JP2019104785A - Adhesive substrate, and method of producing adhesive substrate - Google Patents

Abstract

To provide an adhesive substrate capable of die-bonding a large amount of fine chips in a short time, and a method of producing an adhesive substrate.SOLUTION: The adhesive substrate includes: a supporting substrate; and an adhesive layer provided on the supporting substrate, where the supporting substrate has an uneven pattern or patterns having not less than 2 protrusions on one side or both sides, the adhesive layer is provided at least on an upper face of the protrusion of the uneven pattern, and the surface of the adhesive layer on an upper face of the protrusion has a curved surface.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a tacky substrate and a method of producing the tacky substrate.

  2. Description of the Related Art In recent years, the size and weight reduction of electronic devices has progressed mainly on portable devices such as watches and mobile phones. Along with this, the miniaturization of semiconductor chips incorporated in these electronic devices is further advanced.

  Conventionally, wire bonding has been known as a method of connecting a lead wire to an electrode of a semiconductor chip, but since the space occupied by the wire is large, it is not suitable for miniaturization of the semiconductor chip.

  Then, flip chip bonding which inverts the upper surface with an electrode, and directly connects with an electrode substrate is performed (patent documents 1 and 2). In this method, miniaturization is possible because there is no wire. However, since the conventional method picks up the chips one by one, it takes a very long time to die-bond a large number of very small chips such as micro LEDs.

  In the member for transfer described in Patent Document 3, the adhesive layer adheres to a flat surface to the convex portion of the concavo-convex pattern, but when such a member for transfer is brought into contact with the chip, the planar adhesion Due to the large contact area between the layer and the chip, it was difficult for all the chips to be properly transferred to another sticky substrate when picking up the chips and placing them on another sticky substrate. In addition, since the area in which the flat adhesive layer and the chip are in contact is large, the process is complicated because, for example, the pickup speed of the chip is different from the transfer speed to another adhesive substrate.

JP, 2016-001752, A International Publication WO 2014/098174 International Publication WO 2016/012409

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a pressure-sensitive adhesive substrate capable of die-bonding a large amount of fine chips in a short time and a method of producing the pressure-sensitive adhesive substrate.

  In order to solve the above problems, according to the present invention, it is an adhesive substrate having a support substrate and an adhesive layer provided on the support substrate, wherein the support substrate is formed on one side or both sides. The adhesive layer is provided on the upper surface of the convex portion of the uneven pattern of the support base, and the adhesive layer surface of the upper surface of the convex portion is at least provided. Provided is a tacky substrate characterized by having a curved surface.

  According to the adhesive base material of the present invention, it is possible to die-bond a large number of fine chips in a short time.

  In this case, preferably, the adhesive layer is provided only on the upper surface of the convex portion of the uneven pattern of the support base.

  Further, the adhesive layer is provided also in the concave portion of the uneven pattern of the support base, and the surface height of the adhesive layer provided in the concave portion of the uneven pattern is the same as that of the convex portion. It is preferable to be provided so that it may become a position lower than the surface height of the said adhesion layer provided in the upper surface.

  The adhesive substrate of the present invention includes these specific embodiments. With such a tacky substrate, a large amount of fine chips can be selectively picked up, and a large number of chips can be die-bonded in a short time.

  In this case, it is preferable that only the surface of the pressure-sensitive adhesive layer provided on the upper surface of the convex portion of the support base has a curved surface.

  With such a tacky substrate, it is possible to selectively pick up a large amount of fine chips more reliably, and to die-bond a large number of chips in a short time.

  Moreover, it is preferable that the difference between the surface height of the adhesive layer provided on the upper surface of the convex portion of the support base and the surface height of the concave portion of the concavo-convex pattern of the support base is at most 1 μm to 100 μm. .

  Further, the difference between the surface height of the adhesive layer provided on the upper surface of the convex portion of the support base and the surface height of the adhesive layer provided in the recess of the support base is at most 1 μm to 100 μm. Is preferred.

