JP2019104964A - Sputtering target and manufacturing method of sputtering target - Google Patents

Abstract

To provide a sputtering target of which In material does not leak out to an outer peripheral of the target when plasma sneaks to cause the In material to melt, and a manufacturing method of the sputtering target.SOLUTION: A sputtering target includes a target material 2 divided into multiple small pieces 20, the target material 2 being composed of a laminate in which the target material 2 is bonded to a backing plate 1 with an adhesive 3 including In. A space 35 with no existence of the adhesive 3 is formed between the small piece 20 and the backing plate 1 because an outer peripheral edge of the adhesive 3 for bonding the small piece 20 to the backing plate 1 is arranged from the outer peripheral edge of multiple small pieces 20 of the divided target material 2 to a predetermined position in a central side of the small piece 20.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a sputtering target and a method of manufacturing the sputtering target.

Conventionally, a sputtering method is known as a thin film formation technique (see, for example, Patent Document 1). In the sputtering method, charged particles are made to collide with the surface of a target (material), and the struck target material is attached to the surface of a substrate or the like to form a thin film.
Further, as a sputtering target, one having a configuration in which a target material made of a material to form a thin film is joined to a backing plate made of a material excellent in conductivity and thermal conductivity is known (for example, patent documents 2). For bonding between the sputtering target and the backing plate, metal bonding by low melting point solder having good thermal conductivity is used. The low melting point solder is made of, for example, a metal such as In (indium) or an In alloy.

JP-A-2-209476 Patent No. 5686017 gazette

  In the conventional sputtering target, depending on the power at the time of sputtering and the magnet shape of the apparatus, In may join the target to the backing plate because the plasma also wraps around the side of the target, or in the case of a split target, the junction of the split target. The material melts and causes abnormal discharge and causes poor optical characteristics. As a countermeasure against this, it is necessary to design a target which does not leak to the outer periphery of the target even if the plasma wraps around and the In material melts.

  The present invention has been made in view of the above, and it is an object of the present invention to provide a sputtering target which does not leak up to the outer periphery of the target even if plasma wraps around and the In material melts, and a method of manufacturing the sputtering target.

  In order to achieve the above object, the present invention is provided with a target material (for example, target material 2 described later) divided into a plurality of small pieces (for example, small particles 20 described later), and the target material is a backing plate (for example A sputtering target (for example, a sputtering target 100 described later), which is a sputtering target (for example, a sputtering target 100 described later), which is formed of a laminated body bonded and laminated to a backing plate 1) with a bonding agent containing indium (for example, bonding agent 3 described later). Since the outer peripheral edge of the bonding agent for bonding the small piece to the backing plate is located at a predetermined position on the center side of the small piece from the outer peripheral edge of the plurality of small pieces of target material, the small piece and the backing plate Provide a sputtering target in which a space where the bonding agent is not present is formed. .

  The space extends from the outer peripheral edge of the small piece toward the center side of the small piece to a position of 2% or more and 4% or less of the length in the width direction with respect to the longitudinal direction of the sputtering target Good.

  The bonding agent is disposed between the target material and the backing plate in a state where there is no thickness securing member for securing the thickness of the bonding agent in the stacking direction of the laminate. It may be Further, the thickness of the bonding agent in the stacking direction of the stacked body may be 0.1 mm or more and 0.5 mm or less.

  Further, in the present invention, lamination is performed by bonding a target material (for example, target material 2 described later) to a backing plate (for example, backing plate 1 described later) with a bonding agent containing indium (for example, bonding material 3 described later) Method for producing a sputtering target, the target facing the backing plate including a gap (for example, a gap 22 described below) of the target material divided into a plurality of small pieces (for example, a fragment 20 described later) A plurality of gap peripheral areas on the material (e.g., the gap peripheral area 24 described later), and a plurality of gap peripheral areas on the backing plate (e.g., the gap peripheral area 12 described later) facing the gap peripheral area on the target material The backing plate opposite the backing plate including the entire outer periphery of the target material divided into small pieces of An outer peripheral peripheral region on the backing material (e.g., an outer peripheral peripheral region 25 described later) and an outer peripheral peripheral region on the backing plate opposite the outer peripheral peripheral region on the target material (e.g., an outer peripheral peripheral edge described later) A step of arranging a masking tape (for example, masking tapes 101 and 102 described later) in the region 15), and the bonding agent (for example, a bonding agent 3 described later) in the region on the backing plate surrounded by the masking tape B) placing the target material divided into a plurality of small pieces on the backing plate via the bonding agent and laminating them into a laminate, and reducing the temperature of the laminate And d) removing the masking tape from the laminate. To.

