JP2002317064A - Thermoconductive material - Google Patents

Thermoconductive material

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Publication number
JP2002317064A
JP2002317064A JP2001122546A JP2001122546A JP2002317064A JP 2002317064 A JP2002317064 A JP 2002317064A JP 2001122546 A JP2001122546 A JP 2001122546A JP 2001122546 A JP2001122546 A JP 2001122546A JP 2002317064 A JP2002317064 A JP 2002317064A
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high thermal
heat
member
conductive material
conductive layer
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JP2001122546A
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Japanese (ja)
Inventor
Kenichi Azuma
Shunji Hyozu
Hitoshi Shirato
俊司 俵頭
賢一 東
斉 白土
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Sekisui Chem Co Ltd
積水化学工業株式会社
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Priority to JP2001122546A priority Critical patent/JP2002317064A/en
Publication of JP2002317064A publication Critical patent/JP2002317064A/en
Application status is Pending legal-status Critical

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Abstract

PROBLEM TO BE SOLVED: To provide a thermoconductive material affording such a condition as to be in compliance with the uneven design or warpage of the respective boundary surfaces of two members disposed so as to sandwich itself, and securing high thermal conductivity.
SOLUTION: In this thermoconductive material functioning to transfer the heat of one member to another member through interposition between the two members in a sandwiched condition, at least expandable highly thermoconductive layers each formed of a resin composition containing a forming agent foamable at ≥40°C and a highly thermoconductive filler are borne on both sides.
COPYRIGHT: (C)2002,JPO

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【発明の属する技術分野】本発明は、熱伝導材に関する。 The present invention relates to relates to a heat-conducting material.

【0002】 [0002]

【従来の技術】例えば、電気・電子部品などの発熱部材に添設して発熱体から伝わった発熱体の熱を放熱させるヒートシンク等の放熱部材との間には、従来、熱が発熱部材から放熱部材に効率よく伝わるようにシリコーンオイルコンパウンドや、窒化ホウ素、アルミナ、窒化ケイ素または窒化アルミニウムなどの熱伝導性の高い充填材を樹脂に高充填した高熱伝導材(例えば、特開平10− BACKGROUND ART For example, between the heat radiating member such as a heat sink to dissipate the heat of the transferred from the heating element and additionally provided on the heat-generating member, such as electric and electronic parts heating element, conventionally, the heat generating member the heat radiating member and a silicone oil compound as efficiently transmitted, boron nitride, alumina, high thermal conductivity material of high thermal conductivity are fillers such as silicon nitride or aluminum nitride was highly filled in a resin (for example, JP-a-10-
139893号公報)が提案され、樹脂としてシリコーンゴムを用いた熱伝導シートが上市されている。 139893 JP) is proposed, heat conductive sheet using the silicone rubber is marketed as a resin.

【0003】すなわち、電気・電子部品に限らず、発熱部材及び放熱部材の表面は平滑でないことが多い。 [0003] That is, not only the electric and electronic parts, the surface of the heat generating member and the heat radiating member is often not smooth. 従って、両者を直接接触させても接触面積が小さく熱伝導が悪い場合がある。 Therefore, even when brought into contact with each other directly in some cases the thermal conduction is poor small contact area. そこで、柔軟で凹凸に添いやすく高熱伝導性を有する上記のようなシリコーンオイルコンパウンドや上記熱伝導シート等の熱伝導材を発熱部材と放熱部材との間に介在させるようになっている。 Therefore, so as to interpose a heat conductive material of the silicone oil compound or the like the heat conducting sheet as described above having easy high thermal conductivity Soi flexible and irregularities between the heating member and the heat radiating member.

【0004】しかし、上記シリコーンオイルコンパウンドの場合、柔軟性があり、密着性が高く、熱抵抗性もよいのであるが、粘稠体であるので、取り扱い性が悪いとともに塗りムラが発生する恐れもある。 However, in the case of the silicone oil compound, flexible, high adhesion, although the may be heat resistant, because it is viscous 稠体, a possibility that uneven coating may occur with poor handling properties is there.

【0005】一方、樹脂に高熱伝導性を有する高熱伝導性フィラーを混合分散した上記の熱伝導シートの場合、 On the other hand, if the resin mixed and dispersed with high thermal conductivity fillers having high thermal conductivity of the thermally conductive sheet,
高い熱伝導性を得るために、高熱伝導性フィラーの充填量を大きくすると、柔軟性が乏しくて挟着面への形状追従性、すなわち、密着性が悪くなる。 In order to obtain a high thermal conductivity, by increasing the filling amount of the high thermal conductive filler, and poor flexibility shape followability to the clamping plane, i.e., the adhesion is deteriorated. したがって、上記の熱伝導シートの場合、柔軟性はあるが、高熱伝導性物質の充填量が不十分で熱伝導率が低いものか、あるいは、熱伝導率は良好であるが柔軟性に乏しいものとなり、結果として熱抵抗の大きいものにならざるを得ない。 Therefore, when the heat conducting sheet, what some flexibility but do have low loading is insufficient thermal conductivity of the high thermal conductivity material, or the thermal conductivity is good inflexible next, inevitably resulting in that heat resistance high.

【0006】他方、アルミニウム箔のように熱伝導性に優れ可撓性のある平滑な金属シートを熱伝導シートとして使用することも考えられるが,このような平滑な金属シートでは、やはりCPUや基板等の電子部品やヒートシンクなどの放熱部材は、反り、うねり、凹凸等に追従せず電子部品で発生した熱を十分に放熱部品に伝えることができなくなる恐れがある。 [0006] On the other hand, it is conceivable to use a smooth metal sheet with excellent flexibility in thermal conductivity such as aluminum foil as a thermal conductive sheet, in such a smooth metal sheet is again CPU and substrate radiating member such as electronic parts and heat sinks etc., warping, waviness, there heat may not be able to tell sufficiently heat radiator of generated in the electronic components does not follow the unevenness or the like.