  If the distance between the surface of the pressure-sensitive adhesive layer provided on the upper surface of the convex portion of the support base and the surface of the pressure-sensitive adhesive layer provided on the surface of the concave portion of the support base or the concave portion It is possible to selectively pick up a large number of chips and die-bond a large number of chips in a short time.

  Moreover, it is preferable that the maximum thickness of the said adhesion layer is 0.01 micrometer-100 micrometers.

  An adhesive layer having such a maximum thickness (height) is preferable because the amount of deformation can be reduced when the adhesive base is pressed against the chip.

  Moreover, it is preferable that the space | interval of the said adjacent convex part of the said uneven | corrugated pattern of the said support base material is 1 micrometer-100 micrometers.

  Moreover, it is preferable that the width | variety of the said convex part of the said uneven | corrugated pattern of the said support base material is 1 micrometer-100 micrometers.

  The distance between adjacent convex portions and the width of the convex portions of such a support base material is preferable because fine chips can be picked up reliably.

  Further, the adhesive strength of the adhesive layer is 23 ° C., a peeling angle of 180 °, and a peeling speed of 300 mm / min., In accordance with JIS Z 0237: 2009. It is preferable that the adhesive force at the time of peeling under the conditions of is 0.05 to 50 (N / 25 mm width).

  If the adhesive strength of the adhesive layer in the present invention is in this range, it is preferable in order to have sufficient adhesiveness to pick up the microchip.

  Moreover, it is preferable that the said adhesive base material is for micro LED transfer.

  The adhesive substrate of the present invention is useful for micro LED transfer because it can selectively pick up a large amount of fine chips and can die-bond a large number of chips in a short time.

  Further, in the present invention, in the method for producing an adhesive substrate, an adhesive is applied from a nozzle by electrostatic force to have a curved surface on at least the upper surface of the convex portion of the support substrate. There is provided a method of producing a pressure-sensitive adhesive substrate characterized by forming a pressure-sensitive adhesive layer.

  Thus, the adhesive substrate of the present invention in which the adhesive layer having a curved surface is provided on the surface on the upper surface of the convex portion of the support substrate is produced in a short time by applying the adhesive by electrostatic force. it can.

  In the pressure-sensitive adhesive substrate of the present invention, the concavo-convex pattern is arranged on the surface of the support substrate, and at least the pressure-sensitive adhesive layer is provided on the upper surface of the convex portion of the concave-convex pattern of the support substrate Since the layer surface has a curved surface, a large amount of fine chips can be selectively picked up, and a large number of chips can be die-bonded in a short time. Therefore, it is useful as a substrate for chip transfer.

It is a schematic sectional view (A) showing one embodiment of a pressure sensitive adhesive substrate of the present invention, and a schematic sectional view (B) showing another embodiment of a pressure sensitive adhesive substrate of the present invention. It is a flowchart explaining the manufacturing process of the support base material which has an uneven | corrugated pattern by lithography. It is a photograph of the support base material which is 10 micrometers in width of a convex part, 10 micrometers in height, and 10 micrometers of intervals. It is a photograph of the adhesive base material of Example 1 which formed the adhesive layer in the support base material of FIG. It is a photograph of the support base material which is 5 micrometers in width of a convex part, 10 micrometers in height, and 5 micrometers of intervals. It is a photograph of the adhesive base material of Example 2 which formed the adhesive layer in the support base material of FIG. It is a photograph of the support base material which is 30 micrometers in width of a convex part, 50 micrometers in height, and 30 micrometers of intervals. It is a photograph of the adhesive base material of Example 3 which formed the adhesive layer in the support base material of FIG. FIG. 2 is a schematic cross-sectional view of a tacky substrate of Comparative Example 1; FIG. 6 is a schematic cross-sectional view of a tacky substrate of Comparative Example 2; FIG. 7 is a schematic cross-sectional view of a tacky substrate of Comparative Example 3; It is an image figure of the process of selectively picking and placing micro LED of red, green, blue in the adhesion test of an example and a comparative example.

