TWI237533B - Circuit board and manufacturing method thereof - Google Patents

Abstract

A circuit board includes a substrate, an insulating layer, at least one protrusion, and a first circuit layer. The insulating layer is disposed on the substrate, and has at least one protrusion-positioning region. At least part of the protrusion is disposed on the protrusion-positioning region. The first circuit layer is disposed on the insulating layer and has at least one trace line extending onto the protrusion.

Description

1237533

(1) [Technical Field to which the Invention belongs] The present invention relates to a circuit board and a manufacturing method thereof, and particularly to a circuit board formed by an inkjet method and a manufacturing method thereof. (II) [Previous technology] In the current 5 electronic products, the 'circuit board' is almost an indispensable part, and there are many types of circuit boards, as far as the use is concerned, it is used to place various active components or passive components. The printed circuit board of the component (printed ci rein t board), or the carrier circuit board used for mounting the chip in the packaging process. And 'for a printed circuit board on which various active or passive components are placed', usually an electric pad is formed on a circuit line of the printed circuit board, or even a bump is formed on an electric pad, This makes it easy to electrically connect with active or passive components. Generally speaking, the bumps formed on such circuit boards are mostly solder bumps or gold bumps. In addition, 'for a mounting circuit board used for mounting a chip in a packaging process, an electrical pad is usually formed on one of the circuit wires on the mounting circuit board' or even on an electrical pad. A bump to facilitate electrical connection with the chip. Generally speaking, the bumps formed on such circuit boards are mostly solder bumps or gold bumps. As mentioned above, no matter what kind of circuit board, the circuit lines on it are mostly formed by screen printing or lithographic etching, and then bumps are formed on the electrical pads on the circuit lines. However, due to the limitation of the circuit line forming technology and the substrate material of the circuit board, the conventional circuit board electricity 1237533 Case No. 93101286 A_η Revision V. Description of the invention (2) The line width of the route or the electrical connection on the circuit line Pad size is often not effectively reduced. In other words, the area of the circuit board cannot be effectively reduced, which cannot meet the short, small, light, and thin trend required by electronic products. In addition, as far as the conventional circuit board is concerned, since it must undergo a complicated process for forming circuit lines and bumps, neither the production time nor the production cost can be effectively shortened or reduced. Therefore, how to provide a circuit board that can effectively reduce the line width or the size of the electrical pads of the circuit board, and also shorten the production time of the circuit board, reduce the production cost of the circuit board and its manufacturing method is a major issue in the industry . (C), circuit board method with subtractive circuit. Edge board, [Abstract] In view of the above problems, the object of the present invention is to provide a circuit board that can effectively reduce the line width or the size of the electrical pads of the circuit wires, and can also shorten the production time and reduce the production cost. In order to achieve the above object, the circuit board according to the present invention includes a base insulating layer, at least one protrusion, and a first circuit layer. The insulating layer is on the substrate, and at least one protrusion is provided in the insulating layer. The protrusion is at least partially provided in the protrusion setting area of the insulating layer. Suddenly. The first circuit layer is disposed on the insulating layer, and at least one circuit line of the first circuit layer is extended on the protrusion. In addition, the substrate according to the present invention further includes a second circuit layer, the second circuit layer is disposed on one surface of the substrate, and the insulating layer covers the second circuit layer. At this time, at least one

