JP2019106438A - Print circuit board and wireless communication device - Google Patents

Print circuit board and wireless communication device Download PDF

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Publication number
JP2019106438A
JP2019106438A JP2017237642A JP2017237642A JP2019106438A JP 2019106438 A JP2019106438 A JP 2019106438A JP 2017237642 A JP2017237642 A JP 2017237642A JP 2017237642 A JP2017237642 A JP 2017237642A JP 2019106438 A JP2019106438 A JP 2019106438A
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Prior art keywords
circuit board
insulating layer
wireless communication
printed circuit
communication device
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JP2017237642A
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Japanese (ja)
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佳恵 坂梨
Yoshie Sakanashi
佳恵 坂梨
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Denso Corp
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Denso Corp
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Priority to JP2017237642A priority Critical patent/JP2019106438A/en
Priority to DE102018221036.5A priority patent/DE102018221036A1/en
Publication of JP2019106438A publication Critical patent/JP2019106438A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B32B5/12—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer characterised by the relative arrangement of fibres or filaments of different layers, e.g. the fibres or filaments being parallel or perpendicular to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243—Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/08—Arrays of individually energised antenna units similarly polarised and spaced apart the units being spaced along or adjacent to a rectilinear path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile

Abstract

To provide a print circuit board that can be used without restricting the frequency or the arrangement state of a conductive pattern for an antenna, and a wireless communication device using the print circuit board.SOLUTION: A print circuit board 3 forming a wireless communication device includes a plurality of insulating layers 31a to 31d deposited with conductor layers 8a to 8c in between. The insulating layer 31a includes two dielectric layers 32a and 32b. The dielectric layers 32a and 32b are obtained by impregnating a low-dielectric glass cloth 41 with a such a resin 33 as a low-dielectric epoxy. In the glass cloth 41 of the dielectric layers 32a and 32b, a warp yarn 41a is laminated on one another in a manner of being displaced by a half pitch. This uniformizes the variations in the characteristics due to the glass cloth 41 in the upper surface of the insulating layer 31a, and reduces the influence on the conductor pattern 7a and variations in the characteristics between products of antenna 7.SELECTED DRAWING: Figure 2

Description

本発明は、プリント基板および無線通信装置に関する。   The present invention relates to a printed circuit board and a wireless communication device.

無線通信装置などに用いるプリント基板は、電子部品の実装に加えてグランドパターンを形成したり、導体パターンで送受信用のアンテナを形成するなどしている。このようなプリント基板としては、例えばガラスクロスに樹脂を含浸させた状態としたものに銅箔などの導体パターン形成用の金属層を積層した状態でプレス加工することで形成したものがある。   In addition to mounting of electronic components, a printed circuit board used for a wireless communication apparatus or the like forms a ground pattern or forms an antenna for transmission and reception with a conductor pattern. As such a printed circuit board, for example, there is one formed by pressing in a state in which a metal layer for forming a conductor pattern such as copper foil is laminated on a resin cloth impregnated with a glass cloth.

この場合、ガラスクロスは一般に誘電率が高いため、織目の配置状態によっては表面に形成している導体パターンの電気的特性に影響を与えることがある。例えば、高周波信号を扱うアンテナパターンなどを形成している場合に、ガラスクロスの織目の位置によっては特性が変動し、これによって無線通信装置としての製品毎のばらつきが大きくなる要因となる。   In this case, since the glass cloth generally has a high dielectric constant, it may affect the electrical characteristics of the conductor pattern formed on the surface depending on the arrangement of the weave. For example, in the case of forming an antenna pattern or the like that handles high-frequency signals, the characteristics vary depending on the position of the weave of the glass cloth, which causes a large variation among products as a wireless communication device.

