments of Figure 11 in the setting of coating component
The cross-sectional view of the process of through-hole.
Figure 13 C is to indicate to fill wavelength convert component in the manufacturing method of the light emitting device of the other embodiments of Figure 11
Process cross-sectional view.
Figure 14 A is the work for indicating to load light-emitting component in the manufacturing method of the light emitting device of the other embodiments of Figure 11
The cross-sectional view of sequence.
Figure 14 B is to indicate to be coated in the manufacturing method of the light emitting device of the other embodiments of Figure 11 by reflection component
The cross-sectional view of the process of light-emitting component etc..
Figure 14 C is to indicate to make electrode from reflection component in the manufacturing method of the light emitting device of the other embodiments of Figure 11
The cross-sectional view of the process of exposing.
Figure 15 is the cross-sectional view for schematically showing the structure of light emitting device of other embodiments.
Figure 16 is the flow chart of the manufacturing method of the light emitting device of the other embodiments of Figure 15.
Figure 17 A is to indicate to configure translucent material stacking in the manufacturing method of the light emitting device of the other embodiments of Figure 15
The cross-sectional view of the process of sheet material.
Figure 17 B is to indicate coating by being coated component in the manufacturing method of the light emitting device of the other embodiments of Figure 15
The cross-sectional view of process.
Figure 17 C is the work for indicating to expose photic zone in the manufacturing method of the light emitting device of the other embodiments of Figure 15
The cross-sectional view of sequence.
Figure 17 D is the work for indicating to load light-emitting component in the manufacturing method of the light emitting device of the other embodiments of Figure 15
The cross-sectional view of sequence.
Figure 18 A is to indicate to be coated in the manufacturing method of the light emitting device of the other embodiments of Figure 15 by reflection component
The cross-sectional view of process.
Figure 18 B is the process for indicating to expose electrode in the manufacturing method of the light emitting device of the other embodiments of Figure 15
Cross-sectional view.
Figure 18 C is the process for indicating to be cut off in the manufacturing method of the light emitting device of the other embodiments of Figure 15
Cross-sectional view.
Figure 19 A is the cross-sectional view for schematically showing the structure of light emitting device of other embodiments.
Figure 19 B is the cross-sectional view for schematically showing the structure of light emitting device of other embodiments.
Description of symbols
1... light-emitting component；The light-emitting surface of 1a... light-emitting component；2... reflection component；The outside of 2c... reflection component
Face；3... wavelength convert component；First face of 3a... wavelength convert component；Second face of 3b... wavelength convert component；3c...
The lateral surface of wavelength convert component；5... it is coated component；6... light guide member；7... photic zone；11,12... electrode；16...
The through hole of coating component；17,18... plate-shaped member；20,21... sheet material；25... translucent material laminated sheet；30... recessed
Portion；31... cutting groove；41... reflecting layer；42... metal layer；43... dielectric layer；100,100A,100B,100C,100D,
100E, 100F... light emitting device；A... specific color；A... the range of color.
Specific embodiment
<embodiment>
Hereinafter, being illustrated referring to attached drawing to embodiment.But mode as shown below is exemplified for implementing this
The manufacturing method of light emitting device and light emitting device that the technical idea of mode embodies, is not limited to the following contents.In addition, real
It applies size, material, shape, its opposite configuration of structure member documented by mode etc. to record as long as no specific, then not
It is intended to the scope of the present invention being defined in this, only simple illustration.In addition, the size of component represented by each attached drawing,
Positional relationship etc. is exaggerated sometimes for keeping explanation clear.
[light emitting device]
Firstly, the light emitting device to embodiment is illustrated.
As shown in Figure 1A~Fig. 1 D, light emitting device 100 have light-emitting component 1, reflection component 2, wavelength convert component 3 and
Coating component 5.In addition, light emitting device 100 is provided with light guide member 6 in the side of light-emitting component 1.
The upper surface of light emitting device 100 is made of light emitting region and non-luminous region.In addition, light emitting region is in the dress that shines
It sets and carries out luminous region (for example, wavelength convert component 3) when shining in 100 upper surface, non-luminous region is light emitting region
Region (for example, coating component 5) in addition.
(light-emitting component)
Light-emitting component 1 is able to use the semiconductor light-emitting elements such as LED element.As long as light-emitting component 1 is partly led by various
The element construction that body is constituted is provided with the element of positive and negative a pair of electrodes 11,12.Particularly preferred light-emitting component 1 is can be efficient
Nitride-based semiconductor (the In of ground excited fluophorxAlyGa1-x-yN, 0≤x, 0≤y, x+y≤1).In addition, light-emitting component 1 can also
To be zinc sulphide based semiconductor, zinc selenide based semiconductor, silicon carbide based semiconductor.
(reflection component)
Reflection component 2 is for reflecting the light for carrying out self-emission device 1 and taking out light via wavelength convert component 3
Component.Reflection component 2 is the hair for making the sending of light-emitting component 1 and to the light that transverse direction or lower section are advanced to light emitting device 100
The component of light region that is, 3 lateral reflection of wavelength convert component.
Reflection component 2 is set to the side of light-emitting component 1 and the lower section of wavelength convert component 3.Specifically, reflecting part
Part 2 is coated the lower surface (electrode 11,12 sides) of light-emitting component 1.Also, for reflection component 2, to the side of light-emitting component 1
The region being coated by light guide member 6 in face is coated in a manner of surrounding via light guide member 6, to not by light guide member 6
The direct covering luminous element side in coating region.
In addition, reflection component 2 is arranged via the light guide member 6 formed in the side of light-emitting component 1, however, you can also not be arranged
Light guide member 6, and it is directly arranged at the side of light-emitting component 1.
Reflection component 2 is, for example, the resin layer containing reflecting material.Reflection component 2 be also configured to base material or at
Also contain filler other than reflecting material for the resin of adhesive.
Adhesive be for make above-mentioned reflecting material, filler as reflection component 2 and with the side of light-emitting component 1 with
And the resin of lower surface (electrode 11,12 sides) bonding.As the resin as adhesive, such as can enumerate: polycarbonate resin,
Epoxy resin, phenolic resin, organic siliconresin, acrylic resin, TPX resin, polynofbornene, polyurethane resin etc..
Alternatively, as the resin of adhesive is become, such as these denatured resins or the mixing containing more than one these resins can be enumerated
Resin.Wherein, organic siliconresin or its denatured resin heat resistance, excellent in light-resistance, the volume contraction after solidification is small, thus excellent
Choosing.