【0007】 [0007]

【発明が解決しようとする課題】本発明は、このような事情に鑑みて、熱伝導材を挟むように配置される2つの部材の添設面の凹凸形状や反りうねりに追従した添設状態になり、高い熱伝導性を確保し得る熱伝導材を提供することを目的としている。 [0008] The present invention is, in view of such circumstances, additionally provided while following the unevenness or warpage undulation of additionally provided surfaces of the two members which are arranged so as to sandwich the heat-conducting material to become, and its object is to provide a thermally conductive material capable of ensuring high thermal conductivity.

【0008】 [0008]

【課題を解決するための手段】このような目的を達成するために、本発明の請求項1に記載の発明にかかる熱伝導材(以下、「請求項1の熱伝導材」と記す)は、挟着された状態で2つの部材間に介在し、一方の部材の熱を他方の部材に伝える熱伝導材において、40℃以上で発泡する発泡剤および高熱伝導フィラーを含む樹脂組成物から形成された発泡性高熱伝導層を少なくとも備えている構成とした。 Means for Solving the Problems] To achieve the above object, the heat conductive material according to the invention described in claim 1 of the present invention (hereinafter, referred to as "heat conducting material according to claim 1") interposed between the two members in a state of being sandwiched, forming the heat of the one member in the thermally conductive material to convey to the other member, a resin composition containing a blowing agent and high thermal conductivity filler to be foamed at 40 ° C. or higher and at least it includes configurations foamable high thermal conductive layers.

【0009】本発明の請求項2に記載の発明にかかる熱伝導材(以下、「請求項2の熱伝導材」と記す)は、請求項1の熱伝導材において、発泡性高熱伝導層と発泡剤非含有の非発泡性高熱伝導層とを備え、これらの層が部材間の挟着方向に積層されている構成とした。 [0009] thermally conductive material according to the invention described in claim 2 of the present invention (hereinafter, referred to as "thermal material according to claim 2"), in thermal conduction material according to claim 1, the foamable high thermal conductive layer and a non-foaming high thermal conductive layer-free blowing agent, these layers has a configuration that is stacked in the clamping direction between the members.

【0010】本発明の熱伝導材は、柱状、シート状、波板状等その形状は、用途に応じて適宜決定することができるが、取り扱い性を考慮すると、請求項3のようにシート状とすることが好ましい。 [0010] thermal conductivity material of the present invention, columnar, sheet-like, corrugated, etc. The shape may be appropriately determined in accordance with the use, in consideration of handling properties, as claimed in claim 3 sheet it is preferable that the. また、本発明の熱伝導材の熱伝導率は、特に限定されないが、1W/m・K以上とすることが好ましく、3W/m・K以上とすることがより好ましい。 The thermal conductivity of the thermally conductive material of the present invention is not particularly limited and is preferably 1W / m · K or more, and more preferably to 3W / m · K or more.

【0011】本発明の熱伝導材において、発泡性高熱伝導層に用いられる樹脂としては、特に限定されないが、 [0011] In the thermal transfer material of the present invention, as the resin used in the foamable high thermal conductive layer is not particularly limited,
たとえば、オレフィン系樹脂、スチレン系樹脂、塩化ビニル系樹脂、エステル系樹脂、アミド系樹脂等が挙げられ、(メタ)アクリル酸ブチル、(メタ)アクリル酸2 For example, olefin resins, styrene resins, vinyl chloride resin, ester resin, amide resin and the like, (meth) acrylate, butyl (meth) acrylate 2
−エチルヘキシル等のアクリル酸エステルを重合したアクリル酸エステル重合体、(メタ)アクリル酸ブチル、 - acrylic ester polymer obtained by polymerizing an acrylic acid ester of ethylhexyl (meth) acrylate, butyl
(メタ)アクリル酸2−エチルヘキシル等のモノマーの共重合体、エチレン酢酸ビニル共重合体、エチレン−α (Meth) copolymer of a monomer such as 2-ethylhexyl acrylate, ethylene-vinyl acetate copolymer, ethylene -α
オレフィン共重合体等の軟質オレフィン系樹脂、スチレン−イソプレン−スチレン共重合体(SIS)、スチレン−ブチレン−スチレン共重合体(SBS)、スチレン−エチレン−ブチレン−スチレン共重合体(SEB Soft olefin resins such as olefin copolymers, styrene - isoprene - styrene copolymer (SIS), styrene - butylene - styrene copolymer (SBS), styrene - ethylene - butylene - styrene copolymer (SEB
S)、スチレン−エチレン−プロピレン−スチレン共重合体(SEPS)等の軟質スチレン系樹脂、ウレタンT S), styrene - ethylene - propylene - styrene copolymer (SEPS) or the like of a soft styrene resin, urethane T
PE、エステルTPE、アミドTPE等の熱可塑性エラストマー、これらの樹脂の架橋されたもの、あるいは、 PE, ester TPE, thermoplastic elastomer and amide TPE, those crosslinked these resins, or
ウレタン樹脂、エポキシ樹脂、シリコーン樹脂等の熱硬化性樹脂などが挙げられ、部材への密着性を考慮するとショアA硬度で30以下のものがより好ましい。 Urethane resins, etc. thermosetting resin such as epoxy resin, silicone resin and the like, and more preferably from 30 or less in consideration of Shore A hardness adhesion to members.

【0012】高熱伝導フィラーとしては、特に限定されないが、たとえば、たとえば、金、銅、銀、鉄、アルミニウム、コバルト、すず、ニッケル、チタン、インジウムなどの金属および各種合金などの粒子;酸化アルミニウム(アルミナ)、酸化亜鉛、酸化マグネシウム、酸化ベリリウム、酸化チタン、酸化インジウムすず(IT [0012] As the high thermal conductivity filler is not particularly limited, for example, such as gold, copper, silver, iron, aluminum, cobalt, tin, nickel, titanium, particles such as metals and various alloys such as indium; aluminum oxide ( alumina), zinc oxide, magnesium oxide, beryllium oxide, titanium oxide, indium tin oxide (IT
O)などの酸化物類粒子;窒化ホウ素、窒化ケイ素、窒化アルミニウムなどの窒化物類粒子;炭化ケイ素、ダイヤモンド、非晶カーボン、カーボンブラック、炭素繊維などの炭化物類粒子;石英、石英ガラスなどのシリカ粉類粒子などが挙げられる。 O) oxides particles such as; boron nitride, silicon nitride, nitrides such particles, such as aluminum nitride; such as quartz, quartz glass; silicon carbide, diamond, amorphous carbon, carbon black, carbide such particles, such as carbon fibers such as silica powder such particles.