このような影響を低減する技術として、例えば導体パターンによって扱われる信号の周波数に対してガラスクロスの織目のピッチを条件付けしたり、ガラスクロスに対して導体パターンを傾けて配置することで、ガラスクロスの比誘電率の影響を低減しようとするものがある。   As a technique for reducing such an influence, for example, by conditioning the pitch of the weave of the glass cloth to the frequency of the signal handled by the conductor pattern, or by arranging the conductor pattern to be inclined to the glass cloth, Some attempt to reduce the influence of the dielectric constant of the cross.

しかしながら、導体パターンを含む回路で扱う周波数を考慮したガラスクロスを用いたプリント基板を使うには制約が発生し、また、ガラスクロスに対して導体パターンを傾けて配置するものでは配置スペースに無駄が生ずるという課題が残る。   However, there is a limitation in using a printed circuit board using glass cloth in consideration of the frequency handled by the circuit including the conductor pattern, and in the case of arranging the conductor pattern at an angle to the glass cloth, the space is wasted There remains a problem that arises.

特開２００３−２１８２７１号公報Unexamined-Japanese-Patent No. 2003-218271

本発明は、上記事情を考慮してなされたもので、その目的は、表面部に形成するアンテナ用の導体パターンの周波数や配置状態に制約を与えないで使用することができるプリント基板およびそのプリント基板を用いた無線通信装置を提供することにある。   The present invention has been made in consideration of the above circumstances, and its object is to provide a printed circuit board which can be used without restriction on the frequency or arrangement of a conductor pattern for an antenna formed on the surface and a print thereof It is an object of the present invention to provide a wireless communication device using a substrate.

請求項１に記載のプリント基板は、ｎ枚（ｎは２以上の整数）のガラスクロスに低誘電体を含浸させた絶縁層が少なくとも表層側に設けられたプリント基板において、前記ｎ枚のガラスクロスは、積層時の同一方向の少なくとも一方の糸の山位置が、互いに山−山間の１／ｎだけずれた状態に形成されている。   The printed circuit board according to claim 1 is a printed circuit board in which an insulating layer obtained by impregnating n low (n is an integer of 2 or more) glass cloths with a low dielectric is provided at least on the surface side. The cross is formed in a state where the crest position of at least one yarn in the same direction at the time of lamination is mutually offset by 1 / n between crests and crests.

上記構成を採用することにより、ガラスクロスをｎ枚配置し、これらの少なくとも一方の糸の山−山間の間で山位置を互いに１／ｎずらした状態にすることで、ガラスクロスの誘電率に起因した条件が表面部分でほぼ均一化することができる。これにより、プリント基板上に配置する導体パターンによる回路の周波数や、配置位置にかかわらず、特性のばらつきが少ない回路を配置することができる。   By adopting the above configuration, n glass cloths are arranged, and the peak positions of at least one of these yarns are shifted 1 / n from each other, thereby making it possible to obtain the dielectric constant of the glass cloth. The resulting conditions can be made substantially uniform at the surface portion. As a result, regardless of the frequency of the circuit by the conductor pattern disposed on the printed circuit board or the placement position, a circuit with less variation in characteristics can be disposed.

無線通信装置の断面図Sectional view of wireless communication device 第１実施形態を示すプリント基板の模式的な断面図Typical cross-sectional view of the printed circuit board showing the first embodiment ガラスクロスの上面を模式的に示す図The figure which shows the upper surface of glass cloth typically ガラスクロス２枚の場合の積層状態を示す模式的な断面図A schematic sectional view showing the laminated state in the case of two glass cloths ガラスクロス３枚の場合の積層状態を示す模式的な断面図A schematic sectional view showing the laminated state in the case of three glass cloths 第２実施形態を示すプリント基板の模式的な断面図A schematic sectional view of a printed circuit board showing a second embodiment 第３実施形態を示すプリント基板の模式的な断面図A schematic sectional view of a printed circuit board showing a third embodiment