Reflecting material is the substance for the light reflection for emitting light-emitting component 1.As reflecting material, for example, can enumerate: dioxy
SiClx, titanium oxide, silica, aluminium oxide, potassium titanate, zinc oxide, boron nitride etc..Alternatively, it is also possible to use silica gel powder etc. to set
The powder of rouge.
Filler is the intensity in order to improve the reflection component 2 as resin layer, or in order to improve leading for reflection component 2
The reasons such as heating rate and the preparation added.As filler, such as glass fibre, whisker, aluminium oxide, silica, nitridation can be enumerated
Boron, zinc oxide, aluminium nitride etc..
(light guide member)
Light guide member 6 is so that being easy to take out light from light-emitting component 1, and the light of self-emission device in future 1 is to wavelength convert
The guide-lighting component of component 3.Light guide member 6 can be improved the extraction efficiency of light beam and light.
Light guide member 6 is climbed by the bonding part for engaging wavelength convert component 3 with light-emitting component 1 in light-emitting component 1
Side and form (turn upside down when manufacture state manufacture).
As light guide member 6, such as it is able to use the resin material of translucency.In addition, light guide member 6 can enumerate it is above-mentioned
The translucency jointing material such as the base material of reflection component 2 or resin as adhesive.Alternatively, it is also possible to containing silica,
The diffusants such as titanium oxide, silica, aluminium oxide, potassium titanate, zinc oxide, boron nitride.Thereby, it is possible to more balancedly make light Xiang Bochang
Converting member 3 is incident, is able to suppress the irregular colour of light emitting device 100.
As shown in Figure 1B, light guide member 6 is to regard lower surface (electrode 11,12 of the component width from light-emitting component 1 in section
Side) it is formed towards the mode that wavelength convert component 3 broadens with triangle.By becoming this way, thus light beam and
The extraction efficiency of light further increases.But the shape not specially provided for of light guide member 6.For example, the shape of light guide member 6
It can be convex form in 2 side of reflection component, be concave shape in 1 side of light-emitting component.
Light guide member 6 can also be coated a part of the side of light-emitting component 1, from the extraction efficiency for improving light beam and light
From the perspective of, more preferably it is coated the substantially the entirety of of the side of light-emitting component 1.
In addition, light guide member 6 can also be configured between wavelength convert component 3 and light-emitting component 1.
(wavelength convert component)
Wavelength convert component 3 is that a part of the light containing the wavelength issued to light-emitting component 1 absorbs, and converts
For different wave length light and the component of luminous Wavelength conversion substance.Wavelength conversion substance example used in wavelength convert component 3
Fluorophor in this way.Hereinafter, being illustrated to the case where Wavelength conversion substance is fluorophor.
Wavelength convert component 3 is arranged on the light-emitting surface of light-emitting component 1 and on reflection component 2.
The lower surface of wavelength convert component 3 is formed as than light-emitting component 1 with the aspectant face that shines of light-emitting component 1
Upper surface that is, light-emitting surface it is big.
The base material or adhesive of wavelength convert component 3 are preferably formed by the resin of translucency.As resin here, example
It can such as enumerate: the base material of above-mentioned reflection component 2 or the resin as adhesive.Wherein, organic siliconresin or its denaturation
Resin heat resistance, excellent in light-resistance, the volume contraction after solidification is few, thus it is preferred that.In addition, the base material of wavelength convert component 3 or
Person's adhesive can also also be formed by glass other than resin.
As the fluorophor contained by wavelength convert component 3, for example, can enumerate with the yttrium-aluminium-garnet of cerium activation, with cerium
The Luetcium aluminum garnet of activation, activated with the terbium aluminium garnet of cerium activation, with any of europium and chromium or two it is nitrogenous
Ca aluminosilicate, with it is europkium-activated match it is grand, with europkium-activated silicate, with manganese activated potassium fluosilicate etc..
Here, as described later, glimmering as long as the body colour of wavelength convert component 3 and the body colour of coating component 5 are homology color
The body colour of body of light itself is also possible to random color.Body colour refer to light emitting device 100 it is non-luminescent when component itself color.
For example, in the case where the body colour of fluorophor itself has used the fluorophor of white color system, the body of wavelength convert component 3
Color becomes white color system.Therefore, as described later, if the body colour of wavelength convert component 3 and the body colour of coating component 5 is made to become homology
Color, then the upper surface of light emitting device 100 integrally becomes the color of white color system when non-luminescent.
In the case where light emitting device 100 to be used for example as to the light source of white light of the lighting devices such as the flash lamp of camera,
It is preferable to use the light-emitting component that illuminant colour is blue series and illuminant colour be yellow class and body colour is the fluorophor of yellow class.In addition,
It is preferable to use the light-emitting component that illuminant colour is blue series and illuminant colour be Yellow Red and body colour is the fluorophor of Yellow Red.
As body colour be yellow class and illuminant colour is the fluorophor of yellow, such as can be enumerated: yttrium-aluminium-garnet system fluorophor
(YAG system fluorophor), Luetcium aluminum garnet system fluorophor (LAG system fluorophor), terbium aluminium garnet system fluorophor (TAG system fluorophor)
Deng.In addition, being yellow class as body colour and illuminant colour is the fluorophor of red colour system, KSF can be enumerated.The body colour of these fluorophor exists
It is 10Y or 5Y in the Meng Saier colour circle of aftermentioned Meng Saier colour system (20 form and aspect).
As body colour be Yellow Red and illuminant colour is the fluorophor of red colour system, such as SCASN, CASN can be enumerated etc..These
The body colour of fluorophor is 10YR or 5YR in the Meng Saier colour circle of aftermentioned Meng Saier colour system (20 form and aspect).
In addition, by illuminant colour be yellow class fluorophor and illuminant colour be red colour system fluorophor mix, can make illuminant colour at
For the fluorophor of Yellow Red.
In addition, the body colour as fluorophor itself is the color of the fluorophor of yellow class and the fluorophor of Yellow Red, example
It can such as enumerate: the form and aspect of 5YR, 10YR, 5Y, 10Y in the Meng Saier colour circle of aftermentioned Meng Saier colour system (20 form and aspect).