【0013】上記高熱伝導フィラーの熱伝導率は、樹脂より高ければよいが、10W/m・K以上とすることが好ましく、20W/m・K以上とすることがより好ましい。 [0013] The thermal conductivity of the high thermal conductive filler may be higher than the resin, preferably to 10 W / m · K or more, and more preferably set to 20W / m · K or more. ただし、熱伝導材を、絶縁性を必要とする用途に用いる場合、上記金属および各種合金などの金属系フィラーは、絶縁性に劣るため、他の無機フィラーを用いることが好ましい。 However, a thermally conductive material, when used in applications requiring an insulating, metallic fillers such as the metals and various alloys, have poor insulating properties, it is preferable to use the other inorganic fillers.

【0014】また、高熱伝導性フィラーとして、たとえば、窒化ホウ素などの鱗片状粒子と、炭化ケイ素、窒化アルミなどの球状粒子とを、その比率を1/9〜9/1 Further, as high thermal conductivity fillers, for example, a scaly particles such as boron nitride, silicon carbide, and spherical particles, such as aluminum nitride, the ratio 1 / 9-9 / 1
程度の割合で組み合わせて用いるようにすると、より高い熱伝導率を得ることができる。 If so used in combination at a ratio of degrees, it is possible to obtain a higher thermal conductivity. さらに、熱伝導性物質の添加量は、所定の柔軟性を確保できれば、多い程好ましい。 Furthermore, the addition amount of the thermal conductive material, if securing a predetermined flexibility, preferably as often.

【0015】発泡剤としては、40℃以上で発泡するものであれば特に限定されず、たとえば、熱分解型発泡剤、蒸発型発泡剤を用いることができるが、発熱部材の発熱限界温度(発熱部材の発熱による温度上昇により機能不全になる温度)以下の温度で発泡するものが選択される。 [0015] As the foaming agent is not particularly limited as long as foaming at 40 ° C. or higher, for example, thermal decomposition type foaming agent, can be used volatile blowing agent, heating limit temperature of the heating member (heating which foam at temperatures temperature) below become dysfunctional due to a temperature rise due to heat generation of the member is selected.

【0016】上記熱分解型発泡剤としては、特に限定されないが、たとえば、重炭酸ナトリウム、炭酸アンモニウム、重炭酸アンモニウム、アジド化合物なとの無機系発泡剤、アゾジカルボンアミド、アゾビスホルムアミド、アゾビスイソブチロニトリル、ジアゾアミノベンゼンなどのアゾ化合物、ニトロソ化合物、スルホニルヒドラジド化合物等が挙げられるが、発熱部材がICチップなどの電子部品の場合、体重炭酸ナトリウム、炭酸アンモニウム、重炭酸アンモニウム等を用いることが好ましい。 [0016] Examples of the thermally decomposable foaming agent is not particularly limited, for example, sodium bicarbonate, ammonium carbonate, ammonium bicarbonate, inorganic foaming agents and Do azide compound, azodicarbonamide, azobisformamide, azobis isobutyronitrile, azo compounds such as diazoaminobenzene, nitroso compounds, but sulfonyl hydrazide compounds, and the like, when the heat members of the electronic components such as IC chips, using sodium weight carbonate, ammonium carbonate, ammonium bicarbonate, etc. it is preferable.

【0017】なお、本発明において、熱分解型発泡剤の分解温度は、TG(熱重量測定)/DTA(示差熱分析)で減量開始温度とする。 [0017] In the present invention, the decomposition temperature of the thermally decomposable foaming agent, and weight loss beginning temperature in TG (thermogravimetry) / DTA (differential thermal analysis).

【0018】上記蒸発型発泡剤としては、特に限定されないが、たとえば、常圧で樹脂組成物中に含浸させる場合には、沸点40℃以下の液体で、熱可塑性樹脂との親和性が必要で、たとえば、エタノールや水が挙げられる。 [0018] Examples of the volatile blowing agent is not particularly limited, for example, when impregnating the resin composition at normal pressure, a boiling point of 40 ° C. or less of the liquid is necessary affinity with the thermoplastic resin , for example, ethanol or water. 一方、高圧で樹脂組成物中に含浸させる場合には、 On the other hand, if the impregnation in the resin composition in high pressure,
特に限定がなく、窒素、二酸化炭素、水、エタノール等が挙げられる。 Without particular limitation, nitrogen, carbon dioxide, water, ethanol and the like.

【0019】なお、含浸は、樹脂の溶融状態、固化状態のいずれにおいても行なうことができるが、溶融状態の樹脂に高圧で含浸させる場合には、含浸後高圧状態で樹脂を冷却固化させたのち、低圧に雰囲気に戻すことにより発泡剤を内包した状態に保つことができる。 [0019] Incidentally, impregnation, the molten state of the resin can be carried out in any of the solidification state, in the case of impregnating at high pressure to the resin in a molten state, after which the resin was cooled and solidified under high pressure after impregnation , it can be kept in a state of enclosing a foaming agent by returning the atmosphere to low pressure. また、蒸発型発泡剤の場合、樹脂内に内包させた膨張粒子の状態で樹脂組成物中に含ませるようにしても構わない。 Also, when the volatile blowing agent, may also be included in the resin composition in a state of expansion particles were enclosed in the resin.