  The inventors of the present invention conducted intensive studies to achieve the above object, and as a result, the present invention is a tacky substrate comprising a support base and an adhesive layer provided on the support base, wherein the support base is It has a concavo-convex pattern having two or more convex parts on one side or both sides, and the adhesive layer is provided at least on the upper surface of the convex part of the concavo-convex pattern of the support base material; If it is an adhesive substrate having an adhesive layer surface having a curved surface, a large amount of fine chips can be selectively picked up, and by pressing on a circuit electrode of a substrate, a large number of chips can be obtained in a short time. It has been found that electrical connection can be made, and the present invention has been achieved. Hereinafter, the adhesive substrate of the present invention and the method for producing the adhesive substrate will be described in detail.

  That is, the present invention is an adhesive substrate having a support substrate and an adhesive layer provided on the support substrate, and the support substrate has two or more convex portions on one side or both sides. It has a concavo-convex pattern, the pressure-sensitive adhesive layer is provided at least on the upper surface of the convex portion of the concave-convex pattern of the support base, and the adhesive layer surface of the upper surface of the convex portion has a curved surface. Provided is a tacky substrate that is characterized.

  As a specific embodiment of such an adhesive base material of the present invention, as shown in FIG. 1 (A), the convex of the support base 1 having a concavo-convex pattern having two or more convex parts on one side or both sides. The adhesive layer 2a is provided only on the upper surface 1 'of the part, and the adhesive substrate 100A in which the surface of the adhesive layer 2a on the upper surface 1' of the convex part has a curved surface is mentioned. Moreover, as another aspect, the adhesive layer 2a is provided on the upper surface 1 'of the convex portion of the support base 1 as shown in FIG. 1 (B), and the unevenness of the support base 1 is provided in addition to the adhesive layer 2a. The adhesive layer 2b is provided also in the concave portion of the pattern, and the surface height of the adhesive layer 2b provided in the concave portion of the concavo-convex pattern is the surface of the adhesive layer 2a provided on the upper surface 1 'of the convex portion. The adhesive base material 100B provided so that it may become a position lower than height may be mentioned. Hereinafter, the support substrate and the adhesive layer in the present invention will be described in detail.

[Supporting base material]
The support substrate 1 used in the present invention is not particularly limited as long as it has a concavo-convex pattern having two or more convex portions on one side or both sides, in particular, a regular concavo-convex pattern. . Such a supporting substrate 1 may be produced using, for example, glass, ceramic substrate, silicon wafer, glass epoxy laminated substrate, polyimide laminated substrate, paper phenol substrate, silicone resin substrate, fluorocarbon resin substrate, polyester substrate, etc. it can.

  There is no particular limitation on the method of providing the concavo-convex pattern, but for example, the support base 1 can be formed by forming the concavo-convex pattern directly on the workpiece by photolithography.

  The method for producing the supporting substrate 1 having the concavo-convex pattern by photolithography may be according to a conventionally known method, and as shown in FIG. 2, the photoresist 4 is applied to the object 3 to be processed, and then exposure and then By developing and then etching, and then cleaning the remaining resist, the support substrate 1 having a concavo-convex pattern can be obtained.

  Furthermore, a molding material is pressed against the concavo-convex pattern produced by such a method, the mold is taken, and a thermosetting resin, a thermoplastic resin or the like is poured into the mold to form the support base 1 having the concavo-convex pattern. good.

  Moreover, the support base 1 which has the uneven | corrugated pattern in this invention may apply | coat an adhesive on another board | substrate, and may arrange | position on it. The pressure-sensitive adhesive in this case may be the same as or different from the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer provided on the upper surface of the convex portion of the support base 1 in the present invention. As another board | substrate, the board | substrate similar to the board | substrate used for preparation of the said support base material is mentioned.

  The size and interval of the uneven pattern of the supporting substrate 1 are not particularly limited and may be appropriately selected according to the size of the chip to be picked up, but in order to pick up a fine chip, it is shown in FIG. The width 101 of the raised portion can be 1 μm to 100 μm, preferably 1 μm to 20 μm, and more preferably 1 μm to 10 μm.

