JP2019106502A - Light emitting device manufacturing method - Google Patents

Light emitting device manufacturing method Download PDF

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JP2019106502A
JP2019106502A JP2017239431A JP2017239431A JP2019106502A JP 2019106502 A JP2019106502 A JP 2019106502A JP 2017239431 A JP2017239431 A JP 2017239431A JP 2017239431 A JP2017239431 A JP 2017239431A JP 2019106502 A JP2019106502 A JP 2019106502A
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light emitting
resin
light
emitting device
reinforcing film
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JP6963177B2 (en
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広樹 由宇
hiroki Yu
広樹 由宇
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

To provide a method of easy mounting a resin member.SOLUTION: A light emitting device manufacturing method includes the steps of: preparing a translucent member 4 including a resin member 2 having a first surface Q and a second surface R opposite to the first surface Q and a reinforcement film 3 which is arranged on the first surface and higher hardness than the resin member 2; preparing a light emitting element having a light emitting surface, an electrode surface opposite to the light emitting surface and a lateral face between the light emitting surface and the electrode surface; bringing a collet 12 into contact with the reinforcement film 3 to hold the translucent member 4 by suction and mounting the translucent member 4 on the light emitting surface of the light emitting element; embedding the light emitting element and the translucent member 4 by a coating member; and removing part of the coating member so as to at least partially expose the translucent member 4.SELECTED DRAWING: Figure 4

Description

本開示は、発光装置の製造方法に関する。   The present disclosure relates to a method of manufacturing a light emitting device.

液晶テレビ用バックライトや照明器具などの光源として、発光素子を備える発光装置が用いられている。このような発光装置として、発光素子の発光面に、蛍光体と樹脂とを含む蛍光体含有の樹脂部材が配置された構造が知られている（例えば、特許文献１）。   A light-emitting device provided with a light-emitting element is used as a light source for a backlight for a liquid crystal television, a lighting apparatus, and the like. As such a light emitting device, there is known a structure in which a phosphor-containing resin member containing a phosphor and a resin is disposed on the light emitting surface of a light emitting element (for example, Patent Document 1).

国際公開第２０１４／００２７８４号International Publication No. 2014/002784

発光装置の製造方法では、発光装置を構成する一部材である樹脂部材を容易に載置する方法が望まれている。   In the manufacturing method of a light-emitting device, the method of mounting easily the resin member which is one member which comprises a light-emitting device is desired.

本発明の実施形態に係る発光装置の製造方法は、以下の工程を備える。
第１面と、第１面の反対側の第２面と、を備える樹脂部材と、第１面上に配置され、樹脂部材よりも硬度が高い補強膜と、を備える透光性部材を準備する工程と、発光面と、発光面の反対側の電極面と、発光面と電極面との間の側面と、を備えた発光素子を準備する工程と、補強膜にコレットを当接させて透光性部材を吸着保持し、発光素子の発光面上に、透光性部材を載置する工程と、発光素子及び透光性部材を、被覆部材で埋設する工程と、透光性部材の少なくとも一部が露出するように、被覆部材の一部を除去する工程と、を含む。 A method of manufacturing a light emitting device according to an embodiment of the present invention includes the following steps.
Preparing a translucent member including a resin member including a first surface and a second surface opposite to the first surface, and a reinforcing film disposed on the first surface and having a hardness higher than that of the resin member Preparing a light emitting element having a light emitting surface, a light emitting surface, an electrode surface opposite to the light emitting surface, and a side surface between the light emitting surface and the electrode surface; A step of suction-holding the light-transmissive member, a step of mounting the light-transmissive member on the light-emitting surface of the light-emitting element, a step of embedding the light-emitting element and the light-transmissive member with a covering member; Removing a portion of the covering member such that at least a portion is exposed.

本発明の実施形態に係る発光装置の製造方法によれば、樹脂部材を載置する際に容易に取り扱うことができる。   According to the method of manufacturing a light emitting device according to the embodiment of the present invention, the resin member can be easily handled when it is placed.

実施形態１の発光装置の製造方法を説明する概略平面図である。5 is a schematic plan view illustrating the method for manufacturing the light emitting device of Embodiment 1. FIG. 図１ＡのＩＢ−ＩＢ線における概略断面図である。It is a schematic sectional drawing in the IB-IB line of FIG. 1A. 実施形態１の発光装置の製造方法を説明する概略平面図である。5 is a schematic plan view illustrating the method for manufacturing the light emitting device of Embodiment 1. FIG. 図２ＡのＩＩＢ−ＩＩＢ線における概略断面図である。It is a schematic sectional drawing in the IIB-IIB line of FIG. 2A. 実施形態１の発光装置の製造方法を説明する概略平面図である。5 is a schematic plan view illustrating the method for manufacturing the light emitting device of Embodiment 1. FIG. 図３ＡのＩＩＩＢ−ＩＩＩＢ線における概略断面図である。It is a schematic sectional drawing in the IIIB-IIIB line of FIG. 3A. 実施形態１の発光装置の製造方法を説明する概略断面図である。5 is a schematic cross-sectional view illustrating the method of manufacturing the light emitting device of Embodiment 1. FIG. 実施形態１の発光装置の製造方法を説明する概略断面図である。5 is a schematic cross-sectional view illustrating the method of manufacturing the light emitting device of Embodiment 1. FIG. 実施形態１の発光装置の製造方法を説明する概略平面図である。5 is a schematic plan view illustrating the method for manufacturing the light emitting device of Embodiment 1. FIG. 図６ＡのＶＩＢ−ＶＩＢ線における概略断面図である。It is a schematic sectional drawing in the VIB-VIB line of FIG. 6A. 実施形態１の発光装置の製造方法を説明する概略平面図である。5 is a schematic plan view illustrating the method for manufacturing the light emitting device of Embodiment 1. FIG. 図７ＡのＶＩＩＢ−ＶＩＩＢ線における概略断面図である。It is a schematic sectional drawing in the VIIB-VIIB line of FIG. 7A. 実施形態１の変形例を示す概略断面図である。FIG. 7 is a schematic cross-sectional view showing a modification of the first embodiment. 実施形態１の発光装置の製造方法を説明する概略平面図である。5 is a schematic plan view illustrating the method for manufacturing the light emitting device of Embodiment 1. FIG. 図８ＡのＶＩＩＩＢ−ＶＩＩＩＢ線における概略断面図である。It is a schematic sectional drawing in the VIIIB-VIIIB line | wire of FIG. 8A. 実施形態１の発光装置の製造方法で得られる発光装置の一例を示す概略断面図である。5 is a schematic cross-sectional view showing an example of a light emitting device obtained by the method of manufacturing a light emitting device of Embodiment 1. FIG. 実施形態２の発光装置の製造方法で得られる発光装置の一例を示す概略断面図である。FIG. 7 is a schematic cross-sectional view showing an example of a light emitting device obtained by the method of manufacturing a light emitting device of Embodiment 2. 実施形態２の発光装置の製造方法を説明する概略断面図である。7 is a schematic cross-sectional view illustrating the method of manufacturing the light emitting device of Embodiment 2. FIG. 実施形態２の発光装置の製造方法を説明する概略断面図である。7 is a schematic cross-sectional view illustrating the method of manufacturing the light emitting device of Embodiment 2. FIG. 実施形態２の変形例を説明する概略断面図である。FIG. 13 is a schematic cross-sectional view for explaining a modification of the second embodiment. 実施形態２の発光装置の製造方法を説明する概略断面図である。7 is a schematic cross-sectional view illustrating the method of manufacturing the light emitting device of Embodiment 2. FIG. 実施形態２の発光装置の製造方法を説明する概略断面図である。7 is a schematic cross-sectional view illustrating the method of manufacturing the light emitting device of Embodiment 2. FIG. 実施形態２の発光装置の製造方法を説明する概略断面図である。7 is a schematic cross-sectional view illustrating the method of manufacturing the light emitting device of Embodiment 2. FIG.

