JP2019093369A - Placing device - Google Patents

Abstract

To provide a placing device which reduces the intrusion and deposition of a solution material on a back surface of a substrate, when the solution material is applied to the substrate placed on the placing device.SOLUTION: In a placing device 10 placing a substrate 2 applied with a liquid, a placing surface 12 on which the substrate 2 is placed is a surface with a size that can be stored in an inner range than an outer periphery of a placed surface, has a blow-out portion which blows out a gas toward a non-contacting area 6 that is a part projected out from the placing surface 12 when the substrate 2 is placed on the placing surface 12, and has a counterbored portion that has lower surface height then the placing surface 12.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a coating apparatus for applying a solution material to a substrate.

  2. Description of the Related Art Conventionally, an electrospray apparatus has been known which sprays a voltage-applied solution material from a nozzle and deposits it as a thin film on a substrate held by an adsorption stage. (For example, refer to Patent Document 1). In such an electrospray apparatus, by applying a high voltage to a metal nozzle, a Taylor cone is formed by the Coulomb repulsion between identical charges aggregated on the surface of the solution material at the tip of the nozzle opening, and the Coulomb repulsion However, when the surface tension of the solution material exceeds the surface tension of the droplets, the droplets spread in the form of a spray, and the substrate is fixed to the electrically grounded adsorption stage using the phenomenon that electrospray occurs to supply the solution material. By applying a high voltage to the nozzle, a potential difference between the nozzle and the adsorption stage is provided, and the solution material is sprayed onto the substrate and deposited as a thin film.

JP, 2014-180590, A

  Here, the suction stage used in the electrospray apparatus as disclosed in Patent Document 1 has a large number of holes in the surface on which the substrate is to be mounted, and the vacuum device communicating with the holes sucks the substrate Do. However, in such a suction stage, a scrap gap is present between the suction stage and the substrate due to, for example, very slight unevenness on the surface of the suction stage on which the substrate is mounted, a warp of the substrate, or the like.

  When the solution material is spray applied to the substrate, the sprayed solution material passing near the side of the substrate without being deposited on the substrate is deposited on the adsorption stage near the substrate without depositing on the substrate. In addition, a solution material which is deposited on the substrate and then transmitted along the side of the substrate is also deposited on the adsorption stage in the vicinity of the substrate. The solution material deposited on the adsorption stage in the vicinity of these substrates accumulates at a very small gap inlet between the substrate and the adsorption stage. As a result, capillary action is exerted, and the solution material may further enter the gap, and the solution material may adhere to the back surface of the substrate.

  In order to solve the above-mentioned subject, the mounting device of the present invention is a mounting device on which a substrate to which a liquid is applied is mounted, wherein the mounting surface on which the substrate is mounted is a mounting surface of the substrate It is characterized in that it is a surface of a size that falls within the range inside the outer periphery of the surface.

  By making the mounting surface smaller than the back surface of the substrate which is the mounting surface of the substrate, only the inside can be mounted without being in contact with the outer periphery of the substrate. Since the liquid (solution material) is not deposited directly on the mounting surface, it is possible to prevent the solution material from flowing along the mounting surface and entering the gap between the mounting surface and the substrate by capillary action. In addition, since the solution material transmitted to the side surface of the substrate after being applied to the substrate is affected by the gravity on the back surface of the substrate, the propagation to the gap between the mounting surface and the substrate can be reduced. In this way, the solution material can be introduced into the gap between the mounting surface and the substrate by capillary action, and the solution material can be reduced to the back surface of the substrate.

  In addition, in the mounting surface of the substrate, the substrate has a blowout portion for blowing out gas toward a non-contact area which is a portion protruding from the mounting surface when the substrate is mounted on the mounting surface. It may be a feature.

  In this way, the air stream blown out from the blowout portion toward the non-contact area is applied to the substrate and then hits the solution material transmitted through the substrate surface, so that the solution material is more on the back side of the substrate It is possible to reduce wraparound.