  Furthermore, according to the width 101, the heights 103a and 103b may be 1 μm to 100 μm, preferably 1 μm to 20 μm, and more preferably 1 μm to 10 μm. The height 103a referred to here is, as shown in FIG. 1A, the surface height of the adhesive layer 2a provided on the upper surface of the convex portion of the support base and the surface height of the concave portion of the support base The maximum distance of the difference, and the height 103b, as shown in FIG. 1B, is the surface height of the adhesive layer provided on the upper surface of the convex portion of the support base and the recess of the support base Is the longest distance of the difference from the surface height of the adhesive layer provided on the

  In addition, the interval 102 between the adjacent convex portions is 1 μm to 100 μm, preferably 1 μm to 50 μm, and more preferably 1 μm to 20 μm. In the present invention, the width, height, and spacing of the projections refer to values measured by a scanning electron microscope.

[Adhesive layer]
The adhesive base material 100A, 100B of the present invention is characterized in that at least the adhesive layer 2a is provided on the upper surface 1 'of the convex part of the concavo-convex pattern of the support base material 1, and the surface of the adhesive layer 2a has a curved surface. . With an adhesive substrate having the adhesive layer 2a having such a shape, the pressing pressure at the time of microchip pickup can be dispersed to reduce the pressure applied to the chip, and peeling can be performed with low stress due to the reduction of the adhesion area. be able to. Therefore, a large amount of fine chips can be die-bonded in a short time. Moreover, although the adhesion layer in this invention may be formed also in the recessed part of the uneven | corrugated pattern of the support base material 1, it is preferable that only the surface of the adhesion layer 2a of the convex part upper surface of a support base material has a curved surface.

  The adhesive strength of the adhesive layer is not particularly limited, but the 180 degree peel strength is preferably 0.05 to 50 (N / 25 mm width), more preferably 0.1 to 40 (N / 25 mm width), 0.15 -30 (N / 25 mm width) is more preferable. Within this range, it has sufficient adhesiveness to pick up the microchip.

  Incidentally, the adhesive strength in the present invention means a temperature of 23 ° C., a peeling rate of 300 mm / min, which was measured by the method described in JIS Z 0237: 2009. Peeling angle: Peeling strength when peeled off under the condition of 180 °.

  The maximum thickness (height) of the adhesive layer is not particularly limited, but when the chip transfer substrate is pressed against the chip, the smaller the deformation amount, the better, and 0.01 μm to 100 μm, preferably 0.01 μm. The thickness is preferably 50 μm, more preferably 0.05 μm to 30 μm.

  There is no restriction | limiting in particular as an adhesive which forms the adhesion layer in this invention, What is hardened | cured after application | coating, for example, an acrylic adhesive, a silicone adhesive, a urethane adhesive, a latex adhesive, an epoxy adhesive etc. are mentioned.

  The method for forming the pressure-sensitive adhesive layer is not particularly limited, but the surface of the pressure-sensitive adhesive layer on the upper surface of the convex portion of the support substrate needs to have a curved surface. In particular, as shown in FIG. 1A, it is preferable to form the adhesive layer 2a having a curved surface only on the upper surface of the convex portion of the support base 1. Alternatively, as shown in FIG. 1B, the adhesive layer 2a whose surface has a curved surface on the upper surface 1 'of the convex portion of the support base 1, the adhesive layer 2b even in the concave portion of the concavo-convex pattern of the support base 1 It is preferable to form so that the surface height of the adhesion layer 2b provided in the recessed part of a pattern may become a position lower than the surface height of the adhesion layer 2a provided in the upper surface of a convex part.

  Therefore, only by applying the adhesive with a spin coater or a normal pressure spray, the adhesive applied to the convex portion of the support substrate flows, and the adhesive layer is not formed on the upper surface of the convex portion, or the adhesion of the concave portion The height of the layer and the height of the adhesive layer of the convex portion become the same, and it becomes impossible to selectively pick up a fine flip chip.