以下、本発明の実施形態について適宜図面を参照して説明する。ただし、以下に説明する発光装置及びその製造方法は、実施形態の技術的思想を具現化するためのものであって、以下に限定するものではない。特に、構成部品の寸法、材質、形状、その相対的配置等は、本発明の技術的範囲を限定するものではなく、単なる説明例であり、説明を明確にするために誇張していることがある。以下に記載される実施形態は、各構成等を適宜組み合わせて適用できる。また、樹脂部材、補強膜、透光性部材、被覆部材は、これらの硬化工程の前後や個片化工程の前後において、同じ名称を用いて説明する場合がある。   Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the light emitting device and the manufacturing method thereof to be described below are for embodying the technical idea of the embodiment, and are not limited to the following. In particular, the dimensions, materials, shapes, relative positions, etc. of the component parts do not limit the technical scope of the present invention, and are merely illustrative examples, and are exaggerated to clarify the explanation. is there. The embodiments described below can be applied by appropriately combining each configuration and the like. In addition, the resin member, the reinforcing film, the light transmitting member, and the covering member may be described using the same names before and after the curing process and before and after the singulation process.

＜実施形態１＞
図９は、実施形態１に係る発光装置の製造方法で得られる発光装置１００の一例である。発光装置１００は、発光素子６と、透光性の樹脂部材２と、光反射性の被覆部材８と、を備える。樹脂部材２は発光素子６の発光面Ｔ上に配置され、被覆部材８は、発光素子６の側面及び樹脂部材２の側面を被覆するように配置される。このような構成の発光装置１００の製造方法について、以下、説明する。 First Embodiment
FIG. 9 is an example of a light emitting device 100 obtained by the method of manufacturing a light emitting device according to the first embodiment. The light emitting device 100 includes a light emitting element 6, a light transmitting resin member 2, and a light reflecting covering member 8. The resin member 2 is disposed on the light emitting surface T of the light emitting element 6, and the covering member 8 is disposed to cover the side surface of the light emitting element 6 and the side surface of the resin member 2. Hereinafter, a method of manufacturing the light emitting device 100 having such a configuration will be described.

実施形態１の発光装置１００の製造方法は、主として以下の工程を備える。
（１）第１面Ｑと、第１面Ｑの反対側の第２面Ｒと、を備える樹脂部材２と、第２面Ｒ上に配置され、樹脂部材２よりも硬度が高い補強膜３と、を備える透光性部材４を準備する工程
（２）発光面Ｔと、発光面Ｔの反対側の電極形成面Ｖと、発光面Ｔと電極形成面Ｖとの間の側面Ｗと、を備えた発光素子６を準備する工程
（３）補強膜３にコレット１２を当接させて透光性部材４を吸着保持し、発光素子６の発光面Ｔ上に、透光性部材４を載置する工程
（４）発光素子６及び透光性部材４を、被覆部材８で埋設する工程
（５）透光性部材４の少なくとも一部が露出するように、被覆部材８の一部を除去する工程
を含む。 The method of manufacturing the light emitting device 100 according to the first embodiment mainly includes the following steps.
(1) The resin member 2 including the first surface Q and the second surface R opposite to the first surface Q, and the reinforcing film 3 disposed on the second surface R and having a hardness higher than that of the resin member 2 And (2) a light emitting surface T, an electrode forming surface V on the opposite side of the light emitting surface T, and a side surface W between the light emitting surface T and the electrode forming surface V; (3) The collet 12 is brought into contact with the reinforcing film 3 to adsorb and hold the translucent member 4, and the translucent member 4 is placed on the light emitting surface T of the light emitting element 6. Step of mounting (4) Step of embedding the light emitting element 6 and the light transmitting member 4 by the covering member 8 (5) a part of the covering member 8 so that at least a part of the light transmitting member 4 is exposed. Including the step of removing.

実施形態１の発光装置１００の製造方法を、図１Ａ〜図８Ｂを用いて説明する。   A method of manufacturing the light emitting device 100 of Embodiment 1 will be described with reference to FIGS. 1A to 8B.

（１）透光性部材４を準備する工程
第１面Ｑと、第１面Ｑの反対側の第２面Ｒと、を備えた樹脂部材２を準備する。樹脂部材２の詳細については、後述する。 (1) Step of Preparing Translucent Member 4 A resin member 2 provided with a first surface Q and a second surface R opposite to the first surface Q is prepared. Details of the resin member 2 will be described later.

支持部材１の上面と、樹脂部材２の第１面Ｑとを対向させるようにして、支持部材１の上面Ｚ上に樹脂部材２を配置する。ここでは、後に切断することで複数の個片化された樹脂部材２が得られるような大きさの大面積の樹脂部材２を配置する。
詳細には、図１Ａ及び図１Ｂに示すように、樹脂部材２を支持部材１の上面Ｚ上に配置する。支持部材１は、例えば、樹脂シートを用いることができる。支持部材１は、個片化前の樹脂部材２を配置できる大きさとすることができる。樹脂部材２は、例えば、支持部材１の上面Ｚ上に、樹脂部材２の材料となる硬化前の樹脂材料を印刷、スプレー等によって直接形成することができる。あるいは、上述の方法や、金型を用いた成形等によって別途形成した樹脂部材２を、支持部材１上に載置してもよい。 The resin member 2 is disposed on the upper surface Z of the support member 1 so that the upper surface of the support member 1 faces the first surface Q of the resin member 2. Here, the large-area resin member 2 is disposed such that the plurality of singulated resin members 2 can be obtained by cutting later.
In detail, as shown in FIGS. 1A and 1B, the resin member 2 is disposed on the upper surface Z of the support member 1. For example, a resin sheet can be used as the support member 1. The support member 1 can be made into the magnitude | size which can arrange | position the resin member 2 before singulation. For example, the resin member 2 can be formed directly on the upper surface Z of the support member 1 by printing, spraying or the like before being cured, which is the material of the resin member 2. Alternatively, the resin member 2 separately formed by the above-described method or molding using a mold may be placed on the support member 1.

支持部材１の上面Ｚ上に樹脂部材２を載置する場合、例えば、粘着層を有する支持部材１の上面Ｚ上に樹脂部材２を固定することができる。このような粘着層を有する支持部材１として、例えば、ＵＶ硬化型の粘着層を有するダイシングテープ等の当該分野で公知のものを用いることができる。   When the resin member 2 is placed on the upper surface Z of the support member 1, for example, the resin member 2 can be fixed on the upper surface Z of the support member 1 having the adhesive layer. As the support member 1 having such a pressure-sensitive adhesive layer, for example, those known in the art such as a dicing tape having a UV-curable pressure-sensitive adhesive layer can be used.