Page 7 1237533 _Case No. 93101286_year month_ifi_ V. Description of the invention (3) Electrical connection hole, the first circuit layer is electrically connected to the second circuit layer through the electrical connection hole. In addition, the method for manufacturing a circuit board according to the present invention includes the following steps: forming an insulating layer on a substrate; forming at least one protrusion setting area in the insulating layer; forming at least a protrusion setting area of the insulating layer A protrusion; and forming a first circuit layer on the insulating layer, and extending at least one circuit line of the first circuit layer over the protrusion. In addition, the method for manufacturing a circuit board according to the present invention further includes: forming a second circuit layer on one surface of the substrate, and the insulating layer covers the second circuit layer. At this time, at least one electrical connection hole is formed in the insulating layer, and the first circuit layer is electrically connected to the second circuit layer through the electrical connection hole. As mentioned above, in the present invention, the protrusions can be formed by injecting a high-molecular polymer or a resin material into the protrusion setting area by an inkjet method. The first circuit layer can be formed by spraying a coating liquid containing metal particles on an insulating layer or a projection by an inkjet method. The second circuit layer can be formed by spraying a coating liquid containing metal particles on a substrate by an inkjet method. In summary, as for the circuit board and the manufacturing method thereof of the present invention, since the protrusions can be formed by the inkjet method, and the first circuit layer and the second circuit layer can also be formed by the inkjet method, in other words, That is, there is no need to perform complicated procedures such as a traditional printing method or an etching method. Therefore, the circuit board and the manufacturing method thereof of the present invention can shorten the production time of the circuit board and reduce the production cost. In addition, since the current inkjet technology can already produce line widths of 20 microns or less, the circuit board and its manufacturing method of the present invention can effectively reduce the line width or electrical pads of the circuit lines of the circuit board. size.

1237533 Amendment ----- 9310128B_Year and Month Five, Description of the Invention (4) (IV), [Embodiment] The following will refer to fl ?, related drawings, to explain the electric = board, . What needs to be explained here is that in the present invention, the so-called circuit board is used as a circuit board on which various active components or passive components are placed, or is used in a packaging process as a circuit board on which chips are placed. 2. To make the content of the present invention easier to understand, an example will be given below to illustrate a circuit board according to a preferred embodiment of the present invention. As shown in FIG. 1, the circuit board 1 of the present invention includes a substrate 1, an insulating layer 12, at least one protrusion 13, and a first circuit layer ι4. Please refer to FIG. 2, the insulating layer 12 is disposed on the substrate 丨 丨. Insulation, at least 1 2 is provided with a protrusion setting area 1 2 丨. In this embodiment, the protrusion setting area 121 in the insulation layer 12 is an opening. However, as shown in FIG. 3: a large object setting Zone 1 2 1 can also be a groove (please refer to Figure 7 at the same time). The protrusion setting area 121 is provided with a protrusion 13 / a protrusion 13 respectively, and is at least partially disposed in the protrusion setting area 丄 2 丨 of the insulating layer 丨 2. The first circuit layer 14 is disposed on the insulating layer 12, and the first circuit line im is extended on the protrusion 13. The substrate 11 in the embodiment of the transmission t is a glass substrate. , Insulating layer 12 several materials or inorganic materials. The inorganic material can be oxidized or nitrogen ... (S1NX), or aerobic oxidized (slOXNy) Shi Lun I: from the 1st, 3rd, 3th, 3 homopolymer, or resin materials. In this example, the protrusion 13 is included-it is better to have an elastic material. In addition, as shown in FIG. 4, the substrate 11 of the circuit board 1 of the present invention is more predictable.

1237533 __Case No. 9310128fi_ — year, month and day ___ 5. Description of the invention (5) A second circuit layer 15 is formed first. The second circuit layer 15 is disposed on one surface 11 1 of the substrate 11, and the insulating layer 12 covers the second circuit layer 15. At this time, the insulating layer 12 can be further provided with at least one electrical connection hole 1 2 2, and the circuit line 1 4 1 of the first circuit layer 14 can be connected to the second circuit layer 1 5 through the electrical connection hole 1 2 2. Electrical connection. In addition, as shown in FIG. 5, the circuit board 1 of the present invention may further include an electronic component 16. The electronic component 16 is electrically connected to a circuit line 14 of the first circuit layer 14 provided on the protrusion 13. In this embodiment, the electronic component 16 is a wafer, and the wafer is bonded to the first circuit layer 14 in a flip-chip bonding manner. Of course, the electronic components 16 can also be passive components or active components. Since the protrusions 13 of the present invention can be elastic, when the wafer is bonded to the circuit wires 1 4 1 of the first circuit layer 14 provided on the protrusions 13, the bonding of the wafer can be facilitated. Hereinafter, a method for manufacturing a circuit board according to the present invention will be described in detail with reference to FIGS. 6 to 9. As shown in FIG. 6, a method for manufacturing a circuit board according to the present invention is to form an insulating layer 12 on a substrate n. Then, as shown in FIG. 7, a laser zap method or a lithographic etching method is used. At least one protrusion setting region 1 2 1 is formed in the insulating layer. In this embodiment, the protrusion setting area 1 2 1 is a groove, but the protrusion setting area 1 2 1 may also be an opening. After the protrusion setting area 121 is formed, as shown in FIG. 8, at least one protrusion 13 is formed at the protrusion setting area 121; the protrusions are small and small, and the polymer or resin material 13 , Is formed by being implanted into the protrusion setting region 121. In this embodiment, the protrusion 13 includes a