In the case where the color as fluorophor itself is the fluorophor of yellow class, for example, 10Y, 5Y.As glimmering
In the case that the color of body of light itself is the fluorophor of Yellow Red, for example, 10YR, 5YR.It is Huang by the body colour of fluorophor itself
The fluorophor of colour system, and in the Meng Saier colour circle of Meng Saier colour system (20 form and aspect) be 5Y the case where as an example, below
It is illustrated.
In Meng Saier colour system, lightness is, for example, 7 or more and 9 or less.
In addition, chroma is, for example, 4 or more and 14 or less in Meng Saier colour system.
In addition, as described later, in the case where coating component 5 includes Wavelength conversion substance, wavelength convert component 3 is preferred
Include Wavelength conversion substance identical with the composition of Wavelength conversion substance contained by coating component 5.According to this structure, non-hair
The color of the upper surface entirety of the light emitting device 100 of light time easily becomes identical as the color of wavelength convert component 3.
Wavelength convert component 3 can also contain diffusant.Diffusant is the sending in order to make light-emitting component 1 and fluorophor
Light efficiently spreads and adds.As diffusant, such as object identical with the reflecting material of above-mentioned reflection component 2 can be enumerated
Matter.
The thickness of the up and down direction of wavelength convert component 3 can according to the light that the content of fluorophor, light-emitting component 1 issue with
Tone after the colour mixture of light after wavelength convert etc. can be for example 50 μm or more and 300 μm or less to determine.
(coating component)
Coating component 5 is the component of the lateral surface of coating wavelength convert component 3 and the lateral surface of reflection component 2.Here,
Coating component 5 be coated the lateral surface of wavelength convert component 3 from upper end up to lower end, and be coated the lateral surface of reflection component 2
From upper end up to lower end.Coating component 5 forms a part of the side of light emitting device 100.
Coating component 5 is, for example, resin layer.As the resin for the base material or adhesive for being used as coating component 5, such as can
It enumerates: as the base material of above-mentioned reflection component 2 or the resin of adhesive.Wherein, epoxy resin or its denatured resin are viscous
Conjunction property, barrier properties for gases are excellent, thus it is preferred that.In addition, organic siliconresin or its denatured resin heat resistance, excellent in light-resistance,
Volume contraction after solidification is few, thus it is preferred that.
Coating component 5 includes reflecting material and coloring material.
As reflecting material, such as the reflecting material that can be used in reflection component 2 can be enumerated.
Reflecting material relative to coating component 5 content preferably with respect to coating component 5 total quality be 30 mass % with
Upper and 70 mass % or less.If reflecting material is 30 mass % or more relative to the content of coating component 5, when can make to shine
Light emitting region and the contrast of non-luminous region be further enlarged.On the other hand, if reflecting material is relative to coating component 5
Content is 70 mass % hereinafter, then economy improves.
Coloring material includes either one or two of Wavelength conversion substance, pigment and dyestuff.As Wavelength conversion substance, can enumerate
Substance identical with the Wavelength conversion substance contained by wavelength convert component 3.
It as pigment, is not particularly limited, such as has the pigment for having used inorganic based material, organic based material, can enumerate makes
With the pigment of material below.
It as inorganic based material, such as can enumerate: red oxide (Fe2O3), red lead (Pb3O4), titanium nickel antimony system oxidation
Object, titanium nickel barium system oxide, titanium chromium antimony system oxide, titanium chromium niobium system oxide etc..
It as organic based material, such as can enumerate: anthraquinone system, azo system, quinacridone, perylene system, pyrrolo-
Pyrroledione system, monoazo system, bisazo system, pyrazolone system, benzimidazolone system, quinoxaline system, azomethine system, different Yin
Diindyl quinoline ketone system, isoindoline system etc..
It as dyestuff, is not particularly limited, but can for example enumerate: anthraquinone based dye, methine based dye, azomethine system dye
Material, oxazines based dye, azo based dye, polystyrene dyestuff, coumarin series dyestuff, porphyrin based dye, dibenzopyrone system
Dyestuff, pyrrolo-pyrrole-dione based dye, rhodamine based dye, xanthene based dye, pyrroles's methylene based dye etc..
In addition, substantially the light of self-emission device 1 is not converted to different wave length and is preferred in the future for pigment and dyestuff.
The body colour of wavelength convert component 3 and the body colour of coating component 5 are homology color.Here, homology color refers to: in Meng Saier
In colour system (20 form and aspect), form and aspect: within 3 codomains of hue circle (20 codomain), lightness: within 3 codomains, chroma: 3 codomains with
It is interior.
That is, in the hue circle of Meng Saier colour system (20 form and aspect), on the basis of defined form and aspect, the defined color
Mutually the form and aspect adjacent in its two sides with configuration are homology color；Similarly, Meng Saier colour system (20 form and aspect) etc. form and aspect face
In, lightness is on the basis of the lightness of specified value, and (i.e. two sides are adjacent with the lightness of its ± 1 numerical value for the lightness of the specified value
Lightness) be homology color；Meng Saier colour system (20 form and aspect) etc. in form and aspect face, chroma is using the chroma of specified value as base
The chroma (i.e. two sides adjacent chroma) of standard, the chroma of the specified value and its ± 1 numerical value is homology color.
Specifically, as shown in Fig. 2, for example, Y (yellow) system form and aspect etc. in form and aspect face (5Y), by specific color
In the case that coloured silk is set as color a, range A is homology color.
The measurement of body colour is able to use such as spectral photometric colour measuring meter CM serial (manufacture of Konica Minolta company), color difference
The analyzers such as CR serial (manufacture of Konica Minolta company) are counted to carry out.In such analyzer, using having xenon lamp
Light source and silicon photoelectric diode light receiving element, and can be divided by plane diffraction grating, be able to carry out Meng Saierse
The analyzer of output under color system.
The body colour of wavelength convert component 3 and the body colour of coating component 5 are homology color, and shine dress when so as to make non-luminescent
Setting 100 upper surface integrally becomes the color of wavelength conversion section part 3.
In addition, the upper surface of light emitting device 100 integrally becomes the color of wavelength conversion section part 3 in addition to the dress that shines when non-luminescent
The color for setting 100 upper surface entirety becomes other than the situation identical as the color of wavelength convert component 3, further includes becoming identical
The case where degree.Same degree refer to Meng Saier colour system (20 form and aspect) for example above-mentioned hue circle, etc. in form and aspect face,
Form and aspect, lightness, chroma can cover two sides it is adjacent until.