樹脂部材２は、例えば、ショアＡ硬度１５〜６５の硬さであり、単層、又は、複数の層を備える積層体を用いることができる。樹脂部材２は、発光装置１００の光取り出し面を構成する部材であるため、透過率の高い材料が選択される。さらに耐光性や耐熱性に優れる材料も適している。そのため、取扱いにくい硬さの材料等が選択されることがある。例えば、シリコーン系樹脂は、光学特性に優れた材料であり、発光装置の発光面を構成するのに適した材料である。しかしながら、シリコーン系樹脂は、軟らかくタック性が高いため、工程内等において取扱いにくい（ハンドリングが難しい）場合がある。実施形態１では、このような取扱いにくい樹脂部材２に補強膜３を形成することで、取扱い易い透光性部材４としている。詳細には、樹脂部材２に、それよりも硬度の高い補強膜３を付けることで、樹脂部材２のみの場合に比して硬度の高い透光性部材４とすることで工程内での取扱い性を良好にしている。これにより、予期せぬ部分への樹脂部材２引っ付き等を抑制することができ、歩留の低下を抑制することができる。   The resin member 2 has, for example, a hardness of Shore A hardness 15 to 65, and a single layer or a laminate including a plurality of layers can be used. Since the resin member 2 is a member that constitutes the light extraction surface of the light emitting device 100, a material with high transmittance is selected. Furthermore, materials having excellent light resistance and heat resistance are also suitable. Therefore, a hard material or the like that is difficult to handle may be selected. For example, a silicone resin is a material having excellent optical properties, and is a material suitable for forming the light emitting surface of a light emitting device. However, since the silicone resin is soft and has high tackiness, it may be difficult to handle (hard to handle) in a process or the like. In the first embodiment, the reinforcing film 3 is formed on such a difficult-to-handle resin member 2 to make the light-transmissive member 4 easy to handle. Specifically, by attaching the reinforcing film 3 having a hardness higher than that to the resin member 2, the translucent member 4 having a hardness higher than that of the resin member 2 alone is handled in the process. It has good sex. As a result, it is possible to suppress the resin member 2 sticking to an unexpected portion and the like, and to suppress a decrease in yield.

樹脂部材２の厚みは、例えば、５０μｍ〜２５０μｍとすることができる。樹脂部材２を積層させる場合は、その合計の厚みが、上記の範囲とすることができる。   The thickness of the resin member 2 can be, for example, 50 μm to 250 μm. When laminating the resin member 2, the total thickness can be made into said range.

大面積の樹脂部材２の平面形状は、円形、楕円形、三角形、四角形及び六角形等の多角形等のいずれであってもよい。また、樹脂部材２の厚みは、目的とする配光特性や樹脂部材２の特性等に応じて、適宜選択することができる。図１Ａは、樹脂部材２の一例として、平面形状が矩形の樹脂部材２を図示している。   The planar shape of the large-area resin member 2 may be any of a circle, an ellipse, a triangle, and a polygon such as a square and a hexagon. Further, the thickness of the resin member 2 can be appropriately selected in accordance with the target light distribution characteristic, the characteristic of the resin member 2 and the like. FIG. 1A illustrates a resin member 2 having a rectangular planar shape as an example of the resin member 2.

次に、樹脂部材２の第１面Ｒ上に補強膜３を形成する。補強膜３は、樹脂部材２よりも硬度の高い膜である。これにより、樹脂部材２と補強膜３とが積層された構造の透光性部材４が得られる。この時点では、個片化されていない大面積の透光性部材４である。   Next, the reinforcing film 3 is formed on the first surface R of the resin member 2. The reinforcing film 3 is a film having a hardness higher than that of the resin member 2. Thereby, the translucent member 4 of the structure where the resin member 2 and the reinforcement film 3 were laminated | stacked is obtained. At this time, it is the translucent member 4 of the large area which is not separated into pieces.

補強膜３は、図２Ｂに示すように、大面積の樹脂部材２の側面及び、樹脂部材２が配置されていない支持部材１の上面Ｚ上に形成してもよい。   The reinforcing film 3 may be formed on the side surface of the large-area resin member 2 and the upper surface Z of the support member 1 where the resin member 2 is not disposed, as shown in FIG. 2B.

補強膜３の材料としては、金属材料や、樹脂材料、無機材料等が挙げられる。
金属材料は、原子層堆積法（ＡＬＤ）、ＣＶＤ、スパッタ、蒸着、箔を貼り合わせる、のいずれかで形成することができる。特に、スパッタによれば容易に補強膜３を形成することができる。 Examples of the material of the reinforcing film 3 include metal materials, resin materials, inorganic materials and the like.
The metal material can be formed by any of atomic layer deposition (ALD), CVD, sputtering, vapor deposition, and bonding of foils. In particular, the reinforcing film 3 can be easily formed by sputtering.

樹脂材料は、塗布、スプレー、板やシートの貼り合わせ、のいずれかで形成することができる。   The resin material can be formed by any of coating, spraying, and lamination of plates and sheets.

無機材料は、ＡＬＤ、ＣＶＤ、スパッタ、蒸着、板やシートの貼り合わせ、のいずれかで形成することができる。   The inorganic material can be formed by any of ALD, CVD, sputtering, vapor deposition, and plate or sheet bonding.

次に、大面積の透光性部材４を個片化する。具体的には、図３Ａ及び図３Ｂに示すように、透光性部材４を、上面視において直交する縦切断ライン及び横切断ラインに沿って切断（除去部５を除去）し、透光性部材４を個片化して所望の大きさとする。透光性部材４の個片化の方法は、当該分野で公知の切断方法、例えば、ブレードを用いたブレードダイシングや、レーザダイシング、カッタースクライブ、ドリル、マスクを用いてのブラスト等を利用することができる。   Next, the large-area translucent member 4 is singulated. Specifically, as shown in FIG. 3A and FIG. 3B, the light-transmissive member 4 is cut along the vertical cutting line and the horizontal cutting line orthogonal to each other in top view (removal of the removed portion 5) The member 4 is singulated to a desired size. A method of singulating the light-transmissive member 4 is a cutting method known in the art, for example, blade dicing using a blade, laser dicing, cutter scribing, drill, blast using a mask, etc. Can.

個片化された透光性部材４の平面形状は、円形、楕円形、三角形、四角形及び六角形等の多角形等のいずれであってもよい。   The planar shape of the singulated translucent member 4 may be any of a circle, an ellipse, a triangle, and a polygon such as a square and a hexagon.