（第１実施形態）
以下、本発明の第１実施形態について、図１〜図５を参照して説明する。
図１は無線通信装置１の外形を断面で示している。無線通信装置１を構成する筐体２は、内部の段差部２ａにプリント基板３が、例えばねじ４により固定されている。なお、プリント基板３の固定はねじ以外の方法を用いても良い。プリント基板３には、上面側に通信制御用の制御ＩＣ５、下面側に電子部品６が配置されるとともに、下面側には無線通信用のアンテナ７を構成する導体パターン７ａが形成されている。無線通信装置１は、制御ＩＣ５の制御動作によりアンテナ７を介して外部と無線により信号の授受を行うものである。なお、制御ＩＣ５は、プリント基板３の下面側に配置するものでも良い。 First Embodiment
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS. 1 to 5.
FIG. 1 shows the external appearance of the wireless communication device 1 in cross section. In the case 2 constituting the wireless communication device 1, the printed circuit board 3 is fixed to the internal step portion 2 a by, for example, a screw 4. The printed circuit board 3 may be fixed by using a method other than a screw. A control IC 5 for communication control is disposed on the upper surface side of the printed circuit board 3, and an electronic component 6 is disposed on the lower surface side, and a conductor pattern 7a constituting an antenna 7 for wireless communication is formed on the lower surface side. The wireless communication device 1 wirelessly exchanges signals with the outside via the antenna 7 by the control operation of the control IC 5. The control IC 5 may be disposed on the lower surface side of the printed circuit board 3.

図２はプリント基板３の断面を模式的に示す図で、図１で示したアンテナ７の部分を上に向けた状態で示している。プリント基板３は、４つの絶縁層３１ａ〜３１ｄが積層されており、表層側の絶縁層３１ａの表面にはアンテナ７の導体パターン７ａが配置されている。各絶縁層３１ａ〜３１ｄの間には導体層８ａ〜８ｃが設けられている。導体層８ａは、１ｍｍ以上の幅広なパターンで形成されたグランド層として設けられている。また、プリント基板３の図中下面側の表層側に配置した絶縁層３１ｄの表面には導体層８ｄが設けられている。   FIG. 2 is a view schematically showing a cross section of the printed circuit board 3, with the portion of the antenna 7 shown in FIG. 1 facing upward. The printed circuit board 3 has four insulating layers 31a to 31d stacked, and the conductor pattern 7a of the antenna 7 is disposed on the surface of the insulating layer 31a on the surface side. Conductor layers 8a to 8c are provided between the respective insulating layers 31a to 31d. The conductor layer 8a is provided as a ground layer formed in a wide pattern of 1 mm or more. A conductor layer 8d is provided on the surface of the insulating layer 31d disposed on the surface side of the printed circuit board 3 on the lower surface side in the drawing.

アンテナ７が形成された絶縁層３１ａは、さらに２層の誘電体層３２ａ、３２ｂを積層した状態に形成されている。誘電体層３２ａ、３２ｂおよび絶縁層３１ｂ〜３１ｄのそれぞれには、低誘電ガラスクロス（以下、単に「ガラスクロス」と称する）４１に、低誘電材のエポキシなどの樹脂３３が含浸された状態で板状に固められた構成とされている。なお、ガラスクロス４１の誘電率は、樹脂３３の誘電率と比べると高い。   The insulating layer 31a in which the antenna 7 is formed is formed in a state in which two dielectric layers 32a and 32b are further stacked. Low dielectric glass cloth (hereinafter simply referred to as "glass cloth") 41 impregnated with resin 33 such as epoxy of low dielectric material for each of dielectric layers 32a and 32b and insulating layers 31b to 31d It is considered to be a plate-shaped structure. The dielectric constant of the glass cloth 41 is higher than the dielectric constant of the resin 33.

