JP2019089285A - Cool storage/heat storage sheet and cool storage/heat storage sheet production method - Google Patents

Abstract

To provide a cool storage/heat storage sheet capable of improving cool storage/heat storage efficiency by comprising a sheet formed by mixing a micro capsule and a heat conductive material with a thermoplastic resin, and a heat conductive sheet on one surface of the sheet.SOLUTION: A sheet comprises a sheet body 15 formed by mixing a micro capsule 11 including a cool storage/heat storage material capable of storing cool and heat depending on state change and aluminum nitride 12 as a heat conductive material higher in heat conductivity than that of the micro capsule 11 with a thermoplastic resin as a main material, and a conductive sheet 16 arranged on one surface of the sheet body 15 and having higher heat conductivity than that of the micro capsule 11 and the aluminum nitride 12.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a cold storage / heat storage sheet using microcapsules.

  There is known a microcapsule in which a material such as paraffin or the like capable of performing heat storage / storage cold by utilizing state change of the substance is encapsulated in a capsule such as melamine resin, and a heat insulating material or a mixture of the microcapsules. A coolant is used.

  When this microcapsule is used as a heat insulating material or a coolant, the heat conductivity of the microcapsule itself is not good, so that heat can not penetrate to the inside, and the heat storage potentially possessed by the microcapsule is sufficient. / There is a problem that the function of cold storage can not be exhibited.

  In relation to the problems as described above, Patent Document 1 discloses a technique of mixing microcapsules with silicone resin. The technology disclosed in Patent Document 1 includes organopolysiloxane (21), thermally conductive particles (23, 24) and a heat storage material, and the heat storage material is a heat storage material particle obtained by microencapsulating a heat storage material having a melting point of 0 to 100 ° C. 22) containing 100 to 2000 parts by weight of the thermally conductive particles (23, 24) with respect to 100 parts by weight of the organopolysiloxane, and having a thermal conductivity of 0.2 to 10 W / m · K; The silicone material (20) comprises 100 parts by weight of the silicone base polymer component (A), the crosslinking component (B), the catalyst, the thermally conductive particles, and the microencapsulated heat storage material particles (22) in total of (A + B) component It is obtained by mixing and crosslinking 100 to 500 parts by weight.

  Patent Document 2 discloses a technique for removing air by laminating an embossed sheet on a silicone rubber sheet.

JP 2014-208728 A JP, 2015-65403, A

  The technology disclosed in Patent Document 1 improves the efficiency of heat conduction by including heat conductive particles and a heat storage material in a heat storage silicone material, but there is no means for releasing the stored heat, so the processing target It is not possible to cool things sufficiently.

  In addition, when using a heat storage / storage sheet in which the microcapsules and the heat conductive material are mixed, the heat storage / storage sheet is directly attached to the object to be treated and used. It becomes possible to function the heat storage / storage sheet efficiently. However, in general, when attaching a heat storage / storage sheet to an object, it is necessary to interpose an adhesive layer such as an adhesive, and the heat storage / storage efficiency is lowered by this adhesive layer. The heat storage / storage of the heat storage / storage sheet may decrease due to the heat conduction resistance or the change in the thermal conductivity generated between the heat storage / storage sheet and the adhesive. Also in the technique shown in Patent Document 1, in the case of sticking to an object to be used, an adhesive layer is required, and there is a possibility that heat storage / cold storage can not be performed efficiently.

  Furthermore, since the specific gravity of the microcapsules is much lighter than that of the silicone resin, when the microcapsules are mixed in the proportion as shown in Patent Document 1, when mixing the microcapsules with the silicone resin which is the main material, a large amount of There is a problem that air is mixed and it becomes extremely difficult to mix.

As described above, large crater-like holes are formed on the surface due to the air mixed when mixing the silicone resin and the microcapsules and the air layer formed during pressing, and the contact area with the object to be treated Cause a decrease in the performance of the product. Although patent document 2 shown above excludes air by laminating with an embossed sheet, this technique is for manufacturing a solar cell module, and is not related to heat storage / cold storage.

  In the present invention, the cold storage / heat storage efficiency can be improved by providing a sheet formed by mixing the microcapsules and the heat conductive material in a thermoplastic resin, and the heat radiating body on one side of the sheet. Provide a heat storage / storage sheet.