（２）発光素子を準備する工程
次に、発光素子６を準備する。発光素子６は、少なくとも発光層を含む半導体層を含む半導体積層構造体６ｃと、正負一対の電極６ａ、６ｂを有する。発光素子６は、発光面Ｔと、発光面Ｔの反対側であって、電極６ａ、６ｂが形成された電極面Ｖと、発光面Ｔと電極面Ｖとの間の側面Ｗと、を備える。図５は、後述の透光性部材４を載置する工程後の図面であるが、この図５に示すように、発光素子６の電極面Ｖと支持部材７の上面Ｕと対向させて配置する。このように、ウエハ状態から個片化された発光素子６は、例えば、発光特性等の選別を行った後に、所望の特性を有するものを選択的に用いることで、歩留まりよく発光装置を形成することができる。 (2) Step of Preparing Light Emitting Element Next, the light emitting element 6 is prepared. The light emitting element 6 includes a semiconductor multilayer structure 6c including a semiconductor layer including at least a light emitting layer, and a pair of positive and negative electrodes 6a and 6b. The light emitting element 6 includes a light emitting surface T, an electrode surface V opposite to the light emitting surface T, on which the electrodes 6a and 6b are formed, and a side surface W between the light emitting surface T and the electrode surface V. . FIG. 5 is a drawing after the step of mounting the light-transmissive member 4 described later. As shown in FIG. 5, the electrode surface V of the light-emitting element 6 and the upper surface U of the support member 7 are disposed opposite to each other. Do. As described above, the light emitting elements 6 separated from the wafer state, for example, after selecting the light emission characteristics and the like, selectively use those having the desired characteristics to form the light emitting device with high yield. be able to.

発光素子６の平面形状は、円形、楕円形、三角形、四角形及び六角形等の多角形等のいずれであってもよい。また、発光素子６の大きさ及び厚みは、適宜選択することができる。図５では、一例として平面形状が矩形の発光素子６を用いている。   The planar shape of the light emitting element 6 may be any of a circle, an ellipse, a triangle, and a polygon such as a square and a hexagon. Further, the size and thickness of the light emitting element 6 can be appropriately selected. In FIG. 5, the light emitting element 6 having a rectangular planar shape is used as an example.

（３）透光性部材４を載置する工程
図４に示すように、真空吸着可能なコレット１２を、個片化された透光性部材４の補強膜３に当接させる。コレット１２で透光性部材４を吸着することで、支持部材１から透光性部材４を取り外してピックアップする。透光性部材４を保持した状態でコレット１２を移動させる。その後、図５に示すように、支持部材７に配置された発光素子６の発光面Ｔ上に、透光性部材４を載置する。 (3) Step of Mounting Translucent Member 4 As shown in FIG. 4, the collet 12 capable of vacuum adsorption is brought into contact with the reinforcing film 3 of the singulated translucent member 4. By adsorbing the light-transmissive member 4 with the collet 12, the light-transmissive member 4 is removed from the support member 1 and picked up. The collet 12 is moved while holding the translucent member 4. Thereafter, as shown in FIG. 5, the translucent member 4 is placed on the light emitting surface T of the light emitting element 6 disposed on the support member 7.

図５に示すように、支持部材７の上面Ｕ上に、あらかじめ発光素子６を配置している。複数の発光素子６を、等間隔で列状又は行状に配置することで、後工程において被覆部材８を切断し易い。特に、上面視形状が矩形の発光素子６を用い、隣接する発光素子６の側面Ｗ同士が平行となるように配置することで、被覆部材８を切断し易い。   As shown in FIG. 5, the light emitting element 6 is disposed in advance on the upper surface U of the support member 7. By arranging the plurality of light emitting elements 6 in a line or row at equal intervals, the covering member 8 can be easily cut in a later step. In particular, the covering member 8 can be easily cut by using the light emitting element 6 having a rectangular shape in top view and arranging the side faces W of the adjacent light emitting elements 6 to be parallel.

尚、発光素子６の発光面Ｔ上には、透光性部材４を載置する前に、あらかじめ接着剤を配置しておくことが好ましい。接着剤としては、例えば、透光性の樹脂等を用いることができる。特に、透過率の高い樹脂を用いることが好ましい。具体的には、シリコーン樹脂等が挙げられる。   In addition, it is preferable to dispose an adhesive on the light emitting surface T of the light emitting element 6 in advance before mounting the light transmitting member 4. As an adhesive agent, translucent resin etc. can be used, for example. In particular, it is preferable to use a resin having a high transmittance. Specifically, silicone resin etc. are mentioned.

（４）被覆部材を形成する工程
次に、被覆部材８を形成する。図６Ａ及び図６Ｂに示すように、発光素子６の側面Ｗと、透光性部材４の側面と、を被覆する被覆部材８を形成する。具体的には、支持部材７の上面Ｕに、配置された複数の発光素子６の側面Ｗと、透光性部材４の側面と透光性部材４の上面を被覆する被覆部材８を形成する。また、被覆部材８は、発光素子６の電極面Ｖ及び電極６ａ、６ｂの側面も被覆することが好ましい。これにより、被覆部材８と発光素子６の剥離や、発光素子６の損傷を抑制することができる。ここでは、複数の発光素子６及び透光性部材４を、一体的に被覆するように被覆部材８を形成する例を示している。 (4) Step of Forming a Cover Member Next, the cover member 8 is formed. As shown to FIG. 6A and FIG. 6B, the covering member 8 which covers the side W of the light emitting element 6 and the side of the translucent member 4 is formed. Specifically, on the upper surface U of the support member 7, the covering member 8 for covering the side surfaces W of the plurality of light emitting elements 6 arranged, the side surface of the light transmitting member 4 and the upper surface of the light transmitting member 4 is formed. . Moreover, it is preferable that the covering member 8 also covers the electrode surface V of the light emitting element 6 and the side surfaces of the electrodes 6a and 6b. Thereby, peeling of the covering member 8 and the light emitting element 6 and damage to the light emitting element 6 can be suppressed. Here, an example in which the covering member 8 is formed so as to integrally cover the plurality of light emitting elements 6 and the light transmitting member 4 is shown.

被覆部材８は、光反射性の樹脂材料である。被覆部材８は、トランスファーモールド、コンプレッションモールド、スクリーン印刷、ポッティング、スプレー等の方法で形成することができる。特に、発光素子６の上に透光性部材４を載置した積層構造体を、比較的狭い間隔で配置させる場合は圧縮成形、コンプレッションモールド、トランスファーモールド等の金型を用いた成形方法が好ましい。これにより、狭い空間領域にも被覆部材８を形成することができる。   The covering member 8 is a light reflective resin material. The covering member 8 can be formed by methods such as transfer molding, compression molding, screen printing, potting, and spraying. In particular, when the laminated structure in which the light-transmissive member 4 is placed on the light emitting element 6 is arranged at relatively narrow intervals, a molding method using a mold such as compression molding, compression mold, transfer mold is preferable. . Thereby, the covering member 8 can be formed also in the narrow space area.

（５）透光性部材４を露出させる工程
次に、図７Ａ及び図７Ｂに示すように、発光素子６の上方に配置される被覆部材８及び補強膜３８の一部（発光素子の上方に配置される除去部９）を除去することで、透光性部材４を被覆部材８の表面（上面）から露出させる。これにより、発光素子６から出力される光を、透光性部材４を介して発光装置１００の外へ出力することができる。尚、補強膜３が透光性の場合は、図７Ｃに示すように、補強膜３の一部又は全部を残してもよい。このような透光性の補強膜３としては、ガラスや、ＳｉＯ２膜などが挙げられる。 (5) Step of Exposing the Light Transmissible Member 4 Next, as shown in FIGS. 7A and 7B, a part of the covering member 8 and the reinforcing film 38 disposed above the light emitting element 6 (above the light emitting element The translucent member 4 is exposed from the surface (upper surface) of the covering member 8 by removing the disposed removal portion 9). Thus, the light output from the light emitting element 6 can be output to the outside of the light emitting device 100 through the translucent member 4. When the reinforcing film 3 is translucent, as shown in FIG. 7C, a part or all of the reinforcing film 3 may be left. Glass, a SiO 2 film, etc. are mentioned as such a translucent reinforcement film 3.