  In addition, it may be characterized in that the mounting surface is enclosed and the shoulder drop portion whose surface height is lower than the mounting surface is included.

  By providing the shoulder-dropping portion, the air flow blown out from the shoulder-dropping portion side can easily flow to the outside of the substrate after hitting the non-contact area. Therefore, the solution material extending along the side surface of the substrate and flowing around the back surface of the substrate can be an air flow flowing to the outside of the substrate, and the solution material can be reduced inside from that as compared to the case without the shoulder drop. This can reduce the wraparound of the solution material to the back surface of the substrate.

  The shoulder dropper may be characterized in that the height of the surface close to the outer periphery of the mounting surface of the substrate is higher than the height of the other surfaces.

  By doing this, the velocity of the air flow from the blowout portion flowing from the noncontact region to the outside of the substrate is made to be a shape in which the space between the shoulder drop portion and the noncontact region is narrowed toward the outside of the substrate. The space between the shoulder drop and the non-contact area can be made faster towards the outside of the substrate than in the non-squeezed configuration. By doing this, the case where the solution material applied to the substrate that travels over the surface of the substrate does not squeeze the space between the shoulder drop portion and the non-contact region toward the outside of the substrate. It can be reduced more than that.

  Further, in the shoulder drop portion, the area of the shoulder drop portion projected toward the mounting surface of the substrate from the direction perpendicular to the mounting surface of the substrate is the surface of the mounting surface of the substrate. It may be characterized in that it is inside the outer periphery.

  By forming the shoulder drop portion inward from the range of the substrate, the direction of the air flow from the blowout portion in the non-contact area is the direction in which there is no shoulder drop portion after hitting the non-contact area, that is, By facing the side of the placement apparatus opposite to the direction in which the substrate is present, it is possible to prevent the blowing of air flow to the front side of the substrate. By doing this, it is possible to reduce that the air flow from the blowout part blows to the surface side of the substrate and interferes with the solution material sprayed toward the substrate to affect the application state on the substrate surface.

  Further, the placement device may be characterized by including an adsorption portion opened to the placement surface and a negative pressure application mechanism communicating with the adsorption portion.

  In the case of suction holding on the mounting surface, a negative pressure is generated around the mounting surface, but in the present invention, since there is a distance between the outer periphery of the mounting surface and the outer periphery of the substrate, this negative pressure It can be reduced that the solution material in the vicinity of the outer peripheral portion of the substrate is drawn into the gap between the substrate and the mounting surface.

  According to the present invention, as described above, when the solution material is applied to the substrate placed on the placement apparatus, the solution material can be reduced from coming around and adhering to the back surface of the substrate.

It is the schematic which showed an example of the common electrospray apparatus. It is a schematic plan view of the general mounting apparatus of arrow a of FIG. It is a side view of b arrow of FIG. It is the figure which showed the state of the back surface of the board | substrate at the time of apply | coating without using the mounting apparatus of this invention of c arrow of FIG. It is the schematic which showed an example of the electrospray apparatus which has a mounting apparatus of this invention. FIG. 5 is a schematic plan view showing an example of the mounting device of the first embodiment. It is a side view of e in FIG. FIG. 8 is a schematic side view showing an example of the mounting device of the second embodiment. FIG. 16 is a schematic plan view showing an example of the mounting device of the third embodiment. It is a side view of f arrow of FIG. FIG. 18 is a schematic side view showing an example of the mounting device of the fourth embodiment. FIG. 21 is a schematic side view showing an example of the mounting device of the fifth embodiment.

  Embodiments of the present invention will be described with reference to the drawings. First, a schematic diagram of an example of a typical electrospray device having a mounting device is shown in FIG. The electrospray device 1 is positioned on the spray side of the nozzle 3 for spraying the solution material to which voltage is applied, the voltage control unit 4 for applying a voltage to the solution material sprayed from the nozzle 3, and the substrate 2. And a mounting device 10 'to be mounted.