【0020】発泡剤の配合量は、特に限定されないが、 [0020] The amount of blowing agent is not particularly limited,
大気中で熱伝導材を発泡させた時の発泡倍率が1.1倍〜10倍程度となるような配合量が好ましい。 The amount that the expansion ratio becomes 1.1 times to 10 times when the foamed thermal compound in the atmosphere is preferred. すなわち、発泡倍率が1.1倍未満であると、発泡しても部材への密着性を十分確保できなくなる恐れがあり、10倍を超すと、気泡が多くなりすぎて、シート自体の熱伝導率が下がり、うまく放熱できなくなる恐れがある。 That is, when the expansion ratio is less than 1.1 times, there may not be sufficiently ensured adhesion to foamed even member, when more than 10 times, the bubble is too large, the thermal conductivity of the sheet itself rate is lowered, there is a possibility that can not be successfully heat dissipation.

【0021】また、樹脂組成物中には、発泡時にその形体を維持させるために、添設される発熱部材の発熱温度で架橋を開始したり、電子線や紫外線の照射により架橋を開始する架橋剤を添加したり、難燃剤、酸化防止剤、 Further, the resin composition, in order to maintain its form foaming during, or initiate crosslinking at the heat producing temperature of the heater member to be additionally provided to initiate the crosslinking by irradiation of electron beams or UV cross agent may be added to, flame retardants, antioxidants,
紫外線防止剤等の他の添加剤を添加することができる。 It may be added other additives such as ultraviolet inhibitor.

【0022】請求項2の熱伝導材において、発泡剤非含有の非発泡性高熱伝導層を形成する材料としては発泡性高熱伝導層の発泡による熱伝導材表面の部材表面への変形密着性を阻害せず、熱伝導性に優れたものであれば特に限定されないが、たとえば、発泡性高熱伝導層を形成する樹脂組成物に用いた熱可塑性樹脂と高熱伝導フィラーとを含む熱可塑性樹脂(発泡剤非含有)や、ニッケル、すず、アルミニウム、金、銀、銅、鉄、コバルト、 [0022] In the heat conduction member according to claim 2, the deformation adhesion as a material for forming the non-foaming high thermal conductive layer in the non-containing blowing agent to the component surface of the thermally conductive material surface due to foaming of the foamable high thermal conductive layer not inhibit, but it if not particularly limited as it has excellent thermal conductivity, for example, thermoplastic resin (foam comprising a thermoplastic resin and the high thermal conductive filler used in the resin composition forming the foamable high thermal conductive layer free) and, nickel, tin, aluminum, gold, silver, copper, iron, cobalt agents,
インジウムやこれらの合金などの金属が挙げられる。 Metals such as indium and alloys thereof.

【0023】発泡性高熱伝導層の製造方法としては特に限定されないが、たとえば、高熱伝導フィラーと熱可塑性樹脂とを溶融混練した配合物に熱分解型発泡剤を溶媒とを加え混合紙、塗工溶液を作製したのち、離型性の高い材料で形成された型の型面に塗工し、この塗工物を乾燥(溶媒を除去)させたのち型から剥離することによって形成する方法、予め形成された非発泡性高熱伝導層の表面に上記塗工溶液を塗工し乾燥させて形成させる方法が挙げられる。 [0023] No particular limitation is imposed on the method of manufacturing a sparkling high thermal conductive layer, for example, mixed paper plus the solvent thermally decomposable foaming agent to the formulation was melt kneaded and the high thermal conductive filler and a thermoplastic resin, coating how After the solution was prepared, was applied to the mold surface of the mold formed by the high releasability material, formed by peeling the coating was dried from later type was (solvent removed) is pre the application solution was coated and dried on the surface of the formed non-foaming high thermal conductive layer include a method for forming.

【0024】また、得られた発泡性高熱伝導層の表面に非発泡性高熱伝導層を形成する方法としては、特に限定されないが、たとえば、発泡剤を除いた以外は同様の塗工溶液を発泡性高熱伝導層の表面に塗工し乾燥させる方法、非発泡性高熱伝導層が金属で形成される場合、金属箔を熱伝導性接着剤を介して発泡性高熱伝導層に接着する方法、発泡性高熱伝導層の表面に無電解メッキ、物理蒸着、化学蒸着などを用いて金属膜を形成する方法などが挙げられる。 Further, as a method of forming a non-foaming high thermal conductive layer on the surface of the obtained foamable high thermal conductive layer is not particularly limited, for example, foaming the same coating solution except excluding the blowing agent method of coating and drying on the surface of sexual high thermal conductive layer, if the non-foaming high thermal conductive layer is formed of a metal, a method of bonding a metal foil via a thermally conductive adhesive foamable high thermal conductive layer, foamed electroless plating to the surface of sexual high thermal conductive layer, physical vapor deposition, and a method of forming a metal film by using a chemical vapor deposition.

【0025】 [0025]

【発明の実施の形態】以下に、本発明の実施の形態を、 DETAILED DESCRIPTION OF THE INVENTION Hereinafter, the embodiments of the present invention,
図面を参照しつつ詳しく説明する。 With reference to the accompanying drawings will be described in detail. 図1は本発明にかかる熱伝導材の第1の実施の形態をあらわしている。 Figure 1 represents a first embodiment of a heat conductive material according to the present invention.

【0026】図1に示すように、この熱伝導材1は、シート状をしていて、40℃以上で発泡する熱分解型の発泡剤11と高熱伝導フィラー(図示せず)と樹脂とを含む樹脂組成物12からなる発泡性高熱伝導層のみからなるシート状をしている。 As shown in FIG. 1, the heat conducting member 1 is not a sheet, a thermal decomposition type foaming agent 11 and the high thermal conductive filler which foams at 40 ° C. or higher (not shown) and a resin It has a sheet composed only of foaming high thermal conductive layer made of the resin composition 12 comprising. また、発泡剤11は、大気圧中で発泡させた時発泡倍率が1.1倍〜10倍となる量が配合されている。 Furthermore, the foaming agent 11, the amount of expansion ratio is 1.1 to 10 times when foamed at atmospheric pressure is blended.