  The heat storage / storage sheet according to the present invention has microcapsules in which a heat storage / storage material capable of storing and storing heat due to a change of state is contained in a thermoplastic resin as a main material, and the heat conductivity is more than that of the microcapsules. A sheet body formed by mixing with a high heat conductive material, and a heat conductive sheet disposed on one surface of the sheet body and having a thermal conductivity higher than that of the microcapsules and the heat conductive material It is.

  As described above, in the cold storage / heat storage sheet according to the present invention, the thermoplastic resin as the main material includes microcapsules in which the cold storage / heat storage material capable of cold storage and heat storage due to a change in state is included; A sheet formed by mixing a heat conductive material having a high thermal conductivity, and a heat conductive sheet disposed on one surface of the sheet body and having a thermal conductivity higher than that of the microcapsule and the heat conductive material And, even if the thermal conductivity of the thermoplastic resin is not good, the heat conduction material reliably conducts heat to the inside of the sheet to maximize the cold storage / heat storage function of the microcapsules. The heat conduction sheet can dissipate heat and absorb heat to enhance the cooling / heating effect.

  In the heat storage / storage sheet according to the present invention, at least the surface on which the heat conductive sheet is disposed is embossed.

  As described above, in the heat storage / storage sheet according to the present invention, at least the surface on which the heat conductive sheet is disposed is embossed, so the surface area of the sheet is increased to improve the efficiency of heat release / heat absorption. The effect is that it can be raised. In addition, when the thermoplastic resin has self-adhesiveness in which, for example, the silicone resin is in a gel state, the sheet is firmly attached to the object to be treated by using the adsorptive power generated by the concave portion of the emboss. The effect is that it becomes possible.

  In the heat storage / storage sheet according to the present invention, the thermoplastic resin is a gel-like silicone resin, and the microcapsules are mixed at a ratio of 80% or less with respect to the silicone resin.

  As described above, in the heat storage / storage sheet according to the present invention, the silicone resin in gel state is made adhesive by mixing the microcapsules with the silicone resin in a gel ratio at a ratio of 80% or less to the silicone resin. There is an effect that the heat storage / storage effect can be enhanced by directly holding the object to be treated without using an adhesive.

  The inventors have found that when the microcapsules are mixed at a ratio higher than 80%, the gel state of the silicone resin can not be maintained, and the self-adhesiveness is lost.

  In the heat storage / storage sheet according to the present invention, the thermally conductive material is mixed at a ratio of 10% or less with respect to the thermoplastic resin.

  As described above, in the heat storage / storage sheet according to the present invention, the heat conductive material is mixed with the thermoplastic resin at a ratio of 10% or less, so heat is efficiently conducted to the inside of the sheet, The effect of being able to fully exhibit the function of a microcapsule is produced.

  In the heat storage / storage sheet according to the present invention, the heat conductive material is attached around the microcapsules.

  As described above, in the heat storage / storage sheet according to the present invention, since the heat conductive material adheres around the microcapsules, heat is conducted to the microcapsules more efficiently to increase the efficiency of cold storage / heat storage. The effect of being able to

  In the heat storage / storage sheet according to the present invention, the heat conductive material is mixed at a different ratio in the depth direction of the cold storage / heat storage sheet.

  As described above, in the heat storage / storage sheet according to the present invention, the heat conduction material is mixed at a different ratio in the depth direction of the cold storage / storage sheet, so the heat conduction efficiency is increased near the surface of the sheet, The heat conduction efficiency is gradually lowered as it goes to the inside, so that the heat can be efficiently conducted to the inside of the sheet.

  In the heat storage / storage sheet according to the present invention, the mixing ratio of the microcapsules differs in the depth direction of the heat storage / storage sheet according to the ratio of the heat conductive material.

  As described above, in the heat storage / storage sheet according to the present invention, the mixing ratio of the microcapsules varies in the depth direction of the heat storage / storage sheet according to the ratio of the heat conductive material, so there are many heat conductive materials. By increasing the proportion of microcapsules in the region and decreasing the proportion of microcapsules in the region where the heat conduction material is small, it is possible to remarkably improve the cold storage / heat storage efficiency of the microcapsules.