  The nozzle 3 is a cylindrical thin tube made of metal, for example, and one end of the opening is in communication with a solution material supply unit (not shown), and the other end of the opening is disposed to face the mounting device 10 ′. By applying a voltage controlled by the voltage control unit 4 directly to the nozzle 3, a voltage is applied to the solution material supplied from the solution material supply unit (not shown) to the inside of the nozzle 3 to face the placement device 10 ' After forming the tailor cone by the voltage applied solution material at the side nozzle tip, the solution material is sprayed from the tailor cone tip.

  The placement device 10 'is made of, for example, a conductive material such as metal, and is electrically grounded. By providing a potential difference between the nozzle 3 and the mounting device 10 ′ by the voltage control unit 4, the solution material sprayed from the nozzle 3 flies toward the mounting device 10 ′. Thus, the solution material is applied to the substrate 2 placed on the placement device 10 '.

  Here, in the substrate 2 placed on the placement device 10 ′ and the placement device 10 ′, the flatness or surface roughness of the surface on which the substrate 2 of the substrate 2 is warped or the suction placement device 10 ′ is placed. There is a very slight gap between the mounting device 10 'and the substrate 2 depending on the degree or the like.

  First, a general placement device 10 'will be described using FIGS. 2 and 3. FIG. FIG. 2 is a schematic plan view of the mounting apparatus 10 'in the direction of arrow a in FIG. 1, and FIG. 3 is a view in the direction of arrow b in FIG. The mounting apparatus 10 ′ is provided on the mounting surface 12 on which the substrate 2 is to be mounted, and in the mounting area 13 which is a region on the mounting surface 12 on which the substrate 2 is to be mounted. The suction unit 11 holds the back surface which is the surface opposite to the surface (surface) and holds the substrate 2, and a negative pressure application mechanism (not shown) communicating with the suction unit 11. Here, the size of the mounting surface 12 is larger than the size of the back surface of the substrate 2, and the entire substrate 2 is mounted on the mounting surface 12. That is, the range of the mounting area 13 is equal to the range of the back surface of the substrate 2.

  The adsorbing portion 11 has a plurality of through holes 15 which are opened to the mounting surface 12 and communicate with a negative pressure applying mechanism (not shown). By the negative pressure supplied from a negative pressure application mechanism (not shown), the through hole 15 of the suction unit 11 sucks the back surface of the substrate 2 mounted on the mounting area 13 on the mounting surface 12 and suctions the substrate 2 11 grips.

  Here, as described above, since a very small gap exists between the mounting device 10 ′ and the substrate 2, a negative pressure by a negative pressure application mechanism (not shown) also exists in this gap.

  As the application of the solution material to the substrate 2 proceeds, the solution material deposited on the mounting surface 12 near the substrate side surface 7 without depositing on the substrate 2, and after depositing on the substrate 2, the substrate 2 The solution material deposited on the mounting surface 12 in the vicinity of the substrate side surface 7 along the substrate side surface 7 which is the side surface is accumulated in the gap inlet between the substrate 2 and the mounting surface 12. As a result, capillary action may occur, and the solution material may enter this gap and adhere to the back surface of the substrate 2. Further, the negative pressure from the adsorption portion 11 also acts on this gap, and the solution material in the vicinity of the substrate side surface 7 is drawn into the gap between the substrate 2 and the mounting surface 12 by this negative pressure. Material may stick. This state is shown in FIG. FIG. 4 is a view taken in the direction of the arrow c in FIG. 3, and the hatched portion indicates a portion to which the solution material is attached.

An example of the mounting apparatus of Example 1 of this invention is demonstrated using FIG.5, FIG.6 and FIG. FIG. 5 is a schematic view showing an example of an electrospray apparatus having the mounting device of the present invention. 6 is a schematic plan view of the mounting apparatus 10 according to the first embodiment as viewed in the direction of the arrow d in FIG. 5, and FIG. 7 is a view as viewed in the direction of the arrow e in FIG.
The mounting apparatus 10 according to the first embodiment is, compared to the general mounting apparatus 10 ′ described with reference to FIGS. 2 and 3, in the substrate 2 in which the range of the mounting surface 12 is the mounting surface of the substrate 2. It is smaller than the range of the back surface, and the range of the mounting area 13 is inside the range of the back surface of the substrate 2 and is equal to the range of the mounting surface 12. Because the mounting surface 12 is inside the substrate 2 when the substrate 2 is mounted on the mounting surface 12, the substrate 2 is mounted between the outer periphery of the substrate 2 and the mounting area 13 on the back surface of the substrate 2. There is a non-contact area 6 which is an area where the surface 12 does not contact.