  The entire target material divided into a plurality of small pieces has a long rectangle of 1000 mm or more, and in the step of removing the masking tape, the target material gaps divided into a plurality of small pieces, and the target The bonding agent is provided in the gap peripheral region on the material, the outer peripheral edge peripheral region on the target material, the gap peripheral region on the backing plate, and the outer peripheral edge peripheral region on the backing plate. It may be a nonexistent state.

  In the step of arranging the masking tape, the gap peripheral region and the outer peripheral edge peripheral region on the target material, and the gap peripheral region and the outer peripheral edge peripheral region on the backing plate are divided into a plurality of small pieces. From the outer peripheral edge of each target material of the small pieces toward the center side of each target material of the small pieces, it reaches a position of 2% or more and 4% or less of the length in the width direction with respect to the longitudinal direction of the sputtering target You may extend it.

  In the step of arranging the bonding agent, the masking tape is used without using a thickness securing member for securing the thickness in the stacking direction of the laminate in a region on the backing plate surrounded by the masking tape. The thickness of the bonding agent may be secured to a predetermined thickness by the thickness of

  In the step of arranging the bonding agent, the bonding agent may be arranged such that the thickness of the bonding agent in the stacking direction of the laminate is 0.1 mm or more and 0.5 mm or less.

  According to the present invention, it is possible to provide a method of manufacturing a sputtering target which does not leak to the outer periphery of the target even when plasma wraps around and the In material melts.

It is a schematic plan view which shows the process of arranging the masking tape which concerns on one Embodiment of this invention. It is a schematic sectional drawing which shows the process of arrange | positioning the bonding agent which concerns on one Embodiment of this invention. It is a side schematic sectional drawing which shows the state which started performing the process made into the laminated body which concerns on one Embodiment of this invention. It is a schematic sectional drawing which shows the process set as the laminated body which concerns on one Embodiment of this invention. In the process of setting it as the laminated body concerning one embodiment of the present invention, it is a side schematic sectional view showing the state where the surface oxide film portion of the bonding agent and the excess bonding agent flowed out. It is a schematic sectional drawing which shows the process of removing a masking tape from the laminated body which concerns on one Embodiment of this invention.

Hereinafter, the present embodiment will be described in detail.
The sputtering target 100 manufactured by the method of manufacturing the sputtering target according to the present embodiment is laminated by bonding the target material 2 to the backing plate 1 with the bonding agent 3 containing indium, and a laminated body is configured.

FIG. 1 is a schematic plan view showing a process of arranging a masking tape according to an embodiment of the present invention.
As shown in FIG. 1, the target material 2 is divided into a plurality of small pieces 20, and the entire target material 2 thus divided into a plurality of small pieces 20 is 1000 mm or more, more specifically 1900 mm or more. Has a long rectangular shape. The entire width of the target material 2 is about 127 mm. The target material 2 is, for example, a metal, Si, oxide based target made of ITO (indium oxide) which is a fragile material.
The backing plate 1 has a long rectangular shape which is longer in length and width and wider in area than the whole of the target material 2. The backing plate 1 is made of, for example, an oxygen free copper backing plate 1.
The bonding agent 3 (see FIG. 2 and the like) is formed of a low melting point solder composed of In (indium) and a metal of a general composition of In such as In alloy. The masking tapes 101 and 201 are mainly made of, for example, a Teflon (registered trademark) material, and some Kapton materials may be used. The thickness (thickness in the vertical direction in FIG. 4B etc.) of the masking tapes 101 and 201 extending in the longitudinal direction (horizontal direction in FIG. 1) of the backing plate 1 is in the width direction (vertical direction in FIG. 1) of the backing plate 1 It is configured to be thinner than the thickness (the thickness in the vertical direction in FIG. 4A etc.) of the masking tapes 101 and 201 extending.
FIG. 2 is a schematic cross-sectional view showing a step of arranging a bonding agent according to an embodiment of the present invention.