  In the heat storage / storage sheet according to the present invention, the ratio of the particle size of the microcapsules to the particle size of the heat conductive material is 50: 1 to 50: 1.5.

  Thus, in the heat storage / storage sheet according to the present invention, the ratio of the particle size of the microcapsules to the particle size of the thermally conductive material is 50: 1 to 50: 1.5. It becomes possible to enter a fine gap around the capsule, and it is possible to conduct heat efficiently.

  In the heat storage / storage sheet according to the present invention, the heat conductive sheet is a fiber formed of a heat conductive material having a thermal conductivity higher than that of the microcapsules.

  Thus, in the heat storage / storage sheet according to the present invention, since the heat conductive sheet is a fiber formed of a heat conductive material having a heat conductivity higher than that of the microcapsules, heat radiation / heat absorption on the sheet surface This has the effect of increasing the efficiency and increasing the heat storage / storage efficiency of the entire sheet.

  The method for producing a heat storage / storage sheet according to the present invention is a method for producing a cold storage / storage sheet by mixing a thermoplastic resin, a microcapsule and a heat conducting material having a thermal conductivity higher than that of the microcapsule to produce a cold storage / storage sheet. Wherein the thermoplastic resin, the powdered microcapsules and the heat conductive material are mixed while being degassed.

  Thus, in the heat storage / storage sheet formation method according to the present invention, the air formed on the surface of the microcapsules is excluded by mixing the thermoplastic resin, the microcapsules, and the heat conductive material while degassing. Thus, there is an effect that the thermoplastic resin can be reliably dispersed and kneaded. In addition, by degassing during mixing, waste air can be removed in advance, and the air in the resin can be removed to reduce crater-like air holes generated during pressing.

  The method of producing a heat storage / storage sheet according to the present invention is to press the mixed thermoplastic resin, the microcapsules and the heat conductive material against a molded plate having an embossed surface.

  As described above, in the heat storage / storage sheet formation method according to the present invention, the mixed thermoplastic resin, the microcapsules, and the heat conductive material are pressed against the embossed plate whose surface is embossed, so that the mixing process can be performed during mixing. Even when residual air appears on the surface, the sheet embossed with pressure can eliminate the air and eliminate crater-like holes. In addition, it is possible to remove the air layer generated when pressing as well.

It is a figure which shows the function of a microcapsule. It is a schematic diagram which shows the internal structure of the cool storage / heat storage sheet | seat which concerns on 1st Embodiment. It is a figure which shows the surface shape of the cool storage / heat storage sheet | seat which concerns on 1st Embodiment. It is a flowchart which shows the formation process of the cool storage / heat storage sheet | seat which concerns on 1st Embodiment. It is a figure which shows the structure of the microcapsule and heat-conductive material in the cool storage / heat storage sheet | seat which concerns on other embodiment. It is a figure which shows the structure at the time of changing the mixing ratio of a heat conductive material in the cool storage / heat storage sheet which concerns on other embodiment. It is a figure which shows the structure at the time of changing the mixing ratio of a microcapsule in the cool storage / thermal storage sheet which concerns on other embodiment. In an Example, it is a graph which shows the cooling effect with respect to room temperature when the mixing ratio of a microcapsule is changed. In an Example, it is a graph which shows the cooling effect to room temperature according to the existence of a heat conduction sheet. It is a figure which shows the result of the cool storage effect and adsorption power with respect to the mixing rate of a microcapsule filler in an Example. In an Example, it is a photograph which shows the degree of adhesiveness according to the ratio of a microcapsule.

  Hereinafter, embodiments of the present invention will be described. In addition, the same reference numerals are given to the same elements throughout the present embodiment.

First Embodiment of the Present Invention
The cold storage / heat storage sheet according to the present embodiment will be described using FIGS. 1 to 4. The cold storage / heat storage sheet according to the present embodiment is a thermoplastic resin including microcapsules in which a cold storage / heat storage material capable of cold storage and heat storage due to a change in state is contained, and thermal conductivity having a thermal conductivity higher than that of the microcapsules. A sheet body formed by mixing materials and a heat conductive sheet disposed on one side of the sheet body and having a thermal conductivity higher than that of the microcapsules and the heat conductive material. In addition, as a thermoplastic resin, ethylene vinyl acetate (EVA), polyolefin resin, a silicone resin etc. can be used, for example. Further, aluminum nitride, silicon nitride, or the like can be used as the heat conductive material.