  By making the mounting surface 12 smaller than the back surface of the substrate 2 which is the mounting surface of the substrate 2, the non-contact region 6 can be provided on the back surface of the substrate 2 and the inner side without contacting the outer periphery of the substrate 2. Can only be placed. Since the solution material is not deposited directly on the mounting surface 12, it is possible to prevent the solution material from flowing along the mounting surface 12 and entering the gap between the mounting surface 12 and the substrate 2 by capillary action. In addition, since the solution material transmitted to the substrate side surface 7 after being applied to the substrate 2 is affected by the gravity on the back surface of the substrate 2, the propagation to the gap between the mounting surface 12 and the substrate 2 can be reduced. By doing this, it is possible to reduce that the solution material gets into the gap between the mounting surface 12 and the substrate 2 by capillary action and the solution material gets around to the back surface of the substrate 2. In addition, although negative pressure from the suction unit 11 also acts on the gap between the substrate 2 and the mounting surface 12, negative pressure is generated around the mounting surface 12, but the outer periphery of the mounting surface 12 and the substrate 2 Since the distance between the substrate 2 and the outer periphery of the substrate 2 is reduced, the negative pressure can reduce the attraction of the solution material in the vicinity of the outer periphery of the substrate 2 into the gap between the substrate 2 and the mounting surface 12.

  The mounting apparatus 20 according to the second embodiment of the present invention is a substrate 2 protruding from the mounting surface 12 of the substrate 2 when the substrate 2 is mounted on the mounting surface 12 with respect to the mounting apparatus 10 according to the first embodiment. It further has the blowing part 26 which blows gas on the non-contact area | region 6 which is a part of back surface of.

  An example of the mounting apparatus of Example 2 of this invention is demonstrated using FIG. FIG. 8 is a schematic elevation view seen from the same direction as the e arrow view in FIG. 6 described in the first embodiment. Hereinafter, the same reference numerals as those of the first embodiment are used for the same structures as the first embodiment. The blowout portion 26 of the mounting apparatus 20 according to the second embodiment includes a blowout port 27 opened on the side surface of the mounting apparatus 20, a plurality of through holes 28 communicating with the blowout port 27, and a plurality of through holes 28 Not have a pressurized air supply device.

  The outlet 27 is provided at a predetermined angle of, for example, about 15 ° with respect to the vertical direction from the side surface of the mounting device 20 so that the gas blown out from the outlet 27 hits the non-contact area 6 It is a continuous groove opening on the side of 20. The cross-sectional shape of the groove is uniform over the entire circumference of the groove, the side surface of the groove is parallel to the predetermined angle from the vertical direction described above, and the bottom of the groove is relative to the predetermined angle from the vertical direction described above The angle between the bottom and the side of the groove perpendicular to each other is trapezoidal. Here, the dimension of the groove cross section is, for example, between the side surfaces of the groove, that is, the dimension in the width direction of the groove is about several mm to 10 mm, and the dimension of the depth of the groove is the shallower of the bottom of the groove, ie, The dimension from the lower intersection point of the side surface of the mounting device 20 and the outlet 27 to the bottom of the groove is about several mm to 10 mm.

  A plurality of through holes 28 are disposed at the bottom of the groove of the outlet 27 so that the flow rate distribution or velocity distribution of the gas blown out from the outlet 27 is substantially uniform. Further, the angle of the through hole 28 in the cross-sectional direction of the groove of the outlet 27 is parallel to the side surface of the groove of the outlet 27 so that the gas blown out from the outlet 27 strikes the non-contact area 6 straight.