透光性部材４の露出は、研削、ルーター、切断、エッチングなどの方法を用いることができる。発光装置から出力される光をできるだけ均一に出力する為に、この工程においては被覆部材８と透光性部材４との上面が略同一平面となるように平坦とすることが好ましい。このような観点および量産性を向上させる観点から、透光性部材４を露出する方法は、研削が好ましい。   The exposure of the translucent member 4 can use methods, such as grinding, a router, cutting, and an etching. In order to output the light output from the light emitting device as uniformly as possible, in this process, it is preferable to flatten the upper surface of the covering member 8 and the upper surface of the light transmitting member 4 so as to be substantially the same plane. From such a viewpoint and a viewpoint of improving mass productivity, grinding is preferable as a method of exposing the translucent member 4.

（６）発光装置の個片化
次に、被覆部材８の一部を除去することで、個片化された発光装置を得る。具体的には、図８Ａ及び図８Ｂに示すように、支持部材７の上面Ｕに配置された複数の発光素子６と透光性部材４の積層構造体の間の被覆部材８を、透光性部材４の被覆部材８から露出した部分に対して略垂直に交差する方向に切断する。これにより、発光装置を個片化することができる。 (6) Individualization of Light Emitting Device Next, a part of the covering member 8 is removed to obtain an individualized light emitting device. Specifically, as shown in FIGS. 8A and 8B, the covering member 8 between the plurality of light emitting elements 6 disposed on the upper surface U of the support member 7 and the light transmitting member 4 is light transmitted. It cuts in a direction substantially perpendicular to the portion exposed from the covering member 8 of the sexing member 4. Thus, the light emitting device can be singulated.

発光装置を個片化するための被覆部材８の一部除去は、当該分野で公知の切断方法、例えば、ブレードを用いたブレードダイシングや、レーザダイシング、カッタースクライブ、ドリル、マスクを用いてのブラスト等を利用することができる。   Partial removal of the covering member 8 for singulating the light emitting device can be performed by a cutting method known in the art, such as blade dicing using a blade, laser dicing, cutter scribing, drill, and blast using a mask. Etc. can be used.

なお、発光装置の個片化は、上述の透光性部材４の露出工程の前に行ってもよい。透光性部材４の露出工程後に個片化する場合は、露出された透光性部材４の位置をカメラで確認しながら切断（除去部１０を除去）することができるため、発光装置の量産性や切断位置の精度を高めることができ好ましい。また、被覆部材８を成形する際に、１つの透光性部材４及び１つの発光素子６を被覆するよう成形する場合は、上述の個片化工程（切断工程）を省略することができる。   The singulation of the light emitting device may be performed before the above-described exposure step of the light-transmissive member 4. In the case of singulating the light-transmissive member 4 after the exposure step, the light-emitting device can be mass-produced because the position of the exposed light-transmissive member 4 can be cut (the removal portion 10 is removed) while confirming with the camera. It is preferable because it can improve the accuracy of the cutting and the cutting position. When molding the covering member 8 so as to cover one light transmitting member 4 and one light emitting element 6, the above-described singulation step (cutting step) can be omitted.

＜実施形態２＞
図１０は、実施形態２に係る発光装置の製造方法で得られる発光装置１００Ａの一例である。発光装置１００Ａは、発光素子６と、透光性の樹脂部材２と、樹脂部材２の側面Ｓに配置される補強膜３Ａと、光反射性の被覆部材８と、を備える。樹脂部材２は発光素子６の発光面Ｔ上に配置され、被覆部材８は、発光素子６の側面及び補強膜３Ａの側面を被覆するように配置される。このような構成の発光装置１００Ａの製造方法について、主に実施形態１と異なる点について説明する。 Second Embodiment
FIG. 10 is an example of a light emitting device 100A obtained by the method of manufacturing a light emitting device according to the second embodiment. The light emitting device 100A includes the light emitting element 6, the light transmitting resin member 2, the reinforcing film 3A disposed on the side surface S of the resin member 2, and the light reflecting covering member 8. The resin member 2 is disposed on the light emitting surface T of the light emitting element 6, and the covering member 8 is disposed to cover the side surface of the light emitting element 6 and the side surface of the reinforcing film 3A. The difference between the method of manufacturing the light emitting device 100A having such a configuration and the first embodiment will be mainly described.

実施形態２の発光装置１００Ａの製造方法は、実施形態１における透光性部材４を準備する工程において、樹脂部材２を切断した後に、樹脂部材２の第２面Ｒ上の補強膜３及び樹脂部材２の側面Ｓ上の補強膜３Ａを形成する点が異なる。そのため、樹脂部材２の第２面Ｒ上に加え、樹脂部材２の側面Ｓ上にも補強膜３Ａが配置される。   In the method of manufacturing light emitting device 100A of the second embodiment, in the step of preparing light transmitting member 4 in the first embodiment, after cutting resin member 2, reinforcing film 3 on the second surface R of resin member 2 and the resin The point of forming the reinforcing film 3A on the side surface S of the member 2 is different. Therefore, in addition to the second surface R of the resin member 2, the reinforcing film 3 </ b> A is disposed also on the side surface S of the resin member 2.

まず、図１Ａ、図１Ｂに示すように、支持部材１の上面Ｚ上に樹脂部材２を配置する工程は、実施形態１と同様である。ここでは、後に切断することで複数の個片化された樹脂部材２が得られるような大きさの大面積の樹脂部材２を配置する。   First, as shown in FIGS. 1A and 1B, the step of arranging the resin member 2 on the upper surface Z of the support member 1 is the same as that of the first embodiment. Here, the large-area resin member 2 is disposed such that the plurality of singulated resin members 2 can be obtained by cutting later.

次に、図１１に示すように、樹脂部材２の一部を除去することで、個片化された樹脂部材２が得られる。樹脂部材２の平面形状は、円形、楕円形、三角形、四角形及び六角形等の多角形等のいずれであってもよい。   Next, as shown in FIG. 11, by removing a part of the resin member 2, the singulated resin member 2 is obtained. The planar shape of the resin member 2 may be any of a circle, an ellipse, a triangle, and a polygon such as a square and a hexagon.

個片化された樹脂部材２と隣接する樹脂部材２との間隔は、任意に設定することができる。例えば、隣接する樹脂部材２の間隔は、補強膜３Ａの厚み以上であることが好ましく、例えば、０．１μｍ〜３００μｍ程度とすることができる。このような間隔を空けて配置することで、後の工程において補強膜３Ａを形成する工程において、樹脂部材２の側面Ｓに、補強膜３Ａを形成し易い。また、透光性部材４のハンドリングがしやすく、効率よく発光装置を製造することができる。   The distance between the individualized resin member 2 and the adjacent resin member 2 can be set arbitrarily. For example, the distance between the adjacent resin members 2 is preferably equal to or greater than the thickness of the reinforcing film 3A, and can be, for example, about 0.1 μm to 300 μm. By arranging with such an interval, it is easy to form the reinforcing film 3A on the side surface S of the resin member 2 in the process of forming the reinforcing film 3A in the later process. In addition, the light-transmissive member 4 can be easily handled, and the light-emitting device can be efficiently manufactured.