【0027】この熱伝導材1は、上記のようになっており、図2に示すように、発熱部材Hと放熱部材Cとの間に挟み込むように介在させて使用するが、発熱部材Hおよび放熱部材Cは、反ったり凹凸があり、挟み込んだだけでは図2(a)に示すように、熱伝導材1の表面との間に隙間Sが生じる。 [0027] The thermally conductive material 1 is adapted to the above, as shown in FIG. 2, but for use interposed so as to sandwich between the heating member H and the heat radiating member C, the heat-generating member H and radiating member C, there is uneven or warped, just sandwiched as shown in FIG. 2 (a), a gap S is formed between the heat conductive member 1 surface. しかし、発熱部材Hが使用時に発熱すると発泡剤11が発泡し、熱伝導材1'の表面が発熱部材Hおよび放熱部材Cの反りや凹凸に沿うようになる。 However, the heat-generating member H is the heat generation blowing agent 11 is foaming during use, the surface of the thermally conductive material 1 'is along the warpage or irregularities of the heat-generating member H and the heat radiating member C. したがって、発熱部材Hおよび放熱部材Cと、熱伝導材1の接触面積が増大し、ロス無く発熱部材Hの熱を放熱部材Cに伝達することができる。 Thus, a heat-generating member H and the heat radiating member C, the contact area of ​​the heat-conducting member 1 is increased, it is possible to transfer heat loss without heating member H to the heat radiating member C. また、シート状をしているので取り扱い性がよく、ICチップ等のヒートシンク等の放熱部材への取付の際に有効である。 Further, handleability since the sheet is good, it is effective in the attachment to the heat radiating member such as a heat sink, such as an IC chip.

【0028】図3は、本発明にかかる熱伝導材の第2の実施の形態をあらわしている。 [0028] Figure 3 represents a second embodiment of a heat conductive material according to the present invention. 図3に示すように、この熱伝導材2は、シート状をしていて、40℃以上で発泡する熱分解型の発泡剤21と高熱伝導フィラー(図示せず)と樹脂とを含む樹脂組成物22からなるシート状をした発泡性高熱伝導層23と、この発泡性高熱伝導層2 As shown in FIG. 3, the thermally conductive material 2, have a sheet-like, thermal decomposition type foaming agent 21 and the high thermal conductive filler which foams at 40 ° C. or higher (not shown) and the resin composition comprising a resin a foamable high thermal conductivity layer 23 was a sheet made from the object 22, the foamable high thermal conductive layer 2
3の厚み方向の両面を覆うように積層され、高熱伝導フィラー(図示せず)と樹脂とを含み、発泡剤を含まない樹脂組成物24からなる非発泡性高熱伝導層25とを備えた3層構造になっている以外は第1の実施の形態と同様になっている。 Are stacked so as to cover both sides of the 3 in the thickness direction, and a resin with high thermal conductivity filler (not shown), and a non-foaming high thermal conductive layer 25 made of a resin composition 24 containing no foaming agent 3 except that is a layered structure is made in the same manner as in the first embodiment.

【0029】図4は、本発明にかかる熱伝導材の第3の実施の形態をあらわしている。 [0029] Figure 4 represents a third embodiment of a heat conductive material according to the present invention. 図4に示すように、この熱伝導材3は、シート状をしていて、シート状をした金属からなる非発泡性高熱伝導層31と、この非発泡性高熱伝導層31の厚み方向の両面を覆うように積層され、 As shown in FIG. 4, the heat conductive member 3 is not a sheet, a non-foaming high thermal conductive layer 31 made of a metal which has a sheet-like, both sides of the thickness direction of the non-foaming high thermal conductive layer 31 the laminated so as to cover,
40℃以上で発泡する熱分解型の発泡剤32と高熱伝導フィラー(図示せず)と樹脂とを含む樹脂組成物33からなる発泡性高熱伝導層34とを備えた3層構造になっている以外は第1の実施の形態と同様になっている。 It has a three-layer structure comprising a foamable high thermal conductive layer 34 made of a resin composition 33 containing a resin and a foaming thermal decomposition type foaming agent 32 and the high thermal conductive filler (not shown) at 40 ° C. or higher except has become similar to the first embodiment.

【0030】図5は、本発明にかかる熱伝導材の第4の実施の形態をあらわしている。 [0030] Figure 5 represents a fourth embodiment of a heat conductive material according to the present invention. 図5に示すように、この熱伝導材4は、シート状をしていて、40℃以上で発泡する熱分解型の発泡剤41と高熱伝導フィラー(図示せず)と樹脂とを含む樹脂組成物42からなる柱状をした発泡性高熱伝導層43が間隔を開けて並列に並んでいて、発泡性高熱伝導層43と発泡性高熱伝導層43との間および各発泡性高熱伝導層43の周囲を囲むように、 As shown in FIG. 5, the heat conductive member 4, have a sheet-like, thermal decomposition type foaming agent 41 and the high thermal conductive filler which foams at 40 ° C. or higher (not shown) and the resin composition comprising a resin foamable high thermal conductive layer 43 which is a columnar consisting object 42 is lined in parallel at intervals, between and around the foamable high thermal conductive layer 43 with the foamable high thermal conductive layer 43 and the foamable high thermal conductive layer 43 so as to surround,
高熱伝導フィラー(図示せず)と樹脂とを含み、発泡剤を含まない樹脂組成物45からなる非発泡性高熱伝導層46が設けられている以外は第1の実施の形態と同様になっている。 And a high thermal conductivity filler (not shown) and the resin, except that the non-foaming high thermal conductive layer 46 made of a resin composition 45 containing no foaming agent is provided so as in the first embodiment there.