The thickness of the width direction of coating component 5 is preferably 20 μm or more and 200 μm or less.If the width of coating component 5
Direction with a thickness of 20 μm or more, then the color of the upper surface entirety of the light emitting device 100 when non-luminescent easily becomes and wavelength
The color of converting member 3 is identical.On the other hand, if the width direction of coating component 5 with a thickness of 200 μm hereinafter, if can be real
The miniaturization of existing light emitting device 100.
<movement of light emitting device>
Next, being illustrated to the movement of light emitting device 100.
If driving light emitting device 100, supply electric power, shines from external power supply to light-emitting component 1 via electrode 11,12
Element 1 shines.The a part for the light that light-emitting component 1 issues is reflected by reflection component 2, in wavelength convert component 3 by outside
Portion is removed.At this point, coating component 5 includes reflecting material, thus the light emitting region of the upper surface of light emitting device 100 with it is non-luminescent
The contrast (difference of brightness) in region becomes larger.
[manufacturing method of light emitting device]
Next, being said referring to an example of Fig. 3~Fig. 7 C to the manufacturing method of the light emitting device 100 of embodiment
It is bright.In addition, a light emitting device 100 when Fig. 4 A~Fig. 7 C schematically shows while manufacturing multiple light emitting devices 100.
As shown in figure 3, the manufacturing method of the light emitting device 100 of embodiment includes: to form wavelength conversion section on sheet material
The process S101 of part, the process S102 for loading light-emitting component, coating process S103 is carried out by reflection component, makes wavelength conversion section
The process S104 of the lateral surface exposing of part, coating process S105 is carried out by being coated component, the process S106 for exposing electrode, is turned
It is printed on the process S107 of other sheet materials, the process S108 arranged to the upper surface of light emitting device and the work cut off
Sequence S109, and successively carry out.
In addition, be directed to each component material, configuration etc., for as in the explanation of above-mentioned light emitting device 100 narration as,
Here description is omitted as appropriate.
(process of wavelength convert component is formed on sheet material)
As shown in Figure 4 A, the process S101 for wavelength convert component being formed on sheet material is to form wave on the sheet materials such as resin 20
The process of long converting member 3.
Formation of the wavelength convert component 3 on sheet material 20 can be for example, by print process, compression forming method, phosphorus electro-deposition
Method or method of wavelength convert component etc. of plate is laminated to carry out.
(process of mounting light-emitting component)
As shown in Figure 4 B, the process S102 for loading light-emitting component is the first face for making light-emitting surface 1a Yu wavelength convert component 3
The opposite 3a and the process for loading light-emitting component 1, the wavelength convert component 3 have the first face 3a and with the first face 3a opposite side
Second face 3b.
In process S102, light-emitting component 1 makes being provided with electrode 11, the opposing face of 12 sides, shining for light-emitting component 1
Face 1a is engaged via bonding part with the first face 3a of wavelength convert component 3.At this point, in the viewpoints such as light distribution, preferably with wave
The center of first face 3a of long converting member 3 is engaged with the consistent mode in the center light-emitting surface 1a of light-emitting component 1.
Here, by adjusting the amount of bonding part, so as to make bonding part climbing in the side of light-emitting component 1,
The side of light-emitting component 1 forms bonding part.Light emitting device 100, which becomes, as a result, is provided in the side of light-emitting component 1 as viscous
Close the mode of the light guide member 6 of component.
In addition, the light guide member 6 as bonding part can also be in the light-emitting surface 1a and wavelength convert component of light-emitting component 1
It is configured between 3 the first face 3a with the defined thickness of up and down direction.Thereby, it is possible to make light-emitting component 1 and wavelength convert component 3
More securely bond.In addition, although not shown, but here in the first face of the light-emitting surface 1a of light-emitting component 1 and wavelength convert component 3
Between 3a, in order to light-emitting component 1 and wavelength convert component 3 engagement and bonding part is accompanied with very thin state.
(coating process is carried out by reflection component)
As shown in Figure 4 C, carrying out coating process S103 by reflection component is to be positioned in wavelength by reflection component 2 to be coated
The process of light-emitting component 1 on converting member 3.
In process S103, by the coating whole comprising the light-emitting component 1 including electrode 11,12 of reflection component 2.At this
In process S103, from the face of wavelength convert component 3 up to the upper surface of electrode 11,12 is provided with reflection component 2.
The coating of light-emitting component 1 based on reflection component 2 is for example able to use discharger (distributor) Lai Jinhang, the row
Out device can the upside of fixed sheet material 20 relative to sheet material 20 and along the vertical direction or horizontal direction etc. mobile (movable).
The coating of light-emitting component 1 based on reflection component 2 can be filled out the resin etc. for constituting reflection component 2 by using discharger
It fills on wavelength convert component 3 and carries out.
In addition, can be also coated by compression forming method, transfer moudling etc..
(process for exposing the lateral surface of wavelength convert component)
As shown in Fig. 5 A, Fig. 5 B, the process S104 for exposing the lateral surface of wavelength convert component is by the week of light-emitting component 1
A part of the wavelength convert component 3 enclosed removes, and the process for exposing the lateral surface 3c of wavelength convert component 3.Wavelength convert
The removing of a part of component 3 is carried out from 2 side of reflection component as the first face side 3a of wavelength convert component 3.
In process S104, reflection component 2, wavelength convert component 3 are penetrated through, and forms recess portion 30 up to the thickness of sheet material 20
In degree.In process S104, when having carried out singualtion to light-emitting component 1, formed in the position for being formed with coating component 5 recessed
Portion 30.By the formation of the recess portion 30, expose the lateral surface 3c of wavelength convert component 3.
The formation of recess portion 30 for example can be by using the blade of defined width from the upper surface of reflection component 2 towards sheet material
20 are obliquely carried out component removing with vertical direction or have.Specifically, the formation of recess portion 30 can pass through perforation
Reflection component 2 further penetrates through wavelength convert component 3 and removes a part of sheet material 20 to carry out.
In addition, the formation of recess portion 30 can also be carried out by laser, can also be carried out by etching.
As long as in addition, recess portion 30 around light-emitting component 1, can be formed in any position.It is also possible in the member that shines
In the case that the side of part 1 is configured with light guide member 6, recess portion 30 is formed in a manner of removing a part of light guide member 6.Such as
Shown in Fig. 5 A, Fig. 5 B, in order to improve luminous efficiency, it is preferably formed in than light guide member 6 in the outer part.