As shown in FIG. 5, the target material 2, the backing plate 1, and the bonding agent 3 have the target material 2 laminated on the backing plate 1 with the bonding agent 3 interposed therebetween.
FIG. 5 is a schematic cross-sectional view showing the process of removing the masking tape from the laminate according to an embodiment of the present invention.
As shown in FIG. 5, the gaps 22 are formed in the plurality of small pieces 20 of the divided target material 2 in the manufacturing process of the sputtering target as shown in FIG. The contraction of the backing plate 1 causes the adjacent small pieces 20 to abut each other. The bonding agent 3 bonding the small pieces 20 of the target material 2 to the backing plate 1 is in a state where a gap 32 is formed between the bonding agents 3. Accordingly, since the bonding agent 3 does not exist in the small pieces 20 of the target material 2 and the gaps 32 of the bonding agent 3 generated in the manufacturing process of the sputtering target, there is no In contained in the bonding agent 3.

  The gap 32 of the bonding agent 3 is wider than the gap 22 of the small piece 20 of the target material 2. Specifically, as shown in FIG. 5, not only the area on the backing plate 1 facing the gap 22 of the target material 2 divided into a plurality of small pieces 20, but also the gap peripheral area 12, 24 including this area (The same area as the gap 32).

  Similarly, an outer peripheral peripheral area 15 including both an area 23 outside and an area 13 inside the position on the backing plate 1 facing the entire outer periphery of the target material 2 divided into a plurality of small pieces 20, Also, no adhesive 3 is present in No. 25. For this reason, In contained in the bonding agent 3 does not exist in this region.

  The gap peripheral regions 12 and 24 and the outer peripheral peripheral regions 15 and 25 have a length in the width direction with respect to the longitudinal direction of the sputtering target 100 from the outer peripheral edge of the plurality of small pieces 20 toward each central side of the small pieces 20 in FIG. It extends to a position of 2% or more and 4% or less in length. Therefore, as shown in FIG. 5, the outer peripheral edge of the small piece 20 of the target material 2 has an overhang shape in which the adjacent small pieces 20 project in the direction in which the adjacent small pieces 20 approach each other.

  The thickness of the bonding agent 3 in the vertical direction in FIG. 5 which is the laminating direction of the laminate is 0.1 mm or more and 0.5 mm or less. In the bonding agent 3, a thickness securing member for securing the thickness in the stacking direction of the laminate, for example, a wire is not provided because it is not provided, and such a thickness securing member is used. Instead, the thickness of the bonding agent 3 in the vertical direction as described above is secured.

Next, a method of manufacturing the sputtering target will be described.
In the method of manufacturing the sputtering target, first, the step of arranging the masking tapes 101 and 201 is performed. In the step of arranging the masking tapes 101 and 201, the masking tape 201 is arranged on the side facing the backing plate 1 and the peripheral edge of the plurality of small pieces 20.

  Specifically, in the target material 2, the masking tape 201 is arranged to connect the plurality of small pieces 20. That is, in the target material 2, the masking tape 201 is a region around the gap 22 on the target material 2 facing the backing plate 1 including the gap 22 of the target material 2 divided into a plurality of small pieces 20 (gap peripheral region 24 And a peripheral region (outer peripheral peripheral region 25) on the target member 2 facing the backing plate 1 including the entire peripheral periphery of the target member 2 divided into a plurality of small pieces 20 Ru.

  Further, in the backing plate 1, the masking tape 101 includes a gap peripheral region 12 on the backing plate 1 including a region on the backing plate 1 facing the gaps 22 of the plurality of small pieces 20, and a target divided into a plurality of small pieces 20. An outer peripheral edge area 15 on the backing plate 1 is included, including an area on the backing plate 1 opposite the entire outer edge of the material 2. By the process of arranging the masking tape 101, 201 described above, as shown in FIG. 1, the masking tape 101, 201 is arranged.

Next, a step of arranging the bonding agent 3 is performed. In the step of arranging the bonding agent 3, the bonding agent 3 is poured into the area surrounded by the masking tape 101 on the backing plate 1 and is also arranged on the masking tape 101. The masking tape 101 has a predetermined thickness in the stacking direction (vertical direction in FIG. 2) of a stacked body configured by stacking the backing plate 1 and the target material 2. Thereby, as shown in FIG. 2, FIG. 3, FIG. 4A and FIG. 4B, the bonding agent 3 is also in the same direction over the area surrounded by the masking tape 101 on the backing plate 1 and the upper surface of the masking tape 101. It will be in the state arrange | positioned by the predetermined | prescribed thickness thicker than the thickness of the masking tape 101. FIG.
FIG. 3 is a schematic side sectional view showing a state in which the step of forming a laminate is started. FIG. 4A is a schematic cross-sectional view showing a process of forming a laminate. FIG. 4B is a schematic side sectional view showing a state in which the surface oxide film portion 301 of the bonding agent 3 and the excess bonding agent 3 flow out in the step of forming the laminate.