  By supplying compressed air to the outlet 27 via the plurality of through holes 28 by a compressed air supply device (not shown), the gas is blown toward the non-contact area 6. In this way, the air flow blown out from the blowout part 26 toward the non-contact area 6 is applied to the substrate 2 and then hits the solution material transmitted through the substrate side surface 7 so that the solution material becomes more substrate It is possible to reduce the wrap around 2 back side.

  An example of the mounting apparatus of Example 3 of this invention is demonstrated using FIG. 9 and FIG. FIG. 9 is a schematic plan view of the mounting device 30 of the third embodiment, and FIG. 10 is a view on arrow f in FIG. The mounting apparatus 30 of the third embodiment has a shoulder drop portion 34 whose surface height is lower than the surface height of the mounting surface 12 around the mounting surface 12 as compared with the mounting apparatus 20 described in the second embodiment. Furthermore, it has. In the present embodiment, the blowout portion 36 is provided in the shoulder removing portion 34.

  Here, the shoulder drop portion 34 is a surface parallel to the mounting surface 12 lower than the mounting surface 12 by, for example, about 10 mm, and the range of the surface is wider than the range of the non-contact area 6 of the substrate 2 A shoulder drop 34 appears outside the substrate 2 as viewed in the direction perpendicular to the arrow 12.

  The blowout section 36 has a blowout port 37 opened on the surface of the shoulder drop section 34, a plurality of through holes 38 communicating with the blowout port 37, and a not-shown pressurized air supply device communicating with the plurality of through holes 38. There is. The blowout port 37 faces the noncontact area 6 at a constant distance of, for example, several mm away from the outer periphery of the mounting surface 12 so that the gas blown out from the blowout portion 36 hits the noncontact area 6. It is a continuous groove opened in the direction perpendicular to the non-contact area 6 on the surface of the shoulder drop portion 34. The cross-sectional shape of the groove is uniform over the entire circumference of the groove, and is, for example, a rectangular shape as shown in FIG. 9 having a width of several mm to about 10 mm and a depth of several mm to about 10 mm. A plurality of through holes 38 are arranged at the bottom of the groove of the outlet 37 so that the flow rate distribution or velocity distribution of the gas blown out from the outlet 37 is substantially uniform. By supplying compressed air to the blow-out port 37 via the plurality of through holes 38 by a compressed air supply device (not shown), gas is sprayed from the shoulder drop portion 34 toward the non-contact area 6.

  By providing the shoulder drop portion 34, the air flow blown out from the shoulder drop portion 34 can easily flow to the outside of the substrate 2 after hitting the non-contact area 6. For this reason, the solution material which has traveled to the back surface of the substrate 2 along the substrate side surface 7 receives the air flow flowing to the outside of the substrate 2 and the solution material does not flow around inside than it is reduced compared to the case where the shoulder drop portion 34 is not provided. it can. By doing this, the wraparound of the solution material to the back surface of the substrate 2 can be reduced.

  Here, by providing the shoulder drop portion 34, a portion of the solution material that has passed through the outside of the substrate 2 without being deposited on the substrate 2 is deposited on the shoulder drop portion 34, but the surface height of the shoulder drop portion 34 is Since the height is lower than the surface height of the mounting surface 12 of the mounting device 30, the solution material deposited on the shoulder removal portion 34 does not reach the gap between the mounting surface 12 and the substrate 2. Therefore, the solution material can be prevented from entering the gap between the mounting surface 12 and the substrate 2 due to the capillary phenomenon.

  The placement device 40 of the fourth embodiment of the present invention differs from the placement device 30 of the third embodiment in the shape of the shoulder drop portion 34. An example of the mounting apparatus of Example 4 of this invention is demonstrated using FIG. FIG. 11 is a schematic elevation view seen from the same direction as the e arrow view in FIG. 6 described in the first embodiment. Hereinafter, the same reference numerals as those of the first embodiment are used for the same structures as the first embodiment.