図３に示すように、ガラスクロス４１は、ガラス繊維からなる縦糸４１ａおよび横糸４１ｂを織って形成したものである。縦糸４１ａ、横糸４１ｂは、例えば複数本のガラス繊維を扁平な状態に束ねたものである。このような縦糸４１ａを多数本張った状態で、横糸４１ｂを交互に通していくことでガラスクロス４１が織り上げられている。このようにして織り上げられたガラスクロス４１は、図２に模式的に示しているように、縦糸４１ａおよび横糸４１ｂが互いに波状に変形した状態となっている。   As shown in FIG. 3, the glass cloth 41 is formed by weaving a warp yarn 41 a and a weft yarn 41 b made of glass fiber. The warp yarn 41a and the weft yarn 41b are, for example, a bundle of a plurality of glass fibers in a flat state. The glass cloth 41 is woven up by alternately passing the weft yarns 41b in a state where a large number of such warp yarns 41a are stretched. As schematically shown in FIG. 2, the glass cloth 41 woven in this manner is in a state in which the warp yarn 41a and the weft yarn 41b are deformed into a wave shape.

絶縁層３１ａでは、図４に示すように、誘電体層３２ａのガラスクロス４１の縦糸４１ａは、誘電体層３２ｂのガラスクロス４１の縦糸４１ａに対して、波状の山Ｐａ−山Ｐａの間隔を１ピッチＬとすると、山Ｐｂの位置が半ピッチすなわちＬ／２だけずれた状態に配置されている。   In the insulating layer 31a, as shown in FIG. 4, the warp yarn 41a of the glass cloth 41 of the dielectric layer 32a has a gap between the wave-like peaks Pa and Pa with respect to the warp yarn 41a of the glass cloth 41 of the dielectric layer 32b. Assuming that the pitch is one pitch L, the positions of the peaks Pb are arranged to be shifted by a half pitch, ie, L / 2.

これにより、誘電体層３２ａの表面部分では、誘電体層３２ａ、３２ｂの各ガラスクロス４１の縦糸４１ａからの距離の和がほぼ一定となり、誘電体として表面部分に及ぼす作用が場所によらずほぼ均一となる。また、ガラスクロス４１の製造上の関係で、縦糸４１ａの影響が出やすいので、これにより効果を高めることができる。   Thereby, on the surface portion of the dielectric layer 32a, the sum of the distances from the warp yarn 41a of the glass cloths 41 of the dielectric layers 32a and 32b is substantially constant, and the effect on the surface portion as the dielectric is substantially independent of the place. It becomes uniform. Moreover, since the influence of the warp yarn 41a is likely to occur in relation to the manufacturing of the glass cloth 41, the effect can be enhanced.

また、図４では縦糸４１ａ同士がずれた状態を示しているが、同じように横糸４１ｂについても波状の山−山の間隔を１ピッチとして、半ピッチずれた状態に配置されている。これにより、２枚のガラスクロス４１による表面部分に対して誘電体として作用する成分がほぼ一定となる。   Further, FIG. 4 shows a state in which the warp yarns 41a are shifted from each other, but similarly, the weft 41b is also shifted in a half pitch, with the wave-like peak-to-peak interval being one pitch. Thus, the component acting as a dielectric on the surface portion of the two glass cloths 41 becomes substantially constant.

このような第１実施形態によれば、プリント基板３の表層部に形成されたアンテナ７の導体パターン７ａは、誘電体としてのガラスクロス４１との結合の状態が、面内の配置位置に依存することなくほぼ一定の状態となる。この結果、プリント基板３を用いてアンテナ７を表層部に形成した場合に、製品毎のガラスクロス４１に起因した配置位置についての特性ばらつきが抑制されるようになる。   According to the first embodiment, in the conductor pattern 7a of the antenna 7 formed on the surface layer portion of the printed circuit board 3, the state of coupling with the glass cloth 41 as a dielectric depends on the in-plane arrangement position It becomes almost constant without doing it. As a result, when the antenna 7 is formed in the surface layer portion using the printed circuit board 3, the characteristic variation in the arrangement position caused by the glass cloth 41 for each product is suppressed.