  FIG. 1 is a view showing the function of the microcapsule. Accumulation / storage of heat by microcapsules utilizes energy required for changing the state of a substance, and for example, an organic compound such as paraffin is used as a storage / storage material, which is melamine, urethane, acrylic, gelatin Etc. are formed by being enclosed in a capsule. In FIG. 1 (A), when the ambient temperature is lowered, the cold-storage / heat-storage material is in a solid state to release heat. On the other hand, in FIG. 1 (B), when the ambient temperature rises, the cold-storage / heat-storage material is in a liquid state to absorb heat. That is, it is possible to realize cold storage / heat storage by storing or releasing heat according to the temperature change of the surroundings.

  FIG. 2: is a schematic diagram which shows the internal structure of the cool storage / heat storage sheet | seat which concerns on this embodiment. As shown in the figure, the cold-storing / storage sheet 10 comprises a sheet 15 in which the microcapsules 11 and the aluminum nitride 12 are uniformly dispersed and mixed in a thermoplastic resin, and one side of the sheet 15 And a heat transfer sheet 16 provided.

  As described above, in the cold storage / storage sheet 10 in which the microcapsules are kneaded with the silicone resin, the heat is not sufficiently conducted to the inside of the sheet, and the microcapsules 11 in the inside of the sheet sufficiently function. As a result, the cold storage / heat storage efficiency of the entire sheet may be reduced. Therefore, in the present embodiment, as shown in FIG. 2, a thermally conductive material (here, equivalent to aluminum nitride 12) is mixed with the thermoplastic resin in combination with the microcapsules 11. By doing so, heat can be sufficiently conducted to the inside of the sheet through the aluminum nitride 12, and it becomes possible to fully utilize the function of the microcapsules 11 embedded inside the sheet.

  Further, in the present embodiment, the heat conductive sheet 16 is disposed on one side of the sheet body 15, and the heat conductive sheet 16 is more than the microcapsules 11 and the aluminum nitride 12 like aluminum, for example. It has high thermal conductivity. That is, by arranging the heat conductive sheet 16 on one side of the sheet 15, heat dissipation / heat absorption through the heat conductive sheet 16 is effectively performed, and the cool storage / heat storage effect of the cold storage / heat storage sheet 10 is obtained. It can be further enhanced. In particular, by adhering the heat storage / storage sheet 10 to the back surface of the solar panel or the like so that the heat conduction sheet 16 is on the outside, the cooling effect of the solar panel can be obtained, and the power generation efficiency can be increased. It becomes.

  In addition, as the cold storage / heat storage sheet 10 which concerns on this embodiment is shown in FIG. 3, the embossing may be given to the surface. FIG. 3 (A) is a photograph of the sheet surface in the case of embossing and FIG. 3 (B) is a case without embossing. Embossing of the surface can be formed by a molding plate in a forming step described later, and by increasing the surface area, it is possible to improve the efficiency of heat absorption and heat radiation.

  Next, a method of forming the cold storage / heat storage sheet will be described. FIG. 4 is a flow chart showing a process of forming a cold storage / heat storage sheet according to the present embodiment. First, a molded plate is prepared in which an aluminum plate to be the heat transfer sheet 16 and an embossed fluorine film are stacked and disposed (S1). A thermoplastic resin, microcapsules 11 and aluminum nitride 12 are prepared (S2). At this time, as described later in the second embodiment, when the thermoplastic resin is silicone, the microcapsules 11 are prepared so as to be 80% or less of the silicone. The materials of S2 are mixed and kneaded while degassing with a vacuum kneader (S3).