1237533 month Amendment No. 93im ?, 8fi V. Description of the invention (β) Elastic material is preferred. After forming one or two = forming the protrusions 1 3, as shown in FIG. 9, the circuit layer U ′ is formed on the insulating layer 12 and the at least one circuit line of the first circuit layer 14 is 1 3. Above. At this time, the first mutual circuit 141 and the circuit circuit 141 provided on the protrusion 13 can be used to connect with an electronic component, such as a chip or a chip. At this time, "the protrusions 1 and 3 are elastic", so that the circuit lines M1 of the first circuit layer 14 provided on the protrusions 13 on the same day can facilitate the bonding of the wafer. Spoon: I: In the example, the substrate 11 is a glass substrate. ❿, the insulating layer 1 2 ί (si〇!) ° CSiOx), or nitrogen silicon compounds (s, etc .. The first circuit layer 14 can be sprayed with black square; two milk 2 stone evening S10XNy) coating liquid spraying In the insulating layer 12 or the protrusions containing particles are silver particles, or gold particles, or copper particles, or micro metal & pull system can be manufactured = another circuit board of the present invention will be described in detail with reference to FIGS. 10 to 15. As shown in FIG. 10, a manufacturing method of forming a second circuit bank 15 on a surface 111 of another mine 11 of the present invention is based on a substrate ";; " :: Γ ^^ J, Γ: ... Or: Micro: The metal particles can be silver particles or gold particles, as shown in FIG. 11, and then the substrate insulating layer 12 is covered with the second circuit layer 15. An insulating layer 12 is formed on the reverse 11. After the insulating layer 12 is formed, as shown in FIG. 12, the laser processing is then performed 1237533 j-case number! 1P1.2_L6__year a n Amendment V. Description of the invention (7) (1 a s er z a p) method, or lithographic etching method, in which one protrusion is provided in the insulating layer 1 2 1 and at least one electrical connection hole 1 2 2. In the present example, the 'dog lifting object setting area 1 2 1' is a groove, but the protruding object design may also be an opening. When the protrusion setting area 1 2 1 and the electrical connection hole are formed! After 2 2, as shown in the figure, at least one protrusion j 3 is formed at the protrusion setting area 1. The 1 3 system can inject a polymer or resin 1 3 into the protrusion setting area by an inkjet method. 1 2 1 is formed, and in this embodiment, the object 1 3 is preferably a material with elasticity. After the protrusions 13 are formed, as shown in FIG. 14, the insulating layer forms a first circuit layer 14, and at least one electric 1 4 1 of the first circuit layer 14 is extended on the protrusions 13. In this embodiment, the first electric 5 series can be formed by spraying a coating liquid containing metal particles on 12 or projections 13 by an inkjet method, and the metal particles can be silver particles, particles, or copper. Particles, or particles. At this time, as shown in FIG. 15, the circuit lines 1 4 1 of the first circuit layer 14 on the device 13 can be used to be electrically connected to the unit 16. At this time, since the protrusions 3 can be elastic, when the wafer is bonded to the circuit of the first circuit layer 14 provided on the protrusions 3, the bonding of the wafer can be facilitated. In this embodiment, the electronic component 16 is a wafer, and the flip-chip bonding method is bonded to the first circuit layer 14. Of course, the electronic element can also be a passive element or an active element. In addition, in this embodiment, 11 is a glass substrate. The insulating layer 12 includes an organic material or a material. The inorganic material can be formed of silicon oxide (si 0χ), or nitrogen stone. The embodiment includes 1 21 13 areas; protruding materials, protrusions 12 2 layers on the shape line 14 insulation layer or gold is slightly smaller than the protrusions ^ For this reason, when the line 141 is based on 16 series of substrates, the inorganic material compound 1237533 _ case number 93101286 _ year month day__ 5. Description of the invention (8) (SiNx), or silicon oxynitride (SiOxNy), etc. In summary, as for the circuit board and the manufacturing method thereof of the present invention, since the protrusions can be formed by the inkjet method, and the first circuit layer and the second circuit layer can also be formed by the inkjet method, in other words, That is, there is no need to perform complicated procedures such as a traditional printing method or an etching method. Therefore, the circuit board and the manufacturing method thereof of the present invention can shorten the production time of the circuit board and reduce the production cost. In addition, since the current inkjet technology can already produce line widths of 20 microns or less, the circuit board and its manufacturing method of the present invention can effectively reduce the line width or electrical pads of the circuit lines of the circuit board. size. The above description is exemplary only, and not restrictive. Any equivalent modification or change made without departing from the spirit and scope of the present invention shall be included in the scope of the attached patent application.