  The adhesive layer 2a having a curved surface is formed only on the upper surface 1 'of the convex portion of the supporting base 1 (FIG. 1A), or the adhesive layer 2b is also formed on the concave portion of the concavo-convex pattern of the supporting base 1 Is formed so that the surface height of the adhesive layer 2b provided in the recess of the concavo-convex pattern is lower than the surface height of the adhesive layer 2a having a curved surface. As a specific method for (FIG. 1 (B)), for example, a pressure-sensitive adhesive is applied from above the convex portion using a fine nozzle, or electrostatic application (electrospray) or the like can be mentioned.

  In particular, in electrostatic coating, since a positively or negatively charged adhesive is applied to a substrate by the attraction of static electricity, many are applied to places where the distance between the nozzle and the substrate is close, and even if not finely controlled, in a short time So that the adhesive layer 2a having a curved surface is formed only on the upper surface 1 'of the convex portion of the support base 1, or the surface height of the adhesive layer 2b provided in the concave portion of the concavo-convex pattern is convex The adhesive is preferably applied so that the adhesive layer 2a, 2b can be formed such that the surface provided on the upper surface of the adhesive layer 2a, 2b is positioned lower than the surface height of the adhesive layer 2a having a curved surface.

  The shape of the nozzle is not particularly limited, but a circular shape is desirable in order to apply a voltage uniformly to the dispersion. The diameter of the nozzle is not particularly limited and may be appropriately selected in accordance with the width and interval of the pattern. For example, in order to form the adhesive layer in a convex pattern having a width of 10 μm, a height of 10 μm and an interval of 10 μm, 5 μm to 500 μm, preferably 10 μm to 300 μm, more preferably 20 μm to 100 μm.

  Within this range, the adhesive layer 2a having a curved surface is formed only on the upper surface of the convex portion of the support base 1, or the surface height of the adhesive layer 2b provided in the recess of the support base 1 is The adhesive can be applied such that the adhesive layers 2a and 2b are formed such that the surface provided on the upper surface of the convex portion is at a position lower than the surface height of the adhesive layer 2a having a curved surface.

  The voltage to be applied is not particularly limited, and is, for example, 1,000 V to 10,000 V, preferably 1,000 V to 8,000 V, more preferably 1,000 V to 5,000 V. The distance between the tip of the nozzle and the support substrate is, for example, 10 μm to 3,000 μm, preferably 10 μm to 2,000 μm.

  Although the hardening method of the adhesion layer changes with kinds of resin, there is no limitation in particular, For example, thermosetting, photocuring, moisture hardening, etc. are mentioned.

  The adhesive substrate in the present invention can selectively pick up a large amount of fine chips, and can die-bond a large number of chips in a short time, so it is suitably used for a bonding head for micro LED transfer. Ru.

  Hereinafter, the present invention will be described in more detail by way of examples and comparative examples, but the present invention is not limited to the following examples.

Example 1
Photoresist film 4 is formed on a silicon wafer (workpiece 3) on which an oxide film is formed, and a convex-concave pattern with a width of 10 μm, a height of 10 μm, and an interval of 10 μm is formed using a known photolithography method. The support base material which has an uneven | corrugated pattern was produced (FIG. 2, FIG. 3). Then, using methyl ethyl ketone (MEK), the addition-curable silicone adhesive KR-3700 (manufactured by Shin-Etsu Chemical Co., Ltd., adhesive strength: 8.7 N / 25 mm) is diluted to a solid content concentration of 1.25 mass%. A pressure-sensitive adhesive substrate having the pressure-sensitive adhesive layer having a curved surface only on the convex portion is applied to the upper surface of the convex portion of the concave-convex pattern using an electrostatic spray / coating experimental machine (manufactured by Apic Yamada Co., Ltd.) Manufactured (Figure 4).