  Here, since the powder of the microcapsules 11 has a smaller specific gravity and a smaller particle size than a thermoplastic resin, it becomes extremely difficult to knead. That is, since an air layer is formed around the microcapsules 11 and becomes lumps, the powder of the individual microcapsules 11 is not sufficiently kneaded into the thermoplastic resin. Therefore, as in step S3, the air layer formed around the microcapsules 11 is removed by degassing the air during kneading, and the powders of the individual microcapsules 11 are efficiently kneaded into the silicone resin. It becomes possible. In addition, if an empty cannon is formed in the sheet, the thermal conductivity will be deteriorated, so that it is possible to prevent the formation of the empty can by degassing as in step S3.

  Returning to FIG. 4, when the material is kneaded, it is poured into the formed plate prepared in step S1 (S4). The molding process is performed at a molding temperature of 80 degrees and a molding time of 90 minutes (S5). When the temperature drops below 30 ° C., the embossed fluorine film is peeled off, and a cold storage / heat storage sheet is completed.

  In addition, an embossing can be given to the surface by pouring a material in the shaping | molding board of step S1. At this time, the air remaining inside the thermoplastic resin is pushed out to form crater-like air bubbles on the surface, or an air layer is generated on the pressing surface at the time of pressing, and asperities are formed on the surface of the sheet. In some cases, the application of pressing force ensures that embossing is performed, and crater-like air bubbles and air layers are removed from the gaps of the emboss, and the surface irregularities formed due to the air layers. Can be eliminated.

  Further, in the present embodiment, the mixing ratio of the aluminum nitride 12 is kneaded so as to be 10% or less with respect to the thermoplastic resin (the weight of the aluminum nitride 12 is 10% or less with respect to the weight of the thermoplastic resin) It is also good. By doing so, it is possible to make the cold storage / heat storage function of the microcapsules 11 function to the maximum while sufficiently passing heat to the inside of the sheet.

  As described above, in the cold storage / storage sheet according to the present embodiment, since the heat conductive material having the heat conductivity higher than that of the microcapsule is included, the heat can be reliably conducted to the inside of the sheet, and the heat conduction efficiency can be achieved. While being able to raise, by arranging a heat conduction sheet on one side, it is possible to enhance the heat radiation / heat absorption effect and to make the cold storage / heat storage function function to the maximum.

  In addition, since one surface of the sheet is embossed, the surface area of the sheet can be increased to increase the efficiency of heat dissipation / heat absorption.

  Further, by setting the heat conductive material to a ratio of 10% or less with respect to the thermoplastic resin, the heat can be efficiently conducted to the inside of the sheet, and the function of the microcapsule can be sufficiently exhibited.

  Further, by mixing the thermoplastic resin and the powdery microcapsule while degassing, it is possible to exclude the air formed on the surface of the microcapsule and to disperse the resin in the thermoplastic resin reliably and in a kneading manner. become. In addition, by degassing during mixing, it is possible to remove unnecessary air beforehand, and it is possible to eliminate air in the resin and to reduce crater-like air holes generated at the time of pressing.

Furthermore, by pressing the mixed material against the embossed molding plate, even if air remaining during mixing appears on the surface, the air is eliminated to eliminate crater-like holes. Can. In addition, the air layer generated when pressing with a sheet can be similarly eliminated.

The embossing of the surface is not necessarily required, and may be uniformly smooth.
Second Embodiment of the Present Invention
The cold storage / heat storage sheet according to the present embodiment will be described. The cold storage / heat storage sheet according to the present embodiment is formed by using a thermoplastic resin as a gel-like silicone resin, and mixing microcapsules and a heat conductive material thereto. At this time, by setting the mixing ratio of the microcapsules to 80% or less of the silicone resin (the weight of the microcapsules is 80% or less with respect to the weight of the silicone resin), the sheet is made to be self-adhesive. In the present embodiment, the description overlapping with the first embodiment is omitted.

  In the present embodiment, the cold storage / heat storage sheet 10 is formed by mixing 80% or less of the microcapsules 11 with a gel silicone resin. At this time, the inventors clarified that the mixing ratio of the microcapsules 11 is a very important factor. That is, it has become clear that the tackiness of the gel silicone resin is lost when the mixing ratio of the microcapsules 11 is too high.