なお、上記実施形態では、絶縁層３１ａとして、２層の誘電体層３２ａ、３２ｂを設ける構成としているが、これに代えて、図５に示すように、３層の誘電体層３２ａ、３２ｂ、３２ｃを設ける構成とすることもできる。この場合には、誘電体層３２ａを構成しているガラスクロス４１の縦糸４１ａの山位置Ｐａに対して、山位置Ｐａ−Ｐａ間の距離Ｌである１ピッチを３等分した位置のそれぞれに、誘電体層３２ｂ、３２ｃの各ガラスクロス４１の縦糸４１ａの山位置Ｐｂ、Ｐｃをずらした状態で位置させる。これによって、３層の場合でも上記した２層の実施形態と同様の作用効果を得ることができる。   In the above embodiment, although the two dielectric layers 32a and 32b are provided as the insulating layer 31a, instead of this, as shown in FIG. 5, three dielectric layers 32a and 32b, 32 c may be provided. In this case, for each of the positions obtained by equally dividing one pitch, which is the distance L between the mountain positions Pa and Pa, into three with respect to the mountain position Pa of the warp yarn 41a of the glass cloth 41 constituting the dielectric layer 32a. The peak positions Pb and Pc of the warp yarns 41a of the glass cloths 41 of the dielectric layers 32b and 32c are shifted. By this, even in the case of three layers, it is possible to obtain the same effect as that of the two-layer embodiment described above.

さらに、絶縁層３１ａとして、同様にして４層以上の誘電体層を設けることもできる。この場合には、ｎを１以上の整数として一般化する。絶縁層３１ａとして、ｎ層の誘電体層を設けるとすると、ｎ枚のガラスクロス４１の積層位置として、各縦糸４１ａの山位置Ｐを、１ピッチＬをｎ等分した（ｎ−１）個の等分点、つまり１ピッチＬの１／ｎ毎の点の各位置にずらして配置する。これによって、ｎ層の誘電体層を設ける場合においても上記実施形態と同様の作用効果を得ることができる。   Furthermore, four or more dielectric layers can be provided similarly as the insulating layer 31a. In this case, n is generalized as an integer of 1 or more. Assuming that n dielectric dielectric layers are provided as the insulating layer 31a, (n-1) n pitches P divided equally into n pitch positions P of the piles P of the warp yarns 41a as the lamination position of the n glass cloths 41 It arranges at each position of the equally divided point of each, that is, each 1 / n point of 1 pitch L. By this, even in the case of providing n dielectric layers, it is possible to obtain the same function and effect as the above embodiment.

（第２実施形態）
図６は第２実施形態を示すもので、以下、第１実施形態と異なる部分について説明する。この実施形態では、第１実施形態の絶縁層３１ａと同じ構成の絶縁層３１ｅをさらに積層したプリント基板９を使用している。 Second Embodiment
FIG. 6 shows a second embodiment, and in the following, portions different from the first embodiment will be described. In this embodiment, a printed circuit board 9 in which an insulating layer 31e having the same configuration as that of the insulating layer 31a of the first embodiment is further stacked is used.

すなわち、図６に示すように、プリント基板９は、第１実施形態で示した構成のプリント基板３の絶縁層３１ａ上にさらに絶縁層３１ｅを積層した構成である。絶縁層３１ｅは、誘電体層３２ｃ、３２ｄを積層したものである。絶縁層３１ｅの表面には、アンテナ７を構成する複数本の導体パターン７ｂが設けられている。これによって、アンテナ７は、２層間にわたる導体パターン７ａ、７ｂにより構成される。また、絶縁層３１ｅの各誘電体層３２ｃ、３２ｄのガラスクロス４１は、絶縁層３１ａと同様に、縦糸４１ａの山位置のピッチが半ピッチずれた状態で積層されている。   That is, as shown in FIG. 6, the printed circuit board 9 has a structure in which the insulating layer 31 e is further stacked on the insulating layer 31 a of the printed circuit board 3 configured as shown in the first embodiment. The insulating layer 31e is formed by laminating the dielectric layers 32c and 32d. A plurality of conductor patterns 7b constituting the antenna 7 are provided on the surface of the insulating layer 31e. Thus, the antenna 7 is formed of the conductor patterns 7a and 7b extending between the two layers. Further, the glass cloths 41 of the dielectric layers 32c and 32d of the insulating layer 31e are stacked in a state in which the pitch of the crests of the warp yarns 41a is shifted by a half pitch, similarly to the insulating layer 31a.