(Example 2)
A convex-concave pattern having a width of 5 μm, a height of 10 μm, and an interval of 5 μm is formed on a silicon wafer (processed object 3) having an oxide film formed thereon by the same method as Example 1 The material was produced (FIG. 5). Then, using methyl ethyl ketone (MEK), addition-curable silicone adhesive X-40-3270-1 (Shin-Etsu Chemical Co., Ltd. product, adhesive strength: 0.15 N / 25 mm) at a solid content concentration of 1.25 mass %, And the above-mentioned adhesive is applied on the upper surface of the convex part of the uneven pattern using an electrostatic spray / coating test machine (manufactured by Apic Yamada Co., Ltd.), and an adhesive layer having an adhesive layer having a curved surface only on the convex part Base material was produced (FIG. 6).

(Example 3)
In the same manner as in Example 1, a mold was produced by forming a concavo-convex pattern with a width of 30 μm, a height of 50 μm, and an interval of 30 μm on a silicon wafer (processed object 3) on which an oxide film was formed. An addition-curable dimethylsilicone resin was poured into the mold, cured by heating at 150 ° C. for 4 hours, and peeled off to produce a silicone resin mold in which the concavo-convex pattern was reversed to that of the silicon wafer. An addition-curable methylphenyl silicone resin was poured into the produced mold, cured by heating at 150 ° C. for 4 hours, and peeled off, thereby producing a silicone resin supporting base having a concavo-convex pattern (FIG. 7). Then, using methyl ethyl ketone (MEK) as an adhesive layer, the acrylic resin adhesive olivine BPW 6570 (manufactured by Toyo Chem Co., Ltd., adhesive power: 25.6 N / 25 mm) is diluted to a solid content concentration of 10 mass%, Agent was applied on the upper surface of the convex portion of the uneven pattern using an electrostatic spray / coating experimental machine (manufactured by Apic Yamada Co., Ltd.) to produce a tacky substrate having an adhesive layer having a curved surface only on the convex portion ( Figure 8).

(Comparative example 1)
A convex-concave pattern having a width of 10 μm, a height of 10 μm, and a gap of 10 μm is formed on a silicon wafer (processed object 3) having an oxide film formed thereon by the same method as Example 1 The material was made. Next, methyl ethyl ketone (MEK) is used as an adhesive layer, and an addition-curable silicone adhesive KR-3700 (Shin-Etsu Chemical Co., Ltd. product, adhesive strength: 8.7 N / 25 mm) is solid content concentration 1.25 mass% Diluted, and the adhesive is applied to the concavo-convex pattern using a spin coater (manufactured by Active Co., Ltd.), and the adhesive layer 20 is held only in the concave portion of the supporting substrate 10 as shown in FIG. The adhesive base material which does not have an adhesive layer in part was produced.

(Comparative example 2)
A support base made of a silicone resin having a concavo-convex pattern was produced in the same manner as in Example 3 except that the width was 10 μm, the height was 10 μm, and the interval was 10 μm. Next, methyl ethyl ketone (MEK) is used as an adhesive layer, and an addition-curable silicone adhesive KR-3700 (Shin-Etsu Chemical Co., Ltd. product, adhesive strength: 8.7 N / 25 mm) is solid content concentration 1.25 mass% And the adhesive is applied to the concavo-convex pattern using a hand spray gun, and the concave portion of the support substrate 10 is filled with the adhesive layer 20 as shown in FIG. 10 and does not have the concavo-convex pattern, that is, A tacky substrate in which the surface of the pressure-sensitive adhesive layer 20 formed on the upper surface of the convex portion and the concave portion was flat was manufactured.

(Comparative example 3)
A support base made of a silicone resin having a concavo-convex pattern was produced in the same manner as in Example 3 except that the width of the projections was changed to 20 μm, the height 50 μm, and the interval 20 μm. Then, as an adhesive layer, an addition-curable silicone adhesive KR-3700 (manufactured by Shin-Etsu Chemical Co., Ltd., adhesive strength: 8.7 N / 25 mm) is screen-printed, and a supporting substrate 10 as shown in FIG. A pressure-sensitive adhesive substrate having a rectangular pressure-sensitive adhesive layer 20 at the convex portion of the above was prepared.

[Adhesive test]
Using the adhesive substrates obtained in Examples 1 to 3 and Comparative Examples 1 to 3, the red, green and blue micro LEDs arranged as shown in FIG. 12 were selectively transferred by pick and place. Those that were selectively transferred were marked ○, and those that could not be transferred were marked ×. The results are shown in Table 1.