  Next, a process of forming a laminate is performed. In the step of forming a laminate, the target material 2 divided into a plurality of small pieces 20 is bonded and laminated to the backing plate 1 via the bonding agent 3. Specifically, as shown in FIG. 3, the target material 2 shown in FIG. 1 is joined from the upper side of the backing plate 1 in a state where the bonding agent 3 is disposed. At this time, first, the bonding agent 3 is sandwiched between the masking tape 101 on the right side and the masking tape 201 shown in FIG. 3. Next, the left masking tape 101 and the masking tape 201 are brought close to each other, and the bonding agent 3 is sandwiched between the left masking tape 101 and the masking tape 201. As a result, as shown in FIG. 4B, the surface oxide film portion 301 of the bonding agent 3 and the excess bonding agent 3 flow out. In addition, the masking tape 201 disposed on the target material 2 and the masking tape 101 disposed on the backing plate 1 are in an overlapping positional relationship in which they coincide with each other, as shown in FIGS. 4A and 4B. The lamination by bonding the target material 2 to 1 is performed to form a laminated body. A bonding agent is provided between the masking tape 101 extending in the longitudinal direction (left and right direction in FIG. 1) of the backing plate 1 and the masking tape 201 extending in the longitudinal direction (left and right direction in FIG. 1) in the laminate. A gap 302 in which 3 exists is formed. On the other hand, between the masking tape 101 extending in the width direction (vertical direction in FIG. 1) of the backing plate 1 and the masking tape 201 extending in the width direction (vertical direction in FIG. 1) in the laminate. The gap 302 in which the bonding agent 3 is present is not formed, and the masking tape 101 and the masking tape 201 are in contact with each other.

  Next, the step of removing the masking tapes 101 and 201 is performed, and in the step of removing the masking tapes 101 and 201, the masking tapes 101 and 201 disposed on the backing plate 1 and the target material 2 are removed. The removal of the masking tapes 101 and 201 is a stage in the middle of lowering the temperature of the laminate heated to about 180 ° C. after bonding when bonding the target material 2 to the backing plate 1 with the bonding agent 3 And the temperature is about 140 ° C. When the temperature drops too low, for example, to about 100 ° C., the bonding agent 3 solidifies and the backing plate 1 shrinks, which makes it difficult to remove the masking tapes 101 and 201.

  When the masking tape 101, 201 is pulled out and removed, as shown in FIG. 5, the bonding agent 3 does not exist in the gaps 22 of the plurality of small pieces 20 and the gaps 32 of the adjacent bonding agent 3 It will be in a state, and In which comprises the bonding agent 3 does not exist. In addition, the bonding agent 3 is not present even in a portion between the entire outer peripheral edge of the target material 2 divided into a plurality of small pieces 20 and the end edge of the bonding agent 3, and the bonding agent 3 is configured In does not exist. That is, the bonding agent is applied to the gap peripheral area 24 and outer peripheral peripheral area 25 of the target material 2 and the peripheral area 12 and outer peripheral peripheral area 15 on the backing plate 1 in which the masking tapes 101 and 201 are disposed. Spaces 35 where 3 does not remain and do not exist are respectively formed. In the space 35, the outer peripheral edge of the bonding agent 3 for bonding the small pieces 20 to the backing plate 1 is located at a predetermined position on the center side of the small pieces 20 from the outer peripheral edges of the plurality of small pieces 20 of the target material 2 divided. Is formed between the small piece 20 and the backing plate 1.

  When the temperature drops to about 100 ° C. after removing the masking tapes 101 and 201, the gap 22 of the target material 2 divided into a plurality of small pieces 20 becomes smaller due to the shrinkage of the backing plate 1, and when it becomes normal temperature. The small pieces 20 of the target material 2 are separated from each other by a predetermined gap 22 in the lateral direction in FIG. Through the above steps, a sputtering target is manufactured.