(coating process is carried out by coating component)
As shown in Figure 6A, carrying out coating process S105 by coating component is to contain the lateral surface 3c of wavelength convert component 3
There are reflecting material and coloring material, and the work coating by the coating component 5 of body colour and the body colour homology color of wavelength convert component 3
Sequence.
In process S105, via the coating component 5 of filling in recess portion 30 by coating component 5 to wavelength convert component
The 3 lateral surface 3c and lateral surface 2c of reflection component 2 carries out coating program to form coating component 5.By the process
S105 is formed with coating component 5 in recess portion 30.
The filling of coating component 5 can be carried out for example, by print process, compression forming method, electrodeposition process etc..In addition, by
The filling for covering component 5 is able to use above-mentioned resin discharger to carry out.
Here, material is selected in such a way that the body colour for making the body colour of wavelength convert component 3 and coating component 5 becomes homology color
Material.
(process for exposing electrode)
As shown in Figure 6B, the process S106 for exposing electrode be reflection component 2 by electrode 11,12 sides a part, with
And a part of coating component 5 removes so that the process that the electrode 11,12 of light-emitting component 1 exposes.
In process S106, for example, being removed directly from electrode 11,12 sides by the surface of reflection component 2 and coating component 5
Until electrode 11,12 exposes.As the method for removing reflection component 2 and coating component 5, such as there are grinding, grinding, sandblasting
Deng.
(process for being needed on other sheet materials)
As shown in Figure 7 A, the process S107 for being needed on other sheet materials is to be needed on the tectosome for exposing electrode 11,12
The process of other sheet materials 21 such as resin.
In process S107, in sheet material in a manner of making the electrode 11,12 exposed from reflection component 2 be bonded in sheet material 21
Tectosome is loaded on 21.
In addition, before being needed on other sheet materials 21 or after, the sheet material 20 for being used for the formation of wavelength convert component 3 is removed
It goes.
(process that the upper surface of light emitting device is arranged)
As shown in Figure 7 B, the process S108 arranged to the upper surface of light emitting device is will be by removing sheet material 20
The a part for the coating component 5 that the second face side 3b of wavelength convert component 3 is exposed removes, and carries out to the upper surface of light emitting device
The process of arrangement.
In process S108, such as by removing a part of the upper surface of light emitting device, to turn along wavelength
It changes the second face 3b of component 3 and smooths out the upper surface of light emitting device.
(process cut off)
As seen in figure 7 c, the process S109 cut off is by including the work for being coated the cutting line of component 5 and being cut off
Sequence.That is, the process S109 cut off is the work for carrying out singualtion to the aggregate for once forming multiple light emitting devices 100
Sequence.
In process S109, the cutting line for making the aggregate singualtion of light emitting device 100 is predetermined.The cutting
Line is prespecified can to configure coating component in the left and right of cutting groove 31 to make cutting groove 31 positioned at the central side of coating component 5
5.That is, prespecified cutting line as follows, i.e., when aggregate carries out singualtion, component 5 is coated by cutting groove 31
It divides right and left and cuts off, finally formed in the periphery of light emitting device 100 as coating component 5.In addition, in Fig. 4 A~Fig. 7 C only
A light emitting device 100 is illustrated, but actually arranges multiple formation along the line of the column direction, and in a manner of making one singualtion
It is cut off.
The singualtion of aggregate for example nearby carries out cutting until piece by the center of the width direction along cutting groove 31
Material 21 carries out.In addition, cutting groove 31 is preferably cut off in a manner of reaching a part of sheet material 21.
The singualtion of aggregate can be previous known by cutting method for being cut off along cutting groove 31 with blade etc.
Method implement.
Moreover, passing through the singualtion of the aggregate, multiple light emitting devices 100 are obtained.
In addition, cutting groove 31 can also be formed in the case where configuring on sheet material 20,21 and forming a plurality of light-emitting elements 1
Between all light-emitting components, it can also be formed as unit of a plurality of light-emitting elements 1.
For example, forming cutting groove as unit of two light-emitting components by forming recess portion 30 as unit of light-emitting component 1
31, it is cut off as unit of two light-emitting components 1 by cutting groove 31, to obtain such light emitting device shown in Figure 19 A
100E。
In addition, for example, by forming recess portion 30 and cutting groove 31 as unit of two light-emitting components 1, and by cutting groove
31 are cut off, to obtain such light emitting device 100F shown in Figure 19 B.
More than, pass through the manufacture of light emitting device and light emitting device for being directed to present embodiment by way of carrying out an invention
Method is specifically illustrated.But purport of the invention is not limited to these records, it should the note based on claims
It carries and widely explains.In addition, the mode recorded based on these and carried out various changes, change etc. be also contained in it is of the invention
Purport.
Hereinafter, being illustrated to other embodiments.
Light emitting device 100A as shown in Figure 8 A is such, and coating component 5 can also only be coated wavelength convert component 3.
According to this structure, light emitting device can be realized lightness.In addition, light emitting device reduces fee of material.
Light emitting device 100A is carried out in coating process S105 by coating component, can be by being etched, or is used
Mask etc. manufactures.
Alternatively, it is also possible to be not provided with light guide member 6.In addition, light guide member 6 can also be as shown in Figure 8 B light emitting device
100B is such, is not only arranged at the side of light-emitting component 1, is also provided between light-emitting component 1 and wavelength convert component 3.At this
In the case of kind, from the viewpoint of making light-emitting component 1 and wavelength convert component 3 more securely bond, and from raising light beam with
And from the perspective of the extraction efficiency of light, preferably the up and down direction of light guide member 6 with a thickness of 0.5 μm or more and 20 μm hereinafter,
More preferably 0.5 μm or more and 10 μm or less.In addition, light-emitting component 1 other than a situation, can also be also set up more
It is a.In addition, light emitting device can also have the installation base plate of mounting light emitting device 100.
In addition, wavelength convert component 3 can not only be made into monolayer constructions, it can also be made into multi-ply construction.If wavelength convert component 3
Become homology color with the body colour of coating component 5, then can also be overlapped multiple wavelength conversion sections containing different wave length transformational substance
Part.In addition, wavelength convert component 3 also may include the photic zone without containing Wavelength conversion substance.Alternatively, it is also possible to turn in wavelength
Change on component 3 photic zone of the stacking without containing wavelength convert component 3, the layer containing diffusant, surface have indent and convex layer, convex
The light transparent members such as lens.In addition, photic zone 7 is laminated in Fig. 8 B on wavelength convert component 3.By the way that photic zone 7 is laminated, so as to
Enough protect Wavelength conversion substance from external environment influence.