Page 13 1237533 _Case No. 93101286_Year Month and Day__ Brief Description of the Drawings (V), [Simplified Description of the Drawings] FIG. 1 is a partial schematic view showing a circuit board according to a preferred embodiment of the present invention. FIG. 2 is a cross-sectional view showing the line A-A shown in FIG. 1. FIG. Fig. 3 is another cross-sectional view showing the line A-A shown in Fig. 1. Fig. 4 is a schematic cross-sectional view showing another circuit board according to a preferred embodiment of the present invention. Fig. 5 is a schematic cross-sectional view showing a case where a wafer is provided in another circuit board according to a preferred embodiment of the present invention.

6 to 9 are explanatory diagrams of steps of a method for manufacturing a circuit board according to a preferred embodiment of the present invention. 10 to 15 are another circuit board manufacturing method according to a preferred embodiment of the present invention.

Illustration of method steps. Component symbol description: 1 Circuit board 11 Base board 111 One of the base boards Surface 12 Insulation layer 121 Projection setting area 122 Electrical connection hole 13 Projection 13 ’Resin material (projection) 14 First circuit layer

Page 14 1237533 _ Case No. 93101286_ Year Month Day _ Amendment Brief illustration 141 Circuit line 15 Second circuit layer 16 Electronic component Page 15

III

Claims (1)