According to the sputtering target of the present embodiment described above and the method of manufacturing the sputtering target, the following effects can be obtained.
In the present embodiment, the gap peripheral region 24 on the target material 2 facing the backing plate 1 including the gaps 22 of the target material 2 divided into a plurality of small pieces 20 and the gap peripheral region 24 of the target material 2 Outer peripheral peripheral region 25 of target material 2 facing backing substrate 1 including gap peripheral region 12 on backing plate 1 and entire peripheral edge of target material 2 divided into a plurality of small pieces 20 And disposing the masking tapes 101 and 201 in the outer peripheral edge region 15 on the backing plate 1 facing the outer peripheral edge peripheral region.

  Thereby, the masking tape 101 is formed on the gap peripheral region 24 of the target material 2, the outer peripheral edge peripheral region 25 of the target material 2, the gap peripheral region 12 on the backing plate 1, and the outer peripheral edge region 15 on the backing plate 1. In the portion where the masking tapes 101 and 201 were disposed, the bonding agent 3 is not present and In is not present. Therefore, it is possible to manufacture a sputtering target which does not leak up to the outer periphery of the small piece 20 of the target material 2 even if the plasma wraps around and the bonding agent 3 melts. As a result, it is possible to manufacture a sputtering target in which the occurrence of arcing due to In is suppressed between the small pieces 20 of the target material 2 and the entire outer peripheral edge of the target material 2 divided into a plurality of small pieces 20. It becomes.

  Moreover, the whole of the target material 2 divided into a plurality of small pieces 20 has a long rectangle of 1000 mm or more. Then, in the process of removing the masking tapes 101 and 201, the gap 22 of the target material 2 divided into a plurality of small pieces 20, the gap peripheral region 24 of the target material 2, the outer peripheral edge region 25 of the target material 2, and the backing In the gap peripheral area 12 on the plate 1 and the outer peripheral area 15 on the backing plate 1, the bonding agent 3 is not present.

  When the entire target material 2 has a long rectangle of 1000 mm or more, the target back side is used as a fulcrum for bonding in a state where a frame is installed on the outer periphery of the backing plate to form an In reservoir. It is known that it is possible to adopt a method of knocking forward. However, in this case, an edge void is easily generated on the front side.

  On the other hand, in the present embodiment, since the bonding agent 3 is disposed in the area surrounded by the masking tape 101, the frame on the outer periphery of the backing plate 1 becomes unnecessary. In addition, since the masking plate 101 disposed on the backing plate 1 and the masking tape 201 disposed on the target material 2 can be superposed on each other, the backing plate 1 and the target material 2 can be joined. Since it is possible to simultaneously drain out the surface oxide film portion 301 of the agent 3 and the excess bonding agent 3, only the clean bonding agent 3 which is not oxidized remains in the area surrounded by the masking tape 101, and Since the gap 302 in which the bonding agent 3 is present is formed, it is possible to suppress the generation of edge voids in the bonding agent 3 even if contraction of the bonding agent 3 containing In occurs.

  Further, in the step of arranging the masking tapes 101 and 201, the gap peripheral area 24 and the outer peripheral peripheral area 25 of the target material 2, the gap peripheral area 12 on the backing plate 1 and the outer peripheral peripheral area 15 are From the outer peripheral edge of each target material 2 (the entire outer peripheral edge of the target material 2 divided into a plurality of small pieces 20 and the outer peripheral edge of the small pieces 20 forming the gap 22) toward the center of the small pieces 20 The distance L is from 2% to 4% of the length in the width direction with respect to the longitudinal direction of the sputtering target 100.

  As a result, the bonding agent 3 is disposed closer to the center of the small piece 20 when viewed in the stacking direction of the laminate, and has a positional relationship sufficiently concealed by the respective target materials 2 of the small piece 20. For this reason, it is possible to manufacture a sputtering target in which the occurrence of arcing due to In is reliably suppressed.

  Further, in the step of arranging the bonding agent 3, the bonding agent 3 is arranged such that the thickness of the bonding agent 3 in the stacking direction of the laminate (vertical direction in FIG. 2) is 0.1 mm or more and 0.5 mm or less. . As a result, it becomes possible to bond the target material 2 to the backing plate 1 with a sufficient bonding agent 3.

  In the step of arranging the bonding agent 3, in a region on the backing plate 1 surrounded by the masking tape 101, a wire or the like as a thickness securing member for securing the thickness in the stacking direction of the laminate is not used. The thickness of the bonding agent 3 is secured to a predetermined thickness by the thickness of the masking tape 101.