  When the tackiness of the silicone resin is lost, it is necessary to stick to the object to be treated through an adhesive layer such as an adhesive, which may cause a decrease in the heat transfer efficiency due to a change in the heat conductivity. . That is, as a result, the effect of cold storage / heat storage may be reduced due to the self-adhesiveness as compared with the case of direct sticking to the object to be treated. In the present embodiment, by setting the mixing ratio of the microcapsule 11 to 80% or less of that of the silicone resin, the gel silicone resin can maintain self-adhesiveness, and it is directly adhered to the object to be treated. The effect of cold storage / heat storage can be enhanced.

  In addition, you may embossing to one surface of the side which contacts with respect to a process target object. By doing so, it becomes possible to stick firmly to a processing object using the adsorption power generated by the unevenness of the surface of embossing. When the other surface is embossed, as in the first embodiment, the surface area of the sheet can be increased to increase the efficiency of heat dissipation / heat absorption.

  As described above, in the cold storage / heat storage sheet according to the present embodiment, microcapsules containing a heat storage / cold storage material capable of heat storage and cold storage due to a change in state are mixed with a gel silicone resin, By setting the ratio to 80% or less with respect to the silicone resin, the silicone resin in the gel state can maintain the adhesiveness, and it is directly stuck to the object to be treated without using an adhesive, and the heat storage / cool storage effect Can be enhanced.

(Other embodiments)
The cool storage / heat storage sheet according to the present embodiment will be described with reference to FIGS. 5 to 7. In the present embodiment, the description overlapping with each of the above embodiments is omitted.

  In the present embodiment, the heat conductive material (for example, aluminum nitride 12) is in contact with and adhered to the periphery of the microcapsule 11. FIG. 5 is a view showing the structure of the microcapsules and the heat conductive material in the cold storage / heat storage sheet according to the present embodiment. As shown in FIG. 5, by adhering the aluminum nitride 12 so as to be in direct contact with the periphery of the microcapsule 11, heat can be efficiently transmitted to the microcapsule 11, and the efficiency of cold storage / storage can be increased. .

  In the structure as shown in FIG. 5, aluminum nitride 12 is attached in advance to the periphery of the microcapsule 11 by electrical treatment (electrostatic charge) or heat treatment (heating) in advance, and in that state the first embodiment It is possible to carry out the production process as shown in FIG.

  Further, in the present embodiment, the mixing ratio of the aluminum nitride 12 may be mixed at a different ratio in the depth direction of the cold storage / heat storage sheet 10. That is, in the first embodiment, the structure is made such that 10% or less of aluminum nitride 12 is uniformly dispersed and kneaded with the silicone resin, but from one side of the cold storage / storage sheet 10 to the other side The structure may be such that the mixing ratio of the aluminum nitride 12 changes toward the end.

  FIG. 6 is a view showing a structure in the case of changing the mixing ratio of the heat conduction material in the cool storage / heat storage sheet according to the present embodiment. The mixing ratio of the aluminum nitride 12 may be changed gradually and continuously from one surface of the cold storage / storage sheet 10 to the other surface, as shown in FIG. 6 (A). As shown to B), you may make it change in layers gradually from one side of the cool storage / heat storage sheet | seat 10 to the other side. At this time, it is desirable that the mixing ratio of the aluminum nitride 12 be decreased so as to decrease from the surface on the processing object side to the surface on the heat transfer sheet 16 side.

  With such a structure, for example, in the case of lowering the temperature of the object to be treated, heat is absorbed with high thermal conductivity from the adhering surface side of the cold storage / heat storage sheet 10, and gradually goes as it goes inside The thermal conductivity decreases and the absorbed heat is sufficiently stored in the microcapsules 11 in the sheet. At the same time, heat can be released efficiently by the heat transfer sheet 16, so that the cooling efficiency can be enhanced.

  Furthermore, in the present embodiment, the mixing ratio of the microcapsules 11 may be changed according to the ratio of the aluminum nitride 12 described above. FIG. 7 is a view showing a structure in the case of changing the mixing ratio of the microcapsules in the cool storage / heat storage sheet according to the present embodiment. As shown in FIGS. 7A and 7B, in the region where the mixing ratio of the aluminum nitride 12 is high, the mixing ratio of the microcapsules 11 is increased correspondingly. With such a structure, in the region where the thermal conductivity is high and can absorb a large amount of heat, a large number of microcapsules 11 will be present internally, and the microcapsules 11 can store more heat. .