  As shown in Table 1, when using the adhesive base material (Examples 1 to 3) of the present invention, many micro LEDs can be selectively picked and placed at one time, so that they are suitably used for micro LED transfer Can.

  On the other hand, in Comparative Example 1, since the adhesive layer was not provided on the convex portion of the supporting substrate as in the example, it was not possible to pick up the LED. Moreover, in Comparative Example 2, the adhesive layer was provided on all the concave portions and the convex portions, so that it was not possible to selectively pick up the LED. Also, the picked up LED could not be transferred. Although it was possible to selectively pick up the LED in Comparative Example 3, it could not be transferred to another adhesive substrate because the contact area between the chip and the adhesive layer was large.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has the substantially same constitution as the technical idea described in the claims of the present invention, and the same effects can be exhibited by any invention. Contained in the technical scope of

DESCRIPTION OF SYMBOLS 1, 10 ... Supporting base material, 1 '... Upper surface of convex part of supporting base, 2a, 2b, 20 ... Adhesive layer, 3 ... Workpiece, 4 ... Photoresist, 100A, 100B ... Adhesive base, 101 ... Width of convex portion, 102 ... Distance between adjacent convex portions, 103a, 103b ... height.

Claims (12)

A tacky substrate comprising a support substrate and an adhesive layer provided on the support substrate,
The support substrate has a concavo-convex pattern having two or more convex portions on one side or both sides,
The adhesive layer is provided at least on the upper surface of the convex portion of the uneven pattern of the support base, and the adhesive layer surface of the upper surface of the convex portion has a curved surface. Material.   The adhesive substrate according to claim 1, wherein the adhesive layer is provided only on the upper surface of the convex portion of the uneven pattern of the support substrate.   The adhesive layer is provided also in the concave portion of the uneven pattern of the support base, and the surface height of the adhesive layer provided in the concave portion of the uneven pattern is the upper surface of the convex portion The pressure-sensitive adhesive substrate according to claim 1, wherein the pressure-sensitive adhesive substrate is provided at a position lower than the surface height of the provided pressure-sensitive adhesive layer.   The adhesive substrate according to claim 3, wherein only the surface of the adhesive layer provided on the upper surface of the convex portion of the support substrate has a curved surface.   The difference between the surface height of the adhesive layer provided on the upper surface of the convex portion of the support base and the surface height of the concave portion of the concavo-convex pattern of the support base is at most 1 μm to 100 μm. The adhesive substrate according to claim 2.   The difference between the surface height of the adhesive layer provided on the upper surface of the convex portion of the support base and the surface height of the adhesive layer provided in the recess of the support base is at most 1 μm to 100 μm. The adhesive substrate according to claim 3 or 4, wherein   The maximum thickness of the said adhesion layer is 0.01 micrometer-100 micrometers, The adhesive base material of any one of the Claims 1-6 characterized by the above-mentioned.   The adhesive substrate according to any one of claims 1 to 7, wherein an interval between the adjacent convex portions of the concavo-convex pattern of the support substrate is 1 μm to 100 μm.   The adhesive substrate according to any one of claims 1 to 8, wherein a width of the convex portion of the uneven pattern of the support substrate is 1 μm to 100 μm.   The adhesive strength of the adhesive layer is 23 ° C., a peeling angle of 180 °, and a peeling speed of 300 mm / min, in accordance with JIS Z 0237: 2009. The adhesive base material according to any one of claims 1 to 9, wherein the adhesive strength at the time of peeling under the conditions of is 0.05 to 50 (N / 25 mm width).   The adhesive substrate according to any one of claims 1 to 10, wherein the adhesive substrate is for micro LED transfer. It is a manufacturing method of the adhesive substrate according to any one of claims 1 to 11,
A method for producing an adhesive substrate comprising: forming an adhesive layer having a curved surface on at least the upper surface of the support base by applying an adhesive from a nozzle by electrostatic force.