  Conventionally, a wire is disposed in the bonding agent 3 in order to secure the thickness of the In layer, but voids are easily generated around the wire. However, in the above-described embodiment, since the wire is not used, it is possible to suppress the occurrence of the void.

The present invention is not limited to the above-described embodiment, and modifications, improvements, and the like as long as the object of the present invention can be achieved are included in the present invention.
For example, the target material, backing plate 1, masking tape, bonding agent, and other components and configurations of the target material in the present embodiment are the target material 2, backing plate 1, masking tape 101, 201, and bonding agent 3 in the present embodiment. It is not limited to the configuration such as the material and shape of

DESCRIPTION OF SYMBOLS 1 ... backing plate 2 ... target material 3 ... bonding agent 12 ... gap peripheral area 15 ... outer periphery peripheral area 20 ... small piece 22 ... gap 24 ... gap peripheral area 25 ... outer periphery peripheral area 100 ... sputtering target 101, 102 ... masking tape

Claims (9)

A sputtering target comprising a target material divided into a plurality of small pieces, the target material being a laminate bonded and laminated to a backing plate by a bonding agent containing indium,
Since the outer peripheral edge of the bonding agent for bonding the small piece to the backing plate is located at a predetermined position on the center side of the small pieces from the outer peripheral edges of the plurality of small pieces of the target material, A sputtering target in which a space where the bonding agent is not present is formed between the base plate and the backing plate.   The space extends from the outer peripheral edge of the small piece toward the center side of the small piece to a position of 2% or more and 4% or less of the length in the width direction with respect to the longitudinal direction of the sputtering target. The sputtering target according to 1.   The bonding agent is disposed between the target material and the backing plate in a state where there is no thickness securing member for securing the thickness of the bonding agent in the stacking direction of the laminate. The sputtering target according to claim 1 or claim 2.   The sputtering target according to any one of claims 1 to 3, wherein a thickness of the bonding agent in a lamination direction of the laminated body is 0.1 mm or more and 0.5 mm or less. A method of manufacturing a sputtering target by laminating a target material on a backing plate by bonding with a bonding agent containing indium,
A gap peripheral area on the target material opposite to the backing plate including the gap of the target material divided into a plurality of small pieces, and a gap peripheral area on the backing plate opposite to the gap peripheral area on the target material An outer peripheral peripheral region on the target material facing the backing plate including the entire outer peripheral edge of the target material divided into a plurality of small pieces, and the backing plate opposing the outer peripheral peripheral region on the target material Disposing a masking tape in the upper outer peripheral peripheral region;
Placing the bonding agent in an area on the backing plate which is surrounded by the masking tape;
Bonding and laminating the target material divided into a plurality of small pieces to the backing plate via the bonding agent to form a laminate;
Removing the masking tape from the laminate while the temperature of the laminate is being lowered. The entire target material divided into a plurality of small pieces has a long rectangle of 1000 mm or more,
In the step of removing the masking tape, the gap of the target material divided into a plurality of small pieces, the gap peripheral region on the target material, the outer peripheral edge region on the target material, and the backing plate The method of manufacturing a sputtering target according to claim 5, wherein the bonding agent is not present in the gap peripheral area of and the outer peripheral peripheral area on the backing plate. In the step of arranging the masking tape, the gap peripheral region and the outer peripheral edge peripheral region on the target material, and the gap peripheral region and the outer peripheral edge peripheral region on the backing plate are divided into a plurality of small pieces. From the outer peripheral edge of each target material of the small pieces toward the center side of each target material of the small pieces, it reaches a position of 2% or more and 4% or less of the length in the width direction with respect to the longitudinal direction of the sputtering target Extend up to
The method of manufacturing the sputtering target of Claim 5 or Claim 6.   In the step of arranging the bonding agent, the masking tape is used without using a thickness securing member for securing the thickness in the stacking direction of the laminate in a region on the backing plate surrounded by the masking tape. The method of manufacturing a sputtering target according to any one of claims 5 to 7, wherein the thickness of the bonding agent is secured to a predetermined thickness by the thickness of. 9. The method according to claim 5, wherein, in the step of arranging the bonding agent, the bonding agent is arranged such that a thickness of the bonding agent in a lamination direction of the laminate is 0.1 mm or more and 0.5 mm or less. The method of manufacturing the sputtering target in any one.

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