次に、図１２Ａに示すように、補強膜３、３Ａを形成する。このとき、樹脂部材２の第２面Ｒ及び側面Ｓに連続する補強膜３、３Ａが形成される。樹脂部材２の間に露出している支持部材１の上面Ｚ上にも補強膜３Ａが形成される。支持部材１上の補強膜は、除去することが好ましい。特に、補強膜３、３Ａとして展性の高い金属材料を用いる場合は、支持部材１上の補強膜が引っ付いたまま、透光性部材４Ａをピッククアップする可能性があるため、除去することが好ましい。補強膜３、３Ａとして、例えば、ＳｉＯ２等をスパッタで形成した場合などは、支持部材１上の補強膜と、樹脂部材２の側面Ｓに形成された補強膜３Ａとの間で切断され易いため、支持部材１上の補強膜を除去する工程を省略することができる。 Next, as shown in FIG. 12A, reinforcing membranes 3 and 3A are formed. At this time, reinforcing films 3 and 3A continuous to the second surface R and the side surface S of the resin member 2 are formed. The reinforcing film 3A is also formed on the upper surface Z of the support member 1 exposed between the resin members 2. The reinforcing membrane on the support member 1 is preferably removed. In particular, in the case of using a highly malleable metal material as the reinforcing films 3 and 3A, it is possible to pick up the light-transmissive member 4A while the reinforcing film on the support member 1 is attached. preferable. For example, when SiO 2 or the like is formed by sputtering as the reinforcing films 3 and 3A, it is easy to be cut between the reinforcing film on the support member 1 and the reinforcing film 3A formed on the side surface S of the resin member 2 Therefore, the process of removing the reinforcing film on the support member 1 can be omitted.

また、補強膜３、３Ａとして、例えば、光反射性の樹脂材料を用いる場合は、図１２Ｂに示すように、隣接する樹脂部材２の間を充填するような厚みの補強膜３Ａとしてもよい。このような場合は、支持部材上の補強膜３Ａを切断する工程を備えることで、透光性部材４Ａを形成することができる。   When a light reflective resin material is used as the reinforcing films 3 and 3A, for example, as shown in FIG. 12B, the reinforcing film 3A may be thick enough to fill the space between adjacent resin members 2. In such a case, the translucent member 4A can be formed by including the step of cutting the reinforcing film 3A on the support member.

以上のようにして形成された透光性部材４Ａを、コレットを用いてピックアップし、図１３に示すように発光素子６上に載置する。次に、透光性部材４Ａ及び発光素子６を、図１４に示すように被覆部材８で被覆する。次に、図１５に示すように、被覆部材８と、樹脂部材２の上面に形成された補強膜３とを除去した後、被覆部材８を切断することで、図１０に示す発光装置１００Ａを得ることができる。   The translucent member 4A formed as described above is picked up using a collet, and mounted on the light emitting element 6 as shown in FIG. Next, the translucent member 4A and the light emitting element 6 are covered with the covering member 8 as shown in FIG. Next, as shown in FIG. 15, after removing the covering member 8 and the reinforcing film 3 formed on the upper surface of the resin member 2, the covering member 8 is cut to obtain the light emitting device 100A shown in FIG. You can get it.

以下、実施形態の発光装置及びその製造方法における各構成部材について説明する。   Hereinafter, each component in the light emitting device of the embodiment and the method for manufacturing the same will be described.

（支持部材１、７）
支持部材１は、シート状の樹脂、セラミックス、ガラス等を用いることができる。特に、耐熱性の観点から、シート状のＵＶシートを用いることが好ましい。支持部材１の平面形状、大きさ、厚み等は、配置する樹脂部材２の大きさや数によって適宜調整することができる。特に、均一な厚みを有し、その表面が平坦なシート状の支持部材１であると、樹脂部材２を安定的に配置しやすく好ましい。 (Support members 1, 7)
The support member 1 can use sheet-like resin, ceramics, glass or the like. In particular, it is preferable to use a sheet-like UV sheet from the viewpoint of heat resistance. The planar shape, size, thickness and the like of the support member 1 can be appropriately adjusted depending on the size and the number of the resin members 2 to be disposed. In particular, when the support member 1 is a sheet-like support member 1 having a uniform thickness and a flat surface, the resin member 2 can be stably disposed, which is preferable.

（樹脂部材２）
樹脂部材２は、透光性部材４、４Ａの一部を構成する部材であり、発光素子から出射される光に対して透光性（例えば光透過率５０％以上、好ましくは７０％以上、より好ましくは８５％以上）を有するものであればよい。樹脂部材２の母材は、シリコーン樹脂、エポキシ樹脂、フェノール樹脂、ポリカーボネート樹脂、アクリル樹脂、又はこれらの変性樹脂若しくはハイブリッド樹脂を用いることができる。なかでも、シリコーン樹脂又はその変性樹脂若しくはハイブリッド樹脂は、耐熱性及び耐光性に優れ、好ましい。樹脂部材２は、これらの母材のうちの１種を単層で、若しくはこれらの母材のうちの２種以上を積層して構成することができる。 (Resin member 2)
The resin member 2 is a member that constitutes a part of the light-transmissive members 4 and 4A, and is translucent to light emitted from the light-emitting element (for example, light transmittance 50% or more, preferably 70% or more, More preferably, it has 85% or more). As a base material of the resin member 2, silicone resin, epoxy resin, phenol resin, polycarbonate resin, acrylic resin, or modified resin or hybrid resin thereof can be used. Among them, silicone resins or modified resins or hybrid resins thereof are preferable because they are excellent in heat resistance and light resistance. The resin member 2 can be configured by forming one of these base materials in a single layer or by laminating two or more of these base materials.

（補強膜３、３Ａ）
補強膜３、３Ａは、透光性部材４、４Ａの一部を構成する部材であり、材料によっては、発光装置の一部を構成する部材である。補強膜３、３Ａの材料としては、例えば、金属材料や、樹脂材料、無機材料等が挙げられる。補強膜３、３Ａは、強度の観点から、金属材料の単体又は合金、樹脂材料を用いることが好ましい。特に、補強膜３、３Ａに用いられる金属材料としては、銀、アルミニウム、又はこれらの合金が好ましい。金属材料からなる補強膜３、３Ａの厚みは、例えば、１μｍ〜１０μｍとすることができる。また、金属材料からなる補強膜３、３Ａの硬度は、例えば、ＨＶ２２〜３８８である。 (Reinforcement membrane 3, 3A)
The reinforcing films 3 and 3A are members constituting a part of the light transmitting members 4 and 4A, and depending on the material, are members constituting a part of the light emitting device. As a material of reinforcement film 3 and 3A, a metal material, resin material, an inorganic material etc. are mentioned, for example. The reinforcing films 3 and 3A are preferably made of a single metal material, an alloy, or a resin material from the viewpoint of strength. In particular, silver, aluminum, or an alloy thereof is preferable as the metal material used for the reinforcing films 3 and 3A. The thickness of the reinforcing films 3 and 3A made of a metal material can be, for example, 1 μm to 10 μm. The hardness of the reinforcing films 3 and 3A made of a metal material is, for example, HV 22 to 388.