In the case where wavelength convert component 3 is laminated body and the euphotic situation including not containing Wavelength conversion substance, such as scheme
8B is such, preferably by the configuration of photic zone 7 on the second face 3b of wavelength convert component 3.In addition, in this case, photic zone 7
It can also be used as a part of wavelength convert component 3, but as the layer for not containing Wavelength conversion substance, become and contain wavelength
The different layer of the wavelength convert component 3 of transformational substance.By configuring photic zone 7 on the second face 3b of wavelength convert component 3,
To remove by sheet material 20, when becoming light emitting device 100B, photic zone 7 becomes protective layer and can protect Wavelength conversion substance
From external environment influence.
Photic zone 7, which is transparent component as photic zone 7, can enumerate the light transmissions such as the resin that can be used in wavelength convert component 3
Resin, the glass etc. of property.
In addition, by being set in advance in the second face side 3b of wavelength convert component 3 in the process for forming wavelength convert component
The photic zone 7 without containing Wavelength conversion substance is set, so as to the process S108 arranged in the upper surface to light emitting device
In be easily put together the upper surface of light emitting device.Specifically, by not removing when the upper surface to light emitting device arranges
It removes wavelength convert component 3 and removes a part of the photic zone 7 without containing Wavelength conversion substance, so as to inhibit illuminant colour
Variation and wavelength convert component 3 body colour variation.
The manufacturing method of above-mentioned light emitting device is in the process S104 that the lateral surface for making wavelength convert component exposes, from wave
The first face side 3a of long converting member 3 carries out the removing of a part of wavelength convert component 3.However, as shown in Figure 9 A, it can also be with
The removing of a part of wavelength convert component 3 is carried out from the second face side 3b of wavelength convert component 3.In this case, can
By making 20 top of sheet material, with vertical direction or have from the upper surface of sheet material 20 towards reflection component 2 obliquely by portion
Part removes and forms recess portion 30.The formation of recess portion 30 can further penetrate through wavelength convert component 3 by perforation sheet material 20, and
A part of reflection component 2 is removed to carry out.At this point, reflection component 2 makes the electrode 11 of light-emitting component 1,12 lower sections, removed
Go to the position on the lower up to the lower surface than electrode 11,12.In addition, the thickness of the up and down direction of reflection component 2 assumes
The position for removing reflection component 2, is suitably adjusted.
Next, as shown in Figure 9 B, the manufacturing method of light emitting device is same with the body colour of wavelength convert component 3 by body colour
It is the coating component 5 of color to be coated the lateral surface 3c of the wavelength convert component 3 and lateral surface 2c of reflection component 2.Next, such as
Shown in Figure 10 A, the manufacturing method of light emitting device is by the one of electrode 11, a part of the reflection component 2 of 12 sides and coating component 5
Part removes so that the electrode 11,12 of light-emitting component 1 exposes.Next, as shown in Figure 10 B, the manufacturing method of light emitting device will
The tectosome for exposing electrode 11,12 is needed on other sheet materials 21 such as resin.After transfer, by sheet material 20, one of coating component 5
Divide and a part of wavelength convert component 3 removes.Next, as illustrated in figure 10 c, the manufacturing method of light emitting device is by including
The cutting line of coating component 5 is cut off.
In addition, the process S108 arranged to the upper surface of light emitting device can also be without, or make to send out
The upper surface of electro-optical device is smoother and carries out.
It is identical as the manufacturing method of above-mentioned light emitting device for other items.
Alternatively, it is also possible to be, light emitting device 100C as shown in figure 11 is such, and coating component 5 is coated wavelength convert component 3
Side, the setting of reflection component 2 is to the lower section of coating component 5.
Hereinafter, 2~Figure 14 C carries out an example of the manufacturing method of light emitting device 100C shown in Figure 11 referring to Fig.1
Explanation.In addition, light emitting device when Figure 13 A~Figure 14 C schematically shows while manufacturing multiple light emitting device 100C
100C。
As shown in figure 12, the manufacturing method of light emitting device 100C include: prepare plate-shaped member process S20, mounting shine
The process S205 of element, coating process S206, the process S207 for exposing electrode are carried out by reflection component and is cut off
Process S208, and successively carry out.
In addition, material, the configuration etc. of each component are directed to, such as above-mentioned light emitting device 100, that for illustrating to be described of 100C
Sample, therefore description is omitted as appropriate here.
The process > of < preparation plate-shaped member
The process S20 for preparing plate-shaped member is to prepare to have coating component 5 and be configured at the through hole 16 of coating component 5
The process of the plate-shaped member 17 of interior wavelength convert component 3.
The process for preparing plate-shaped member includes the process S201 for preparing coating component, in the work of coating component setting through hole
The sequence S202 and process S21 for filling wavelength convert component, and successively carry out.
(process for preparing coating component)
As shown in FIG. 13A, the process S201 for preparing coating component is the process for preparing the coating component 5 of sheet.
(in the process of coating component setting through hole)
As shown in Figure 13 B, in the specified part that the process S202 of coating component setting through hole is in the coating component 5 of sheet
The process of position setting through hole 16.
In process S202, there is the position of wavelength convert component 3 to form through hole 16 in the formation of light emitting device 100C.
The formation of through hole 16 can be for example coated under component 5 by using punching die from the upper surface of coating component 5 direction
Surface is carried out with vertical direction or with obliquely perforating to component.
The diameter of through hole 16 properly selects.The diameter of through hole 16 for example can become 200 μm or more and
1200 μm or less.In the case where the diameter of through hole 16 is bigger than the diameter of light-emitting component 1, the extraction efficiency of light can be improved.
In the case where the diameter of through hole 16 is smaller than the diameter of light-emitting component 1, light emitting region can be reduced, and improve brightness.
In addition, the shape of through hole 16 can for example be enumerated when looking down, it is rectangle, hexagon, circle etc..In addition, perforation
The shape in hole 16 preferably becomes the similar shape with light-emitting component 1 mathematically in the viewpoints such as light distribution.
[process of filling wavelength convert component]
As shown in fig. 13 c, the process S21 for filling wavelength convert component is the filling wavelength convert component 3 in through hole 16
Process.
The process S21 of filling wavelength convert component includes preparing the process S203 of wavelength convert component and making wavelength convert
The process S204 of substance biasing, and successively carry out.