  The shoulder drop portion 44 of the fourth embodiment has a second surface which is a surface other than the first surface 41 which is the surface on the side close to the outer periphery of the back surface of the substrate 2 which is the mounting surface of the substrate 2. The first surface 41, which is higher than the height 42, has a shape closer to the back surface of the substrate 2 than the second surface 42. Here, the blowout port 47 of the blowout portion 46 is open to the second surface 42.

  Here, the second surface 42 is a surface parallel to the mounting surface 12 surrounding the periphery of the mounting surface 12, and the range thereof is inside the range of the non-contact region 6.

  Further, the first surface 41 is a surface further surrounding the periphery of the second surface 42 surrounding the periphery of the mounting surface 12, and is a surface parallel to the mounting surface 12 lower than the mounting surface 12 by, for example, about 5 mm. is there. The range facing the first surface 41 in the non-contact area 6 is a range of a fixed distance of, for example, about 10 mm from the substrate side surface 7.

  The surface height of the second surface 42 is, for example, about 10 mm lower than the surface height of the first surface 41. Thereby, the space between the non-contact area 6 and the shoulder drop portion 44 has a shape narrowed toward the outside of the substrate 2.

  By setting the velocity of the air flow from the blowout portion 46 flowing from the noncontact region 6 to the outside of the substrate 2 in such a shape that the space between the shoulder drop 44 and the noncontact region 6 is narrowed toward the outside of the substrate 2 The space between the shoulder drop 44 and the non-contact area 6 can be made faster than in the case of the non-squeezed shape toward the outside of the substrate 2. By doing this, the rolled solution material that passes through the outside of the substrate 2 without being deposited on the substrate 2 or the solution material applied to the substrate 2 that travels on the surface of the substrate 2 The space between the drop portion 44 and the non-contact area 6 can be reduced more than in the case where the shape is not narrowed toward the outside of the substrate 2.

  The placement device 50 according to the fifth embodiment of the present invention differs from the placement device 30 according to the third embodiment in the shape of the shoulder drop portion 34. An example of the mounting apparatus of Example 5 of this invention is demonstrated using FIG. FIG. 12 is a schematic elevation view of a view taken in the direction of an arrow e in FIG. 6 described in the first embodiment. Hereinafter, the same reference numerals as those of the first embodiment are used for the same structures as the first embodiment.

  In the shoulder drop portion 54 of the fifth embodiment, the range of the shoulder drop portion 54 projected toward the back surface of the substrate 2 from the direction perpendicular to the back surface of the substrate 2 which is the mounting surface of the substrate 2 is the same as that of the substrate 2. The outer periphery of the back surface, that is, the inner side separated by a predetermined distance of about 10 mm, for example, from the substrate side surface 7.

  Here, the outer periphery of the shoulder drop portion 54 is equal to the outer periphery of the mounting device 50. That is, the placement device 50 does not exist below the non-contact region 6 in a range of a predetermined distance from the substrate side surface 7 when the placement device 50 side is viewed from the non-contact region 6 side.

  By forming the shoulder drop portion 54 inward from the range of the substrate 2, in the non-contact region 6, after the direction of the air flow from the blowout portion 56 hits the non-contact region 6, the shoulder drop portion 54 By facing in the opposite direction, that is, in the direction opposite to the direction in which the substrate 2 is present along the side surface of the mounting device 50, it is possible to prevent the blowing of the air flow to the surface side of the substrate 2. By doing this, it is possible to reduce that the air flow from the blowout part 56 blows to the surface side of the substrate 2 and interferes with the solution material sprayed toward the substrate 2 to affect the application state on the surface of the substrate 2 .

  As mentioned above, although the Example of this invention was described, this invention is not limited to these. For example, the suction portion is not limited to the set of through holes, and may be, for example, a groove opened in a ring shape or a lattice shape on the mounting surface 12. It may be porous. In addition, instead of adsorption by a negative pressure application mechanism, electrostatic adsorption may be performed. Moreover, it is not necessary to have an adsorption part.