【0031】図6は、本発明にかかる熱伝導材の第5の実施の形態をあらわしている。 [0031] Figure 6 represents a fifth embodiment of a heat conductive material according to the present invention. 図6に示すように、この熱伝導材5は、シート状をしていて、高熱伝導フィラー(図示せず)と樹脂とを含み、発泡剤を含まない樹脂組成物51からなる柱状をした非発泡性高熱伝導層52が間隔を開けて並列に並んでいて、非発泡性高熱伝導層5 As shown in FIG. 6, the heat conductive member 5 is not a sheet, a high thermal conductivity filler (not shown) and a resin, a non were columnar of the resin composition 51 containing no foaming agent and lined in parallel foamable high thermal conductive layer 52 is spaced, non-foaming high thermal conductive layer 5
2と非発泡性高熱伝導層52との間および各非発泡性高熱伝導層52の周囲を囲むように、40℃以上で発泡する熱分解型の発泡剤53と高熱伝導フィラー(図示せず)と樹脂とを含む樹脂組成物54からなる柱状をした発泡性高熱伝導層55が設けられている以外は第1の実施の形態と同様になっている。 2 so as to surround the periphery and between the non-foaming high thermal conductive layer 52 of the non-foaming high thermal conductive layer 52, the thermal decomposition type foaming at 40 ° C. or more blowing agent 53 and the high thermal conductive filler (not shown) foamable high thermal conductive layer 55 which is a columnar made of the resin composition 54 comprising a resin, except that provided has the same as the first embodiment with.

【0032】図7は、本発明にかかる熱伝導材の第6の実施の形態をあらわしている。 [0032] Figure 7 represents a sixth embodiment of the thermally conductive material according to the present invention. 図7に示すように、この熱伝導材6は、シート状をしていて、40℃以上で発泡する蒸発型の発泡剤61と高熱伝導フィラー(図示せず)と樹脂とを含む樹脂組成物62からなるシート状をした発泡性高熱伝導層63内に発泡性高熱伝導層63の厚み方向に収縮した状態の多数のバネ64が埋設されている。 As shown in FIG. 7, the heat-conducting material 6, have a sheet-like, evaporable blowing agent 61 and the high thermal conductive filler which foams at 40 ° C. or higher (not shown) and the resin composition comprising a resin numerous spring 64 in a state in which contracted in the thickness direction of the foamable high thermal conductive layer 63 in sheet form foamable high thermal conductive layer 63 made of 62 is embedded.

【0033】すなわち、この熱伝導材6は、上記のようになっているので、熱伝導材6が発熱部材Hの発熱によって加熱されると発泡剤61が発泡するとともに熱可塑性樹脂が軟化するので熱可塑性樹脂による規制がゆるみバネ64の復元力によって、熱伝導材の表面をより発熱部材Hおよび放熱部材Cに密着させやすくなる。 [0033] That is, the heat-conducting material 6, so look like the above, the thermoplastic resin is softened with the blowing agent 61 and the heat conduction member 6 is heated by heat generation of the heat generating member H foams by the restoring force of the spring 64 loosened regulation by a thermoplastic resin, it is easily brought into close contact with the surface of the thermally conductive material to a more heat-generating member H and the heat dissipation member C.

【0034】なお、この熱伝導材6は、特に限定されないが、たとえば、ばね64を収縮させた状態で型内にセットするとともに、この型内に高熱伝導フィラー(図示せず)と樹脂とを含み、発泡剤を非含有の溶融状態の樹脂組成物を充填し、樹脂を冷却固化させたのち、この冷却固化物に高圧状態で蒸発型の発泡剤61を含浸させることによって製造することができる。 [0034] Incidentally, the heat conduction member 6 is not particularly limited, for example, as well as set in the mold in a state where the spring 64 is contracted, and a resin high thermal conductivity filler (not shown) within the mold wherein the foaming agent filling the resin composition in a molten state of free, after the resin was cooled and solidified, may be prepared by impregnating the foaming agent 61 evaporable under high pressure in the cooling and solidification thereof .

【0035】本発明は、上記の実施の形態に限定されない。 The present invention is not limited to the above embodiments. たとえば、上記の第2、3の実施の形態では、3層構造になっていたが、2層構造にしても構わないし、4 For example, in the second and third embodiments described above, but had become a three-layer structure, but may be a two-layer structure, 4
層構造以上の多層構造としても構わない。 It may be as a layer structure or more of the multi-layer structure. また、上記バネ64に代えて発熱部材による加熱時の形状回復するような形状記憶材料を用いるようにしても構わない。 Further, it may be used a shape memory material, such as shape recovery at the time of heating by the heat generation member in place of the spring 64.

【0036】 [0036]

【実施例】以下に、本発明の実施例をより詳しく説明する。 THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention in more detail.

【0037】(実施例1)アクリル酸2−エチルヘキシル重合体(以下、「EHA」と記す)、熱伝導性充填材としての窒化ホウ素(電気化学工業社製 デンカボロンナイトSGP)、熱伝導性充填材としての炭化珪素(屋久島電工社製 グレードGC−800S)を、EHA: [0037] (Example 1) 2-ethylhexyl polymer acrylic acid (hereinafter, referred to as "EHA"), boron nitride as the thermally conductive filler (manufactured by Denki Kagaku Kogyo Kabushiki Kaisha Denka boron nitride SGP), the heat conductive filler silicon carbide as wood (the Yakushima Denko Co., Ltd. grade GC-800S), EHA:
窒化ホウ素:炭化珪素=40体積%:40体積%:20 Boron nitride: silicon carbide = 40 vol%: 40 vol%: 20
体積%となるように配合し、この配合物100重量部に対し、発泡剤としての重炭酸ナトリウム(分解温度60 Formulated such that the volume%, relative to the formulation 100 parts by weight of sodium bicarbonate as a foaming agent (decomposition temperature 60
℃)2重量部と、溶媒としての酢酸エチル400重量部を加えて混合して塗工溶液を作製した。 ° C.) and 2 parts by weight, to prepare a coating solution was mixed with ethyl acetate 400 parts by weight of a solvent.

【0038】この塗工溶液をマルチコーターでポリエチレンテレフタレートフィルム上に塗工し乾燥させて、厚み100μmの熱伝導材サンプルを得た。 [0038] The coating solution was coated on a polyethylene terephthalate film and dried in a multi-coater to give a thermally conductive material the thickness of the sample 100 [mu] m.