上記のように構成されているので、アンテナ７を構成する導体パターン７ａは、絶縁層３１ａからのガラスクロス４１に起因した特性の変動が解消されるとともに、絶縁層３１ｅからのガラスクロス４１に起因した特性の変動も解消される。また、同様にして、アンテナ７を構成する導体パターン７ｂは、絶縁層３１ｅからのガラスクロス４１に起因した特性の変動が解消される。   Since it is comprised as mentioned above, while the fluctuation | variation of the characteristic resulting from the glass cloth 41 from the insulating layer 31a is eliminated, the conductor pattern 7a which comprises the antenna 7 originates in the glass cloth 41 from the insulating layer 31e It is also possible to eliminate the fluctuation of the characteristics. Similarly, in the conductor pattern 7b constituting the antenna 7, the fluctuation of the characteristics caused by the glass cloth 41 from the insulating layer 31e is eliminated.

この結果、第１実施形態と同様に、２層の絶縁層３１ａ、３１ｅを積層形成した場合でも、多層アンテナ７を構成する導体パターン７ａ、７ｂに対して、製品毎のガラスクロス４１に起因した特性ばらつきが抑制されるようになる。   As a result, as in the first embodiment, even when the two insulating layers 31a and 31e are laminated, the conductor patterns 7a and 7b constituting the multilayer antenna 7 are caused by the glass cloth 41 for each product. Characteristic variations are suppressed.

（第３実施形態）
図７は第３実施形態を示すもので、以下、第１実施形態と異なる部分について説明する。この実施形態では、第１実施形態の絶縁層３１ａと同じ構成の絶縁層３１ｆを反対側の面の絶縁層３１ｄに積層したプリント基板９１を使用している。 Third Embodiment
FIG. 7 shows a third embodiment, and in the following, portions different from the first embodiment will be described. In this embodiment, a printed circuit board 91 is used in which an insulating layer 31f having the same configuration as the insulating layer 31a of the first embodiment is stacked on the insulating layer 31d on the opposite side.

すなわち、図７に示すように、プリント基板９１は、第１実施形態で示した構成のプリント基板３と同じものに、裏面側の絶縁層３１ｄ上にさらに絶縁層３１ｆを積層した構成である。絶縁層３１ｆは、誘電体層３２ｅ、３２ｆを積層したものである。絶縁層３１ｆの表面には、複数本の導体パターン７ｃが設けられている。また、絶縁層３１ｆの各誘電体層３２ｅ、３２ｆのガラスクロス４１は、絶縁層３１ａと同様に、縦糸４１ａの山位置のピッチが半ピッチずれた状態で積層されている。   That is, as shown in FIG. 7, the printed circuit board 91 has a configuration in which an insulating layer 31 f is further stacked on the insulating layer 31 d on the back side on the same side as the printed circuit board 3 of the configuration shown in the first embodiment. The insulating layer 31 f is a laminate of dielectric layers 32 e and 32 f. A plurality of conductor patterns 7c are provided on the surface of the insulating layer 31f. Further, the glass cloths 41 of the dielectric layers 32e and 32f of the insulating layer 31f are stacked in a state in which the pitch of the crests of the warp yarns 41a is shifted by a half pitch, similarly to the insulating layer 31a.

上記のように構成されているので、絶縁層３１ｆの表面に設けられた導体パターン７ｃについても、絶縁層３１ｆからのガラスクロス４１に起因した特性の変動が解消されるようになる。   Since it is comprised as mentioned above, the fluctuation | variation of the characteristic resulting from the glass cloth 41 from the insulating layer 31f comes to be canceled also about the conductor pattern 7c provided in the surface of the insulating layer 31f.