  For example, in the second to fifth embodiments, the outlet of the outlet may not be a continuous groove. Also, the cross-sectional shape of the groove may not be uniform over the entire circumference of the groove. In addition, the width of the groove of the outlet may be smaller than several mm, or may be larger than 10 mm. Moreover, the depth of the groove of the blowout part may be smaller than several mm, and may be larger than 10 mm. Also, the cross-sectional shape of the groove may not be rectangular, for example, semi-circular. Also, the outlet may not be a groove, and may be, for example, a plurality of through holes arranged in a line.

  Further, the number of through holes communicating with the blowout port may not be plural. For example, one through hole may be provided on each side of the groove of the outlet, or one through hole may be provided for the entire groove. Further, the through hole communicating with the blowout port may be opened not to the bottom of the groove of the blowout port but to a side surface or the like. Instead of the through hole, for example, a groove having a groove opened inside the groove of the outlet or a groove having a porous inner wall may be used.

  Also, without providing a blowout port on the side surface of the mounting device or on the surface of the shoulder removal portion, for example, it is located at a position away from the side surface of the mounting device or in the space between the shoulder removal portion and the non-contact area What is necessary is just to blow out a gas toward a non-contact area | region, such as providing the nozzle which blows off a gas towards a non-contact area | region.

  Further, in the third to fifth embodiments, the shoulder drop portion may not be a plane parallel to the mounting surface.

  In the fourth embodiment, the first surface 41 and the second surface 42 may not be parallel to the mounting surface 12, and may be, for example, a continuous slope which gradually approaches the substrate side surface 7. Further, the distance between the non-contact area 6 and the first surface 41 is not limited to 5 mm, and the distance may change in the range along the outer periphery of the substrate 2. Further, the range facing the non-contact area of the first surface 41 may not be about 10 mm from the substrate side surface 7, for example, may be several mm or less, and the substrate side surface from the substrate side surface 7 to the mounting device 40 side It may be opposed at a position away from 7.

  Further, the distance between the outer periphery of the shoulder portion 54 of the fifth embodiment and the substrate side surface 7 may not be 10 mm. Further, as in the fourth embodiment, the space between the non-contact area 6 and the shoulder drop portion 54 may be shaped so as to be narrowed toward the outside of the substrate 2.

DESCRIPTION OF SYMBOLS 1 electrospray apparatus 2 board | substrate 3 nozzle 4 voltage control part 6 non-contact area | region 7 board | substrate side 10, 20, 30, 40, 50 mounting apparatus 11 adsorption | suction part 12 mounting surface 13 mounting area 15 through hole 26, 36, 46 , 56 blowout portion 27, 37, 47, 57 blowout port 28, 38, 47, 57 through hole 34, 44, 54 shoulder removing portion 41 first surface 42 second surface

Claims (6)

In the mounting apparatus on which the substrate to which the liquid is applied is mounted,
The mounting apparatus according to claim 1, wherein the mounting surface on which the substrate is mounted is a surface having a size that falls within a range inside the outer periphery of the mounting surface of the substrate.   The substrate mounting surface has a blowout portion for blowing out gas toward a non-contact area which is a portion protruding from the mounting surface when the substrate is mounted on the mounting surface. The mounting apparatus according to claim 1.   The mounting apparatus according to claim 2, characterized in that the mounting surface is enclosed and a shoulder drop portion having a surface height lower than the mounting surface is provided.   The mounting apparatus according to claim 3, wherein a height of a surface close to an outer periphery of the mounting surface of the substrate is higher than a height of the other surfaces of the shoulder drop portion.   In the shoulder drop portion, the range of the shoulder drop portion projected toward the mounting surface of the substrate from the direction perpendicular to the mounting surface of the substrate is from the outer periphery of the mounting surface of the substrate The mounting device according to claim 3 or 4, characterized in that it is inside. The placement device includes a suction unit that opens to the placement surface.
The mounting apparatus according to any one of claims 1 to 5, further comprising: a negative pressure applying mechanism in communication with the suction unit.

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