(process for preparing wavelength convert component)
The process S203 for preparing wavelength convert component is to prepare the wavelength conversion section comprising Wavelength conversion substance and resin
The process of part 3.
In process S203, Wavelength conversion substance and resin are mixed, wavelength convert component 3 is made.
(process for biasing Wavelength conversion substance)
As shown in fig. 13 c, the process S204 for biasing Wavelength conversion substance is that wavelength convert component 3 is being configured at perforation
After in hole 16, make Wavelength conversion substance 40 to (face for the being placed with light-emitting component 1) side the first face 3a of wavelength convert component 3 or
The process of (face with the face opposite side for the being placed with light-emitting component 1) side the second face 3b biasing of wavelength convert component 3.Here,
It is illustrated for the case where biasing Wavelength conversion substance 40 to the first face side 3a of wavelength convert component 3.In addition, afterwards
Attached drawing in, omit Wavelength conversion substance 40 diagram.
In process S204, after wavelength convert component 3 is configured in through hole 16, by natural sedimentation or by force
System precipitating makes the first face side 3a or wavelength convert component 3 of Wavelength conversion substance 40 in resin to wavelength convert component 3
The biasing of the second face side 3b.Thereafter, resin solidification is made by heating etc..The wavelength that Wavelength conversion substance 40 biases is obtained as a result, to turn
Change component 3.In addition, matching in the case where configuring wavelength convert component 3 in through hole 16 in the open side of a side of through hole 16
It is equipped with sheet material etc..
Additionally, it is preferred that Wavelength conversion substance 40 is biased to the first face side 3a of wavelength convert component 3.Turn as a result, in wavelength
The the second face side 3b for changing component 3 does not include Wavelength conversion substance 40 substantially, and wavelength convert component 3 can be protected from external rings
Border influences.
(process of mounting light-emitting component)
As shown in Figure 14 A, the process S205 for loading light-emitting component is the wavelength for impaling light-emitting surface 1a and coating component 5
The first face opposite 3a of converting member 3 and the process for loading light-emitting component 1.
The process S102 substantially phase of the mounting light-emitting component illustrated in process S205 and the manufacturing method of light emitting device 100
Together, therefore here it omits the description.
(coating process is carried out by reflection component)
As shown in Figure 14B, carrying out coating process S206 by reflection component is to be positioned in wavelength by reflection component 2 to be coated
The process of light-emitting component 1 on converting member 3.
In process S206, the whole of the light-emitting component 1 containing electrode 11,12 is coated by reflection component 2.In the work
In sequence S206, from the face of wavelength convert component 3 and the face of coating component 5 up to the upper surface of electrode 11,12 is provided with reflection
Component 2.
The coating of light-emitting component 1 based on reflection component 2 is for example able to use discharger (distributor) Lai Jinhang, the row
Device is in the upper of fixed plate-shaped member 17 (component (3C referring to Fig.1) with coating component 5 and wavelength convert component 3) out
Side, along the vertical direction or horizontal direction etc. can move (movable) relative to plate-shaped member 17.Luminous member based on reflection component 2
Part 1 it is coating can by using discharger and by the resin etc. for constituting reflection component 2 be filled on plate-shaped member 17 into
Row.
In addition, can be also coated by compression forming method, transfer moudling etc..
(process for exposing electrode)
As shown in Figure 14 C, the process S207 for exposing electrode is that a part of the reflection component 2 by electrode 11,12 sides is removed
It goes so that the process that the electrode 11,12 of light-emitting component 1 exposes.
In process S207, for example, removing from electrode 11,12 sides by the surface of reflection component 2 up to electrode 11,12 reveals
Until out.As the method for removing reflection component 2, such as have grinding, grinding, sandblasting etc..
(process cut off)
The process S208 cut off is the collection using cutting line to multiple light emitting device 100C arranged along the line of the column direction
The process that zoarium is cut off.That is, the process S208 cut off is to the set for once forming multiple light emitting device 100C
The process of body progress singualtion.
In process S208, the cutting line that singualtion is carried out for the aggregate to light emitting device 100C is predetermined.
The cutting line predetermines to keep the size of light emitting device 100C impartial.In addition, only illustrating luminous dress in Figure 13 A~Figure 14 C
100C is set, but actually arranges multiple and is formed along the line of the column direction, and cut off in a manner of making one singualtion.
The singualtion of aggregate can by the cutting method cut off at the position of cutting line by blade, in cutting line
Position scribing line after cut the known method such as method for breaking of aggregate to carry out.
Moreover, passing through the singualtion of the aggregate, multiple light emitting device 100C are obtained.
In addition, light emitting device 100D as shown in figure 15 is such, photic zone 7 can also be laminated on wavelength convert component 3.
Here, photic zone 7 is laminated on the second face 3b of wavelength convert component 3.For photic zone 7, for such as above-mentioned light emitting device
As the mode etc. of 100B describes, therefore omit the description here.
Hereinafter, 6~Figure 18 C carries out an example of the manufacturing method of light emitting device 100D shown in figure 15 referring to Fig.1
Explanation.In addition, two light emitting devices when Figure 17 A~Figure 18 C schematically shows while manufacturing multiple light emitting device 100D
100D。
As shown in figure 16, the manufacturing method of light emitting device 100D include: configure translucent material laminated sheet process S301,
By be coated component carry out coating process S302, make photic zone expose process S303, load light-emitting component process S304, by
Reflection component carries out coating process S305, the process S306 for exposing electrode and the process S307 cut off, and successively
It carries out.
In addition, being directed to material, the configuration etc. of each component, illustrate institute for such as above-mentioned light emitting device 100,100C, 100D
As narration, therefore description is omitted as appropriate here.
(process of configuration translucent material laminated sheet)
As shown in Figure 17 A, the process S301 for configuring translucent material laminated sheet is to separate perseverance on the sheet material 20 of resin etc.
Fixed interval and the process for configuring translucent material laminated sheet (block) 25 made of being laminated with wavelength conversion section part 3 and photic zone 7.
In addition, before process S301, such as prepare that photic zone 7 has been laminated on the second face 3b of wavelength convert component 3
Sheet material.Alternatively, it is also possible to as described above, bias Wavelength conversion substance 40 to the first face side 3a of wavelength convert component 3.
(coating process is carried out by coating component)
As seen in this fig. 17b, carrying out coating process S302 by coating component is to be positioned in sheet material 20 by coating component 5 is coating
On translucent material laminated sheet 25 process.