【0039】(実施例2)EHA:窒化ホウ素:炭化珪素=40体積%:40体積%:20体積%の配合物に代えて、EHA:窒化ホウ素:炭化珪素=40体積%:6 [0039] (Example 2) EHA: Boron nitride: silicon carbide = 40 vol%: 40 vol%: instead of the 20% by volume of the formulation, EHA: boron nitride: silicon carbide = 40 vol%: 6
0体積%:0体積%の配合物を用いた以外は、実施例1 0 vol%: 0 except for using the volume percent of the formulation, Example 1
と同様にして厚み100μmの熱伝導材サンプルを得た。 To obtain a thermally conductive material the thickness of the sample 100μm in the same manner as.

【0040】(実施例3)発泡剤として重炭酸ナトリウムに代えて炭酸アンモニウム(分解温度40℃)を用いるようにした以外は、実施例1と同様にして厚み100 [0040] except that the (Example 3) As in place of sodium bicarbonate as a foaming agent using ammonium carbonate (decomposition temperature 40 ° C.), the thickness in the same manner as in Example 1 100
μmの熱伝導材サンプルを得た。 To obtain a heat-conductive material samples [mu] m.

【0041】(比較例1)発泡剤を添加しなかった以外は、実施例1と同様にして厚み100μmの熱伝導材サンプルを得た。 [0041] (Comparative Example 1) except for not adding a foaming agent to obtain a thermally conductive material the thickness of the sample 100μm in the same manner as in Example 1.

【0042】(比較例2)発泡剤を添加しなかった以外は、実施例1と同様にして厚み100μmの熱伝導材サンプルを得た。 [0042] Except for not adding (Comparative Example 2) blowing agent, to obtain a thermally conductive material the thickness of the sample 100μm in the same manner as in Example 1. そして、上記実施例1〜3および比較例1,2で得た熱伝導材サンプルのそれぞれについて熱抵抗値を以下のようにして測定し、その結果を表1に示した。 Then, measured by the thermal resistance in the following manner for each of the thermally conductive material samples obtained in Examples 1 to 3 and Comparative Examples 1 and 2, Table 1 shows the results.

【0043】〔熱抵抗の測定〕アルミニウム製の冷却器の上に熱伝導材サンプルを載せ、さらに、熱伝導材サンプルの上に30mm×30mm×高さ10mmのヒーターを載せ、締めつけ板と冷却器との間で締めつけトルク1N・mで熱伝導材サンプルをおよびヒーターを挟着した状態で冷却器の内部に恒温水槽から23℃の水を循環供給しておき、ヒーターに40Wの電力を印加し、5分後のヒーターの温度(T1)と、冷却器のシート接触面近傍温度(T2)を、周辺温度(室温)23℃で測定し,その測定結果から熱抵抗値を以下の式で求めた。 [0043] placing a thermally conductive material samples over [thermal resistance measurement] aluminum cooler, further put the heater 30 mm × 30 mm × height 10mm on a thermally conductive material samples, the clamping plate and cooler the heat conduction material samples and the inside 23 ° C. water from a constant temperature water bath of the cooler while sandwiched heater leave circulated and supplied, the power of 40W is applied to the heater at a tightening torque 1N · m between , and the 5 minutes after the heater temperature (T1), a cooler of the sheet contact surface temperature near the (T2), measured at ambient temperature (room temperature) 23 ° C., determined by the following equation of heat resistance from the measured results It was. ・熱抵抗値(℃/W)=(T1−T2)/(ヒーターへの供給電力) Thermal resistance (℃ / W) = (T1-T2) / (supplied power to the heater)

【0044】 [0044]

【表1】 [Table 1]

【0045】表1によれば、本発明の熱伝導材が、接触面への変形追従性に優れ、接触面に凹凸、反り、うねり等があっても、良好な熱伝導状態を得られることがよくわかる。 [0045] According to Table 1, the thermal conductive material of the present invention is excellent in deformation followability to the contact surface, uneven contact surface, warp, even if undulation, obtained a good thermal conductivity state There can be seen well.

【0046】 [0046]

【発明の効果】本発明にかかる熱伝導材シートは、以上のように構成されているので、熱伝導材を挟むように配置される2つの部材の添設面の凹凸形状や反りうねりに追従した添設状態を常に確保でき、結果として優れた熱伝導性を示す。 Thermally conductive sheet according to the present invention, which is configured as described above, following the irregularities and warping undulation of additionally provided surfaces of the two members which are arranged so as to sandwich the heat-conducting material always be secured additionally provided state, exhibits excellent thermal conductivity as a result. また、請求項3のようにすれば、取り扱い性に優れたものとすることができる。 Further, if as claimed in claim 3, it is possible to improve the handling properties.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明にかかる熱伝導材の第1の実施の形態を模式的にあらわす断面図である。 The first embodiment of a thermally conductive material in the present invention; FIG is a sectional view showing schematically.

【図2】図1の熱伝導材の使用状態を模式的にあらわし、同図(a)はその発泡剤が発泡する前の状態の断面図、同図(a)はその発泡剤が発泡した後の状態の断面図である。 [2] The use state of the thermal material of Figure 1 schematically represents, FIG (a) is a sectional view of a state before the foaming agent foams, FIG (a) is its blowing agent and foam it is a cross-sectional view of a state after.

【図3】本発明にかかる熱伝導材の第2の実施の形態を模式的にあらわす断面図である。 The second embodiment of a thermally conductive material in the present invention; FIG is a sectional view showing schematically.

【図4】本発明にかかる熱伝導材の第3の実施の形態を模式的にあらわす断面図である。 [4] The third embodiment of the thermally conductive material according to the present invention is a cross-sectional view showing schematically.

【図5】本発明にかかる熱伝導材の第4の実施の形態を模式的にあらわす断面図である。 [5] The fourth embodiment of a heat conductive material according to the present invention is a cross-sectional view showing schematically.