補強膜３、３Ａに用いられる樹脂材料としては、樹脂材料としては、熱可塑性樹脂、又は、熱硬化性樹脂のいずれでもよい。例えば、アクリル樹脂、ＡＢＳ樹脂、フッ素樹脂であることが好ましい。また、補強膜３、３Ａの厚さは、ピックアップする為に十分な強度を確保できればよいが材料損失を考慮すると１ｎｍ〜１００ｎｍであることが好ましい。このような比較的薄い補強膜であれば、小型の発光装置を形成することができる。また、透光性、光反射性のいずれでもよい。樹脂材料からなる補強膜３の厚みは材料等にもよるが、例えば、１０μｍ〜１５０μｍとすることができる。また、樹脂材料からなる補強膜３の硬度は、例えば、ショアＤ硬度１４〜２８である。また、補強膜として用いられる樹脂材料は、透光性又は光反射性とすることができる。   As a resin material used for reinforcement film 3 and 3A, as a resin material, any of a thermoplastic resin or a thermosetting resin may be sufficient. For example, acrylic resin, ABS resin, and fluorine resin are preferable. The thickness of the reinforcing films 3 and 3A is only required to ensure sufficient strength for pickup, but is preferably 1 nm to 100 nm in consideration of material loss. With such a relatively thin reinforcing film, a compact light emitting device can be formed. Further, it may be light transmissive or light reflective. The thickness of the reinforcing film 3 made of a resin material may be, for example, 10 μm to 150 μm although it depends on the material and the like. The hardness of the reinforcing film 3 made of a resin material is, for example, Shore D hardness 14 to 28. Further, the resin material used as the reinforcing film can be made translucent or light reflective.

補強膜３、３Ａに用いられる無機材料としては、例えば、ガラス、セラミックス等が挙げられる。無機材料からなる補強膜３、３Ａの厚みは、例えば、１μｍ〜１０μｍとすることができる。また、無機材料からなる補強膜３、３Ａの硬度は、例えば、ＨＶ６４０〜２３００である。   As an inorganic material used for reinforcement film 3 and 3A, glass, ceramics, etc. are mentioned, for example. The thickness of the reinforcing films 3 and 3A made of an inorganic material can be, for example, 1 μm to 10 μm. The hardness of the reinforcing films 3 and 3A made of an inorganic material is, for example, HV 640 to 2300.

（発光素子６）
発光素子６は、当該分野で一般的に用いられる発光ダイオード、レーザダイオード等を用いることができる。例えば、窒化物系半導体（ＩｎＸＡｌＹＧａ１−Ｘ−ＹＮ、０≦Ｘ、０≦Ｙ、Ｘ＋Ｙ≦１）、ＧａＰ、ＧａＡｓなどのＩＩＩ−Ｖ族化合物半導体、ＺｎＳｅ、ＩＩ−ＶＩ族化合物半導体等、種々の半導体を利用することができる。なお、発光素子６は、半導体層を成長させるための基板を有していてもよい。基板としては、サファイア等の絶縁性基板、ＳｉＣ、ＺｎＯ、Ｓｉ、ＧａＡｓ、ダイヤモンド、窒化物半導体と格子接合するニオブ酸リチウム、ガリウム酸ネオジム等の酸化物からなる基板が挙げられる。なお、基板はレーザリフトオフ法等を利用して除去されていてもよい。 (Light-emitting element 6)
As the light emitting element 6, a light emitting diode, a laser diode or the like generally used in the relevant field can be used. For example, the nitride semiconductor (In X Al Y Ga 1- X-Y N, 0 ≦ X, 0 ≦ Y, X + Y ≦ 1), GaP, III-V group compound semiconductor such as GaAs, ZnSe, II-VI group Various semiconductors such as compound semiconductors can be used. Note that the light emitting element 6 may have a substrate for growing a semiconductor layer. Examples of the substrate include insulating substrates such as sapphire, and substrates made of oxides such as lithium niobate and neodymium gallium oxide lattice-joined to SiC, ZnO, Si, GaAs, diamond, and nitride semiconductors. The substrate may be removed using a laser lift off method or the like.

（被覆部材８）
被覆部材８は、例えば、母材である樹脂に光反射性又は光吸収性物質を含有させた材料により形成することができる。これにより、被覆部材８を所望の形状に成形しやすい。樹脂としては、例えば、シリコーン樹脂、変性シリコーン樹脂、エポキシ樹脂、変性エポキシ樹脂、不飽和ポリエステル樹脂、ポリイミド樹脂、変性ポリイミド樹脂、フェノール樹脂、ウレタン樹脂、アクリレート樹脂、ユリア樹脂、アクリル樹脂、ポリフタルアミド（ＰＰＡ）、ポリフェニレンサルファイド（ＰＰＳ）、液晶ポリマー（ＬＣＰ）等が挙げられる。これらは単独で又は２種以上の樹脂を組み合わせて用いてもよい。特に、耐熱性、耐光性の観点から、シリコーン樹脂、変性シリコーン樹脂、又はハイブリッドシリコーン樹脂が好ましい。また、接着性の観点から、エポキシ樹脂、変性エポキシ樹脂、ハイブリッドエポキシ樹脂が好ましい。なお、被覆部材８の厚み（発光素子６の側面から発光装置の側面までの距離）は、例えば１０μｍ〜１００μｍとすることで、主発光面Ｑ以外からの発光素子の光を十分に遮光しつつ、小型の発光装置を形成することができる。 (Covering member 8)
The covering member 8 can be formed of, for example, a material in which a resin that is a base material contains a light reflective or light absorbing material. Thereby, the covering member 8 can be easily formed into a desired shape. As resin, for example, silicone resin, modified silicone resin, epoxy resin, modified epoxy resin, unsaturated polyester resin, polyimide resin, modified polyimide resin, phenol resin, urethane resin, acrylate resin, urea resin, acrylic resin, polyphthalamide (PPA), polyphenylene sulfide (PPS), liquid crystal polymer (LCP) and the like. You may use these individually or in combination of 2 or more types of resin. In particular, in view of heat resistance and light resistance, silicone resins, modified silicone resins, or hybrid silicone resins are preferable. Further, from the viewpoint of adhesiveness, epoxy resins, modified epoxy resins, and hybrid epoxy resins are preferable. The thickness of the covering member 8 (the distance from the side surface of the light emitting element 6 to the side surface of the light emitting device) is, for example, 10 μm to 100 μm to sufficiently block the light of the light emitting element from other than the main light emitting surface Q , A small light emitting device can be formed.

