JP2019096728A - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP2019096728A JP2019096728A JP2017224610A JP2017224610A JP2019096728A JP 2019096728 A JP2019096728 A JP 2019096728A JP 2017224610 A JP2017224610 A JP 2017224610A JP 2017224610 A JP2017224610 A JP 2017224610A JP 2019096728 A JP2019096728 A JP 2019096728A
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- Prior art keywords
- liquid supply
- cutting
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- flange
- blade
- Prior art date
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Abstract
Description
スピンドル62の軸方向(Y軸方向)に延びる溝631aは、ブレード支持部631の外周に周方向に等間隔を空けて複数形成されている。
第2の挟持部642の環状の背面は、切削ブレード60を挟持する面となる。第2の放射溝642aは、第2の挟持部642の背面に周方向に等間隔を空けて複数形成されており、第2の挟持部642の背面を横断している。
図1に示す被加工物Wは、例えば、ガラス材とエポキシ樹脂とからなるガラスエポシキを母材とする円形板状の基板であり、その表面Waには、切削予定ラインSによって区画された格子状の領域にデバイスDが形成されている。また、被加工物Wには、銅、アルミニウム、又はニッケル等の金属からなる図示しない配線が形成され、配線がエポキシ樹脂で覆われている。例えば、被加工物Wの裏面WbはダイシングテープTの貼着面に貼着され、ダイシングテープTの外周部は環状フレームFに貼着されている。これにより、被加工物Wは環状フレームFを用いたハンドリングが可能なワークユニットの状態になっている。なお、被加工物Wは、上記のようなガラエポ基板に限定されず、矩形状の外形を備えるパッケージ基板、低誘電率絶縁体と金属箔と積層された積層体(Low−k膜)を備える半導体ウエーハ、又は、切削予定ラインにTEG(評価用素子)と称される金属膜が形成されているウエーハ等であってもよい。
例えば、分子内に3つ以上の窒素原子を有し、且つ、縮環構造を有する複素芳香環化合物、又は、分子内に4つ以上の窒素原子を有する複素芳香環化合物を用いることが好ましい。更に、芳香環化合物は、カルボキシル基、スルホ基、ヒドロキシ基、アルコキシ基を含むことが好ましい。具体的には、テトラゾール誘導体、1,2,3−トリアゾール誘導体、及び1,2,4−トリアゾール誘導体であることが好ましい。
11:切削送り手段
110:ボールネジ 111:ガイドレール 112:モータ 113:可動板
12:インデックス送り手段
120:ボールネジ 121:ガイドレール 122:モータ 123:可動板
3:保持手段
30:保持テーブル 30a:保持面 31:支持ベース 34:固定クランプ
18:アライメント手段 180:撮像手段 19:モニター
6:切削手段 60:切削ブレード 600:開口 61:ハウジング
62:スピンドル 620:雄ねじ
63:第1のフランジ 630:ボス部 630a:雄ねじ 631:ブレード支持部 631a:溝 632:第1の挟持部 632a:第1の放射溝 632b:凹部 633:連通口 634:嵌合孔
64:第2のフランジ 640:開口 642:第2の挟持部 642a:第2の放射溝
650:ブレード挟持ナット 651:フランジ固定ナット
66:液体供給室
67:第1の液体供給手段 68:第2の液体供給手段
W:被加工物 S:切削予定ライン D:デバイス T:ダイシングテープ F:環状フレーム
70:第3の液体供給手段
Claims (6)
- 被加工物を保持する保持手段と、該保持手段が保持した被加工物を切削する切削ブレードを回転可能に備えた切削手段とを少なくとも備えた切削装置であって、
該切削手段は、ハウジングに回転可能に支持されたスピンドルと、該スピンドルの先端に装着された第1のフランジと、該第1のフランジの中央に形成されたボス部が挿入される開口を有し該切削ブレードを固定する第2のフランジと、を備え、
該第1のフランジは、該ボス部の外周に形成され該切削ブレードの中央に形成された開口に挿入するブレード支持部と、該ブレード支持部の外周に形成され該切削ブレードを挟持する環状の第1の挟持部と、該ブレード支持部の外周に複数形成され該スピンドルの軸方向に延びる溝と、該溝に連通し該スピンドルの軸方向に貫通する連通口と、該第1の挟持部に複数形成され該スピンドルの軸方向に対して放射状に延びる第1の放射溝と、を備え、
該第2のフランジは、該ブレード支持部を受け入れ該第1の挟持部と共に該切削ブレードを挟持する環状の第2の挟持部と、該第2の挟持部に複数形成され該スピンドルの軸方向に対して放射状に延びる第2の放射溝と、を備え、
該連通口には、液体を供給する液体供給路を備えた液体供給手段が接続され、
該液体供給手段によって供給された液体は、該連通口から該溝と該第1の放射溝と該第2の放射溝とに至り該切削ブレードに供給される切削装置。 - 前記第1のフランジと前記第2のフランジとで前記切削ブレードを挟持したとき、前記溝と前記第1の放射溝との間及び該溝と前記第2の放射溝との間に環状の液体供給室を形成する請求項1記載の切削装置。
- 前記液体供給手段は、第1の液体供給路を備えた第1の液体供給手段と、第2の液体供給路を備えた第2の液体供給手段とを備え、
前記切削ブレードの回転方向に対して、下流側に該第1の液体供給手段が位置づけられ、上流側に該第2の液体供給手段が位置づけられる請求項1又は2記載の切削装置。 - 前記第1の液体供給手段は、防食剤を供給し、前記第2の液体供給手段は、酸化剤を供給する請求項3記載の切削装置。
- 前記第1の液体供給手段は、防食剤と有機酸とを混合して供給し、前記第2の液体供給手段は、酸化剤を供給する請求項3記載の切削装置。
- 前記液体供給手段に第3の液体供給路を備えた第3の液体供給手段を加え、前記切削ブレードの回転方向に対して、前記第2の液体供給手段より上流側に該第3の液体供給手段が位置づけられ、
前記第1の液体供給手段は、防食剤を供給し、該第2の液体供給手段は、酸化剤を供給し、該第3の液体供給手段は、有機酸を供給する請求項3記載の切削装置。
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JP2016054182A (ja) * | 2014-09-03 | 2016-04-14 | 株式会社ディスコ | ウエーハの加工方法 |
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