【図6】本発明にかかる熱伝導材の第5の実施の形態を模式的にあらわす断面図である。 [6] The fifth embodiment of a heat conductive material according to the present invention is a cross-sectional view showing schematically.

【図7】本発明にかかる熱伝導材の第6の実施の形態を模式的にあらわす断面図である。 [7] The sixth embodiment of the thermally conductive material according to the present invention is a cross-sectional view showing schematically.

【符号の説明】 DESCRIPTION OF SYMBOLS

C 放熱部材 H 発熱部材 1,2,3,4,5,6 熱伝導材 11,21,32,41,53,61 発泡剤 12,22,24,33,42,45,51,54 樹脂組成物 23,34,43,55,63 発泡性高熱伝導層 25,31,46,52 非発泡性高熱伝導層 C radiation member H heating member 1,2,3,4,5,6 thermal material 11,21,32,41,53,61 blowing agent 12,22,24,33,42,45,51,54 resin It objects 23,34,43,55,63 foamable high thermal conductive layer 25,31,46,52 effervescent high thermal conductive layer

フロントページの続き Fターム(参考) 4F074 AA48 AC32 AC33 AG01 AG20 BA03 BA04 CA29 CC04Y CC22X CC24X CC32Y CC42 CE02 CE24 CE43 CE98 DA07 DA59 4F100 AD06H AD08H AK25A AR00A AR00B BA02 BA10A BA10B CA01 CA23 DJ04A GB41 JJ01A JJ01B JL05 5F036 AA01 BA23 BB21 BC23 BD21 Front page of the continued F-term (reference) 4F074 AA48 AC32 AC33 AG01 AG20 BA03 BA04 CA29 CC04Y CC22X CC24X CC32Y CC42 CE02 CE24 CE43 CE98 DA07 DA59 4F100 AD06H AD08H AK25A AR00A AR00B BA02 BA10A BA10B CA01 CA23 DJ04A GB41 JJ01A JJ01B JL05 5F036 AA01 BA23 BB21 BC23 BD21

Claims (3)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】挟着された状態で2つの部材間に介在し、 1. A interposed between the two members in clamped state,
    一方の部材の熱を他方の部材に伝える熱伝導材において、40℃以上で発泡する発泡剤および高熱伝導フィラーを含む樹脂組成物から形成された発泡性高熱伝導層を少なくとも備えていることを特徴とする熱伝導材。 In the heat conductive material to transfer heat of the one member to the other member, characterized by comprising at least a foamable high thermal conductive layer formed from a resin composition containing a blowing agent and high thermal conductivity filler to be foamed at 40 ° C. or higher heat conductive material to be.
  2. 【請求項2】発泡性高熱伝導層と発泡剤非含有の非発泡性高熱伝導層とを備え、これらの層が部材間の挟着方向に積層されている請求項1に記載の熱伝導材。 Wherein a foamable high thermal conductive layer and the foaming agent-free non-foaming high thermal conductive layer, thermally conductive material according to claim 1 in which these layers are stacked in the clamping direction between the member .
  3. 【請求項3】シート状に形成されている請求項1または請求項2に記載の熱伝導材。 3. A heat conductive material according to claim 1 or claim 2 which is formed into a sheet.
JP2001122546A 2001-04-20 2001-04-20 Thermoconductive material Pending JP2002317064A (en)

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JP2006526687A (en) * 2003-05-30 2006-11-24 スリーエム イノベイティブ プロパティズ カンパニー Thermally conductive foam interface material
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JP2009503241A (en) * 2005-08-05 2009-01-29 スリーエム イノベイティブ プロパティズ カンパニー Thermally conductive adhesive tape with improved function
JP2010021230A (en) * 2008-07-09 2010-01-28 Denso Corp Manufacturing method of electronic apparatus
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US8025350B2 (en) 2003-03-20 2011-09-27 Silverbrook Research Pty Ltd Printing and flat panel display device
JP2006526687A (en) * 2003-05-30 2006-11-24 スリーエム イノベイティブ プロパティズ カンパニー Thermally conductive foam interface material
JP4773339B2 (en) * 2003-05-30 2011-09-14 スリーエム イノベイティブ プロパティズ カンパニー Thermally conductive foam interface material
JP2005107487A (en) * 2003-09-26 2005-04-21 Samsung Sdi Co Ltd Display apparatus and plasma display apparatus
JP2009503241A (en) * 2005-08-05 2009-01-29 スリーエム イノベイティブ プロパティズ カンパニー Thermally conductive adhesive tape with improved function
WO2007052860A1 (en) * 2005-11-02 2007-05-10 Korea Institute Of Science And Technology Hollow diamond shells filled compostte materials
US8369764B2 (en) 2008-03-21 2013-02-05 Ricoh Company, Ltd. Fixing member, fixing device, and image forming apparatus
JP2010021230A (en) * 2008-07-09 2010-01-28 Denso Corp Manufacturing method of electronic apparatus
JP2014223809A (en) * 2009-12-21 2014-12-04 サン−ゴバン パフォーマンス プラスティックス コーポレイション Thermally conductive foam material
WO2012063672A1 (en) * 2010-11-11 2012-05-18 北川工業株式会社 Heat-conductive resin composition
JP2013231166A (en) * 2012-03-30 2013-11-14 Sekisui Chem Co Ltd Shock absorbing material
WO2014024786A1 (en) * 2012-08-07 2014-02-13 ポリマテック株式会社 Heat-diffusing sound insulation sheet and heat-diffusing sound insulation structure
CN104471637A (en) * 2012-08-07 2015-03-25 保力马科技(日本)株式会社 Heat-diffusing sound insulation sheet and heat-diffusing sound insulation structure
JPWO2014024786A1 (en) * 2012-08-07 2016-07-25 ポリマテック・ジャパン株式会社 Thermal diffusive sound insulation sheet and thermal diffusive sound insulation structure
TWI587331B (en) * 2012-08-07 2017-06-11 Thermal diffuse noise board and thermal diffuse soundproof structure
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