  Furthermore, in the present embodiment, the ratio of the particle size of the microcapsules 11 to the particle size of the thermally conductive material may be 50: 1 to 50: 1.5. For example, specifically, the particle diameter of the thermally conductive material may be about 1.0 μm to 1.5 μm with respect to the particle diameter of 50 μm of the microcapsules. By having the particle diameter in such a ratio, the heat conductive material can be uniformly diffused in the gaps of the microcapsules 11 to increase the heat conduction efficiency.

  Furthermore, in the present embodiment, a fibrous or cloth-like heat conduction sheet may be used as the heat transfer sheet 16. Also, instead of the aluminum nitride 12, a fibrous heat conductive material may be used, or fibers may be mixed with a thermoplastic resin to form a sheet.

  As described above, in the heat storage / storage sheet according to the present embodiment, heat can be efficiently transmitted to the inside of the sheet to improve the heat conduction efficiency, and directly to the object to be processed without using an adhesive. It can be stuck to enhance the heat storage / storage effect.

  The following experiment was performed about the cool storage / heat storage sheet which concerns on this invention.

(1) Experiment of cold storage effect according to mixing ratio of microcapsules The cold storage effect with respect to the mixing ratio of the microcapsules 11 was confirmed. FIG. 8 is a graph showing a cold storage effect with respect to room temperature when the mixing ratio of microcapsules is changed. While keeping the room temperature at 60 ° C, create a sheet where the mixing ratio of microcapsules 11 is different from 0%, 10%, 20%, 30%, 40%, 50%, 60% with respect to silicon. The temperature change of each was measured.

  As apparent from the graph, as the mixing ratio increases, the time to reach 60 degrees at room temperature increases. That is, it is clear that the cold storage effect can be enhanced by increasing the mixing ratio of the microcapsules 11. Although it is not included in the experimental data, it has been confirmed that the cold storage effect increases according to the mixing ratio of the microcapsules 11 up to the maximum ratio (80%) at which the microcapsules 11 can be mixed.

(2) Experiment of the cool storage effect according to the presence or absence of a heat conductive sheet The cool storage effect at the time of sticking a heat conductive sheet on one side of a sheet body was checked. FIG. 9 is a graph showing a cold storage effect with respect to room temperature according to the presence or absence of a heat transfer sheet. When the room temperature is lowered from 60 degrees to 0 degrees,
(A) An aluminum sheet attached to one side of a sheet of a mixture ratio 50% of the microcapsules 11 (hereinafter referred to as "Al sheet")
(B) An aluminum sheet is attached to one side of a sheet of a mixture ratio of 50% of the microcapsules 11 and mixed with 10% of aluminum nitride (hereinafter referred to as "Al sheet + 10% Al")
(C) Sheet having a mixing ratio of 50% of microcapsules 11 (hereinafter referred to as "none")
The temperature change was measured for each of

As apparent from the graph, (B) "Al sheet + Al 10%" according to the decrease in room temperature
It turns out that it cools in order of (A) "Al sheet", (C) "none", and the final temperature is also low in this order.

  From the above, it is clear that the cold storage / heat storage sheet according to the present invention exerts a cold storage / heat storage effect by the microcapsules 11 and the aluminum nitride 12, and by disposing the heat transfer sheet 16 on one side, It has become clear that the heat dissipation / heat absorption effect can be more effectively enhanced.

(3) Experiment about self-adhesiveness The filler of the microcapsule 11 was mixed with the silicone for potting with low viscosity, and the adsorption power by touch was confirmed. In the case of silicone alone, it is too soft and is torn, but by mixing the microcapsule filler, the hardness increases and it becomes difficult to be torn. FIG. 10 is a diagram showing the results of the cold storage effect and the adsorption force with respect to the mixing ratio of the microcapsule filler. The cold storage effect increases as the proportion of the microcapsules 11 increases, and when it is 80% or more, mixing of the microcapsules itself becomes difficult. On the other hand, the adsorptive power decreases as the proportion of the microcapsules 11 increases, and when it is about 80% or more, the self-adhesive power is almost lost.