この結果、第１実施形態と同様に、２層の絶縁層３１ａ、３１ｆを両面に積層形成した場合でも、導体パターン７ａ、７ｂに対して、製品毎のガラスクロス４１に起因した特性ばらつきが抑制されるようになる。   As a result, as in the first embodiment, even when the two insulating layers 31a and 31f are laminated on both sides, the characteristic variation caused by the glass cloth 41 for each product is suppressed with respect to the conductor patterns 7a and 7b. Will be

また、プリント基板９１は、同じ構成の絶縁層３１ａ、３１ｆを両面に配置しているので、反りなどの条件が均衡するので、反りの発生を抑制することができる。   Moreover, since the printed circuit board 91 arranges the insulating layers 31a and 31f having the same configuration on both sides, conditions such as warpage are balanced, so that the occurrence of warpage can be suppressed.

（他の実施形態）
なお、本発明は、上述した実施形態のみに限定されるものではなく、その要旨を逸脱しない範囲で種々の実施形態に適用可能であり、例えば、以下のように変形または拡張することができる。 (Other embodiments)
The present invention is not limited to the above-described embodiment, and can be applied to various embodiments without departing from the scope of the present invention. For example, the present invention can be modified or expanded as follows.

第２実施形態、第３実施形態についても、各絶縁層３１ａ、３１ｅ、３１ｆを３層以上の誘電体層で構成することができる。
また、第２実施形態と第３実施形態を複合した構成のプリント基板を形成することもできる。 Also in the second embodiment and the third embodiment, the respective insulating layers 31a, 31e, and 31f can be formed of three or more dielectric layers.
Moreover, the printed circuit board of the structure which compounded 2nd Embodiment and 3rd Embodiment can also be formed.

さらに、上記実施形態においては、誘電体層３２ａ、３２ｂおよび絶縁層３１ｂ〜３１ｄのそれぞれを、低誘電材のエポキシなどの樹脂３３を用いる構成としたが、樹脂３３は低誘電材のもの以外に、通常の誘電率を有する樹脂を用いることもできる。   Furthermore, in the above embodiment, although each of the dielectric layers 32a and 32b and the insulating layers 31b to 31d is configured to use the resin 33 such as epoxy of a low dielectric material, the resin 33 is other than the low dielectric material. It is also possible to use a resin having a normal dielectric constant.

本開示は、実施例に準拠して記述されたが、本開示は当該実施例や構造に限定されるものではないと理解される。本開示は、様々な変形例や均等範囲内の変形をも包含する。加えて、様々な組み合わせや形態、さらには、それらに一要素のみ、それ以上、あるいはそれ以下、を含む他の組み合わせや形態をも、本開示の範疇や思想範囲に入るものである。   Although the present disclosure has been described based on the examples, it is understood that the present disclosure is not limited to the examples and structures. The present disclosure also includes various modifications and variations within the equivalent range. In addition, various combinations and forms, and further, other combinations and forms including only one element, or more or less than these elements are also within the scope and the scope of the present disclosure.

図面中、１は無線通信装置、３、９、９１はプリント基板、５は制御ＩＣ、７はアンテナ、７ａ、７ｂ、７ｃは導体パターン、８ａ〜８ｄは導体層、３１ａ〜３１ｆは絶縁層、３２ａ〜３２ｆは誘電体層、３３は樹脂（低誘電体）、４１はガラスクロス、４１ａは縦糸、４１ｂは横糸である。   In the drawings, 1 is a wireless communication device, 3, 9, 91 is a printed circuit board, 5 is a control IC, 7 is an antenna, 7a, 7b, 7c are conductor patterns, 8a to 8d are conductor layers, 31a to 31f are insulating layers, 32a to 32f are dielectric layers, 33 is a resin (low dielectric), 41 is a glass cloth, 41a is a warp, 41b is a weft.