1237533 _ Case No. 93101286_ Year Month Date _ ^ _ VI. Scope of Patent Application 1. A circuit board includes: a substrate; an insulating layer is provided on the substrate, and at least one protrusion is provided in the insulating layer Installation area; at least one protrusion is at least partially provided in the protrusion installation area of the insulating layer; a first circuit layer is provided on the insulation layer, and at least one circuit line of the first circuit layer is extended On the protrusion; and an electronic component, which is electrically connected to the circuit line of the first circuit layer provided on the protrusion. 2. The circuit board according to item 1 of the scope of patent application, wherein the substrate includes a second circuit layer, the second circuit layer is disposed on one surface of the substrate, and the insulating layer covers the second Circuit layer. 3. The circuit board according to item 2 of the scope of patent application, wherein the insulation layer is further provided with at least one electrical connection hole, and the first circuit layer is electrically connected to the second circuit layer through the electrical connection hole. link. 4. The circuit board according to item 1 of the scope of patent application, wherein the electronic component is a wafer, and the wafer is bonded to the first circuit layer in a flip-chip bonding manner. 5. The circuit board according to item 1 of the scope of patent application, wherein the substrate is Page 16 1237533 _ Case No. 93101286 _ Month and Day __ VI. Scope of patent application Glass substrate. 6. The circuit board according to item 1 of the scope of patent application, wherein the insulating layer comprises an organic material or an inorganic material. 7. The circuit board according to item 1 of the scope of the patent application, wherein the insulating layer is a stone oxide compound, or a nitrogen oxide compound, or a nitrogen oxide oxide. 8. The circuit board according to item 1 of the scope of the patent application, wherein the protrusions include a polymer or a resin material. 9. The circuit board according to item 1 of the scope of patent application, wherein the protrusion is elastic. 10. The circuit board according to item 1 of the scope of application for a patent, wherein the protrusion setting area of the insulating layer is an opening. 1 1. The circuit board according to item 1 of the scope of patent application, wherein the protrusion setting area of the insulating layer is a groove. 12. A method for manufacturing a circuit board, comprising: forming an insulating layer on a substrate; forming at least one protrusion setting area in the insulating layer; forming at least one protrusion at the protrusion setting area of the insulating layer; Page 17 1237533 _Case No. 93101286_ Year Month Date _ ^ _ VI. Scope of patent application: A first circuit layer is formed on the insulating layer, and at least one circuit line of the first circuit layer is extended to the protrusion. Above; and the circuit line electrically connecting an electronic component to the first circuit layer on the protrusion. 1 3. The method for manufacturing a circuit board according to item 12 of the scope of patent application, further comprising: forming a second circuit layer on one surface of the substrate, and the insulating layer covering the second circuit layer. 14. The method for manufacturing a circuit board according to item 13 of the scope of patent application, wherein after the insulating layer is formed on the substrate, at least one electrical connection hole is further formed in the insulating layer. And is electrically connected to the second circuit layer through the electrical connection hole. 15. The method for manufacturing a circuit board according to item 13 of the scope of the patent application, wherein the electrical connection hole is formed by a laser processing (1 a s e r z a p) method or a lithography I insect engraving method. 16. The method for manufacturing a circuit board according to item 12 of the scope of the patent application, wherein the protrusion setting area is formed by a laser processing method or a lithographic etching method. 17. The method for manufacturing a circuit board according to item 14 of the scope of application for a patent, wherein the electrical connection holes are formed at the same time when the protrusion setting area is formed. Page 18 1237533 _ Case No. 93101286 _ Month and Day __ VI. Patent application scope 1 8. The circuit board manufacturing method described in item 12 of the patent application scope, wherein the electronic component is a wafer and the wafer is Bonded to the first circuit layer by a flip-chip bonding method. 19. The method for manufacturing a circuit board according to item 12 of the scope of the patent application, wherein the first circuit layer is a spray solution containing metal particles sprayed on the insulating layer or protrusions by an inkjet method. form. 20. The method for manufacturing a circuit board according to item 19 of the scope of patent application, wherein the metal particles are silver particles, or gold particles, or copper particles, or palladium particles. 2 1. The method for manufacturing a circuit board according to item 13 of the scope of patent application, wherein the second circuit layer is formed by spraying a coating liquid containing metal particles on the substrate by an inkjet method. 2 2. The method for manufacturing a circuit board according to item 21 of the scope of the patent application, wherein the metal particles are silver particles, or gold particles, or copper particles, or palladium particles. 2 3. The method for manufacturing a circuit board according to item 12 of the scope of patent application, wherein the substrate is a glass substrate. Page 19 1237533 _ Case No. 93101286 _ year month date __ VI. Patent application scope 2 4. The method for manufacturing a circuit board as described in item 12 of the patent application scope, wherein the insulating layer comprises an organic material or an inorganic material material. 25. The method for manufacturing a circuit board according to item 12 of the scope of the patent application, wherein the insulation layer is an oxygen compound, or a nitrogen oxide compound, or an oxynitride. 26. The method for manufacturing a circuit board according to item 12 of the scope of patent application, wherein the protrusions include a polymer or a resin material. 27. The method for manufacturing a circuit board according to item 12 of the scope of patent application, wherein the protrusion is elastic. 28. The method for manufacturing a circuit board according to item 12 of the scope of the patent application, wherein the protruding area of the insulating layer is an opening. 29. The method for manufacturing a circuit board according to item 12 of the scope of the patent application, wherein the protrusion setting area of the insulating layer is a groove. 30. The method for manufacturing a circuit board according to item 12 of the scope of patent application, wherein the protrusion is formed by an inkjet method. Page 20