  Also, in order to confirm the self-adhesiveness, when the time of sticking to a vertically standing iron plate was tested under the environment of room temperature 60 degrees for each ratio of microcapsules 11, in 80% or less, it can stick for 1 hour or more However, when it became larger than 80%, it could not stick for 1 hour or more.

  Furthermore, FIG. 11 is a photograph showing the degree of tackiness according to the proportion of the microcapsules 11. 11A shows the case where the microcapsule 11 is 0%, FIG. 11B shows the case where the microcapsule 11 is 40%, and FIG. 11C shows the case where the microcapsule 11 is 80%. As shown in the photograph, when the microcapsule 11 is 0%, the self-adhesiveness is very high, but when it is pulled, it is immediately broken and the handling becomes very difficult. When the microcapsule 11 is 40%, the self-adhesiveness is high, and it is very easy to handle because it returns to its original state by elastic force without being broken even if it is pulled slightly. Also, when the microcapsules 11 are larger than 80%, the self-adhesiveness is low, and they hardly stretch even when pulled. That is, it will be in a difficult state to stick on a wall surface etc. for a predetermined period, and to maintain.

  From the above, it has become clear that in the cold-storage / heat-storage sheet of the present invention, when the thermoplastic resin is a silicone resin, it is desirable to set the mixing ratio of the microcapsules to 80% or less.

10 cold storage / heat storage sheet 11 microcapsule 12 aluminum nitride 15 sheet 16 heat transfer sheet

Claims (11)

A thermoplastic resin as a main material is mixed with a microcapsule in which a cold storage / heat storage material capable of cold storage and heat storage due to a state change is contained, and a heat conductive material having a thermal conductivity higher than that of the microcapsule. Sheet body to be
A heat storage / storage sheet comprising: a heat conductive sheet disposed on one side of the sheet and having a thermal conductivity higher than that of the microcapsules and the heat conductive material. In the cold storage / heat storage sheet according to claim 1,
A cold storage / heat storage sheet characterized in that at least the surface on which the heat conductive sheet is disposed is embossed. In the cold storage / heat storage sheet according to claim 1 or 2,
The thermoplastic resin is a gel-like silicone resin,
The cold storage / heat storage sheet, wherein the microcapsules are mixed at a ratio of 80% or less to the silicone resin. In the cold storage / heat storage sheet according to any one of claims 1 to 3,
The cold storage / heat storage sheet, wherein the heat conductive material is mixed with the thermoplastic resin at a ratio of 10% or less. In the cold storage / heat storage sheet according to any one of claims 1 to 4,
The heat storage / storage sheet, wherein the heat conductive material adheres around the microcapsules. In the cold storage / heat storage sheet according to any one of claims 1 to 5,
The cold storage / heat storage sheet characterized in that the heat conduction material is mixed at different rates in the depth direction of the cold storage / heat storage sheet. In the cold storage / heat storage sheet according to claim 6,
A cold-storing / heat-storing sheet, wherein the mixing ratio of the microcapsules varies in the depth direction of the cold-storing / storing sheet according to the ratio of the heat-conducting material. In the cold storage / heat storage sheet according to any one of claims 1 to 7,
The ratio of the particle size of the microcapsules to the particle size of the thermally conductive material is 50: 1 to 50: 1
. A cold storage / heat storage sheet characterized by being 5. In the cold storage / heat storage sheet according to any one of claims 1 to 8,
The cold-storage / heat-storage sheet, wherein the heat-conductive sheet is a fiber formed of a heat-conductive material having a thermal conductivity higher than that of the microcapsules. In a method of producing a cold storage / heat storage sheet, wherein a cold storage / heat storage sheet is formed by mixing a thermoplastic resin, a microcapsule, and a heat conductive material having a thermal conductivity higher than that of the microcapsule.
A method of producing a cold-storage / heat-storage sheet, comprising degassing and mixing the thermoplastic resin, the powdered microcapsule and the heat-conductive material. In the cold storage / heat storage sheet generation method according to claim 10,
A method of producing a cold-storage / heat-storage sheet, comprising pressing the mixed thermoplastic resin, the microcapsules, and the heat-conductive material against a molded plate whose surface is embossed.