光反射性又は光吸収性物質としては、例えば、セラミックス、二酸化チタン、二酸化ケイ素、二酸化ジルコニウム、チタン酸カリウム、アルミナ、窒化アルミニウム、窒化ケイ素、窒化ホウ素、ムライト、酸化ニオブ、酸化亜鉛、硫酸バリウム、各種希土類酸化物（例えば、酸化イットリウム、酸化ガドリニウム）等が挙げられる。光反射性又は光吸収性物質は、被覆部材の全重量において、約２０重量％〜８０重量％程度含有されていることが好ましく、約３０重量％〜７０重量％程度がより好ましい。これにより、被覆部材の遮光性及び強度を確保することができる。   As the light reflective or light absorbing substance, for example, ceramics, titanium dioxide, silicon dioxide, zirconium dioxide, potassium titanate, alumina, aluminum nitride, silicon nitride, boron nitride, mullite, niobium oxide, zinc oxide, barium sulfate, Various rare earth oxides (for example, yttrium oxide, gadolinium oxide) and the like can be mentioned. The light-reflecting or light-absorbing substance is preferably contained in an amount of about 20% by weight to about 80% by weight, and more preferably about 30% by weight to about 70% by weight, based on the total weight of the covering member. Thereby, the light shielding property and the strength of the covering member can be secured.

本発明の実施形態に係る発光装置は、照明用光源、各種インジケーター用光源、車載用光源、ディスプレイ用光源、液晶のバックライト用光源、センサー用光源、信号機等、種々の発光装置に使用することができる。   The light emitting device according to the embodiment of the present invention may be used for various light emitting devices such as illumination light sources, light sources for various indicators, light sources for vehicles, light sources for displays, light sources for backlight of liquid crystals, light sources for sensors, and traffic lights. Can.

１ 支持部材
Ｚ 支持部材の上面
２ 樹脂部材
Ｑ 第１面
Ｒ 第２面
Ｓ 側面
３、３Ａ 補強膜
４、４Ａ 透光性部材
５ 除去部
６ 発光素子
６ａ、６ｂ 発光素子の電極
６ｃ 半導体積層構造体
Ｔ 発光面
Ｖ 電極形成面
Ｗ 側面
７ 支持部材
Ｕ 支持部材の上面
８ 被覆部材
９ 除去部
１０ 除去部
１２ コレット
１００、１００Ａ 発光装置 REFERENCE SIGNS LIST 1 support member Z upper surface of support member 2 resin member Q first surface R second surface S side surface 3, 3A reinforcing film 4, 4A light transmitting member 5 removed portion 6 light emitting element 6 a, 6 b electrode of light emitting element 6 c semiconductor laminated structure Body T light emitting surface V electrode forming surface W side surface 7 support member U upper surface of support member 8 covering member 9 removing portion 10 removing portion 12 collet 100, 100 A light emitting device

Claims (10)

第１面と、前記第１面の反対側の第２面と、を備える樹脂部材と、前記第１面上に配置され、前記樹脂部材よりも硬度が高い補強膜と、を備える透光性部材を準備する工程と、
発光面と、前記発光面の反対側の電極面と、前記発光面と前記電極面との間の側面と、を備えた発光素子を準備する工程と、
前記補強膜にコレットを当接させて透光性部材を吸着保持し、前記発光素子の前記発光面上に、前記透光性部材を載置する工程と、
前記発光素子及び透光性部材を、被覆部材で埋設する工程と、
前記透光性部材の少なくとも一部が露出するように、前記被覆部材の一部を除去する工程と、
を含む発光装置の製造方法。 A translucent member comprising: a resin member including a first surface and a second surface opposite to the first surface; and a reinforcing film disposed on the first surface and having a hardness higher than that of the resin member Preparing the members;
Preparing a light emitting device comprising a light emitting surface, an electrode surface opposite to the light emitting surface, and a side surface between the light emitting surface and the electrode surface;
Allowing a collet to be in contact with the reinforcing film to adsorb and hold a light-transmissive member, and placing the light-transmissive member on the light emitting surface of the light emitting element;
Embedding the light emitting element and the light transmitting member with a covering member;
Removing a portion of the covering member such that at least a portion of the translucent member is exposed;
A method of manufacturing a light emitting device including: 前記透光性部材を準備する工程は、前記樹脂部材の前記第１面上に前記補強膜を形成した後、個片化して前記透光性部材を得る工程を含む、請求項１記載の発光装置の製造方法。   The step of preparing the light-transmissive member includes the step of forming the reinforcing film on the first surface of the resin member and then singulating to obtain the light-transmissive member. Device manufacturing method. 前記透光性部材を準備する工程は、前記樹脂部材を切断した後、前記樹脂部材の前記第１面上及び側面上に前記補強膜を形成して前記透光性部材を得る工程を含む、請求項２記載の発光装置の製造方法。   The step of preparing the light transmitting member includes the step of forming the reinforcing film on the first surface and the side surface of the resin member after cutting the resin member to obtain the light transmitting member. A method of manufacturing a light emitting device according to claim 2. 前記被覆部材の一部を除去する工程は、前記補強膜の一部を除去する工程を備える、請求項１〜請求項３のいずれか１項に記載の発光装置の製造方法。   The method of manufacturing a light emitting device according to any one of claims 1 to 3, wherein the step of removing a part of the covering member comprises the step of removing a part of the reinforcing film. 前記被覆部材の一部を除去する工程は、前記補強膜を除去し、前記樹脂部材の少なくとも一部を露出させる工程を含む、請求項１〜請求項３のいずれか１項に記載の発光装置の製造方法。   The light emitting device according to any one of claims 1 to 3, wherein the step of removing a portion of the covering member includes the step of removing the reinforcing film to expose at least a portion of the resin member. Manufacturing method. 前記透光性部材の一部を除去する方法は、研削、ルーターのいずれかの方法を用いる、請求項１〜請求項５のいずれか１項に記載の発光装置の製造方法。   The method of manufacturing a light emitting device according to any one of claims 1 to 5, wherein the method of removing a part of the translucent member uses any method of grinding and a router. 前記補強膜は金属材料であり、前記補強膜を形成する工程は、スパッタ、蒸着、箔、塗布のいずれかの方法を用いる、請求項２〜請求項６のいずれか１項に記載の発光装置の製造方法。   The light emitting device according to any one of claims 2 to 6, wherein the reinforcing film is a metal material, and the step of forming the reinforcing film uses a method of sputtering, vapor deposition, foil, or coating. Manufacturing method. 前記補強膜は、厚みが１μｍ〜１０μｍである、請求項７記載の発光装置の製造方法。   The method for manufacturing a light emitting device according to claim 7, wherein the reinforcing film has a thickness of 1 μm to 10 μm. 前記補強膜は樹脂材料であり、前記補強膜を形成する工程は、塗布、スプレー、シートの貼り合わせのいずれかの方法を用いる、請求項１〜請求項６のいずれか１項に記載の発光装置の製造方法。   The light emission according to any one of claims 1 to 6, wherein the reinforcing film is a resin material, and the step of forming the reinforcing film uses any of a coating method, a spray method, and a sheet bonding method. Device manufacturing method. 前記樹脂部材は、シリコーン樹脂、変性シリコーン樹脂、ハイブリッドシリコーン樹脂、のうちいずれか１つである請求項９に記載の発光装置の製造方法。   The method according to claim 9, wherein the resin member is any one of a silicone resin, a modified silicone resin, and a hybrid silicone resin.
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