In process S302, the whole of translucent material laminated sheet 25 is coated by coating component 5.In process S302
In, from the face of sheet material 20 up to the upper surface of photic zone 7 is provided with coating component 5.
Translucent material laminated sheet 25 based on coating component 5 it is coating be for example able to use discharger (distributor) come
It carries out, the discharger is in the upside of fixed sheet material 20, along the vertical direction or horizontal direction etc. can move relative to sheet material 20
Dynamic (movable).The coating of translucent material laminated sheet 25 based on coating component 5 can will constitute quilt by using discharger
The resin etc. for covering component 5 is filled on sheet material 20 to carry out.
In addition, can be also coated by compression forming method, transfer moudling etc..
(process for exposing photic zone)
As shown in Figure 17 C, the process S303 for exposing photic zone is to remove a part of the coating component 5 of 7 side of photic zone
It goes so that the process that photic zone 7 exposes.
It removes in process S303, such as from 7 side of photic zone by the surface of coating component 5 up to photic zone 7 exposes.Make
Method to remove coating component 5, such as have grinding, grinding, sandblasting etc..In addition, in process S303, it can also be by light transmission
A part of layer 7 removes.
In addition, sheet material 20 is removed after exposing photic zone 7.But it is also possible to before exposing photic zone 7, by piece
Material 20 removes.
(process of mounting light-emitting component)
As shown in figure 17d, the process S304 for loading light-emitting component is the first face for making light-emitting surface 1a Yu wavelength convert component 3
The opposite 3a and the process for loading light-emitting component 1.
The process S205 of mounting light-emitting component illustrated by the manufacturing method of process S304 and light emitting device 100C is substantially
It is identical, therefore omit the description here.
(coating process is carried out by reflection component)
As shown in Figure 18 A, carrying out coating process S305 by reflection component is turned by the coating wavelength that is positioned in of reflection component 2
The process for changing the light-emitting component 1 on component 3.
Process S305 is in addition to replacing plate-shaped member 17 (referring to the component with coating component 5 and wavelength convert component 3
(Figure 13 C)), and on the plate-shaped member 18 with coating component 5 and translucent material laminated sheet 25 setting reflection component 2 with
Outside, other are roughly the same with coating process S206 is carried out by reflection component illustrated by the manufacturing method of light emitting device 100C,
Therefore it omits the description here.
(process for exposing electrode)
As shown in figure 18b, the process S306 for exposing electrode is that a part of the reflection component 2 by electrode 11,12 sides is removed
It goes so that the process that the electrode 11,12 of light-emitting component 1 exposes.
The process S207 substantially phase for exposing electrode illustrated by manufacturing method of the process S306 with light emitting device 100C
Together, therefore here it omits the description.
(process cut off)
As shown in figure 18 c, the process S307 cut off be using cutting line to it is multiple arrange along the line of the column direction shine
The process that the aggregate of device 100D is cut off.That is, the process S307 cut off is to being once formed with multiple shine
The process that the aggregate of device 100D carries out singualtion.
Process S307 and the process S208 cut off illustrated in the manufacturing method of light emitting device 100C are substantially
It is identical, therefore omit the description here.In addition, only illustrating two light emitting device 100D in Figure 17 A~Figure 18 C, but actually edge
The arrangement of ranks direction is multiple and is formed, and is cut off in a manner of making one singualtion.
Moreover, passing through the singualtion of the aggregate, multiple light emitting device 100D are obtained.
In addition, the manufacturing method of light emitting device can also in the range of not brought a negative impact to above-mentioned each process,
Between above-mentioned each process or front and back includes other processes.For example, it is also possible to include will manufacture the mixed foreign matter in midway remove it is different
Object removal step etc..
Industrial utilizability
The light emitting device of embodiments of the present invention can be used in the various lighting devices such as flash lamp, the general illumination of camera
In.
Claims (10)
1. a kind of light emitting device, which is characterized in that have:
Light-emitting component, with light-emitting surface and side；
Reflection component is set to the side of the light-emitting component；
Wavelength convert component is arranged on the light-emitting surface of the light-emitting component and on the reflection component；And
Coating component, to being coated from upper end to lower end for the lateral surface of the wavelength convert component,
The coating component contains reflecting material and coloring material,
The body colour of the wavelength convert component and the body colour of the coating component are homology color.
2. light emitting device according to claim 1, which is characterized in that
The coating component is coated the lateral surface of the reflection component.
3. light emitting device according to claim 1 or 2, which is characterized in that the reflecting material is relative to the coating portion
The content of part is 30 mass % or more and 70 mass % or less.
4. light emitting device described in any one of claim 1 to 3, which is characterized in that
The reflection component is provided with via light guide member in the side of the light-emitting component.
5. light emitting device according to any one of claims 1 to 4, which is characterized in that
The coloring material includes either one or two of Wavelength conversion substance, pigment and dyestuff.
6. light emitting device according to claim 5, which is characterized in that the wavelength convert component includes: to be coated with described
The identical Wavelength conversion substance of the composition of the Wavelength conversion substance contained by component.
7. a kind of manufacturing method of light emitting device characterized by comprising
With the first face and with first face of the wavelength convert component in the second face of the opposite side in first face with
The process for making light-emitting surface and the described first aspectant mode load light-emitting component；
The process of the light-emitting component is coated by reflection component；
A part of the wavelength convert component around the light-emitting component is removed, and makes the wavelength convert component
The process that lateral surface exposes；And
By containing reflecting material and coloring material and body colour is coating with the body colour homology color of the wavelength convert component
Component is come the process that is coated the lateral surface of the wavelength convert component.
8. the manufacturing method of light emitting device according to claim 7, which is characterized in that by the one of the wavelength convert component
The process that part removes is carried out from the first surface side of the wavelength convert component.
9. the manufacturing method of light emitting device according to claim 7, which is characterized in that by the one of the wavelength convert component
The process that part removes is carried out from the second surface side of the wavelength convert component.
10. the manufacturing method of the light emitting device according to any one of claim 7~9, which is characterized in that load the hair
Leaded light is arranged in a manner of including: light-emitting surface and at least part of side to be coated the light-emitting component in the process of optical element
The process of component.
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| JP2018123620A JP6658808B2 (en) | 2017-12-25 | 2018-06-28 | Light emitting device and method of manufacturing light emitting device |
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