Claims (10)

ｎ枚（ｎは２以上の整数）のガラスクロス（４１）に低誘電体（３３）を含浸させた絶縁層（３１ａ、３１ｅ、３１ｆ）が少なくとも表層側に設けられたプリント基板において、
前記ｎ枚のガラスクロスは、積層時の同一方向の少なくとも一方の糸の山位置が、互いに山−山間の１／ｎだけずれた状態に形成されているプリント基板。 In a printed circuit board provided with at least the surface layer side of insulating layers (31a, 31e, 31f) in which n low (n is an integer of 2 or more) glass cloths (41) are impregnated with a low dielectric (33)
The printed board in which the n glass cloths are formed in the state where the mountain position of at least one thread in the same direction at the time of lamination is mutually offset by 1 / n between the mountain and the mountain. 前記絶縁層（３１ａ、３１ｅ）は、導体パターン（７ａ）を挟んで複数層設けられている請求項１に記載のプリント基板。   The printed circuit board according to claim 1, wherein the insulating layer (31a, 31e) is provided in a plurality of layers sandwiching the conductor pattern (7a). 前記絶縁層（３１ａ、３１ｆ）は、表側および裏側の２つの表層側に設けられた請求項１または２に記載のプリント基板。   The printed circuit board according to claim 1 or 2, wherein the insulating layers (31a, 31f) are provided on the two surface sides of the front side and the back side. 前記絶縁層を構成するｎ枚のガラスクロスは、少なくとも縦糸（４１ａ）について、糸の山位置が、互いに山−山間の１／ｎだけずれた状態に形成されている請求項１から３のいずれか一項に記載のプリント基板。   The glass cloth of n sheets which comprises the said insulating layer is formed in the state which the pile position of the thread | yaw mutually mutually shifted | deviated by 1 / n between peaks-mountain at least about the warp (41a). The printed circuit board according to claim 1. 前記絶縁層を構成するｎ枚のガラスクロスは、低誘電ガラスクロスである請求項１から４のいずれか一項に記載のプリント基板。   The printed circuit board according to any one of claims 1 to 4, wherein the n glass cloths constituting the insulating layer are low dielectric glass cloths. アンテナとして機能する導体パターンを有し、ｎ枚（ｎは２以上の整数）のガラスクロスに低誘電体を含浸させた絶縁層が少なくとも表層側に設けられたプリント基板を備えた無線通信装置において、
前記ｎ枚のガラスクロスは、少なくとも前記導体パターンと対向する部分について、積層時の同一方向の少なくとも一方の糸の山位置が、互いに山−山間の１／ｎだけずれた状態に形成されている無線通信装置。 A wireless communication apparatus comprising a printed circuit board having a conductor pattern functioning as an antenna and at least an insulating layer provided on the surface side of n (n is an integer of 2 or more) glass cloth impregnated with a low dielectric. ,
In the n glass cloths, at least the portion facing the conductor pattern, the crest position of at least one yarn in the same direction at the time of lamination is formed so as to be mutually shifted by 1 / n between crests and crests Wireless communication device. 前記絶縁層は、前記導体パターンを挟んで複数層設けられている請求項６に記載の無線通信装置。   The wireless communication device according to claim 6, wherein the insulating layer is provided in a plurality of layers sandwiching the conductor pattern. 前記絶縁層は、表側および裏側の２つの表層側に設けられた請求項６または７に記載の無線通信装置。   The wireless communication device according to claim 6, wherein the insulating layer is provided on two surface sides, the front side and the back side. 前記絶縁層を構成するｎ枚のガラスクロスは、少なくとも縦糸について、糸の山位置が、互いに山−山間の１／ｎだけずれた状態に形成されている請求項６から８のいずれか一項に記載の無線通信装置。   9. The glass cloth of n sheets constituting the insulating layer is formed in a state in which, for at least the warp, the crest positions of the yarns are mutually shifted by 1 / n between crests and crests. The wireless communication device according to. 前記絶縁層を構成するｎ枚のガラスクロスは、低誘電ガラスクロスである請求項６から９のいずれか一項に記載の無線通信装置。   The wireless communication device according to any one of claims 6 to 9, wherein the n glass cloths constituting the insulating layer are a low dielectric glass cloth.
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